WO2018139048A1 - Interposer and electronic machine - Google Patents

Interposer and electronic machine Download PDF

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Publication number
WO2018139048A1
WO2018139048A1 PCT/JP2017/043085 JP2017043085W WO2018139048A1 WO 2018139048 A1 WO2018139048 A1 WO 2018139048A1 JP 2017043085 W JP2017043085 W JP 2017043085W WO 2018139048 A1 WO2018139048 A1 WO 2018139048A1
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WO
WIPO (PCT)
Prior art keywords
interposer
element body
circuit board
terminal electrode
connection terminal
Prior art date
Application number
PCT/JP2017/043085
Other languages
French (fr)
Japanese (ja)
Inventor
浩和 矢▲崎▼
啓人 米森
貴紀 土屋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018139048A1 publication Critical patent/WO2018139048A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to an interposer provided with an insulating element body, and more specifically, a wiring member such as a flat cable, a substrate, an electronic component, and the like can be obliquely connected to the bottom surface of the element body.
  • a wiring member such as a flat cable, a substrate, an electronic component, and the like can be obliquely connected to the bottom surface of the element body.
  • the present invention also relates to an electronic device using the interposer of the present invention, and more specifically, a wiring member such as a flat cable connected to the interposer is not bent in the middle or is bent even if it is bent.
  • the present invention relates to an electronic device having a small size (bending amount).
  • a flat cable may be used to connect a circuit board and a circuit board that are arranged apart from each other.
  • FIG. 17A is a side cross-sectional view of the electronic device 1500.
  • FIG. 17B is a cross-sectional plan view of the electronic device 1500.
  • circuit boards 102 and 103 and a battery pack 104 are accommodated in a housing (equipment housing) 101.
  • Electronic components (IC chip, mounting component) 105 are mounted on the circuit boards 102 and 103, respectively.
  • the circuit board 102 and the circuit board 103 are connected by a flat and long flat cable 106.
  • the flat cable 106 has a certain degree of flexibility.
  • the flat cable 106 is formed in multiple layers, and has a structure in which a signal conductor and a ground conductor wider than the signal conductor are vertically stacked with an insulating layer interposed therebetween.
  • the signal conductor and the ground conductor are each made of, for example, copper (copper foil).
  • a coaxial connector 107 is connected to each end of the flat cable 106.
  • One coaxial connector 107 is connected to a coaxial connector 108 provided on the circuit board 102, and the other coaxial connector 107 is connected to a coaxial connector 108 provided on the circuit board 103.
  • the flat cable 106 is largely bent at four positions (P1 to P4) shown in FIG. 17A, and the circuit board 102 and the circuit board 103 are connected to each other through a gap between the battery pack 104 and the housing 101. Connected. Note that reference symbols P1 to P4 in FIG. 17A are supplemented by the applicant for the purpose of explanation.
  • the impedance of the signal conductor is deviated from the original design value, which may increase the insertion loss. That is, the impedance of the signal conductor is affected by the size of the capacitance formed between the signal conductor and the ground conductor, but is formed between the signal conductor and the ground conductor by bending the flat cable 106 greatly. The magnitude of the capacitance to be changed may change, and the impedance of the signal conductor may deviate from the original design value. And there was a possibility that insertion loss might become large because the impedance of a signal conductor shifted.
  • the flat cable 106 and the circuit boards 102 and 103 are connected by the coaxial connectors 107 and 108.
  • the coaxial connectors 107 and 108 are made of a metal plate such as phosphor bronze mechanically, for example. This was a mechanical structure manufactured by processing, and had a large dimension in the height direction and a dimension in the plane direction. For this reason, the electronic device 1500 requires a space for arranging the coaxial connectors 107 and 108 on the circuit boards 102 and 103, and there is a problem that the electronic device 1500 is increased in size.
  • the interposer of the present invention is provided on an insulator body and a bottom surface of the element body, with a conductive bonding material interposed therebetween.
  • the circuit board terminal electrode connected to the circuit board, the connection terminal electrode provided on the upper surface side of the element body and connected to the outside via the conductive bonding material, and the circuit board terminal electrode
  • a wiring electrode that connects the terminal electrode for the substrate and the connecting terminal electrode, and an upper surface of the element body is provided with an inclined surface that is a plane disposed obliquely with respect to the bottom surface. Is provided on the inclined surface.
  • a wiring member such as a flat cable, a substrate, an electronic component, or the like can be connected to the connection terminal electrode.
  • a wiring member it is not restricted to a flat cable, A general lead wire etc. may be sufficient.
  • the element body is preferably a laminated element body in which insulator layers are laminated.
  • a via conductor is formed by passing between both main surfaces of the insulator layer, a line conductor is formed between the layers of the insulator layer, and a wiring electrode is laminated using the via conductor and the line conductor. It can be easily formed inside the element body.
  • the element body is preferably a ceramic. In this case, an interposer with excellent heat resistance can be produced.
  • a metal shield be formed on the outer surface of the element body.
  • the metal shield can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside.
  • the element body has one or more side surfaces in addition to the bottom surface and the inclined surface, and the metal shield is formed on the entire side surface or a part of the side surface.
  • the element body preferably includes a top surface and one or more side surfaces, and the metal shield is preferably formed on the entire surface or a part of the top surface and the side surfaces.
  • the metal shield is formed so as to go around the outer periphery of the side surface of the element body. In these cases, noise emission and penetration can be effectively suppressed.
  • the case where there is one side corresponds to, for example, the case where the element body is cylindrical.
  • the element body is made of a magnetic material.
  • the interposer can have a function of a so-called magnetic bead inductor (a ferrite bead inductor when the magnetic material is ferrite) that suppresses the passage of noise.
  • the element body may be made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer may be made of a magnetic substance. That is, even if the entire element body is not a magnetic body, the element body is a laminated element body in which a plurality of insulator layers are stacked, and even if a part of the insulator layer is a magnetic body, a magnetic bead inductor ( When the magnetic material is ferrite, the function of a ferrite bead inductor) can be provided.
  • the electronic device can be manufactured by mounting the interposer of the present invention on a circuit board and connecting a wiring member such as a flat cable to the connection terminal electrode of the interposer. More specifically, for example, a first interposer, a second interposer, a first circuit board on which the first interposer is mounted, and a second circuit board on which the second interposer is mounted are provided.
  • a wiring member such as a flat cable
  • the connection terminal electrode of the first interposer and the connection terminal electrode of the second interposer can be connected to manufacture an electronic device. In this case, it is possible to eliminate bending in the middle of the flat cable or the like, or to reduce the amount of bending (bending amount) in the middle of the flat cable or the like.
  • the height at which the first interposer is arranged may be equal to the height at which the second interposer is arranged.
  • the height at which the first interposer is arranged may be different from the height at which the second interposer is arranged.
  • each of a first circuit board and a second circuit board includes an upper main surface and a lower main surface, the first interposer is mounted on the upper main surface of the first circuit board, and the second A second interposer may be mounted on the lower main surface of the circuit board.
  • the wiring member is preferably a flat cable. In this case, the connection of the wiring member to the connection terminal is facilitated.
  • the interposer has at least one side surface, a metal shield is formed on the side surface, an electronic component is mounted on the circuit board adjacent to the side surface on which the metal shield of the interposer is formed, and the metal shield is formed on the bottom surface It is also preferable that the side surface is covered up to a position higher than the height of the electronic component. In this case, it is possible to effectively suppress the noise radiated by the interposer from entering and affecting adjacent electronic components and the noise radiated by the adjacent electronic components from entering and affecting the interposer. can do.
  • the interposer includes at least one side surface, a metal shield is formed on the side surface, and the metal shield is formed so as to go around the outer periphery of the side surface of the element body. Also in this case, it is possible to effectively suppress noise emission from the interposer and noise intrusion into the interposer.
  • the interposer of the present invention is provided with an inclined surface, which is a plane arranged obliquely with respect to the bottom surface, on the upper side surface of the element body, and the connection terminal electrode is provided on the inclined surface. Wiring members, substrates, electronic components, and the like can be connected obliquely to the bottom surface. Therefore, if the interposer of the present invention is used, for example, it is possible to eliminate bending in the middle of a flat cable or the like, or to reduce the amount of bending (bending amount) in the middle of a flat cable or the like.
  • the electronic device of the present invention uses the interposer of the present invention, there is no bending in the middle of a wiring member such as a flat cable, or the size of folding in the middle of a wiring member such as a flat cable (bending) The amount is small.
  • FIG. 1 is a perspective view showing an interposer 100 according to Embodiment 1.
  • FIG. 1 is a cross-sectional view showing an interposer 100.
  • FIG. 1 is a cross-sectional view illustrating an electronic device 200 according to a first embodiment.
  • 2 is a cross-sectional view of a main part showing an electronic device 200.
  • FIG. It is sectional drawing which shows the interposer 300 concerning Embodiment 2.
  • FIG. FIG. 9 is a cross-sectional view showing an electronic apparatus 600 according to a fifth embodiment.
  • FIG. 10 is a cross-sectional view illustrating an electronic apparatus 700 according to a sixth embodiment.
  • FIG. 10A is a perspective view of an interposer 800 according to the seventh embodiment.
  • FIG. 10B is a plan view of the interposer 800.
  • FIG. 11A is a perspective view of an interposer 900 according to the eighth embodiment.
  • FIG. 11B is a plan view of the interposer 900.
  • 10 is a perspective view of an interposer 1000 according to Embodiment 9.
  • FIG. It is a front view of the electronic device 1100 concerning Embodiment 10.
  • FIG. It is sectional drawing of the interposer 1200 concerning Embodiment 11.
  • FIG. It is sectional drawing of the interposer 1300 concerning Embodiment 12.
  • FIG. FIG. 16A is a perspective view of an interposer 1400 according to the thirteenth embodiment.
  • FIG. 16B is an exploded perspective view of the interposer 1400.
  • FIG. 17A is a side cross-sectional view of the electronic device 1500 disclosed in Patent Document 1.
  • FIG. 17B is a cross-sectional
  • each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
  • FIG. 1 and 2 show an interposer 100 according to the first embodiment.
  • 3 and 4 show an electronic apparatus 200 according to the first embodiment manufactured using the interposer 100.
  • FIG. 1 is a perspective view of the interposer 100
  • FIG. 2 is a cross-sectional view of the interposer 100
  • 3 is a cross-sectional view of the electronic device 200
  • FIG. 1 is a perspective view of the interposer 100
  • FIG. 2 is a cross-sectional view of the interposer 100
  • 3 is a cross-sectional view of the electronic device 200
  • the interposer 100 includes the multilayer body 1.
  • the multilayer body 1 has a structure in which three insulator layers 1a to 1c are laminated.
  • the multilayer body 1 (insulator layers 1a to 1c) is made of a ceramic such as LTCC (Low Temperature Co-fired Ceramics).
  • the multilayer body 1 includes a top surface TS (Top surface), a bottom surface BS (Bottom surface), and four side surfaces SS (Side surface). Furthermore, the multilayer body 1 includes an inclined surface IS (Inclined Surface) which is a plane disposed obliquely with respect to the bottom surface BS. The inclined surface IS intersects the top surface TS and the three side surfaces SS, respectively.
  • Via conductors 2 are formed through the insulator layers 1a to 1c.
  • a line conductor 3 is formed between the insulator layers 1a to 1c.
  • a wiring electrode is formed inside the multilayer body 1 using the via conductor 2 and the line conductor 3.
  • the via conductor 2 and the line conductor 3 are each formed of, for example, copper, silver, an alloy containing these, or the like.
  • a circuit board terminal electrode 4 connected to the circuit board is formed on the bottom surface BS of the multilayer body 1.
  • the circuit board terminal electrode 4 is formed of, for example, copper, silver, an alloy containing these, or the like.
  • a plating layer 4 a is formed on the surface of the circuit board terminal electrode 4.
  • the plating layer 4a is formed in a multilayer structure, for example, with a metal selected from nickel for the first layer and gold, copper, tin, etc. for the second layer.
  • connection terminal electrode 5 connected to a flat cable or the like is formed on the inclined surface IS of the multilayer body 1.
  • the via conductor 2 exposed from the inclined surface IS of the multilayer body 1 is used as the connection terminal electrode 5 as it is.
  • a plating layer 5 a is formed on the surface of the connection terminal electrode 5.
  • the plated layer 5a is formed in a multilayer structure, for example, with a metal selected from nickel as the first layer and gold, copper, tin, and the like as the second layer.
  • the target connected to the connection terminal electrode 5 is arbitrary. It may be a wiring member such as a flat cable, a substrate, or an electronic component. Further, the wiring member is not limited to the flat cable, and a general lead wire or the like may be connected.
  • the circuit board terminal electrode 4 and the connection terminal electrode 5 are connected inside the multilayer body 1 by the wiring electrodes formed using the via conductor 2 and the line conductor 3 described above.
  • the interposer 100 connects the circuit board terminal electrode 4 to the mounting electrode formed on the circuit board with a conductive bonding material, and the connection terminal electrode 5 is electrically connected to the connection terminal formed at the end of the flat cable. Connect with a bonding material.
  • a bonding material for example, solder or a conductive adhesive can be used.
  • the connection terminal electrode 5 is provided on the inclined surface IS arranged obliquely with respect to the bottom surface BS, the connected flat cable can be drawn obliquely with respect to the bottom surface BS. is there. Therefore, if the interposer 100 is used, it is possible to eliminate bending in the middle of the flat cable, or to reduce the amount of bending (bending amount) in the middle of the flat cable.
  • the interposer 100 can be manufactured to an extremely small size by using a multilayer ceramic technology used for manufacturing a multilayer ceramic electronic component (such as a multilayer ceramic capacitor).
  • the interposer 100 can be manufactured by the following manufacturing method, for example.
  • Ceramic green sheets for preparing the insulator layers 1a to 1c are prepared.
  • the green sheet is prepared as a mother green sheet in which a large number of interposers 100 are arranged in a matrix so as to manufacture a large number of interposers 100 at a time.
  • a hole for forming the via conductor 2 is formed in each mother green sheet.
  • the hole is formed by, for example, laser light irradiation.
  • a conductive paste pattern for forming the line conductor 3 and the circuit board terminal electrode 4 is formed by printing a conductive paste on one main surface or both main surfaces of each mother green sheet.
  • a mother green sheet for producing the insulator layer 1a, a mother green sheet for producing the insulator layer 1b, and a mother green sheet for producing the insulator layer 1c are sequentially laminated and pressed.
  • the green mother laminated body is made by integrating.
  • the unfired mother laminate body is divided into individual unfired laminate bodies.
  • the division is performed by, for example, cutting the division line with a dicer.
  • Each of the divided unfired laminated bodies has a rectangular parallelepiped shape including a top surface TS, a bottom surface BS, and four side surfaces SS.
  • the unfired multilayer body is fixed, and the unfired multilayer body is irradiated with laser light to form the inclined surface IS on the unfired multilayer body.
  • the unfired laminated body may be barrel-polished.
  • the unfired multilayer body is fired with a predetermined profile to produce the multilayer body 1.
  • a circuit board terminal electrode 4 is formed on the bottom surface BS of the multilayer body 1. Further, on the inclined surface IS of the multilayer body 1, a connection terminal electrode 5 (an exposed end surface of the via conductor 2) is formed.
  • the plating layer 4a is formed on the surface of the circuit board terminal electrode 4 and the plating layer 5a is formed on the surface of the connection terminal electrode 5, for example, by electrolytic plating, thereby completing the interposer 100.
  • Manufacturing method 2 of interposer 100 In the manufacturing method 2 of the interposer 100, a part of the manufacturing method 1 is changed.
  • the unsintered laminated body after being divided individually was irradiated with laser light to form the inclined surface IS.
  • manufacturing method 2 instead of this, when the unfired mother laminated body is divided into individual unfired laminated bodies, the dicer is replaced several times along the way, if necessary, Is gradually increased to form the inclined surface IS in each of the divided unfired laminated bodies.
  • the inclined surface IS can be flattened.
  • the unsintered laminated body after being divided individually was irradiated with laser light to form the inclined surface IS.
  • a mother green sheet for producing the insulator layers 1b and 1c instead of this, a mother green sheet for producing the insulator layers 1b and 1c, and a width for forming the inclined surface IS along the dividing line in each dividing line portion.
  • Different line windows openings
  • a line-shaped window having a small width is provided on the mother green sheet for producing the insulator layer 1b
  • a line-shaped window having a large width is provided on the mother green sheet for producing the insulator layer 1c.
  • No window was provided in the mother green sheet for producing the insulator layer 1a.
  • a mother green sheet for producing the insulator layer 1a, a mother green sheet for producing the insulator layer 1b, and a mother green sheet for producing the insulator layer 1c are sequentially laminated.
  • an unfired mother laminated body is produced by pressurizing and integrating, an inclined surface is formed in the dividing line portion.
  • the inclined surface IS is formed in each unfired laminated body by the inclined surfaces of the dividing line portions.
  • the unfired laminated body is barrel-polished to flatten the inclined surface IS.
  • the multilayer body 1 is configured by the three insulator layers 1a to 1c.
  • the multilayer body 1 is configured by an insulator layer having a larger number of layers. This is an effective manufacturing method.
  • the electronic device 200 is, for example, a portable electronic device such as a smartphone. Note that in FIG. 3, provision of reference numerals to fine components may be omitted.
  • the electronic device 200 includes a housing 21.
  • the casing 21 is made of, for example, resin.
  • a first circuit board 22, a second circuit board 23, a third circuit board 24, and a battery pack 25 are accommodated in the housing 21.
  • the battery pack 25 is fixed to the inner wall of the casing 21.
  • the first circuit board 22 is fixed on the battery pack 25.
  • the second circuit board 23 and the third circuit board 24 are each fixed to the inner wall of the housing 21.
  • Electronic components 26 such as semiconductor devices, capacitors, resistors, and inductors are mounted on the first circuit board 22, the second circuit board 23, and the third circuit board 24, respectively.
  • the mounting electrode 27 formed on the main surfaces of the circuit boards 22 to 24 and the terminal electrode of the electronic component 26 are connected to a conductive bonding material 28 such as solder or a conductive adhesive. It is done by joining by.
  • first interposer 100A is mounted on the first circuit board 22, and the second interposer 100B is mounted on the second circuit board 23.
  • Each of the interposers 100A and 100B is the interposer 100 according to the first embodiment described above.
  • the interposers 100A and 100B are mounted by connecting the mounting electrodes 27 formed on the main surfaces of the circuit boards 22 and 23 and the circuit board terminal electrodes 4 of the interposers 100A and 100B with a conductive material such as solder or a conductive adhesive. This is performed by bonding with the adhesive bonding material 28. That is, the interposers 100A and 100B are simultaneously mounted on the circuit boards 22 and 23 by the same method as the other electronic components 26.
  • connection terminals 30 are formed at both ends of the flat cable 29, and the connection terminal electrodes 5 of the interposers 100A and 100B and the connection terminal 30 of the flat cable 29 are connected by solder or conductive. Bonded by a conductive bonding material 28 such as a conductive adhesive.
  • the interposer 100 ⁇ / b> A and the interposer 100 ⁇ / b> B are arranged at different height positions inside the housing 21.
  • the flat cable 29 that connects the interposer 100A and the interposer 100B is not bent, the flat cable 29 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 29 is shifted to increase insertion loss. There is nothing.
  • FIG. 5 shows an interposer 300 according to the second embodiment. However, FIG. 5 is a cross-sectional view of the interposer 300.
  • the interposer 300 has changed a part of the configuration of the interposer 100 according to the first embodiment.
  • the via conductor 2 exposed on the inclined surface IS of the multilayer body 1 is used as it is as the connection terminal electrode 5.
  • the interposer 300 has the connection terminal electrode 15 separately formed on the inclined surface IS.
  • a plating layer 15 a was formed on the surface of the connection terminal electrode 15.
  • the connection terminal electrode 15 is connected to the via conductor 2.
  • connection terminal electrode 15 is formed by printing a conductive paste on the inclined surface IS of the unfired laminated body to form a pattern, and then firing the unfired laminated body to produce the laminated body 1. Can be formed.
  • the other configuration of the interposer 300 is the same as that of the interposer 100.
  • FIG. 6 shows an interposer 400 according to the third embodiment. However, FIG. 6 is a cross-sectional view of the interposer 400.
  • the interposer 400 has changed a part of the configuration of the interposer 100 according to the first embodiment.
  • the multilayer body 1 was provided with a top surface TS, a bottom surface BS, four side surfaces SS, and an inclined surface IS.
  • the interposer 400 eliminates the top surface TS
  • the laminated body 41 has a shape including a bottom surface BS, four side surfaces SS, and an inclined surface IS.
  • the multilayer body 41 does not include the top surface TS arranged in parallel with the bottom surface BS, and instead, the area of the inclined surface IS is larger than the inclined surface IS of the multilayer body 1.
  • the multilayer body 41 has a structure in which three insulator layers 41a to 41c are laminated.
  • the interposer 400 has changed the structure of the wiring electrode formed using the via conductor 2 and the line conductor 3 inside the multilayer body 41 from the interposer 100 in accordance with the above change.
  • the other configuration of the interposer 400 is the same as that of the interposer 100.
  • FIG. 7 shows an interposer 500 according to the fourth embodiment. 7 is a cross-sectional view of the interposer 500.
  • the interposer 500 further changes the configuration of the interposer 400 according to the third embodiment.
  • the interposer 400 was provided with a laminated body 41 having a structure in which three insulating layers 41a to 41c were laminated.
  • the interposer 500 includes a single block-shaped element body 51 instead of the laminated element body 41.
  • the element body 51 is also made of an insulator such as ceramic.
  • the interposer 500 includes the wiring electrode inside the element body 51 only by the via conductor 2 and omits the line conductor 3.
  • the other configuration of the interposer 500 is the same as that of the interposer 100.
  • FIG. 8 shows an electronic apparatus 600 according to the fifth embodiment. However, FIG. 8 is a cross-sectional view of the electronic apparatus 600.
  • the electronic device 600 includes a housing 61.
  • a first circuit board 62, a second circuit board 63, and a battery pack 65 are accommodated in the housing 61.
  • the first circuit board 62, the second circuit board 63, and the battery pack 65 are fixed to the inner wall of the casing 61, respectively.
  • Electronic components 26 are mounted on the first circuit board 62 and the second circuit board 63, respectively.
  • first interposer 100A is mounted on the first circuit board 62
  • second interposer 100B is mounted on the second circuit board 63.
  • Interposer 100A and interposer 100B are connected by a flat cable 69.
  • the flat cable 69 connects the interposer 100A and the interposer 100B via the top surface of the battery pack 65.
  • the interposer 100 ⁇ / b> A and the interposer 100 ⁇ / b> B are arranged at the same height in the housing 61.
  • the flat cable 69 is pulled out from the interposer 100A and the interposer 100B without being bent. That is, because the flat cable 69 that connects the interposer 100A and the interposer 100B has a small bending amount (bending amount), the flat cable 39 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 39 is shifted. Insertion loss does not increase.
  • FIG. 9 shows an electronic apparatus 700 according to the sixth embodiment. Note that FIG. 9 is a cross-sectional view of the electronic device 700.
  • the electronic device 700 includes a housing 71.
  • a first circuit board 72, a second circuit board 73, and a battery pack 75 are accommodated in the housing 71.
  • the electronic component 26 is mounted on the upper main surface of the first circuit board 72. In addition, electronic components 26 are mounted on the upper and lower main surfaces of the second circuit board 73, respectively.
  • the battery pack 75 is fixed to the inner wall of the casing 71.
  • the first circuit board 72 is fixed on the battery pack 75.
  • the second circuit board 73 is fixed inside the casing 71 in a suspended state.
  • the first interposer 100A is mounted on the upper main surface of the first circuit board 72.
  • the second interposer 100B is mounted on the lower main surface of the second circuit board 73.
  • Interposer 100A and interposer 100B are connected by a flat cable 79.
  • the interposer 100A and the interposer 100B are arranged at different height positions inside the casing 71.
  • the flat cable 79 that connects the interposer 100A and the interposer 100B is not bent, the flat cable 79 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 79 is shifted to increase insertion loss. There is nothing.
  • FIGS. 10A and 10B show an interposer 800 according to the seventh embodiment.
  • FIG. 10A is a perspective view of the interposer 800.
  • FIG. 10B is a plan view of the interposer 800.
  • the interposer 800 has a new configuration added to the interposer 100 according to the first embodiment. Specifically, the metal shield 36 was formed on the four side surfaces SS of the multilayer body 1 of the interposer 100.
  • the metal shield 36 is formed on each of the four side surfaces SS of the multilayer body 1 with a certain width along the side in contact with the bottom surface BS. As a result, in the present embodiment, the metal shield 36 is formed on the entire surface of the one side surface SS, and is partially formed on each of the three side surfaces SS.
  • the material and configuration of the metal shield 51 are arbitrary, but can be formed of, for example, Ti, Ni, Cr, SUS, Cu, Al, Ag, or an alloy thereof. Further, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, and a corrosion-resistant layer made of Ti, Ni, Cr, SUS, or an alloy thereof
  • the three-layer structure can be formed.
  • the adhesion layer is preferably made of a material having high affinity with the element body 1 and hardly peeled off
  • the conductive layer is preferably made of a material having high conductivity
  • the corrosion-resistant layer is preferably made of a material resistant to oxidation and corrosion.
  • the metal shield 36 is connected to the circuit board terminal electrode 4 via wiring electrodes (via conductor 2 and line conductor 3). Therefore, the metal shield 36 can be connected to the ground potential by connecting the circuit board terminal electrode 4 to the ground potential.
  • the metal shield 36 can be formed, for example, by sputtering after masking the outer surface of the multilayer body 1 where the metal shield 36 is not formed.
  • the interposer 800 can suppress the noise radiated from the interposer to the outside and the noise entering the interposer from the outside by the metal shield 36. That is, since the interposer 800 is shielded by the metal shield 36, the transmission of the side surface SS of the laminated body 1 of the magnetic field component and electric field component constituting the noise is suppressed, and noise radiated to the outside from the interposer , Noise entering the interposer from the outside is suppressed.
  • the metal shield 36 is formed so as to go around the outer periphery of the four side surfaces SS of the multilayer body 1 and has a high noise shielding effect.
  • FIG. 11A and 11B show an interposer 900 according to the eighth embodiment.
  • FIG. 11A is a perspective view of the interposer 900.
  • FIG. 11B is a plan view of the interposer 900.
  • the interposer 900 has changed a part of the configuration of the interposer 800 according to the seventh embodiment described above. Specifically, in the interposer 800, the metal shields 36 are formed on the four side surfaces SS of the multilayer body 1 with a certain width along the sides in contact with the bottom surface BS. The interposer 900 is modified to form a metal shield 46 on the entire surface of the four side surfaces SS of the multilayer body 1 and the entire surface of the top surface TS.
  • the interposer 900 has a better noise shielding effect than the interposer 800.
  • FIG. 12 shows an interposer 1000 according to the ninth embodiment. However, FIG. 12 is a perspective view of the interposer 1000.
  • the interposer 1000 has changed a part of the configuration of the interposer 900 according to the above-described eighth embodiment. Specifically, in the interposer 1000, in addition to the metal shield 46, the metal shield 56 is also formed around the connection terminal electrode 5 on the inclined surface IS of the multilayer body 1.
  • the interposer 1000 has a better noise shielding effect than the interposer 900.
  • the interposers 800, 900, and 100 according to the seventh to ninth embodiments, examples of forming the metal shields 36, 46, and 56 have been described.
  • the present invention is not limited to the above example. While confirming the noise shielding effect, the formation position can be appropriately set as necessary.
  • FIG. 13 shows an electronic apparatus 1100 according to the tenth embodiment. However, FIG. 13 is a front view of the electronic device 1100.
  • the interposer 800 according to the seventh embodiment described above is mounted on the circuit board 64.
  • an electronic component 67 is mounted on the circuit board 64 adjacent to the interposer 800.
  • the height H S of the metal shield 36 formed on the side surface SS which faces the electronic component 67 of the laminated body 1 is higher than the height H D of the electronic component 67.
  • the noise cannot be sufficiently shielded by the metal shield 36, and the noise radiated from the electronic component 67 becomes an interposer. effect or apply, interposer there is a possibility that noise radiation or affect the electronic component 67, but in the electronic device 11000, the height H S of the metal shield 36 is greater than the height H D of the electronic component 67 Therefore, the influence of noise between the two is effectively suppressed.
  • FIG. 14 shows an interposer 1200 according to the eleventh embodiment. However, FIG. 14 is a cross-sectional view of the interposer 1200.
  • the interposer 1200 has changed a part of the configuration of the interposer 100 according to the first embodiment. Specifically, in the interposer 100, the three insulator layers 1a to 1c constituting the multilayer body 1 are made of a non-magnetic material, but in the interposer 1200, the three insulator layers 1a to 1d are formed. Among them, the insulator layer 1a laminated on the lowermost layer was made of the magnetic body Z. More specifically, the insulator layer 1a was made of a magnetic material Z made of ferrite.
  • the interposer 1200 also has a function of a so-called magnetic bead inductor (ferrite bead inductor), and can suppress passage of noise included in a signal passing through the interposer.
  • magnetic bead inductor ferrite bead inductor
  • FIG. 15 shows an interposer 1300 according to the twelfth embodiment. 15 is a perspective view of the interposer 1300.
  • the interposer 1300 has changed a part of the configuration of the interposer 1200 according to the eleventh embodiment. Specifically, in the interposer 1200, the insulator layer 1a laminated on the lowermost layer of the multilayer body 1 is made of the magnetic body Z. In the interposer 1300, all of the three insulator layers 1a to 1c are made magnetic. Made with body Z.
  • the laminated element body 1 may be partially made of a magnetic substance like the interposer 1200, or the laminated element body 1 like the interposer 1300. The whole may be made of a magnetic material.
  • Interposer 1300 also has the function of a magnetic bead inductor (ferrite bead inductor).
  • FIGS. 16A and 16B show an interposer 1400 according to the thirteenth embodiment.
  • 16A is a perspective view of the interposer 1400.
  • FIG. 16B is an exploded perspective view of the interposer 1400 and shows a state where the metal shield 36 is removed.
  • the interposer 1400 combines the features of the interposer 800 according to the seventh embodiment and the features of the interposer 1200 according to the eleventh embodiment.
  • the interposer 1400 is formed by using the magnetic body Z, the insulator layer 1a laminated at the lowest layer among the three insulator layers 1a to 1c constituting the multilayer body 1. did.
  • the metal shield 36 is formed on the four side surfaces SS of the multilayer body 1 in the same manner as the interposer 800.
  • the interposer 1400 Since the interposer 1400 is formed with the metal shield 36, noise radiated from the interposer to the outside and noise entering the interposer from the outside are suppressed. Further, the interposer 1400 has the function of a so-called magnetic bead inductor (ferrite bead inductor) because the insulator layer 1a constituting the element body 1 is made of the magnetic body Z.
  • magnetic bead inductor ferrite bead inductor
  • interposers 100, 300, 500, 800, 900, 1000, 1200, 1300, 1400 and the electronic devices 200, 600, 700, 1100 according to the embodiments have been described.
  • the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
  • interposers 100, 300, 400, 500, 800, 900, 1000, 1200, 1300, and 1400 are made of the laminated element bodies 1 and 41 and the element body 51 using ceramics, these materials are arbitrary. You may produce with other materials, such as resin.
  • the inclination angle of the inclined surface IS of the laminated element bodies 1 and 41 and the element body 51 of the interposers 100, 300, 400, 500, 800, 900, 1000, 1200, 1300, and 1400 is arbitrary. Can be changed.
  • the electronic devices 200, 600, 700, and 1100 are portable electronic devices such as smartphones, the type of the electronic device is arbitrary and may be other types of electronic devices.

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Abstract

Provided is an interposer allowing a flat cable, or the like, to be connected obliquely relative to the bottom surface of an element body. The invention comprises an element body (1) serving as an insulator, circuit base board terminal electrodes (4) provided at the bottom surface of the element body (1), connection terminal electrodes (5) provided on the top surface side of the element body (1), and wiring electrodes (via conductors (2), line path conductors (3)) provided in the interior of the element body (1) for connecting the circuit base board terminal electrodes (4) to the connection terminal electrodes (5). Provided on the upper surface of the element body (1) is an inclined surface (IS), which is a flat surface disposed obliquely relative to the bottom surface (BS), on which is provided the connection terminal electrodes (5).

Description

インターポーザおよび電子機器Interposers and electronic devices
　本発明は、絶縁体の素体を備えたインターポーザに関し、さらに詳しくは、フラットケーブルなどの配線部材や、基板や、電子部品などを、素体の底面に対して斜めに接続することが可能なインターポーザに関する。 The present invention relates to an interposer provided with an insulating element body, and more specifically, a wiring member such as a flat cable, a substrate, an electronic component, and the like can be obliquely connected to the bottom surface of the element body. Regarding the interposer.
　また、本発明は、本発明のインターポーザを使用した電子機器に関し、さらに詳しくは、インターポーザに接続されたフラットケーブルなどの配線部材が、途中で折り曲げられていない、あるいは、折り曲げられていても、折り曲げの大きさ（折り曲げ量）の小さい電子機器に関する。 The present invention also relates to an electronic device using the interposer of the present invention, and more specifically, a wiring member such as a flat cable connected to the interposer is not bent in the middle or is bent even if it is bent. The present invention relates to an electronic device having a small size (bending amount).
　スマートフォン等の電子機器において、離れて配置された回路基板と回路基板とを接続するのに、フラットケーブルを使用する場合がある。 In an electronic device such as a smartphone, a flat cable may be used to connect a circuit board and a circuit board that are arranged apart from each other.
　そのような電子機器が、特許文献１（特許第５８４２８５０号公報）に開示されている。図１７（Ａ）、（Ｂ）に、特許文献１に開示された電子機器（携帯電子機器）１５００を示す。ただし、図１７（Ａ）は、電子機器１５００の側面断面図である。図１７（Ｂ）は、電子機器１５００の平面断面図である。 Such an electronic device is disclosed in Patent Document 1 (Japanese Patent No. 5842850). 17A and 17B show an electronic device (portable electronic device) 1500 disclosed in Patent Document 1. FIG. Note that FIG. 17A is a side cross-sectional view of the electronic device 1500. FIG. 17B is a cross-sectional plan view of the electronic device 1500.
　電子機器１５００は、筐体（機器筐体）１０１の内部に、２つの回路基板（実装回路基板）１０２、１０３と、バッテリーパック１０４とが収容されている。回路基板１０２、１０３には、それぞれ、電子部品（ＩＣチップ、実装部品）１０５が実装されている。 In the electronic device 1500, two circuit boards (mounting circuit boards) 102 and 103 and a battery pack 104 are accommodated in a housing (equipment housing) 101. Electronic components (IC chip, mounting component) 105 are mounted on the circuit boards 102 and 103, respectively.
　回路基板１０２と回路基板１０３とが、平板状かつ長尺状のフラットケーブル１０６によって接続されている。フラットケーブル１０６は、ある程度の可撓性を備えている。 The circuit board 102 and the circuit board 103 are connected by a flat and long flat cable 106. The flat cable 106 has a certain degree of flexibility.
　フラットケーブル１０６は、図示しないが、多層に形成されており、信号導体と、信号導体よりも幅の広いグランド導体とが、絶縁層を間に挟んで上下に重ねて設けられた構造である。信号導体、グランド導体は、それぞれ、たとえば、銅（銅箔）によって作製されている。 Although not shown, the flat cable 106 is formed in multiple layers, and has a structure in which a signal conductor and a ground conductor wider than the signal conductor are vertically stacked with an insulating layer interposed therebetween. The signal conductor and the ground conductor are each made of, for example, copper (copper foil).
　フラットケーブル１０６の両端には、それぞれ、同軸コネクタ１０７が接続されている。そして、一方の同軸コネクタ１０７が、回路基板１０２に設けられた同軸コネクタ１０８に接続され、他方の同軸コネクタ１０７が、回路基板１０３に設けられた同軸コネクタ１０８に接続されている。 A coaxial connector 107 is connected to each end of the flat cable 106. One coaxial connector 107 is connected to a coaxial connector 108 provided on the circuit board 102, and the other coaxial connector 107 is connected to a coaxial connector 108 provided on the circuit board 103.
　フラットケーブル１０６は、図１７（Ａ）に示す４個所（Ｐ１～Ｐ４）で大きく折り曲げられたうえ、バッテリーパック１０４と筐体１０１との隙間を経由して、回路基板１０２と回路基板１０３とを接続している。なお、図１７（Ａ）における符号Ｐ１～Ｐ４は、本件出願人が、説明のために補足したものである。 The flat cable 106 is largely bent at four positions (P1 to P4) shown in FIG. 17A, and the circuit board 102 and the circuit board 103 are connected to each other through a gap between the battery pack 104 and the housing 101. Connected. Note that reference symbols P1 to P4 in FIG. 17A are supplemented by the applicant for the purpose of explanation.
特許第５８４２８５０号公報Japanese Patent No. 5842850
　電子機器１５００は、フラットケーブル１０６が大きく折り曲げられることによって、信号導体のインピーダンスが本来の設計値からずれてしまい、挿入損失が大きくなる虞があった。すなわち、信号導体のインピーダンスは、信号導体とグランド導体との間に形成される容量の大きさの影響を受けるが、フラットケーブル１０６が大きく折り曲げられることによって、信号導体とグランド導体との間に形成される容量の大きさが変化し、信号導体のインピーダンスが本来の設計値からずれてしまう虞があった。そして、信号導体のインピーダンスがずれてしまうことによって、挿入損失が大きくなってしまう虞があった。 In the electronic device 1500, when the flat cable 106 is largely bent, the impedance of the signal conductor is deviated from the original design value, which may increase the insertion loss. That is, the impedance of the signal conductor is affected by the size of the capacitance formed between the signal conductor and the ground conductor, but is formed between the signal conductor and the ground conductor by bending the flat cable 106 greatly. The magnitude of the capacitance to be changed may change, and the impedance of the signal conductor may deviate from the original design value. And there was a possibility that insertion loss might become large because the impedance of a signal conductor shifted.
　また、電子機器１５００は、フラットケーブル１０６と回路基板１０２、１０３との接続を、同軸コネクタ１０７、１０８によっておこなっているが、同軸コネクタ１０７、１０８は、たとえば、リン青銅などの金属板を機械的に加工して作製した機械的構造物であり、高さ方向の寸法、および、平面方向の寸法が、それぞれ大きかった。そのため、電子機器１５００は、回路基板１０２、１０３上に、同軸コネクタ１０７、１０８を配置するための空間が必要であり、大型化してしまうという問題があった。 In the electronic device 1500, the flat cable 106 and the circuit boards 102 and 103 are connected by the coaxial connectors 107 and 108. The coaxial connectors 107 and 108 are made of a metal plate such as phosphor bronze mechanically, for example. This was a mechanical structure manufactured by processing, and had a large dimension in the height direction and a dimension in the plane direction. For this reason, the electronic device 1500 requires a space for arranging the coaxial connectors 107 and 108 on the circuit boards 102 and 103, and there is a problem that the electronic device 1500 is increased in size.
　本発明は、上述した従来の課題を解決するためになされたものであり、その手段として本発明のインターポーザは、絶縁体の素体と、素体の底面に設けられ、導電性接合材を介して回路基板に接続される回路基板用端子電極と、素体の上面側に設けられ、導電性接合材を介して外部に接続される接続用端子電極と、素体の内部に設けられ、回路基板用端子電極と接続用端子電極とを接続する配線電極と、を備え、素体の上側面には、底面に対して斜めに配置された平面である傾斜面が設けられ、接続用端子電極が、傾斜面に設けられたものとした。 The present invention has been made in order to solve the above-described conventional problems, and as a means for that purpose, the interposer of the present invention is provided on an insulator body and a bottom surface of the element body, with a conductive bonding material interposed therebetween. The circuit board terminal electrode connected to the circuit board, the connection terminal electrode provided on the upper surface side of the element body and connected to the outside via the conductive bonding material, and the circuit board terminal electrode A wiring electrode that connects the terminal electrode for the substrate and the connecting terminal electrode, and an upper surface of the element body is provided with an inclined surface that is a plane disposed obliquely with respect to the bottom surface. Is provided on the inclined surface.
　なお、接続用端子電極には、フラットケーブルなどの配線部材や、基板、電子部品などを接続することができる。なお、配線部材の場合は、フラットケーブルには限られず、一般的なリード線などであっても良い。 Note that a wiring member such as a flat cable, a substrate, an electronic component, or the like can be connected to the connection terminal electrode. In addition, in the case of a wiring member, it is not restricted to a flat cable, A general lead wire etc. may be sufficient.
　素体が、絶縁体層が積層された積層素体であることが好ましい。この場合には、絶縁体層の両主面間を貫通させてビア導体を形成するとともに、絶縁体層の層間に線路導体を形成し、ビア導体と線路導体とを使って、配線電極を積層素体の内部に容易に形成することができる。 The element body is preferably a laminated element body in which insulator layers are laminated. In this case, a via conductor is formed by passing between both main surfaces of the insulator layer, a line conductor is formed between the layers of the insulator layer, and a wiring electrode is laminated using the via conductor and the line conductor. It can be easily formed inside the element body.
　素体が、セラミックであることが好ましい。この場合には、耐熱性に優れたインターポーザを作製することができる。 The element body is preferably a ceramic. In this case, an interposer with excellent heat resistance can be produced.
　素体の外表面に金属シールドが形成されることも好ましい。この場合には、金属シールドによって、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズを抑制することができる。 It is also preferable that a metal shield be formed on the outer surface of the element body. In this case, the metal shield can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside.
　上記の場合において、素体が、底面および傾斜面以外に、１つ以上の側面を備え、金属シールドが、側面の、全面または一部分に形成されることも好ましい。また、素体が、底面および傾斜面以外に、天面および１つ以上の側面を備え、金属シールドが、天面および側面の、全面または一部分に形成されることも好ましい。さらに、金属シールドが、素体の側面の外周を一回りするように形成されることも好ましい。これらの場合には、ノイズの放射や浸入を効果的に抑制することができる。 In the above case, it is also preferable that the element body has one or more side surfaces in addition to the bottom surface and the inclined surface, and the metal shield is formed on the entire side surface or a part of the side surface. In addition to the bottom surface and the inclined surface, the element body preferably includes a top surface and one or more side surfaces, and the metal shield is preferably formed on the entire surface or a part of the top surface and the side surfaces. Furthermore, it is also preferable that the metal shield is formed so as to go around the outer periphery of the side surface of the element body. In these cases, noise emission and penetration can be effectively suppressed.
　なお、上記において、側面が１つの場合とは、たとえば、素体が円柱状などである場合が該当する。 In addition, in the above, the case where there is one side corresponds to, for example, the case where the element body is cylindrical.
　素体が磁性体からなることも好ましい。この場合には、インターポーザに、ノイズの通過を抑制する、いわゆる磁性ビーズインダクタ（磁性体がフェライトである場合はフェライトビーズインダクタ）の機能をもたせることができる。 It is also preferable that the element body is made of a magnetic material. In this case, the interposer can have a function of a so-called magnetic bead inductor (a ferrite bead inductor when the magnetic material is ferrite) that suppresses the passage of noise.
　素体が、複数の絶縁体層が積層された積層素体からなり、絶縁体層の一部が磁性体からなるようにしても良い。すなわち、素体全体を磁性体にしなくても、素体を複数の絶縁体層が積層された積層素体とし、絶縁体層の一部を磁性体にしても、インターポーザに、磁性ビーズインダクタ（磁性体がフェライトである場合はフェライトビーズインダクタ）の機能をもたせることができる。 The element body may be made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer may be made of a magnetic substance. That is, even if the entire element body is not a magnetic body, the element body is a laminated element body in which a plurality of insulator layers are stacked, and even if a part of the insulator layer is a magnetic body, a magnetic bead inductor ( When the magnetic material is ferrite, the function of a ferrite bead inductor) can be provided.
　本発明のインターポーザを回路基板に実装し、インターポーザの接続用端子電極にフラットケーブルなどの配線部材を接続して、電子機器を作製することができる。より具体的には、たとえば、第１のインターポーザと、第２のインターポーザと、第１のインターポーザを実装した第１の回路基板と、第２のインターポーザを実装した第２の回路基板と、を備え、フラットケーブルなどの配線部材により、第１のインターポーザの接続用端子電極と、第２のインターポーザの接続用端子電極とを接続し、電子機器を作製することができる。この場合には、フラットケーブルなどの途中での折り曲げをなくしたり、フラットケーブルなどの途中での折り曲げの大きさ（折り曲げ量）を小さくしたりすることができる。　 The electronic device can be manufactured by mounting the interposer of the present invention on a circuit board and connecting a wiring member such as a flat cable to the connection terminal electrode of the interposer. More specifically, for example, a first interposer, a second interposer, a first circuit board on which the first interposer is mounted, and a second circuit board on which the second interposer is mounted are provided. By using a wiring member such as a flat cable, the connection terminal electrode of the first interposer and the connection terminal electrode of the second interposer can be connected to manufacture an electronic device. In this case, it is possible to eliminate bending in the middle of the flat cable or the like, or to reduce the amount of bending (bending amount) in the middle of the flat cable or the like. *
　第１のインターポーザが配置された高さと、第２のインターポーザが配置された高さとは、等しくても良い。あるいは、第１のインターポーザが配置された高さと、第２のインターポーザが配置された高さとは、異なっていても良い。たとえば、第１の回路基板および第２の回路基板が、それぞれ、上側主面と下側主面とを備え、第１の回路基板の上側主面に第１のインターポーザが実装され、第２の回路基板の下側主面に第２のインターポーザが実装されるようにしても良い。 The height at which the first interposer is arranged may be equal to the height at which the second interposer is arranged. Alternatively, the height at which the first interposer is arranged may be different from the height at which the second interposer is arranged. For example, each of a first circuit board and a second circuit board includes an upper main surface and a lower main surface, the first interposer is mounted on the upper main surface of the first circuit board, and the second A second interposer may be mounted on the lower main surface of the circuit board.
　上記の場合において、配線部材が、フラットケーブルであることも好ましい。この場合には、接続端子への配線部材の接続が容易になる。 In the above case, the wiring member is preferably a flat cable. In this case, the connection of the wiring member to the connection terminal is facilitated.
　インターポーザが、少なくとも１つの側面を備え、当該側面に金属シールドが形成され、当該インターポーザの金属シールドが形成された側面に隣接して、回路基板上に、電子部品が実装され、金属シールドが、底面から、電子部品の高さよりも高い位置まで、側面を覆っていることも好ましい。この場合には、インターポーザが放射させたノイズが隣接する電子部品に浸入して影響を与えること、隣接する電子部品が放射させたノイズがインターポーザに侵入して影響を与えることを、効果的に抑制することができる。 The interposer has at least one side surface, a metal shield is formed on the side surface, an electronic component is mounted on the circuit board adjacent to the side surface on which the metal shield of the interposer is formed, and the metal shield is formed on the bottom surface It is also preferable that the side surface is covered up to a position higher than the height of the electronic component. In this case, it is possible to effectively suppress the noise radiated by the interposer from entering and affecting adjacent electronic components and the noise radiated by the adjacent electronic components from entering and affecting the interposer. can do.
　また、インターポーザが、少なくとも１つの側面を備え、当該側面に金属シールドが形成され、金属シールドが、素体の前記側面の外周を一回りするように形成されることも好ましい。この場合も、インターポーザからのノイズの放射や、インターポーザへのノイズの浸入を効果的に抑制することができる。 It is also preferable that the interposer includes at least one side surface, a metal shield is formed on the side surface, and the metal shield is formed so as to go around the outer periphery of the side surface of the element body. Also in this case, it is possible to effectively suppress noise emission from the interposer and noise intrusion into the interposer.
　本発明のインターポーザは、素体の上側面に、底面に対して斜めに配置された平面である傾斜面が設けられ、接続用端子電極が、傾斜面に設けられているため、フラットケーブルなどの配線部材や、基板や、電子部品などを、底面に対して斜めに接続することが可能である。そのため、本発明のインターポーザを使用すれば、たとえば、フラットケーブルなどの途中での折り曲げをなくしたり、フラットケーブルなどの途中での折り曲げの大きさ（折り曲げ量）を小さくしたりすることができる。 The interposer of the present invention is provided with an inclined surface, which is a plane arranged obliquely with respect to the bottom surface, on the upper side surface of the element body, and the connection terminal electrode is provided on the inclined surface. Wiring members, substrates, electronic components, and the like can be connected obliquely to the bottom surface. Therefore, if the interposer of the present invention is used, for example, it is possible to eliminate bending in the middle of a flat cable or the like, or to reduce the amount of bending (bending amount) in the middle of a flat cable or the like.
　本発明の電子機器は、本発明のインターポーザを使用しているため、フラットケーブルなどの配線部材の途中での折り曲げがない、あるいは、フラットケーブルなどの配線部材の途中での折り曲げの大きさ（折り曲げ量）の小さいものになっている。 Since the electronic device of the present invention uses the interposer of the present invention, there is no bending in the middle of a wiring member such as a flat cable, or the size of folding in the middle of a wiring member such as a flat cable (bending) The amount is small.
実施形態１にかかるインターポーザ１００を示す斜視図である。1 is a perspective view showing an interposer 100 according to Embodiment 1. FIG. インターポーザ１００を示す断面図である。1 is a cross-sectional view showing an interposer 100. FIG. 実施形態１にかかる電子機器２００を示す断面図である。1 is a cross-sectional view illustrating an electronic device 200 according to a first embodiment. 電子機器２００を示す要部断面図である。2 is a cross-sectional view of a main part showing an electronic device 200. FIG. 実施形態２にかかるインターポーザ３００を示す断面図である。It is sectional drawing which shows the interposer 300 concerning Embodiment 2. FIG. 実施形態３にかかるインターポーザ４００を示す断面図である。It is sectional drawing which shows the interposer 400 concerning Embodiment 3. FIG. 実施形態４にかかるインターポーザ５００を示す断面図である。It is sectional drawing which shows the interposer 500 concerning Embodiment 4. FIG. 実施形態５にかかる電子機器６００を示す断面図である。FIG. 9 is a cross-sectional view showing an electronic apparatus 600 according to a fifth embodiment. 実施形態６にかかる電子機器７００を示す断面図である。FIG. 10 is a cross-sectional view illustrating an electronic apparatus 700 according to a sixth embodiment. 図１０（Ａ）は、実施形態７にかかるインターポーザ８００の斜視図である。図１０（Ｂ）は、インターポーザ８００の平面図である。FIG. 10A is a perspective view of an interposer 800 according to the seventh embodiment. FIG. 10B is a plan view of the interposer 800. 図１１（Ａ）は、実施形態８にかかるインターポーザ９００の斜視図である。図１１（Ｂ）は、インターポーザ９００の平面図である。FIG. 11A is a perspective view of an interposer 900 according to the eighth embodiment. FIG. 11B is a plan view of the interposer 900. 実施形態９にかかるインターポーザ１０００の斜視図である。10 is a perspective view of an interposer 1000 according to Embodiment 9. FIG. 実施形態１０にかかる電子機器１１００の正面図である。It is a front view of the electronic device 1100 concerning Embodiment 10. FIG. 実施形態１１にかかるインターポーザ１２００の断面図である。It is sectional drawing of the interposer 1200 concerning Embodiment 11. FIG. 実施形態１２にかかるインターポーザ１３００の断面図である。It is sectional drawing of the interposer 1300 concerning Embodiment 12. FIG. 図１６（Ａ）は、実施形態１３にかかるインターポーザ１４００の斜視図である。図１６（Ｂ）は、インターポーザ１４００の分解斜視図である。FIG. 16A is a perspective view of an interposer 1400 according to the thirteenth embodiment. FIG. 16B is an exploded perspective view of the interposer 1400. 図１７（Ａ）は、特許文献１に開示された電子機器１５００の側面断面図である。図１７（Ｂ）は、電子機器１５００の平面断面図である。FIG. 17A is a side cross-sectional view of the electronic device 1500 disclosed in Patent Document 1. FIG. FIG. 17B is a cross-sectional plan view of the electronic device 1500.
　以下、図面とともに、本発明を実施するための形態について説明する。 Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
　なお、各実施形態は、本発明の実施の形態を例示的に示したものであり、本発明が実施形態の内容に限定されることはない。また、異なる実施形態に記載された内容を組合せて実施することも可能であり、その場合の実施内容も本発明に含まれる。また、図面は、実施形態の理解を助けるためのものであり、必ずしも厳密に描画されていない場合がある。たとえば、描画された構成要素ないし構成要素間の寸法の比率が、明細書に記載されたそれらの寸法の比率と一致していない場合がある。また、明細書に記載されている構成要素が、図面において省略されている場合や、個数を省略して描画されている場合などがある。 Each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
　［実施形態１］
　図１、図２に、実施形態１にかかるインターポーザ１００を示す。また、図３、図４に、インターポーザ１００を使用して作製した実施形態１にかかる電子機器２００を示す。ただし、図１はインターポーザ１００の斜視図であり、図２はインターポーザ１００の断面図である。また、図３は電子機器２００の断面図であり、図４は電子機器２００の要部断面図である。 [Embodiment 1]
1 and 2 show an interposer 100 according to the first embodiment. 3 and 4 show an electronic apparatus 200 according to the first embodiment manufactured using the interposer 100. FIG. However, FIG. 1 is a perspective view of the interposer 100, and FIG. 2 is a cross-sectional view of the interposer 100. 3 is a cross-sectional view of the electronic device 200, and FIG.
　（インターポーザ１００）
　実施形態１にかかるインターポーザ１００は、積層素体１を備える。積層素体１は、３層の絶縁体層１ａ～１ｃが積層された構造である。積層素体１（絶縁体層１ａ～１ｃ）は、たとえば、ＬＴＣＣ（Low Temperature Co-fired Ceramics；低温同時焼成セラミック）などのセラミックによって作製されている。 (Interposer 100)
The interposer 100 according to the first embodiment includes the multilayer body 1. The multilayer body 1 has a structure in which three insulator layers 1a to 1c are laminated. The multilayer body 1 (insulator layers 1a to 1c) is made of a ceramic such as LTCC (Low Temperature Co-fired Ceramics).
　積層素体１は、天面ＴＳ（Top Surface）と、底面ＢＳ（Bottom Surface）と、４つの側面ＳＳ（Side Surface）とを備えている。さらに、積層素体１は、底面ＢＳに対して斜めに配置された平面である傾斜面ＩＳ（Inclined Surface）を備えている。傾斜面ＩＳは、天面ＴＳおよび３つの側面ＳＳと、それぞれ、交差している。 The multilayer body 1 includes a top surface TS (Top surface), a bottom surface BS (Bottom surface), and four side surfaces SS (Side surface). Furthermore, the multilayer body 1 includes an inclined surface IS (Inclined Surface) which is a plane disposed obliquely with respect to the bottom surface BS. The inclined surface IS intersects the top surface TS and the three side surfaces SS, respectively.
　絶縁体層１ａ～１ｃを貫通して、ビア導体２が形成されている。また、絶縁体層１ａ～１ｃの層間に、線路導体３が形成されている。そして、ビア導体２と線路導体３とを使って、積層素体１の内部に、配線電極が形成されている。ビア導体２、線路導体３は、それぞれ、たとえば、銅、銀、これらを含む合金などによって形成されている。 Via conductors 2 are formed through the insulator layers 1a to 1c. A line conductor 3 is formed between the insulator layers 1a to 1c. A wiring electrode is formed inside the multilayer body 1 using the via conductor 2 and the line conductor 3. The via conductor 2 and the line conductor 3 are each formed of, for example, copper, silver, an alloy containing these, or the like.
　積層素体１の底面ＢＳに、回路基板に接続される回路基板用端子電極４が形成されている。回路基板用端子電極４は、たとえば、銅、銀、これらを含む合金などによって形成されている。回路基板用端子電極４の表面に、めっき層４ａが形成されている。めっき層４ａは、たとえば、第１層がニッケル、第２層が金、銅、錫などから選ばれる金属によって多層構造に形成されている。 A circuit board terminal electrode 4 connected to the circuit board is formed on the bottom surface BS of the multilayer body 1. The circuit board terminal electrode 4 is formed of, for example, copper, silver, an alloy containing these, or the like. A plating layer 4 a is formed on the surface of the circuit board terminal electrode 4. The plating layer 4a is formed in a multilayer structure, for example, with a metal selected from nickel for the first layer and gold, copper, tin, etc. for the second layer.
　積層素体１の傾斜面ＩＳに、フラットケーブルなどに接続される接続用端子電極５が形成されている。本実施形態においては、積層素体１の傾斜面ＩＳから露出したビア導体２を、そのまま、接続用端子電極５として利用した。接続用端子電極５の表面に、めっき層５ａが形成されている。めっき層５ａは、たとえば、第１層がニッケル、第２層が金、銅、錫などから選ばれる金属によって多層構造に形成されている。 A connection terminal electrode 5 connected to a flat cable or the like is formed on the inclined surface IS of the multilayer body 1. In the present embodiment, the via conductor 2 exposed from the inclined surface IS of the multilayer body 1 is used as the connection terminal electrode 5 as it is. A plating layer 5 a is formed on the surface of the connection terminal electrode 5. The plated layer 5a is formed in a multilayer structure, for example, with a metal selected from nickel as the first layer and gold, copper, tin, and the like as the second layer.
　なお、接続用端子電極５に接続される対象は任意である。フラットケーブルなどの配線部材であっても良いし、基板であっても良いし、電子部品などであっても良い。また、配線部材である場合も、フラットケーブルには限られず、一般的なリード線などを接続しても良い。 The target connected to the connection terminal electrode 5 is arbitrary. It may be a wiring member such as a flat cable, a substrate, or an electronic component. Further, the wiring member is not limited to the flat cable, and a general lead wire or the like may be connected.
　回路基板用端子電極４と接続用端子電極５とが、積層素体１の内部において、上述した、ビア導体２と線路導体３とを使って形成した配線電極によって接続されている。 The circuit board terminal electrode 4 and the connection terminal electrode 5 are connected inside the multilayer body 1 by the wiring electrodes formed using the via conductor 2 and the line conductor 3 described above.
　インターポーザ１００は、回路基板用端子電極４を回路基板に形成された実装用電極に導電性接合材によって接続し、接続用端子電極５にフラットケーブルの端部に形成された接続用端子を導電性接合材によって接続して使用する。導電性接合材としては、たとえば、はんだや、導電性接着剤を使用することができる。 The interposer 100 connects the circuit board terminal electrode 4 to the mounting electrode formed on the circuit board with a conductive bonding material, and the connection terminal electrode 5 is electrically connected to the connection terminal formed at the end of the flat cable. Connect with a bonding material. As the conductive bonding material, for example, solder or a conductive adhesive can be used.
　インターポーザ１００は、接続用端子電極５が、底面ＢＳに対して斜めに配置された傾斜面ＩＳに設けられているため、接続されたフラットケーブルを、底面ＢＳに対して斜めに引き出すことが可能である。そのため、インターポーザ１００を使用すれば、フラットケーブルの途中での折り曲げをなくしたり、フラットケーブルの途中での折り曲げの大きさ（折り曲げ量）を小さくしたりすることができる。 In the interposer 100, since the connection terminal electrode 5 is provided on the inclined surface IS arranged obliquely with respect to the bottom surface BS, the connected flat cable can be drawn obliquely with respect to the bottom surface BS. is there. Therefore, if the interposer 100 is used, it is possible to eliminate bending in the middle of the flat cable, or to reduce the amount of bending (bending amount) in the middle of the flat cable.
　インターポーザ１００は、積層セラミック電子部品（積層セラミックコンデンサなど）の製造に使用されている積層セラミック技術を用いて、極めて小さな寸法に作製することができる。 The interposer 100 can be manufactured to an extremely small size by using a multilayer ceramic technology used for manufacturing a multilayer ceramic electronic component (such as a multilayer ceramic capacitor).
　インターポーザ１００は、たとえば、次に示す製造方法によって製造することができる。 The interposer 100 can be manufactured by the following manufacturing method, for example.
　（インターポーザ１００の製造方法１）
　まず、絶縁体層１ａ～１ｃを作製するためのセラミックのグリーンシートを用意する。グリーンシートは、多数のインターポーザ１００を一括して製造するように、多数個分がマトリックス状に配置されたマザーグリーンシートとして用意される。 (Manufacturing method 1 of interposer 100)
First, ceramic green sheets for preparing the insulator layers 1a to 1c are prepared. The green sheet is prepared as a mother green sheet in which a large number of interposers 100 are arranged in a matrix so as to manufacture a large number of interposers 100 at a time.
　各マザーグリーンシートに、ビア導体２を形成するための孔を形成する。孔の形成は、たとえば、レーザー光の照射によっておこなう。 A hole for forming the via conductor 2 is formed in each mother green sheet. The hole is formed by, for example, laser light irradiation.
　次に、各マザーグリーンシートに形成した孔に、導電性ペーストを充填する。続いて、各マザーグリーンシートの一方主面、または、両主面に、導電性ペーストを印刷して、線路導体３、回路基板用端子電極４を形成するための導電性ペーストパターンを形成する。 Next, the conductive paste is filled in the holes formed in each mother green sheet. Subsequently, a conductive paste pattern for forming the line conductor 3 and the circuit board terminal electrode 4 is formed by printing a conductive paste on one main surface or both main surfaces of each mother green sheet.
　次に、絶縁体層１ａを作製するためのマザーグリーンシート、絶縁体層１ｂを作製するためのマザーグリーンシート、絶縁体層１ｃを作製するためのマザーグリーンシートを順番に積層し、加圧して一体化させ、未焼成マザー積層素体を作製する。 Next, a mother green sheet for producing the insulator layer 1a, a mother green sheet for producing the insulator layer 1b, and a mother green sheet for producing the insulator layer 1c are sequentially laminated and pressed. The green mother laminated body is made by integrating.
　次に、未焼成マザー積層素体を、個々の未焼成積層素体に分割する。分割は、たとえば、分割ラインをダイサーで削ることによっておこなう。分割された個々の未焼成積層素体は、天面ＴＳと、底面ＢＳと、４つの側面ＳＳとを備えた直方体形状になっている。 Next, the unfired mother laminate body is divided into individual unfired laminate bodies. The division is performed by, for example, cutting the division line with a dicer. Each of the divided unfired laminated bodies has a rectangular parallelepiped shape including a top surface TS, a bottom surface BS, and four side surfaces SS.
　次に、未焼成積層素体を固定し、未焼成積層素体にレーザー光を照射して、未焼成積層素体に傾斜面ＩＳを形成する。傾斜面ＩＳを形成した後に、未焼成積層素体をバレル研磨しても良い。 Next, the unfired multilayer body is fixed, and the unfired multilayer body is irradiated with laser light to form the inclined surface IS on the unfired multilayer body. After forming the inclined surface IS, the unfired laminated body may be barrel-polished.
　次に、未焼成積層素体を、所定のプロファイルで焼成して、積層素体１を作製する。積層素体１の底面ＢＳには、回路基板用端子電極４が形成されている。また、積層素体１の傾斜面ＩＳには、接続用端子電極５（露出したビア導体２の端面）が形成されている。 Next, the unfired multilayer body is fired with a predetermined profile to produce the multilayer body 1. A circuit board terminal electrode 4 is formed on the bottom surface BS of the multilayer body 1. Further, on the inclined surface IS of the multilayer body 1, a connection terminal electrode 5 (an exposed end surface of the via conductor 2) is formed.
　次に、たとえば電解めっきにより、回路基板用端子電極４の表面にめっき層４ａ、接続用端子電極５の表面にめっき層５ａを形成して、インターポーザ１００を完成させる。 Next, the plating layer 4a is formed on the surface of the circuit board terminal electrode 4 and the plating layer 5a is formed on the surface of the connection terminal electrode 5, for example, by electrolytic plating, thereby completing the interposer 100.
　（インターポーザ１００の製造方法２）
　インターポーザ１００の製造方法２は、製造方法１の一部の工程に変更を加えた。 (Manufacturing method 2 of interposer 100)
In the manufacturing method 2 of the interposer 100, a part of the manufacturing method 1 is changed.
　製造方法１では、個々に分割された後の未焼成積層素体に、レーザー光を照射して傾斜面ＩＳを形成していた。製造方法２では、これに代えて、未焼成マザー積層素体を、個々の未焼成積層素体に分割する際に、必要に応じて、途中で、数度にわたって、ダイサーを取り換え、ダイサーの幅を徐々に大きくすることによって、分割された個々の未焼成積層素体に傾斜面ＩＳを形成するようにした。 In the manufacturing method 1, the unsintered laminated body after being divided individually was irradiated with laser light to form the inclined surface IS. In manufacturing method 2, instead of this, when the unfired mother laminated body is divided into individual unfired laminated bodies, the dicer is replaced several times along the way, if necessary, Is gradually increased to form the inclined surface IS in each of the divided unfired laminated bodies.
　なお、分割後に、未焼成積層素体をバレル研磨すれば、傾斜面ＩＳを平坦化させることができる。 In addition, if the unsintered laminated body is barrel-polished after the division, the inclined surface IS can be flattened.
　製造方法２の他の工程は、製造方法１と同じにした。 Other steps of manufacturing method 2 were the same as manufacturing method 1.
　（インターポーザ１００の製造方法３）
　インターポーザ１００の製造方法３も、製造方法１の一部の工程に変更を加えた。 (Manufacturing method 3 of interposer 100)
Also in the manufacturing method 3 of the interposer 100, a part of the manufacturing method 1 is changed.
　製造方法１では、個々に分割された後の未焼成積層素体に、レーザー光を照射して傾斜面ＩＳを形成していた。製造方法３では、これに代えて、絶縁体層１ｂ、１ｃを作製するためのマザーグリーンシート、それぞれの、分割ライン部分に、分割ラインに沿って、傾斜面ＩＳを形成するための、幅の異なるライン状の窓（開口）を設けた。具体的には、絶縁体層１ｂを作製するためのマザーグリーンシートに、幅の小さいライン状の窓を設け、絶縁体層１ｃを作製するためのマザーグリーンシートに、幅の大きいライン状の窓を設けた。絶縁体層１ａを作製するためのマザーグリーンシートには、窓は設けなかった。 In the manufacturing method 1, the unsintered laminated body after being divided individually was irradiated with laser light to form the inclined surface IS. In the manufacturing method 3, instead of this, a mother green sheet for producing the insulator layers 1b and 1c, and a width for forming the inclined surface IS along the dividing line in each dividing line portion. Different line windows (openings) were provided. Specifically, a line-shaped window having a small width is provided on the mother green sheet for producing the insulator layer 1b, and a line-shaped window having a large width is provided on the mother green sheet for producing the insulator layer 1c. Was provided. No window was provided in the mother green sheet for producing the insulator layer 1a.
　そのようにした上で、絶縁体層１ａを作製するためのマザーグリーンシート、絶縁体層１ｂを作製するためのマザーグリーンシート、絶縁体層１ｃを作製するためのマザーグリーンシートを順番に積層し、加圧して一体化させ、未焼成マザー積層素体を作製すると、分割ライン部分に、傾斜面が形成される。そして、未焼成マザー積層素体を個々の未焼成積層素体に分割すると、分割ライン部分の傾斜面によって、個々の未焼成積層素体に傾斜面ＩＳが形成される。なお、分割後に、未焼成積層素体をバレル研磨して、傾斜面ＩＳを平坦化させることが好ましい。 After doing so, a mother green sheet for producing the insulator layer 1a, a mother green sheet for producing the insulator layer 1b, and a mother green sheet for producing the insulator layer 1c are sequentially laminated. When an unfired mother laminated body is produced by pressurizing and integrating, an inclined surface is formed in the dividing line portion. Then, when the unfired mother laminated body is divided into individual unfired laminated bodies, the inclined surface IS is formed in each unfired laminated body by the inclined surfaces of the dividing line portions. In addition, after the division, it is preferable that the unfired laminated body is barrel-polished to flatten the inclined surface IS.
　製造方法３の他の工程は、製造方法１と同じにした。 Other steps of manufacturing method 3 were the same as manufacturing method 1.
　なお、本実施形態では、積層素体１を３層の絶縁体層１ａ～１ｃによって構成したが、製造方法３は、積層素体１が、より多くの層数の絶縁体層によって構成されている場合に有効な製造方法である。 In the present embodiment, the multilayer body 1 is configured by the three insulator layers 1a to 1c. However, in the manufacturing method 3, the multilayer body 1 is configured by an insulator layer having a larger number of layers. This is an effective manufacturing method.
　（電子機器２００）
　インターポーザ１００を使用して、図３、図４に示す、実施形態１にかかる電子機器２００を作製した。電子機器２００は、たとえば、スマートフォン等の携帯型の電子機器である。なお、図３においては、微細な構成要素への符号の付与を省略している場合がある。 (Electronic device 200)
Using the interposer 100, the electronic device 200 according to the first embodiment shown in FIGS. 3 and 4 was manufactured. The electronic device 200 is, for example, a portable electronic device such as a smartphone. Note that in FIG. 3, provision of reference numerals to fine components may be omitted.
　電子機器２００は、筐体２１を備える。筐体２１は、たとえば、樹脂によって作製されている。 The electronic device 200 includes a housing 21. The casing 21 is made of, for example, resin.
　筐体２１の内部に、第１の回路基板２２と、第２の回路基板２３と、第３の回路基板２４と、バッテリーパック２５とが収容されている。 A first circuit board 22, a second circuit board 23, a third circuit board 24, and a battery pack 25 are accommodated in the housing 21.
　バッテリーパック２５は、筐体２１の内壁に固定されている。第１の回路基板２２は、バッテリーパック２５上に固定されている。第２の回路基板２３および第３の回路基板２４は、それぞれ、筐体２１の内壁に固定されている。 The battery pack 25 is fixed to the inner wall of the casing 21. The first circuit board 22 is fixed on the battery pack 25. The second circuit board 23 and the third circuit board 24 are each fixed to the inner wall of the housing 21.
　第１の回路基板２２、第２の回路基板２３、第３の回路基板２４には、それぞれ、半導体装置、キャパシタ、抵抗、インダクタなどの電子部品２６が実装されている。なお、電子部品２６の実装は、回路基板２２～２４の主面に形成された実装用電極２７と、電子部品２６の端子電極とを、はんだや、導電性接着剤などの導電性接合材２８によって接合することによっておこなわれている。 Electronic components 26 such as semiconductor devices, capacitors, resistors, and inductors are mounted on the first circuit board 22, the second circuit board 23, and the third circuit board 24, respectively. In mounting the electronic component 26, the mounting electrode 27 formed on the main surfaces of the circuit boards 22 to 24 and the terminal electrode of the electronic component 26 are connected to a conductive bonding material 28 such as solder or a conductive adhesive. It is done by joining by.
　また、第１の回路基板２２に第１のインターポーザ１００Ａが実装され、第２の回路基板２３に第２のインターポーザ１００Ｂが実装されている。インターポーザ１００Ａ、１００Ｂは、それぞれ、上述した、実施形態１にかかるインターポーザ１００である。 Also, the first interposer 100A is mounted on the first circuit board 22, and the second interposer 100B is mounted on the second circuit board 23. Each of the interposers 100A and 100B is the interposer 100 according to the first embodiment described above.
　インターポーザ１００Ａ、１００Ｂの実装は、回路基板２２、２３の主面に形成された実装用電極２７と、インターポーザ１００Ａ、１００Ｂの回路基板用端子電極４とを、はんだや、導電性接着剤などの導電性接合材２８によって接合することによっておこなわれている。すなわち、インターポーザ１００Ａ、１００Ｂは、他の電子部品２６と同様の方法によって、同時に、回路基板２２、２３に実装されたものである。 The interposers 100A and 100B are mounted by connecting the mounting electrodes 27 formed on the main surfaces of the circuit boards 22 and 23 and the circuit board terminal electrodes 4 of the interposers 100A and 100B with a conductive material such as solder or a conductive adhesive. This is performed by bonding with the adhesive bonding material 28. That is, the interposers 100A and 100B are simultaneously mounted on the circuit boards 22 and 23 by the same method as the other electronic components 26.
　インターポーザ１００Ａとインターポーザ１００Ｂとが、フラットケーブル２９によって接続されている。より具体的には、フラットケーブル２９の両端に、それぞれ、接続端子３０が形成されており、インターポーザ１００Ａ、１００Ｂの接続用端子電極５と、フラットケーブル２９の接続端子３０とが、はんだや、導電性接着剤などの導電性接合材２８によって接合されている。 The interposer 100A and the interposer 100B are connected by a flat cable 29. More specifically, connection terminals 30 are formed at both ends of the flat cable 29, and the connection terminal electrodes 5 of the interposers 100A and 100B and the connection terminal 30 of the flat cable 29 are connected by solder or conductive. Bonded by a conductive bonding material 28 such as a conductive adhesive.
　電子機器２００では、インターポーザ１００Ａとインターポーザ１００Ｂとが、筐体２１の内部において、異なる高さ位置に配置されている。 In the electronic device 200, the interposer 100 </ b> A and the interposer 100 </ b> B are arranged at different height positions inside the housing 21.
　電子機器２００は、インターポーザ１００Ａとインターポーザ１００Ｂとを接続するフラットケーブル２９が折り曲げられていないため、フラットケーブル２９が断線しにくく、また、フラットケーブル２９の信号導体のインピーダンスがずれて挿入損失が大きくなることがない。 In the electronic device 200, since the flat cable 29 that connects the interposer 100A and the interposer 100B is not bent, the flat cable 29 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 29 is shifted to increase insertion loss. There is nothing.
　［実施形態２（インターポーザ３００）］
　図５に、実施形態２にかかるインターポーザ３００を示す。ただし、図５はインターポーザ３００の断面図である。 [Embodiment 2 (interposer 300)]
FIG. 5 shows an interposer 300 according to the second embodiment. However, FIG. 5 is a cross-sectional view of the interposer 300.
　インターポーザ３００は、実施形態１にかかるインターポーザ１００の構成の一部を変更した。 The interposer 300 has changed a part of the configuration of the interposer 100 according to the first embodiment.
　インターポーザ１００では、積層素体１の傾斜面ＩＳに露出したビア導体２を、そのまま、接続用端子電極５として利用していた。インターポーザ３００は、これに代えて、傾斜面ＩＳに、別途、接続用端子電極１５を形成した。そして、接続用端子電極１５の表面に、めっき層１５ａを形成した。なお、接続用端子電極１５は、ビア導体２に接続されている。 In the interposer 100, the via conductor 2 exposed on the inclined surface IS of the multilayer body 1 is used as it is as the connection terminal electrode 5. In place of this, the interposer 300 has the connection terminal electrode 15 separately formed on the inclined surface IS. A plating layer 15 a was formed on the surface of the connection terminal electrode 15. The connection terminal electrode 15 is connected to the via conductor 2.
　接続用端子電極１５は、未焼成積層素体の傾斜面ＩＳに導電性ペーストを印刷してパターンを形成しておき、その上で、未焼成積層素体を焼成し、積層素体１を作製することによって形成することができる。 The connection terminal electrode 15 is formed by printing a conductive paste on the inclined surface IS of the unfired laminated body to form a pattern, and then firing the unfired laminated body to produce the laminated body 1. Can be formed.
　インターポーザ３００の他の構成は、インターポーザ１００と同じにした。 The other configuration of the interposer 300 is the same as that of the interposer 100.
　［実施形態３（インターポーザ４００）］
　図６に、実施形態３にかかるインターポーザ４００を示す。ただし、図６はインターポーザ４００の断面図である。 [Embodiment 3 (interposer 400)]
FIG. 6 shows an interposer 400 according to the third embodiment. However, FIG. 6 is a cross-sectional view of the interposer 400.
　インターポーザ４００は、実施形態１にかかるインターポーザ１００の構成の一部を変更した。 The interposer 400 has changed a part of the configuration of the interposer 100 according to the first embodiment.
　インターポーザ１００では、積層素体１が、天面ＴＳと、底面ＢＳと、４つの側面ＳＳと、傾斜面ＩＳとを備えていた。インターポーザ４００は、これらのうち、天面ＴＳをなくし、積層素体４１を、底面ＢＳと、４つの側面ＳＳと、傾斜面ＩＳとを備える形状にした。積層素体４１は、底面ＢＳに対して平行に配置された天面ＴＳを備えておらず、代わりに、傾斜面ＩＳの面積が、積層素体１の傾斜面ＩＳよりも大きくなっている。なお、積層素体４１は、３層の絶縁体層４１ａ～４１ｃを積層した構造である。 In the interposer 100, the multilayer body 1 was provided with a top surface TS, a bottom surface BS, four side surfaces SS, and an inclined surface IS. Of these, the interposer 400 eliminates the top surface TS, and the laminated body 41 has a shape including a bottom surface BS, four side surfaces SS, and an inclined surface IS. The multilayer body 41 does not include the top surface TS arranged in parallel with the bottom surface BS, and instead, the area of the inclined surface IS is larger than the inclined surface IS of the multilayer body 1. The multilayer body 41 has a structure in which three insulator layers 41a to 41c are laminated.
　また、インターポーザ４００は、上記変更にともない、積層素体４１の内部の、ビア導体２と線路導体３とを使って形成した配線電極の構造を、インターポーザ１００から変更した。 In addition, the interposer 400 has changed the structure of the wiring electrode formed using the via conductor 2 and the line conductor 3 inside the multilayer body 41 from the interposer 100 in accordance with the above change.
　インターポーザ４００の他の構成は、インターポーザ１００と同じにした。 The other configuration of the interposer 400 is the same as that of the interposer 100.
　［実施形態４（インターポーザ５００）］
　図７に、実施形態４にかかるインターポーザ５００を示す。ただし、図７はインターポーザ５００の断面図である。 [Embodiment 4 (interposer 500)]
FIG. 7 shows an interposer 500 according to the fourth embodiment. 7 is a cross-sectional view of the interposer 500.
　インターポーザ５００は、実施形態３にかかるインターポーザ４００の構成を、さらに変更した。 The interposer 500 further changes the configuration of the interposer 400 according to the third embodiment.
　インターポーザ４００は、３層の絶縁体層４１ａ～４１ｃが積層された構造の積層素体４１を備えていた。これに対し、インターポーザ５００は、積層素体４１に代えて、単体ブロック状の素体５１を備えている。素体５１も、セラミックなどの絶縁体によって作製されている。 The interposer 400 was provided with a laminated body 41 having a structure in which three insulating layers 41a to 41c were laminated. In contrast, the interposer 500 includes a single block-shaped element body 51 instead of the laminated element body 41. The element body 51 is also made of an insulator such as ceramic.
　また、インターポーザ５００は、上記変更にともない、素体５１の内部の配線電極を、ビア導体２のみで構成し、線路導体３を省略した。 Further, in accordance with the above change, the interposer 500 includes the wiring electrode inside the element body 51 only by the via conductor 2 and omits the line conductor 3.
　インターポーザ５００の他の構成は、インターポーザ１００と同じにした。 The other configuration of the interposer 500 is the same as that of the interposer 100.
　［実施形態５（電子機器６００）］
　図８に、実施形態５にかかる電子機器６００を示す。ただし、図８は電子機器６００の断面図である。 [Embodiment 5 (electronic device 600)]
FIG. 8 shows an electronic apparatus 600 according to the fifth embodiment. However, FIG. 8 is a cross-sectional view of the electronic apparatus 600.
　電子機器６００は、筐体６１を備える。 The electronic device 600 includes a housing 61.
　筐体６１の内部に、第１の回路基板６２と、第２の回路基板６３と、バッテリーパック６５とが収容されている。 A first circuit board 62, a second circuit board 63, and a battery pack 65 are accommodated in the housing 61.
　第１の回路基板６２、第２の回路基板６３、バッテリーパック６５は、それぞれ、筐体６１の内壁に固定されている。 The first circuit board 62, the second circuit board 63, and the battery pack 65 are fixed to the inner wall of the casing 61, respectively.
　第１の回路基板６２、第２の回路基板６３には、それぞれ、電子部品２６が実装されている。 Electronic components 26 are mounted on the first circuit board 62 and the second circuit board 63, respectively.
　また、第１の回路基板６２に第１のインターポーザ１００Ａが実装され、第２の回路基板６３に第２のインターポーザ１００Ｂが実装されている。 Also, the first interposer 100A is mounted on the first circuit board 62, and the second interposer 100B is mounted on the second circuit board 63.
　インターポーザ１００Ａとインターポーザ１００Ｂとが、フラットケーブル６９によって接続されている。なお、フラットケーブル６９は、バッテリーパック６５の天面上を経由して、インターポーザ１００Ａとインターポーザ１００Ｂとを接続している。 Interposer 100A and interposer 100B are connected by a flat cable 69. The flat cable 69 connects the interposer 100A and the interposer 100B via the top surface of the battery pack 65.
　電子機器６００では、インターポーザ１００Ａとインターポーザ１００Ｂとが、筐体６１の内部において、同じ高さ位置に配置されている。 In the electronic device 600, the interposer 100 </ b> A and the interposer 100 </ b> B are arranged at the same height in the housing 61.
　電子機器６００では、フラットケーブル６９がインターポーザ１００Ａとインターポーザ１００Ｂそれぞれから曲げずに引き出されている。すなわち、は、インターポーザ１００Ａとインターポーザ１００Ｂとを接続するフラットケーブル６９の折り曲げの大きさ（折り曲げ量）が小さいため、フラットケーブル３９が断線しにくく、また、フラットケーブル３９の信号導体のインピーダンスがずれて挿入損失が大きくなることがない。 In the electronic device 600, the flat cable 69 is pulled out from the interposer 100A and the interposer 100B without being bent. That is, because the flat cable 69 that connects the interposer 100A and the interposer 100B has a small bending amount (bending amount), the flat cable 39 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 39 is shifted. Insertion loss does not increase.
　［実施形態６（電子機器７００）］
　図９に、実施形態６にかかる電子機器７００を示す。ただし、図９は電子機器７００の断面図である。 [Embodiment 6 (electronic device 700)]
FIG. 9 shows an electronic apparatus 700 according to the sixth embodiment. Note that FIG. 9 is a cross-sectional view of the electronic device 700.
　電子機器７００は、筐体７１を備える。 The electronic device 700 includes a housing 71.
　筐体７１の内部に、第１の回路基板７２と、第２の回路基板７３と、バッテリーパック７５とが収容されている。 A first circuit board 72, a second circuit board 73, and a battery pack 75 are accommodated in the housing 71.
　第１の回路基板７２の上側主面に、電子部品２６が実装されている。また、第２の回路基板７３の上下両主面に、それぞれ、電子部品２６が実装されている。 The electronic component 26 is mounted on the upper main surface of the first circuit board 72. In addition, electronic components 26 are mounted on the upper and lower main surfaces of the second circuit board 73, respectively.
　バッテリーパック７５が、筐体７１の内壁に固定されている。そして、第１の回路基板７２が、バッテリーパック７５上に固定されている。 The battery pack 75 is fixed to the inner wall of the casing 71. The first circuit board 72 is fixed on the battery pack 75.
　第２の回路基板７３は、筐体７１の内部に、宙に浮かせた状態で固定されている。 The second circuit board 73 is fixed inside the casing 71 in a suspended state.
　第１の回路基板７２の上側主面に、第１のインターポーザ１００Ａが実装されている。また、第２の回路基板７３の下側主面に、第２のインターポーザ１００Ｂが実装されている。 The first interposer 100A is mounted on the upper main surface of the first circuit board 72. The second interposer 100B is mounted on the lower main surface of the second circuit board 73.
　インターポーザ１００Ａとインターポーザ１００Ｂとが、フラットケーブル７９によって接続されている。 Interposer 100A and interposer 100B are connected by a flat cable 79.
　電子機器７００では、インターポーザ１００Ａとインターポーザ１００Ｂとが、筐体７１の内部において、異なる高さ位置に配置されている。 In the electronic device 700, the interposer 100A and the interposer 100B are arranged at different height positions inside the casing 71.
　電子機器７００は、インターポーザ１００Ａとインターポーザ１００Ｂとを接続するフラットケーブル７９が折り曲げられていないため、フラットケーブル７９が断線しにくく、また、フラットケーブル７９の信号導体のインピーダンスがずれて挿入損失が大きくなることがない。 In the electronic device 700, since the flat cable 79 that connects the interposer 100A and the interposer 100B is not bent, the flat cable 79 is difficult to be disconnected, and the impedance of the signal conductor of the flat cable 79 is shifted to increase insertion loss. There is nothing.
　このように、インターポーザ１００Ａ、インターポーザ１００Ｂ、フラットケーブル７９を使って、第１の回路基板７２の上側主面と、第２の回路基板７３の下側主面とを接続することも可能である。 In this way, it is possible to connect the upper main surface of the first circuit board 72 and the lower main surface of the second circuit board 73 using the interposer 100A, the interposer 100B, and the flat cable 79.
　［実施形態７（インターポーザ８００）］
　図１０（Ａ）、（Ｂ）に、それぞれ、実施形態７にかかるインターポーザ８００を示す。ただし、図１０（Ａ）は、インターポーザ８００の斜視図である。図１０（Ｂ）は、インターポーザ８００の平面図である。 [Embodiment 7 (Interposer 800)]
FIGS. 10A and 10B show an interposer 800 according to the seventh embodiment. However, FIG. 10A is a perspective view of the interposer 800. FIG. 10B is a plan view of the interposer 800.
　インターポーザ８００は、実施形態１にかかるインターポーザ１００に、新たな構成を追加した。具体的には、インターポーザ１００の積層素体１の４つの側面ＳＳに、金属シールド３６を形成した。 The interposer 800 has a new configuration added to the interposer 100 according to the first embodiment. Specifically, the metal shield 36 was formed on the four side surfaces SS of the multilayer body 1 of the interposer 100.
　金属シールド３６は、積層素体１の４つの側面ＳＳに、それぞれ、底面ＢＳと接する辺に沿って、一定の幅で形成されている。この結果、本実施形態においては、金属シールド３６は、１つの側面ＳＳの全面に形成され、３つの側面ＳＳにそれぞれ部分的に形成されている。 The metal shield 36 is formed on each of the four side surfaces SS of the multilayer body 1 with a certain width along the side in contact with the bottom surface BS. As a result, in the present embodiment, the metal shield 36 is formed on the entire surface of the one side surface SS, and is partially formed on each of the three side surfaces SS.
　金属シールド５１の材質および構成は任意であるが、たとえば、Ｔｉ、Ｎｉ、Ｃｒ、ＳＵＳ、Ｃｕ、Ａｌ、Ａｇ、またはそれらの合金によって形成することができる。また、Ｔｉ、Ｎｉ、Ｃｒ、ＳＵＳ、またはそれらの合金からなる密着層、Ｃｕ、Ａｌ、Ａｇ、またはそれらの合金からなる導電層、Ｔｉ、Ｎｉ、Ｃｒ、ＳＵＳ、またはそれらの合金からなる耐食層の３層構造に形成することができる。密着層は素体１と親和性が高く剥離しにくい材質であることが望ましく、導電層は導電率が高い材質であることが望ましく、耐食層は酸化や腐食に強い材質であることが望ましい。 The material and configuration of the metal shield 51 are arbitrary, but can be formed of, for example, Ti, Ni, Cr, SUS, Cu, Al, Ag, or an alloy thereof. Further, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, and a corrosion-resistant layer made of Ti, Ni, Cr, SUS, or an alloy thereof The three-layer structure can be formed. The adhesion layer is preferably made of a material having high affinity with the element body 1 and hardly peeled off, the conductive layer is preferably made of a material having high conductivity, and the corrosion-resistant layer is preferably made of a material resistant to oxidation and corrosion.
　金属シールド３６は、図示を省略するが、配線電極（ビア導体２、線路導体３）を経由して、回路基板用端子電極４に接続されている。したがって、当該回路基板用端子電極４をグランド電位に接続することによって、金属シールド３６をグランド電位に接続することができる。 Although not shown, the metal shield 36 is connected to the circuit board terminal electrode 4 via wiring electrodes (via conductor 2 and line conductor 3). Therefore, the metal shield 36 can be connected to the ground potential by connecting the circuit board terminal electrode 4 to the ground potential.
　金属シールド３６は、たとえば、積層素体１の金属シールド３６を形成しない外表面にマスクをしたうえで、スパッタリングによって形成することができる。 The metal shield 36 can be formed, for example, by sputtering after masking the outer surface of the multilayer body 1 where the metal shield 36 is not formed.
　インターポーザ８００は、金属シールド３６によって、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズを抑制することができる。すなわち、インターポーザ８００は、金属シールド３６によって遮蔽されているため、ノイズを構成する磁界成分や電界成分の積層素体１の側面ＳＳの透過が抑制されており、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズが抑制されている。 The interposer 800 can suppress the noise radiated from the interposer to the outside and the noise entering the interposer from the outside by the metal shield 36. That is, since the interposer 800 is shielded by the metal shield 36, the transmission of the side surface SS of the laminated body 1 of the magnetic field component and electric field component constituting the noise is suppressed, and noise radiated to the outside from the interposer , Noise entering the interposer from the outside is suppressed.
　なお、インターポーザ８００は、積層素体１の４つの側面ＳＳの外周を一回りするように金属シールド３６が形成されており、高いノイズ遮蔽効果を備えている。 In the interposer 800, the metal shield 36 is formed so as to go around the outer periphery of the four side surfaces SS of the multilayer body 1 and has a high noise shielding effect.
　［実施形態８（インターポーザ９００）］
　図１１（Ａ）、（Ｂ）に、それぞれ、実施形態８にかかるインターポーザ９００を示す。ただし、図１１（Ａ）は、インターポーザ９００の斜視図である。図１１（Ｂ）は、インターポーザ９００の平面図である。 [Eighth embodiment (interposer 900)]
11A and 11B show an interposer 900 according to the eighth embodiment. However, FIG. 11A is a perspective view of the interposer 900. FIG. 11B is a plan view of the interposer 900.
　インターポーザ９００は、上述した実施形態７にかかるインターポーザ８００の構成の一部に変更を加えた。具体的には、インターポーザ８００は、積層素体１の４つの側面ＳＳに、それぞれ、底面ＢＳと接する辺に沿って、一定の幅で金属シールド３６を形成していた。インターポーザ９００は、これに変更を加え、積層素体１の４つの側面ＳＳの全面、および、天面ＴＳの全面に、金属シールド４６を形成した。 The interposer 900 has changed a part of the configuration of the interposer 800 according to the seventh embodiment described above. Specifically, in the interposer 800, the metal shields 36 are formed on the four side surfaces SS of the multilayer body 1 with a certain width along the sides in contact with the bottom surface BS. The interposer 900 is modified to form a metal shield 46 on the entire surface of the four side surfaces SS of the multilayer body 1 and the entire surface of the top surface TS.
　インターポーザ９００は、インターポーザ８００よりも、さらに優れたノイズ遮蔽効果を備えている。 The interposer 900 has a better noise shielding effect than the interposer 800.
　［実施形態９（インターポーザ１０００）］
　図１２に、実施形態９にかかるインターポーザ１０００を示す。ただし、図１２は、インターポーザ１０００の斜視図である。 [Embodiment 9 (interposer 1000)]
FIG. 12 shows an interposer 1000 according to the ninth embodiment. However, FIG. 12 is a perspective view of the interposer 1000.
　インターポーザ１０００は、上述した実施形態８にかかるインターポーザ９００の構成の一部に変更を加えた。具体的には、インターポーザ１０００は、金属シールド４６に加えて、積層素体１の傾斜面ＩＳの接続用端子電極５の周囲にも、金属シールド５６を形成した。 The interposer 1000 has changed a part of the configuration of the interposer 900 according to the above-described eighth embodiment. Specifically, in the interposer 1000, in addition to the metal shield 46, the metal shield 56 is also formed around the connection terminal electrode 5 on the inclined surface IS of the multilayer body 1.
　インターポーザ１０００は、インターポーザ９００よりも、さらに優れたノイズ遮蔽効果を備えている。 The interposer 1000 has a better noise shielding effect than the interposer 900.
　以上のように、実施形態７～９にかかるインターポーザ８００、９００、１００において、金属シールド３６、４６、５６の形成例を説明したが、積層素体１の外表面における金属シールドの形成位置は任意であり、上記の形成例には限定されない。ノイズ遮蔽効果を確認しながら、必要に応じて、適宜、形成位置を設定することができる。 As described above, in the interposers 800, 900, and 100 according to the seventh to ninth embodiments, examples of forming the metal shields 36, 46, and 56 have been described. However, the present invention is not limited to the above example. While confirming the noise shielding effect, the formation position can be appropriately set as necessary.
　［実施形態１０（電子機器１１００）］
　図１３に、実施形態１０にかかる電子機器１１００を示す。ただし、図１３は、電子機器１１００の正面図である。 [Embodiment 10 (electronic device 1100)]
FIG. 13 shows an electronic apparatus 1100 according to the tenth embodiment. However, FIG. 13 is a front view of the electronic device 1100.
　電子機器１１００は、回路基板６４に、上述した実施形態７にかかるインターポーザ８００が実装されている。また、電子機器１１００は、回路基板６４に、インターポーザ８００に隣接して、電子部品６７が実装されている。 In the electronic device 1100, the interposer 800 according to the seventh embodiment described above is mounted on the circuit board 64. In the electronic device 1100, an electronic component 67 is mounted on the circuit board 64 adjacent to the interposer 800.
　電子機器１１００は、積層素体１の電子部品６７に対向する側面ＳＳに形成された金属シールド３６の高さＨＳが、電子部品６７の高さＨＤよりも高くなっている。 The electronic device 1100, the height H S of the metal shield 36 formed on the side surface SS which faces the electronic component 67 of the laminated body 1 is higher than the height H D of the electronic component 67.
　仮に、金属シールド３６の高さＨＳが、電子部品６７の高さＨＤよりも低いと、金属シールド３６でノイズを十分に遮蔽することができず、電子部品６７の放射したノイズがインターポーザに影響を与えたり、インターポーザが放射したノイズが電子部品６７に影響を与えたりする虞があるが、電子機器１１０００では、金属シールド３６の高さＨＳが電子部品６７の高さＨＤよりも高いため、両者間でのノイズの影響が効果的に抑制されている。 If the height H S of the metal shield 36 is lower than the height H D of the electronic component 67, the noise cannot be sufficiently shielded by the metal shield 36, and the noise radiated from the electronic component 67 becomes an interposer. effect or apply, interposer there is a possibility that noise radiation or affect the electronic component 67, but in the electronic device 11000, the height H S of the metal shield 36 is greater than the height H D of the electronic component 67 Therefore, the influence of noise between the two is effectively suppressed.
　［実施形態１１（インターポーザ１２００）］
　図１４に、実施形態１１にかかるインターポーザ１２００を示す。ただし、図１４は、インターポーザ１２００の断面図である。 [Embodiment 11 (Interposer 1200)]
FIG. 14 shows an interposer 1200 according to the eleventh embodiment. However, FIG. 14 is a cross-sectional view of the interposer 1200.
　インターポーザ１２００は、実施形態１にかかるインターポーザ１００の構成の一部に変更を加えた。具体的には、インターポーザ１００では、積層素体１を構成する３層の絶縁体層１ａ～１ｃを非磁性体で作製していたが、インターポーザ１２００では、３層の絶縁体層１ａ～１ｄのうち、最下層に積層された絶縁体層１ａを、磁性体Ｚによって作製した。より具体的には、絶縁体層１ａを、フェライトからなる磁性体Ｚによって作製した。 The interposer 1200 has changed a part of the configuration of the interposer 100 according to the first embodiment. Specifically, in the interposer 100, the three insulator layers 1a to 1c constituting the multilayer body 1 are made of a non-magnetic material, but in the interposer 1200, the three insulator layers 1a to 1d are formed. Among them, the insulator layer 1a laminated on the lowermost layer was made of the magnetic body Z. More specifically, the insulator layer 1a was made of a magnetic material Z made of ferrite.
　インターポーザ１２００は、いわゆる磁性ビーズインダクタ（フェライトビーズインダクタ）の機能も兼有しており、インターポーザを通る信号に含まれるノイズの通過を抑制することができる。 The interposer 1200 also has a function of a so-called magnetic bead inductor (ferrite bead inductor), and can suppress passage of noise included in a signal passing through the interposer.
　［実施形態１２（インターポーザ１３００）］
　図１５に、実施形態１２にかかるインターポーザ１３００を示す。ただし、図１５は、インターポーザ１３００の斜視図である。 [Embodiment 12 (interposer 1300)]
FIG. 15 shows an interposer 1300 according to the twelfth embodiment. 15 is a perspective view of the interposer 1300.
　インターポーザ１３００は、上述した実施形態１１にかかるインターポーザ１２００の構成の一部に変更を加えた。具体的には、インターポーザ１２００では、積層素体１の最下層に積層された絶縁体層１ａを磁性体Ｚによって作製しが、インターポーザ１３００では、３層の絶縁体層１ａ～１ｃの全てを磁性体Ｚによって作製した。 The interposer 1300 has changed a part of the configuration of the interposer 1200 according to the eleventh embodiment. Specifically, in the interposer 1200, the insulator layer 1a laminated on the lowermost layer of the multilayer body 1 is made of the magnetic body Z. In the interposer 1300, all of the three insulator layers 1a to 1c are made magnetic. Made with body Z.
　インターポーザに磁性ビーズインダクタ（フェライトビーズインダクタ）の機能を兼有させる場合、インターポーザ１２００のように積層素体１を部分的に磁性体で作製しても良いし、インターポーザ１３００のように積層素体１の全体を磁性体で作製しても良い。 When the interposer also has the function of a magnetic bead inductor (ferrite bead inductor), the laminated element body 1 may be partially made of a magnetic substance like the interposer 1200, or the laminated element body 1 like the interposer 1300. The whole may be made of a magnetic material.
　インターポーザ１３００も、磁性ビーズインダクタ（フェライトビーズインダクタ）の機能を兼有している。 Interposer 1300 also has the function of a magnetic bead inductor (ferrite bead inductor).
　［実施形態１３（インターポーザ１４００）］
　図１６（Ａ）、（Ｂ）に、実施形態１３にかかるインターポーザ１４００を示す。ただし、図１６（Ａ）は、インターポーザ１４００の斜視図である。図１６（Ｂ）は、インターポーザ１４００の分解斜視図であり、金属シールド３６を除去した状態を示している。 [Embodiment 13 (Interposer 1400)]
FIGS. 16A and 16B show an interposer 1400 according to the thirteenth embodiment. 16A is a perspective view of the interposer 1400. FIG. FIG. 16B is an exploded perspective view of the interposer 1400 and shows a state where the metal shield 36 is removed.
　インターポーザ１４００は、上述した実施形態７にかかるインターポーザ８００の特長と、上述した実施形態１１にかかるインターポーザ１２００の特長とを組み合わせた。 The interposer 1400 combines the features of the interposer 800 according to the seventh embodiment and the features of the interposer 1200 according to the eleventh embodiment.
　具体的には、インターポーザ１４００は、インターポーザ１２００と同様に、積層素体１を構成する３層の絶縁体層１ａ～１ｃのうち、最下層に積層された絶縁体層１ａを磁性体Ｚによって作製した。また、インターポーザ１４００は、インターポーザ８００と同様に、積層素体１の４つの側面ＳＳに金属シールド３６を形成した。 Specifically, as with the interposer 1200, the interposer 1400 is formed by using the magnetic body Z, the insulator layer 1a laminated at the lowest layer among the three insulator layers 1a to 1c constituting the multilayer body 1. did. In the interposer 1400, the metal shield 36 is formed on the four side surfaces SS of the multilayer body 1 in the same manner as the interposer 800.
　インターポーザ１４００は、金属シールド３６を形成したことによって、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズが抑制されている。また、インターポーザ１４００は、素体１を構成する絶縁体層１ａを磁性体Ｚによって作製したことによって、いわゆる磁性ビーズインダクタ（フェライトビーズインダクタ）の機能を兼有している。 Since the interposer 1400 is formed with the metal shield 36, noise radiated from the interposer to the outside and noise entering the interposer from the outside are suppressed. Further, the interposer 1400 has the function of a so-called magnetic bead inductor (ferrite bead inductor) because the insulator layer 1a constituting the element body 1 is made of the magnetic body Z.
　以上、実施形態にかかるインターポーザ１００、３００、５００、８００、９００、１０００、１２００、１３００、１４００、電子機器２００、６００、７００、１１００について説明した。しかしながら、本発明が上述した内容に限定されることはなく、発明の趣旨に沿って、種々の変更をなすことができる。 As described above, the interposers 100, 300, 500, 800, 900, 1000, 1200, 1300, 1400 and the electronic devices 200, 600, 700, 1100 according to the embodiments have been described. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
　たとえば、インターポーザ１００、３００、４００、５００、８００、９００、１０００、１２００、１３００、１４００は、積層素体１、４１、素体５１を、セラミックによって作製したが、これらの材質は任意であり、樹脂など、他の材質によって作製しても良い。 For example, although the interposers 100, 300, 400, 500, 800, 900, 1000, 1200, 1300, and 1400 are made of the laminated element bodies 1 and 41 and the element body 51 using ceramics, these materials are arbitrary. You may produce with other materials, such as resin.
　また、インターポーザ１００、３００、４００、５００、８００、９００、１０００、１２００、１３００、１４００の積層素体１、４１、素体５１の傾斜面ＩＳの傾斜角度は任意であり、必要に応じて、変更することができる。 In addition, the inclination angle of the inclined surface IS of the laminated element bodies 1 and 41 and the element body 51 of the interposers 100, 300, 400, 500, 800, 900, 1000, 1200, 1300, and 1400 is arbitrary. Can be changed.
　また、電子機器２００、６００、７００、１１００は、スマートフォン等の携帯型の電子機器であったが、電子機器の種類は任意であり、他の種類の電子機器であっても良い。 Moreover, although the electronic devices 200, 600, 700, and 1100 are portable electronic devices such as smartphones, the type of the electronic device is arbitrary and may be other types of electronic devices.
　また、電子機器２００、６００、７００を示す図３、図４、図８、図９では、理解をしやすいように、インターポーザ１００Ａ、１００Ｂの寸法を他の構成に比べて大きく示したが、インターポーザ１００Ａ、１００Ｂは、極めて小さな寸法に作製することが可能である。 3, 4, 8, and 9 showing the electronic devices 200, 600, and 700, the dimensions of the interposers 100 </ b> A and 100 </ b> B are shown larger than other configurations for easy understanding. 100A and 100B can be manufactured to extremely small dimensions.
１、４１・・・積層素体
１ａ、１ｂ、１ｃ、４１ａ、４１ｂ、４１ｃ・・・絶縁体層
２・・・ビア導体
３・・・線路導体
４・・・回路基板用端子電極
４ａ・・・めっき層
５・・・接続用端子電極
５ａ・・・めっき層
２１、６１、７１・・・筐体
２２、２３、２４、６２、６３、６４、７２、７３・・・回路基板
２５、６５、７５・・・バッテリーパック
２６・・・電子部品
２７・・・実装用電極
２８・・・導電性接合材
２９、６９、７９・・・フラットケーブル
３０・・・接続用端子
３６、４６、５６・・・金属シールド
６７・・・電子部品
５１・・・素体
Ｚ・・・磁性体
１００、１００Ａ、１００Ｂ、３００、４００、５００、８００、９００、１０００、１２００、１３００、１４００・・・インターポーザ
２００、６００、７００、１１００・・・電子機器 DESCRIPTION OF SYMBOLS 1, 41 ... Laminated body 1a, 1b, 1c, 41a, 41b, 41c ... Insulator layer 2 ... Via conductor 3 ... Line conductor 4 ... Circuit board terminal electrode 4a ...・ Plating layer 5... Connection terminal electrode 5 a... Plating layer 21, 61, 71 .. Case 22, 23, 24, 62, 63, 64, 72, 73. 75 ... Battery pack 26 ... Electronic component 27 ... Mounting electrode 28 ... Conductive bonding material 29, 69, 79 ... Flat cable 30 ... Connection terminals 36, 46, 56 ... Metal shield 67 ... Electronic component 51 ... Element body Z ... Magnetic bodies 100, 100A, 100B, 300, 400, 500, 800, 900, 1000, 1200, 1300, 1400 ... interposer 200, 600, 700, 1 00 ... electronic equipment

Claims (17)

  1. 　絶縁体の素体と、
    　前記素体の底面に設けられ、導電性接合材を介して回路基板に接続される回路基板用端子電極と、
    　前記素体の上面側に設けられ、導電性接合材を介して外部に接続される接続用端子電極と、
    　前記素体の内部に設けられ、前記回路基板用端子電極と前記接続用端子電極とを接続する配線電極と、を備え、
    　前記素体の上側面には、前記底面に対して斜めに配置された平面である傾斜面が設けられ、
    　前記接続用端子電極が、前記傾斜面に設けられたインターポーザ。     An insulator body;
    A circuit board terminal electrode provided on the bottom surface of the element body and connected to the circuit board via a conductive bonding material;
    A connection terminal electrode provided on the upper surface side of the element body and connected to the outside via a conductive bonding material;
    A wiring electrode provided inside the element body and connecting the circuit board terminal electrode and the connection terminal electrode;
    The upper surface of the element body is provided with an inclined surface that is a plane disposed obliquely with respect to the bottom surface,
    An interposer in which the connection terminal electrode is provided on the inclined surface.
  2. 　前記素体が、絶縁体層が積層された積層素体である、請求項１に記載されたインターポーザ。 The interposer according to claim 1, wherein the element body is a laminated element body in which insulator layers are laminated.
  3. 　前記素体が、セラミックである、請求項１または２に記載されたインターポーザ。 The interposer according to claim 1 or 2, wherein the element body is ceramic.
  4. 　前記素体の外表面に金属シールドが形成された、請求項１ないし３のいずれか1項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 3, wherein a metal shield is formed on an outer surface of the element body.
  5. 　前記素体が、前記底面および前記傾斜面以外に、１つ以上の側面を備え、
    　前記金属シールドが、前記側面の、全面または一部分に形成された、請求項４に記載されたインターポーザ。     The element body includes one or more side surfaces in addition to the bottom surface and the inclined surface,
    The interposer according to claim 4, wherein the metal shield is formed on the entire side surface or a part of the side surface.
  6. 　前記金属シールドが、前記素体の前記側面の外周を一回りするように形成された、請求項５に記載されたインターポーザ。 The interposer according to claim 5, wherein the metal shield is formed so as to go around the outer periphery of the side surface of the element body.
  7. 　前記素体が、前記底面および前記傾斜面以外に、天面および１つ以上の側面を備え、
    　前記金属シールドが、前記天面および前記側面の、全面または一部分に形成された、請求項４に記載されたインターポーザ。     In addition to the bottom surface and the inclined surface, the element body includes a top surface and one or more side surfaces,
    The interposer according to claim 4, wherein the metal shield is formed on the entire top surface or the side surface of the top surface and the side surface.
  8. 　前記素体が磁性体からなる、請求項１ないし７のいずれか1項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 7, wherein the element body is made of a magnetic material.
  9. 　前記素体が、複数の絶縁体層が積層された積層素体からなり、前記絶縁体層の一部が磁性体からなる、請求項１ないし７のいずれか1項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 7, wherein the element body is made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer is made of a magnetic substance.
  10. 　絶縁体からなる素体と、前記素体の底面に設けられ、導電性接合材を介して回路基板に接続される回路基板用端子電極と、前記素体の上面側に設けられ、導電性接合材を介して外部に接続される接続用端子電極と、前記素体の内部に設けられ、前記回路基板用端子電極と前記接続用端子電極とを接続する配線電極と、を備え、前記素体の上側面には、前記底面に対して斜めに配置された平面からなる傾斜面が設けられ、前記接続用端子電極が、前記傾斜面に設けられたインターポーザと、
    　前記インターポーザを実装した回路基板と、
    　前記インターポーザの前記接続用端子電極に接続された配線部材と、を備えた電子機器。     An element body made of an insulator, a circuit board terminal electrode provided on the bottom surface of the element body and connected to the circuit board via a conductive bonding material, and a conductive bond provided on the upper surface side of the element body A connection terminal electrode connected to the outside via a material, and a wiring electrode provided inside the element body and connecting the circuit board terminal electrode and the connection terminal electrode, The upper side surface is provided with an inclined surface formed of a plane arranged obliquely with respect to the bottom surface, and the connection terminal electrode is provided with an interposer provided on the inclined surface;
    A circuit board on which the interposer is mounted;
    And a wiring member connected to the connection terminal electrode of the interposer.
  11. 　前記インターポーザが、少なくとも１つの側面を備え、当該側面に金属シールドが形成され、
    　当該インターポーザの前記金属シールドが形成された前記側面に隣接して、前記回路基板上に、電子部品が実装され、
    　前記金属シールドが、前記底面から、前記電子部品の高さよりも高い位置まで、前記側面を覆っている、請求項１０に記載された電子機器。     The interposer includes at least one side surface, and a metal shield is formed on the side surface;
    An electronic component is mounted on the circuit board adjacent to the side surface where the metal shield of the interposer is formed,
    The electronic device according to claim 10, wherein the metal shield covers the side surface from the bottom surface to a position higher than the height of the electronic component.
  12. 　前記インターポーザが、少なくとも１つの側面を備え、当該側面に金属シールドが形成され、
    　前記金属シールドが、前記素体の前記側面の外周を一回りするように形成された、請求項１０に記載された電子機器。     The interposer includes at least one side surface, and a metal shield is formed on the side surface;
    The electronic device according to claim 10, wherein the metal shield is formed so as to go around the outer periphery of the side surface of the element body.
  13. 　第１の前記インターポーザと、
    　第２の前記インターポーザと、
    　第１の前記インターポーザを実装した第１の回路基板と、
    　第２の前記インターポーザを実装した第２の回路基板と、を備え、
    　前記配線部材により、第１の前記インターポーザの前記接続用端子電極と、第２の前記インターポーザの前記接続用端子電極とが接続された、請求項１０ないし１２のいずれか１項に記載された電子機器。     A first interposer;
    A second interposer;
    A first circuit board on which the first interposer is mounted;
    A second circuit board on which the second interposer is mounted,
    The electron according to any one of claims 10 to 12, wherein the connection terminal electrode of the first interposer and the connection terminal electrode of the second interposer are connected by the wiring member. machine.
  14. 　第１の前記インターポーザが配置された高さと、
    　第２の前記インターポーザが配置された高さと、が等しい、請求項１３に記載された電子機器。     A height at which the first interposer is disposed;
    The electronic device according to claim 13, wherein a height at which the second interposer is disposed is equal.
  15. 　第１の前記インターポーザが配置された高さと、
    　第２の前記インターポーザが配置された高さと、が異なる、請求項１３に記載された電子機器。     A height at which the first interposer is disposed;
    The electronic apparatus according to claim 13, wherein a height at which the second interposer is arranged is different.
  16. 　第１の前記回路基板および第２の前記回路基板が、それぞれ、上側主面と下側主面とを備え、
    　第１の前記回路基板の前記上側主面に第１の前記インターポーザが実装され、
    　第２の前記回路基板の前記下側主面に第２の前記インターポーザが実装された、請求項１５に記載された電子機器。     Each of the first circuit board and the second circuit board includes an upper main surface and a lower main surface,
    The first interposer is mounted on the upper main surface of the first circuit board;
    The electronic device according to claim 15, wherein the second interposer is mounted on the lower main surface of the second circuit board.
  17. 　前記配線部材がフラットケーブルである、請求項１０ないし１６のいずれか1項に記載された電子機器。 The electronic device according to any one of claims 10 to 16, wherein the wiring member is a flat cable.
PCT/JP2017/043085 2017-01-27 2017-11-30 Interposer and electronic machine WO2018139048A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251889A (en) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd Three-dimensional electronic circuit device
JP2010087232A (en) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd Electronic component and substrate for electronic component, and methods of manufacturing them
JP2011200332A (en) * 2010-03-24 2011-10-13 Toshiba Corp Two-dimensional-array ultrasonic probe and probe diagnostic apparatus
JP2014049577A (en) * 2012-08-30 2014-03-17 Toshiba Corp Semiconductor device and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251889A (en) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd Three-dimensional electronic circuit device
JP2010087232A (en) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd Electronic component and substrate for electronic component, and methods of manufacturing them
JP2011200332A (en) * 2010-03-24 2011-10-13 Toshiba Corp Two-dimensional-array ultrasonic probe and probe diagnostic apparatus
JP2014049577A (en) * 2012-08-30 2014-03-17 Toshiba Corp Semiconductor device and method of manufacturing the same

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