WO2017193654A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2017193654A1
WO2017193654A1 PCT/CN2017/073059 CN2017073059W WO2017193654A1 WO 2017193654 A1 WO2017193654 A1 WO 2017193654A1 CN 2017073059 W CN2017073059 W CN 2017073059W WO 2017193654 A1 WO2017193654 A1 WO 2017193654A1
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WO
WIPO (PCT)
Prior art keywords
substrate
display panel
chip
backing plate
disposed
Prior art date
Application number
PCT/CN2017/073059
Other languages
English (en)
French (fr)
Inventor
马永达
先建波
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/544,924 priority Critical patent/US10288930B2/en
Publication of WO2017193654A1 publication Critical patent/WO2017193654A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the invention belongs to the technical field of liquid crystal display, and particularly relates to a display panel and a display device.
  • the display panel generally includes a chip mounting area.
  • the chip of the chip mounting area is susceptible to the force of moving or damaging it, thereby affecting the display function of the display panel.
  • embodiments of the present invention provide a display panel and a display device, which can reduce or avoid the force of the chip in the chip mounting area being moved or damaged. Protect the chip to improve the quality of the display panel and display device.
  • a display panel including: a first substrate; a second substrate, the second substrate including a region overlapping the first substrate and a region not overlapping the first substrate a chip mounting region is disposed in the non-overlapping region; a pad disposed in the chip mounting region and having a receiving portion; and a chip disposed in the receiving portion of the pad and Electrically connected to the second substrate.
  • a distance of the surface of the backing plate away from the second substrate to a surface of the second substrate near the backing plate is not less than a surface of the chip away from the second substrate to the first The distance between the two substrates near the surface of the chip.
  • the display panel further includes a flexible circuit board electrically connected to the chip, the flexible circuit board being disposed between the second substrate and the backing plate, and the backing plate At least partially overlap.
  • an adhesive layer is disposed between the flexible circuit board and the backing plate.
  • the flexible circuit board and the backing plate are of a unitary structure.
  • a surface of the backing plate that is in contact with the second substrate is a reflective surface.
  • the backing plate is made of polycarbonate or glass material.
  • a side of the receiving portion adjacent to the display area of the display panel is an opening.
  • a side of the receiving portion corresponding to the chip that is away from the second substrate is an opening.
  • a side of the receiving portion adjacent to the display area of the display panel and a side thereof corresponding to the chip away from the second substrate are openings.
  • the display panel further includes: a first polarizer disposed on a surface of the first substrate away from the second substrate; and a second polarizer disposed on the second substrate away from the a surface of the first substrate; and a spacer and liquid crystal molecules disposed between the first substrate and the second substrate.
  • a surface of the first substrate remote from the second substrate is a display surface of the display panel, and a surface of the second substrate remote from the first substrate is a surface facing the backlight.
  • another display panel including a second substrate, a chip, and a flexible circuit board, the flexible circuit board being disposed on the second substrate and electrically connected to the second substrate,
  • the flexible circuit board is provided with a chip mounting area
  • the display panel further includes: a backing plate disposed in the chip mounting area of the flexible circuit board and having a receiving portion, the chip being disposed in the receiving portion And electrically connected to the flexible circuit board.
  • a distance between a surface of the backing plate away from the flexible circuit board to a surface of the flexible circuit board near the backing plate is not less than a surface of the chip away from the flexible circuit board. The distance between the surfaces of the flexible circuit board adjacent to the chip.
  • a side of the receiving portion adjacent to the display area of the display panel is an opening.
  • a side of the receiving portion corresponding to the chip that is away from the flexible circuit board is an opening.
  • a side of the receiving portion adjacent to the display area of the display panel and a side thereof corresponding to the chip away from the flexible circuit board are openings.
  • the flexible circuit board and the backing plate are of a unitary structure.
  • the backing plate is made of polycarbonate or glass material.
  • the display panel further includes a first substrate disposed on the second substrate pair, and a first polarizer is disposed on a surface of the first substrate remote from the second substrate; a second polarizer is disposed on a surface of the substrate remote from the first substrate; a spacer is disposed between the first substrate and the second substrate; and the first substrate and the second substrate are disposed on the first substrate and the second substrate The liquid crystal molecules are filled between them.
  • a surface of the second substrate that is away from the first substrate is a display surface of the display panel, and a surface of the second substrate that is away from the first substrate is a surface that faces the backlight.
  • a display device comprising the above display panel provided by the embodiment of the invention.
  • the present invention has the following beneficial effects: in the display panel and the display device provided by the embodiments of the present invention, by using the pad, the chip of the chip mounting area can be reduced or prevented from being moved or damaged during assembly of the display panel and the display device. The force can thus protect the chip, thereby improving the quality of the display panel and the display device.
  • FIG. 1A is a top plan view of a display panel according to a first embodiment of the present invention.
  • Figure 1B is a cross-sectional view taken along line A-A' in Figure 1A;
  • FIG. 2A is a top view of a display panel according to a second embodiment of the present invention.
  • Figure 2B is a cross-sectional view taken along line B-B' in Figure 2A;
  • FIG. 3 is a cross-sectional view of a display panel according to a third embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a display panel according to a fourth embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a display panel according to a fifth embodiment of the present invention.
  • the display panel of the first embodiment includes a second substrate 10 (eg, an array substrate), a first substrate 11 (eg, a color filter substrate) disposed opposite the second substrate 10, a chip IC, and a backing plate 12, wherein the second substrate 10 includes a region overlapping the first substrate 11 and a region not overlapping the first substrate 11, wherein a chip mounting region is disposed in the non-overlapping region, and the backing plate 12 is disposed at
  • the chip mounting area on the two substrates 10 has a receiving portion 121 for accommodating the chip IC, that is, the chip IC is disposed in the accommodating portion 121, and the chip IC passes through the electrical connection point 101 and the second substrate 10 Electrical connection.
  • the second substrate 10 is not limited to the array substrate
  • the first substrate 11 is not limited
  • the chip IC can be reduced or avoided during the assembly process of the display panel and the display device including the display panel, or Damaged forces can thus protect the chip, thereby improving the quality of the display panel and display device.
  • the upper surface of the pad 12 is not lower than the upper surface of the chip IC (ie, the surface away from the second substrate 10). That is, the distance from the surface of the backing plate 12 away from the second substrate 10 to the surface of the second substrate 10 near the backing plate 12 is not less than the distance from the surface of the chip IC remote from the second substrate 10 to the surface of the second substrate 10 close to the chip IC.
  • the receiving portion 121 of the backing plate 12 is a through hole penetrating through the backing plate 12. The shape of the through hole is similar to the shape of the chip IC.
  • the size of the through hole is not less than the size of the chip IC, and the chip IC is provided.
  • the depth H of the through hole ie, the receiving portion 121) (ie, the thickness of the pad 12) is not less than the thickness D of the chip IC (including the thickness of the electrical connection point 101), so that the chip IC is completely located.
  • the inside of the housing portion 121 protects the chip IC. In this case, during assembly of the display panel and the display device, the pad 12 can further protect the upper portion of the chip IC from damage; and the chip IC is balanced when the display panel and the display device are mounted. Not even subject to drooping The force of the direct component does not cause stress marks on the second substrate 10, and thus does not affect the display effects of the display panel and the display device.
  • the surface of the backing plate 12 that is in contact with the second substrate 10 is a reflective surface, so that light leakage from the wiring gap of the second substrate 10 can be avoided.
  • the backing plate 12 can be made of, but not limited to, polycarbonate (ie, PC material) or a glass material.
  • FIG. 2A is a plan view of a display panel according to a second embodiment of the present invention
  • FIG. 2B is a cross-sectional view taken along line B-B' of FIG. 2A.
  • the display panel provided in this embodiment is similar to the display panel provided in the first embodiment, and includes: a second substrate 10, a first substrate 11, a pad 12, and a chip IC, due to these components.
  • the structure and positional relationship have been described in detail in the first embodiment, and will not be described herein.
  • the side of the backing plate 12 adjacent to the display area of the display panel is an opening, that is, the receiving portion 121 on the backing plate 12 is opened.
  • the display panel further includes a flexible circuit board 13, and a part of the flexible circuit board 13 is laminated under the backing plate 12 (for example, below the side of the backing plate 12 away from the display area of the display panel) And the second substrate 10, and the flexible wiring board 13 is electrically connected to the chip IC, in other words, the flexible wiring board 13 and the backing plate 12 may be of a split structure.
  • the flexible wiring board 13 and the backing plate 12 may be of a split structure. It can be understood that by laminating the flexible circuit board 13 on the second substrate 10 by means of the backing plate 12, the connection strength of the flexible wiring board 13 and the second substrate 10 can be increased, and the backing plate 12 and the flexible wiring board 13 are separated. Structure, which facilitates the replacement of parts. The two can be connected by providing an adhesive layer between the flexible wiring board 13 and the backing plate 12.
  • the display panel provided in this embodiment further includes: a first polarizer 14 disposed on a surface of the first substrate 11 away from the second substrate 10 (ie, a display surface of the display panel), in the second a second polarizer 15 disposed on a surface of the substrate 10 remote from the first substrate 11 (ie, a surface facing the backlight of the display device), a spacer disposed between the second substrate 10 and the first substrate 11 a pad 16 and the second substrate 10 and the Liquid crystal molecules (not shown) filled between the first substrates 11 are described. That is, the display panel provided in this embodiment may be a liquid crystal display panel.
  • the display panel provided by the embodiment of the present invention is not limited to the liquid crystal display panel, and may be other types of display panels, for example, an organic light emitting display panel.
  • the display panel provided in this embodiment is similar to the display panel provided in the second embodiment, and includes a second substrate 10, a first substrate 11, a pad 12, a chip IC, a flexible circuit board 13, and a first
  • the polarizer 14, the second polarizer 15, the spacer 16 and the liquid crystal molecules have been described in detail in the above embodiments due to the structure and positional relationship of these components, and will not be described herein. .
  • the flexible wiring board 13 and the backing plate 12 are of a unitary structure, so that by laminating the flexible wiring board 13 on the second substrate 10 by means of the backing plate 12, the flexible wiring board 13 can be added.
  • the connection strength of the second substrate 10 is such that the backing plate 12 and the flexible wiring board 13 have an integrated structure to facilitate assembly of the display panel.
  • the display panel provided in this embodiment is similar to the display panel provided in the third embodiment, and further includes: a second substrate 10, a first substrate 11, a pad 12, a chip IC, a flexible circuit board 13, and a first
  • the polarizer 14, the second polarizer 15, the spacer 16 and the liquid crystal molecules have been described in detail in the above embodiments due to the structure and positional relationship of these components, and will not be described herein. .
  • the side of the backing plate 12 corresponding to the chip IC that is away from the second substrate 10 is not provided with an opening, that is, the receiving portion 121 of the backing plate 12 is adjacent to the display panel of the backing plate 12. a display area and a notch close to one side of the second substrate 10, and the contents of the first to third embodiments Compared with the nano portion 121, the housing portion 121 of the present embodiment can further protect the upper surface of the chip IC.
  • FIG. 5 is a cross-sectional view of a display panel according to a fifth embodiment of the present invention.
  • the display panel provided in this embodiment includes: a second substrate 10, a first substrate 11, a pad 12, a chip IC, a flexible circuit board 13, a first polarizer 14, a second polarizer 15, and a spacer. 16 and liquid crystal molecules (not shown), wherein the second substrate 10 and the first substrate 11 are disposed on the box, and the flexible circuit board 13 is disposed on the second substrate 10 and electrically connected to the second substrate 10, the flexible circuit board A chip mounting area is provided on the substrate 12, and the pad 12 is disposed in the chip mounting area of the flexible circuit board 13 and has a receiving portion 121. The chip IC is disposed in the receiving portion 121 and electrically connected to the flexible circuit board 13 through the electrical connection point 101.
  • the display panel provided by the embodiment can reduce or avoid the force of the chip IC being moved or damaged by the pad 12 having the receiving portion 121, thereby protecting the chip IC, thereby improving the display panel and the display. The quality of the device.
  • the upper surface of the backing plate 12 i.e., the surface away from the flexible wiring board 13
  • the upper surface of the chip IC i.e., the surface away from the flexible wiring board 13
  • the distance from the surface of the backing plate 12 away from the flexible wiring board 13 to the surface of the flexible wiring board 13 close to the backing plate 12 is not less than the distance from the surface of the chip IC remote from the flexible wiring board 13 to the surface of the flexible wiring board 13 close to the chip IC.
  • the receiving portion 121 of the backing plate 12 may be a through hole penetrating through the backing plate 12, and the shape of the through hole is similar to the shape of the chip IC.
  • the size of the through hole is not smaller than the size of the chip IC, and the chip IC is disposed on the through hole.
  • the depth H of the through hole ie, the accommodating portion 121
  • the thickness D of the chip IC including the thickness of the electrical connection point 101
  • the pad 12 can further protect the upper portion of the chip IC from damage during assembly of the display panel and the display device; and, by placing the pad 12 and the chip IC on the flexible wiring board 13 Then, the flexible circuit board 13 is mounted on the second substrate 10, which can prevent the chip IC from generating stress marks on the second substrate 10, so that the display panel and the display are not displayed.
  • the display effect of the device has an effect.
  • the backing plate 12 can be made of, but not limited to, polycarbonate (ie, PC material) or a glass material.
  • the side of the backing plate 12 adjacent to the display area of the display panel is an opening, that is, the receiving portion 121 on the backing plate 12 is opened on the display area of the backing plate 12 near the display panel.
  • a notch on one side as shown in the second embodiment and the third embodiment; and/or, an opening of the backing plate 12 corresponding to the chip IC away from the flexible circuit board 13 is not provided with an opening, that is, the back of the backing plate 12
  • the accommodating portion 121 is a notch that is opened on a side of the backing plate 12 close to the display area of the display panel and close to the side of the flexible wiring board 13, as shown in the fourth embodiment.
  • the flexible circuit board 13 and the backing plate 12 may be of a unitary structure.
  • the side of the backing plate 12 corresponding to the chip IC away from the flexible circuit board 13 is an opening from which the chip IC can The opening enters the housing portion 121 for mounting.
  • first polarizer 14 the second polarizer 15, the spacers 16, and the liquid crystal molecules (not shown) and the positional relationship therebetween are as shown in the second embodiment, and are not Let me repeat.
  • the display panel of the present embodiment is not limited to the liquid crystal display panel, but may be other types of display panels, for example, an organic light emitting display panel.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

一种显示面板及包括显示面板的一种显示装置。显示面板包括第一基板（11）、第二基板（10），垫板（12）和芯片（IC）。第二基板（10）包括与第一基板（11）重叠的区域和与第一基板（11）不重叠的区域，不重叠的区域中设置有芯片安装区。垫板（12）设置在芯片安装区内且具有容纳部（121）。芯片（IC）设置在垫板（12）的容纳部（121）内且与第二基板（10）电连接。

Description

显示面板及显示装置
相关申请的交叉引用
本申请要求于2016年5月12日提交的题为“显示面板及显示装置”的中国专利申请No.201620429180.X的优先权，其全部内容通过引用合并于此。
技术领域
本发明属于液晶显示技术领域，具体涉及显示面板及显示装置。
背景技术
显示面板一般包括芯片安装区，但是，在显示面板的制备过程中，芯片安装区的芯片易受到使其移动或损坏的作用力而对其产生影响，从而影响显示面板的显示功能。
发明内容
为了至少部分解决现有技术中存在的技术问题，本发明实施例提供了一种显示面板及一种显示装置，可减轻或避免芯片安装区的芯片受到使其移动或损坏的作用力，因而可保护芯片，从而提高显示面板和显示装置的质量。
根据本发明的实施例，提供了一种显示面板，包括：第一基板；第二基板，所述第二基板包括与所述第一基板重叠的区域和与所述第一基板不重叠的区域，所述不重叠的区域中设置有芯片安装区；垫板，所述垫板设置在所述芯片安装区内且具有容纳部；和芯片，所述芯片设置在所述垫板的容纳部内且与所述第二基板电连接。
可选地，所述垫板的远离所述第二基板的表面到所述第二基板靠近所述垫板的表面的距离不小于所述芯片的远离所述第二基板的表面到所述第二基板靠近所述芯片的表面的距离。
可选地，所述显示面板还包括与所述芯片电连接的柔性线路板，所述柔性线路板设置在所述第二基板和所述垫板之间，且与所述垫板 至少部分地重叠。
可选地，所述柔性线路板和所述垫板之间设置有胶粘层。
可选地，所述柔性线路板和所述垫板为一体式结构。
可选地，所述垫板的与所述第二基板相接触的表面为反光面。
可选地，所述垫板采用聚碳酸酯或玻璃材料制成。
可选地，所述容纳部的靠近所述显示面板的显示区域的一侧为开口。
可选地，所述容纳部的与所述芯片对应的远离所述第二基板的一侧为开口。
可选地，所述容纳部的靠近所述显示面板的显示区域的一侧及其与所述芯片对应的远离所述第二基板的一侧为开口。
可选地，所述显示面板还包括：第一偏光片，其设置在所述第一基板远离所述第二基板的表面上；第二偏光片，其设置在所述第二基板远离所述第一基板的表面上；和隔垫物和液晶分子，其设置在所述第一基板和所述第二基板之间。
可选地，所述第一基板的远离所述第二基板的表面为所述显示面板的显示表面，并且所述第二基板的远离所述第一基板的表面为朝向背光源的表面。
根据本发明的实施例，还提供另一种显示面板，包括第二基板、芯片和柔性线路板，所述柔性线路板设置在所述第二基板上且与所述第二基板电连接，所述柔性线路板上设置有芯片安装区，所述显示面板还包括：垫板，所述垫板设置在所述柔性线路板上的芯片安装区内且具有容纳部，所述芯片设置于容纳部内且与所述柔性线路板电连接。
可选地，所述垫板的远离所述柔性线路板的表面到所述柔性线路板靠近所述垫板的表面之间的距离不小于所述芯片的远离所述柔性线路板的表面到所述柔性线路板的靠近所述芯片的表面之间的距离。
可选地，所述容纳部的靠近所述显示面板的显示区域的一侧为开口。
可选地，所述容纳部的与所述芯片对应的远离所述柔性线路板的一侧为开口。
可选地，所述容纳部的靠近所述显示面板的显示区域的一侧及其与所述芯片对应的远离所述柔性线路板的一侧为开口。
可选地，所述柔性线路板和所述垫板为一体式结构。
可选地，所述垫板采用聚碳酸酯或玻璃材料制成。
可选地，所述显示面板还包括与第二基板对盒设置的第一基板，在所述第一基板的远离所述第二基板的表面上设置有第一偏光片；在所述第二基板的远离所述第一基板的表面上设置有第二偏光片；在所述第一基板和所述第二基板之间设置有隔垫物；在所述第一基板和所述第二基板之间填充有液晶分子。
可选地，所述第一基板的远离的第二基板的表面为所述显示面板的显示表面，并且所述第二基板的远离所述第一基板的表面为朝向背光源的表面。
根据本发明的实施例，还提供一种显示装置，包括本发明实施例提供的上述显示面板。
本发明具有以下有益效果：本发明实施例提供的显示面板及显示装置中，通过借助垫板可减轻或避免芯片安装区的芯片在显示面板及显示装置的组装过程中受到使其移动或损坏的作用力，因而可保护芯片，从而提高显示面板和显示装置的质量。
附图说明
图1A为本发明第一实施例提供的显示面板的俯视图；
图1B为沿图1A中的线A-A’截取的剖视图；
图2A本发明第二实施例提供的显示面板的俯视图；
图2B为沿图2A中的线B-B’截取的剖视图；
图3为本发明第三实施例提供的显示面板的剖视图；
图4为本发明第四实施例提供的显示面板的剖视图；
图5为本发明第五实施例提供的显示面板的剖视图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合 附图来对本发明提供的显示面板及显示装置进行详细描述。
第一实施例
图1A为本发明第一实施例提供的显示面板的俯视图；图1B为沿图1A中的线A-A’截取的剖视图。参阅图1A和图1B，第一实施例的显示面板包括第二基板10(例如，阵列基板)、与第二基板10对盒设置的第一基板11(例如，彩膜基板)、芯片IC和垫板12，其中，第二基板10包括与第一基板11重叠的区域和与第一基板11不重叠的区域，在所述不重叠的区域中设置有芯片安装区，垫板12设置在第二基板10上的芯片安装区内且具有容纳部121，该容纳部121用于容纳芯片IC，即，芯片IC设置于容纳部121内，并且，芯片IC通过电连接点101与第二基板10电连接。需注意，第二基板10不限于阵列基板，并且第一基板11不限于彩膜基板，例如，第二基板10可以为彩膜基板，第一基板11可以为阵列基板。
可以理解，本实施例提供的显示面板中，通过借助具有容纳部121的垫板12，可减轻或避免芯片IC在显示面板和包含该显示面板的显示装置的组装过程中受到的使其移动或损坏的作用力，因而可保护芯片，从而提高显示面板和显示装置的质量。
在本实施例中，可选地，垫板12的上表面(即，远离第二基板10的表面)不低于芯片IC的上表面(即，远离第二基板10的表面)。即，垫板12的远离第二基板10的表面到第二基板10靠近垫板12的表面的距离不小于芯片IC的远离第二基板10的表面到第二基板10靠近芯片IC的表面的距离。具体地，参看图1B，垫板12的容纳部121为贯穿垫板12的通孔，该通孔的形状类似于芯片IC的形状，该通孔的尺寸不小于芯片IC的尺寸，芯片IC设于该通孔内，该通孔(即，容纳部121)的深度H(即，垫板12的厚度)不小于芯片IC的厚度D(包括电连接点101的厚度)，使芯片IC完全位于容纳部121内，以保护芯片IC。在这种情况下，在显示面板和显示装置的组装过程中，垫板12可进一步保护芯片IC的上部以避免其受到损坏；而且，在安装显示面板和显示装置的边框时芯片IC受力均衡甚至不会受到具有垂 直分量的作用力，因此，不会对第二基板10产生应力痕，从而不会对显示面板和显示装置的显示效果产生影响。
可选地，垫板12的与第二基板10相接触的表面为反光面，这样，可避免从第二基板10的走线间隙漏光。
在本实施例中，垫板12可以采用但不限于聚碳酸酯(即，PC材料)或玻璃材料制成。
第二实施例
图2A为本发明第二实施例提供的显示面板的俯视图；图2B为沿图2A中的线B-B’截取的剖视图。参阅图2A和图2B，本实施例提供的显示面板与第一实施例提供的显示面板相类似，同样包括：第二基板10、第一基板11、垫板12和芯片IC，由于这些部件的结构和位置关系在第一实施例中已有了详细的描述，在此不再赘述。
下面仅描述本实施例与第一实施例的不同点。
具体地，本实施例中，垫板12的靠近显示面板的显示区域的一侧(如图2A所示的朝上的一侧)为开口，即，垫板12上的容纳部121为开设在垫板12的靠近显示面板的显示区域的一侧的缺口。
而且，本实施例中，所述显示面板还包括柔性线路板13，柔性线路板13的一部分叠压在垫板12的下方(例如，垫板12的远离显示面板的显示区域的一侧的下方)及第二基板10上，且柔性线路板13与芯片IC电连接，换言之，柔性线路板13与垫板12可以为分体式结构。可以理解，通过借助垫板12将柔性线路板13叠压在第二基板10上，可增加柔性线路板13和第二基板10的连接强度，将垫板12和柔性线路板13设为分体结构，这便于零部件的更换。可以通过在柔性线路板13与垫板12之间设置胶黏层而使得两者连接。
此外，本实施例提供的显示面板还包括：在所述第一基板11的远离第二基板10的表面(即，显示面板的显示表面)上设置的第一偏光片14、在所述第二基板10的远离第一基板11的表面(即，朝向显示装置的背光源的表面)上设置的第二偏光片15、在所述第二基板10和所述第一基板11之间设置的隔垫物16、以及在所述第二基板10和所 述第一基板11之间填充的液晶分子(图中未示出)。也就是说，本实施例提供的显示面板可以为液晶显示面板。
当然，在实际应用中，本发明实施例提供的显示面板并不局限于液晶显示面板，还可以为其他类型的显示面板，例如，有机发光显示面板。
第三实施例
图3为本发明第三实施例提供的显示面板的剖视图。参阅图3，本实施例提供的显示面板与第二实施例提供的显示面板相类似，同样包括：第二基板10、第一基板11、垫板12、芯片IC、柔性线路板13、第一偏光片14、第二偏光片15、隔垫物16和液晶分子(图中未示出)，由于这些部件的结构和位置关系在上述实施例中已有了详细的描述，在此不再赘述。
下面仅描述本实施例与第二实施例的不同点。
具体地，在本实施例中，柔性线路板13与垫板12为一体式结构，这样，通过借助垫板12将柔性线路板13叠压在第二基板10上，可增加柔性线路板13和第二基板10的连接强度，将垫板12和柔性线路板13设为一体式结构便于显示面板的组装。
第四实施例
图4为本发明第四实施例提供的显示面板的剖视图。参阅图4，本实施例提供的显示面板与第三实施例提供的显示面板相类似，同样包括：第二基板10、第一基板11、垫板12、芯片IC、柔性线路板13、第一偏光片14、第二偏光片15、隔垫物16和液晶分子(图中未示出)，由于这些部件的结构和位置关系在上述实施例中已有了详细的描述，在此不再赘述。
下面仅描述本实施例与第三实施例的不同点。具体地，在本实施例中，垫板12的与芯片IC对应的远离第二基板10的一侧并未设置开口，即，垫板12的容纳部121为开设在垫板12的靠近显示面板的显示区域且靠近第二基板10的一侧的缺口，与第一至第三实施例中的容 纳部121相比，本实施例的容纳部121能够进一步保护芯片IC的上表面。
在此需要说明的是，上述各实施例中的各个技术特征，在不矛盾的情况下，可任意组合来形成新的实施例。
第五实施例
图5为本发明第五实施例提供的显示面板的剖视图。参阅图5，本实施例提供的显示面板包括：第二基板10、第一基板11、垫板12、芯片IC、柔性线路板13、第一偏光片14、第二偏光片15、隔垫物16和液晶分子(图中未示出)，其中，第二基板10和第一基板11对盒设置，柔性线路板13设置于第二基板10上且与第二基板10电连接，柔性线路板13上设置有芯片安装区，垫板12设置在柔性线路板13的芯片安装区内且具有容纳部121，芯片IC设置于容纳部121内且通过电连接点101与柔性线路板13电连接。
可以理解，本实施例提供的显示面板通过借助具有容纳部121的垫板12，可减轻或避免芯片IC受到的使其移动或损坏的作用力，因而可保护芯片IC，从而提高显示面板和显示装置的质量。
在本实施例中，可选地，垫板12的上表面(即，远离柔性线路板13的表面)不低于芯片IC的上表面(即，远离柔性线路板13的表面)。即，垫板12的远离柔性线路板13的表面到柔性线路板13靠近垫板12的表面的距离不小于芯片IC的远离柔性线路板13的表面到柔性线路板13靠近芯片IC的表面的距离。具体地，垫板12的容纳部121可以为贯穿垫板12的通孔，该通孔的形状类似于芯片IC的形状，该通孔的尺寸不小于芯片IC的尺寸，芯片IC设于该通孔内，该通孔(即，容纳部121)的深度H不小于芯片IC的厚度D(包括电连接点101的厚度)，使芯片IC完全位于容纳部121内，以保护芯片IC。在这种情况下，在显示面板和显示装置的组装过程中，垫板12可进一步保护芯片IC的上部以避免其受到损坏；而且，通过将垫板12及芯片IC设置在柔性线路板13上，再将柔性线路板13安装在第二基板10上，可以避免芯片IC对第二基板10产生应力痕，从而不会对显示面板和显示 装置的显示效果产生影响。
在本实施例中，垫板12可以采用但不限于聚碳酸酯(即，PC材料)或玻璃材料制成。
可选地，在本实施例中，垫板12的靠近显示面板的显示区域的一侧为开口，即，垫板12上的容纳部121为开设在垫板12的靠近显示面板的显示区域的一侧的缺口，如第二实施例和第三实施例所示；和/或，垫板12的与芯片IC对应的远离柔性线路板13的一侧并未设置开口，即，垫板12的容纳部121为开设在垫板12的靠近显示面板的显示区域且靠近柔性线路板13的一侧的缺口，如第四实施例所示。
进一步可选地，柔性线路板13和垫板12可为一体式结构，在这种情况下，垫板12的与芯片IC对应的远离柔性线路板13的一侧为开口，芯片IC可从该开口进入所述容纳部121内来安装。
需要说明的是，第一偏光片14、第二偏光片15、隔垫物16和液晶分子(图中未示出)的结构和相互之间位置关系如第二实施例所示，在此不再赘述。
还需要说明的是，本实施例的显示面板并不局限于液晶显示面板，而可以为其他类型的显示面板，例如，有机发光显示面板。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (22)

  1. 一种显示面板，包括：
    第一基板；
    第二基板，所述第二基板包括与所述第一基板重叠的区域和与所述第一基板不重叠的区域，所述不重叠的区域中设置有芯片安装区；
    垫板，所述垫板设置在所述芯片安装区内且具有容纳部；和
    芯片，所述芯片设置在所述垫板的容纳部内且与所述第二基板电连接。
  2. 根据权利要求1所述的显示面板，其中，所述垫板的远离所述第二基板的表面到所述第二基板靠近所述垫板的表面的距离不小于所述芯片的远离所述第二基板的表面到所述第二基板靠近所述芯片的表面的距离。
  3. 根据权利要求1所述的显示面板，还包括与所述芯片电连接的柔性线路板，所述柔性线路板设置在所述第二基板和所述垫板之间，且与所述垫板至少部分地重叠。
  4. 根据权利要求3所述的显示面板，其中，所述柔性线路板和所述垫板之间设置有胶粘层。
  5. 根据权利要求3所述的显示面板，其中，所述柔性线路板和所述垫板为一体式结构。
  6. 根据权利要求1所述的显示面板，其中，所述垫板的与所述第二基板相接触的表面为反光面。
  7. 根据权利要求1所述的显示面板，其中，所述垫板采用聚碳酸酯或玻璃材料制成。
  8. 根据权利要求1所述的显示面板，其中，所述容纳部的靠近所述显示面板的显示区域的一侧为开口。
  9. 根据权利要求1所述的显示面板，其中，所述容纳部的与所述芯片对应的远离所述第二基板的一侧为开口。
  10. 根据权利要求1所述的显示面板，其中，所述容纳部的靠近所述显示面板的显示区域的一侧及其与所述芯片对应的远离所述第二基板的一侧为开口。
  11. 根据权利要求1所述的显示面板，还包括：
    第一偏光片，其设置在所述第一基板远离所述第二基板的表面上；
    第二偏光片，其设置在所述第二基板远离所述第一基板的表面上；和
    隔垫物和液晶分子，其设置在所述第一基板和所述第二基板之间。
  12. 根据权利要求11所述的显示面板，其中，所述第一基板的远离所述第二基板的表面为所述显示面板的显示表面，并且所述第二基板的远离所述第一基板的表面为朝向背光源的表面。
  13. 一种显示面板，包括第二基板、芯片和柔性线路板，所述柔性线路板设置在所述第二基板上且与所述第二基板电连接，所述柔性线路板上设置有芯片安装区，所述显示面板还包括：
    垫板，所述垫板设置在所述柔性线路板的芯片安装区内且具有容纳部，所述芯片设置于所述容纳部内且与所述柔性线路板电连接。
  14. 根据权利要求13所述的显示面板，其中，所述垫板的远离所述柔性线路板的表面到所述柔性线路板靠近所述垫板的表面之间的距离不小于所述芯片的远离所述柔性线路板的表面到所述柔性线路板的 靠近所述芯片的表面之间的距离。
  15. 根据权利要求13所述的显示面板，其中，所述容纳部的靠近所述显示面板的显示区域的一侧为开口。
  16. 根据权利要求13所述的显示面板，其中，所述容纳部的与所述芯片对应的远离所述柔性线路板的一侧为开口。
  17. 根据权利要求13所述的显示面板，其中，所述容纳部的靠近所述显示面板的显示区域的一侧及其与所述芯片对应的远离所述柔性线路板的一侧为开口。
  18. 根据权利要求13所述的显示面板，其中，所述柔性线路板和所述垫板为一体式结构。
  19. 根据权利要求13所述的显示面板，其中，所述垫板采用聚碳酸酯或玻璃材料制成。
  20. 根据权利要求13所述的显示面板，还包括与第二基板对盒设置的第一基板，在所述第一基板的远离所述第二基板的表面上设置有第一偏光片；在所述第二基板的远离第一基板的表面上设置有第二偏光片；在所述第一基板和所述第二基板之间设置有隔垫物；在所述第一基板和所述第二基板之间填充有液晶分子。
  21. 根据权利要求20所述的显示面板，其中，所述第一基板的远离的第二基板的表面为所述显示面板的显示表面，并且所述第二基板的远离所述第一基板的表面为朝向背光源的表面。
  22. 一种显示装置，包括权利要求1至21中任意一项所述的显示面板。
PCT/CN2017/073059 2016-05-12 2017-02-07 显示面板及显示装置 WO2017193654A1 (zh)

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CN205594261U (zh) * 2016-05-12 2016-09-21 京东方科技集团股份有限公司 显示面板及显示装置
CN108957840B (zh) * 2018-08-21 2021-09-21 京东方科技集团股份有限公司 一种显示模组、显示装置、偏光片及其制备方法
CN108957872A (zh) * 2018-10-09 2018-12-07 张家港康得新光电材料有限公司 显示装置
CN111432047B (zh) * 2019-01-09 2021-11-30 群创光电股份有限公司 电子装置
WO2023220985A1 (zh) * 2022-05-18 2023-11-23 京东方科技集团股份有限公司 显示模组、显示装置和驱动电路板

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