WO2018121793A1 - 分体式阵列摄像模组及其制造方法 - Google Patents
分体式阵列摄像模组及其制造方法 Download PDFInfo
- Publication number
- WO2018121793A1 WO2018121793A1 PCT/CN2018/070009 CN2018070009W WO2018121793A1 WO 2018121793 A1 WO2018121793 A1 WO 2018121793A1 CN 2018070009 W CN2018070009 W CN 2018070009W WO 2018121793 A1 WO2018121793 A1 WO 2018121793A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- camera module
- array camera
- circuit board
- photosensitive
- lens
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
Definitions
- the invention relates to the field of camera modules, and further relates to a split array camera module and a manufacturing method thereof.
- the dual camera can capture images with the cooperation of two cameras, enabling a richer image acquisition function.
- the existing dual cameras can be divided into two categories according to their functions: one is to use three cameras to generate stereo vision, to obtain the depth of field of the image, to use the depth of field information for background blur, 3D scanning, auxiliary focus, motion recognition, etc., or to utilize The information of the two pictures is fused; the other type is to use two different pictures on the left and right to achieve better resolution, better color, dynamic range and other better image quality or optical zoom function. .
- the pixel requirements of the camera module are getting higher and higher, and the number of lenses of the lens is increasing. From the original two or three pieces to the current five, six or even more pieces, facing the high-pixel camera module.
- the requirement is that the volume is small, on the other hand, the problem of good optical imaging quality is required, and the module for multi-camera is also faced with such a problem, how to make the module as a whole suitable for high pixels, and stable or safe to two or
- the plurality of camera modules cooperate with each other to form an integral module to meet the requirements of the multi-camera module in the development of the existing camera module, which is a problem to be solved.
- the consistency of the optical axis between multiple cameras is an important aspect of the optical design of the multi-camera camera module. How to ensure that multiple camera modules can be assembled in one body and ensure the consistency of the optical axis. This is a multi-camera. A problem to be considered in the manufacture of camera modules.
- two mutually matched cameras respectively collect image information, and the accuracy of the image acquisition and the image quality are closely related to the incident light of the two cameras, and the optical axis consistency between the two cameras ensures the imaging quality of the camera module.
- Foundation That is to say, how to improve the optical axis consistency of the two camera modules on the basis of stably and compactly fixing two cameras, or to make the error within a predetermined range, thereby improving the precision of the installation and making it more accurate Good image quality is another important issue to consider for the development of dual cameras.
- the conventional camera module is usually a camera module assembled by a COB method, and the basic structure thereof comprises a circuit board, a photosensitive element, a lens holder, a lens and a filter element, wherein the photosensitive element is attached
- the circuit board is electrically connected to the circuit board by a gold wire
- the lens holder is mounted on the circuit board by glue
- the lens is mounted on the lens holder
- the filter element is mounted on the lens holder
- the circuit The board is usually provided with protruding electronic components.
- the lens holder is usually bonded to the circuit board after being manufactured by injection molding, and the mounting condition of the lens is not provided with good flatness, and the bonding fixing method increases the cumulative tolerance.
- the electronic component protrudes from the circuit board, so the installation space needs to be reserved when the mirror mount is installed, so that the overall required area of the circuit board is large, and the electronic component is exposed to the space inside the camera module, and the surface is contaminated with dust. Impurities can easily affect the imaging effect of the camera module. In short, the traditional COB placement camera module has many unfavorable factors, especially not suitable for the existing high-pixel camera module.
- An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the split array camera module includes at least two camera module units that are separately disposed, so that the camera modules can be relatively independent.
- the unit performs active calibration so that the optical axes of the camera module units are identical.
- An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the split-type array camera module includes an assembly body, and the assembly body stably assembles and fixes each of the camera module units. One whole.
- An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the assembly has a receiving chamber, and each of the camera module units is received therein, so that the split array camera module
- the outer shape is more regular and easy to install and use.
- An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the assembly includes at least one partition wall, the partition wall separating the receiving chambers, so that each of the camera module units Set in isolation to reduce electromagnetic interference between each other.
- An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the assembly body includes at least one supporting edge extending toward the receiving chamber to stably support and mount each of the camera module units. .
- An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the camera module includes a photosensitive component, and the photosensitive component includes a base and a circuit board, and the base is integrated Formed on the circuit board, it has good flatness, and can provide flat mounting conditions for the mounted components, thereby improving the optical axis consistency of the camera module unit.
- An object of the present invention is to provide a split-type array camera module and a method of fabricating the same, wherein the base has a light window to provide a light path for a photosensitive element, and the inner side wall of the base is obliquely disposed, Small stray light is reflected to the photosensitive element.
- An object of the present invention is to provide a split-type array camera module, wherein the photosensitive element has at least one photosensitive area and a non-sensitive area, and the base integrally encapsulates at least a portion of the non-photosensitive area of the photosensitive element to An integral package area of the pedestal is expanded.
- An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the circuit board includes a circuit board body and at least one electronic component, the electronic component protruding from the circuit board body, The base is integrally formed on the circuit board main body to cover the electronic component to reduce space occupation.
- An object of the present invention is to provide a split-type array camera module and a method of fabricating the same, wherein the photosensitive element is electrically connected to the circuit board body through at least one electrical connection element, and the base covers the electrical connection element .
- An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the base includes a support member, and the support member is spaced apart from the circuit board and the base body to facilitate The wiring board and the photosensitive member are protected during the manufacturing process.
- An object of the present invention is to provide a split array camera module and a method of fabricating the same, wherein the camera module unit includes a filter element, and the filter element is mounted to the base body.
- An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the camera module unit includes a seat, the holder is mounted with the base body, and a filter element is mounted on The support.
- An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the circuit board main body has a sinking region, and the photosensitive element is disposed in the sinking region to reduce the photosensitive element and The relative height of the main body of the circuit board.
- An object of the present invention is to provide a split-type array camera module and a manufacturing method thereof, wherein the circuit board body comprises a first board body and a second board body, and the first board body is electrically conductively passed through a conductive adhesive Connected to the second plate.
- An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the height and size of each of the camera module units can be freely assembled to facilitate cooperation of different types of camera module units.
- an aspect of the present invention provides an array camera module including: at least two camera module units and an assembly, wherein each of the camera module units is respectively fixed to the assembly In order to form a whole.
- the assembly includes an upper cover for fixedly connecting each of the camera module units.
- the assembly body includes a main body, and the main body forms a receiving chamber, and each of the camera module units is housed in the receiving chamber.
- the assembly body includes an upper cover, the upper cover is adapted to cover the receiving compartment, and the upper cover has at least two lens ports, so that each of the camera module units is accommodated in When the housing is in the housing chamber, the lens is illuminated by the lens port.
- the upper cover is integrally connected to the body. It is to be understood that the assembly may be implemented only to have only the above upper cover, or to have the main body forming the receiving chamber described above and the upper cover integrally formed on the main body, or without the upper cover. And only the body of the side wall and the like are suitable structures.
- the assembly body includes a partition wall, and the partition wall is located in the receiving chamber, and the receiving chamber is partitioned into at least two portions for respectively accommodating each of the camera module units.
- the partition wall material is selected from one or more of a plastic, a resin, a rubber, and a metal.
- the assembly includes at least one partition wall that divides the receiving chamber into at least two portions for respectively accommodating each of the camera module units, and the partition wall is connected to the Cover the cover.
- the assembly includes at least one support edge extending inwardly from the body to facilitate support of each of the camera module units.
- the support edge is a boss structure.
- each of the camera module units includes a photosensitive component and a lens, wherein the lens is located in a photosensitive path of the photosensitive component, and the photosensitive component comprises a circuit board, a photosensitive element and a base.
- the base is integrally formed on the circuit board, the photosensitive element is electrically connected to the circuit board, the lens is located in a photosensitive path of the photosensitive element, and the base has at least one light window.
- the photosensitive element provides a light path.
- the photosensitive element is located inside the base.
- the photosensitive member includes the base integrally encapsulating the wiring board and at least a portion of the non-photosensitive area of the photosensitive element.
- the base encass the electrical connection element.
- the circuit board includes at least one electronic component that encapsulates the electronic component.
- the support member is disposed on the circuit board body to facilitate protection of the circuit board body and the photosensitive member during manufacturing.
- the support member is disposed in a non-photosensitive region of the photosensitive member to facilitate protection of the photosensitive member during manufacture.
- each of the camera units includes a seat that is mounted to the base to facilitate mounting a filter element.
- the mount is at least partially connected to the circuit board.
- each of the mounts of each of the camera module units is integrally connected.
- the photosensitive element is disposed in the sinker zone to facilitate lowering the relative height of the photosensitive element and the wiring board.
- the circuit board includes a first board body and a second board body, and the second board body is fixedly coupled to the first board body by a connecting medium.
- the connection medium is an anisotropic conductive paste.
- the base includes an extension mounting portion that extends at least partially upwardly from the base body to form a limit slot that limits the component being mounted.
- the photosensitive member is disposed on the flip-chip to facilitate mounting the photosensitive member to the wiring board in a flip chip manner.
- the circuit boards of each of the camera module units are integrally connected.
- each camera module unit is separately provided.
- the bottom of each of the camera module units has a height difference.
- each of the camera module units includes a lens support member, the lens is mounted to the lens support member, and the lens support member is mounted to the base.
- the lens supporting component is a driving component, so that the camera module unit forms a moving focus camera module.
- the lens supporting element is a barrel element, so that the camera module unit constitutes a certain focus camera module.
- At least two of the camera module units are fixed focus camera modules.
- At least two of the camera module units are dynamic focus camera modules.
- At least one of each of the camera module units is a focus camera module, and at least one is a fixed focus camera module.
- each of the array camera modules includes a filter element, and the filter element is mounted to the base.
- the type of circuit board is selected from the group consisting of a hard board, a soft board, a hard and soft board, and a soft board.
- FIG. 1 is a perspective view of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
- FIG. 2 is an exploded perspective view of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
- FIG. 3 is a schematic diagram of an assembly process of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a split-type array camera module in accordance with a first preferred embodiment of the present invention.
- FIG. 5 is a cross-sectional view of a split-type array camera module in accordance with a second preferred embodiment of the present invention.
- FIG. 6 is a cross-sectional view of a split-type array camera module in accordance with a third preferred embodiment of the present invention.
- FIG. 7 is a cross-sectional view of a split-type array camera module in accordance with a fourth preferred embodiment of the present invention.
- 8A, 8B are schematic cross-sectional views of a split-type array camera module in accordance with a fifth preferred embodiment of the present invention.
- FIG. 9 is a cross-sectional view of a split-type array camera module in accordance with a sixth preferred embodiment of the present invention.
- FIG. 10 is a cross-sectional view of a split-type array camera module in accordance with a seventh preferred embodiment of the present invention.
- FIG. 11 is a cross-sectional view of a split-type array camera module in accordance with an eighth preferred embodiment of the present invention.
- Figure 12 is a cross-sectional view showing a split type array camera module in accordance with a ninth preferred embodiment of the present invention.
- Figure 13 is a cross-sectional view showing a split type array camera module in accordance with a tenth preferred embodiment of the present invention.
- Figure 14 is a schematic diagram of a split-type array camera module in accordance with a twelfth preferred embodiment of the present invention.
- 15A, 15B, and 15C are cross-sectional views showing different embodiments of a split type array camera module according to a tenth preferred embodiment of the present invention.
- Figure 16 is a top plan view of a split-type array camera module in accordance with an eleventh preferred embodiment of the present invention.
- 17 is a block diagram of a method of fabricating a split-type array camera module in accordance with the above-described preferred embodiment of the present invention.
- FIG. 18 is a schematic diagram of the application of a split-type array camera module in accordance with the above-described preferred embodiment of the present invention.
- the camera module of the multi-camera is an important trend in the recent development of the camera module, especially when the various performances of the camera module tend to be extreme, the pixels of the camera module are getting higher and higher, and the number of lenses of the lens is increasing. Under the development of multi-camera camera modules has become an important trend and direction.
- the combination of multiple camera modules can achieve more functions, such as using stereo camera to generate stereo vision, obtaining depth of field of image, using background depth information for background blur, 3D scanning, auxiliary focusing, motion recognition, etc., or using two The information of the picture is fused; or the two different pictures on the left and right are used for fusion, in order to obtain higher resolution, better color, dynamic range and other better image quality or optical zoom function.
- a split-type array camera module which includes at least two camera module units and an assembly, and each of the camera module units is separately assembled by the assembly, so that each camera The modules have little influence on each other, and the structure is formed as a whole, and the appearance is regular, which is convenient for installation and application.
- each of the camera module units includes at least one photosensitive component
- the photosensitive component includes a base and a circuit board
- the base is mounted or integrally formed by
- the circuit board is preferably integrally formed to provide a flat mounting plane, which is superior to the conventional COB assembly method, improves the optical performance of the camera module, and is optimized in volume and process.
- the camera module unit can be manufactured as different types of camera modules. Therefore, the specific optimized structure of the camera module unit of the present invention is combined with the assembly structure of the camera module unit of the present invention to provide a structural regularity.
- the optical imaging performance and volume optimized array camera module enable the same or different camera modules to be assembled stably and safely to form a whole and realize more functions.
- the split array camera module of the present invention can be applied to an electronic device, such as but not limited to, a smart phone, a notebook computer, a tablet computer, a camera, a monitoring device, a wearable device,
- the split dual camera array camera module 100 composed of two camera module units will be described below as an example.
- the split array camera module 100 may include more of the camera module units, and the present invention is not limited in this regard.
- the split-type array camera module 100 includes at least two camera module units and an assembly 30, and each of the camera module units is separately assembled to the assembly 30 to form a unit.
- the two camera module units are a first camera module unit 10 and a second camera module unit 20, respectively.
- the assembly body 30 includes a main body 31 and has a receiving chamber 32.
- the first camera module unit 10 and the second camera module unit 20 are housed in the receiving chamber 32.
- the main body 31 forms the accommodating chamber 32, and the first camera module unit 10 and the second camera module unit 20 are limited and fixed therein, so that the first camera module is
- the unit 10 and the second camera module unit 20 are integrally formed to facilitate installation of an application.
- the accommodating chamber 32 is not a closed structure, but a semi-open structure, so that each of the camera module units can perform lighting and provide an electrically connectable position.
- the assembly may not form the obvious receiving chamber, for example, the first camera module unit 10 and the second camera module unit 20 are fixed by spaced apart plate members. .
- first camera module unit 10 and the second camera module unit 20 are respectively fixed to the side wall of the main body 31 of the assembly 30, for example, by glue bonding, thereby passing through
- the main body 31 provides a fixed position for the first camera module unit 10 and the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are opposite.
- the position is determined to form an array structure.
- the array described in the present invention is used to describe that each camera module unit forms a positional layout relationship, and is not limited to being arranged in a column manner, and the layout mode can be based on requirements and array camera modules.
- the number and type are determined, such as linear arrangement, triangular arrangement, symmetric arrangement, and the like.
- the assembly body 30 may be a square frame structure, so that each of the camera module units is constrained and assembled in a square structured structure to facilitate installation applications, such as mounting on electronics. device.
- the structure of the assembly 30 may be deformed according to the size and structure of each camera module unit, thereby forming a regular or irregular structure, so that each of the camera modules The unit can be assembled stably.
- the assembly 30 includes an upper cover 33 adapted to block the main body 31 to facilitate closing the receiving chamber 32.
- the upper cover 33 has at least two lens ports 331 corresponding to the camera module units, so that each of the camera module units performs daylighting through the lens port 331.
- the upper cover 33 is integrally connected to the main body 31, thereby constructing an integral receiving structure.
- the upper cover 33 may not be provided, or the upper cover 33 may be connected separately from the main body 31, or only the upper cover 33 may be connected without connecting the main 31. It should be understood by those skilled in the art that the arrangement of the upper cover 33, and the manner of connection, are not limitations of the present invention.
- the assembly process of the split-type array camera module 100 may be performed by first inverting the assembly 30, applying glue on the top of the camera module units 10, 20, and then The first camera module unit 10 and the second camera module unit 20 are respectively actively calibrated, so that the first camera module unit 10 is pre-assembled. And the optical axis of the second camera module unit 20 is consistent, and then the first camera module unit 10 and the second camera module unit 20 are solidified, so that the first camera module unit 10 and The second camera module unit 20 is fixedly coupled to the assembly 30.
- the fixed position of the camera module unit 10, 20 and the assembly body 30 may be a top portion or a side wall.
- the side wall of the main body 31 of the assembly 30 and the camera module unit may be fixed at the time of bonding, and/or the upper cover 33 of the assembly 30 may be attached during bonding. And fixed to the camera module unit.
- the assembly 30 may be free of the upper cover 33, and the camera module units 10, 20 are connected to the side wall or the bottom wall of the assembly 30. It will be understood by those skilled in the art that the bonding position of the glue is not a limitation of the present invention.
- the assembly body 30 may include a supporting edge 34 disposed at the bottom of the main body 31 to facilitate supporting the first camera module unit 10 and the The second camera module unit 20 is described. Specifically, the supporting edge 34 extends from the main body 31 into the receiving chamber 32 to form a boss for providing support for the first camera module unit 10 and the second camera module unit 20. position.
- the upper cover 33 is detachably coupled to the main body 31.
- the supporting edge 34 limits the first camera module unit 10 and the second camera module unit 20 such that the first camera module unit 10 and the second camera module unit 20 are in a predetermined state. position. It is to be noted that, in this embodiment of the present invention, the heights of the supporting edges 34 corresponding to the first camera module unit 10 and the second camera module unit 20 are the same, when two camera modules are used. When the heights of the units are the same, the heights of the ends of the camera module units can be made uniform. In other embodiments of the present invention, the positions of the first camera module unit 10 and the second camera module unit 20 may be different according to the height of the support side 34, so that different limit heights may be provided.
- the height difference between the first camera module unit 10 and the second camera module unit 20 can be compensated by the support edge 34, so that the split type The ends of the array camera module 100 are identical.
- the top heights of the first camera module unit 10 and the second camera module unit 20 may be inconsistent, and the present invention is not limited in this regard. That is, the support side 34 may be a convex plane of the same plane, or may be a different plane of the boss.
- the height of the camera module may be the same or different, and the first camera module unit 10 and The tops of the second camera module units 20 may or may not be identical, and the present invention is not limited in these respects.
- the first camera module unit 10 and the second camera module unit 20 are separately disposed, so that the first camera module unit 10 and the second camera are The mutual influence of the module unit 20 is small, and the assembly of the assembly body 30 ensures the consistency of the optical axes of the first camera module unit 10 and the second camera module unit 20.
- the first camera module unit 10 and the second camera module unit 20 may be pre-assembled into the assembly body 30, and then the first camera module unit 10 and / or the second camera module unit 20 performs automatic calibration, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are identical, or the angle of the optical axis is at a predetermined error.
- the relative position within the range or a certain distance. If the first camera module unit 10 and the second camera module unit 20 are fixedly connected, and the influence between each other is large, that is, when one of the camera module units is adjusted It will inevitably affect another camera module unit, and cannot achieve the purpose of independent active calibration in the present invention.
- the basic structure of the first camera module unit 10 and the second camera module unit 20 are identical, that is, the first camera module unit 10 and the first The second camera module unit 20 can be the same type of camera module.
- the first camera module can be of different types, and the invention is not limited in this respect.
- the first camera module unit 10 includes a first photosensitive component 11 , a first lens 12 , a first lens supporting component 13 and a first filter component 14 .
- the first lens 12 is located in a photosensitive path of the first photosensitive member 11, the first lens 12 is mounted on the first lens supporting member 13, and the first lens supporting member 13 is mounted on the first lens a photosensitive member 11 such that the first lens 12 is located in a photosensitive path of the first photosensitive member 11, and the first filter element 14 is mounted to the first photosensitive member 11 such that Light from a lens 12 passes through the first filter element 14 to reach the first photosensitive member 11.
- the first photosensitive member 11 includes a first wiring board 111, a first photosensitive element 113, and a first pedestal 112.
- the first photosensitive element 113 is electrically connected to the first circuit board 111 to transmit photosensitive information to the first circuit board 111, and the first lens 12 is located in a photosensitive path of the first photosensitive element 113. In order to allow the first photosensitive element 113 to receive light, it is photosensitive.
- the first photosensitive element 113 may be disposed on the first circuit board 111 by a surface mount technology (SMT) and electrically connected through at least one first electrical connection element 1133. Connected to the first circuit board 111.
- SMT surface mount technology
- the first electrical connection element 1133 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a pad, a pin, or the like.
- the first photosensitive element 113 has a first photosensitive area 1131 for performing photosensitivity, and a first non-sensitive area 1132 for electrically connecting to the The first circuit board 111.
- the first non-photosensitive area 1132 is electrically connected to the first wiring board 111 through the electrical connection element.
- the first photosensitive element 113 is located inside the first pedestal 112, that is, not encapsulated by the pedestal.
- the first photosensitive element 113 needs to be attached to the first wiring board 111, such as glue bonding, so that the first photosensitive element 113 is stably fixed, and then The first photosensitive element 113 is electrically connected to the first circuit board 111 through the first electrical connection element 1133, and is electrically connected to the first circuit board 111, for example, by a gold wire.
- the first pedestal 112 is integrally connected to the first circuit board 111.
- the first pedestal 112 includes a first pedestal body 1121 and has a first light window 1122.
- the first light window 1122 provides a light path for the first photosensitive element 113.
- the first photosensitive element 113 is located in the first light window 1122, and the photosensitive path of the first photosensitive element 113 is in the same direction as the first light window 1122.
- the first pedestal body 1121 forms the first light window 1122 to provide a light path for the first photosensitive element 113.
- the first base body 1121 is a closed loop structure that accommodates the shape of the first photosensitive element 113.
- the first base body 1121 has a first inner side wall having an angle of inclination to facilitate mold fabrication and to reduce stray light reflection to the photosensitive element.
- first inner side wall having an angle of inclination to facilitate mold fabrication and to reduce stray light reflection to the photosensitive element.
- the side wall is at a vertical angle
- the incident angle of the light reaching the first base body 1111 is relatively large, so that the reflection angle of the light is large, and it is relatively easy to reflect to the inside, that is, to the photosensitive element.
- Position reflection When the first inner side wall is inclined, the incident angle of the light is small, the light incident in the same direction, and the reflected light is offset from the position away from the photosensitive element, so that the oblique arrangement helps to reduce the interference of stray light.
- the magnitude of the tilt angle can be set as desired.
- the first inner sidewall of the first base body 1121 may be vertically disposed, that is, the tilt angle is not present.
- the first pedestal 112 is disposed on the first circuit board 111 by integral molding, such as molding, thereby the first pedestal 112 and the The first circuit board 111 is stably fixed and reduces an additional mounting and fixing process. For example, the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is lowered.
- the first pedestal 112 may be integrally formed on the first circuit board 111 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
- mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
- COB Chip On Board
- the shape of the molding and the flatness of the surface can be better controlled, for example, such that the first base body 1121 has a better flatness, thereby being a mounted component, such as the lens supporting member.
- the first filter element 14 provides a flat mounting condition to help improve the optical axis uniformity of the first camera module unit 10.
- the first circuit board 111 includes a first circuit board body 1111 and at least one first electronic component 1112, and the first electronic component 1112 protrudes from the first circuit board.
- the main body 1111 is configured to cooperate with the operation of the first circuit board main body 1111.
- the first pedestal 112 is integrally formed on the first circuit board main body 1111 and covers the first electronic component 1112, thereby reducing the occupied space of the first electronic component 1112.
- the first electronic component 1112 is by way of example and not limitation, a resistor, a capacitor, a driver, or the like.
- the first electronic component 1112 may not be disposed or the first electronic component 1112 may protrude from the first circuit board body 1111, such as embedded in the first The circuit board main body 1111, the present invention is not limited in this respect.
- Each of the first electronic components 1112 may be mounted on an edge region of the first wiring board 111, such as outside the first photosensitive member 113, by being spaced apart from each other by, for example, an SMT process. It is worth mentioning that each of the first electronic components 1112 may be located on the same side or opposite side of the first circuit board 111, for example, in one specific example, the first photosensitive element 113 and each of the The first electronic components 1112 may be respectively located on the same side of the first circuit board 111, and the first photosensitive elements 113 are mounted on the chip mounting area of the first circuit board 111, each of the first An electronic component 1112 is attached to the edge region of the first wiring board 111 at a distance from each other.
- the first pedestal 112 covers each of the first electronic components 1112 after molding to isolate adjacent first electronic components 1112 and isolate the first electronic components by the first pedestal 112 1112 and the first photosensitive element 113.
- the manner in which the first pedestal 112 covers each of the first electronic components 1112 after molding has many advantages.
- the first pedestal 112 includes Each of the first electronic components 1112 is covered so that mutual interference between adjacent first electronic components 1112 does not occur, even when the distance between adjacent first electronic components 1112 is relatively close.
- the imaging quality of the camera module unit can be ensured, so that a larger number of the first electronic components 1112 can be mounted on the first circuit board 111 of a small area, thereby making the camera module
- the structure of the unit is more compact, so as to improve the imaging quality of the camera module unit based on controlling the size of the camera module unit;
- the first base 112 covers each of the first An electronic component 1112 such that no safety distance is required between the first pedestal 112 and each of the first electronic components 1112, whether in the horizontal direction or in the height direction, to enable The size of the camera module unit.
- the first pedestal 112 covers each of the first electronic components 1112, so that no glue is needed for connection and leveling between the first pedestal 112 and the first circuit board 111.
- the first pedestal 112 covers each of the first electronic components 1112, and in the process of subsequently transporting and assembling the camera module unit to form the split array camera module 100, The first pedestal 112 can prevent the first electronic component 1112 from shaking and falling off, thereby facilitating structural stability of the split-type array camera module 100.
- the first pedestal 112 covers each of the first electronic components 1112, and can be prevented during the subsequent transportation and assembly of the camera module unit to form the split array camera module 100. Contaminants contaminate each of the first electronic components 1112, or contaminants on the surface of the electronic components are shed to contaminate the photosensitive elements to ensure image quality of the first camera module unit 10.
- the first electronic component 1112 can be insulated from the air. In this manner, the oxidation rate of the metal portion of the first electronic component 1112 can be slowed down. The environment stability of the first electronic component 1112 and the split array camera module 100 is improved.
- the first pedestal 112 is integrally formed on the first circuit board main body 1111 and covers the first electronic component 1112 of the first circuit board 111, thereby making the first The pedestal 112 and the first circuit board main body 1111 have a large connection area, the connection is more stable, and the structural strength is better by integral molding, so the first pedestal 112 can be firmly and reliably supported.
- the components of the first camera module unit 10 are fixed, thereby ensuring the yield of the product.
- the number of lenses of the lens is increasing, for example, up to 5p, 6p, and 6p, etc., and when the number of lenses of the camera module lens increases, it needs to be satisfied at the same time.
- the filter element is mounted to the pedestal integrally formed such that the filter element can be provided with flat mounting conditions and can pass through the pedestal
- the height is effectively controlled to control the height position at which the filter element is mounted, and thus the structure of the present invention is more suitable for a high-pixel camera module.
- the first pedestal 112 has a first mounting slot 1123 communicating with the first optical window 1122.
- the first filter element 14 is located between the first lens 12 and the first photosensitive element 113 to facilitate filtering light passing through the first lens 12 to the first photosensitive element 113.
- the first filter element 14 is mounted to the first mounting groove 1123.
- the first filter element 14 can be implemented as an infrared cut filter, a full transmissive spectrum filter, a blue glass filter, or the like.
- the second camera module unit 20 includes a second photosensitive component 21 , a second lens 22 , a second lens supporting component 23 and a second filter component 24 .
- the second lens 22 is located in the photosensitive path of the second photosensitive member 21, the second lens 22 is mounted on the second lens supporting member 23, and the second lens supporting member 23 is mounted on the first lens a photosensitive member 21 such that the second lens 22 is located in a photosensitive path of the second photosensitive member 21, and the second filter element 24 is mounted to the second photosensitive member 21 such that The light of the two lenses 22 passes through the second filter element 24 to reach the second photosensitive member 21.
- the second photosensitive component 21 includes a second circuit board 211, a second photosensitive element 213, and a second base 212.
- the second photosensitive element 213 is electrically connected to the second circuit board 211 to transmit photosensitive information to the second circuit board 211, and the second lens 22 is located in the photosensitive path of the second photosensitive element 213.
- the second photosensitive element 213 is exposed to light to perform light sensing.
- the second photosensitive element 213 may be disposed on the second circuit board 211 by a surface mount technology (SMT) and electrically connected through the at least one second electrical connection element 2133. Connected to the second circuit board 211.
- SMT surface mount technology
- the second electrical connection element 2133 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a pad, a pin, or the like.
- the second photosensitive element 213 has a second photosensitive area 2131 for performing photosensitivity, and a second non-sensitive area 2132 for electrically connecting to the The second circuit board 211.
- the second non-photosensitive area 2132 is electrically connected to the second wiring board 211 through the electrical connection element.
- the second photosensitive element 213 is located inside the second pedestal 212, that is, not encapsulated by the pedestal.
- the second photosensitive element 213 needs to be attached to the second circuit board 211, such as glue bonding, so that the second photosensitive element 213 is stably fixed, and then The second photosensitive element 213 is electrically connected to the second circuit board 211 through the second electrical connection element 2133, and is electrically connected to the second circuit board 211, for example, by a gold wire.
- the second pedestal 212 is integrally connected to the second circuit board 211.
- the second base 212 includes a second base body 2121 and a second light window 2122.
- the second light window 2122 provides a light path for the second photosensitive element 213.
- the second photosensitive element 213 is located in the second light window 2122, and the photosensitive path of the second photosensitive element 213 is aligned with the second light window 2122.
- the second pedestal body 2121 forms the second light window 2122 to provide a light path for the second photosensitive element 21313.
- the second base body 2121. is a closed loop structure that accommodates the shape of the second photosensitive element 213.
- the second base body 2121 has a second inner side wall having an inclination angle ⁇ to facilitate mold manufacturing and reduce stray light reflection to the photosensitive element.
- the incident angle of the light reaching the second base body 2121 is large, so that the reflection angle of the light is large, and it is relatively easy to reflect to the inside, that is, to the photosensitive element.
- Position reflection When the second inner side wall is inclined, the incident angle of the light is small, and the light incident in the same direction is offset from the position of the photosensitive element in the direction of the reflected light, so that the oblique arrangement helps to reduce the interference of stray light.
- the magnitude of the tilt angle ⁇ can be set as desired.
- the second inner side wall of the second base body 2121 may be vertically disposed, that is, the tilt angle ⁇ is not present.
- the second pedestal 212 may be integrally formed on the second circuit board 211 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
- mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
- COB Chip On Board
- the shape of the molding and the flatness of the surface can be better controlled, for example, such that the second base body 2121 has a better flatness, thereby being a mounted component, such as the second lens supporting member. 23.
- the second filter element 24 provides flat mounting conditions to help improve optical axis uniformity of the second camera module unit 20.
- the second circuit board 211 includes a second circuit board body 2111 and at least one second electronic component 2112, and the second electronic component 2112 protrudes from the second circuit board.
- the main body 2111 is configured to cooperate with the operation of the second circuit board main body 2111.
- the second pedestal 212 is integrally formed on the second circuit board main body 2111 and covers at least part of the second electronic component 2112, thereby reducing the occupied space of the second electronic component 2112.
- the second electronic component 2112 is by way of example and not limitation, a resistor, a capacitor, a driver, or the like.
- the second electronic component 2112 may not be disposed or the second electronic component 2112 may not protrude from the second circuit board body 2111, such as embedded in the first The second circuit board main body 2111, the present invention is not limited in this respect.
- the types of the first circuit board main body 1111 and the second circuit board main body 2111 are selected from a soft board, a hard board, and a soft and hard board.
- Each of the second electronic components 2112 may be mounted on an edge region of the second wiring board 211, such as outside the second photosensitive member 213, by being spaced apart from each other by, for example, an SMT process. It is worth mentioning that each of the second electronic components 2112 may be located on the same side or opposite side of the second circuit board 211, for example, in one specific example, the second photosensitive element 213 and each The second electronic component 2112 may be respectively located on the same side of the second circuit board 211, and the second photosensitive element 213 is mounted on the chip mounting area of the second circuit board 211, each of the The two electronic components 2112 are respectively mounted on the edge regions of the second wiring board 211 at intervals.
- the second pedestal 212 covers each of the second electronic components 2112 after molding to isolate adjacent second electronic components 2112 and isolate the second electronic components by the second pedestal 212 2112 and the second photosensitive element 213.
- the first and second bases can also be respectively disposed on the first and second circuit boards by means of glue mounting.
- at least one of the first and second bases is disposed on the corresponding circuit board by integral molding.
- two of the bases are integrally formed on the corresponding circuit board, or one of the bases is integrally formed on the corresponding circuit board, and the other of the bases is conventional.
- the bracket is disposed on the corresponding circuit board by means of mounting.
- first lens supporting element 13 and the second lens supporting element 23 can be implemented as a driving element or a barrel element to form a moving focus camera module or a fixed focus camera module.
- the drive element is by way of example and not limitation, a voice coil motor, a piezoelectric motor or the like.
- both the first camera module unit 10 and the second camera module unit 20 are The moving focus camera module, that is, the split array camera module 100 is composed of two moving focus camera modules.
- the first camera module unit 10 is a dynamic focus camera module
- the The two camera module unit 20 is a fixed focus camera module, that is, the split array camera module 100 is composed of a moving focus camera module and a fixed focus camera module.
- the first lens supporting component 13 is implemented as a lens barrel component and the second lens 22 component is implemented as a driving component
- the first camera module unit 1010 is a fixed focus camera module
- the The two camera module unit 20 is a dynamic focus camera module.
- the first lens supporting member 13 and the second lens supporting member 23 are both implemented as the barrel member
- the first camera module unit 10 and the second camera module unit 20 are both Fixed focus camera module.
- the first lens support element 13 or the second lens support element 23 when the first lens support element 13 or the second lens support element 23 is implemented as a drive element, the first lens support element 13 and the second The lens supporting member 23 is electrically connected to the first circuit board 111 or the second circuit board 211 to facilitate driving the first lens 12 or the second lens 22 to operate.
- the first lens supporting member 13 and the second lens supporting member 23 may be electrically connected to the first circuit board 111 or the second circuit board 211 by providing pins, pads or leads or the like. .
- the types of the first camera module unit 10 and the second camera module unit 20 can be configured according to requirements, so as to achieve better image acquisition effects by mutual cooperation, and the invention is not limited in this respect.
- the first photosensitive element 113 and the second photosensitive element 213 of the first camera module unit 10 and the second camera module unit 20 The types may be the same or different, thereby forming camera module units of different functions.
- FIG. 5 a cross-sectional view of a split-type array camera module 100 in accordance with a second preferred embodiment of the present invention.
- the second pedestal 212 of the second photosensitive component 21 of the second camera module unit 20 integrally encapsulates at least part of the second non-the second photosensitive element 213 Photosensitive area 2132.
- the second susceptor 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213 such that the second photosensitive element 213 is stably fixed and the The formable area of the second pedestal 212 is described.
- the second pedestal 212 covers the second electrical connection element 2133.
- the second pedestal 212 is molded in a manner of the photosensitive element.
- the range in which integral molding can be performed is extended to the second non-photosensitive area 2132 of the second photosensitive element 213, thereby increasing the number without affecting the normal photosensitive operation of the second photosensitive element 213 a connection area at the bottom of the second pedestal 212, so that the second pedestal 212 and the second circuit board 211 and the second photosensitive element 213 are more stably connected, and the top portion may be other components, as described
- the second lens 22, the second lens support member 23, etc. provide a larger mountable area.
- the second electrical connection element 2133 is covered by the second pedestal 212, thereby avoiding external interference with the second electrical connection element 2133, and preventing the second electrical connection element 2133 from oxidizing or contaminating dust.
- FIG. 6 is a cross-sectional view of a split-type array camera module 100 in accordance with a third preferred embodiment of the present invention.
- the assembly body 30 includes a partition wall 35 disposed in the accommodating chamber 32 to partition the accommodating chamber 32 to accommodate each of the camera module units.
- the partition wall 35 may be made of a material such as plastic, resin, rubber, metal, etc., in order to reduce electromagnetic interference of the first camera module unit 10 and the second camera module unit 20.
- the partition wall 35 is fixedly coupled to the upper cover 33 such that when the upper cover 33 closes the receiving chamber 32, the partition wall 35 will be the first The camera module unit 10 and the second camera module unit 20 are isolated.
- the partition wall 35 is fixedly connected to the side wall of the main body 31, and the receiving chamber 32 is divided into two parts to respectively accommodate the first camera module unit 10 and the The second camera module unit 20 is described. That is, when the first camera module unit 10 and the second camera module unit 20 are mounted to the assembly 30, the first camera module unit 10 and the second camera module The group unit 20 is isolated by the partition wall 35.
- the partition wall 35 may also be other structures and materials, and the invention is not limited in this respect.
- FIG. 7 is a cross-sectional view of a split-type array camera module 100 in accordance with a fourth preferred embodiment of the present invention.
- the first pedestal 112 includes a first support member 1124 for supporting the mold during manufacture to prevent the first circuit board 111 or the first photosensitive element 113 from being damage. That is, during the manufacturing process, the manufacturing mold may be abutted against the first supporting member 1124 such that the mold does not directly contact the first wiring board 111 or the first photosensitive element 113, And the molding material is prevented from overflowing to the inside.
- first support member 1124 may have an annular structure that conforms to the shape of the edge of the first base body 1121.
- the first support element 1124 has elasticity, such as, but not limited to, a glue coating or a pad.
- the second pedestal 212 includes a second support member 2124 for supporting the mold during manufacture to prevent damage to the second wiring board 211 or the second photosensitive element 213. That is, during the manufacturing process, the manufacturing mold may be abutted against the second support member 2124 such that the mold does not directly contact the first circuit board 111 or the second photosensitive element 213. And the molding material is prevented from overflowing to the inside.
- the second supporting member 2124 may have an annular structure conforming to the shape of the edge of the second base body 2121.
- the second support element 2124 has elasticity, such as, but not limited to, a glue coating or a pad.
- the first camera module unit 10 includes a first support 15 for mounting other components, such as the first filter element 14, the first lens. 12 or the first lens support element 13.
- the first mount 15 is mounted to the first base body 1121, and the first filter element 14 is mounted to the first mount 15.
- the first mount 15 sinks within the first light window 1122 of the first pedestal 112 such that the position of the first filter element 14 sinks, close to the first
- the photosensitive element 113 reduces the back focus occupancy of the first camera module unit 10 and reduces the required area of the first filter element 14.
- the second holder 25 is mounted to the second base body 2121, and the second filter element 24 is mounted to the second holder 25.
- the second mount 25 sinks within the second light window 2122 of the second pedestal 212 such that the position of the second filter element 24 sinks, near the second
- the photosensitive element 213 reduces the back focus occupancy of the second camera module unit 20 and reduces the required area of the second filter element 24.
- the array camera module may include only one of the supports, such as the first support 15 or the second support 25, as will be understood by those skilled in the art. Yes, the number of the supports is not a limitation of the present invention.
- the first support 15 is mounted to the first mounting slot 1123 of the first base 112, and the second mount 25 is mounted to the second base 212.
- the first base body 1121 and the second base body 2121 may be a platform structure, and the first support 15 and the second support 25 may also be combined. Without falling down, and being directly mounted to the platform structure of the first support 15 and the second support 25, those skilled in the art should understand that the mounting position and specific structure of the support It is not a limitation of the invention.
- the holder may form the light window in cooperation with the base, that is, the base may have an opening and communicate with the outside, and the A holder may be added to the opening to form a closed window of light.
- the mount can be extended to the circuit board body to form a closed light window.
- the first abutment 15 and the second abutment 25 are integrally connected. That is, the portions of the first pedestal 15 and the second pedestal 25 are connected to each other so as to be mountable to the first pedestal 112 and the second pedestal 212 at one time, and provide relative Consistent installation conditions.
- the second circuit board main body 2111 has a second sinking area 21111, and the second photosensitive element 213 is sunkenly disposed on the second The sinking area 21111 is arranged to reduce the relative heights of the second photosensitive element 213 and the second wiring board main body 2111.
- the second sinker region 21111 can be implemented as a groove or a through hole. That is, the two sides of the second circuit board main body 2111 may be disconnected or connected.
- the second sinker region 21111 is a groove
- the second photosensitive member 213 is disposed at the bottom of the groove, and is electrically connected to the second circuit board main body 2111 through the second electrical connection member 2133.
- the outer end of the second electrical connection element 2133 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outer side of the second sinker region 21111, and the invention is not limited in this respect.
- the top surface of the second photosensitive element 213 may coincide with the top surface of the second circuit board main body 2111, or be higher than the top surface of the second circuit board main body 2111, or lower than the second line.
- the top surface of the plate main body 2111, that is, the present invention does not limit the sinking depth.
- the second sinker region 21111 is a through hole, that is, both sides of the second circuit board 211 are communicated through the through hole.
- the second circuit board 211 of the second camera module unit 20 includes a second bottom plate 1113 disposed on the bottom of the second circuit board main body 2111 so as to support the photosensitive element and enhance the The structural strength of the two circuit board main body 2111. That is, the second photosensitive element 213 is sunkly disposed in the second sinker region 21111 and supported by the bottom plate 1113.
- the second photosensitive element 213 is electrically connected to the second wiring board main body 2111 through the second electrical connection element 2133.
- the bottom plate 1113 may be a metal plate disposed on the bottom of the second circuit board main body 2111 by attaching.
- the first susceptor 112 of the first photosensitive component 11 of the first camera module unit 10 integrally encapsulates the first photosensitive element 113 At least a portion of the first non-photosensitive region 1132.
- the first susceptor 112 integrally encapsulates the first wiring board 111 and the first photosensitive element 113 such that the first photosensitive element 113 is stably fixed, and the The formable area of the first pedestal 112 is described.
- the first pedestal 112 covers the first electrical connection element 1133.
- the first pedestal 112 is molded into the photosensitive element in a manner that the first pedestal 112 is formed only on the first circuit board 111 in the first embodiment.
- the range in which the integral molding can be performed is extended to the first non-photosensitive region 1132 of the first photosensitive member 113, thereby increasing the number without affecting the normal photosensitive operation of the first photosensitive member 113.
- a connection area at the bottom of a pedestal 112 so that the first pedestal 112 and the first circuit board 111 and the first photosensitive element 113 can be more stably connected, and the top portion can be other components, as described
- the first lens 12, the first lens support member 13, etc. provide a larger mountable area.
- the electrical connection element is covered by the first pedestal 112, thereby avoiding external interference with the electrical connection element, and preventing the electrical connection element from oxidizing or contaminating dust to affect the imaging quality of the camera module unit.
- the second pedestal 212 of the second photosensitive component 21 of the second camera module unit 20 integrally encapsulates at least a portion of the second non-photosensitive region 2132 of the second photosensitive element 213.
- the second susceptor 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213 such that the second photosensitive element 213 is stably fixed and the The formable area of the second pedestal 212 is described.
- the second pedestal 212 covers the second electrical connection element 2133.
- the second circuit board main body 2111 has a second sinking area 21111, and the second photosensitive element 213 is sunkenly disposed in the second sinking area 21111 to facilitate lowering.
- the second sinker region 21111 can be implemented as a groove or a through hole. That is, the two sides of the second circuit board main body 2111 may be disconnected or connected.
- the second sinker region 21111 is a groove
- the second photosensitive member 213 is disposed at the bottom of the groove, and is electrically connected to the second circuit board main body 2111 through the second electrical connection member 2133.
- the outer end of the second electrical connection element 2133 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outer side of the second sinker region 21111, and the invention is not limited in this respect.
- the top surface of the second photosensitive element 213 may coincide with the top surface of the second circuit board main body 2111, or be higher than the top surface of the second circuit board main body 2111, or lower than the second line.
- the top surface of the plate main body 2111, that is, the present invention does not limit the sinking depth.
- the second sinker region 21111 is a through hole, that is, both sides of the second circuit board 211 are communicated through the through hole.
- the second photosensitive element 213 and the second electrical connection element 2133 are integrally packaged by the second pedestal 212, so the second photosensitive element can be fixed by the second pedestal 212. 213.
- a second bottom plate may be disposed at the bottom of the second circuit board 211, or the second bottom plate may not be disposed.
- the first susceptor 212 of the first photosensitive component 21 of the first camera module unit 20 integrally encapsulates the first photosensitive element 213 At least a portion of the first non-photosensitive region 2132.
- the first susceptor 212 integrally encapsulates the first wiring board 211 and the first photosensitive element 213 such that the first photosensitive element 213 is stably fixed and the seat is enlarged.
- a formable region of the first pedestal 212 is described.
- the first pedestal 212 covers the first electrical connection element 2133.
- the first circuit board body 1111 includes a first board body 11112 and a second board body 11113.
- the first board body 11112 and the second board body 11113 are fixedly connected by a connecting medium 11114.
- the first plate 11112 may be a hard plate
- the second plate 11113 may be a soft plate
- the connecting medium 11114 may be an anisotropic conductive adhesive.
- the first board 11113 may further include an interface end, such as a connector, to facilitate electrical connection to an electronic device.
- the first base body 1121 is integrally formed with the first plate body 11112
- the second plate body 11113 is overlapped with one end of the first plate body 11112
- the first circuit board body 1111 may be formed by the first board body 11112 and the second board body 11113, and then integrally formed, or may be first in the first board body 11112.
- the first plate body 11113 is electrically connected to the first plate body 11112, for example, and is fixed to the first plate body 11112 by the anisotropic conductive adhesive.
- the second circuit board body 2111 can also be constructed in the above manner, and the present invention is not limited in this regard.
- the second circuit board main body 2111 is provided with a second reverse groove 21115, and the photosensitive element is mounted on the second reverse groove 21115 in an inverted manner.
- the second photosensitive element 213 is attached to the second wiring board main body 2111 by means of an FC (Flip Chip).
- FC Flexible Chip
- the second photosensitive element 213 is mounted from the second circuit board main body 2111 to the second circuit board main body 2111, and the second photosensitive element 213 is second.
- the photosensitive region 2131 is photo-sensitized through the upper opening of the second light window 2122 and the second reverse groove 21115.
- the first camera module unit 10 can also be configured in the above manner.
- FIG. 13 is a cross-sectional view of a split-type array camera module 100 in accordance with a tenth preferred embodiment of the present invention.
- the second pedestal 212 of the second photosensitive component 21 of the second camera module unit 20 integrally encapsulates the second photosensitive element 213 At least a portion of the second non-photosensitive region 2132.
- the second susceptor 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213 such that the second photosensitive element 213 is stably fixed and the The formable area of the second pedestal 212 is described.
- the second pedestal 212 covers the second electrical connection element 2133.
- the second base 212 includes a second extension mounting portion 2125 extending at least partially upward from the second base body 2121 and forming a second limiting slot 21251 for limiting the mounting of the second base.
- Lens 2224 or the second lens support element 2325 In this embodiment of the invention, the second lens 22 is mounted to the second extension mounting portion 2125, and the second extension mounting portion 2125 replaces the second lens support member 23 to form a certain focus Camera module.
- the first camera module unit 10 may also be configured as described above.
- FIG. 14 is a schematic diagram of a split-type array camera module 100 in accordance with an eleventh preferred embodiment of the present invention.
- the first circuit board main body 1111 and the second circuit board main body 2111 are integrally connected to form a unitary structure
- a pedestal 112 and the second pedestal 212 are respectively formed in different regions of the overall structure, that is, regions corresponding to the first circuit board main body 1111 and the second circuit board 211.
- the split-type array camera module 100 is composed of two camera module units of different heights, and the first camera module unit 10 and the second camera module unit 20 The relative position can be arranged according to the needs. For example, referring to FIG. 15A, the top ends of the first camera module unit 10 and the second camera module unit 20 are aligned, and there is a height difference at the bottom. For example, referring to FIG. 15B, the first camera module is made. The unit 10 and the bottom of the second camera module unit 20 are identical, and there is a height difference at the top.
- two of the first camera module unit 10 and the second camera module unit 20 are caused.
- the ends are inconsistent and there is a height difference at both ends. It should be understood by those skilled in the art that the type and height of the camera module unit are not limited by the present invention.
- the split-type array camera module 100 is composed of two camera module units of different sizes, and the first camera module unit 10 and the second camera module unit 20 The relative position can be arranged according to the needs.
- the structure of the assembly body 30 may vary with the size of the camera module, such as a position where the cross section of the camera module is large, so that the opening area of the assembly body 30 is large, and the camera module unit is The position of the cross section is small, so that the opening area of the assembly body 30 is small, so as to adapt to the size of each of the camera module units.
- FIG. 17 is a block diagram of a method of fabricating a split-type array camera module 100 in accordance with the above-described preferred embodiment of the present invention.
- the present invention provides a method 1000 for fabricating a split array camera module, the method comprising the steps of:
- Each camera module unit is assembled by an assembly 30.
- the method includes the following steps:
- a base is integrally formed on a circuit board.
- a lens is disposed on the photosensitive path of the photosensitive element
- the step 10012 may be before the step 10011 or after the step 10011.
- the method may include the steps of: integrally forming the base on the circuit board and the photosensitive element, for example, integrally molding a base on a circuit board and at least a portion of the non-photosensitive area of a photosensitive element.
- the circuit board and the photosensitive element are integrally packaged.
- the method includes the following steps:
- the present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one split array camera module 100, wherein the split array camera module 100 is respectively disposed on the electronic device body 200, for acquiring images.
- the type of the electronic device body 200 is not limited.
- the electronic device body 200 may be a smart phone, a wearable device, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, and a monitor. Any device or the like that can be configured with the camera module. It will be understood by those skilled in the art that although the electronic device body 200 is implemented as a smart phone in FIG. 35, it does not constitute a limitation on the content and scope of the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
本发明提供一阵列摄像模组,其包括:至少两摄像模组单元,其中至少一摄像模组单元包括:一感光组件和一镜头,其中所述感光组件包括一至少一线路板、一感光元件和一基座,所述感光元件电连接于所述线路板,所述基座一体成型于所述线路板,形成一光窗,为所述感光元件提供光线通路,所述镜头位于所述感光元件的光线通路;和一组装体,各摄像模组单元被分别地固定于所述组装体,以构成一整体。
Description
本发明涉及摄像模组领域,更进一步,涉及一分体式阵列摄像模组及其制造方法。
随着智能设备的不断发展,对摄像模组的要求越来越高。比如,近两年来,智能手机的摄像头由单个变成双摄像头,而双摄像头模组的发展也成为手机摄像模组发展的一个重要趋势。
简单来说,双摄像头可以通过两个摄像头的配合采集图像,从而实现更加丰富的图像采集功能。现有的双摄像头按照功能主要可以分为两类:一类是利用双摄像头产生立体视觉,获得影像的景深,利用景深信息进行背景虚化,3D扫描,辅助对焦,动作识别等应用,或者利用两张图片的信息进行融合;另一类是利用左右两张不同的图片进行融合,以期望得到更高的分辨率,更好的色彩,动态范围等更好的图像质量或实现光学变焦的功能。
另一方面,摄像模组的像素要求越来越高,镜头的镜片数量不断增多,由原来的两、三片到现在的五、六甚至更多片,对于高像素的摄像模组面临一方面要求体积小,另一方面要求光学成像质量好的这样的问题,而对于多摄像头的模组同样是面临着这样的问题,如何让模组整体适合高像素,且稳定、安全的将两个或者多个摄像模组相互配合地构成一整体的模组,以适应现有摄像模组发展中对于多摄像头模组的要求,这是需要解决的问题。
摄像头在安装于电子设备,比如智能手机时,外部需要保持平整,两个摄像头外观保证美观,因此如何将两个摄像模组外部规则的组装是多摄像模组需要考虑的问题之一。
进一步,多摄像头之间光轴的一致性是多摄像头摄像模组光学设计的一个重要方面,如何保证多个摄像模组能够被组装于一体,且可以保证光轴的一致性,这是多摄像头摄像模组制造中需要考虑的一个问题。
进一步,两个相互配合的摄像头,各自采集图像信息,而图像采集的准确性以及成像质量和两个摄像头入射的光线息息相关,两个摄像头之间的光轴一致性,是保证摄像模组成像质量的基础。也就是说,如何在稳定地、结构紧凑地固定两个摄像头的基础上,提高两个摄像模组的光轴一致性,或者使其误差在预定范围内,提高安装的精度,使其具较好的成像质量,是双摄像头发展需要考虑的另一重要问题。
进一步,传统的摄像模组,通常是通过COB方式组装的摄像模组,其基本结构包括一电路板、一感光元件、一镜座、一镜头和一滤光元件,其中所述感光元件贴附于所述电路板,通过一金线电连接于所述电路板,镜座通过胶水贴装于电路板,镜头被安装于镜座,所述滤光元件被安装于所述镜座,且电路板上通常设置有凸出的电子元件。这种结构中,一方面,镜座通常是通过注塑成型的方式制造完成后粘接于所述电路板,不能为镜头提供平整性较好的安装条件,且粘接固定方式增加了累积公差。另一方面,电子元件凸出于电路板,因此在安装镜座时需要预留安装空间,因此使得线路板的整体需求面积较大,且电子元件暴露于摄像模组内空间,表面沾染的灰尘杂质很容易影响摄像模组的成像效果。总之,传统的COB贴装方式的摄像模组存在诸多不利因素,尤其不适应于现有的高像素摄像模组的需求。
发明内容
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述分体式阵列摄像模组包括至少两摄像模组单元被分体地设置,从而可以相对独立对各摄像模组单元进行主动校准,使得各摄像模组单元的光轴一致。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述分体式阵列摄像模组包括一组装体,所述组装体将各所述摄像模组单元稳定地组装固定形成一整体。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述组装体具有一收容室,将各所述摄像模组单元收容于其中,使得所述分体式阵列摄像模组外部形状较规则,便于安装使用。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述组装体包括至少一分隔壁,所述分隔壁将所述收容室分隔,使得各所述摄像模组 单元相隔离地设置,减小相互之间的电磁干扰。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述组装体包括至少一支撑边,相所述收容室延伸,以便于稳定地支撑安装各所述摄像模组单元。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中一所述摄像模组单元包括一感光组件,所述感光组件包括一基座和一线路板,所述基座一体成型于所述线路板,具有良好的平整性,可以为被安装的部件提供平整的安装条件,从而提高所述摄像模组单元的光轴一致性。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述基座具有一光窗,为一感光元件提供光线通路,且所述基座的内侧壁倾斜地设置,减小杂散光反射至所述感光元件。
本发明的一个目的在于提供一分体式阵列摄像模组,其中所述感光元件具有至少一感光区和非感光区,所述基座一体封装所述感光元件的至少部分所述非感光区,以扩展所述基座的一体封装区域。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述线路板包括一线路板主体和至少一电子元件,所述电子元件凸出于所述线路板主体,所述基座一体成型于所述线路板主体,包覆所述电子元件,减小空间占用。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述感光元件通过至少一电连接元件电连接于所述线路板主体,所述基座包覆所述电连接元件。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述基座包括一支承元件,所述支承元件被间隔设置于所述线路板和所述基座主体,以便于在制造的过程中保护所述线路板和所述感光元件。
本发明一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述摄像模组单元包括一滤光元件,所述滤光元件被安装于所述基座主体。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述摄像模组单元包括一支座,所述支座被安装所述基座主体,一滤光元件被安装于所述支座。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述线路板主体具有一下沉区,所述感光元件被设置于所述下沉区,以降低所述感光 元件和所述线路板主体的相对高度。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述线路板主体包括一第一板体和一第二板体,所述第一板体通过一导电胶导电地连接于所述第二板体。
本发明的一个目的在于提供一分体式阵列摄像模组及其制造方法,其中所述各所述摄像模组单元的高度、大小可自由搭配组装,以便于不同类型的摄像模组单元的配合。
为了实现以上至少一发明目的,本发明的一方面提供一阵列摄像模组,其包括:至少两摄像模组单元和一组装体,其中各所述摄像模组单元被分别固定于所述组装体,以便于构成一整体。
根据一些实施例,所述组装体包括一上盖,用于固定连接各所述摄像模组单元。
根据一些实施例,其中所述组装体包括一主体,所述主体形成一收容室,各所述摄像模组单元被容纳于所述收容室。
根据一些实施例,其中所述组装体包括一上盖,所述上盖适于遮盖于所述收容室,所述上盖具有至少两镜头口,以便于各所述摄像模组单元被容纳于所述组装体的所述收容室内时,通过所述镜头口进行采光。
根据一些实施例,其中所述上盖一体地连接于所述主体。可以理解的是,所述组装体可以只实施为只具有上述上盖,或具有上述形成所述收容室的所述主体和一体形成于所述主体的所述上盖,或者没有上述上盖,而只有侧壁的主体等合适的结构。
根据一些实施例,其中所述组装体包括一分隔壁,所述分隔壁位于所述收容室内,将所述收容室分隔为至少两部分,分别用于容纳各所述摄像模组单元。
根据一些实施例,其中所述分隔壁材质选自塑料、树脂、橡胶、金属中的一种或多种。
根据一些实施例,其中所述分隔壁被连接于所述主体。根据一些实施例,所述组装体包括至少一分隔壁,所述分隔壁将所述收容室分隔为至少两部分,分别用于容纳各所述摄像模组单元,所述分隔壁被连接于所述上盖。
根据一些实施例,其中所述组装体包括至少一支撑边,所述支撑边自所述主体向内侧延伸,以便于支撑各所述摄像模组单元。
根据一些实施例,其中所述支撑边为凸台结构。
根据一些实施例,其中各所述摄像模组单元包括一感光组件和一镜头,其中所述镜头位于所述感光组件的感光路径,所述感光组件包括一线路板,一感光元件和一基座,所述基座一体成型于所述线路板,所述感光元件电连接于所述线路板,所述镜头位于所述感光元件的感光路径,所述基座具有一至少一光窗,为所述感光元件提供光线通路。
根据一些实施例,其中所述感光元件位于所述基座内侧。
根据一些实施例,其中所述感光组件包括所述基座一体封装所述线路板和所述感光元件的至少部分非感光区。
根据一些实施例,其中所述感光元件通过至少一电连接元件电连接于所述线路板,所述基座包覆所述电连接元件。
根据一些实施例,其中所述线路板包括至少一电子元件,所述一体基座包覆所述电子元件。
根据一些实施例,其中所述基座包括一支承元件,所述支撑元件被设置于所述线路板主体,以便于在制造的过程中保护所述线路板主体和所述感光元件。
根据一些实施例,其中所述基座包括一支承元件,所述支承元件被设置于所述感光元件的非感光区,以便于在制造的过程中保护所述感光元件。
根据一些实施例,其中各所述摄像单元包括一支座,所述支座被安装于所述基座,以便于安装一滤光元件。
根据一些实施例,所述支座至少部分被连接于所述线路板。
根据一些实施例,其中各所述摄像模组单元的各支座一体地连接。
根据一些实施例,其中所述线路板被设有至少一下沉区,所述感光元件被设置于所述下沉区,以便于降低所述感光元件和所述线路板的相对高度。
根据一些实施例,其中所述线路板包括一第一板体和一第二板体,所述第二板体通过一连接介质固定连接于所述第一板体。
根据一些实施例,其中所述第一板体为硬板,所述第二板体为软板,所述连接介质为各向异性导电胶。
根据一些实施例,其中所述基座包括一延伸安装部,自所述基座主体至少部分地向上延伸,以形成一限位槽,限位被安装的部件。
根据一些实施例,其中所述线路板被设有一倒贴槽,所述感光元件被设置于 所述倒贴槽,以便于以倒贴芯片方式将所述感光元件安装于所述线路板。
根据一些实施例,其中各所述摄像模组单元的所述线路板一体地连接。
根据一些实施例,其中各摄像模组单元被分体地设置。
根据一些实施例,其中各所述摄像模组单元的底部具有高度差。
根据一些实施例,其中各所述摄像模组单元包括一镜头支撑元件,所述镜头被安装于所述镜头支撑元件,所述镜头支撑元件被安装于所述基座。
根据一些实施例,其中所述镜头支撑元件为一驱动元件,以便于所述摄像模组单元构成一动焦摄像模组。
根据一些实施例,其中所述镜头支撑元件是一镜筒元件,以便于所述摄像模组单元构成一定焦摄像模组。
根据一些实施例,其中各所述摄像模组单元中至少两个是定焦摄像模组。
根据一些实施例,其中各所述摄像模组单元中至少两个是动焦摄像模组。
根据一些实施例,其中各所述摄像模组单元中至少一个是动焦摄像模组,至少一个是定焦摄像模组。
根据一些实施例,其中各所述阵列摄像模组包括一滤光元件,所述滤光元件被安装于所述基座。
根据一些实施例,其中所述线路板类型选自硬板,软板,软硬结合板,软板。
图1是根据本发明的第一个优选实施例的分体式阵列摄像模组的立体示意图。
图2根据本发明的第一个优选实施例的分体式阵列摄像模组的分解示意图。
图3是根据本发明的第一个优选实施例的分体式阵列摄像模组组装过程示意图。
图4是根据本发明的第一个优选实施例的分体式阵列摄像模组的剖视示意图。
图5是根据本发明的第二个优选实施例的分体式阵列摄像模组的剖视示意图。
图6是根据本发明的第三个优选实施例的分体式阵列摄像模组的剖视示意图。
图7是根据本发明的第四个优选实施例的分体式阵列摄像模组的剖视示意图。
图8A,8B是根据本发明的第五个优选实施例的分体式阵列摄像模组的剖视示意图。
图9是根据本发明的第六个优选实施例的分体式阵列摄像模组的剖视示意图。
图10是根据本发明的第七个优选实施例的分体式阵列摄像模组的剖视示意图。
图11是根据本发明的第八个优选实施例的分体式阵列摄像模组的剖视示意图。
图12是根据本发明的第九个优选实施例的分体式阵列摄像模组的剖视示意图。
图13是根据本发明的第十个优选实施例的分体式阵列摄像模组的剖视示意图。
图14是根据本发明的第十二个优选实施例的分体式阵列摄像模组示意图。
图15A,15B,15C是根据本发明的第十个优选实施例的分体式阵列摄像模组的不同实施方式剖视示意图。
图16是根据本发明的第十一个优选实施例的分体式阵列摄像模组的俯视图。
图17是根据本发明的上述优选实施例的分体式阵列摄像模组制造方法框图。
图18是根据本发明的上述优选实施例的分体式阵列摄像模组的应用示意图。
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特 定的方位构造和操作,因此上述术语不能理解为对本发明的限制。
多摄像头的摄像模组是摄像模组近期发展的重要趋势,尤其当摄像模组的各种性能以趋于极致,摄像模组的像素越来越高,镜头的镜片数量越来越多的情况下,发展多摄像头的摄像模组已经成为重要趋势和方向。多个摄像模组的配合可以实现更多的功能,比如利用双摄像头产生立体视觉,获得影像的景深,利用景深信息进行背景虚化,3D扫描,辅助对焦,动作识别等应用,或者利用两张图片的信息进行融合;或者利用左右两张不同的图片进行融合,以期望得到更高的分辨率,更好的色彩,动态范围等更好的图像质量或实现光学变焦的功能。可是这些不同的功能的摄像模组的结合,且能够稳定的被安装应用,需要硬件的配合实现,而现有的多摄像头模组大多停留在理论阶段,或者仅仅是将两个摄像模组各自独立组装,相互位置关系通过安装的位置来确定,不宜于大范围的生产应用。根据本发明的实施例,提供一分体式阵列摄像模组,其包括至少两摄像模组单元和一组装体,各所述摄像模组单元通过所述组装体被分体地组装,使得各摄像模组之间相互影响较小,且结构上形成一个整体,外观规整,便于安装应用。且进一步,根据本发明的实施例,各所述摄像模组单元包括至少一感光组件,所述感光组件包括一基座和一线路板,所述基座贴装或通过一体成型的方式形成于所述线路板,优选通过一体成型的方式使得基座能够提供平整的安装平面,优于传统的COB组装方式,提高摄像模组的光学性能,且在体积、工艺方面优化。而所述摄像模组单元的可以被制造为不同类型的摄像模组,因此本发明的摄像模组单元的具体优化结构和本发明的摄像模组单元的组装结构结合在一起,提供一结构规整,且光学性能良好、体积优化的阵列摄像模组,使得相同的或不同的摄像模组能够稳定、安全地组装于一体,形成一整体,实现更多功能。
本发明的所述分体式阵列摄像模组可以被应用于电子设备,所述电子设备举例地但不限于,智能手机,笔记本电脑,平板电脑,相机,监控设备,可穿戴设备,
为了便于说明,以下以两个摄像模组单元构成的分体式双摄阵列摄像模组100为例进行说明。在本发明的其他实施例中,所述分体式阵列摄像模组100可以包括更多个所述摄像模组单元,本发明在这方面并不限制。
参照图1至图4,根据本发明的第一个优选实施例的分体式阵列摄像模组100。所述分体式阵列摄像模组100包括至少两摄像模组单元和一组装体30,各所述 摄像模组单元被分体地组装于所述组装体30,从而形成一整体。
具体地,两所述摄像模组单元分别为一第一摄像模组单元10和一第二摄像模组单元20。所述组装体30包括一主体31并且具有一收容室32,所述第一摄像模组单元10和所述第二摄像模组单元20被容纳于所述收容室32内。换句话说,所述主体31形成所述收容室32,将所述第一摄像模组单元10和所述第二摄像模组单元20限位固定于其中,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20构成一整体,便于安装应用。值得一提的是,所述收容室32并不是封闭结构,而是半开放结构,以便于各所述摄像模组单元得以进行采光以及提供可电连接的位置。
在本发明的其他实施例中,所述组装体可以不形成明显的所述收容室,比如通过间隔的板状部件固定所述第一摄像模组单元10和所述第二摄像模组单元20。
进一步,所述第一摄像模组单元10和所述第二摄像模组单元20分别被固定于所述组装体30的所述主体31的侧壁,比如,通过胶水粘接固定,从而通过所述主体31分别为所述第一摄像模组单元10和所述第二摄像模组单元20提供固定位置,使得所述第一摄像模组单元10和所述第二摄像模组单元20的相对位置确定,形成一阵列结构。值得一提的是,在本发明中所述的阵列,用来表述各摄像模组单元形成一种位置布局关系,并不是限于以列的方式排布,布局方式可以根据需求以及阵列摄像模组的数量、类型来确定,比如线性排列,三角形排列、对称排列等。
更具体地,在一些实施例中,所述组装体30可以是一方形框架结构,从而使得各所述摄像模组单元被限位组装于方形的规整结构中,方便安装应用,比如安装于电子设备。当然,在本发明的其他实施例中,所述组装体30的结构可以随各所述摄像模组单元的大小、结构而变形,从而形成规则或不规则的结构,使得各所述摄像模组单元得以被稳定组装。
进一步,所述组装体30包括一上盖33,所述上盖33适于遮挡于所述主体31,以便于将所述收容室32封闭。进一步,所述上盖33具有至少两镜头口331,所述镜头口331与各所述摄像模组单元相对应,以便于各所述摄像模组单元通过所述镜头口331进行采光。
在本发明的这个实施例中,所述上盖33一体地连接于所述主体31,从而构造一整体的容纳结构。举例地,在组装所述分体式阵列摄像模组的过程中,
当然,在本发明的其他实施中,可以不设置所述上盖33,或者使得所述上盖33与所述主体31分离地连接,或只连接所述上盖33而不连接所述主31,本领域的技术人员应当理解的是,所述上盖33的设置,以及连接方式并不是本发明的限制。
进一步,参照图3,举例地,所述分体式阵列摄像模组100的组装过程可以是,先将所述组装体30倒置,在所述摄像模组单元10,20的顶部施加胶水,而后将所述倒置地预组装于所述组装体30,进一步,对所述第一摄像模组单元10和所述第二摄像模组单元20分别进行主动校准,使得所述第一摄像模组单元10和所述第二摄像模组单元20的光轴一致,而后将所述第一摄像模组单元10和所述第二摄像模组单元20进行固化,使得所述第一摄像模组单元10和所述第二摄像模组单元20固定连接于所述组装体30。
值得一提的是,所述摄像模组单元10,20与所述组装体30的固定位置可以是顶部,也可以是侧壁。比如,在粘接时可以在所述组装体30的所述主体31的侧壁和所述摄像模组单元固定,和/或者在粘接时可以在所述组装体30的所述上盖33和所述摄像模组单元固定。所述组装体30可以没有所述上盖33,所述摄像模组单元10,20与所述组装体30的所述侧壁或底壁相连接。本领域的技术人员应当理解的是,所述胶水的粘接位置,并不是本发明的限制。
在本发明的另一实施例中,参照图15,所述组装体30可以包括一支撑边34,被设置于所述主体31的底部,以便于支撑所述第一摄像模组单元10和所述第二摄像模组单元20。具体地,所述支撑边34自所述主体31向所述收容室32内延伸,以形成一凸台,为所述第一摄像模组单元10和所述第二摄像模组单元20提供支撑位置。所述上盖33可分离地连接于所述主体31。
所述支撑边34限位所述第一摄像模组单元10和所述第二摄像模组单元20,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20处于预定位置。值得一提是,在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20对应的所述支撑边34的高度相同,当两个摄像模组单元的高度相同时,可以使得各所述摄像模组单元的端部高度一致。在本发明的其他实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20所在位置对应所述支撑边34的高度可以不同,从而可以提供不同的限位高度,即使两个所述摄像模组单元的高度不同,仍旧可以通过所述支撑边34补偿所述第一摄像模组单元10 和所述第二摄像模组单元20的高度差,使得所述分体式阵列摄像模组100的端部一致。当然,在本发明的其他实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20的顶部高度可以不一致,本发明在这方面并不限制。也就是说,所述支撑边34可以是同一平面的凸台,也可以是不同平面的凸台,所述摄像模组的高度可以相同,也可以不同,所述第一摄像模组单元10和所述第二摄像模组单元20的顶部可以一致,也可以不一致,本发明在这些方面都不限制。
值得一提的是,本发明中所述第一摄像模组单元10和所述第二摄像模组单元20分体地设置,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20的相互影响较小,且通过所述组装体30封装,保证所述第一摄像模组单元10和所述第二摄像模组单元20的光轴的一致性。而在组装的过程中,可以分别将所述第一摄像模组单元10和所述第二摄像模组单元20预组装于所述组装体30,进而对所述第一摄像模组单元10和/或所述第二摄像模组单元20进行自动校准,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20的光轴一致,或者光轴夹角处于预定的误差范围内,或保持一定距离的相对位置。而假如所述第一摄像模组单元10和所述第二摄像模组单元20连体固定设置时,且相互之间的影响较大,也就是说,对其中一摄像模组单元进行调整时,必然会影响另一个摄像模组单元,并不能实现本发明的中的独立主动校准的目的。
在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20的基本结构一致,也就是说,所述第一摄像模组单元10和所述第二摄像模组单元20可以为相同类型的摄像模组,当然,在本发明的其他实施例中,所述第一摄像模组可以为不同类型,本发明在这方面并不限制。
具体地,所述第一摄像模组单元10包括一第一感光组件11、一第一镜头12、一第一镜头支撑元件13和一第一滤光元件14。
所述第一镜头12位于所述第一感光组件11的感光路径,所述第一镜头12被安装于所述第一镜头支撑元件13,所述第一镜头支撑元件13被安装于所述第一感光组件11,以使得所述第一镜头12位于所述第一感光组件11的感光路径,所述第一滤光元件14被安装于所述第一感光组件11,以使得通过所述第一镜头12的光线经过所述第一滤光元件14的作用而到达所述第一感光组件11。
所述第一感光组件11包括一第一线路板111、一第一感光元件113和以第一基座112。
所述第一感光元件113电连接于所述第一线路板111,以便于向所述第一线路板111传递感光信息,所述第一镜头12位于所述第一感光元件113的感光路径,以便于所述第一感光元件113接收光线而进行感光。特别地,在一些实施方式中,所述第一感光元件113可以通过表面贴装工艺SMT(Surface Mount Technology)被设置于所述第一线路板111,且通过至少一第一电连接元件1133电连接于所述第一线路板111。所述第一电连接元件1133举例地但不限于,金线、银线、铜线、铝线、焊盘、引脚等。
所述第一感光元件113具有一第一感光区1131和第一非感光区1132,所述第一感光区1131用于进行感光作用,所述第一非感光区1132用于电连接于所述第一线路板111。在本发明的这个实施例中,所述第一非感光区1132通过所述电连接元件电连接于所述第一线路板111。
在发明的这个实施例中,所述第一感光元件113位于所述第一基座112的内侧,也就是说,并没有被所述基座封装。在本发明的这种实施例中,所述第一感光元件113需要贴装于所述第一线路板111,比如胶水粘接,从而使得所述第一感光元件113被稳定地固定,而后将所述第一感光元件113通过所述第一电连接元件1133电连接于所述第一线路板111,比如通过打金线的方式电连接于所述第一线路板111。
进一步,所述第一基座112一体连接于所述第一线路板111。所述第一基座112包括一第一基座主体1121以及具有一第一光窗1122。所述第一光窗1122为所述第一感光元件113提供光线通路。换句话说,所述第一感光元件113位于所述第一光窗1122内,所述第一感光元件113的感光路径与所述第一光窗1122方向一致。
更具体地,所述第一基座主体1121形成所述第一光窗1122,为所述第一感光元件113提供光线通路。在一些实施例中,所述第一基座主体1121是一闭合环形结构,适应所述第一感光元件113的形状。
在本发明的这个实施例中,所述第一基座主体1121具有一第一内侧壁,所述第一内侧壁具有倾斜角,从而方便模具制造,且减少杂散光反射至所述感光元件。比如,当所述侧壁为垂直角度时,到达所述第一基座主体1121的光线的入射角较大,因此光线的反射角较大,比较容易向内侧反射,即向所述感光元件所在位置反射。而当所述第一内侧壁倾斜时,光线的入射角较小,同方向入射的光 线,反射光线向远离所述感光元件的位置偏移,从而倾斜的设置方式有助于减少杂散光的干扰。所述倾斜角的大小可以根据需求设置。当然,在一些实施例中,所述第一基座主体1121的所述第一内侧壁可以为竖直设置,也就是说,不存在所述倾斜角。
进一步地,根据本发明的实施例,所述第一基座112通过一体成型的方式设置于所述第一线路板111,比如模塑成型的方式,从而将所述第一基座112和所述第一线路板111稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组单元的高度。
举例地,所述第一基座112可以通过模具模塑一体成型的方式设置于所述第一线路板111,如模塑于线路板的方式,区别于传统的COB(Chip On Board)方式。通过模具一体成型的方式,可以较好地控制成型形状以及表面平整度,比如,使得第一基座主体1121具有较好的平整度,从而为被安装的部件,比如所述镜头支撑元件、所述第一滤光元件14,提供平整的安装条件,从而有助于提高所述第一摄像模组单元10的光轴一致性。
进一步,根据本发明的这个实施例,所述第一线路板111包括一第一线路板主体1111和至少一第一电子元件1112,所述第一电子元件1112凸出于所述第一线路板主体1111,用于配合所述第一线路板主体1111的工作。所述第一基座112一体成型于所述第一线路板主体1111,并且包覆所述第一电子元件1112,从而减少所述第一电子元件1112的占用空间。所述第一电子元件1112举例地但不限于,电阻、电容、驱动器等。当然,在本发明的另一些实施例中,可以不设置所述第一电子元件1112或者所述第一电子元件1112凸出于所述第一线路板主体1111,比如内埋于所述第一线路板主体1111,本发明在这方面并不限制。
每个所述第一电子元件1112可以通过诸如SMT工艺被相互间隔地贴装于所述第一线路板111的边缘区域,比如所述第一感光元件113外侧。值得一提的是,每个所述第一电子元件1112可以分别位于所述第一线路板111的同侧或者相反侧,例如在一个具体示例中,所述第一感光元件113和每个所述第一电子元件1112可以分别位于所述第一线路板111的同一侧,并且所述第一感光元件113被贴装于所述第一线路板111的芯片贴装区域,每个所述第一电子元件1112分别被相互间隔地贴装于所述第一线路板111的边缘区域。所述第一基座112在成型后包覆每个所述第一电子元件1112,以藉由所述第一基座112隔离相邻所述 第一电子元件1112和隔离所述第一电子元件1112与所述第一感光元件113。
在本发明的所述摄像模组中,通过所述第一基座112在成型后包覆每个所述第一电子元件1112的方式具有很多的优势,首先,所述第一基座112包覆每个所述第一电子元件1112,以使相邻所述第一电子元件1112之间不会出现相互干扰的不良现象,即便是相邻所述第一电子元件1112的距离较近时也能够保证所述摄像模组单元的成像品质,这样,可以使小面积的所述第一线路板111上能够被贴装更多数量的所述第一电子元件1112,从而使所述摄像模组单元的结构更加的紧凑,以有利于在控制所述摄像模组单元的尺寸的基础上提高所述摄像模组单元的成像品质;其次,所述第一基座112包覆每个所述第一电子元件1112,从而无论是在水平方向还是在高度方向,在所述第一基座112和每个所述第一电子元件1112之间都不需要预留安全距离,以能够减小所述摄像模组单元的尺寸。第三,所述第一基座112包覆每个所述第一电子元件1112,从而在所述第一基座112和所述第一线路板111间不需要使用胶水进行连接和调平,以有利于降低所述摄像模组单元的高度尺寸。第四,所述第一基座112包覆每个所述第一电子元件1112,在后续运输和组装所述摄像模组单元以形成所述分体式阵列摄像模组100的过程中,所述第一基座112可以防止所述第一电子元件1112晃动和脱落,从而有利于保证所述分体式阵列摄像模组100的结构稳定性。第五,所述第一基座112包覆每个所述第一电子元件1112,在后续运输和组装所述摄像模组单元以形成所述分体式阵列摄像模组100的过程中,能够防止污染物污染每个所述第一电子元件1112,或电子元件表面的污染物脱落污染感光元件从而保证所述第一摄像模组单元10的成像品质。第六,所述第一基座112包覆所述电子元件后能够将所述第一电子元件1112与空气隔绝,通过这样的方式,能够减缓所述第一电子元件1112的金属部分的氧化速度,有利于提高所述第一电子元件1112和所述分体式阵列摄像模组100的环境稳定性。
值得一提的是,所述第一基座112一体成型于所述第一线路板主体1111,并且包覆所述第一线路板111的所述第一电子元件1112,从而使得所述第一基座112和所述第一线路板主体1111具有较大的连接面积,连接更加稳定,且通过一体成型的方式具有较好的结构强度,因此所述第一基座112可以牢固、可靠地支撑、固定所述第一摄像模组单元10的部件,从而保证了产品的良率。
还值得一提的是,对于高像素的摄像模组单元,所述镜头的镜片数量不断增 多,比如达到5p,6p以及6p以上等,而当摄像模组镜头的镜片数量增多时,同时需要满足光学性能的需求,比如提供更小的后焦距,以防止所述滤光元件影响所述摄像模组单元的成像质量,比如提供更洁净和更平整的安装条件,使得成像不出现黑点,边缘像糊等,而根据本发明的实施例中,所述滤光元件被安装于一体成型的所述基座,从而可以为所述滤光元件提供平整的安装条件,且可以通过所述基座的高度有效地控制所述滤光元件被安装的高度位置,因此本发明的结构更适于高像素的摄像模组。
所述第一基座112具有一第一安装槽1123,连通于所述第一光窗1122。所述第一滤光元件14位于所述第一镜头12和所述第一感光元件113之间,以便于过滤通过所述第一镜头12到达所述第一感光元件113的光线。所述第一滤光元件14被安装于所述第一安装槽1123。举例地,所述第一滤光元件14能够被实施为红外截止滤光片、全透光谱滤光片、蓝玻璃滤光片等。
所述第二摄像模组单元20包括一第二感光组件21、一第二镜头22、一第二镜头支撑元件23和一第二滤光元件24。
所述第二镜头22位于所述第二感光组件21的感光路径,所述第二镜头22被安装于所述第二镜头支撑元件23,所述第二镜头支撑元件23被安装于所述第二感光组件21,以使得所述第二镜头22位于所述第二感光组件21的感光路径,所述第二滤光元件24被安装于所述第二感光组件21,以使得通过所述第二镜头22的光线经过所述第二滤光元件24的作用而到达所述第二感光组件21。
所述第二感光组件21包括一第二线路板211、一第二感光元件213和以第二基座212。
所述第二感光元件213电连接于所述第二线路板211,以便于向所述第二线路板211传递感光信息,所述第二镜头22位于所述第二感光元件213的感光路径,以便于所述第二感光元件213接收光线而进行感光。特别地,在一些实施方式中,所述第二感光元件213可以通过表面贴装工艺SMT(Surface Mount Technology)被设置于所述第二线路板211,且通过至少一第二电连接元件2133电连接于所述第二线路板211。所述第二电连接元件2133举例地但不限于,金线、银线、铜线、铝线、焊盘、引脚等。
所述第二感光元件213具有一第二感光区2131和第二非感光区2132,所述第二感光区2131用于进行感光作用,所述第二非感光区2132用于电连接于所述 第二线路板211。在本发明的这个实施例中,所述第二非感光区2132通过所述电连接元件电连接于所述第二线路板211。
在发明的这个实施例中,所述第二感光元件213位于所述第二基座212的内侧,也就是说,并没有被所述基座封装。在本发明的这种实施例中,所述第二感光元件213需要贴装于所述第二线路板211,比如胶水粘接,从而使得所述第二感光元件213被稳定地固定,而后将所述第二感光元件213通过所述第二电连接元件2133电连接于所述第二线路板211,比如通过打金线的方式电连接于所述第二线路板211。
进一步,所述第二基座212一体连接于所述第二线路板211。所述第二基座212包括一第二基座主体2121以及具有一第二光窗2122。所述第二光窗2122为所述第二感光元件213提供光线通路。换句话说,所述第二感光元件213位于所述第二光窗2122内,所述第二感光元件213的感光路径与所述第二光窗2122方向一致。
更具体地,所述第二基座主体2121形成所述第二光窗2122,为所述第二感光元件21313提供光线通路。在一些实施例中,所述第二基座主体2121是一闭合环形结构,适应所述第二感光元件213的形状。
在本发明的这个实施例中,所述第二基座主体2121具有一第二内侧壁,所述第二内侧壁具有一倾斜角α,从而方便模具制造,且减少杂散光反射至所述感光元件。比如,当所述侧壁为垂直角度时,到达所述第二基座主体2121的光线的入射角较大,因此光线的反射角较大,比较容易向内侧反射,即向所述感光元件所在位置反射。而当所述第二内侧壁倾斜时,光线的入射角较小,同方向入射的光线,反射光线方向远离所述感光元件的位置偏移,从而倾斜的设置方式有助于减少杂散光的干扰。所述倾斜角α的大小可以根据需求设置。当然,在一些实施例中,所第二基座主体2121的所述第二内侧壁可以为竖直设置,也就是说,不存在所述倾斜角α。
进一步地,根据本发明的这个实施例,所述第二基座212通过一体成型的方式设置于所述第二线路板211,比如模塑成型的方式,从而将所述第二基座212和所述第二线路板211稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组单元的高度。
举例地,所述第二基座212可以通过模具模塑一体成型的方式设置于所述第 二线路板211,如模塑于线路板的方式,区别于传统的COB(Chip On Board)方式。通过模具一体成型的方式,可以较好地控制成型形状以及表面平整度,比如,使得第二基座主体2121具有较好的平整度,从而为被安装的部件,比如第二所述镜头支撑元件23、所述第二滤光元件24,提供平整的安装条件,从而有助于提高所述第二摄像模组单元20的光轴一致性。
进一步,根据本发明的这个实施例,所述第二线路板211包括一第二线路板主体2111和至少一第二电子元件2112,所述第二电子元件2112凸出于所述第二线路板主体2111,用于配合所述第二线路板主体2111的工作。所述第二基座212一体成型于所述第二线路板主体2111,并且包覆至少部分所述第二电子元件2112,从而减少所述第二电子元件2112的占用空间。所述第二电子元件2112举例地但不限于,电阻、电容、驱动器等。当然,在本发明的另一些实施例中,可以不设置所述第二电子元件2112或者所述第二电子元件2112不凸出于所述第二线路板主体2111,比如内埋于所述第二线路板主体2111,本发明在这方面并不限制。举例地,所述第一线路板主体1111和所述第二线路板主体2111的类型选择软板、硬板、软硬结合板。
每个所述第二电子元件2112可以通过诸如SMT工艺被相互间隔地贴装于所述第二线路板211的边缘区域,比如所述第二感光元件213外侧。值得一提的是,每个所述第二电子元件2112可以分别位于所述第二线路板211的同侧或者相反侧,例如在一个具体示例中,所述第二感光元件213和每个所述第二电子元件2112可以分别位于所述第二线路板211的同一侧,并且所述第二感光元件213被贴装于所述第二线路板211的芯片贴装区域,每个所述第二电子元件2112分别被相互间隔地贴装于所述第二线路板211的边缘区域。所述第二基座212在成型后包覆每个所述第二电子元件2112,以藉由所述第二基座212隔离相邻所述第二电子元件2112和隔离所述第二电子元件2112与所述第二感光元件213。
所述第二基座212一体成型设置于所述第二线路板211带来的优势与所述第一摄像模组单元10一致,在此不再赘述。可以理解的是,所述第一和第二基座也可以通过胶水贴装的方式分别设置于所述第一和第二线路板。优选地,所述第一和第二基座中至少一个所述基座通过一体成型的方式设置于对应的所述线路板。例如两个所述基座都一体成型的方式设置于对应的所述线路板,或者一个所述基座一体成型的方式设置于对应的所述线路板,而另一个所述基座是传统的支 架,并通过贴装的方式设置于对应的所述线路板。
进一步,所述第一镜头支撑元件13和所述第二镜头支撑元件23可以被实施为一驱动元件或一镜筒元件,从而形成一动焦摄像模组或一定焦摄像模组。所述驱动元件举例地但不限于,音圈马达,压电马达等。比如,当所述第一镜头支撑元件13和所述第二镜头支撑元件23都被实施为一驱动元件时,所述第一摄像模组单元10和所述第二摄像模组单元20都为动焦摄像模组,也就是说,所述分体式阵列摄像模组100是由两个动焦摄像模组构成。当所述第一镜头12支撑单元被实施为驱动元件,所述第二镜头支撑元件23被实施为镜筒元件时,所述第一摄像模组单元10为动焦摄像模组,所述第二摄像模组单元20是定焦摄像模组,也就是说,所述分体式阵列摄像模组100由一动焦摄像模组和一定焦摄像模组构成。当所述第一镜头支撑元件13被实施为镜筒元件,所述第二镜头22元件被实施为一驱动元件时,所述第一摄像模组单元1010为定焦摄像模组,所述第二摄像模组单元20为动焦摄像模组。当所述第一镜头支撑元件13和所述第二镜头支撑元件23都被实施为所述镜筒元件时,所述第一摄像模组单元10和所述第二摄像模组单元20都为定焦摄像模组。
值得一提的是,在一些实施例中,当所述第一镜头支撑元件13或所述第二镜头支撑元件23被实施为驱动元件时,所述第一镜头支撑元件13和所述第二镜头支撑元件23电连接于所述第一线路板111或所述第二线路板211,以便于驱动所述第一镜头12或所述第二镜头22工作。举例地,所述第一镜头支撑元件13和所述第二镜头支撑元件23可以通过设置引脚、焊盘或引线等方式电连接于所述第一线路板111或所述第二线路板211。
所述第一摄像模组单元10和所述第二摄像模组单元20的类型可以根据需求配置,以便于相互配合实现更好的图像采集效果,本发明在这方面并不限制。
值得一提的是,在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20的所述第一感光元件113以及所述第二感光元件213的类型可以相同,也可以不同,从而形成不同功能的摄像模组单元。
如图5所示,根据本发明的第二个优选实施例的分体式阵列摄像模组100的剖视示意图。不同于上述实施例的是,所述第二摄像模组单元20的所述第二感光组件21的所述第二基座212一体封装所述第二感光元件213的至少部分所述第二非感光区2132。换句话说,所述第二基座212一体成型地封装所述第二线 路板211、所述第二感光元件213,从而使得所述第二感光元件213被稳定地固定,且增大了所述第二基座212的可成型区域。所述第二基座212包覆所述第二电连接元件2133。
值得一提的是说,相对于上述第一个实施例中第一基座112只成型于所述第一线路板111的方式,模塑成型于感光元件的方式将所述第二基座212可以进行一体成型的范围扩展至所述第二感光元件213的所述第二非感光区2132,从而在不影响所述第二感光元件213的正常感光工作的情况下,增大了所述第二基座212底部的连接面积,从而可以使得所述第二基座212和所述第二线路板211以及所述第二感光元件213更加稳定地连接,且顶部可以为其他部件,如所述第二镜头22、所述第二镜头支撑元件23等,提供更大的可安装面积。且所述第二电连接元件2133被所述第二基座212包覆,从而避免外部干扰所述第二电连接元件2133,且防止所述第二电连接元件2133氧化或沾染灰尘而影响所述摄像模组单元的成像质量。
如图6所示,是根据本发明的第三个优选实施例的分体式阵列摄像模组100的剖视示意图。在本发明的这个实施例中,所述组装体30包括一分隔壁35,被设置于所述收容室32内,从而将所述收容室32进行分隔,分别容纳各所述摄像模组单元。所述分隔壁35可以由塑料、树脂、橡胶、金属等材料制成,以便于减弱所述第一摄像模组单元10和所述第二摄像模组单元20的电磁干扰。
进一步,在本发明的一个实施例中,所述分隔壁35固定连接于所述上盖33,从而当所述上盖33封闭所述收容室32时,所述分隔壁35将所述第一摄像模组单元10和所述第二摄像模组单元20隔离。
在本发明的另一实施例中,所述分隔壁35固定连接于所述主体31的侧壁,将所述收容室32分隔为两部分,分别容纳所述第一摄像模组单元10和所述第二摄像模组单元20。也就是说,当所述第一摄像模组单元10和所述第二摄像模组单元20被安装于所述组装体30时,所述第一摄像模组单元10和所述第二摄像模组单元20被所述分隔壁35隔离。当然,在本发明的其他实施例中,所述分隔壁35还可以是其他结构和材质,本发明在这方面并不限制。
如图7所示,是根据本发明的第四个优选实施例的分体式阵列摄像模组100的剖视示意图。在这种实施方式中,所述第一基座112包括一第一支承元件1124,用于在制造的过程中支撑模具,防止对所述第一线路板111或所述第一感光元件 113的损伤。也就是说,在制造的过程中,可以将所述制造模具抵靠于所述第一支承元件1124,从而使得模具不会直接接触所述第一线路板111或所述第一感光元件113,且防止成型材料向内侧溢流。
进一步,所述第一支承元件1124可以为环形结构,与所述第一基座主体1121的边缘形状一致。所述第一支承元件1124具有弹性,举例地但不限于,胶水涂层或胶垫。
所述第二基座212包括一第二支承元件2124,用于在制造的过程中支撑模具,防止对所述第二线路板211或所述第二感光元件213的损伤。也就是说,在制造的过程中,可以将所述制造模具抵靠于所述第二支承元件2124,从而使得模具不会直接接触所述第一线路板111或所述第二感光元件213,且防止成型材料向内侧溢流。
进一步,所述第二支承元件2124可以为环形结构,与所述第二基座主体2121的边缘形状一致。所述第二支承元件2124具有弹性,举例地但不限于,胶水涂层或胶垫。
如图8A,8B所示,是根据本发明的第五个优选实施例的分体式阵列摄像模组100的剖视示意图。参照图8A,在本发明的这个实施中,所述第一摄像模组单元10包括一第一支座15,用于安装其他部件,如所述第一滤光元件14、所述第一镜头12或所述第一镜头支撑元件13。
在本发明的这个实施例附图中,所述第一支座15被安装于所述第一基座主体1121,所述第一滤光元件14被安装于所述第一支座15。特别地,所述第一支座15下沉于所述第一基座112的所述第一光窗1122内,从而使得所述第一滤光元件14的位置下沉,靠近所述第一感光元件113,减小所述第一摄像模组单元10的后焦距占用,且减小所述第一滤光元件14的需求面积。
所述第二支座25被安装于所述第二基座主体2121,所述第二滤光元件24被安装于所述第二支座25。特别地,所述第二支座25下沉于所述第二基座212的所述第二光窗2122内,从而使得所述第二滤光元件24的位置下沉,靠近所述第二感光元件213,减小所述第二摄像模组单元20的后焦距占用,且减小所述第二滤光元件24的需求面积。当然,本发明的其他实施例中,所述阵列摄像模组可以只包括一个所述支座,比如所述第一支座15或所述第二支座25,本领域的技术人员应当理解的是,所述支座的数量并不是本发明的限制。
在这个实施例中,所述第一支座15被安装于所述第一基座112的所述第一安装槽1123,所述第二支座25被安装于所述第二基座212的所述第二安装槽2123。而在本发明的其他实施例中,所述第一基座主体1121和所述第二基座主体2121可以为平台结构,所述第一支座15和所述第二支座25也可以并不向下沉,且被直接安装于所述第一支座15和所述第二支座25的平台结构,本领域的技术的人员应当理解的是,所述支座的安装位置和具体结构并不是本发明的限制。
值得一提的是,在本发明的其他实施例中,所述支座可以配合所述基座形成所述光窗,也就是说,所述基座可以具有开口,连通于外部,而所述支座可以补充于所述开口,形成一封闭的所述光窗。举例地,所述支座可以延伸连接至所述线路板主体,以形成封闭的光窗。
参照图8B,在这种实施方式中,所述第一支座15和所述第二支座25一体地连接。也就是说,所述第一支座15和所述第二支座25相邻的部分相互连接,从而能够一次安装于所述第一基座112和所述第二基座212,并且提供相对一致的安装条件。
图9是根据本发明的第六个优选实施例的分体式阵列摄像模组100的剖视示意图。在这个实施例中,与第一个实施例不同的是,所述第二线路板主体2111具有一第二下沉区21111,所述第二感光元件213被下沉地设置于所述第二下沉区21111,以便于降低所述第二感光元件213和所述第二线路板主体2111的相对高度。
所述第二下沉区21111可以被实施为一凹槽或通孔。也就是说,可以使得所述第二线路板主体2111两侧不连通或者连通。当所述第二下沉区21111为凹槽时,所述第二感光元件213被设置于槽底,并且通过所述第二电连接元件2133电连接于所述第二线路板主体2111。所述第二电连接元件2133的外端可以被电连接于所述凹槽的槽底,也可以被电连接于所述第二下沉区21111的外侧,本发明在这方面并不限制。更进一步,所述第二感光元件213的顶面可以与所述第二线路板主体2111顶面一致,或者高于所述第二线路板主体2111的顶面,或者低于所述第二线路板主体2111的顶面,也就是说,本发明并不限制下沉深度。
进一步,在本发明的这个实施例附图中,所述第二下沉区21111为一通孔,也就是说,所述第二线路板211两侧通过所述通孔连通。所述第二摄像模组单元20的所述第二线路板211包括一第二底板1113,叠层设置于第二线路板主体2111 的底部,以便于支撑所述感光元件,且增强所述第二线路板主体2111的结构强度。也就是说,所述第二感光元件213,被下沉设置于所述第二下沉区21111,且被所述底板1113支撑。所述第二感光元件213通过所述第二电连接元件2133电连接于所述第二线路板主体2111。
在一些实施例中,所述底板1113可以为一金属板,通过贴附的方式设置于所述第二线路板主体2111底部。
图10是根据本发明的第七个优选实施例的分体式阵列摄像模组100的剖视示意图。不同于第一个实施例的是,在这个实施例中,所述第一摄像模组单元10的所述第一感光组件11的所述第一基座112一体封装所述第一感光元件113的至少部分所述第一非感光区1132。换句话说,所述第一基座112一体成型地封装所述第一线路板111、所述第一感光元件113,从而使得所述第一感光元件113被稳定地固定,且增大了所述第一基座112的可成型区域。所述第一基座112包覆所述第一电连接元件1133。
值得一提的是说,相对于上述第一个实施例中第一基座112只成型于所述第一线路板111的方式,模塑成型于感光元件的方式将所述第一基座112可以进行一体成型的范围扩展至所述第一感光元件113的所述第一非感光区1132,从而在不影响所述第一感光元件113的正常感光工作的情况下,增大了所述第一基座112底部的连接面积,从而可以使得所述第一基座112和所述第一线路板111以及所述第一感光元件113更加稳定地连接,且顶部可以为其他部件,如所述第一镜头12、所述第一镜头支撑元件13等,提供更大的可安装面积。且所述电连接元件被所述第一基座112包覆,从而避免外部干扰所述电连接元件,且防止所述电连接元件氧化或沾染灰尘而影响所述摄像模组单元的成像质量。
所述第二摄像模组单元20的所述第二感光组件21的所述第二基座212一体封装所述第二感光元件213的至少部分所述第二非感光区2132。换句话说,所述第二基座212一体成型地封装所述第二线路板211、所述第二感光元件213,从而使得所述第二感光元件213被稳定地固定,且增大了所述第二基座212的可成型区域。所述第二基座212包覆所述第二电连接元件2133。
进一步,在这个实施例中,所述第二线路板主体2111具有一第二下沉区21111,所述第二感光元件213被下沉地设置于所述第二下沉区21111,以便于降低所述第二感光元件213和所述第二线路板主体2111的相对高度。
第二下沉区21111可以被实施为一凹槽或通孔。也就是说,可以使得所述第二线路板主体2111两侧不连通或者连通。当所述第二下沉区21111为凹槽时,所述第二感光元件213被设置于槽底,并且通过所述第二电连接元件2133电连接于所述第二线路板主体2111。所述第二电连接元件2133的外端可以被电连接于所述凹槽的槽底,也可以被电连接于所述第二下沉区21111的外侧,本发明在这方面并不限制。更进一步,所述第二感光元件213的顶面可以与所述第二线路板主体2111顶面一致,或者高于所述第二线路板主体2111的顶面,或者低于所述第二线路板主体2111的顶面,也就是说,本发明并不限制下沉深度。
进一步,在本发明的这个实施例附图中,所述第二下沉区21111为一通孔,也就是说,所述第二线路板211两侧通过所述通孔连通。
在这个实施例中,所述第二感光元件213以及所述第二电连接元件2133被所述第二基座212一体封装,因此通过所述第二基座212可以固定所述第二感光元件213。在所述第二线路板211底部可以设置一第二底板,也可以不设置所述第二底板。
图11是根据本发明的第八个优选实施例的分体式阵列摄像模组100的剖视示意图。不同于第一个实施例的是,在这个实施例中,所述第一摄像模组单元20的所述第一感光组件21的所述第一基座212一体封装所述第一感光元件213的至少部分所述第一非感光区2132。换句话说,所述第一基座212一体成型地封装所述第一线路板211、所述第一感光元件213,从而使得所述第一感光元件213被稳定地固定,且增大了所述第一基座212的可成型区域。所述第一基座212包覆所述第一电连接元件2133。
进一步,第一线路板主体1111包括一第一板体11112和第二板体11113,所述第一板体11112和所述第二板体11113通过一连接介质11114固定连接。所述第一板体11112可以为一硬板,所述第二板体11113可以为一软板,所述连接介质11114可以为各向异性导电胶。所述第一板体11113还可以包括一接口端,比如设置一连接器,以便于电连接于一电子设备。
在一些实施例中,所述第一基座主体1121一体成型于所述第一板体11112,所述第二板体11113搭接于所述第一板体11112的一端部。在制造的过程中,可以先通过所述第一板体11112和所述第二板体11113形成所述第一线路板主体1111,再进行一体成型,也可以先在所述第一板体11112上进行一体成型,而后 将所述第二板体11113电连接于所述第一板体11112,比如通过所述各向异性导电胶固定于所述第一板体11112。
在一些实施例中,所述第二线路板主体2111也可以通过上述方式构成,本发明在这方面并不限制。
图12是根据本发明的第九个优选实施例的分体式阵列摄像模组100的剖视示意图。不同于第一个优选实施例的是,在这个实施例中,所述第二线路板主体2111设有一第二倒贴槽21115,所述感光元件以倒贴的方式安装于所述第二倒贴槽21115。也就是说,将所述第二感光元件213通过FC(Flip Chip,倒装芯片)方式被安装于所述第二线路板主体2111。所述第二倒贴槽21115与所述第二镜头22方向相对。
也就是说,在安装的过程中,所述第二感光元件213从所述第二线路板主体2111下方向所述第二线路板主体2111安装,所述第二感光元件213的所述第二感光区2131通过所述第二光窗2122以及所述第二倒贴槽21115的上开口进行感光作用。
当然,在本发明的其他实施例中,所述第一摄像模组单元10也可以通过上述方式构成。
图13是根据本发明的第十个优选实施例的分体式阵列摄像模组100的剖视示意图。不同于上述优选实施例的是,在这个实施例中,所述第二摄像模组单元20的所述第二感光组件21的所述第二基座212一体封装所述第二感光元件213的至少部分所述第二非感光区2132。换句话说,所述第二基座212一体成型地封装所述第二线路板211、所述第二感光元件213,从而使得所述第二感光元件213被稳定地固定,且增大了所述第二基座212的可成型区域。所述第二基座212包覆所述第二电连接元件2133。
所述第二基座212包括一第二延伸安装部2125,自所述第二基座主体2121至少部分地向上延伸,并且形成一第二限位槽21251,用于限位安装所述第二镜头2224或所述第二镜头支撑元件2325。在本发明的这个实施例中,所述第二镜头22被安装于所述第二延伸安装部2125,所述第二延伸安装部2125替代了所述第二镜头支撑元件23,从而形成一定焦摄像模组。
在本发明的其他实施例中,所述第一摄像模组单元10也可以通过上述方式构成。
图14是根据本发明的第十一个优选实施例的分体式阵列摄像模组100示意图。不同于第一个优选实施例的是,在本发明的这个实施例中,所述第一线路板主体1111和所述第二线路板主体2111一体地连接,从而形成一整体结构,所述第一基座112和所述第二基座212分别成型于所述整体结构的不同区域,也就是所述第一线路板主体1111和所述第二线路板211对应的区域。
图15A,15B,15C是根据本发明的第十二个优选实施例的分体式阵列摄像模组100的不同实施方式剖视示意图。在本发明的这个实施例中,所述分体式阵列摄像模组100由两个不同高度的摄像模组单元构成,所述第一摄像模组单元10和所述第二摄像模组单元20的相对位置可以根据需求布置。比如,参照图15A,使得所述第一摄像模组单元10和所述第二摄像模组单元20的顶端一致,而底部存在高度差,比如,参照图15B,使得所述第一摄像模组单元10和所述第二摄像模组单元20的底部一致,而顶部存在高度差,比如,参照图15C,使得所述第一摄像模组单元10和所述第二摄像模组单元20的两端都不一致,两端都存在高度差。本领域的技术人员应当理解的是,所述摄像模组单元的类型以及高度大小,并不是本发明的限制。
图16是根据本发明的第十一个优选实施例的分体式阵列摄像模组100的俯视图。在本发明的这个实施例中,所述分体式阵列摄像模组100由两个不同大小的摄像模组单元构成,所述第一摄像模组单元10和所述第二摄像模组单元20的相对位置可以根据需求布置。所述组装体30的结构可以随所述摄像模组的大小变化,比如在摄像模组横截面较大的位置,使得所述组装体30的开口区域较大,而在所述摄像模组单元横截面较小的位置,使得所述组装体30的开口区域较小,从而适应各所述摄像模组单元的大小。
值得一提的是,上述实施例以及附图中,仅作为举例来说明本发明可以被实施的一些方式,而上述各实施例中的各个特征可以自由组合,从而形成不同的摄像模组单元,构成本发明的其他实施例,也属于本发明构思范围。且本发明中上述各实施例以及其他实施例中,各所述摄像模组单元的类型和结构都可以自由组合,通过所述组装体30进行组装,从而构成不同结构的所述分体式阵列摄像模组100,本发明在这方面并不限制。
图17是根据本发明的上述优选实施例的分体式阵列摄像模组100制造方法框图。本发明提供一分体式阵列摄像模组的制造方法1000,所述方法包括如下 步骤:
1001:形成至少两摄像模组单元;和
1002:通过一组装体30分别组装各摄像模组单元。
其中所述步骤1001中,包括步骤:
10011:将一感光元件安装于一线路板;
10012:将一基座一体成型于一线路板。
10013:将一镜头设置于所述感光元件的感光路径;
10014:对所述摄像模组单元进行主动校准。
其中,所述步骤10012可以在所述步骤10011之前,也可以在所述步骤10011之后。
其中所述步骤10012中,可以包括步骤:所述基座一体成型于所述线路板和所述感光元件,比如,将一基座一体成型于一线路板以及一感光元件的至少部分非感光区,一体封装所述线路板和所述感光元件。
所述步骤1002中,包括步骤:
10021:将各所述摄像模组单元预固定于所述组装体30;
10022:分别主动校准所述摄像模组单元,使得各所述摄像模组单元的光轴一致;和
10023:固定各所述摄像模组单元。
图18是根据本发明的上述优选实施例的分体式阵列摄像模组100的应用示意图。本发明进一步提供一电子设备300,其中所述电子设备包括一电子设备本体200和至少一分体式阵列摄像模组100,其中所述分体式阵列摄像模组100分别被设置于所述电子设备本体200,以用于获取图像。值得一提的是,所述电子设备本体200的类型不受限制,例如所述电子设备本体200可以是智能手机、可穿戴设备、平板电脑、笔记本电脑、电子书、个人数字助理、相机、监控装置等任何能够被配置所述摄像模组的电子设备。本领域的技术人员可以理解的是,尽管附图35中以所述电子设备本体200被实施为智能手机为例,但其并不构成对本发明的内容和范围的限制。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式 可以有任何变形或修改。
Claims (36)
- 一阵列摄像模组,其特征在于,包括:至少两摄像模组单元;和至少一组装体,其中各所述摄像模组单元被分别固定于所述组装体,以便于构成一整体。
- 根据权利要求1所述的阵列摄像模组,其中所述组装体包括至少一上盖,所述上盖具有至少一镜头口,以便于各所述摄像模组单元被固定于所述组装体时,通过所述镜头口进行采光。
- 根据权利要求2所述的阵列摄像模组,其中所述组装体形成至少一收容室,各所述摄像模组单元被容纳于所述收容室。
- 根据权利要求1所述的阵列摄像模组,其中所述组装体包括一主体和至少一上盖,其中所述上盖一体地连接于所述主体;或所述组装体包括一主体,其具有至少一侧壁,各所述摄像模组单元粘贴于所述侧壁,所述组装体顶侧形成开口而不需要上盖。
- 根据权利要求3所述的阵列摄像模组,其中所述组装体包括至少一分隔壁,所述分隔壁位于所述收容室内,将所述收容室分隔为至少两部分,分别用于容纳各所述摄像模组单元。
- 根据权利要求5所述的阵列摄像模组,其中所述分隔壁材质选自塑料、树脂、橡胶、金属中的一种或多种。
- 根据权利要求5所述的阵列摄像模组,其中所述分隔壁被连接于所述主体。
- 根据权利要求2所述的阵列摄像模组,其中所述组装体包括至少一分隔壁,所述分隔壁将所述收容室分隔为至少两部分,分别用于容纳各所述摄像模组单元,所述分隔壁被连接于所述上盖。
- 根据权利要求2所述的阵列摄像模组,其中所述组装体包括至少一支撑边,所述支撑边自所述主体向内侧延伸,以便于支撑各所述摄像模组单元。
- 根据权利要求9所述的阵列摄像模组,其中所述支撑边为凸台结构。
- 根据权利要求1至10任一所述的阵列摄像模组,其中各所述摄像模组单元包括至少一感光组件和至少一镜头,其中所述镜头位于所述感光组件的感光 路径,所述感光组件包括至少一线路板,至少一感光元件和至少一基座,所述基座一体成型于所述线路板,所述感光元件电连接于所述线路板,所述镜头位于所述感光元件的感光路径,所述基座具有至少一光窗,为所述感光元件提供光线通路。
- 根据权利要求11所述的阵列摄像模组,其中所述感光元件位于所述基座内侧。
- 根据权利要求11所述的阵列摄像模组,其中所述基座一体封装所述线路板和所述感光元件的至少部分非感光区。
- 根据权利要求13所述的阵列摄像模组,其中所述感光元件通过至少一电连接元件电连接于所述线路板,所述基座包覆所述电连接元件。
- 根据权利要求11所述的阵列摄像模组,其中所述线路板包括至少一电子元件,所述一体基座包覆所述电子元件。
- 根据权利要求11所述的阵列摄像模组,其中所述基座包括一支承元件,所述支承元件被设置于所述线路板主体,以便于在制造的过程中保护所述线路板主体和所述感光元件。
- 根据权利要求11所述的阵列摄像模组,其中所述基座包括一支承元件,所述支承元件被设置于所述感光元件的非感光区,以便于在制造的过程中保护所述感光元件。
- 根据权利要其11所述的阵列摄像模组,其中各所述摄像模组单元包括一支座,所述支座至少部分被安装于所述基座,以便于安装一滤光元件。
- 根据权利要求18所述的阵列摄像模组,其中所述支座至少部分被连接于所述线路板。
- 根据权利要求18所述的阵列摄像模组,其中各所述摄像模组单元的各支座一体地连接。
- 根据权利要求11所述的阵列摄像模组,其中所述线路板被设有至少一下沉区,所述感光元件被设置于所述下沉区,以便于降低所述感光元件和所述线路板的相对高度。
- 根据权利要求11所述的阵列摄像模组,其中所述线路板包括一第一板体和一第二板体,所述第二板体通过一连接介质固定连接于所述第一板体。
- 根据权利要求22所述的阵列摄像模组,其中所述第一板体为硬板,所 述第二板体为软板,所述连接介质为各向异性导电胶。
- 根据权利要求11所述的阵列摄像模组,其中所述基座包括一延伸安装部,自所述基座主体至少部分地向上延伸,以形成一限位槽,限位被安装的部件。
- 根据权利要求11所述的阵列摄像模组,其中所述线路板被设有一倒贴槽,所述感光元件被设置于所述倒贴槽,以便于以倒贴芯片方式将所述感光元件安装于所述线路板。
- 根据权利要求11所述的阵列摄像模组,其中各所述摄像模组单元的所述线路板一体地连接。
- 根据权利要求11所述的阵列摄像模组,其中各摄像模组单元被分体地设置。
- 根据权利要求11所述的阵列摄像模组,其中各所述摄像模组单元的底部具有高度差。
- 根据权利要求11所述的阵列摄像模组,其中各所述摄像模组单元包括至少一镜头支撑元件,所述镜头被安装于所述镜头支撑元件,所述镜头支撑元件被安装于所述基座。
- 根据权利要求29所述的阵列摄像模组,其中所述镜头支撑元件为一驱动元件,以便于所述摄像模组单元构成一动焦摄像模组。
- 根据权利要求29所述的阵列摄像模组,其中所述镜头支撑元件是一镜筒元件,以便于所述摄像模组单元构成一定焦摄像模组。
- 根据权利要求11所述的阵列摄像模组,其中各所述摄像模组单元中至少两个是定焦摄像模组。
- 根据权利要求11所述的阵列摄像模组,其中各所述摄像模组单元中至少两个是动焦摄像模组。
- 根据权利要求11所述的阵列摄像模组,其中各所述摄像模组单元中至少一个是动焦摄像模组,至少一个是定焦摄像模组。
- 根据权利要求11所述的阵列摄像模组,其中各所述阵列摄像模组包括一滤光元件,所述滤光元件被安装于所述基座。
- 根据权利要求11所述的阵列摄像模组,其中各所述线路板类型选自硬板,软板,软硬结合板,陶瓷基板。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611269070.2 | 2016-12-31 | ||
CN201621491163.5U CN206807579U (zh) | 2016-12-31 | 2016-12-31 | 分体式阵列摄像模组 |
CN201611269070.2A CN108270949B (zh) | 2016-12-31 | 2016-12-31 | 分体式阵列摄像模组及其制造方法 |
CN201621491163.5 | 2016-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018121793A1 true WO2018121793A1 (zh) | 2018-07-05 |
Family
ID=62707010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/070009 WO2018121793A1 (zh) | 2016-12-31 | 2018-01-02 | 分体式阵列摄像模组及其制造方法 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2018121793A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110876003A (zh) * | 2018-09-04 | 2020-03-10 | 宁波舜宇光电信息有限公司 | Tof摄像模组和电子设备以及组装方法 |
CN111050057A (zh) * | 2020-01-03 | 2020-04-21 | 昆山丘钛微电子科技有限公司 | 摄像头模组及电子产品 |
CN111050056A (zh) * | 2020-01-03 | 2020-04-21 | 嘉善万顺达电子有限公司 | 摄像镜头模块 |
CN113114913A (zh) * | 2021-04-27 | 2021-07-13 | 维沃移动通信有限公司 | 摄像头及电子设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100044814A1 (en) * | 2008-08-25 | 2010-02-25 | Cheng Uei Precision Industry Co., Ltd. | Camera Module and Manufacturing Method Thereof |
CN105681637A (zh) * | 2016-03-15 | 2016-06-15 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其感光组件和制造方法 |
CN105744131A (zh) * | 2016-03-15 | 2016-07-06 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其线路板组件和制造方法 |
CN205545559U (zh) * | 2015-12-30 | 2016-08-31 | 南昌欧菲光电技术有限公司 | 成像模组及电子装置 |
CN206807579U (zh) * | 2016-12-31 | 2017-12-26 | 宁波舜宇光电信息有限公司 | 分体式阵列摄像模组 |
-
2018
- 2018-01-02 WO PCT/CN2018/070009 patent/WO2018121793A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100044814A1 (en) * | 2008-08-25 | 2010-02-25 | Cheng Uei Precision Industry Co., Ltd. | Camera Module and Manufacturing Method Thereof |
CN205545559U (zh) * | 2015-12-30 | 2016-08-31 | 南昌欧菲光电技术有限公司 | 成像模组及电子装置 |
CN105681637A (zh) * | 2016-03-15 | 2016-06-15 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其感光组件和制造方法 |
CN105744131A (zh) * | 2016-03-15 | 2016-07-06 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其线路板组件和制造方法 |
CN206807579U (zh) * | 2016-12-31 | 2017-12-26 | 宁波舜宇光电信息有限公司 | 分体式阵列摄像模组 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110876003A (zh) * | 2018-09-04 | 2020-03-10 | 宁波舜宇光电信息有限公司 | Tof摄像模组和电子设备以及组装方法 |
CN111050057A (zh) * | 2020-01-03 | 2020-04-21 | 昆山丘钛微电子科技有限公司 | 摄像头模组及电子产品 |
CN111050056A (zh) * | 2020-01-03 | 2020-04-21 | 嘉善万顺达电子有限公司 | 摄像镜头模块 |
CN113114913A (zh) * | 2021-04-27 | 2021-07-13 | 维沃移动通信有限公司 | 摄像头及电子设备 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11601576B2 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
CN110708454B (zh) | 基于模塑工艺的摄像模组 | |
US12007583B2 (en) | Lens, camera module and manufacturing method thereof | |
US11533416B2 (en) | Camera module and array camera module based on integral packaging technology | |
US20210203818A1 (en) | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | |
US12022180B2 (en) | Array camera module and application thereof | |
CN109510932B (zh) | 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法 | |
CN105847645B (zh) | 基于一体封装工艺的摄像模组及其一体基座组件及制造方法 | |
WO2018121793A1 (zh) | 分体式阵列摄像模组及其制造方法 | |
WO2017140118A1 (zh) | 阵列摄像模组及其模塑感光组件、线路板组件和制造方法以及电子设备 | |
TWI657306B (zh) | 陣列攝像模組及其模塑感光組件、線路板組件和製造方法以及電子設備 | |
CN101303444A (zh) | 相机模组及其组装方法 | |
WO2018113795A1 (zh) | 阵列摄像模组及其应用 | |
CN108270949B (zh) | 分体式阵列摄像模组及其制造方法 | |
TWI685255B (zh) | 分體式陣列攝像模組及其製造方法 | |
CN113206938B (zh) | 分体双摄模组和感光组件及制造方法和电子设备 | |
WO2018130172A1 (zh) | 线路板和模塑感光组件及其制造方法以及摄像模组和电子设备 | |
WO2020062146A1 (zh) | 摄像模组中的承载结构及制造方法、摄像模组及终端设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18734055 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18734055 Country of ref document: EP Kind code of ref document: A1 |