WO2018109205A1 - Procédé de fabrication d'une bande pour un câble conducteur transposé en continu et câble produit par ce procédé - Google Patents
Procédé de fabrication d'une bande pour un câble conducteur transposé en continu et câble produit par ce procédé Download PDFInfo
- Publication number
- WO2018109205A1 WO2018109205A1 PCT/EP2017/083144 EP2017083144W WO2018109205A1 WO 2018109205 A1 WO2018109205 A1 WO 2018109205A1 EP 2017083144 W EP2017083144 W EP 2017083144W WO 2018109205 A1 WO2018109205 A1 WO 2018109205A1
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- WIPO (PCT)
- Prior art keywords
- tape
- deposition
- metallic sheath
- cable
- hts
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000151 deposition Methods 0.000 claims abstract description 69
- 230000008021 deposition Effects 0.000 claims abstract description 68
- 238000001465 metallisation Methods 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 230000001747 exhibiting effect Effects 0.000 claims abstract description 3
- 230000007935 neutral effect Effects 0.000 claims abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000009941 weaving Methods 0.000 claims description 3
- 238000000137 annealing Methods 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims 1
- 230000006866 deterioration Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 238000004804 winding Methods 0.000 description 10
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- 230000001351 cycling effect Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000013072 incoming material Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 238000000992 sputter etching Methods 0.000 description 3
- 230000017105 transposition Effects 0.000 description 3
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 3
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000000869 ion-assisted deposition Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- -1 oxygen ions Chemical class 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/30—Insulated conductors or cables characterised by their form with arrangements for reducing conductor losses when carrying alternating current, e.g. due to skin effect
- H01B7/306—Transposed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0801—Manufacture or treatment of filaments or composite wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/20—Permanent superconducting devices
- H10N60/203—Permanent superconducting devices comprising high-Tc ceramic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/048—Superconductive coils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Definitions
- the present invention relates to the manufacture of electrically conducting cables of the type used for numerous applications that require the conduction of high currents with accurate position of each element within the cable and for use in the generation of, for example, high quality magnetic fields.
- One type of relatively well know conducting cable of this type is a continuously transposed cable, known as a Roebel cable.
- a Roebel cable Such a cable has a number of flat tapes of conductive material that are laid and transposed such that they are geometrically aligned along their cross-section. In some cases the material forming the tapes is selected to be superconducting at the operating temperatures of the cable. Often the tapes are formed from a core of high temperature superconducting (HTS) material with a coating such as a metallised outer surface.
- HTS high temperature superconducting
- the "core” is represented by a metallic tape coated with HTS layer.
- Such cables have significant benefits in terms of providing, in principle, a high level of control of electromagnetic fields during their operation and can be employed in superconducting spools, windings, motor generator coils, magnets, transformer cables and current leads, for example.
- Roebel cable reduces ac losses that occur by transporting of ac current. Being based on high temperature superconducting (HTS) tape, the Roebel cable allows an outstanding performance regarding engineering current density at very high (> 20T) magnetic fields. Favourable properties of the Roebel cable are at least in part due to a transposition of meander shaped tapes (strands) within the cable.
- the manufacturing of the Roebel cable comprises a deposition of a HTS superconducting layer onto a buffered metallic tape playing a role of substrate. Buffer layers on the substrate tape are aimed to form a biaxially textured template with a sufficient degree of crystallinity which should be finally "transferred" to the HTS layer.
- the HTS coated tape undergoes a metallization which is required for electrical stabilization of the HTS tape in case of a local quench.
- the tape is formed into meander shape that allows an assembling of the Roebel cable with a pre-designed transposition period (transposition length).
- the forming of the meander shape is usually performed by punching.
- these techniques for manufacturing such cables can require punching of the tapes which form the cables which can create open edges on the tapes with gaps in the metallised exterior of the tapes. These openings can provide an interface for penetration of water and other contaminants into the cable. In the short term this may not be an issue, but over the long term it can result in deterioration of the entire cable because of diffusion of such contaminants.
- Roebel cable stability determined a as a number of heating /cooling cycling between 77 and 300 K. Nevertheless this does not provide a stability at liquid Helium temperature (4.2 K), especially at superfluid liquid Helium ( ⁇ 4 K) by where a "ballooning" of the tapes causes typically a deterioration after several cooling-heating cycles.
- the present invention seeks provide a method which overcomes some of the problems caused by actual manufacturing technology for such transposed cables, as well as providing a cable formed by such a method.
- the present invention provides a method for producing HTS tape and a cable formed from the produced tape as described in the accompanying claims.
- a tape and corresponding cable produced in accordance with this method has a longer usable life and is capable of operating even after a large number of cooling and heating cycles with none of the bubbling effects as seen in prior art arrangements.
- Fig. 1 is a schematic cross-sectional view of the HTS tape ready for assembling of the Roebel cable
- Fig. 2 is a view of a HTS tape processed in accordance with suggested method
- Fig. 3 is a schematic view of a layout of the vacuum deposition installation for the sheath deposition
- Fig. 4 is a schematic view of HTS tape torsion by installation in by the sheath deposition, an outer surface of the HTS tape is turned around after several windings towards the position of its "inner” surface
- Fig. 5 is a schematic view of HTS tape torsion by winding on a drum for the sheath deposition
- Fig. 6 is a schematic view of tape stack employed in the sheath deposition
- Fig. 7 is a schematic view of reel-to-reel tape transport in "stack" modus with synchronizing of tape windings for the sheath deposition;
- Fig. 8 is a schematic cross-sectional view of the HTS tape with two side deposited sheath layer ready for assembling of the Roebel cable, and;
- Fig. 9 is a schematic cross-sectional view of the HTS tape with two side deposited sheath layer ready for assembling of the Roebel cable, and also schematically illustrates de-burring and forced smoothening at the HTS tape before the sheath deposition.
- the objective of the method of the present invention is to produce a time-stable cable formed from tape of the type shown in this figure.
- the cable has groups of tape 2 which are formed from metallised HTS material, the tapes 2 being of generally rectangular or square cross-section.
- the objective is to provide a stable cable that operates in a high current regime in the range of around 10KA to around 50KA and yet which has a sufficiently low value of AC loss for the application to which it is being applied.
- Such a cable is normally formed by producing the tapes, metalising them, forming a meander in the tapes, and then assembling them through weaving or other process generally in accordance with the teaching of prior art methods such as those disclosed in the citations above.
- what the applicants have realised is that such a process can leave the end product, the cable, prone to deterioration over time. The reason of this deterioration is not known in fact.
- tapes are initially formed and provided with a minimal layer of metallisation coating on the core HTS material.
- this process there is a first stage of metallising the tapes of HTS material in a manner similar to that in the prior art, but with a thickness of metallisation which is much reduced when compared to the prior art.
- the metallisation is generally provided with a thickness in the range of 0.05 to 2 ⁇ , dependent upon the material being used in the metallisation process. For example, using Pt may have a thickness of around 0.05 ⁇ , Au 0.15 ⁇ , Ag 0.2 ⁇ and Cu up to 2 ⁇ .
- the deposition of the metallic sheath has a basic difference with simple deposition of a metallic layer: the metallic sheath should not only eliminated voids that may be formed on the interface punched (and therefore, not smooth, and even sometimes not clean) edges but also the sheath should be free of voids in its interior. Furthermore, the sheath is assumed to have a good adhesion to all surfaces of the tape covered with it. In addition, it should provide excellent current exchange between all surface elements coated with this sheath. In this sense, the aim of the sheath is to provide a full tape protection in all chemical, electrical and mechanical aspects.
- the metallic sheath may cover possibly only a part of tape surface. It is clear therefore that the metallic sheath has to be deposited onto several surfaces of the tape, with preferential deposition to the punched sides and edges. Because of such multifunctional requirements the metallic sheath may have a multi-layered architecture in which for example one layer is responsible for adhesion, other layer provides tightness and some further layer yields electrical conductivity. Furthermore, the metallic sheath may comprise a mechanical impregnation that improves capability of the sheath to withstand cooling/heating cycling. Such impregnation may be based on specific sublayers with different thermal expansion coefficient or even discontinuous layer after deposition of further sheath sub-layers cause a formation of embedded islands of metal or even dielectric (e.g. Si0 2 , Cr 2 03) which are distributed within a "matrix" formed by other sheath sublayers.
- Si0 2 , Cr 2 03 dielectric
- the layer or layers are in the region of 0.5 to 50 ⁇ thickness, again dependent upon the metallisation material.
- the material may be the same metal as used in the prior metallisation step, although there may be a different metal applied or indeed, in the metallic sheath deposition may be different layers of different metals applied in sequence in sub-steps to form the overall metallisation.
- the resulting tapes are then annealed using a neutral annealing process that may be in an oxygen rich atmosphere, after which the tapes are assembled into the end cable.
- deburring may be performed before the deposition of the metallic sheath to improve the consistency of metallisation, that the deposition of the metallic sheath can be performed in a way that it enables coverage of the entire surface of each tape, including rear and edge surfaces to optimise coating, and may be performed such there is preferential deposition onto edge areas of the tape.
- metallisation may be performed on plural tape elements that are of similar structure at the same time during the metallisation stage to improve efficiency of the manufacturing process. With such an approach the tape elements may be superimposed to provide a stacking structure and with spacing by interleaving tape.
- the weakest "element” in the Roebel cable is a side surface of the meander shaped HTS coated tape.
- two factors may be important with this respect: (i) mechanical load applied to the side surface of the HTS coated tape during cooling/heating cycles and (ii) a mechanical friction of different HTS coated tapes during cooling/heating cycles and cable bending.
- this side area of the HTS coated tape represents possibly a "gate” for penetration of foreign materials into an "interior” of the HTS coated tape. This may lead to a local "ballooning" (delamination) effect that cause the deterioration after long exposition of Helium coolant.
- the minimal thickness of the metallization may vary from 0.05 to 3 ⁇ . It depends on applied metal and used deposition technique.
- the sheath deposition is performed by means of physical vacuum deposition. It is performed in a way which besides a preferential coverage of the area that comprises the side area and the edge area, a partial coverage of the entire surface of the tape including a rear surface of the HTS tape is provided.
- an ion cleaning of the surface to be coated is performed prior to the main step of metallic sheath deposition.
- the ion assisted deposition where the ion treatment is performed during deposition may be also employed using ions with 1 -150 eV energy.
- a thickness of the sheath metallic layer may vary from 0.5 to 4 ⁇ .
- the sheath metallic layer comprises silver, gold or/and platinum or an alloy based on at least some of these metals.
- the sheath metallic layer may comprises a first sublayer and a second sublayer which comprise a metallic components or alloys of different art.
- the first sublayer may be based on very thin, say 0.05 ⁇ thick, silver-gold alloy that provides good adhesion, mechanical stability and "transparency" for oxygen diffusion but still not sufficient for the electrical or chemical protection of HTS material. Therefore the second based on e.g. silver or different silver alloys, 1-2 ⁇ thick, may be applied as the second sublayer.
- the heat treatment is performed in an oxygen atmosphere may be performed while an additional heat treatment in oxygen atmosphere may be performed after the metallization.
- the sheath deposition is performed simultaneously onto a multitude of different tape areas corresponding to a different meander periods of the meander shape of the HTS tape.
- the different meander periods are shifted one against other in order to provide a simultaneous exposition of the side area and the edge area of the HTS tape to the incoming material.
- the different meander periods are superimposed in a way that the HTS tape forms a stack in a deposition area where the sheath deposition is performed.
- HTS tape in the stack is spaced by an interleaf tape.
- a deburring is performed with in interval which does not exceed 15 hours prior to the sheath deposition.
- FIG. 9 is a schematic view of de-burring and forced smoothening at the HTS tape before the sheath deposition. It may comprise the steps of smoothening via polishing, cleaning, blowing and/or etching, surface activation (ion etching), pre- metallization and then plating, e.g. with copper.
- the method comprises of a number of processing steps listed below.
- a polished Cr-Ni stainless steel substrate tape is coated with yttria-stabilized zirconia (YSZ) buffer layer which is bi-axially textured.
- the bi-axial texture is provided by alternating ion assisted deposition (ABAD) which enables a high ( ⁇ 10° of full- width at half maximum) in-plane texture.
- the buffered substrate tape serves as a template for deposition of a further buffer cap layer of cerium oxide (CeO 2 ) and finally a high temperature superconducting layer of YBa 2 Cu30 7 - x (YBCO). Both of these layers are deposited via pulsed laser deposition in one vacuum deposition run where the buffered substrate is heated to 750°C.
- a variation of target composition results in variation of deposited layer composition.
- a layer of Ce0 2 and a layer of YBCO are deposited.
- Typical thickness of YSZ, CeO 2 and YBCO layers corresponds to 2.0, 0.060 and 1.5 ⁇ respectively.
- the HTS tape undergoes a metallization.
- Material used for metallization in this example is silver which was deposited via physical vacuum deposition based on thermal vacuum evaporation.
- a minimal thickness of the metallization i.e. the thickness of the silver layer
- This thickness is quite sufficient to enable a structural uniformity the metallic layer over the tape surface, and thus to achieve a chemical and mechanical protection which is needed for the tape during the next step of forming of the meander shape and following quality control of electrical parameters.
- the metallization step it is less important how far the edge and side areas as well as a rear surface of the HTS tape are coated with the metallic layer.
- the main requirement here is to provide a layer uniformly above the HTS layer.
- the forming of the meander shape was performed in the present example by mechanical punching (see Fig. 2).
- the HTS tape undergoes a sheath deposition of a sheath metallic layer 5, which was a silver layer in given example.
- a sheath metallic layer 5 Prior to the deposition of silver the surface of the tape was cleaned by fine ion etching in the vacuum chamber. The cleaning was performed by negatively charged oxygen ions and molecules with characteristic energy of 0.5- 30 eV at oxygen pressure of 0.1 mbar under ion density of 1 mA/cm 2 for 4 min. This step of cleaning/etching determines adhesion and uniformity degree of the sheath layer and thus represents an important factor in improving the long-term stability of the Roebel cable.
- the sheath deposition was performed in the same chamber via a tangential flow of an incoming material in vacuum of 10 "5 mbar.
- Fig. 3 reveals one of possible layouts of the vacuum deposition technique.
- the HTS tape windings 10 which are shown in a cross-sectional view move in perpendicular to the plane of the figure. They move together or independently along a base 1 1.
- the base may be a wall of a drum on which the HTS tape is wound, with the rotation axis of the drum positioned above the HTS tape windings 10.
- a deposition source 12, 14 is represented by a boats 12 that are heated resistively, and material (silver in this case) 14 aimed for evaporation.
- the geometry of the installation enables a shorter distance between the deposition source and the base plane 11 than the distance between the deposition source and the nearest tape winding. Due to such geometry tangential flow 15 of the incoming material (silver vapour) is provided for both deposition sources. In reality the number of deposition sources 12, 14 (i.e. sources of tangential flows 15) may be higher than 2.
- tangential flow deposition of the sheath deposition is performed onto a side area 16 and an edge area 17 of the HTS tape. Sometimes an additional masking technique that reduces deposition onto the rest of the open surface of the tape 10 may be used.
- the tape after several windings, should be turned around its longer axis by 180°. This is schematically shown in Fig. 4. Otherwise the sheath deposition has to be repeated one time more after turning around of a complete tape.
- FIG. 5 An example of tape torsion is clarified in Fig. 5 where the tape 10a is turned around (during winding on drum 11 , 19) to an orientation 10b that enables the sheath deposition onto a second (rear) surface of the HTS tape.
- twisting tape during reel-to-reel winding process is possible.
- the sheath deposition was performed about 30 hours after the forming of the meander shape, i.e. after punching in this case.
- the HTS tape was heated to 450°C for 1 hour in oxygen atmosphere with an ambient pressure. Cooling of the HTS tape was performed within 2 hours with a rate of 2°C/min.
- a shunt layer was performed by employing galvanic plating in a water solution of CuS0 4 .
- the HTS tape was translated from reel-to-reel with a speed of 1.5 m/hour. This regime resulted in a shunt layer thickness of 20 ⁇ per each side. After plating the tape was washed in water, after which the droplets of water were removed by blowing with dry gaseous nitrogen.
- Assembling of the Roebel cable represents the last step in manufacture, This procedure is handled so as not to introduce additional mechanical load to the edge and side areas of the tape during cooling of the Roebel cable to the operation temperature of 4.2 K.
- HTS tapes fabricated in accordance with given example exhibit outstanding mechanical and thermo-cycling stability.
- the tape withstands (without any signs of deterioration) more than 100 cycles of cooling to 4.2 K and heating to 300 K (instead of 3-5 cycles in the known state of the art).
- Similar stable behaviour was found for a cycled bending of the HTS tape between radii of 300 and 20 mm.
- the same was found for the Roebel cable assembled from the HTS tape.
- an improvement of mechanical stability of the cable was also confirmed via repeatable bending and temperature cycling tests.
- a sheath deposition of the sheath layer comprises two or more sublayers.
- a sheath deposition which comprises two depositions of two sheath sublayers.
- a first sub layer deposition is aimed to deposit a gold-silver alloy with a 5% content of gold. This deposition is performed via flash thermal vacuum evaporation of mixed grains of silver and gold.
- Fig. 8 is a schematic cross-sectional view of the HTS tape with two side deposited sheath layer ready for assembling of the Roebel cable.
- Fig. 8 shows a substrate 80, multilayer with HTS layer shown generally at 81 , and an Ag envelope 82.
- the HTS tape has preferably been de-burred.
- the method of the present invention improves significantly the usable lifetime of cables produced by the method without incurring significantly large increases in the number of manufacturing steps or cost.
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- Manufacturing & Machinery (AREA)
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Abstract
L'invention concerne un procédé de fabrication d'une bande supraconductrice à haute température (HTS) utilisable dans un câble conducteur transposé en continu. Les étapes du procédé consistent : à déposer une couche supraconductrice HTS sur une bande métal tamponnée ; à procéder à une métallisation de la bande ; et à réaliser une forme de méandre dans la bande ; la métallisation étant effectuée pour assurer une épaisseur de métallisation qui permet une uniformité structurelle sur la surface de la bande ; un dépôt d'une gaine métallique présentant un soudage étroit sans lacunes à la surface de la bande, effectuée après la réalisation de la forme de méandre ; et un traitement thermique dans une atmosphère neutre étant mis en œuvre après le dépôt de la gaine métallique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16204679 | 2016-12-16 | ||
EP16204679.1 | 2016-12-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018109205A1 true WO2018109205A1 (fr) | 2018-06-21 |
Family
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PCT/EP2017/083144 WO2018109205A1 (fr) | 2016-12-16 | 2017-12-15 | Procédé de fabrication d'une bande pour un câble conducteur transposé en continu et câble produit par ce procédé |
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Cited By (2)
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CN112442664A (zh) * | 2019-08-30 | 2021-03-05 | 泽瓦薄膜技术股份有限公司 | 用于涂覆基底的装置、方法和***以及超导的带状导体 |
CN113380458A (zh) * | 2021-06-09 | 2021-09-10 | 上海超导科技股份有限公司 | 适用于绞缆的超导带材制备方法、超导带材及超导电缆 |
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US20080210454A1 (en) * | 2004-03-31 | 2008-09-04 | Michael Fee | Composite Superconductor Cable Produced by Transposing Planar Subconductors |
WO2011159176A1 (fr) | 2010-06-18 | 2011-12-22 | General Cable Superconductors Limited | Câble supraconducteur transposé amélioré |
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Cited By (2)
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CN112442664A (zh) * | 2019-08-30 | 2021-03-05 | 泽瓦薄膜技术股份有限公司 | 用于涂覆基底的装置、方法和***以及超导的带状导体 |
CN113380458A (zh) * | 2021-06-09 | 2021-09-10 | 上海超导科技股份有限公司 | 适用于绞缆的超导带材制备方法、超导带材及超导电缆 |
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