WO2017204245A1 - Board assembly and electronic endoscope system - Google Patents

Board assembly and electronic endoscope system Download PDF

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Publication number
WO2017204245A1
WO2017204245A1 PCT/JP2017/019351 JP2017019351W WO2017204245A1 WO 2017204245 A1 WO2017204245 A1 WO 2017204245A1 JP 2017019351 W JP2017019351 W JP 2017019351W WO 2017204245 A1 WO2017204245 A1 WO 2017204245A1
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WO
WIPO (PCT)
Prior art keywords
board
relay
parent
connector
cable
Prior art date
Application number
PCT/JP2017/019351
Other languages
French (fr)
Japanese (ja)
Inventor
敦 小師
Original Assignee
Hoya株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya株式会社 filed Critical Hoya株式会社
Priority to CN201790000662.6U priority Critical patent/CN209376016U/en
Priority to JP2018519580A priority patent/JP6646342B2/en
Publication of WO2017204245A1 publication Critical patent/WO2017204245A1/en

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Definitions

  • the present invention relates to a board assembly in which a relay board to which a cable is attached and a parent board are connected by a board-to-board connector, and an electronic endoscope system including the board assembly.
  • an electronic scope having an imaging device, an endoscope processor for processing an imaging signal transmitted from the electronic scope, and an endoscope processor
  • An electronic endoscope system including a monitor that displays an observation image based on a processed imaging signal is known.
  • power supply and signal input / output to the imaging device at the distal end of the electronic scope are performed via a cable.
  • the connection of the cables from these image sensors to the endoscope processor is usually configured to be once connected by a connector via a circuit board. Conventionally, the cable is soldered to the circuit board.
  • Patent Document 1 discloses a configuration example for reducing the total thickness of a connection portion of a coaxial cable to a substrate.
  • a small relay board is used on the cable side using a board-to-board connector. That is, the cable from the image sensor is connected to the circuit board (parent board) using the board-to-board connector via the small relay board.
  • the width of the small relay board is limited.
  • the cables must not protrude in the width direction of the small relay board, and thus the process of stacking the cables in the thickness direction is unavoidable.
  • the thickness of the cable processing becomes too large, there may be a problem in the fitting between the connectors due to the height restriction of the board-to-board connector.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to connect a relay board of a cable to a parent board using a board-to-board connector, and the number of cables connected to the relay board is
  • the present invention is to provide a board assembly capable of eliminating the board-to-board connector fitting failure even when the board is increased, and an electronic endoscope system including the board assembly.
  • One embodiment of the present invention includes a parent board provided with a board-to-board connector, and a relay board provided with a cable and provided with a board-to-board connector.
  • the parent board and the relay board are connected to the board-to-board.
  • a board assembly in which connectors are fitted and connected so that the cable is sandwiched between the parent board and the relay board.
  • Each of the parent substrate and the relay substrate has a laminated structure of a plurality of layers.
  • the first total number of layers which is the sum of the number of layers of the layer of the relay board and the number of layers of the layer of the parent board in the board-to-board connector mounting part, is It is larger than the second total number of layers, which is the sum of the number of layers of the layer of the relay substrate and the number of layers of the layer of the parent substrate in the corresponding portion of the parent substrate corresponding to the attachment portion.
  • the substrate assembly is configured.
  • the cable mounting portion on the relay board is connected to the parent board. Since there is no interference, the board-to-board connector failure can be solved.
  • the fitting failure includes not being electrically connected between the connectors.
  • the layers are partially overlapped so that the number of layers stacked partially increases in the mounting portion of the board-to-board connector.
  • the parent substrate it is also preferable that a part of the layer is partially removed so that the number of layers of the parent substrate in the corresponding portion is partially reduced.
  • the layers are partially overlapped so that the number of layers stacked partially increases in the mounting portion of the board-to-board connector.
  • the height of the top of the attachment portion of the cable to the relay board from the fitting side face of the relay board is A, and the fitting side face of the parent board and the relay board in the mounting portion It is preferable that A ⁇ B + C is satisfied, where B is a distance between the fitting side surfaces and C is an increase in thickness due to the partially overlapped layer.
  • the height of the top of the attachment portion of the cable to the relay board from the fitting side face of the relay board is A, and the fitting side face of the parent board and the relay in the mounting part A ⁇ B + C ′ is satisfied, where B is the distance from the mating side surface of the substrate, and C ′ is a decrease in the thickness of the parent substrate due to partial removal of the layer. Is preferable.
  • the height of the top of the attachment portion of the cable to the relay board from the fitting side face of the relay board is A, and the fitting side face of the parent board and the relay in the mounting part It is preferable that A ⁇ B + C ′′ is satisfied, where B is the distance from the mating side surface of the substrate and C ′′ is the increase in thickness due to the layer partially overlapped with the relay substrate.
  • Another aspect of the present invention also includes a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector, and the parent board and the relay board are connected to the board.
  • the board assembly is configured such that the connectors on the board are fitted and connected to each other, and the cable is sandwiched between the parent board and the relay board.
  • Each of the parent substrate and the relay substrate has a laminated structure of a plurality of layers. The distance between the facing surfaces of the relay board and the parent board in the attachment part of the cable to the relay board is such that the top of the attachment part of the cable to the relay board is in the mounting part of the board-to-board connector.
  • the substrate thickness of at least one of the parent substrate and the relay substrate is partially changed so as to be larger than the height from the fitting side surface of the relay substrate. According to such a structure, even if the number of cables connected to the relay board increases, the cable mounting portion on the relay board does not interfere with the parent board, so the board-to-board It is possible to eliminate the connector fitting failure.
  • At least one of the parent substrate and the relay substrate is configured so that a thickness of at least one of the parent substrate and the relay substrate is partially increased.
  • the parent substrate is configured such that the thickness of the portion of the parent substrate facing the mounting portion is partially reduced.
  • Still another embodiment of the present invention also includes a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector.
  • the board assembly is a board assembly in which board-to-board connectors are fitted and connected so that the cable is sandwiched between the parent board and the relay board.
  • the surface of the mounting portion of the board-to-board connector of at least one of the relay substrate and the parent substrate is configured to protrude with respect to the surface of the portion around the mounting portion.
  • Still another embodiment of the present invention also includes a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector.
  • the board assembly is a board assembly in which board-to-board connectors are fitted and connected so that the cable is sandwiched between the parent board and the relay board.
  • the surface of the corresponding portion of the parent substrate corresponding to the portion where the cable is attached to the relay substrate is configured to be recessed in the direction away from the relay substrate with respect to the surface of the portion around the corresponding portion.
  • the electronic endoscope system is A light source device that emits light; An endoscope provided with an image sensor that images the subject illuminated with the light; A processor connected to the connector portion of the endoscope and processing an image of a subject imaged by the imaging device; And a monitor for displaying the processed image.
  • the connector portion includes the board assembly, and the cable includes at least a signal transmission cable extending from the imaging element.
  • FIG. 1 is a block diagram showing an example of the configuration of an electronic endoscope system 1 to which the substrate assembly of the present embodiment is applied.
  • An endoscope system 1 illustrated in FIG. 1 is a medical imaging system, and includes an electronic scope 100, an endoscope processor 200, and a monitor 300.
  • the electronic scope 100 has an insertion tube 100A and a connector portion 100B.
  • An objective optical system 101, an imaging unit 102, and an illumination optical system 103 are provided in the insertion tube 100A.
  • a circuit board 11 is provided in the connector portion 100B.
  • the circuit board 11 includes an image sensor driver 104 and an AFE (Analog Front End) 105.
  • a light guide 106 is disposed from the connector portion 100B to the distal end portion 100C of the insertion tube 100A.
  • the imaging unit 102 and the circuit board 11 are connected by a plurality of cables 14 and a relay board 13. The configuration of the connection portion between the relay board 13 and the circuit board 11 will be described in detail later.
  • the endoscope processor 200 incorporates an endoscope image processing apparatus, and includes a system controller 201, a timing controller 202, a light source unit 203, an image processing unit 204, and a front panel 205.
  • the light source unit 203 includes a light source driver 203A, a light source 203B, and a condenser lens 203C.
  • the system controller 201 controls each element constituting the endoscope system 1.
  • the timing controller 202 transmits a clock signal for adjusting the signal processing timing to each circuit in the endoscope system 1.
  • the light source 203B is driven and controlled by the light source driver 203A to emit white light.
  • a high-intensity lamp such as a xenon lamp, a halogen lamp, a mercury lamp, or a metal halide lamp is used.
  • the illumination light emitted from the light source 203B is incident on the light guide 106 via the condenser lens 203C, and is guided in the light guide 106 toward the distal end portion 100C of the electronic scope 100.
  • the light guide 106 is, for example, an LCB (Light Carrying Bundle) in which a plurality of optical fibers are bundled.
  • the illumination light guided in the light guide 106 is emitted from the end surface of the light guide 106 disposed in the distal end portion 100C. Illumination light emitted from the end face of the light guide 106 is emitted from the distal end portion 100C via the illumination optical system 103 and illuminates the subject. Illumination light (reflected light) reflected by the subject enters the imaging unit 102 via the objective optical system 101.
  • the imaging unit 102 has an imaging element (not shown). The reflected light incident on the imaging unit 102 forms a subject image on the light receiving surface of each pixel included in the imaging device.
  • the image sensors have color filters of green (G), cyan (Cy), magenta (Mg), yellow (Ye) (or red (R), green (G), blue (B)), G, Cy. , Mg, Ye (R, G, B) pixels.
  • Each pixel accumulates the formed subject image as a charge corresponding to the amount of light, and pixel signals corresponding to each color of G, Cy, Mg, Ye (R, G, B) (G pixel signal, Cy pixel signal, (Mg pixel signal, Ye pixel signal) (R pixel signal, G pixel signal, B pixel signal).
  • the converted pixel signals are subjected to signal amplification processing and A / D conversion processing by the AFE 105, and are transmitted to the image processing unit 204 of the endoscope processor 200.
  • a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor is used as the imaging device.
  • the pixel signal received by the image processing unit 204 is converted into a video signal by predetermined signal processing and transmitted to the monitor 300.
  • the monitor 300 displays an observation image based on the video signal received from the image processing unit 204.
  • the electronic endoscope system is an electronic scope 100 (electronic endoscope) including the light source unit 203 (light source device) that emits light and the imaging unit 102 that includes the imaging element that images the illuminated subject. And an endoscope processor 200 (processor) that is connected to the connector unit 100B of the electronic scope 100 and processes an image of a subject imaged by an image sensor, and a monitor 300 that displays the processed image.
  • the connector unit 100B of the electronic scope 100 includes a board assembly in which a relay board is connected to a parent board using a board-to-board connector, which will be described later.
  • the cable attached to the relay board includes at least a signal transmission cable extending from the image sensor. Since the signal transmission cable extending from the imaging device is reliably electrically connected to the circuit board 11 by the board-to-board connectors 31 and 34, an image signal can be supplied to the endoscope processor 200.
  • FIG. 2 is a diagram illustrating a configuration of a main part of the configuration of the board assembly 10, that is, a connection portion between the relay board 13 and the circuit board 11.
  • the relay board 13 is connected to the circuit board 11 on a board-to-board basis.
  • the state connected by the connector connection is a state viewed from the side of the relay board 13 opposite to the connector fitting surface (hereinafter also referred to as the surface).
  • the circuit board 11 and the relay board 13 are both boards having a laminated structure of a plurality of layers.
  • a board-to-board connector for example, a connector plug
  • the board connector 31 is connected to a board-to-board connector (for example, a connector receptacle) 34 (see FIG. 4B) mounted on the circuit board 11 side by connector fitting.
  • the plurality of cables 14 are connected to the plurality of lands 33 of the relay board 13 by soldering.
  • the plurality of cables 14 are bundled in a composite cable 20 including a shield member.
  • the plurality of cables 14 include an insulated wire and a coaxial cable for transmitting signals for inputting / outputting various signals between the circuit board 11 and the imaging unit 102.
  • the land 33 and the cable 14 may be provided with reference numerals only for some of them for convenience of illustration.
  • the relay substrate 13 Since the relay substrate 13 needs to be inserted into the insertion tube 101A, the relay substrate 13 is configured to have a narrow shape (a shape that is elongated along the axial direction of the insertion tube 101A).
  • the plurality of cables 14 are respectively connected to the land 33 on the front surface side and the land (not shown) on the back surface side of the relay substrate 13. Note that the plurality of cables 14 are covered with a protective coat 35 at a connection portion to the land 33 (see FIG. 4).
  • the configuration in which the plurality of cables 14 are connected to both surfaces of the relay board 13 enables the plurality of cables 14 to be relayed by the relay board 13 even when the number of the plurality of cables 14 is large. There is.
  • FIG. 3 is a diagram for explaining a problem of a fitting failure that may occur when the cable 14 is soldered also to the connector fitting surface side of the relay board 13.
  • FIG. 3A is a cross-sectional view of the soldered portion of the cable 14 to the relay board 13 as seen from the longitudinal direction of the relay board 13, and FIG. It is sectional drawing which looked at the connection part of the board
  • the height of the cable attachment portion (specifically, the height of the top of the attachment portion of the cable 14 to the relay substrate 13 from the fitting side surface of the relay substrate 13 or the relay)
  • the height from the connector fitting side surface of the board 13 to the highest part of the protective coating 35 on the connector fitting side is A, and the connector fitting height between the circuit board 11 and the relay board 13 (board-to-board connector 31).
  • the distance between the fitting side surface of the circuit board 11 and the fitting side surface of the relay board 13 is B, and when A> B, the cable as shown in FIG.
  • the mounting portion (protective coat 35) may interfere with the circuit board 11 to prevent a complete fitting of the board-to-board connector.
  • the first is the total number of layers of the layer of the relay board 13 and the number of layers of the layer of the circuit board 10 (parent board) in the mounting portion of the board-to-board connectors 31 and 34. Is the number of layers of the layer of the relay substrate 13 in the attachment portion of the cable 14 in the relay substrate 13, and the number of layers of the layer of the circuit board 11 in the corresponding portion of the circuit board 11 corresponding to the attachment portion of the cable 14.
  • the thickness of each of the plurality of layers constituting the circuit board 11 is the same.
  • the thickness of each layer of the plurality of layers constituting the relay substrate 13 is the same.
  • the thickness of each layer of the plurality of layers constituting the circuit board 11 and the relay board 13 is the same.
  • the distance between the facing surfaces of the relay board 13 and the circuit board 11 at the portion where the cable 14 is attached to the relay board 13 is the top of the portion where the cable 14 is attached to the relay board 13.
  • the board thickness of at least one of the circuit board 11 and the relay board 13 is partially changed so as to be larger than the height from the fitting side surface of the relay board 13 in the mounting portion of the board-to-board connectors 31 and 34. ing.
  • at least one of the circuit board 11 and the relay board 13 is configured so that the board thickness in the board-to-board connectors 31 and 34 is partially increased.
  • the circuit board 11 is configured such that the board thickness of the portion of the circuit board 11 facing the mounting portion of the cable 14 is partially reduced.
  • the surface of the mounting portion of the board-to-board connectors 41 and 43 of at least one of the relay substrate 13 and the circuit board 11 protrudes from the surface of the portion around the mounting portion. It is configured as follows.
  • the surface of the corresponding portion of the circuit board 11 corresponding to the attachment portion of the cable 14 to the relay substrate 11 is recessed in the direction away from the relay substrate 13 with respect to the surface of the portion around the corresponding portion. It is configured as follows. With such a configuration, even when the number of cables connected to the relay board 13 increases and the cables rise from the surface of the relay board 13, the cable mounting portion on the relay board 13 does not interfere with the circuit board 11. Therefore, it is possible to eliminate the problem of fitting the board-to-board connectors 31, 34.
  • the first embodiment is a configuration example in which the connector fitting height is increased by adding one or more layers to the connector mounting portion on the circuit board 11 side to avoid a connector fitting defect.
  • the thicknesses of the layers constituting the circuit board 11 are the same as each other, and the thicknesses of the one or more layers to be added are preferably the same as the thicknesses of the layers constituting the circuit board 11.
  • FIG. 4A shows a soldered portion of the cable 14 to the relay board 13 to which the board assembly 10 (board-to-board connector mounting structure) according to the first embodiment is applied, as viewed from the longitudinal direction of the relay board 13.
  • FIG. 4B is a cross-sectional view of the connecting portion of the relay board 13 and the circuit board 11 in FIG. 4A as viewed from the lateral direction perpendicular to the longitudinal direction.
  • the thickness of the additional layer 11a (the increase in thickness due to the partially overlaid layer 11a) is defined as C
  • the dimension of the additional layer 11a so that A ⁇ B + C is satisfied. (That is, the number of layers to be overlapped) is set.
  • the material of the circuit board 11 on which the layers are partially overlapped there is no particular limitation on the material of the circuit board 11 on which the layers are partially overlapped, and substrates of various materials such as ceramics and organic plastics can be used, but ceramic is considered preferable in terms of manufacturability.
  • the structure of the present embodiment is realized by stacking and firing a small layer on a large layer.
  • various lamination techniques and processing techniques known in the art may be used.
  • the second embodiment is a configuration example in which the thickness of the portion facing the cable mounting portion (protective coat 35) on the circuit board 11 side is partially removed to reduce the board thickness and avoid the connector fitting failure. It is.
  • the thicknesses of the layers constituting the circuit board 11 are the same as each other, and the thicknesses of the layers to be removed are preferably the same as the thicknesses of the layers constituting the circuit board 11.
  • FIG. 5A is a cross-sectional view of the soldered portion of the cable 14 to the relay board 13 to which the board-to-board connector mounting structure according to the second embodiment is applied, as viewed from the longitudinal direction of the relay board 13.
  • FIG. 5B is a cross-sectional view of the connection portion of the relay board 13 and the circuit board 11 in FIG. 5A as seen from the lateral direction perpendicular to the longitudinal direction.
  • the layer of the circuit board 11 facing the cable attachment portion (protective coat 35) is partially extracted to form the dug layer portion 11b.
  • the depth of the dug layer portion 11b (the reduction in the thickness of the parent substrate due to partial removal of the layer)
  • C ′ the depth of the dug layer portion 11b
  • the dimension (number of layers to be extracted) of the dug layer portion C ′ is set so that A ⁇ B + C ′ is satisfied.
  • the number of layers to be extracted is not particularly limited, and a configuration in which all layers constituting the circuit board 11 are extracted may be employed.
  • the part extracted from all layers is formed as a hole.
  • the material of the circuit board 11 formed by partially extracting the layer is not particularly limited, and substrates of various materials such as ceramic and organic plastic can be used.
  • various lamination techniques and processing techniques known in the art may be used in order to obtain a printed circuit board configuration in which layers are partially extracted.
  • the third embodiment is a configuration example in which the connector fitting height is increased by adding one or more layers to the connector mounting portion on the relay board 13 side to avoid a connector fitting defect.
  • the thicknesses of the layers constituting the relay board 13 are the same as each other, and the thicknesses of the one or more layers to be added are preferably the same as the thicknesses of the layers constituting the relay board 13.
  • FIG. 6A is a cross-sectional view of the soldered portion of the cable 14 to the relay board 13 to which the board-to-board connector mounting structure according to the third embodiment is applied, as viewed from the longitudinal direction of the relay board 13.
  • 6 (b) is a cross-sectional view of the connecting portion of the relay board 13 and the circuit board 11 in FIG. 6 (a) as seen from the lateral direction perpendicular to the longitudinal direction.
  • the thickness of the additional layer 13a added to the connector mounting portion of the relay board 13 (the thickness increase due to the layer 13a partially overlapped with the relay board 13) is defined as C ′′
  • the embodiment 3 the thickness of the additional layer 13a (that is, the number of layers to be overlapped) is set so that A ⁇ B + C ′′ is satisfied.
  • the material of the relay substrate 13 on which the layers are partially overlapped is not particularly limited, and substrates of various materials such as ceramics and organic plastics can be used, but ceramic is considered preferable in terms of manufacturability.
  • a ceramic material the structure of the present embodiment is realized by stacking and firing a small layer on a large layer.
  • various lamination techniques and processing techniques known in the art may be used.
  • the board-to-board connector mounting structure shown in the first to third embodiments is based on the following technical concept. That is, the board assembly provided by the present embodiment has a configuration in which the multilayer relay board to which the cable is attached and the multilayer parent board are connected by a board-to-board connector, and the relay board in the mounting portion of the board-to-board connector.
  • the first total number of layers which is the sum of the number of layers stacked and the number of layers of the parent board layer, corresponds to the number of layers of the relay board layer in the cable mounting portion of the relay board and the correspondence of the parent board corresponding to the mounting portion. It can be expressed that the structure is configured to be larger than the second total number of layers, which is the sum of the number of layers of the parent substrate layer in the portion.
  • the embodiment of the present invention is not limited to the above-described configuration, and various modifications can be made within the scope of the technical idea of the present invention.
  • the embodiment of the present application also includes an embodiment that is exemplarily specified in the specification or a combination of obvious embodiments and the like as appropriate.
  • the above embodiment is an example in which the mounting structure using the board-to-board connector is applied to the relay board in the electronic scope of the endoscope and the connector connecting portion of the circuit board which is the parent board.
  • the board-to-board connector mounting structure can be applied to a connector connection portion between a relay board and a parent board in various electronic devices.
  • the first embodiment one or more layers are added to the connector mounting portion on the circuit board 11 side of the circuit board.
  • the layer of the portion facing the cable mounting portion on the circuit board 11 side is added. It is a configuration that is partially removed
  • the third embodiment is a configuration in which one or more layers are added to the connector mounting portion on the relay board 13 side.
  • the configurations of the first, second, and third embodiments are the same. It is good also as a structure which combines at least 2 or more.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Heart & Thoracic Surgery (AREA)
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Abstract

A board assembly includes: a mother board provided with a board-to-board connector; and a relay board to which a cable is attached, and to which a board-to-board connector is provided. The mother board and the relay board have the board-to-board connectors fitted and connected to each other. The cable is placed so as to be sandwiched between the mother board and the relay board. The mother board and the relay board respectively have layered structures with a plurality of layers. A first total layer count, which is the sum of the number of layered layers of the relay board and the number of layered layers of the mother board at the mounting part of the board-to-board connector, is greater than a second total layer count, which is the sum of the number of layered layers of the relay board at the cable attachment part on the relay board and the number of layered layers of the mother board at the corresponding part of the mother board that corresponds to the attachment part.

Description

基板組立体及び電子内視鏡システムSubstrate assembly and electronic endoscope system
　本発明は、ケーブルが取り付けられた中継基板と親基板とが基板対基板コネクタにより接続された基板組立体、及びこの基板組立体を備える電子内視鏡システムに関する。 The present invention relates to a board assembly in which a relay board to which a cable is attached and a parent board are connected by a board-to-board connector, and an electronic endoscope system including the board assembly.
　人の食道や腸などの管腔内を観察するための内視鏡システムとして、撮像素子を有する電子スコープ、電子スコープから送信された撮像信号を処理する内視鏡プロセッサ、及び内視鏡プロセッサで処理された撮像信号に基づいて観察画像を表示するモニタを備える電子内視鏡システムが知られている。このような電子内視鏡システムにおいて、電子スコープ先端部の撮像素子への電源供給及び信号の入出力は、ケーブルを介して行われる。これら撮像素子からのケーブルの内視鏡プロセッサへの接続は、通常は、一旦回路基板を介してコネクタ接続される構成とされる。また、従来は、上記回路基板に対して、ケーブルはハンダ付けされていた。 As an endoscope system for observing the inside of a lumen of a human esophagus or intestine, an electronic scope having an imaging device, an endoscope processor for processing an imaging signal transmitted from the electronic scope, and an endoscope processor An electronic endoscope system including a monitor that displays an observation image based on a processed imaging signal is known. In such an electronic endoscope system, power supply and signal input / output to the imaging device at the distal end of the electronic scope are performed via a cable. The connection of the cables from these image sensors to the endoscope processor is usually configured to be once connected by a connector via a circuit board. Conventionally, the cable is soldered to the circuit board.
　電子スコープの細径化の観点から、ケーブルを回路基板に接続する部分の総厚はできるだけ低減する事が望ましい。下記特許文献１は、同軸ケーブルの基板への接続部分の総厚を低減するための構成例について開示している。 ∙ From the viewpoint of reducing the diameter of the electronic scope, it is desirable to reduce the total thickness of the portion where the cable is connected to the circuit board as much as possible. Patent Document 1 below discloses a configuration example for reducing the total thickness of a connection portion of a coaxial cable to a substrate.
特許第５６３１６１８号公報Japanese Patent No. 5613618
　ところで、ハンダ付けによりケーブルを回路基板（親基板）へ接続する構成の場合には、撮像素子の修理や調整を行う際にハンダを溶融させてケーブルを取り外す必要があり手間がかかるため、最近では基板対基板コネクタを用いてケーブル側に小型中継基板を使用することが行われている。すなわち、撮像素子からのケーブルは小型中継基板を介して、基板対基板コネクタを用いて回路基板（親基板）へ接続される。 By the way, in the case of a configuration in which a cable is connected to a circuit board (parent board) by soldering, it is necessary to melt the solder and remove the cable when repairing or adjusting the image sensor. A small relay board is used on the cable side using a board-to-board connector. That is, the cable from the image sensor is connected to the circuit board (parent board) using the board-to-board connector via the small relay board.
　このような構成の場合、基板対基板コネクタの一方が搭載される小型中継基板には、電子スコープの可撓管内を挿通させるために、小型中継基板の幅に制約が生じる。特に、ケーブルの本数が増えた場合には、ケーブルが小型中継基板の幅方向にはみ出してはならない為、ケーブルを厚み方向に重ねる処理をせざるを得ない。しかしながら、ケーブル処理の厚みが大きくなりすぎると基板対基板コネクタの高さ制約からコネクタ同士の嵌合に問題が生じ得る。 In such a configuration, since the small relay board on which one of the board-to-board connectors is mounted is inserted through the flexible tube of the electronic scope, the width of the small relay board is limited. In particular, when the number of cables increases, the cables must not protrude in the width direction of the small relay board, and thus the process of stacking the cables in the thickness direction is unavoidable. However, if the thickness of the cable processing becomes too large, there may be a problem in the fitting between the connectors due to the height restriction of the board-to-board connector.
　本発明は上記の事情に鑑みてなされたものであり、本発明の目的は、ケーブルの中継基板を親基板に基板対基板コネクタを用いて接続する構成において、中継基板に接続されるケーブル本数が増加した場合であっても、基板対基板コネクタの嵌合不具合を解消することのできる基板組立体及び、この基板組立体を備えて電子内視鏡システムを提供することである。 The present invention has been made in view of the above circumstances, and an object of the present invention is to connect a relay board of a cable to a parent board using a board-to-board connector, and the number of cables connected to the relay board is The present invention is to provide a board assembly capable of eliminating the board-to-board connector fitting failure even when the board is increased, and an electronic endoscope system including the board assembly.
　本発明の一態様は、基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合して接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体である。
　前記親基板及び前記中継基板のそれぞれは、複数のレイヤの積層構造を有する。
　前記基板対基板コネクタの実装部分における前記中継基板の前記レイヤの積層数と前記親基板の前記レイヤの積層数の合計である第１の総積層数は、前記中継基板における前記ケーブルの取付け部分における前記中継基板の前記レイヤの積層数と、前記取り付け部分に対応する前記親基板の対応部分における前記親基板の前記レイヤの積層数との合計である第２の総積層数よりも大きくなるように、前記基板組立体は構成されている。 One embodiment of the present invention includes a parent board provided with a board-to-board connector, and a relay board provided with a cable and provided with a board-to-board connector. The parent board and the relay board are connected to the board-to-board. A board assembly in which connectors are fitted and connected so that the cable is sandwiched between the parent board and the relay board.
Each of the parent substrate and the relay substrate has a laminated structure of a plurality of layers.
The first total number of layers, which is the sum of the number of layers of the layer of the relay board and the number of layers of the layer of the parent board in the board-to-board connector mounting part, is It is larger than the second total number of layers, which is the sum of the number of layers of the layer of the relay substrate and the number of layers of the layer of the parent substrate in the corresponding portion of the parent substrate corresponding to the attachment portion. The substrate assembly is configured.
　このような構造によれば、前記中継基板に接続されるケーブル数が増加してケーブルが前記中継基板の面から盛り上がる場合であっても、前記中継基板上のケーブルの取付け部分が前記親基板と干渉しない為、基板対基板コネクタの嵌合不具合を解消することができる。嵌合不具合とは、コネクタ間の電気的に接続されないことを含む。 According to such a structure, even when the number of cables connected to the relay board increases and the cable rises from the surface of the relay board, the cable mounting portion on the relay board is connected to the parent board. Since there is no interference, the board-to-board connector failure can be solved. The fitting failure includes not being electrically connected between the connectors.
　前記親基板では、前記基板対基板コネクタの実装部分において部分的に前記レイヤの積層数が増加するようにレイヤが部分的に重ねられていることが好ましい。 In the parent substrate, it is preferable that the layers are partially overlapped so that the number of layers stacked partially increases in the mounting portion of the board-to-board connector.
　前記親基板では、前記対応部分における前記親基板の積層数が部分的に減少するように前記レイヤの一部が部分的に抜かれている、ことも好ましい。 In the parent substrate, it is also preferable that a part of the layer is partially removed so that the number of layers of the parent substrate in the corresponding portion is partially reduced.
　前記中継基板では、前記基板対基板コネクタの実装部分において部分的に前記レイヤの積層数が増加するようにレイヤが部分的に重ねられている、ことも好ましい。 In the relay board, it is also preferable that the layers are partially overlapped so that the number of layers stacked partially increases in the mounting portion of the board-to-board connector.
　一例によれば、前記ケーブルの前記中継基板への取付け部分の頂部の、前記中継基板の嵌合側面からの高さをＡとし、前記実装部分における前記親基板の嵌合側面と前記中継基板の嵌合側面との間の距離をＢとし、前記部分的に重ねられたレイヤによる厚さの増加分をＣとしたとき、Ａ≦Ｂ＋Ｃを満たす、ことが好ましい。 According to an example, the height of the top of the attachment portion of the cable to the relay board from the fitting side face of the relay board is A, and the fitting side face of the parent board and the relay board in the mounting portion It is preferable that A ≦ B + C is satisfied, where B is a distance between the fitting side surfaces and C is an increase in thickness due to the partially overlapped layer.
　他の一例によれば、前記ケーブルの前記中継基板への取付け部分の頂部の、前記中継基板の嵌合側面からの高さをＡとし、前記実装部分における前記親基板の嵌合側面と前記中継基板の嵌合側面との間の距離をＢとし、前記レイヤの一部が前記部分的に抜かれたことによる前記親基板の厚さの減少分をＣ’としたとき、Ａ≦Ｂ＋Ｃ’を満たす、ことが好ましい。 According to another example, the height of the top of the attachment portion of the cable to the relay board from the fitting side face of the relay board is A, and the fitting side face of the parent board and the relay in the mounting part A ≦ B + C ′ is satisfied, where B is the distance from the mating side surface of the substrate, and C ′ is a decrease in the thickness of the parent substrate due to partial removal of the layer. Is preferable.
　他の一例によれば、前記ケーブルの前記中継基板への取付け部分の頂部の、前記中継基板の嵌合側面からの高さをＡとし、前記実装部分における前記親基板の嵌合側面と前記中継基板の嵌合側面との間の距離をＢとし、前記中継基板に部分的に重ねられたレイヤによる厚さの増加分をＣ”としたとき、Ａ≦Ｂ＋Ｃ”を満たす、ことが好ましい。 According to another example, the height of the top of the attachment portion of the cable to the relay board from the fitting side face of the relay board is A, and the fitting side face of the parent board and the relay in the mounting part It is preferable that A ≦ B + C ″ is satisfied, where B is the distance from the mating side surface of the substrate and C ″ is the increase in thickness due to the layer partially overlapped with the relay substrate.
　本発明の他の一態様も、基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合させて接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体である。
　前記親基板及び前記中継基板のそれぞれは、複数のレイヤの積層構造を有する。
　前記ケーブルの前記中継基板への取付け部分における前記中継基板と前記親基板の対向面間の間隔が、前記ケーブルの前記中継基板への取付け部分の頂部の、前記基板対基板コネクタの実装部分における前記中継基板の嵌合側面からの高さよりも大きくなるように、前記親基板と前記中継基板の少なくとも一方の基板厚さが部分的に変更されている。
　このような構造によれば、前記中継基板に接続されるケーブル数が増加する場合であっても、前記中継基板上の前記ケーブルの取付け部分が前記親基板と干渉しない為、前記基板対基板間コネクタの嵌合不具合を解消することができる。 Another aspect of the present invention also includes a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector, and the parent board and the relay board are connected to the board. The board assembly is configured such that the connectors on the board are fitted and connected to each other, and the cable is sandwiched between the parent board and the relay board.
Each of the parent substrate and the relay substrate has a laminated structure of a plurality of layers.
The distance between the facing surfaces of the relay board and the parent board in the attachment part of the cable to the relay board is such that the top of the attachment part of the cable to the relay board is in the mounting part of the board-to-board connector. The substrate thickness of at least one of the parent substrate and the relay substrate is partially changed so as to be larger than the height from the fitting side surface of the relay substrate.
According to such a structure, even if the number of cables connected to the relay board increases, the cable mounting portion on the relay board does not interfere with the parent board, so the board-to-board It is possible to eliminate the connector fitting failure.
　前記親基板と前記中継基板の少なくとも一方の、前記実装部分における厚さが部分的に増加するように、前記親基板と前記中継基板の少なくとも一方は構成されている、ことが好ましい。 It is preferable that at least one of the parent substrate and the relay substrate is configured so that a thickness of at least one of the parent substrate and the relay substrate is partially increased.
　前記取付け部分に対向する前記親基板の部分の厚さが部分的に減少するように、前記親基板は構成されている、ことも好ましい。 It is also preferable that the parent substrate is configured such that the thickness of the portion of the parent substrate facing the mounting portion is partially reduced.
　本発明のさらに他の一態様も、基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合して接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体である。
　前記中継基板及び前記親基板の少なくとも一方の前記基板対基板コネクタの実装部分の面は、前記実装部分の周りの部分の面に対して突出するように構成されている。 Still another embodiment of the present invention also includes a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector. The board assembly is a board assembly in which board-to-board connectors are fitted and connected so that the cable is sandwiched between the parent board and the relay board.
The surface of the mounting portion of the board-to-board connector of at least one of the relay substrate and the parent substrate is configured to protrude with respect to the surface of the portion around the mounting portion.
　本発明のさらに他の一態様も、基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合して接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体である。
　前記ケーブルの前記中継基板への取り付け部分に対応する前記親基板の対応部分の面は、前記対応部分の周りの部分の面に対して前記中継基板から遠ざかる方向に凹むように構成されている。 Still another embodiment of the present invention also includes a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector. The board assembly is a board assembly in which board-to-board connectors are fitted and connected so that the cable is sandwiched between the parent board and the relay board.
The surface of the corresponding portion of the parent substrate corresponding to the portion where the cable is attached to the relay substrate is configured to be recessed in the direction away from the relay substrate with respect to the surface of the portion around the corresponding portion.
　本発明のさらに他の一態様は、電子内視鏡システムである。当該電子内視鏡システムは、
　光を出射する光源装置と、
　前記光で照明された被写体を撮像する撮像素子を備えた内視鏡と、
　前記内視鏡のコネクタ部と接続し、前記撮像素子で撮像した被写体の画像を処理するプロセッサと、
　処理した前記画像を表示するモニタと、を備える。
　前記コネクタ部は、前記基板組立体を備え、前記ケーブルは、前記撮像素子から延びる信号伝送ケーブルを少なくとも含む。 Yet another embodiment of the present invention is an electronic endoscope system. The electronic endoscope system is
A light source device that emits light;
An endoscope provided with an image sensor that images the subject illuminated with the light;
A processor connected to the connector portion of the endoscope and processing an image of a subject imaged by the imaging device;
And a monitor for displaying the processed image.
The connector portion includes the board assembly, and the cable includes at least a signal transmission cable extending from the imaging element.
　以上のように、上述の基板組立体によれば、中継基板に接続されるケーブル本数が増加した場合であっても、基板対基板コネクタの嵌合不具合を解消することができる。 As described above, according to the above-described board assembly, even when the number of cables connected to the relay board is increased, the board-to-board connector fitting failure can be solved.
一実施形態にかかる電子内視鏡システムの一例のブロック図である。It is a block diagram of an example of an electronic endoscope system concerning one embodiment. 中継基板と回路基板の接続部分の構成を示す図である。It is a figure which shows the structure of the connection part of a relay board | substrate and a circuit board. 中継基板のコネクタ嵌合面側にもケーブルをハンダ付けする場合に生じ得る嵌合不具合の問題を説明する図である。It is a figure explaining the problem of the fitting defect which may arise when soldering a cable also to the connector fitting surface side of a relay substrate. 一実施形態による基板対基板コネクタ実装構造の一例を説明する為の図である。It is a figure for demonstrating an example of the board-to-board connector mounting structure by one Embodiment. 一実施形態による基板対基板コネクタ実装構造の一例を説明する図である。It is a figure explaining an example of the board-to-board connector mounting structure by one Embodiment. 一実施形態による基板対基板コネクタ実装構造の一例を説明する図である。It is a figure explaining an example of the board-to-board connector mounting structure by one Embodiment.
　以下、本発明の実施形態について図面を用いて詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
［内視鏡システム１の構成］
　図１は、本実施形態の基板組立体が適用される電子内視鏡システム１の構成の一例を示すブロック図である。図１に示す内視鏡システム１は、医療用の撮像システムであり、電子スコープ１００、内視鏡プロセッサ２００及びモニタ３００を有している。 [Configuration of Endoscope System 1]
FIG. 1 is a block diagram showing an example of the configuration of an electronic endoscope system 1 to which the substrate assembly of the present embodiment is applied. An endoscope system 1 illustrated in FIG. 1 is a medical imaging system, and includes an electronic scope 100, an endoscope processor 200, and a monitor 300.
　電子スコープ１００は、挿入管１００Ａとコネクタ部１００Ｂとを有している。挿入管１００Ａ内には、対物光学系１０１、撮像ユニット１０２及び照明光学系１０３が設けられている。コネクタ部１００Ｂ内には、回路基板１１が設けられている。回路基板１１には、撮像素子ドライバ１０４及びＡＦＥ（Analog Front End）１０５が含まれている。また、コネクタ部１００Ｂから挿入管１００Ａの先端部１００Ｃにかけてライトガイド１０６が配置されている。撮像ユニット１０２と回路基板１１とは、複数のケーブル１４及び中継基板１３によって接続されている。中継基板１３と回路基板１１との接続部分の構成については後に詳細に説明する。 The electronic scope 100 has an insertion tube 100A and a connector portion 100B. An objective optical system 101, an imaging unit 102, and an illumination optical system 103 are provided in the insertion tube 100A. A circuit board 11 is provided in the connector portion 100B. The circuit board 11 includes an image sensor driver 104 and an AFE (Analog Front End) 105. A light guide 106 is disposed from the connector portion 100B to the distal end portion 100C of the insertion tube 100A. The imaging unit 102 and the circuit board 11 are connected by a plurality of cables 14 and a relay board 13. The configuration of the connection portion between the relay board 13 and the circuit board 11 will be described in detail later.
　内視鏡プロセッサ２００は、内視鏡用の画像処理装置が組み込まれており、システムコントローラ２０１、タイミングコントローラ２０２、光源ユニット２０３、画像処理ユニット２０４及びフロントパネル２０５を備えている。光源ユニット２０３は、光源ドライバ２０３Ａ、光源２０３Ｂ、集光レンズ２０３Ｃを有している。 The endoscope processor 200 incorporates an endoscope image processing apparatus, and includes a system controller 201, a timing controller 202, a light source unit 203, an image processing unit 204, and a front panel 205. The light source unit 203 includes a light source driver 203A, a light source 203B, and a condenser lens 203C.
　システムコントローラ２０１は、内視鏡システム１を構成する各要素を制御する。タイミングコントローラ２０２は、信号の処理タイミングを調整するクロック信号を内視鏡システム１内の各回路に送信する。 The system controller 201 controls each element constituting the endoscope system 1. The timing controller 202 transmits a clock signal for adjusting the signal processing timing to each circuit in the endoscope system 1.
　光源２０３Ｂは、光源ドライバ２０３Ａによって駆動制御され、白色光を放射する。光源２０３Ｂには、キセノンランプ、ハロゲンランプ、水銀ランプ、メタルハライドランプ等の高輝度ランプが用いられる。光源２０３Ｂから放射された照明光は集光レンズ２０３Ｃを介してライトガイド１０６に入射され、電子スコープ１００の先端部１００Ｃに向けてライトガイド１０６内を導波される。ライトガイド１０６は、例えば、複数の光ファイバを束ねたＬＣＢ（Light Carrying Bundle）である。 The light source 203B is driven and controlled by the light source driver 203A to emit white light. As the light source 203B, a high-intensity lamp such as a xenon lamp, a halogen lamp, a mercury lamp, or a metal halide lamp is used. The illumination light emitted from the light source 203B is incident on the light guide 106 via the condenser lens 203C, and is guided in the light guide 106 toward the distal end portion 100C of the electronic scope 100. The light guide 106 is, for example, an LCB (Light Carrying Bundle) in which a plurality of optical fibers are bundled.
　ライトガイド１０６内を導波された照明光は、先端部１００Ｃ内に配置されたライトガイド１０６の端面より射出される。ライトガイド１０６の端面より射出された照明光は、照明光学系１０３を介して先端部１００Ｃから射出され、被写体を照明する。被写体で反射された照明光（反射光）は、対物光学系１０１を介して撮像ユニット１０２に入射される。撮像ユニット１０２は撮像素子（不図示）を有している。撮像ユニット１０２に入射された反射光は、撮像素子が備える各画素の受光面上で被写体像を結ぶ。 The illumination light guided in the light guide 106 is emitted from the end surface of the light guide 106 disposed in the distal end portion 100C. Illumination light emitted from the end face of the light guide 106 is emitted from the distal end portion 100C via the illumination optical system 103 and illuminates the subject. Illumination light (reflected light) reflected by the subject enters the imaging unit 102 via the objective optical system 101. The imaging unit 102 has an imaging element (not shown). The reflected light incident on the imaging unit 102 forms a subject image on the light receiving surface of each pixel included in the imaging device.
　撮像素子は、それぞれグリーン（Ｇ）、シアン（Ｃｙ）、マゼンタ（Ｍｇ）、イエロー（Ｙｅ）（若しくはレッド（Ｒ）、グリーン（Ｇ）、ブルー（Ｂ））のカラーフィルタを有する、Ｇ、Ｃｙ、Ｍｇ、Ｙｅ（Ｒ，Ｇ，Ｂ）の画素を備えている。各画素は、結像した被写体像を光量に応じた電荷として蓄積して、Ｇ、Ｃｙ、Ｍｇ、Ｙｅ（Ｒ，Ｇ，Ｂ）の各色に対応した画素信号（Ｇ画素信号、Ｃｙ画素信号、Ｍｇ画素信号、Ｙｅ画素信号）（Ｒ画素信号、Ｇ画素信号、Ｂ画素信号）に変換する。変換された各画素信号は、ＡＦＥ１０５によって信号増幅処理やＡ／Ｄ変換処理が施されて、内視鏡プロセッサ２００の画像処理ユニット２０４に送信される。撮像素子には、例えば、ＣＣＤ（Charge Coupled Device）イメージセンサやＣＭＯＳ（Complementary Metal Oxide Semiconductor）イメージセンサが用いられる。 The image sensors have color filters of green (G), cyan (Cy), magenta (Mg), yellow (Ye) (or red (R), green (G), blue (B)), G, Cy. , Mg, Ye (R, G, B) pixels. Each pixel accumulates the formed subject image as a charge corresponding to the amount of light, and pixel signals corresponding to each color of G, Cy, Mg, Ye (R, G, B) (G pixel signal, Cy pixel signal, (Mg pixel signal, Ye pixel signal) (R pixel signal, G pixel signal, B pixel signal). The converted pixel signals are subjected to signal amplification processing and A / D conversion processing by the AFE 105, and are transmitted to the image processing unit 204 of the endoscope processor 200. For example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor is used as the imaging device.
　画像処理ユニット２０４で受信された画素信号は、所定の信号処理によって映像信号に変換されモニタ３００に送信される。モニタ３００は、画像処理ユニット２０４から受信した映像信号に基づいて観察画像を表示する。 The pixel signal received by the image processing unit 204 is converted into a video signal by predetermined signal processing and transmitted to the monitor 300. The monitor 300 displays an observation image based on the video signal received from the image processing unit 204.
　このように、電子内視鏡システムは、光を出射する光源ユニット２０３（光源装置）と、照明された被写体を撮像する撮像素子を備えた撮像ユニット１０２を含む電子スコープ１００（電子内視鏡）と、電子スコープ１００のコネクタ部１００Ｂと接続し、撮像素子で撮像した被写体の画像を処理する内視鏡プロセッサ２００（プロセッサ）と、処理した画像を表示するモニタ３００と、を備える。電子スコープ１００のコネクタ部１００Ｂは、後述する、基板対基板コネクタを用いて中継基板を親基板に接続した基板組立体を備える。このとき、中継基板に取り付けられるケーブルは、撮像素子から延びる信号伝送ケーブルを少なくとも含む。撮像素子から延びる信号伝送ケーブルは、基板対基板コネクタ３１，３４によって確実に、回路基板１１と電気的に接続されるので、内視鏡プロセッサ２００に画像信号を供給することができる。 As described above, the electronic endoscope system is an electronic scope 100 (electronic endoscope) including the light source unit 203 (light source device) that emits light and the imaging unit 102 that includes the imaging element that images the illuminated subject. And an endoscope processor 200 (processor) that is connected to the connector unit 100B of the electronic scope 100 and processes an image of a subject imaged by an image sensor, and a monitor 300 that displays the processed image. The connector unit 100B of the electronic scope 100 includes a board assembly in which a relay board is connected to a parent board using a board-to-board connector, which will be described later. At this time, the cable attached to the relay board includes at least a signal transmission cable extending from the image sensor. Since the signal transmission cable extending from the imaging device is reliably electrically connected to the circuit board 11 by the board-to- board connectors 31 and 34, an image signal can be supplied to the endoscope processor 200.
［回路基板及び中継基板の接続部分の構成］
　次に、回路基板（親基板）１１及び中継基板１３の接続部分の構造について詳細に説明する。図２は、基板組立体１０の構成の主要部、すなわち、中継基板１３と回路基板１１の接続部分の構成を示す図であり、詳細には、中継基板１３が、回路基板１１に基板対基板コネクタ接続により接続された状態を、中継基板１３の、コネクタ嵌合面と逆の面（以下、表面とも記す）側から見た状態を表している。回路基板１１、中継基板１３はいずれも複数のレイヤの積層構造を有する基板である。 [Configuration of connection part of circuit board and relay board]
Next, the structure of the connection portion between the circuit board (parent board) 11 and the relay board 13 will be described in detail. FIG. 2 is a diagram illustrating a configuration of a main part of the configuration of the board assembly 10, that is, a connection portion between the relay board 13 and the circuit board 11. Specifically, the relay board 13 is connected to the circuit board 11 on a board-to-board basis. The state connected by the connector connection is a state viewed from the side of the relay board 13 opposite to the connector fitting surface (hereinafter also referred to as the surface). The circuit board 11 and the relay board 13 are both boards having a laminated structure of a plurality of layers.
　図２中に破線で示したように、中継基板１３のコネクタ嵌合面（以下、裏面とも記す）側には、基板対基板コネクタ（例えば、コネクタプラグ）３１が実装されており、この基板対基板コネクタ３１は、回路基板１１側に実装された基板対基板コネクタ（例えば、コネクタレセプタクル）３４（図４（ｂ）参照）にコネクタ嵌合により接続されている。複数のケーブル１４は、中継基板１３の複数のランド３３にそれぞれハンダ付けにより接続される。複数のケーブル１４は、シールド部材を含む複合ケーブル２０内に束ねられている。なお、複数のケーブル１４は、回路基板１１と、撮像ユニット１０２との間で各種信号を入出力する為の、絶縁線や信号を伝送する同軸ケーブルを含んでいる。なお、図２及び以降の図において、ランド３３及びケーブル１４には図示の便宜上一部のものについてのみ符号を付している場合がある。 As shown by a broken line in FIG. 2, a board-to-board connector (for example, a connector plug) 31 is mounted on the connector fitting surface (hereinafter also referred to as the back surface) side of the relay board 13. The board connector 31 is connected to a board-to-board connector (for example, a connector receptacle) 34 (see FIG. 4B) mounted on the circuit board 11 side by connector fitting. The plurality of cables 14 are connected to the plurality of lands 33 of the relay board 13 by soldering. The plurality of cables 14 are bundled in a composite cable 20 including a shield member. The plurality of cables 14 include an insulated wire and a coaxial cable for transmitting signals for inputting / outputting various signals between the circuit board 11 and the imaging unit 102. In FIG. 2 and the subsequent drawings, the land 33 and the cable 14 may be provided with reference numerals only for some of them for convenience of illustration.
　中継基板１３を挿入管１０１Ａ内に挿通させる必要性から、中継基板１３は、幅の狭い形状（挿入管１０１Ａの軸線方向に沿って細長い形状）に構成されている。複数のケーブル１４は、中継基板１３の表面側のランド３３及び裏面側のランド（不図示）にそれぞれ接続されている。なお、複数のケーブル１４は、ランド３３への接続部分において保護コート３５により覆われる（図４参照）。このように、複数のケーブル１４を中継基板１３の両面に接続する構成とすることにより、複数のケーブル１４の本数が多い場合にも、複数のケーブル１４を中継基板１３で中継できるようになる利点がある。 Since the relay substrate 13 needs to be inserted into the insertion tube 101A, the relay substrate 13 is configured to have a narrow shape (a shape that is elongated along the axial direction of the insertion tube 101A). The plurality of cables 14 are respectively connected to the land 33 on the front surface side and the land (not shown) on the back surface side of the relay substrate 13. Note that the plurality of cables 14 are covered with a protective coat 35 at a connection portion to the land 33 (see FIG. 4). As described above, the configuration in which the plurality of cables 14 are connected to both surfaces of the relay board 13 enables the plurality of cables 14 to be relayed by the relay board 13 even when the number of the plurality of cables 14 is large. There is.
　ここで、ケーブル１４の本数が増加し、中継基板１３のコネクタ嵌合面（裏面）側にもケーブル１４をハンダ付けする必要がある場合に発生する事が想定される嵌合不具合の問題について説明する。図３は、中継基板１３のコネクタ嵌合面側にもケーブル１４をハンダ付けする場合に生じ得る嵌合不具合の問題を説明する為の図である。詳細には、図３（ａ）は、ケーブル１４の中継基板１３へのハンダ付け部分を、中継基板１３の長手方向から見た断面図であり、図３（ｂ）は、中継基板１３及び回路基板１１の接続部分を、上記長手方向に対して垂直となる横方向から見た断面図である。なお、図示の便宜上、図３（ａ）と図３（ｂ）とでは上下関係が逆に示されている（以下の図においても同様）。 Here, a description will be given of a problem of a fitting failure that may occur when the number of cables 14 increases and the cable 14 needs to be soldered also to the connector fitting surface (back surface) side of the relay board 13. To do. FIG. 3 is a diagram for explaining a problem of a fitting failure that may occur when the cable 14 is soldered also to the connector fitting surface side of the relay board 13. Specifically, FIG. 3A is a cross-sectional view of the soldered portion of the cable 14 to the relay board 13 as seen from the longitudinal direction of the relay board 13, and FIG. It is sectional drawing which looked at the connection part of the board | substrate 11 from the horizontal direction perpendicular | vertical with respect to the said longitudinal direction. For convenience of illustration, the vertical relationship is shown in reverse in FIGS. 3A and 3B (the same applies to the following drawings).
　図３（ａ）に示すように、ケーブル取付け部の高さ（具体的には、ケーブル１４の中継基板１３への取付け部分の頂部の、中継基板１３の嵌合側面からの高さ、あるいは中継基板１３のコネクタ嵌合側面から、当該コネクタ嵌合側における保護コート３５の最高部までの高さ）をＡとし、回路基板１１と中継基板１３間のコネクタ嵌合高さ（基板対基板コネクタ３１，３４の実装部分における回路基板１１の嵌合側面と中継基板１３の嵌合側面との間の距離）をＢとすると、Ａ＞Ｂとなるときに、図３（ｂ）に示すようにケーブル取付け部（保護コート３５）が回路基板１１に干渉し、基板対基板コネクタの完全な嵌合が妨げられる事態が生じ得る。そこで、本実施形態では、このような嵌合不具合が生じることを回避する基板対基板コネクタ実装構造をとる。以下、嵌合不具合が生じることを回避することができる基板組立体１０の３つの例について説明する。
　なお、実施例１～３のいずれにおいても、基板対基板コネクタ３１，３４の実装部分における中継基板１３のレイヤの積層数と回路基板１０（親基板）のレイヤの積層数の合計である第１の総積層数が、中継基板１３におけるケーブル１４の取付け部分における中継基板１３のレイヤの積層数と、ケーブル１４の取り付け部分に対応する回路基板１１の対応部分における回路基板１１のレイヤの積層数との合計である第２の総積層数よりも大きくなるように構成されている。この場合、回路基板１１を構成する複数のレイヤの各レイヤの厚さはいずれも同じであることが好ましい。また、中継基板１３を構成する複数のレイヤの各レイヤの厚さはいずれも同じであることも好ましい。さらに、回路基板１１及び中継基板１３を構成する複数のレイヤの各レイヤの厚さはいずれも同じであることが好ましい。
　また、実施例１～３のいずれにおいても、ケーブル１４の中継基板１３への取付け部分における中継基板１３と回路基板１１の対向面間の間隔が、ケーブル１４の中継基板１３への取付け部分の頂部の、基板対基板コネクタ３１，３４の実装部分における中継基板１３の嵌合側面からの高さよりも大きくなるように、回路基板１１と中継基板１３の少なくとも一方の基板厚さが部分的に変更されている。この場合、基板対基板コネクタ３１，３４における基板厚さが部分的に増加するように、回路基板１１と中継基板１３の少なくとも一方は構成されている。あるいは、ケーブル１４の取付け部分に対向する回路基板１１の部分の基板厚さが部分的に減少するように、回路基板１１は構成されている。 As shown in FIG. 3 (a), the height of the cable attachment portion (specifically, the height of the top of the attachment portion of the cable 14 to the relay substrate 13 from the fitting side surface of the relay substrate 13 or the relay) The height from the connector fitting side surface of the board 13 to the highest part of the protective coating 35 on the connector fitting side is A, and the connector fitting height between the circuit board 11 and the relay board 13 (board-to-board connector 31). , 34, the distance between the fitting side surface of the circuit board 11 and the fitting side surface of the relay board 13 is B, and when A> B, the cable as shown in FIG. The mounting portion (protective coat 35) may interfere with the circuit board 11 to prevent a complete fitting of the board-to-board connector. Therefore, in this embodiment, a board-to-board connector mounting structure that avoids such a fitting failure is taken. Hereinafter, three examples of the substrate assembly 10 that can avoid the occurrence of a fitting failure will be described.
In any of the first to third embodiments, the first is the total number of layers of the layer of the relay board 13 and the number of layers of the layer of the circuit board 10 (parent board) in the mounting portion of the board-to- board connectors 31 and 34. Is the number of layers of the layer of the relay substrate 13 in the attachment portion of the cable 14 in the relay substrate 13, and the number of layers of the layer of the circuit board 11 in the corresponding portion of the circuit board 11 corresponding to the attachment portion of the cable 14. It is comprised so that it may become larger than the 2nd total number of lamination | stacking which is the sum total. In this case, it is preferable that the thickness of each of the plurality of layers constituting the circuit board 11 is the same. Moreover, it is also preferable that the thickness of each layer of the plurality of layers constituting the relay substrate 13 is the same. Furthermore, it is preferable that the thickness of each layer of the plurality of layers constituting the circuit board 11 and the relay board 13 is the same.
In any of the first to third embodiments, the distance between the facing surfaces of the relay board 13 and the circuit board 11 at the portion where the cable 14 is attached to the relay board 13 is the top of the portion where the cable 14 is attached to the relay board 13. The board thickness of at least one of the circuit board 11 and the relay board 13 is partially changed so as to be larger than the height from the fitting side surface of the relay board 13 in the mounting portion of the board-to- board connectors 31 and 34. ing. In this case, at least one of the circuit board 11 and the relay board 13 is configured so that the board thickness in the board-to- board connectors 31 and 34 is partially increased. Alternatively, the circuit board 11 is configured such that the board thickness of the portion of the circuit board 11 facing the mounting portion of the cable 14 is partially reduced.
　さらに、実施例１、３のいずれも、中継基板１３及び回路基板１１の少なくとも一方の基板対基板コネクタ４１，４３の実装部分の面は、この実装部分の周りの部分の面に対して突出するように構成されている。
　また、実施例２は、ケーブル１４の中継基板１１への取り付け部分に対応する回路基板１１の対応部分の面は、この対応部分の周りの部分の面に対して中継基板１３から遠ざかる方向に凹むように構成されている。
　このような構成により、中継基板１３に接続されるケーブル数が増加してケーブルが中継基板１３の面から盛り上がる場合であっても、中継基板１３上のケーブルの取付け部分が回路基板１１と干渉しない為、基板対基板コネクタ３１，３４の嵌合不具合を解消することができる。 Further, in both the first and third embodiments, the surface of the mounting portion of the board-to-board connectors 41 and 43 of at least one of the relay substrate 13 and the circuit board 11 protrudes from the surface of the portion around the mounting portion. It is configured as follows.
In the second embodiment, the surface of the corresponding portion of the circuit board 11 corresponding to the attachment portion of the cable 14 to the relay substrate 11 is recessed in the direction away from the relay substrate 13 with respect to the surface of the portion around the corresponding portion. It is configured as follows.
With such a configuration, even when the number of cables connected to the relay board 13 increases and the cables rise from the surface of the relay board 13, the cable mounting portion on the relay board 13 does not interfere with the circuit board 11. Therefore, it is possible to eliminate the problem of fitting the board-to- board connectors 31, 34.
［実施例１］
　実施例１は、回路基板１１側のコネクタ実装部分に１以上のレイヤを追加することによってコネクタ嵌合高さをかさ上げし、コネクタ嵌合不具合を回避する構成例である。この場合、回路基板１１を構成するレイヤの厚さは互いに同じであり、追加する１以上のレイヤのレイヤの厚さは、回路基板１１を構成するレイヤの厚さと同じであることが好ましい。図４（ａ）は、実施例１による基板組立体１０（基板対基板コネクタ実装構造）が適用された、ケーブル１４の中継基板１３へのハンダ付け部分を、中継基板１３の長手方向から見た断面図であり、図４（ｂ）は、図４（ａ）における中継基板１３及び回路基板１１の接続部分を、上記長手方向に対して垂直となる横方向から見た断面図である。 [Example 1]
The first embodiment is a configuration example in which the connector fitting height is increased by adding one or more layers to the connector mounting portion on the circuit board 11 side to avoid a connector fitting defect. In this case, the thicknesses of the layers constituting the circuit board 11 are the same as each other, and the thicknesses of the one or more layers to be added are preferably the same as the thicknesses of the layers constituting the circuit board 11. FIG. 4A shows a soldered portion of the cable 14 to the relay board 13 to which the board assembly 10 (board-to-board connector mounting structure) according to the first embodiment is applied, as viewed from the longitudinal direction of the relay board 13. FIG. 4B is a cross-sectional view of the connecting portion of the relay board 13 and the circuit board 11 in FIG. 4A as viewed from the lateral direction perpendicular to the longitudinal direction.
　具体的には、追加レイヤ１１ａの厚み（部分的に重ねられたレイヤ１１ａによる厚さの増加分）をＣと定義すると、実施例１では、Ａ≦Ｂ＋Ｃが満たされるように追加レイヤ１１ａの寸法（すなわち、重ねるレイヤ数）が設定される。このような構成とすることにより、ケーブルの取付け部（保護コート３５）が回路基板１１に干渉しコネクタ嵌合不具合が生じることが回避される。この場合、Ａ＞Ｂであることが好ましい。 Specifically, if the thickness of the additional layer 11a (the increase in thickness due to the partially overlaid layer 11a) is defined as C, in Example 1, the dimension of the additional layer 11a so that A ≦ B + C is satisfied. (That is, the number of layers to be overlapped) is set. By adopting such a configuration, it is avoided that the cable mounting portion (protective coat 35) interferes with the circuit board 11 to cause a connector fitting failure. In this case, it is preferable that A> B.
　レイヤが部分的に重ねられる回路基板１１の材質には特に制限は無く、セラミック、有機系プラスティック等の様々な材質の基板を用いることができるが、製造性の面ではセラミックが好ましいと考えられる。セラミック材質の場合には、大きなレイヤに小さなレイヤを重ねて焼成することで本実施例の構成が実現される。また、レイヤが部分的に重ねられたプリント基板構成とする為に、当技術分野で知られる様々な積層技術や加工技術が用いられても良い。 There is no particular limitation on the material of the circuit board 11 on which the layers are partially overlapped, and substrates of various materials such as ceramics and organic plastics can be used, but ceramic is considered preferable in terms of manufacturability. In the case of a ceramic material, the structure of the present embodiment is realized by stacking and firing a small layer on a large layer. In addition, in order to obtain a printed circuit board configuration in which layers are partially overlapped, various lamination techniques and processing techniques known in the art may be used.
［実施例２］
　実施例２は、回路基板１１側のケーブル取付け部（保護コート３５）に対向する部分のレイヤが部分的に抜けた構成とすることによって基板厚みを低減し、コネクタ嵌合不具合を回避する構成例である。ここで、回路基板１１を構成するレイヤの厚さは互いに同じであり、抜くレイヤの厚さは、回路基板１１を構成するレイヤの厚さと同じであることが好ましい。図５（ａ）は、実施例２による基板対基板コネクタ実装構造が適用された、ケーブル１４の中継基板１３へのハンダ付け部分を、中継基板１３の長手方向から見た断面図であり、図５（ｂ）は、図５（ａ）における中継基板１３及び回路基板１１の接続部分を、上記長手方向に対して垂直となる横方向から見た断面図である。 [Example 2]
The second embodiment is a configuration example in which the thickness of the portion facing the cable mounting portion (protective coat 35) on the circuit board 11 side is partially removed to reduce the board thickness and avoid the connector fitting failure. It is. Here, the thicknesses of the layers constituting the circuit board 11 are the same as each other, and the thicknesses of the layers to be removed are preferably the same as the thicknesses of the layers constituting the circuit board 11. FIG. 5A is a cross-sectional view of the soldered portion of the cable 14 to the relay board 13 to which the board-to-board connector mounting structure according to the second embodiment is applied, as viewed from the longitudinal direction of the relay board 13. FIG. 5B is a cross-sectional view of the connection portion of the relay board 13 and the circuit board 11 in FIG. 5A as seen from the lateral direction perpendicular to the longitudinal direction.
　具体的には、図５（ｂ）に示すように、回路基板１１におけるケーブル取付け部（保護コート３５）との対向部分のレイヤを部分的に抜き、掘下げレイヤ部１１ｂを形成する。図５（ａ）に示すように、掘下げレイヤ部１１ｂの深さ（レイヤの一部が前記部分的に抜かれたことによる前記親基板の厚さの減少分）をＣ’と定義すると、実施例２では、Ａ≦Ｂ＋Ｃ’が満たされるように掘り下げレイヤ部Ｃ’の寸法（抜き取るレイヤ数）が設定される。このような構成とすることにより、ケーブルの取付け部（保護コート３５）が回路基板１１に干渉しコネクタ嵌合不具合が生じることが回避される。この場合、Ａ＞Ｂであることが好ましい。 Specifically, as shown in FIG. 5B, the layer of the circuit board 11 facing the cable attachment portion (protective coat 35) is partially extracted to form the dug layer portion 11b. As shown in FIG. 5A, when the depth of the dug layer portion 11b (the reduction in the thickness of the parent substrate due to partial removal of the layer) is defined as C ′, the embodiment 2, the dimension (number of layers to be extracted) of the dug layer portion C ′ is set so that A ≦ B + C ′ is satisfied. By adopting such a configuration, it is avoided that the cable mounting portion (protective coat 35) interferes with the circuit board 11 to cause a connector fitting failure. In this case, it is preferable that A> B.
　なお、抜き取るレイヤ数に特に制限は無く、回路基板１１を構成する全レイヤを抜く構成としても良い。全レイヤを抜く場合には、全レイヤ抜き取られた部分は、穴として形成されることとなる。レイヤが部分的に抜き取られて形成される回路基板１１の材質には特に制限は無く、セラミック、有機系プラスティック等の様々な材質の基板を用いることができる。また、レイヤが部分的に抜き取られたプリント基板構成とする為に、当技術分野で知られる様々な積層技術や加工技術が用いられても良い。 Note that the number of layers to be extracted is not particularly limited, and a configuration in which all layers constituting the circuit board 11 are extracted may be employed. In the case of extracting all layers, the part extracted from all layers is formed as a hole. The material of the circuit board 11 formed by partially extracting the layer is not particularly limited, and substrates of various materials such as ceramic and organic plastic can be used. In addition, various lamination techniques and processing techniques known in the art may be used in order to obtain a printed circuit board configuration in which layers are partially extracted.
［実施例３］
　実施例３は、中継基板１３側のコネクタ実装部分に１以上のレイヤを追加することによってコネクタ嵌合高さをかさ上げし、コネクタ嵌合不具合を回避する構成例である。ここで、中継基板１３を構成するレイヤの厚さは互いに同じであり、追加する１以上のレイヤのレイヤの厚さは、中継基板１３を構成するレイヤの厚さと同じであることが好ましい。図６（ａ）は、実施例３による基板対基板コネクタ実装構造が適用された、ケーブル１４の中継基板１３へのハンダ付け部分を、中継基板１３の長手方向から見た断面図であり、図６（ｂ）は、図６（ａ）における中継基板１３及び回路基板１１の接続部分を、上記長手方向に対して垂直となる横方向から見た断面図である。 [Example 3]
The third embodiment is a configuration example in which the connector fitting height is increased by adding one or more layers to the connector mounting portion on the relay board 13 side to avoid a connector fitting defect. Here, the thicknesses of the layers constituting the relay board 13 are the same as each other, and the thicknesses of the one or more layers to be added are preferably the same as the thicknesses of the layers constituting the relay board 13. FIG. 6A is a cross-sectional view of the soldered portion of the cable 14 to the relay board 13 to which the board-to-board connector mounting structure according to the third embodiment is applied, as viewed from the longitudinal direction of the relay board 13. 6 (b) is a cross-sectional view of the connecting portion of the relay board 13 and the circuit board 11 in FIG. 6 (a) as seen from the lateral direction perpendicular to the longitudinal direction.
　具体的には、中継基板１３のコネクタ取付け部分に追加される追加レイヤ１３ａの厚み（中継基板１３に部分的に重ねられたレイヤ１３ａによる厚さの増加分）をＣ”と定義すると、実施例３では、Ａ≦Ｂ＋Ｃ”が満たされるように追加レイヤ１３ａの厚み（すなわち、重ねるレイヤ数）が設定される。このような構成とすることにより、ケーブルの取り付け部分が、回路基板１１に干渉しコネクタ嵌合不具合が生じることが回避される。この場合、Ａ＞Ｂであることが好ましい。 Specifically, when the thickness of the additional layer 13a added to the connector mounting portion of the relay board 13 (the thickness increase due to the layer 13a partially overlapped with the relay board 13) is defined as C ″, the embodiment 3, the thickness of the additional layer 13a (that is, the number of layers to be overlapped) is set so that A ≦ B + C ″ is satisfied. By adopting such a configuration, it is avoided that the cable mounting portion interferes with the circuit board 11 to cause a connector fitting failure. In this case, it is preferable that A> B.
　レイヤが部分的に重ねられる中継基板１３の材質には特に制限は無く、セラミック、有機系プラスティック等の様々な材質の基板を用いることができるが、製造性の面ではセラミックが好ましいと考えられる。セラミック材質の場合には、大きなレイヤに小さなレイヤを重ねて焼成することで本実施例の構成が実現される。また、レイヤが部分的に重ねられたプリント基板構成とする為に、当技術分野で知られる様々な積層技術や加工技術が用いられても良い。 The material of the relay substrate 13 on which the layers are partially overlapped is not particularly limited, and substrates of various materials such as ceramics and organic plastics can be used, but ceramic is considered preferable in terms of manufacturability. In the case of a ceramic material, the structure of the present embodiment is realized by stacking and firing a small layer on a large layer. In addition, in order to obtain a printed circuit board configuration in which layers are partially overlapped, various lamination techniques and processing techniques known in the art may be used.
　上記実施例１から３で示された基板対基板コネクタ実装構造は、次の様な技術的概念に基づくものである。すなわち、本実施形態により提供される基板組立体は、ケーブルが取り付けられる多層中継基板と多層親基板とが基板対基板コネクタでコネクタ接続される構成において、基板対基板コネクタの実装部分における中継基板のレイヤの積層数と親基板のレイヤの積層数の合計である第１の総積層数が、中継基板におけるケーブルの取付け部分における中継基板のレイヤの積層数と、取り付け部分に対応する親基板の対応部分における親基板のレイヤの積層数との合計である第２の総積層数よりも大きくなるように構成されている構造である、と表現することができる。 The board-to-board connector mounting structure shown in the first to third embodiments is based on the following technical concept. That is, the board assembly provided by the present embodiment has a configuration in which the multilayer relay board to which the cable is attached and the multilayer parent board are connected by a board-to-board connector, and the relay board in the mounting portion of the board-to-board connector. The first total number of layers, which is the sum of the number of layers stacked and the number of layers of the parent board layer, corresponds to the number of layers of the relay board layer in the cable mounting portion of the relay board and the correspondence of the parent board corresponding to the mounting portion. It can be expressed that the structure is configured to be larger than the second total number of layers, which is the sum of the number of layers of the parent substrate layer in the portion.
　以上が本発明の実施形態の説明である。本発明は、上記の構成に限定されるものではなく、本発明の技術的思想の範囲において様々な変形が可能である。例えば明細書中に例示的に明示される実施形態等又は自明な実施形態等を適宜組み合わせた内容も本願の実施形態に含まれる。 The above is the description of the embodiment of the present invention. The present invention is not limited to the above-described configuration, and various modifications can be made within the scope of the technical idea of the present invention. For example, the embodiment of the present application also includes an embodiment that is exemplarily specified in the specification or a combination of obvious embodiments and the like as appropriate.
　上述の実施形態は、基板対基板コネクタを用いた実装構造を内視鏡の電子スコープにおける中継基板とその親基板である回路基板のコネクタ接続部分に適用した例であったが、本発明による基板対基板コネクタ実装構造は、様々な電子機器における中継基板と親基板間のコネクタ接続部分に適用することができる。 The above embodiment is an example in which the mounting structure using the board-to-board connector is applied to the relay board in the electronic scope of the endoscope and the connector connecting portion of the circuit board which is the parent board. The board-to-board connector mounting structure can be applied to a connector connection portion between a relay board and a parent board in various electronic devices.
　上述の実施例１は、回路基板の回路基板１１側のコネクタ実装部分に１以上のレイヤを追加する構成であり、実施例２は、回路基板１１側のケーブル取付け部に対向する部分のレイヤを部分的に抜く構成であり、実施例３は、中継基板１３側のコネクタ実装部分に１以上のレイヤを追加する構成であったが、これら実施例１、実施例２、実施例３の構成の少なくとも２以上を組み合わせる構成としても良い。 In the first embodiment, one or more layers are added to the connector mounting portion on the circuit board 11 side of the circuit board. In the second embodiment, the layer of the portion facing the cable mounting portion on the circuit board 11 side is added. It is a configuration that is partially removed, and the third embodiment is a configuration in which one or more layers are added to the connector mounting portion on the relay board 13 side. However, the configurations of the first, second, and third embodiments are the same. It is good also as a structure which combines at least 2 or more.
１　　　　内視鏡システム
１０　　　基板組立体
１１　　　回路基板
１１ａ　　追加レイヤ
１１ｂ　　掘下げレイヤ部
１３　　　中継基板
１３ａ　　追加レイヤ
１４　　　ケーブル
３１　　　基板対基板コネクタ（コネクタプラグ）
３３　  　ランド
３４　　　基板対基板コネクタ（コネクタレセプタクル）
１００　　電子スコープ
１００Ａ　挿入管
１００Ｂ　コネクタ部
１００Ｃ　先端部
１０１　　対物光学系
１０２　　撮像ユニット
１０３　　対物光学系
１０４　　撮像素子ドライバ
１０５　　ＡＦＥ（Analog Front End）
１０６　　ライトガイド
２００　　内視鏡プロセッサ
２０１　　システムコントローラ
２０２　　タイミングコントローラ
２０３　　光源ユニット
２０３Ａ　光源ドライバ
２０３Ｂ　光源
２０３Ｃ　集光レンズ
２０４　　画像処理ユニット
２０５　　フロントパネル
３００　　モニタ DESCRIPTION OF SYMBOLS 1 Endoscope system 10 Board | substrate assembly 11 Circuit board 11a Additional layer 11b Digging layer part 13 Relay board 13a Additional layer 14 Cable 31 Board-to-board connector (connector plug)
33 Land 34 Board-to-board connector (connector receptacle)
DESCRIPTION OF SYMBOLS 100 Electronic scope 100A Insertion tube 100B Connector part 100C Tip part 101 Objective optical system 102 Imaging unit 103 Objective optical system 104 Imaging element driver 105 AFE (Analog Front End)
106 Light guide 200 Endoscope processor 201 System controller 202 Timing controller 203 Light source unit 203A Light source driver 203B Light source 203C Condensing lens 204 Image processing unit 205 Front panel 300 Monitor

Claims (13)

  1. 　基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合して接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体であって、
    　前記親基板及び前記中継基板のそれぞれは、複数のレイヤの積層構造を有し、
    　前記基板対基板コネクタの実装部分における前記中継基板の前記レイヤの積層数と前記親基板の前記レイヤの積層数の合計である第１の総積層数が、前記中継基板における前記ケーブルの取付け部分における前記中継基板の前記レイヤの積層数と、前記取り付け部分に対応する前記親基板の対応部分における前記親基板の前記レイヤの積層数との合計である第２の総積層数よりも大きくなるように構成されている、基板組立体。     Including a parent board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector, and the parent board and the relay board are fitted together with the board-to-board connector A board assembly that is connected and arranged so that the cable is sandwiched between the parent board and the relay board,
    Each of the parent substrate and the relay substrate has a laminated structure of a plurality of layers,
    The first total number of layers, which is the sum of the number of layers of the relay board and the number of layers of the parent board in the board-to-board connector mounting part, is the cable attachment part of the relay board. It is larger than the second total number of layers, which is the sum of the number of layers of the layer of the relay substrate and the number of layers of the layer of the parent substrate in the corresponding portion of the parent substrate corresponding to the attachment portion. A substrate assembly configured.
  2. 　前記親基板では、前記基板対基板コネクタの実装部分において部分的に前記レイヤの積層数が増加するようにレイヤが部分的に重ねられている、請求項１に記載の基板組立体。 2. The board assembly according to claim 1, wherein in the parent board, layers are partially overlapped so that the number of layers stacked partially increases in a mounting portion of the board-to-board connector.
  3. 　前記親基板では、前記対応部分における前記親基板の積層数が部分的に減少するように前記レイヤの一部が部分的に抜かれている、請求項１又は２に記載の基板組立体。 The board assembly according to claim 1 or 2, wherein a part of the layer is partially removed from the parent board so that the number of layers of the parent board in the corresponding part is partially reduced.
  4. 　前記中継基板では、前記基板対基板コネクタの実装部分において部分的に前記レイヤの積層数が増加するようにレイヤが部分的に重ねられている、請求項１から３のいずれか一項に記載の基板組立体。 4. The layer according to claim 1, wherein in the relay board, layers are partially overlapped so that the number of layers stacked partially increases in a mounting portion of the board-to-board connector. Board assembly.
  5. 　前記ケーブルの前記中継基板への取付け部分の頂部の、前記中継基板の嵌合側面からの高さをＡとし、前記実装部分における前記親基板の嵌合側面と前記中継基板の嵌合側面との間の距離をＢとし、前記部分的に重ねられたレイヤによる厚さの増加分をＣとしたとき、Ａ≦Ｂ＋Ｃを満たす、請求項２に記載の基板組立体。 The height from the fitting side surface of the relay board of the top of the attachment portion of the cable to the relay board is A, and the fitting side surface of the parent board and the fitting side face of the relay board in the mounting portion The substrate assembly according to claim 2, wherein A ≦ B + C is satisfied, where B is a distance between them and C is an increase in thickness due to the partially overlapped layers.
  6. 　前記ケーブルの前記中継基板への取付け部分の頂部の、前記中継基板の嵌合側面からの高さをＡとし、前記実装部分における前記親基板の嵌合側面と前記中継基板の嵌合側面との間の距離をＢとし、前記レイヤの一部が前記部分的に抜かれたことによる前記親基板の厚さの減少分をＣ’としたとき、Ａ≦Ｂ＋Ｃ’を満たす、請求項３に記載の基板組立体。 The height from the fitting side surface of the relay board of the top of the attachment portion of the cable to the relay board is A, and the fitting side surface of the parent board and the fitting side face of the relay board in the mounting portion 4. The relationship according to claim 3, wherein A ≦ B + C ′ is satisfied, where B is a distance between them and C ′ is a decrease in thickness of the parent substrate due to partial removal of the layer. Board assembly.
  7. 　前記ケーブルの前記中継基板への取付け部分の頂部の、前記中継基板の嵌合側面からの高さをＡとし、前記実装部分における前記親基板の嵌合側面と前記中継基板の嵌合側面との間の距離をＢとし、前記中継基板に部分的に重ねられたレイヤによる厚さの増加分をＣ”としたとき、Ａ≦Ｂ＋Ｃ”を満たす、請求項４に記載の基板組立体。 The height from the fitting side surface of the relay board of the top of the attachment portion of the cable to the relay board is A, and the fitting side surface of the parent board and the fitting side face of the relay board in the mounting portion 5. The board assembly according to claim 4, wherein A ≦ B + C ″ is satisfied, where B is a distance between them and C ″ is an increase in thickness due to a layer partially overlapped with the relay board.
  8. 　基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合させて接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体であって、
    　前記親基板及び前記中継基板のそれぞれは、複数のレイヤの積層構造を有し、
    　前記ケーブルの前記中継基板への取付け部分における前記中継基板と前記親基板の対向面間の間隔が、前記ケーブルの前記中継基板への取付け部分の頂部の、前記基板対基板コネクタの実装部分における前記中継基板の嵌合側面からの高さよりも大きくなるように、前記親基板と前記中継基板の少なくとも一方の基板厚さが部分的に変更されている、基板組立体。     Including a master board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector, and the board-to-board connector is fitted between the parent board and the relay board. A board assembly that is connected and arranged so that the cable is sandwiched between the parent board and the relay board,
    Each of the parent substrate and the relay substrate has a laminated structure of a plurality of layers,
    The distance between the facing surfaces of the relay board and the parent board in the attachment part of the cable to the relay board is such that the top of the attachment part of the cable to the relay board is in the mounting part of the board-to-board connector. A board assembly in which a substrate thickness of at least one of the parent board and the relay board is partially changed so as to be larger than a height from a fitting side surface of the relay board.
  9. 　前記親基板と前記中継基板の少なくとも一方の、前記実装部分における厚さが部分的に増加するように、前記親基板と前記中継基板の少なくとも一方は構成されている、請求項８に記載の基板組立体。 9. The board according to claim 8, wherein at least one of the parent board and the relay board is configured such that a thickness of at least one of the parent board and the relay board partially increases in the mounting portion. Assembly.
  10. 　前記取付け部分に対向する前記親基板の部分の厚さが部分的に減少するように、前記親基板は構成されている、請求項８又は９に記載の基板組立体。 10. The substrate assembly according to claim 8, wherein the parent substrate is configured so that a thickness of a portion of the parent substrate facing the mounting portion is partially reduced.
  11. 　基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合して接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体であって、
    　前記中継基板及び前記親基板の少なくとも一方の前記基板対基板コネクタの実装部分の面は、前記実装部分の周りの部分の面に対して突出するように構成されている、基板組立体。     Including a parent board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector, and the parent board and the relay board are fitted together with the board-to-board connector A board assembly that is connected and arranged so that the cable is sandwiched between the parent board and the relay board,
    The board assembly is configured such that a surface of a mounting part of the board-to-board connector of at least one of the relay board and the parent board protrudes from a surface of a part around the mounting part.
  12. 　基板対基板コネクタが設けられた親基板と、ケーブルが取り付けられ、基板対基板コネクタが設けられた中継基板とを含み、前記親基板と前記中継基板とを基板対基板コネクタ同士を嵌合して接続し、前記親基板と前記中継基板の間に前記ケーブルが挟まれるように配置された基板組立体であって、
    　前記ケーブルの前記中継基板への取り付け部分に対応する前記親基板の対応部分の面は、前記対応部分の周りの部分の面に対して前記中継基板から遠ざかる方向に凹むように構成されている、基板組立体。     Including a parent board provided with a board-to-board connector and a relay board provided with a cable and provided with a board-to-board connector, and the parent board and the relay board are fitted together with the board-to-board connector A board assembly that is connected and arranged so that the cable is sandwiched between the parent board and the relay board,
    The surface of the corresponding portion of the parent substrate corresponding to the attachment portion of the cable to the relay substrate is configured to be recessed in the direction away from the relay substrate with respect to the surface of the portion around the corresponding portion. Board assembly.
  13. 　光を出射する光源装置と、
    　前記光で照明された被写体を撮像する撮像素子を備えた内視鏡と、
    　前記内視鏡のコネクタ部と接続し、前記撮像素子で撮像した被写体の画像を処理するプロセッサと、
    　処理した前記画像を表示するモニタと、を備え、
    　前記コネクタ部は、請求項１～１２のいずれか１項に記載の基板組立体を備え、
    　前記ケーブルは、前記撮像素子から延びる信号伝送ケーブルを少なくとも含む、電子内視鏡システム。                                                                                 A light source device that emits light;
    An endoscope provided with an image sensor that images the subject illuminated with the light;
    A processor connected to the connector portion of the endoscope and processing an image of a subject imaged by the imaging device;
    A monitor for displaying the processed image,
    The connector portion includes the board assembly according to any one of claims 1 to 12,
    The electronic endoscope system, wherein the cable includes at least a signal transmission cable extending from the imaging device.
PCT/JP2017/019351 2016-05-25 2017-05-24 Board assembly and electronic endoscope system WO2017204245A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020042916A (en) * 2018-09-06 2020-03-19 株式会社フジクラ Connector and connector-equipped substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645390U (en) * 1987-06-30 1989-01-12
JP2013105794A (en) * 2011-11-10 2013-05-30 Sharp Corp Board unit and electronic apparatus
WO2014083967A1 (en) * 2012-11-29 2014-06-05 オリンパスメディカルシステムズ株式会社 Board structure
WO2014083959A1 (en) * 2012-11-29 2014-06-05 オリンパスメディカルシステムズ株式会社 Connection structure for circuit boards
WO2014171275A1 (en) * 2013-04-16 2014-10-23 オリンパスメディカルシステムズ株式会社 Substrate connection structure
WO2014208171A1 (en) * 2013-06-28 2014-12-31 オリンパスメディカルシステムズ株式会社 Imaging module and endoscope device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645390U (en) * 1987-06-30 1989-01-12
JP2013105794A (en) * 2011-11-10 2013-05-30 Sharp Corp Board unit and electronic apparatus
WO2014083967A1 (en) * 2012-11-29 2014-06-05 オリンパスメディカルシステムズ株式会社 Board structure
WO2014083959A1 (en) * 2012-11-29 2014-06-05 オリンパスメディカルシステムズ株式会社 Connection structure for circuit boards
WO2014171275A1 (en) * 2013-04-16 2014-10-23 オリンパスメディカルシステムズ株式会社 Substrate connection structure
WO2014208171A1 (en) * 2013-06-28 2014-12-31 オリンパスメディカルシステムズ株式会社 Imaging module and endoscope device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020042916A (en) * 2018-09-06 2020-03-19 株式会社フジクラ Connector and connector-equipped substrate
JP7185450B2 (en) 2018-09-06 2022-12-07 株式会社フジクラ connector, board with connector

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