WO2018103155A1 - 柔性基板及其制作方法 - Google Patents

柔性基板及其制作方法 Download PDF

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Publication number
WO2018103155A1
WO2018103155A1 PCT/CN2016/112527 CN2016112527W WO2018103155A1 WO 2018103155 A1 WO2018103155 A1 WO 2018103155A1 CN 2016112527 W CN2016112527 W CN 2016112527W WO 2018103155 A1 WO2018103155 A1 WO 2018103155A1
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organic material
material layer
flexible substrate
long side
side edge
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PCT/CN2016/112527
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English (en)
French (fr)
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秦芳
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武汉华星光电技术有限公司
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Priority to US15/505,111 priority Critical patent/US10586936B2/en
Publication of WO2018103155A1 publication Critical patent/WO2018103155A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible substrate and a method of fabricating the same.
  • OLED Organic Light Emitting Display
  • a flexible OLED display device needs to form an array structure of pixel structures on a substrate.
  • Each pixel structure generally includes a thin film transistor (TFT), a capacitor, and the like.
  • TFT thin film transistor
  • OLED flexible display devices are generally prepared on an organic material substrate, and the organic material substrate is placed on a glass substrate for carrying. There are differences in the characteristics of the organic material substrate and the glass substrate for carrying, and it is necessary to undergo Excimer Laser Annealing (ELA), hydrogen activation, etc. when manufacturing an OLED flexible display of low temperature poly-silicon (LTPS) material.
  • ELA Excimer Laser Annealing
  • LTPS low temperature poly-silicon
  • the OLED evaporation alignment index Mark in the series Mark closest to the edge of the substrate is taken as an example. Because of the large viscosity coefficient of organic materials used in flexible organic material substrates, flexible organic The edge of the material substrate will form a steep angle, which will cause the etching residue to occur at this position, and since the flexible organic material substrate in the OLED flexible display device of the LTPS material is mostly colored and high temperature resistant organic material, the vapor deposition is in place. When the alignment light source is incident from the back surface of the flexible organic material substrate and passes through the colored flexible organic material substrate, the light loss is caused, the light reflectance of the alignment mark is lowered, and the alignment success rate is affected.
  • An object of the present invention is to provide a flexible substrate capable of improving alignment accuracy and product yield, increasing light transmittance, improving alignment success rate, reducing warpage, and avoiding etch residue on edges.
  • Another object of the present invention is to provide a method for fabricating a flexible substrate.
  • the flexible substrate produced by the method has higher alignment accuracy and product yield, higher light transmittance, higher alignment success rate, and higher warpage. Low, there is less etch residue on the edges.
  • the present invention first provides a flexible substrate comprising a first organic material layer laid on a carrier substrate and a second organic material layer completely covering the first organic material layer; the second organic material layer is on the carrier substrate
  • the upper cover area is larger than the cover area of the first organic material layer on the carrier substrate, and the long side edge of the second organic material layer surrounds the long side edge of the first organic material layer.
  • the distance between the long side edge of the second organic material layer and the corresponding long side edge of the first organic material layer is not less than 3 mm.
  • the second organic material layer is provided with an alignment mark between the long side edge thereof and the long side edge of the first organic material layer.
  • the carrier substrate is a glass substrate.
  • the materials of the first organic material layer and the second organic material layer are both polyimide.
  • the invention also provides a method for manufacturing a flexible substrate, comprising the following steps:
  • Step S1 providing a carrier substrate, coating a first organic material layer on the carrier substrate and curing;
  • Step S2 coating a second organic material layer on the first organic material layer and the carrier substrate and curing;
  • the second organic material layer completely covers the first organic material layer; the coverage area of the second organic material layer on the carrier substrate is larger than the coverage area of the first organic material layer on the carrier substrate, and the long edge of the second organic material layer surrounds the The long edge of an organic material layer.
  • the manufacturing method of the flexible substrate further includes:
  • Step S3 depositing a barrier layer on the second organic material layer and the carrier substrate;
  • step S4 in the array process, a registration mark is formed on the second organic material layer between the long side edge of the second organic material layer and the long side edge of the first organic material layer.
  • the distance between the long side edge of the second organic material layer and the corresponding long side edge of the first organic material layer is not less than 3 mm.
  • the carrier substrate is a glass substrate.
  • the materials of the first organic material layer and the second organic material layer are both polyimide.
  • the present invention also provides a flexible substrate comprising a first organic material layer laid on the carrier substrate and a second organic material layer completely covering the first organic material layer; the coverage area of the second organic material layer on the carrier substrate is greater than Coverage area of the first organic material layer on the carrier substrate, second The long side edge of the organic material layer surrounds the long side edge of the first organic material layer;
  • the carrier substrate is a glass substrate
  • the material of the first organic material layer and the second organic material layer are both polyimide.
  • the present invention provides a flexible substrate, which divides the flexible substrate into a first organic material layer and a second organic material layer, and the second organic material layer has a larger coverage area on the carrier substrate than the first organic material.
  • the coverage area of the layer on the carrier substrate, the long edge of the second organic material layer surrounding the long edge of the first organic material layer, can reduce the thickness of the edge of the flexible substrate, avoid etching residue at the edge; reduce the organic material in The coverage area on the carrier substrate reduces the warpage of the flexible substrate; in addition, an alignment mark is disposed on the second organic material layer between the long edge of the second organic material layer and the long edge of the first organic material layer In the case of film shrinkage of the flexible substrate, the alignment accuracy of the subsequent evaporation process can be ensured, and since only one layer of organic material exists at the alignment mark, the light transmittance increases, and the alignment mark is improved.
  • the invention provides a method for manufacturing a flexible substrate, wherein the flexible substrate is coated in two layers, and the flexible substrate prepared by the method has higher alignment precision and product yield, higher light transmittance, and high success rate of alignment.
  • the warpage is low, and there is less phenomenon of etch residue at the edges.
  • Figure 1 is a front elevational view of a flexible substrate of the present invention
  • FIG. 2 is a plan view of a 1/4 area of the flexible substrate of the present invention.
  • FIG. 3 is a flow chart of a method of fabricating a flexible substrate of the present invention.
  • the present invention first provides a flexible substrate comprising a first organic material layer 21 laid on the carrier substrate 1 and a second organic material layer 22 completely covering the first organic material layer 21.
  • the coverage area of the second organic material layer 22 on the carrier substrate 1 is larger than the coverage area of the first organic material layer 21 on the carrier substrate 1, and the long side edge of the second organic material layer 22 surrounds the long side of the first organic material layer 21. edge.
  • the carrier substrate 1 is preferably a glass substrate; the materials of the first organic material layer 21 and the second organic material layer 22 may be, but not limited to, polyimide (PI).
  • PI polyimide
  • the distance between the long side edge of the second organic material layer 22 and the corresponding long side edge of the first organic material layer 21 is not less than 3 mm. Such an arrangement can reduce the thickness of the edge of the flexible substrate, avoid etching residue at the edge of the flexible substrate, and can The coverage area of the organic material on the carrier substrate 1 is reduced, and the warpage of the flexible substrate is reduced.
  • the second organic material layer 22 is provided with an alignment mark 3 between the long edge of the first organic material layer 21 and the long edge of the first organic material layer 21, and the alignment mark 3 and the first organic material layer 21 are There is no overlap in the direction perpendicular to the carrier substrate 1.
  • the presence of the alignment mark 3 can still ensure the alignment accuracy of the subsequent evaporation process, and since only one layer of organic material exists at the alignment mark 3, the light transmittance increases. The reflectance of the alignment mark 3 is improved, and the alignment success rate is improved.
  • the present invention further provides a method for fabricating a flexible substrate, comprising the following steps:
  • step S1 the carrier substrate 1 is provided, and the first organic material layer 21 is coated on the carrier substrate 1 and cured.
  • the carrier substrate 1 is preferably a glass substrate; the material of the first organic material layer 21 may be, but not limited to, PI.
  • Step S2 coating the second organic material layer 22 on the first organic material layer 21 and the carrier substrate 1 and curing.
  • the material of the second organic material layer 22 may be, but not limited to, PI.
  • the second organic material layer 22 completely covers the first organic material layer 21; the coverage area of the second organic material layer 22 on the carrier substrate 1 is larger than the coverage area of the first organic material layer 21 on the carrier substrate 1, and the second organic material layer
  • the long side edge of 22 surrounds the long side edge of the first organic material layer 21. Further, the distance between the long side edge of the second organic material layer 22 and the corresponding long side edge of the first organic material layer 21 is not less than 3 mm to ensure that the area of the alignment mark 3 is made flat in the subsequent step.
  • Step S3 depositing a barrier layer on the second organic material layer 22 and the carrier substrate 1.
  • step S4 in the Array process, the alignment mark is formed on the second organic material layer 22 between the long side edge of the second organic material layer 22 and the long side edge of the first organic material layer 21.
  • the alignment mark 3 is made of a black light-shielding material.
  • the alignment mark 3 is formed only on the second organic material layer 22, and does not overlap with the first organic material layer 21 in a direction perpendicular to the carrier substrate 1.
  • the flexible substrate produced by the method comprises a first organic material layer 21 and completely covers the first
  • the second organic material layer 22 of the organic material layer 21 can reduce the thickness of the edge of the flexible substrate, avoid etching residue at the edge of the flexible substrate, and can reduce the coverage area of the organic material on the carrier substrate 1 and reduce the warpage of the flexible substrate. Curvature; in the case of film shrinkage of the flexible substrate, the presence of the alignment mark 3 can still ensure the alignment accuracy of the subsequent evaporation process, and since there is only one layer of organic material at the alignment mark 3, the light transmittance Increased, the reflectivity of the alignment mark 3 and the success rate of the alignment are improved.
  • the flexible substrate of the present invention divides the flexible substrate into a first organic material layer and a second organic material layer, and the coverage area of the second organic material layer on the carrier substrate is greater than that of the first organic material layer on the carrier substrate.
  • the upper cover edge of the second organic material layer surrounds the long edge of the first organic material layer, which can reduce the thickness of the edge of the flexible substrate and avoid the etching residue at the edge; reduce the organic material on the carrier substrate Covering the area, reducing the warpage of the flexible substrate; in addition, placing an alignment mark on the second organic material layer between the long side edge of the second organic material layer and the long side edge of the first organic material layer, on the flexible substrate
  • the alignment accuracy of subsequent evaporation processes can be ensured, and since only one layer of organic material exists in the alignment mark, the light transmittance increases, and the reflectance of the alignment mark is improved and Bit success rate.
  • the flexible substrate is coated in two layers, and the flexible substrate produced by the method has higher alignment precision and product yield, higher light transmittance, high success rate of alignment, and warpage.
  • the degree is low and there is less etch residue at the edges.

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Abstract

一种柔性基板及其制作方法，柔性基板分为第一有机材料层(21)及第二有机材料层(22)，且第二有机材料层(22)在承载基板(1)上的覆盖面积大于第一有机材料层(21)在承载基板(1)上的覆盖面积，第二有机材料层(22)的长边边缘包围第一有机材料层(21)的长边边缘，能够降低柔性基板边缘的厚度，避免边缘处的刻蚀残留；减小有机材料在承载基板(1)上的覆盖面积，降低柔性基板的翘曲度；于第二有机材料层(22)的长边边缘与第一有机材料层(21)的长边边缘之间在第二有机材料层(22)上设置对位标记(3)，能保证后续蒸镀等制程的对位精度，且由于对位标记(3)处仅存在一层有机材料，光穿透率增大，对位成功率提高。

Description

柔性基板及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性基板及其制作方法。
背景技术
有机发光二极管显示器件(Organic Light Emitting Display，OLED)OLED是一种极具发展前景的显示技术，它不仅具有十分优异的显示性能，还具有自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。
柔性的OLED显示器件需要在基板上制作出呈阵列式分布的像素结构，每一像素结构一般包括薄膜晶体管(Thin Film Transistor，TFT)、电容等元件。
目前，OLED柔性显示器件一般是基于有机材料基板上制备的，有机材料基板置于承载用的玻璃基板上。有机材料基板与承载用的玻璃基板特性存在差异，且在制作低温多晶硅(Low Temperature Poly-silicon，LTPS)材料的OLED柔性显示器时需经过准分子激光退火(Excimer Laser Annealing，ELA)、氢活化等高温制程，柔性的有机材料基板会产生一定的膜缩，因此需要将各类对位标记(Mark)制作在有机材料基板上，以保证后续制程(如OLED蒸镀对位)的对位精度。但是，有机材料基板在承载用玻璃基板上的覆盖面积越大，在阵列制程中有机材料基板产生的翘曲度越大，生产良率越低，因此，我们需要在保证各类对位Mark制作在有机材料基板上的同时尽可能减小其在承载用玻璃基板上的覆盖面积。
以实际生产中版图设计与设备规格为依据，以距基板边缘最近的系列Mark中的OLED蒸镀对位Mark为例，由于柔性的有机材料基板所使用有机材料的粘度系数较大，柔性的有机材料基板边缘会形成很陡的角度，导致此位置易造成刻蚀残留等现象，且由于现在LTPS材料的OLED柔性显示器件中的柔性有机材料基板多采用有色耐高温有机材料，在蒸镀对位时，对位光源从柔性有机材料基板背面射入，穿过有色的柔性有机材料基板，会造成光的损失，降低对位Mark的光反射率，影响对位成功率。
发明内容
本发明的目的在于提供一种柔性基板，能够提高对位精度和产品良率，增大光穿透率，提高对位成功率，降低翘曲度，避免边缘出现刻蚀残留。
本发明的另一目的在于提供一种柔性基板的制作方法，由该方法制作的柔性基板对位精度和产品良率较高，光穿透率较大，对位成功率高，翘曲度较低，边缘出现刻蚀残留的现象较少。
为实现上述目的，本发明首先提供一种柔性基板，包括铺设在承载基板上的第一有机材料层、及完全覆盖第一有机材料层的第二有机材料层；第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料层的长边边缘包围第一有机材料层的长边边缘。
所述第二有机材料层的长边边缘与第一有机材料层相应长边边缘的距离不小于3mm。
所述第二有机材料层于其长边边缘与第一有机材料层的长边边缘之间设置对位标记。
所述承载基板为玻璃基板。
所述第一有机材料层与第二有机材料层的材质均为聚酰亚胺。
本发明还提供一种柔性基板的制作方法，包括如下步骤：
步骤S1、提供承载基板，在所述承载基板上涂布第一有机材料层并固化；
步骤S2、在第一有机材料层与承载基板上涂布第二有机材料层并固化；
第二有机材料层完全覆盖第一有机材料层；第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料层的长边边缘包围第一有机材料层的长边边缘。
所述柔性基板的制作方法还包括：
步骤S3、在所述第二有机材料层与承载基板上沉积阻隔层；
以及步骤S4、于阵列制程中，在所述第二有机材料层的长边边缘与第一有机材料层的长边边缘之间在第二有机材料层上制作对位标记。
所述第二有机材料层的长边边缘与第一有机材料层相应长边边缘的距离不小于3mm。
所述承载基板为玻璃基板。
所述第一有机材料层与第二有机材料层的材质均为聚酰亚胺。
本发明还提供一种柔性基板，包括铺设在承载基板上的第一有机材料层、及完全覆盖第一有机材料层的第二有机材料层；第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二 有机材料层的长边边缘包围第一有机材料层的长边边缘；
其中，所述承载基板为玻璃基板；
其中，所述第一有机材料层与所述第二有机材料层的材质均为聚酰亚胺。
本发明的有益效果：本发明提供的一种柔性基板，将柔性基板分为第一有机材料层及第二有机材料层，且第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料层的长边边缘包围第一有机材料层的长边边缘，能够降低柔性基板边缘的厚度，避免边缘处的刻蚀残留；减小有机材料在承载基板上的覆盖面积，降低柔性基板的翘曲度；另外，于第二有机材料层的长边边缘与第一有机材料层的长边边缘之间在第二有机材料层上设置对位标记，在柔性基板产生膜缩的情况下，仍能保证后续蒸镀等制程的对位精度，且由于对位标记处仅存在一层有机材料，光穿透率增大，提高了对位标记的反射率，对位成功率提高。本发明提供的一种柔性基板的制作方法，将柔性基板分两层涂布，由该方法制作的柔性基板对位精度和产品良率较高，光穿透率较大，对位成功率高，翘曲度较低，边缘出现刻蚀残留的现象较少。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的柔性基板的主视图；
图2为本发明的柔性基板的1/4面积的俯视图；
图3为本发明的柔性基板的制作方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图1与图2，本发明首先提供一种柔性基板，包括铺设在承载基板1上的第一有机材料层21、及完全覆盖第一有机材料层21的第二有机材料层22。第二有机材料层22在承载基板1上的覆盖面积大于第一有机材料层21在承载基板1上的覆盖面积，第二有机材料层22的长边边缘包围第一有机材料层21的长边边缘。
具体地，所述承载基板1优选为玻璃基板；所述第一有机材料层21与第二有机材料层22的材质均可以但不限于为聚酰亚胺(Polymide，PI)。
第二有机材料层22的长边边缘与第一有机材料层21相应长边边缘的距离不小于3mm，这样的设置能够降低柔性基板边缘的厚度，避免柔性基板边缘处出现刻蚀残留，同时能够减小有机材料在承载基板1上的覆盖面积，降低柔性基板的翘曲度。
值得注意的是：所述第二有机材料层22于其长边边缘与第一有机材料层21的长边边缘之间设置对位标记3，该对位标记3与第一有机材料层21在垂直于承载基板1的方向上没有重叠。在柔性基板产生膜缩的情况下，对位标记3的存在仍能保证后续蒸镀等制程的对位精度，且由于对位标记3处仅存在一层有机材料，光穿透率增大，提高了对位标记3的反射率，对位成功率提高。
请参阅图3，结合图1与图2，本发明还提供一种柔性基板的制作方法，包括如下步骤：
步骤S1、提供承载基板1，在所述承载基板1上涂布第一有机材料层21并固化。
具体地，所述承载基板1优选为玻璃基板；所述第一有机材料层21的材质可以但不限于为PI。
步骤S2、在第一有机材料层21与承载基板1上涂布第二有机材料层22并固化。
具体地，所述第二有机材料层22的材质可以但不限于为PI。
第二有机材料层22完全覆盖第一有机材料层21；第二有机材料层22在承载基板1上的覆盖面积大于第一有机材料层21在承载基板1上的覆盖面积，第二有机材料层22的长边边缘包围第一有机材料层21的长边边缘。进一步地，第二有机材料层22的长边边缘与第一有机材料层21相应长边边缘的距离不小于3mm，以保证后续步骤制作对位标记3的区域平坦。
步骤S3、在所述第二有机材料层22与承载基板1上沉积阻隔层。
以及步骤S4、于阵列(Array)制程中，在所述第二有机材料层22的长边边缘与第一有机材料层21的长边边缘之间在第二有机材料层22上制作对位标记3。
具体地：所述对位标记3采用黑色遮光材料。所述对位标记3仅制作在第二有机材料层22上，与第一有机材料层21在垂直于承载基板1的方向上没有重叠。
通过该方法制得的柔性基板包括第一有机材料层21、及完全覆盖第一 有机材料层21的第二有机材料层22，能够降低柔性基板边缘的厚度，避免柔性基板边缘处出现刻蚀残留，同时能够减小有机材料在承载基板1上的覆盖面积，降低柔性基板的翘曲度；在柔性基板产生膜缩的情况下，对位标记3的存在仍能保证后续蒸镀等制程的对位精度，且由于对位标记3处仅存在一层有机材料，光穿透率增大，提高了对位标记3的反射率及对位成功率。
综上所述，本发明的柔性基板，将柔性基板分为第一有机材料层及第二有机材料层，且第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料层的长边边缘包围第一有机材料层的长边边缘，能够降低柔性基板边缘的厚度，避免边缘处的刻蚀残留；减小有机材料在承载基板上的覆盖面积，降低柔性基板的翘曲度；另外，于第二有机材料层的长边边缘与第一有机材料层的长边边缘之间在第二有机材料层上设置对位标记，在柔性基板产生膜缩的情况下，仍能保证后续蒸镀等制程的对位精度，且由于对位标记处仅存在一层有机材料，光穿透率增大，提高了对位标记的反射率及对位成功率。本发明的柔性基板的制作方法，将柔性基板分两层涂布，由该方法制作的柔性基板对位精度和产品良率较高，光穿透率较大，对位成功率高，翘曲度较低，边缘出现刻蚀残留的现象较少。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (13)

  1. 一种柔性基板，包括铺设在承载基板上的第一有机材料层、及完全覆盖第一有机材料层的第二有机材料层；第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料层的长边边缘包围第一有机材料层的长边边缘。
  2. 如权利要求1所述的柔性基板，其中，所述第二有机材料层的长边边缘与第一有机材料层相应边缘的距离不小于3mm。
  3. 如权利要求1所述的柔性基板，其中，所述第二有机材料层于其长边边缘与第一有机材料层的相应边缘之间设置对位标记。
  4. 如权利要求1所述的柔性基板，其中，所述承载基板为玻璃基板。
  5. 如权利要求1所述的柔性基板，其中，所述第一有机材料层与所述第二有机材料层的材质均为聚酰亚胺。
  6. 一种柔性基板的制作方法，包括如下步骤：
    步骤S1、提供承载基板，在所述承载基板上涂布第一有机材料层并固化；
    步骤S2、在第一有机材料层与承载基板上涂布第二有机材料层并固化；
    第二有机材料层完全覆盖第一有机材料层；第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料层的长边边缘包围第一有机材料层的长边边缘。
  7. 如权利要求6所述的柔性基板的制作方法，还包括：
    步骤S3、在所述第二有机材料层与承载基板上沉积阻隔层；
    以及步骤S4、于阵列制程中，在所述第二有机材料层的长边边缘与第一有机材料层的长边边缘之间在第二有机材料层上制作对位标记。
  8. 如权利要求6所述的柔性基板的制作方法，其中，所述第二有机材料层的长边边缘与第一有机材料层相应长边边缘的距离不小于3mm。
  9. 如权利要求6所述的柔性基板的制作方法，其中，所述承载基板为玻璃基板。
  10. 如权利要求6所述的柔性基板的制作方法，其中，所述第一有机材料层与所述第二有机材料层的材质均为聚酰亚胺。
  11. 一种柔性基板，包括铺设在承载基板上的第一有机材料层、及完全覆盖第一有机材料层的第二有机材料层；第二有机材料层在承载基板上的覆盖面积大于第一有机材料层在承载基板上的覆盖面积，第二有机材料 层的长边边缘包围第一有机材料层的长边边缘；
    其中，所述承载基板为玻璃基板；
    其中，所述第一有机材料层与所述第二有机材料层的材质均为聚酰亚胺。
  12. 如权利要求11所述的柔性基板，其中，所述第二有机材料层的长边边缘与第一有机材料层相应边缘的距离不小于3mm。
  13. 如权利要求11所述的柔性基板，其中，所述第二有机材料层于其长边边缘与第一有机材料层的相应边缘之间设置对位标记。
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