WO2017135294A1 - 多結晶誘電体薄膜および容量素子 - Google Patents

多結晶誘電体薄膜および容量素子 Download PDF

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WO2017135294A1
WO2017135294A1 PCT/JP2017/003577 JP2017003577W WO2017135294A1 WO 2017135294 A1 WO2017135294 A1 WO 2017135294A1 JP 2017003577 W JP2017003577 W JP 2017003577W WO 2017135294 A1 WO2017135294 A1 WO 2017135294A1
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Prior art keywords
thin film
dielectric thin
polycrystalline dielectric
polycrystalline
film
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PCT/JP2017/003577
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English (en)
French (fr)
Inventor
久美子 山▲崎▼
千原　宏
佑起 永峰
純一 山▲崎▼
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Tdk株式会社
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Priority to US16/068,762 priority Critical patent/US10611693B2/en
Priority to CN201780006873.5A priority patent/CN108475580B/zh
Priority to EP17747450.9A priority patent/EP3392889A4/en
Priority to JP2017565580A priority patent/JP6866852B2/ja
Priority to KR1020187019705A priority patent/KR20180094020A/ko
Publication of WO2017135294A1 publication Critical patent/WO2017135294A1/ja

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Definitions

  • the present invention relates to a polycrystalline dielectric thin film and a capacitive element.
  • a thin film using a metal oxide material has been widely used as the dielectric thin film.
  • the improvement of the characteristics of the dielectric thin film by the metal oxide material is reaching its limit, and a new material having higher characteristics is demanded.
  • One candidate for a new material is a metal oxynitride material in which a part of oxygen atoms in an oxygen octahedron having a perovskite crystal structure is replaced with a nitrogen atom.
  • Patent Document 1 and Patent Document 2 describe a method for producing a powder of perovskite oxynitride ABO 2 N.
  • Patent Document 1 and Patent Document 2 do not disclose anything about obtaining a thin film using perovskite oxynitride ABO 2 N.
  • Non-Patent Document 1 and Non-Patent Document 2 describe that a thin film made of perovskite oxynitride ABO 2 N was produced.
  • the thin film obtained in Non-Patent Document 1 and Non-Patent Document 2 is an epitaxial film.
  • An epitaxial film is a thin film produced by epitaxial growth.
  • Epitaxial growth is one of thin-film crystal growth techniques, and refers to crystal growth in which crystal growth is performed on a crystal serving as a substrate and aligned with the crystal plane of the underlying substrate.
  • Non-Patent Document 1 describes that it takes a long time of 530 hours or less to produce an epitaxial film having a thickness of 20 nm or less.
  • the present invention has been made in view of such a situation, and an object thereof is to provide a polycrystalline dielectric thin film and a capacitive element with high manufacturing efficiency and low dielectric loss.
  • the polycrystalline dielectric thin film according to the present invention is a polycrystalline dielectric thin film whose main composition is a perovskite oxynitride,
  • the polycrystalline dielectric thin film according to the present invention has the above characteristics, so that the dielectric loss can be reduced.
  • the A is one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, and Na.
  • the B is preferably one or more elements selected from Ta, Nb, Ti and W.
  • the polycrystalline dielectric thin film according to the present invention has an octahedral structure of BO 4 N 2 , and the arrangement of N in the octahedral structure is preferably cis type.
  • the capacitive element according to the present invention includes the polycrystalline dielectric thin film.
  • FIG. 1 shows a schematic diagram of a thin film capacitor according to this embodiment.
  • a thin film capacitor 1 shown in FIG. 1 is formed on a substrate 11 in the order of a lower electrode 12 and a polycrystalline dielectric thin film 13, and includes an upper electrode 14 on the surface of the polycrystalline dielectric thin film 13.
  • the material of the substrate 11 is not particularly limited, but using a Si single crystal substrate as the substrate 11 is excellent in availability and cost. When flexibility is important, Ni foil can be used as a substrate.
  • the material of the lower electrode 12 and the upper electrode 14 is not particularly limited, and may function as an electrode.
  • Pt, Ag, Ni, etc. are mentioned.
  • the thickness of the lower electrode 12 is preferably 0.01 to 10 ⁇ m.
  • the thickness of the upper electrode 14 is preferably 0.01 to 10 ⁇ m.
  • the polycrystalline dielectric thin film 13 is a polycrystalline dielectric thin film whose main composition is a perovskite oxynitride.
  • A may be any A site ion of the perovskite oxynitride.
  • B may be a B site ion of the perovskite oxynitride.
  • A is preferably one or more elements selected from Sr, Ba, Ca, La, Ce, Pr, Nd, and Na. It is more preferable to use one or more elements selected from Sr, Ba, La, and Nd because a high capacity can be obtained, and it is most preferable to use Sr.
  • B is preferably one or more elements selected from Ta, Nb, Ti, and W. It is more preferable to use one or more elements selected from Ta and Ti because a polycrystalline dielectric thin film 13 with few different phases can be obtained, and Ta is most preferable.
  • a / b is more preferably a / b ⁇ 1.05.
  • n is more preferably n ⁇ 0.8.
  • the total of the average valence of A site ions and the average valence of B site ions is 6.7 to 7.3.
  • the total average valence is preferably 7 valences.
  • the average valence is a value obtained by averaging the valences of ions existing at the A site and the B site according to their abundance ratios.
  • Sr and La are present at a ratio of 4: 1 at the A site and Ta and Ti are present at a ratio of 4: 1 at the B site.
  • the valence of Sr ions is 2, and the valence of La ions is 3. Therefore, when the average valence is ⁇ , ⁇ is calculated by the following equation (1).
  • the total average valence ( ⁇ + ⁇ ) is 7.
  • the perovskite oxynitride is Sr a Ta b O o N n
  • the case where the A site element and / or the B site element are different elements is also applicable.
  • the polycrystalline dielectric thin film 13 preferably has an octahedral structure of BO 4 N 2 and the arrangement of N in the octahedral structure is mainly cis type.
  • the structure in which N has a cis arrangement is a structure in which two Ns are adjacent to each other as shown in FIG. 2A.
  • the structure in which N takes the trans arrangement is a structure in which two Ns are not adjacent to each other as shown in FIG. 2B.
  • FIGS. 3A and 3B are diagrams showing a case where a plurality of octahedral structures are connected in a case where N takes a cis arrangement and a case where N takes a trans arrangement. From FIG. 3A, it can be seen that when N takes a cis configuration, the crystal extends zigzag as seen from the c-axis direction. On the other hand, FIG. 3B shows that when N takes the trans arrangement, the crystal extends in a straight line in the c-axis direction. In addition, the c-axis length is longer when N takes a trans arrangement than when N takes a cis arrangement.
  • N is mainly in the cis configuration. Even if neutron diffraction is not performed, if ABO 2 N is a polycrystal, it is known that N takes a stable cis configuration.
  • ABO 2 N having a trans arrangement as described in Non-Patent Document 1, a substrate stress is applied to the single crystal of ABO 2 N by, for example, epitaxial growth on the substrate. It is necessary to prepare a state.
  • the trans configuration is usually not completely zero.
  • the cis arrangement Even if the cis arrangement is stable, the arrangement of some Ns may be disturbed due to thermal motion or the like, and may take a trans arrangement. Even in such a case, since the cis arrangement is dominant as an overall number, in the neutron diffraction, the result of the cis arrangement is obtained from the site existence probability.
  • the polycrystalline dielectric thin film according to the present embodiment is a different type of thin film from the epitaxial film.
  • N takes a trans configuration.
  • XRD data of an epitaxial film in which the perovskite oxynitride is SrTaO 2 N is created, and the polycrystalline film according to the present embodiment is formed. What is necessary is just to confirm that there is no common peak compared with the XRD data of a dielectric thin film.
  • FIG. 4 shows XRD data of an epitaxial film in which the perovskite oxynitride is CaTaO 2 N. Similar to FIG. 4, XRD data of the epitaxial film of SrTaO 2 N may be prepared. The fact that the thin film is a polycrystalline film can be confirmed by the fact that there is a peak in XRD data and the crystal plane derived from the peak is not only a specific crystal plane.
  • the polycrystalline dielectric thin film 13 is a kind of polycrystalline film and a kind of dielectric thin film.
  • the thickness of the polycrystalline dielectric thin film 13 is not particularly limited, but is preferably 10 nm to 1 ⁇ m.
  • the method of forming the thin film that will eventually become the polycrystalline dielectric thin film 13 For example, vacuum deposition, sputtering, PLD (pulse laser deposition), MO-CVD (metal organic chemical vapor deposition), MOD (organic metal decomposition), sol-gel method, CSD (chemical solution deposition) And the like.
  • the raw materials used during film formation may contain minute impurities and subcomponents, but there is no particular problem as long as the amount does not significantly impair the performance of the thin film.
  • the polycrystalline dielectric thin film 13 according to the present embodiment may also contain minute impurities and subcomponents to such an extent that the performance is not significantly impaired.
  • the finally obtained thin film tends to be a polycrystalline film.
  • the polycrystalline dielectric thin film 13 according to the present embodiment is formed by a method such as a PLD method, a sputtering method, or a CSD method
  • N tends to have a cis arrangement.
  • synthesis is also possible by the CVD method, since the number of component elements is large, the PLD method and the sputtering method have higher composition controllability.
  • a film forming method by the PLD method will be described.
  • a Si single crystal substrate is prepared as the substrate 11.
  • SiO 2 , TiO x , and Pt are sequentially formed on the Si single crystal substrate to form the lower electrode 12 made of Pt.
  • the method for forming the lower electrode 12 is not particularly limited. For example, sputtering method, CVD, etc. are mentioned.
  • a metal oxide thin film was formed on the lower electrode 12 by the PLD method. Further, in order to expose a part of the lower electrode 12, a metal mask was used to form a region where no thin film was formed.
  • a target including a constituent element of a target polycrystalline dielectric thin film is placed in a film forming chamber.
  • a pulse laser is irradiated on the surface of the target.
  • the target energy is instantly evaporated by the strong energy of the pulse laser.
  • an evaporant is deposited on the substrate arranged to face the target to form a metal oxide thin film.
  • the type of target is not particularly limited, and in addition to a metal oxide sintered body containing constituent elements of a polycrystalline dielectric thin film to be produced, an alloy, a nitride sintered body, a metal oxynitride sintered body, or the like can be used. it can. Further, although it is preferable that each element is distributed on the average in the target, the distribution may vary within a range that does not affect the quality of the obtained polycrystalline dielectric thin film. Furthermore, the number of targets is not necessarily one, and a plurality of targets including a part of the constituent elements of the polycrystalline dielectric thin film can be prepared and used for film formation.
  • the shape of the target is not limited and may be a shape suitable for the film forming apparatus to be used.
  • the film forming conditions oxygen gas pressure, nitrogen gas pressure, film forming chamber size, gas introduction tube position, etc.
  • the a / b of the polycrystalline dielectric thin film finally obtained is adjusted. Can be controlled. For example, if a / b of the target is increased, a / b in the formed film can be increased. Further, not only the target a / b but also the film forming conditions are important. This is because the metal element evaporated from the target by the pulse laser is affected by the elements constituting the atmosphere in the film formation chamber and reaches the film formation surface of the substrate.
  • the composition of the finally obtained polycrystalline dielectric thin film is Sr a Ta b O o N n
  • a sintered body containing Sr 2 Ta 2 O 7 is prepared as a target. Then, by adjusting the film forming conditions (for example, the gas pressure of oxygen, the gas pressure of nitrogen, the size of the film forming chamber, the position of the gas introduction pipe, etc.), the a / b can be controlled.
  • the substrate 11 it is preferable to heat the substrate 11 with an infrared laser during film formation in order to crystallize the metal oxide thin film to be formed.
  • the heating temperature of the substrate 11 varies depending on the constituent elements and composition of the metal oxide thin film and the substrate 11, for example, the film is formed by heating to 600 to 800 ° C.
  • the temperature of the substrate 11 By setting the temperature of the substrate 11 to an appropriate temperature, the metal oxynitride thin film can be easily crystallized and the occurrence of cracks that occur during cooling can be prevented.
  • the polycrystalline dielectric thin film 13 made of perovskite oxynitride can be obtained by introducing nitrogen radicals and performing nitriding during film formation.
  • the thin film capacitor 1 can be manufactured by forming the upper electrode 14 on the polycrystalline dielectric thin film 13.
  • the material of the upper electrode 14, Ag, Au, Cu etc. can be used.
  • FIG. For example, it can be formed by a sputtering method.
  • the capacitive element according to the present invention is an element using dielectricity, and includes a capacitor, thermistor, filter, diplexer, resonator, oscillator, antenna, piezoelectric element, transistor, ferroelectric memory, and the like.
  • the polycrystalline dielectric thin film according to this embodiment is suitably used for a capacitor element that is particularly required to have a small dielectric loss.
  • the SrCO 3 powder and Ta 2 O 5 powder were mixed for 16 hours by a wet ball mill using an ethanol solvent to obtain a mixed slurry.
  • the mixed slurry was dried at 80 ° C. for 12 hours with a constant temperature dryer to obtain a mixture.
  • the mixture was lightly crushed in a mortar and placed in a ceramic crucible. And it heat-processed for 2 hours at 1000 degreeC in air
  • the calcined product was mixed again in a wet ball mill using an ethanol solvent for 16 hours to obtain a slurry after calcining.
  • the obtained calcined slurry was dried at 80 ° C. for 12 hours with a constant temperature dryer to obtain a calcined mixture.
  • a polyvinyl alcohol solution was added as a binder to the post-calcined mixture and mixed to obtain a granulated product.
  • the addition amount of the polyvinyl alcohol solution was 0.6% by weight with respect to 100% by weight of the pulverized product.
  • the granulated product was molded into a cylindrical shape having a diameter of about 23 mm and a height of about 9 mm to obtain a molded product.
  • the molding method was CIP molding.
  • the sintered product was fired at 1400 ° C. for 2 hours in an air atmosphere using an electric furnace to obtain a sintered product. Further, the upper and lower surfaces of the sintered product were mirror-polished to obtain a film formation target having a height of 5 mm. It was confirmed that the relative density of the obtained deposition target was 96 to 98%.
  • the film formation target obtained as described above was placed in a film formation apparatus, and a Si substrate was placed so as to face the film formation target.
  • a Si substrate a substrate having a Pt film as a lower electrode on the surface was used.
  • a film was formed by a PLD method so as to have a thickness of 200 nm.
  • the a / b of the finally obtained polycrystalline dielectric thin film was controlled by adjusting the film forming conditions (oxygen gas pressure, nitrogen gas pressure, etc.).
  • a polycrystalline dielectric thin film was obtained by introducing nitrogen radicals and performing nitriding during film formation. The time required for film formation was 0.5 to 2 hours.
  • the XRD pattern of the thin film sample obtained in Experimental Example 1 was measured using a fully automatic horizontal multipurpose X-ray diffractometer SmartLab manufactured by Rigaku Corporation. It was confirmed that all examples of Experimental Example 1 were not epitaxial films. Further, o and n in the obtained thin film sample were quantified by an impulse heating melt extraction method (infrared absorption method) using TC600 manufactured by LECO. Further, the valences of Sr ions and Ta ions were determined from XPS chemical shifts, and it was confirmed that there was no change in valence from the raw materials. Specifically, the valence of Sr ions was 2, and the valence of Ta ions was 5. Moreover, the value of a / b and the value of n were computed from the value quantified by the impulse heating melt extraction method.
  • Dielectric loss was measured with an impedance analyzer (manufactured by Agilent Technologies) 4294A at a measurement voltage of 100 mV and a measurement frequency of 1 MHz.
  • an impedance analyzer manufactured by Agilent Technologies 4294A at a measurement voltage of 100 mV and a measurement frequency of 1 MHz.
  • the case where tan ⁇ was 10% or less was considered good.
  • the results are shown in Table 1.
  • Example 1 the dielectric loss of Example 1 in which a / b is greater than 1 was 1% or less. On the other hand, in Comparative Examples 1 and 2 in which a / b is 1 or less, the dielectric loss exceeded 1%.
  • Example 11 and Comparative Example 11 Thin film samples of Example 11 and Comparative Example 11 were prepared in the same manner as in Experimental Example 1 except that La 2 O 3 powder and TiO 2 powder were used instead of SrCO 3 powder and Ta 2 O 5 powder, and various measurements were performed. Went. Furthermore, the thin film samples of Example 12 and Comparative Example 12 were produced in the same manner as in Experimental Example 1 except that BaO powder and Ta 2 O 5 were used, and various measurements were performed. Further, thin film samples of Example 13 and Comparative Example 13 were prepared in the same manner as in Experimental Example 1 except that Nd 2 O 3 powder and TiO 2 powder were used, and various measurements were performed. The results are shown in Table 2. In addition, the XRD measurement was performed about the thin film sample of the Example obtained in Experimental Example 2.
  • Example 11 and Comparative Example 11 the valences of La ions and Ti ions were determined from the XPS chemical shift, and it was confirmed that there was no change in valence from the raw materials. Specifically, the valence of La ions was 3, and the valence of Ti ions was 4.
  • Example 12 and Comparative Example 12 the valences of Ba ions and Ta ions were determined from XPS chemical shifts, and it was confirmed that there was no change in valence from the raw materials.
  • the valence of Ba ions was 2, and the valence of Ta ions was 5. Furthermore, regarding Example 13 and Comparative Example 13, the valences of Nd ions and Ti ions were determined from XPS chemical shifts, and it was confirmed that there was no change in valence from the raw materials. Specifically, the valence of Nd ions was 3, and the valence of Ti ions was 4.
  • Example 11 the dielectric loss of Example 11 in which a / b was greater than 1 was 1% or less. On the other hand, in Comparative Example 11 in which a / b was 1 or less, the dielectric loss exceeded 1%.
  • Example 21 was obtained by changing the value of n.
  • the results are shown in Table 3.
  • n ⁇ 0.7 the structure in which the Ta—N chain is connected in a zigzag pattern is not sufficiently formed, and it is estimated that tan ⁇ deteriorates.

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Abstract

【課題】　誘電損失ｔａｎδの小さい多結晶誘電体薄膜および容量素子を提供する。 【解決手段】　主組成がペロブスカイト型酸窒化物である多結晶誘電体薄膜である。ペロブスカイト型酸窒化物が組成式ＡａＢｂＯｏＮｎ（ａ＋ｂ＋ｏ＋ｎ＝５）で表され、ａ／ｂ＞１およびｎ≧０．７である。

Description

多結晶誘電体薄膜および容量素子
　本発明は、多結晶誘電体薄膜および容量素子に関する。
　近年、デジタル機器の小型化、高性能化に伴い、高性能な誘電体薄膜を用いた容量素子が求められている。
　従来、誘電体薄膜としては金属酸化物材料を用いた薄膜が広く用いられてきた。しかしながら、金属酸化物材料による誘電体薄膜の特性向上は限界を迎えつつあり、より高い特性を持つ新しい材料が求められている。新しい材料の候補の一つにペロブスカイト結晶構造の酸素８面体中の酸素原子の一部を窒素原子に置換した金属酸窒化物材料が挙げられる。しかし、金属酸窒化物材料を有する誘電体薄膜を得ることは困難である。
　例えば、特許文献１および特許文献２には、ペロブスカイト型酸窒化物ＡＢＯ２Ｎの粉末を作製する方法が記載されている。しかし、特許文献１および特許文献２には、ペロブスカイト型酸窒化物ＡＢＯ２Ｎを用いた薄膜を得ることに関しては何ら開示されていない。
　また、非特許文献１および非特許文献２にはペロブスカイト型酸窒化物ＡＢＯ２Ｎからなる薄膜を作製した旨が記載されている。しかし、非特許文献１および非特許文献２で得られる薄膜はエピタキシャル膜である。
　エピタキシャル膜はエピタキシャル成長により製造される薄膜のことである。エピタキシャル成長とは、薄膜結晶成長技術のひとつであり、基板となる結晶の上に結晶成長を行い、下地の基板の結晶面にそろえて配列する結晶成長を指す。
　エピタキシャル膜はその製造に非常に時間がかかるという欠点がある。非特許文献１では厚さ２０ｎｍ以下のエピタキシャル膜の製造に５３０時間以下という長い時間がかかる旨が記載されている。
特開昭６１－１２２１０８号公報 特開２０１３－００１６２５号公報
Scientific Reports 4. DOI: 10.1038/srep04987 KAST 平成25年度研究概要 32-33ページ
　本発明は、このような実状に鑑みてなされ、製造効率が高く誘電損失の小さい多結晶誘電体薄膜および容量素子を提供することを目的とする。
　本発明に係る多結晶誘電体薄膜は、主組成がペロブスカイト型酸窒化物である多結晶誘電体薄膜であって、
　前記ペロブスカイト型酸窒化物が組成式ＡａＢｂＯｏＮｎ（ａ＋ｂ＋ｏ＋ｎ＝５）で表され、
　ａ／ｂ＞１
　ｎ≧０．７
　であることを特徴とする。
　本発明に係る多結晶誘電体薄膜は、上記の特徴を有することで、誘電損失を小さくすることができる。
　本発明に係る多結晶誘電体薄膜は、前記ＡがＳｒ，Ｂａ，Ｃａ，Ｌａ，Ｃｅ，Ｐｒ，Ｎｄ，Ｎａから選ばれる１種類以上の元素であり、
　前記ＢがＴａ，Ｎｂ，Ｔｉ，Ｗから選ばれる１種類以上の元素であることが好ましい。
　本発明に係る多結晶誘電体薄膜は、ＢＯ４Ｎ２の８面体構造を有し、前記８面体構造中におけるＮの配置はｃｉｓ型が主であることが好ましい。
　本発明に係る容量素子は、前記多結晶誘電体薄膜を有する。
本発明の一実施形態に係る薄膜キャパシタの概略図である。 Ｎの配置がｃｉｓ型である場合を示す模式図である。 Ｎの配置がｔｒａｎｓ型である場合を示す模式図である。 Ｎの配置がｃｉｓ型である場合を示す模式図である。 Ｎの配置がｔｒａｎｓ型である場合を示す模式図である。 ＣａＴａＯ２Ｎからなるエピタキシャル膜のＸＲＤパターンの概略図である。
　以下、本発明を実施形態に基づき説明する。
　本実施形態に係る薄膜キャパシタの模式図を図１に示す。図１に示す薄膜キャパシタ１は、基板１１上に下部電極１２、多結晶誘電体薄膜１３の順に形成され、多結晶誘電体薄膜１３の表面に上部電極１４を備える。
　基板１１の材質には特に制限はないが、基板１１としてＳｉ単結晶基板を用いることが入手容易性およびコスト性に優れている。フレキシビリティを重視する場合にはＮｉ箔を基板として使用することも出来る。
　下部電極１２および上部電極１４の材質に特に制限はなく、電極として機能すればよい。例えば、Ｐｔ，Ａｇ，Ｎｉ等が挙げられる。下部電極１２の厚みは０．０１～１０μｍが好ましい。上部電極１４の厚みは０．０１～１０μｍが好ましい。
　多結晶誘電体薄膜１３は、主組成がペロブスカイト型酸窒化物である多結晶誘電体薄膜である。
　前記ペロブスカイト型酸窒化物は組成式ＡａＢｂＯｏＮｎ（ａ＋ｂ＋ｏ＋ｎ＝５）で表すことができる。Ａは前記ペロブスカイト型酸窒化物のＡサイトイオンであればよい。Ｂは前記ペロブスカイト型酸窒化物のＢサイトイオンであればよい。
　ＡはＳｒ，Ｂａ，Ｃａ，Ｌａ，Ｃｅ，Ｐｒ，Ｎｄ，Ｎａから選ばれる１種類以上の元素であることが好ましい。Ｓｒ，Ｂａ，Ｌａ，Ｎｄから選ばれる１種類以上の元素を用いることが、高い容量が得られるため、さらに好ましく、Ｓｒを用いることが最も好ましい。ＢはＴａ，Ｎｂ，Ｔｉ，Ｗから選ばれる１種類以上の元素であることが好ましい。Ｔａ，Ｔｉから選ばれる１種類以上の元素を用いることが、異相が少ない多結晶誘電体薄膜１３が得られるため、さらに好ましく、Ｔａを用いることが最も好ましい。
　さらに、ａ／ｂ＞１，ｎ≧０．７およびであることが好ましい。また、ａ／ｂは、さらに好ましくはａ／ｂ≧１．０５である。ｎは、さらに好ましくはｎ≧０．８である。ａ／ｂおよびｎを上記の範囲とすることで、ｔａｎδを良好にすることができる。
　また、前記ペロブスカイト型酸窒化物は、Ａサイトイオンの平均価数およびＢサイトイオンの平均価数の合計が６．７～７．３価である。好ましくは平均価数の合計が７価である。
　ここで、平均価数とは、ＡサイトおよびＢサイトに存在するイオンの価数を、その存在比に応じて平均化した値とする。例えば、ＡサイトにＳｒとＬａが４：１の比で存在し、ＢサイトにＴａとＴｉが４：１の比で存在する場合について述べる。Ｓｒイオンの価数は２であり、Ｌａイオンの価数は３である。よって、その平均価数をαとした場合に、αは以下の式（１）により算出される。また、Ｔａイオンの価数は５であり、Ｔｉイオンの価数は４である。よって、その平均価数をβとした場合に、βは以下の式（２）により算出される。そして、α＝２．２、β＝４．８となる。そして、平均価数の合計（α＋β）は７となる。
　α＝（Ｓｒイオンの価数）×（Ｓｒイオンの存在比）＋（Ｌａイオンの価数）×（Ｌａイオンの存在比）
　＝２×４／５＋３×１／５
　＝２．２　・・・式（１）
　β＝（Ｔａイオンの価数）×（Ｔａイオンの存在比）＋（Ｔｉイオンの価数）×（Ｔｉイオンの存在比）
　＝５×４／５＋４×１／５
　＝４．８　・・・式（２）
　なお、本願の平均価数の合計の計算においては、ＡサイトリッチまたはＢサイトリッチである場合、すなわち、ａ／ｂ≠１である場合でも、ａ／ｂ＝１として取り扱う。例えば、上記の場合において、ａ／ｂ＝１．２の場合であっても、平均価数の合計は２．２＋４．８＝７である。
　以下、例としてペロブスカイト型酸窒化物がＳｒａＴａｂＯｏＮｎである場合について説明するが、Ａサイト元素および／またはＢサイト元素が異なる元素である場合についてもあてはまる。
　多結晶誘電体薄膜１３においては、ＢＯ４Ｎ２の８面体構造を有し、前記８面体構造中におけるＮの配置はｃｉｓ型が主であることが好ましい。
　ここで、Ｎがｃｉｓ配置をとる構造とは、図２Ａに示すように二つのＮが互いに隣り合う位置にある構造である。これに対し、Ｎがｔｒａｎｓ配置をとる構造とは、図２Ｂに示すように二つのＮが隣り合っていない位置にある構造である。
　Ｎがｃｉｓ配置をとる場合およびＮがｔｒａｎｓ配置をとる場合のそれぞれについて、複数の８面体構造が連なる場合を示した図が図３Ａおよび図３Ｂである。図３Ａより、Ｎがｃｉｓ配置をとる場合には、結晶はｃ軸方向からみてジグザグに伸びていることがわかる。これに対し、図３Ｂより、Ｎがｔｒａｎｓ配置をとる場合には、結晶はｃ軸方向に一直線に伸びていることがわかる。また、Ｎがｃｉｓ配置をとる場合より、Ｎがｔｒａｎｓ配置をとる場合の方が、ｃ軸長が長くなる。
　本実施形態に係る多結晶誘電体薄膜において、Ｎがｃｉｓ配置をとる場合が主であることは中性子回折により確認できる。中性子回折を行わなくとも、ＡＢＯ２Ｎが多結晶体であればＮは安定なｃｉｓ配置をとることが知られている。一方、ｔｒａｎｓ配置のＡＢＯ２Ｎを得たい場合は、非特許文献１にあるように基板にエピタキシャル成長させるなどしてＡＢＯ２Ｎの単結晶に基板応力を加え、ｔｒａｎｓ配置の方が安定な特殊な状態を用意する必要がある。ただし、ｃｉｓ配置が主である多結晶体において、通常、ｔｒａｎｓ配置が完全に０になるわけではない。ｃｉｓ配置が安定であっても、熱運動等により一部のＮは配列が乱れ、ｔｒａｎｓ配置をとる場合がある。そのような場合も、全体的な数としてはｃｉｓ配置が優位であるため、中性子回折ではサイトの存在確率からｃｉｓ配置である結果が得られる。
　ところで、本実施形態に係る多結晶誘電体薄膜はエピタキシャル膜とは異なる種類の薄膜である。ここで、ペロブスカイト型酸窒化物がＳｒａＴａｂＯｏＮｎであるエピタキシャル膜を特定の基板で作製した場合には、Ｎがｔｒａｎｓ配置をとる。
　本実施形態に係る多結晶誘電体薄膜がエピタキシャル膜ではないことを確認するためには、ペロブスカイト型酸窒化物がＳｒＴａＯ２Ｎであるエピタキシャル膜のＸＲＤデータを作成し、本実施形態に係る多結晶誘電体薄膜のＸＲＤデータと比較して共通するピークがないことを確認すればよい。なお、図４はペロブスカイト型酸窒化物がＣａＴａＯ２Ｎであるエピタキシャル膜のＸＲＤデータである。図４と同様にしてＳｒＴａＯ２Ｎのエピタキシャル膜のＸＲＤデータを用意すればよい。また、薄膜が多結晶膜であることはＸＲＤデータにピークがあり、そのピークに由来する結晶面が特定の結晶面のみではないことにより確認できる。
　多結晶誘電体薄膜１３は、多結晶膜の一種であり、誘電体薄膜の一種でもある。多結晶誘電体薄膜１３の厚さには特に制限はないが、好ましくは１０ｎｍ～１μｍである。
　薄膜キャパシタ１の製造方法 
　次に、薄膜キャパシタ１の製造方法について説明する。以下、Ａサイト原子をＳｒ、Ｂサイト原子をＴａとする場合について説明するが、他の種類の原子を用いる場合でも同様である。
　最終的に多結晶誘電体薄膜１３となる薄膜の成膜方法に特に制限はない。例えば、真空蒸着法、スパッタリング法、ＰＬＤ法（パルスレーザー蒸着法）、ＭＯ－ＣＶＤ（有機金属化学気相成長法）、ＭＯＤ（有機金属分解法）、ゾル・ゲル法、ＣＳＤ（化学溶液堆積法）などが例示される。また、成膜時に使用する原料には微少な不純物や副成分が含まれている場合があるが、薄膜の性能を大きく損なわない程度の量であれば特に問題はない。また、本実施形態に係る多結晶誘電体薄膜１３も、性能を大きく損なわない程度に微少な不純物や副成分を含んでいても構わない。
　上記の成膜方法のうち、ＰＬＤ法、スパッタリング法およびＣＳＤ法などの方法で成膜すると、最終的に得られる薄膜が多結晶膜となりやすい。また、本実施形態に係る多結晶誘電体薄膜１３についてＰＬＤ法、スパッタリング法およびＣＳＤ法などの方法で成膜するとＮがｃｉｓ配置をとる構造となりやすい。ＣＶＤ法でも合成は可能であるが、成分元素数が多いため、ＰＬＤ法やスパッタリング法の方がより組成制御性が高い。本実施形態ではＰＬＤ法による成膜方法について説明する。
　まず、基板１１としてＳｉ単結晶基板を準備する。次に、Ｓｉ単結晶基板上にＳｉＯ２、ＴｉＯｘ、Ｐｔの順に成膜し、Ｐｔからなる下部電極１２を形成する。下部電極１２を形成する方法には特に制限はない。例えば、スパッタリング法やＣＶＤなどが挙げられる。
　次に、下部電極１２上にＰＬＤ法で金属酸化物薄膜を成膜した。また、下部電極１２の一部を露出させるためにメタルマスクを使用して薄膜が一部成膜されない領域を形成した。
　ＰＬＤ法では、まず、目的とする多結晶誘電体薄膜の構成元素を含むターゲットを成膜室内に設置する。次に、ターゲットの表面上にパルスレーザーを照射する。パルスレーザーの強いエネルギーによりターゲットの表面を瞬時に蒸発させる。そして、ターゲットと対向するように配置した基板上に蒸発物を堆積させて金属酸化物薄膜を成膜する。
　ターゲットの種類に特に制限はなく、作製する多結晶誘電体薄膜の構成元素を含む金属酸化物焼結体の他、合金、窒化物焼結体、金属酸窒化物焼結体などを用いることができる。また、ターゲットにおいては各元素が平均的に分布していることが好ましいが、得られる多結晶誘電体薄膜の品質に影響がない範囲で分布にばらつきがあってもよい。さらに、ターゲットは必ずしも一つである必要はなく、多結晶誘電体薄膜の構成元素の一部を含むターゲットを複数用意して成膜に用いることも可能である。ターゲットの形状にも制限はなく、使用する成膜装置に適した形状とすればよい。また、成膜条件（酸素のガス圧，窒素のガス圧，成膜室の大きさおよびガス導入管の位置等）を調整することで、最終的に得られる多結晶誘電体薄膜のａ／ｂを制御することができる。例えば、ターゲットのａ／ｂを大きくすれば、成膜された膜中のａ／ｂを大きくすることができる。また、ターゲットａ／ｂのみではなく、成膜条件も重要である。パルスレーザーによりターゲットから蒸発した金属元素は成膜室中の雰囲気を構成する元素の影響を受け、基板の成膜面に到達するからである。
　例えば、最終的に得られる多結晶誘電体薄膜の組成がＳｒａＴａｂＯｏＮｎである場合には、ターゲットとしてＳｒ２Ｔａ２Ｏ７を含む焼結体を準備する。そして、成膜条件（例えば酸素のガス圧，窒素のガス圧，成膜室の大きさおよびガス導入管の位置等）を調整することで、最終的に得られる多結晶誘電体薄膜のａ／ｂを制御することができる。
　また、ＰＬＤ法の際には、成膜する金属酸化物薄膜を結晶化させるために成膜時に基板１１を赤外線レーザーで加熱することが好ましい。基板１１の加熱温度は金属酸化物薄膜および基板１１の構成元素および組成等により変化するが、例えば、６００～８００℃となるように加熱して成膜を行う。基板１１の温度を適温とすることで、金属酸窒化物薄膜が結晶化しやすくなるとともに冷却時に生じる割れの発生を防止することができる。
　成膜中に、窒素ラジカルを導入して窒化処理を行うことで、ペロブスカイト型酸窒化物からなる多結晶誘電体薄膜１３を得ることができる。
　最後に、多結晶誘電体薄膜１３上に上部電極１４を形成することで、薄膜キャパシタ１を製造することができる。なお、上部電極１４の材質に特に制限はなく、Ａｇ，Ａｕ，Ｃｕ等を用いることができる。また、上部電極１４の形成方法にも特に制限はない。例えば、スパッタリング法により形成することができる。
　以上、本発明の実施形態について説明してきたが、本発明はこうした実施形態に何等限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々異なる態様で実施し得ることは勿論である。
　なお、本発明に係る容量素子とは、誘電性を利用した素子のことであり、コンデンサ、サーミスタ、フィルター、ダイプレクサ、共振器、発信子、アンテナ、圧電素子、トランジスタ、強誘電体メモリ等を含む。本実施形態に係る多結晶誘電体薄膜は、特に誘電損失が小さいことが求められる容量素子に好適に用いられる。
　以下、本発明を、さらに詳細な実施例に基づき説明するが、本発明は、これら実施例に限定されない。
　実験例１
　まず、成膜用ターゲットとして用いるＳｒ２Ｔａ２Ｏ７焼結体の原料として、ＳｒＣＯ３粉末およびＴａ２Ｏ５粉末を準備した。Ｓｒ／Ｔａのモル比が１となるようにＳｒＣＯ３粉末およびＴａ２Ｏ５粉末を秤量した。
　次に、ＳｒＣＯ３粉末およびＴａ２Ｏ５粉末に対して、エタノール溶媒を用いた湿式ボールミルにて１６時間混合して混合スラリーを得た。
　次に、前記混合スラリーを恒温乾燥機にて８０℃で１２時間乾燥し、混合物を得た。
　次に、前記混合物を乳鉢にて軽く解砕し、セラミック製のるつぼに入れた。そして、電気炉を用いて大気雰囲気中、１０００℃で２時間熱処理し、仮焼物を得た。
　次に、前記仮焼物に対して、再びエタノール溶媒を用いた湿式ボールミルにて１６時間混合して仮焼後スラリーを得た。
　得られた仮焼後スラリーを恒温乾燥機にて８０℃で１２時間乾燥し、仮焼後混合物を得た。
　前記仮焼後混合物に対し、バインダーとしてポリビニルアルコール溶液を添加し、混合して造粒物を得た。ポリビニルアルコール溶液の添加量は、粉砕物１００重量％に対して０．６重量％とした。
　前記造粒物を直径約２３ｍｍ、高さ約９ｍｍの円柱形状に成形して成型物を得た。成形方法はＣＩＰ成形とした。
　前記成型物に対し、電気炉を用いて大気雰囲気中、１４００℃で２時間焼成して焼結物を得た。さらに、前記焼結物の上面および下面を鏡面研磨して高さ５ｍｍの成膜ターゲットを得た。なお、得られた成膜ターゲットの相対密度が９６～９８％であることを確認した。
　上記のようにして得られた成膜用ターゲットを成膜装置に設置し、成膜用ターゲットと対向するように、Ｓｉ基板を設置した。当該Ｓｉ基板としては表面に下部電極としてＰｔ膜を有するものを用いた。
　実験例１では、ＰＬＤ法で厚さ２００ｎｍとなるように成膜した。このときの成膜条件（酸素のガス圧，窒素のガス圧等）を調整することで、最終的に得られる多結晶誘電体薄膜のａ／ｂを制御した。成膜中に、窒素ラジカルを導入して窒化処理を行うことで多結晶誘電体薄膜を得た。なお、成膜時の所要時間は０．５～２時間であった。
　実験例１で得られた薄膜サンプルのＸＲＤパターンをリガク社製全自動水平型多目的Ｘ線回折装置ＳｍａｒｔＬａｂを用いて測定した。実験例１の実施例は全てエピタキシャル膜ではないことを確認した。また、得られた薄膜サンプルにおけるｏおよびｎはＬＥＣＯ社製ＴＣ６００を用いてインパルス加熱溶融抽出法（赤外線吸収法）によって定量した。また、ＳｒイオンおよびＴａイオンの価数をＸＰＳのケミカルシフトから判定し、原料から価数の変化がないことを確認した。具体的には、Ｓｒイオンの価数は２で、Ｔａイオンの価数は５であった。また、ａ／ｂの値およびｎの値はインパルス加熱溶融抽出法で定量した値から算出した。
　また、実験例１で得られた薄膜サンプルについてＸＲＤパターンから、実験例１の実施例は全て多結晶膜であることを確認した。すなわち、薄膜が結晶化し、多結晶薄膜となっていることを確認した。また、得られた多結晶薄膜は特定の面に対して配向している配向膜ではないことを確認した。これはｃｉｓ配置が安定となる状態である。なお、図３ＡにはＴａ－Ｎ鎖が図示されていないが、ＡＢＯ２Ｎのｃｉｓ型構造では、Ｔａ－Ｎ鎖がジグザグに連なっている。
　続いて、実験例１で得られた薄膜サンプルに蒸着を用いてＡｇ電極を形成し、誘電損失（ｔａｎδ）を測定した。
　誘電損失の測定はインピーダンスアナライザー（アジレントテクノロジー社製）４２９４Ａにて、測定電圧：１００ｍＶ、測定周波数：１ＭＨｚで行った。本実験例では、ｔａｎδが１０％以下である場合を良好とした。結果を表１に示す。
Figure JPOXMLDOC01-appb-T000001
　表１より、ａ／ｂが１より大きい実施例１は誘電損失が１％以下となった。これに対し、ａ／ｂが１以下である比較例１、２は誘電損失が１％を超えた。
　表１より、ａ／ｂが高いほど、ｔａｎδが０％に近づく。これはＡＢＯ２Ｎに特有の現象である。理論計算によれば、陰イオン欠陥が生じたときには、Ａサイトが欠陥となることで補償されやすいと推定される。しかし、Ａサイトが欠陥となると誘電性が低下しｔａｎδが上昇してしまうと考えられる。そこで、ａ／ｂを高くし、Ａサイト元素をストイキオ（ａ／ｂ＝１）よりも多く含有させることで、Ａサイト欠陥を生じにくくすることができ、ｔａｎδを小さくできると考えられる。
　実験例２
　ＳｒＣＯ３粉末およびＴａ２Ｏ５粉末の代わりにＬａ２Ｏ３粉末およびＴｉＯ２粉末を用いた点以外は実験例１と同様にして実施例１１および比較例１１の薄膜サンプルを作製し、各種測定を行った。さらに、ＢａＯ粉末およびＴａ２Ｏ５を用いた点以外は実験例１と同様にして実施例１２および比較例１２の薄膜サンプルを作製し、各種測定を行った。さらに、Ｎｄ２Ｏ３粉末およびＴｉＯ２粉末を用いた点以外は実験例１と同様にして実施例１３および比較例１３の薄膜サンプルを作製し、各種測定を行った。結果を表２に示す。なお、実験例２で得られた実施例の薄膜サンプルについてＸＲＤ測定を行った。ＸＲＤ測定により、実験例２の実施例および比較例も全てエピタキシャル膜ではなく多結晶薄膜であることを確認した。さらに、Ｎの配置がｃｉｓ型であることを確認した。また、実施例１１および比較例１１に関して、ＬａイオンおよびＴｉイオンの価数をＸＰＳのケミカルシフトから判定し、原料から価数の変化がないことを確認した。具体的には、Ｌａイオンの価数は３で、Ｔｉイオンの価数は４であった。実施例１２および比較例１２に関して、ＢａイオンおよびＴａイオンの価数をＸＰＳのケミカルシフトから判定し、原料から価数の変化がないことを確認した。具体的には、Ｂａイオンの価数は２で、Ｔａイオンの価数は５であった。さらに、実施例１３および比較例１３に関して、ＮｄイオンおよびＴｉイオンの価数をＸＰＳのケミカルシフトから判定し、原料から価数の変化がないことを確認した。具体的には、Ｎｄイオンの価数は３で、Ｔｉイオンの価数は４であった。
Figure JPOXMLDOC01-appb-T000002
　表２より、ａ／ｂが１より大きい実施例１１は誘電損失が１％以下となった。これに対し、ａ／ｂが１以下である比較例１１は誘電損失が１％を超えた。
　実験例３
　実施例１（ｎ＝０．８）について、ｎの値を変化させて実施例２１および比較例２１，２２を得た。結果を表３に示す。
Figure JPOXMLDOC01-appb-T000003
　表３より、ｎ≧０．７である実施例はｔａｎδが１０％以下であり、誘電損失に優れた多結晶誘電体薄膜となる。これに対し、ｎ＜０．７である比較例２１，２２はｔａｎδが１０％を超え、悪化する。
　ｎ＜０．７である場合には、Ｔａ－Ｎ鎖がジグザグに連なる構造が十分に構成されないため、ｔａｎδが悪化すると推測される。
　１・・・薄膜キャパシタ
　１１・・・基板
　１２・・・下部電極
　１３・・・多結晶誘電体薄膜
　１４・・・上部電極
　

Claims (4)

  1. 　主組成がペロブスカイト型酸窒化物である多結晶誘電体薄膜であって、
    　前記ペロブスカイト型酸窒化物が組成式ＡａＢｂＯｏＮｎ（ａ＋ｂ＋ｏ＋ｎ＝５）で表され、
    　ａ／ｂ＞１
    　ｎ≧０．７
    　であることを特徴とする多結晶誘電体薄膜。
  2. 　前記ＡがＳｒ，Ｂａ，Ｃａ，Ｌａ，Ｃｅ，Ｐｒ，Ｎｄ，Ｎａから選ばれる１種類以上の元素であり、
    　前記ＢがＴａ，Ｎｂ，Ｔｉ，Ｗから選ばれる１種類以上の元素である請求項１に記載の多結晶誘電体薄膜。
  3. 　ＢＯ４Ｎ２の８面体構造を有し、前記８面体構造中におけるＮの配置がｃｉｓ型である請求項１または２に記載の多結晶誘電体薄膜。
  4. 　請求項１～３のいずれかに記載の多結晶誘電体薄膜を有する容量素子。
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