WO2018179655A1 - Mold releasing film and method for manufacturing flexible printed circuit board - Google Patents

Mold releasing film and method for manufacturing flexible printed circuit board Download PDF

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Publication number
WO2018179655A1
WO2018179655A1 PCT/JP2017/047063 JP2017047063W WO2018179655A1 WO 2018179655 A1 WO2018179655 A1 WO 2018179655A1 JP 2017047063 W JP2017047063 W JP 2017047063W WO 2018179655 A1 WO2018179655 A1 WO 2018179655A1
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WIPO (PCT)
Prior art keywords
layer
release film
cushion layer
adhesive
laminate
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Application number
PCT/JP2017/047063
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French (fr)
Japanese (ja)
Inventor
田中　秀明
優人 谷川
勝司 安田
喜吉 平塚
正志 中島
Original Assignee
日本メクトロン株式会社
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Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Publication of WO2018179655A1 publication Critical patent/WO2018179655A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a release film and a method for producing a flexible printed board.
  • the current release film is discarded when the cover film is laminated. Therefore, there is a problem that resources are wasted and the cost is increased by the need for a new release film.
  • the present invention has been made on the basis of the above circumstances. (1) To provide a release film capable of satisfactorily preventing tearing of the release film due to the spread of the end side of the cushion layer; (2) Waste of resources. It is an object of the present invention to provide at least one of a releasable release film and a method for producing a flexible printed circuit board.
  • a release film comprising: an adhesive layer that is attached to a base layer and has an exposed trap portion that protrudes from an end side of the cushion layer.
  • the adhesive layer has an acrylic resin as a main component.
  • the trap portion protrudes at least 3 mm from the end of the cushion layer.
  • the cushion layer is mainly composed of polypropylene.
  • the cushion layer is mainly composed of unstretched polypropylene or inflation polypropylene among polypropylene.
  • a cover film is temporarily adhered with respect to the base laminated body which has an insulating resin layer and a pattern layer, and a temporary adhesion body is formed.
  • a base layer mainly composed of a polyester-based resin, a cushion layer mainly composed of an olefin-based resin, a cushion layer attached to the base layer, and an end of the cushion layer
  • a second step of aligning the release film having an adhesive layer that protrudes from the portion side and has an exposed trap portion with respect to the temporary adhesive body from the cover film side The third step of laminating the cover film on the base laminate to form the laminate by heating and pressing the temporary adhesive through the film, and after the third step, In the fourth step of peeling the release film having a temperature lower than that of the laminate from the laminate, and in the release film after peeling, the cushion layer is peeled off from the adhesive layer and a new cushion layer is attached to the adhesive layer. And a step of returning to the first step again after the fifth step and repeating each step.
  • FIG. 4 is an enlarged plan view showing a state near a boundary where a pattern layer and a cover film are bonded to each other according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing a state when a laminate is cut along the line II-II shown in FIG.
  • FIG. 7 is a cross-sectional view showing a state in which the laminate is cut along the line III-III shown in FIG.
  • FIG. 7 is a cross-sectional view taken along the line IV-IV in FIG. 6 and is a diagram showing the flow of the adhesive layer in a portion close to the pattern layer, although it is not a cross section of the pattern layer.
  • FIG. 7 is a cross-sectional view showing a state when a laminate is cut along the line II-II shown in FIG. 6 when the release film of Comparative Example 1 is used.
  • FIG. 7 is a cross-sectional view showing a state in which the laminate is cut along the line III-III shown in FIG.
  • FIG. 7 is a cross-sectional view taken along the line IV-IV in FIG. 6 when the release film of Comparative Example 1 is used, and is a view showing the flow of the adhesive layer in a portion close to the pattern layer, but not the cross section of the pattern layer It is. It is a figure which concerns on one embodiment of this invention and shows the image which peels a release film from a laminated body. It is a figure which concerns on one embodiment of this invention and shows the image which peels a cushion layer from the adhesion layer.
  • FIG. 6 is a plan view showing a state of measurement of the length of the adhesive flowing out in the laminate 50 according to the embodiment of the present invention.
  • FIG. 25 is a diagram showing the maximum flow-out length when PMP is used as a cushion layer material in Comparative Examples 31 to 35. It is a figure which concerns on one embodiment of this invention and shows about the maximum length of the outflow when CPP with a thickness of 20 ⁇ m is used as the material of the cushion layer.
  • FIG. 27 is a diagram illustrating a state in which lamination is performed from the state illustrated in FIG. 26 according to an embodiment of the present invention, in which a part of the cushion layer flows out to the outside and a flow-out portion is formed.
  • FIG. 28 is a side cross-sectional view illustrating a state where lamination is performed from the state illustrated in FIG. 27 according to an embodiment of the present invention, in which a part of the cushion layer flows out to the outside and a flow-out portion is formed.
  • the Z direction is the thickness direction of each film
  • Z1 is the back side (upper side; front side) in FIG. 1
  • Z2 is the front side (lower side; back side) in FIG.
  • FIG. 1 is a cross-sectional view showing configurations of the base laminate 10 and the cover film 20.
  • the base laminate 10 is obtained by etching a metal foil having a predetermined thickness, such as a copper clad laminate, and forming the metal foil into a desired pattern shape.
  • the base laminate 10 includes an insulating resin layer 11 and a pattern layer 12.
  • the insulating resin layer 11 is made of polyimide having a predetermined thickness and electrical insulation. Examples of the thickness of the insulating resin layer 11 include 25 ⁇ m (1 mil) and 12.5 ⁇ m (1/2 mil), but other thicknesses may be used.
  • the pattern layer 12 is a portion obtained by patterning a metal foil having a predetermined thickness such as a copper foil into a desired pattern shape by using a normal photofabrication technique such as etching.
  • Examples of the thickness of the pattern layer 12 include 35 ⁇ m (1 oz), 17.5 ⁇ m (1/2 oz), and 12 ⁇ m (1/3 oz), but other thicknesses may be used.
  • the base laminate 10 may have other layers.
  • an adhesive for adhering these is provided between the insulating resin layer 11 and the pattern layer 12 (not shown).
  • the thickness of the adhesive may be 10 ⁇ m or 12 ⁇ m, for example, but the thickness can be set as appropriate.
  • the cover film 20 laminated on the base laminate 10 described above has a cover layer 21 and an adhesive layer 22.
  • the cover layer 21 is made of polyimide. Examples of the thickness of the cover layer 21 include 25 ⁇ m (1 mil) and 12.5 ⁇ m (1/2 mil), but other thicknesses may be used.
  • the adhesive layer 22 is mainly made of, for example, an epoxy adhesive, but a polyurethane adhesive or an acrylic adhesive may also be used.
  • the adhesive layer 22 has a thickness of 28 ⁇ m, for example, but may have a thickness other than this.
  • the cover film 20 has an opening 23.
  • the opening 23 is a portion that has been drilled with, for example, a laser.
  • FIG. 2 is a cross-sectional view showing the configuration of the release film 30.
  • the release film 30 has a base layer 31, an adhesive layer 32, and a cushion layer 33.
  • the base layer 31 is composed mainly of a polyester resin.
  • polyester resins include those containing PET (PolyethylenelyTerephthalate) as the main component, those containing PBT (Polybutylene Terephtalate) as the main component, those containing PTT (Polytrimethylene Terephtalate) as the main component, and PEN (Polyethylene Naphthalate).
  • PET PolyethylenelyTerephthalate
  • PBT Polybutylene Terephtalate
  • PTT Polytrimethylene Terephtalate
  • PEN Polyethylene Naphthalate
  • a main component of PBN Polybutylene Naphthalate
  • those containing PET as a main component are particularly preferred from the viewpoint of availability.
  • those listed or other than listed may be used as the main component.
  • the adhesive layer 32 includes, for example, an acrylic adhesive mainly composed of an acrylic resin.
  • the pressure-sensitive adhesive layer 32 is not limited to an acrylic pressure-sensitive adhesive, and is mainly composed of a rubber-based pressure-sensitive adhesive in which a tackifier is added to natural rubber, a silicone-based pressure-sensitive adhesive in which a tackifier is added to silicone rubber, and polyurethane. Examples include urethane-based pressure-sensitive adhesives. Among these, an acrylic pressure-sensitive adhesive is preferable because it is easily available and can be repeatedly used.
  • the cushion layer 33 covers the cover film 20 from the cover film 20 side (upper side; Z1 side) when laminating the cover film 20 and the base laminate 10 by heating and pressurization, This is a portion that follows the unevenness of the base laminate 10. That is, when laminating the cover film 20 on the base laminate 10, it is a part that prevents the adhesive material from flowing out of the adhesive material layer 22 by following the unevenness existing therebetween.
  • the cushion layer 33 is mainly composed of an olefin resin.
  • olefin resins include polypropylene resins, polyethylene resins, and polypentene resins.
  • a polypropylene resin and a polyethylene resin are preferable in that the flow of the adhesive layer 22 can be satisfactorily suppressed.
  • polypropylene resins CPP (Cast Polypropylene) and IPP (Inflation Polypropylene) have a good surface slipperiness, and even if the release film 30 is peeled off after lamination, a laminate is obtained. This is particularly preferable because generation of 50 wrinkles can be prevented.
  • polyethylene resins LDPE (Low Density Polyethylene) has good surface slipperiness, and even if the release film 30 is peeled off after lamination, generation of wrinkles in the laminate 50 can be prevented. Is particularly preferred.
  • the adhesive layer 32 has a portion that is not adhered to the cushion layer 33. That is, as shown in FIG. 2, the adhesive layer 32 has a trap portion 34 that protrudes from the end side of the cushion layer 33 and is exposed to the outside.
  • the trap portion 34 is a portion that traps (holds) the cushion layer 33 that spreads during lamination on the end side of the cushion layer 33. This prevents the cushion layer 33 from unnecessarily spreading and prevents a thin portion from being formed in the cushion layer 33.
  • the trap portion 34 may have any size as long as it can trap the spread cushion layer 33 well, but in a direction along the surface of the release film 30 (a direction orthogonal to the Z direction). It is preferable that it exists 3 mm or more.
  • FIG. 3 is a cross-sectional view showing the configuration of the temporary adhesive body 40.
  • the adhesive layer 22 is not sufficiently deformed, and is thus only partially bonded to the base laminate 10.
  • FIG. 3 shows a state in which the adhesive layer 22 has not reached the surface of the insulating resin layer 11 as such an image.
  • FIG. 4 is a cross-sectional view showing the configuration of the laminate 50.
  • FIG. 5 is a plan view showing a state in which the laminate 50 is viewed from the upper side (Z1 side).
  • FIG. 4 shows a state cut along line II in FIG.
  • the laminate 50 corresponds to a flexible printed board, it may be understood that what is formed through various processes on the laminate 50 corresponds to the flexible printed board.
  • the opening part 23 of the cover film 20 is aligned with the pattern part 12a (the remaining part of the metal foil) of the pattern layer 12.
  • the pattern layer 12 is electrically connected by performing a subsequent plating process on the conductive portion provided outside the opening 23. It becomes possible.
  • the opening 23 includes a portion having a depth to the pattern layer 12 (one-step opening 231) and a portion having a depth deeper than the pattern layer 12 and to the insulating resin layer 11 (two steps).
  • An opening 232 may be employed.
  • the opening 23 may have any shape.
  • it may have a slit shape as shown in FIG. 5, a circular hole shape, a rectangular shape, an elliptical shape, or other shapes.
  • FIG. 6 it is good also as a structure which the cover film 20 exists only in the one side of the pattern part 12a of the pattern layer 12, and does not exist in the other side.
  • a method for manufacturing a flexible printed board using the base laminate 10, the cover film 20, and the release film 30 having the above-described configuration will be described below.
  • the first to sixth steps are sequentially described, but it is needless to say that various steps other than these may exist.
  • the flow of the adhesive material of the adhesive material layer 22 will also be described.
  • FIG. 7 is a view showing a state of alignment between the temporary adhesive body 40 and the release film 30.
  • the mounting plate 100 is made of a resin that is more flexible than a metal such as PET (Polyethylene Terephthalate) or PBT (Polybutylene Terephthalate).
  • PET Polyethylene Terephthalate
  • PBT Polybutylene Terephthalate
  • the temporary adhesive body 40 is preheated so that it may become predetermined
  • the temporary adhesive body 40 and the release film 30 are aligned.
  • the release film 30 covers the temporary adhesive body 40.
  • the release film 30 is disposed at the position. In this alignment, the release film 30 may be in light contact with the upper surface of the temporary adhesive body 40.
  • the laminate 50 is formed by pressing the temporary adhesive 40 using the release film 30.
  • a hot plate (not shown) is disposed on the release film 30.
  • the hot plate is heated to a predetermined temperature such as 180 degrees.
  • the temperature of the hot plate may be around 180 degrees as long as the adhesive layer 22 and the cushion layer 33 are melted.
  • the temporary adhesive body 40 is pressed through the hot plate and the release film 30 with a predetermined pressing force.
  • the pressing time is, for example, about 10 seconds to 30 seconds.
  • FIG. 8 is a view showing a state after the release film 30 is pressed against the temporary adhesive body 40 via a hot plate. As shown in FIG. 8, the cushion layer 33 melts, and the cushion layer 33 follows the uneven shape on the surface side of the cover film 20. Therefore, the melted cushion layer 33 enters the opening 23 or turns around to cover the side surface at the end of the base laminate 10.
  • the adhesive layer 22 of the cover film 20 is also softened, and the adhesive constituting the adhesive layer 22 melts and flows out. Thereby, the adhesive layer 22 follows the unevenness of the surface of the base laminate 10. Therefore, the adhesive layer 22 is bonded to the base laminate 10.
  • the cushion layer 33 and the adhesive layer 22 are compared, the cushion layer 33 is first melted than the adhesive layer 22. Therefore, in the opening 23, the melted cushion layer 33 enters before the melted adhesive layer 22 and occupies the opening 23. Therefore, the flow of the adhesive layer 22 is suppressed at the opening 23. Similarly, at the end of the base laminate 10, the adhesive layer 22 is prevented from flowing out by covering the side surface before the melted adhesive layer 22 is covered.
  • FIG. 9 is an enlarged plan view showing a state near the boundary where the pattern layer 12 and the cover film 20 are bonded together.
  • FIG. 10 is a cross-sectional view showing a state when the laminate 50 is cut along the line II-II shown in FIG.
  • FIG. 11 is a cross-sectional view showing a state when the laminate 50 is cut along the line III-III shown in FIG. 6, and is a view showing the flow of the adhesive layer 22 in a portion close to the cover film 20.
  • FIG. 12 is a cross-sectional view taken along the line IV-IV in FIG. 6, and is a view showing the flow of the adhesive layer 22 at a portion close to the pattern layer 12 but not the cross section of the pattern layer 12.
  • FIGS. 13 to 15 show how the adhesive material flows out of the adhesive layer 22 when Comparative Example 1 is used as a release film that is currently used.
  • the release film uses PMP (polymethylpentene) made of polymethylpentene resin at a portion corresponding to the cushion layer 33.
  • FIG. 13 is a cross-sectional view showing a state in which the laminate 50 is cut along the line II-II shown in FIG. 6 when the release film of Comparative Example 1 is used.
  • 14 is a cross-sectional view showing a state when the laminate 50 is cut along the line III-III shown in FIG. 6 when the release film of Comparative Example 1 is used, and is close to the cover film 20.
  • part. 15 is a cross-sectional view taken along the line IV-IV in FIG. 6 when the release film of Comparative Example 1 is used, and is not a cross-section of the pattern layer 12 but an adhesive in a portion close to the pattern layer 12 It is a figure which shows the outflow of the layer 22.
  • FIG. 16 is a diagram illustrating an image in which the release film 30 is peeled from the laminate 50.
  • this intermediate may be interpreted as a flexible printed circuit board.
  • the finished product of a flexible printed circuit board is obtained through various processes with respect to an intermediate.
  • FIG. 17 is a diagram illustrating an image in which the cushion layer 33 is peeled off from the adhesive layer 32.
  • FIG. 18 is a diagram illustrating an image in which a new cushion layer 33 is pasted to the adhesive layer 32, and is a diagram illustrating a state immediately before being pasted.
  • the adhesion layer 32 is adhere
  • the process returns again to the first step, and a new laminate 50 is formed. At this time, the release film 30 as a recycled product is used again in the second and subsequent steps.
  • CPP is Example 1
  • IPP is Example 2
  • LDPE is Example 3
  • TPX is Comparative Example 1
  • OPP is Comparative Example 2.
  • the base layer 31 of the release film 30 is made of PET and has a thickness of 50 ⁇ m.
  • the adhesive layer 32 has a thickness of 7 ⁇ m.
  • the release film 30 has a trap portion 34, and the trap portion 34 protrudes 3 mm from the end portion of the cushion layer 33.
  • an epoxy adhesive was used as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20. Further, as an adhesive (not shown) between the insulating resin layer 11 and the pattern layer 12, an epoxy adhesive was used as an adhesive (not shown) between the insulating resin layer 11 and the pattern layer 12.
  • the thickness of the copper pattern layer 12 is 35 ⁇ m
  • the thickness of the insulating resin layer 11 made of polyimide is 25 ⁇ m
  • the copper pattern layer 12 and the insulating resin layer 11 H1 / H2 which is the ratio of the width H1 of the pattern portion 12a and the width H2 between the adjacent pattern portions 12a, is 260 ⁇ m / 140 ⁇ m.
  • the thickness of the cover layer 21 made of polyimide is 25 ⁇ m
  • the thickness of the adhesive layer 22 is 28 ⁇ m.
  • the laminating conditions when using the laminating apparatus are as follows: the heating temperature is 185 degrees, the press pressure is 2 MPa, the preheating time is 10 seconds (the preheating temperature is equal to the heating temperature), and the pressing time is 80 seconds.
  • Table 1 the maximum dimension of the adhesive on the pattern portion 12a shown in FIG. 6 was measured.
  • the cushion layer 33 was also evaluated for tearing (releasability). In this evaluation, “B” indicates that the cushion layer 33 is not torn, and “D” indicates that the cushion layer 33 is torn. In Table 1, the wrinkles of the laminated body 50 after lamination were also evaluated. In this evaluation, “B” indicates that the laminate 50 does not have wrinkles, and “D” indicates that the laminate 50 has wrinkles.
  • the CPP of Example 1, the IPP of Example 2, and the LDPE of Example 3 are not unsuitable as the material of the cushion layer 33 in any of the three evaluation items. Therefore, the CPP of Example 1, the IPP of Example 2, and the LDPE of Example 3 are suitable as materials for the cushion layer 33.
  • the OPP of Comparative Example 2 was wrinkled on the laminate 50 after lamination. Therefore, OPP is not suitable as a material for the cushion layer 33.
  • the flow of the adhesive material was larger than 100 ⁇ m on the pattern portion 12a, and the flow of the adhesive material was larger than 150 ⁇ m in the space 14. Therefore, PMP is not suitable as a material for the cushion layer 33.
  • the thickness of the cushion layer 33 of the release film 30 was evaluated.
  • Table 2 shows the evaluation results when the thickness of the cushion layer 33 is 20 ⁇ m (Comparative Example 3), 40 ⁇ m (Example 4), and 60 ⁇ m (Example 5).
  • the material of the cushion layer 33 is CPP
  • the length of the flow of the adhesive, the tearing of the cushion layer 33 (releasability), and the wrinkles of the laminated body 50 after the lamination are evaluated as in Table 1. evaluated.
  • the evaluation criteria are the same as in Table 1.
  • the laminating apparatus used the configuration of the materials and thicknesses of other members (cover film 20 and release film 30), the laminating conditions, and the like are the same as those in Table 1 described above. Accordingly, the release film 30 also has a trap portion 34.
  • Example 4 and Example 5 In the evaluation of Table 2 described above, regarding the flow-out of the adhesive, in Example 4 and Example 5, none of the three evaluation items is unsuitable as the material of the cushion layer 33. Therefore, in the case of 40 ⁇ m in Example 4 and 60 ⁇ m in Example 5, the thickness of the cushion layer 33 is suitable. On the other hand, in Comparative Example 3, the cushion layer 33 was torn. Therefore, in the case of 20 ⁇ m in Comparative Example 3, the thickness of the cushion layer 33 is not suitable.
  • the thickness of the copper pattern layer 12 is 12 ⁇ m, 18 ⁇ m, and 35 ⁇ m
  • the thickness of the cushion layer 33 is 20 ⁇ m, 40 ⁇ m, and 60 ⁇ m.
  • Example 3 shows the evaluation results when the thickness of the CPP (hereinafter simply referred to as CPP) which is the cushion layer 33 in Example 11 is 20 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • CPP the thickness of the CPP
  • Example 12 the evaluation results are obtained when the thickness of the CPP is 20 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m.
  • Example 13 is an evaluation result when the thickness of the CPP is 20 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • Example 14 is an evaluation result when the thickness of the CPP is 40 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • Example 15 is an evaluation result when the thickness of the CPP is 40 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m.
  • Example 16 is an evaluation result in the case where the thickness of the CPP is 40 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • Example 17 is an evaluation result when the thickness of the CPP is 60 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • Example 18 is an evaluation result in the case where the thickness of the CPP is 60 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m. Moreover, Example 18 is an evaluation result when the thickness of the CPP is 60 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • Comparative Example 11 is an evaluation result when PMP is used as the cushion layer 33 and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • Comparative Example 12 is an evaluation result when PMP is used as the cushion layer 33 and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m.
  • Comparative Example 13 is an evaluation result when PMP is used and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • the evaluation criteria are the same as in Table 1. Further, the laminating apparatus used, laminating conditions, and the like are the same as those in Table 1 described above.
  • Examples 11 to 19 when the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m (Examples 13, 16, and 19), the adhesive between the insulating resin layer 11 and the pattern layer 12 is used.
  • the thickness of the adhesive is 12 ⁇ m, otherwise the thickness of the adhesive is 10 ⁇ m.
  • the thickness of the pattern layer 12 is 12 ⁇ m (Examples 11, 14, and 19)
  • the thickness of the insulating resin layer 11 is 13 ⁇ m, and otherwise, the thickness of the insulating resin layer 11 is 25 ⁇ m. It is.
  • the dimension in the height direction of the pattern layer 12 (pattern part 12a) changes, it can be said that there is no problem in suppressing the outflow.
  • the thickness of the CPP is 20 ⁇ m
  • the flow of the adhesive is suppressed to 100 ⁇ m or less. Therefore, when the CPP is used as the material of the cushion layer 33, the followability to the unevenness of the pattern layer 12 is good. It can be said that there is.
  • the flow-out of the adhesive material could be suppressed to 100 ⁇ m at any position on the pattern portion 12 a and the space 14.
  • the flow-out of the adhesive exceeded 100 ⁇ m on the pattern portion 12a.
  • the flow-out of the adhesive exceeded 150 ⁇ m. Therefore, PMP is not suitable for use in the 35 ⁇ m pattern layer 12.
  • the material of the cushion layer 33 was CPP
  • the length of the adhesive flowing out was measured as in Table 1.
  • the thickness of the used laminating apparatus and other materials (base laminate 10 and cover film 20), lamination conditions, and the like are the same as those in Table 1 described above.
  • the measurement of the flow length of the adhesive material in the laminate 50 is performed as shown in FIG. That is, as shown in FIG. 19, the maximum lengths M1 and M2 of the adhesive material flowing out on the pattern portion 12a and in the space 14 are measured. On both the pattern portion 12a and the space 14, the maximum flow lengths M1 and M2 correspond to the maximum flow length from the end of the cover film 20 (cover layer 21) in the direction away from the cover film 20. is doing.
  • FIG. 20 to FIG. 23 are graphs showing the measured maximum lengths M1 and M2.
  • FIG. 20 is a diagram showing the maximum flow lengths M1 and M2 when PMP is used as the material of the cushion layer 33.
  • the maximum length M2 of the adhesive flowing out in the space 14 is particularly long.
  • the width S of the space 14 is 140 ⁇ m (in the case of the comparative example 31 in which the width L of the pattern portion 12a is 60 ⁇ m, the comparative example 32 in the case of 160 ⁇ m, and the comparative example 33 of 260 ⁇ m), and 240 ⁇ m (the width L of the pattern portion 12a is In any case of Comparative Example 4 (260 ⁇ m) and 340 ⁇ m (Comparative Example 35 where the width L of the pattern portion 12a is 460 ⁇ m), the maximum flow-out length M2 is larger than 150 ⁇ m. For this reason, in the space 14, it is considered that the maximum flow length M2 becomes longer regardless of the width L of the pattern portion 12a, and is not suitable as a material for the cushion layer 33.
  • the maximum length M1 of the adhesive material flowing out in the pattern portion 12a is longer than that in the case of FIGS. 21 to 23 described later.
  • the width L of the pattern portion 12a is 160 ⁇ m (in the case of Comparative Examples 31 and 31 in which the width S of the space 14 is 140 ⁇ m), 260 ⁇ m (in the case of Comparative Example 33 in which the width S of the space 14 is 140 ⁇ m) and )
  • the maximum flow-out length M1 is larger than 100 ⁇ m. Therefore, when the width L of the pattern portion 12a is 160 ⁇ m, 260 ⁇ m, and 460 ⁇ m, the maximum flow length M1 is long, which is inappropriate.
  • FIG. 21 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 20 ⁇ m is used as the material of the cushion layer 33 (Examples 21 to 25).
  • FIG. 22 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 40 ⁇ m is used as the material of the cushion layer 33 (Examples 26 to 30).
  • FIG. 23 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 60 ⁇ m is used as the material of the cushion layer 33 (Examples 31 to 35).
  • L / S which is a combination of the width L and the width S, is 60 ⁇ m / 140 ⁇ m (Examples 21, 26, 31), 160 ⁇ m / 140 ⁇ m (Examples 22, 27, 32), 260 ⁇ m / 140 ⁇ m (Examples 23, 28).
  • the maximum length M1 and M2 of the adhesive material can be kept short. ing.
  • the maximum flow-out length M ⁇ b> 2 in the space 14 is significantly lower than when PMP is used as the material of the cushion layer 33. Therefore, any thickness of CPP of 20 ⁇ m to 60 ⁇ m is suitable as a material for the cushion layer 33.
  • FIG. 26 is a plan view showing the release film 30 and the insulating resin layer 11 before lamination, and is a view transparently showing the positional relationship between the cushion layer 33 and the trap portion 34.
  • FIG. 27 is a side sectional view showing the arrangement of the release film 30 and the insulating resin layer 11 before lamination.
  • FIG. 28 shows a state in which lamination is performed from the state shown in FIG. 26, and shows a state in which a part of the cushion layer 33 flows out to the outside and a flow-out portion 33a is formed.
  • FIG. 29 is a side sectional view showing a state in which lamination is performed from the state shown in FIG. 27, and a state in which a part of the cushion layer 33 flows out to the outside and a flow-out portion 33 a is formed.
  • the adhesive layer 32 is provided with a trap part 34 that protrudes (protrudes) beyond the end side of the cushion layer 33, and the cushion layer 33 is easily peeled off depending on the presence or absence of the trap part 34. Evaluation was made regarding the length (prevention of tearing of the cushion layer 33).
  • Example 40 the example in which the thickness of the cushion layer 33 made of CPP is 40 ⁇ m and the trap portion 34 exists is referred to as Example 40. Further, the thickness of the cushion layer 33 made of CPP is 40 ⁇ m, but the one having no trap portion 34 is used as a comparative example 40. In Example 40, the trap portion 34 protrudes 3 mm from the end portion of the cushion layer 33.
  • the base layer 31 of the release film 30 is made of PET and has a thickness of 50 ⁇ m.
  • the adhesive layer 32 has a thickness of 7 ⁇ m.
  • the thickness of the copper pattern layer 12 is 35 ⁇ m
  • the thickness of the insulating resin layer 11 made of polyimide is 25 ⁇ m
  • the thickness of the adhesive between the copper pattern layer 12 and the insulating resin layer 11 is 12 ⁇ m.
  • the thickness of the cover layer 21 made of polyimide is 25 ⁇ m
  • the thickness of the adhesive layer 22 is 28 ⁇ m.
  • the laminating conditions when using the laminating apparatus are as follows: the heating temperature is 185 degrees, the press pressure is 2 MPa, the preheating time is 10 seconds (the preheating temperature is equal to the heating temperature), and the pressing time is 80 seconds.
  • the case where the cushion layer 33 is torn is described as “Yes”, and the case where the cushion layer 33 is not torn is described as “None”.
  • the trap part 34 prevents the formation of a part that causes the cushion layer 33 to be broken by sticking and holding the flow-out part 33 a having a thickness smaller than that of the cushion layer 33. Therefore, it is considered that the trap portion 34 is required to have a size that covers at least the flow-out portion 33a. That is, it is considered that the trap portion 34 may be at least as long as it corresponds to the dimension in which the flow-out portion 33 a flows out from the end portion of the cushion layer 33.
  • L1 1.1 mm
  • L2 1.0 mm
  • L3 1.4 mm
  • L4 1.4 mm
  • L5 1.1 mm
  • L6 1.5 mm
  • L7 1.6 mm
  • L8 1.0 mm
  • L9 1.5 mm
  • L10 0.7 mm.
  • an average value Av of these L1 to L10 was calculated, and a standard deviation ⁇ was calculated based on the average value and each dimension.
  • the probability ⁇ out of the range obtained by adding or subtracting four times the standard deviation ⁇ to the average value Av is known as 0.006%. Accordingly, 99.997% of the flow-out portion 33a is included in the value (cover rate C) obtained by adding the standard deviation ⁇ to 4 times the average value Av. Therefore, the cover rate C was calculated.
  • the average value Av of the above-mentioned L1 to L10 is calculated as 1.2 mm (calculated to the first decimal place), and the standard deviation ⁇ is calculated as 0.3 mm, so the cover ratio C is calculated as 2.4 mm. It was done. If this 2.4 mm is given a slight margin and a numerical value without the first decimal place in the dimensional unit mm is calculated, it becomes 3 mm. As described above, the dimensions of the trap portion 34 are calculated.
  • a base layer 31 mainly composed of a polyester-based resin
  • the cushion layer 33 that follows the unevenness of the cover film 20 and the base laminate 10 while covering the cover film 20 by heating and pressurization, and the cushion layer 33 is formed with respect to the base layer 31.
  • an adhesive layer 32 having a trap portion 34 that protrudes from the end side of the cushion layer 33 and is exposed.
  • the cushion layer 33 that spreads during lamination can be trapped (held) by the trap portion 34.
  • the cushion layer 33 is unnecessarily spread, and it is possible to prevent the cushion layer 33 from being formed with a thin portion more than necessary.
  • the cushion layer 33 can be prevented from jumping out from the end portion of the release film 30. Therefore, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
  • the cushion layer 33 follows the unevenness of the cover film 20 and the base laminate 10 while covering the cover film 20 by heating and pressurization, and the cushion layer 33 is mainly composed of an olefin resin. Therefore, it is possible to satisfactorily prevent the adhesive material from flowing out of the adhesive material layer 22. Thereby, it is possible to prevent the adhesive material that has flowed out from spreading in the pattern portion 12a and the space 14, and it is possible to prevent the spread adhesive material from becoming inoperable after the plating process.
  • FIG. 25 is a diagram illustrating a configuration of the integrated object 80 in a state where the flow-out portion 22a is formed.
  • 25 shows an anisotropic conductive property of the laminate 50 in the vicinity of the III-III cross section shown in FIG. 6 in the laminate 50 formed using the release film 30 using PMP as the cushion layer 33.
  • the image of the integrated object 80 in which the film 60 was affixed and the sticking target object 70 was affixed through the anisotropic conductive film 60 is shown.
  • the anisotropic conductive film 60 has a large number of metal particles 62 dispersed in the thermosetting resin layer 61.
  • the flow-out portion 22a is formed by melting the adhesive layer 22, the flow-out portion 22a is in a state of covering the pattern portion 12a by a predetermined amount.
  • the outflow part 22a has electrical insulation. Therefore, even if the anisotropic conductive film 60 in which the metal particles 62 are dispersed is used, there is a possibility that electrical conduction cannot be established between the conductor portion 72 and the pattern portion 12a of the pasting target 70.
  • the metal particles 62 existing in the space 14 between the adjacent pattern parts 12a are in the thickness direction of the integrated object 80. In this case, it moves to the conductor portion 72 side. Therefore, when the flow-out increases, the metal particles 62 are connected in a direction crossing the plurality of pattern portions 12a, and conductivity is exhibited even in a direction crossing the plurality of pattern portions 12a. Therefore, anisotropic conductivity that shows conductivity only in the thickness direction of the integrated object 80 is hindered.
  • FIG. 24 shows a configuration when the release film 30 of the present embodiment is used.
  • FIG. 24 is a diagram illustrating a configuration of the integrated object 80 in a state where formation of the flow-out portion 22a is suppressed using the release film 30.
  • an anisotropic conductive film 60 is attached to the laminate 50 in the vicinity of the cross-section III-III shown in FIG. 6 in the laminate 50, and further attached via the anisotropic conductive film 60.
  • the metal particles 62 are applied to the application object by applying a pressing force between the laminate 50 and the application object 70 with the anisotropic conductive film 60 sandwiched between the laminate 50 and the application object 70. 70, and the metal particles 62 are also in electrical contact with the pattern portion 12a. As a result, the conductor portion 72 and the pattern portion 12a are electrically connected. Thus, when the release film 30 of this Embodiment is used, an electrical continuity state can be ensured between the conductor part 72 and the pattern part 12a as shown in FIG.
  • the metal particles 62 existing in the space 14 between the adjacent pattern portions 12 a are in the conductor portion 72 side in the thickness direction of the integrated product 80. It is possible to prevent the movement. Thereby, it becomes possible to prevent the metal particles 62 from being connected in a direction crossing the plurality of pattern portions 12a. Therefore, anisotropic conductivity that exhibits conductivity only in the thickness direction of the integrated object 80 can be ensured.
  • the miniaturization of the pattern layer 12 proceeds, if the formation of the flow-out portion 22a is not suppressed, the effective area that can be electrically connected is reduced, and the miniaturization of the pattern layer 12 is hindered.
  • the release film 30 of the present embodiment by suppressing the formation of the flow-out portion 22a using the release film 30 of the present embodiment, a wide effective area that can be electrically connected can be secured, and the pattern layer 12 can be made finer. be able to.
  • the adhesive layer 32 is mainly composed of an acrylic resin.
  • the adhesive layer 32 has an acrylic resin as a main component, sufficient adhesive force can be secured.
  • the cushion layer 33 spreading during lamination can be sufficiently trapped (held) by the trap portion 34. Therefore, it is possible to satisfactorily prevent the cushion layer 33 from jumping out from the end portion of the release film 30. Thereby, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
  • the trap portion 34 protrudes at least 3 mm or more from the end portion of the cushion layer 33.
  • the cushion layer 33 spread during lamination can be sufficiently trapped (held). Thereby, it is possible to satisfactorily prevent the cushion layer 33 from jumping out from the end portion of the release film 30. Thereby, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
  • the cushion layer 33 is preferably composed mainly of polypropylene.
  • the cushion layer 33 has polypropylene as a main component, the formation of the flow-out portion 22a can be satisfactorily suppressed. Moreover, when peeling the cushion layer 33 from the laminated body 50 after lamination, it becomes possible to prevent that the cushion layer 33 is torn, and the release property of the release film 30 can be made favorable.
  • the cushion layer 33 is mainly composed of unstretched polypropylene or inflation polypropylene among polypropylene.
  • the cushion layer 33 is mainly composed of polypropylene, it is possible to satisfactorily prevent the flow-out portion 22a from being formed.
  • the cushion layer 33 is torn, and the release property of the release film 30 can be made favorable.
  • the cover film 20 is temporarily bonded with respect to the base laminated body 10 which has the insulating resin layer 11 and the pattern layer 12, and temporary bonding body is carried out. 40 is formed.
  • the base layer 31 mainly composed of polyester resin
  • the cushion layer 33 mainly composed of olefin resin
  • the cushion layer 33 are bonded to the base layer 31.
  • the release film 30 having the adhesive layer 32 having the exposed trap portion 34 protruding from the end side of the cushion layer 33 is aligned with the temporary adhesive body 40 from the cover film 20 side.
  • the temporary adhesive body 40 is heated and pressed through the release film 30 to laminate the cover film 20 to the base laminate 10 to form the laminate 50.
  • the release film 30 having a temperature lower than that during lamination is peeled off from the laminate 50.
  • the cushion layer 33 is peeled off from the adhesive layer 32 and a new cushion layer 33 is attached to the adhesive layer 32. And after the 5th process, it returns to the 1st process again and repeats each process.
  • the trap portion 34 may protrude with respect to the end portion of the cushion layer 33 over the entire outer periphery of the release film 30, and at least a part thereof is at the end portion of the cushion layer 33. On the other hand, it may protrude.
  • the release film 30 may have any shape.
  • it may be a rectangular sheet or may be wound in a roll.
  • the cushion layer 33 divided into a predetermined dimension is formed with respect to an integrated product of the long base layer 31 and the adhesive layer 32 that can be wound in a roll shape.
  • the trap part 34 can be formed by affixing intermittently.
  • the release film 30 having a predetermined shape does not have the trap portion 34 at the beginning, and the trap layer 33 is removed from the outer peripheral edge portion of the release film 30 by a hot press or other technique, thereby trapping.
  • the part 34 may be formed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Provided is a mold releasing film capable of favorably preventing a break thereof due to the spread of an end side of a cushion layer. A mold releasing film 30 used when laminating a cover film 20 onto a base laminated body 10 having an insulating resin layer 11 and a pattern layer 12 is provided with: a base layer 31 that is mainly composed of a polyester-based resin; a cushion layer 33 that is mainly composed of an olefin-based resin and that, by means of heating and pressurization, follows irregularities of the cover film 20 and the base laminated body 10 while covering the cover film 20; and an adhesive layer 32 that attaches the cushion layer 33 to the base layer 31 and includes a trap part 34 exposed to protrude from an end side of the cushion layer 33.

Description

離型フィルムおよびフレキシブルプリント基板の製造方法Release film and method for producing flexible printed circuit board
　本発明は、離型フィルムおよびフレキシブルプリント基板の製造方法に関する。 The present invention relates to a release film and a method for producing a flexible printed board.
　フレキシブルプリント基板の製造工程にはラミネート工程が存在している。ラミネート工程は、銅箔をエッチングしたパターン層を有するベースフィルム（フレキシブルプリント基板の中間生成物）に対して、カバーフィルムをラミネートするものである。このとき、カバーフィルムをラミネートするのみならず、後に剥がす離型フィルムを貼り付けている。そして、離型フィルムを介してカバーフィルムをパターン層に加圧しつつ、加熱することで、パターン層の凹凸部に対するカバーフィルムの密着性を良好にしている。そのような技術としては、たとえば特許文献１に開示のようなものがある。 There is a laminating process in the manufacturing process of flexible printed circuit boards. In the laminating step, a cover film is laminated on a base film (an intermediate product of a flexible printed board) having a pattern layer obtained by etching a copper foil. At this time, not only the cover film is laminated, but also a release film to be peeled later is attached. And the adhesiveness of the cover film with respect to the uneven | corrugated | grooved part of a pattern layer is made favorable by heating, pressing a cover film to a pattern layer through a mold release film. An example of such a technique is disclosed in Patent Document 1.
特許第５７６５０１８号公報Japanese Patent No. 5765018
　ところで、特許文献１に開示のような離型フィルムを介してカバーフィルムをベースフィルムにラミネートする場合には、カバーフィルムの接着材が流れ出してしまう、という問題がある。すなわち、カバーフィルムの開口や縁部へ離型フィルムのクッション層の入り込みが不十分である場合、接着材が加圧や加熱に応じて流れ出してしまい、銅箔の有効面積が小さくなる、という問題がある。 By the way, when a cover film is laminated on a base film through a release film as disclosed in Patent Document 1, there is a problem that an adhesive for the cover film flows out. That is, when the cushion layer of the release film is insufficiently inserted into the opening or edge of the cover film, the adhesive material flows out in response to pressure or heating, and the effective area of the copper foil is reduced. There is.
　このような問題を解決するために、クッション層には、追従性が良好となる素材を用いることが検討されている。しかしながら、追従性が良好となるクッション層は、それ自体が熱によって溶融するものであるので、離型フィルムの端部側から、クッション層が広がってしまう、という問題がある。そして、広がったクッション層には薄い部分が形成されることにより、離型フィルムの剥離に際して、離型フィルムが部分的に破れてしまう、という問題がある。 In order to solve such problems, it has been studied to use a material having good followability for the cushion layer. However, since the cushion layer with good followability itself melts by heat, there is a problem that the cushion layer spreads from the end side of the release film. And since the thin part is formed in the spread cushion layer, there exists a problem that a release film will be partially torn at the time of peeling of a release film.
　また、現状の離型フィルムは、カバーフィルムのラミネートを行うと、廃棄している。したがって、資源の無駄が生じていると共に、新たな離型フィルムを必要とする分だけコストがかかる、という問題もある。 Also, the current release film is discarded when the cover film is laminated. Therefore, there is a problem that resources are wasted and the cost is increased by the need for a new release film.
　本発明は上記の事情にもとづきなされたもので、（１）クッション層の端部側の広がりによる離型フィルムの破れを良好に防止できる離型フィルムを提供すること、（２）資源の無駄を低減可能な離型フィルムおよびフレキシブルプリント基板の製造方法を提供すること、の少なくとも１つを目的とする。 The present invention has been made on the basis of the above circumstances. (1) To provide a release film capable of satisfactorily preventing tearing of the release film due to the spread of the end side of the cushion layer; (2) Waste of resources. It is an object of the present invention to provide at least one of a releasable release film and a method for producing a flexible printed circuit board.
　上記課題を解決するために、本発明の第１の観点によると、絶縁樹脂層とパターン層を有するベース積層体に対して、カバーフィルムをラミネートする際に用いられる離型フィルムであって、ポリエステル系樹脂を主成分とするベース層と、オレフィン系樹脂を主成分とすると共に、加熱および加圧によってカバーフィルムを覆いつつ当該カバーフィルムとベース積層体の凹凸に追従するクッション層と、クッション層をベース層に対して貼り付けると共に、クッション層の端部側よりはみ出して露出しているトラップ部が存在する粘着層と、を備えることを特徴とする離型フィルムが提供される。 In order to solve the above problems, according to a first aspect of the present invention, a release film used when a cover film is laminated on a base laminate having an insulating resin layer and a pattern layer, the polyester A base layer mainly composed of a base resin, a cushion layer that is mainly composed of an olefin resin, covers the cover film by heating and pressurizing, and follows the unevenness of the cover film and the base laminate, and a cushion layer. There is provided a release film comprising: an adhesive layer that is attached to a base layer and has an exposed trap portion that protrudes from an end side of the cushion layer.
　また、本発明の他の側面は、上述の発明において、粘着層は、アクリル系樹脂を主成分としている、ことが好ましい。 Further, in another aspect of the present invention, in the above-described invention, it is preferable that the adhesive layer has an acrylic resin as a main component.
　さらに、本発明の他の側面は、上述の発明において、トラップ部は、クッション層の端部に対して少なくとも３ｍｍ以上はみ出している、ことが好ましい。 Furthermore, in another aspect of the present invention, in the above-described invention, it is preferable that the trap portion protrudes at least 3 mm from the end of the cushion layer.
　また、本発明の他の側面は、上述の発明において、クッション層は、ポリプロピレンを主成分としている、ことが好ましい。 In another aspect of the present invention, in the above-described invention, it is preferable that the cushion layer is mainly composed of polypropylene.
　さらに、本発明の他の側面は、上述の発明において、クッション層は、ポリプロピレンのうち無延伸ポリプロピレンまたはインフレーションポリプロピレンのいずれかを主成分とする、ことが好ましい。 Furthermore, in another aspect of the present invention, in the above-described invention, it is preferable that the cushion layer is mainly composed of unstretched polypropylene or inflation polypropylene among polypropylene.
　また、本発明の第２の観点によると、フレキシブルプリント基板の製造方法であって、絶縁樹脂層とパターン層を有するベース積層体に対して、カバーフィルムを仮接着して仮接着体を形成する第１工程と、第１工程の後に、ポリエステル系樹脂を主成分とするベース層と、オレフィン系樹脂を主成分とするクッション層と、クッション層をベース層に対して貼り付けると共にクッション層の端部側よりはみ出して露出しているトラップ部が存在する粘着層とを有する離型フィルムを、カバーフィルム側から仮接着体に対して位置合わせする第２工程と、第２工程の後に、離型フィルムを介して仮接着体を加熱および加圧することで、カバーフィルムをベース積層体にラミネートしてラミネート体を形成する第３工程と、第３工程の後に、ラミネート時よりも温度の低下した離型フィルムをラミネート体から剥がす第４工程と、剥がした後の離型フィルムにおいて、粘着層からクッション層を剥がすと共に、新たなクッション層を粘着層に貼り付ける第５工程と、を備え、第５工程の後に再び第１工程に戻り各工程を繰り返す、ことを特徴とするフレキシブルプリント基板の製造方法が提供される。 Moreover, according to the 2nd viewpoint of this invention, it is a manufacturing method of a flexible printed circuit board, Comprising: A cover film is temporarily adhered with respect to the base laminated body which has an insulating resin layer and a pattern layer, and a temporary adhesion body is formed. After the first step and the first step, a base layer mainly composed of a polyester-based resin, a cushion layer mainly composed of an olefin-based resin, a cushion layer attached to the base layer, and an end of the cushion layer A second step of aligning the release film having an adhesive layer that protrudes from the portion side and has an exposed trap portion with respect to the temporary adhesive body from the cover film side; The third step of laminating the cover film on the base laminate to form the laminate by heating and pressing the temporary adhesive through the film, and after the third step, In the fourth step of peeling the release film having a temperature lower than that of the laminate from the laminate, and in the release film after peeling, the cushion layer is peeled off from the adhesive layer and a new cushion layer is attached to the adhesive layer. And a step of returning to the first step again after the fifth step and repeating each step.
　本発明によると、（１）クッション層の端部側の広がりによる離型フィルムの破れを良好に防止できる離型フィルムを提供すること、（２）資源の無駄を低減可能な離型フィルムおよびフレキシブルプリント基板の製造方法を提供すること、の少なくとも１つを提供することができる。 According to the present invention, (1) to provide a release film that can satisfactorily prevent tearing of the release film due to the spread of the end side of the cushion layer, (2) a release film and flexible that can reduce waste of resources Providing a method of manufacturing a printed circuit board can be provided.
本発明の一実施の形態に係るベース積層体およびカバーフィルムの構成を示す断面図である。It is sectional drawing which shows the structure of the base laminated body and cover film which concern on one embodiment of this invention. 本発明の一実施の形態に係る離型フィルムの構成を示す断面図である。It is sectional drawing which shows the structure of the release film which concerns on one embodiment of this invention. 本発明の一実施の形態に係る仮接着体の構成を示す断面図である。It is sectional drawing which shows the structure of the temporary adhesion body which concerns on one embodiment of this invention. 本発明の一実施の形態に係るラミネート体の構成を示す断面図である。It is sectional drawing which shows the structure of the laminated body which concerns on one embodiment of this invention. 図４に示すラミネート体を上方側から見た状態を示す平面図である。It is a top view which shows the state which looked at the laminated body shown in FIG. 4 from the upper side. ラミネート体の別の構成例に係り、カバーフィルムがパターン層のランドの一方側のみに存在して、他方側には存在しない構成を示す平面図である。It is a top view which shows the structure which concerns on another structural example of a laminated body, and a cover film exists only in the one side of the land of a pattern layer, and does not exist in the other side. 本発明の一実施の形態に係る仮接着体と離型フィルムの位置合わせの様子を示す図である。It is a figure which shows the mode of position alignment of the temporary adhesive body and release film which concern on one embodiment of this invention. 本発明の一実施の形態に係り、熱板を介して離型フィルムを仮接着体に対して押圧した後の状態を示す図である。It is a figure which concerns on one embodiment of this invention and shows the state after pressing a release film with respect to a temporary adhesion body through a hot platen. 本発明の一実施の形態に係り、パターン層とカバーフィルムを貼り合わせた境界付近の状態を拡大して示す平面図である。FIG. 4 is an enlarged plan view showing a state near a boundary where a pattern layer and a cover film are bonded to each other according to an embodiment of the present invention. 図６に示すII－II線に沿ってラミネート体を切断したときの様子を示す断面図である。FIG. 7 is a cross-sectional view showing a state when a laminate is cut along the line II-II shown in FIG. 図６に示すIII－III線に沿ってラミネート体を切断したときの様子を示す断面図であり、カバーフィルムに近接した部位における接着材層の流れ出しを示す図である。FIG. 7 is a cross-sectional view showing a state in which the laminate is cut along the line III-III shown in FIG. 6, and is a view showing the flow of the adhesive layer in a portion close to the cover film. 図６のIV－IV線に沿った断面図であり、パターン層の断面ではないがパターン層に近接した部位における接着材層の流れ出しを示す図である。FIG. 7 is a cross-sectional view taken along the line IV-IV in FIG. 6 and is a diagram showing the flow of the adhesive layer in a portion close to the pattern layer, although it is not a cross section of the pattern layer. 比較例１の離型フィルムを用いた場合において、図６に示すII－II線に沿ってラミネート体を切断したときの様子を示す断面図である。FIG. 7 is a cross-sectional view showing a state when a laminate is cut along the line II-II shown in FIG. 6 when the release film of Comparative Example 1 is used. 比較例１の離型フィルムを用いた場合において、図６に示すIII－III線に沿ってラミネート体を切断したときの様子を示す断面図であり、カバーフィルムに近接した部位における接着材層の流れ出しを示す図である。FIG. 7 is a cross-sectional view showing a state in which the laminate is cut along the line III-III shown in FIG. 6 in the case where the release film of Comparative Example 1 is used, and the adhesive layer in a portion close to the cover film It is a figure which shows outflow. 比較例１の離型フィルムを用いた場合において、図６のIV－IV線に沿った断面図であり、パターン層の断面ではないがパターン層に近接した部位における接着材層の流れ出しを示す図である。FIG. 7 is a cross-sectional view taken along the line IV-IV in FIG. 6 when the release film of Comparative Example 1 is used, and is a view showing the flow of the adhesive layer in a portion close to the pattern layer, but not the cross section of the pattern layer It is. 本発明の一実施の形態に係り、ラミネート体から離型フィルムを剥がすイメージを示す図である。It is a figure which concerns on one embodiment of this invention and shows the image which peels a release film from a laminated body. 本発明の一実施の形態に係り、粘着層からクッション層を剥がすイメージを示す図である。It is a figure which concerns on one embodiment of this invention and shows the image which peels a cushion layer from the adhesion layer. 本発明の一実施の形態に係り、新たなクッション層を粘着層に貼り付けるイメージを示す図であり、貼り付ける直前の状態を示す図である。It is a figure which shows the image which affixes a new cushion layer to the adhesion layer according to one embodiment of this invention, and is a figure which shows the state just before affixing. 本発明の一実施の形態に係り、ラミネート体５０において接着材の流れ出しの長さの測定の様子を示す平面図である。FIG. 6 is a plan view showing a state of measurement of the length of the adhesive flowing out in the laminate 50 according to the embodiment of the present invention. 比較例３１～３５に係り、ＰＭＰをクッション層の材質とした場合の流れ出しの最大長さについて示す図である。FIG. 25 is a diagram showing the maximum flow-out length when PMP is used as a cushion layer material in Comparative Examples 31 to 35. 本発明の一実施の形態に係り、２０μｍの厚みのＣＰＰをクッション層の材質とした場合の流れ出しの最大長さについて示す図である。It is a figure which concerns on one embodiment of this invention and shows about the maximum length of the outflow when CPP with a thickness of 20 μm is used as the material of the cushion layer. 本発明の一実施の形態に係り、４０μｍの厚みのＣＰＰをクッション層の材質とした場合の流れ出しの最大長さについて示す図である。It is a figure which concerns on one embodiment of this invention and shows about the maximum length of outflow when CPP of thickness of 40 micrometers is made into the material of a cushion layer. 本発明の一実施の形態に係り、６０μｍの厚みのＣＰＰをクッション層の材質とした場合の流れ出しの最大長さについて示す図である。It is a figure which concerns on one embodiment of this invention and shows about the maximum length of the outflow when CPP of thickness of 60 micrometers is made into the material of a cushion layer. 本発明の一実施の形態に係り、離型フィルムを用いて流れ出し部の形成が抑制された状態の一体化物の構成を示す図である。It is a figure which shows the structure of the integrated object of the state which concerns on one embodiment of this invention and the formation of the flow-out part was suppressed using the release film. 本発明の一実施の形態に係り、流れ出し部が形成された状態の一体化物の構成を示す図である。It is a figure which shows the structure of the integrated object in the state in which the outflow part was formed in one embodiment of this invention. 本発明の一実施の形態に係り、ラミネート前の離型フィルムと絶縁樹脂層を示す平面図であり、クッション層とトラップ部の位置関係を透過的に示す図である。It is a top view which shows the release film and insulating resin layer before lamination concerning one embodiment of this invention, and is a figure which transparently shows the positional relationship of a cushion layer and a trap part. 本発明の一実施の形態に係り、ラミネート前の離型フィルムと絶縁樹脂層の配置を示す側断面図である。It is a sectional side view which shows arrangement | positioning of the release film and insulating resin layer before lamination concerning one embodiment of this invention. 本発明の一実施の形態に係り、図２６に示す状態からラミネートを行った状態を示し、クッション層の一部が外側に流れ出して流れ出し部が形成された状態を示す図である。FIG. 27 is a diagram illustrating a state in which lamination is performed from the state illustrated in FIG. 26 according to an embodiment of the present invention, in which a part of the cushion layer flows out to the outside and a flow-out portion is formed. 本発明の一実施の形態に係り、図２７に示す状態からラミネートを行った状態を示し、クッション層の一部が外側に流れ出して流れ出し部が形成された状態を示す側断面図である。FIG. 28 is a side cross-sectional view illustrating a state where lamination is performed from the state illustrated in FIG. 27 according to an embodiment of the present invention, in which a part of the cushion layer flows out to the outside and a flow-out portion is formed.
　以下、本発明の一実施の形態に係る離型フィルム３０およびフレキシブルプリント基板の製造方法について、以下に説明する。なお、以下の説明においては、最初にラミネート対象であるベース積層体１０とカバーフィルム２０について説明し、その後に離型フィルム３０について説明する。また、以下の説明では、Ｚ方向は、それぞれのフィルムの厚み方向とし、Ｚ１は図１における紙面奥側（上側；表面側）、Ｚ２は紙面手前側（下側；裏面側）とする。 Hereinafter, a method for manufacturing a release film 30 and a flexible printed board according to an embodiment of the present invention will be described. In the following description, first, the base laminate 10 and the cover film 20 to be laminated will be described, and then the release film 30 will be described. In the following description, the Z direction is the thickness direction of each film, Z1 is the back side (upper side; front side) in FIG. 1, and Z2 is the front side (lower side; back side) in FIG.
＜ベース体およびカバーフィルムの構成について＞
　図１は、ベース積層体１０およびカバーフィルム２０の構成を示す断面図である。図１に示すように、ベース積層体１０は、たとえば銅張積層板といった所定の厚みの金属箔にエッチング加工を施して、その金属箔を所望のパターン形状に形成したものである。このベース積層体１０は、絶縁樹脂層１１と、パターン層１２とを備えている。絶縁樹脂層１１は、所定の厚みを有すると共に電気的な絶縁性を有するポリイミドを材質としている。この絶縁樹脂層１１の厚みとしては、たとえば、２５μｍ（１ｍｉｌ）、１２．５μｍ（１／２ｍｉｌ）等があるが、これ以外の厚みであっても良い。 <Configuration of base body and cover film>
FIG. 1 is a cross-sectional view showing configurations of the base laminate 10 and the cover film 20. As shown in FIG. 1, the base laminate 10 is obtained by etching a metal foil having a predetermined thickness, such as a copper clad laminate, and forming the metal foil into a desired pattern shape. The base laminate 10 includes an insulating resin layer 11 and a pattern layer 12. The insulating resin layer 11 is made of polyimide having a predetermined thickness and electrical insulation. Examples of the thickness of the insulating resin layer 11 include 25 μm (1 mil) and 12.5 μm (1/2 mil), but other thicknesses may be used.
　また、パターン層１２は、上述したように、たとえば銅箔等の所定の厚みの金属箔を、エッチング等の通常のフォトファブリケーション手法を用いて所望のパターン形状にパターニングされた部分である。このパターン層１２の厚みとしては、たとえば、３５μｍ（１ｏｚ）、１７．５μｍ（１／２ｏｚ）、１２μｍ（１／３ｏｚ）等があるが、これ以外の厚みであっても良い。また、ベース積層体１０は、これ以外の層を有していても良い。 Further, as described above, the pattern layer 12 is a portion obtained by patterning a metal foil having a predetermined thickness such as a copper foil into a desired pattern shape by using a normal photofabrication technique such as etching. Examples of the thickness of the pattern layer 12 include 35 μm (1 oz), 17.5 μm (1/2 oz), and 12 μm (1/3 oz), but other thicknesses may be used. The base laminate 10 may have other layers.
　なお、絶縁樹脂層１１とパターン層１２の間には、これらを接着するための接着材が設けられている（図示省略）。接着材の厚みは、たとえば１０μｍ、１２μｍの場合があるが、その厚みは適宜設定することが可能である。 Note that an adhesive for adhering these is provided between the insulating resin layer 11 and the pattern layer 12 (not shown). The thickness of the adhesive may be 10 μm or 12 μm, for example, but the thickness can be set as appropriate.
　上述のベース積層体１０にラミネートされるカバーフィルム２０は、カバー層２１と、接着材層２２とを有している。カバー層２１は、ポリイミドを材質としている。このカバー層２１の厚みとしては、たとえば、２５μｍ（１ｍｉｌ）、１２．５μｍ（１／２ｍｉｌ）等があるが、これ以外の厚みであっても良い。 The cover film 20 laminated on the base laminate 10 described above has a cover layer 21 and an adhesive layer 22. The cover layer 21 is made of polyimide. Examples of the thickness of the cover layer 21 include 25 μm (1 mil) and 12.5 μm (1/2 mil), but other thicknesses may be used.
　また、接着材層２２は、たとえばエポキシ系の接着材を主要な材質としているが、その他、ポリウレタン系の接着材、アクリル系の接着材を用いても良い。この接着材層２２の厚みは、たとえば２８μｍとするものがあるが、これ以外の厚みであっても良い。 The adhesive layer 22 is mainly made of, for example, an epoxy adhesive, but a polyurethane adhesive or an acrylic adhesive may also be used. The adhesive layer 22 has a thickness of 28 μm, for example, but may have a thickness other than this.
　図１に示すように、カバーフィルム２０には、開口部２３が設けられている。この開口部２３は、たとえばレーザー等で孔開け加工された部分である。 As shown in FIG. 1, the cover film 20 has an opening 23. The opening 23 is a portion that has been drilled with, for example, a laser.
＜離型フィルムの構成について＞
　次に、離型フィルム３０の構成について説明する。図２は、離型フィルム３０の構成を示す断面図である。図２に示すように、離型フィルム３０は、ベース層３１と、粘着層３２と、クッション層３３とを有している。 <About the structure of the release film>
Next, the configuration of the release film 30 will be described. FIG. 2 is a cross-sectional view showing the configuration of the release film 30. As shown in FIG. 2, the release film 30 has a base layer 31, an adhesive layer 32, and a cushion layer 33.
　ベース層３１は、ポリエステル系樹脂を主成分として構成されている。このようなポリエステル系樹脂には、ＰＥＴ(Polyethylene Terephthalate)を主成分とするもの、ＰＢＴ(Polybutylene Terephtalate)を主成分とするもの、ＰＴＴ（Polytrimethylene Terephtalate)を主成分とするもの、ＰＥＮ（Polyethylene Naphthalate）を主成分とするもの、ＰＢＮ（Polybutylene Naphthalate）を主成分とするもの、およびこれらの中から選択されたものを混合した混合物が挙げられる。この中では、入手のし易さの点で、特にＰＥＴを主成分とするものが好ましい。しかしながら、ポリエステル系樹脂であれば、列記したものや列記以外のものを主成分として良い。 The base layer 31 is composed mainly of a polyester resin. Such polyester resins include those containing PET (PolyethylenelyTerephthalate) as the main component, those containing PBT (Polybutylene Terephtalate) as the main component, those containing PTT (Polytrimethylene Terephtalate) as the main component, and PEN (Polyethylene Naphthalate). , A main component of PBN (Polybutylene Naphthalate), and a mixture of those selected from these. Of these, those containing PET as a main component are particularly preferred from the viewpoint of availability. However, as long as it is a polyester resin, those listed or other than listed may be used as the main component.
　また、粘着層３２は、たとえばアクリル系樹脂を主成分とするアクリル系粘着剤がある。しかしながら、粘着層３２は、アクリル系粘着剤には限られず、天然ゴムに粘着付与剤を添加したゴム系粘着剤、シリコーンゴムに粘着付与剤を添加したシリコーン系粘着剤、ポリウレタンを主成分とするウレタン系粘着剤等が挙げられる。これらの中でも、入手のし易さや繰り返し利用可能な点で、アクリル系粘着剤が好ましい。 Also, the adhesive layer 32 includes, for example, an acrylic adhesive mainly composed of an acrylic resin. However, the pressure-sensitive adhesive layer 32 is not limited to an acrylic pressure-sensitive adhesive, and is mainly composed of a rubber-based pressure-sensitive adhesive in which a tackifier is added to natural rubber, a silicone-based pressure-sensitive adhesive in which a tackifier is added to silicone rubber, and polyurethane. Examples include urethane-based pressure-sensitive adhesives. Among these, an acrylic pressure-sensitive adhesive is preferable because it is easily available and can be repeatedly used.
　また、クッション層３３は、加熱および加圧によって、カバーフィルム２０とベース積層体１０をラミネートする際に、カバーフィルム２０側（上方側；Ｚ１側）からカバーフィルム２０を覆いつつ、カバーフィルム２０とベース積層体１０の凹凸に追従する部分である。すなわち、カバーフィルム２０をベース積層体１０に対してラミネートする際に、これらの間に存在する凹凸に良好に追従することで、接着材層２２からの接着材の流れ出しを防ぐ部分である。 The cushion layer 33 covers the cover film 20 from the cover film 20 side (upper side; Z1 side) when laminating the cover film 20 and the base laminate 10 by heating and pressurization, This is a portion that follows the unevenness of the base laminate 10. That is, when laminating the cover film 20 on the base laminate 10, it is a part that prevents the adhesive material from flowing out of the adhesive material layer 22 by following the unevenness existing therebetween.
　このクッション層３３は、オレフィン系樹脂を主成分としている。このようなオレフィン系樹脂としては、ポリプロピレン系樹脂、ポリエチレン系樹脂、ポリペンテン系樹脂が挙げられる。これらの中でも、ポリプロピレン系樹脂およびポリエチレン系樹脂は、接着材層２２の流れ出しを良好に抑制できる点で好ましい。また、ポリプロピレン系樹脂の中でも、ＣＰＰ（Cast Polypropylene；無延伸ポリプロピレン）およびＩＰＰ（Inflation Polypropylene；インフレーションポリプロピレン）は、表面の滑り性が良好であり、ラミネート後に離型フィルム３０を剥がしても、ラミネート体５０の皺の発生を防げるので、特に好ましい。また、ポリエチレン系樹脂の中でも、ＬＤＰＥ（Low Density Polyethylene；低密度ポリエチレン）は、表面の滑り性が良好であり、ラミネート後に離型フィルム３０を剥がしても、ラミネート体５０の皺の発生を防げるので、特に好ましい。 The cushion layer 33 is mainly composed of an olefin resin. Examples of such olefin resins include polypropylene resins, polyethylene resins, and polypentene resins. Among these, a polypropylene resin and a polyethylene resin are preferable in that the flow of the adhesive layer 22 can be satisfactorily suppressed. Among polypropylene resins, CPP (Cast Polypropylene) and IPP (Inflation Polypropylene) have a good surface slipperiness, and even if the release film 30 is peeled off after lamination, a laminate is obtained. This is particularly preferable because generation of 50 wrinkles can be prevented. Among polyethylene resins, LDPE (Low Density Polyethylene) has good surface slipperiness, and even if the release film 30 is peeled off after lamination, generation of wrinkles in the laminate 50 can be prevented. Is particularly preferred.
　ここで、図２から明らかなように、粘着層３２には、クッション層３３に対して粘着していない部分が存在している。すなわち、図２に示すように、粘着層３２には、クッション層３３の端部側よりはみ出して、外部に露出しているトラップ部３４が存在している。このトラップ部３４は、クッション層３３の端部側において、ラミネート時に広がるクッション層３３をトラップする（保持する）部分である。それにより、クッション層３３が不必要に広がってしまい、クッション層３３に薄い部分が形成されるのを防止している。このトラップ部３４は、広がったクッション層３３を良好にトラップできるものであれば、どのような寸法であっても良いが、離型フィルム３０の表面に沿う方向（Ｚ方向に直交する方向）において３ｍｍ以上存在することが好ましい。 Here, as is apparent from FIG. 2, the adhesive layer 32 has a portion that is not adhered to the cushion layer 33. That is, as shown in FIG. 2, the adhesive layer 32 has a trap portion 34 that protrudes from the end side of the cushion layer 33 and is exposed to the outside. The trap portion 34 is a portion that traps (holds) the cushion layer 33 that spreads during lamination on the end side of the cushion layer 33. This prevents the cushion layer 33 from unnecessarily spreading and prevents a thin portion from being formed in the cushion layer 33. The trap portion 34 may have any size as long as it can trap the spread cushion layer 33 well, but in a direction along the surface of the release film 30 (a direction orthogonal to the Z direction). It is preferable that it exists 3 mm or more.
＜仮接着体とラミネート体について＞
　以下の説明においては、ベース積層体１０とカバーフィルム２０とを仮接着したものを、仮接着体４０と称呼する。図３は、仮接着体４０の構成を示す断面図である。この図３に示すように、仮接着体４０では、接着材層２２の変形が不十分なため、ベース積層体１０に対して部分的にしか接着していない。図３では、そのようなイメージとして、接着材層２２が絶縁樹脂層１１の表面に到達していない様子を示している。 <About temporary adhesive and laminate>
In the following description, the base laminate 10 and the cover film 20 that are temporarily bonded will be referred to as a temporary bonded body 40. FIG. 3 is a cross-sectional view showing the configuration of the temporary adhesive body 40. As shown in FIG. 3, in the temporary adhesive body 40, the adhesive layer 22 is not sufficiently deformed, and is thus only partially bonded to the base laminate 10. FIG. 3 shows a state in which the adhesive layer 22 has not reached the surface of the insulating resin layer 11 as such an image.
　また、仮接着体４０に対して、ラミネートを実行して、ベース積層体１０とカバーフィルム２０の間のラミネートが完了したものを、ラミネート体５０と称呼する。図４は、ラミネート体５０の構成を示す断面図である。また、図５は、ラミネート体５０を上方側（Ｚ１側）から見た状態を示す平面図である。なお、図４は、図５においてＩ－Ｉ線に沿って切断した状態を示している。 In addition, the laminated body 50 that has been laminated by the lamination between the base laminate 10 and the cover film 20 is referred to as a laminate 50. FIG. 4 is a cross-sectional view showing the configuration of the laminate 50. FIG. 5 is a plan view showing a state in which the laminate 50 is viewed from the upper side (Z1 side). FIG. 4 shows a state cut along line II in FIG.
　ここで、ラミネート体５０は、フレキシブルプリント基板に対応するが、ラミネート体５０に対して種々の工程を経て形成されるものがフレキシブルプリント基板に対応すると解しても良い。 Here, although the laminate 50 corresponds to a flexible printed board, it may be understood that what is formed through various processes on the laminate 50 corresponds to the flexible printed board.
　なお、図３に示すように、カバーフィルム２０の開口部２３は、パターン層１２のパターン部１２ａ（金属箔の残存部分）と位置合わせされる。それにより、図４に示すようなラミネート体５０を形成した後に、開口部２３の外側に設けられている導電部位に対し、後のめっき処理等を行うことで、パターン層１２が電気的に接続可能となる。なお、図４に示す構成では、開口部２３は、パターン層１２までの深さの部位（一段開口部２３１）と、パターン層１２よりも深く絶縁樹脂層１１までの深さの部位（二段開口部２３２）とが存在している。しかしながら、二段開口部２３２が存在しなく一段開口部２３１のみが存在する構成としても良い。また、開口部２３は、どのような形状であっても良い。たとえば、図５に示すようなスリット状でも良く、円穴状でも良く、矩形状や楕円形状他、その他の形状であっても良い。また、図６に示すように、カバーフィルム２０がパターン層１２のパターン部１２ａの一方側のみに存在して、他方側には存在しない構成としても良い。 In addition, as shown in FIG. 3, the opening part 23 of the cover film 20 is aligned with the pattern part 12a (the remaining part of the metal foil) of the pattern layer 12. Thereby, after the laminate 50 as shown in FIG. 4 is formed, the pattern layer 12 is electrically connected by performing a subsequent plating process on the conductive portion provided outside the opening 23. It becomes possible. In the configuration shown in FIG. 4, the opening 23 includes a portion having a depth to the pattern layer 12 (one-step opening 231) and a portion having a depth deeper than the pattern layer 12 and to the insulating resin layer 11 (two steps). An opening 232). However, a configuration in which the two-stage opening 232 does not exist and only the one-stage opening 231 exists may be employed. The opening 23 may have any shape. For example, it may have a slit shape as shown in FIG. 5, a circular hole shape, a rectangular shape, an elliptical shape, or other shapes. Moreover, as shown in FIG. 6, it is good also as a structure which the cover film 20 exists only in the one side of the pattern part 12a of the pattern layer 12, and does not exist in the other side.
＜フレキシブルプリント基板の製造方法について＞ <About manufacturing method of flexible printed circuit board>
　以上のような構成のベース積層体１０、カバーフィルム２０および離型フィルム３０を用いた、フレキシブルプリント基板の製造方法について、以下に説明する。なお、以下の説明では、第１工程から第６工程について順次記載するが、これら以外の種々の工程が存在していても良いのは勿論である。また、以下の説明においては、接着材層２２の接着材の流れ出しに関しても併せて説明する。 A method for manufacturing a flexible printed board using the base laminate 10, the cover film 20, and the release film 30 having the above-described configuration will be described below. In the following description, the first to sixth steps are sequentially described, but it is needless to say that various steps other than these may exist. In the following description, the flow of the adhesive material of the adhesive material layer 22 will also be described.
　（１）第１工程：仮接着体４０の形成
　ラミネート体５０を形成する場合、図３に示すように、先ずは仮接着体４０を形成する。このとき、ベース積層体１０に対してカバーフィルム２０の位置合わせを行い、ベース積層体１０に対してカバーフィルム２０を比較的軽い圧力で押圧する。それにより、仮接着体４０が形成される。 (1) First Step: Formation of Temporary Adhesive Body 40 When the laminate 50 is formed, first, the temporary adhesive body 40 is formed as shown in FIG. At this time, the cover film 20 is aligned with the base laminate 10, and the cover film 20 is pressed against the base laminate 10 with a relatively light pressure. Thereby, the temporary adhesion body 40 is formed.
　（２）第２工程：仮接着体と離型フィルムの位置合わせ
　次に、仮接着体４０と離型フィルム３０の位置合わせを行う。図７は、仮接着体４０と離型フィルム３０の位置合わせの様子を示す図である。図７に示すように、仮接着体４０と離型フィルム３０の位置合わせにおいては、仮接着体４０を載置板１００の上部に載置する。載置板１００は、たとえばＰＥＴ(Polyethylene Terephthalate)やＰＢＴ（Polybutylene Terephthalate）等のような金属等よりも柔軟性を有する樹脂を材質としている。そして、仮接着体４０が所定の温度となるように予熱して、接着材層２２が柔軟な状態としておく。なお、仮接着体４０のみならず、離型フィルム３０も予熱することが好ましい。また、予熱を行わないようにしても良い。 (2) Second step: Positioning of temporary adhesive body and release film Next, the temporary adhesive body 40 and the release film 30 are aligned. FIG. 7 is a view showing a state of alignment between the temporary adhesive body 40 and the release film 30. As shown in FIG. 7, in positioning the temporary adhesive body 40 and the release film 30, the temporary adhesive body 40 is placed on the placement plate 100. The mounting plate 100 is made of a resin that is more flexible than a metal such as PET (Polyethylene Terephthalate) or PBT (Polybutylene Terephthalate). And the temporary adhesive body 40 is preheated so that it may become predetermined | prescribed temperature, and the adhesive material layer 22 is made into a flexible state. In addition, it is preferable to preheat not only the temporary adhesive body 40 but the release film 30. FIG. Further, preheating may not be performed.
　そして、図７に示すように、仮接着体４０と離型フィルム３０の位置合わせを行うが、このとき、離型フィルム３０の押圧後に、その離型フィルム３０が仮接着体４０を覆うような位置に、離型フィルム３０を配置する。なお、この位置合わせにおいては、仮接着体４０の上面に対して、離型フィルム３０が軽く接触する状態としても良い。 Then, as shown in FIG. 7, the temporary adhesive body 40 and the release film 30 are aligned. At this time, after the release film 30 is pressed, the release film 30 covers the temporary adhesive body 40. The release film 30 is disposed at the position. In this alignment, the release film 30 may be in light contact with the upper surface of the temporary adhesive body 40.
　（３）第３工程：ラミネート体５０の形成
　次に、離型フィルム３０を用いて仮接着体４０を押圧することで、ラミネート体５０を形成する。このラミネート体５０を形成するラミネート工程では、離型フィルム３０の上部には熱板（図示省略）が配置されている。熱板は、たとえば１８０度といった所定の温度に熱せられている。なお、熱板の温度は、接着材層２２およびクッション層３３を溶融させる温度であれば、１８０度から前後しても良い。 (3) Third Step: Formation of Laminate 50 Next, the laminate 50 is formed by pressing the temporary adhesive 40 using the release film 30. In the laminating process for forming the laminate 50, a hot plate (not shown) is disposed on the release film 30. The hot plate is heated to a predetermined temperature such as 180 degrees. The temperature of the hot plate may be around 180 degrees as long as the adhesive layer 22 and the cushion layer 33 are melted.
　そして、熱板および離型フィルム３０を介して、所定の押圧力で仮接着体４０を押圧する。このとき、ベース積層体１０では、熱板からの熱が離型フィルム３０を介して伝達され、温度が急激に上昇するので、この押圧時間は、たとえば１０秒から３０秒程度となっている。 Then, the temporary adhesive body 40 is pressed through the hot plate and the release film 30 with a predetermined pressing force. At this time, in the base laminate 10, the heat from the hot plate is transmitted through the release film 30, and the temperature rises rapidly. Therefore, the pressing time is, for example, about 10 seconds to 30 seconds.
　図８は、熱板を介して離型フィルム３０を仮接着体４０に対して押圧した後の状態を示す図である。図８に示すように、クッション層３３が溶融し、クッション層３３は、カバーフィルム２０の表面側の凹凸形状に追従する。したがって、溶融したクッション層３３が開口部２３に入り込んだり、ベース積層体１０の端部において側面を覆うように回り込む。 FIG. 8 is a view showing a state after the release film 30 is pressed against the temporary adhesive body 40 via a hot plate. As shown in FIG. 8, the cushion layer 33 melts, and the cushion layer 33 follows the uneven shape on the surface side of the cover film 20. Therefore, the melted cushion layer 33 enters the opening 23 or turns around to cover the side surface at the end of the base laminate 10.
　一方、カバーフィルム２０の接着材層２２も軟化し、接着材層２２を構成する接着材が溶融して流れ出す。それにより、接着材層２２は、ベース積層体１０の表面の凹凸に追従する。そのため、接着材層２２がベース積層体１０と接着される。 Meanwhile, the adhesive layer 22 of the cover film 20 is also softened, and the adhesive constituting the adhesive layer 22 melts and flows out. Thereby, the adhesive layer 22 follows the unevenness of the surface of the base laminate 10. Therefore, the adhesive layer 22 is bonded to the base laminate 10.
　ここで、クッション層３３と接着材層２２を比較すると、接着材層２２よりもクッション層３３の方が、溶融するのが先となっている。したがって、開口部２３においては、溶け出したクッション層３３が、溶け出した接着材層２２よりも先に入り込んで、開口部２３を占有する。したがって、開口部２３では、接着材層２２の流れ出しが抑えられている。同様に、ベース積層体１０の端部においても、溶け出した接着材層２２よりも先に側面を覆うように回り込むことで、接着材層２２の流れ出しが抑えられている。 Here, when the cushion layer 33 and the adhesive layer 22 are compared, the cushion layer 33 is first melted than the adhesive layer 22. Therefore, in the opening 23, the melted cushion layer 33 enters before the melted adhesive layer 22 and occupies the opening 23. Therefore, the flow of the adhesive layer 22 is suppressed at the opening 23. Similarly, at the end of the base laminate 10, the adhesive layer 22 is prevented from flowing out by covering the side surface before the melted adhesive layer 22 is covered.
　図９は、パターン層１２とカバーフィルム２０を貼り合わせた境界付近の状態を拡大して示す平面図である。図１０は、図６に示すII－II線に沿ってラミネート体５０を切断したときの様子を示す断面図である。図１１は、図６に示すIII－III線に沿ってラミネート体５０を切断したときの様子を示す断面図であり、カバーフィルム２０に近接した部位における接着材層２２の流れ出しを示す図である。図１２は、図６のIV－IV線に沿った断面図であり、パターン層１２の断面ではないがパターン層１２に近接した部位における接着材層２２の流れ出しを示す図である。 FIG. 9 is an enlarged plan view showing a state near the boundary where the pattern layer 12 and the cover film 20 are bonded together. FIG. 10 is a cross-sectional view showing a state when the laminate 50 is cut along the line II-II shown in FIG. FIG. 11 is a cross-sectional view showing a state when the laminate 50 is cut along the line III-III shown in FIG. 6, and is a view showing the flow of the adhesive layer 22 in a portion close to the cover film 20. . FIG. 12 is a cross-sectional view taken along the line IV-IV in FIG. 6, and is a view showing the flow of the adhesive layer 22 at a portion close to the pattern layer 12 but not the cross section of the pattern layer 12.
　一方、現状用いられている離型フィルムとしての、比較例１を用いた場合の、接着材層２２の接着材の流れ出しの様子を、図１３から図１５に示す。なお、比較例１では、離型フィルムは、クッション層３３に相当する部位に、ポリメチルペンテン樹脂を材質とするＰＭＰ（ポリメチルペンテン；polymethylpentene）を用いている。図１３は、比較例１の離型フィルムを用いた場合において、図６に示すII－II線に沿ってラミネート体５０を切断したときの様子を示す断面図である。図１４は、比較例１の離型フィルムを用いた場合において、図６に示すIII－III線に沿ってラミネート体５０を切断したときの様子を示す断面図であり、カバーフィルム２０に近接した部位における接着材層２２の流れ出しを示す図である。図１５は、比較例１の離型フィルムを用いた場合において、図６のIV－IV線に沿った断面図であり、パターン層１２の断面ではないがパターン層１２に近接した部位における接着材層２２の流れ出しを示す図である。 Meanwhile, FIGS. 13 to 15 show how the adhesive material flows out of the adhesive layer 22 when Comparative Example 1 is used as a release film that is currently used. In Comparative Example 1, the release film uses PMP (polymethylpentene) made of polymethylpentene resin at a portion corresponding to the cushion layer 33. FIG. 13 is a cross-sectional view showing a state in which the laminate 50 is cut along the line II-II shown in FIG. 6 when the release film of Comparative Example 1 is used. 14 is a cross-sectional view showing a state when the laminate 50 is cut along the line III-III shown in FIG. 6 when the release film of Comparative Example 1 is used, and is close to the cover film 20. It is a figure which shows the outflow of the adhesive material layer 22 in a site | part. 15 is a cross-sectional view taken along the line IV-IV in FIG. 6 when the release film of Comparative Example 1 is used, and is not a cross-section of the pattern layer 12 but an adhesive in a portion close to the pattern layer 12 It is a figure which shows the outflow of the layer 22.
　図１３から図１５に示すような、比較例１の場合と比べると、本実施の形態の離型フィルム３０を用いた場合には、図９から図１２に示されるように、接着材の流れ出し（流れ出し部２２ａ）は大幅に抑制されている。なお、かかる流れ出しの抑制の詳細については、後述する。 Compared with the case of Comparative Example 1 as shown in FIGS. 13 to 15, when the release film 30 of the present embodiment is used, as shown in FIGS. The (flow-out part 22a) is greatly suppressed. The details of the suppression of the outflow will be described later.
　（４）第４工程：離型フィルムのラミネート体からの剥がし
　上述のようにラミネート体５０を形成した後に、ラミネート体５０から離型フィルム３０を剥がす。図１６は、ラミネート体５０から離型フィルム３０を剥がすイメージを示す図である。ラミネート体５０から離型フィルム３０を剥がすことで、ラミネート体５０は、フレキシブルプリント基板を製造する途中段階の中間体となる。なお、この中間体を、フレキシブルプリント基板と解して良いのは勿論である。そして、中間体に対する各種工程を経て、フレキシブルプリント基板の完成品を得る。 (4) Fourth step: peeling the release film from the laminate After forming the laminate 50 as described above, the release film 30 is peeled from the laminate 50. FIG. 16 is a diagram illustrating an image in which the release film 30 is peeled from the laminate 50. By peeling the release film 30 from the laminate 50, the laminate 50 becomes an intermediate in the middle of manufacturing the flexible printed circuit board. Of course, this intermediate may be interpreted as a flexible printed circuit board. And the finished product of a flexible printed circuit board is obtained through various processes with respect to an intermediate.
　（５）第５工程：粘着層からのクッション層の剥がしおよび新たなクッション層の貼り付け
　次に、使用済みの離型フィルム３０において、粘着層３２からクッション層３３を剥がす。図１７は、粘着層３２からクッション層３３を剥がすイメージを示す図である。粘着層３２からクッション層３３を剥がす場合、それまでクッション層３３を粘着力で保持していた粘着層３２が、再び露出する。 (5) Fifth Step: Peeling off the cushion layer from the adhesive layer and attaching a new cushion layer Next, in the used release film 30, the cushion layer 33 is peeled off from the adhesive layer 32. FIG. 17 is a diagram illustrating an image in which the cushion layer 33 is peeled off from the adhesive layer 32. When the cushion layer 33 is peeled from the adhesive layer 32, the adhesive layer 32 that has been holding the cushion layer 33 with adhesive force until then is exposed again.
　この剥がしの後に、粘着層３２に対して、新たなクッション層３３を貼り付ける。図１８は、新たなクッション層３３を粘着層３２に貼り付けるイメージを示す図であり、貼り付ける直前の状態を示す図である。そして、ベース層３１および粘着層３２を、クッション層３３に対して押圧することで、粘着層３２がクッション層３３に対して粘着され、新たな離型フィルム３０が形成される。すなわち、ベース層３１と粘着層３２とを再度利用した、リサイクル品としての離型フィルム３０が形成される。 After this peeling, a new cushion layer 33 is attached to the adhesive layer 32. FIG. 18 is a diagram illustrating an image in which a new cushion layer 33 is pasted to the adhesive layer 32, and is a diagram illustrating a state immediately before being pasted. And the adhesion layer 32 is adhere | attached with respect to the cushion layer 33 by pressing the base layer 31 and the adhesion layer 32 with respect to the cushion layer 33, and the new release film 30 is formed. That is, a release film 30 as a recycled product is formed by using the base layer 31 and the adhesive layer 32 again.
　なお、リサイクル品としての離型フィルム３０が形成された後には、再び第１工程に戻り、新たなラミネート体５０を形成する。このとき、リサイクル品としての離型フィルム３０は、再び第２工程以降の工程にて、用いられることになる。 In addition, after the release film 30 as a recycled product is formed, the process returns again to the first step, and a new laminate 50 is formed. At this time, the release film 30 as a recycled product is used again in the second and subsequent steps.
＜実施例について＞
　次に、本発明の実施例について説明する。
（１）離型フィルムのクッション層の種類に関して
　先ず、離型フィルム３０のクッション層３３として用いることができる材質に関して、その材質の種類別の評価を行った。表１は、それぞれの材質のクッション層３３についての評価結果である。ここでは、材質のクッション層３３としては、ＣＰＰ（無延伸ポリプロピレン）、ＩＰＰ（インフレーションポリプロピレン）、ＬＤＰＥ（低密度ポリエチレン）、ＯＰＰ（２軸延伸ポリエチレン）およびＰＭＰ（ポリメチルペンテン）について、評価を行った。以下の表１～表３の各実施例および各比較例では、ＰＭＰ（ポリメチルペンテン）に関するものとしては、三井化学株式会社製のＴＰＸ（登録商標）を用いて評価を行った。なお、評価項目としては、接着材の流れ出し（流れ出し部２２ａ）の長さ、クッション層３３の破れ（離型性）、およびラミネート後のラミネート体５０の皺である。 <About Examples>
Next, examples of the present invention will be described.
(1) Regarding Type of Cushion Layer of Release Film First, regarding a material that can be used as the cushion layer 33 of the release film 30, evaluation was performed for each type of material. Table 1 shows the evaluation results for the cushion layer 33 of each material. Here, as the cushion layer 33 of the material, CPP (unstretched polypropylene), IPP (inflation polypropylene), LDPE (low density polyethylene), OPP (biaxially stretched polyethylene) and PMP (polymethylpentene) are evaluated. It was. In each of the examples and comparative examples in Tables 1 to 3 below, TPX (registered trademark) manufactured by Mitsui Chemicals, Inc. was evaluated for PMP (polymethylpentene). The evaluation items are the length of the adhesive flow-out (flow-out portion 22a), the tear of the cushion layer 33 (releasability), and the wrinkles of the laminated body 50 after lamination.
　なお、表１では、ＣＰＰを実施例１、ＩＰＰを実施例２、ＬＤＰＥを実施例３、ＴＰＸを比較例１、ＯＰＰを比較例２としている。 In Table 1, CPP is Example 1, IPP is Example 2, LDPE is Example 3, TPX is Comparative Example 1, and OPP is Comparative Example 2.
　この評価においては、離型フィルム３０のベース層３１としては、ＰＥＴを材質としていて、その厚みが５０μｍとなっている。また、粘着層３２は、その厚みが７μｍとなっている。ただし、接着材層２２の接着材が流れ出した場合において、流れ出した接着材に対する粘着力が同程度であれば、他の材質や厚みの接着材層２２を用いても同様の評価が得られると考えられている。また、離型フィルム３０にはトラップ部３４が存在し、そのトラップ部３４は、クッション層３３の端部に対して３ｍｍはみ出している。 In this evaluation, the base layer 31 of the release film 30 is made of PET and has a thickness of 50 μm. The adhesive layer 32 has a thickness of 7 μm. However, when the adhesive of the adhesive layer 22 flows out, the same evaluation can be obtained even if the adhesive layer 22 of another material or thickness is used as long as the adhesive strength against the flowed out adhesive is similar. It is considered. Further, the release film 30 has a trap portion 34, and the trap portion 34 protrudes 3 mm from the end portion of the cushion layer 33.
　また、カバーフィルム２０の接着材層２２の接着材としては、エポキシ系の接着材を用いた。また、絶縁樹脂層１１とパターン層１２の間の接着材（図示省略）としては、エポキシ系の接着材を用いた。 In addition, as an adhesive for the adhesive layer 22 of the cover film 20, an epoxy adhesive was used. Further, as an adhesive (not shown) between the insulating resin layer 11 and the pattern layer 12, an epoxy adhesive was used.
　また、ラミネート装置としては、真空プレスを用いた。かかる実験結果を、表１に示す。なお、表１の実験結果では、ベース積層体１０としては、銅のパターン層１２の厚みが３５μｍ、ポリイミドを材質とする絶縁樹脂層１１の厚みが２５μｍ、銅のパターン層１２と絶縁樹脂層１１の間の接着材の厚みが１２μｍ、パターン部１２ａの幅Ｈ１と、隣り合うパターン部１２ａの間の幅Ｈ２の比であるＨ１／Ｈ２が、２６０μｍ／１４０μｍとなっている。また、カバーフィルム２０としては、ポリイミドを材質とするカバー層２１の厚みが２５μｍ、接着材層２２の厚みが２８μｍとなっている。 Moreover, a vacuum press was used as the laminating apparatus. The experimental results are shown in Table 1. In the experimental results of Table 1, as the base laminate 10, the thickness of the copper pattern layer 12 is 35 μm, the thickness of the insulating resin layer 11 made of polyimide is 25 μm, the copper pattern layer 12 and the insulating resin layer 11 H1 / H2, which is the ratio of the width H1 of the pattern portion 12a and the width H2 between the adjacent pattern portions 12a, is 260 μm / 140 μm. Moreover, as the cover film 20, the thickness of the cover layer 21 made of polyimide is 25 μm, and the thickness of the adhesive layer 22 is 28 μm.
　また、ラミネート装置を用いた際のラミネート条件は、加熱温度が１８５度、プレス圧力が２ＭＰａ、予熱時間が１０秒（予熱温度も加熱温度と同等）、加圧時間が８０秒となっている。この表１では、図６に示すパターン部１２ａ上での接着材の最大寸法を測定した。 The laminating conditions when using the laminating apparatus are as follows: the heating temperature is 185 degrees, the press pressure is 2 MPa, the preheating time is 10 seconds (the preheating temperature is equal to the heating temperature), and the pressing time is 80 seconds. In Table 1, the maximum dimension of the adhesive on the pattern portion 12a shown in FIG. 6 was measured.
Figure JPOXMLDOC01-appb-T000001
  
Figure JPOXMLDOC01-appb-T000001
  
　上述の表１では、図６において隣り合うパターン部１２ａの間のスペース１４（二段開口部２３２に対応する高さ位置）における接着材の流れ出しの最大寸法を測定した。この測定では、接着材の流れ出しの最大寸法が５０μｍ以下の場合を「Ａ」、５０μｍよりは大きいが１００μｍ以下の場合を「Ｂ」、１００μｍよりは大きいが１５０μｍ以下の場合を「Ｃ」、１５０μｍより大きい場合を「Ｄ」とした。なお、「Ａ」と「Ｂ」は、製品として許容できるレベルとなっているが、「Ｃ」は製品として許容できない場合があり、「Ｄ」は製品として完全に許容できないものとなっている。 In Table 1 above, the maximum dimension of the adhesive flowing out in the space 14 (the height position corresponding to the two-stage opening 232) between the adjacent pattern portions 12a in FIG. 6 was measured. In this measurement, “A” is the case where the maximum dimension of the flow-out of the adhesive is 50 μm or less, “B” when it is larger than 50 μm but 100 μm or less, “C” when it is larger than 100 μm but 150 μm or less, and 150 μm. The larger case was designated as “D”. “A” and “B” are acceptable levels for products, but “C” may not be acceptable as a product, and “D” is completely unacceptable as a product.
　また、表１では、クッション層３３の破れ（離型性）についても評価した。この評価では、クッション層３３の破れがないものを「Ｂ」、クッション層３３に破れが生じたものを「Ｄ」で表した。また、表１では、ラミネート後のラミネート体５０の皺についても評価した。この評価では、ラミネート体５０に皺がないものを「Ｂ」、ラミネート体５０に皺が生じたものを「Ｄ」で表した。 In Table 1, the cushion layer 33 was also evaluated for tearing (releasability). In this evaluation, “B” indicates that the cushion layer 33 is not torn, and “D” indicates that the cushion layer 33 is torn. In Table 1, the wrinkles of the laminated body 50 after lamination were also evaluated. In this evaluation, “B” indicates that the laminate 50 does not have wrinkles, and “D” indicates that the laminate 50 has wrinkles.
　上述した表１の評価では、実施例１のＣＰＰ、実施例２のＩＰＰおよび実施例３のＬＤＰＥは、３つの評価項目のいずれでも、クッション層３３の材質として不適なものがない。したがって、実施例１のＣＰＰ、実施例２のＩＰＰおよび実施例３のＬＤＰＥは、クッション層３３の材質として好適となっている。一方、比較例２のＯＰＰは、ラミネート後にラミネート体５０に皺が生じた。したがって、ＯＰＰは、クッション層３３の材質としては不適となっている。また、比較例１のＰＭＰは、パターン部１２ａ上で接着材の流れ出しが１００μｍよりも大きくなり、またスペース１４では接着材の流れ出しが１５０μｍよりも大きくなった。したがって、ＰＭＰは、クッション層３３の材質としては不適となっている。 In the evaluation of Table 1 described above, the CPP of Example 1, the IPP of Example 2, and the LDPE of Example 3 are not unsuitable as the material of the cushion layer 33 in any of the three evaluation items. Therefore, the CPP of Example 1, the IPP of Example 2, and the LDPE of Example 3 are suitable as materials for the cushion layer 33. On the other hand, the OPP of Comparative Example 2 was wrinkled on the laminate 50 after lamination. Therefore, OPP is not suitable as a material for the cushion layer 33. In the PMP of Comparative Example 1, the flow of the adhesive material was larger than 100 μm on the pattern portion 12a, and the flow of the adhesive material was larger than 150 μm in the space 14. Therefore, PMP is not suitable as a material for the cushion layer 33.
　なお、クッション層３３の材質としてＯＰＰを用いるもののみ、ラミネート体５０の皺が生じていることから、クッション層３３の材質としてＯＰＰは不適となっている。これは、ＯＰＰの特性に起因するものである。すなわち、ＴＭＡ（Thermo Mechanical Analysis；熱機械分析）試験において、温度を上昇させたときの寸法変化率を調べると、ＯＰＰは、１５０度を超えると著しく収縮し、その後破断することが分かった。一方、ＣＰＰ、ＩＰＰ、ＬＤＰＥにおいては、温度を上昇させても収縮せずに伸びることが分かった。このことから、熱板がたとえば１８０度といった所定の温度に熱せられるとき（上述の第３工程参照）、クッション層３３の材質としてＯＰＰを材質とするとクッション層３３に収縮が生じ、それがラミネート体５０の皺の原因になると考えられる。 In addition, since the wrinkle of the laminated body 50 has arisen only in what uses OPP as a material of the cushion layer 33, OPP is unsuitable as a material of the cushion layer 33. This is due to the characteristics of OPP. That is, in the TMA (Thermo-Mechanical-Analysis) test, when the rate of dimensional change when the temperature was raised was examined, it was found that OPP significantly contracted when it exceeded 150 degrees and then fractured. On the other hand, it was found that CPP, IPP, and LDPE extend without contraction even when the temperature is increased. For this reason, when the hot plate is heated to a predetermined temperature such as 180 degrees (see the third step described above), if OPP is used as the material of the cushion layer 33, the cushion layer 33 contracts, which is the laminate. It is thought to cause 50 wrinkles.
（２）離型フィルムのクッション層の厚みに関して
　次に、離型フィルム３０のクッション層３３の厚みに関して、評価を行った。表２は、クッション層３３の厚みを２０μｍ（比較例３）、４０μｍ（実施例４）、６０μｍ（実施例５）としたときの評価結果である。ここでは、クッション層３３の材質をＣＰＰとし、表１と同様に、接着材の流れ出しの長さ、クッション層３３の破れ（離型性）、およびラミネート後のラミネート体５０の皺を評価項目として評価した。なお、評価基準は、表１と同じとなっている。また、用いたラミネート装置、その他の部材（カバーフィルム２０や離型フィルム３０）の材質や厚み等の構成、ラミネート条件等は、上述した表１の場合と同じである。したがって、離型フィルム３０にはトラップ部３４も存在している。 (2) Regarding the thickness of the cushion layer of the release film Next, the thickness of the cushion layer 33 of the release film 30 was evaluated. Table 2 shows the evaluation results when the thickness of the cushion layer 33 is 20 μm (Comparative Example 3), 40 μm (Example 4), and 60 μm (Example 5). Here, the material of the cushion layer 33 is CPP, and the length of the flow of the adhesive, the tearing of the cushion layer 33 (releasability), and the wrinkles of the laminated body 50 after the lamination are evaluated as in Table 1. evaluated. The evaluation criteria are the same as in Table 1. In addition, the laminating apparatus used, the configuration of the materials and thicknesses of other members (cover film 20 and release film 30), the laminating conditions, and the like are the same as those in Table 1 described above. Accordingly, the release film 30 also has a trap portion 34.
Figure JPOXMLDOC01-appb-T000002
  
Figure JPOXMLDOC01-appb-T000002
  
　上述した表２の評価では、接着材の流れ出しに関しては、実施例４および実施例５においては、３つの評価項目のいずれでも、クッション層３３の材質として不適なものがない。したがって、実施例４の４０μｍ、実施例５の６０μｍの場合は、クッション層３３の厚みとして好適となっている。一方、比較例３においては、クッション層３３に破れが生じた。したがって、比較例３の２０μｍの場合は、クッション層３３の厚みとしては不適となっている。 In the evaluation of Table 2 described above, regarding the flow-out of the adhesive, in Example 4 and Example 5, none of the three evaluation items is unsuitable as the material of the cushion layer 33. Therefore, in the case of 40 μm in Example 4 and 60 μm in Example 5, the thickness of the cushion layer 33 is suitable. On the other hand, in Comparative Example 3, the cushion layer 33 was torn. Therefore, in the case of 20 μm in Comparative Example 3, the thickness of the cushion layer 33 is not suitable.
（３）銅のパターン層１２の厚み、クッション層３３の厚みと、接着材の流れ出しの長さに関して
　次に、銅のパターン層１２の厚み、クッション層３３の厚みと、接着材の流れ出しの長さに関して、評価を行った。この評価では、銅のパターン層１２の厚みを、１２μｍ、１８μｍ、３５μｍとし、またクッション層３３の厚みを、２０μｍ、４０μｍ、６０μｍとしている。 (3) Regarding the thickness of the copper pattern layer 12, the thickness of the cushion layer 33, and the flow length of the adhesive material Next, the thickness of the copper pattern layer 12, the thickness of the cushion layer 33, and the flow length of the adhesive material An evaluation was made on this. In this evaluation, the thickness of the copper pattern layer 12 is 12 μm, 18 μm, and 35 μm, and the thickness of the cushion layer 33 is 20 μm, 40 μm, and 60 μm.
　また、それぞれの厚み銅のパターン層１２に、ＰＭＰを貼り付けた場合の接着材の流れ出しについても評価を行った。表３においては、実施例１１がクッション層３３であるＣＰＰ（以下、単にＣＰＰと表記する）の厚みが２０μｍ、パターン部１２ａ（銅箔）の厚みが１２μｍの場合の評価結果である。以下同様に、実施例１２では、ＣＰＰの厚みが２０μｍ、パターン部１２ａ（銅箔）の厚みが１８μｍの場合の評価結果である。また、実施例１３がＣＰＰの厚みが２０μｍ、パターン部１２ａ（銅箔）の厚みが３５μｍの場合の評価結果である。また、実施例１４がＣＰＰの厚みが４０μｍ、パターン部１２ａ（銅箔）の厚みが１２μｍの場合の評価結果である。また、実施例１５がＣＰＰの厚みが４０μｍ、パターン部１２ａ（銅箔）の厚みが１８μｍの場合の評価結果である。また、実施例１６がＣＰＰの厚みが４０μｍ、パターン部１２ａ（銅箔）の厚みが３５μｍの場合の評価結果である。また、実施例１７がＣＰＰの厚みが６０μｍ、パターン部１２ａ（銅箔）の厚みが１２μｍの場合の評価結果である。また、実施例１８がＣＰＰの厚みが６０μｍ、パターン部１２ａ（銅箔）の厚みが１８μｍの場合の評価結果である。また、実施例１８がＣＰＰの厚みが６０μｍ、パターン部１２ａ（銅箔）の厚みが３５μｍの場合の評価結果である。 Also, the flow of the adhesive when PMP was applied to each thick copper pattern layer 12 was evaluated. Table 3 shows the evaluation results when the thickness of the CPP (hereinafter simply referred to as CPP) which is the cushion layer 33 in Example 11 is 20 μm and the thickness of the pattern portion 12a (copper foil) is 12 μm. Similarly, in Example 12, the evaluation results are obtained when the thickness of the CPP is 20 μm and the thickness of the pattern portion 12a (copper foil) is 18 μm. Moreover, Example 13 is an evaluation result when the thickness of the CPP is 20 μm and the thickness of the pattern portion 12a (copper foil) is 35 μm. Moreover, Example 14 is an evaluation result when the thickness of the CPP is 40 μm and the thickness of the pattern portion 12a (copper foil) is 12 μm. Moreover, Example 15 is an evaluation result when the thickness of the CPP is 40 μm and the thickness of the pattern portion 12a (copper foil) is 18 μm. Moreover, Example 16 is an evaluation result in the case where the thickness of the CPP is 40 μm and the thickness of the pattern portion 12a (copper foil) is 35 μm. Moreover, Example 17 is an evaluation result when the thickness of the CPP is 60 μm and the thickness of the pattern portion 12a (copper foil) is 12 μm. Moreover, Example 18 is an evaluation result in the case where the thickness of the CPP is 60 μm and the thickness of the pattern portion 12a (copper foil) is 18 μm. Moreover, Example 18 is an evaluation result when the thickness of the CPP is 60 μm and the thickness of the pattern portion 12a (copper foil) is 35 μm.
　また、比較例１１は、クッション層３３としてＰＭＰを用いると共にパターン部１２ａ（銅箔）の厚みが１２μｍの場合の評価結果である。また、比較例１２は、クッション層３３としてＰＭＰを用いると共にパターン部１２ａ（銅箔）の厚みが１８μｍの場合の評価結果である。また、比較例１３は、ＰＭＰを用いると共にパターン部１２ａ（銅箔）の厚みが３５μｍの場合の評価結果である。なお、評価基準は、表１と同じとなっている。また、用いたラミネート装置や、ラミネート条件等は、上述した表１の場合と同じである。 Further, Comparative Example 11 is an evaluation result when PMP is used as the cushion layer 33 and the thickness of the pattern portion 12a (copper foil) is 12 μm. Comparative Example 12 is an evaluation result when PMP is used as the cushion layer 33 and the thickness of the pattern portion 12a (copper foil) is 18 μm. Comparative Example 13 is an evaluation result when PMP is used and the thickness of the pattern portion 12a (copper foil) is 35 μm. The evaluation criteria are the same as in Table 1. Further, the laminating apparatus used, laminating conditions, and the like are the same as those in Table 1 described above.
　なお、上記の実施例１１～１９においては、パターン部１２ａ（銅箔）の厚みが３５μｍの場合（実施例１３，１６，１９）には、絶縁樹脂層１１とパターン層１２の間の接着材の厚みは１２μｍであり、それ以外の場合には上記の接着材の厚みは１０μｍである。また、パターン層１２の厚みが１２μｍの場合（実施例１１，１４，１９）には、絶縁樹脂層１１の厚みは１３μｍであり、それ以外の場合には上記の絶縁樹脂層１１の厚みは２５μｍである。 In Examples 11 to 19, when the thickness of the pattern portion 12a (copper foil) is 35 μm (Examples 13, 16, and 19), the adhesive between the insulating resin layer 11 and the pattern layer 12 is used. The thickness of the adhesive is 12 μm, otherwise the thickness of the adhesive is 10 μm. Further, when the thickness of the pattern layer 12 is 12 μm (Examples 11, 14, and 19), the thickness of the insulating resin layer 11 is 13 μm, and otherwise, the thickness of the insulating resin layer 11 is 25 μm. It is.
Figure JPOXMLDOC01-appb-T000003
  
Figure JPOXMLDOC01-appb-T000003
  
　上述した表３の評価では、接着材の流れ出しに関しては、実施例１１～１９においては、接着材の流れ出しは、パターン部１２ａ上およびスペース１４のいずれの箇所でも、１００μｍ以下となっている。したがって、２０μｍ～６０μｍの厚みのＣＰＰは、１２～３５μｍのいずれの厚みのパターン層１２に対しても、クッション層３３として好適となっている。 In the evaluation of Table 3 described above, regarding the flow-out of the adhesive, in Examples 11 to 19, the flow-out of the adhesive is 100 μm or less on both the pattern portion 12 a and the space 14. Therefore, CPP having a thickness of 20 μm to 60 μm is suitable as the cushion layer 33 for the pattern layer 12 having any thickness of 12 to 35 μm.
　したがって、パターン層１２（パターン部１２ａ）の高さ方向の寸法が変化しても、流れ出しの抑制には、問題がないと言える。特に、ＣＰＰの厚みが最も薄い２０μｍの場合においても、接着材の流れ出しが１００μｍ以下に抑えられたので、クッション層３３の材質としてＣＰＰを用いる場合、パターン層１２の凹凸への追従性が良好であると言える。 Therefore, even if the dimension in the height direction of the pattern layer 12 (pattern part 12a) changes, it can be said that there is no problem in suppressing the outflow. In particular, even when the thickness of the CPP is 20 μm, the flow of the adhesive is suppressed to 100 μm or less. Therefore, when the CPP is used as the material of the cushion layer 33, the followability to the unevenness of the pattern layer 12 is good. It can be said that there is.
　一方、ＰＭＰに関しては、１２μｍおよび１８μｍの厚みのパターン層１２については、パターン部１２ａ上およびスペース１４のいずれの箇所でも、接着材の流れ出しを１００μｍに抑えることができた。しかしながら、３５μｍの厚みのパターン層１２については、パターン部１２ａ上では接着材の流れ出しが１００μｍを超えた。また、スペース１４では接着材の流れ出しが１５０μｍを超えた。したがって、ＰＭＰは、３５μｍのパターン層１２に用いるのは不適となっている。 On the other hand, regarding the PMP, with respect to the pattern layer 12 having a thickness of 12 μm and 18 μm, the flow-out of the adhesive material could be suppressed to 100 μm at any position on the pattern portion 12 a and the space 14. However, for the pattern layer 12 having a thickness of 35 μm, the flow-out of the adhesive exceeded 100 μm on the pattern portion 12a. Moreover, in the space 14, the flow-out of the adhesive exceeded 150 μm. Therefore, PMP is not suitable for use in the 35 μm pattern layer 12.
（４）パターン部の幅とスペースの幅を変えたときの流れ出しの長さに関して
　次に、クッション層３３としてＰＭＰを材質とする離型フィルム３０と、クッション層３３としてＣＰＰを材質とする離型フィルム３０のそれぞれについて、ベース積層体１０のパターン部１２ａの幅Ｌと、スペース１４の幅Ｓを変えたときの流れ出しの長さに関して測定した。この測定では、クッション層３３の材質をＣＰＰとし、表１と同様に、接着材の流れ出しの長さを測定した。また、用いたラミネート装置やその他の素材（ベース積層体１０およびカバーフィルム２０）の厚み、ラミネート条件等は、上述した表１の場合と同じである。 (4) Regarding the length of flow when the width of the pattern portion and the width of the space are changed Next, the release film 30 made of PMP as the cushion layer 33 and the release made of CPP as the cushion layer 33 About each of the films 30, it measured about the length of the outflow when the width L of the pattern part 12a of the base laminated body 10 and the width S of the space 14 were changed. In this measurement, the material of the cushion layer 33 was CPP, and the length of the adhesive flowing out was measured as in Table 1. Moreover, the thickness of the used laminating apparatus and other materials (base laminate 10 and cover film 20), lamination conditions, and the like are the same as those in Table 1 described above.
　ラミネート体５０における接着材の流れ出しの長さの測定は、図１９のようにして行っている。すなわち、図１９に示すように、パターン部１２ａ上およびスペース１４での、接着材の流れ出しの最大長さＭ１，Ｍ２をそれぞれ測定している。パターン部１２ａ上およびスペース１４のいずれにおいても、流れ出しの最大長さＭ１，Ｍ２は、カバーフィルム２０から離れる方向における、カバーフィルム２０（カバー層２１）の端部からの流れ出しの最大長さに対応している。 The measurement of the flow length of the adhesive material in the laminate 50 is performed as shown in FIG. That is, as shown in FIG. 19, the maximum lengths M1 and M2 of the adhesive material flowing out on the pattern portion 12a and in the space 14 are measured. On both the pattern portion 12a and the space 14, the maximum flow lengths M1 and M2 correspond to the maximum flow length from the end of the cover film 20 (cover layer 21) in the direction away from the cover film 20. is doing.
　このような流れ出しの最大長さＭ１，Ｍ２の測定を、パターン部１２ａの幅Ｌとスペース１４の幅Ｓとを変化させて行った。そして、測定された最大長さＭ１，Ｍ２をグラフ化したものが、図２０から図２３である。図２０は、ＰＭＰをクッション層３３の材質とした場合の流れ出しの最大長さＭ１，Ｍ２について示す図である。 The maximum lengths M1 and M2 of the flow out were measured by changing the width L of the pattern portion 12a and the width S of the space 14. FIG. 20 to FIG. 23 are graphs showing the measured maximum lengths M1 and M2. FIG. 20 is a diagram showing the maximum flow lengths M1 and M2 when PMP is used as the material of the cushion layer 33. FIG.
　図２０から明らかなように、ＰＭＰをクッション層３３とした場合、特にスペース１４における接着材の流れ出しの最大長さＭ２が長くなっている。図２０では、スペース１４の幅Ｓが１４０μｍ（パターン部１２ａの幅Ｌが６０μｍの比較例３１、１６０μｍの比較例３２、および２６０μｍの比較例３３の場合）、２４０μｍ（パターン部１２ａの幅Ｌが２６０μｍの比較例４の場合）、３４０μｍ（パターン部１２ａの幅Ｌが４６０μｍの比較例３５の場合）のいずれの場合でも、流れ出しの最大長さＭ２が１５０μｍよりも大きくなっている。このことから、スペース１４では、パターン部１２ａの幅Ｌによらずに流れ出しの最大長さＭ２が長くなると考えられ、クッション層３３の材質として不適である。 As is apparent from FIG. 20, when PMP is used as the cushion layer 33, the maximum length M2 of the adhesive flowing out in the space 14 is particularly long. In FIG. 20, the width S of the space 14 is 140 μm (in the case of the comparative example 31 in which the width L of the pattern portion 12a is 60 μm, the comparative example 32 in the case of 160 μm, and the comparative example 33 of 260 μm), and 240 μm (the width L of the pattern portion 12a is In any case of Comparative Example 4 (260 μm) and 340 μm (Comparative Example 35 where the width L of the pattern portion 12a is 460 μm), the maximum flow-out length M2 is larger than 150 μm. For this reason, in the space 14, it is considered that the maximum flow length M2 becomes longer regardless of the width L of the pattern portion 12a, and is not suitable as a material for the cushion layer 33.
　また、パターン部１２ａにおける接着材の流れ出しの最大長さＭ１も、後述する図２１～図２３の場合よりも長くなっている。特に、パターン部１２ａの幅Ｌが１６０μｍ（スペース１４の幅Ｓが１４０μｍの比較例３１，３１の場合）、２６０μｍ（スペース１４の幅Ｓが１４０μｍの比較例３３、および２４０μｍの比較例３４の場合）、４６０μｍ（スペース１４の幅Ｓが３４０μｍの比較例３５の場合）のいずれの場合でも、流れ出しの最大長さＭ１が１００μｍよりも大きくなっている。したがって、パターン部１２ａの幅Ｌが１６０μｍ、２６０μｍ、４６０μｍの場合には、流れ出しの最大長さＭ１が長く、不適である。 Also, the maximum length M1 of the adhesive material flowing out in the pattern portion 12a is longer than that in the case of FIGS. 21 to 23 described later. In particular, the width L of the pattern portion 12a is 160 μm (in the case of Comparative Examples 31 and 31 in which the width S of the space 14 is 140 μm), 260 μm (in the case of Comparative Example 33 in which the width S of the space 14 is 140 μm) and ) In any case of 460 μm (in the case of Comparative Example 35 in which the width S of the space 14 is 340 μm), the maximum flow-out length M1 is larger than 100 μm. Therefore, when the width L of the pattern portion 12a is 160 μm, 260 μm, and 460 μm, the maximum flow length M1 is long, which is inappropriate.
　図２１は、２０μｍの厚みのＣＰＰをクッション層３３の材質とした場合の流れ出しの最大長さＭ１、Ｍ２について示す図である（実施例２１～２５）。図２２は、４０μｍの厚みのＣＰＰをクッション層３３の材質とした場合の流れ出しの最大長さＭ１，Ｍ２について示す図である（実施例２６～３０）。図２３は、６０μｍの厚みのＣＰＰをクッション層３３の材質とした場合の流れ出しの最大長さＭ１，Ｍ２について示す図である（実施例３１～３５）。 FIG. 21 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 20 μm is used as the material of the cushion layer 33 (Examples 21 to 25). FIG. 22 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 40 μm is used as the material of the cushion layer 33 (Examples 26 to 30). FIG. 23 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 60 μm is used as the material of the cushion layer 33 (Examples 31 to 35).
　図２１～図２３から明らかなように、パターン部１２ａにおける接着材の流れ出しの最大長さＭ１、およびスペース１４における接着材の流れ出しの最大長さＭ２は、いずれも１００μｍ以下となっている。したがって、幅Ｌと幅Ｓの組み合わせであるＬ／Ｓが６０μｍ／１４０μｍ（実施例２１，２６，３１）、１６０μｍ／１４０μｍ（実施例２２，２７，３２）、２６０μｍ／１４０μｍ（実施例２３，２８，３３）、２６０μｍ／２４０μｍ（実施例２４，２９，３４）、４６０μｍ／３４０μｍ（実施例２５，３０，３５）のいずれの場合でも、接着材の流れ出しの最大長さＭ１，Ｍ２を短く抑えられている。特に、図１９と比較して明らかなように、スペース１４における流れ出しの最大長さＭ２は、ＰＭＰをクッション層３３の材質として用いた場合よりも大幅に低下している。したがって、２０μｍ～６０μｍのいずれの厚みのＣＰＰにおいても、クッション層３３の材質として好適である。 As is clear from FIGS. 21 to 23, the maximum length M1 of the adhesive flowing out in the pattern portion 12a and the maximum length M2 of the adhesive flowing out in the space 14 are both 100 μm or less. Therefore, L / S, which is a combination of the width L and the width S, is 60 μm / 140 μm (Examples 21, 26, 31), 160 μm / 140 μm (Examples 22, 27, 32), 260 μm / 140 μm (Examples 23, 28). 33), 260 μm / 240 μm (Examples 24, 29, and 34), and 460 μm / 340 μm (Examples 25, 30, and 35), the maximum length M1 and M2 of the adhesive material can be kept short. ing. In particular, as apparent from comparison with FIG. 19, the maximum flow-out length M <b> 2 in the space 14 is significantly lower than when PMP is used as the material of the cushion layer 33. Therefore, any thickness of CPP of 20 μm to 60 μm is suitable as a material for the cushion layer 33.
（５）トラップ部３４の存在による、クッション層３３の剥がれ易さ（クッション層３３の破れの防止）について
　次に、クッション層３３としてＣＰＰを材質とする離型フィルム３０において、トラップ部３４が存在する場合と、存在しない場合で、クッション層３３の剥がれ易さ（クッション層３３の破れの防止）に関して評価を行った。 (5) Ease of peeling of the cushion layer 33 due to the presence of the trap portion 34 (prevention of tearing of the cushion layer 33) Next, in the release film 30 made of CPP as the cushion layer 33, the trap portion 34 exists. Evaluation was made regarding the ease of peeling of the cushion layer 33 (prevention of tearing of the cushion layer 33) in the case where it does and the case where it does not exist.
　このクッション層３３の剥がれ易さ（クッション層３３の破れの防止）について詳述すると、ベース積層体１０に対してカバーフィルム２０をラミネートする際に、離型フィルム３０を用いる場合、その離型フィルム３０のクッション層３３の端部側は、ラミネート時の加熱・加圧によって、外側に広がってしまう。 The ease of peeling of the cushion layer 33 (prevention of tearing of the cushion layer 33) will be described in detail. When the release film 30 is used when the cover film 20 is laminated on the base laminate 10, the release film is used. The end portion side of the 30 cushion layers 33 spreads outward due to heating and pressurization during lamination.
　図２６は、ラミネート前の離型フィルム３０と絶縁樹脂層１１を示す平面図であり、クッション層３３とトラップ部３４の位置関係を透過的に示す図である。図２７は、ラミネート前の離型フィルム３０と絶縁樹脂層１１の配置を示す側断面図である。図２８は、図２６に示す状態からラミネートを行った状態を示し、クッション層３３の一部が外側に流れ出して流れ出し部３３ａが形成された状態を示す図である。図２９は、図２７に示す状態からラミネートを行った状態を示し、クッション層３３の一部が外側に流れ出して流れ出し部３３ａが形成された状態を示す側断面図である。 FIG. 26 is a plan view showing the release film 30 and the insulating resin layer 11 before lamination, and is a view transparently showing the positional relationship between the cushion layer 33 and the trap portion 34. FIG. 27 is a side sectional view showing the arrangement of the release film 30 and the insulating resin layer 11 before lamination. FIG. 28 shows a state in which lamination is performed from the state shown in FIG. 26, and shows a state in which a part of the cushion layer 33 flows out to the outside and a flow-out portion 33a is formed. FIG. 29 is a side sectional view showing a state in which lamination is performed from the state shown in FIG. 27, and a state in which a part of the cushion layer 33 flows out to the outside and a flow-out portion 33 a is formed.
　図２８および図２９に示すような流れ出し部３３ａが形成されると、クッション層３３の端部側に、当該クッション層３３の他の部分よりも厚みの薄い部分が形成されることになる。そのため、クッション層３３が破れるきっかけとなる部分が形成され、それによってクッション層３３をラミネート体５０から剥がし難くなる。したがって、粘着層３２には、クッション層３３の端部側よりもはみ出している（飛び出している）トラップ部３４を設けているが、このトラップ部３４の存在の有無により、クッション層３３の剥がれ易さ（クッション層３３の破れの防止）に関して、評価を行った。 When the flow-out portion 33a as shown in FIGS. 28 and 29 is formed, a portion having a smaller thickness than other portions of the cushion layer 33 is formed on the end portion side of the cushion layer 33. Therefore, a portion that causes the cushion layer 33 to be broken is formed, which makes it difficult to peel the cushion layer 33 from the laminate 50. Therefore, the adhesive layer 32 is provided with a trap part 34 that protrudes (protrudes) beyond the end side of the cushion layer 33, and the cushion layer 33 is easily peeled off depending on the presence or absence of the trap part 34. Evaluation was made regarding the length (prevention of tearing of the cushion layer 33).
　表４は、その評価結果であるが、この評価では、ＣＰＰを材質とするクッション層３３の厚みが４０μｍでありトラップ部３４が存在するものを実施例４０とている。また、ＣＰＰを材質とするクッション層３３の厚みが４０μｍであるが、トラップ部３４が存在しないものを比較例４０としている。また、実施例４０では、トラップ部３４は、クッション層３３の端部に対して３ｍｍはみ出している。 Table 4 shows the results of the evaluation. In this evaluation, the example in which the thickness of the cushion layer 33 made of CPP is 40 μm and the trap portion 34 exists is referred to as Example 40. Further, the thickness of the cushion layer 33 made of CPP is 40 μm, but the one having no trap portion 34 is used as a comparative example 40. In Example 40, the trap portion 34 protrudes 3 mm from the end portion of the cushion layer 33.
　また、この評価では、離型フィルム３０のベース層３１としては、ＰＥＴを材質としていて、その厚みが５０μｍとなっている。また、粘着層３２は、その厚みが７μｍとなっている。また、銅のパターン層１２の厚みが３５μｍ、ポリイミドを材質とする絶縁樹脂層１１の厚みが２５μｍ、銅のパターン層１２と絶縁樹脂層１１の間の接着材の厚みが１２μｍとしている。また、カバーフィルム２０としては、ポリイミドを材質とするカバー層２１の厚みが２５μｍ、接着材層２２の厚みが２８μｍとなっている。 In this evaluation, the base layer 31 of the release film 30 is made of PET and has a thickness of 50 μm. The adhesive layer 32 has a thickness of 7 μm. The thickness of the copper pattern layer 12 is 35 μm, the thickness of the insulating resin layer 11 made of polyimide is 25 μm, and the thickness of the adhesive between the copper pattern layer 12 and the insulating resin layer 11 is 12 μm. Moreover, as the cover film 20, the thickness of the cover layer 21 made of polyimide is 25 μm, and the thickness of the adhesive layer 22 is 28 μm.
　また、ラミネート装置を用いた際のラミネート条件は、加熱温度が１８５度、プレス圧力が２ＭＰａ、予熱時間が１０秒（予熱温度も加熱温度と同等）、加圧時間が８０秒となっている。なお、表４では、クッション層３３の破れがある場合を『あり』、クッション層３３の破れがない場合を『なし』と記載している。 The laminating conditions when using the laminating apparatus are as follows: the heating temperature is 185 degrees, the press pressure is 2 MPa, the preheating time is 10 seconds (the preheating temperature is equal to the heating temperature), and the pressing time is 80 seconds. In Table 4, the case where the cushion layer 33 is torn is described as “Yes”, and the case where the cushion layer 33 is not torn is described as “None”.
Figure JPOXMLDOC01-appb-T000004
  
Figure JPOXMLDOC01-appb-T000004
  
　表４から明らかなように、トラップ部３４が存在する実施例４０においては、クッション層３３の破れは確認されなかった。一方、トラップ部３４が存在しない比較例４０においては、クッション層３３の破れが存在した。したがって、トラップ部３４が存在する場合には、クッション層３３の剥がれ易さが向上し、クッション層３３の破れを防止できると考えられる。 As is clear from Table 4, in Example 40 where the trap portion 34 exists, the cushion layer 33 was not broken. On the other hand, in the comparative example 40 in which the trap part 34 does not exist, the cushion layer 33 was torn. Therefore, when the trap part 34 exists, it is thought that the ease of peeling of the cushion layer 33 is improved and the cushion layer 33 can be prevented from being torn.
（６）トラップ部３４の寸法について
　次に、トラップ部３４がクッション層３３の端部に対して、どのぐらい飛び出す（はみ出す）寸法が必要なのかについて述べる。トラップ部３４は、クッション層３３よりも厚みが薄くなる流れ出し部３３ａを粘着して保持することで、クッション層３３が破れるきっかけとなる部分が形成されるのを防止するものである。したがって、トラップ部３４は、最低限、流れ出し部３３ａを覆う程度の寸法があれば良い、と考えられる。すなわち、トラップ部３４は、最低限、流れ出し部３３ａがクッション層３３の端部から流れ出す寸法に対応するものであれば良い、と考えられる。 (6) About the dimension of the trap part 34 Next, it will be described how much the trap part 34 needs to project to the end part of the cushion layer 33. The trap part 34 prevents the formation of a part that causes the cushion layer 33 to be broken by sticking and holding the flow-out part 33 a having a thickness smaller than that of the cushion layer 33. Therefore, it is considered that the trap portion 34 is required to have a size that covers at least the flow-out portion 33a. That is, it is considered that the trap portion 34 may be at least as long as it corresponds to the dimension in which the flow-out portion 33 a flows out from the end portion of the cushion layer 33.
　この流れ出しの寸法の測定は、上述した実施例４０の構成について行った。そして、流れ出し部３３ａにおおける流れ出しの寸法は、ラミネートする前のクッション層３３の端部から離れる方向に向かい、どの程度流れ出したのかを測定した。このとき、ラミネート前のクッション層３３の端部に沿って、所定の間隔で、合計１０点の寸法（Ｌ１，Ｌ２，Ｌ３，Ｌ４，Ｌ５，Ｌ６，Ｌ７，Ｌ８，Ｌ９，Ｌ１０）を測定した。 The measurement of the dimension of this outflow was performed for the configuration of Example 40 described above. And the dimension of the outflow in the outflow part 33a went to the direction away from the edge part of the cushion layer 33 before laminating, and measured how much it flowed out. At this time, a total of 10 dimensions (L1, L2, L3, L4, L5, L6, L7, L8, L9, L10) were measured at predetermined intervals along the end of the cushion layer 33 before lamination. .
　なお、実際の測定結果は次のようになっている。すなわち、Ｌ１＝１．１ｍｍ、Ｌ２＝１．０ｍｍ、Ｌ３＝１．４ｍｍ、Ｌ４＝１．４ｍｍ、Ｌ５＝１．１ｍｍ、Ｌ６＝１．５ｍｍ、Ｌ７＝１．６ｍｍ、Ｌ８＝１．０ｍｍ、Ｌ９＝１．５ｍｍ、Ｌ１０＝０．７ｍｍとなっている。 The actual measurement results are as follows. That is, L1 = 1.1 mm, L2 = 1.0 mm, L3 = 1.4 mm, L4 = 1.4 mm, L5 = 1.1 mm, L6 = 1.5 mm, L7 = 1.6 mm, L8 = 1.0 mm, L9 = 1.5 mm and L10 = 0.7 mm.
　そして、これらＬ１～Ｌ１０の平均値Ａｖを計算し、さらに平均値と各寸法の際に基づいて標準偏差σを算出した。ここで、平均値Ａｖに対して標準偏差σの４倍の値を加減した範囲から外れる確率εは、０．００６％として知られている。したがって、平均値Ａｖに、標準偏差σを４倍したものを加えた値（カバー率Ｃ）には、流れ出し部３３ａの９９．９９７％が収まることになるので、このカバー率Ｃを算出した。 Then, an average value Av of these L1 to L10 was calculated, and a standard deviation σ was calculated based on the average value and each dimension. Here, the probability ε out of the range obtained by adding or subtracting four times the standard deviation σ to the average value Av is known as 0.006%. Accordingly, 99.997% of the flow-out portion 33a is included in the value (cover rate C) obtained by adding the standard deviation σ to 4 times the average value Av. Therefore, the cover rate C was calculated.
　すると、上述のＬ１～Ｌ１０の平均値Ａｖは１．２ｍｍと算出され（小数点第１位まで算出）、標準偏差σは０．３ｍｍと算出されたので、カバー率Ｃは、２．４ｍｍと算出された。この２．４ｍｍに若干の余裕分を持たせ、また寸法単位ｍｍの小数点第１位がない数値を算出すると、３ｍｍとなる。以上のようにして、トラップ部３４の寸法が算出されている。 Then, the average value Av of the above-mentioned L1 to L10 is calculated as 1.2 mm (calculated to the first decimal place), and the standard deviation σ is calculated as 0.3 mm, so the cover ratio C is calculated as 2.4 mm. It was done. If this 2.4 mm is given a slight margin and a numerical value without the first decimal place in the dimensional unit mm is calculated, it becomes 3 mm. As described above, the dimensions of the trap portion 34 are calculated.
＜効果について＞
　以上のような構成の離型フィルム３０およびフレキシブルプリント基板の製造方法によると、次のような効果が生じる。 <About effect>
According to the method for manufacturing the release film 30 and the flexible printed board having the above-described configuration, the following effects are produced.
　すなわち、絶縁樹脂層１１とパターン層１２を有するベース積層体１０に対して、カバーフィルム２０をラミネートする際に用いられる離型フィルム３０においては、ポリエステル系樹脂を主成分とするベース層３１と、オレフィン系樹脂を主成分とすると共に、加熱および加圧によってカバーフィルム２０を覆いつつ当該カバーフィルム２０とベース積層体１０の凹凸に追従するクッション層３３と、クッション層３３をベース層３１に対して貼り付けると共に、クッション層３３の端部側よりはみ出して露出しているトラップ部３４が存在する粘着層３２と、を備えている。 That is, in the release film 30 used when laminating the cover film 20 to the base laminate 10 having the insulating resin layer 11 and the pattern layer 12, a base layer 31 mainly composed of a polyester-based resin, The cushion layer 33 that follows the unevenness of the cover film 20 and the base laminate 10 while covering the cover film 20 by heating and pressurization, and the cushion layer 33 is formed with respect to the base layer 31. And an adhesive layer 32 having a trap portion 34 that protrudes from the end side of the cushion layer 33 and is exposed.
　このため、クッション層３３の端部側において、ラミネート時に広がるクッション層３３を、トラップ部３４によってトラップする（保持する）ことが可能となる。それにより、クッション層３３が不必要に広がってしまい、クッション層３３に薄い部分が必要以上に形成されるのを防止可能となる。また、クッション層３３が離型フィルム３０の端部から飛び出してしまうのを防止可能となる。したがって、離型フィルム３０をラミネート体５０から剥がし易くなる。また、離型フィルム３０をラミネート体５０から剥がす際に、クッション層３３が破れ難くなる。 Therefore, on the end side of the cushion layer 33, the cushion layer 33 that spreads during lamination can be trapped (held) by the trap portion 34. Thereby, the cushion layer 33 is unnecessarily spread, and it is possible to prevent the cushion layer 33 from being formed with a thin portion more than necessary. Further, the cushion layer 33 can be prevented from jumping out from the end portion of the release film 30. Therefore, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
　また、クッション層３３は、加熱および加圧によってカバーフィルム２０を覆いつつ当該カバーフィルム２０とベース積層体１０の凹凸に追従するものであり、そのクッション層３３はオレフィン系樹脂を主成分としている。したがって、接着材層２２から接着材が流れ出すのを良好に防止可能となる。それにより、流れ出した接着材がパターン部１２ａやスペース１４において広がってしまうのを防止可能となり、広がった接着材により、めっき処理後に導通不能となるのを防止可能となる。 Further, the cushion layer 33 follows the unevenness of the cover film 20 and the base laminate 10 while covering the cover film 20 by heating and pressurization, and the cushion layer 33 is mainly composed of an olefin resin. Therefore, it is possible to satisfactorily prevent the adhesive material from flowing out of the adhesive material layer 22. Thereby, it is possible to prevent the adhesive material that has flowed out from spreading in the pattern portion 12a and the space 14, and it is possible to prevent the spread adhesive material from becoming inoperable after the plating process.
　このようなクッション層３３を備えることで、図２５に示すような不具合を解消可能となる。図２５は、流れ出し部２２ａが形成された状態の一体化物８０の構成を示す図である。なお、図２５は、クッション層３３としてＰＭＰを用いている離型フィルム３０を利用して形成したラミネート体５０のうち、図６に示すIII－III断面付近において、ラミネート体５０に異方導電性フィルム６０が貼り付けられ、さらにその異方導電性フィルム６０を介して貼付対象物７０が貼り付けられた一体化物８０のイメージを示すものである。なお、異方導電性フィルム６０は、熱硬化性樹脂層６１の内部に金属粒子６２が多数分散されているものである。 By providing such a cushion layer 33, it is possible to solve the problem as shown in FIG. FIG. 25 is a diagram illustrating a configuration of the integrated object 80 in a state where the flow-out portion 22a is formed. 25 shows an anisotropic conductive property of the laminate 50 in the vicinity of the III-III cross section shown in FIG. 6 in the laminate 50 formed using the release film 30 using PMP as the cushion layer 33. The image of the integrated object 80 in which the film 60 was affixed and the sticking target object 70 was affixed through the anisotropic conductive film 60 is shown. The anisotropic conductive film 60 has a large number of metal particles 62 dispersed in the thermosetting resin layer 61.
　図２５に示すように、接着材層２２が融けることで流れ出し部２２ａが形成されると、その流れ出し部２２ａは、パターン部１２ａを所定だけ覆う状態となる。流れ出し部２２ａは電気的な絶縁性を備えている。したがって、金属粒子６２が分散された異方導電性フィルム６０を用いても、貼付対象物７０の導体部７２とパターン部１２ａの間で電気的に導通させることができなくなる虞がある。 As shown in FIG. 25, when the flow-out portion 22a is formed by melting the adhesive layer 22, the flow-out portion 22a is in a state of covering the pattern portion 12a by a predetermined amount. The outflow part 22a has electrical insulation. Therefore, even if the anisotropic conductive film 60 in which the metal particles 62 are dispersed is used, there is a possibility that electrical conduction cannot be established between the conductor portion 72 and the pattern portion 12a of the pasting target 70.
　加えて、接着材の流れ出しが多くなり、図２５に示すような流れ出し部２２ａが形成されると、隣り合うパターン部１２ａの間のスペース１４に存在する金属粒子６２は、一体化物８０の厚み方向において、導体部７２側に移動することになる。したがって、流れ出しが多くなると、金属粒子６２同士が複数のパターン部１２ａを横断する方向で繋がってしまい、複数のパターン部１２ａを横断する方向でも導電性を示してしまう。そのため、一体化物８０の厚み方向のみに導電性を示すような異方導電性が阻害されてしまう。 In addition, when the flow-out part 22a as shown in FIG. 25 is formed as the flow of the adhesive increases, the metal particles 62 existing in the space 14 between the adjacent pattern parts 12a are in the thickness direction of the integrated object 80. In this case, it moves to the conductor portion 72 side. Therefore, when the flow-out increases, the metal particles 62 are connected in a direction crossing the plurality of pattern portions 12a, and conductivity is exhibited even in a direction crossing the plurality of pattern portions 12a. Therefore, anisotropic conductivity that shows conductivity only in the thickness direction of the integrated object 80 is hindered.
　これに対して、本実施の形態の離型フィルム３０を用いた場合の構成を図２４に示す。図２４は、離型フィルム３０を用いて流れ出し部２２ａの形成が抑制された状態の一体化物８０の構成を示す図である。なお、図２４も、ラミネート体５０のうち、図６に示すIII－III断面付近において、ラミネート体５０に異方導電性フィルム６０が貼り付けられ、さらにその異方導電性フィルム６０を介して貼付対象物７０が貼り付けられた一体化物８０のイメージを示す図である。 On the other hand, FIG. 24 shows a configuration when the release film 30 of the present embodiment is used. FIG. 24 is a diagram illustrating a configuration of the integrated object 80 in a state where formation of the flow-out portion 22a is suppressed using the release film 30. In FIG. 24, an anisotropic conductive film 60 is attached to the laminate 50 in the vicinity of the cross-section III-III shown in FIG. 6 in the laminate 50, and further attached via the anisotropic conductive film 60. It is a figure which shows the image of the integrated object 80 on which the target object 70 was affixed.
　図２４に示す一体化物８０においては、ラミネート体５０と貼付対象物７０の間に、異方導電性フィルム６０を挟んで押圧力を及ぼし、加熱等を行うことで、金属粒子６２が貼付対象物７０の導体部７２と電気的に接触し、また金属粒子６２がパターン部１２ａとも電気的に接触する。それにより、導体部７２とパターン部１２ａとが電気的に導通する状態となる。このように、本実施の形態の離型フィルム３０を用いると、図２４に示すような導体部７２とパターン部１２ａの間で、電気的な導通状態を確保することができる。 In the integrated product 80 shown in FIG. 24, the metal particles 62 are applied to the application object by applying a pressing force between the laminate 50 and the application object 70 with the anisotropic conductive film 60 sandwiched between the laminate 50 and the application object 70. 70, and the metal particles 62 are also in electrical contact with the pattern portion 12a. As a result, the conductor portion 72 and the pattern portion 12a are electrically connected. Thus, when the release film 30 of this Embodiment is used, an electrical continuity state can be ensured between the conductor part 72 and the pattern part 12a as shown in FIG.
　また、離型フィルム３０を用いて流れ出し部２２ａの形成を抑制することにより、隣り合うパターン部１２ａの間のスペース１４に存在する金属粒子６２は、一体化物８０の厚み方向において、導体部７２側に移動するのを防止可能となる。それにより、金属粒子６２同士が複数のパターン部１２ａを横断する方向で繋がってしまうのを防止可能となる。そのため、一体化物８０の厚み方向のみに導電性を示すような異方導電性を確保することができる。 In addition, by suppressing the formation of the flow-out portion 22 a using the release film 30, the metal particles 62 existing in the space 14 between the adjacent pattern portions 12 a are in the conductor portion 72 side in the thickness direction of the integrated product 80. It is possible to prevent the movement. Thereby, it becomes possible to prevent the metal particles 62 from being connected in a direction crossing the plurality of pattern portions 12a. Therefore, anisotropic conductivity that exhibits conductivity only in the thickness direction of the integrated object 80 can be ensured.
　ここで、パターン層１２の微細化が進展する場合、流れ出し部２２ａの形成が抑制されないと、電気的に接続可能な有効面積が小さくなり、パターン層１２の微細化の妨げになる。しかしながら、本実施の形態の離型フィルム３０を用いて流れ出し部２２ａの形成を抑制することにより、電気的に接続可能な有効面積を広く確保することができ、パターン層１２の微細化に対応させることができる。 Here, when the miniaturization of the pattern layer 12 proceeds, if the formation of the flow-out portion 22a is not suppressed, the effective area that can be electrically connected is reduced, and the miniaturization of the pattern layer 12 is hindered. However, by suppressing the formation of the flow-out portion 22a using the release film 30 of the present embodiment, a wide effective area that can be electrically connected can be secured, and the pattern layer 12 can be made finer. be able to.
　また、本実施の形態では、粘着層３２は、アクリル系樹脂を主成分としていることが好ましい。粘着層３２がアクリル系樹脂を主成分とする場合、十分な粘着力を確保することができる。それにより、クッション層３３の端部側において、ラミネート時に広がるクッション層３３を、トラップ部３４によって十分にトラップする（保持する）ことが可能となる。したがって、クッション層３３が離型フィルム３０の端部から飛び出してしまうのを良好に防止可能となる。それにより、離型フィルム３０をラミネート体５０から剥がし易くなる。また、離型フィルム３０をラミネート体５０から剥がす際に、クッション層３３が破れ難くなる。 In the present embodiment, it is preferable that the adhesive layer 32 is mainly composed of an acrylic resin. When the adhesive layer 32 has an acrylic resin as a main component, sufficient adhesive force can be secured. Thereby, on the end side of the cushion layer 33, the cushion layer 33 spreading during lamination can be sufficiently trapped (held) by the trap portion 34. Therefore, it is possible to satisfactorily prevent the cushion layer 33 from jumping out from the end portion of the release film 30. Thereby, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
　さらに、本実施の形態では、トラップ部３４は、クッション層３３の端部に対して少なくとも３ｍｍ以上はみ出していることが好ましい。クッション層３３の端部に対し、トラップ部３４が少なくとも３ｍｍはみ出している場合、ラミネート時に広がったクッション層３３を十分にトラップする（保持する）ことができる。それにより、クッション層３３が離型フィルム３０の端部から飛び出してしまうのを良好に防止可能となる。それにより、離型フィルム３０をラミネート体５０から剥がし易くなる。また、離型フィルム３０をラミネート体５０から剥がす際に、クッション層３３が破れ難くなる。 Furthermore, in the present embodiment, it is preferable that the trap portion 34 protrudes at least 3 mm or more from the end portion of the cushion layer 33. When the trap portion 34 protrudes at least 3 mm from the end portion of the cushion layer 33, the cushion layer 33 spread during lamination can be sufficiently trapped (held). Thereby, it is possible to satisfactorily prevent the cushion layer 33 from jumping out from the end portion of the release film 30. Thereby, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
　また、本実施の形態では、クッション層３３は、ポリプロピレンを主成分としていることが好ましい。クッション層３３がポリプロピレンを主成分とする場合、流れ出し部２２ａが形成されるのを良好に抑制することができる。また、ラミネート後にクッション層３３をラミネート体５０から剥がす場合、クッション層３３が破れるのを防止可能となり、離型フィルム３０の離型性を良好とすることができる。 In the present embodiment, the cushion layer 33 is preferably composed mainly of polypropylene. When the cushion layer 33 has polypropylene as a main component, the formation of the flow-out portion 22a can be satisfactorily suppressed. Moreover, when peeling the cushion layer 33 from the laminated body 50 after lamination, it becomes possible to prevent that the cushion layer 33 is torn, and the release property of the release film 30 can be made favorable.
　さらに、本実施の形態では、クッション層３３は、ポリプロピレンのうち無延伸ポリプロピレンまたはインフレーションポリプロピレンのいずれかを主成分とする、ことが好ましい。これらを主成分とする場合、クッション層３３がポリプロピレンを主成分とする場合、流れ出し部２２ａが形成されるのを良好に抑制することができる。また、ラミネート後にクッション層３３をラミネート体５０から剥がす場合、クッション層３３が破れるのを防止可能となり、離型フィルム３０の離型性を良好とすることができる。さらに、ラミネート後に、ラミネート体５０に皺が生じるのを良好に防止可能となる。 Furthermore, in the present embodiment, it is preferable that the cushion layer 33 is mainly composed of unstretched polypropylene or inflation polypropylene among polypropylene. When these are the main components, when the cushion layer 33 is mainly composed of polypropylene, it is possible to satisfactorily prevent the flow-out portion 22a from being formed. Moreover, when peeling the cushion layer 33 from the laminated body 50 after lamination, it becomes possible to prevent that the cushion layer 33 is torn, and the release property of the release film 30 can be made favorable. Furthermore, it is possible to satisfactorily prevent wrinkles from occurring in the laminate 50 after lamination.
　また、本実施の形態のフレキシブルプリント基板の製造方法においては、第１工程では、絶縁樹脂層１１とパターン層１２を有するベース積層体１０に対して、カバーフィルム２０を仮接着して仮接着体４０を形成する。また、第２工程では、第１工程の後に、ポリエステル系樹脂を主成分とするベース層３１と、オレフィン系樹脂を主成分とするクッション層３３と、クッション層３３をベース層３１に対して貼り付けると共にクッション層３３の端部側よりはみ出して露出しているトラップ部３４が存在する粘着層３２とを有する離型フィルム３０を、カバーフィルム２０側から仮接着体４０に対して位置合わせする。 Moreover, in the manufacturing method of the flexible printed circuit board of this Embodiment, in the 1st process, the cover film 20 is temporarily bonded with respect to the base laminated body 10 which has the insulating resin layer 11 and the pattern layer 12, and temporary bonding body is carried out. 40 is formed. In the second step, after the first step, the base layer 31 mainly composed of polyester resin, the cushion layer 33 mainly composed of olefin resin, and the cushion layer 33 are bonded to the base layer 31. At the same time, the release film 30 having the adhesive layer 32 having the exposed trap portion 34 protruding from the end side of the cushion layer 33 is aligned with the temporary adhesive body 40 from the cover film 20 side.
　また、第３工程では、第２工程の後に、離型フィルム３０を介して仮接着体４０を加熱および加圧することで、カバーフィルム２０をベース積層体１０にラミネートしてラミネート体５０を形成する。また、第４工程では、第３工程の後に、ラミネート時よりも温度の低下した離型フィルム３０をラミネート体５０から剥がす。また、第５工程では、剥がした後の離型フィルム３０において、粘着層３２からクッション層３３を剥がすと共に、新たなクッション層３３を粘着層３２に貼り付ける。そして、第５工程の後に、再び第１工程に戻り各工程を繰り返している。 In the third step, after the second step, the temporary adhesive body 40 is heated and pressed through the release film 30 to laminate the cover film 20 to the base laminate 10 to form the laminate 50. . In the fourth step, after the third step, the release film 30 having a temperature lower than that during lamination is peeled off from the laminate 50. In the fifth step, in the release film 30 after being peeled off, the cushion layer 33 is peeled off from the adhesive layer 32 and a new cushion layer 33 is attached to the adhesive layer 32. And after the 5th process, it returns to the 1st process again and repeats each process.
　このようにすることで、ラミネート体５０の形成後に、使用済みの離型フィルム３０の全体を無駄に廃棄せずに済む。すなわち、ラミネート後には、粘着層３２からクッション層３３を剥がし、そのクッション層３３のみを廃棄するか、または再加工する。一方、粘着層３２には新たなクッション層３３が貼り付けられるので、ベース層３１と粘着層３２は、再利用される。したがって、上述のように、使用済みの離型フィルム３０の全体を無駄に廃棄せずに済み、ベース層３１と粘着層３２について再利用を図ることができる。したがって、資源の無駄を低減できると共に、新たな離型フィルム３０の全体を必要としない分だけ、コストを低減可能となる。 By doing so, it is not necessary to waste the entire used release film 30 after the laminate 50 is formed. That is, after lamination, the cushion layer 33 is peeled off from the adhesive layer 32, and only the cushion layer 33 is discarded or reprocessed. On the other hand, since a new cushion layer 33 is affixed to the adhesive layer 32, the base layer 31 and the adhesive layer 32 are reused. Therefore, as described above, it is not necessary to waste the entire used release film 30 and the base layer 31 and the adhesive layer 32 can be reused. Therefore, waste of resources can be reduced, and cost can be reduced by the amount that does not require the entire new release film 30.
＜変形例＞
　以上、本発明の一実施の形態について説明したが、本発明はこれ以外にも種々変形可能となっている。以下、それについて述べる。 <Modification>
Although one embodiment of the present invention has been described above, the present invention can be variously modified in addition to this. This will be described below.
　上述の実施の形態においては、トラップ部３４は、離型フィルム３０の外周の全体に亘りクッション層３３の端部に対して突出していても良く、少なくとも一部のみがクッション層３３の端部に対して突出していても良い。 In the above-described embodiment, the trap portion 34 may protrude with respect to the end portion of the cushion layer 33 over the entire outer periphery of the release film 30, and at least a part thereof is at the end portion of the cushion layer 33. On the other hand, it may protrude.
　また、離型フィルム３０の形状は、どのようなものであっても良い。たとえば矩形のシート状であっても良く、ロール状に巻回されたものであっても良い。離型フィルム３０がロール状に巻回されたものである場合、ロール状に巻回可能な長尺のベース層３１と粘着層３２の一体化物に対し、所定寸法に区切られたクッション層３３が間欠的に貼り付けられることで、トラップ部３４を形成することができる。 Further, the release film 30 may have any shape. For example, it may be a rectangular sheet or may be wound in a roll. When the release film 30 is wound in a roll shape, the cushion layer 33 divided into a predetermined dimension is formed with respect to an integrated product of the long base layer 31 and the adhesive layer 32 that can be wound in a roll shape. The trap part 34 can be formed by affixing intermittently.
　また、所定形状の離型フィルム３０が当初はトラップ部３４が存在しないものとし、熱プレスその他の手法によって、離型フィルム３０の外周縁部から所定範囲のクッション層３３を除去することで、トラップ部３４を形成するようにしても良い。 In addition, it is assumed that the release film 30 having a predetermined shape does not have the trap portion 34 at the beginning, and the trap layer 33 is removed from the outer peripheral edge portion of the release film 30 by a hot press or other technique, thereby trapping. The part 34 may be formed.
　１０…ベース積層体、１１…絶縁樹脂層、１２…パターン層、１２ａ…パターン部、１４…スペース、２０…カバーフィルム、２１…カバー層、２２…接着材層、２２ａ…流れ出し部、２３…開口部、３０…離型フィルム、３１…ベース層、３２…粘着層、３３…クッション層、３４…トラップ部、４０…仮接着体、５０…ラミネート体、６０…異方導電性フィルム、６１…熱硬化性樹脂層、６２…金属粒子、７０…貼付対象物、７２…導体部、８０…一体化物、１００…載置板、２３１…一段開口部、２３２…二段開口部 DESCRIPTION OF SYMBOLS 10 ... Base laminated body, 11 ... Insulating resin layer, 12 ... Pattern layer, 12a ... Pattern part, 14 ... Space, 20 ... Cover film, 21 ... Cover layer, 22 ... Adhesive material layer, 22a ... Outflow part, 23 ... Opening 30 ... Release film, 31 ... Base layer, 32 ... Adhesive layer, 33 ... Cushion layer, 34 ... Trap part, 40 ... Temporary adhesive, 50 ... Laminate, 60 ... Anisotropic conductive film, 61 ... Heat Curable resin layer, 62 ... metal particles, 70 ... object to be pasted, 72 ... conductor part, 80 ... integrated object, 100 ... mounting plate, 231 ... one-stage opening, 232 ... two-stage opening

Claims (7)

  1. 　絶縁樹脂層とパターン層を有するベース積層体に対して、カバーフィルムをラミネートする際に用いられる離型フィルムであって、
    　ポリエステル系樹脂を主成分とするベース層と、
    　オレフィン系樹脂を主成分とすると共に、加熱および加圧によって前記カバーフィルムを覆いつつ当該カバーフィルムと前記ベース積層体の凹凸に追従するクッション層と、
    　前記クッション層を前記ベース層に対して貼り付けると共に、前記クッション層の端部側よりはみ出して露出しているトラップ部が存在する粘着層と、
    　を備えることを特徴とする離型フィルム。     A release film used when laminating a cover film on a base laminate having an insulating resin layer and a pattern layer,
    A base layer mainly composed of a polyester resin;
    A cushion layer that has an olefin-based resin as a main component and follows the unevenness of the cover film and the base laminate while covering the cover film by heating and pressurization,
    Adhering the cushion layer to the base layer, and an adhesive layer in which there is an exposed trapped part protruding from the end side of the cushion layer;
    A release film comprising:
  2. 　請求項１記載の離型フィルムであって、
    　前記粘着層は、アクリル系樹脂を主成分としている、
    　ことを特徴とする離型フィルム。     The release film according to claim 1,
    The adhesive layer is mainly composed of an acrylic resin.
    A release film characterized by that.
  3. 　請求項１記載の離型フィルムであって、
    　前記トラップ部は、前記クッション層の端部に対して少なくとも３ｍｍ以上はみ出している、
    　ことを特徴とする離型フィルム。     The release film according to claim 1,
    The trap part protrudes at least 3 mm or more from the end of the cushion layer;
    A release film characterized by that.
  4. 　請求項２記載の離型フィルムであって、
    　前記トラップ部は、前記クッション層の端部に対して少なくとも３ｍｍ以上はみ出している、
    　ことを特徴とする離型フィルム。     The release film according to claim 2,
    The trap part protrudes at least 3 mm or more from the end of the cushion layer;
    A release film characterized by that.
  5. 　請求項１から４のいずれか１項に記載の離型フィルムであって、
    　前記クッション層は、ポリプロピレンを主成分としている、
    　ことを特徴とする離型フィルム。     The release film according to any one of claims 1 to 4,
    The cushion layer is mainly composed of polypropylene,
    A release film characterized by that.
  6. 　請求項５記載の離型フィルムであって、
    　前記クッション層は、前記ポリプロピレンのうち無延伸ポリプロピレンまたはインフレーションポリプロピレンのいずれかを主成分とする、
    　ことを特徴とする離型フィルム。     The release film according to claim 5,
    The cushion layer is mainly composed of either unstretched polypropylene or inflation polypropylene among the polypropylene.
    A release film characterized by that.
  7. 　フレキシブルプリント基板の製造方法であって、
    　絶縁樹脂層とパターン層を有するベース積層体に対して、カバーフィルムを仮接着して仮接着体を形成する第１工程と、
    　前記第１工程の後に、ポリエステル系樹脂を主成分とするベース層と、オレフィン系樹脂を主成分とするクッション層と、前記クッション層を前記ベース層に対して貼り付けると共に前記クッション層の端部側よりはみ出して露出しているトラップ部が存在する粘着層とを有する離型フィルムを、前記カバーフィルム側から前記仮接着体に対して位置合わせする第２工程と、
    　前記第２工程の後に、前記離型フィルムを介して前記仮接着体を加熱および加圧することで、前記カバーフィルムを前記ベース積層体にラミネートしてラミネート体を形成する第３工程と、
    　前記第３工程の後に、ラミネート時よりも温度の低下した前記離型フィルムを前記ラミネート体から剥がす第４工程と、
    　剥がした後の前記離型フィルムにおいて、前記粘着層から前記クッション層を剥がすと共に、新たな前記クッション層を前記粘着層に貼り付ける第５工程と、
    　を備え、前記第５工程の後に再び前記第１工程に戻り各工程を繰り返す、
    　ことを特徴とするフレキシブルプリント基板の製造方法。     A method for manufacturing a flexible printed circuit board, comprising:
    A first step of temporarily bonding a cover film to a base laminate having an insulating resin layer and a pattern layer to form a temporary bonded body;
    After the first step, a base layer mainly composed of a polyester-based resin, a cushion layer mainly composed of an olefin-based resin, and an end portion of the cushion layer while the cushion layer is attached to the base layer A second step of aligning the release film having an adhesive layer with an exposed trap portion protruding from the side with respect to the temporary adhesive body from the cover film side;
    After the second step, a third step of laminating the cover film to the base laminate to form a laminate by heating and pressurizing the temporary adhesive through the release film;
    After the third step, a fourth step of peeling the release film having a temperature lower than that at the time of laminating from the laminate,
    In the release film after peeling, the fifth step of peeling the cushion layer from the adhesive layer and attaching a new cushion layer to the adhesive layer;
    And after each of the fifth steps, return to the first step again and repeat each step.
    A method for producing a flexible printed circuit board.
PCT/JP2017/047063 2017-03-29 2017-12-27 Mold releasing film and method for manufacturing flexible printed circuit board WO2018179655A1 (en)

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100588A (en) * 1982-11-30 1984-06-09 日本メクトロン株式会社 Method of laminating cover film on circuit board
JPH02175247A (en) * 1988-12-28 1990-07-06 Mitsui Petrochem Ind Ltd Release film composed of laminate
JPH0433855A (en) * 1990-05-30 1992-02-05 Dainippon Ink & Chem Inc Manufacture of metal foil-plated laminated plate
JPH0489340U (en) * 1990-02-16 1992-08-04
JP2003313313A (en) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd Mold release film
WO2005002850A1 (en) * 2003-07-01 2005-01-13 Sumitomo Bakelite Co., Ltd. Mold release film and process for producing flexible printed wiring board therewith
JP2005212453A (en) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd Release film and manufacturing process of release film
WO2008001682A1 (en) * 2006-06-27 2008-01-03 Mitsui Chemicals, Inc. Film and mold release film
JP2010098075A (en) * 2008-10-15 2010-04-30 Nippon Mektron Ltd Method for manufacturing flexible circuit substrate, and flexible circuit substrate
JP2015083379A (en) * 2010-03-12 2015-04-30 積水化学工業株式会社 Release film and method of producing release film

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100588A (en) * 1982-11-30 1984-06-09 日本メクトロン株式会社 Method of laminating cover film on circuit board
JPH02175247A (en) * 1988-12-28 1990-07-06 Mitsui Petrochem Ind Ltd Release film composed of laminate
JPH0489340U (en) * 1990-02-16 1992-08-04
JPH0433855A (en) * 1990-05-30 1992-02-05 Dainippon Ink & Chem Inc Manufacture of metal foil-plated laminated plate
JP2003313313A (en) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd Mold release film
WO2005002850A1 (en) * 2003-07-01 2005-01-13 Sumitomo Bakelite Co., Ltd. Mold release film and process for producing flexible printed wiring board therewith
JP2005212453A (en) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd Release film and manufacturing process of release film
WO2008001682A1 (en) * 2006-06-27 2008-01-03 Mitsui Chemicals, Inc. Film and mold release film
JP2010098075A (en) * 2008-10-15 2010-04-30 Nippon Mektron Ltd Method for manufacturing flexible circuit substrate, and flexible circuit substrate
JP2015083379A (en) * 2010-03-12 2015-04-30 積水化学工業株式会社 Release film and method of producing release film

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