WO2017110050A1 - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
- Publication number
- WO2017110050A1 WO2017110050A1 PCT/JP2016/005025 JP2016005025W WO2017110050A1 WO 2017110050 A1 WO2017110050 A1 WO 2017110050A1 JP 2016005025 W JP2016005025 W JP 2016005025W WO 2017110050 A1 WO2017110050 A1 WO 2017110050A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- case
- fixing
- contact
- electronic device
- fixing portion
- Prior art date
Links
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000003990 capacitor Substances 0.000 description 53
- 239000010408 film Substances 0.000 description 13
- 230000006866 deterioration Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Definitions
- the present invention relates to an electronic device used for various electronic equipment, electrical equipment, industrial equipment, automobile electrical equipment, and the like.
- FIG. 10 is a schematic diagram showing a cross section of a portion surrounded by a circle B shown in FIG.
- the film capacitor 121 has a plurality of wound bodies 123 or a laminated body in which a metallized film is wound or laminated, and a polarity for connection to an external mounted body.
- the capacitor element 122 having the different terminals 124 and 125 is housed in the case 140 and is filled with the filling resin 127 except for the portion connected to the external mounted body of the terminals 124 and 125. It has become.
- the capacitor element 121 includes a fixing portion 128 (only the left end is shown in FIG. 9B) provided on the capacitor element 122 and a support portion 141 provided on the upper end portion of the side wall of the case 140. By being placed, it is fixed at a desired position in the case 140.
- the capacitor element is housed in a case and filled with resin, so that deterioration of the performance and function of the film capacitor can be suppressed even in a severe use environment.
- Patent Document 1 is known as prior art document information related to the invention of this application.
- the support portion 141 provided at the upper end portion of the side wall of the case 140 and the fixing portion 128 provided in the capacitor element 122 include the support portion 141.
- the lower surface of the fixing portion 128 are in contact with each other over the entire surface, and there are slight protrusions such as burrs on the upper surface of the supporting portion 141 or a part of the lower surface of the fixing portion 128. If the upper surface of the support portion 141 or the lower surface of the fixing portion 128 is warped, the fixing portion 128 may be attached to the supporting portion 141 depending on the location of the protrusion or the direction of warping even if it is a minute protrusion. It becomes impossible to place stably.
- An object of the present invention is to solve such a conventional problem and to provide an electronic device having excellent dimensional accuracy and strength.
- An electronic device of the present invention is an electronic device comprising a case, a device element accommodated in the case, and a filling resin filled in the case so as to be embedded in the device element.
- a fixing part for fixing to the case is provided, and a supporting part for supporting the fixing part is provided for the case, and the supporting part has an upper surface facing the lower surface of the fixing part.
- the fixed portion and the support portion are in contact with each other between the lower surface of the fixed portion other than the contact portion and the upper surface of the support portion.
- region which does not contact is provided, the lower surface of a fixing
- FIG. 1 is a perspective view which shows the external appearance of the film capacitor in Embodiment 1 of this invention
- (b) is a perspective view which shows the structure of the capacitor
- (A) is a perspective view which shows the external appearance of the conventional film capacitor
- (b) is a perspective view which shows the structure of the conventional capacitor
- FIG. 1A is a perspective view showing an appearance of a film capacitor 1 which is an electronic device according to Embodiment 1 of the present invention
- FIG. 1B is a capacitor element 2 and a case 20 according to Embodiment 1 of the present invention. It is a perspective view which shows the structure.
- FIG. 2 is a view of a part of the case 20 surrounded by a circle B shown in FIG.
- FIG. 3 is a cross-sectional view of a part of the case 20 surrounded by a circle B shown in FIG.
- the winding body 3 is omitted).
- FIG. 4 is a view of a cross section in a state in which the fixing portion of the capacitor element 2 shown in FIG.
- a film capacitor 1 which is an electronic device has a plurality of wound bodies 3 or a laminated body in which a metallized film is wound or laminated, and an external mounted body and an electric body. And terminals 4 and 5 having different polarities made of metal such as copper, and an insulating member 6 made of insulating resin or the like interposed between the terminals 4 and 5.
- the capacitor element 2 is housed in a case 20 made of metal or resin.
- the case 20 of the film capacitor 1 is configured to be filled with a filling resin 7 such as an epoxy resin or a urethane resin, except for a portion connected to an external mounted body of the terminals 4 and 5.
- fixing portions 8 (only the left end is shown in FIG. 1B) provided at both ends of the insulating member 6 provided in the capacitor element 2 are provided at the upper end of the side wall of the case 20.
- the terminals 4 and 5 provided in the capacitor element 2 are also arranged at predetermined positions in the case 20.
- the support portion 21 provided in the case 20 has an upper surface 22 that faces the lower surface 10 of the fixing portion 8.
- the fixing portion 8 is fitted to the support portion 21 in the direction of arrow E, and the lower surface 10 a on the one end side of the lower surface 10 of the fixing portion 8 and the one end side of the support portion 21.
- the upper surface 22 a is in contact with the contact portion 16, and the lower surface 10 b on the other end side of the lower surface 10 of the fixing portion 8 and the upper surface 22 b on the other end side of the support portion 21 are in contact with each other at the contact portion 17.
- the two contact portions of the contact portion 16 and the contact portion 17 are located so as to sandwich the center portion in the long side direction (left and right direction in FIG. 4) of the lower surface of the fixed portion 8, and the two contact portions 16 and 17.
- the region sandwiched between the two is a non-contact region 18 where the lower surface 10c of the fixed portion 8 and the upper surface 22c of the support portion 21 are not in contact with each other.
- the lower surface 10 c of the fixing portion 8 that forms the non-contact region 18 is inclined with respect to the bottom surface 29 of the case 20.
- the upper surface 22 of the support portion 21 facing the lower surface 10c of the fixing portion 8 is provided in parallel to the lower surface 10c of the fixing portion 8.
- the filling resin 7 is filled in the case 20 so that the non-contact area 18 is buried.
- the lower surface 10 of the fixing portion 8 of the insulating member 6 provided in the capacitor element 2 and the upper surface 22 of the support portion 21 provided in the case 20 are in contact with each other at the two contact portions 16 and 17. It has become. With such a configuration, there is a protrusion on the lower surface 10 of the fixing portion 8 or a part of the upper surface 22 of the supporting portion 21, or warping occurs on the upper surface 22 of the supporting portion 21 or the lower surface 10 of the fixing portion 8. Even if it is a case, the fixing
- the two contact portions of the contact portion 17 with the upper surface 22b of the fixed portion 8 are each positioned so as to sandwich the central portion without being biased to one side in the long side direction of the lower surface 10 of the fixing portion 8.
- the lower surface 10c of the fixing portion 8 that forms the non-contact region 18 where the lower surface 10 of the fixing portion 8 and the upper surface 22 of the support portion 21 are not in contact is such that the lower surface 10a side of the fixing portion 8 is more than the lower surface 10b side.
- the structure is inclined with respect to the bottom surface 29 on the outer side of the case 20 so as to be upward.
- the air existing in the non-contact region 18 easily escapes upward along the inclination of the lower surface 10c of the fixing portion 8, and it becomes difficult to collect air in the lower surface 10c portion of the fixing portion 8.
- a convex engaging portion 14 is provided on the fixing portion 8, and the terminals 4, 5 may be provided with an engaged portion 15 having a hole or a concave shape, and the engaged portion 14 may be engaged with the engaged portion 15 and fixed.
- the insulating member 6 and the terminals 4 and 5 are firmly fixed, so that the fixing strength of the terminals 4 and 5 and the accuracy of the arrangement position can be further improved.
- notches 26 and 27 are provided at the upper end portion of the support portion 21, and the width direction dimension of the lower end of the fixing portion 8 on the side wall of the case 20 is set to the width direction on the side wall of the case 20 at the upper end of the support portion 21.
- FIG. 5 is a view showing a cross-section of a part of the case in Embodiment 2 of the present invention and a fixing portion 38 of the capacitor element 32.
- FIG. 6 is a cross-sectional view of the state in which the fixing portion 38 of the capacitor element 32 shown in FIG.
- the fixed portion 38 is provided integrally with the terminal 35 at the end portion of the terminal 35, the notch 49 is provided near the lower end of the fixed portion 38, and the upper end portion of the support portion 51a of the case 50 is cut. Since it is the same structure as Embodiment 1 except not providing a notch, description is partially abbreviate
- FIG. 1 is the same structure as Embodiment 1 except not providing a notch
- the fixing portion 38 is provided at an end portion obtained by extending the terminal 35 provided in the capacitor element 32.
- fixing portions 38 (only the left end is shown in FIG. 5) provided at both ends of the terminal 35 provided in the capacitor element 32 are provided on a support portion 51 a provided at the upper end portion of the side wall of the case 50.
- the portion 50 is disposed at a predetermined position in the case 50, and a portion of the terminals 34, 35 provided on the capacitor element 32 and connected to the external mounted body is disposed at the predetermined position.
- the support portion 51 a provided in the case 50 has an upper surface 52 that faces the lower surface 40 of the fixed portion 38.
- the fixing portion 38 is fitted to the support portion 51a in the direction of arrow E, and the lower surface 40a on one end side of the lower surface 40 of the fixing portion 38 and the upper surface 52a on one end side of the support portion 51a are at the contact portion 46.
- the lower surface 40b on the other end side of the lower surface 40 of the fixing portion 38 and the upper surface 52b on the other end side of the support portion 51a are in contact with each other at the contact portion 47.
- the two contact portions of the contact portion 46 and the contact portion 47 are located so as to sandwich the central portion in the long side direction (left-right direction in FIG.
- the lower surface 40c of the fixing portion 38 forming the non-contact region 48 is inclined with respect to the outer bottom surface 59 of the case 50 so that the lower surface 40a side of the fixing portion 38 is higher than the lower surface 40b side.
- the filling resin 37 is filled in the case 50 so that the non-contact area 48 is buried.
- a notch 49 is provided at the lower end portion of the fixing portion 38 so that the width dimension of the side wall of the case 20 at the lower end of the fixing portion 38 is larger than the width direction size of the side wall of the case 20 at the upper end of the support portion 51a. It may be small. With such a configuration, the fixing portion 38 can be smoothly fitted to the support portion 51a, so that a reduction in fixing strength due to poor fitting can be prevented.
- the two fixing portions 38 are provided at both ends of the terminal 35, but one of the two fixing portions 38 is at the end of the terminal 35 and the other is at the terminal. It may be provided at the end of the terminal 34 having a polarity different from that of the terminal 35.
- FIG. 7 is a view showing a cross section of the capacitor element fixing portion 68 according to Embodiment 3 of the present invention in a state in which it is fitted to the support portion of the case.
- the present embodiment is different from the first embodiment in that the upper surface 82 c of the support portion 81 a provided at the upper end portion of the side wall of the case 80 forms the non-contact region 78 of the case 80.
- the upper surface 82d is substantially parallel to the outer bottom surface 89 and faces the lower surface 70c of the fixed portion 68, and the upper surface 82e rises upward from the upper surface 82d substantially perpendicularly to the case 80.
- This is a configuration that is not parallel to the lower surface 70c of the fixing portion 68 facing the upper surface 82c of 81a in the width direction of the side wall of the case 80 (left-right direction in FIG. 7).
- the upper surface of the support portion 21 and the lower surface of the fixed portion 8 that form a non-contact region are parallel to each other.
- the contact area between the filling resin 67 filled in the non-contact region 78 and the case 80 increases, and the adhesive strength between the filling resin 67 and the case 80 increases.
- the fixing strength of the capacitor element can be further strengthened.
- the upper surface 82c of the support portion 81a is constituted by an upper surface 82d that is parallel to the bottom surface 89 outside the case 80, and an upper surface 82e that rises above the case 80 substantially perpendicularly from the upper surface 82d.
- FIG. 8 is a diagram showing a cross-section in a state where the capacitor element fixing portion 98 according to the fourth embodiment of the present invention is fitted to the support portion of the case 110.
- this embodiment is different from the first embodiment in that the lower surface 100c forming the non-contact region 108 of the fixing portion 98 provided in the capacitor element is V-shaped. It is.
- the angle of inclination of the lower surface 100c becomes larger than the configuration in which the lower surface 10 of the fixing portion 8 is inclined in one direction as in the first embodiment, and the case 110 is filled.
- the air present in the non-contact region 108 is likely to escape upward along the inclination of the lower surface 100c of the fixing portion 98 as the liquid level of the filling resin 97 rises. It becomes more difficult to collect.
- the fixing strength of the capacitor element in the case 110 can be further strengthened.
- the present invention it is possible to obtain an electronic device in which the device element is firmly fixed in the case and the dimensional accuracy of the arrangement position of the terminal connected to the external mounted body is excellent.
- the present invention is useful for an electronic device in which a device element is housed in a case, which is used for various electronic devices, electrical devices, industrial devices, automobile electrical equipment, and the like.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
図1(a)は、本発明の実施の形態1における電子デバイスであるフィルムコンデンサ1の外観を示す斜視図、図1(b)は、本発明の実施の形態1におけるコンデンサ素子2とケース20の構成を示す斜視図である。図2は、図1(b)に示す円Bに囲まれたケース20の一部を矢印A方向から見た図である。図3は、図1(b)に示す円Bに囲まれたケース20の一部を矢印C方向に切断した断面と、コンデンサ素子2の固定部8を示す図(金属化フィルムを巻回した巻回体3は省略している)である。図4は、図3に示すコンデンサ素子2の固定部が、ケース20の支持部21に嵌合した状態の断面を矢印D方向から見た図である。
図5は、本発明の実施の形態2におけるケースの一部を切断した断面と、コンデンサ素子32の固定部38を示す図である。図6は、図5に示すコンデンサ素子32の固定部38がケース50の支持部に嵌合した状態の断面を矢印D方向から見た図である。
実施の形態3について、構成が実施の形態1と同じ部分については一部説明を省略する。
実施の形態4について、構成が実施の形態1と同じ部分については一部説明を省略する。
2、32 コンデンサ素子
3 巻回体
4、5、34、35 端子
6、36 絶縁部材
7、37、67、97 充填樹脂
8、38、68、98 固定部
10、10a、10b、10c、40、40a、40b、40c、70c、100c 下面
14 係合部
15 被係合部
16、17、46、47、76、77、106、107 接触部
18、48、78、108 非接触領域
20、50、80、110 ケース
21、51a、81a、111a 支持部
22、22a、22b、22c、52、52a、52b、52c、82c、82d、82e、112c 上面
26、27、49、 切り欠き部
29、59、89、119 底面
Claims (6)
- ケースと、前記ケースに収容されたデバイス素子と、前記デバイス素子を埋設するように前記ケースに充填された充填樹脂と、を備えた電子デバイスであって、
前記デバイス素子には前記ケースに固定する固定部が設けられ、前記ケースには、前記固定部の下面と対向する上面を備えた前記固定部を支持する支持部が設けられ、
前記固定部と前記支持部とは、前記固定部の下面の長辺方向における中央部を挟んだ二つの接触部で接触し、前記接触部以外の、前記固定部の下面と、前記支持部の上面と、の間には、前記固定部と、前記支持部と、が接触しない非接触領域が設けられ、前記固定部の下面は前記ケースの底面に対して傾斜し、前記非接触領域は前記充填樹脂に埋没していることを特徴とする電子デバイス。 - 前記デバイス素子は、端子を含み、前記固定部が前記端子に設けられていることを特徴とする請求項1に記載の電子デバイス。
- 前記デバイス素子は、極性の異なる二つの端子と、前記極性の異なる二つの端子の間に介挿された絶縁部材とを含み、前記固定部は前記絶縁部材に設けられていることを特徴とする請求項1に記載の電子デバイス。
- 前記固定部は、前記絶縁部材の長辺方向の両端部に設けられていることを特徴とする請求項3に記載の電子デバイス。
- 前記絶縁部材は係合部を有し、この係合部が前記二つの端子の被係合部と係合することで前記絶縁部材と前記二つの端子どうしが固定されていることを特徴とする請求項3に記載の電子デバイス。
- 前記固定部の下端の、前記ケースの側壁における幅方向の寸法が、前記支持部の上端の、前記ケースの側壁における幅方向の寸法よりも小さいことを特徴とする請求項1に記載の電子デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112016005973.6T DE112016005973T5 (de) | 2015-12-25 | 2016-11-30 | Elektronische vorrichtung |
JP2017557690A JP6811378B2 (ja) | 2015-12-25 | 2016-11-30 | 電子デバイス |
CN201680074074.7A CN108369860A (zh) | 2015-12-25 | 2016-11-30 | 电子器件 |
US15/992,362 US10460872B2 (en) | 2015-12-25 | 2018-05-30 | Electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-253886 | 2015-12-25 | ||
JP2015253886 | 2015-12-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/992,362 Continuation US10460872B2 (en) | 2015-12-25 | 2018-05-30 | Electronic device |
Publications (1)
Publication Number | Publication Date |
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WO2017110050A1 true WO2017110050A1 (ja) | 2017-06-29 |
Family
ID=59089912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2016/005025 WO2017110050A1 (ja) | 2015-12-25 | 2016-11-30 | 電子デバイス |
Country Status (5)
Country | Link |
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US (1) | US10460872B2 (ja) |
JP (1) | JP6811378B2 (ja) |
CN (1) | CN108369860A (ja) |
DE (1) | DE112016005973T5 (ja) |
WO (1) | WO2017110050A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3581858B1 (en) * | 2017-02-09 | 2021-01-06 | Mitsubishi Electric Corporation | Ceiling-embedded type indoor unit for air conditioner, and air conditioner |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5670632U (ja) * | 1979-11-05 | 1981-06-11 | ||
JPS5792822A (en) * | 1980-12-01 | 1982-06-09 | Fuji Kenkyusho Co Ltd | Condenser |
JPS61182023U (ja) * | 1985-04-30 | 1986-11-13 | ||
JPS62184724U (ja) * | 1986-05-15 | 1987-11-24 | ||
JP2006216756A (ja) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | ケースモールド型コンデンサ及びその製造方法 |
JP2009105108A (ja) * | 2007-10-22 | 2009-05-14 | Panasonic Corp | ケースモールド型コンデンサ |
JP2012151378A (ja) * | 2011-01-21 | 2012-08-09 | Panasonic Corp | ケースモールド型コンデンサ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2023049B1 (en) * | 2007-07-25 | 2013-10-30 | Sanyo Electric Co., Ltd. | In-ceiling mount type air conditioner and indoor unit thereof |
CN202110954U (zh) * | 2011-07-08 | 2012-01-11 | 无锡宸瑞电子科技有限公司 | 一种能有效吸收高频谐波的DC-Link电容器 |
WO2014091696A1 (ja) * | 2012-12-10 | 2014-06-19 | パナソニック株式会社 | ケースモールド型コンデンサとその製造方法 |
-
2016
- 2016-11-30 WO PCT/JP2016/005025 patent/WO2017110050A1/ja active Application Filing
- 2016-11-30 JP JP2017557690A patent/JP6811378B2/ja active Active
- 2016-11-30 CN CN201680074074.7A patent/CN108369860A/zh active Pending
- 2016-11-30 DE DE112016005973.6T patent/DE112016005973T5/de not_active Withdrawn
-
2018
- 2018-05-30 US US15/992,362 patent/US10460872B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5670632U (ja) * | 1979-11-05 | 1981-06-11 | ||
JPS5792822A (en) * | 1980-12-01 | 1982-06-09 | Fuji Kenkyusho Co Ltd | Condenser |
JPS61182023U (ja) * | 1985-04-30 | 1986-11-13 | ||
JPS62184724U (ja) * | 1986-05-15 | 1987-11-24 | ||
JP2006216756A (ja) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | ケースモールド型コンデンサ及びその製造方法 |
JP2009105108A (ja) * | 2007-10-22 | 2009-05-14 | Panasonic Corp | ケースモールド型コンデンサ |
JP2012151378A (ja) * | 2011-01-21 | 2012-08-09 | Panasonic Corp | ケースモールド型コンデンサ |
Also Published As
Publication number | Publication date |
---|---|
JP6811378B2 (ja) | 2021-01-13 |
JPWO2017110050A1 (ja) | 2018-10-11 |
DE112016005973T5 (de) | 2018-09-20 |
US10460872B2 (en) | 2019-10-29 |
US20180277303A1 (en) | 2018-09-27 |
CN108369860A (zh) | 2018-08-03 |
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