TWI435084B - Inspection pin and inspection device using the same - Google Patents

Description

檢測針腳及應用其之檢測裝置Detection pin and detection device using the same

本發明是有關於一種檢測針腳及應用其之檢測裝置，且特別是有關於一種具可撓性之檢測針腳及應用其之檢測裝置。The present invention relates to a detecting pin and a detecting device using the same, and more particularly to a flexible detecting pin and a detecting device using the same.

當半導體封裝件產出後，都會進行訊號檢測，以淘汰不良的半導體封裝件。目前的檢測裝置有懸臂式探針型(Cantilever type)及垂直式探針型(Vertical type)。When the semiconductor package is produced, signal detection is performed to eliminate defective semiconductor packages. Current detection devices include a Cantilever type and a Vertical type.

懸臂式探針型包括多根檢測針腳及電路板。檢測針腳之一端用以接觸半導體封裝件，其另一端延伸至電性接觸於電路板，整根檢測針腳位於電路板之同一側。懸臂式探針型之多根檢測針腳僅能排列成線形(例如是四邊形)，無法排列成陣列形，因此只能檢測半導體封裝件周圍的電性接點。The cantilever probe type includes a plurality of detection pins and a circuit board. One end of the detecting pin is for contacting the semiconductor package, and the other end is extended to be electrically connected to the circuit board, and the entire detecting pin is located on the same side of the circuit board. The plurality of detecting pins of the cantilever probe type can only be arranged in a line shape (for example, a quadrangle), and cannot be arranged in an array shape, so that only electrical contacts around the semiconductor package can be detected.

垂直式探針型包括多根檢測針腳、電路板及轉接板。整根檢測針腳係位於電路板之同一側，並透過轉接板電性連接於電路板。垂直式探針型之檢測針腳排列成陣列形，雖此，然其檢測針腳中相鄰二者的間距(pitch)太大，無法符合具微小間距(150微米以下)之半導體封裝件的檢測需求。The vertical probe type includes multiple detection pins, a circuit board, and an adapter plate. The entire detection pin is located on the same side of the circuit board and is electrically connected to the circuit board through the adapter board. The vertical probe type detection pins are arranged in an array shape. However, the pitch of adjacent ones in the detection pins is too large to meet the detection requirements of semiconductor packages having a small pitch (below 150 micrometers). .

本發明係有關於一種檢測針腳及應用其之檢測裝置，檢測裝置具有複數根檢測針腳，該些檢測針腳可排列成陣列形且二相鄰之檢測針腳的間距甚小，可檢測電性接點呈陣列形且具微小間距之半導體封裝件。The invention relates to a detecting pin and a detecting device applying the same, the detecting device has a plurality of detecting pins, the detecting pins can be arranged in an array shape and the spacing between two adjacent detecting pins is very small, and the electrical contact can be detected. A semiconductor package that is array-shaped and has a small pitch.

根據本發明之第一方面，提出一種檢測針腳。檢測針腳用以檢測一半導體元件，半導體元件具有數個電性接點。檢測針腳包括一第一部分、一第二部分及一第三部分。第三部分用以接觸該些電性接點之一者。其中，第二部分連接第一部分與第三部分、第二部分之截面積係往第三部分的方向漸縮且第二部分與第三部分間夾一第一夾角，第一夾角介於155度至185度之間。According to a first aspect of the invention, a detection stitch is proposed. The detection pins are used to detect a semiconductor component having a plurality of electrical contacts. The detecting stitch includes a first portion, a second portion and a third portion. The third part is used to contact one of the electrical contacts. Wherein, the cross-sectional area of the second portion connecting the first portion and the third portion and the second portion is tapered toward the third portion, and the first portion and the third portion are sandwiched by a first angle, the first angle being between 155 degrees Between 185 degrees.

根據本發明之第一方面，提出一種檢測裝置。檢測裝置用以檢測一半導體元件。半導體元件具有數個電性接點。檢測裝置包括一第一板件及數根檢測針腳。該些根檢測針腳穿過第一板件設置。各該檢測針腳包括一第一部分、一第二部分及一第三部分。第三部分用以接觸電性接點。其中，第二部分連接第一部分與第三部分、第二部分之截面積係往第三部分的方向漸縮且第二部分與第三部分之間夾一第一夾角，第一夾角介於155度至185度之間。According to a first aspect of the invention, a detection device is proposed. The detecting device is for detecting a semiconductor component. The semiconductor component has several electrical contacts. The detecting device comprises a first plate and a plurality of detecting pins. The root detecting pins are disposed through the first panel. Each of the detecting pins includes a first portion, a second portion and a third portion. The third part is used to contact the electrical contacts. Wherein, the cross-sectional area of the second portion connecting the first portion and the third portion and the second portion is tapered toward the third portion, and the first angle is sandwiched between the second portion and the third portion, and the first angle is between 155 Degree to 185 degrees.

為了對本發明之上述及其他方面有更佳的瞭解，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下：In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

請參照第1圖，其繪示依照本發明一實施例之檢測裝置之剖視圖。檢測裝置100檢測半導體元件(未繪示)，例如是晶片(chip)或半導體封裝件。檢測裝置100包括第一板件102、第二板件104、電路板112、固定元件120及多根檢測針腳106。其中，檢測針腳106用以接觸半導體元件之電性接點。Referring to FIG. 1, a cross-sectional view of a detecting device in accordance with an embodiment of the present invention is shown. The detecting device 100 detects a semiconductor element (not shown) such as a chip or a semiconductor package. The detecting device 100 includes a first plate member 102, a second plate member 104, a circuit board 112, a fixing member 120, and a plurality of detecting pins 106. The detecting pin 106 is for contacting an electrical contact of the semiconductor component.

請參照第2圖，其繪示第1圖中局部2’的放大示意圖。檢測針腳106包括第一部分106a、第二部分106b及第三部分106c。檢測針腳106之第三部分106c用以接觸半導體元件之電性接點。其中，二相鄰之第三部分106c的間距P1可小至33微米(μm)或更小，因此可檢測相鄰二電性接點之間距微小(例如是150微米以下)的半導體元件。Please refer to Fig. 2, which shows an enlarged schematic view of a portion 2' in Fig. 1. The detection stitch 106 includes a first portion 106a, a second portion 106b, and a third portion 106c. The third portion 106c of the test pin 106 is for contacting an electrical contact of the semiconductor component. Wherein, the pitch P1 of the two adjacent third portions 106c can be as small as 33 micrometers (μm) or less, so that semiconductor elements having a small distance (for example, 150 micrometers or less) between adjacent two electrical contacts can be detected.

第一部分106a之材質具導電性，其例如是金屬或合金。合金例如是鎢化錸(ReW)、錸(Re)、鈹化銅(BeCu)或Palinery-7TM。其中Palinery-7TM係由金(Gu)、鈀(Pa)、鉑(Pt)、銀(Au)、銅(Cu)、鋅(Zn)及鎢(W)所組成。第二部分106b之材質及第三部分106c之材質相似於第一部分106a之材質。第一部分106a、第二部分106b與第三部分106c之材質係不同或相同，本實施例之第一部分106a、第二部分106b及第三部分106c之材質係以相同為例作說明。The material of the first portion 106a is electrically conductive, such as a metal or an alloy. The alloy is, for example, tantalum (ReW), ruthenium (Re), copper beryllide (BeCu) or Palinery-7TM. Among them, Palinery-7TM is composed of gold (G), palladium (Pa), platinum (Pt), silver (Au), copper (Cu), zinc (Zn) and tungsten (W). The material of the second portion 106b and the material of the third portion 106c are similar to those of the first portion 106a. The materials of the first portion 106a, the second portion 106b, and the third portion 106c are different or the same. The materials of the first portion 106a, the second portion 106b, and the third portion 106c of the present embodiment are described by way of example.

較佳但非限定地，第一部分106a、第二部分106b與第三部分106c係於同一製程中一體成形而形成檢測針腳106。Preferably, but not limited to, the first portion 106a, the second portion 106b, and the third portion 106c are integrally formed in the same process to form the detecting stitch 106.

以下進一步說明第一部分106a、第二部分106b及第三部分106c的構造。The configuration of the first portion 106a, the second portion 106b, and the third portion 106c is further explained below.

請繼續參照第2圖，第二部分106b之橫截面(即與針腳之軸向垂直的截面)之形狀可以是圓形、矩形、三角形或其它外形，本發明對第二部分106b之橫截面的形狀不作任何限制。第二部分106b之一端106b1連接於第三部分106c。當第二部分106b之該端106b1之外徑D1愈小，二相鄰之第二部分106b可愈接近，使間距P1縮小。在一實施態樣中，第二部分106b之該端106b1之外徑D1係約25 μm，如此可使間距P1小至33 μm。Referring to FIG. 2, the cross section of the second portion 106b (ie, the cross section perpendicular to the axial direction of the stitch) may be circular, rectangular, triangular or other shape, and the cross section of the second portion 106b of the present invention. There are no restrictions on the shape. One end 106b1 of the second portion 106b is coupled to the third portion 106c. When the outer diameter D1 of the end 106b1 of the second portion 106b is smaller, the second adjacent portions 106b can be closer to each other, so that the pitch P1 is reduced. In one embodiment, the outer diameter D1 of the end 106b1 of the second portion 106b is about 25 μm, such that the pitch P1 can be as small as 33 μm.

在第二部分106b之該端106b1之外徑D1係25 μm的設計下，第三部分106c之檢測端106c1之外徑大約介於15至25 μm之間，其中檢測端106c1用以接觸電性接點。In the design of the outer diameter D1 of the end portion 106b1 of the second portion 106b is 25 μm, the outer diameter of the detecting end 106c1 of the third portion 106c is between about 15 and 25 μm, wherein the detecting end 106c1 is used for electrical contact. contact.

第二部分106b連接第一部分106a與第三部分106c。第二部分106b之橫截面積係從第一部分106a往第三部分106c的方向漸縮，即第二部分106b係錐桿。此外，藉由第二部分106b之漸縮外型，可使二相鄰之第三部分106c之間的間距縮小。The second portion 106b connects the first portion 106a with the third portion 106c. The cross-sectional area of the second portion 106b tapers from the first portion 106a toward the third portion 106c, i.e., the second portion 106b is a tapered rod. Furthermore, by the tapered shape of the second portion 106b, the spacing between the two adjacent third portions 106c can be reduced.

本實施例中，第三部分106c之橫截面積係從第二部分106b往第三部分106c之檢測端106c1的方向漸縮。於其它實施態樣中，請參照第3圖，其繪示依照本發明其它實施態樣之檢測針腳之第三部分的示意圖。第二部分206b連接於第三部分206c，第三部分206c的橫截面積係均等，即第三部分206c係細長圓柱。In this embodiment, the cross-sectional area of the third portion 106c is tapered from the second portion 106b toward the detecting end 106c1 of the third portion 106c. In other embodiments, please refer to FIG. 3, which is a schematic diagram showing a third portion of the detecting stitch according to another embodiment of the present invention. The second portion 206b is coupled to the third portion 206c, the third portion 206c having an equal cross-sectional area, i.e., the third portion 206c is an elongated cylinder.

第一部分106a的橫截面積係均等，即第一部分106a係細長圓柱，然此非用以限制本發明，第一部分106a亦可為錐桿。The cross-sectional area of the first portion 106a is equal, that is, the first portion 106a is an elongated cylinder. However, this is not intended to limit the invention, and the first portion 106a may also be a tapered rod.

此外，第二部分106b與第三部分106c之間夾一第一夾角A1，第一夾角A1係鈍角，其角度值例如是介於約155度至185度之間，藉此可使第二部分106b與第三部分106c構成一可撓性元件。如此，當第三部分106c接觸於電性接點而受到電性接點之作用力時，第三部分106c係可動而避免強迫刮壞電性接點。此外，藉由第二部分106b與第三部分106c之可撓性，第三部分106c可刮除電性接點上之雜質(例如是氧化層)，使第三部分106c確實地電性接觸到電性接點的導電本體。In addition, a first angle A1 is sandwiched between the second portion 106b and the third portion 106c, and the first angle A1 is an obtuse angle, and the angle value is, for example, between about 155 degrees and 185 degrees, thereby enabling the second portion. 106b and third portion 106c form a flexible element. Thus, when the third portion 106c is in contact with the electrical contact and is subjected to the force of the electrical contact, the third portion 106c is movable to avoid forcibly scraping the electrical contact. In addition, by virtue of the flexibility of the second portion 106b and the third portion 106c, the third portion 106c can scrape off impurities (such as an oxide layer) on the electrical contacts, so that the third portion 106c is electrically electrically contacted. Conductive body of a sexual contact.

此外，由於第一夾角A1之設計，使第二部分106b可受到第二板件104的止擋而避免第三部分106c脫離第二板件104。Moreover, due to the design of the first angle A1, the second portion 106b can be stopped by the second panel 104 to prevent the third portion 106c from disengaging from the second panel 104.

此外，該些第一部分106a大致上互相平行，且該些第三部分106c大致上互相平行，第一部分106a的平行方向與第三部分106c的平行方向大致上同向，然此非用以限制本發明。第一部分106a與第二部分106b之間夾一第二夾角A2，由於第一部分106a的平行方向與第三部分106c的平行方向大致上同向，因此第一夾角A1與第二夾角A2係內錯角，其角度值大致上相等。In addition, the first portions 106a are substantially parallel to each other, and the third portions 106c are substantially parallel to each other. The parallel direction of the first portion 106a is substantially the same as the parallel direction of the third portion 106c, but this is not used to limit the present. invention. A second angle A2 is sandwiched between the first portion 106a and the second portion 106b. Since the parallel direction of the first portion 106a is substantially the same as the parallel direction of the third portion 106c, the first angle A1 and the second angle A2 are within the wrong angle. , the angle values are roughly equal.

此外，由於第二夾角A2之設計，使第二部分106b可受到第一板件102的止擋而避免第一部分106a脫離第一板件102。Moreover, due to the design of the second angle A2, the second portion 106b can be stopped by the first panel 102 to prevent the first portion 106a from disengaging from the first panel 102.

檢測針腳可穿過電路板設置。例如，請回到第1圖，電路板112具有貫穿部114及相對之第一面112a與第二面112b。第一板件102設於電路板112之第一面112a上。檢測針腳106係穿過電路板112之貫穿部114、第一板件102及第二板件104。其中，第一部分106a延伸至電路板112之第二面112b，第一部分106a係採用例如是焊接的方式電性連接於電路板112，而第三部分106c係突出於第二板件104之下表面。詳細而言，檢測針腳106係從電路板112之第一面112a之側穿過電路板112而延伸至電路板112之第二面112b。The detection pins can be placed through the board settings. For example, returning to Figure 1, the circuit board 112 has a penetration portion 114 and opposing first and second faces 112a, 112b. The first plate member 102 is disposed on the first surface 112a of the circuit board 112. The detection pin 106 passes through the through portion 114 of the circuit board 112, the first plate member 102, and the second plate member 104. The first portion 106a extends to the second surface 112b of the circuit board 112. The first portion 106a is electrically connected to the circuit board 112 by soldering, for example, and the third portion 106c protrudes from the lower surface of the second board 104. . In detail, the detection pin 106 extends from the side of the first side 112a of the circuit board 112 through the circuit board 112 to the second side 112b of the circuit board 112.

如第2圖所示，第一部分106a穿過第一板件102設置，第三部分106c穿過第二板件104設置。詳細而言，第一板件102具有第一凹槽116(第一凹槽116繪示於第1圖)、多個第一貫孔108及相對之第一面102a與第二面102b，其中第一貫孔108從第一面102a延伸至第二面，該些第一貫孔108大致上彼此平行地排列。檢測針腳106之第一部分106a穿過對應之第一貫孔108而延伸至電路板112之第二面112b(第二面112b繪示於第1圖)並電性連接於電路板112之第二面112b，亦即，第一部分106a從鄰近第一板件102之第一面102a之側延伸至連接於電路板112之第二面102b。As shown in FIG. 2, the first portion 106a is disposed through the first panel member 102, and the third portion 106c is disposed through the second panel member 104. In detail, the first plate member 102 has a first recess 116 (the first recess 116 is shown in FIG. 1 ), a plurality of first through holes 108 and opposite first and second faces 102 a and 102 b , wherein The first through hole 108 extends from the first face 102a to the second face, and the first through holes 108 are arranged substantially in parallel with each other. The first portion 106a of the detecting pin 106 extends through the corresponding first through hole 108 to the second surface 112b of the circuit board 112 (the second surface 112b is shown in FIG. 1) and is electrically connected to the second surface of the circuit board 112. The face 112b, that is, the first portion 106a extends from a side adjacent the first face 102a of the first panel 102 to a second face 102b that is coupled to the circuit board 112.

此外，二相鄰之第一貫孔108的間距係可改變二相鄰之第一部分106a的間距。In addition, the spacing of the two adjacent first through holes 108 can change the spacing of the two adjacent first portions 106a.

第二板件104具有第二凹槽118(第二凹槽118繪示於第1圖)與多個第二貫孔110。其中，第二貫孔110貫穿第二板件104之相對二面，該些第二貫孔110大致上彼此平行地排列。其中，第二貫孔110之內徑略大於第三部分106c之最大外徑，使檢測針腳106之第三部分106c可輕易地穿過對應之第二貫孔110設置。當第三部分106c接觸於電性接點而受力時，第三部分106c受到第二貫孔110導引而上下移動。在其它實施態樣中，亦可省略第二板件104，如此，第三部分106c仍可與電性接點接觸而完成檢測。The second plate member 104 has a second recess 118 (the second recess 118 is shown in FIG. 1 ) and a plurality of second through holes 110 . The second through holes 110 extend through opposite sides of the second plate member 104, and the second through holes 110 are substantially parallel to each other. The inner diameter of the second through hole 110 is slightly larger than the maximum outer diameter of the third portion 106c, so that the third portion 106c of the detecting pin 106 can be easily disposed through the corresponding second through hole 110. When the third portion 106c is forced into contact with the electrical contact, the third portion 106c is guided by the second through hole 110 to move up and down. In other implementations, the second panel 104 can also be omitted, such that the third portion 106c can still be in contact with the electrical contacts to complete the inspection.

此外，二相鄰之第二貫孔110的間距以及第二部分106b之該端106b1的外徑D1係可改變二相鄰之第三部分106c的間距P1。舉例來說，當二相鄰之第二貫孔110之間距愈小或第二部分106b之該端106b1的外徑D1愈小時，二相鄰之第三部分106c之間距P1可設計得愈小；反之，當二相鄰之第二貫孔110之間距愈大或第二部分106b之該端106b1的外徑D1愈大時，二相鄰之第三部分106c之間距P1可設計得愈大。藉此，間距P1之值可介於一範圍內，該範圍例如是介於約180 μm至33 μm之間，然此非用以限制本發明。該範圍之上限值亦可高於180 μm，該範圍之下限值亦低於33 μm，實際的數值可依據受檢測之半導體元件之電性接點的間距而定，本發明不作任何限制。In addition, the pitch of the two adjacent second through holes 110 and the outer diameter D1 of the end 106b1 of the second portion 106b may change the pitch P1 of the two adjacent third portions 106c. For example, the smaller the distance between the two adjacent second through holes 110 or the smaller the outer diameter D1 of the end 106b1 of the second portion 106b, the smaller the distance P1 between the two adjacent third portions 106c can be designed. Conversely, the larger the distance between the two adjacent second through holes 110 or the larger the outer diameter D1 of the end 106b1 of the second portion 106b, the larger the distance P1 between the two adjacent third portions 106c can be designed. . Thereby, the value of the pitch P1 may be in a range, for example, between about 180 μm and 33 μm, which is not intended to limit the invention. The upper limit of the range may also be higher than 180 μm, and the lower limit of the range is also lower than 33 μm. The actual value may be determined according to the spacing of the electrical contacts of the semiconductor component to be inspected, and the present invention does not impose any limitation. .

此外，第一板件102與第二板件104在接合後，第一凹槽116與第二凹槽118相通，第二部分106b位於第一凹槽116與第二凹槽118內。In addition, after the first plate member 102 and the second plate member 104 are engaged, the first groove 116 communicates with the second groove 118, and the second portion 106b is located within the first groove 116 and the second groove 118.

如第2圖所示，固定元件120係黏膠或環氧樹脂(epoxy)，其結合第一板件102與檢測針腳106，以將檢測針腳106固定於第一板件102上。本實施例中，固定元件120連接第一板件102之第二面102b與第一部分106a，以將第一部分106a固定於第一板件102上；於其它實施態樣中，固定元件120可連接第一板件102之第一面102a與第一部分106a，以將第一部分106a固定於第一板件102上。當固定元件120設於第一板件102之第一面102a時，固定元件120較佳地係完全不接觸到第二部分106b，可使第二部分106b產生較佳可撓性，然此非用以限制本發明。在其它實施態樣中，當固定元件120設於第一板件102之第一面102a時，固定元件120亦可接觸到部分之第二部分106b。As shown in FIG. 2, the fixing member 120 is an adhesive or epoxy which is coupled to the first plate member 102 and the detecting pin 106 to fix the detecting pin 106 to the first plate member 102. In this embodiment, the fixing member 120 connects the second surface 102b of the first plate member 102 with the first portion 106a to fix the first portion 106a to the first plate member 102. In other implementations, the fixing member 120 can be connected. The first face 102a of the first panel 102 is coupled to the first portion 106a to secure the first portion 106a to the first panel member 102. When the fixing member 120 is disposed on the first face 102a of the first plate member 102, the fixing member 120 preferably does not contact the second portion 106b at all, so that the second portion 106b can produce better flexibility. It is used to limit the invention. In other embodiments, when the fixing component 120 is disposed on the first face 102a of the first panel 102, the securing component 120 can also contact the second portion 106b of the portion.

在其它實施態樣中，亦可省略固定元件120。如此，第一部分106a藉由第一貫孔108之限制而不致與第一板件102脫離。在此情況下，第一貫孔108之內徑可與第一部分106a之外徑較精密地配合或緊配，以增進檢測針腳106的穩固性。In other embodiments, the securing element 120 can also be omitted. As such, the first portion 106a is not constrained from the first panel 102 by the restriction of the first through hole 108. In this case, the inner diameter of the first through hole 108 can be closely fitted or tightly fitted to the outer diameter of the first portion 106a to enhance the stability of the detecting stitch 106.

如第2圖所示，在一實施態樣中，第三部分106c之長度L3大約係508 μm，而第一板件102與第二板件104之間的距離L1大約介於7000 μm至8000 μm之間。較佳但非限定地，每根第二部分106b之長度大致上相等，如此使得連接於該些長度大致上相等之第二部分106b的該些第三部分106c，其受力較一致。As shown in FIG. 2, in an embodiment, the length L3 of the third portion 106c is approximately 508 μm, and the distance L1 between the first plate member 102 and the second plate member 104 is approximately 7000 μm to 8000. Between μm. Preferably, but not limited to, the length of each of the second portions 106b is substantially equal such that the portions of the third portions 106c that are coupled to the second portions 106b of substantially equal length are more force-stressed.

一些第一貫孔之排列外形與對應之該些第二貫孔之排列外形可以不同或相似。例如，請參照第4圖，其繪示第1圖之第一板件之第一貫孔與第二板件之第二貫孔的排列外形示意圖。第4圖僅繪示第一板件102中局部區域的此些第一貫孔108以及第二板件104中局部區域的此些第二貫孔110。檢測針腳106(未繪示於第4圖)可穿過第4圖中其中一第一貫孔108與對應之第二貫孔110。該些第一貫孔108之排列外形與該些第二貫孔110之排列外形係不同，例如，該些第一貫孔108排列成六邊形，而該些第二貫孔110排列成四邊形。雖此，請參照第5圖，其繪示本實施例之檢測針腳交叉之示意圖。藉由該些第二部分106b彼此交叉設置，可使設於第一板件102與第二板件104之間的該些第二部分106b的長度差異縮小，甚至使該些第二部分106b之長度大致上相等。The arrangement shape of the first through holes may be different or similar to the arrangement shape of the corresponding second through holes. For example, please refer to FIG. 4 , which is a schematic diagram showing the arrangement of the first through holes of the first plate and the second through holes of the second plate of FIG. 1 . FIG. 4 illustrates only the first through holes 108 in a partial area of the first plate member 102 and the second through holes 110 in a partial area of the second plate member 104. The detecting pin 106 (not shown in FIG. 4) can pass through one of the first through holes 108 and the corresponding second through hole 110 in FIG. The arrangement of the first through holes 108 is different from the arrangement of the second through holes 110. For example, the first through holes 108 are arranged in a hexagonal shape, and the second through holes 110 are arranged in a quadrangular shape. . However, please refer to FIG. 5, which illustrates a schematic diagram of detecting the intersection of stitches in the embodiment. By the two second portions 106b being disposed to cross each other, the difference in length between the second portions 106b disposed between the first plate member 102 and the second plate member 104 can be reduced, and even the second portions 106b can be The lengths are roughly equal.

在其它實施態樣中，請參照第6圖，其繪示其它實施態樣之第一板件之第一貫孔與第二板件之第二貫孔的排列外形示意圖。第一板件202具有數個第一貫孔208，第二板件204具有數個第二貫孔210，該些第一貫孔208對應於該些第二貫孔210。該些第一貫孔208之排列外形相似於該些第二貫孔210的排列外形，例如，第一貫孔208排列成四邊形，而第二貫孔110亦排列成相似的四邊形。相似地，可藉由該些第二部分106b彼此交叉設置，使設於第一板件202與第二板件204間之該些第二部分106b的長度差異縮小，甚至使該些第二部分106b之長度大致上相等。In other embodiments, please refer to FIG. 6 , which is a schematic diagram showing the arrangement of the first through holes of the first plate and the second through holes of the second plate in other embodiments. The first plate member 202 has a plurality of first through holes 208, and the second plate member 204 has a plurality of second through holes 210, and the first through holes 208 correspond to the second through holes 210. The arrangement of the first through holes 208 is similar to the arrangement of the second through holes 210. For example, the first through holes 208 are arranged in a quadrangular shape, and the second through holes 110 are also arranged in a similar quadrangular shape. Similarly, the lengths of the second portions 106b disposed between the first plate member 202 and the second plate member 204 may be reduced by the intersection of the second portions 106b, and even the second portions may be reduced. The length of 106b is substantially equal.

綜上所述，無論多個第一貫孔108的排列外形與對應之該些第二貫孔110的排列外形係相同或相異，藉由第二部分106b彼此交叉設置，可縮小該些第二部分106b之長度差異，使對應之該些檢測針腳106的受力較一致。In summary, regardless of the arrangement shape of the plurality of first through holes 108 and the arrangement shape of the corresponding second through holes 110 are the same or different, the second portions 106b can be arranged to cross each other to reduce the number of the first through holes 108. The difference in length between the two portions 106b makes the corresponding force of the detecting pins 106 relatively uniform.

此外，當該些第一貫孔208(繪示於第6圖)之排列外形相似於該些第二貫孔210的排列外形(如第6圖所示)時，藉由檢測針腳106穿過位置相對應之第一貫孔208與第二貫孔210，使每根檢測針腳106之第二部分106b大致上平行地配置。例如，第一貫孔208’位於排列外形(四邊形)之相對位置，與第二貫孔210’位於排列外形(四邊形)之相對位置大致上一致，而第一貫孔208”位於排列外形之相對位置，與第二貫孔210”位於排列外形之相對位置大致上一致。穿過對應之第一貫孔208’與第二貫孔210’的檢測針腳與穿過對應之第一貫孔208”與第二貫孔210”的檢測針腳，其第二部分的長度大致上相同。In addition, when the arrangement of the first through holes 208 (shown in FIG. 6) is similar to the arrangement shape of the second through holes 210 (as shown in FIG. 6), the detection pin 106 passes through The first through hole 208 and the second through hole 210 corresponding to each other are disposed such that the second portion 106b of each of the detecting pins 106 is disposed substantially in parallel. For example, the first through hole 208' is located at a relative position of the aligned shape (quadrilateral shape), and substantially coincides with the relative position of the second through hole 210' at the aligned shape (quadrilateral shape), and the first through hole 208" is located at the relative position of the aligned shape. The position is substantially identical to the relative position of the second through hole 210" in the aligned shape. Passing through the detecting pin of the corresponding first through hole 208' and the second through hole 210' and the detecting pin passing through the corresponding first through hole 208" and the second through hole 210", the length of the second portion is substantially the same.

本發明縮小該些第二部分106b之長度差異並不侷限於上述方法。在其它實施態樣中，請參照第7圖，其繪示其它實施態樣之第一板件、第二板件及檢測針腳的剖視圖。第一板件402具有第一段差面402c1、第二段差面402c2以及相對之第一面402a與第二面402b。其中，第一面402a、第一段差面402c1及第二段差面402c2朝向第二板件404。第一面402a與第一段差面402c1相距一段差距離S2，第一段差面402c1與第二段差面402c2相距一段差距離S3，使得第一面402a、第一段差面402c1及第二段差面402c2分別與第二板件404相距不同距離。藉此段差結構，可增加第二部分106b之長度的設計彈性，使設於第一板件402與第二板件404之間的該些第二部分106b的長度差異縮小。The narrowing of the length of the second portion 106b of the present invention is not limited to the above method. In other embodiments, please refer to FIG. 7 , which illustrates a cross-sectional view of the first plate, the second plate, and the detecting pin of other embodiments. The first plate 402 has a first step surface 402c1, a second step surface 402c2, and an opposite first surface 402a and second surface 402b. The first surface 402a, the first step surface 402c1, and the second step surface 402c2 face the second plate member 404. The first surface 402a is spaced apart from the first differential surface 402c1 by a distance S2, and the first differential surface 402c1 and the second differential surface 402c2 are separated by a distance S3, such that the first surface 402a, the first differential surface 402c1 and the second differential surface 402c2 They are respectively at different distances from the second plate 404. With this step structure, the design flexibility of the length of the second portion 106b can be increased, and the difference in length between the second portions 106b disposed between the first plate member 402 and the second plate member 404 can be reduced.

此外，多個第一貫孔的分布區域與對應之該些第二貫孔的分布區域可重疊或彼此錯開一距離。例如，請參照第8圖，其繪示第1圖之第一板件之第一貫孔與第二板件之第二貫孔的分布區域示意圖。一些第一貫孔108的分布區域R1與對應之該些第二貫孔110的分布區域R2係重疊，進一步地說，分布區域R1之至少一部分與分布區域R2之至少一部分係沿著貫孔(第一貫孔108或第二貫孔110)之延伸方向重疊。In addition, the distribution area of the plurality of first through holes and the corresponding distribution areas of the second through holes may overlap or be offset from each other by a distance. For example, please refer to FIG. 8 , which is a schematic view showing a distribution area of a first through hole of a first plate member and a second through hole of a second plate member in FIG. 1 . The distribution area R1 of the first through holes 108 overlaps with the distribution area R2 corresponding to the second through holes 110. Further, at least a part of the distribution area R1 and at least a part of the distribution area R2 are along the through hole ( The extending direction of the first constant hole 108 or the second through hole 110) overlaps.

又例如，請參照第9圖，其繪示其它實施態樣之第一板件之第一貫孔與第二板件之第二貫孔的分布區域示意圖。其它實施態樣中，第一板件302具有多個第一貫孔308，第二板件304具有多個第二貫孔310。其中一些第一貫孔308的分布區域R3與對應之該些第二貫孔310的分布區域R4係不重疊。進一步地說，分布區域R3與分布區域R4係沿著與貫孔(第一貫孔108或第二貫孔110)之延伸方向垂直的方向錯開一距離S1。For example, please refer to FIG. 9 , which illustrates a schematic view of a distribution area of a first through hole of a first plate member and a second through hole of a second plate member in other embodiments. In other implementations, the first plate 302 has a plurality of first through holes 308 and the second plate 304 has a plurality of second through holes 310. The distribution area R3 of some of the first through holes 308 does not overlap with the distribution area R4 of the corresponding second through holes 310. Further, the distribution region R3 and the distribution region R4 are shifted by a distance S1 in a direction perpendicular to the extending direction of the through hole (the first through hole 108 or the second through hole 110).

本發明上述實施例之檢測針腳及應用其之檢測裝置，檢測針腳可排列成陣列形且二相鄰之檢測針腳的間距甚小，可檢測電性接點呈陣列形且其間距甚小的半導體封裝件。The detecting pin and the detecting device using the same according to the above embodiments of the present invention, the detecting pin can be arranged in an array shape and the spacing between two adjacent detecting pins is very small, and the semiconductor having the array of electrical contacts and having a small spacing can be detected. Package.

綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100．．．檢測裝置100. . . Testing device

102、202、302、402．．．第一板件102, 202, 302, 402. . . First plate

402c1．．．第一段差面402c1. . . First section

402c2．．．第二段差面402c2. . . Second paragraph

102a、112a、402a．．．第一面102a, 112a, 402a. . . First side

102b、112b、402b．．．第二面102b, 112b, 402b. . . Second side

104、204、304、404．．．第二板件104, 204, 304, 404. . . Second plate

106．．．檢測針腳106. . . Detecting stitches

106a．．．第一部分106a. . . first part

106b、206b．．．第二部分106b, 206b. . . the second part

106b1．．．第二部份之一端106b1. . . One of the second parts

106c、206c．．．第三部分106c, 206c. . . the third part

106c1．．．檢測端106c1. . . Detection side

108、208、208’、208”、308．．．第一貫孔108, 208, 208', 208", 308... first through hole

110、210、210’、210”、310．．．第二貫孔110, 210, 210', 210", 310... second through hole

112．．．電路板112. . . Circuit board

114．．．貫穿部114. . . Penetration

116．．．第一凹槽116. . . First groove

118．．．第二凹槽118. . . Second groove

120．．．固定元件120. . . Fixed component

A1．．．第一夾角A1. . . First angle

A2．．．第二夾角A2. . . Second angle

D1．．．外徑D1. . . Outer diameter

L1、S1．．．距離L1, S1. . . distance

L3．．．長度L3. . . length

P1．．．間距P1. . . spacing

R1、R2、R3、R4．．．分布區域R1, R2, R3, R4. . . distribution area

S2、S3．．．段差距離S2, S3. . . Step distance

第1圖繪示依照本發明一實施例之檢測裝置之剖視圖。1 is a cross-sectional view of a detecting device in accordance with an embodiment of the present invention.

第2圖繪示第1圖中局部2’的放大示意圖。Fig. 2 is an enlarged schematic view showing a portion 2' in Fig. 1.

第3圖繪示依照本發明其它實施態樣之檢測針腳之第三部分的示意圖。FIG. 3 is a schematic view showing a third portion of the detecting stitch according to another embodiment of the present invention.

第4圖繪示第1圖之第一板件之第一貫孔與第二板件之第二貫孔的排列外形示意圖。FIG. 4 is a schematic view showing the arrangement of the first through holes of the first plate and the second through holes of the second plate of FIG. 1 .

第5圖繪示本實施例之檢測針腳交叉之示意圖。FIG. 5 is a schematic view showing the intersection of the detection stitches in the embodiment.

第6圖繪示其它實施態樣之第一板件之第一貫孔與第二板件之第二貫孔的排列外形示意圖。FIG. 6 is a schematic view showing the arrangement of the first through holes of the first plate member and the second through holes of the second plate member in other embodiments.

第7圖繪示其它實施態樣之第一板件、第二板件及檢測針腳的剖視圖。FIG. 7 is a cross-sectional view showing the first plate member, the second plate member, and the detecting pin of other embodiments.

第8圖繪示第1圖之第一板件之第一貫孔與第二板件之第二貫孔的分布區域示意圖。FIG. 8 is a schematic view showing a distribution area of the first through hole of the first plate member and the second through hole of the second plate member in FIG. 1 .

第9圖繪示其它實施態樣之第一板件之第一貫孔與第二板件之第二貫孔的分布區域示意圖。FIG. 9 is a schematic view showing a distribution area of the first through hole of the first plate member and the second through hole of the second plate member in other embodiments.

102．．．第一板件102. . . First plate

102a．．．第一面102a. . . First side

102b．．．第二面102b. . . Second side

104．．．第二板件104. . . Second plate

106．．．檢測針腳106. . . Detecting stitches

106a．．．第一部分106a. . . first part

106b．．．第二部分106b. . . the second part

106b1．．．第二部份之一端106b1. . . One of the second parts

106c．．．第三部分106c. . . the third part

106c1．．．檢測端106c1. . . Detection side

108．．．第一貫孔108. . . First consistent hole

110．．．第二貫孔110. . . Second through hole

120．．．固定元件120. . . Fixed component

A1．．．第一夾角A1. . . First angle

A2．．．第二夾角A2. . . Second angle

D1．．．外徑D1. . . Outer diameter

L1．．．距離L1. . . distance

L3．．．長度L3. . . length

P1．．．間距P1. . . spacing

Claims (13)

一種檢測針腳，用以檢測一半導體元件，該半導體元件具有複數個電性接點，該檢測針腳包括：一第一部分；一第二部分；以及一第三部分，用以接觸該些電性接點之一者；其中，該第二部分連接該第一部分與該第三部分、該第二部分之截面積係往該第三部分的方向漸縮且該第二部分與該第三部分間夾一第一夾角，該第一夾角介於155度至185度之間。A detecting pin for detecting a semiconductor component, the semiconductor component having a plurality of electrical contacts, the detecting pin comprising: a first portion; a second portion; and a third portion for contacting the electrical contacts One of the points; wherein the second portion is connected to the third portion, the cross-sectional area of the second portion is tapered toward the third portion, and the second portion is sandwiched between the second portion and the third portion a first angle, the first angle being between 155 degrees and 185 degrees. 如申請專利範圍第1項所述之檢測針腳，其中該第一部分與該第二部分之間夾一第二夾角，該第一夾角與該第二夾角實質上相等。The detecting stitch of claim 1, wherein a first angle is formed between the first portion and the second portion, and the first angle is substantially equal to the second angle. 如申請專利範圍第1項所述之檢測針腳，其中該第一部分實質上平行於該第三部分。The detecting stitch of claim 1, wherein the first portion is substantially parallel to the third portion. 一種檢測裝置，用以檢測一半導體元件，該半導體元件具有複數個電性接點，該檢測裝置包括：一第一板件；以及複數根檢測針腳，穿過該第一板件設置，各該檢測針腳包括：一第一部分；一第二部分；及一第三部分，用以接觸該些電性接點之一者；其中，該第二部分連接該第一部分與該第三部分、該第二部分之截面積係往該第三部分的方向漸縮且該第二部分與該第三部分之間夾一第一夾角，該第一夾角介於155度至185度之間。A detecting device for detecting a semiconductor component having a plurality of electrical contacts, the detecting device comprising: a first plate member; and a plurality of detecting pins disposed through the first plate member, each of the The detecting pin includes: a first portion; a second portion; and a third portion for contacting one of the electrical contacts; wherein the second portion connects the first portion and the third portion, the first portion The cross-sectional area of the two portions is tapered toward the third portion and a first angle is sandwiched between the second portion and the third portion, the first angle being between 155 degrees and 185 degrees. 如申請專利範圍第4項所述之檢測裝置，其中該第一部分穿過該第一板件設置，該檢測裝置更包括：一第二板件，相對該第一板件配置，該第三部分穿過該第二板件設置。The detecting device of claim 4, wherein the first portion is disposed through the first plate, the detecting device further comprising: a second plate member disposed opposite to the first plate member, the third portion Pass through the second panel setting. 如申請專利範圍第5項所述之檢測裝置，其中該第一板件具有一第一面及一段差面，該第一面及該段差面朝向該第二板件，且該第一面與該段差面相距一段差距離。The detecting device of claim 5, wherein the first panel has a first surface and a difference surface, the first surface and the differential surface face the second panel, and the first surface is The difference between the sections is a distance apart. 如申請專利範圍第4項所述之檢測裝置，更包括：一電路板，具有相對之一第一面與一第二面，該第一板件設於該電路板之該第一面；其中，該第一部分延伸至該電路板之該第二面。The detecting device of claim 4, further comprising: a circuit board having a first surface and a second surface, wherein the first panel is disposed on the first side of the circuit board; The first portion extends to the second side of the circuit board. 如申請專利範圍第7項所述之檢測裝置，其中該電路板更具有一貫穿部，該第一部分經過該貫穿部延伸至該電路板之該第二面。The detecting device of claim 7, wherein the circuit board further has a through portion, the first portion extending through the through portion to the second side of the circuit board. 如申請專利範圍第4項所述之檢測裝置，其中該第一部分、該第二部分與該第三部分係一體成形。The detecting device of claim 4, wherein the first portion, the second portion, and the third portion are integrally formed. 如申請專利範圍第4項所述之檢測裝置，更包括：一固定元件，結合該第一板件與該檢測針腳，以將該檢測針腳固定於該第一板件上。The detecting device of claim 4, further comprising: a fixing component, the first plate member and the detecting pin are coupled to fix the detecting pin to the first plate member. 如申請專利範圍第10項所述之檢測裝置，其中該第一板件具有相對之一第一面與一第二面，該第一部分從該第一板件之該第一面延伸至該第一板件之該第二面，該固定元件設於該第一板件之該第一面與該第二面中之一者。The detecting device of claim 10, wherein the first panel has a first surface and a second surface, the first portion extending from the first surface of the first panel to the first The second surface of a plate member is disposed on one of the first side and the second side of the first plate member. 如申請專利範圍第4項所述之檢測裝置，其中該第一部分與該第二部分間夾一第二夾角，該第一夾角與該第二夾角實質上相等。The detecting device of claim 4, wherein the first portion and the second portion are sandwiched by a second angle, the first angle being substantially equal to the second angle. 如申請專利範圍第4項所述之檢測裝置，其中該第一部分與該第三部分實質上平行。The detecting device of claim 4, wherein the first portion is substantially parallel to the third portion.