WO2017125330A1 - Système multicouche doté de couches à base d'étain - Google Patents

Système multicouche doté de couches à base d'étain Download PDF

Info

Publication number
WO2017125330A1
WO2017125330A1 PCT/EP2017/050744 EP2017050744W WO2017125330A1 WO 2017125330 A1 WO2017125330 A1 WO 2017125330A1 EP 2017050744 W EP2017050744 W EP 2017050744W WO 2017125330 A1 WO2017125330 A1 WO 2017125330A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
layers
tin
multilayer system
contact element
Prior art date
Application number
PCT/EP2017/050744
Other languages
German (de)
English (en)
Inventor
Jian Song
Savio Fabretti
Eugen Silbernagel
Original Assignee
Phoenix Contact Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Contact Gmbh & Co. Kg filed Critical Phoenix Contact Gmbh & Co. Kg
Priority to CN201790000509.3U priority Critical patent/CN209397269U/zh
Publication of WO2017125330A1 publication Critical patent/WO2017125330A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/027—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Definitions

  • the present invention relates to various aspects
  • Multilayer system in particular for an electrical contact element, an electrical contact element, an electrical, in particular detachable
  • Tin is the most commonly used
  • the contact zones offset relative to each other.
  • the protective oxide layer on the non-precious surface is broken and the underlying metal is oxidized. This process is repeated at each cycle of motion and results in the formation of a thick, high-resistance oxide layer on the surfaces and, ultimately, a large increase in contact resistance.
  • tin is susceptible to fretting corrosion, which is ultimately reflected in cyclically-exposed contacts in a small number of cycles of a few hundred cycles.
  • German Patent Application DE 197 47 756 A1 describes a clamp material which comprises a multilayer system on a carrier material.
  • a tin surface layer is provided.
  • a nickel layer and / or copper layer may be provided between the tin surface layer and the substrate.
  • a gold surface layer may be provided instead of the tin surface layer.
  • the invention has the object, a multilayer system, an electrical contact element, an electrical connector and a method for producing an electrical
  • Multilayer system in particular for an electrical contact element, solved, wherein the multi-layer system comprises an at least partially alternating and at least three layers comprehensive layer sequence with at least two tin-based layers on the one hand and with one or more others
  • the frictional wear resistance can be increased by providing an at least partially tin-based layer and one or more further metallic separating layers alternating layers. It is particularly surprising that it has been found that the multilayer system according to the invention, even if it has, for example, no nanoparticles, exhibits an unexpectedly high resistance to fretting corrosion. It is believed that the high fretting corrosion resistance can be attributed to the fact that the alternating contacting of the tin-based layer and the further metal separation layer disturbs the growth kinetics of a tin oxide layer, so that the fretting corrosion of the tin-based layer is retarded. At the same time, the presence of the tin-based layer in turn ensures the surface protection of the further metallic separating layer against corrosion. Since in the multi-layer system also no metals we gold or
  • a tin-based layer is understood in particular to mean that the layer consists of tin or a tin alloy.
  • the one or more further metallic separating layers are in particular no layers of tin or a tin alloy, but of another metal or another metal alloy.
  • the layer sequence preferably has only two different types of layers. That is the metallic one
  • Separating layers are preferably made of the same material (in particular copper or a copper alloy). However, it is also conceivable to provide separating layers of different materials.
  • the tin-based layers are separated from one another by the one or more further metallic separating layers. Since the at least partially alternating layer sequence comprises at least three layers with at least two tin-based layers and at least one further metallic separating layer, the layer sequence has at least the order: tin-based layer - further metallic separating layer - tin-based layer.
  • the layer sequence is at least partially alternating in some areas, is understood in particular that in addition to alternating area and non-alternating areas may be present. In addition, that can
  • Layer sequence also include other layers. It is also conceivable that layers may also be present between the tin-based layers and the one or more further metal layers. Likewise, the multilayer system can also consist exclusively of the at least partially alternating layer sequence.
  • the layer sequence comprises the same number of tin-based layers and of further metallic separating layers.
  • the layer sequence comprises more tin-based layers than further metallic separating layers.
  • the at least partially alternating layer sequence comprises at least three tin-based layers. If the number of tin-based layers is increased to at least three, the total thickness of the tin-based layers can be increased, and thus a further increased fretting corrosion resistance can be achieved.
  • the at least partially alternating layer sequence comprises at least two, preferably at least three further metallic separating layers.
  • the one or more further metallic ones are based
  • Separation layers can be achieved a high Reibkorrosionsbe pretechnik because copper-based metallic release layers even a lesser
  • copper-based release layers are in particular
  • the layer sequence alternating at least in some regions is a strictly alternating layer sequence. It has been found that this corrosion resistance can be effectively and inexpensively increased.
  • a strictly alternating layer sequence is understood in particular to mean that a tin-based layer and a further metallic separating layer are always provided in direct contact with each other and in alternation. Nevertheless, it is possible for the multi-layer system to comprise further layers above or below the alternating layer sequence.
  • the multi-layer system comprises at least one intermediate layer, in particular based on nickel.
  • the intermediate layer is arranged in particular between the at least partially alternating layer sequence and the substrate.
  • the intermediate layer has in particular nickel or a nickel alloy.
  • An intermediate layer based on nickel can be one
  • the at least partially alternating layer sequence comprises at least four, preferably at least five, more preferably at least six layers. If at least four layers (altogether two tin-based layers and two metallic separating layers in each case alternating) are provided in the alternating layer sequence, one for most
  • the tin-based layers each have a layer thickness of at least 0.1 ⁇ and / or at most 5 ⁇ . Inn area of this
  • Multilayer system requires too much space and material.
  • the layers of the multilayer system comprise introduced nanoparticles, the nanoparticles preferably comprising ceramic and / or metallic nanoparticles.
  • Nanoparticles are understood in particular to mean particles whose size is in the range from 1 to 200 nm.
  • all layers of the at least partially alternating layer sequence or else all layers of the multilayer system have corresponding nanoparticles. It has been shown that, depending on the nature of the particles, the introduced nanoparticles can be used to improve the wear resistance and / or the electrical properties, ie in particular a better electrical connection or a better surface protection.
  • the alternating layer sequence could now relevant to multi-layer systems with tin-based layers. Namely, as described, the nanoparticles deposit mainly at the periphery of the tin-based layers. Due to the alternating layer sequence can now relevant
  • the multi-layer system and at the same time a sufficient total thickness of the tin-based layers can be achieved.
  • the multi-layer system can alternatively also be provided free of nanoparticles since it has been recognized that even without the nanoparticle concentrations, an almost similar amount is already present
  • Friction corrosion resistance can be achieved.
  • the layers of the multilayer system are applied at least partially by electroplating. This allows the layers of the
  • Multilayer system and in particular the layer sequence are applied individually layer by layer.
  • very thin layer thicknesses can be achieved with low material consumption.
  • the object is achieved by an electric
  • Contact element solved comprising a particular copper-based substrate and arranged on the substrate multilayer system according to the first aspect. Due to the multi-layer system can advantageously a
  • the copper-based substrate consists in particular of copper or a copper alloy.
  • the electrical contact element may in particular be part of a detachable electrical connector.
  • the layer of the multilayer system facing away from the substrate is a tin-based layer.
  • the layer of the multilayer system facing away from the substrate is understood in particular to be the topmost layer (surface layer) of the multilayer system. This is for example exposed to the environment and / or comes primarily in contact with a mating contact. In principle, however, it is also possible that one of the further metallic separating layers represents the layer of the multi-layer system facing away from the substrate.
  • the layer facing the substrate of the Multilayer system is understood in particular to mean the layer which is in direct contact with the substrate.
  • the choice of the layer facing the substrate can in particular be made dependent on the respective substrate and optimized thereon.
  • the object mentioned is achieved by an electrical, in particular releasable connector comprising an electrical contact element according to the second aspect.
  • an electrical, in particular releasable connector comprising an electrical contact element according to the second aspect.
  • the object mentioned at the outset is achieved by a method for producing an electrical contact element comprising a multilayer system, in particular according to the first aspect, comprising the steps of: providing a substrate; and applying at least one
  • Layer sequence with at least two tin-based layers on the one hand and with one or more further metallic separating layer on the other hand on the substrate.
  • the layer sequence is at least partially electroplated
  • Multilayer system and in particular the layer sequence are applied individually layer by layer.
  • very thin layer thicknesses can be achieved with low material consumption.
  • nanoparticles are introduced at least into a part of the layers of the multilayer system.
  • the introduced nanoparticles can be used to improve the wear resistance and / or the electrical properties, that is to say in particular a better electrical connection at the onset of the oxidation.
  • the electrical contact element is part of an electrical, in particular releasable connector. So if the process for producing a
  • the electrical connector can thus be produced economically and has an improved Reibkorrosionsbe Onemaschine. As already described, this is particularly advantageous when the electrical connector is used in an environment in which it is exposed to a regular, in particular cyclic movement. With regard to further advantageous embodiments of the different aspects, reference is made in particular to the description of the first aspect and its advantages.
  • FIG. 1 shows three exemplary embodiments of an electrical contact element according to the second aspect, each with a multilayer system according to the first aspect
  • Fig. 2 shows an embodiment of a method according to the fourth
  • FIG. 1 initially shows three exemplary embodiments of an electrical contact according to the second aspect, each with a multilayer system according to the first aspect.
  • an embodiment of an electrical contact element is shown in cross section, which may for example be part of an embodiment of a releasable electrical connector according to the third aspect.
  • the electrical contact element comprises a multilayer system 1 and a substrate 2, which in this case consists of copper or a copper alloy.
  • the multilayer system 1 is applied to the substrate.
  • the multilayer system 1 comprises an alternating layer sequence 4 comprising three layers 6, 7, 8 with two tin-based layers 6, 8 and a further metallic one
  • the further metallic separating layer 7 is based on copper, ie it consists for example of copper or a copper alloy.
  • a layer sequence 4 which results in an alternating layer sequence 4 on tin based on the one hand and a copper-based layer 7 on the other hand.
  • the uppermost layer of the multilayer system 1 facing away from the substrate 2 is the tin-based layer 8.
  • the layer of the substrate 2 in direct contact with the substrate 2
  • Multilayer system 1 is the tin-based layer 6.
  • a second embodiment of an electrical contact element is shown in cross section.
  • the electrical contact element of FIG. 1 b is similar to that of FIG. 1 a, so that reference can be made to the embodiment of FIG. 1 a.
  • the electrical contact element of FIG. 1 b comprises another multilayer system 1 'with a different layer sequence 4', which is applied to the substrate 2 '.
  • the multi-layer system V comprises an alternating layer sequence 4 "comprising five layers 6, 7, 8, 9, 10 comprising five tin-based layers 6, 8, 10 and two further metallic separating layers 7, 9.
  • a layer sequence 4 ' which on the other hand comprises an alternating layer sequence of tin-based layers 6, 8, 10 on the one hand and copper-based layers 7, 9.
  • Multilayer system V in this case is the tin-based layer 10.
  • the layer of the multilayer system 1 which is in direct contact with the substrate 2 'and faces the substrate 2' is in turn the tin-based layer 6.
  • a third embodiment of an electrical contact element is shown in cross section.
  • the electrical contact element of FIG. 1 c is similar to that of FIG. 1 b, so that reference may first be made to the embodiment of FIG. 1 b.
  • the electrical contact element of Fig. 1c comprises another multilayer system 1 "with a different layer sequence 4" applied to the substrate 2 ", in which case the multilayer system V comprises one Intermediate layer 3 "and an alternating and six layers 5, 6, 7, 8, 9, 10 comprising layer sequence 4" with three tin-based layers 6, 8, 10 and three further metal separation layers 5, 7, 9.
  • the intermediate layer 3 " is between the substrate 2 "and
  • the alternating layer sequence 4 " is based on nickel, ie it consists for example of nickel or a nickel alloy. Also in this case, the further metallic separating layers 5, 7, 9 are based on copper. This results in a layer sequence 4 ", which is an alternating
  • Layer sequence of tin-based layers 6, 8, 10 on the one hand and on copper-based layers 5, 7, 9 on the other hand comprises.
  • the topmost layer of the multilayer system 1 "facing away from the substrate 2 is again the tin-based layer 10.
  • the layer of the multilayer system 1" which is in direct contact with the substrate 2 "and faces the substrate 2" is in this case nickel based layer 3 ".
  • a mating contact 12 is indicated, which can contact the electrical contact element via the multilayer system.
  • the layer sequences 4, 4 ', 4 are each strictly alternating layer sequences, in which always a tin-based layer and another metallic
  • the individual layers 3 ", 5, 6, 7, 8, 9, 10 of the multilayer systems 1, 1 ', 1" each have a layer thickness of between 0.1 ⁇ m and 5 ⁇ m.
  • nanoparticles for example metallic or ceramic
  • the individual layers 3", 5, 6, 7, 8, 9, 10 are also advantageously applied by electroplating (see Fig. 2).
  • the alternating layer sequences 4, 4 ', 4 " the layers of which consist alternately of a tin-based layer and one or more further metallic separating layers, the
  • FIG. 2 now shows an exemplary embodiment of a method according to the fourth aspect, with which, for example, the electrical contact elements of FIG. 1 can be produced. 2 shows a flow diagram 100.
  • a nickel-based layer for example layer 3 "of FIG. 1 c
  • a substrate for example layer 3 "of FIG. 1 c
  • a copper-based layer (for example, layer 5 of FIG. 1 c) is applied.
  • step 130 a tin-based layer is applied (for example, layer 6 of FIG. 1 a, b, c) applied.
  • step 140 a copper-based layer is deposited (eg, layer 7 of FIGS. 1a, b, c).
  • step 150 a tin-based layer is again applied (for example, layer 8 of FIGS. 1a, b, c).
  • the application of the layers is completed or the steps 140, 150 are repeated once (for applying the layers 9, 10 of FIG. 1 b, c) or repeatedly for applying further layers.
  • the layers are preferably applied by means of electroplating in order to be able to apply the layers of the multilayer system individually, layer by layer, and to be able to realize them thinly.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne entre autres un système multicouche, notamment pour un élément de contact électrique. Le but de l'invention est d'améliorer à faible coût la résistance à la corrosion de contact. A cet effet, le système multicouche (1, 1', 1'') comprend une séquence de couches (4, 4', 4'') pourvue d'au moins trois couches et alternée au moins dans certaines zones et, d'une part, au moins deux couches (6, 8, 10) à base d'étain et, d'autre part, au moins une autre couche intercalaire (5, 7, 9) métallique. L'invention concerne également un élément de contact électrique, un connecteur électrique, notamment détachable, et un procédé de fabrication d'un élément de contact électrique.
PCT/EP2017/050744 2016-01-19 2017-01-16 Système multicouche doté de couches à base d'étain WO2017125330A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201790000509.3U CN209397269U (zh) 2016-01-19 2017-01-16 具有锡基层的多层***

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016100803.6 2016-01-19
DE102016100803.6A DE102016100803A1 (de) 2016-01-19 2016-01-19 Mehrschichtsystem mit auf Zinn basierenden Schichten

Publications (1)

Publication Number Publication Date
WO2017125330A1 true WO2017125330A1 (fr) 2017-07-27

Family

ID=57860845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/050744 WO2017125330A1 (fr) 2016-01-19 2017-01-16 Système multicouche doté de couches à base d'étain

Country Status (3)

Country Link
CN (1) CN209397269U (fr)
DE (1) DE102016100803A1 (fr)
WO (1) WO2017125330A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19747756A1 (de) 1996-10-30 1998-05-28 Yazaki Corp Klemmenmaterial und Anschlußklemme
GB2527368A (en) * 2014-06-20 2015-12-23 Daido Metal Co Structure and fabrication method of a multilayer overlay for plain bearings

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD206862A1 (de) * 1981-11-18 1984-02-08 Reiner Richter Oberflaechenbeschichteter steckverbinder
DE3635692C1 (en) * 1986-10-21 1987-09-17 Heraeus Gmbh W C Composite material for plug contacts or sliding contacts
DE102007017380A1 (de) * 2007-04-05 2008-10-09 Freie Universität Berlin Materialsystem und Verfahren zur dessen Herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19747756A1 (de) 1996-10-30 1998-05-28 Yazaki Corp Klemmenmaterial und Anschlußklemme
GB2527368A (en) * 2014-06-20 2015-12-23 Daido Metal Co Structure and fabrication method of a multilayer overlay for plain bearings

Also Published As

Publication number Publication date
CN209397269U (zh) 2019-09-17
DE102016100803A1 (de) 2017-07-20

Similar Documents

Publication Publication Date Title
EP1547107B1 (fr) Contact electrique
DE102007047007A1 (de) Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
DE112009000314T5 (de) Anschlussstecker und Kabelbaum
DE102014117410B4 (de) Elektrisches Kontaktelement, Einpressstift, Buchse und Leadframe
WO2009109485A1 (fr) Matériau composite en forme de barre contenant des fils cnt et procédé de fabrication
EP0604710B1 (fr) Corps de contact électrique
DE202015008963U1 (de) Kabel-Kontaktstück-System zur elektrischen Verbindung eines Kabels mit einem Kontaktstück
EP1927419A1 (fr) Grille compreant des fils enlacés présentant un étamage
DE102010039655A1 (de) Elektrische Verbindungsklemme sowie Verfahren und Vorrichtung zum Herstellen einer elektrischen Verbindungsklemme
EP1616372B1 (fr) Contacts pour fiche electrique et produit semi-fini utilise pour les produire
DE112016002685B4 (de) Anschlussstück und Verbinder
EP2128305A1 (fr) Fil en acier composite métallique doté d'au moins deux couches métalliques
WO2003015217A2 (fr) Contact electrique
DE102016013812A1 (de) Anschlusspaar, Verbinder und Herstellungsverfahren
WO2021180421A1 (fr) Fil et bande comprenant des nanotubes de nitrure de bore pour contacts électriques
DE102006043795B3 (de) Elektrischer Mikroschalter
EP3862759A1 (fr) Fil enrobe et procédé de fabrication de fil enrobe
WO2017125330A1 (fr) Système multicouche doté de couches à base d'étain
DE102011015219B4 (de) Verlötbare Elektrode und Verfahren zur Herstellung einer verlötbaren Elektrode
EP3871293B1 (fr) Élément de contact électrique
DE202013004915U1 (de) Verbunddraht und Kontaktelement
DE2419043C3 (de) Schaltvorrichtung mit bewegbaren Kontakten und Verfahren zu deren Herstellung
CH664650A5 (de) Elektrischer gleitkontakt, insbesondere fuer kommutierungssysteme.
DE102012008908B4 (de) Verfahren zur Herstellung eines Schleifkontaktats mit mehreren Kontakten
DE102008043361A1 (de) Anschlussdraht und Verfahren zur Herstellung eines solchen

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17700939

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17700939

Country of ref document: EP

Kind code of ref document: A1