WO2018149378A1 - Plastic packaging material transferring apparatus and method - Google Patents

Plastic packaging material transferring apparatus and method Download PDF

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Publication number
WO2018149378A1
WO2018149378A1 PCT/CN2018/076294 CN2018076294W WO2018149378A1 WO 2018149378 A1 WO2018149378 A1 WO 2018149378A1 CN 2018076294 W CN2018076294 W CN 2018076294W WO 2018149378 A1 WO2018149378 A1 WO 2018149378A1
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WO
WIPO (PCT)
Prior art keywords
vacuum suction
vacuum
rigid plate
suction mechanism
molding
Prior art date
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PCT/CN2018/076294
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French (fr)
Chinese (zh)
Inventor
李扬渊
陈明涵
Original Assignee
苏州迈瑞微电子有限公司
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Publication of WO2018149378A1 publication Critical patent/WO2018149378A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Definitions

  • the invention relates to a chip molding material transfer device, in particular to a transfer device and method for a rigid plate, a flexible film and a molding compound used in a Compression-mold packaging process transfer chip package.
  • the Compression-mold packaging process uses a release film to load the molding compound into the lower cavity of the molding device, the upper cavity vacuum-adsorbs the substrate on which the chip is mounted, the upper cavity and the lower cavity are closed, and the heating is performed.
  • the melted plastic sealing material is plastically sealed, and the release film is simultaneously used for demoulding.
  • the compression molding process is more conducive to reducing the thickness of the plastic seal, ensuring the stability of the plastic seal quality, and improving the productivity by continuous operation.
  • the conventional method is to first place the rigid plate on the release film, sprinkle the seal on the rigid plate, keep the molding material above the rigid plate, and load the rigid plate and the molding compound into the lower film using the release film.
  • the problem caused by the cavity is that the release film is deformed by the weight of the rigid plate, which may cause the molding compound 24 to slide down between the rigid plate and the release film.
  • the existing solution is to increase the thickness of the release film and reduce it. Elasticity to reduce the degree of the problem, but the thicker release film has a larger compression deformation scale during the plastic sealing process, which is not conducive to the structural dimensional stability of the plastic chip, and the low elastic release film is not conducive to demolding.
  • the suction device is divided into two parts, which are relatively movable, including a partially-adsorbing flexible film with a vacuum nozzle and a portion without a vacuum nozzle. Therefore, the existing device has the following disadvantages: 1.
  • the rigid plate is not positioned.
  • the functional rigid plate is not fixed in the loading structure; the molding compound will fall into the gap between the edge of the rigid plate and the vacuum suction device, and finally the molding material will remain on the surface of the rigid plate during demolding. 2.
  • a flexible film is used as a member for bearing, and the flexible film is deformed during transportation. 3, with relatively active components, mechanical structure is complex.
  • the present invention provides a molding material transfer device which uses a suction nozzle to adsorb a rigid plate to prevent the plastic sealing particles from entering the gap between the rigid plate transfer mechanisms, and at the same time, the rigid plate is used as a bearing mechanism for the flexible film. Deformation occurred.
  • the molding material transfer device specifically includes:
  • a vacuum suction mechanism having a first vacuum nozzle and a second vacuum nozzle
  • the first vacuum nozzle is configured to adsorb a rigid plate and is in communication with the independently controllable first vacuum air passage;
  • the second vacuum nozzle is configured to adsorb the flexible film and is in communication with the independently controllable second vacuum air path.
  • a transport mechanism is further included for driving the vacuum suction mechanism to move between the first position, the second position and the third position.
  • a topping mechanism is further included, the topping mechanism transferring the rigid plate to the position of the first vacuum nozzle when the vacuum suction mechanism is moved to the first position.
  • a spreading mechanism is further included, and the spreading mechanism places the molding compound on the rigid plate when the vacuum suction mechanism is moved to the first position.
  • a film stage is further included, and when the vacuum suction mechanism is moved to the second position, the film stage transfers the flexible film to the position of the second vacuum nozzle or only for carrying the flexible film.
  • a spreading mechanism is further included, and the spreading mechanism places the molding compound on the rigid plate when the vacuum suction mechanism is moved to the second position.
  • the method further comprises a molding device, and when the vacuum suction mechanism is moved to the third position, the compression molding device cooperates with the vacuum suction mechanism to receive the rigid plate, the flexible film and the molding compound transferred by the vacuum suction mechanism.
  • the first vacuum nozzle is positioned higher than the second vacuum nozzle.
  • the present invention also provides a molding compound transfer method, comprising the following steps:
  • the S2 transport mechanism drives the vacuum suction mechanism to move to the first position, and the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle;
  • the S3 vacuum suction mechanism sucks the rigid plate, and the top material mechanism leaves;
  • the S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; the vacuum suction mechanism adsorbs the flexible film; and the spreading mechanism places the molding compound on the rigid plate;
  • the S5 transport mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
  • the present invention also provides another molding material transfer method, comprising the following steps:
  • S1 conveys the rigid plate to the top material mechanism
  • the S2 transport mechanism drives the vacuum suction mechanism to move to the first position, and the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle;
  • the S3 vacuum suction mechanism sucks the rigid plate, and the top material mechanism leaves; the scattering mechanism places the molding compound on the rigid plate;
  • the S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; the vacuum suction mechanism adsorbs the flexible film;
  • the S5 transport mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
  • the present invention uses the first vacuum nozzle to suck the edge of the rigid board, which brings several advantages: 1 there is no gap between the edge of the rigid board and the transport mechanism so that the molding material does not enter the bottom of the rigid board;
  • the rigid plate can be used as the force-bearing member for carrying the plasticized pellets without bending; 3.
  • the vacuum suction mechanism is integrally provided to simplify the prior art mechanical structure.
  • Figure 1a shows a schematic cross-sectional view of a prior art molding compound transfer apparatus.
  • Figure 1b shows a schematic view of the transport state of the molding compound transfer device of Figure 1a, wherein the flexible film produces a curved arc.
  • Figure 2 shows a top view of the molding compound transfer apparatus of the present invention.
  • Figure 3 is a schematic cross-sectional view showing the top material mechanism and vacuum suction mechanism of the molding compound transfer apparatus of the present invention in which the rigid sheets are conveyed into the top material mechanism.
  • Figure 4 illustrates the transfer of the rigid sheet to the first vacuum nozzle of the molding material transfer apparatus of the present invention.
  • Figure 5 illustrates the topping mechanism of the molding compound transfer apparatus of the present invention exiting the position of Figure 4 with the rigid plate being held by the first vacuum nozzle.
  • Figure 6 is a view showing a state in which the plastic pellets are placed on the rigid plate of the molding compound transfer device of the present invention and the second vacuum nozzle sucks the flexible film.
  • Figure 7 illustrates the transfer of the rigid sheet and flexible film of the present invention to a position corresponding to the compression molding apparatus.
  • Figure 8 illustrates the aid of the molding compound transfer device of the present invention as a positioning device positioning rigid plate on the device and the compression molding device.
  • Figure 9 illustrates the rigid sheet and flexible film on the molding compound transfer apparatus of the present invention being incorporated into a compression molding apparatus die cavity.
  • Figure 10 is a cross-sectional view showing the second embodiment of the molding compound transfer device of the present invention.
  • Figure 11 shows a partial enlarged view of Figure 10.
  • the molding material transfer device 1 disclosed in the present invention may use a package of a chip in any technical field.
  • the present invention describes a technical solution and a method of the present invention by using a fingerprint chip package as an embodiment, but should not be construed as limiting the scope of the present invention.
  • the scope of the invention should be determined by the scope of the claims.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the molding material transfer device shown in FIGS. 2 and 3 includes a vacuum suction mechanism 1 including a transport mechanism (not shown) well known to those skilled in the art, and the transport mechanism can drive the vacuum suction mechanism 1 below.
  • the first position in which the rigid plate is located, the second position in which the flexible film is located, and the third position in which the compression molding device is located moves.
  • the vacuum suction mechanism 1 has a certain thickness in a frame structure, and the center of the frame structure includes a rectangular opening 10 for accommodating the granule molding compound 24 (refer to FIG. 6).
  • the frame structure includes a peripheral frame structure 101 and a frame structure 102 in the inner periphery, which are integrally provided.
  • At least two first vacuum nozzles 11 and a second vacuum nozzle 12 are disposed inside the inner frame structure 101 and the peripheral frame structure 102 in a symmetrical position, and the first vacuum nozzle 11 is disposed in the inner circumference frame 101 structure.
  • the second vacuum nozzle 12 is disposed on the bottom end surface 100 of the peripheral frame structure, and the bottom end surface 103 of the inner frame is higher than the bottom end surface 100 of the peripheral frame such that the level of the first vacuum nozzle 11 is It is higher than the level of the second vacuum nozzle 12.
  • the first vacuum suction nozzle 11 is higher than the second vacuum suction nozzle 12 so that the rigid plate 23 can be accommodated in the stepped space at the bottom of the inner frame structure where the first vacuum suction nozzle 11 is located, and the first vacuum suction nozzle is sucked when the rigid plate is sucked 11 It is possible to lift the rigid plate 23 directly, and it is not necessary to provide a shaft x and a shaft hole h capable of moving the outer frame and the inner frame to accommodate different materials (see Fig. 1b).
  • the first vacuum nozzle 11 is for adsorbing a rigid plate 23 for encapsulating a chip, and the rigid plate 23 is a material having a high dielectric constant which is not easily deformed, including but not limited to: anisotropic materials such as glass, sapphire, ceramic, or the like. Same-sex material.
  • the rigid board 23 is plastically attached to the surface of the fingerprint sensing chip, and has a high dielectric constant capable of forming a sensing electric field between the fingerprint sensor (not shown) and the finger to sense the fingerprint image.
  • the suction of the negative pressure of the rigid plate 23 by the first vacuum suction nozzle 11 is achieved by communicating with the first vacuum air passage 13 which can be independently controlled, and the first vacuum air passage 13 is in communication with a vacuum source (not shown).
  • the second vacuum nozzle 12 is for adsorbing the flexible film 25 for laying between the stamping device 3 and the package material for separating the packaged chip from the mold, and the second vacuum nozzle 12
  • the vacuum suction of the adsorption flexible film 25 is achieved by a second vacuum air path 14 that can be independently controlled, and the second vacuum air path 14 is in communication with the vacuum source.
  • the first vacuum air path 13 and the second vacuum air path 14 are independent of each other, so that the timing of the operation of the vacuum nozzle can be controlled separately, but the first vacuum air path 13 and the second vacuum air path 14 can use the same vacuum source.
  • a groove 104 is disposed at a position intermediate the first vacuum nozzle and the second vacuum nozzle on the vacuum suction mechanism 1, and extends upward on the surface of the groove 104.
  • the auxiliary positioning hole 15 for assisting the positioning of the rigid plate 23 is a blind hole which is provided along at least two of the frames 101 of the vacuum suction mechanism, and three are provided in the present embodiment (refer to FIG. 2).
  • the bottom portion further includes a top plate 2 for moving the rigid plate 23 to the bottom of the first vacuum nozzle 11, the top plate 2 including the flat plate structure 21 extending at the bottom and
  • the position adjusting mechanism 20 at one end of the flat plate structure has a rectangular cross section of the flat plate structure 21 whose height is slightly larger than the bottom portion.
  • a positioning pin 22 is provided on the upper surface of the position adjusting mechanism 20 for insertion into the positioning hole 15 provided in the recess 104 of the vacuum suction mechanism 1.
  • a baffle plate is provided for supporting the bar 24 of the rigid plate 23, and the rigid plate 23 is automatically conveyed by the conveying mechanism into the top material mechanism 2, and the bar 24 is lifted against the rigid plate 23,
  • the position adjusting mechanism 20 adjusts the position of the rigid plate 23 in the top material mechanism 2 such that the relative position of the rigid plate 23 and the top material mechanism 2 is determined, and the position adjusting mechanism 20 is housed in the first position when the top material mechanism 23 is engaged with the vacuum suction mechanism 1.
  • a plastic particle material 24 is placed on the rigid plate 23 in the opening 10 of the frame structure 101, and the first vacuum nozzle 11 can suck the rigid raw material plate 23 by vacuum.
  • the outer edge is such that there is no gap g between the outer edge of the rigid plate material 23 and the vacuum suction mechanism.
  • Technical defects on the board surface When the vacuum suction mechanism 1 is in the second position, the second vacuum nozzle 12 is positioned above the film stage 4, and the flexible film is placed on the film stage 4, and the second vacuum nozzle 12 is adjacent to the stage and sucks the flexible film 25. It will be readily apparent to those skilled in the art that the stage can also be moved to transfer the flexible film 25 to the position of the second vacuum nozzle 12.
  • the molding apparatus 3 includes an upper mold (not shown).
  • the lower molds 31, 32 the lower mold includes a press lower mold 32 and a support lower mold 31, and the support lower mold 31 is disposed outside the press lower mold 32.
  • the pressing lower mold 32 is disposed in a cavity formed inside the supporting lower mold 31, and the pressing lower mold 32 can slide inside the supporting lower mold 31 to apply a certain pressure to the molding compound at the time of plastic sealing, and press the lower mold 32. Relatively supporting the lower mold 31, the lower mold slides downward to form a plastic injection molding cavity 36.
  • a positioning pin 34 is provided on the upper end surface 35 of the supporting lower mold 31, and the positioning pin 34 is used to insert the positioning hole 15 in the vacuum suction mechanism 1 so that the rigid plate 23 can be placed just on the pressing lower mold 35.
  • the positioning pin 34 is pierced in the flexible film disposed directly under the positioning hole 15, and the upper end surface 35 of the supporting lower mold 31 is further provided with an independently controllable vacuum chamber 33 for sucking and placing the lower mold.
  • the flexible film 35 on the 32 functions to fix the flexible film 25.
  • the above-mentioned molding material transfer device 1 operates according to the following steps:
  • S1 conveys the rigid plate to the top material mechanism
  • the S2 transfer mechanism drives the vacuum suction mechanism to move to the first position, the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle
  • the S3 vacuum suction mechanism absorbs the rigid plate, the top
  • the S4 transfer mechanism drives the vacuum suction mechanism to move the rigid plate to the second position, the vacuum suction mechanism absorbs the flexible film
  • the S5 transport mechanism drives the vacuum suction mechanism to move to the third position.
  • the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the molding device.
  • the apparatus is in operation and the transport mechanism transports the rigid plate 23 to the top material mechanism 2, which includes transfer devices and methods known to those skilled in the art, such as conveyor belts.
  • the position of the rigid plate 23 is defined in the raised state of the bar 24 on the right side of the top material mechanism and the position adjusting mechanism 20 on the left side of the top material mechanism, and the position adjusting mechanism 20 further adjusts the position of the rigid plate to make the rigidity
  • the plate is fixed to the top material mechanism 2.
  • the transport mechanism drives the vacuum suction mechanism 1 to move to the first position.
  • the first position is above the top material mechanism, and the top material mechanism transfers/lifts the rigid plate 23 to the first position.
  • the top material mechanism 23 is moved upward, and the positioning pin 22 disposed on the top material mechanism 23 is inserted into the vacuum suction mechanism during the upward movement.
  • the person skilled in the art can position the left and right edges of the rigid plate 23 just as the position of the positioning hole 15 is properly set so that the rigid plate 23 is just moved to the position of the first vacuum nozzle 11. It is aligned with the first vacuum nozzles 11 on the left and right sides.
  • the vacuum suction mechanism sucks the rigid plate 23 through the first vacuum suction nozzle 11, when the top material mechanism 2 is removed, and there is no gap between the edge of the rigid plate 23 and the first vacuum suction nozzle 11, and the rigid plate 23 and the top
  • the relative position between the material mechanisms 2 is fixed. Then, the molding material 24 flows out from the outlet of the spreading mechanism 5 to the rigid plate, and since the rigid plate 23 is directly supported by the force, deformation like the flexible film 23 does not occur.
  • step S4 shown in FIG. 6 the working state of the molding material transfer device is carried out by the transfer mechanism with the vacuum suction mechanism 1 transferring the rigid plate 23 to the second position, the film stage being below the second position, the The second vacuum nozzle 12 adsorbs the flexible film 25 placed on the film stage, or the second vacuum nozzle can adsorb the flexible film by moving the film stage to transfer the film to the position of the second vacuum nozzle.
  • the transport mechanism transfers the rigid plate 23, the molding compound 24 and the flexible film 25 to the third position with the vacuum suction mechanism 1, and is disposed below the third position.
  • the positioning pin 34 on the supporting lower die 31 is aligned with the positioning hole 15 on the topping mechanism 2, before the positioning pin 34 is inserted into the positioning hole 15
  • the positioning needle 34 first pierces the flexible film 25 at the bottom of the vacuum suction mechanism so that the relative positions of the flexible film 25 and the supporting lower mold 31 are fixed. After the positioning pin 34 is fully inserted into the positioning hole 15, the vacuum chamber 33 sucks the raw material of the flexible film 25.
  • the vacuum suction of the first vacuum nozzle 11 and the second vacuum nozzle 12 will lower the rigid plate 23, the molding compound 24 and the flexible film 25, and the first vacuum nozzle 11 and the second vacuum nozzle 12 can be closed by the preset.
  • the suction is interrupted by the valves 131, 141 (see Fig. 2) of the first vacuum air passage 13 and the second vacuum air passage 14. Subsequent movement of the press lower die 32 lowers the rigid plate 23 and a portion of the flexible film 25 in the cavity 36 of the stamper apparatus 3.
  • the transfer device leaves the molding device 3 to complete a plastic material transfer process, and performs the conventional steps of clamping the upper and lower molds, vacuuming and heating the plastic sealing material in the subsequent injection molding process.
  • the molding material transfer device 1 can also be operated according to the following steps: S1 transfers the rigid plate to the top material mechanism; and the S2 transfer mechanism drives the vacuum suction mechanism to move to the first Position, the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle; the S3 vacuum suction mechanism adsorbs the rigid plate, and the top material mechanism leaves; the S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; vacuum suction The mechanism adsorbs the flexible film; the spreading mechanism places the molding compound on the rigid plate; the S5 transfer mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
  • the only difference from the above steps is that the action of preventing the molding compound is set in step S4, and the other steps are completely the same and will not be described again.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the present embodiment is different from the first embodiment in that the first vacuum air passage 13 and the second vacuum air passage 14 are in communication with each other, and the first vacuum valve 131 is disposed in the first vacuum air passage.
  • a second vacuum valve 141 is disposed in the second vacuum air passage 14.
  • the first vacuum valve 131 and the second vacuum valve 141 can be independently controlled, and can be in an open state in steps S3 and S4 such that the first vacuum nozzle 11 and the second vacuum nozzle 12 are provided with suction, and are closed in step S5.
  • the state causes both the first vacuum nozzle 11 and the second vacuum nozzle 12 to lose suction to facilitate the vacuum suction mechanism to leave the compression molding apparatus 3.
  • the present invention uses the first vacuum nozzle to suck the edge of the rigid board, which brings several advantages: 1 there is no gap between the edge of the rigid board and the vacuum suction mechanism, so that the molding material does not leak water and penetrates the surface of the rigid board.
  • the 2 can use a rigid plate as the force-bearing member carrying the plastic pellets without bending; 3 when the rigid plate is loaded in the top material mechanism, the baffle and the position adjustment mechanism are used to define the position of the rigid plate, and the rigid plate is used in the top material mechanism When positioning into the vacuum suction mechanism, the positioning pin and the positioning hole are used to define the relative positions of the rigid plate and the topping mechanism, and the positioning plate and the positioning pin are used to define the rigid plate and the pressing die when the vacuum suction mechanism puts the rigid plate into the molding device.
  • the relative position of the equipment, the above-mentioned position in the process of the transfer of the rigid board is the same, to achieve the purpose of precise matching with the nozzle; 4 simplifies the mechanical structure of the prior art.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Disclosed is a plastic packaging material transferring apparatus, comprising: a vacuum suction mechanism provided with a first vacuum suction nozzle (11) and a second vacuum suction nozzle (12), wherein the first vacuum suction nozzle (11) is used for adsorbing a rigid board (23) and is in communication with an independently controllable first vacuum air passage (13); and the second vacuum suction nozzle (12) is used for adsorbing a flexible film (25) and is in communication with an independently controllable second vacuum air passage (14). With the transferring apparatus, the plastic packaging material will not fall below the rigid board, and the flexible thin film will not be transformed during transportation.

Description

塑封料转运设备及方法Plastic sealing material transfer device and method
本申请要求了申请日为2017年02月15日，申请号为201710082260.1，发明名称为“塑封料转运设备及方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。The present application claims the priority of the Chinese Patent Application Serial No. JP-A------------
技术领域Technical field
本发明涉及芯片塑封料转运设备，特别涉及用于压模(Compression-mold)封装工艺转运芯片封装时使用的刚性板、柔性薄膜和塑封料的转运设备及方法。The invention relates to a chip molding material transfer device, in particular to a transfer device and method for a rigid plate, a flexible film and a molding compound used in a Compression-mold packaging process transfer chip package.
背景技术Background technique
芯片压模(Compression-mold)封装工艺用离型膜装载塑封料移入压模设备的下模腔,上模腔真空吸附装有芯片的基板,上模腔和下模腔再合模,通过加热融化塑封料进行塑封,离型膜同时用于脱模.不同于传统注塑封装,压模工艺更利于降低塑封厚度,保障塑封质量的稳定性,和连续作业提高产率。The Compression-mold packaging process uses a release film to load the molding compound into the lower cavity of the molding device, the upper cavity vacuum-adsorbs the substrate on which the chip is mounted, the upper cavity and the lower cavity are closed, and the heating is performed. The melted plastic sealing material is plastically sealed, and the release film is simultaneously used for demoulding. Different from the traditional injection molding, the compression molding process is more conducive to reducing the thickness of the plastic seal, ensuring the stability of the plastic seal quality, and improving the productivity by continuous operation.
部分芯片(如指纹传感器)封装要求塑封层表面有刚性盖板,为芯片提供保护或散热。请参照图1a和1b现有做法是先将刚性板放置在离型膜上,在刚性板上撒塑封料,保持塑封料在刚性板上方,使用离型膜装载刚性板和塑封料移入下膜腔.其导致的问题是离型膜因刚性板的重量而变形arc,转运中可能导致塑封料24滑落至刚性板下方与离型膜之间.现有解决办法是增加离型膜厚度并降低弹性来减小该问题的程度,但较厚的离型膜在塑封过程中压缩变形尺度较大,不利于塑封芯片的结构尺寸稳定性,低弹性的离型膜则不利于脱模.Some chips (such as fingerprint sensors) require a rigid cover on the surface of the plastic layer to provide protection or heat dissipation. Referring to Figures 1a and 1b, the conventional method is to first place the rigid plate on the release film, sprinkle the seal on the rigid plate, keep the molding material above the rigid plate, and load the rigid plate and the molding compound into the lower film using the release film. The problem caused by the cavity is that the release film is deformed by the weight of the rigid plate, which may cause the molding compound 24 to slide down between the rigid plate and the release film. The existing solution is to increase the thickness of the release film and reduce it. Elasticity to reduce the degree of the problem, but the thicker release film has a larger compression deformation scale during the plastic sealing process, which is not conducive to the structural dimensional stability of the plastic chip, and the low elastic release film is not conducive to demolding.
现有技术中吸取设备分为可相对活动两部分，包括带有真空吸嘴的部分吸附柔性薄膜和不带真空吸嘴的部分，因此现有设备存在以下的缺点：1、没有定位刚性板的功能刚性板在上料结构中位置不固定；塑封料会掉入刚性板边缘和真空吸取设备之间的缝隙中，最终在脱模时会导致塑封料留在刚性板表面。2、现有技术在转运的过程，使用柔性薄膜作为承受力的构件，柔性薄膜在运输过程中会发生变形。3、具有相对活动的构件，机械结构复杂。In the prior art, the suction device is divided into two parts, which are relatively movable, including a partially-adsorbing flexible film with a vacuum nozzle and a portion without a vacuum nozzle. Therefore, the existing device has the following disadvantages: 1. The rigid plate is not positioned. The functional rigid plate is not fixed in the loading structure; the molding compound will fall into the gap between the edge of the rigid plate and the vacuum suction device, and finally the molding material will remain on the surface of the rigid plate during demolding. 2. In the prior art, in the process of transport, a flexible film is used as a member for bearing, and the flexible film is deformed during transportation. 3, with relatively active components, mechanical structure is complex.
发明内容Summary of the invention
为了解决上述技术问题，本发明提供一种塑封料转运设备，其使用吸嘴吸附刚性板，防止塑封颗粒料进入刚性板转运机构之间的间隙，同时使用刚性板作为承力机构柔性薄膜不会发生变形。塑封料转运设备，具体地包括：In order to solve the above technical problem, the present invention provides a molding material transfer device which uses a suction nozzle to adsorb a rigid plate to prevent the plastic sealing particles from entering the gap between the rigid plate transfer mechanisms, and at the same time, the rigid plate is used as a bearing mechanism for the flexible film. Deformation occurred. The molding material transfer device specifically includes:
真空吸取机构，具有第一真空吸嘴和第二真空吸嘴；a vacuum suction mechanism having a first vacuum nozzle and a second vacuum nozzle;
所述第一真空吸嘴，用于吸附刚性板，并与可独立控制的第一真空风路连通；The first vacuum nozzle is configured to adsorb a rigid plate and is in communication with the independently controllable first vacuum air passage;
所述第二真空吸嘴，用于吸附柔性薄膜，并与可独立控制的第二真空风路连通。The second vacuum nozzle is configured to adsorb the flexible film and is in communication with the independently controllable second vacuum air path.
优选地，还包括转运机构，用于带动所述真空吸取机构在第一位置、第二位置和第三位置之间移动。Preferably, a transport mechanism is further included for driving the vacuum suction mechanism to move between the first position, the second position and the third position.
优选地，还包括顶料机构，所述真空吸取机构移动至第一位置时，顶料机构将刚性板转移至所述第一真空吸嘴的位置。Preferably, a topping mechanism is further included, the topping mechanism transferring the rigid plate to the position of the first vacuum nozzle when the vacuum suction mechanism is moved to the first position.
优选地，还包括撒料机构，所述真空吸取机构移动至第一位置时，所述撒料机构将塑封料放置在所述刚性板上。Preferably, a spreading mechanism is further included, and the spreading mechanism places the molding compound on the rigid plate when the vacuum suction mechanism is moved to the first position.
优选地，还包括薄膜载台，所述真空吸取机构移动至第二位置时，薄膜载台将柔性薄膜转移至第二真空吸嘴的位置或仅用于承载所述柔性薄膜待。Preferably, a film stage is further included, and when the vacuum suction mechanism is moved to the second position, the film stage transfers the flexible film to the position of the second vacuum nozzle or only for carrying the flexible film.
优选地，还包括撒料机构，所述真空吸取机构移动至第二位置时，所述撒料机构将塑封料放置在所述刚性板上。Preferably, a spreading mechanism is further included, and the spreading mechanism places the molding compound on the rigid plate when the vacuum suction mechanism is moved to the second position.
优选地，还包括压模设备，所述真空吸取机构移动至第三位置时，压模设备与所述真空吸取机构配合接收真空吸取机构转移的刚性板、柔性薄膜和塑封料。Preferably, the method further comprises a molding device, and when the vacuum suction mechanism is moved to the third position, the compression molding device cooperates with the vacuum suction mechanism to receive the rigid plate, the flexible film and the molding compound transferred by the vacuum suction mechanism.
优选地，所述第一真空吸嘴的位置高于第二真空吸嘴。Preferably, the first vacuum nozzle is positioned higher than the second vacuum nozzle.
为更好的解决上述技术问题本发明还提供一种塑封料转运方法，包括如下步骤：In order to better solve the above technical problems, the present invention also provides a molding compound transfer method, comprising the following steps:
S1将刚性板转移至顶料机构中；S1 transfers the rigid board to the top material mechanism;
S2转运机构带动真空吸取机构移动至第一位置,顶料机构将刚性板转移至第一真空吸嘴的位置；The S2 transport mechanism drives the vacuum suction mechanism to move to the first position, and the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle;
S3真空吸取机构吸附住刚性板，顶料机构离开；The S3 vacuum suction mechanism sucks the rigid plate, and the top material mechanism leaves;
S4转运机构带动真空吸取机构将刚性板移动至第二位置；真空吸取机构吸附柔性薄膜；撒料机构在刚性板上放置塑封料；The S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; the vacuum suction mechanism adsorbs the flexible film; and the spreading mechanism places the molding compound on the rigid plate;
S5转运机构带动真空吸取机构移动至第三位置，真空吸取机构将柔性薄膜、刚性板、塑封料放置在压模设备上。The S5 transport mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
为更好的解决上述技术问题本发明还提供另一种塑封料转运方法，包括如下步骤：In order to better solve the above technical problems, the present invention also provides another molding material transfer method, comprising the following steps:
S1将刚性板传送至顶料机构中；S1 conveys the rigid plate to the top material mechanism;
S2转运机构带动真空吸取机构移动至第一位置,顶料机构将刚性板转移至第一真空吸嘴的位置；The S2 transport mechanism drives the vacuum suction mechanism to move to the first position, and the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle;
S3真空吸取机构吸附住刚性板，顶料机构离开；撒料机构在刚性板上放置塑封料；The S3 vacuum suction mechanism sucks the rigid plate, and the top material mechanism leaves; the scattering mechanism places the molding compound on the rigid plate;
S4转运机构带动真空吸取机构将刚性板移动至第二位置；真空吸取机构吸附柔性薄膜；The S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; the vacuum suction mechanism adsorbs the flexible film;
S5转运机构带动真空吸取机构移动至第三位置，真空吸取机构将柔性薄膜、刚性板、塑封料放置在压模设备上。The S5 transport mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
本发明相对现有技术使用了第一真空吸嘴吸住刚性板的边缘其带来多个好处：1刚性板边缘和转运机构之间不存在缝隙使得塑封料不会进入刚性板的底部；2可以使用刚性板作为承载塑封颗粒料的受力构件不会发生弯曲；3、真空吸取机构一体设置简化了现有技术的机械结构。Compared with the prior art, the present invention uses the first vacuum nozzle to suck the edge of the rigid board, which brings several advantages: 1 there is no gap between the edge of the rigid board and the transport mechanism so that the molding material does not enter the bottom of the rigid board; The rigid plate can be used as the force-bearing member for carrying the plasticized pellets without bending; 3. The vacuum suction mechanism is integrally provided to simplify the prior art mechanical structure.
附图说明DRAWINGS
图1a展示了现有技术塑封料转运设备剖面示意图视图。Figure 1a shows a schematic cross-sectional view of a prior art molding compound transfer apparatus.
图1b展示了图1a中塑封料转运设备转运状态示意图，其中柔性薄膜产生了弯曲arc。Figure 1b shows a schematic view of the transport state of the molding compound transfer device of Figure 1a, wherein the flexible film produces a curved arc.
图2展示了本发明塑封料转运设备俯视图。Figure 2 shows a top view of the molding compound transfer apparatus of the present invention.
图3展示了本发明塑封料转运设备的顶料机构和真空吸取机构的剖面示意图其中刚性板被传送至顶料机构中。Figure 3 is a schematic cross-sectional view showing the top material mechanism and vacuum suction mechanism of the molding compound transfer apparatus of the present invention in which the rigid sheets are conveyed into the top material mechanism.
图4展示了本发明塑封料转运设备顶料机构将刚性板转移至第一真空吸嘴的位置。Figure 4 illustrates the transfer of the rigid sheet to the first vacuum nozzle of the molding material transfer apparatus of the present invention.
图5展示了本发明塑封料转运设备顶料机构离开图4中的位置，刚性板被第一真空吸嘴吸住。Figure 5 illustrates the topping mechanism of the molding compound transfer apparatus of the present invention exiting the position of Figure 4 with the rigid plate being held by the first vacuum nozzle.
图6展示了本发明塑封料转运设备刚性板上放置塑封颗粒料和第二真空吸嘴吸住柔性薄膜的状态。Figure 6 is a view showing a state in which the plastic pellets are placed on the rigid plate of the molding compound transfer device of the present invention and the second vacuum nozzle sucks the flexible film.
图7展示了本发明塑封料转运设备将刚性板和柔性薄膜转移到与压模设备对应的位置。Figure 7 illustrates the transfer of the rigid sheet and flexible film of the present invention to a position corresponding to the compression molding apparatus.
图8展示了本发明塑封料转运设备将上的辅助定为装置和压模设备上的定位装置定位刚性板。Figure 8 illustrates the aid of the molding compound transfer device of the present invention as a positioning device positioning rigid plate on the device and the compression molding device.
图9展示了本发明塑封料转运设备上的展示了刚性板和柔性薄膜被收入压模设备压模腔中。Figure 9 illustrates the rigid sheet and flexible film on the molding compound transfer apparatus of the present invention being incorporated into a compression molding apparatus die cavity.
图10展示了本发明塑封料转运设备实施例二剖面示意图。Figure 10 is a cross-sectional view showing the second embodiment of the molding compound transfer device of the present invention.
图11展示了图10中的局部放大图。Figure 11 shows a partial enlarged view of Figure 10.
具体实施方式detailed description
本发明揭示的塑封料转运设备1，可以使用在任何技术领域的芯片的封装，本发明以指纹芯片封装作为实施例说明本发明的技术方案和方法，但不应当解释为对本发明保护范围的限定，本发明的保护范围应当以权利要求书的限定为准。The molding material transfer device 1 disclosed in the present invention may use a package of a chip in any technical field. The present invention describes a technical solution and a method of the present invention by using a fingerprint chip package as an embodiment, but should not be construed as limiting the scope of the present invention. The scope of the invention should be determined by the scope of the claims.
以下结合附图对本发明的所述的塑封料转运设备和方法做进一步的描述：The molding material transfer device and method of the present invention are further described below with reference to the accompanying drawings:
实施例一：Embodiment 1:
请参照图2和图3展示的塑封料转运设备包括真空吸取机构1，真空吸取机构1包括本领域技术人员公知的转运机构(图中未示出)，转运机构能够带动真空吸取机构1在下文所述的刚性板所在的第一位置、柔性薄膜所在的第二位置和压模设备所在的第三位置之间移动。真空吸取机构1呈框体结构具有一定的厚度，框体结构中心包括矩形的开口10，该矩形开口10用于收容颗粒塑封料24(参照图6)。框体结构包括在***框体结构101和在内围的框体结构102，两者一体设置。在内围框体结构101和***框体结构102对称的位置内部设置有至少两个第一真空吸嘴11和第二真空吸嘴12，第一真空吸嘴11设置在内围框体101结构底部端面103上，第二真空吸嘴12设置在***框体结构的底部端面上100，内围框体的底部端面103高于***框体的底部端面100使得第一真空吸嘴11的水平高度高于第二真空吸嘴12的水平高度。第一真空吸嘴11高于第二真空吸嘴12使得刚性板23能够的收容在第一真空吸嘴11所在的内框体结构底部的台阶空间内，并且吸附刚性板时第一真空吸嘴11能 够直接将刚性板23提升上去，不需要为了适应不同的材料设置能够使得外框体和内框体能够对活动的轴x和轴孔h(参照图1b)。第一真空吸嘴11用于吸附用于封装芯片的刚性板23，刚性板23为不易发生形变具有高介电常数的材料，包括但不限于：玻璃、蓝宝石、陶瓷等各向异性材料或各项同性材料。刚性板23塑封后附着在指纹传感芯片的表面，其具有高介电常数能够形成在指纹传感器(图中未示出)和手指之间形成感测电场进而感测指纹图像。第一真空吸嘴11吸附刚性板23的负压吸力是通过和能够独立控制的第一真空风路13联通实现的，第一真空风路13与真空源联通(图中未示出)。第二真空吸嘴12用于吸附柔性薄膜25，柔性薄膜材料25用于铺装在压模设备3和封装原料之间用于将封装后的芯片从模具中分离出来，第二真空吸嘴12吸附柔性薄膜25的负压吸力是通过和能够独立控制的第二真空风路14实现的，第二真空风路14与真空源联通。第一真空风路13与第二真空风路14相互独立不联通，如此真空吸嘴工作的时机可以单独控制，但是第一真空风路13和第二真空风路14可以使用相同的真空源。The molding material transfer device shown in FIGS. 2 and 3 includes a vacuum suction mechanism 1 including a transport mechanism (not shown) well known to those skilled in the art, and the transport mechanism can drive the vacuum suction mechanism 1 below. The first position in which the rigid plate is located, the second position in which the flexible film is located, and the third position in which the compression molding device is located moves. The vacuum suction mechanism 1 has a certain thickness in a frame structure, and the center of the frame structure includes a rectangular opening 10 for accommodating the granule molding compound 24 (refer to FIG. 6). The frame structure includes a peripheral frame structure 101 and a frame structure 102 in the inner periphery, which are integrally provided. At least two first vacuum nozzles 11 and a second vacuum nozzle 12 are disposed inside the inner frame structure 101 and the peripheral frame structure 102 in a symmetrical position, and the first vacuum nozzle 11 is disposed in the inner circumference frame 101 structure. On the bottom end surface 103, the second vacuum nozzle 12 is disposed on the bottom end surface 100 of the peripheral frame structure, and the bottom end surface 103 of the inner frame is higher than the bottom end surface 100 of the peripheral frame such that the level of the first vacuum nozzle 11 is It is higher than the level of the second vacuum nozzle 12. The first vacuum suction nozzle 11 is higher than the second vacuum suction nozzle 12 so that the rigid plate 23 can be accommodated in the stepped space at the bottom of the inner frame structure where the first vacuum suction nozzle 11 is located, and the first vacuum suction nozzle is sucked when the rigid plate is sucked 11 It is possible to lift the rigid plate 23 directly, and it is not necessary to provide a shaft x and a shaft hole h capable of moving the outer frame and the inner frame to accommodate different materials (see Fig. 1b). The first vacuum nozzle 11 is for adsorbing a rigid plate 23 for encapsulating a chip, and the rigid plate 23 is a material having a high dielectric constant which is not easily deformed, including but not limited to: anisotropic materials such as glass, sapphire, ceramic, or the like. Same-sex material. The rigid board 23 is plastically attached to the surface of the fingerprint sensing chip, and has a high dielectric constant capable of forming a sensing electric field between the fingerprint sensor (not shown) and the finger to sense the fingerprint image. The suction of the negative pressure of the rigid plate 23 by the first vacuum suction nozzle 11 is achieved by communicating with the first vacuum air passage 13 which can be independently controlled, and the first vacuum air passage 13 is in communication with a vacuum source (not shown). The second vacuum nozzle 12 is for adsorbing the flexible film 25 for laying between the stamping device 3 and the package material for separating the packaged chip from the mold, and the second vacuum nozzle 12 The vacuum suction of the adsorption flexible film 25 is achieved by a second vacuum air path 14 that can be independently controlled, and the second vacuum air path 14 is in communication with the vacuum source. The first vacuum air path 13 and the second vacuum air path 14 are independent of each other, so that the timing of the operation of the vacuum nozzle can be controlled separately, but the first vacuum air path 13 and the second vacuum air path 14 can use the same vacuum source.
请参照图3和图4展示的塑封料转运设备，在真空吸取机构1上第一真空吸嘴和第二真空吸嘴的中间的位置设置有凹槽104，在凹槽104的表面向上延伸设置有辅助定位的定位孔15。用于辅助定位刚性板23辅助定位孔15为盲孔，其沿着真空吸取机构的框体101设置至少两个，本实施方案设置了三个(参照图2)。在真空吸取机构转移到第一位置时，其底部还包括用于将刚性板23移动至第一真空吸嘴11底部的顶料板2，顶料板2包括在底部延伸的平板结构21和在平板结构一端的位置调整机构20，位置调整机构20的剖面呈矩形其高度略大于底部延伸的平板结构21。在位置调整机构20的上表面上设置有定位针22用于***设置在真空吸取机构1凹槽内104的定位孔15内。在顶料板2的一端设置有挡板用于顶住刚性板23的挡杆24，刚性板23由传送机构自动输送到顶料机构2中，所述挡杆24升起顶住刚性板23，位置调整机构20调整刚性板23在顶料机构2中的位置使得刚性板23与顶料机构2的相对位置确定，顶料机构23与真空吸取机构1啮合时位置调整机构20被收容在第一真空吸嘴和第二真空吸嘴的之间的凹槽104内，同时所述刚性板23的上表面与第一真空吸嘴11相抵触，也可以在第一真空吸嘴和刚性盖板预留一定的间隙利用吸力将刚性盖板提升上去。Referring to the molding material transfer device shown in FIG. 3 and FIG. 4, a groove 104 is disposed at a position intermediate the first vacuum nozzle and the second vacuum nozzle on the vacuum suction mechanism 1, and extends upward on the surface of the groove 104. A positioning hole 15 having an auxiliary positioning. The auxiliary positioning hole 15 for assisting the positioning of the rigid plate 23 is a blind hole which is provided along at least two of the frames 101 of the vacuum suction mechanism, and three are provided in the present embodiment (refer to FIG. 2). When the vacuum suction mechanism is transferred to the first position, the bottom portion further includes a top plate 2 for moving the rigid plate 23 to the bottom of the first vacuum nozzle 11, the top plate 2 including the flat plate structure 21 extending at the bottom and The position adjusting mechanism 20 at one end of the flat plate structure has a rectangular cross section of the flat plate structure 21 whose height is slightly larger than the bottom portion. A positioning pin 22 is provided on the upper surface of the position adjusting mechanism 20 for insertion into the positioning hole 15 provided in the recess 104 of the vacuum suction mechanism 1. At one end of the top plate 2, a baffle plate is provided for supporting the bar 24 of the rigid plate 23, and the rigid plate 23 is automatically conveyed by the conveying mechanism into the top material mechanism 2, and the bar 24 is lifted against the rigid plate 23, The position adjusting mechanism 20 adjusts the position of the rigid plate 23 in the top material mechanism 2 such that the relative position of the rigid plate 23 and the top material mechanism 2 is determined, and the position adjusting mechanism 20 is housed in the first position when the top material mechanism 23 is engaged with the vacuum suction mechanism 1. In the groove 104 between the vacuum nozzle and the second vacuum nozzle, while the upper surface of the rigid plate 23 is in contact with the first vacuum nozzle 11, it can also be pre-empted in the first vacuum nozzle and the rigid cover Leave a certain gap to lift the rigid cover with suction.
请参照图5和图6使用撒料机构5,在所述框体结构101的开口10内刚性板23上放置塑封颗粒原料24，第一真空吸嘴11可通过真空吸住刚性原料板23的外侧边缘，使得刚板性原料23的外边缘和真空吸取机构之间不存在间隙g解决了现有技术中刚性原料板23和真空吸取机构1之间存在间隙g漏料导致塑封料残留在刚性板表面的技术缺陷。真空吸取机构1 位于第二位置时，第二真空吸嘴12位于薄膜载台4上方，柔性薄膜铺设薄膜载台4上，第二真空吸嘴12靠近所述载台并吸住柔性薄膜25。本领域技术人员易于得知，还可以移动所述载台将柔性薄膜25转移到第二真空吸嘴12的位置。Referring to FIG. 5 and FIG. 6, using the spreading mechanism 5, a plastic particle material 24 is placed on the rigid plate 23 in the opening 10 of the frame structure 101, and the first vacuum nozzle 11 can suck the rigid raw material plate 23 by vacuum. The outer edge is such that there is no gap g between the outer edge of the rigid plate material 23 and the vacuum suction mechanism. In the prior art, there is a gap between the rigid material plate 23 and the vacuum suction mechanism 1 and the leakage of the plastic material remains in the rigidity. Technical defects on the board surface. When the vacuum suction mechanism 1 is in the second position, the second vacuum nozzle 12 is positioned above the film stage 4, and the flexible film is placed on the film stage 4, and the second vacuum nozzle 12 is adjacent to the stage and sucks the flexible film 25. It will be readily apparent to those skilled in the art that the stage can also be moved to transfer the flexible film 25 to the position of the second vacuum nozzle 12.
请参照图7-9真空吸取机构1在第三位置时，刚性板23、塑封料24和柔性薄膜25被放置在压模设备3上，压模设备3包括上模(图中未示出)和下模31、32，下模包括压合下模32和支撑下模31，支撑下模31设置在压合下模32的外部。压合下模32设置在支撑下模31内部形成的腔体内，压合下模32可在支撑下31模内部滑动以在塑封压合的时候对塑封料施加一定的压力，压合下模32相对支撑下模31下模向下滑动会形成收容塑封注塑腔体36。在支撑下模31上部端面35上还设置有定位针34，定位针34用于***真空吸取机构1上的定位孔15使得刚性板23能够被恰好的放置在压合下模35上。同时定位针34刺破设置在定位孔15正下方的柔性薄膜中，在支撑下模31上端面35上还设置有可独立控制的真空腔33，真空腔33用于吸住放置在支撑下模32上的柔性薄膜35起到固定柔性薄膜25的作用。Referring to FIG. 7-9, when the vacuum suction mechanism 1 is in the third position, the rigid plate 23, the molding compound 24 and the flexible film 25 are placed on the molding apparatus 3, and the molding apparatus 3 includes an upper mold (not shown). And the lower molds 31, 32, the lower mold includes a press lower mold 32 and a support lower mold 31, and the support lower mold 31 is disposed outside the press lower mold 32. The pressing lower mold 32 is disposed in a cavity formed inside the supporting lower mold 31, and the pressing lower mold 32 can slide inside the supporting lower mold 31 to apply a certain pressure to the molding compound at the time of plastic sealing, and press the lower mold 32. Relatively supporting the lower mold 31, the lower mold slides downward to form a plastic injection molding cavity 36. Further, a positioning pin 34 is provided on the upper end surface 35 of the supporting lower mold 31, and the positioning pin 34 is used to insert the positioning hole 15 in the vacuum suction mechanism 1 so that the rigid plate 23 can be placed just on the pressing lower mold 35. At the same time, the positioning pin 34 is pierced in the flexible film disposed directly under the positioning hole 15, and the upper end surface 35 of the supporting lower mold 31 is further provided with an independently controllable vacuum chamber 33 for sucking and placing the lower mold. The flexible film 35 on the 32 functions to fix the flexible film 25.
上述的塑封料转运设备1工作时是按照如下的步骤进行的：The above-mentioned molding material transfer device 1 operates according to the following steps:
S1将刚性板传送至顶料机构中；S2转运机构带动真空吸取机构移动至第一位置,顶料机构将刚性板转移至第一真空吸嘴的位置；S3真空吸取机构吸附住刚性板，顶料机构离开，撒料机构在刚性板上放置塑封料；S4转运机构带动真空吸取机构将刚性板移动至第二位置，真空吸取机构吸附柔性薄膜；S5转运机构带动真空吸取机构移动至第三位置，真空吸取机构将柔性薄膜、刚性板、塑封料放置在压模设备上。S1 conveys the rigid plate to the top material mechanism; the S2 transfer mechanism drives the vacuum suction mechanism to move to the first position, the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle; and the S3 vacuum suction mechanism absorbs the rigid plate, the top The material mechanism leaves, the spreading mechanism places the molding compound on the rigid plate; the S4 transfer mechanism drives the vacuum suction mechanism to move the rigid plate to the second position, the vacuum suction mechanism absorbs the flexible film; and the S5 transport mechanism drives the vacuum suction mechanism to move to the third position. The vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the molding device.
进一步对上述的各个步骤描述：Further description of each of the above steps:
请参照图3中展示的步骤S1,设备工作状态，传送机构将刚性板23传送至顶料机构2中，所述传送机构23包括本领域技术人员公知的传送设备和方法，例如传送带。位于顶料机构上右侧的挡杆24和位于顶料机构左侧的位置调整机构20处于升起的状态限定了刚性板23的位置，此时位置调整机构20进一步调整刚性板的位置使得刚性板固定在顶料机构2上。Referring to step S1 shown in FIG. 3, the apparatus is in operation and the transport mechanism transports the rigid plate 23 to the top material mechanism 2, which includes transfer devices and methods known to those skilled in the art, such as conveyor belts. The position of the rigid plate 23 is defined in the raised state of the bar 24 on the right side of the top material mechanism and the position adjusting mechanism 20 on the left side of the top material mechanism, and the position adjusting mechanism 20 further adjusts the position of the rigid plate to make the rigidity The plate is fixed to the top material mechanism 2.
请参照图3和图4展示的步骤S2设备工作状态，转运机构带动真空吸取机构1移动至第一位置,第一位置在顶料机构的上方，顶料机构将刚性板23转移/抬升至第一真空吸嘴11的位置。Referring to the working state of the device in step S2 shown in FIG. 3 and FIG. 4, the transport mechanism drives the vacuum suction mechanism 1 to move to the first position. The first position is above the top material mechanism, and the top material mechanism transfers/lifts the rigid plate 23 to the first position. The position of a vacuum nozzle 11.
请参照图4和图5展示的步骤S3塑封料转运设备1的工作状态，顶料机构23向上移动，在上移的过程中设置在顶料机构23上的定位针22***真空吸取机构上的定为孔15内，本领域技术人员只要恰当的设置定位孔15的位置就能够使得刚性板23恰好被移动至所述第 一真空吸嘴11的位置时，刚性板23左右两侧边缘位置恰好与左右两侧的第一真空吸嘴11对齐。真空吸取机构通过第一真空吸嘴11吸住刚性板23，此时顶料机构2移开，刚性板23的边缘与第一真空吸嘴11之间密封不存在缝隙，同时刚性板23与顶料机构2之间的相对位置固定。然后，通过塑封料24从撒料机构5的出口流出至在刚性板上，由于刚性板23作为直接的受力支撑，不会发生类似柔性薄膜23的变形现象。Referring to the working state of the molding material transfer device 1 shown in FIG. 4 and FIG. 5, the top material mechanism 23 is moved upward, and the positioning pin 22 disposed on the top material mechanism 23 is inserted into the vacuum suction mechanism during the upward movement. Within the hole 15, the person skilled in the art can position the left and right edges of the rigid plate 23 just as the position of the positioning hole 15 is properly set so that the rigid plate 23 is just moved to the position of the first vacuum nozzle 11. It is aligned with the first vacuum nozzles 11 on the left and right sides. The vacuum suction mechanism sucks the rigid plate 23 through the first vacuum suction nozzle 11, when the top material mechanism 2 is removed, and there is no gap between the edge of the rigid plate 23 and the first vacuum suction nozzle 11, and the rigid plate 23 and the top The relative position between the material mechanisms 2 is fixed. Then, the molding material 24 flows out from the outlet of the spreading mechanism 5 to the rigid plate, and since the rigid plate 23 is directly supported by the force, deformation like the flexible film 23 does not occur.
请参照图6展示的步骤S4塑封料转运设备的工作状态，转运机构带着真空吸取机构1转移刚性板23至第二位置，所述薄膜载台在第二位置的下方，所述所述第二真空吸嘴12吸附摆放在薄膜载台上的柔性薄膜25，或者可以通过移动薄膜载台将薄膜转移到第二真空吸嘴的位置后第二真空吸嘴吸附柔性薄膜。Referring to step S4 shown in FIG. 6 , the working state of the molding material transfer device is carried out by the transfer mechanism with the vacuum suction mechanism 1 transferring the rigid plate 23 to the second position, the film stage being below the second position, the The second vacuum nozzle 12 adsorbs the flexible film 25 placed on the film stage, or the second vacuum nozzle can adsorb the flexible film by moving the film stage to transfer the film to the position of the second vacuum nozzle.
请参照图7-图9展示的步骤S5塑封料转运设备的工作状态，转运机构带着真空吸取机构1将刚性板23、塑封料24和柔性薄膜25转移至第三位置，第三位置下方设置有压模设备3上，在真空吸取机构1放置刚性板23的过程中，支撑下模31上的定位针34对准顶料机构2上的定位孔15，在定位针34***定位孔15之前定位针34先刺破位于真空吸取机构底部的柔性薄膜25使得柔性薄膜25和支撑下模31的相对位置固定。定位针34完全***定位孔15后所述真空腔33吸住柔性薄膜25原料。第一真空吸嘴11和第二真空吸嘴12断开真空吸力将将刚性板23、塑封料24和柔性薄膜25放下，第一真空吸嘴11和第二真空吸嘴12可通过关闭预设在第一真空风路13和第二真空风路中14的阀门131、141(参照图2)断开吸力。随后压合下模32向下移动将刚性板23和部分的柔性薄膜25收容在压模设备3的模腔36中。Referring to the working state of the molding material transfer device in step S5 shown in FIG. 7 to FIG. 9, the transport mechanism transfers the rigid plate 23, the molding compound 24 and the flexible film 25 to the third position with the vacuum suction mechanism 1, and is disposed below the third position. In the molding apparatus 3, in the process of placing the rigid plate 23 in the vacuum suction mechanism 1, the positioning pin 34 on the supporting lower die 31 is aligned with the positioning hole 15 on the topping mechanism 2, before the positioning pin 34 is inserted into the positioning hole 15 The positioning needle 34 first pierces the flexible film 25 at the bottom of the vacuum suction mechanism so that the relative positions of the flexible film 25 and the supporting lower mold 31 are fixed. After the positioning pin 34 is fully inserted into the positioning hole 15, the vacuum chamber 33 sucks the raw material of the flexible film 25. The vacuum suction of the first vacuum nozzle 11 and the second vacuum nozzle 12 will lower the rigid plate 23, the molding compound 24 and the flexible film 25, and the first vacuum nozzle 11 and the second vacuum nozzle 12 can be closed by the preset. The suction is interrupted by the valves 131, 141 (see Fig. 2) of the first vacuum air passage 13 and the second vacuum air passage 14. Subsequent movement of the press lower die 32 lowers the rigid plate 23 and a portion of the flexible film 25 in the cavity 36 of the stamper apparatus 3.
转运设备离开压模设备3完成一次塑封料转运过程，在随后的注塑过程中进行上下模合模，抽真空加温融化塑封料等常规步骤。The transfer device leaves the molding device 3 to complete a plastic material transfer process, and performs the conventional steps of clamping the upper and lower molds, vacuuming and heating the plastic sealing material in the subsequent injection molding process.
请参照图6本领域技术人员易于得知塑封料转运设备1工作时还可以是按照如下的步骤进行的：S1将刚性板转移至顶料机构中；S2转运机构带动真空吸取机构移动至第一位置,顶料机构将刚性板转移至第一真空吸嘴的位置；S3真空吸取机构吸附住刚性板，顶料机构离开；S4转运机构带动真空吸取机构将刚性板移动至第二位置；真空吸取机构吸附柔性薄膜；撒料机构在刚性板上放置塑封料；S5转运机构带动真空吸取机构移动至第三位置，真空吸取机构将柔性薄膜、刚性板、塑封料放置在压模设备上。与上述步骤的区别仅在于防止塑封料的动作被设置在步骤S4内，其他步骤完全相同不再赘述。Referring to FIG. 6 , those skilled in the art can easily know that the molding material transfer device 1 can also be operated according to the following steps: S1 transfers the rigid plate to the top material mechanism; and the S2 transfer mechanism drives the vacuum suction mechanism to move to the first Position, the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle; the S3 vacuum suction mechanism adsorbs the rigid plate, and the top material mechanism leaves; the S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; vacuum suction The mechanism adsorbs the flexible film; the spreading mechanism places the molding compound on the rigid plate; the S5 transfer mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device. The only difference from the above steps is that the action of preventing the molding compound is set in step S4, and the other steps are completely the same and will not be described again.
实施例二：Embodiment 2:
请参照图10和图11，本实施与实施例一不同之处在于，第一真空风路13和第二真空 风路14相互联通，在第一真空风路中设置第一真空阀门131，在第二真空风路14中设置第二真空阀门141。第一真空阀门131和第二真空阀门141可以独立控制，并且能够在步骤S3和S4中处于打开的状态使得第一真空吸嘴11和第二真空吸嘴12具备吸力，在步骤S5中处于关闭的状态使得第一真空吸嘴11和第二真空吸嘴12都失去吸力便于真空吸取机构离开所述压模设备3。Referring to FIG. 10 and FIG. 11 , the present embodiment is different from the first embodiment in that the first vacuum air passage 13 and the second vacuum air passage 14 are in communication with each other, and the first vacuum valve 131 is disposed in the first vacuum air passage. A second vacuum valve 141 is disposed in the second vacuum air passage 14. The first vacuum valve 131 and the second vacuum valve 141 can be independently controlled, and can be in an open state in steps S3 and S4 such that the first vacuum nozzle 11 and the second vacuum nozzle 12 are provided with suction, and are closed in step S5. The state causes both the first vacuum nozzle 11 and the second vacuum nozzle 12 to lose suction to facilitate the vacuum suction mechanism to leave the compression molding apparatus 3.
本发明相对现有技术使用了第一真空吸嘴吸住刚性板的边缘其带来多个好处：1刚性板边缘和真空吸取机构之间不存在缝隙使得塑封料不会漏水渗透到刚性板表面；2可以使用刚性板作为承载塑封颗粒料的受力构件不会发生弯曲；3在顶料机构中装载刚性板时使用挡板和位置调整机构限定刚性板的位置，在顶料机构将刚性板顶入真空吸取机构中时使用定位针和定位孔限定刚性板和顶料机构的相对位置，在真空吸取机构将刚性板放入压模设备上时使用定位孔和定位针限定刚性板和压模设备的相对位置，上述在刚性板转移的过程中每次的位置都相同，达到与吸嘴精准配合目的；4简化了现有技术的机械结构。Compared with the prior art, the present invention uses the first vacuum nozzle to suck the edge of the rigid board, which brings several advantages: 1 there is no gap between the edge of the rigid board and the vacuum suction mechanism, so that the molding material does not leak water and penetrates the surface of the rigid board. 2 can use a rigid plate as the force-bearing member carrying the plastic pellets without bending; 3 when the rigid plate is loaded in the top material mechanism, the baffle and the position adjustment mechanism are used to define the position of the rigid plate, and the rigid plate is used in the top material mechanism When positioning into the vacuum suction mechanism, the positioning pin and the positioning hole are used to define the relative positions of the rigid plate and the topping mechanism, and the positioning plate and the positioning pin are used to define the rigid plate and the pressing die when the vacuum suction mechanism puts the rigid plate into the molding device. The relative position of the equipment, the above-mentioned position in the process of the transfer of the rigid board is the same, to achieve the purpose of precise matching with the nozzle; 4 simplifies the mechanical structure of the prior art.

Claims (10)

  1. 塑封料转运设备，其特征在于，包括：A molding material transfer device characterized by comprising:
    真空吸取机构，具有第一真空吸嘴和第二真空吸嘴；a vacuum suction mechanism having a first vacuum nozzle and a second vacuum nozzle;
    所述第一真空吸嘴，用于吸附刚性板，并与可独立控制的第一真空风路连通；The first vacuum nozzle is configured to adsorb a rigid plate and is in communication with the independently controllable first vacuum air passage;
    所述第二真空吸嘴，用于吸附柔性薄膜，并与可独立控制的第二真空风路连通。The second vacuum nozzle is configured to adsorb the flexible film and is in communication with the independently controllable second vacuum air path.
  2. 根据权利要求1所述的塑封料转运设备，其特征在于，还包括转运机构，用于带动所述真空吸取机构在第一位置、第二位置和第三位置之间移动。The molding material transfer apparatus according to claim 1, further comprising a transport mechanism for driving said vacuum suction mechanism to move between the first position, the second position, and the third position.
  3. 根据权利要求2所述的塑封料转运设备，其特征在于，还包括顶料机构，所述真空吸取机构移动至第一位置时，顶料机构将刚性板转移至所述第一真空吸嘴的位置。The molding material transfer device according to claim 2, further comprising a top material mechanism, wherein the top material mechanism transfers the rigid plate to the first vacuum nozzle when the vacuum suction mechanism is moved to the first position position.
  4. 根据权利要求3所述的塑封料转运设备，其特征在于，还包括撒料机构，所述真空吸取机构移动至第一位置时，所述撒料机构将塑封料放置在所述刚性板上。The molding material transfer apparatus according to claim 3, further comprising a spreading mechanism, wherein said spreading mechanism places the molding compound on said rigid plate when said vacuum suction mechanism is moved to the first position.
  5. 根据权利要求2所述的塑封料转运设备，其特征在于，还包括薄膜载台，所述真空吸取机构移动至第二位置时，薄膜载台将柔性薄膜转移至第二真空吸嘴的位置或仅用于承载所述柔性薄膜待。The molding material transfer apparatus according to claim 2, further comprising a film stage, wherein the film stage transfers the flexible film to the position of the second vacuum nozzle when the vacuum suction mechanism is moved to the second position It is only used to carry the flexible film to be used.
  6. 根据权利要求5所述的塑封料转运设备，其特征在于，还包括撒料机构，所述真空吸取机构移动至第二位置时，所述撒料机构将塑封料放置在所述刚性板上。The molding material transfer apparatus according to claim 5, further comprising a spreading mechanism, wherein said spreading mechanism places the molding compound on said rigid plate when said vacuum suction mechanism is moved to the second position.
  7. 根据权利要求2所述的塑封料转运设备，其特征在于，还包括压模设备，所述真空吸取机构移动至第三位置时，压模设备与所述真空吸取机构配合接收真空吸取机构转移的刚性板、柔性薄膜和塑封料。The molding material transfer device according to claim 2, further comprising a molding device, wherein when the vacuum suction mechanism is moved to the third position, the compression molding device cooperates with the vacuum suction mechanism to receive the transfer of the vacuum suction mechanism Rigid panels, flexible films and molding compounds.
  8. 根据权利要求1所述的塑封料转运设备，其特征在于，所述第一真空吸嘴的位置高于第二真空吸嘴。The molding compound transfer apparatus according to claim 1, wherein said first vacuum nozzle is positioned higher than said second vacuum nozzle.
  9. 塑封料转运方法，其特征在于，包括如下步骤：A molding material transfer method, comprising the steps of:
    S1将刚性板转移至顶料机构中；S1 transfers the rigid board to the top material mechanism;
    S2转运机构带动真空吸取机构移动至第一位置,顶料机构将刚性板转移至第一真空吸嘴的位置；The S2 transport mechanism drives the vacuum suction mechanism to move to the first position, and the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle;
    S3真空吸取机构吸附住刚性板，顶料机构离开；The S3 vacuum suction mechanism sucks the rigid plate, and the top material mechanism leaves;
    S4转运机构带动真空吸取机构将刚性板移动至第二位置；真空吸取机构吸附柔性薄膜；撒料机构在刚性板上放置塑封料；The S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; the vacuum suction mechanism adsorbs the flexible film; and the spreading mechanism places the molding compound on the rigid plate;
    S5转运机构带动真空吸取机构移动至第三位置，真空吸取机构将柔性薄膜、刚性板、 塑封料放置在压模设备上。The S5 transport mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
  10. 塑封料转运方法，其特征在于，包括如下步骤：A molding material transfer method, comprising the steps of:
    S1将刚性板传送至顶料机构中；S1 conveys the rigid plate to the top material mechanism;
    S2转运机构带动真空吸取机构移动至第一位置,顶料机构将刚性板转移至第一真空吸嘴的位置；The S2 transport mechanism drives the vacuum suction mechanism to move to the first position, and the top material mechanism transfers the rigid plate to the position of the first vacuum nozzle;
    S3真空吸取机构吸附住刚性板，顶料机构离开；撒料机构在刚性板上放置塑封料；The S3 vacuum suction mechanism sucks the rigid plate, and the top material mechanism leaves; the scattering mechanism places the molding compound on the rigid plate;
    S4转运机构带动真空吸取机构将刚性板移动至第二位置；真空吸取机构吸附柔性薄膜；The S4 transport mechanism drives the vacuum suction mechanism to move the rigid plate to the second position; the vacuum suction mechanism adsorbs the flexible film;
    S5转运机构带动真空吸取机构移动至第三位置，真空吸取机构将柔性薄膜、刚性板、塑封料放置在压模设备上。The S5 transport mechanism drives the vacuum suction mechanism to move to the third position, and the vacuum suction mechanism places the flexible film, the rigid plate and the molding compound on the compression molding device.
PCT/CN2018/076294 2017-02-15 2018-02-11 Plastic packaging material transferring apparatus and method WO2018149378A1 (en)

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