WO2018012313A1 - Wire saw device and method for cutting workpiece - Google Patents
Wire saw device and method for cutting workpiece Download PDFInfo
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- WO2018012313A1 WO2018012313A1 PCT/JP2017/024063 JP2017024063W WO2018012313A1 WO 2018012313 A1 WO2018012313 A1 WO 2018012313A1 JP 2017024063 W JP2017024063 W JP 2017024063W WO 2018012313 A1 WO2018012313 A1 WO 2018012313A1
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- wire
- workpiece
- saw device
- cutting
- wire saw
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- 238000005520 cutting process Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000002159 abnormal effect Effects 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 238000004804 winding Methods 0.000 claims abstract description 3
- 238000012423 maintenance Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 abstract description 21
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000006731 degradation reaction Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Definitions
- the present invention relates to a wire saw cutting technique, and more particularly to a wire saw apparatus and a workpiece cutting method that can be applied to a wafer cutting step of slicing a workpiece such as a silicon semiconductor single crystal ingot into a wafer.
- a plurality of silicon semiconductor wafers are obtained by thinly cutting a silicon semiconductor single crystal ingot pulled up by a single crystal pulling apparatus in the direction perpendicular to the axis with an inner peripheral slicer.
- a cutting method using a wire saw has attracted attention in recent years.
- a workpiece is pressed against a wire row spirally wound between a plurality of main rollers (wire guides), and the wire is moved while supplying slurry to a contact portion between the workpiece and the wire.
- a method of cutting a workpiece into a wafer shape for example, Patent Document 1).
- a large number of wafers for example, several hundred wafers
- a vibration meter is attached to the holding portion of the grooved roller and used for detecting disconnection, and as in Patent Document 3, vibration is applied to the bearing housing of the reel bobbin or the bracket of the bearing housing.
- the present invention has been made in view of the above-mentioned problems, and before cutting a workpiece, it is possible to determine a state in which the tension of the wire is disturbed or abnormal vibration of the wire saw device occurs, and the workpiece is cut out from the workpiece. It is an object of the present invention to provide a wire saw apparatus and a workpiece cutting method that can prevent quality deterioration of a wafer.
- a wire supply reel extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, and the wire
- a wire saw device that performs cutting by pressing, Provided is a wire saw device comprising: a vibration sensor attached to the work holding unit; and a load cell for detecting a tension of the wire.
- a method for cutting a workpiece using the wire saw device of the present invention Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values; There is provided a workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal.
- Such a workpiece cutting method uses the above-described wire saw device of the present invention, and therefore can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece
- Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, It is preferable that the work is cut after maintenance of the wire saw device is performed until the value falls within the control value limit.
- the state of the wire saw device can be grasped before the workpiece is cut, and maintenance is performed in the case of an abnormal condition outside the control value limit. The occurrence of defects due to quality deterioration can be reduced.
- a method of cutting a workpiece using the wire saw device of the present invention wherein the wire is moved forward and backward at least in a state where the workpiece is not in contact with the wire before the workpiece is cut.
- the standard deviation of the tension of the wire detected by the load cell is 0.45 N or less and the vibration detected by the vibration sensor is 1.0 mm / sec or less while repeatedly running more than once.
- the workpiece cutting method is characterized in that the workpiece is cut.
- the wire saw device of the present invention Before the workpiece is cut, at least one of the tension of the wire detected by the load cell and the vibration detected by the vibration sensor is measured, and the normal value of the wire saw device is measured using this measurement value. Alternatively, an abnormality can be determined. Therefore, if it is determined that the wire saw device is normal, the quality of the wafer cut out from the workpiece can be prevented from being deteriorated by cutting the workpiece.
- the warp quality is deteriorated when the workpiece is cut in a state where the wire tension cannot be kept constant and is greatly violated or abnormal vibration occurs. It can be seen. Further, when the abnormality is noticed during the cutting of the workpiece and the apparatus is stopped for maintenance, the Warp quality deteriorates due to the temperature change. In either case, since a large number of wafers are cut out at a time, there is a problem that it is likely to lead to a large number of defects.
- the present inventor has intensively studied to solve such problems.
- the wire saw device includes a vibration sensor attached to a part that holds the workpiece and a load cell that detects wire tension
- the wire tension and vibration sensor detected by the load cell before cutting the workpiece It is possible to measure at least one of the detected vibrations and use this measurement value to determine whether the wire saw device is normal or abnormal.
- the workpiece is cut. For example, it has been conceived that quality deterioration of a wafer cut out from a workpiece can be prevented. And the best form for implementing these was scrutinized and the present invention was completed.
- a wire saw device 13 of the present invention includes a wire supply reel 1 that extends a wire 8 and a wire array that is spirally wound around a plurality of wire guides 6. 9, a wire take-up reel 7 for winding the wire 8, and a work holding part 10 for holding the work W to be cut, and the work holding part on the wire array 9 that travels at least once forward and backward.
- the workpiece W held by 10 is pressed and cut.
- the wire saw device 13 includes a vibration sensor (vibrometer) 11 attached to the work holding unit 10 and a load cell 5 that detects the tension of the wire 8.
- the wire 8 passes from the wire supply reel 1 through the long roller 2, the traverser 3, and the plurality of pulleys P and is wound around the wire guide 6 in parallel at a predetermined pitch to form a wire row 9.
- the work W is cut by lowering the work W held by the work holding unit 10 to the wire row 9.
- the wire 8 exiting the wire guide 6 passes through the plurality of pulleys P and the traverser 3 and is taken up by the wire take-up reel 7.
- a load cell 5 and a tension mechanism 4 are provided between the wire supply reel 1 and the wire guide 6 and between the wire guide 6 and the wire take-up reel 7, respectively, and the tension detected by the load cell 5. Based on the above, the tension of the wire 8 is controlled by the tension mechanism 4.
- a vibration sensor 11 is attached to the work holding unit 10.
- the vibration sensor 11 can be configured to directly attach to the plate to which the workpiece W in the workpiece holding unit 10 is bonded, and monitor the vibration.
- the load cell 5 and the vibration sensor 11 are connected to the monitoring PC 12 and can constantly monitor the detection values output from the load cell 5 and the vibration sensor 11.
- the wire 8 is detected by the load cell 5 while the wire 8 is repeatedly moved at least once forward and backward while the workpiece W is not in contact with the wire 8.
- a determination step of measuring at least one of the tension of 8 and the vibration detected by the vibration sensor 11 and determining whether the wire saw device 13 is normal or abnormal is performed using the measured value. Then, in this determination step, when it is determined that the wire saw device 13 is normal, a cutting step for cutting the workpiece W is performed.
- the wire 8 is moved forward and backward at least once in a state where the workpiece W does not contact the wire row 9.
- This operation is referred to as warm-up operation (SP1).
- SP2 at least one of tension and vibration is measured
- SP3 a determination step for determining whether the wire saw device 13 is normal or abnormal from the measured value (measured value) is performed. If normal, warm-up is continued (SP4), and then the workpiece W is cut as it is (SP5). On the other hand, if abnormal, the wire saw device 13 is stopped (SP6), and maintenance such as replacement of the pulley P is performed (SP7). Thereafter, the warm-up operation is performed again (SP1), and this flow can be continued until normal.
- control chart management (SP8) is performed using the measured values, and when the measured values are outside the control value limit, it is determined that the wire saw device 13 is abnormal (SP9).
- the wire saw device 13 is stopped before the workpiece W is cut, and the workpiece W can be cut after maintenance of the wire saw device 13 is performed until the workpiece W is within the control value limit.
- the state of the wire saw device 13 can be grasped before the work W is cut, and maintenance is performed in the case of an abnormal state outside the control value limit, so that the wafer cut out from the work W can be obtained.
- the occurrence of defects due to quality deterioration or quality deterioration can be reduced.
- tension variation ⁇ that can be calculated using a measured value of the tension of the wire 8 detected by the load cell 5 during one forward and backward cycle during warm-up. If the vibration amplitude that can be calculated by using the vibration measurement value detected by the vibration sensor 11 is managed in the control chart (SP8), the control limit line (within the control value limit) is normal, or is out ( There is a method (SP9) that judges that the value is outside the control value limit).
- Cutting can be done. That is, a case where this condition is satisfied is determined to be normal, and a case where this condition is not satisfied is determined to be abnormal.
- Such a workpiece cutting method using the wire saw device of the present invention can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece
- Example 1 Using the wire saw device of the present invention as shown in FIG. 1, the workpiece was cut according to the workpiece cutting method of the present invention. In addition, an ingot having a diameter of 300 mm manufactured by the CZ method (Czochralski method) was used as the workpiece W.
- CZ method Czochralski method
- the load cell 5 detects the workpiece 8 while repeatedly running (warming up) the wire 8 at least once forward and backward, with the workpiece W not in contact with the wire 8 (wire row 9). The tension of the wire 8 to be measured was measured.
- FIG. 3 is a management chart of the tension variation ⁇ during one forward and backward cycle during warm-up. Each point in FIG. 3 indicates a tension variation ⁇ during one cycle of forward and backward movement during warm-up.
- the tension variation ⁇ is within the control limit line (within the control value limit) of UCL (Upper Control Limit: upper control limit line) and LCL (Lower Control Limit: lower control limit line)
- UCL Upper Control Limit: upper control limit line
- LCL Lower Control Limit
- Example 1 As a result, as shown in FIG. 4B, in Example 1, the Warp quality averaged 6.8 ⁇ m.
- Comparative Example 1 As Comparative Example 1, when the tension variation ⁇ as shown by the down arrow (a) in FIG. Went. The tension variation ⁇ indicated by the down arrow (a) in FIG. 3 was 0.46 N that deviated from the control limit line. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
- Example 2 Using the measured value obtained by measuring the vibration detected by the vibration sensor, the average value of the vibration amplitude during one forward and backward cycle during warm-up was calculated. Then, the workpiece was cut in the same manner as in Example 1 except that control chart management was performed using the average value of the vibration amplitude.
- the wire 8 is repeatedly moved forward and backward at least once (warm-up operation) while the vibration detected by the vibration sensor 11 is detected. Measurements were made.
- FIG. 5 is a management chart of the average value of the vibration amplitude during one forward and backward cycle during warm-up. Each point in FIG. 5 indicates the average value of the vibration amplitude during one forward and backward cycle during warm-up.
- the wire saw device was determined to be normal, and when the average value was outside (the control value limit), the wire saw device was determined to be abnormal.
- CL in FIG. 5 indicates a center line.
- Example 2 As a result, as shown in FIG. 6B, in Example 2, the Warp quality averaged 7.1 ⁇ m.
- Comparative Example 2 As Comparative Example 2, when the average value of the vibration amplitude as shown by the down arrow (a) in FIG. 5 is out of the control limit line and is determined to be abnormal, maintenance is not performed and the workpiece W is left as it is. Was cut.
- the vibration at the position indicated by the down arrow (a) in FIG. 5 was 1.2 mm / sec. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
- the present invention is not limited to the above embodiment.
- the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
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Abstract
Description
前記ワーク保持部に取り付けられた振動センサと、前記ワイヤの張力を検出するロードセルとを備えることを特徴とするワイヤソー装置を提供する。 In order to achieve the above object, according to the present invention, a wire supply reel extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, and the wire A wire take-up reel and a work holding part that holds a work to be cut, and the work held by the work holding part in the wire row that travels at least once forward and backward. In a wire saw device that performs cutting by pressing,
Provided is a wire saw device comprising: a vibration sensor attached to the work holding unit; and a load cell for detecting a tension of the wire.
前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退1回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力、及び前記振動センサによって検出される振動の少なくとも一方の測定を行い、該測定された測定値を用いて前記ワイヤソー装置の正常又は異常の判断を行う判断工程と、
前記ワイヤソー装置が正常であると判断された場合に、前記ワークの切断を行う切断工程を有することを特徴とするワークの切断方法を提供する。 According to the present invention, there is provided a method for cutting a workpiece using the wire saw device of the present invention,
Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values;
There is provided a workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal.
前記測定値を用いて管理図管理を行い、前記測定値が管理値限界外にあった場合に前記ワイヤソー装置が異常であると判断して、前記ワークの切断前に前記ワイヤソー装置を停止し、前記管理値限界内に入るまで、前記ワイヤソー装置のメンテナンスを行ってから、前記ワークを切断することが好ましい。 At this time, in the determination step,
Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, It is preferable that the work is cut after maintenance of the wire saw device is performed until the value falls within the control value limit.
図1に示すような本発明のワイヤソー装置を用いて、本発明のワークの切断方法に従ってワークの切断を行った。なお、CZ法(チョクラルスキー法)で製造された直径300mmのインゴットをワークWとして使用した。 (Example 1)
Using the wire saw device of the present invention as shown in FIG. 1, the workpiece was cut according to the workpiece cutting method of the present invention. In addition, an ingot having a diameter of 300 mm manufactured by the CZ method (Czochralski method) was used as the workpiece W.
比較例1として、図3の下矢印(a)が示すような、張力バラつきσが管理限界線を外れており、異常と判断された場合において、メンテナンスを実施せず、そのまま、ワークWの切断を行った。図3の下矢印(a)が示す張力バラつきσは管理限界線を外れた0.46Nであった。このときのスライス品25枚の平均Warp品質を測定した結果を図4(a)に示した。 (Comparative Example 1)
As Comparative Example 1, when the tension variation σ as shown by the down arrow (a) in FIG. Went. The tension variation σ indicated by the down arrow (a) in FIG. 3 was 0.46 N that deviated from the control limit line. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
振動センサによって検出される振動の測定を行って得られた測定値を用いて、暖機時における前進後退1サイクル時の振動振幅の平均値を算出した。そして、この振動振幅の平均値を用いて、管理図管理を行ったこと以外は、実施例1と同様にしてワークの切断を行った。 (Example 2)
Using the measured value obtained by measuring the vibration detected by the vibration sensor, the average value of the vibration amplitude during one forward and backward cycle during warm-up was calculated. Then, the workpiece was cut in the same manner as in Example 1 except that control chart management was performed using the average value of the vibration amplitude.
比較例2として、図5の下矢印(a)が示すような、振動振幅の平均値が管理限界線を外れており、異常と判断された場合において、メンテナンスを実施せず、そのまま、ワークWの切断を行った。図5の下矢印(a)が示す位置での振動は1.2mm/secであった。このときのスライス品25枚の平均Warp品質を測定した結果を図6(a)に示した。 (Comparative Example 2)
As Comparative Example 2, when the average value of the vibration amplitude as shown by the down arrow (a) in FIG. 5 is out of the control limit line and is determined to be abnormal, maintenance is not performed and the workpiece W is left as it is. Was cut. The vibration at the position indicated by the down arrow (a) in FIG. 5 was 1.2 mm / sec. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
Claims (4)
- ワイヤを延出するワイヤ供給リールと、複数のワイヤガイドの周囲に螺旋状に巻回された前記ワイヤによって形成されるワイヤ列と、前記ワイヤを巻き取るワイヤ巻き取りリールと、切断対象のワークを保持するワーク保持部とを有し、少なくとも前進後退を1回以上繰り返して走行する前記ワイヤ列に前記ワーク保持部に保持された前記ワークを押しつけて切断加工を行うワイヤソー装置において、
前記ワーク保持部に取り付けられた振動センサと、前記ワイヤの張力を検出するロードセルとを備えることを特徴とするワイヤソー装置。 A wire supply reel for extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, a wire take-up reel for winding the wire, and a workpiece to be cut A wire saw device that performs a cutting process by pressing the workpiece held by the workpiece holding portion against the wire row that travels by repeating at least one forward and backward movement at least once.
A wire saw device comprising: a vibration sensor attached to the workpiece holding unit; and a load cell for detecting a tension of the wire. - 請求項1に記載のワイヤソー装置を用いてワークを切断する方法であって、
前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退1回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力、及び前記振動センサによって検出される振動の少なくとも一方の測定を行い、該測定された測定値を用いて前記ワイヤソー装置の正常又は異常の判断を行う判断工程と、
前記ワイヤソー装置が正常であると判断された場合に、前記ワークの切断を行う切断工程を有することを特徴とするワークの切断方法。 A method of cutting a workpiece using the wire saw device according to claim 1,
Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values;
A workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal. - 前記判断工程において、
前記測定値を用いて管理図管理を行い、前記測定値が管理値限界外にあった場合に前記ワイヤソー装置が異常であると判断して、前記ワークの切断前に前記ワイヤソー装置を停止し、前記管理値限界内に入るまで、前記ワイヤソー装置のメンテナンスを行ってから、前記ワークを切断することを特徴とする請求項2に記載のワークの切断方法。 In the determination step,
Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, The work cutting method according to claim 2, wherein the work is cut after maintenance of the wire saw device is performed until the control value is within the control value limit. - 請求項1に記載のワイヤソー装置を用いてワークを切断する方法であって、
前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退1回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力の標準偏差が0.45N以下、且つ、前記振動センサによって検出される振動が1.0mm/sec以下であることを確認してから、前記ワークの切断を行うことを特徴とするワークの切断方法。 A method of cutting a workpiece using the wire saw device according to claim 1,
The standard deviation of the tension of the wire detected by the load cell is not more than 0.45 N while the wire is repeatedly moved at least once forward and backward, with the workpiece not in contact with the wire before cutting the workpiece And the workpiece | work cutting method characterized by cutting the said workpiece | work after confirming that the vibration detected by the said vibration sensor is 1.0 mm / sec or less.
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CN109153104B (en) | 2021-03-16 |
JP6729697B2 (en) | 2020-07-22 |
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JPWO2018012313A1 (en) | 2019-02-21 |
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