WO2018008400A1 - Laser machining apparatus and laser machining method - Google Patents

Laser machining apparatus and laser machining method Download PDF

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Publication number
WO2018008400A1
WO2018008400A1 PCT/JP2017/022833 JP2017022833W WO2018008400A1 WO 2018008400 A1 WO2018008400 A1 WO 2018008400A1 JP 2017022833 W JP2017022833 W JP 2017022833W WO 2018008400 A1 WO2018008400 A1 WO 2018008400A1
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WO
WIPO (PCT)
Prior art keywords
laser
refrigerant
processing
nozzle
irradiation nozzle
Prior art date
Application number
PCT/JP2017/022833
Other languages
French (fr)
Japanese (ja)
Inventor
呉屋　真之
太郎 竹内
竜一 成田
Original Assignee
三菱重工業株式会社
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Application filed by 三菱重工業株式会社 filed Critical 三菱重工業株式会社
Publication of WO2018008400A1 publication Critical patent/WO2018008400A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Definitions

  • the present invention relates to a laser processing apparatus and a laser processing method.
  • Patent Document 1 laser light is oscillated by a laser oscillator, a laser beam output from the laser oscillator is irradiated onto a cylindrical surface of a metal pipe to be processed, and the cylindrical surface of the metal pipe is cut through.
  • a laser processing method for a metal pipe laser processing of a cylindrical surface of the metal pipe is described while injecting a gas containing dry ice particles into a hollow portion of the metal pipe.
  • CFRP Carbon Fiber Reinforced Plastic
  • AWAJ Abrasive Water Jet
  • carbon fiber reinforced plastic which is a composite material in which carbon fiber and resin are composited
  • thermal processing such as cutting and drilling is performed using laser processing
  • material deterioration or alteration occurs due to thermal effects.
  • the desired processing specifications cannot be satisfied.
  • Patent Document 1 it is conceivable to blow a gas containing dry ice particles (hereinafter referred to as a refrigerant) onto a processing portion of the processing object.
  • a gas containing dry ice particles hereinafter referred to as a refrigerant
  • a coolant when a coolant is sprayed on the processing site, moisture in the atmosphere is frozen and solidified by the coolant, and this is evaporated by the heat of the laser to generate white smoke. And since this white smoke blocks a laser beam, there exists a problem which cannot irradiate the process part of a process target object with the laser beam of sufficient intensity
  • the present invention solves the above-described problems, and an object thereof is to provide a laser processing apparatus and a laser processing method capable of supplying a coolant to a processing portion of a processing object without affecting the laser.
  • a laser processing apparatus includes a cylindrical laser irradiation nozzle that passes a laser irradiated from a condensing optical system, and a laser that passes through the laser irradiation nozzle.
  • Assist gas supply means for injecting an assist gas from the laser irradiation nozzle along the traveling direction
  • annular refrigerant injection nozzle arranged coaxially with the laser outside the laser irradiation nozzle
  • the laser irradiation Refrigerant supply means for injecting refrigerant from the refrigerant injection nozzle along the traveling direction of the laser passing through the nozzle.
  • the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, the assist gas is injected along with the laser along the laser traveling direction passing through the laser irradiation nozzle, thereby preventing interference between the laser and the refrigerant. Prevents white smoke from being evaporated by the heat of the laser. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
  • the laser processing apparatus includes a cylindrical laser irradiation nozzle that allows a laser irradiated from a condensing optical system to pass through, and the laser along a traveling direction of the laser that passes through the laser irradiation nozzle.
  • An assist gas supply means for injecting an assist gas from the irradiation nozzle; a refrigerant injection nozzle comprising a plurality of holes arranged on the circumference coaxial with the laser; and the laser irradiation nozzle passing through the laser irradiation nozzle.
  • Refrigerant supply means for injecting the refrigerant from the refrigerant injection nozzle along the laser traveling direction.
  • the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, the assist gas is injected along with the laser along the laser traveling direction passing through the laser irradiation nozzle, thereby preventing interference between the laser and the refrigerant. Prevents white smoke from being evaporated by the heat of the laser. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
  • the relationship between the injection pressure P1 of the assist gas injected from the laser irradiation nozzle and the injection pressure P2 of the refrigerant injected from the refrigerant injection nozzle is expressed as P2 ⁇ It is preferable to set to P1.
  • the assist gas has a higher pressure than the refrigerant and prevents the refrigerant from being mixed into the assist gas, so that the effect of preventing the interference between the laser and the refrigerant can be remarkably obtained.
  • an annular shield gas injection is arranged outside the laser irradiation nozzle and outside the refrigerant injection nozzle independently of the laser. It is preferable to include a nozzle and a shield gas supply unit that injects a shield gas from the shield gas injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle.
  • the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, since the shielding gas is injected outside the refrigerant, interference between the refrigerant and the atmosphere is prevented, and a situation in which moisture in the atmosphere is frozen and solidified by the refrigerant is prevented. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
  • the shield includes a plurality of holes disposed on the circumference coaxial with the laser outside the laser irradiation nozzle and outside the coolant jet nozzle. It is preferable to include a gas injection nozzle and a shield gas supply unit that injects a shield gas from the shield gas injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle.
  • the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, since the shielding gas is injected outside the refrigerant, interference between the refrigerant and the atmosphere is prevented, and a situation in which moisture in the atmosphere is frozen and solidified by the refrigerant is prevented. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
  • the relationship between the injection pressure P2 of the refrigerant injected from the refrigerant injection nozzle and the injection pressure P3 of the shield gas injected from the shield gas injection nozzle is expressed as P2. It is preferable to set> P3.
  • the shield gas since the shield gas has a lower pressure than the refrigerant and prevents the shield gas from being mixed into the refrigerant side, the effect of preventing the interference between the laser and the refrigerant can be obtained remarkably.
  • a laser processing method includes a processing step of moving the laser in a predetermined direction while irradiating the processing target with a laser, and the processing on the rear side in the movement direction of the laser during the processing step.
  • this laser processing method it is possible to effectively cool a portion where the thermal influence of the laser is generated without cooling the processing portion which is not affected by the laser on the front side in the moving direction of the laser.
  • a laser processing method is a laser processing method for cutting an object to be processed with a laser, along the cutting line while leaving a predetermined cutting line.
  • the workpiece is cut by irradiating a laser on the preliminary cutting line along the cutting line while leaving the cutting line, and the coolant is jetted toward the cutting surface of the preliminary cutting line.
  • the thermal influence on the machining portion of the workpiece can be suppressed by the refrigerant when the workpiece is cut along the cutting line.
  • the coolant can be supplied to the processing site of the processing object without affecting the laser.
  • a laser processing method is a laser processing method for performing a through-processing on an object to be processed with a laser, and the through-holes are within a predetermined through-hole range.
  • a through hole having a diameter smaller than the diameter of the through hole is cut within the range of the through hole, and the through hole is cut by injecting the coolant into the preliminary through hole.
  • the coolant can be supplied to the processing site of the processing object without affecting the laser.
  • the coolant can be supplied to the processing portion of the processing object without affecting the laser.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG.
  • FIG. 3 is a view taken along the line aa in FIG.
  • FIG. 4 is another example of the aa arrow view in FIG.
  • FIG. 5 is a schematic diagram showing a schematic configuration of another example of the laser processing apparatus according to the embodiment of the present invention.
  • FIG. 6 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG.
  • FIG. 7 is a view taken along the line bb in FIG.
  • FIG. 8 is another example of the view taken along the line bb in FIG.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG.
  • FIG. 3 is a view taken along the line
  • FIG. 9 is an explanatory diagram of the steps of the laser processing method according to the embodiment of the present invention.
  • FIG. 10 is an explanatory diagram of the steps of the laser processing method according to the embodiment of the present invention.
  • FIG. 11 is an explanatory diagram of the steps of the laser processing method according to the embodiment of the present invention.
  • FIG. 12 is an explanatory diagram of a process of another example of the laser processing method according to the embodiment of the present invention.
  • FIG. 13 is an explanatory diagram of a process of another example of the laser processing method according to the embodiment of the present invention.
  • FIG. 14 is an explanatory diagram of a process of another example of the laser processing method according to the embodiment of the present invention.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a laser processing apparatus according to the present embodiment.
  • FIG. 2 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG.
  • FIG. 3 is a view taken along the line aa in FIG.
  • FIG. 4 is another example of the aa arrow view in FIG.
  • the laser processing apparatus 10 is an apparatus that performs various types of processing such as cutting and drilling on the workpiece 100.
  • the laser processing apparatus 10 of this embodiment performs the cutting process in drilling. Further, the laser processing apparatus 10 also measures the workpiece 100.
  • the laser processing apparatus 10 includes a frame 12, a moving unit 14, a stage unit 16, a laser processing unit 22 including a laser processing head 60, and a control unit 24.
  • the laser processing apparatus 10 irradiates the processing object 100 held by the stage unit 16 with a laser beam by the laser processing unit 22 to laser process the processing object 100.
  • the horizontal plane is the XY plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis
  • the direction orthogonal to the horizontal plane is the Z-axis direction.
  • the direction rotating around the Y axis is defined as the ⁇ Y direction.
  • the frame 12 is a housing of the laser processing apparatus 10 and is fixed to an installation surface such as the ground or a base.
  • the frame 12 has a gate 12a and a base 12b inserted into the space of the gate 12a.
  • the fixed part of the moving unit 14 is fixed to the frame 12. Therefore, in the laser processing apparatus 10 of the present embodiment, the moving unit 14 is fixed to the gate 12a and the base 12b of the frame 12, and the processing object 100 and the laser processing unit 22 are relatively moved by the moving unit 14. This is a so-called gate-type processing device.
  • the moving unit 14 moves the workpiece 100 and the laser processing head 60 relative to each other.
  • the moving unit 14 includes a Y-axis moving mechanism 30, an X-axis moving mechanism 34, a Z-axis moving mechanism 38, and a ⁇ Y rotating mechanism 39.
  • the Y-axis moving mechanism 30 includes a rail 30a that is disposed on the base 12b of the frame 12 and extends in the Y-axis direction, and a Y-axis moving member 30b that moves along the rail 30a. In the Y-axis moving mechanism 30, the stage unit 16 is fixed to the Y-axis moving member 30b.
  • the Y-axis moving mechanism 30 moves the stage unit 16 in the Y-axis direction by moving the Y-axis moving member 30b along the rail 30a.
  • the Y-axis moving mechanism 30 can use various mechanisms as a mechanism for moving the Y-axis moving member 30b in the Y-axis direction. For example, a mechanism in which a ball screw is inserted into the Y-axis moving member 30b and the ball screw is rotated by a motor, a linear motor mechanism, a belt mechanism, or the like can be used. Similarly, various mechanisms can be used for the X-axis moving mechanism 34 and the Z-axis moving mechanism 38.
  • the X-axis moving mechanism 34 includes a rail 33 that is disposed on the gate 12a of the frame 12 and extends in the X-axis direction, and an X-axis moving member 34a that moves along the rail 33.
  • a Z axis moving mechanism 38 is fixed to an X axis moving member 34a.
  • the X-axis moving mechanism 34 moves the Z-axis moving mechanism 38 in the X-axis direction by moving the X-axis moving member 34 a along the rail 33.
  • the Z-axis moving mechanism 38 includes a rail 38a that is fixed to the X-axis moving member 34a and extends in the Z-axis direction, and a Z-axis moving member 38b that moves along the rail 38a.
  • the ⁇ Y rotating mechanism 39 is fixed to the Z-axis moving member 38b.
  • the Z-axis moving mechanism 38 moves the ⁇ Y rotating mechanism 39 in the Z-axis direction by moving the ⁇ Y rotating mechanism 39 along the rail 38a.
  • the ⁇ Y rotation mechanism 39 is fixed to the Z-axis moving member 38b, and the laser processing head 60 is fixed.
  • the ⁇ Y rotation mechanism 39 rotates the laser processing head 60 in the ⁇ Y direction by rotating the laser processing head 60 in the ⁇ Y direction with respect to the Z-axis moving member 38b.
  • the moving unit 14 uses the Y-axis moving mechanism 30, the X-axis moving mechanism 34, and the Z-axis moving mechanism 38 to move the workpiece 100 and the laser processing head 60 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Move relative to each other. Further, the moving unit 14 rotates the laser processing head 60 with respect to the processing object 100 using the ⁇ Y rotation mechanism 39. Thereby, the direction of the laser irradiated to the workpiece 100 from the laser processing head 60 can be adjusted.
  • the moving unit 14 may include a mechanism for rotating the laser processing head 60 around the X axis. Further, a mechanism for adjusting the direction of laser irradiation may be provided in the laser processing head 60.
  • the stage unit 16 is disposed on the Y-axis moving member 30b of the Y-axis moving mechanism 30.
  • the stage unit 16 is a stage that supports the workpiece 100.
  • the member integrated with the Y-axis moving member 30b that is, the Y-axis moving member 30b is used as the stage of the stage unit 16, but another support member is provided on the Y-axis moving member 30b. It may be provided as a stage.
  • the stage unit 16 serves as a stage moving mechanism 42 that causes the Y-axis moving mechanism 30 to move the workpiece 100.
  • the stage unit 16 includes a fixing mechanism that fixes the workpiece 100 at a predetermined position of the Y-axis moving member 30b.
  • the stage unit 16 may further include an adjustment mechanism that adjusts the orientation of the workpiece 100 relative to the Y-axis moving member 30b, that is, the posture, as the stage moving mechanism 42.
  • an adjustment mechanism that adjusts the orientation of the workpiece 100 relative to the Y-axis moving member 30b, that is, the posture, as the stage moving mechanism 42.
  • a mechanism for rotating the workpiece 100 may be provided as the stage moving mechanism 42.
  • the laser processing unit 22 includes a laser processing head 60, a laser light source 62, an assist gas supply unit 64, and a refrigerant supply unit 66.
  • the laser light source 62 includes a fiber laser output device that outputs a laser using an optical fiber as a medium.
  • a fiber laser output device for example, a Fabry-Perot type fiber laser output device or a ring type fiber laser output device can be used, and the laser is oscillated when these output devices are excited.
  • the fiber of the fiber laser output device for example, silica glass to which a rare earth element such as erbium (Er), neodymium (Nd), ytterbium (Yb) is added can be used.
  • a laser that performs nanosecond order pulse oscillation such as a YAG laser or a YVO4 laser can be used as the fiber laser.
  • the laser light source 62 includes a short pulse laser output device that outputs a laser with a short pulse, for example, a frequency of 20 kHz.
  • a short pulse laser output device for example, a titanium sapphire laser can be used as a laser oscillation source, and a pulse having a pulse width of 100 picoseconds or less can be oscillated.
  • the short pulse laser outputs the laser with a short pulse having a pulse width of 100 nanoseconds or less.
  • the short pulse laser is preferably a short pulse having a pulse width of 10 nanoseconds or more, and more preferably a laser having a pulse width of less than 1 nanosecond.
  • Assist gas supply means 64 supplies assist gas to the laser processing head 60.
  • the assist gas supply means 64 includes an assist gas supply unit 64a and an assist gas supply pipe 64b.
  • the assist gas supply unit 64a pumps the assist gas from the assist gas storage tank in which the assist gas is stored to the assist gas supply pipe 64b by a compressor or the like.
  • the assist gas supply pipe 64b is connected to the laser processing head 60, and supplies the assist gas pumped by the assist gas supply unit 64a to the laser processing head 60.
  • an inert gas that is a dry gas such as air, nitrogen gas, oxygen gas, argon gas, xenon gas, helium gas, or a mixed gas thereof is used.
  • the refrigerant supply means 66 supplies the refrigerant to the laser processing head 60.
  • the refrigerant supply means 66 includes a refrigerant supply unit 66a and a refrigerant supply pipe 66b.
  • the refrigerant supply unit 66a pumps the refrigerant from the refrigerant storage tank in which the refrigerant is stored to the refrigerant supply pipe 66b by a compressor or the like.
  • the refrigerant supply pipe 66b is connected to the laser processing head 60, and supplies the refrigerant pumped by the refrigerant supply unit 66a to the laser processing head 60.
  • the refrigerant for example, dry ice particles of about -80 ° C., carbon dioxide gas, liquid nitrogen, or the like is applied.
  • the laser processing head 60 receives the laser output from the laser light source 62 and irradiates the processing target object 100 with the incident laser, thereby laser processing the processing target object 100.
  • the laser output from the laser light source 62 is guided to the laser processing head 60 by an optical member that guides laser light such as an optical fiber.
  • the laser processing head 60 includes a casing 72, a condensing optical system 74, and a nozzle 76, as shown in FIG.
  • the casing 72 receives a laser output from the laser light source 62 and houses a scanning mechanism (not shown) for guiding the laser to the condensing optical system 74 together with the condensing optical system 74.
  • the condensing optical system 74 has a plurality of lenses (one in the figure), condenses the laser L by the plurality of lenses, and sets the predetermined focal length and depth to the processing object 100.
  • a laser L having a spot diameter of 2 is irradiated.
  • the nozzle 76 is attached to the tip of the casing 72 where the condensing optical system 74 is disposed, and is formed in a cylindrical shape so as to allow the laser L condensed by the condensing optical system 74 to pass therethrough.
  • the nozzle 76 is formed in a hollow conical shape whose diameter gradually decreases as the laser L converges toward the front side in the traveling direction of the laser L.
  • the nozzle 76 has a laser irradiation nozzle 76A and a refrigerant injection nozzle 76B.
  • the laser irradiation nozzle 76A is for passing the laser L condensed by the condensing optical system 74 and irradiating the processing object 100 with the laser L. It is a through hole.
  • the laser irradiation nozzle 76A is connected to the assist gas supply pipe 64b of the assist gas supply means 64, and jets the assist gas A together with the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A.
  • the processing speed for the processing object 100 such as metal can be further improved.
  • the assist gas A is a nitrogen gas, an argon gas, or the like that suppresses the formation of an oxide film as a heat-affected layer that affects heat
  • the processing accuracy for the workpiece 100 such as metal can be further improved.
  • the gas type and mixing ratio of the assist gas A, the ejection amount (injection pressure) from the laser irradiation nozzle 76A, and the like can be changed according to the processing conditions such as the type of the processing object 100 and the processing mode.
  • the refrigerant injection nozzle 76B is independently arranged outside the laser irradiation nozzle 76A.
  • the coolant injection nozzle 76B is, for example, a hole formed in an annular shape coaxially with the optical axis La of the laser L so as to surround the laser irradiation nozzle 76A as shown in FIG. 3, or the laser L as shown in FIG.
  • the refrigerant injection nozzle 76B is connected to the refrigerant supply pipe 66b of the refrigerant supply means 66, and injects the refrigerant R outside the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A.
  • the coolant R is sprayed outside the laser L along the traveling direction of the laser L, so that the periphery of the processing portion of the processing object 100 by the laser L is cooled, and the heat of the processing object 100 by the laser L is cooled. The influence can be suppressed.
  • the ejection amount (injection pressure) of the refrigerant R from the refrigerant injection nozzle 76B can be changed according to the processing conditions such as the type of the processing object 100 and the processing mode.
  • the laser processing unit 22 may include a camera having a photographing means for photographing an image at a position where the laser is irradiated, for example, a CCD (Charge Coupled Device) image sensor. Thereby, the irradiation position of a laser, etc. can be adjusted based on the acquired image.
  • a camera having a photographing means for photographing an image at a position where the laser is irradiated for example, a CCD (Charge Coupled Device) image sensor.
  • CCD Charge Coupled Device
  • the laser processing unit 22 opens a through hole by irradiating the processing object 100 with the laser output from the laser light source 62 from the laser processing head 60. Moreover, the laser processing unit 22 can cut the processing object 100 with a line by moving the irradiation position of the laser L, and can also cut the processing object 100.
  • the control unit 24 controls operations of the moving unit 14, the stage unit 16, the laser processing unit 22, the assist gas supply unit 64a, and the refrigerant supply unit 66a.
  • the control unit 24 controls the operation of the stage moving mechanism 42 of the moving unit 14 and the stage unit 16 to move the workpiece 100 and the laser processing head 60 relative to each other. Further, the control unit 24 controls driving of the laser processing unit 22 and irradiates the processing object 100 with the laser L. Further, the control unit 24 controls driving of the assist gas supply unit 64a to control supply of the assist gas A, injection pressure of the assist gas A from the laser irradiation nozzle 76A, and the like. Further, the control unit 24 controls driving of the refrigerant supply unit 66a to control supply of the refrigerant R, injection pressure of the refrigerant R from the refrigerant injection nozzle 76B, and the like.
  • the laser processing apparatus 10 has a cylindrical laser irradiation nozzle 76A that passes the laser L irradiated from the condensing optical system 74 and a traveling direction of the laser L that passes the laser irradiation nozzle 76A.
  • An assist gas supply means 64 for injecting the assist gas A from the laser irradiation nozzle 76A along the ring, an annular refrigerant injection nozzle 76B arranged coaxially with the laser L outside the laser irradiation nozzle 76A, and a laser irradiation nozzle.
  • Refrigerant supply means 66 for injecting the refrigerant R from the refrigerant injection nozzle 76B along the traveling direction of the laser L passing through 76A.
  • the laser processing apparatus 10 of the present embodiment has a cylindrical laser irradiation nozzle 76A that allows the laser L irradiated from the condensing optical system 74 to pass through, and a traveling direction of the laser L that passes the laser irradiation nozzle 76A.
  • the laser processing apparatus 10 processes the workpiece 100 by irradiating the workpiece 100 with the laser L passing through the laser irradiation nozzle 76A.
  • the refrigerant R is injected from the refrigerant injection nozzle 76B outside the laser L along the traveling direction of the laser L, the part to be processed by the laser L of the workpiece 100 is cooled.
  • the assist gas A is jetted together with the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A, thereby preventing interference between the laser L and the refrigerant R, and moisture in the atmosphere is frozen by the refrigerant R. Even if it is solidified, it is prevented from being vaporized by the heat of the laser L and generating white smoke. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
  • the laser irradiation nozzle 76A is formed with a through hole having an inner diameter having a gap with the laser L so that the passing laser L does not come in contact, and the assist gas supply means 64 has the gap It is preferable to supply the assist gas A to the through hole so as to satisfy the above condition. Thereby, since the assist gas A is injected so as to surround the laser L, the effect of preventing the interference between the laser L and the refrigerant R can be obtained remarkably.
  • the relationship between the injection pressure P1 of the assist gas A injected from the laser irradiation nozzle 76A and the injection pressure P2 of the refrigerant R injected from the refrigerant injection nozzle 76B is P2 ⁇ P1. It is preferable to set.
  • the setting of the injection pressure P1 of the assist gas A and the injection pressure P2 of the refrigerant R is performed by controlling the driving of the assist gas supply unit 64a and the refrigerant supply unit 66a by the control unit 24.
  • the distance W from the focal point F of the laser L on the innermost side of the injection range of the coolant R is 0 on the processing surface 100 a of the processing object 100. It is preferable to be in the range of 1 mm or more and 50 mm or less. When the thickness is 0.1 mm or more, the effect of preventing interference between the laser L and the refrigerant R can be obtained favorably, and when the thickness is 50 mm or less, the effect of cooling the processing site can be favorably obtained. In order to set such a distance W, an angle along the laser L in the refrigerant injection nozzle 76B is set.
  • the irradiation position of the laser L is moved along the processing surface 100a of the processing object 100 (processing process). May not be performed on the front side in the moving direction of the laser L but only on the rear side (refrigerant injection step). That is, even if the refrigerant R is injected to the front side in the moving direction of the laser L, there is no thermal influence of the laser L (before the thermal influence occurs), and this is not effective. Only the rear side in the moving direction of the laser L is assumed.
  • the refrigerant injection nozzle 76B has a plurality of holes arranged in an annular shape so as to surround the laser irradiation nozzle 76A, and has an on-off valve that selectively supplies the refrigerant R to each hole. This can be realized by providing the switching mechanism.
  • another coolant injection nozzle may be provided so that the coolant R can be further injected from the surface opposite to the processing surface 100a of the processing object 100 irradiated with the laser L.
  • the refrigerant is supplied to the other refrigerant injection nozzle by the refrigerant supply means 66 described above. By doing in this way, the cooling efficiency of the process site
  • FIG. 5 is a schematic diagram showing a schematic configuration of another example of the laser processing apparatus according to the embodiment of the present invention.
  • FIG. 6 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG.
  • FIG. 7 is a view taken along the line bb in FIG.
  • FIG. 8 is another example of the view taken along the line bb in FIG.
  • the laser processing apparatus 110 of another example is different from the laser processing apparatus 10 described with reference to FIGS. 1 and 2 with a shield gas supply means 68 and a shield gas injection nozzle 76C. And the other configurations are the same. Therefore, in the description of the laser processing apparatus 110 of another example, the same parts as those of the laser processing apparatus 10 described above are denoted by the same reference numerals and description thereof is omitted.
  • the shield gas supply means 68 supplies shield gas to the laser processing head 60.
  • the shield gas supply means 68 includes a shield gas supply unit 68a and a shield gas supply pipe 68b. Although not clearly shown in the drawing, the shield gas supply unit 68a pumps the shield gas to the shield gas supply pipe 68b by a compressor or the like from a shield gas storage tank in which the shield gas is stored.
  • the shield gas supply pipe 68b is connected to the laser processing head 60, and supplies the shield gas pumped by the shield gas supply unit 68a to the laser processing head 60.
  • an inert gas that is a dry gas such as air, nitrogen gas, oxygen gas, argon gas, xenon gas, helium gas, or a mixed gas thereof is used.
  • the shield gas injection nozzle 76 ⁇ / b> C is provided in the nozzle 76.
  • the shield gas injection nozzle 76C is independently arranged outside the laser irradiation nozzle 76A and outside the refrigerant injection nozzle 76B. That is, the shield gas injection nozzle 76C is disposed on the outermost side with respect to the laser irradiation nozzle 76A and the refrigerant injection nozzle 76B.
  • the shield gas injection nozzle 76C is, for example, a hole formed in an annular shape coaxially with the optical axis La of the laser L so as to surround the refrigerant injection nozzle 76B as shown in FIG. 7, or a laser as shown in FIG.
  • the laser irradiation nozzle 76A is shown as having the same configuration as that shown in FIG. 3, but it may be the same as that shown in FIG.
  • This shield gas injection nozzle 76C is connected to the shield gas supply pipe 68b of the shield gas supply means 68, and shield gas is provided outside the laser L and inside the refrigerant R along the traveling direction of the laser L passing through the laser irradiation nozzle 76A. S is injected.
  • the control unit 24 controls operations of the moving unit 14, the stage unit 16, the laser processing unit 22, the assist gas supply unit 64a, the refrigerant supply unit 66a, and the shield gas supply unit 68a.
  • the control unit 24 controls the operation of the stage moving mechanism 42 of the moving unit 14 and the stage unit 16 to move the workpiece 100 and the laser processing head 60 relative to each other. Further, the control unit 24 controls driving of the laser processing unit 22 and irradiates the processing object 100 with the laser L. Further, the control unit 24 controls driving of the assist gas supply unit 64a to control supply of the assist gas A, injection pressure of the assist gas A from the laser irradiation nozzle 76A, and the like.
  • control unit 24 controls driving of the refrigerant supply unit 66a to control supply of the refrigerant R, injection pressure of the refrigerant R from the refrigerant injection nozzle 76B, and the like. Further, the control unit 24 controls driving of the shield gas supply unit 68a to control supply of the shield gas S, injection pressure of the shield gas S from the shield gas injection nozzle 76C, and the like.
  • the laser processing apparatus 110 has a cylindrical laser irradiation nozzle 76A that passes the laser L irradiated from the condensing optical system 74 and a traveling direction of the laser L that passes the laser irradiation nozzle 76A.
  • the refrigerant supply means 66 for injecting the refrigerant R from the refrigerant injection nozzle 76B along the direction and the outside of the laser irradiation nozzle 76A and the outside of the refrigerant injection nozzle 76B are independently arranged coaxially with the laser L.
  • An annular shield gas injection nozzle 76C and a laser L passing through the laser irradiation nozzle 76A are aligned along the traveling direction of the laser L.
  • the laser processing apparatus 110 has a cylindrical laser irradiation nozzle 76A that allows the laser L irradiated from the condensing optical system 74 to pass therethrough and a traveling direction of the laser L that passes the laser irradiation nozzle 76A.
  • the assist gas supply means 64 for injecting the assist gas A from the laser irradiation nozzle 76A, the refrigerant injection nozzle 76B arranged independently outside the laser irradiation nozzle 76A, and the laser irradiation nozzle 76A.
  • a shield gas injection nozzle 76C composed of a hole and a laser L that passes through the laser irradiation nozzle 76A are aligned along the traveling direction of the laser L.
  • the laser processing apparatus 110 processes the processing object 100 by irradiating the processing object 100 with the laser L passing through the laser irradiation nozzle 76A.
  • the refrigerant R is injected from the refrigerant injection nozzle 76B outside the laser L along the traveling direction of the laser L, the part to be processed by the laser L of the workpiece 100 is cooled.
  • the shielding gas S is injected outside the refrigerant R, interference between the refrigerant R and the atmosphere is prevented, and a situation in which moisture in the atmosphere freezes and solidifies due to the refrigerant R is prevented.
  • the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
  • the assist gas A is jetted together with the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A, interference between the laser L and the refrigerant R is further prevented. Even if it freezes and solidifies, it is prevented from being vaporized by the heat of the laser L and generating white smoke. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
  • the laser irradiation nozzle 76A is formed with a through hole having an inner diameter having a gap with the laser L so that the passing laser L does not come in contact, and the assist gas supply means 64 has the gap It is preferable to supply the assist gas A to the through hole so as to satisfy the above condition. Thereby, since the assist gas A is injected so as to surround the laser L, the effect of preventing the interference between the laser L and the refrigerant R can be obtained remarkably.
  • the relationship between the injection pressure P2 of the refrigerant R injected from the refrigerant injection nozzle 76B and the injection pressure P3 of the shield gas S injected from the shield gas injection nozzle 76C is expressed as P2> P3. It is preferable to set to.
  • the setting of the injection pressure P3 of the shield gas S and the injection pressure P2 of the refrigerant R is performed by controlling the drive of the shield gas supply unit 68a and the refrigerant supply unit 66a by the control unit 24.
  • the relationship is preferably set to P1 ⁇ P2> P3, and the refrigerant R is also prevented from being mixed into the assist gas A, so that the effect of preventing the interference between the laser L and the refrigerant R can be obtained remarkably.
  • the distance W from the focal point F of the laser L on the innermost side of the injection range of the coolant R is 0 on the processing surface 100a of the processing object 100. It is preferable to be in the range of 1 mm or more and 50 mm or less. When the thickness is 0.1 mm or more, the effect of preventing interference between the laser L and the refrigerant R can be obtained favorably, and when the thickness is 50 mm or less, the effect of cooling the processing site can be favorably obtained. In order to set such a distance W, an angle along the laser L in the refrigerant injection nozzle 76B is set.
  • the irradiation position of the laser L is moved along the processing surface 100a of the processing object 100 (processing process). May not be performed on the front side in the moving direction of the laser L but only on the rear side (refrigerant injection step). That is, even if the refrigerant R is injected to the front side in the moving direction of the laser L, there is no thermal influence of the laser L (before the thermal influence occurs), and this is not effective. Only the rear side in the moving direction of the laser L is assumed.
  • the refrigerant injection nozzle 76B has a plurality of holes arranged in an annular shape so as to surround the laser irradiation nozzle 76A, and has an on-off valve that selectively supplies the refrigerant R to each hole. This can be realized by providing the switching mechanism.
  • another coolant injection nozzle may be provided so that the coolant R can be further injected from the surface opposite to the processing surface 100a of the processing object 100 irradiated with the laser L.
  • the refrigerant is supplied to the other refrigerant injection nozzle by the refrigerant supply means 66 described above. By doing in this way, the cooling efficiency of the process site
  • FIGS. 9 to 11 are explanatory diagrams of steps of the laser processing method according to the present embodiment.
  • the laser processing method of the present embodiment is a processing method in the case where the processing object 100 is cut by a predetermined cutting line CL1 with a laser L as shown in FIGS.
  • the workpiece 100 is cut by irradiating the laser L onto the preliminary cutting line CL2 along the cutting line CL1 while leaving the cutting line CL1.
  • processing is performed by irradiating laser L onto the cutting line CL1 while injecting the coolant R toward the cut surface of the preliminary cutting line CL2 in the preliminary processing step.
  • the object 100 is cut.
  • the laser L is irradiated toward the thickness D direction of the workpiece 100, and the depth direction in the figure is the traveling direction.
  • an injection nozzle is provided so that the injection position can be moved in the thickness D direction as the laser L moves the focal point of the workpiece 100 in the thickness D direction. It is preferable that an injection nozzle is provided so that the injection position can be moved in the traveling direction as L progresses.
  • the injection direction of the refrigerant R may be a direction orthogonal to the cut surface of the preliminary cutting line CL2, or may be a direction inclined to the cutting surface of the preliminary cutting line CL2.
  • the processing object 100 is cut by irradiating the laser L onto the preliminary cutting line CL2 along the cutting line CL1 while leaving the cutting line CL1, and the cutting surface of the preliminary cutting line CL2 is cut.
  • the coolant R applies the processing object 100 to the processing site. Thermal effects can be suppressed.
  • the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
  • the laser L when the thickness D of the workpiece 100 is large, the laser L must be irradiated for a long time before penetrating the thickness D of the workpiece 100, but the thermal effect on the workpiece is significant.
  • the preliminary cutting line CL2 is set and cut within a range in which no thermal influence is generated on the processing portion of the cutting line CL1, and then the refrigerant R is injected from the cut surface side of the preliminary cutting line CL2.
  • the cutting since the cutting is performed on the cutting line CL1, it is effective to suppress the thermal influence on the processing site when cutting the cutting line CL1.
  • the distance H of the preliminary cutting line CL2 from the cutting line CL1 is set.
  • FIGS. 12 to FIG. 14 are explanatory diagrams of processes of another example of the laser processing method according to the present embodiment.
  • the laser processing method of the present embodiment is a processing method in the case where a predetermined through hole TH1 is cut in the workpiece 100 by the laser L, as shown in FIGS.
  • a preliminary through hole TH2 having a diameter smaller than the diameter of the through hole TH1 is cut within the range of the through hole TH1.
  • the preliminary through hole TH2 may be plural or single.
  • the through hole TH1 is cut by the laser L while jetting the coolant R into the preliminary through hole TH2 in the preliminary machining step.
  • the laser L is irradiated toward the thickness D direction of the workpiece 100, and the circumferential direction of the through hole TH1 is the traveling direction.
  • the injection of the refrigerant R is performed along the traveling direction of the laser L. Further, the refrigerant R may be injected from the direction opposite to the irradiation direction of the laser L, that is, from the opening on the opposite side of the preliminary through hole TH2.
  • the preliminary through-hole TH2 having a diameter smaller than the diameter of the through-hole TH1 is cut in the range of the through-hole TH1, and the coolant R is injected into the preliminary through-hole TH2 while the through-hole TH1 is formed.
  • the refrigerant R can suppress the thermal influence on the processing part of the processing object 100.
  • the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
  • the position of the preliminary through hole TH2 is set and cut within a range in which no thermal influence is generated on the processed portion of the through hole TH1, and then the refrigerant R is injected into the preliminary through hole TH2.
  • the through-hole TH1 is cut, it is effective to suppress the thermal influence on the machining site when the through-hole TH1 is cut.
  • the intensity of the laser L and the object to be machined Considering the material of 100, the distance of the preliminary through hole TH2 from the cutting line along the peripheral surface of the through hole TH1 is set.
  • the workpiece 100 is a carbon fiber reinforced plastic (CFRP: Carbon Fiber Reinforced Plastic), or a metal material such as carbon fiber reinforced plastic and titanium, which is easily affected by laser L processing. It is preferable to apply a superposition of and.
  • CFRP Carbon Fiber Reinforced Plastic
  • the coolant R can be supplied to the workpiece of the workpiece without affecting the laser L when the coolant R cools the workpiece. .

Abstract

According to the present invention, a refrigerant is supplied to a machining portion of an object to be machined without affecting a laser beam. The present invention has: a cylindrical laser beam irradiation nozzle (76A) through which a laser beam (L) emitted from a condensing optical system (74) is passed; an assist gas supply means (64) for injecting an assist gas (A) from the laser beam irradiation nozzle (76A) in the advancing direction of the laser beam (L) passed through the laser beam irradiation nozzle (76A); an annular refrigerant injection nozzle (76B) that is arranged independently of and coaxially to the laser beam (L) outside the laser beam irradiation nozzle (76A); and a refrigerant supply means (66) for injecting a refrigerant (R) from the refrigerant injection nozzle (76B) in the advancing direction of the laser beam (L) passed through the laser beam irradiation nozzle (76A).

Description

レーザ加工装置およびレーザ加工方法Laser processing apparatus and laser processing method
　本発明は、レーザ加工装置およびレーザ加工方法に関する。 The present invention relates to a laser processing apparatus and a laser processing method.
　従来、例えば、特許文献１には、レーザ発振器によりレーザ光を発振させ、レーザ発振器より出力されたレーザ光線を加工対象物となる金属パイプの円筒面に照射し、金属パイプの円筒面を貫通切断する金属パイプのレーザ加工方法として、金属パイプの中空部にドライアイス粒子を含んだ気体を噴射しながら金属パイプの円筒面をレーザ加工することが記載されている。 Conventionally, for example, in Patent Document 1, laser light is oscillated by a laser oscillator, a laser beam output from the laser oscillator is irradiated onto a cylindrical surface of a metal pipe to be processed, and the cylindrical surface of the metal pipe is cut through. As a laser processing method for a metal pipe, laser processing of a cylindrical surface of the metal pipe is described while injecting a gas containing dry ice particles into a hollow portion of the metal pipe.
特開２００６－３２６６１５号公報JP 2006-326615 A
　ところで、炭素繊維と樹脂とが複合された複合材料である炭素繊維強化プラスチック（ＣＦＲＰ：Carbon　Fiber　Reinforced　Plastic）は、軽量かつ高強度であることから、例えば、航空機の構造材や自動車の部材として使用されている。この炭素繊維強化プラスチックの加工手法としては、機械加工や研磨剤を混入させたウォータージェット加工（アブレッシブウォータージェット（ＡＷＪ：Abrasive　Water　Jet）加工）が使用されているが、以下の課題を有する。 By the way, carbon fiber reinforced plastic (CFRP: Carbon Fiber Reinforced Plastic), which is a composite material composed of carbon fiber and resin, is lightweight and high in strength. Has been. As a processing technique of this carbon fiber reinforced plastic, water jet processing (Abrasive Water Jet (AWJ) processing) mixed with mechanical processing or an abrasive is used, but has the following problems.
　例えば、航空機の翼のような板厚が不均一な端部をアブレッシブウォータージェットによりトリム加工する場合、ガーネットなどの研磨剤を含む大量の廃液処理や、研磨剤によるノズル摩耗による工具の消耗が課題であり、研磨剤含有廃液の出ない加工技術の確立が要望されている。また、例えば、航空機のエンジンナセルは、高精度の穴あけ加工が必要であり一気通貫の機械加工が望まれるが、炭素繊維強化プラスチックとチタンなどの金属材とを重ね合わせた材料が用いられる場合、異材・厚板の同時加工のため、加工性の悪い炭素繊維強化プラスチックに加工条件を合わせなければならず、加工時間が非常に長く、工程短縮が要望されている。 For example, when trimming an edge with uneven thickness, such as an aircraft wing, with an abrasive water jet, a large amount of waste liquid containing abrasives such as garnet, and tool wear due to abrasive nozzle wear Therefore, there is a demand for the establishment of a processing technique that does not generate an abrasive-containing waste liquid. In addition, for example, aircraft nacelles for aircraft require high-precision drilling, and it is desirable to perform machining at once. However, when a material in which carbon fiber reinforced plastic and a metal material such as titanium are overlapped is used. For simultaneous processing of different materials and thick plates, processing conditions must be matched with carbon fiber reinforced plastic having poor processability, and the processing time is very long, and there is a demand for process shortening.
　このような課題に対し、レーザ加工は非接触加工であることから、研磨剤含有廃液などの産業廃棄物が発生せず、工具の消耗を抑制することが期待され、また、高密度エネルギーであるため加工時間の短縮に有効と考えられる。 For such problems, since laser processing is non-contact processing, industrial waste such as abrasive-containing waste liquid is not generated, and it is expected to suppress consumption of the tool, and it is high-density energy. Therefore, it is considered effective for shortening the machining time.
　しかし、炭素繊維と樹脂とが複合された複合材料である炭素繊維強化プラスチックを加工対象物とし、レーザ加工を用いて切断や穴あけの熱加工を実施すると、熱影響により材質劣化や変質が生じ、所望とする加工仕様を満足することができない。 However, when carbon fiber reinforced plastic, which is a composite material in which carbon fiber and resin are composited, is used as an object to be processed and thermal processing such as cutting and drilling is performed using laser processing, material deterioration or alteration occurs due to thermal effects. The desired processing specifications cannot be satisfied.
　そこで、上述した特許文献１の記載のように、例えば、ドライアイス粒子を含んだ気体（以下、冷媒という）を加工対象物の加工部位に吹き付けることが考えられる。ところが、レーザ加工において、加工部位に冷媒を吹き付けた場合、冷媒により大気中の水分が凍って固体化し、これがレーザの熱で蒸発して白煙を生じる。そして、この白煙がレーザ光を遮ることで、十分な強度のレーザ光を加工対象物の加工部分に照射することができない問題がある。 Therefore, as described in Patent Document 1 described above, for example, it is conceivable to blow a gas containing dry ice particles (hereinafter referred to as a refrigerant) onto a processing portion of the processing object. However, in laser processing, when a coolant is sprayed on the processing site, moisture in the atmosphere is frozen and solidified by the coolant, and this is evaporated by the heat of the laser to generate white smoke. And since this white smoke blocks a laser beam, there exists a problem which cannot irradiate the process part of a process target object with the laser beam of sufficient intensity | strength.
　本発明は上述した課題を解決するものであり、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することのできるレーザ加工装置およびレーザ加工方法を提供することを目的とする。 The present invention solves the above-described problems, and an object thereof is to provide a laser processing apparatus and a laser processing method capable of supplying a coolant to a processing portion of a processing object without affecting the laser.
　上述の目的を達成するために、本発明の一態様に係るレーザ加工装置は、集光光学系から照射されるレーザを通過させる筒状のレーザ照射ノズルと、前記レーザ照射ノズルを通過するレーザの進行方向に沿って前記レーザ照射ノズルからアシストガスを噴射させるアシストガス供給手段と、前記レーザ照射ノズルの外側に前記レーザと同軸に独立して配置された円環状の冷媒噴射ノズルと、前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記冷媒噴射ノズルから冷媒を噴射させる冷媒供給手段と、を有する。 In order to achieve the above-described object, a laser processing apparatus according to an aspect of the present invention includes a cylindrical laser irradiation nozzle that passes a laser irradiated from a condensing optical system, and a laser that passes through the laser irradiation nozzle. Assist gas supply means for injecting an assist gas from the laser irradiation nozzle along the traveling direction, an annular refrigerant injection nozzle arranged coaxially with the laser outside the laser irradiation nozzle, and the laser irradiation Refrigerant supply means for injecting refrigerant from the refrigerant injection nozzle along the traveling direction of the laser passing through the nozzle.
　このレーザ加工装置によれば、レーザ照射ノズルを通過するレーザが加工対象物に照射されて当該加工対象物を加工する際、冷媒が冷媒噴射ノズルからレーザの外側でレーザの進行方向に沿って噴射されるため加工対象物のレーザによる加工部位を冷却する。さらに、アシストガスがレーザ照射ノズルを通過するレーザの進行方向に沿ってレーザと共に噴射されることで、レーザと冷媒との干渉を妨げ、冷媒により大気中の水分が凍って固体化しても、これがレーザの熱で蒸発し白煙が発生する事態を防ぐ。この結果、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to this laser processing apparatus, when the laser beam passing through the laser irradiation nozzle is irradiated onto the processing object and the processing object is processed, the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, the assist gas is injected along with the laser along the laser traveling direction passing through the laser irradiation nozzle, thereby preventing interference between the laser and the refrigerant. Prevents white smoke from being evaporated by the heat of the laser. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
　また、本発明の一態様に係るレーザ加工装置は、集光光学系から照射されるレーザを通過させる筒状のレーザ照射ノズルと、前記レーザ照射ノズルを通過するレーザの進行方向に沿って前記レーザ照射ノズルからアシストガスを噴射させるアシストガス供給手段と、前記レーザ照射ノズルの外側に前記レーザと同軸の円周上に配置した複数の穴からなる冷媒噴射ノズルと、前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記冷媒噴射ノズルから冷媒を噴射させる冷媒供給手段と、を有する。 The laser processing apparatus according to an aspect of the present invention includes a cylindrical laser irradiation nozzle that allows a laser irradiated from a condensing optical system to pass through, and the laser along a traveling direction of the laser that passes through the laser irradiation nozzle. An assist gas supply means for injecting an assist gas from the irradiation nozzle; a refrigerant injection nozzle comprising a plurality of holes arranged on the circumference coaxial with the laser; and the laser irradiation nozzle passing through the laser irradiation nozzle. Refrigerant supply means for injecting the refrigerant from the refrigerant injection nozzle along the laser traveling direction.
　このレーザ加工装置によれば、レーザ照射ノズルを通過するレーザが加工対象物に照射されて当該加工対象物を加工する際、冷媒が冷媒噴射ノズルからレーザの外側でレーザの進行方向に沿って噴射されるため加工対象物のレーザによる加工部位を冷却する。さらに、アシストガスがレーザ照射ノズルを通過するレーザの進行方向に沿ってレーザと共に噴射されることで、レーザと冷媒との干渉を妨げ、冷媒により大気中の水分が凍って固体化しても、これがレーザの熱で蒸発し白煙が発生する事態を防ぐ。この結果、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to this laser processing apparatus, when the laser beam passing through the laser irradiation nozzle is irradiated onto the processing object and the processing object is processed, the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, the assist gas is injected along with the laser along the laser traveling direction passing through the laser irradiation nozzle, thereby preventing interference between the laser and the refrigerant. Prevents white smoke from being evaporated by the heat of the laser. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
　また、本発明の一態様に係るレーザ加工装置では、前記レーザ照射ノズルから噴射させる前記アシストガスの噴射圧力Ｐ１と、前記冷媒噴射ノズルから噴射させる前記冷媒の噴射圧力Ｐ２との関係を、Ｐ２＜Ｐ１に設定することが好ましい。 In the laser processing apparatus according to an aspect of the present invention, the relationship between the injection pressure P1 of the assist gas injected from the laser irradiation nozzle and the injection pressure P2 of the refrigerant injected from the refrigerant injection nozzle is expressed as P2 < It is preferable to set to P1.
　このレーザ加工装置によれば、アシストガスが冷媒よりも圧力が高く、冷媒がアシストガス側に混入することを防ぐため、レーザと冷媒との干渉を防ぐ作用効果を顕著に得ることができる。 According to this laser processing apparatus, the assist gas has a higher pressure than the refrigerant and prevents the refrigerant from being mixed into the assist gas, so that the effect of preventing the interference between the laser and the refrigerant can be remarkably obtained.
　また、本発明の一態様に係るレーザ加工装置では、前記レーザ照射ノズルの外側であって、且つ、前記冷媒噴射ノズルの外側に前記レーザと同軸に独立して配置された円環状のシールドガス噴射ノズルと、前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記シールドガス噴射ノズルからシールドガスを噴射させるシールドガス供給手段と、を有することが好ましい。 Further, in the laser processing apparatus according to one aspect of the present invention, an annular shield gas injection is arranged outside the laser irradiation nozzle and outside the refrigerant injection nozzle independently of the laser. It is preferable to include a nozzle and a shield gas supply unit that injects a shield gas from the shield gas injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle.
　このレーザ加工装置によれば、レーザ照射ノズルを通過するレーザが加工対象物に照射されて当該加工対象物を加工する際、冷媒が冷媒噴射ノズルからレーザの外側でレーザの進行方向に沿って噴射されるため加工対象物のレーザによる加工部位を冷却する。さらに、シールドガスが冷媒よりも外側で噴射されることで、冷媒と大気の干渉を妨げ、冷媒により大気中の水分が凍って固体化する事態を防ぐ。この結果、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to this laser processing apparatus, when the laser beam passing through the laser irradiation nozzle is irradiated onto the processing object and the processing object is processed, the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, since the shielding gas is injected outside the refrigerant, interference between the refrigerant and the atmosphere is prevented, and a situation in which moisture in the atmosphere is frozen and solidified by the refrigerant is prevented. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
　また、本発明の一態様に係るレーザ加工装置では、前記レーザ照射ノズルの外側であって、且つ、前記冷媒噴射ノズルの外側に前記レーザと同軸の円周上に配置した複数の穴からなるシールドガス噴射ノズルと、前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記シールドガス噴射ノズルからシールドガスを噴射させるシールドガス供給手段と、を有することが好ましい。 In the laser processing apparatus according to an aspect of the present invention, the shield includes a plurality of holes disposed on the circumference coaxial with the laser outside the laser irradiation nozzle and outside the coolant jet nozzle. It is preferable to include a gas injection nozzle and a shield gas supply unit that injects a shield gas from the shield gas injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle.
　このレーザ加工装置によれば、レーザ照射ノズルを通過するレーザが加工対象物に照射されて当該加工対象物を加工する際、冷媒が冷媒噴射ノズルからレーザの外側でレーザの進行方向に沿って噴射されるため加工対象物のレーザによる加工部位を冷却する。さらに、シールドガスが冷媒よりも外側で噴射されることで、冷媒と大気の干渉を妨げ、冷媒により大気中の水分が凍って固体化する事態を防ぐ。この結果、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to this laser processing apparatus, when the laser beam passing through the laser irradiation nozzle is irradiated onto the processing object and the processing object is processed, the coolant is ejected from the coolant ejection nozzle along the traveling direction of the laser outside the laser. Therefore, the processing part by the laser of the processing object is cooled. Furthermore, since the shielding gas is injected outside the refrigerant, interference between the refrigerant and the atmosphere is prevented, and a situation in which moisture in the atmosphere is frozen and solidified by the refrigerant is prevented. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
　また、本発明の一態様に係るレーザ加工装置では、前記冷媒噴射ノズルから噴射させる前記冷媒の噴射圧力Ｐ２と、前記シールドガス噴射ノズルから噴射させる前記シールドガスの噴射圧力Ｐ３との関係を、Ｐ２＞Ｐ３に設定することが好ましい。 In the laser processing apparatus according to one aspect of the present invention, the relationship between the injection pressure P2 of the refrigerant injected from the refrigerant injection nozzle and the injection pressure P3 of the shield gas injected from the shield gas injection nozzle is expressed as P2. It is preferable to set> P3.
　このレーザ加工装置によれば、シールドガスが冷媒よりも圧力が低く、シールドガスが冷媒側に混入することを防ぐため、レーザと冷媒との干渉を防ぐ作用効果を顕著に得ることができる。 According to this laser processing apparatus, since the shield gas has a lower pressure than the refrigerant and prevents the shield gas from being mixed into the refrigerant side, the effect of preventing the interference between the laser and the refrigerant can be obtained remarkably.
　本発明の一態様に係るレーザ加工方法は、加工対象物にレーザを照射しつつ前記レーザを所定方向に移動する加工工程と、前記加工工程の際に前記レーザの移動方向の後側において前記加工対象物に向けて冷媒を噴射する冷媒噴射工程と、を含む。 A laser processing method according to an aspect of the present invention includes a processing step of moving the laser in a predetermined direction while irradiating the processing target with a laser, and the processing on the rear side in the movement direction of the laser during the processing step. A refrigerant injection step of injecting the refrigerant toward the object.
　このレーザ加工方法によれば、レーザの移動方向の前側においてレーザの熱影響がない加工部位を冷却することがなく、レーザによる熱影響が生じる部分に対して効果的に冷却を行うことができる。 According to this laser processing method, it is possible to effectively cool a portion where the thermal influence of the laser is generated without cooling the processing portion which is not affected by the laser on the front side in the moving direction of the laser.
　上述の目的を達成するために、本発明の一態様に係るレーザ加工方法は、加工対象物をレーザにて切断加工するレーザ加工方法であって、所定の切断線を残しつつ前記切断線に沿って前記加工対象物を切断する予備加工工程と、前記予備加工工程による切断面に冷媒を噴射しつつ前記切断線上で前記加工対象物を切断する本加工工程と、を含む。 In order to achieve the above-described object, a laser processing method according to an aspect of the present invention is a laser processing method for cutting an object to be processed with a laser, along the cutting line while leaving a predetermined cutting line. A preliminary processing step of cutting the processing object, and a main processing step of cutting the processing object on the cutting line while injecting a coolant onto the cut surface of the preliminary processing step.
　このレーザ加工方法によれば、切断線を残しつつ当該切断線に沿う予備切断線上にレーザを照射して加工対象物を切断し、予備切断線の切断面に向けて冷媒を噴射しつつ切断線上にレーザを照射して加工対象物を切断することで、切断線で切断する際に、冷媒により加工対象物の加工部位への熱影響を抑制することができる。この結果、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to this laser processing method, the workpiece is cut by irradiating a laser on the preliminary cutting line along the cutting line while leaving the cutting line, and the coolant is jetted toward the cutting surface of the preliminary cutting line. When the workpiece is cut by irradiating the laser beam to the workpiece, the thermal influence on the machining portion of the workpiece can be suppressed by the refrigerant when the workpiece is cut along the cutting line. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
　上述の目的を達成するために、本発明の一態様に係るレーザ加工方法は、加工対象物をレーザにて貫通加工するレーザ加工方法であって、所定の貫通孔の範囲内に前記貫通孔の径よりも小径の予備貫通孔を切削する予備加工工程と、前記予備加工工程による前記予備貫通孔内に冷媒を噴射しつつ所定の前記貫通孔を切削する本加工工程と、を含む。 In order to achieve the above-described object, a laser processing method according to an aspect of the present invention is a laser processing method for performing a through-processing on an object to be processed with a laser, and the through-holes are within a predetermined through-hole range. A preliminary processing step of cutting a preliminary through hole having a diameter smaller than the diameter, and a main processing step of cutting the predetermined through hole while injecting a coolant into the preliminary through hole by the preliminary processing step.
　このレーザ加工方法によれば、貫通孔の範囲内に貫通孔の径よりも小径の予備貫通孔を切削し、予備貫通孔内に冷媒を噴射しつつ貫通孔を切削することで、貫通孔を切削する際に、冷媒により加工対象物の加工部位への熱影響を抑制することができる。この結果、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to this laser processing method, a through hole having a diameter smaller than the diameter of the through hole is cut within the range of the through hole, and the through hole is cut by injecting the coolant into the preliminary through hole. When cutting, it is possible to suppress the thermal influence on the processing part of the processing object by the refrigerant. As a result, the coolant can be supplied to the processing site of the processing object without affecting the laser.
　本発明によれば、レーザに影響を及ぼすことなく冷媒を加工対象物の加工部位に供給することができる。 According to the present invention, the coolant can be supplied to the processing portion of the processing object without affecting the laser.
図１は、本発明の実施形態に係るレーザ加工装置の概略構成を示す模式図である。FIG. 1 is a schematic diagram showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. 図２は、図１に示すレーザ加工ヘッドの概略構成を示す模式図である。FIG. 2 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG. 図３は、図２におけるａ－ａ矢視図である。FIG. 3 is a view taken along the line aa in FIG. 図４は、図２におけるａ－ａ矢視図の他の例である。FIG. 4 is another example of the aa arrow view in FIG. 図５は、本発明の実施形態に係るレーザ加工装置の他の例の概略構成を示す模式図である。FIG. 5 is a schematic diagram showing a schematic configuration of another example of the laser processing apparatus according to the embodiment of the present invention. 図６は、図５に示すレーザ加工ヘッドの概略構成を示す模式図である。FIG. 6 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG. 図７は、図６におけるｂ－ｂ矢視図である。FIG. 7 is a view taken along the line bb in FIG. 図８は、図６におけるｂ－ｂ矢視図の他の例である。FIG. 8 is another example of the view taken along the line bb in FIG. 図９は、本発明の実施形態に係るレーザ加工方法の工程の説明図である。FIG. 9 is an explanatory diagram of the steps of the laser processing method according to the embodiment of the present invention. 図１０は、本発明の実施形態に係るレーザ加工方法の工程の説明図である。FIG. 10 is an explanatory diagram of the steps of the laser processing method according to the embodiment of the present invention. 図１１は、本発明の実施形態に係るレーザ加工方法の工程の説明図である。FIG. 11 is an explanatory diagram of the steps of the laser processing method according to the embodiment of the present invention. 図１２は、本発明の実施形態に係るレーザ加工方法の他の例の工程の説明図である。FIG. 12 is an explanatory diagram of a process of another example of the laser processing method according to the embodiment of the present invention. 図１３は、本発明の実施形態に係るレーザ加工方法の他の例の工程の説明図である。FIG. 13 is an explanatory diagram of a process of another example of the laser processing method according to the embodiment of the present invention. 図１４は、本発明の実施形態に係るレーザ加工方法の他の例の工程の説明図である。FIG. 14 is an explanatory diagram of a process of another example of the laser processing method according to the embodiment of the present invention.
　以下に、本発明に係る実施形態を図面に基づいて詳細に説明する。なお、この実施形態によりこの発明が限定されるものではない。また、下記実施形態における構成要素には、当業者が置換可能かつ容易なもの、あるいは実質的に同一のものが含まれる。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same.
［実施形態１］
　図１は、本実施形態に係るレーザ加工装置の概略構成を示す模式図である。図２は、図１に示すレーザ加工ヘッドの概略構成を示す模式図である。図３は、図２におけるａ－ａ矢視図である。図４は、図２におけるａ－ａ矢視図の他の例である。 [Embodiment 1]
FIG. 1 is a schematic diagram showing a schematic configuration of a laser processing apparatus according to the present embodiment. FIG. 2 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG. FIG. 3 is a view taken along the line aa in FIG. FIG. 4 is another example of the aa arrow view in FIG.
　図１に示すように、レーザ加工装置１０は、加工対象物１００に対して、切断加工、穴あけ加工などの各種加工を行う装置である。なお、加工の種類は特に限定されないが、本実施形態のレーザ加工装置１０は、穴あけにおける切削加工を行う。また、レーザ加工装置１０は、加工対象物１００の計測も行う。 As shown in FIG. 1, the laser processing apparatus 10 is an apparatus that performs various types of processing such as cutting and drilling on the workpiece 100. In addition, although the kind of process is not specifically limited, The laser processing apparatus 10 of this embodiment performs the cutting process in drilling. Further, the laser processing apparatus 10 also measures the workpiece 100.
　レーザ加工装置１０は、フレーム１２と、移動ユニット１４と、ステージユニット１６と、レーザ加工ヘッド６０を含むレーザ加工ユニット２２と、制御部２４と、を有する。レーザ加工装置１０は、ステージユニット１６に保持される加工対象物１００にレーザ加工ユニット２２によりレーザを照射し、加工対象物１００をレーザ加工する。ここで、本実施形態では、水平面をＸ軸方向と、Ｘ軸に直交するＹ軸方向とを含むＸＹ平面とし、水平面に直交する方向をＺ軸方向とする。また、Ｙ軸周りに回転する方向をθＹ方向とする。 The laser processing apparatus 10 includes a frame 12, a moving unit 14, a stage unit 16, a laser processing unit 22 including a laser processing head 60, and a control unit 24. The laser processing apparatus 10 irradiates the processing object 100 held by the stage unit 16 with a laser beam by the laser processing unit 22 to laser process the processing object 100. Here, in the present embodiment, the horizontal plane is the XY plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis, and the direction orthogonal to the horizontal plane is the Z-axis direction. Further, the direction rotating around the Y axis is defined as the θY direction.
　フレーム１２は、レーザ加工装置１０の筐体であり、地面、土台などの設置面に固定されている。フレーム１２は、門１２ａと門１２ａの空間に挿入された土台１２ｂとを有する。フレーム１２は、移動ユニット１４の固定部が固定されている。従って、本実施形態のレーザ加工装置１０は、フレーム１２の門１２ａと土台１２ｂとに移動ユニット１４が固定され、移動ユニット１４により加工対象物１００と、レーザ加工ユニット２２とを相対的に移動させる、いわゆる門型の加工装置である。 The frame 12 is a housing of the laser processing apparatus 10 and is fixed to an installation surface such as the ground or a base. The frame 12 has a gate 12a and a base 12b inserted into the space of the gate 12a. The fixed part of the moving unit 14 is fixed to the frame 12. Therefore, in the laser processing apparatus 10 of the present embodiment, the moving unit 14 is fixed to the gate 12a and the base 12b of the frame 12, and the processing object 100 and the laser processing unit 22 are relatively moved by the moving unit 14. This is a so-called gate-type processing device.
　移動ユニット１４は、加工対象物１００とレーザ加工ヘッド６０とを相対移動させる。移動ユニット１４は、Ｙ軸移動機構３０と、Ｘ軸移動機構３４と、Ｚ軸移動機構３８と、θＹ回転機構３９と、を有する。Ｙ軸移動機構３０は、フレーム１２の土台１２ｂ上に配置され、Ｙ軸方向に延在するレール３０ａと、レール３０ａに沿って移動するＹ軸移動部材３０ｂと、を有する。Ｙ軸移動機構３０は、Ｙ軸移動部材３０ｂにステージユニット１６が固定されている。Ｙ軸移動機構３０は、レール３０ａに沿って、Ｙ軸移動部材３０ｂを移動させることで、ステージユニット１６をＹ軸方向に移動させる。Ｙ軸移動機構３０は、Ｙ軸移動部材３０ｂをＹ軸方向に移動させる機構として、種々の機構を用いることができる。例えば、Ｙ軸移動部材３０ｂにボールねじを挿入し、ボールねじをモータなどで回転させる機構や、リニアモータ機構、ベルト機構などを用いることができる。Ｘ軸移動機構３４と、Ｚ軸移動機構３８も同様に種々の機構を用いることができる。 The moving unit 14 moves the workpiece 100 and the laser processing head 60 relative to each other. The moving unit 14 includes a Y-axis moving mechanism 30, an X-axis moving mechanism 34, a Z-axis moving mechanism 38, and a θY rotating mechanism 39. The Y-axis moving mechanism 30 includes a rail 30a that is disposed on the base 12b of the frame 12 and extends in the Y-axis direction, and a Y-axis moving member 30b that moves along the rail 30a. In the Y-axis moving mechanism 30, the stage unit 16 is fixed to the Y-axis moving member 30b. The Y-axis moving mechanism 30 moves the stage unit 16 in the Y-axis direction by moving the Y-axis moving member 30b along the rail 30a. The Y-axis moving mechanism 30 can use various mechanisms as a mechanism for moving the Y-axis moving member 30b in the Y-axis direction. For example, a mechanism in which a ball screw is inserted into the Y-axis moving member 30b and the ball screw is rotated by a motor, a linear motor mechanism, a belt mechanism, or the like can be used. Similarly, various mechanisms can be used for the X-axis moving mechanism 34 and the Z-axis moving mechanism 38.
　Ｘ軸移動機構３４は、フレーム１２の門１２ａ上に配置され、Ｘ軸方向に延在するレール３３と、レール３３に沿って移動するＸ軸移動部材３４ａと、を有する。Ｘ軸移動機構３４は、Ｘ軸移動部材３４ａにＺ軸移動機構３８が固定されている。Ｘ軸移動機構３４は、レール３３に沿って、Ｘ軸移動部材３４ａを移動させることで、Ｚ軸移動機構３８をＸ軸方向に移動させる。Ｚ軸移動機構３８は、Ｘ軸移動部材３４ａに固定され、Ｚ軸方向に延在するレール３８ａと、レール３８ａに沿って移動するＺ軸移動部材３８ｂと、を有する。Ｚ軸移動機構３８は、Ｚ軸移動部材３８ｂにθＹ回転機構３９が固定されている。Ｚ軸移動機構３８は、レール３８ａに沿って、θＹ回転機構３９を移動させることで、θＹ回転機構３９をＺ軸方向に移動させる。θＹ回転機構３９は、Ｚ軸移動部材３８ｂに固定され、レーザ加工ヘッド６０が固定されている。θＹ回転機構３９は、Ｚ軸移動部材３８ｂに対して、レーザ加工ヘッド６０をθＹ方向に回転させることで、レーザ加工ヘッド６０をθＹ方向に回転させる。 The X-axis moving mechanism 34 includes a rail 33 that is disposed on the gate 12a of the frame 12 and extends in the X-axis direction, and an X-axis moving member 34a that moves along the rail 33. In the X axis moving mechanism 34, a Z axis moving mechanism 38 is fixed to an X axis moving member 34a. The X-axis moving mechanism 34 moves the Z-axis moving mechanism 38 in the X-axis direction by moving the X-axis moving member 34 a along the rail 33. The Z-axis moving mechanism 38 includes a rail 38a that is fixed to the X-axis moving member 34a and extends in the Z-axis direction, and a Z-axis moving member 38b that moves along the rail 38a. In the Z-axis moving mechanism 38, the θY rotating mechanism 39 is fixed to the Z-axis moving member 38b. The Z-axis moving mechanism 38 moves the θY rotating mechanism 39 in the Z-axis direction by moving the θY rotating mechanism 39 along the rail 38a. The θY rotation mechanism 39 is fixed to the Z-axis moving member 38b, and the laser processing head 60 is fixed. The θY rotation mechanism 39 rotates the laser processing head 60 in the θY direction by rotating the laser processing head 60 in the θY direction with respect to the Z-axis moving member 38b.
　移動ユニット１４は、Ｙ軸移動機構３０とＸ軸移動機構３４とＺ軸移動機構３８とを用いて、加工対象物１００とレーザ加工ヘッド６０とをＸ軸方向、Ｙ軸方向およびＺ軸方向のそれぞれに相対移動させる。また、移動ユニット１４は、θＹ回転機構３９を用いて、加工対象物１００に対してレーザ加工ヘッド６０を回転させる。これにより、レーザ加工ヘッド６０から加工対象物１００に対して照射されるレーザの向きを調整することができる。移動ユニット１４は、レーザ加工ヘッド６０をＸ軸周りに回転させる機構を備えていてもよい。また、レーザが照射される向きを調整する機構は、レーザ加工ヘッド６０に設けてもよい。 The moving unit 14 uses the Y-axis moving mechanism 30, the X-axis moving mechanism 34, and the Z-axis moving mechanism 38 to move the workpiece 100 and the laser processing head 60 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Move relative to each other. Further, the moving unit 14 rotates the laser processing head 60 with respect to the processing object 100 using the θY rotation mechanism 39. Thereby, the direction of the laser irradiated to the workpiece 100 from the laser processing head 60 can be adjusted. The moving unit 14 may include a mechanism for rotating the laser processing head 60 around the X axis. Further, a mechanism for adjusting the direction of laser irradiation may be provided in the laser processing head 60.
　ステージユニット１６は、Ｙ軸移動機構３０のＹ軸移動部材３０ｂ上に配置されている。ステージユニット１６は、加工対象物１００を支持するステージである。本実施形態のステージユニット１６は、Ｙ軸移動部材３０ｂと一体化させた部材、つまり、Ｙ軸移動部材３０ｂをステージユニット１６のステージとしたが、Ｙ軸移動部材３０ｂ上に別の支持部材をステージとして設けてもよい。ステージユニット１６は、Ｙ軸移動機構３０が加工対象物１００を移動させるステージ移動機構４２となる。ステージユニット１６は、加工対象物１００をＹ軸移動部材３０ｂの所定の位置に固定する固定機構を備えている。また、ステージユニット１６は、ステージ移動機構４２として、さらにＹ軸移動部材３０ｂに対して加工対象物１００の向きを、つまり姿勢を調整する調整機構を備えていてもよい。具体的には、ステージ移動機構４２として、加工対象物１００を回転させる機構を備えていてもよい。 The stage unit 16 is disposed on the Y-axis moving member 30b of the Y-axis moving mechanism 30. The stage unit 16 is a stage that supports the workpiece 100. In the stage unit 16 of the present embodiment, the member integrated with the Y-axis moving member 30b, that is, the Y-axis moving member 30b is used as the stage of the stage unit 16, but another support member is provided on the Y-axis moving member 30b. It may be provided as a stage. The stage unit 16 serves as a stage moving mechanism 42 that causes the Y-axis moving mechanism 30 to move the workpiece 100. The stage unit 16 includes a fixing mechanism that fixes the workpiece 100 at a predetermined position of the Y-axis moving member 30b. The stage unit 16 may further include an adjustment mechanism that adjusts the orientation of the workpiece 100 relative to the Y-axis moving member 30b, that is, the posture, as the stage moving mechanism 42. Specifically, a mechanism for rotating the workpiece 100 may be provided as the stage moving mechanism 42.
　レーザ加工ユニット２２は、レーザ加工ヘッド６０と、レーザ光源６２と、アシストガス供給手段６４と、冷媒供給手段６６と、を有する。 The laser processing unit 22 includes a laser processing head 60, a laser light source 62, an assist gas supply unit 64, and a refrigerant supply unit 66.
　レーザ光源６２は、光ファイバを媒質としてレーザを出力するファイバレーザ出力装置がある。ファイバレーザ出力装置としては、例えば、ファブリペロー型ファイバレーザ出力装置やリング型ファイバレーザ出力装置を用いることができ、これらの出力装置が励起されることによりレーザが発振される。ファイバレーザ出力装置のファイバは、例えば、エルビウム（Ｅｒ）、ネオジム（Ｎｄ）、イッテルビウム（Ｙｂ）などの希土類元素が添加されたシリカガラスを用いることができる。なお、本実施形態では、ファイバレーザとしてＹＡＧレーザやＹＶＯ４レーザなどのナノ秒オーダーパルス発振をするレーザも使用可能である。また、レーザ光源６２は、レーザを短パルス、例えば、周波数２０ｋＨｚで出力する短パルスレーザ出力装置がある。短パルスレーザ出力装置としては、レーザの発振源として例えば、チタンサファイアレーザを用いることができ、パルス幅が１００ピコ秒以下のパルスを発振することができる。ここで、本実施形態において、短パルスレーザは、パルス幅が１００ナノ秒以下の短パルスでレーザを出力するものである。なお、レーザ加工ユニット２２は、短パルスレーザを、パルス幅が１０ナノ秒以上の短パルスとすることが好ましく、パルス幅が１ナノ秒未満のレーザとすることがより好ましい。 The laser light source 62 includes a fiber laser output device that outputs a laser using an optical fiber as a medium. As the fiber laser output device, for example, a Fabry-Perot type fiber laser output device or a ring type fiber laser output device can be used, and the laser is oscillated when these output devices are excited. As the fiber of the fiber laser output device, for example, silica glass to which a rare earth element such as erbium (Er), neodymium (Nd), ytterbium (Yb) is added can be used. In the present embodiment, a laser that performs nanosecond order pulse oscillation such as a YAG laser or a YVO4 laser can be used as the fiber laser. The laser light source 62 includes a short pulse laser output device that outputs a laser with a short pulse, for example, a frequency of 20 kHz. As the short pulse laser output device, for example, a titanium sapphire laser can be used as a laser oscillation source, and a pulse having a pulse width of 100 picoseconds or less can be oscillated. Here, in the present embodiment, the short pulse laser outputs the laser with a short pulse having a pulse width of 100 nanoseconds or less. In the laser processing unit 22, the short pulse laser is preferably a short pulse having a pulse width of 10 nanoseconds or more, and more preferably a laser having a pulse width of less than 1 nanosecond.
　アシストガス供給手段６４は、アシストガスをレーザ加工ヘッド６０に供給するものである。アシストガス供給手段６４は、アシストガス供給部６４ａと、アシストガス供給管６４ｂとを含む。アシストガス供給部６４ａは、図には明示しないが、アシストガスが貯留されるアシストガス貯留タンクからコンプレッサなどでアシストガスをアシストガス供給管６４ｂに圧送する。アシストガス供給管６４ｂは、レーザ加工ヘッド６０に接続され、アシストガス供給部６４ａにより圧送されたアシストガスをレーザ加工ヘッド６０に供給する。アシストガスとしては、例えば、空気、窒素ガス、酸素ガス、アルゴンガス、キセノンガス、ヘリウムガス、または、これらの混合ガスなどのドライガスである不活性ガスが適用される。 Assist gas supply means 64 supplies assist gas to the laser processing head 60. The assist gas supply means 64 includes an assist gas supply unit 64a and an assist gas supply pipe 64b. Although not explicitly shown in the drawing, the assist gas supply unit 64a pumps the assist gas from the assist gas storage tank in which the assist gas is stored to the assist gas supply pipe 64b by a compressor or the like. The assist gas supply pipe 64b is connected to the laser processing head 60, and supplies the assist gas pumped by the assist gas supply unit 64a to the laser processing head 60. As the assist gas, for example, an inert gas that is a dry gas such as air, nitrogen gas, oxygen gas, argon gas, xenon gas, helium gas, or a mixed gas thereof is used.
　冷媒供給手段６６は、冷媒をレーザ加工ヘッド６０に供給するものである。冷媒供給手段６６は、冷媒供給部６６ａと、冷媒供給管６６ｂとを含む。冷媒供給部６６ａは、図には明示しないが、冷媒が貯留される冷媒貯留タンクからコンプレッサなどで冷媒を冷媒供給管６６ｂに圧送する。冷媒供給管６６ｂは、レーザ加工ヘッド６０に接続され、冷媒供給部６６ａにより圧送された冷媒をレーザ加工ヘッド６０に供給する。冷媒としては、例えば、約－８０℃程度のドライアイス粒子や炭酸ガスや液体窒素などが適用される。 The refrigerant supply means 66 supplies the refrigerant to the laser processing head 60. The refrigerant supply means 66 includes a refrigerant supply unit 66a and a refrigerant supply pipe 66b. Although not shown in the drawing, the refrigerant supply unit 66a pumps the refrigerant from the refrigerant storage tank in which the refrigerant is stored to the refrigerant supply pipe 66b by a compressor or the like. The refrigerant supply pipe 66b is connected to the laser processing head 60, and supplies the refrigerant pumped by the refrigerant supply unit 66a to the laser processing head 60. As the refrigerant, for example, dry ice particles of about -80 ° C., carbon dioxide gas, liquid nitrogen, or the like is applied.
　レーザ加工ヘッド６０は、レーザ光源６２から出力されたレーザが入射され、入射されたレーザを加工対象物１００に照射することで、加工対象物１００をレーザ加工する。なお、レーザ光源６２から出力されたレーザは、光ファイバなどのレーザ光を導く光学部材でレーザ加工ヘッド６０まで案内される。 The laser processing head 60 receives the laser output from the laser light source 62 and irradiates the processing target object 100 with the incident laser, thereby laser processing the processing target object 100. The laser output from the laser light source 62 is guided to the laser processing head 60 by an optical member that guides laser light such as an optical fiber.
　レーザ加工ヘッド６０は、図２に示すように、ケーシング７２と、集光光学系７４と、ノズル７６と、を含む。ケーシング７２は、レーザ光源６２から出力されたレーザが入射され、このレーザを集光光学系７４に導く走査機構（図示せず）が集光光学系７４と共に収納されている。集光光学系７４は、複数のレンズを有し（図示では１つ）、複数のレンズにより、レーザＬを集光し、所定の焦点距離、焦点深度とすることで、加工対象物１００に所定のスポット径のレーザＬを照射する。ノズル７６は、集光光学系７４が配置されたケーシング７２の先端部に取り付けられ、集光光学系７４により集光されたレーザＬを通過させるように筒状に形成されている。本実施形態では、ノズル７６は、レーザＬの集光に合わせてレーザＬの進行方向の先側に向かうにつれて次第に径が縮小する中空の円錐形状に形成されている。 The laser processing head 60 includes a casing 72, a condensing optical system 74, and a nozzle 76, as shown in FIG. The casing 72 receives a laser output from the laser light source 62 and houses a scanning mechanism (not shown) for guiding the laser to the condensing optical system 74 together with the condensing optical system 74. The condensing optical system 74 has a plurality of lenses (one in the figure), condenses the laser L by the plurality of lenses, and sets the predetermined focal length and depth to the processing object 100. A laser L having a spot diameter of 2 is irradiated. The nozzle 76 is attached to the tip of the casing 72 where the condensing optical system 74 is disposed, and is formed in a cylindrical shape so as to allow the laser L condensed by the condensing optical system 74 to pass therethrough. In the present embodiment, the nozzle 76 is formed in a hollow conical shape whose diameter gradually decreases as the laser L converges toward the front side in the traveling direction of the laser L.
　ノズル７６は、レーザ照射ノズル７６Ａと、冷媒噴射ノズル７６Ｂと、を有する。レーザ照射ノズル７６Ａは、上述したように、集光光学系７４により集光されたレーザＬを通過させ、加工対象物１００にレーザＬを照射させるためのもので筒状に形成された筒内の貫通孔である。このレーザ照射ノズル７６Ａは、アシストガス供給手段６４のアシストガス供給管６４ｂが接続され、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザＬと共にアシストガスＡを噴射する。 The nozzle 76 has a laser irradiation nozzle 76A and a refrigerant injection nozzle 76B. As described above, the laser irradiation nozzle 76A is for passing the laser L condensed by the condensing optical system 74 and irradiating the processing object 100 with the laser L. It is a through hole. The laser irradiation nozzle 76A is connected to the assist gas supply pipe 64b of the assist gas supply means 64, and jets the assist gas A together with the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A.
　ここで、アシストガスＡとして、酸化反応熱を加工処理に利用できる酸素ガスを用いた場合、金属などの加工対象物１００に対する加工速度をより向上させることができる。また、アシストガスＡとして、熱影響を与える熱影響層としての酸化被膜の生成を抑える窒素ガスやアルゴンガスなどを用いた場合、金属などの加工対象物１００に対する加工精度をより向上させることができる。アシストガスＡのガス種、混合比、および、レーザ照射ノズル７６Ａからの噴出量（噴射圧力）などは、加工対象物１００の種類や加工モードなどの加工条件に応じて変えることができる。 Here, when oxygen gas that can use oxidation reaction heat for processing is used as the assist gas A, the processing speed for the processing object 100 such as metal can be further improved. Further, when the assist gas A is a nitrogen gas, an argon gas, or the like that suppresses the formation of an oxide film as a heat-affected layer that affects heat, the processing accuracy for the workpiece 100 such as metal can be further improved. . The gas type and mixing ratio of the assist gas A, the ejection amount (injection pressure) from the laser irradiation nozzle 76A, and the like can be changed according to the processing conditions such as the type of the processing object 100 and the processing mode.
　冷媒噴射ノズル７６Ｂは、レーザ照射ノズル７６Ａの外側に独立して配置されている。冷媒噴射ノズル７６Ｂは、例えば、図３に示すようにレーザ照射ノズル７６Ａの周りを囲むようにレーザＬの光軸Ｌａと同軸に円環状に形成された穴、または図４に示すようにレーザＬの光軸Ｌａと同軸の円周上に円環状に配置された複数の穴である。この冷媒噴射ノズル７６Ｂは、冷媒供給手段６６の冷媒供給管６６ｂが接続され、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザＬの外側で冷媒Ｒを噴射する。 The refrigerant injection nozzle 76B is independently arranged outside the laser irradiation nozzle 76A. The coolant injection nozzle 76B is, for example, a hole formed in an annular shape coaxially with the optical axis La of the laser L so as to surround the laser irradiation nozzle 76A as shown in FIG. 3, or the laser L as shown in FIG. Are a plurality of holes arranged in an annular shape on a circumference coaxial with the optical axis La of the optical axis La. The refrigerant injection nozzle 76B is connected to the refrigerant supply pipe 66b of the refrigerant supply means 66, and injects the refrigerant R outside the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A.
　ここで、冷媒ＲをレーザＬの進行方向に沿ってレーザＬの外側で噴射することで、加工対象物１００におけるレーザＬでの加工部位の周囲を冷却し、レーザＬによる加工対象物１００の熱影響を抑制することができる。冷媒Ｒの冷媒噴射ノズル７６Ｂからの噴出量（噴射圧力）は、加工対象物１００の種類や加工モードなどの加工条件に応じて変えることができる。 Here, the coolant R is sprayed outside the laser L along the traveling direction of the laser L, so that the periphery of the processing portion of the processing object 100 by the laser L is cooled, and the heat of the processing object 100 by the laser L is cooled. The influence can be suppressed. The ejection amount (injection pressure) of the refrigerant R from the refrigerant injection nozzle 76B can be changed according to the processing conditions such as the type of the processing object 100 and the processing mode.
　また、レーザ加工ユニット２２は、レーザを照射する位置の画像を撮影する撮影手段、例えば、ＣＣＤ（Charge　Coupled　Device）イメージセンサなどを有するカメラを備えていてもよい。これにより、取得した画像に基づいてレーザの照射位置などを調整することができる。 Further, the laser processing unit 22 may include a camera having a photographing means for photographing an image at a position where the laser is irradiated, for example, a CCD (Charge Coupled Device) image sensor. Thereby, the irradiation position of a laser, etc. can be adjusted based on the acquired image.
　レーザ加工ユニット２２は、レーザ光源６２から出力されるレーザをレーザ加工ヘッド６０から加工対象物１００に照射することで、貫通孔があけられる。また、レーザ加工ユニット２２は、レーザＬの照射位置を移動させることで、加工対象物１００を線で切削することができ、加工対象物１００を切断することもできる。 The laser processing unit 22 opens a through hole by irradiating the processing object 100 with the laser output from the laser light source 62 from the laser processing head 60. Moreover, the laser processing unit 22 can cut the processing object 100 with a line by moving the irradiation position of the laser L, and can also cut the processing object 100.
　制御部２４は、移動ユニット１４、ステージユニット１６、レーザ加工ユニット２２、アシストガス供給部６４ａ、冷媒供給部６６ａの各部の動作を制御する。制御部２４は、移動ユニット１４やステージユニット１６のステージ移動機構４２の動作を制御し、加工対象物１００とレーザ加工ヘッド６０とを相対移動させる。また、制御部２４はレーザ加工ユニット２２の駆動を制御し、加工対象物１００にレーザＬを照射する。また、制御部２４はアシストガス供給部６４ａの駆動を制御し、アシストガスＡの供給や、アシストガスＡのレーザ照射ノズル７６Ａからの噴射圧力などを制御する。また、制御部２４は冷媒供給部６６ａの駆動を制御し、冷媒Ｒの供給や、冷媒Ｒの冷媒噴射ノズル７６Ｂからの噴射圧力などを制御する。 The control unit 24 controls operations of the moving unit 14, the stage unit 16, the laser processing unit 22, the assist gas supply unit 64a, and the refrigerant supply unit 66a. The control unit 24 controls the operation of the stage moving mechanism 42 of the moving unit 14 and the stage unit 16 to move the workpiece 100 and the laser processing head 60 relative to each other. Further, the control unit 24 controls driving of the laser processing unit 22 and irradiates the processing object 100 with the laser L. Further, the control unit 24 controls driving of the assist gas supply unit 64a to control supply of the assist gas A, injection pressure of the assist gas A from the laser irradiation nozzle 76A, and the like. Further, the control unit 24 controls driving of the refrigerant supply unit 66a to control supply of the refrigerant R, injection pressure of the refrigerant R from the refrigerant injection nozzle 76B, and the like.
　このように、本実施形態のレーザ加工装置１０は、集光光学系７４から照射されるレーザＬを通過させる筒状のレーザ照射ノズル７６Ａと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザ照射ノズル７６ＡからアシストガスＡを噴射させるアシストガス供給手段６４と、レーザ照射ノズル７６Ａの外側にレーザＬと同軸に独立して配置された円環状の冷媒噴射ノズル７６Ｂと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿って冷媒噴射ノズル７６Ｂから冷媒Ｒを噴射させる冷媒供給手段６６と、を有する。 As described above, the laser processing apparatus 10 according to the present embodiment has a cylindrical laser irradiation nozzle 76A that passes the laser L irradiated from the condensing optical system 74 and a traveling direction of the laser L that passes the laser irradiation nozzle 76A. An assist gas supply means 64 for injecting the assist gas A from the laser irradiation nozzle 76A along the ring, an annular refrigerant injection nozzle 76B arranged coaxially with the laser L outside the laser irradiation nozzle 76A, and a laser irradiation nozzle. Refrigerant supply means 66 for injecting the refrigerant R from the refrigerant injection nozzle 76B along the traveling direction of the laser L passing through 76A.
　また、本実施形態のレーザ加工装置１０は、集光光学系７４から照射されるレーザＬを通過させる筒状のレーザ照射ノズル７６Ａと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザ照射ノズル７６ＡからアシストガスＡを噴射させるアシストガス供給手段６４と、レーザ照射ノズル７６Ａの外側にレーザＬと同軸の円周上に配置した複数の穴からなる冷媒噴射ノズル７６Ｂと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿って冷媒噴射ノズル７６Ｂから冷媒Ｒを噴射させる冷媒供給手段６６と、を有する。 Further, the laser processing apparatus 10 of the present embodiment has a cylindrical laser irradiation nozzle 76A that allows the laser L irradiated from the condensing optical system 74 to pass through, and a traveling direction of the laser L that passes the laser irradiation nozzle 76A. Assist gas supply means 64 for injecting the assist gas A from the laser irradiation nozzle 76A, a refrigerant injection nozzle 76B comprising a plurality of holes arranged on the circumference coaxial with the laser L outside the laser irradiation nozzle 76A, and the laser irradiation nozzle Refrigerant supply means 66 for injecting the refrigerant R from the refrigerant injection nozzle 76B along the traveling direction of the laser L passing through 76A.
　すなわち、レーザ加工装置１０は、レーザ照射ノズル７６Ａを通過するレーザＬが加工対象物１００に照射されて当該加工対象物１００を加工する。この際、冷媒Ｒが冷媒噴射ノズル７６ＢからレーザＬの外側でレーザＬの進行方向に沿って噴射されるため加工対象物１００のレーザＬによる加工部位を冷却する。さらに、アシストガスＡがレーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザＬと共に噴射されることで、レーザＬと冷媒Ｒとの干渉を妨げ、冷媒Ｒにより大気中の水分が凍って固体化しても、これがレーザＬの熱で蒸発し白煙が発生する事態を防ぐ。この結果、レーザＬに影響を及ぼすことなく冷媒Ｒを加工対象物１００の加工部位に供給することができる。 That is, the laser processing apparatus 10 processes the workpiece 100 by irradiating the workpiece 100 with the laser L passing through the laser irradiation nozzle 76A. At this time, since the refrigerant R is injected from the refrigerant injection nozzle 76B outside the laser L along the traveling direction of the laser L, the part to be processed by the laser L of the workpiece 100 is cooled. Further, the assist gas A is jetted together with the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A, thereby preventing interference between the laser L and the refrigerant R, and moisture in the atmosphere is frozen by the refrigerant R. Even if it is solidified, it is prevented from being vaporized by the heat of the laser L and generating white smoke. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
　また、本実施形態のレーザ加工装置１０では、レーザ照射ノズル７６Ａは、通過するレーザＬが接触しないようにレーザＬと隙間を有する内径の貫通孔が形成され、アシストガス供給手段６４は、前記隙間を満たすように貫通孔にアシストガスＡを供給することが好ましい。これにより、アシストガスＡがレーザＬを囲むように噴射されるため、レーザＬと冷媒Ｒとの干渉を防ぐ作用効果を顕著に得ることができる。 Further, in the laser processing apparatus 10 of the present embodiment, the laser irradiation nozzle 76A is formed with a through hole having an inner diameter having a gap with the laser L so that the passing laser L does not come in contact, and the assist gas supply means 64 has the gap It is preferable to supply the assist gas A to the through hole so as to satisfy the above condition. Thereby, since the assist gas A is injected so as to surround the laser L, the effect of preventing the interference between the laser L and the refrigerant R can be obtained remarkably.
　また、本実施形態のレーザ加工装置１０では、レーザ照射ノズル７６Ａから噴射させるアシストガスＡの噴射圧力Ｐ１と、冷媒噴射ノズル７６Ｂから噴射させる冷媒Ｒの噴射圧力Ｐ２との関係を、Ｐ２＜Ｐ１に設定することが好ましい。このアシストガスＡの噴射圧力Ｐ１および冷媒Ｒの噴射圧力Ｐ２の設定は、制御部２４によりアシストガス供給部６４ａおよび冷媒供給部６６ａの駆動を制御することで実施される。これにより、アシストガスＡが冷媒Ｒよりも圧力が高く、冷媒ＲがアシストガスＡ側に混入することを防ぐため、レーザＬと冷媒Ｒとの干渉を防ぐ作用効果を顕著に得ることができる。 Moreover, in the laser processing apparatus 10 of this embodiment, the relationship between the injection pressure P1 of the assist gas A injected from the laser irradiation nozzle 76A and the injection pressure P2 of the refrigerant R injected from the refrigerant injection nozzle 76B is P2 <P1. It is preferable to set. The setting of the injection pressure P1 of the assist gas A and the injection pressure P2 of the refrigerant R is performed by controlling the driving of the assist gas supply unit 64a and the refrigerant supply unit 66a by the control unit 24. Thereby, since the assist gas A has a higher pressure than the refrigerant R and prevents the refrigerant R from being mixed into the assist gas A side, the effect of preventing the interference between the laser L and the refrigerant R can be significantly obtained.
　また、本実施形態のレーザ加工装置１０では、図２に示すように、加工対象物１００の加工面１００ａにおいて、冷媒Ｒの噴射範囲の最内側のレーザＬの焦点Ｆからの距離Ｗは、０．１ｍｍ以上５０ｍｍ以下の範囲とすることが好ましい。０．１ｍｍ以上とすることでレーザＬと冷媒Ｒとの干渉を防ぐ作用効果を良好に得ることができ、５０ｍｍ以下とすることで加工部位を冷却する作用効果を良好に得ることができる。このような距離Ｗとするため、冷媒噴射ノズル７６ＢにおけるレーザＬに沿う角度を設定する。 In the laser processing apparatus 10 of the present embodiment, as shown in FIG. 2, the distance W from the focal point F of the laser L on the innermost side of the injection range of the coolant R is 0 on the processing surface 100 a of the processing object 100. It is preferable to be in the range of 1 mm or more and 50 mm or less. When the thickness is 0.1 mm or more, the effect of preventing interference between the laser L and the refrigerant R can be obtained favorably, and when the thickness is 50 mm or less, the effect of cooling the processing site can be favorably obtained. In order to set such a distance W, an angle along the laser L in the refrigerant injection nozzle 76B is set.
　なお、加工対象物１００をレーザＬにて切断などの加工をするにあたりレーザＬの照射位置を加工対象物１００の加工面１００ａに沿って移動させるが（加工工程）、この場合、冷媒Ｒの噴射は、レーザＬの移動方向の前側では行わず後側のみとしてもよい（冷媒噴射工程）。すなわち、レーザＬの移動方向の前側に冷媒Ｒを噴射してもレーザＬの熱影響がない（熱影響が生じる前）加工部位を冷却することになり効果的ではないため、冷媒Ｒの噴射をレーザＬの移動方向の後側のみとする。この場合、例えば、冷媒噴射ノズル７６Ｂは、レーザ照射ノズル７６Ａの周りを囲むように円環状に配置された複数の穴とし、各穴に対して選択的に冷媒Ｒを供給する開閉弁などを有した切換機構を備えることで実現できる。 In addition, when processing the processing object 100 with the laser L, such as cutting, the irradiation position of the laser L is moved along the processing surface 100a of the processing object 100 (processing process). May not be performed on the front side in the moving direction of the laser L but only on the rear side (refrigerant injection step). That is, even if the refrigerant R is injected to the front side in the moving direction of the laser L, there is no thermal influence of the laser L (before the thermal influence occurs), and this is not effective. Only the rear side in the moving direction of the laser L is assumed. In this case, for example, the refrigerant injection nozzle 76B has a plurality of holes arranged in an annular shape so as to surround the laser irradiation nozzle 76A, and has an on-off valve that selectively supplies the refrigerant R to each hole. This can be realized by providing the switching mechanism.
　なお、図には明示しないが、レーザＬを照射する加工対象物１００の加工面１００ａとは反対側の面から冷媒Ｒをさらに噴射できるように、別の冷媒噴射ノズルを有してもよい。この別の冷媒噴射ノズルへの冷媒の供給は、上述した冷媒供給手段６６で行う。このようにすることで、加工対象物１００の加工部位の冷却効率を向上することができる。 Although not clearly shown in the figure, another coolant injection nozzle may be provided so that the coolant R can be further injected from the surface opposite to the processing surface 100a of the processing object 100 irradiated with the laser L. The refrigerant is supplied to the other refrigerant injection nozzle by the refrigerant supply means 66 described above. By doing in this way, the cooling efficiency of the process site | part of the workpiece 100 can be improved.
［実施形態２］
　以下、本実施形態のレーザ加工装置の他の例について説明する。図５は、本発明の実施形態に係るレーザ加工装置の他の例の概略構成を示す模式図である。図６は、図５に示すレーザ加工ヘッドの概略構成を示す模式図である。図７は、図６におけるｂ－ｂ矢視図である。図８は、図６におけるｂ－ｂ矢視図の他の例である。 [Embodiment 2]
Hereinafter, another example of the laser processing apparatus of the present embodiment will be described. FIG. 5 is a schematic diagram showing a schematic configuration of another example of the laser processing apparatus according to the embodiment of the present invention. FIG. 6 is a schematic diagram showing a schematic configuration of the laser processing head shown in FIG. FIG. 7 is a view taken along the line bb in FIG. FIG. 8 is another example of the view taken along the line bb in FIG.
　図５および図６に示すように、他の例のレーザ加工装置１１０は、図１および図２を参照して説明したレーザ加工装置１０に対し、シールドガス供給手段６８と、シールドガス噴射ノズル７６Ｃと、をさらに有する点が異なり、その他の構成は同様である。従って、他の例のレーザ加工装置１１０についての説明において、上述したレーザ加工装置１０と同等部分には同一の符号を付して説明を省略する。 As shown in FIGS. 5 and 6, the laser processing apparatus 110 of another example is different from the laser processing apparatus 10 described with reference to FIGS. 1 and 2 with a shield gas supply means 68 and a shield gas injection nozzle 76C. And the other configurations are the same. Therefore, in the description of the laser processing apparatus 110 of another example, the same parts as those of the laser processing apparatus 10 described above are denoted by the same reference numerals and description thereof is omitted.
　シールドガス供給手段６８は、シールドガスをレーザ加工ヘッド６０に供給するものである。シールドガス供給手段６８は、シールドガス供給部６８ａと、シールドガス供給管６８ｂとを含む。シールドガス供給部６８ａは、図には明示しないが、シールドガスが貯留されるシールドガス貯留タンクからコンプレッサなどでシールドガスをシールドガス供給管６８ｂに圧送する。シールドガス供給管６８ｂは、レーザ加工ヘッド６０に接続され、シールドガス供給部６８ａにより圧送されたシールドガスをレーザ加工ヘッド６０に供給する。シールドガスとしては、例えば、空気、窒素ガス、酸素ガス、アルゴンガス、キセノンガス、ヘリウムガス、または、これらの混合ガスなどのドライガスである不活性ガスが適用される。 The shield gas supply means 68 supplies shield gas to the laser processing head 60. The shield gas supply means 68 includes a shield gas supply unit 68a and a shield gas supply pipe 68b. Although not clearly shown in the drawing, the shield gas supply unit 68a pumps the shield gas to the shield gas supply pipe 68b by a compressor or the like from a shield gas storage tank in which the shield gas is stored. The shield gas supply pipe 68b is connected to the laser processing head 60, and supplies the shield gas pumped by the shield gas supply unit 68a to the laser processing head 60. As the shielding gas, for example, an inert gas that is a dry gas such as air, nitrogen gas, oxygen gas, argon gas, xenon gas, helium gas, or a mixed gas thereof is used.
　シールドガス噴射ノズル７６Ｃは、ノズル７６に設けられている。シールドガス噴射ノズル７６Ｃは、レーザ照射ノズル７６Ａの外側であって、且つ、冷媒噴射ノズル７６Ｂの外側に独立して配置されている。すなわち、シールドガス噴射ノズル７６Ｃは、レーザ照射ノズル７６Ａおよび冷媒噴射ノズル７６Ｂに対して最外側に配置されている。シールドガス噴射ノズル７６Ｃは、例えば、図７に示すように冷媒噴射ノズル７６Ｂの周りを囲むようにレーザＬの光軸Ｌａと同軸に円環状に形成された穴、または図８に示すようにレーザＬの光軸Ｌａと同軸の円周上に円環状に配置された複数の穴である。なお、図７および図８では、レーザ照射ノズル７６Ａを図３と同様の構成として示しているが、図４と同様の構成であってもよい。このシールドガス噴射ノズル７６Ｃは、シールドガス供給手段６８のシールドガス供給管６８ｂが接続され、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザＬの外側かつ冷媒Ｒの内側でシールドガスＳを噴射する。 The shield gas injection nozzle 76 </ b> C is provided in the nozzle 76. The shield gas injection nozzle 76C is independently arranged outside the laser irradiation nozzle 76A and outside the refrigerant injection nozzle 76B. That is, the shield gas injection nozzle 76C is disposed on the outermost side with respect to the laser irradiation nozzle 76A and the refrigerant injection nozzle 76B. The shield gas injection nozzle 76C is, for example, a hole formed in an annular shape coaxially with the optical axis La of the laser L so as to surround the refrigerant injection nozzle 76B as shown in FIG. 7, or a laser as shown in FIG. A plurality of holes arranged in an annular shape on a circumference coaxial with the optical axis La of L. 7 and 8, the laser irradiation nozzle 76A is shown as having the same configuration as that shown in FIG. 3, but it may be the same as that shown in FIG. This shield gas injection nozzle 76C is connected to the shield gas supply pipe 68b of the shield gas supply means 68, and shield gas is provided outside the laser L and inside the refrigerant R along the traveling direction of the laser L passing through the laser irradiation nozzle 76A. S is injected.
　制御部２４は、移動ユニット１４、ステージユニット１６、レーザ加工ユニット２２、アシストガス供給部６４ａ、冷媒供給部６６ａ、シールドガス供給部６８ａの各部の動作を制御する。制御部２４は、移動ユニット１４やステージユニット１６のステージ移動機構４２の動作を制御し、加工対象物１００とレーザ加工ヘッド６０とを相対移動させる。また、制御部２４はレーザ加工ユニット２２の駆動を制御し、加工対象物１００にレーザＬを照射する。また、制御部２４はアシストガス供給部６４ａの駆動を制御し、アシストガスＡの供給や、アシストガスＡのレーザ照射ノズル７６Ａからの噴射圧力などを制御する。また、制御部２４は冷媒供給部６６ａの駆動を制御し、冷媒Ｒの供給や、冷媒Ｒの冷媒噴射ノズル７６Ｂからの噴射圧力などを制御する。また、制御部２４はシールドガス供給部６８ａの駆動を制御し、シールドガスＳの供給や、シールドガスＳのシールドガス噴射ノズル７６Ｃからの噴射圧力などを制御する。 The control unit 24 controls operations of the moving unit 14, the stage unit 16, the laser processing unit 22, the assist gas supply unit 64a, the refrigerant supply unit 66a, and the shield gas supply unit 68a. The control unit 24 controls the operation of the stage moving mechanism 42 of the moving unit 14 and the stage unit 16 to move the workpiece 100 and the laser processing head 60 relative to each other. Further, the control unit 24 controls driving of the laser processing unit 22 and irradiates the processing object 100 with the laser L. Further, the control unit 24 controls driving of the assist gas supply unit 64a to control supply of the assist gas A, injection pressure of the assist gas A from the laser irradiation nozzle 76A, and the like. Further, the control unit 24 controls driving of the refrigerant supply unit 66a to control supply of the refrigerant R, injection pressure of the refrigerant R from the refrigerant injection nozzle 76B, and the like. Further, the control unit 24 controls driving of the shield gas supply unit 68a to control supply of the shield gas S, injection pressure of the shield gas S from the shield gas injection nozzle 76C, and the like.
　このように、本実施形態のレーザ加工装置１１０は、集光光学系７４から照射されるレーザＬを通過させる筒状のレーザ照射ノズル７６Ａと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザ照射ノズル７６ＡからアシストガスＡを噴射させるアシストガス供給手段６４と、レーザ照射ノズル７６Ａの外側に独立して配置された冷媒噴射ノズル７６Ｂと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿って冷媒噴射ノズル７６Ｂから冷媒Ｒを噴射させる冷媒供給手段６６と、レーザ照射ノズル７６Ａの外側であって、且つ、冷媒噴射ノズル７６Ｂの外側にレーザＬと同軸に独立して配置された円環状のシールドガス噴射ノズル７６Ｃと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってシールドガス噴射ノズル７６ＣからシールドガスＳを噴射させるシールドガス供給手段６８と、を有する。 As described above, the laser processing apparatus 110 according to the present embodiment has a cylindrical laser irradiation nozzle 76A that passes the laser L irradiated from the condensing optical system 74 and a traveling direction of the laser L that passes the laser irradiation nozzle 76A. Assist gas supply means 64 for injecting the assist gas A from the laser irradiation nozzle 76A along, the refrigerant injection nozzle 76B arranged independently outside the laser irradiation nozzle 76A, and the progress of the laser L passing through the laser irradiation nozzle 76A The refrigerant supply means 66 for injecting the refrigerant R from the refrigerant injection nozzle 76B along the direction and the outside of the laser irradiation nozzle 76A and the outside of the refrigerant injection nozzle 76B are independently arranged coaxially with the laser L. An annular shield gas injection nozzle 76C and a laser L passing through the laser irradiation nozzle 76A are aligned along the traveling direction of the laser L. A shield gas supply means 68 for ejecting the shielding gas S from Rudogasu injection nozzle 76C, a.
　また、本実施形態のレーザ加工装置１１０は、集光光学系７４から照射されるレーザＬを通過させる筒状のレーザ照射ノズル７６Ａと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザ照射ノズル７６ＡからアシストガスＡを噴射させるアシストガス供給手段６４と、レーザ照射ノズル７６Ａの外側に独立して配置された冷媒噴射ノズル７６Ｂと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿って冷媒噴射ノズル７６Ｂから冷媒Ｒを噴射させる冷媒供給手段６６と、レーザ照射ノズル７６Ａの外側であって、且つ、冷媒噴射ノズル７６Ｂの外側にレーザＬと同軸の円周上に配置した複数の穴からなるシールドガス噴射ノズル７６Ｃと、レーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってシールドガス噴射ノズル７６ＣからシールドガスＳを噴射させるシールドガス供給手段６８と、を有する。 Further, the laser processing apparatus 110 according to the present embodiment has a cylindrical laser irradiation nozzle 76A that allows the laser L irradiated from the condensing optical system 74 to pass therethrough and a traveling direction of the laser L that passes the laser irradiation nozzle 76A. In the traveling direction of the laser L passing through the laser irradiation nozzle 76A, the assist gas supply means 64 for injecting the assist gas A from the laser irradiation nozzle 76A, the refrigerant injection nozzle 76B arranged independently outside the laser irradiation nozzle 76A, and the laser irradiation nozzle 76A. A plurality of refrigerant supply means 66 for injecting the refrigerant R from the refrigerant injection nozzle 76B along the outer circumference of the laser irradiation nozzle 76A and on the circumference coaxial with the laser L outside the refrigerant injection nozzle 76B. A shield gas injection nozzle 76C composed of a hole and a laser L that passes through the laser irradiation nozzle 76A are aligned along the traveling direction of the laser L. A shield gas supply means 68 for ejecting the shielding gas S from Rudogasu injection nozzle 76C, a.
　すなわち、レーザ加工装置１１０は、レーザ照射ノズル７６Ａを通過するレーザＬが加工対象物１００に照射されて当該加工対象物１００を加工する。この際、冷媒Ｒが冷媒噴射ノズル７６ＢからレーザＬの外側でレーザＬの進行方向に沿って噴射されるため加工対象物１００のレーザＬによる加工部位を冷却する。さらに、シールドガスＳが冷媒Ｒよりも外側で噴射されることで、冷媒Ｒと大気の干渉を妨げ、冷媒Ｒにより大気中の水分が凍って固体化する事態を防ぐ。この結果、レーザＬに影響を及ぼすことなく冷媒Ｒを加工対象物１００の加工部位に供給することができる。しかも、アシストガスＡがレーザ照射ノズル７６Ａを通過するレーザＬの進行方向に沿ってレーザＬと共に噴射されることで、レーザＬと冷媒Ｒとの干渉をさらに妨げるため、冷媒Ｒにより大気中の水分が凍って固体化しても、これがレーザＬの熱で蒸発し白煙が発生する事態を防ぐ。この結果、レーザＬに影響を及ぼすことなく冷媒Ｒを加工対象物１００の加工部位に供給することができる。 That is, the laser processing apparatus 110 processes the processing object 100 by irradiating the processing object 100 with the laser L passing through the laser irradiation nozzle 76A. At this time, since the refrigerant R is injected from the refrigerant injection nozzle 76B outside the laser L along the traveling direction of the laser L, the part to be processed by the laser L of the workpiece 100 is cooled. Further, since the shielding gas S is injected outside the refrigerant R, interference between the refrigerant R and the atmosphere is prevented, and a situation in which moisture in the atmosphere freezes and solidifies due to the refrigerant R is prevented. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L. Moreover, since the assist gas A is jetted together with the laser L along the traveling direction of the laser L passing through the laser irradiation nozzle 76A, interference between the laser L and the refrigerant R is further prevented. Even if it freezes and solidifies, it is prevented from being vaporized by the heat of the laser L and generating white smoke. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
　また、本実施形態のレーザ加工装置１１０では、レーザ照射ノズル７６Ａは、通過するレーザＬが接触しないようにレーザＬと隙間を有する内径の貫通孔が形成され、アシストガス供給手段６４は、前記隙間を満たすように貫通孔にアシストガスＡを供給することが好ましい。これにより、アシストガスＡがレーザＬを囲むように噴射されるため、レーザＬと冷媒Ｒとの干渉を防ぐ作用効果を顕著に得ることができる。 Further, in the laser processing apparatus 110 of the present embodiment, the laser irradiation nozzle 76A is formed with a through hole having an inner diameter having a gap with the laser L so that the passing laser L does not come in contact, and the assist gas supply means 64 has the gap It is preferable to supply the assist gas A to the through hole so as to satisfy the above condition. Thereby, since the assist gas A is injected so as to surround the laser L, the effect of preventing the interference between the laser L and the refrigerant R can be obtained remarkably.
　また、本実施形態のレーザ加工装置１１０では、冷媒噴射ノズル７６Ｂから噴射させる冷媒Ｒの噴射圧力Ｐ２と、シールドガス噴射ノズル７６Ｃから噴射させるシールドガスＳの噴射圧力Ｐ３との関係を、Ｐ２＞Ｐ３に設定することが好ましい。このシールドガスＳの噴射圧力Ｐ３および冷媒Ｒの噴射圧力Ｐ２の設定は、制御部２４によりシールドガス供給部６８ａおよび冷媒供給部６６ａの駆動を制御することで実施される。これにより、シールドガスＳが冷媒Ｒよりも圧力が低く、シールドガスＳが冷媒Ｒ側に混入することを防ぐため、レーザＬと冷媒Ｒとの干渉を防ぐ作用効果を顕著に得ることができる。 In the laser processing apparatus 110 of the present embodiment, the relationship between the injection pressure P2 of the refrigerant R injected from the refrigerant injection nozzle 76B and the injection pressure P3 of the shield gas S injected from the shield gas injection nozzle 76C is expressed as P2> P3. It is preferable to set to. The setting of the injection pressure P3 of the shield gas S and the injection pressure P2 of the refrigerant R is performed by controlling the drive of the shield gas supply unit 68a and the refrigerant supply unit 66a by the control unit 24. Thereby, since the shield gas S has a lower pressure than the refrigerant R and prevents the shield gas S from being mixed into the refrigerant R side, the effect of preventing the interference between the laser L and the refrigerant R can be obtained significantly.
　なお、レーザ照射ノズル７６Ａから噴射させるアシストガスＡの噴射圧力Ｐ１と、冷媒噴射ノズル７６Ｂから噴射させる冷媒Ｒの噴射圧力Ｐ２と、シールドガス噴射ノズル７６Ｃから噴射させるシールドガスＳの噴射圧力Ｐ３との関係は、Ｐ１≧Ｐ２＞Ｐ３に設定することが好ましく、冷媒ＲがアシストガスＡ側に混入することも防ぐため、レーザＬと冷媒Ｒとの干渉を防ぐ作用効果を顕著に得ることができる。 Note that the injection pressure P1 of the assist gas A injected from the laser irradiation nozzle 76A, the injection pressure P2 of the refrigerant R injected from the refrigerant injection nozzle 76B, and the injection pressure P3 of the shield gas S injected from the shield gas injection nozzle 76C. The relationship is preferably set to P1 ≧ P2> P3, and the refrigerant R is also prevented from being mixed into the assist gas A, so that the effect of preventing the interference between the laser L and the refrigerant R can be obtained remarkably.
　また、本実施形態のレーザ加工装置１１０では、図６に示すように、加工対象物１００の加工面１００ａにおいて、冷媒Ｒの噴射範囲の最内側のレーザＬの焦点Ｆからの距離Ｗは、０．１ｍｍ以上５０ｍｍ以下の範囲とすることが好ましい。０．１ｍｍ以上とすることでレーザＬと冷媒Ｒとの干渉を防ぐ作用効果を良好に得ることができ、５０ｍｍ以下とすることで加工部位を冷却する作用効果を良好に得ることができる。このような距離Ｗとするため、冷媒噴射ノズル７６ＢにおけるレーザＬに沿う角度を設定する。 In the laser processing apparatus 110 of the present embodiment, as shown in FIG. 6, the distance W from the focal point F of the laser L on the innermost side of the injection range of the coolant R is 0 on the processing surface 100a of the processing object 100. It is preferable to be in the range of 1 mm or more and 50 mm or less. When the thickness is 0.1 mm or more, the effect of preventing interference between the laser L and the refrigerant R can be obtained favorably, and when the thickness is 50 mm or less, the effect of cooling the processing site can be favorably obtained. In order to set such a distance W, an angle along the laser L in the refrigerant injection nozzle 76B is set.
　なお、加工対象物１００をレーザＬにて切断などの加工をするにあたりレーザＬの照射位置を加工対象物１００の加工面１００ａに沿って移動させるが（加工工程）、この場合、冷媒Ｒの噴射は、レーザＬの移動方向の前側では行わず後側のみとしてもよい（冷媒噴射工程）。すなわち、レーザＬの移動方向の前側に冷媒Ｒを噴射してもレーザＬの熱影響がない（熱影響が生じる前）加工部位を冷却することになり効果的ではないため、冷媒Ｒの噴射をレーザＬの移動方向の後側のみとする。この場合、例えば、冷媒噴射ノズル７６Ｂは、レーザ照射ノズル７６Ａの周りを囲むように円環状に配置された複数の穴とし、各穴に対して選択的に冷媒Ｒを供給する開閉弁などを有した切換機構を備えることで実現できる。 In addition, when processing the processing object 100 with the laser L, such as cutting, the irradiation position of the laser L is moved along the processing surface 100a of the processing object 100 (processing process). May not be performed on the front side in the moving direction of the laser L but only on the rear side (refrigerant injection step). That is, even if the refrigerant R is injected to the front side in the moving direction of the laser L, there is no thermal influence of the laser L (before the thermal influence occurs), and this is not effective. Only the rear side in the moving direction of the laser L is assumed. In this case, for example, the refrigerant injection nozzle 76B has a plurality of holes arranged in an annular shape so as to surround the laser irradiation nozzle 76A, and has an on-off valve that selectively supplies the refrigerant R to each hole. This can be realized by providing the switching mechanism.
　なお、図には明示しないが、レーザＬを照射する加工対象物１００の加工面１００ａとは反対側の面から冷媒Ｒをさらに噴射できるように、別の冷媒噴射ノズルを有してもよい。この別の冷媒噴射ノズルへの冷媒の供給は、上述した冷媒供給手段６６で行う。このようにすることで、加工対象物１００の加工部位の冷却効率を向上することができる。 Although not clearly shown in the figure, another coolant injection nozzle may be provided so that the coolant R can be further injected from the surface opposite to the processing surface 100a of the processing object 100 irradiated with the laser L. The refrigerant is supplied to the other refrigerant injection nozzle by the refrigerant supply means 66 described above. By doing in this way, the cooling efficiency of the process site | part of the workpiece 100 can be improved.
［実施形態３］
　以下、図９から図１１を用い、本実施形態のレーザ加工方法について説明する。図９から図１１は、本実施形態に係るレーザ加工方法の工程の説明図である。 [Embodiment 3]
Hereinafter, the laser processing method of this embodiment will be described with reference to FIGS. 9 to 11 are explanatory diagrams of steps of the laser processing method according to the present embodiment.
　本実施形態のレーザ加工方法は、図９から図１１に示すように、レーザＬにより加工対象物１００を所定の切断線ＣＬ１で切断する場合の加工方法である。 The laser processing method of the present embodiment is a processing method in the case where the processing object 100 is cut by a predetermined cutting line CL1 with a laser L as shown in FIGS.
　まず、図９および図１０に示すように、予備加工工程として、切断線ＣＬ１を残しつつ当該切断線ＣＬ１に沿う予備切断線ＣＬ２上にレーザＬを照射して加工対象物１００を切断する。 First, as shown in FIGS. 9 and 10, as a preliminary processing step, the workpiece 100 is cut by irradiating the laser L onto the preliminary cutting line CL2 along the cutting line CL1 while leaving the cutting line CL1.
　次に、図１０および図１１に示すように、本加工工程として、予備加工工程による予備切断線ＣＬ２の切断面に向けて冷媒Ｒを噴射しつつ切断線ＣＬ１上にレーザＬを照射して加工対象物１００を切断する。 Next, as shown in FIG. 10 and FIG. 11, as the main processing step, processing is performed by irradiating laser L onto the cutting line CL1 while injecting the coolant R toward the cut surface of the preliminary cutting line CL2 in the preliminary processing step. The object 100 is cut.
　レーザＬは、加工対象物１００の厚さＤ方向に向けて照射され、図の奥行き方向が進行方向となる。冷媒Ｒの噴射については、レーザＬによる加工対象物１００の厚さＤ方向への焦点移動に伴って厚さＤ方向に噴射位置を移動できるように噴射ノズルが設けられていることが好ましく、レーザＬの進行に伴って進行方向に噴射位置を移動できるように噴射ノズルが設けられていることが好ましい。また、冷媒Ｒの噴射方向は、予備切断線ＣＬ２の切断面に直交する方向であっても、予備切断線ＣＬ２の切断面に傾斜する方向であってもよい。 The laser L is irradiated toward the thickness D direction of the workpiece 100, and the depth direction in the figure is the traveling direction. As for the injection of the refrigerant R, it is preferable that an injection nozzle is provided so that the injection position can be moved in the thickness D direction as the laser L moves the focal point of the workpiece 100 in the thickness D direction. It is preferable that an injection nozzle is provided so that the injection position can be moved in the traveling direction as L progresses. Further, the injection direction of the refrigerant R may be a direction orthogonal to the cut surface of the preliminary cutting line CL2, or may be a direction inclined to the cutting surface of the preliminary cutting line CL2.
　このようなレーザ加工方法によれば、切断線ＣＬ１を残しつつ当該切断線ＣＬ１に沿う予備切断線ＣＬ２上にレーザＬを照射して加工対象物１００を切断し、予備切断線ＣＬ２の切断面に向けて冷媒Ｒを噴射しつつ切断線ＣＬ１上にレーザＬを照射して加工対象物１００を切断することで、切断線ＣＬ１で切断する際に、冷媒Ｒにより加工対象物１００の加工部位への熱影響を抑制することができる。この結果、レーザＬに影響を及ぼすことなく冷媒Ｒを加工対象物１００の加工部位に供給することができる。 According to such a laser processing method, the processing object 100 is cut by irradiating the laser L onto the preliminary cutting line CL2 along the cutting line CL1 while leaving the cutting line CL1, and the cutting surface of the preliminary cutting line CL2 is cut. By irradiating the laser L onto the cutting line CL1 and cutting the workpiece 100 while injecting the refrigerant R toward the cutting line CL1, when cutting along the cutting line CL1, the coolant R applies the processing object 100 to the processing site. Thermal effects can be suppressed. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
　特に、加工対象物１００の厚さＤが大きい場合は、加工対象物１００の厚さＤを貫通するまでにレーザＬを長時間照射しなければならず加工部位への熱影響が顕著であるが、本実施形態のレーザ加工方法では、切断線ＣＬ１の加工部位に熱影響が生じない範囲で予備切断線ＣＬ２を設定して切断し、その後に予備切断線ＣＬ２の切断面側から冷媒Ｒを噴射しながら切断線ＣＬ１上で切断を行うことから、切断線ＣＬ１を切断する際の加工部位への熱影響を抑制することに効果的である。このため、切断線ＣＬ１の加工部位に熱影響が生じない範囲で予備切断線ＣＬ２を切断するため、および冷媒Ｒの噴射により加工部位を効果的に冷却するため、レーザＬの強度や加工対象物１００の材質を考慮して、切断線ＣＬ１からの予備切断線ＣＬ２の距離Ｈを設定する。 In particular, when the thickness D of the workpiece 100 is large, the laser L must be irradiated for a long time before penetrating the thickness D of the workpiece 100, but the thermal effect on the workpiece is significant. In the laser processing method of the present embodiment, the preliminary cutting line CL2 is set and cut within a range in which no thermal influence is generated on the processing portion of the cutting line CL1, and then the refrigerant R is injected from the cut surface side of the preliminary cutting line CL2. However, since the cutting is performed on the cutting line CL1, it is effective to suppress the thermal influence on the processing site when cutting the cutting line CL1. For this reason, in order to cut the preliminary cutting line CL2 within a range in which the processing part of the cutting line CL1 is not affected by heat, and to cool the processing part effectively by injection of the refrigerant R, the intensity of the laser L and the object to be processed Considering 100 materials, the distance H of the preliminary cutting line CL2 from the cutting line CL1 is set.
［実施形態４］
　以下、図１２から図１４を用い、本実施形態のレーザ加工方法の他の例について説明する。図１２から図１４は、本実施形態に係るレーザ加工方法の他の例の工程の説明図である。 [Embodiment 4]
Hereinafter, another example of the laser processing method of the present embodiment will be described with reference to FIGS. FIG. 12 to FIG. 14 are explanatory diagrams of processes of another example of the laser processing method according to the present embodiment.
　本実施形態のレーザ加工方法は、図１２から図１４に示すように、レーザＬにより加工対象物１００に所定の貫通孔ＴＨ１を切削する場合の加工方法である。 The laser processing method of the present embodiment is a processing method in the case where a predetermined through hole TH1 is cut in the workpiece 100 by the laser L, as shown in FIGS.
　まず、図１２および図１３に示すように、予備加工工程として、貫通孔ＴＨ１の範囲内に、貫通孔ＴＨ１の径よりも小径の予備貫通孔ＴＨ２を切削する。予備貫通孔ＴＨ２は複数であってもよく、単一であってもよい。 First, as shown in FIGS. 12 and 13, as a preliminary machining step, a preliminary through hole TH2 having a diameter smaller than the diameter of the through hole TH1 is cut within the range of the through hole TH1. The preliminary through hole TH2 may be plural or single.
　次に、図１３および図１４に示すように、本加工工程として、予備加工工程による予備貫通孔ＴＨ２内に冷媒Ｒを噴射しつつレーザＬにて貫通孔ＴＨ１を切削する。 Next, as shown in FIGS. 13 and 14, as the main machining step, the through hole TH1 is cut by the laser L while jetting the coolant R into the preliminary through hole TH2 in the preliminary machining step.
　レーザＬは、加工対象物１００の厚さＤ方向に向けて照射され、貫通孔ＴＨ１の孔の周方向が進行方向となる。冷媒Ｒの噴射については、レーザＬの進行方向に沿って行う。また、冷媒Ｒは、レーザＬの照射方向とは逆方向から、すなわち予備貫通孔ＴＨ２の反対側の開口から噴射してもよい。 The laser L is irradiated toward the thickness D direction of the workpiece 100, and the circumferential direction of the through hole TH1 is the traveling direction. The injection of the refrigerant R is performed along the traveling direction of the laser L. Further, the refrigerant R may be injected from the direction opposite to the irradiation direction of the laser L, that is, from the opening on the opposite side of the preliminary through hole TH2.
　このようなレーザ加工方法によれば、貫通孔ＴＨ１の範囲内に貫通孔ＴＨ１の径よりも小径の予備貫通孔ＴＨ２を切削し、予備貫通孔ＴＨ２内に冷媒Ｒを噴射しつつ貫通孔ＴＨ１を切削することで、貫通孔ＴＨ１を切削する際に、冷媒Ｒにより加工対象物１００の加工部位への熱影響を抑制することができる。この結果、レーザＬに影響を及ぼすことなく冷媒Ｒを加工対象物１００の加工部位に供給することができる。 According to such a laser processing method, the preliminary through-hole TH2 having a diameter smaller than the diameter of the through-hole TH1 is cut in the range of the through-hole TH1, and the coolant R is injected into the preliminary through-hole TH2 while the through-hole TH1 is formed. By cutting, when the through-hole TH1 is cut, the refrigerant R can suppress the thermal influence on the processing part of the processing object 100. As a result, the refrigerant R can be supplied to the processing portion of the processing object 100 without affecting the laser L.
　特に、加工対象物１００の厚さＤが大きい場合は、加工対象物１００の厚さＤを貫通するまでにレーザＬを長時間照射しなければならず加工部位への熱影響が顕著であるが、本実施形態のレーザ加工方法では、貫通孔ＴＨ１の加工部位に熱影響が生じない範囲で予備貫通孔ＴＨ２の位置を設定して切削し、その後に予備貫通孔ＴＨ２内に冷媒Ｒを噴射しながら貫通孔ＴＨ１の切削を行うことから、貫通孔ＴＨ１を切削する際の加工部位への熱影響を抑制することに効果的である。このため、貫通孔ＴＨ１の加工部位に熱影響が生じない範囲で予備貫通孔ＴＨ２を切削するため、および冷媒Ｒの噴射により効果的に加工部位を冷却するため、レーザＬの強度や加工対象物１００の材質を考慮して、貫通孔ＴＨ１の周面に沿う切削線からの予備貫通孔ＴＨ２の距離を設定する。 In particular, when the thickness D of the workpiece 100 is large, the laser L must be irradiated for a long time before penetrating the thickness D of the workpiece 100, but the thermal effect on the workpiece is significant. In the laser processing method of this embodiment, the position of the preliminary through hole TH2 is set and cut within a range in which no thermal influence is generated on the processed portion of the through hole TH1, and then the refrigerant R is injected into the preliminary through hole TH2. However, since the through-hole TH1 is cut, it is effective to suppress the thermal influence on the machining site when the through-hole TH1 is cut. For this reason, in order to cut the preliminary through-hole TH2 within a range in which no thermal influence is generated on the machining site of the through-hole TH1, and to cool the machining site effectively by the injection of the refrigerant R, the intensity of the laser L and the object to be machined Considering the material of 100, the distance of the preliminary through hole TH2 from the cutting line along the peripheral surface of the through hole TH1 is set.
　なお、上述した各実施形態において、加工対象物１００は、レーザＬの加工により熱影響を受けやすい、炭素繊維強化プラスチック（ＣＦＲＰ：Carbon　Fiber　Reinforced　Plastic）や、炭素繊維強化プラスチックとチタンなどの金属材とが重ね合わせたものが適用されることが好ましい。このような加工対象物１００をレーザＬにて加工する際に、冷媒Ｒにより加工部位を冷却するにあたり、レーザＬに影響を及ぼすことなく冷媒Ｒを加工対象物の加工部位に供給することができる。 In each of the above-described embodiments, the workpiece 100 is a carbon fiber reinforced plastic (CFRP: Carbon Fiber Reinforced Plastic), or a metal material such as carbon fiber reinforced plastic and titanium, which is easily affected by laser L processing. It is preferable to apply a superposition of and. When such a workpiece 100 is machined by the laser L, the coolant R can be supplied to the workpiece of the workpiece without affecting the laser L when the coolant R cools the workpiece. .
　１０　レーザ加工装置
　１１０　レーザ加工装置
　６４　アシストガス供給手段
　６６　冷媒供給手段
　６８　シールドガス供給手段
　７４　集光光学系
　７６Ａ　レーザ照射ノズル
　７６Ｂ　冷媒噴射ノズル
　７６Ｃ　シールドガス噴射ノズル
　１００　加工対象物 DESCRIPTION OF SYMBOLS 10 Laser processing apparatus 110 Laser processing apparatus 64 Assist gas supply means 66 Refrigerant supply means 68 Shield gas supply means 74 Condensing optical system 76A Laser irradiation nozzle 76B Refrigerant injection nozzle 76C Shield gas injection nozzle 100 Processing object

Claims (9)

  1. 　集光光学系から照射されるレーザを通過させる筒状のレーザ照射ノズルと、
    　前記レーザ照射ノズルを通過するレーザの進行方向に沿って前記レーザ照射ノズルからアシストガスを噴射させるアシストガス供給手段と、
    　前記レーザ照射ノズルの外側に前記レーザと同軸に独立して配置された円環状の冷媒噴射ノズルと、
    　前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記冷媒噴射ノズルから冷媒を噴射させる冷媒供給手段と、
    　を有するレーザ加工装置。     A cylindrical laser irradiation nozzle that passes the laser irradiated from the condensing optical system;
    Assist gas supply means for injecting an assist gas from the laser irradiation nozzle along the traveling direction of the laser passing through the laser irradiation nozzle;
    An annular refrigerant injection nozzle disposed independently and coaxially with the laser outside the laser irradiation nozzle;
    Refrigerant supply means for injecting the refrigerant from the refrigerant injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle;
    A laser processing apparatus.
  2. 　集光光学系から照射されるレーザを通過させる筒状のレーザ照射ノズルと、
    　前記レーザ照射ノズルを通過するレーザの進行方向に沿って前記レーザ照射ノズルからアシストガスを噴射させるアシストガス供給手段と、
    　前記レーザ照射ノズルの外側に前記レーザと同軸の円周上に配置した複数の穴からなる冷媒噴射ノズルと、
    　前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記冷媒噴射ノズルから冷媒を噴射させる冷媒供給手段と、
    　を有するレーザ加工装置。     A cylindrical laser irradiation nozzle that passes the laser irradiated from the condensing optical system;
    Assist gas supply means for injecting an assist gas from the laser irradiation nozzle along the traveling direction of the laser passing through the laser irradiation nozzle;
    A refrigerant injection nozzle comprising a plurality of holes arranged on the circumference coaxial with the laser on the outside of the laser irradiation nozzle;
    Refrigerant supply means for injecting the refrigerant from the refrigerant injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle;
    A laser processing apparatus.
  3. 　前記レーザ照射ノズルから噴射させる前記アシストガスの噴射圧力Ｐ１と、前記冷媒噴射ノズルから噴射させる前記冷媒の噴射圧力Ｐ２との関係を、Ｐ２＜Ｐ１に設定する請求項１または２に記載のレーザ加工装置。 The laser processing according to claim 1 or 2, wherein a relationship between an injection pressure P1 of the assist gas injected from the laser irradiation nozzle and an injection pressure P2 of the refrigerant injected from the refrigerant injection nozzle is set to P2 <P1. apparatus.
  4. 　前記レーザ照射ノズルの外側であって、且つ、前記冷媒噴射ノズルの外側に前記レーザと同軸に独立して配置された円環状のシールドガス噴射ノズルと、
    　前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記シールドガス噴射ノズルからシールドガスを噴射させるシールドガス供給手段と、
    　を有する請求項１または２に記載のレーザ加工装置。     An annular shield gas injection nozzle arranged outside the laser irradiation nozzle and outside the coolant injection nozzle independently and coaxially with the laser;
    Shielding gas supply means for injecting shielding gas from the shielding gas injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle;
    The laser processing apparatus according to claim 1, comprising:
  5. 　前記レーザ照射ノズルの外側であって、且つ、前記冷媒噴射ノズルの外側に前記レーザと同軸の円周上に配置した複数の穴からなるシールドガス噴射ノズルと、
    　前記レーザ照射ノズルを通過する前記レーザの進行方向に沿って前記シールドガス噴射ノズルからシールドガスを噴射させるシールドガス供給手段と、
    　を有する請求項１または２に記載のレーザ加工装置。     A shield gas injection nozzle comprising a plurality of holes arranged on the circumference coaxial with the laser outside the laser irradiation nozzle and outside the refrigerant injection nozzle;
    Shielding gas supply means for injecting shielding gas from the shielding gas injection nozzle along the traveling direction of the laser passing through the laser irradiation nozzle;
    The laser processing apparatus according to claim 1, comprising:
  6. 　前記冷媒噴射ノズルから噴射させる前記冷媒の噴射圧力Ｐ２と、前記シールドガス噴射ノズルから噴射させる前記シールドガスの噴射圧力Ｐ３との関係を、Ｐ２＞Ｐ３に設定する請求項４または５に記載のレーザ加工装置。 The laser according to claim 4 or 5, wherein a relationship between an injection pressure P2 of the refrigerant injected from the refrigerant injection nozzle and an injection pressure P3 of the shield gas injected from the shield gas injection nozzle is set to P2> P3. Processing equipment.
  7. 　加工対象物にレーザを照射しつつ前記レーザを所定方向に移動する加工工程と、
    　前記加工工程の際に前記レーザの移動方向の後側において前記加工対象物に向けて冷媒を噴射する冷媒噴射工程と、
    　を含むレーザ加工方法。     A processing step of moving the laser in a predetermined direction while irradiating the processing target with the laser;
    A refrigerant injection step of injecting a refrigerant toward the object to be processed on the rear side in the moving direction of the laser during the processing step;
    A laser processing method including:
  8. 　加工対象物をレーザにて切断加工するレーザ加工方法であって、
    　所定の切断線を残しつつ前記切断線に沿って前記加工対象物を切断する予備加工工程と、
    　前記予備加工工程による切断面に冷媒を噴射しつつ前記切断線上で前記加工対象物を切断する本加工工程と、
    　を含むレーザ加工方法。     A laser processing method for cutting a workpiece with a laser,
    A preliminary processing step of cutting the workpiece along the cutting line while leaving a predetermined cutting line;
    A main processing step of cutting the object to be processed on the cutting line while injecting a coolant onto the cut surface of the preliminary processing step;
    A laser processing method including:
  9. 　加工対象物をレーザにて貫通加工するレーザ加工方法であって、
    　所定の貫通孔の範囲内に前記貫通孔の径よりも小径の予備貫通孔を切削する予備加工工程と、
    　前記予備加工工程による前記予備貫通孔内に冷媒を噴射しつつ所定の前記貫通孔を切削する本加工工程と、
    　を含むレーザ加工方法。     A laser processing method for penetrating a workpiece with a laser,
    A pre-processing step of cutting a preliminary through hole having a diameter smaller than the diameter of the through hole within a predetermined through hole;
    A main processing step of cutting the predetermined through-hole while injecting a refrigerant into the preliminary through-hole by the preliminary processing step;
    A laser processing method including:
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CN113894444A (en) * 2021-09-28 2022-01-07 武汉大学 Water-guided pulse laser processing system and method based on interference light path design
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