WO2018049699A1 - 一种基于***头矩阵的图像获取装置 - Google Patents
一种基于***头矩阵的图像获取装置 Download PDFInfo
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- WO2018049699A1 WO2018049699A1 PCT/CN2016/100546 CN2016100546W WO2018049699A1 WO 2018049699 A1 WO2018049699 A1 WO 2018049699A1 CN 2016100546 W CN2016100546 W CN 2016100546W WO 2018049699 A1 WO2018049699 A1 WO 2018049699A1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
- H04N13/20—Image signal generators
- H04N13/204—Image signal generators using stereoscopic image cameras
- H04N13/243—Image signal generators using stereoscopic image cameras using three or more 2D image sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
- H04N13/20—Image signal generators
- H04N13/282—Image signal generators for generating image signals corresponding to three or more geometrical viewpoints, e.g. multi-view systems
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2213/00—Details of stereoscopic systems
- H04N2213/001—Constructional or mechanical details
Definitions
- the present invention relates to the field of optical electronic product technology, and in particular to an image acquisition device based on a miniature camera matrix.
- the related art provides a method of setting four digital cameras of the same model and the same lens in a shooting scene in a 2 ⁇ 2 matrix, the four digital The camera performs image processing and calculation on a plurality of images acquired by the captured object in the shooting scene to obtain a three-dimensional stereoscopic image of the object to be photographed.
- the camera adopts the planar matrix method, the amount of three-dimensional operations is greatly simplified, and the accuracy of the three-dimensional operation is improved.
- this method needs to align the horizontal lines of the cameras in the parallel direction, and align the vertical columns of the camera in the vertical direction, that is, the camera is required to form a geometrically accurate rectangular structure, and also requires the photosensitive elements of the camera to remain at the same horizontal plane. on.
- a camera matrix formed by four digital cameras is used to photograph an object. Since the digital camera itself has a casing and the casing has a certain size, the lenses of the four digital cameras are located in the middle of the digital camera. In the extreme case, the distance between the lenses of two adjacent digital cameras is at least the width of the outer casing of a digital camera.
- the distance between the lenses of two adjacent digital cameras is at least the outer casing width of one digital camera when the object is photographed in the related art
- the size of the outer casing of the digital camera cannot be further reduced, so that the size of the mechanism becomes large, and the related art
- the image capturing method cannot capture a closer image, resulting in a limited range of three-dimensional image acquisition, and it is impossible to obtain a three-dimensional image of a close object.
- the mechanical mounting structure itself has errors, and at the same time, due to the inconsistency in manufacturing, the optical axis, the photosensitive surface and the outer casing of the camera There is a geometric inconsistency between the two, so that the final photosensitive elements are not guaranteed to be on the same level, the optical axes of the photosensitive elements are not guaranteed to be parallel to each other, and it is not guaranteed to form a standard rectangular structure.
- the above errors can be compensated by the after-the-fact marking, the existence of the error greatly affects the accuracy and accuracy of the three-dimensional calculation.
- an object of the present invention is to provide an image acquisition device based on a miniature camera matrix, wherein the micro lens and the corresponding miniature photosensitive element and the corresponding image generation circuit form a miniature camera, and the plurality of miniature cameras constitute a miniature camera matrix.
- the miniature camera matrix is placed on the same plane by means of a micro-camera with a matrix structure processed, welded or fabricated on one board, and an integrated housing is used to ensure the geometric accuracy of the position of the micro cameras and the micro camera light.
- the parallelism of the axes and the geometrical accuracy of the matrix structure can also reduce the distance between adjacent miniature cameras.
- an embodiment of the present invention provides an image acquisition apparatus based on a miniature camera matrix, including an image generation circuit board and a micro lens matrix;
- the image generation circuit board includes an image generation circuit matrix, each of the image generation circuits in the image generation circuit matrix includes a micro photosensitive element, and each of the micro photosensitive elements constitutes a matrix of miniature photosensitive elements;
- Each of the microlenses in the micro lens matrix is fixedly disposed on the image generation circuit board, and corresponds to each of the micro photosensitive elements, and an axis of each of the micro lenses is perpendicular to the image generation circuit The plane where the board is located.
- an embodiment of the present invention provides a first possible implementation manner of the first aspect, wherein each of the micro lenses of the micro lens matrix is set in an m ⁇ n format, where m is greater than or equal to 2, and n is greater than Equal to 2.
- the embodiment of the present invention provides a second possible implementation manner of the first aspect, wherein each of the micro lenses in the horizontal direction of the micro lens matrix is equally spaced, The spacing between two adjacent microlenses is greater than or equal to 10 mm;
- Each of the micro lenses in the vertical direction of the micro lens matrix is equally spaced, and a distance between two adjacent micro lenses is 10 mm or more.
- the embodiment of the present invention provides a third possible implementation manner of the first aspect, wherein each of the micro photosensitive elements in the matrix of the miniature photosensitive elements is integrally formed with the image generating circuit board; or Each of the micro photosensitive elements in the matrix of the micro photosensitive elements is solder-mounted on the image generating circuit board.
- the embodiment of the present invention provides a fourth possible implementation manner of the first aspect, wherein each of the micro photosensitive elements in the matrix of the miniature photosensitive elements is processed or soldered, It is required that the horizontal direction corresponds to the pixel row alignment, and the vertical direction corresponds to the pixel column alignment.
- an embodiment of the present invention provides a fifth possible implementation manner of the first aspect, further including an image acquisition circuit board, where the image acquisition circuit board includes a digital signal processor and a communication module connected in sequence;
- the image generation circuit is configured to convert an analog image generated by the miniature photosensitive element into a digital image
- the digital signal processor is used for system control of the micro camera matrix to complete various control functions of image acquisition, including image acquisition, image transmission, image gain and shutter control, communication protocol interaction management, timing interruption, task switching, and storage. Management, micro camera parameter settings, acquisition control and acquisition format definition;
- the communication module is configured to output a plurality of the digital images to the upper terminal under the control of the digital signal processor.
- the embodiment of the present invention provides a sixth possible implementation manner of the first aspect, further comprising: a fixed substrate and a front shell;
- the image generation circuit board is fixed on the fixed substrate, and the fixed substrate is mounted on an inner surface of the front case;
- the front case is provided with a plurality of lens holes corresponding to the micro lenses in a one-to-one manner, and each of the micro lenses is photographed through each of the lens holes.
- the embodiment of the present invention provides the seventh possible implementation manner of the first aspect, further including a rear cover, the image acquisition circuit board is fixedly mounted on the rear shell orientation One side of the front case.
- the embodiment of the present invention provides the eighth possible implementation manner of the first aspect, wherein the front case and the rear case are fixedly connected to form a housing, and the housing A power input port and a data communication interface are provided thereon;
- the power input port is configured to connect a power line, and supply power to the image generation circuit board and the image acquisition circuit board through the power line;
- the data communication interface is configured to connect a data line, and the communication module outputs the plurality of the digital images to the upper terminal through the data line.
- an embodiment of the present invention provides a ninth possible implementation manner of the first aspect, wherein the device further includes a lens protection cover, the lens protection cover is configured to protect the micro lens matrix Each of the microlenses in the middle.
- the micro lens and the corresponding micro photosensitive element and the corresponding image generating circuit form a miniature camera
- the plurality of miniature cameras constitute a miniature camera matrix
- the axes of the respective miniature cameras are perpendicular to the plane of the image generating circuit board.
- FIG. 1 is a schematic structural diagram of an image acquiring apparatus according to an embodiment of the present invention
- FIG. 2 is a schematic exploded view of an image acquisition device according to an embodiment of the present invention.
- FIG. 3 is a schematic diagram of assembly of an image acquisition device according to an embodiment of the present invention.
- FIG. 4 is a schematic diagram showing the module composition of an image obtaining apparatus according to an embodiment of the present invention.
- Image generation circuit board 200 micro photosensitive element 201, mounting hole 202, micro lens 203, image generation circuit 204;
- Image acquisition circuit board 400
- the present invention provides a An image acquisition apparatus based on a micro camera matrix will be specifically described below by way of embodiments.
- an image acquiring apparatus in an embodiment of the present invention includes an image generating circuit board 200 and a micro lens matrix;
- the image generation circuit board 200 includes an image generation circuit matrix, and each of the image generation circuits 204 in the image generation circuit matrix includes a micro photosensitive element 201, and each of the micro photosensitive elements 201 constitutes a matrix of miniature photosensitive elements;
- Each of the micro lenses 203 in the micro lens matrix is fixedly disposed on the image generation circuit board 200, and corresponds to the respective micro photosensitive elements 201, and the axes of the respective micro lenses 203 are perpendicular to the plane of the image generation circuit board 200, respectively.
- the micro lens 203 and the corresponding micro photosensitive element 201 and the corresponding image generating circuit 204 form a miniature camera
- the plurality of miniature cameras constitute a miniature camera matrix
- the axes of the respective miniature cameras are perpendicular to the image generating circuit board 200, respectively.
- the micro camera matrix is placed on the same plane, thereby ensuring the geometric accuracy of the mutual position of the micro cameras.
- the parallelism of the optical axis of the micro camera and the geometric accuracy of the matrix structure can also reduce the distance between adjacent micro cameras. Through the above measures, the accuracy and accuracy of the three-dimensional image are higher, and the measurement range is larger.
- the acquisition device is more integrated and convenient for processing, making the device a truly integrated miniaturized three-dimensional image acquisition device.
- the types and types of the respective micro photosensitive elements 201 described above are identical, the respective image generating circuits 204 are identical, and the models and types of the respective micro lenses 203 are identical, thereby ensuring that the respective miniature cameras are identical.
- the above-mentioned micro lens 203 transmits the captured optical signal to the micro photosensitive element 201, and the function of the micro photosensitive element 201 is to convert the optical signal captured by the micro lens 203 into an electrical signal for subsequent image processing.
- the micro photosensitive element 201 may be a CCD (Charge-coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). Of course, other well-known applications can be implemented in the image acquisition process. An electrical device that converts an optical signal into an electrical signal.
- the main function of the image generation circuit 204 is to convert the electrical signal obtained by the miniature photosensitive element 201 from an analog signal to a digital signal to form a digital image for subsequent circuit reading.
- each of the micro lenses 203 in the micro lens matrix is disposed in the form of m ⁇ n, where m is greater than or equal to 2, and n is greater than or equal to 2.
- each of the micro lenses 203 may be set in a 2 ⁇ 2 format, or a 2 ⁇ 3 format setting, or a 3 ⁇ 3 format setting, or a 4 ⁇ 5 format setting, which will not be enumerated here.
- each microlens 203 is set in the form of m ⁇ n, which can ensure that the framing range is appropriate, and a complete object to be photographed or a scene to be photographed is captured.
- the spacing between the microlenses 203 has an influence on the range of the field of view.
- the microlenses 203 in the horizontal direction of the micro lens matrix are equally spaced, and the adjacent two micro lenses 203
- the distance between the micro lenses 203 is equal to or greater than or equal to 10 mm.
- the respective micro lenses 203 in the vertical direction of the micro lens matrix are equally spaced, and the distance between the adjacent two micro lenses 203 is 10 mm or more.
- micro-lens 203 in the horizontal direction of the micro-lens matrix is equally spaced, and the micro-lens 203 in the vertical direction of the micro-lens matrix are equally spaced, which facilitates the post-image three-dimensional processing operation and facilitates the production of the image generation circuit board 200. And installation.
- each of the micro lenses 203 in the horizontal direction of the micro lens matrix is equally spaced, and the distance between the adjacent two micro lenses 203 is greater than or equal to 10 mm and less than or equal to 120 mm, and likewise, the vertical direction in the micro lens matrix
- the respective micro lenses 203 are equally spaced, and the distance between the adjacent two micro lenses 203 is 10 mm or more and 120 mm or less.
- the distance between the two micro lenses 203 adjacent in the horizontal direction or the vertical direction is greater than or equal to 10 mm and less than or equal to 120 mm, which can avoid the decrease in the closeness of the photo, resulting in a problem that the accuracy of the final synthesized three-dimensional image is not high. It is also possible to reduce the size of the image acquisition device and facilitate the production and processing of the image acquisition device.
- the upper limit of the pitch is not limited to 120 mm, and may be 150 mm or 180 mm. Can be determined according to actual needs. In general, the larger the focal length value of the micro lens 203, the larger the field of view of the subject, and the larger the spacing of the adjacent micro lenses 203.
- the distance between the two micro lenses 203 adjacent in the horizontal direction in the micro lens matrix is two micros adjacent to each other in the vertical direction of the micro lens matrix.
- the spacing between the lenses 203 is equal.
- the respective micro lenses 203 are disposed corresponding to the respective micro photosensitive elements 201 and the respective image generating circuits 204, the arrangement manner of the respective micro photosensitive elements 201 and the setting manner of each of the image generating circuits 204 are all related to the micro lens.
- the setting of 203 is the same, and will not be described here.
- each of the micro photosensitive elements 201 in the micro photosensitive element matrix is integrally formed with the image forming circuit board 200; or, each of the micro photosensitive elements 201 in the micro photosensitive element matrix is solder-mounted on the image forming circuit board 200.
- each of the micro-sensing elements 201 in the micro-sensor array is processed or soldered, it is required that the horizontal direction corresponds to the pixel row alignment, and the vertical direction corresponds to the pixel column alignment.
- independent miniature photosensitive elements 201 existing in the related art include CCD and/or CMOS, and the technology is very mature. According to the requirements of field of view, measurement accuracy and measurement speed, it is possible to select a suitable miniature photosensitive device.
- the component 201 is then designed with a corresponding image generation circuit board 200.
- the image generation circuit board 200 can adopt a PCB (Printed Circuit Board) circuit board, and then the respective micro photosensitive elements 201 are in accordance with the aforementioned micro lens 203.
- the layout is required to be soldered on the image generation circuit board 200.
- a dedicated photosensitive member positioning fixture can be used to ensure the positional accuracy of each of the micro photosensitive elements 201 after welding.
- the micro photosensitive member 201 is soldered to the image forming circuit board 200 by soldering.
- the photosensitive elements such as CCD and CMOS are basically processed into rectangles according to the number of rows and columns of pixels. Because of the three-dimensional operation, the pixel rows corresponding to the corresponding coordinate positions of the same row need to be on the same straight line, and the coordinates of the same column are corresponding. The pixel columns of the positions also need to be on the same straight line. Therefore, in the embodiment, when the respective micro photosensitive elements 201 are required to form a standard rectangle, the position of the pixels in the matrix of the miniature photosensitive elements (the position is represented by the values of rows and columns) For the corresponding rectangular structure, the accuracy of the three-dimensional operation is ensured.
- the micro photosensitive element 201 on the image generating circuit board 200 is processed or soldered, it is required that the horizontal direction corresponds to the pixel row alignment, and the vertical direction corresponds to the pixel column alignment, thereby ensuring The accuracy of 3D operations.
- the pixel pitch of the photosensitive elements is generally on the order of micrometers, it is difficult for the micro photosensitive element 201 to ensure that the corresponding pixel rows or columns are completely aligned during soldering, and the relative offset or relative of the corresponding pixel row or column is inevitably generated. Rotation, in order to make up for the above errors, it is necessary to measure and calibrate the above machining errors after processing, which can be compensated in the three-dimensional calculation and corrected in software.
- the micro photosensitive element 201 and the image forming circuit board 200 are integrally formed by means of simultaneous processing. According to the geometrical precision of the matrix, in order to ensure that each pixel position in the matrix of the miniature photosensitive element also forms a standard rectangular structure, and the accuracy and speed of the three-dimensional operation are improved, the processed image generation circuit board 200 can be customized, and each micro photosensitive element 201 and image are prepared.
- the generation circuit board 200 is integrally formed, and each of the micro photosensitive elements 201 is processed in the process of processing the image generation circuit board 200, that is, a large CCD or CMOS formed by processing a plurality of photosensitive regions having a rectangular shape.
- the method avoids the error caused by the aforementioned welding method, reduces the image calculation time, and makes the three-dimensional image data more accurate. According to the integrally formed method, it is also necessary to process the image generation circuit 204 on the image generation circuit board 200, place the image generation circuit 204 on another circuit board or on the image acquisition circuit board 400, or perform circuit layout. The adjustment is performed at a position that does not affect the matrix in which the micro photosensitive element 201 is integrally formed.
- FIG. 2 is a schematic diagram showing the explosion of the image acquisition device according to the embodiment of the present invention
- FIG. 4 is a schematic diagram showing the module composition of the image acquisition device according to the embodiment of the present invention. As shown in FIG. 2 and FIG. 4, the present invention is implemented.
- the image acquisition device of the example further includes an image acquisition circuit board 400 that includes a digital signal processor 702 and a communication module 704 that are sequentially connected.
- the micro lens 203 focuses the optical signal to the micro photosensitive element 201, and the micro photosensitive element 201 generates an analog image based on the optical signal, and the image generating circuit 204 converts the analog image generated by the micro photosensitive element 201 into a digital image, and performs image acquisition control, gain, and Shutter control.
- the image generation circuit 204 also communicates with the digital signal processor 702 in the image acquisition circuit board 400 to transmit the digital image to the digital signal processor 702, which is used by the digital signal processor 702 in the image acquisition circuit board 400.
- System control complete various control functions of image acquisition, including image acquisition, image transmission, image gain and shutter control, communication protocol interaction management, timing interrupt, task switching, storage management, micro camera parameter setting, acquisition control and acquisition format Definition, etc.
- Digital signal processor 702 is also used to pass various digital images
- the communication module 704 outputs to the upper terminal.
- the communication module 704 is configured to output a plurality of digital images to the upper terminal under the control of the digital signal processor 702.
- the digital signal processor 702 is similar to a CPU (Central Processing Unit) chip on an embedded computer, which may be a DSP (Digital Signal Processing), an ARM (Acorn RISC Machine, RISC micro processing). Chips such as FPGAs (Field Programmable Gate Arrays) are the control cores of the entire image acquisition system. There is also an identical chip in the image generation circuit 204, except that the digital signal processor in the image generation circuit 204 is only responsible for image acquisition and control of a single micro camera, and the digital signal processor 702 is responsible for the micro camera matrix in this embodiment.
- a CPU Central Processing Unit
- DSP Digital Signal Processing
- ARM Acorn RISC Machine
- FPGAs Field Programmable Gate Arrays
- the overall control of the image acquisition when the digital signal processor 702 is running, firstly calls the embedded program, communicates with the upper terminal, and communicates with the digital signal processor in the image generation circuit 204, controls the initialization command of the micro camera, and sets the micro
- the parameters of the camera such as exposure time, trigger mode, image gain, etc., send the internal parameters of the micro camera to the upper terminal, such as the number of the micro camera, etc., after obtaining the shooting command, control the image acquisition of each micro camera, after the acquisition is completed, Transfer images to the host terminal.
- the image generation circuit board 200 and the image acquisition circuit board 400 are electrically connected through a circuit interface.
- some modules of the image generation circuit board 200 may be formed according to the size and specific conditions of the outer casing.
- the analog-to-digital conversion circuit is moved down to the image acquisition circuit board 400, or the image generation circuit board 200 or the image acquisition circuit board 400 is partially divided into another circuit board in order to reduce the board area.
- the above changes do not affect the specific The realization of the image acquisition device function is only convenient for the design requirements of the package and the external dimensions.
- the upper terminal sends a shooting trigger signal to the communication module 704, and the communication module 704 sends the shooting trigger signal to the digital signal processor 702, and the digital signal processor 702 controls the miniature photosensitive element 201 to obtain an analog image according to the optical signal according to the shooting trigger signal.
- the signal and control image generation circuit 204 converts the analog image into a digital image, and the control communication module 704 outputs the plurality of digital images to the upper terminal.
- the image acquisition circuit board 400 further includes a non-volatile memory 705 and a power module 706.
- the power module 706 is electrically connected to each of the electrical devices on the image acquisition circuit board 400 to supply power to the respective power devices.
- Non-volatile memory 705 and digital signal processor 702 The connection is used to store variables generated by the digital signal processor 702 during image processing and a plurality of digital images.
- the communication module 704 includes a data exchange circuit or device and a corresponding output input interface.
- the data exchange circuit or device is like a network switch. It can collect the images collected by the micro camera matrix to the same network interface output. It can also use multiple network interfaces to output in parallel. The number of output interfaces corresponds to the time required to acquire images.
- the output input interface of the communication module 704 includes: a system bus interface, a network device interface, and an I/O control interface.
- the system bus interface, the network device interface, and the I/O control interface are respectively connected to the digital signal processor 702, and the network device interface and the I The /O control interface is connected to the power module 706, respectively.
- the above system bus interface includes but is not limited to: RS-232/485 interface, 1394 interface, USB interface and cameralink interface.
- the above network device interfaces including but not limited to: RJ-45 interface, RJ-11 interface, SC optical interface, FDDI interface, AUI interface, BNC interface, and Console interface, may also be 3G, 4G, WIFI (WIreless-Fidelity, wireless) Fidelity) and other wireless network interfaces.
- the image acquisition device in the embodiment of the present invention further includes a fixed substrate 100, and the image generation circuit board 200 is fixed on the fixed substrate 100.
- a mounting hole 202 is formed in the image forming circuit board 200, and the image forming circuit board 200 is fixed to the fixed substrate 100 through the mounting hole 202.
- the image forming circuit board 200 can be fixed to the fixed substrate 100 by bolting through the mounting hole 202, and the image forming circuit board 200 can be fixed to the fixed substrate 100 by riveting or pivoting through the mounting hole 202. .
- the image acquiring device in the embodiment of the present invention further includes a front case 300.
- the front case 300 is provided with a plurality of lens holes 301 corresponding to the respective micro lenses 203, and the fixed substrate 100 is mounted on the front case 300.
- the inner surface of each of the micro lenses 203 is photographed through each of the lens holes 301.
- FIG. 3 is a schematic view showing the assembly of the image acquiring device according to the embodiment of the present invention.
- each of the micro lenses 203 cooperates with each lens hole 301 to fix the micro lens 203 on one hand and the lens through the lens.
- the hole 301 is photographed.
- Miniature lens 203 fixed in image generation On the circuit board 200, the image generation circuit board 200 is fixed on the fixed substrate 100, and the fixed substrate 100 is mounted on the inner surface of the front case 300, so that the respective micro lenses 203 are photographed through the respective lens holes 301, and also composed of the respective micro cameras.
- the micro camera matrix is fixed to the inner surface of the front case 300.
- the image acquiring device of the embodiment of the present invention further includes a rear case 500.
- the front case 300 and the rear case 500 are fixedly connected to form a case, and the image capturing circuit board 400 is fixedly mounted on the rear case 500 toward the front case. 300 side.
- the fixed substrate 100 is fixedly connected to the front case 300
- the image acquisition circuit board 400 is fixedly connected to the rear case 500
- the rear case 300 of the front case 300 is fixedly connected to form a complete case.
- the fixed substrate 100 and the image acquisition circuit board 400 are located in the case. Inside the body.
- the fixed substrate 100 is fixedly connected to the front case 300 by bolts, snaps, pivots, riveting, etc.
- the image capture circuit board 400 is fixedly connected to the rear case 500 by bolts, snaps, pivots, riveting, etc.
- the front case The 300 and the rear case 500 can be fixed to form a housing by snapping, bolting, or the like.
- the housing is provided with a power input port 601 and a data communication interface 602.
- the power input port 601 is used to connect the power line, and the image generation circuit board 200 and the image acquisition circuit board 400 are powered by the power line.
- the interface 602 is configured to connect the data lines, the digital signal processor 702 receives the shooting trigger signal through the data line, and the communication module 704 outputs the plurality of digital images through the data line, preferably to the upper terminal of the image acquiring device.
- the data communication interface 602 includes a plurality of different types of interfaces to meet data input and output requirements in different situations.
- the image acquisition device further includes a lens protection cover for protecting each of the micro lenses 203 in the micro lens matrix.
- the lens protection cover is mounted on the outer surface of the front case 300 and covers the surface of each lens hole 301 for protecting each micro lens 203 to avoid damage of each micro lens 203.
- the lens cover can be made of plastic.
- FIG. 1 to FIG. 4 four micro lenses 203 are taken as an example, and the number of the micro lenses 203 in the figure does not play a limiting role, but is merely an illustrative example. Same Similarly, the number of the micro photosensitive elements 201 and the image generating circuit 204 is not limited to four, and FIGS. 1 to 4 are merely illustrative examples and do not serve as a limitation.
- the image capturing device in the embodiment of the present invention can be placed in the shooting scene to take a picture of the object to be photographed, wherein the micro lens 203 and the corresponding micro photosensitive element 201 and the corresponding image generating circuit 204 form a miniature camera, and each micro camera And the image acquisition circuit board 400 constitutes a digital camera.
- a plurality of digital cameras constituting the parallel array are processed in a set of machine boxes to form a three-dimensional stereoscopic image acquisition device.
- the image acquiring device in the embodiment of the present invention needs to calibrate and detect some specific parameters of the device before capturing the image, and the contents of the calibration and detection include: focal length, distortion, optical axis geometric position of the micro lens; Geometric positional relationship, actual measurement spacing, row and column offset, etc.
- Calibration and detection require special calibration equipment and software. After calibration, the measured parameters need to be provided to the 3D image processing software to input the relevant measurement dimensions.
- the three-dimensional calculation formula calculates the three-dimensional coordinate size, and at the same time, compensates for manufacturing and installation errors through software, and improves the accuracy of three-dimensional data.
- a plurality of two-dimensional images of the object plane are generally acquired in a synchronous manner.
- each micro camera After obtaining the shooting signal, each micro camera captures a data format of a plurality of planar two-dimensional images, and the plurality of planar two-dimensional images are transmitted to the external image data processing device through the data communication interface 602 for processing, and the external image data processing device is used for multiple The planar two-dimensional image is processed to obtain a three-dimensional image of the object to be photographed.
- the process of processing the image data in the form of a matrix plane two-dimensional image by the external image data processing device is: performing feature point matching operation on the plurality of captured images, and calculating the space of the feature points according to the matched feature point image coordinates Position coordinates, according to the obtained spatial position coordinates of each feature point, calculate other three-dimensional dimensions of the measured object that need special measurement, form three-dimensional point cloud data, establish a three-dimensional point cloud graphic, and perform three-dimensional stereoscopic reproduction.
- the micro lens 203 and the corresponding micro photosensitive element 201 and the corresponding image generating circuit 204 form a miniature camera, and the matrix formed by the adjacent four miniature cameras is an image acquiring unit.
- the matrix formed by the adjacent four miniature cameras is an image acquiring unit.
- the micro cameras are larger than four, each time a micro camera is shifted to the right or downward, multiple image acquisition units are determined by the principle that the micro cameras can overlap. If there are 6 micro cameras, two image acquisition units are obtained, and two of the micro cameras are in an overlapping state, and appear in both image acquisition units.
- a matrix composed of four adjacent micro cameras is used as an image acquisition unit, and the image acquired by each image acquisition unit is processed to obtain a three-dimensional stereoscopic image of the object to be photographed.
- the above image acquisition device and the corresponding external image data processing device acquire the three-dimensional data of the object in the same manner as the human eye sees the world. Since the two-dimensional image is captured by the planar matrix method, just as the person looks at the object from different angles, the standard procedure is adopted. The calculation calculates the parallax of the same feature point on the image at different positions, and the three-dimensional shape of the object can be obtained.
- the terms “set”, “install”, “connected”, and “connected” are to be understood broadly, and may be fixed connections, for example, unless otherwise specifically defined and defined. It can also be a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be internal communication between the two elements.
- the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
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- Image Input (AREA)
Abstract
一种基于***头矩阵的图像获取装置,包括图像生成电路板(200)和微型镜头矩阵;图像生成电路板(200)包括图像生成电路矩阵,图像生成电路矩阵中的各个图像生成电路(200)均包括微型感光元件(201),各个微型感光元件(201)组成微型感光元件矩阵;微型镜头矩阵中的各个微型镜头(203)固定设置于图像生成电路板(200)上,与各个微型感光元件(201)一一对应,且各个微型镜头(203)的轴线分别垂直于图像生成电路板(200)所在平面。通过基于***头矩阵的图像获取装置能够保证后期处理的三维立体图像精确度和准确度,提高测量范围和图像获取装置的集成度,方便加工制作,使该装置成为一套集成化、小型化的三维图像前端采集装置。
Description
本发明涉及光学电子产品技术领域,具体而言,涉及一种基于***头矩阵的图像获取装置。
为了采用图像拍摄的方式获得被拍摄物体的三维立体图像,相关技术提供了如下方法:将四个型号、镜头完全相同的数码相机以2×2矩阵的形式设置在拍摄场景中,该四个数码相机对拍摄场景中被拍摄物体拍摄得到的多张图片,对获取的多张图片进行图像处理与运算,得到被拍摄物体的三维立体图像。
在三维运算时,由于相机采用了平面矩阵方式,极大简化了三维运算量,提高了三维运算的准确性。但该方法需要将平行方向的相机的水平行对齐,将垂直方向的相机的垂直列对齐,也就是说要求相机组成几何尺寸精确的矩形结构,同时,还要求相机的感光元件保持在同一个水平面上。矩阵相机结构的几何精度越高,其对应的测量精度和准确性也越高。
目前,可以将四个现有数码相机安装在一套固定的机械结构上,依靠对相机的精确定位,满足以上对相机矩阵结构几何精度的要求,但该方法存在以下问题:
1、上述相关技术中采用由四个数码相机形成的相机矩阵对被拍摄物体进行拍摄,由于数码相机本身具有外壳,且外壳具有一定的尺寸,四个数码相机的镜头均位于数码相机的中间位置,极限情况下,两个相邻的数码相机的镜头之间的距离最小为一个数码相机的外壳宽度。由于相关技术中在对被拍摄物体进行拍摄时,两个相邻的数码相机的镜头之间的距离最小为一个数码相机的外壳宽度,无法再进一步缩小,使机构尺寸变大,同时相关技术中的图像拍摄方式无法拍摄得到更加近距离的图像,导致最终得到的三维立体图像拍摄范围有限,无法得到近距离物体的三维立体图像。
2、由于采用既有相机加机械安装结构的方式,机械安装结构本身存在误差,同时,由于加工制造的不一致性,相机的光轴、感光面与外壳之
间存在几何尺寸的不一致性,这样,导致最后感光元件不能保证在同一水平面上,感光元件的光轴也不能保证相互平行,同时也不能保证组成一个标准的矩形结构。以上误差虽然可以通过事后标定做一些弥补,但误差的存在极大影响了三维计算的精度和准确性。
发明内容
有鉴于此,本发明的目的在于提供一种基于***头矩阵的图像获取装置,其中微型镜头和对应的微型感光元件、对应的图像生成电路组成一个***头,多个***头组成***头矩阵,采用将矩阵结构的***头在一块板上加工、焊接或制作的方式,以及采用一体化外壳的方式,将***头矩阵放置在同一平面上,保证***头相互位置的几何精度,以及***头光轴的平行以及矩阵结构的几何精度,也可以缩小相邻的***头之间的距离,通过以上措施,保证三维立体图像精确度和准确度更高,测量范围更大,图像获取装置的集成度更高,方便加工制作,使该装置成为真正意义上的集成化小型化的三维图像采集装置。
第一方面,本发明实施例提供了一种基于***头矩阵的图像获取装置,包括图像生成电路板和微型镜头矩阵;
所述图像生成电路板包括图像生成电路矩阵,所述图像生成电路矩阵中的各个图像生成电路均包括微型感光元件,各个所述微型感光元件组成微型感光元件矩阵;
所述微型镜头矩阵中的各个所述微型镜头固定设置于所述图像生成电路板上,与各个所述微型感光元件一一对应,且各个所述微型镜头的轴线分别垂直于所述图像生成电路板所在平面。
结合第一方面,本发明实施例提供了第一方面第一种可能的实施方式,其中,所述微型镜头矩阵的各个所述微型镜头以m×n形式设置,其中m大于等于2,n大于等于2。
结合第一方面第一种可能的实施方式,本发明实施例提供了第一方面第二种可能的实施方式,其中,所述微型镜头矩阵中水平方向上的各个所述微型镜头等间距设置,相邻的两个所述微型镜头之间的间距大于等于10毫米;
所述微型镜头矩阵中竖直方向上的各个所述微型镜头等间距设置,相邻的两个所述微型镜头之间的间距大于等于10毫米。
结合第一方面,本发明实施例提供了第一方面第三种可能的实施方式,其中,所述微型感光元件矩阵中的各个所述微型感光元件与所述图像生成电路板一体成形;或者,所述微型感光元件矩阵中的各个所述微型感光元件焊接安装在所述图像生成电路板上。
结合第一方面第三种可能的实施方式,本发明实施例提供了第一方面第四种可能的实施方式,其中,所述微型感光元件矩阵中的各个所述微型感光元件加工或焊接时,要求水平方向对应像素行对齐,垂直方向对应像素列对齐。
结合第一方面,本发明实施例提供了第一方面第五种可能的实施方式,其中,还包括图像采集电路板,所述图像采集电路板包括依次连接的数字信号处理器和通信模块;
所述图像生成电路用于将所述微型感光元件生成的模拟图像转化为数字图像;
所述数字信号处理器,用于***头矩阵的***控制,完成图像采集的各种控制功能,包括图像采集、图像传输、图像增益和快门控制、通信协议交互管理、定时中断、任务切换、存储管理、***头的参数设置、采集控制和采集格式定义;
所述通信模块,用于在所述数字信号处理器的控制下将多幅所述数字图像输出到上位终端。
结合第一方面第五种可能的实施方式,本发明实施例提供了第一方面第六种可能的实施方式,其中,还包括固定基板和前壳;
所述图像生成电路板固定在所述固定基板上,所述固定基板安装在所述前壳的内表面;
所述前壳上设置有与各个所述微型镜头一一对应的多个镜头孔,各个所述微型镜头通过各个所述镜头孔拍摄。
结合第一方面第六种可能的实施方式,本发明实施例提供了第一方面第七种可能的实施方式,其中,还包括后壳,所述图像采集电路板固定安装在所述后壳朝向所述前壳的一面。
结合第一方面第七种可能的实施方式,本发明实施例提供了第一方面第八种可能的实施方式,其中,所述前壳和所述后壳固定连接形成壳体,所述壳体上设置有电源输入口和数据通信接口;
所述电源输入口用于,连接电源线,通过所述电源线为所述图像生成电路板和所述图像采集电路板供电;
所述数据通信接口用于,连接数据线,所述通信模块通过所述数据线将多幅所述数字图像输出到上位终端。
结合第一方面上述的实施方式,本发明实施例提供了第一方面第九种可能的实施方式,其中,所述装置还包括镜头保护罩,所述镜头保护罩用于保护所述微型镜头矩阵中的各个所述微型镜头。
本发明实施例中,微型镜头和对应的微型感光元件、对应的图像生成电路组成一个***头,多个***头组成***头矩阵,各个***头的轴线分别垂直于图像生成电路板所在平面。与相关技术相比,由于本发明实施例中采用将矩阵结构的***头在一块板上加工、焊接或制作的方式,将***头矩阵放置在同一平面上,因此保证***头相互位置的几何精度,以及***头光轴的平行以及矩阵结构的几何精度,也可以缩小相邻的***头之间的距离,通过以上措施,保证三维立体图像精确度和准确度更高,测量范围更大,图像获取装置的集成度更高,方便加工制作,使该装置成为真正意义上的集成化小型化的三维图像采集装置。
为使本发明的上述目的、特征和优点能更明显易懂,下文特举较佳实施例,并配合所附附图,作详细说明如下。
为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本发明的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,
在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。
图1示出了本发明实施例所提供的图像获取装置的结构示意图;
图2示出了本发明实施例提供的图像获取装置的***示意图;
图3示出了本发明实施例提供的图像获取装置的装配示意图;
图4示出了本发明实施例所提供的图像获取装置的模块组成示意图。
附图标记;
固定基板100;
图像生成电路板200、微型感光元件201、安装孔202、微型镜头203、图像生成电路204;
前壳300、镜头孔301;
图像采集电路板400;
后壳500;
电源输入口601、数据通信接口602。
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。因此,以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围,而是仅仅表示本发明的选定实施例。基于本发明的实施例,本领域技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。
考虑到相关技术中的图像拍摄方式无法拍摄得到几何位置关系满足精度要求的图像,导致最终得到的三维立体图像精确度和准确性有限,无法得到更加精准的三维立体图像,本发明提供了一种基于***头矩阵的图像获取装置,下面通过实施例进行具体描述。
图1示出了本发明实施例所提供的图像获取装置的结构示意图,如图1所示,本发明实施例中的图像获取装置包括图像生成电路板200和微型镜头矩阵;
图像生成电路板200包括图像生成电路矩阵,图像生成电路矩阵中的各个图像生成电路204均包括微型感光元件201,各个微型感光元件201组成微型感光元件矩阵;
微型镜头矩阵中的各个微型镜头203固定设置于图像生成电路板200上,与各个微型感光元件201一一对应,且各个微型镜头203的轴线分别垂直于图像生成电路板200所在平面。
本发明实施例中,微型镜头203和对应的微型感光元件201、对应的图像生成电路204组成一个***头,多个***头组成***头矩阵,各个***头的轴线分别垂直于图像生成电路板200所在平面。与相关技术相比,由于本发明实施例中采用将矩阵结构的***头在一块板上加工、焊接或制作的方式,将***头矩阵放置在同一平面上,因此保证***头相互位置的几何精度,以及***头光轴的平行以及矩阵结构的几何精度,也可以缩小相邻的***头之间的距离,通过以上措施,保证三维立体图像精确度和准确度更高,测量范围更大,图像获取装置的集成度更高,方便加工制作,使该装置成为真正意义上的集成化小型化的三维图像采集装置。
上述各个微型感光元件201型号和类型完全相同,各个图像生成电路204完全相同,以及各个微型镜头203的型号和类型完全相同,从而保证各个***头完全相同。
上述微型镜头203将捕获到的光信号传输至微型感光元件201,微型感光元件201的作用是将微型镜头203捕获到的光信号转变为电信号,以便于后续图像处理。微型感光元件201可以为CCD(Charge-coupled Device,图像传感器),也可以为CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体),当然,也可以为其他公知的能够应用在图像获取过程中实现光信号转变为电信号的电器件。
图像生成电路204主要功能是将微型感光元件201获得的电信号由模拟信号转换为数字信号,形成一幅数字图像,用于后续电路的读取。
本发明实施例中,优选微型镜头矩阵中的各个微型镜头203以m×n形式设置,其中m大于等于2,n大于等于2。
具体地,各个微型镜头203可以以2×2形式设置,或者2×3形式设置,或者3×3形式设置,或者4×5形式设置,这里不再做一一列举。
本实施例中,采用m×n形式设置各个微型镜头203,能够保证取景范围合适,拍摄到完整的被拍摄物体或被拍摄场景。
研究发现,各个微型镜头203之间的间距对拍摄视场范围存在影响,本实施例中,优选微型镜头矩阵中水平方向上的各个微型镜头203等间距设置,相邻的两个微型镜头203之间的间距大于等于10毫米,同样地,微型镜头矩阵中竖直方向上的各个微型镜头203等间距设置,相邻的两个微型镜头203之间的间距大于等于10毫米。
将微型镜头矩阵中水平方向上的各个微型镜头203等间距设置,以及微型镜头矩阵中竖直方向上的各个微型镜头203等间距设置,便于后期图像三维处理运算,便于图像生成电路板200的生产和安装。
另外考虑到微型镜头矩阵中各个微型镜头203之间的间距过大时,拍摄得到的多张照片接近程度会下降,导致最终合成的三维立体图像精确度不高,另一种优选的实施方式中,优选微型镜头矩阵中水平方向上的各个微型镜头203等间距设置,相邻的两个微型镜头203之间的间距大于等于10毫米且小于等于120毫米,同样地,微型镜头矩阵中竖直方向上的各个微型镜头203等间距设置,相邻的两个微型镜头203之间的间距大于等于10毫米且小于等于120毫米。
使水平方向或者竖直方向相邻的两个微型镜头203之间的间距大于等于10毫米且小于等于120毫米,能够避免张照片接近程度下降,导致最终合成的三维立体图像精确度不高的问题,还能够减小图像获取设备的尺寸,便于图像获取设备的生产加工。
需要说明的是,在水平方向或者竖直方向相邻的两个微型镜头203之间的间距大于等于10毫米的基础上,间距的上限不局限于120毫米,也可以是150毫米或者180毫米,可以根据实际需要确定。一般来说,微型镜头203的焦距值越大,拍摄物体的视场范围越大,相邻微型镜头203的间距也需要越大。
为了进一步保证多个***头拍摄得到的图像规律有序,优选微型镜头矩阵中水平方向上相邻的两个微型镜头203之间的间距与微型镜头矩阵中竖直方向上相邻的两个微型镜头203之间的间距相等。
本领域技术人员能够理解,由于各个微型镜头203与各个微型感光元件201和各个图像生成电路204对应设置,因此各个微型感光元件201的设置方式,以及各个图像生成电路204的设置方式均与微型镜头203的设置方式相同,这里不再赘述。
图1中,微型感光元件矩阵中的各个微型感光元件201与图像生成电路板200一体成形;或者,微型感光元件矩阵中的各个微型感光元件201焊接安装在图像生成电路板200上。其中,微型感光元件矩阵中的各个微型感光元件201加工或焊接时,要求水平方向对应像素行对齐,垂直方向对应像素列对齐。
相关技术中已有的各种类型的独立的微型感光元件201均包括CCD和/或CMOS,并且技术已经十分成熟,根据视场范围、测量精度和测量速度等要求,可以选择适合使用的微型感光元件201,然后设计对应的图像生成电路板200,图像生成电路板200可以采用PCB(Printed Circuit Board,印制电路板)电路板的方式,然后将各个微型感光元件201按照前述的微型镜头203的布设要求焊接在图像生成电路板200上。采用焊接方式时,为了保证焊接精度,可使用专用的感光元件定位卡具,保证焊接后各微型感光元件201的位置精度。
采用焊接的方式将微型感光元件201焊接在图像生成电路板200上。目前CCD和CMOS等感光元件基本都是按照像素的行和列的数量加工成矩形,由于三维运算时,要求同一行的对应坐标位置的像素行需要在同一条直线上,同时,同一列对应坐标位置的像素列也需要在同一条直线上,因此本实施例中要求各个微型感光元件201组成标准矩形时,微型感光元件矩阵中的像素所在的位置(该位置用行和列的值表示)也对组成对应的矩形结构,从而保证三维运算的精准度,所以,图像生成电路板200上的微型感光元件201加工或焊接时,要求水平方向对应像素行对齐,垂直方向对应像素列对齐,从而保证三维运算的精准度。
由于,CCD和CMOS等感光元件的像素间距一般为微米级,微型感光元件201在焊接时很难保证其对应的像素行或列完全对齐,必然会产生对应像素行或列的相对偏移或相对旋转,为了弥补以上误差,就需要在加工后,对以上加工误差进行测量和标定,可以在三维计算中进行弥补和软件上的修正。
或者,采用同步加工的方式将微型感光元件201与图像生成电路板200一体成形。根据矩阵几何精度的需要,为保证微型感光元件矩阵中的各个像素位置也形成标准的矩形结构,提高三维运算的精度和速度,可以定制加工图像生成电路板200,将各个微型感光元件201和图像生成电路板200一体成形,在加工图像生成电路板200的过程中加工完成各个微型感光元件201,也就是相当于加工一块由多个组成矩形的感光区域而形成的一个大型的CCD或CMOS。该方法避免了前述的焊接方法造成的误差,减少图像运算时间,使三维图像数据更加准确。按照一体成形的方法,还需要对图像生成电路板200上的图像生成电路204进行处理,将图像生成电路204放置在另一块电路板上或放置在图像采集电路板400上,或对电路布局进行调整,加工在不影响微型感光元件201一体成型矩阵的位置上。
图2示出了本发明实施例提供的图像获取装置的***示意图,图4示出了本发明实施例所提供的图像获取装置的模块组成示意图,如图2和图4所示,本发明实施例的图像获取装置还包括图像采集电路板400,图像采集电路板400包括依次连接的数字信号处理器702和通信模块704。
微型镜头203将光信号聚焦到微型感光元件201,微型感光元件201根据光信号生成模拟图像,图像生成电路204将微型感光元件201生成的模拟图像转换为数字图像,并进行图像采集控制、增益和快门控制。图像生成电路204还与图像采集电路板400中的数字信号处理器702进行通讯,将数字图像发送至数字信号处理器702,图像采集电路板400中的数字信号处理器702用于***头矩阵的***控制,完成图像采集的各种控制功能,包括图像采集、图像传输、图像增益和快门控制、通信协议交互管理、定时中断、任务切换、存储管理、***头的参数设置、采集控制和采集格式定义等。数字信号处理器702还用于将各幅数字图像通过
通信模块704输出到上位终端。通信模块704用于在数字信号处理器702的控制下将多幅数字图像输出到上位终端。
具体地,数字信号处理器702类似嵌入式计算机上的CPU(Central Processing Unit,中央处理器)芯片,其可以是DSP(Digital Signal Processing,数字信号处理器)、ARM(Acorn RISC Machine,RISC微处理器)、FPGA(Field Programmable Gate Array,现场可编程逻辑门阵列)等芯片,是整个图像采集***的控制核心。图像生成电路204中也有一块相同的芯片,不同的是,图像生成电路204中的数字信号处理器只负责单个***头的图像采集和控制,数字信号处理器702负责本实施例中***头矩阵的图像采集的总体控制,数字信号处理器702运行时,首先调入内嵌程序,与上位终端通讯,并与图像生成电路204中的数字信号处理器通讯,控制执行***头的初始化命令,设置***头的参数,例如曝光时间、触发方式、图像增益等,将***头内部参数发送到上位终端,例如***头的编号等,在得到拍摄命令后,控制各个***头的图像采集,采集完成后,将图像传输到上位终端。
需要说明的是,图像生成电路板200和图像采集电路板400之间通过电路接口进行电性连接,在具体电路设计过程中,可根据外壳尺寸和具体情况,将图像生成电路板200的部分模块例如模数转换电路下移到图像采集电路板400,或为了缩小电路板面积,将图像生成电路板200或图像采集电路板400部分模块分割为另一个电路板,以上的改变,并不影响具体的图像获取装置功能的实现,只是方便了封装和外形尺寸的设计要求。
另外,上位终端向通信模块704发送拍摄触发信号,通信模块704将该拍摄触发信号发送至数字信号处理器702,数字信号处理器702根据该拍摄触发信号控制微型感光元件201根据光信号得到模拟图像信号,并控制图像生成电路204将模拟图像转化为数字图像,以及控制通信模块704将多幅数字图像输出至上位终端。
如图4所示,图像采集电路板400还包括非易失性存储器705和电源模块706,电源模块706分别与图像采集电路板400上的各个用电器件电连接,为各个用电器件供电。非易失性存储器705与数字信号处理器702
连接,用于存储数字信号处理器702在图像处理过程中生成的变量以及多幅数字图像。
上述通信模块704包括:数据交换电路或设备以及对应的输出输入接口。数据交换电路或设备就像网络交换机,可以将***头矩阵采集到的图像集中到同一个网络接口输出,也可以采用多个网络接口并行输出,输出接口的数量与采集图像需要的时间相对应。
通信模块704的输出输入接口包括:***总线接口、网络设备接口和I/O控制接口,***总线接口、网络设备接口和I/O控制接口分别与数字信号处理器702连接,网络设备接口和I/O控制接口分别与电源模块706连接。***总线接口,用于将多幅数字图像通过***总线传输出去,网络设备接口,用于将多幅数字图像通过网络设备传输出去,I/O控制接口,用于接收外部设备发出的拍摄触发信号。
上述***总线接口,包括但不限于:RS-232/485接口、1394接口、USB接口和camerlink接口。上述网络设备接口,包括但不限于:RJ-45接口、RJ-11接口、SC光纤接口、FDDI接口、AUI接口、BNC接口和Console接口,还可以是3G、4G、WIFI(WIreless-Fidelity,无线保真)等无线网络接口。
如图1所示,本发明实施例中的图像获取装置还包括固定基板100,图像生成电路板200固定在固定基板100上。如图1所示,图像生成电路板200上开设有安装孔202,通过该安装孔202将图像生成电路板200固定在固定基板100上。其中,能够通过安装孔202以螺栓连接的方式将图像生成电路板200固定在固定基板100上,还能够通过安装孔202以铆接或者枢接的方式将图像生成电路板200固定在固定基板100上。
如图2所示,本发明实施例中的图像获取装置还包括前壳300,前壳300上设置有与各个微型镜头203一一对应的多个镜头孔301,固定基板100安装在前壳300的内表面,各个微型镜头203通过各个镜头孔301拍摄。
图3示出了本发明实施例提供的图像获取装置的装配示意图,如图3所示,各个微型镜头203与各个镜头孔301配合,一方面用于固定微型镜头203,一方面用于通过镜头孔301摄像。微型镜头203固定在图像生成
电路板200上,图像生成电路板200固定在固定基板100上,固定基板100安装在前壳300的内表面,从而使各个微型镜头203通过各个镜头孔301拍摄,也使由各个***头组成的***头矩阵固定在前壳300的内表面。
如图2和图3所示,本发明实施例的图像获取装置还包括后壳500,前壳300和后壳500固定连接形成壳体,图像采集电路板400固定安装在后壳500朝向前壳300的一面。
具体地,固定基板100与前壳300固定连接,图像采集电路板400与后壳500固定连接,前壳300后壳500固定连接形成完整的壳体,固定基板100和图像采集电路板400位于壳体内部。
其中,固定基板100通过螺栓、卡接、枢接、铆接等方式与前壳300固定连接,图像采集电路板400通过螺栓、卡接、枢接、铆接等方式与后壳500固定连接,前壳300和后壳500能够通过卡接、螺栓连接等方式固定形成壳体。
如图3所示,壳体上设置有电源输入口601和数据通信接口602,电源输入口601用于连接电源线,通过电源线为图像生成电路板200和图像采集电路板400供电,数据通信接口602用于连接数据线,数字信号处理器702通过数据线接收上述拍摄触发信号,通信模块704通过数据线将多幅数字图像输出,优选输出至该图像获取装置的上位终端。其中,数据通信接口602包括多种不同类型的接口,从而满足不同情况下的数据输入输出要求。
考虑到微型镜头203的易破损性,另外一种实施方式中,图像获取装置还包括镜头保护罩,镜头保护罩用于保护微型镜头矩阵中的各个微型镜头203。
其中,镜头保护罩安装在前壳300的外表面,覆盖在各个镜头孔301表面,用于保护各个微型镜头203,避免各个微型镜头203损坏。镜头保护罩可以为塑料材质。
需要说明的是,上述图1至图4中,均以四个微型镜头203为例进行说明,图中微型镜头203的个数并不起到限制作用,只是示意性举例。同
样地,微型感光元件201和图像生成电路204的数量也不限于四个,图1至图4只是示意性举例,不起到限制作用。
本发明实施例中的图像获取装置能够放置在拍摄场景中,对被拍摄物体进行拍照,其中,微型镜头203和对应的微型感光元件201、对应的图像生成电路204组成一个***头,各个***头和图像采集电路板400组成一个数字相机,本发明实施例将组成平行阵列的多个数字相机加工在一套机器盒内,形成三维立体图像采集装置。
本发明实施例中的图像获取装置在拍摄图像之前,需要对该装置的一些具体参数进行标定和检测,标定和检测的内容包括:微型镜头的焦距、畸变、光轴几何位置;微型感光元件的几何位置关系、实际测量间距、行和列的偏移等等,标定和检测需要采用专用标定设备和软件,标定完成后,需要将测量后的参数提供给三维图像处理软件,将相关测量尺寸输入三维运算公式,计算三维坐标尺寸,同时,通过软件补偿制造和安装误差,提高三维数据精度。上述图像采集装置,一般采用同步方式采集物体平面多幅二维图像。在获得拍摄信号后,各个***头拍摄得到多幅平面二维图像的数据格式,多幅平面二维图像通过数据通信接口602传输至外部图像数据处理装置进行处理,通过外部图像数据处理装置对多幅平面二维图像进行处理,进而得到被拍摄物体的三维立体图像。
其中,外部图像数据处理装置对矩阵平面二维图像形式的图像数据进行处理的过程为:对拍摄得到的多张图像进行特征点匹配运算,根据匹配好的特征点像坐标,计算特征点的空间位置坐标,根据得到的各个特征点的空间位置坐标,计算被测物的其它需要特别测量的三维尺寸,形成三维点云数据,建立三维点云图形,进行三维立体重现。
需要说明的是,本发明实施例中,微型镜头203和对应的微型感光元件201、对应的图像生成电路204组成一个***头,设置相邻的四个***头组成的矩阵为图像获取单元,当***头只有四个时,则存在一个图像获取单元,当***头大于四个时,则每次向右或者向下偏移一个***头,采用***头可以重叠的原则确定多个图像获取单元,如***头为6个时,则得到两个图像获取单元,其中有两个***头为重叠状态,在两个图像获取单元中均出现。
本实施例中,按照相邻的四个***头组成的矩阵为图像获取单元,对每个图像获取单元获取得到的图像进行处理,从而得到被拍摄物体的三维立体图像。
以上图像获取装置以及对应的外部图像数据处理装置获取物体三维数据的方式,与人眼看世界的方式相同,由于采用平面矩阵方式拍摄二维图像,就像人从不同角度看物体一样,通过标准程序运算,将不同位置图像上,同一特征点的视差计算出来,就能够得到物体的三维外形尺寸。
由于目前三维运算计算量巨大,独立和小型的电路难以胜任如此海量的运算,只能将三维运算放置在上位运算的终端上,未来随着计算芯片功能的逐步强大,以及功耗的逐步降低,相信未来一定会出现本地三维数据自动处理的电路板和芯片。
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该发明产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。
在本发明的描述中,还需要说明的是,除非另有明确的规定和限定,术语“设置”、“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
最后应说明的是:以上所述实施例,仅为本发明的具体实施方式,用以说明本发明的技术方案,而非对其限制,本发明的保护范围并不局限于此,尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术
人员应当理解:任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,其依然可以对前述实施例所记载的技术方案进行修改或可轻易想到变化,或者对其中部分技术特征进行等同替换;而这些修改、变化或者替换,并不使相应技术方案的本质脱离本发明实施例技术方案的精神和范围。都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应所述以权利要求的保护范围为准。
Claims (10)
- 一种基于***头矩阵的图像获取装置,其特征在于,包括图像生成电路板和微型镜头矩阵;所述图像生成电路板包括图像生成电路矩阵,所述图像生成电路矩阵中的各个图像生成电路均包括微型感光元件,各个所述微型感光元件组成微型感光元件矩阵;所述微型镜头矩阵中的各个所述微型镜头固定设置于所述图像生成电路板上,与各个所述微型感光元件一一对应,且各个所述微型镜头的轴线分别垂直于所述图像生成电路板所在平面。
- 根据权利要求1所述的装置,其特征在于,所述微型镜头矩阵的各个所述微型镜头以m×n形式设置,其中m大于等于2,n大于等于2。
- 根据权利要求2所述的装置,其特征在于,所述微型镜头矩阵中水平方向上的各个所述微型镜头等间距设置,相邻的两个所述微型镜头之间的间距大于等于10毫米;所述微型镜头矩阵中竖直方向上的各个所述微型镜头等间距设置,相邻的两个所述微型镜头之间的间距大于等于10毫米。
- 根据权利要求1所述的装置,其特征在于,所述微型感光元件矩阵中的各个所述微型感光元件与所述图像生成电路板一体成形;或者,所述微型感光元件矩阵中的各个所述微型感光元件焊接安装在所述图像生成电路板上。
- 根据权利要求4所述的装置,其特征在于,所述微型感光元件矩阵中的各个所述微型感光元件加工或焊接时,要求水平方向对应像素行对齐,垂直方向对应像素列对齐。
- 根据权利要求1所述的装置,其特征在于,还包括图像采集电路板,所述图像采集电路板包括依次连接的数字信号处理器和通信模块;所述图像生成电路,用于将所述微型感光元件生成的模拟图像转化为数字图像;所述数字信号处理器,用于***头矩阵的***控制,完成图像采集的各种控制功能,包括图像采集、图像传输、图像增益和快门控制、通 信协议交互管理、定时中断、任务切换、存储管理、***头的参数设置、采集控制和采集格式定义;所述通信模块,用于在所述数字信号处理器的控制下将多幅所述数字图像输出到上位终端。
- 根据权利要求6所述的装置,其特征在于,还包括固定基板和前壳;所述图像生成电路板固定在所述固定基板上,所述固定基板安装在所述前壳的内表面;所述前壳上设置有与各个所述微型镜头一一对应的多个镜头孔,各个所述微型镜头通过各个所述镜头孔拍摄。
- 根据权利要求7所述的装置,其特征在于,还包括后壳,所述图像采集电路板固定安装在所述后壳朝向所述前壳的一面。
- 根据权利要求8所述的装置,其特征在于,所述前壳和所述后壳固定连接形成壳体,所述壳体上设置有电源输入口和数据通信接口;所述电源输入口,用于连接电源线,通过所述电源线为所述图像生成电路板和所述图像采集电路板供电;所述数据通信接口,用于连接数据线,所述通信模块通过所述数据线将多幅所述数字图像输出到上位终端。
- 根据权利要求1至9任一项所述的装置,其特征在于,所述装置还包括镜头保护罩,所述镜头保护罩用于保护所述微型镜头矩阵中的各个所述微型镜头。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111861861A (zh) * | 2020-07-30 | 2020-10-30 | 哈尔滨方聚科技发展有限公司 | 一种微型动态红外图像生成装置 |
US11303786B2 (en) | 2016-09-13 | 2022-04-12 | Beijing Qingying Machine Visual Technology Co. | Image acquisition apparatus based on miniature camera matrix |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107289869A (zh) * | 2017-06-08 | 2017-10-24 | 杭州联络互动信息科技股份有限公司 | 一种利用矩阵镜头进行3d测量的方法、装置及*** |
CN107390174A (zh) * | 2017-08-07 | 2017-11-24 | 深圳欧沃机器人有限公司 | 一种光敏矩阵定位方法及装置 |
CN108521540B (zh) * | 2018-05-31 | 2023-06-16 | 北京图森智途科技有限公司 | 一种多目相机 |
CN112639390A (zh) * | 2019-11-21 | 2021-04-09 | 北京机电研究所有限公司 | 用于三维尺寸的动态测量装置及其测量方法 |
JP2022038528A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社ディスコ | 加工装置 |
CN112614178A (zh) * | 2020-12-08 | 2021-04-06 | 快优智能技术有限公司 | 一种基于单设备的多摄像头位置定位方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100007714A1 (en) * | 2008-07-10 | 2010-01-14 | Samsung Electronics Co., Ltd. | Flexible image photographing apparatus with a plurality of image forming units and method for manufacturing the same |
CN101900929A (zh) * | 2009-05-26 | 2010-12-01 | 介面光电股份有限公司 | 具有立体影像显示与触控的数字影像采集装置 |
CN103813108A (zh) * | 2012-11-15 | 2014-05-21 | Lg电子株式会社 | 阵列相机、移动终端、及其操作方法 |
CN103888751A (zh) * | 2014-03-12 | 2014-06-25 | 天津理工大学 | 一种基于dsp的嵌入式全景立体球视觉图像采集*** |
CN104836943A (zh) * | 2015-01-30 | 2015-08-12 | 中国科学技术大学 | 一种平面分布的多摄像头全景图拍摄***及其实现方法 |
CN205305019U (zh) * | 2015-12-04 | 2016-06-08 | 深圳市第六星设计技术有限公司 | 3d摄像头机构及具有该机构的移动设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2490596Y (zh) * | 2001-07-18 | 2002-05-08 | 陈建全 | 复眼式多阶自动变焦的摄影装置 |
US20160241842A1 (en) * | 2006-06-13 | 2016-08-18 | Billy D. Newbery | Digital Stereo Photographic System |
WO2011052064A1 (ja) * | 2009-10-30 | 2011-05-05 | キヤノン株式会社 | 情報処理装置および方法 |
CN102447934B (zh) * | 2011-11-02 | 2013-09-04 | 吉林大学 | 稀疏镜头采集的组合立体图像***中立体元的合成方法 |
US20130258044A1 (en) * | 2012-03-30 | 2013-10-03 | Zetta Research And Development Llc - Forc Series | Multi-lens camera |
CN104917937B (zh) * | 2014-03-10 | 2018-10-26 | 奇景光电股份有限公司 | 影像撷取组件及其镜头单元阵列 |
US9262801B2 (en) * | 2014-04-01 | 2016-02-16 | Gopro, Inc. | Image taping in a multi-camera array |
CN106210489B (zh) | 2016-09-13 | 2017-10-31 | 北京清影机器视觉技术有限公司 | 一种基于***头矩阵的图像获取装置 |
-
2016
- 2016-09-13 CN CN201610822488.5A patent/CN106210489B/zh active Active
- 2016-09-28 WO PCT/CN2016/100546 patent/WO2018049699A1/zh active Application Filing
- 2016-09-28 US US16/331,761 patent/US11303786B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100007714A1 (en) * | 2008-07-10 | 2010-01-14 | Samsung Electronics Co., Ltd. | Flexible image photographing apparatus with a plurality of image forming units and method for manufacturing the same |
CN101900929A (zh) * | 2009-05-26 | 2010-12-01 | 介面光电股份有限公司 | 具有立体影像显示与触控的数字影像采集装置 |
CN103813108A (zh) * | 2012-11-15 | 2014-05-21 | Lg电子株式会社 | 阵列相机、移动终端、及其操作方法 |
CN103888751A (zh) * | 2014-03-12 | 2014-06-25 | 天津理工大学 | 一种基于dsp的嵌入式全景立体球视觉图像采集*** |
CN104836943A (zh) * | 2015-01-30 | 2015-08-12 | 中国科学技术大学 | 一种平面分布的多摄像头全景图拍摄***及其实现方法 |
CN205305019U (zh) * | 2015-12-04 | 2016-06-08 | 深圳市第六星设计技术有限公司 | 3d摄像头机构及具有该机构的移动设备 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11303786B2 (en) | 2016-09-13 | 2022-04-12 | Beijing Qingying Machine Visual Technology Co. | Image acquisition apparatus based on miniature camera matrix |
CN111861861A (zh) * | 2020-07-30 | 2020-10-30 | 哈尔滨方聚科技发展有限公司 | 一种微型动态红外图像生成装置 |
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