WO2017185840A1 - 背板装置、通信设备 - Google Patents

背板装置、通信设备 Download PDF

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Publication number
WO2017185840A1
WO2017185840A1 PCT/CN2017/071746 CN2017071746W WO2017185840A1 WO 2017185840 A1 WO2017185840 A1 WO 2017185840A1 CN 2017071746 W CN2017071746 W CN 2017071746W WO 2017185840 A1 WO2017185840 A1 WO 2017185840A1
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Prior art keywords
backplane
line card
disposed
backplanes
switch board
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PCT/CN2017/071746
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English (en)
French (fr)
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张远望
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中兴通讯股份有限公司
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Publication of WO2017185840A1 publication Critical patent/WO2017185840A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L49/00—Packet switching elements
    • H04L49/40—Constructional details, e.g. power supply, mechanical construction or backplane

Definitions

  • the present invention relates to the field of communication hardware architecture, and in particular to a backplane device and a communication device.
  • the device forwarding bandwidth requirements of the aggregation and core nodes are increasing.
  • the high-speed bus rate of the communication boards connected to the service boards is getting higher and higher (current mainstream devices are already greater than or equal to 25 Gbps), and the number of high-speed channels is also increasing.
  • the insertion loss per unit length becomes larger and larger, and the system high-speed channel length becomes a key factor that restricts the bandwidth capacity of the device.
  • the power consumption of the board is also increased due to the increased processing bandwidth and enhanced functions. Heat dissipation has also become a bottleneck in the overall design of system hardware.
  • FIG. 1 is a line card and a switch board in the related art of the present invention.
  • Schematic diagram of the orthogonal architecture as shown in Figure 1, the problem of the two layers of the front and rear boards is that the depth of the equipment is deep; the orthogonal architecture is because the switch board needs to bridge all the line cards, so it will also lead to the movement inside the switch board. Line growth; limited by the size of the switch board, the number of line cards cannot be too much, and the capacity of the device is constrained.
  • FIG. 2 is a line card and related art in the related art of the present invention.
  • the schematic diagram of the traditional backplane structure of the switchboard is vertical. As shown in Fig. 2, in order to reduce the insertion loss, the high-frequency board with lower loss coefficient is used, and the cost of synchronization increases a lot.
  • the use of the traditional backplane also affects the use of the front and rear air ducts due to the backplane blocking. Heat dissipation is constrained.
  • the embodiments of the present invention provide a backplane device and a communication device, which solve the problems of high speed channel insertion loss, high cost, difficulty in meeting depth requirements, poor heat dissipation, and system bandwidth capacity size constraints of the backplane frame system in the related art. .
  • a backplane device comprising: a line card disposed on a side of the backplane device and perpendicular to the switchboard; the switchboard, and the plurality of backplanes Orthogonally disposed; the plurality of backplanes are disposed on the other side of the backplane device, disposed in parallel with the line card; wherein the plurality of backs are passed between the line card and the switchboard
  • the board performs high speed signal connections.
  • the backplane device further includes: a middle plate disposed between two sides of the backboard device, configured to fix a position of the line card, the plurality of backboards, and the switchboard, and / or, the transmission of low speed signals and / or power signals.
  • the preset area of the middle plate is hollowed out, or a ventilation hole is provided on the middle plate.
  • backplane and the line card are coplanarly connected by a coplanar connector, and/or the backplane and the switchboard are orthogonally connected by an orthogonal connector.
  • the line card is vertically disposed on an upper side and/or a lower side of the switchboard.
  • the backplane includes at least one of the following: a high speed signal electric backplane, and an optical waveguide board.
  • a communication device including: a backplane device, a fan, wherein the backplane device includes: a line card disposed on a side of the backplane device with a switchboard, Vertically disposed with the switchboard; the switchboard is disposed orthogonally to the plurality of backplanes; the plurality of backplanes are disposed on the other side of the backplane apparatus, disposed in parallel with the line card, a plurality of backplanes further including a backplane gap disposed to ventilate and dissipate the backplane device through the backplane gap; a fan disposed outside the backplane gap; wherein the line card and the High-speed signal connections are made between the switch boards through the plurality of backplanes.
  • the backplane device further includes: a middle plate disposed between two sides of the backboard device, configured to fix a position of the line card, the plurality of backboards, and the switchboard, and / or, the transmission of low speed signals and / or power signals.
  • the preset area of the middle plate is hollowed out or provided with ventilation holes for ventilation, and/or the plurality of back plates and the exchange plate are connected by orthogonal connectors, the plurality of backs The board and the line card are connected by a coplanar connector.
  • a line card is disposed, and the switch board is disposed on one side of the backboard device and perpendicular to the switch board; the switch board is disposed orthogonally to the plurality of back boards; the plurality of back boards, Provided on the other side of the backplane device, disposed in parallel with the line card; wherein the line card and the switchboard are connected by the plurality of backplanes for high-speed signal through orthogonal multiple backs
  • the design of the board solves the problems of high-speed channel insertion loss, high cost, difficulty in meeting deep demand, poor heat dissipation, and system bandwidth capacity size constraints in the backplane frame system of the related art.
  • FIG. 1 is a schematic diagram of an orthogonal structure of a line card and a switch board in the related art of the present invention
  • FIG. 2 is a schematic diagram of a conventional backplane structure in which a line card and a switch board are vertical in the related art of the present invention
  • FIG. 3 is a schematic structural diagram of a backplane device according to an embodiment of the present invention.
  • FIG. 4 is a block diagram of a communication device in accordance with an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a backplane device according to an embodiment of the present invention. As shown in FIG.
  • the line card 303 is disposed on a side of the backboard device with the switchboard, and is perpendicular to the switchboard;
  • the switch board 301 is disposed orthogonally to the plurality of back boards;
  • the high speed signal connection is performed between the line card and the switch board through multiple back boards.
  • the line card and the switch board are placed vertically, and the high-speed signal channel is the shortest. Since the switch board does not need to bridge all the line cards as shown in FIG. 1, the board has a short trace, and the system high-speed channel can better meet the total insertion loss requirement;
  • the orthogonal backplane is set to take high-speed signals, and the board area is small, so the impact of using high-speed boards on cost is much reduced;
  • the high-speed backplane can greatly compress the depth dimension, and the depth of the device can better meet the depth requirement even if the rear fan is added;
  • the high-speed backplane is orthogonal to the switchboard, it can design a straight air duct with a rear exhaust, and the heat dissipation efficiency is high.
  • the high-speed signal connector area of the middle board can be hollowed out or ventilated in the middle panel, and the line card has a high-speed back.
  • the fan in the board area cooperates with the fan on the other side of the line card to dissipate heat, and the heat dissipation efficiency and heat dissipation capacity are greatly increased, which greatly improves the heat dissipation design bottleneck;
  • the line card is disposed, and the switch board is disposed on one side of the backboard device, perpendicular to the switch board; the switch board is disposed orthogonally with the plurality of back boards; and the plurality of back boards are disposed on the back board device Side, parallel with the line card; wherein, the line card and the switch board are connected by a plurality of backplanes for high-speed signal connection, and the design structure of the orthogonal multi-backplane is used to solve the high-speed channel insertion loss of the backplane frame system in the related art. High, high cost, difficult to meet deep demand, poor heat dissipation and system bandwidth capacity size constraints.
  • the line card may be vertically disposed on the upper side or the lower side of the switch board, or may be vertically disposed on the upper and lower sides at the same time. Because the line card can be designed in two rows, the capacity of the system is larger than the orthogonal system of Figure 1 under the same conditions, which can better meet the single-capacity capacity requirement. At the same time, this architecture form facilitates the light-emitting interface on the front of the switchboard, and is also more convenient to implement the cluster system.
  • the backplane 302 can be a set of high-speed signal electrical backplanes, or can be a group of optical waveguides and other optical signals, and there is a gap between the plurality of backplanes, which can be used as a ventilation and heat dissipation channel.
  • the number of the backplanes 302 corresponds to the number of rows of the line cards 303; the optional coplanar connector 306 of the connection line cards, the backplane and the line cards are coplanarly connected by the coplanar connectors
  • the connector connecting the switchboard is an orthogonal connector 305, and the backplane and the switchboard are orthogonally connected by orthogonal connectors.
  • the middle plate of the backboard device may be provided with a venting hole, or the high-speed connector region is hollowed out, as shown in FIG. 3, including: a middle plate 304, and the middle plate is disposed on the back plate device Between the two sides, it can be used for positioning of line cards, switch boards and back boards, and for low speed signals and power supply.
  • a communication device including the above-mentioned backplane device, is provided in the embodiment, and the communication device is used to implement the foregoing embodiments and preferred embodiments, and details are not described herein.
  • FIG. 4 is a schematic structural diagram of a communication device according to an embodiment of the present invention. As shown in FIG. 4, the device includes: a backplane device and a fan.
  • FIG. 4 shows a design example of a specific communication device, including: a switch board 401, a main control board 408, and upper and lower sides.
  • Design two rows of line card slots for setting the line card 403 to increase the system bandwidth capacity, the orthogonal back plate 402, and the fan 407 can be designed on the outside of the back plate to construct the airflow of the forward wind and the rear wind and increase the total Ventilation capacity 409; the high-speed connector area on the middle plate 404 can be hollowed out because there is no high-speed signal, and the direct orthogonal connector is used, and the front and rear ventilations are used to dissipate heat to the switching network. Since the orthogonal back plate 402 is placed vertically, the line card can also be cooled.
  • each side of the line card is designed with a fan, and the air passage efficiency is high, and the heat dissipation capability is strong; the high-speed signal back board can compress the depth of the device because of the small width, which can better satisfy the use.
  • the requirements for a standard cabinet eg, 800 mm deep; also include: an orthogonal connector 405, a coplanar connector 406.
  • An orthogonal multi-backplane hardware architecture (backplane device) provided by this embodiment and a communication device implemented based on the architecture.
  • the line card can be selected according to the requirements of a row of slots or one row under the switchboard.
  • the slot width needs to be kept as wide as possible to meet the panel opening requirements to meet the air inlet requirements;
  • the switch board height selection needs to be considered as a cluster system.
  • the panel needs to meet the light-emitting module, and at the same time, a certain spare area opening is required to meet the air intake requirement, but at the same time, the high-speed signal length of the backplane is required to satisfy the system channel constraint, and the switch board slot is required.
  • the interval should not be too large;
  • the connector can be equipped with an intermediate connector or an orthogonal connector without a middle plate. It mainly depends on the structural positioning requirements.
  • the advantage of the form with the middle plate is that the positioning is simple.
  • the disadvantage is that the signal needs to be increased by one level connection.
  • the requirements for structural design are higher;
  • the length selection of the high-speed orthogonal small backplane is determined by the spacing of the upper and lower row of card slots and the position of the high-speed signal socket. It is also necessary to consider retaining a certain width to meet the requirements of high-speed signal routing, and at the same time taking into account the depth of the insertion box;
  • the air duct design is preferred to the hollow plate high-speed signal connector area hollowing out; for large power consumption and interface-intensive line cards, the opening of the front panel may be a bottleneck of the intake air, and the free space of the upper and lower sides of the line card may be extended.
  • the internal air guide structure is added to increase the heat dissipation effect of the line card.
  • a line card is disposed, and the switch board is disposed on one side of the backboard device and perpendicular to the switchboard; the switchboard is disposed orthogonally to the plurality of backplanes; a plurality of backplanes disposed on the other side of the backplane device, disposed in parallel with the line card; wherein the line card and the switchboard pass through the plurality of backplanes High-speed signal connection, through the design of the orthogonal multi-backplane, solves the problems of high-speed channel insertion loss, high cost, difficulty in meeting depth requirements, poor heat dissipation, and system bandwidth capacity size constraints in the backplane architecture system of the related art.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明提供了一种背板装置、通信设备，其中，该背板装置包括：线卡，与交换板设置在背板装置的一侧，与所述交换板垂直；所述交换板，与多个背板正交设置；所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置；其中，所述线卡和所述交换板之间通过所述多个背板进行高速信号连接，通过本发明，解决了相关技术中背板构架***的高速通道***损耗高、成本高、难以满足深度需求、散热不好及***带宽容量规模约束等问题。

Description

背板装置、通信设备 技术领域
本发明涉及通信硬件架构领域，具体而言，涉及一种背板装置、通信设备。
背景技术
汇聚及核心节点的设备转发带宽需求越来越大，通信设备内部连接业务单板的高速总线速率越来越高(当前主流设备已经大于或等于25Gbps)，高速通道数量也越来越多。随着通道速率提高，单位长度***损耗越来越大，***高速通道长度越来越成为制约设备带宽容量的一个关键因素；单板功耗也因处理带宽增大、功能加强而越来越大，散热也已经成为***硬件总体设计的瓶颈。
为了解决总线速率提升引入的通道***损耗增大，会尽量控制背板高速通道长度，目前一个常用的方法是线卡和交换板采用正交架构，图1是本发明相关技术中线卡和交换板正交架构示意图，如图1，这种架构形式前后两层单板带来的问题是设备深度较深；正交架构因为交换板要跨接所有线卡，所以也会导致交换板内的走线增长；受交换板尺寸限制，线卡数量不能太多，设备容量受到约束。为了减小交换板内走线长度，平衡***高速通道总的长度，及增加线卡数量，也会选择使用线卡和交换网垂直的传统背板架构，图2是本发明相关技术中线卡和交换板垂直的传统背板架构示意图，如图2，为降低插损使用损耗系数更低的高频板材，同步带来成本增加很多；使用传统背板也因背板阻挡影响使用前后风道，散热受约束。
针对相关技术中存在的上述问题，业界都在积极寻求有效的解决方案。
发明内容
本发明实施例提供了一种背板装置、通信设备，以解决相关技术中背板构架***的高速通道***损耗高、成本高、难以满足深度需求、散热不好及***带宽容量规模约束等问题。
根据本发明的一个实施例，提供了一种背板装置，包括：线卡，与交换板设置在背板装置的一侧，与所述交换板垂直；所述交换板，与多个背板正交设置；所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置；其中，所述线卡和所述交换板之间通过所述多个背板进行高速信号连接。
进一步地，所述多个背板之间存在间隙，和/或，所述背板的数量与所述线卡槽位的列数对应。
进一步地，所述背板装置还包括：中板，设置在所述背板装置的两侧之间，设置为固定所述线卡、所述多个背板和所述交换板的位置，和/或，进行低速信号和/或电源信号的传输。
进一步地，所述中板的预设区域镂空，或，在所述中板上设置通风孔。
进一步地，所述背板和所述线卡之间通过共面连接器进行共面连接，和/或，所述背板和所述交换板之间通过正交连接器进行正交连接。
进一步地，所述线卡垂直设置在所述交换板的上侧和/或下侧。
进一步地，所述背板包括以下至少之一：高速信号电背板、光波导板。
根据本发明的另一实施例，提供了一种通信设备，包括：背板装置、风扇，其中，所述背板装置包括：线卡，与交换板设置在所述背板装置的一侧，与所述交换板垂直；所述交换板，与多个背板正交设置；所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置，所述多个背板之间还包括背板间隙，设置为通过所述背板间隙对所述背板装置进行通风散热；风扇，设置在所述背板间隙的外侧；其中，所述线卡和所述交换板之间通过所述多个背板进行高速信号连接。
进一步地，所述背板装置还包括：中板，设置在所述背板装置的两侧之间，设置为固定所述线卡、所述多个背板和所述交换板的位置，和/或，进行低速信号和/或电源信号的传输。
进一步地，所述中板的预设区域镂空或设置用于通风的通风孔，和/或，所述多个背板和所述交换板之间通过正交连接器连接，所述多个背板和所述线卡之间通过共面连接器连接。
通过本发明实施例，采用线卡，与交换板设置在背板装置的一侧，与所述交换板垂直；所述交换板，与多个背板正交设置；所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置；其中，所述线卡和所述交换板之间通过所述多个背板进行高速信号连接，通过正交多背板的设计构架，解决相关技术中背板构架***的高速通道***损耗高、成本高、难以满足深度需求、散热不好及***带宽容量规模约束等问题。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是本发明相关技术中线卡和交换板正交架构示意图；
图2是本发明相关技术中线卡和交换板垂直的传统背板架构示意图；
图3是根据本发明实施例的背板装置的架构示意图；
图4是根据本发明实施例的通信设备的架构示意图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用 于区别类似的对象，而不必用于描述特定的顺序或先后次序。
在本实施例中提供了一种背板装置，图3是根据本发明实施例的背板装置的架构示意图，如图3所示，包括：
线卡303，与交换板设置在背板装置的一侧，与交换板垂直；
交换板301，与多个背板正交设置；
多个背板302，设置在背板装置的另一侧，与线卡平行设置；
其中，线卡和交换板之间通过多个背板进行高速信号连接。
线卡和交换板垂直放置，高速信号通道最短，交换板因为不需像图1那样跨接所有线卡，所以板内走线较短，***高速通道可以较好满足总的***损耗要求；
正交背板设置为走高速信号，单板面积很小，所以使用高速板材对成本的影响降低很多；
多个正交背板设计可以相同，可以降低设计难度、缩短设计周期，还可以降低设计成本；
高速背板相比于相关技术中的交换板放到后面，可以极大压缩深度尺寸，设备深度即使加上后面的风扇，也可以较好满足深度需求；
高速背板因为和交换板正交，可以设计后面抽风的直通风道，散热效率较高，中板的高速信号连接器区域可以镂空或在中板上挖孔通风，线卡因为增加了高速背板区域的风扇，配合线卡另一边的风扇散热，散热效率和散热能力大增，极大改善了散热设计瓶颈；
通过上述步骤，采用线卡，与交换板设置在背板装置的一侧，与交换板垂直；交换板，与多个背板正交设置；多个背板，设置在背板装置的另一侧，与线卡平行设置；其中，线卡和交换板之间通过多个背板进行高速信号连接，通过正交多背板的设计构架，解决相关技术中背板构架***的高速通道***损耗高、成本高、难以满足深度需求、散热不好及***带宽容量规模约束等问题。
可选的，线卡垂直可以设置在交换板的上侧或下侧，也可以同时垂直设置在上下两侧。线卡因为可以设计两排，***的容量在相同条件下比图一的正交***大，可更好满足单机容量需求，同时这个架构形式方便交换板前面出光接口，也更便于实现集群***。
背板302可以是一组高速信号电背板，也可以为一组光波导板等走光信号，多个背板之间存在间隙，可以用作通风散热通道。如图3所示，背板302的数量和线卡303槽位的列数对应；连接线卡的可选共面连接器306，背板和线卡之间通过共面连接器进行共面连接，连接交换板的连接器为正交连接器305，背板和交换板之间通过正交连接器进行正交连接。
在根据本实施例的可选实施方式中，背板装置的中板可以设置有通风孔，或者高速连接器区域镂空，如图3所示，包括：中板304，中板设置在背板装置的两侧之间，可以作线卡、交换板及背板的定位及走低速信号和电源供电用。
在本实施例中还提供了一种通信设备，包括上述背板装置，该通信设备用于实现上述实施例及优选实施方式，已经进行过说明的不再赘述。
图4是根据本发明实施例的通信设备的架构示意图，如图4所示，包括：背板装置、风扇。
包括图3所示的背板装置，基于图3所示正交多背板架构的设备，图4所示为具体的通信设备的设计实例，包括：交换板401，主控板408，上下侧设计两排线卡槽位，用于设置线卡403，以增加***带宽容量，正交背板402，在背板外侧可以设计风扇407，构建前进风、后出风的风道并增加总的通风量409；中板404上高速连接器区域因为无高速信号可以镂空，使用直接正交连接器，前后通风给交换网散热，因正交背板402是竖着放置，还可以给线卡散热，形成很好的风道，每排线卡两边都设计有风扇，且风道效率较高，散热能力较强；高速信号背板因为宽度较小，可以压缩设备的深度，能较好满足用于标准机柜(如：800mm深)的需求；还包括：正交连接器405、共面连接器406。
通过本实施例提供的一种正交多背板硬件架构(背板装置)及基于此架构实现的通信设备。
线卡根据需求可选则一排插槽或在交换板上下各一排，槽位宽度需要保留尽可能宽些，以满足面板开孔可以满足风道进风要求；
交换板高度选择需要考虑满足作为集群***时，面板需要满足出光模块，同时留有一定空余面积开孔满足进风需求，但同时也需要兼顾背板高速信号长度满足***通道约束，交换板槽位间隔也不能太大；
连接器可选带中板或不带中板的正交连接器，主要取决于结构定位需求设计，带中板的形式好处是定位简单，缺点是信号需要增加一级连接，如果不带中板则对结构设计要求更高；
高速正交小背板的长度选择由上下两排线卡槽位间距及高速信号插座位置决定，也需要考虑保留一定宽度满足高速信号走线需求，同时兼顾插箱深度；
风道设计优选中板高速信号连接器区域镂空形式；对于大功耗、接口密集的线卡，可能前面板的开孔会是进风的一个瓶颈，可以延伸线卡上下两侧空余空间开孔，内部增加导风结构增加线卡散热效果。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
工业实用性
通过本发明实施例提供的上述技术方案，采用线卡，与交换板设置在背板装置的一侧，与所述交换板垂直；所述交换板，与多个背板正交设置；所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置；其中，所述线卡和所述交换板之间通过所述多个背板进 行高速信号连接，通过正交多背板的设计构架，解决相关技术中背板构架***的高速通道***损耗高、成本高、难以满足深度需求、散热不好及***带宽容量规模约束等问题。

Claims (10)

  1. 一种背板装置，包括：
    线卡，与交换板设置在背板装置的一侧，与所述交换板垂直；
    所述交换板，与多个背板正交设置；
    所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置；
    其中，所述线卡和所述交换板之间通过所述多个背板进行高速信号连接。
  2. 根据权利要求1所述的背板装置，其中，所述多个背板之间存在间隙，和/或，所述背板的数量与所述线卡槽位的列数对应。
  3. 根据权利要求1所述的背板装置，其中，所述背板装置还包括：
    中板，设置在所述背板装置的两侧之间，设置为固定所述线卡、所述多个背板和所述交换板的位置，和/或，进行低速信号和/或电源信号的传输。
  4. 根据权利要求3所述的背板装置，其中，所述中板的预设区域镂空，或，在所述中板上设置通风孔。
  5. 根据权利要求1所述的背板装置，其中，所述背板和所述线卡之间通过共面连接器进行共面连接，和/或，所述背板和所述交换板之间通过正交连接器进行正交连接。
  6. 根据权利要求1所述的背板装置，其中，所述线卡垂直设置在所述交换板的上侧和/或下侧。
  7. 根据权利要求1至6任一项所述的背板装置，其中，所述背板包括以下至少之一：高速信号电背板、光波导板。
  8. 一种通信设备，包括：背板装置、风扇，其中，所述背板装置包括：
    线卡，与交换板设置在所述背板装置的一侧，与所述交换板垂直；
    所述交换板，与多个背板正交设置；
    所述多个背板，设置在所述背板装置的另一侧，与所述线卡平行设置，所述多个背板之间还包括背板间隙，设置为通过所述背板间隙对所述背板装置进行通风散热；
    风扇，设置在所述背板间隙的外侧；
    其中，所述线卡和所述交换板之间通过所述多个背板进行高速信号连接。
  9. 根据权利要求8所述的通信设备，其中，所述背板装置还包括：
    中板，设置在所述背板装置的两侧之间，设置为固定所述线卡、所述多个背板和所述交换板的位置，和/或，进行低速信号和/或电源信号的传输。
  10. 根据权利要求9所述的通信设备，其中，所述中板的预设区域镂空或设置设置为通风的通风孔，和/或，所述多个背板和所述交换板之间通过正交连接器连接，所述多个背板和所述线卡之间通过共面连接器连接。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112543571A (zh) * 2019-09-20 2021-03-23 中兴通讯股份有限公司 背板组件及插箱
CN116133313A (zh) * 2021-11-12 2023-05-16 华为技术有限公司 通信设备和业务信号调度的方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107566919A (zh) * 2017-09-18 2018-01-09 北京百卓网络技术有限公司 一种通信设备
CN109757052B (zh) * 2017-11-06 2021-11-02 中兴通讯股份有限公司 一种通信设备数据信号传输装置及通信设备
CN109996414A (zh) 2017-12-29 2019-07-09 中兴通讯股份有限公司 一种线缆背板、线缆盒和线缆组件
CN108270097A (zh) * 2017-12-29 2018-07-10 曙光信息产业(北京)有限公司 一种正交高速背板
CN108966593B (zh) * 2018-07-11 2020-02-21 新华三技术有限公司 机箱及通信设备
CN110831393B (zh) * 2018-08-13 2022-08-05 中兴通讯股份有限公司 一种通讯设备
CN111836121B (zh) * 2019-04-18 2023-03-24 中兴通讯股份有限公司 一种板卡连接架构及具有该架构的通信设备
CN210868472U (zh) * 2019-07-17 2020-06-26 华为机器有限公司 框式设备
CN111781992B (zh) * 2020-06-19 2022-03-08 苏州浪潮智能科技有限公司 一种服务器内多板卡的布局方法及服务器多板卡装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7009939B2 (en) * 2001-05-21 2006-03-07 Lucent Technologies Inc. Adaptive resource management in a communication system
CN101778044A (zh) * 2010-01-20 2010-07-14 中国人民解放军国防科学技术大学 一种吞吐率可调整交换网络体系结构
CN101984599A (zh) * 2010-11-01 2011-03-09 华为技术有限公司 背板及通讯设备、通讯***

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7009939B2 (en) * 2001-05-21 2006-03-07 Lucent Technologies Inc. Adaptive resource management in a communication system
CN101778044A (zh) * 2010-01-20 2010-07-14 中国人民解放军国防科学技术大学 一种吞吐率可调整交换网络体系结构
CN101984599A (zh) * 2010-11-01 2011-03-09 华为技术有限公司 背板及通讯设备、通讯***

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112543571A (zh) * 2019-09-20 2021-03-23 中兴通讯股份有限公司 背板组件及插箱
CN112543571B (zh) * 2019-09-20 2023-04-28 中兴通讯股份有限公司 背板组件及插箱
CN116133313A (zh) * 2021-11-12 2023-05-16 华为技术有限公司 通信设备和业务信号调度的方法

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