WO2017209149A1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
WO2017209149A1
WO2017209149A1 PCT/JP2017/020154 JP2017020154W WO2017209149A1 WO 2017209149 A1 WO2017209149 A1 WO 2017209149A1 JP 2017020154 W JP2017020154 W JP 2017020154W WO 2017209149 A1 WO2017209149 A1 WO 2017209149A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
emitting device
led
light emitting
package
Prior art date
Application number
PCT/JP2017/020154
Other languages
French (fr)
Japanese (ja)
Inventor
田村　量
賢治 草野
友一 秋山
今井　貞人
高史 飯野
龍一 羽田
Original Assignee
シチズン電子株式会社
シチズン時計株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シチズン電子株式会社, シチズン時計株式会社 filed Critical シチズン電子株式会社
Priority to JP2018520938A priority Critical patent/JPWO2017209149A1/en
Publication of WO2017209149A1 publication Critical patent/WO2017209149A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to a light emitting device.
  • a COB (Chip On Board) LED package in which a plurality of LED (light emitting diode) elements are mounted on one substrate and these LED elements are integrally sealed with a translucent resin containing a phosphor.
  • LED light emitting diode
  • a translucent resin containing a phosphor a translucent resin containing a phosphor.
  • white light or the like can be obtained according to the application by mixing light from each LED element and light obtained by exciting the phosphor with the light.
  • Patent Document 1 discloses a high-luminance light-emitting element having a base having thermal conductivity, a wiring board having a conductive portion fixed to the base, and a light-emitting element chip mounted on a mounting area of the base. Is described.
  • the base has a heat dissipation surface for dissipating heat from the light-emitting element chip, and the conductive portion of the wiring board is connected to the light-emitting element chip by an electrical connection member and one of the conductive portions.
  • An electrical connection surface for supplying a drive current for driving the light emitting element chip is provided in the portion, and the electrical connection surface and the heat dissipation surface of the base are arranged to face each other.
  • an LED chip is mounted on an electrode pattern formed on the surface of a base insulating substrate, the LED chip is sealed with a light-transmitting resin, and then a through-hole provided on a substrate on the mounting side.
  • a back-side mounted LED formed by back-side mounting so as to embed a sealing resin portion in a hole is described.
  • a light emitting device In order to increase the amount of light emitted from the light emitting device, it is conceivable to configure a light emitting device by mounting a plurality of COB LED packages on a common circuit board (main circuit board, wiring board, motherboard).
  • a common circuit board main circuit board, wiring board, motherboard.
  • the connection electrode to the external power source is formed on the upper surface of the package substrate, when the LED package is mounted on the upper surface of the circuit substrate, the space between the circuit substrate and the LED package is Difficult to make electrical connection.
  • the light emitting device emits light, heat is generated from each LED package. If a plurality of LED packages are used, the amount of heat generated is increased by the number of LED packages. Therefore, the heat is efficiently released to the outside. Is required.
  • an object of the present invention is to provide a light emitting device that uses a plurality of COB LED packages to increase the amount of emitted light and improve the heat dissipation of these LED packages.
  • Another object of the present invention is to improve the light extraction efficiency of the light emitting device including the LED package mounted on the opening of the circuit board from the back side of the circuit board and the bonding strength of the LED package.
  • a circuit board having an opening, a package board, an LED element mounted on the package board, and a sealing resin for sealing the LED element.
  • the package board is inserted into the opening from the back side of the circuit board.
  • the LED package has an LED package soldered to the back surface of the circuit board, and a heat dissipation board disposed in contact with the package board on the back side of the circuit board.
  • the LED package is soldered to the circuit board.
  • the two opposite corners of the package substrate are solder-connected to the circuit board, the slits are formed so as to correspond to the two corners of the package substrate, It is preferable that the LED package or the heat dissipation board is mechanically fixed at positions corresponding to the two corners.
  • the four corners of the package substrate are soldered to the circuit board, the slits are formed so as to correspond to the four corners of the package substrate, and the circuit board is at a position corresponding to the middle of each side of the package substrate, It is preferably mechanically fixed to the LED package or the heat dissipation substrate.
  • the light emitting device includes a plurality of LED packages, and the circuit board includes a plurality of openings into which the plurality of LED packages are inserted, and the package substrate of each LED package includes an elastic heat dissipation sheet. It is preferable to be in contact with the heat dissipation substrate.
  • the light emitting device has a plurality of LED packages
  • the circuit board has a plurality of openings into which the plurality of LED packages are respectively inserted, and the four corners of the circuit board are mechanically fixed to the heat dissipation board, It is preferable that another slit is formed in the circuit board at positions adjacent to the fixed positions at the four corners of the circuit board.
  • a circuit board having an opening, a package substrate, an LED element mounted on the package substrate, and a sealing resin that seals the LED element are inserted into the opening from the back side of the circuit board,
  • a light-emitting device comprising: a light-reflective ring-shaped resin formed so as to contact an upper surface of a substrate and an end surface of a circuit board in an opening.
  • a circuit board in which a plurality of openings are formed a package board in which connection electrodes to the circuit board are formed on the upper end, a plurality of LED elements mounted on the package board, and a plurality of LED elements are sealed.
  • a plurality of LED packages each having a sealing resin to be stopped, inserted into a plurality of openings from the back side of the circuit board, and having connection electrodes electrically connected to the back side of the circuit board;
  • a light emitting device including a heat dissipation substrate disposed on a back surface side of a circuit board so as to sandwich a package substrate of a plurality of LED packages therebetween.
  • connection electrodes of the plurality of LED packages are solder-connected to the back surface of the circuit board, and the circuit board is slit at positions adjacent to the connection positions where the connection electrodes of the plurality of LED packages are respectively solder-connected. Is preferably formed.
  • connection electrodes of the plurality of LED packages are respectively formed at two opposite corners of the package substrate, the slits are formed to correspond to the two corners of the package substrate, and the circuit board is In addition, it is preferably mechanically fixed to the plurality of LED packages or the heat dissipation substrate at positions corresponding to the other two corners of the package substrate.
  • connection electrodes of the plurality of LED packages are respectively formed at the four corners of the package substrate, the slits are formed so as to correspond to the four corners of the package substrate, and the circuit substrate is in the middle of each side of the package substrate. It is preferable to be mechanically fixed to the plurality of LED packages or the heat dissipation board at a position corresponding to.
  • the package substrates of the plurality of LED packages are in contact with the heat dissipation substrate via elastic heat dissipation sheets.
  • the four corners of the circuit board may be mechanically fixed to the heat dissipation board, and the circuit board may further have other slits formed at positions adjacent to the fixing positions at the four corners of the circuit board. preferable.
  • the light emitting device is formed so that each of the plurality of openings surrounds the sealing resin of the LED package inserted into the opening and contacts the upper surface of the package substrate and the end surface of the circuit board in the opening. It is preferable to further have a light-reflecting cyclic resin.
  • the cyclic resin has a slope inclined so that the diameter of the space portion in the opening becomes larger toward the upper side in the opening.
  • each of the plurality of LED packages further includes a resin frame formed on the package substrate so as to surround the plurality of LED elements and filled with sealing resin therein, and the annular resin has a plurality of openings.
  • the annular resin has a plurality of openings.
  • the height from the upper surface of the heat dissipation substrate to the upper surface of the circuit board in the plurality of openings is preferably larger than the height from the upper surface of the heat dissipation substrate to the upper surface of the sealing resin of the plurality of LED packages.
  • the amount of emitted light is increased by using a plurality of COB LED packages, and the heat dissipation of these LED packages is improved.
  • the stress generated by soldering the LED package to the circuit board is relieved, and the circuit board is less likely to bend.
  • the light extraction efficiency and the bonding strength of the LED package of the light emitting device including the LED package mounted on the opening of the circuit board from the back side of the circuit board are improved.
  • FIG. 1 is a perspective view of a light emitting device 1.
  • FIG. 2 is a top view of the light emitting device 1.
  • FIG. 1 is a side view of a light emitting device 1.
  • FIG. It is a reverse view of the light-emitting device 1 from which the thermal radiation board
  • 3 is a top view of the circuit board 2.
  • FIG. 3 is a cross-sectional view of the light emitting device 1 taken along line VI-VI in FIG. 2.
  • (A) to (D) are perspective views for explaining the structure and manufacturing process of the LED package 4.
  • (A) And (B) is the top view and sectional drawing for demonstrating the effect
  • FIG. 1 is a perspective view of a light emitting device 1.
  • FIG. 2 is a top view of the light emitting device 1.
  • FIG. 1 is a side view of a light emitting device 1.
  • FIG. It is a
  • FIG. It is the elements on larger scale of another light-emitting device 1A.
  • (A) And (B) is the top view and side view of another light-emitting device 1B.
  • (A) to (C) are a top view, a side view, and a partially enlarged view of still another light emitting device 1C.
  • FIG. 16 is a cross-sectional view of the light emitting device 1D along the line XIX-XIX in FIG. It is a fragmentary sectional view of light-emitting device 1D for demonstrating the function of the cyclic resin 56.
  • FIG. It is sectional drawing at the time of using LED package 4 'with the light-emitting device 1D. It is sectional drawing at the time of using LED package 5 by light-emitting device 1D.
  • (A) And (B) is a fragmentary sectional view of light-emitting device 1D at the time of using another cyclic resin 56A, 56B.
  • (A) And (B) is the top view and sectional drawing of another cyclic resin 56C. It is sectional drawing of another LED package 5 '. It is a top view of another light emitting device 1E. It is a figure which shows the example of the shape of the heat sink in the light-emitting device 1E. (A) and (B) explain the stress generated when the LED package is solder-connected to the back side of the circuit board 2 'and the circuit board 2' and the heat dissipation board 3 on the back side thereof are screwed together. It is the top view and sectional drawing for doing. It is sectional drawing which shows the example of the light-emitting device containing a back surface mounting type LED package.
  • the light emitting device 1 has a structure in which a plurality of LED packages 4 are mounted on a circuit board 2 from the back side, and a heat dissipation board 3 is arranged on the back side.
  • FIG. 4 is a rear view of the light emitting device 1 from which the heat dissipation substrate 3 has been removed.
  • the light emitting device 1 has 21 LED packages 4 as light emitting portions, and is used as, for example, various LED light source devices for illumination. However, this 21 is an example, and the number of LED packages 4 is not particularly limited, and may be one, for example.
  • FIG. 5 is a top view of the circuit board 2.
  • the circuit board 2 (main circuit board, wiring board, mother board) is a substantially rectangular insulating board.
  • FR-4 Flume Retardant Type 4
  • FR-4 Flume Retardant Type 4
  • 21 openings 12 for inserting the LED packages 4 are formed on the circuit board 2 at substantially equal intervals.
  • two screw holes 17 and “ ⁇ ”-shaped slits 16 are formed per one opening 12 around each opening 12 in the circuit board 2.
  • the two slits 16 are opposed to each other with the opening 12 interposed therebetween, and the two screw holes 17 are also opposed to each other with the opening 12 interposed therebetween.
  • a total of four of these are formed at the rectangular corners surrounding the opening 12.
  • Each is arranged.
  • a fixing screw 15 is attached to the screw hole 17.
  • two electrodes 13 for connecting the light emitting device 1 to an external power source are formed.
  • the circuit board 2 is for electrically connecting the electrode 13 and the LED package 4 mounted in each opening 12 (that is, a plurality of LED packages 4 to each other).
  • a wiring pattern is formed.
  • each LED package 4 emits light.
  • all the LED packages 4 of the light emitting device 1 may emit light simultaneously, or only some of the LED packages 4 may emit light depending on the wiring pattern on the circuit board 2.
  • the heat dissipation substrate 3 is a rectangular metal substrate disposed on the back side of the circuit board 2 in contact with the package substrates of the plurality of LED packages 4 so that each LED package 4 is sandwiched between the circuit boards 2. Since the heat dissipation substrate 3 functions as a heat sink for releasing the heat generated in each LED package 4 to the outside of the light emitting device 1, it is made of, for example, aluminum or copper having excellent heat resistance and heat dissipation. However, the material of the heat dissipation substrate 3 may be other than aluminum and copper as long as it has excellent heat resistance and heat dissipation. As shown in FIGS. 1 to 3, at the four corners of the circuit board 2 and the heat dissipation board 3, they are fixed to each other by screws 14.
  • FIG. 6 is a cross-sectional view of the light emitting device 1 taken along line VI-VI in FIG.
  • a step is formed in the thickness direction in each opening 12 of the circuit board 2, and the diameter of the opening 12 is larger on the back side than on the top side.
  • Each LED package 4 is a COB LED package, and includes a package substrate 20, an LED element 51, a resin frame 53, and a sealing resin 54, and is inserted into the opening 12 from the back side of the circuit substrate 2.
  • Each LED package 4 is solder-connected to the step portion in the opening 12 from the back surface side of the circuit board 2 at the end of the package substrate 20.
  • the step 12 as shown in FIG. 6 may not be formed in the opening 12 of the circuit board 2, and each LED package 4 is soldered to the back surface of the circuit board 2 outside the opening 12. It may be.
  • FIGS. 7A to 7D are perspective views for explaining the structure and manufacturing process of the LED package 4.
  • the package substrate 20 is configured by attaching an insulating substrate 22 having an opening 221 at the center to the upper surface of the metal substrate 21, and has a rectangular shape as a whole.
  • the upper surface of the metal substrate 21 has a mounting region 211 in which the LED element 51 is mounted at the center, and the rear surface of the metal substrate 21 is in contact with the heat dissipation substrate 3. Since the metal substrate 21 has a function of dissipating heat generated by the LED elements 51 and phosphor particles, which will be described later, toward the heat dissipation substrate 3, the metal substrate 21 is made of, for example, aluminum or copper, similarly to the heat dissipation substrate 3.
  • an arc-shaped wiring pattern 23a is formed on one side of the center line that bisects the opening 221, and an arc-shaped wiring pattern 23b is formed on the other side. It is formed so as to surround it.
  • a connection electrode 24a connected to the wiring pattern 23a is provided at one corner located diagonally on the upper surface of the insulating substrate 22, and a connection electrode 24b connected to the wiring pattern 23b is provided at the other corner, respectively. Is formed.
  • the LED element 51 is, for example, a blue LED made of a gallium nitride compound semiconductor and emitting blue light having an emission wavelength band of about 450 to 460 nm.
  • the emission wavelength band of the LED element 51 is not particularly limited, and the LED element 51 may be, for example, a green LED that emits green light or a red LED that emits red light.
  • the LED element 51 of one LED package 4 is a blue LED, and the LED element 51 of another LED package 4 is a green LED. It may be.
  • FIG. 7B shows an example in which nine LED elements 51 are mounted for ease of illustration, but the number of LED elements 51 included in the LED package 4 is not particularly limited. For example, it may be one.
  • the lower surface of the LED element 51 is fixed to the upper surface of the metal substrate 21 with, for example, a transparent insulating adhesive.
  • the LED element 51 has a pair of element electrodes on the upper surface, and as shown in FIG. 7C, the element electrodes of the adjacent LED elements 51 are mutually connected by bonding wires 52 (hereinafter simply referred to as wires 52). Is electrically connected.
  • a wire 52 coming out of the LED element 51 located on the outer peripheral side of the mounting region 211 is connected to the wiring pattern 23 a or the wiring pattern 23 b of the insulating substrate 22. Thereby, a current is supplied to each LED element 51 through the wire 52.
  • the resin frame 53 is a circular frame made of, for example, white resin in accordance with the size of the mounting region 211, and surrounds the LED element 51 mounted on the mounting region 211 on the upper surface of the insulating substrate 22.
  • the wiring patterns 23a and 23b are fixed at positions overlapping with each other.
  • the resin frame 53 is a dam material for preventing the sealing resin 54 from flowing out, and the light emitted from the LED element 51 to the side is above the LED package 4 (on the upper surface side of the circuit board 2). Reflect towards.
  • the sealing resin 54 is made of, for example, a colorless and transparent thermosetting resin such as an epoxy resin or a silicone resin.
  • the sealing resin 54 is filled in a space on the mounting region 211 surrounded by the resin frame 53, and the LED element 51 and the wire 52 is integrally covered and protected (sealed).
  • the upper surface of the circuit board 2 is higher than the upper surfaces of the resin frame 53 and the sealing resin 54, but these heights are the same or reversed depending on the thickness of the circuit board 2. You may do it.
  • the sealing resin 54 may contain a phosphor that is excited by the LED element 51.
  • the sealing resin 54 may contain a yellow phosphor such as YAG (Yttrium Aluminum Garnet).
  • the LED package 4 emits white light obtained by mixing the blue light from the LED element 51 and the yellow light obtained by exciting the yellow phosphor thereby.
  • the sealing resin 54 may contain, for example, a plurality of types of phosphors such as a yellow phosphor and a red phosphor, or may contain different types of phosphors for each LED package 4.
  • a plurality of LED elements 51 are mounted in the mounting region 211 of the package substrate 20 shown in FIG.
  • the LED elements 51 are connected to each other by wires 52 and are electrically connected to the wiring patterns 23 a and 23 b through the wires 52.
  • a resin frame 53 is formed around the opening 221 on the upper surface of the insulating substrate 22, and then a region surrounded by the resin frame 53 is filled with the sealing resin 54. The Thereby, the LED package 4 shown in FIG. 6 is completed.
  • the shape of the opening 221 of the insulating substrate 22 in the LED package 4 may be rectangular, unlike the illustrated example.
  • the mounting area 211 of the metal substrate 21 and the resin frame 53 are also rectangular.
  • the mounting area 211 may be rectangular and the LED elements 51 may be arranged in a rectangular lattice.
  • the opening 12 of the circuit board 2 may be rectangular, unlike the illustrated example.
  • the LED package 4 is mounted on each opening 12 of the circuit board 2 from the back surface side. Therefore, even a COB LED package having no electrode on the back surface of the package substrate can be easily mounted. It is possible to easily increase the amount of emitted light. Further, in the light emitting device 1, the heat dissipation substrate 3 is disposed in contact with the package substrate of each LED package 4, and the heat generated in each LED package 4 is released to the outside of the device through the heat dissipation substrate 3. Will improve. The same applies to the light emitting devices 1A to 1E described below.
  • FIG. 28A illustrates the stress generated when the LED package is solder-connected to the back side of the circuit board 2 ′ and the circuit board 2 ′ and the heat dissipation board 3 on the back side thereof are screwed.
  • FIG. FIG. 28B is a cross-sectional view along the line XXVIIIB-XXVIIIB shown in FIG.
  • an LED package in which a circular resin frame 53 is formed on the upper surface of a rectangular package substrate 20 and an LED element (not shown) is mounted on the inner region and sealed with a sealing resin 54 is the circuit substrate 2.
  • the circular openings 12 ' are connected to the circuit board 2' from the back side by solders 25a and 25b.
  • the back surface side of the package substrate 20 is in contact with the heat dissipation substrate 3, and the circuit board 2 ′ is fixed to the heat dissipation substrate 3 with the LED package interposed therebetween via two screws 15.
  • FIGS. 8A and 8B are a top view and a cross-sectional view for explaining the function of the slit 16 in the circuit board 2 of the light emitting device 1, respectively.
  • FIG. 8A is a partially enlarged view of the upper surface of the circuit board 2, and the position of the package board 20 of the LED package 4 is also indicated by a broken line.
  • FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB shown in FIG.
  • the package substrate 20 is connected to the wiring pattern on the back surface side of the circuit board 2 by solder 25a and 25b at two opposing corners where the connection electrodes 24a and 24b are formed. ing.
  • the slit 16 of the circuit board 2 is formed in the vicinity of the connection position so as to correspond to the two corners of the LED package 4 where the solder 25a and 25b are connected. In other words, the slit 16 is formed at a position adjacent to a connection position where each LED package 4 is solder-connected.
  • the shape of the slit 16 is not particularly limited, for example, may be a straight line shape or a curved shape, unlike the “ ⁇ ” shape shown in the figure.
  • the circuit board 2 is fixed to the package board 20 (LED package 4) by screws 15 at positions corresponding to the other two corner portions of the package board 20 that are not soldered.
  • the fixing means is not limited to a screw as long as the circuit board 2 and the package substrate 20 are mechanically fixed.
  • the circuit board 2 and the heat dissipation board 3 may be mechanically fixed by screws 15 around the package board 20 (opening 12).
  • a horizontal stress Fh acts on the circuit board 2 'and the package board 20 at the joints formed by the solders 25a and 25b. Further, by screwing the circuit board 2, the stress Fv in the vertical direction also acts on the circuit board 2 as shown in FIG. However, in the circuit board 2, since the slit 16 is formed in the vicinity of the connection position of the solders 25a and 25b, a reverse force Fh ′ that cancels the horizontal stress Fh also acts, and this results from the solder connection. Stress is relieved. In addition, since the slit 16 is formed in the circuit board 2, a reverse force Fv ′ that cancels the stress Fv in the vertical direction also acts, so that the stress caused by screwing is also alleviated.
  • FIG. 9 is a cross-sectional view of another LED package 4 '.
  • the LED package 4 ′ is different from the LED package 4 in that it has a ceramic substrate 30 instead of the package substrate 20 in which the metal substrate 21 and the insulating substrate 22 are bonded together, but otherwise has the same configuration as the LED package 4.
  • the ceramic substrate 30 is also an example of a package substrate, and the light emitting device 1 may have an LED package 4 ′ shown in FIG. 9 instead of the LED package 4.
  • the ceramic substrate 30 is a flat substrate on which a wiring pattern and connection electrodes are formed and on which the LED elements 51 are mounted.
  • the ceramic substrate 30 also functions as the metal substrate 21 and the insulating substrate 22 of the LED package 4.
  • the package substrate can be a flat substrate having no opening. Further, although the ceramic substrate has a property of being easily cracked, since the stress relaxation effect can be obtained as described above by providing the slit 16 in the circuit substrate 2, even when the ceramic substrate is used as the package substrate, the ceramic substrate is cracked. Can be prevented.
  • FIG. 10 is a cross-sectional view of yet another LED package 5.
  • the LED package 5 is different from the LED package 4 in that it has a lead frame 40 instead of the package substrate 20 and a lens resin 55 is added, but has the same configuration as the LED package 4 in other points.
  • the lead frame 40 is also an example of a package substrate, and the light emitting device 1 may have the LED package 5 shown in FIG.
  • the lead frame 40 is electrically connected to the LED element 51 and the circuit board 2, the mounting part 41 having the LED element 51 mounted on the upper surface and the back surface being in contact with the heat dissipation board 3, and being thinner than the mounting part 41. Electrode portions 44a and 44b. Insulating resin 42 is filled between the mounting portion 41 and the electrode portions 44a and 44b, and between the electrode portions 44a and 44b and the heat dissipation substrate 3 to be electrically insulated from each other. If the LED package 5 having the lead frame 40 is used, it is possible to ensure both electrical insulation between the LED package and the heat dissipation board and heat dissipation from the LED package to the heat dissipation board.
  • the lens resin 55 is a substantially hemispherical member formed on the upper surface side of the opening 12 in which the LED package 5 is inserted.
  • the lens resin 55 covers the entire sealing resin 54 and extends from the LED element 51 through the sealing resin 54.
  • the emitted light is condensed.
  • the lens resin 55 is formed by injection molding using, for example, a transparent resin such as a silicone resin after the LED package 5 is mounted in the opening 12 from the back side of the circuit board 2. Even when the LED packages 4 and 4 ′ described above are used, such a lens resin may be formed on the upper surface side of the circuit board 2.
  • FIG. 11 is a partially enlarged view of another light emitting device 1A.
  • FIG. 11 only the part of one LED package in the light emitting device 1A is shown in an enlarged manner.
  • the LED package shown in FIG. 11 is the same as the LED package 4 described above. However, unlike the LED package 4, the four corners of the package substrate 20 are formed on the back side of the circuit board 2A by solder 25a, 25b, 25c, 25d. Connected to the wiring pattern.
  • the circuit board 2A has four slits 16A per LED package.
  • the slit 16A has the same “ ⁇ ” shape as the slit 16, and is located in the vicinity of the connection position so as to correspond to the four corners of the LED package 4 where the solder 25a, 25b, 25c, and 25d are connected. Is formed.
  • the circuit board 2A is fixed to the heat dissipation board 3 with four screws 15A at positions corresponding to the middle of the sides of the package board 20 of each LED package 4.
  • the screw 15A may fix the circuit board 2A and the package board 20.
  • the positions of the slits are not limited to two, but may be four.
  • the stress caused by solder connection and the stress mitigating effect caused by screwing can be obtained.
  • FIGS. 12A and 12B are a top view and a side view of yet another light emitting device 1B, respectively.
  • the number of mounted LED packages 4 is 15, and the point that the package substrate 20 of each LED package 4 is in contact with the heat radiating substrate 3 through the heat radiating sheet 6 is the light emitting device 1.
  • Reference numeral 2B in FIGS. 12A and 12B denotes a circuit board of the light-emitting device 1B.
  • the heat dissipation sheet 6 is a rubber type sheet having thermal conductivity and elasticity.
  • each LED package When a plurality of LED packages are mounted on a circuit board, the height of each LED package may vary depending on the soldering state. If there is such a variation in height, a gap may be formed between the LED package 4 and the heat dissipation board 3, and heat dissipation to the heat dissipation board 3 may be insufficient.
  • the package substrate 20 of each LED package 4 is preferably brought into contact with the heat dissipation substrate 3 through the heat dissipation sheet 6 having thermal conductivity and elasticity as in the light emitting device 1B. With the heat dissipating sheet 6, it is possible to absorb variations in height when a plurality of LED packages are mounted on a circuit board, and a stable thermal connection from each LED package to the heat dissipating board becomes possible.
  • FIGS. 13A to 13C are a top view, a side view, and a partially enlarged view of still another light emitting device 1C, respectively.
  • FIG. 13C is an enlarged view of the upper surface of the portion indicated by reference numeral XIIIC in FIGS. 13A and 13B.
  • the light emitting device 1C is different from the light emitting device 1 in that the number of mounted LED packages 4 is 15, and the slits 16C are formed at the four corners of the circuit board 2C. It has the same configuration as the device 1.
  • the slit 16 ⁇ / b> C has the same “ ⁇ ” shape as the slit 16, and is provided around the screw 14 that fixes the circuit board 2 and the heat dissipation board 3 at each of the four corners of the circuit board 2 ⁇ / b> C. It is formed one by one.
  • the circuit board When the four corners of the circuit board are fixed with screws or the like, the circuit board may bend, and for example, the central part of the circuit board may rise, resulting in poor connection of the LED package.
  • FIG. 29 is a cross-sectional view showing an example of a light emitting device including a back surface mount type LED package.
  • the LED package having the metal substrate 21, the insulating substrate 22, the LED element 51, the resin frame 53, and the sealing resin 54 is formed on the circuit board 2D in a stepped opening (through hole) of the circuit board 2D. It is mounted from the back side.
  • This LED package is solder-connected to the circuit board 2D at the connection electrodes 24a and 24b formed on the upper surface end of the insulating substrate 22, and the heat dissipation board 3 is disposed on the back side of the LED package and the circuit board 2D. Has been placed.
  • the LED element 51 is mounted at the center of the upper surface of the metal substrate 21 and is electrically connected to the wiring patterns 23a and 23b on the insulating substrate 22 fixed to the outer peripheral portion of the upper surface of the metal substrate 21 via wires 52. It is sealed with a sealing resin 54 filled in a resin frame 53 on the insulating substrate 22.
  • a part of the emitted light L directed from the upper surface of the sealing resin 54 which is the light emitting portion of the LED package to the side is irradiated onto the end surface 2E of the circuit board 2D.
  • the opening of the circuit board is not subjected to special processing in consideration of reflection, and the reflectance of the end face of the circuit board is low, so a part of the emitted light from the light emitting part is irradiated to this end face.
  • optical loss vignetting
  • a loss of several percent of the total luminous flux from the LED element may occur, thereby reducing the light extraction efficiency above the board.
  • the circuit board If the circuit board is made thinner or the diameter of the opening is made larger, this loss will be reduced. However, the circuit board needs to have a certain thickness from the viewpoint of mechanical strength. Since there is a limit, there is a limit in enlarging the diameter of the opening.
  • the bonding strength is weak.
  • the LED package is easily peeled off at the joint. Accordingly, in a light emitting device including a back surface mounting type LED package, a device for increasing the bonding strength between the LED package and the circuit board is also required. Therefore, in the following, a light emitting device with improved light extraction efficiency and LED package bonding strength will be described.
  • FIG 14 to 16 are a perspective view, a top view, and a side view, respectively, of yet another light emitting device 1D.
  • 17 is a rear view of the light emitting device 1D from which the heat dissipation substrate 3 is removed
  • FIG. 18 is a top view of the circuit board 2D of the light emitting device 1D
  • FIG. 19 is taken along line XIX-XIX in FIG. It is sectional drawing of light-emitting device 1D.
  • the light emitting device 1D is different from the light emitting device 1 in that the slit 16 is not formed on the circuit board and the annular resin 56 is formed around each opening 12 instead. It has the same configuration as the device 1.
  • the light emitting device 1 ⁇ / b> D will be described with a focus on differences from the light emitting device 1, and description overlapping with the light emitting device 1 will be omitted.
  • the light emitting device 1 ⁇ / b> D is applied so as to surround the entire periphery of the end surface of the circuit board 2 ⁇ / b> D in each of the plurality of openings 12 (see FIG. 18).
  • the cyclic resin 56 is a light-reflective white resin.
  • particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, or boron nitride are used as a reflective filler in a silicone resin, an epoxy resin, an acrylic resin, or the like. Consists of mixing.
  • the lower end of the annular resin 56 covers the upper surface end of the package substrate 20 without contacting the resin frame 53 of the LED package 4 inserted into the opening 12, and the upper end of the annular resin 56 is on the upper surface of the circuit board 2D. It reaches the edge of the opening 12. That is, the annular resin 56 surrounds the sealing resin 54 of the LED package 4, and the upper surface of the package substrate 20 of the LED package 4 and the end surface of the circuit substrate 2 ⁇ / b> D in the opening 12 (corresponding to the end surface 2 ⁇ / b> E in FIG. 29). ).
  • the surface of the annular resin 56 is preferably a slope that is monotonously inclined so that the diameter of the space portion in the opening 12 becomes larger toward the upper side in the opening 12.
  • the opening 12 of the circuit board 2D may also be rectangular, unlike the illustrated example.
  • the annular resin 56 is formed in a rectangular frame shape so as to surround the entire circumference of the end surface of the circuit board 2 ⁇ / b> D in the opening 12.
  • FIG. 20 is a partial cross-sectional view of the light emitting device 1D for explaining the function of the annular resin 56.
  • the light-reflective annular resin 56 is applied to the end surface of the circuit board 2D in the opening 12, so that the side from the top surface of the sealing resin 54 of the LED package 4 is shown in FIG.
  • the outgoing light L traveling in the direction is reflected above the light emitting device 1D on the surface of the annular resin 56.
  • the surface of the annular resin 56 an inclined surface, the emitted light L is easily reflected above the light emitting device 1D. For this reason, in light-emitting device 1D, the light extraction efficiency from LED package 4 improves compared with the case where the cyclic resin 56 is not provided.
  • the height h1 from the upper surface of the heat dissipation board 3 to the upper surface of the circuit board 2D in the opening 12 is the upper end of the resin frame 53 of the LED package 4 from the upper surface of the heat dissipation board 3.
  • the height to the upper surface of the sealing resin 54 is greater than h2.
  • the cyclic resin 56 is particularly effective for improving the light extraction efficiency from the LED package 4 when h1> h2 as described above.
  • each LED package 4 is solder-connected to the step portion in the opening 12 from the back surface side of the circuit board 2D at the end of the package substrate 20, and the circuit board in the opening 12 is further connected.
  • the annular resin 56 applied so as to cover the 2D end face is also fixed to the circuit board 2D.
  • the bonding area between the circuit board 2D and the LED package 4 is relatively wide. .
  • the mechanical bonding strength between the circuit board 2D and the LED package 4 is improved as compared with the case where the annular resin 56 is not provided.
  • FIG. 21 is a cross-sectional view when the LED package 4 'is used in the light emitting device 1D.
  • FIG. 22 is a cross-sectional view when the LED package 5 is used in the light emitting device 1D.
  • the LED package 4 may be replaced with the LED package 4 ′ having the ceramic substrate 30, or the LED package 5 having the lead frame 40 and the lens resin 55. May be.
  • the lens resin 55 may be disposed so as to cover the sealing resin 54 and the annular resin 56 for each opening 12 of the circuit board 2D. .
  • FIG. 23 (A) and 23 (B) are partial cross-sectional views of the light emitting device 1D when different annular resins 56A and 56B are used, respectively.
  • the annular resins 56A and 56B are made of the same material as the annular resin 56, but the end surface 2E of the circuit board 2D in each opening 12 and the resin frame 53 of the LED package 4 inserted in the opening 12 are used. The region on the package substrate 20 between them is filled. As described above, the end of the annular resin 56 ⁇ / b> B on the center side of the opening 12 may be in contact with the resin frame 53 of the LED package 4 inserted into the opening 12.
  • the amount of resin applied as the cyclic resin is larger than that in FIG. 23A.
  • FIG. 23B the amount of resin applied as the cyclic resin is larger than that in FIG. 23A.
  • the end of the cyclic resin 56B is directly above the resin frame 53. Has reached. If more resin than this is applied as the cyclic resin, the cyclic resin covers the upper surface of the sealing resin 54 and hinders light emission. Therefore, the amount of resin is preferably smaller than the example of FIG.
  • the cross section of the resin frame 53 is rectangular and the upper end thereof is a flat surface. However, as shown in FIGS. 23 (A) and 23 (B), the resin frame 53 The cross section of 53 may be rounded.
  • FIGS. 24A and 24B are a top view and a cross-sectional view of still another cyclic resin 56C, respectively.
  • FIG. 24B shows a cross section of the cyclic resin 56C along the line XXIVB-XXIVB in FIG.
  • the annular resins 56, 56A, and 56B are formed by applying a resin on the circuit board 2D after each LED package 4 is mounted on the circuit board 2D.
  • the annular resin may be produced in advance as a single component by resin molding or the like, and this is formed in each opening 12 of the circuit board 2D. It may be fitted in.
  • FIG. 25 is a cross-sectional view of yet another LED package 5 '.
  • the LED package 5 ′ is an LED package in which a hemispherical lens resin 55 ′ is formed, similar to the LED package 5 shown in FIGS. 10 and 22.
  • the lens resin 55 of the LED package 5 is formed so as to cover the entire upper surface side of the opening 12 of the circuit board 2 after the LED package 5 is mounted on the circuit board 2.
  • the lens resin 55 ′ of the LED package 5 ′ is not so large as to cover the entire upper surface side of the opening 12 of the circuit board 2D, and spreads only above the resin frame 53 and the sealing resin 54 of the LED package 5 ′.
  • it is formed at the stage of a single LED package.
  • an LED package in which a lens resin is formed in advance such as the LED package 5 ', may be used.
  • FIG. 26 is a top view of yet another light emitting device 1E.
  • the light emitting device 1E is different from the light emitting device 1 only in that the same cyclic resin 56 as that of the light emitting device 1D is added, and has the same configuration as the light emitting device 1 in other points.
  • one light emitting device may have both the slit 16 of the light emitting device 1 and the annular resin 56 of the light emitting device 1D.
  • FIG. 27 is a diagram showing an example of the shape of the heat dissipation board in the light emitting device 1E.
  • the heat radiating substrate 3 of the light emitting devices 1 and 1D is composed of one metal substrate having a size sufficient to cover all the LED packages 4 in the light emitting device.
  • the heat radiating board 3 ′ in the example shown in FIG. 27 is composed of two metal substrates denoted by reference numerals 3a and 3b.
  • One heat radiating board 3a is in contact with a part of the LED packages 4 and the other heat radiating board.
  • 3 b is in contact with the remaining LED package 4.
  • the heat dissipation substrate of the light emitting device does not necessarily have to be in contact with all the LED packages, and a plurality of the heat dissipation substrates may be arranged so as to cover all the LED packages.
  • the heat dissipation board should just function as a heat sink, the shape is not limited to a flat plate shape, and may be formed with heat dissipation fins.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Provided is a light-emitting device in which the amount of light emitted using a plurality of COB LED packages is increased, and the heat dissipation of the LED packages is improved. The light-emitting device has: a circuit board in which a plurality of openings are formed; a plurality of LED packages each having a package substrate in which a connection electrode to the circuit board is formed on the end part of the top surface, a plurality of LED elements mounted on the package substrate, and a sealing resin for sealing the plurality of LED elements, the plurality of LED packages being inserted, respectively, in the plurality of openings from the back-surface side of the circuit board, and the connection electrodes being electrically connected to the back surface of the circuit board; and a heat-dissipation substrate disposed on the back-surface side of the circuit board so as to sandwich the package substrates of the plurality of LED packages against the circuit board.

Description

発光装置Light emitting device
　本発明は、発光装置に関する。 The present invention relates to a light emitting device.
　１つの基板上に複数のＬＥＤ（発光ダイオード）素子が実装され、蛍光体を含有する透光性の樹脂によりそれらのＬＥＤ素子が一体的に封止されたＣＯＢ（Chip On Board）のＬＥＤパッケージが知られている。こうしたＬＥＤパッケージでは、各ＬＥＤ素子からの光とそれらの光により蛍光体を励起させて得られる光とを混合させることにより、用途に応じて白色光などが得られる。 A COB (Chip On Board) LED package in which a plurality of LED (light emitting diode) elements are mounted on one substrate and these LED elements are integrally sealed with a translucent resin containing a phosphor. Are known. In such an LED package, white light or the like can be obtained according to the application by mixing light from each LED element and light obtained by exciting the phosphor with the light.
　また、特許文献１には、熱伝導性を有する基台と、基台に固着する導電部を備えた配線板と、基台の実装エリアに実装される発光素子チップとを有する高輝度発光素子が記載されている。この高輝度発光素子では、基台は発光素子チップからの熱を放熱するための放熱面を備え、配線板の導電部は発光素子チップと電気的接続部材によって接続されると共に、導電部の一部に発光素子チップを駆動する駆動電流を供給するための電気的接続面が設けられ、電気的接続面と基台の放熱面とが対向して配置されている。 Patent Document 1 discloses a high-luminance light-emitting element having a base having thermal conductivity, a wiring board having a conductive portion fixed to the base, and a light-emitting element chip mounted on a mounting area of the base. Is described. In this high-intensity light-emitting element, the base has a heat dissipation surface for dissipating heat from the light-emitting element chip, and the conductive portion of the wiring board is connected to the light-emitting element chip by an electrical connection member and one of the conductive portions. An electrical connection surface for supplying a drive current for driving the light emitting element chip is provided in the portion, and the electrical connection surface and the heat dissipation surface of the base are arranged to face each other.
　また、特許文献２には、ベース絶縁基板の表面に形成された電極パターン上にＬＥＤチップを実装し、そのＬＥＤチップを透光性樹脂で封止した後、実装側の基板に設けられた貫通孔に封止樹脂部を埋設するように裏面実装して形成された裏面実装型ＬＥＤが記載されている。 In Patent Document 2, an LED chip is mounted on an electrode pattern formed on the surface of a base insulating substrate, the LED chip is sealed with a light-transmitting resin, and then a through-hole provided on a substrate on the mounting side. A back-side mounted LED formed by back-side mounting so as to embed a sealing resin portion in a hole is described.
特開２００４－２６５９８６号公報JP 2004-265986 A 特開２００８－２０５１０７号公報JP 2008-205107 A
　発光装置の出射光量を増加させるためには、共通の回路基板（主回路基板、配線基板、マザーボード）上にＣＯＢのＬＥＤパッケージを複数個実装して発光装置を構成することが考えられる。しかしながら、一般に、ＣＯＢのＬＥＤパッケージでは、外部電源との接続電極がパッケージ基板の上面に形成されているため、回路基板の上面にＬＥＤパッケージを実装しようとすると、回路基板とＬＥＤパッケージとの間の電気的な接続をとることが難しい。また、発光装置を発光させたときには各ＬＥＤパッケージから熱が発生し、複数のＬＥＤパッケージを用いれば、ＬＥＤパッケージの個数分だけ発熱量も多くなるため、それらの熱を効率よく外部に放出させる工夫が必要になる。 In order to increase the amount of light emitted from the light emitting device, it is conceivable to configure a light emitting device by mounting a plurality of COB LED packages on a common circuit board (main circuit board, wiring board, motherboard). However, in general, in the COB LED package, since the connection electrode to the external power source is formed on the upper surface of the package substrate, when the LED package is mounted on the upper surface of the circuit substrate, the space between the circuit substrate and the LED package is Difficult to make electrical connection. In addition, when the light emitting device emits light, heat is generated from each LED package. If a plurality of LED packages are used, the amount of heat generated is increased by the number of LED packages. Therefore, the heat is efficiently released to the outside. Is required.
　そこで、本発明は、複数のＣＯＢのＬＥＤパッケージを用いて出射光量を増加させるとともに、それらのＬＥＤパッケージの放熱性を向上させた発光装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a light emitting device that uses a plurality of COB LED packages to increase the amount of emitted light and improve the heat dissipation of these LED packages.
　また、本発明は、回路基板にＬＥＤパッケージを半田接続することにより発生する応力を緩和させて回路基板のたわみを生じにくくした発光装置を提供することを目的とする。 It is another object of the present invention to provide a light emitting device that reduces the stress generated by soldering an LED package to a circuit board and makes the circuit board less likely to bend.
　また、本発明は、回路基板の開口部に回路基板の裏面側から実装されたＬＥＤパッケージを含む発光装置の光取出し効率とＬＥＤパッケージの接合強度を向上させることを目的とする。 Another object of the present invention is to improve the light extraction efficiency of the light emitting device including the LED package mounted on the opening of the circuit board from the back side of the circuit board and the bonding strength of the LED package.
　開口部が形成された回路基板と、パッケージ基板、パッケージ基板上に実装されたＬＥＤ素子およびＬＥＤ素子を封止する封止樹脂を有し、回路基板の裏面側から開口部内に挿入され、パッケージ基板の端部が回路基板の裏面に半田接続されたＬＥＤパッケージと、パッケージ基板に接触して回路基板の裏面側に配置された放熱基板とを有し、回路基板には、ＬＥＤパッケージが半田接続される接続位置に隣接する位置にスリットが形成されていることを特徴とする発光装置が提供される。 A circuit board having an opening, a package board, an LED element mounted on the package board, and a sealing resin for sealing the LED element. The package board is inserted into the opening from the back side of the circuit board. The LED package has an LED package soldered to the back surface of the circuit board, and a heat dissipation board disposed in contact with the package board on the back side of the circuit board. The LED package is soldered to the circuit board. There is provided a light emitting device characterized in that a slit is formed at a position adjacent to the connecting position.
　上記の発光装置では、パッケージ基板の対向する２つの角部が回路基板に半田接続され、スリットは、パッケージ基板の２つの角部に対応するように形成され、回路基板は、パッケージ基板の他の２つの角部に対応する位置で、ＬＥＤパッケージまたは放熱基板に機械的に固定されていることが好ましい。 In the above light emitting device, the two opposite corners of the package substrate are solder-connected to the circuit board, the slits are formed so as to correspond to the two corners of the package substrate, It is preferable that the LED package or the heat dissipation board is mechanically fixed at positions corresponding to the two corners.
　上記の発光装置では、パッケージ基板の四隅が回路基板に半田接続され、スリットは、パッケージ基板の四隅に対応するように形成され、回路基板は、パッケージ基板の各辺の中間に対応する位置で、ＬＥＤパッケージまたは放熱基板に機械的に固定されていることが好ましい。 In the above light emitting device, the four corners of the package substrate are soldered to the circuit board, the slits are formed so as to correspond to the four corners of the package substrate, and the circuit board is at a position corresponding to the middle of each side of the package substrate, It is preferably mechanically fixed to the LED package or the heat dissipation substrate.
　上記の発光装置は、ＬＥＤパッケージを複数個有し、回路基板には、複数のＬＥＤパッケージがそれぞれ挿入される複数の開口部が形成され、各ＬＥＤパッケージのパッケージ基板は、弾性を有する放熱シートを介して放熱基板に接触していることが好ましい。 The light emitting device includes a plurality of LED packages, and the circuit board includes a plurality of openings into which the plurality of LED packages are inserted, and the package substrate of each LED package includes an elastic heat dissipation sheet. It is preferable to be in contact with the heat dissipation substrate.
　上記の発光装置は、ＬＥＤパッケージを複数個有し、回路基板には、複数のＬＥＤパッケージがそれぞれ挿入される複数の開口部が形成され、回路基板の四隅が放熱基板に機械的に固定され、回路基板には、さらに、回路基板の四隅における固定位置に隣接する位置にも別のスリットが形成されていることが好ましい。 The light emitting device has a plurality of LED packages, the circuit board has a plurality of openings into which the plurality of LED packages are respectively inserted, and the four corners of the circuit board are mechanically fixed to the heat dissipation board, It is preferable that another slit is formed in the circuit board at positions adjacent to the fixed positions at the four corners of the circuit board.
　また、開口部が形成された回路基板と、パッケージ基板、パッケージ基板上に実装されたＬＥＤ素子およびＬＥＤ素子を封止する封止樹脂を有し、回路基板の裏面側から開口部内に挿入され、パッケージ基板の端部が回路基板の裏面側に接続されたＬＥＤパッケージと、パッケージ基板に接触して回路基板の裏面側に配置された放熱基板と、開口部内において、封止樹脂を取り囲み、かつパッケージ基板の上面および開口部内の回路基板の端面に接触するように成形された光反射性の環状樹脂とを有することを特徴とする発光装置が提供される。 In addition, a circuit board having an opening, a package substrate, an LED element mounted on the package substrate, and a sealing resin that seals the LED element are inserted into the opening from the back side of the circuit board, An LED package in which the end of the package substrate is connected to the back side of the circuit board, a heat dissipation board that is in contact with the package board and arranged on the back side of the circuit board, and encloses the sealing resin in the opening, and the package There is provided a light-emitting device comprising: a light-reflective ring-shaped resin formed so as to contact an upper surface of a substrate and an end surface of a circuit board in an opening.
　また、複数の開口部が形成された回路基板と、上面の端部に回路基板との接続電極が形成されたパッケージ基板、パッケージ基板上に実装された複数のＬＥＤ素子および複数のＬＥＤ素子を封止する封止樹脂をそれぞれが有し、回路基板の裏面側から複数の開口部内にそれぞれ挿入され、接続電極が回路基板の裏面に電気的に接続された複数のＬＥＤパッケージと、回路基板との間で複数のＬＥＤパッケージのパッケージ基板を挟むように回路基板の裏面側に配置された放熱基板とを有することを特徴とする発光装置が提供される。 In addition, a circuit board in which a plurality of openings are formed, a package board in which connection electrodes to the circuit board are formed on the upper end, a plurality of LED elements mounted on the package board, and a plurality of LED elements are sealed. A plurality of LED packages each having a sealing resin to be stopped, inserted into a plurality of openings from the back side of the circuit board, and having connection electrodes electrically connected to the back side of the circuit board; There is provided a light emitting device including a heat dissipation substrate disposed on a back surface side of a circuit board so as to sandwich a package substrate of a plurality of LED packages therebetween.
　上記の発光装置では、複数のＬＥＤパッケージの接続電極は、回路基板の裏面に半田接続され、回路基板には、複数のＬＥＤパッケージの接続電極がそれぞれ半田接続される接続位置に隣接する位置にスリットが形成されていることが好ましい。 In the above light emitting device, the connection electrodes of the plurality of LED packages are solder-connected to the back surface of the circuit board, and the circuit board is slit at positions adjacent to the connection positions where the connection electrodes of the plurality of LED packages are respectively solder-connected. Is preferably formed.
　上記の発光装置では、複数のＬＥＤパッケージの接続電極は、パッケージ基板の対向する２つの角部にそれぞれ形成され、スリットは、パッケージ基板の２つの角部に対応するように形成され、回路基板は、パッケージ基板の他の２つの角部に対応する位置で、複数のＬＥＤパッケージまたは放熱基板に機械的に固定されていることが好ましい。 In the above light emitting device, the connection electrodes of the plurality of LED packages are respectively formed at two opposite corners of the package substrate, the slits are formed to correspond to the two corners of the package substrate, and the circuit board is In addition, it is preferably mechanically fixed to the plurality of LED packages or the heat dissipation substrate at positions corresponding to the other two corners of the package substrate.
　上記の発光装置では、複数のＬＥＤパッケージの接続電極は、パッケージ基板の四隅にそれぞれ形成され、スリットは、パッケージ基板の四隅に対応するように形成され、回路基板は、パッケージ基板の各辺の中間に対応する位置で、複数のＬＥＤパッケージまたは放熱基板に機械的に固定されていることが好ましい。 In the above light emitting device, the connection electrodes of the plurality of LED packages are respectively formed at the four corners of the package substrate, the slits are formed so as to correspond to the four corners of the package substrate, and the circuit substrate is in the middle of each side of the package substrate. It is preferable to be mechanically fixed to the plurality of LED packages or the heat dissipation board at a position corresponding to.
　上記の発光装置では、複数のＬＥＤパッケージのパッケージ基板は、弾性を有する放熱シートを介して放熱基板に接触していることが好ましい。 In the above light-emitting device, it is preferable that the package substrates of the plurality of LED packages are in contact with the heat dissipation substrate via elastic heat dissipation sheets.
　上記の発光装置では、回路基板の四隅が放熱基板に機械的に固定され、回路基板には、さらに、回路基板の四隅における固定位置に隣接する位置にも別のスリットが形成されていることが好ましい。 In the above light emitting device, the four corners of the circuit board may be mechanically fixed to the heat dissipation board, and the circuit board may further have other slits formed at positions adjacent to the fixing positions at the four corners of the circuit board. preferable.
　上記の発光装置は、複数の開口部のそれぞれにおいて、その開口部に挿入されたＬＥＤパッケージの封止樹脂を取り囲み、かつパッケージ基板の上面およびその開口部内の回路基板の端面に接触するように成形された光反射性の環状樹脂をさらに有することが好ましい。 The light emitting device is formed so that each of the plurality of openings surrounds the sealing resin of the LED package inserted into the opening and contacts the upper surface of the package substrate and the end surface of the circuit board in the opening. It is preferable to further have a light-reflecting cyclic resin.
　上記の発光装置では、環状樹脂は、開口部内で上方に向かうほどその開口部内の空間部分の径が大きくなるように傾斜した斜面を有することが好ましい。 In the above light emitting device, it is preferable that the cyclic resin has a slope inclined so that the diameter of the space portion in the opening becomes larger toward the upper side in the opening.
　上記の発光装置では、複数のＬＥＤパッケージのそれぞれは、複数のＬＥＤ素子を取り囲むようにパッケージ基板に形成され内部に封止樹脂が充填された樹脂枠をさらに有し、環状樹脂は、複数の開口部のそれぞれにおいて、その開口部内の回路基板の端面とその開口部に挿入されたＬＥＤパッケージの樹脂枠との間にあるパッケージ基板上の領域を埋め尽くしていることが好ましい。 In the above light emitting device, each of the plurality of LED packages further includes a resin frame formed on the package substrate so as to surround the plurality of LED elements and filled with sealing resin therein, and the annular resin has a plurality of openings. In each of the parts, it is preferable that a region on the package substrate between the end face of the circuit board in the opening and the resin frame of the LED package inserted in the opening is filled.
　上記の発光装置では、放熱基板の上面から複数の開口部における回路基板の上面までの高さは、放熱基板の上面から複数のＬＥＤパッケージの封止樹脂の上面までの高さよりも大きいことが好ましい。 In the above light emitting device, the height from the upper surface of the heat dissipation substrate to the upper surface of the circuit board in the plurality of openings is preferably larger than the height from the upper surface of the heat dissipation substrate to the upper surface of the sealing resin of the plurality of LED packages. .
　上記の発光装置によれば、複数のＣＯＢのＬＥＤパッケージを用いることで出射光量が増加するとともに、それらのＬＥＤパッケージの放熱性が向上する。 According to the above light emitting device, the amount of emitted light is increased by using a plurality of COB LED packages, and the heat dissipation of these LED packages is improved.
　また、上記の発光装置によれば、回路基板にＬＥＤパッケージを半田接続することにより発生する応力が緩和されて、回路基板のたわみが生じにくくなる。 Further, according to the above light emitting device, the stress generated by soldering the LED package to the circuit board is relieved, and the circuit board is less likely to bend.
　また、上記の発光装置によれば、回路基板の開口部に回路基板の裏面側から実装されたＬＥＤパッケージを含む発光装置の光取出し効率とＬＥＤパッケージの接合強度が向上する。 Further, according to the above light emitting device, the light extraction efficiency and the bonding strength of the LED package of the light emitting device including the LED package mounted on the opening of the circuit board from the back side of the circuit board are improved.
発光装置１の斜視図である。1 is a perspective view of a light emitting device 1. FIG. 発光装置１の上面図である。2 is a top view of the light emitting device 1. FIG. 発光装置１の側面図である。1 is a side view of a light emitting device 1. FIG. 放熱基板３が取り除かれた発光装置１の裏面図である。It is a reverse view of the light-emitting device 1 from which the thermal radiation board | substrate 3 was removed. 回路基板２の上面図である。3 is a top view of the circuit board 2. FIG. 図２のＶＩ－ＶＩ線に沿った発光装置１の断面図である。FIG. 3 is a cross-sectional view of the light emitting device 1 taken along line VI-VI in FIG. 2. （Ａ）～（Ｄ）は、ＬＥＤパッケージ４の構造および製造工程を説明するための斜視図である。(A) to (D) are perspective views for explaining the structure and manufacturing process of the LED package 4. （Ａ）および（Ｂ）は、発光装置１の回路基板２におけるスリット１６の働きを説明するための上面図および断面図である。(A) And (B) is the top view and sectional drawing for demonstrating the effect | action of the slit 16 in the circuit board 2 of the light-emitting device 1. FIG. 別のＬＥＤパッケージ４’の断面図である。It is sectional drawing of another LED package 4 '. さらに別のＬＥＤパッケージ５の断面図である。It is sectional drawing of another LED package 5. FIG. 別の発光装置１Ａの部分拡大図である。It is the elements on larger scale of another light-emitting device 1A. （Ａ）および（Ｂ）は、さらに別の発光装置１Ｂの上面図および側面図である。(A) And (B) is the top view and side view of another light-emitting device 1B. （Ａ）～（Ｃ）は、さらに別の発光装置１Ｃの上面図、側面図および部分拡大図である。(A) to (C) are a top view, a side view, and a partially enlarged view of still another light emitting device 1C. さらに別の発光装置１Ｄの斜視図である。It is a perspective view of another light-emitting device 1D. 発光装置１Ｄの上面図である。It is a top view of light-emitting device 1D. 発光装置１Ｄの側面図である。It is a side view of light-emitting device 1D. 放熱基板３が取り除かれた発光装置１Ｄの裏面図である。It is a back view of light-emitting device 1D from which the thermal radiation board | substrate 3 was removed. 発光装置１Ｄの回路基板２Ｄの上面図である。It is a top view of circuit board 2D of light emitting device 1D. 図１５のＸＩＸ－ＸＩＸ線に沿った発光装置１Ｄの断面図である。FIG. 16 is a cross-sectional view of the light emitting device 1D along the line XIX-XIX in FIG. 環状樹脂５６の働きを説明するための発光装置１Ｄの部分断面図である。It is a fragmentary sectional view of light-emitting device 1D for demonstrating the function of the cyclic resin 56. FIG. 発光装置１ＤでＬＥＤパッケージ４’を使用した場合の断面図である。It is sectional drawing at the time of using LED package 4 'with the light-emitting device 1D. 発光装置１ＤでＬＥＤパッケージ５を使用した場合の断面図である。It is sectional drawing at the time of using LED package 5 by light-emitting device 1D. （Ａ）および（Ｂ）は、別の環状樹脂５６Ａ，５６Ｂを使用した場合の発光装置１Ｄの部分断面図である。(A) And (B) is a fragmentary sectional view of light-emitting device 1D at the time of using another cyclic resin 56A, 56B. （Ａ）および（Ｂ）は、さらに別の環状樹脂５６Ｃの上面図および断面図である。(A) And (B) is the top view and sectional drawing of another cyclic resin 56C. さらに別のＬＥＤパッケージ５’の断面図である。It is sectional drawing of another LED package 5 '. さらに別の発光装置１Ｅの上面図である。It is a top view of another light emitting device 1E. 発光装置１Ｅにおける放熱基板の形状の例を示す図である。It is a figure which shows the example of the shape of the heat sink in the light-emitting device 1E. （Ａ）および（Ｂ）は、回路基板２’の裏面側にＬＥＤパッケージが半田接続され、かつ回路基板２’とその裏面側の放熱基板３とがねじ止めされたときに発生する応力を説明するための上面図および断面図である。(A) and (B) explain the stress generated when the LED package is solder-connected to the back side of the circuit board 2 'and the circuit board 2' and the heat dissipation board 3 on the back side thereof are screwed together. It is the top view and sectional drawing for doing. 裏面実装型のＬＥＤパッケージを含む発光装置の例を示す断面図である。It is sectional drawing which shows the example of the light-emitting device containing a back surface mounting type LED package.
　以下、図面を参照しつつ、発光装置について説明する。ただし、本発明は図面または以下に記載される実施形態には限定されないことを理解されたい。 Hereinafter, the light emitting device will be described with reference to the drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.
　図１～図３は、それぞれ、発光装置１の斜視図、上面図および側面図である。発光装置１は、回路基板２に裏面側から複数のＬＥＤパッケージ４が実装され、さらにそれらの裏面側に放熱基板３が配置された構造を有する。図４は、放熱基板３が取り除かれた発光装置１の裏面図である。発光装置１は、発光部として２１個のＬＥＤパッケージ４を有し、例えば各種の照明用のＬＥＤ光源装置として利用される。ただし、この２１個は一例であり、ＬＥＤパッケージ４の個数は特に限定されず、例えば１個であってもよい。 1 to 3 are a perspective view, a top view, and a side view of the light emitting device 1, respectively. The light emitting device 1 has a structure in which a plurality of LED packages 4 are mounted on a circuit board 2 from the back side, and a heat dissipation board 3 is arranged on the back side. FIG. 4 is a rear view of the light emitting device 1 from which the heat dissipation substrate 3 has been removed. The light emitting device 1 has 21 LED packages 4 as light emitting portions, and is used as, for example, various LED light source devices for illumination. However, this 21 is an example, and the number of LED packages 4 is not particularly limited, and may be one, for example.
　図５は、回路基板２の上面図である。回路基板２（主回路基板、配線基板、マザーボード）は、ほぼ矩形の絶縁基板であり、機械的な強度および耐熱性を確保するために、例えば、ＦＲ－４（Flame Retardant Type 4）を基材とするガラスエポキシ基板などで構成される。図示した例では、ＬＥＤパッケージ４を挿入するための２１個の開口部１２が、回路基板２上にほぼ等間隔で形成されている。 FIG. 5 is a top view of the circuit board 2. The circuit board 2 (main circuit board, wiring board, mother board) is a substantially rectangular insulating board. For example, FR-4 (Flame Retardant Type 4) is used as a base material to ensure mechanical strength and heat resistance. It is composed of a glass epoxy substrate. In the illustrated example, 21 openings 12 for inserting the LED packages 4 are formed on the circuit board 2 at substantially equal intervals.
　図５に示すように、回路基板２における各開口部１２の周囲には、ねじ穴１７および「く」の字型のスリット１６が、１つの開口部１２当たり２個ずつ形成されている。２個のスリット１６は開口部１２を挟んで対向し、２個のねじ穴１７も開口部１２を挟んで対向しており、これらの計４個は、開口部１２を取り囲む矩形の角部にそれぞれ配置されている。図２に示すように、ねじ穴１７には、固定用のねじ１５が取り付けられる。 As shown in FIG. 5, two screw holes 17 and “<”-shaped slits 16 are formed per one opening 12 around each opening 12 in the circuit board 2. The two slits 16 are opposed to each other with the opening 12 interposed therebetween, and the two screw holes 17 are also opposed to each other with the opening 12 interposed therebetween. A total of four of these are formed at the rectangular corners surrounding the opening 12. Each is arranged. As shown in FIG. 2, a fixing screw 15 is attached to the screw hole 17.
　図２および図５に示す回路基板２の左端には、発光装置１を外部電源に接続するための２個の電極１３が形成されている。また、詳細は図示していないが、回路基板２には、電極１３と各開口部１２に実装されるＬＥＤパッケージ４とを（すなわち、複数のＬＥＤパッケージ４を互いに）電気的に接続するための配線パターンが形成されている。電極１３が外部電源に接続されて電圧が印加されることにより、各ＬＥＤパッケージ４は発光する。その際、発光装置１のすべてのＬＥＤパッケージ４が同時に発光してもよいし、回路基板２上の配線パターンによっては、一部のＬＥＤパッケージ４のみが発光してもよい。 At the left end of the circuit board 2 shown in FIGS. 2 and 5, two electrodes 13 for connecting the light emitting device 1 to an external power source are formed. Although not shown in detail, the circuit board 2 is for electrically connecting the electrode 13 and the LED package 4 mounted in each opening 12 (that is, a plurality of LED packages 4 to each other). A wiring pattern is formed. When the electrode 13 is connected to an external power source and a voltage is applied, each LED package 4 emits light. At that time, all the LED packages 4 of the light emitting device 1 may emit light simultaneously, or only some of the LED packages 4 may emit light depending on the wiring pattern on the circuit board 2.
　放熱基板３は、各ＬＥＤパッケージ４を回路基板２との間で挟むように、複数のＬＥＤパッケージ４のパッケージ基板に接触して回路基板２の裏面側に配置された矩形の金属基板である。放熱基板３は、各ＬＥＤパッケージ４で発生した熱を発光装置１の外部に放出させるためのヒートシンクとして機能するため、例えば、耐熱性および放熱性に優れたアルミニウムまたは銅で構成される。ただし、放熱基板３の材質は、耐熱性と放熱性に優れたものであれば、アルミニウムおよび銅以外のものであってもよい。なお、図１～図３に示すように、回路基板２および放熱基板３の四隅において、両者はねじ１４により互いに固定されている。 The heat dissipation substrate 3 is a rectangular metal substrate disposed on the back side of the circuit board 2 in contact with the package substrates of the plurality of LED packages 4 so that each LED package 4 is sandwiched between the circuit boards 2. Since the heat dissipation substrate 3 functions as a heat sink for releasing the heat generated in each LED package 4 to the outside of the light emitting device 1, it is made of, for example, aluminum or copper having excellent heat resistance and heat dissipation. However, the material of the heat dissipation substrate 3 may be other than aluminum and copper as long as it has excellent heat resistance and heat dissipation. As shown in FIGS. 1 to 3, at the four corners of the circuit board 2 and the heat dissipation board 3, they are fixed to each other by screws 14.
　図６は、図２のＶＩ－ＶＩ線に沿った発光装置１の断面図である。図６に示すように、回路基板２の各開口部１２には、厚さ方向の途中に段差が形成されており、開口部１２の径は、上面側よりも裏面側の方が大きい。各ＬＥＤパッケージ４は、ＣＯＢのＬＥＤパッケージであり、パッケージ基板２０、ＬＥＤ素子５１、樹脂枠５３および封止樹脂５４を有し、回路基板２の裏面側から開口部１２内に挿入されている。各ＬＥＤパッケージ４は、パッケージ基板２０の端部で回路基板２の裏面側から開口部１２内の段差部分に半田接続されている。ただし、回路基板２の開口部１２には、図６に示したような段差が形成されていなくてもよく、各ＬＥＤパッケージ４は、開口部１２の外側における回路基板２の裏面に半田接続されていてもよい。 FIG. 6 is a cross-sectional view of the light emitting device 1 taken along line VI-VI in FIG. As shown in FIG. 6, a step is formed in the thickness direction in each opening 12 of the circuit board 2, and the diameter of the opening 12 is larger on the back side than on the top side. Each LED package 4 is a COB LED package, and includes a package substrate 20, an LED element 51, a resin frame 53, and a sealing resin 54, and is inserted into the opening 12 from the back side of the circuit substrate 2. Each LED package 4 is solder-connected to the step portion in the opening 12 from the back surface side of the circuit board 2 at the end of the package substrate 20. However, the step 12 as shown in FIG. 6 may not be formed in the opening 12 of the circuit board 2, and each LED package 4 is soldered to the back surface of the circuit board 2 outside the opening 12. It may be.
　図７（Ａ）～図７（Ｄ）は、ＬＥＤパッケージ４の構造および製造工程を説明するための斜視図である。 FIGS. 7A to 7D are perspective views for explaining the structure and manufacturing process of the LED package 4.
　図７（Ａ）に示すように、パッケージ基板２０は、中央に開口部２２１が形成された絶縁基板２２を金属基板２１の上面に貼り付けて構成され、全体として矩形の形状を有する。金属基板２１の上面は、その中央にＬＥＤ素子５１が実装される実装領域２１１を有し、金属基板２１の裏面は、放熱基板３に接触している。金属基板２１は、ＬＥＤ素子５１および後述する蛍光体の粒子により発生した熱を放熱基板３側に放熱させる機能を有するため、放熱基板３と同様に、例えばアルミニウムまたは銅で構成される。 As shown in FIG. 7A, the package substrate 20 is configured by attaching an insulating substrate 22 having an opening 221 at the center to the upper surface of the metal substrate 21, and has a rectangular shape as a whole. The upper surface of the metal substrate 21 has a mounting region 211 in which the LED element 51 is mounted at the center, and the rear surface of the metal substrate 21 is in contact with the heat dissipation substrate 3. Since the metal substrate 21 has a function of dissipating heat generated by the LED elements 51 and phosphor particles, which will be described later, toward the heat dissipation substrate 3, the metal substrate 21 is made of, for example, aluminum or copper, similarly to the heat dissipation substrate 3.
　絶縁基板２２の上面には、開口部２２１を２等分する中心線を挟んだ一方の側に円弧状の配線パターン２３ａが、他方の側に円弧状の配線パターン２３ｂが、それぞれ開口部２２１を取り囲むように形成されている。また、絶縁基板２２の上面で対角に位置する一方の角部には、配線パターン２３ａに連結した接続電極２４ａが、他方の角部には、配線パターン２３ｂに連結した接続電極２４ｂが、それぞれ形成されている。接続電極２４ａ，２４ｂが回路基板２に接続されて電圧が印加されることによって、ＬＥＤパッケージ４のＬＥＤ素子５１は発光する。 On the upper surface of the insulating substrate 22, an arc-shaped wiring pattern 23a is formed on one side of the center line that bisects the opening 221, and an arc-shaped wiring pattern 23b is formed on the other side. It is formed so as to surround it. In addition, a connection electrode 24a connected to the wiring pattern 23a is provided at one corner located diagonally on the upper surface of the insulating substrate 22, and a connection electrode 24b connected to the wiring pattern 23b is provided at the other corner, respectively. Is formed. When the connection electrodes 24a and 24b are connected to the circuit board 2 and a voltage is applied, the LED element 51 of the LED package 4 emits light.
　ＬＥＤ素子５１は、例えば、窒化ガリウム系化合物半導体などで構成された、発光波長帯域が４５０～４６０ｎｍ程度の青色光を出射する青色ＬＥＤである。ただし、ＬＥＤ素子５１の発光波長帯域は特に限定されず、ＬＥＤ素子５１は、例えば、緑色光を出射する緑色ＬＥＤまたは赤色光を出射する赤色ＬＥＤであってもよい。また、例えば、あるＬＥＤパッケージ４のＬＥＤ素子５１は青色ＬＥＤであり、他のＬＥＤパッケージ４のＬＥＤ素子５１は緑色ＬＥＤであるというように、ＬＥＤパッケージ４ごとにＬＥＤ素子５１の発光波長帯域が異なっていてもよい。 The LED element 51 is, for example, a blue LED made of a gallium nitride compound semiconductor and emitting blue light having an emission wavelength band of about 450 to 460 nm. However, the emission wavelength band of the LED element 51 is not particularly limited, and the LED element 51 may be, for example, a green LED that emits green light or a red LED that emits red light. Further, for example, the LED element 51 of one LED package 4 is a blue LED, and the LED element 51 of another LED package 4 is a green LED. It may be.
　図７（Ｂ）に示すように、ＬＥＤパッケージ４では、複数のＬＥＤ素子５１が、円形の実装領域２１１上に格子状に配列して実装されている。図７（Ｂ）では、図示を簡単にするために、９個のＬＥＤ素子５１が実装された場合の例を示しているが、ＬＥＤパッケージ４に含まれるＬＥＤ素子５１の個数は特に限定されず、例えば１個であってもよい。 As shown in FIG. 7B, in the LED package 4, a plurality of LED elements 51 are arrayed and mounted on a circular mounting region 211 in a grid pattern. FIG. 7B shows an example in which nine LED elements 51 are mounted for ease of illustration, but the number of LED elements 51 included in the LED package 4 is not particularly limited. For example, it may be one.
　ＬＥＤ素子５１の下面は、例えば透明な絶縁性の接着剤などにより、金属基板２１の上面に固定されている。また、ＬＥＤ素子５１は上面に１対の素子電極を有し、図７（Ｃ）に示すように、隣接するＬＥＤ素子５１の素子電極は、ボンディングワイヤ５２（以下、単にワイヤ５２という）により相互に電気的に接続されている。実装領域２１１の外周側に位置するＬＥＤ素子５１から出たワイヤ５２は、絶縁基板２２の配線パターン２３ａまたは配線パターン２３ｂに接続されている。これにより、各ＬＥＤ素子５１には、ワイヤ５２を介して電流が供給される。 The lower surface of the LED element 51 is fixed to the upper surface of the metal substrate 21 with, for example, a transparent insulating adhesive. The LED element 51 has a pair of element electrodes on the upper surface, and as shown in FIG. 7C, the element electrodes of the adjacent LED elements 51 are mutually connected by bonding wires 52 (hereinafter simply referred to as wires 52). Is electrically connected. A wire 52 coming out of the LED element 51 located on the outer peripheral side of the mounting region 211 is connected to the wiring pattern 23 a or the wiring pattern 23 b of the insulating substrate 22. Thereby, a current is supplied to each LED element 51 through the wire 52.
　樹脂枠５３は、実装領域２１１の大きさに合わせて例えば白色の樹脂で構成された円形の枠体であり、絶縁基板２２の上面で、実装領域２１１上に実装されたＬＥＤ素子５１を取り囲むように、配線パターン２３ａ，２３ｂと重なる位置に固定されている。樹脂枠５３は、封止樹脂５４の流出しを防止するためのダム材であり、また、ＬＥＤ素子５１から側方に出射された光を、ＬＥＤパッケージ４の上方（回路基板２の上面側）に向けて反射させる。 The resin frame 53 is a circular frame made of, for example, white resin in accordance with the size of the mounting region 211, and surrounds the LED element 51 mounted on the mounting region 211 on the upper surface of the insulating substrate 22. The wiring patterns 23a and 23b are fixed at positions overlapping with each other. The resin frame 53 is a dam material for preventing the sealing resin 54 from flowing out, and the light emitted from the LED element 51 to the side is above the LED package 4 (on the upper surface side of the circuit board 2). Reflect towards.
　封止樹脂５４は、例えば、エポキシ樹脂またはシリコーン樹脂などの無色かつ透明な熱硬化性樹脂で構成され、樹脂枠５３により囲まれた実装領域２１１上の空間に充填されて、ＬＥＤ素子５１およびワイヤ５２を一体に被覆し保護（封止）する。なお、図６では、樹脂枠５３および封止樹脂５４の上面よりも回路基板２の上面の方が高い位置にあるが、回路基板２の厚さによっては、これらの高さは同じかまたは逆転していてもよい。 The sealing resin 54 is made of, for example, a colorless and transparent thermosetting resin such as an epoxy resin or a silicone resin. The sealing resin 54 is filled in a space on the mounting region 211 surrounded by the resin frame 53, and the LED element 51 and the wire 52 is integrally covered and protected (sealed). In FIG. 6, the upper surface of the circuit board 2 is higher than the upper surfaces of the resin frame 53 and the sealing resin 54, but these heights are the same or reversed depending on the thickness of the circuit board 2. You may do it.
　封止樹脂５４は、ＬＥＤ素子５１によって励起される蛍光体を含有してもよい。例えば、ＬＥＤ素子５１が青色ＬＥＤである場合には、封止樹脂５４は、ＹＡＧ（Yttrium Aluminum Garnet）などの黄色蛍光体を含有してもよい。この場合、ＬＥＤパッケージ４は、ＬＥＤ素子５１からの青色光と、それによって黄色蛍光体を励起させて得られる黄色光とを混合させることで得られる白色光を出射する。また、封止樹脂５４は、例えば、黄色蛍光体と赤色蛍光体などの複数種類の蛍光体を含有してもよいし、ＬＥＤパッケージ４ごとに異なる種類の蛍光体を含有してもよい。 The sealing resin 54 may contain a phosphor that is excited by the LED element 51. For example, when the LED element 51 is a blue LED, the sealing resin 54 may contain a yellow phosphor such as YAG (Yttrium Aluminum Garnet). In this case, the LED package 4 emits white light obtained by mixing the blue light from the LED element 51 and the yellow light obtained by exciting the yellow phosphor thereby. Moreover, the sealing resin 54 may contain, for example, a plurality of types of phosphors such as a yellow phosphor and a red phosphor, or may contain different types of phosphors for each LED package 4.
　ＬＥＤパッケージ４の製造時には、図７（Ａ）に示すパッケージ基板２０の実装領域２１１に、図７（Ｂ）に示すように、複数のＬＥＤ素子５１が実装される。そして、図７（Ｃ）に示すように、ＬＥＤ素子５１同士がワイヤ５２で接続され、ワイヤ５２を介して配線パターン２３ａ，２３ｂに電気的に接続される。次に、図７（Ｄ）に示すように、絶縁基板２２の上面における開口部２２１の周囲に樹脂枠５３が形成され、その後、樹脂枠５３で囲まれた領域に封止樹脂５４が充填される。これにより、図６に示すＬＥＤパッケージ４が完成する。 When the LED package 4 is manufactured, as shown in FIG. 7B, a plurality of LED elements 51 are mounted in the mounting region 211 of the package substrate 20 shown in FIG. Then, as shown in FIG. 7C, the LED elements 51 are connected to each other by wires 52 and are electrically connected to the wiring patterns 23 a and 23 b through the wires 52. Next, as shown in FIG. 7D, a resin frame 53 is formed around the opening 221 on the upper surface of the insulating substrate 22, and then a region surrounded by the resin frame 53 is filled with the sealing resin 54. The Thereby, the LED package 4 shown in FIG. 6 is completed.
　なお、ＬＥＤパッケージ４における絶縁基板２２の開口部２２１の形状は、図示した例とは異なり、矩形であってもよい。この場合、金属基板２１の実装領域２１１と樹脂枠５３も矩形になる。特に、多数のＬＥＤ素子５１を高密度に実装する場合には、実装領域２１１を矩形にして、各ＬＥＤ素子５１を矩形の格子状に配置するとよい。また、回路基板２の開口部１２も、図示した例とは異なり、矩形であってもよい。 Note that the shape of the opening 221 of the insulating substrate 22 in the LED package 4 may be rectangular, unlike the illustrated example. In this case, the mounting area 211 of the metal substrate 21 and the resin frame 53 are also rectangular. In particular, when a large number of LED elements 51 are mounted at a high density, the mounting area 211 may be rectangular and the LED elements 51 may be arranged in a rectangular lattice. Also, the opening 12 of the circuit board 2 may be rectangular, unlike the illustrated example.
　発光装置１では、回路基板２の各開口部１２に裏面側からＬＥＤパッケージ４が実装されるので、パッケージ基板の裏面に電極がないＣＯＢのＬＥＤパッケージでも実装が容易であり、複数のＬＥＤパッケージを用いて出射光量を容易に増加させることができる。また、発光装置１では、各ＬＥＤパッケージ４のパッケージ基板に接触して放熱基板３が配置されており、各ＬＥＤパッケージ４で発生した熱は放熱基板３を通して装置外部に放出されるので、放熱性が向上する。これらの点は、以下で説明する発光装置１Ａ～１Ｅについても同様である。 In the light emitting device 1, the LED package 4 is mounted on each opening 12 of the circuit board 2 from the back surface side. Therefore, even a COB LED package having no electrode on the back surface of the package substrate can be easily mounted. It is possible to easily increase the amount of emitted light. Further, in the light emitting device 1, the heat dissipation substrate 3 is disposed in contact with the package substrate of each LED package 4, and the heat generated in each LED package 4 is released to the outside of the device through the heat dissipation substrate 3. Will improve. The same applies to the light emitting devices 1A to 1E described below.
　一般に、回路基板の開口部にＬＥＤパッケージが実装された発光装置では、回路基板とパッケージ基板とが半田付けされたり、回路基板が例えばねじにより機械的に固定されたりすると、基板と半田の材質の違いによる線膨張応力や、ねじ止めによる応力が発生する。 In general, in a light emitting device in which an LED package is mounted in an opening of a circuit board, when the circuit board and the package board are soldered, or the circuit board is mechanically fixed by, for example, a screw, Linear expansion stress due to differences and stress due to screwing occur.
　図２８（Ａ）は、回路基板２’の裏面側にＬＥＤパッケージが半田接続され、かつ回路基板２’とその裏面側の放熱基板３とがねじ止めされたときに発生する応力を説明するための上面図である。図２８（Ｂ）は、図２８（Ａ）に示すＸＸＶＩＩＩＢ－ＸＸＶＩＩＩＢ線に沿った断面図である。これらの図では、矩形のパッケージ基板２０の上面に円形の樹脂枠５３が形成され、その内側領域に図示しないＬＥＤ素子が実装されて封止樹脂５４で封止されたＬＥＤパッケージが、回路基板２’の円形の開口部１２’に回路基板２’の裏面側から半田２５ａ，２５ｂで接続された場合の例を示している。パッケージ基板２０の裏面側は放熱基板３に接触しており、回路基板２’は、２本のねじ１５を介して、ＬＥＤパッケージを挟んで放熱基板３に固定されている。 FIG. 28A illustrates the stress generated when the LED package is solder-connected to the back side of the circuit board 2 ′ and the circuit board 2 ′ and the heat dissipation board 3 on the back side thereof are screwed. FIG. FIG. 28B is a cross-sectional view along the line XXVIIIB-XXVIIIB shown in FIG. In these drawings, an LED package in which a circular resin frame 53 is formed on the upper surface of a rectangular package substrate 20 and an LED element (not shown) is mounted on the inner region and sealed with a sealing resin 54 is the circuit substrate 2. In this example, the circular openings 12 'are connected to the circuit board 2' from the back side by solders 25a and 25b. The back surface side of the package substrate 20 is in contact with the heat dissipation substrate 3, and the circuit board 2 ′ is fixed to the heat dissipation substrate 3 with the LED package interposed therebetween via two screws 15.
　この場合、図２８（Ａ）および図２８（Ｂ）に矢印Ｆｈで示すように、半田２５ａ，２５ｂによる接合部分において、基板と半田の材質の違いや、半田接続が行われたときの熱に起因して、回路基板２’とパッケージ基板２０には水平方向の応力が作用する。また、回路基板２’をねじ止めすることにより、図２８（Ｂ）に矢印Ｆｖで示すように、回路基板２’には鉛直方向の応力も作用する。これらの応力は、回路基板２’にたわみを生じさせるため、回路基板２’とパッケージ基板２０との接続信頼性を低下させるおそれがある。特に、パッケージ基板２０としてセラミック（Ａｌ２Ｏ３・ＡｌＮなど）基板を使用する場合には、セラミックは割れやすい材質であるために、この応力を緩和する工夫が必要になる。 In this case, as indicated by an arrow Fh in FIGS. 28A and 28B, the difference between the material of the substrate and the solder and the heat when the solder connection is performed at the joint portion by the solder 25a and 25b. As a result, horizontal stress acts on the circuit board 2 ′ and the package board 20. Further, by screwing the circuit board 2 ′, a stress in the vertical direction also acts on the circuit board 2 ′ as indicated by an arrow Fv in FIG. Since these stresses cause the circuit board 2 ′ to bend, the connection reliability between the circuit board 2 ′ and the package substrate 20 may be reduced. In particular, when a ceramic (Al 2 O 3 .AlN or the like) substrate is used as the package substrate 20, since ceramic is a material that is easily broken, it is necessary to devise measures to alleviate this stress.
　図８（Ａ）および図８（Ｂ）は、それぞれ、発光装置１の回路基板２におけるスリット１６の働きを説明するための上面図および断面図である。図８（Ａ）は、回路基板２の上面の部分拡大図であり、ＬＥＤパッケージ４のパッケージ基板２０の位置も破線で示している。図８（Ｂ）は、図８（Ａ）に示すＶＩＩＩＢ－ＶＩＩＩＢ線に沿った断面図である。 FIGS. 8A and 8B are a top view and a cross-sectional view for explaining the function of the slit 16 in the circuit board 2 of the light emitting device 1, respectively. FIG. 8A is a partially enlarged view of the upper surface of the circuit board 2, and the position of the package board 20 of the LED package 4 is also indicated by a broken line. FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB shown in FIG.
　図８（Ａ）に示すように、パッケージ基板２０は、接続電極２４ａ，２４ｂが形成されている対向する２つの角部において、半田２５ａ，２５ｂにより回路基板２の裏面側の配線パターンに接続されている。回路基板２のスリット１６は、半田２５ａ，２５ｂの接続位置であるＬＥＤパッケージ４の２つの角部に対応するように、その接続位置の近傍に形成されている。言い換えると、スリット１６は、各ＬＥＤパッケージ４が半田接続される接続位置に隣接する位置に形成されている。なお、スリット１６の形状は、例えば、図示した「く」の字型の形状とは異なり、一直線状であってもよいし、曲線状であってもよく、特に限定されない。 As shown in FIG. 8A, the package substrate 20 is connected to the wiring pattern on the back surface side of the circuit board 2 by solder 25a and 25b at two opposing corners where the connection electrodes 24a and 24b are formed. ing. The slit 16 of the circuit board 2 is formed in the vicinity of the connection position so as to correspond to the two corners of the LED package 4 where the solder 25a and 25b are connected. In other words, the slit 16 is formed at a position adjacent to a connection position where each LED package 4 is solder-connected. The shape of the slit 16 is not particularly limited, for example, may be a straight line shape or a curved shape, unlike the “<” shape shown in the figure.
　また、回路基板２は、パッケージ基板２０における半田付けされていない他の２つの角部に対応する位置で、ねじ１５によりパッケージ基板２０（ＬＥＤパッケージ４）に固定されている。なお、この固定手段は、回路基板２とパッケージ基板２０とを機械的に固定するものであれば、ねじに限らず、どのようなものでもよい。また、図２８（Ｂ）に示すように、パッケージ基板２０（開口部１２）の周囲においても、回路基板２と放熱基板３とは、ねじ１５により機械的に固定されていてもよい。 Further, the circuit board 2 is fixed to the package board 20 (LED package 4) by screws 15 at positions corresponding to the other two corner portions of the package board 20 that are not soldered. The fixing means is not limited to a screw as long as the circuit board 2 and the package substrate 20 are mechanically fixed. Further, as shown in FIG. 28B, the circuit board 2 and the heat dissipation board 3 may be mechanically fixed by screws 15 around the package board 20 (opening 12).
　図８（Ａ）および図８（Ｂ）に示すように、半田２５ａ，２５ｂによる接合部分において、回路基板２’とパッケージ基板２０には水平方向の応力Ｆｈが作用する。また、回路基板２をねじ止めすることにより、図８（Ｂ）に示すように、回路基板２には鉛直方向の応力Ｆｖも作用する。しかしながら、回路基板２では、半田２５ａ，２５ｂの接続位置の近傍にスリット１６が形成されていることにより、水平方向の応力Ｆｈを打ち消す逆方向の力Ｆｈ’も作用するため、半田接続に起因する応力が緩和される。また、回路基板２では、スリット１６が形成されていることにより、鉛直方向の応力Ｆｖを打ち消す逆方向の力Ｆｖ’も作用するため、ねじ止めに起因する応力も緩和される。 As shown in FIGS. 8A and 8B, a horizontal stress Fh acts on the circuit board 2 'and the package board 20 at the joints formed by the solders 25a and 25b. Further, by screwing the circuit board 2, the stress Fv in the vertical direction also acts on the circuit board 2 as shown in FIG. However, in the circuit board 2, since the slit 16 is formed in the vicinity of the connection position of the solders 25a and 25b, a reverse force Fh ′ that cancels the horizontal stress Fh also acts, and this results from the solder connection. Stress is relieved. In addition, since the slit 16 is formed in the circuit board 2, a reverse force Fv ′ that cancels the stress Fv in the vertical direction also acts, so that the stress caused by screwing is also alleviated.
　図９は、別のＬＥＤパッケージ４’の断面図である。ＬＥＤパッケージ４’は、金属基板２１と絶縁基板２２とが貼り合わされたパッケージ基板２０に代えてセラミック基板３０を有する点がＬＥＤパッケージ４とは異なるが、その他の点ではＬＥＤパッケージ４と同じ構成を有する。セラミック基板３０もパッケージ基板の一例であり、発光装置１は、ＬＥＤパッケージ４に代えて、図９に示すＬＥＤパッケージ４’を有してもよい。セラミック基板３０は、その上面に配線パターンおよび接続電極が形成され、かつＬＥＤ素子５１が実装される平坦な基板であり、ＬＥＤパッケージ４の金属基板２１と絶縁基板２２の機能を兼ねている。 FIG. 9 is a cross-sectional view of another LED package 4 '. The LED package 4 ′ is different from the LED package 4 in that it has a ceramic substrate 30 instead of the package substrate 20 in which the metal substrate 21 and the insulating substrate 22 are bonded together, but otherwise has the same configuration as the LED package 4. Have. The ceramic substrate 30 is also an example of a package substrate, and the light emitting device 1 may have an LED package 4 ′ shown in FIG. 9 instead of the LED package 4. The ceramic substrate 30 is a flat substrate on which a wiring pattern and connection electrodes are formed and on which the LED elements 51 are mounted. The ceramic substrate 30 also functions as the metal substrate 21 and the insulating substrate 22 of the LED package 4.
　セラミックは比較的、熱伝導率が高いため、セラミック基板を使用すれば、パッケージ基板を開口部がない平坦な基板とすることが可能である。また、セラミック基板は割れやすい性質があるが、回路基板２にスリット１６を設けることで、上記の通り応力の緩和効果が得られるため、パッケージ基板としてセラミック基板を用いた場合でも、セラミック基板の割れを防止することができる。 Since ceramic has a relatively high thermal conductivity, if a ceramic substrate is used, the package substrate can be a flat substrate having no opening. Further, although the ceramic substrate has a property of being easily cracked, since the stress relaxation effect can be obtained as described above by providing the slit 16 in the circuit substrate 2, even when the ceramic substrate is used as the package substrate, the ceramic substrate is cracked. Can be prevented.
　図１０は、さらに別のＬＥＤパッケージ５の断面図である。ＬＥＤパッケージ５は、パッケージ基板２０に代えてリードフレーム４０を有する点、およびレンズ樹脂５５が追加されている点がＬＥＤパッケージ４とは異なるが、その他の点ではＬＥＤパッケージ４と同じ構成を有する。リードフレーム４０もパッケージ基板の一例であり、発光装置１は、ＬＥＤパッケージ４に代えて、図１０に示すＬＥＤパッケージ５を有してもよい。 FIG. 10 is a cross-sectional view of yet another LED package 5. The LED package 5 is different from the LED package 4 in that it has a lead frame 40 instead of the package substrate 20 and a lens resin 55 is added, but has the same configuration as the LED package 4 in other points. The lead frame 40 is also an example of a package substrate, and the light emitting device 1 may have the LED package 5 shown in FIG.
　リードフレーム４０は、上面にＬＥＤ素子５１が実装され裏面が放熱基板３に接触している実装部４１と、実装部４１よりも厚さが薄くＬＥＤ素子５１および回路基板２に電気的に接続されている電極部４４ａ，４４ｂとで構成される。実装部４１と電極部４４ａ，４４ｂの間、および電極部４４ａ，４４ｂと放熱基板３の間には、絶縁樹脂４２が充填されて互いに電気的に絶縁されている。リードフレーム４０を有するＬＥＤパッケージ５を使用すれば、ＬＥＤパッケージと放熱基板との間の電気的な絶縁性と、ＬＥＤパッケージから放熱基板への放熱性との両方を確保することが可能である。 The lead frame 40 is electrically connected to the LED element 51 and the circuit board 2, the mounting part 41 having the LED element 51 mounted on the upper surface and the back surface being in contact with the heat dissipation board 3, and being thinner than the mounting part 41. Electrode portions 44a and 44b. Insulating resin 42 is filled between the mounting portion 41 and the electrode portions 44a and 44b, and between the electrode portions 44a and 44b and the heat dissipation substrate 3 to be electrically insulated from each other. If the LED package 5 having the lead frame 40 is used, it is possible to ensure both electrical insulation between the LED package and the heat dissipation board and heat dissipation from the LED package to the heat dissipation board.
　レンズ樹脂５５は、ＬＥＤパッケージ５が挿入された開口部１２の上面側に形成されたほぼ半球状の部材であり、封止樹脂５４の全体を覆い、封止樹脂５４を通したＬＥＤ素子５１からの出射光を集光する。レンズ樹脂５５は、ＬＥＤパッケージ５が回路基板２の裏面側から開口部１２内に実装された後で、例えば、シリコーン樹脂などの透明樹脂を用いて、インジェクション成形により形成される。上記したＬＥＤパッケージ４，４’を使用する場合にも、回路基板２の上面側にはこうしたレンズ樹脂を形成してもよい。 The lens resin 55 is a substantially hemispherical member formed on the upper surface side of the opening 12 in which the LED package 5 is inserted. The lens resin 55 covers the entire sealing resin 54 and extends from the LED element 51 through the sealing resin 54. The emitted light is condensed. The lens resin 55 is formed by injection molding using, for example, a transparent resin such as a silicone resin after the LED package 5 is mounted in the opening 12 from the back side of the circuit board 2. Even when the LED packages 4 and 4 ′ described above are used, such a lens resin may be formed on the upper surface side of the circuit board 2.
　図１１は、別の発光装置１Ａの部分拡大図である。図１１では、発光装置１Ａにおける１つのＬＥＤパッケージの部分のみを拡大して示している。図１１に示したＬＥＤパッケージは上記のＬＥＤパッケージ４と同じものであるが、ＬＥＤパッケージ４とは異なり、パッケージ基板２０の四隅が、半田２５ａ，２５ｂ，２５ｃ，２５ｄにより回路基板２Ａの裏面側の配線パターンに接続されている。発光装置１Ａでは、回路基板２Ａは、１つのＬＥＤパッケージ当たり４個のスリット１６Ａを有する。スリット１６Ａは、スリット１６と同じ「く」の字型の形状を有し、半田２５ａ，２５ｂ，２５ｃ，２５ｄの接続位置であるＬＥＤパッケージ４の四隅に対応するように、その接続位置の近傍に形成されている。 FIG. 11 is a partially enlarged view of another light emitting device 1A. In FIG. 11, only the part of one LED package in the light emitting device 1A is shown in an enlarged manner. The LED package shown in FIG. 11 is the same as the LED package 4 described above. However, unlike the LED package 4, the four corners of the package substrate 20 are formed on the back side of the circuit board 2A by solder 25a, 25b, 25c, 25d. Connected to the wiring pattern. In the light emitting device 1A, the circuit board 2A has four slits 16A per LED package. The slit 16A has the same “<” shape as the slit 16, and is located in the vicinity of the connection position so as to correspond to the four corners of the LED package 4 where the solder 25a, 25b, 25c, and 25d are connected. Is formed.
　また、回路基板２Ａは、各ＬＥＤパッケージ４のパッケージ基板２０の各辺の中間に対応する位置で、４本のねじ１５Ａにより放熱基板３に固定されている。あるいは、ねじ１５Ａは、回路基板２Ａとパッケージ基板２０とを固定するものであってもよい。 The circuit board 2A is fixed to the heat dissipation board 3 with four screws 15A at positions corresponding to the middle of the sides of the package board 20 of each LED package 4. Alternatively, the screw 15A may fix the circuit board 2A and the package board 20.
　図１１に示したように、スリットの位置は２か所に限らず、４か所であってもよい。発光装置１Ａでも、発光装置１と同様に、半田接続に起因する応力と、ねじ止めに起因する応力の緩和効果が得られる。 As shown in FIG. 11, the positions of the slits are not limited to two, but may be four. In the light emitting device 1 </ b> A, as in the light emitting device 1, the stress caused by solder connection and the stress mitigating effect caused by screwing can be obtained.
　図１２（Ａ）および図１２（Ｂ）は、それぞれ、さらに別の発光装置１Ｂの上面図および側面図である。発光装置１Ｂは、実装されているＬＥＤパッケージ４の個数が１５個である点、および各ＬＥＤパッケージ４のパッケージ基板２０が放熱シート６を介して放熱基板３に接触している点が発光装置１とは異なるが、その他の点では発光装置１と同じ構成を有する。図１２（Ａ）および図１２（Ｂ）の符号２Ｂは、発光装置１Ｂの回路基板を示す。放熱シート６は、熱伝導性および弾性を有するラバータイプのシートである。 FIGS. 12A and 12B are a top view and a side view of yet another light emitting device 1B, respectively. In the light emitting device 1B, the number of mounted LED packages 4 is 15, and the point that the package substrate 20 of each LED package 4 is in contact with the heat radiating substrate 3 through the heat radiating sheet 6 is the light emitting device 1. However, it has the same configuration as the light emitting device 1 in other points. Reference numeral 2B in FIGS. 12A and 12B denotes a circuit board of the light-emitting device 1B. The heat dissipation sheet 6 is a rubber type sheet having thermal conductivity and elasticity.
　回路基板に複数のＬＥＤパッケージを実装した場合には、それらの半田付けの状態によっては、ＬＥＤパッケージごとに高さのバラつきが生じ得る。こうした高さのバラつきがあると、ＬＥＤパッケージ４と放熱基板３との間に隙間が生じてしまうことがあり、放熱基板３への放熱が不十分になるおそれがある。これに対処するためには、発光装置１Ｂのように、熱伝導性および弾性を有する放熱シート６を介して、各ＬＥＤパッケージ４のパッケージ基板２０を放熱基板３に接触させるとよい。放熱シート６があれば、複数のＬＥＤパッケージを回路基板に実装した場合の高さのバラつきを吸収することができ、各ＬＥＤパッケージから放熱基板への安定した熱接続が可能になる。 When a plurality of LED packages are mounted on a circuit board, the height of each LED package may vary depending on the soldering state. If there is such a variation in height, a gap may be formed between the LED package 4 and the heat dissipation board 3, and heat dissipation to the heat dissipation board 3 may be insufficient. In order to cope with this, the package substrate 20 of each LED package 4 is preferably brought into contact with the heat dissipation substrate 3 through the heat dissipation sheet 6 having thermal conductivity and elasticity as in the light emitting device 1B. With the heat dissipating sheet 6, it is possible to absorb variations in height when a plurality of LED packages are mounted on a circuit board, and a stable thermal connection from each LED package to the heat dissipating board becomes possible.
　図１３（Ａ）～図１３（Ｃ）は、それぞれ、さらに別の発光装置１Ｃの上面図、側面図および部分拡大図である。図１３（Ｃ）は、図１３（Ａ）および図１３（Ｂ）に符号ＸＩＩＩＣで示した部分の上面の拡大図である。発光装置１Ｃは、実装されているＬＥＤパッケージ４の個数が１５個である点、および回路基板２Ｃの四隅にスリット１６Ｃが形成されている点が発光装置１とは異なるが、その他の点では発光装置１と同じ構成を有する。スリット１６Ｃは、スリット１６と同じ「く」の字型の形状を有し、回路基板２Ｃの４つの角部のそれぞれにおいて、回路基板２と放熱基板３とを固定するねじ１４の周囲に、４個ずつ形成されている。 FIGS. 13A to 13C are a top view, a side view, and a partially enlarged view of still another light emitting device 1C, respectively. FIG. 13C is an enlarged view of the upper surface of the portion indicated by reference numeral XIIIC in FIGS. 13A and 13B. The light emitting device 1C is different from the light emitting device 1 in that the number of mounted LED packages 4 is 15, and the slits 16C are formed at the four corners of the circuit board 2C. It has the same configuration as the device 1. The slit 16 </ b> C has the same “<” shape as the slit 16, and is provided around the screw 14 that fixes the circuit board 2 and the heat dissipation board 3 at each of the four corners of the circuit board 2 </ b> C. It is formed one by one.
　回路基板の四隅をねじなどで固定すると、回路基板にたわみが生じ、例えば回路基板の中央部分が盛り上がって、ＬＥＤパッケージの接続不良が生じることがある。これに対処するためには、発光装置１Ｃのように、回路基板２Ｃの四隅における固定位置に隣接する位置にも、上記のスリット１６とは別のスリット１６Ｃを設けるとよい。スリット１６Ｃがあれば、スリット１６と同様に、ねじ１４により生じる応力の緩和効果が得られ、回路基板のたわみが少なくなるため、ＬＥＤパッケージの接続不良を回避することが可能になる。 When the four corners of the circuit board are fixed with screws or the like, the circuit board may bend, and for example, the central part of the circuit board may rise, resulting in poor connection of the LED package. In order to cope with this, it is preferable to provide slits 16C different from the slits 16 at positions adjacent to the fixed positions at the four corners of the circuit board 2C as in the light emitting device 1C. If there is the slit 16C, the effect of relieving the stress caused by the screw 14 is obtained as in the case of the slit 16, and the deflection of the circuit board is reduced. Therefore, it is possible to avoid the connection failure of the LED package.
　図２９は、裏面実装型のＬＥＤパッケージを含む発光装置の例を示す断面図である。この発光装置では、金属基板２１、絶縁基板２２、ＬＥＤ素子５１、樹脂枠５３および封止樹脂５４を有するＬＥＤパッケージが、回路基板２Ｄの段差付きの開口部（貫通孔）内に回路基板２Ｄの裏面側から実装されている。このＬＥＤパッケージは、絶縁基板２２の上面端部に形成された接続電極２４ａ，２４ｂの部分で回路基板２Ｄに半田接続されており、ＬＥＤパッケージおよび回路基板２Ｄの裏面側には、放熱基板３が配置されている。ＬＥＤ素子５１は、金属基板２１の上面中央に実装され、金属基板２１の上面外周部に固定された絶縁基板２２上の配線パターン２３ａ，２３ｂにワイヤ５２を介して電気的に接続され、さらに、絶縁基板２２上の樹脂枠５３内に充填された封止樹脂５４によって封止されている。 FIG. 29 is a cross-sectional view showing an example of a light emitting device including a back surface mount type LED package. In this light emitting device, the LED package having the metal substrate 21, the insulating substrate 22, the LED element 51, the resin frame 53, and the sealing resin 54 is formed on the circuit board 2D in a stepped opening (through hole) of the circuit board 2D. It is mounted from the back side. This LED package is solder-connected to the circuit board 2D at the connection electrodes 24a and 24b formed on the upper surface end of the insulating substrate 22, and the heat dissipation board 3 is disposed on the back side of the LED package and the circuit board 2D. Has been placed. The LED element 51 is mounted at the center of the upper surface of the metal substrate 21 and is electrically connected to the wiring patterns 23a and 23b on the insulating substrate 22 fixed to the outer peripheral portion of the upper surface of the metal substrate 21 via wires 52. It is sealed with a sealing resin 54 filled in a resin frame 53 on the insulating substrate 22.
　図２９に示した発光装置では、ＬＥＤパッケージの発光部である封止樹脂５４の上面から側方に向かう出射光Ｌの一部は、回路基板２Ｄの端面２Ｅに照射される。通常、回路基板の開口部には反射を考慮した特別な加工は施されておらず、回路基板の端面の反射率は低いため、発光部からの出射光の一部がこの端面に照射されることで、光学的な損失（ケラレ）が発生する。回路基板の厚さ（端面の大きさ）によっては、ＬＥＤ素子からの全光束のうち数％の損失が生じることもあり、これによって、基板上方への光取出し効率が低下する。回路基板を薄くしたり、開口部の径を大きくしたりすればこの損失量は少なくなるが、機械的な強度の観点から回路基板にはある程度の厚さが必要であり、利用可能なスペースにも限りがあることから、開口部の径を拡大するにも限度がある。 In the light emitting device shown in FIG. 29, a part of the emitted light L directed from the upper surface of the sealing resin 54 which is the light emitting portion of the LED package to the side is irradiated onto the end surface 2E of the circuit board 2D. Usually, the opening of the circuit board is not subjected to special processing in consideration of reflection, and the reflectance of the end face of the circuit board is low, so a part of the emitted light from the light emitting part is irradiated to this end face. As a result, optical loss (vignetting) occurs. Depending on the thickness of the circuit board (end face size), a loss of several percent of the total luminous flux from the LED element may occur, thereby reducing the light extraction efficiency above the board. If the circuit board is made thinner or the diameter of the opening is made larger, this loss will be reduced. However, the circuit board needs to have a certain thickness from the viewpoint of mechanical strength. Since there is a limit, there is a limit in enlarging the diameter of the opening.
　また、図２９に示したＬＥＤパッケージは、絶縁基板２２の端部に形成された接続電極２４ａ，２４ｂの部分のみで回路基板２Ｄに電気的かつ機械的に接続されているため、接合強度が弱く、その接合部分でＬＥＤパッケージが剥がれやすい。したがって、裏面実装型のＬＥＤパッケージを含む発光装置では、ＬＥＤパッケージと回路基板の間の接合強度を高める工夫も必要になる。そこで、以下では、光取出し効率とＬＥＤパッケージの接合強度を向上させた発光装置を説明する。 In addition, since the LED package shown in FIG. 29 is electrically and mechanically connected to the circuit board 2D only at the connection electrodes 24a and 24b formed at the end of the insulating substrate 22, the bonding strength is weak. The LED package is easily peeled off at the joint. Accordingly, in a light emitting device including a back surface mounting type LED package, a device for increasing the bonding strength between the LED package and the circuit board is also required. Therefore, in the following, a light emitting device with improved light extraction efficiency and LED package bonding strength will be described.
　図１４～図１６は、それぞれ、さらに別の発光装置１Ｄの斜視図、上面図および側面図である。また、図１７は放熱基板３が取り除かれた発光装置１Ｄの裏面図であり、図１８は発光装置１Ｄの回路基板２Ｄの上面図であり、図１９は図１５のＸＩＸ－ＸＩＸ線に沿った発光装置１Ｄの断面図である。発光装置１Ｄは、回路基板にスリット１６が形成されておらず、代わりに各開口部１２の周囲に環状樹脂５６が形成されている点が発光装置１とは異なるが、その他の点では、発光装置１と同様の構成を有する。以下では、発光装置１Ｄについて、発光装置１とは異なる点を中心に説明し、発光装置１と重複する説明は省略する。 14 to 16 are a perspective view, a top view, and a side view, respectively, of yet another light emitting device 1D. 17 is a rear view of the light emitting device 1D from which the heat dissipation substrate 3 is removed, FIG. 18 is a top view of the circuit board 2D of the light emitting device 1D, and FIG. 19 is taken along line XIX-XIX in FIG. It is sectional drawing of light-emitting device 1D. The light emitting device 1D is different from the light emitting device 1 in that the slit 16 is not formed on the circuit board and the annular resin 56 is formed around each opening 12 instead. It has the same configuration as the device 1. Hereinafter, the light emitting device 1 </ b> D will be described with a focus on differences from the light emitting device 1, and description overlapping with the light emitting device 1 will be omitted.
　図１５および図１９に示すように、発光装置１Ｄは、複数の開口部１２（図１８を参照）のそれぞれにおいて、その開口部１２内における回路基板２Ｄの端面の全周を囲むように塗布された環状樹脂５６を有する。環状樹脂５６は、光反射性の白色樹脂であり、例えば、シリコーン樹脂、エポキシ樹脂またはアクリル樹脂などに、反射性のフィラーとして、酸化チタン、二酸化ケイ素、二酸化ジルコニウム、アルミナまたは窒化ホウ素などの粒子を混入させて構成される。 As shown in FIGS. 15 and 19, the light emitting device 1 </ b> D is applied so as to surround the entire periphery of the end surface of the circuit board 2 </ b> D in each of the plurality of openings 12 (see FIG. 18). A ring-shaped resin 56. The cyclic resin 56 is a light-reflective white resin. For example, particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, or boron nitride are used as a reflective filler in a silicone resin, an epoxy resin, an acrylic resin, or the like. Consists of mixing.
　環状樹脂５６の下端は、開口部１２内に挿入されたＬＥＤパッケージ４の樹脂枠５３に接触せずにパッケージ基板２０の上面端部を覆い、環状樹脂５６の上端は、回路基板２Ｄの上面における開口部１２の縁部にまで達している。すなわち、環状樹脂５６は、ＬＥＤパッケージ４の封止樹脂５４を取り囲み、かつそのＬＥＤパッケージ４のパッケージ基板２０の上面および開口部１２内の回路基板２Ｄの端面（図２９の端面２Ｅに相当するもの）に接触するように成形されている。環状樹脂５６の表面は、開口部１２内で上方に向かうほどその開口部１２内の空間部分の径が大きくなるように単調に傾斜した斜面であることが好ましい。 The lower end of the annular resin 56 covers the upper surface end of the package substrate 20 without contacting the resin frame 53 of the LED package 4 inserted into the opening 12, and the upper end of the annular resin 56 is on the upper surface of the circuit board 2D. It reaches the edge of the opening 12. That is, the annular resin 56 surrounds the sealing resin 54 of the LED package 4, and the upper surface of the package substrate 20 of the LED package 4 and the end surface of the circuit substrate 2 </ b> D in the opening 12 (corresponding to the end surface 2 </ b> E in FIG. 29). ). The surface of the annular resin 56 is preferably a slope that is monotonously inclined so that the diameter of the space portion in the opening 12 becomes larger toward the upper side in the opening 12.
　なお、回路基板２Ｄの開口部１２も、図示した例とは異なり、矩形であってもよい。この場合、環状樹脂５６は、開口部１２内における回路基板２Ｄの端面の全周を囲むように、矩形の枠状に成形される。 Note that the opening 12 of the circuit board 2D may also be rectangular, unlike the illustrated example. In this case, the annular resin 56 is formed in a rectangular frame shape so as to surround the entire circumference of the end surface of the circuit board 2 </ b> D in the opening 12.
　図２０は、環状樹脂５６の働きを説明するための発光装置１Ｄの部分断面図である。発光装置１Ｄでは、光反射性の環状樹脂５６が開口部１２内の回路基板２Ｄの端面に塗布されていることにより、図２０に示すように、ＬＥＤパッケージ４の封止樹脂５４の上面から側方に向かう出射光Ｌは、環状樹脂５６の表面で発光装置１Ｄの上方に反射する。特に、環状樹脂５６の表面を傾斜面にすることにより、出射光Ｌは、発光装置１Ｄの上方に反射しやすくなる。このため、発光装置１Ｄでは、環状樹脂５６が設けられていない場合と比べて、ＬＥＤパッケージ４からの光取出し効率が向上する。 FIG. 20 is a partial cross-sectional view of the light emitting device 1D for explaining the function of the annular resin 56. In the light emitting device 1D, the light-reflective annular resin 56 is applied to the end surface of the circuit board 2D in the opening 12, so that the side from the top surface of the sealing resin 54 of the LED package 4 is shown in FIG. The outgoing light L traveling in the direction is reflected above the light emitting device 1D on the surface of the annular resin 56. In particular, by making the surface of the annular resin 56 an inclined surface, the emitted light L is easily reflected above the light emitting device 1D. For this reason, in light-emitting device 1D, the light extraction efficiency from LED package 4 improves compared with the case where the cyclic resin 56 is not provided.
　図２０に示すように、発光装置１Ｄでは、放熱基板３の上面から開口部１２における回路基板２Ｄの上面までの高さｈ１は、放熱基板３の上面からＬＥＤパッケージ４の樹脂枠５３の上端および封止樹脂５４の上面までの高さｈ２よりも大きい。環状樹脂５６は、このようにｈ１＞ｈ２である場合に、ＬＥＤパッケージ４からの光取出し効率を向上させるために特に有効である。 As shown in FIG. 20, in the light emitting device 1D, the height h1 from the upper surface of the heat dissipation board 3 to the upper surface of the circuit board 2D in the opening 12 is the upper end of the resin frame 53 of the LED package 4 from the upper surface of the heat dissipation board 3. The height to the upper surface of the sealing resin 54 is greater than h2. The cyclic resin 56 is particularly effective for improving the light extraction efficiency from the LED package 4 when h1> h2 as described above.
　また、発光装置１Ｄでは、各ＬＥＤパッケージ４は、パッケージ基板２０の端部で回路基板２Ｄの裏面側から開口部１２内の段差部分に半田接続されており、さらに、開口部１２内における回路基板２Ｄの端面を覆うように塗布された環状樹脂５６によっても、回路基板２Ｄに固定されている。発光装置１Ｄでは、開口部１２の全周にわたって環状樹脂５６が回路基板２Ｄの端面とパッケージ基板２０の上面に接触しているため、回路基板２ＤとＬＥＤパッケージ４との接合面積が比較的広くなる。このため、発光装置１Ｄでは、環状樹脂５６が設けられていない場合と比べて、回路基板２ＤとＬＥＤパッケージ４との機械的な接合強度も向上する。 Further, in the light emitting device 1D, each LED package 4 is solder-connected to the step portion in the opening 12 from the back surface side of the circuit board 2D at the end of the package substrate 20, and the circuit board in the opening 12 is further connected. The annular resin 56 applied so as to cover the 2D end face is also fixed to the circuit board 2D. In the light emitting device 1D, since the annular resin 56 is in contact with the end surface of the circuit board 2D and the upper surface of the package substrate 20 over the entire circumference of the opening 12, the bonding area between the circuit board 2D and the LED package 4 is relatively wide. . For this reason, in the light emitting device 1D, the mechanical bonding strength between the circuit board 2D and the LED package 4 is improved as compared with the case where the annular resin 56 is not provided.
　図２１は、発光装置１ＤでＬＥＤパッケージ４’を使用した場合の断面図である。図２２は、発光装置１ＤでＬＥＤパッケージ５を使用した場合の断面図である。発光装置１Ｄでも、図２１および図２２に示すように、ＬＥＤパッケージ４を、セラミック基板３０を有するＬＥＤパッケージ４’に代えてもよいし、リードフレーム４０およびレンズ樹脂５５を有するＬＥＤパッケージ５に代えてもよい。ＬＥＤパッケージ５を使用する場合には、図２２に示すように、レンズ樹脂５５は、回路基板２Ｄの開口部１２ごとに、封止樹脂５４および環状樹脂５６を覆うように配置されていてもよい。 FIG. 21 is a cross-sectional view when the LED package 4 'is used in the light emitting device 1D. FIG. 22 is a cross-sectional view when the LED package 5 is used in the light emitting device 1D. Also in the light emitting device 1D, as shown in FIGS. 21 and 22, the LED package 4 may be replaced with the LED package 4 ′ having the ceramic substrate 30, or the LED package 5 having the lead frame 40 and the lens resin 55. May be. When the LED package 5 is used, as shown in FIG. 22, the lens resin 55 may be disposed so as to cover the sealing resin 54 and the annular resin 56 for each opening 12 of the circuit board 2D. .
　図２３（Ａ）および図２３（Ｂ）は、それぞれ、別の環状樹脂５６Ａ，５６Ｂを使用した場合の発光装置１Ｄの部分断面図である。環状樹脂５６Ａ，５６Ｂは、環状樹脂５６と同様の材質で構成されるが、各開口部１２内の回路基板２Ｄの端面２Ｅとその開口部１２に挿入されたＬＥＤパッケージ４の樹脂枠５３との間にあるパッケージ基板２０上の領域を埋め尽くしている。このように、開口部１２の中央側における環状樹脂５６Ｂの端部は、開口部１２内に挿入されたＬＥＤパッケージ４の樹脂枠５３に接触していてもよい。図２３（Ａ）よりも図２３（Ｂ）の場合の方が、環状樹脂として塗布される樹脂の量が多く、図２３（Ｂ）では、環状樹脂５６Ｂの端部は樹脂枠５３の直上にまで達している。環状樹脂としてこれ以上の樹脂を塗布すると、環状樹脂が封止樹脂５４の上面を覆ってしまい、発光の妨げになるので、樹脂の量は図２３（Ｂ）の例よりも少ない方が好ましい。 23 (A) and 23 (B) are partial cross-sectional views of the light emitting device 1D when different annular resins 56A and 56B are used, respectively. The annular resins 56A and 56B are made of the same material as the annular resin 56, but the end surface 2E of the circuit board 2D in each opening 12 and the resin frame 53 of the LED package 4 inserted in the opening 12 are used. The region on the package substrate 20 between them is filled. As described above, the end of the annular resin 56 </ b> B on the center side of the opening 12 may be in contact with the resin frame 53 of the LED package 4 inserted into the opening 12. In the case of FIG. 23B, the amount of resin applied as the cyclic resin is larger than that in FIG. 23A. In FIG. 23B, the end of the cyclic resin 56B is directly above the resin frame 53. Has reached. If more resin than this is applied as the cyclic resin, the cyclic resin covers the upper surface of the sealing resin 54 and hinders light emission. Therefore, the amount of resin is preferably smaller than the example of FIG.
　なお、これまでに説明した各図では、樹脂枠５３の断面が矩形であり、その上端が平坦面になっているが、図２３（Ａ）および図２３（Ｂ）に示すように、樹脂枠５３の断面は丸みを帯びた形状であってもよい。 In each of the drawings described so far, the cross section of the resin frame 53 is rectangular and the upper end thereof is a flat surface. However, as shown in FIGS. 23 (A) and 23 (B), the resin frame 53 The cross section of 53 may be rounded.
　図２４（Ａ）および図２４（Ｂ）は、それぞれ、さらに別の環状樹脂５６Ｃの上面図および断面図である。図２４（Ｂ）は、図２４（Ａ）ＸＸＩＶＢ－ＸＸＩＶＢ線に沿った環状樹脂５６Ｃの断面を示す。上記の環状樹脂５６，５６Ａ，５６Ｂは、各ＬＥＤパッケージ４が回路基板２Ｄに実装された後で、回路基板２Ｄ上に樹脂を塗布することで形成される。しかしながら、図２４（Ａ）および図２４（Ｂ）に示す環状樹脂５６Ｃのように、樹脂成型などにより環状樹脂を予め単体の部品として作製してもよく、それを回路基板２Ｄの各開口部１２に嵌め込んでもよい。 FIGS. 24A and 24B are a top view and a cross-sectional view of still another cyclic resin 56C, respectively. FIG. 24B shows a cross section of the cyclic resin 56C along the line XXIVB-XXIVB in FIG. The annular resins 56, 56A, and 56B are formed by applying a resin on the circuit board 2D after each LED package 4 is mounted on the circuit board 2D. However, as in the annular resin 56C shown in FIGS. 24A and 24B, the annular resin may be produced in advance as a single component by resin molding or the like, and this is formed in each opening 12 of the circuit board 2D. It may be fitted in.
　図２５は、さらに別のＬＥＤパッケージ５’の断面図である。ＬＥＤパッケージ５’は、図１０および図２２に示すＬＥＤパッケージ５と同様に、半球状のレンズ樹脂５５’が形成されたＬＥＤパッケージである。上記のＬＥＤパッケージ５のレンズ樹脂５５は、ＬＥＤパッケージ５が回路基板２に実装された後で回路基板２の開口部１２の上面側全体を覆うように形成される。一方、ＬＥＤパッケージ５’のレンズ樹脂５５’は、回路基板２Ｄの開口部１２の上面側全体を覆うほど大きくはなく、ＬＥＤパッケージ５’の樹脂枠５３および封止樹脂５４の上方のみに広がるように、ＬＥＤパッケージ単体の段階で形成される。上記の発光装置１，１Ａ～１Ｄおよび次に説明する発光装置１Ｅでは、ＬＥＤパッケージ５’のように予めレンズ樹脂が形成されたＬＥＤパッケージを用いてもよい。 FIG. 25 is a cross-sectional view of yet another LED package 5 '. The LED package 5 ′ is an LED package in which a hemispherical lens resin 55 ′ is formed, similar to the LED package 5 shown in FIGS. 10 and 22. The lens resin 55 of the LED package 5 is formed so as to cover the entire upper surface side of the opening 12 of the circuit board 2 after the LED package 5 is mounted on the circuit board 2. On the other hand, the lens resin 55 ′ of the LED package 5 ′ is not so large as to cover the entire upper surface side of the opening 12 of the circuit board 2D, and spreads only above the resin frame 53 and the sealing resin 54 of the LED package 5 ′. In addition, it is formed at the stage of a single LED package. In the light emitting devices 1 and 1A to 1D and the light emitting device 1E described below, an LED package in which a lens resin is formed in advance, such as the LED package 5 ', may be used.
　図２６は、さらに別の発光装置１Ｅの上面図である。発光装置１Ｅは、発光装置１Ｄのものと同じ環状樹脂５６が追加されている点のみが上記の発光装置１とは異なり、その他の点では発光装置１と同様の構成を有する。発光装置１Ｅのように、１つの発光装置が、発光装置１のスリット１６と発光装置１Ｄの環状樹脂５６の両方の構成を有してもよい。これにより、発光装置１Ｅでは、発光装置１と同様に応力を緩和する効果と、発光装置１Ｄと同様に光取出し効率およびＬＥＤパッケージ４の接合強度が向上する効果が得られる。 FIG. 26 is a top view of yet another light emitting device 1E. The light emitting device 1E is different from the light emitting device 1 only in that the same cyclic resin 56 as that of the light emitting device 1D is added, and has the same configuration as the light emitting device 1 in other points. Like the light emitting device 1E, one light emitting device may have both the slit 16 of the light emitting device 1 and the annular resin 56 of the light emitting device 1D. Thereby, in the light-emitting device 1E, the effect of relieving stress as in the light-emitting device 1 and the effect of improving the light extraction efficiency and the bonding strength of the LED package 4 as in the light-emitting device 1D are obtained.
　図２７は、発光装置１Ｅにおける放熱基板の形状の例を示す図である。上記の発光装置１，１Ｄの放熱基板３は、発光装置内のすべてのＬＥＤパッケージ４を覆うのに十分な大きさを有する１枚の金属基板で構成される。一方、図２７に示した例における放熱基板３’は、符号３ａ，３ｂで示す２枚の金属基板で構成され、一方の放熱基板３ａは一部のＬＥＤパッケージ４に接触し、他方の放熱基板３ｂは残りのＬＥＤパッケージ４に接触している。このように、発光装置の放熱基板は、必ずしも１枚ですべてのＬＥＤパッケージに接触していなくてもよく、複数枚ですべてのＬＥＤパッケージを覆うように配置されていてもよい。なお、放熱基板は、ヒートシンクとして機能するものであればよいので、その形状は平坦な板状のものに限らず、放熱フィンなどが形成されたものであってもよい。 FIG. 27 is a diagram showing an example of the shape of the heat dissipation board in the light emitting device 1E. The heat radiating substrate 3 of the light emitting devices 1 and 1D is composed of one metal substrate having a size sufficient to cover all the LED packages 4 in the light emitting device. On the other hand, the heat radiating board 3 ′ in the example shown in FIG. 27 is composed of two metal substrates denoted by reference numerals 3a and 3b. One heat radiating board 3a is in contact with a part of the LED packages 4 and the other heat radiating board. 3 b is in contact with the remaining LED package 4. Thus, the heat dissipation substrate of the light emitting device does not necessarily have to be in contact with all the LED packages, and a plurality of the heat dissipation substrates may be arranged so as to cover all the LED packages. In addition, since the heat dissipation board should just function as a heat sink, the shape is not limited to a flat plate shape, and may be formed with heat dissipation fins.

Claims (10)

  1. 　複数の開口部が形成された回路基板と、
    　上面の端部に前記回路基板との接続電極が形成されたパッケージ基板、前記パッケージ基板上に実装された複数のＬＥＤ素子および前記複数のＬＥＤ素子を封止する封止樹脂をそれぞれが有し、前記回路基板の裏面側から前記複数の開口部内にそれぞれ挿入され、前記接続電極が前記回路基板の裏面に電気的に接続された複数のＬＥＤパッケージと、
    　前記回路基板との間で前記複数のＬＥＤパッケージの前記パッケージ基板を挟むように前記回路基板の裏面側に配置された放熱基板と、
    　を有することを特徴とする発光装置。     A circuit board having a plurality of openings formed therein;
    Each has a package substrate in which connection electrodes to the circuit board are formed at end portions of the upper surface, a plurality of LED elements mounted on the package substrate, and a sealing resin for sealing the plurality of LED elements, A plurality of LED packages inserted into the plurality of openings from the back side of the circuit board, and the connection electrodes are electrically connected to the back side of the circuit board;
    A heat dissipation board disposed on the back side of the circuit board so as to sandwich the package board of the plurality of LED packages with the circuit board;
    A light emitting device comprising:
  2. 　前記複数のＬＥＤパッケージの前記接続電極は、前記回路基板の裏面に半田接続され、
    　前記回路基板には、前記複数のＬＥＤパッケージの前記接続電極がそれぞれ半田接続される接続位置に隣接する位置にスリットが形成されている、請求項１に記載の発光装置。     The connection electrodes of the plurality of LED packages are solder-connected to the back surface of the circuit board,
    2. The light emitting device according to claim 1, wherein a slit is formed in the circuit board at a position adjacent to a connection position where the connection electrodes of the plurality of LED packages are connected by soldering.
  3. 　前記複数のＬＥＤパッケージの前記接続電極は、前記パッケージ基板の対向する２つの角部にそれぞれ形成され、
    　前記スリットは、前記パッケージ基板の前記２つの角部に対応するように形成され、
    　前記回路基板は、前記パッケージ基板の他の２つの角部に対応する位置で、前記複数のＬＥＤパッケージまたは前記放熱基板に機械的に固定されている、請求項２に記載の発光装置。     The connection electrodes of the plurality of LED packages are respectively formed at two opposing corners of the package substrate,
    The slit is formed to correspond to the two corners of the package substrate,
    The light emitting device according to claim 2, wherein the circuit board is mechanically fixed to the plurality of LED packages or the heat dissipation board at positions corresponding to the other two corners of the package board.
  4. 　前記複数のＬＥＤパッケージの前記接続電極は、前記パッケージ基板の四隅にそれぞれ形成され、
    　前記スリットは、前記パッケージ基板の前記四隅に対応するように形成され、
    　前記回路基板は、前記パッケージ基板の各辺の中間に対応する位置で、前記複数のＬＥＤパッケージまたは前記放熱基板に機械的に固定されている、請求項２に記載の発光装置。     The connection electrodes of the plurality of LED packages are respectively formed at four corners of the package substrate,
    The slits are formed to correspond to the four corners of the package substrate,
    The light emitting device according to claim 2, wherein the circuit board is mechanically fixed to the plurality of LED packages or the heat dissipation board at a position corresponding to the middle of each side of the package board.
  5. 　前記複数のＬＥＤパッケージの前記パッケージ基板は、弾性を有する放熱シートを介して前記放熱基板に接触している、請求項２～４のいずれか一項に記載の発光装置。 5. The light emitting device according to claim 2, wherein the package substrate of the plurality of LED packages is in contact with the heat dissipation substrate through an elastic heat dissipation sheet.
  6. 　前記回路基板の四隅が前記放熱基板に機械的に固定され、
    　前記回路基板には、さらに、前記回路基板の四隅における固定位置に隣接する位置にも別のスリットが形成されている、請求項２～５のいずれか一項に記載の発光装置。     Four corners of the circuit board are mechanically fixed to the heat dissipation board,
    The light emitting device according to any one of claims 2 to 5, wherein the circuit board is further formed with another slit at a position adjacent to a fixed position at four corners of the circuit board.
  7. 　前記複数の開口部のそれぞれにおいて、当該開口部に挿入されたＬＥＤパッケージの前記封止樹脂を取り囲み、かつ前記パッケージ基板の上面および当該開口部内の前記回路基板の端面に接触するように成形された光反射性の環状樹脂をさらに有する、請求項１～６のいずれか一項に記載の発光装置。 Each of the plurality of openings is formed so as to surround the sealing resin of the LED package inserted into the opening and to be in contact with the upper surface of the package substrate and the end surface of the circuit board in the opening. The light emitting device according to any one of claims 1 to 6, further comprising a light reflective cyclic resin.
  8. 　前記環状樹脂は、前記開口部内で上方に向かうほど当該開口部内の空間部分の径が大きくなるように傾斜した斜面を有する、請求項７に記載の発光装置。 The light emitting device according to claim 7, wherein the annular resin has an inclined surface that is inclined so that a diameter of a space portion in the opening increases toward the upper side in the opening.
  9. 　前記複数のＬＥＤパッケージのそれぞれは、前記複数のＬＥＤ素子を取り囲むように前記パッケージ基板に形成され内部に前記封止樹脂が充填された樹脂枠をさらに有し、
    　前記環状樹脂は、前記複数の開口部のそれぞれにおいて、当該開口部内の前記回路基板の端面と当該開口部に挿入されたＬＥＤパッケージの前記樹脂枠との間にある前記パッケージ基板上の領域を埋め尽くしている、請求項７または８に記載の発光装置。     Each of the plurality of LED packages further includes a resin frame formed on the package substrate so as to surround the plurality of LED elements and filled with the sealing resin therein.
    In each of the plurality of openings, the annular resin fills a region on the package substrate between an end surface of the circuit board in the opening and the resin frame of the LED package inserted in the opening. The light emitting device according to claim 7 or 8, which is exhausted.
  10. 　前記放熱基板の上面から前記複数の開口部における前記回路基板の上面までの高さは、前記放熱基板の上面から前記複数のＬＥＤパッケージの前記封止樹脂の上面までの高さよりも大きい、請求項７～９のいずれか一項に記載の発光装置。 The height from the upper surface of the heat dissipation substrate to the upper surface of the circuit board in the plurality of openings is greater than the height from the upper surface of the heat dissipation substrate to the upper surface of the sealing resin of the plurality of LED packages. The light emitting device according to any one of 7 to 9.
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Cited By (9)

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CN109899723A (en) * 2019-03-21 2019-06-18 苏州源泽光电科技集团有限公司 A kind of ceramic heat-dissipating LED downlight
JP2019212752A (en) * 2018-06-05 2019-12-12 日亜化学工業株式会社 Light-emitting device
JPWO2021039096A1 (en) * 2019-08-27 2021-03-04
WO2021182585A1 (en) * 2020-03-13 2021-09-16 シチズン電子株式会社 Light-emitting device, manufacturing method therefor, and surface light-emitting device
JP2022025833A (en) * 2020-07-30 2022-02-10 日本特殊陶業株式会社 Semiconductor package and semiconductor package array
JP2023143976A (en) * 2018-12-12 2023-10-06 日亜化学工業株式会社 Manufacturing method of light emitting module, light emitting module, and projector
US11949209B2 (en) 2018-06-14 2024-04-02 Nichia Corporation Semiconductor device and method of manufacturing the semiconductor device
US11967803B2 (en) 2018-12-12 2024-04-23 Nichia Corporation Method of manufacturing light emitting module, light emitting module, and projector
CN113497075B (en) * 2020-04-01 2024-06-11 刘台徽 Full-color miniature light-emitting diode packaging body and packaging method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311791A (en) * 2003-04-08 2004-11-04 Sharp Corp Lighting device, backlight and display
JP2006303191A (en) * 2005-04-20 2006-11-02 Matsushita Electric Works Ltd Led unit
JP2007200727A (en) * 2006-01-26 2007-08-09 Matsushita Electric Works Ltd Lighting device
JP2009117124A (en) * 2007-11-05 2009-05-28 Harison Toshiba Lighting Corp Light source unit
JP2010010659A (en) * 2008-05-30 2010-01-14 Toshiba Lighting & Technology Corp Substrate and lighting apparatus
JP2010098181A (en) * 2008-10-17 2010-04-30 Citizen Electronics Co Ltd Led light-emitting device
US20120012881A1 (en) * 2011-05-04 2012-01-19 Lee Gun Kyo Light emitting device module and lighting system including the same
WO2013018783A1 (en) * 2011-08-01 2013-02-07 株式会社Ｓｔｅｑ Semiconductor device and fabrication method for same
JP2015220307A (en) * 2014-05-16 2015-12-07 日亜化学工業株式会社 Light-emitting device and method for manufacturing the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311791A (en) * 2003-04-08 2004-11-04 Sharp Corp Lighting device, backlight and display
JP2006303191A (en) * 2005-04-20 2006-11-02 Matsushita Electric Works Ltd Led unit
JP2007200727A (en) * 2006-01-26 2007-08-09 Matsushita Electric Works Ltd Lighting device
JP2009117124A (en) * 2007-11-05 2009-05-28 Harison Toshiba Lighting Corp Light source unit
JP2010010659A (en) * 2008-05-30 2010-01-14 Toshiba Lighting & Technology Corp Substrate and lighting apparatus
JP2010098181A (en) * 2008-10-17 2010-04-30 Citizen Electronics Co Ltd Led light-emitting device
US20120012881A1 (en) * 2011-05-04 2012-01-19 Lee Gun Kyo Light emitting device module and lighting system including the same
WO2013018783A1 (en) * 2011-08-01 2013-02-07 株式会社Ｓｔｅｑ Semiconductor device and fabrication method for same
JP2015220307A (en) * 2014-05-16 2015-12-07 日亜化学工業株式会社 Light-emitting device and method for manufacturing the same

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7364971B2 (en) 2018-06-05 2023-10-19 日亜化学工業株式会社 light emitting device
JP2019212752A (en) * 2018-06-05 2019-12-12 日亜化学工業株式会社 Light-emitting device
JP7231809B2 (en) 2018-06-05 2023-03-02 日亜化学工業株式会社 light emitting device
JP2023052858A (en) * 2018-06-05 2023-04-12 日亜化学工業株式会社 Light-emitting device
JP2023052842A (en) * 2018-06-05 2023-04-12 日亜化学工業株式会社 Light-emitting device
JP7364970B2 (en) 2018-06-05 2023-10-19 日亜化学工業株式会社 light emitting device
US11949209B2 (en) 2018-06-14 2024-04-02 Nichia Corporation Semiconductor device and method of manufacturing the semiconductor device
US11967803B2 (en) 2018-12-12 2024-04-23 Nichia Corporation Method of manufacturing light emitting module, light emitting module, and projector
JP7406175B2 (en) 2018-12-12 2023-12-27 日亜化学工業株式会社 Manufacturing method of light emitting module, light emitting module and projector
JP2023162205A (en) * 2018-12-12 2023-11-08 日亜化学工業株式会社 Manufacturing method of light emitting module, light emitting module, and projector
JP2023143976A (en) * 2018-12-12 2023-10-06 日亜化学工業株式会社 Manufacturing method of light emitting module, light emitting module, and projector
CN109899723A (en) * 2019-03-21 2019-06-18 苏州源泽光电科技集团有限公司 A kind of ceramic heat-dissipating LED downlight
JP7268170B2 (en) 2019-08-27 2023-05-02 京セラ株式会社 electronic device
JPWO2021039096A1 (en) * 2019-08-27 2021-03-04
WO2021182585A1 (en) * 2020-03-13 2021-09-16 シチズン電子株式会社 Light-emitting device, manufacturing method therefor, and surface light-emitting device
CN113497075B (en) * 2020-04-01 2024-06-11 刘台徽 Full-color miniature light-emitting diode packaging body and packaging method thereof
JP7291675B2 (en) 2020-07-30 2023-06-15 日本特殊陶業株式会社 Semiconductor package array
JP2022025833A (en) * 2020-07-30 2022-02-10 日本特殊陶業株式会社 Semiconductor package and semiconductor package array

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