WO2017080197A1 - 散热结构及终端 - Google Patents

散热结构及终端 Download PDF

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Publication number
WO2017080197A1
WO2017080197A1 PCT/CN2016/084641 CN2016084641W WO2017080197A1 WO 2017080197 A1 WO2017080197 A1 WO 2017080197A1 CN 2016084641 W CN2016084641 W CN 2016084641W WO 2017080197 A1 WO2017080197 A1 WO 2017080197A1
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Prior art keywords
heat dissipation
heat
plate
dissipation plate
heatsink
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PCT/CN2016/084641
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English (en)
French (fr)
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付常佳
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乐视控股（北京）有限公司
乐视致新电子科技（天津）有限公司
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Publication of WO2017080197A1 publication Critical patent/WO2017080197A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the technical field of heat dissipation of a whole machine, and in particular, to a heat dissipation structure and a terminal.
  • a heat-dissipating material with a high thermal conductivity is usually used as a heat sink (Heatsink), and the Heatsink is respectively in contact with the module back plate and the light bar, and the heat on the light bar is quickly derived by Heatsink, and the heat is partially It is stored on the Heatsink and exported by Heatsink thermal radiation. A part of the heat is transferred to the module backplane that is in contact with it.
  • the heat on the back panel of the module is mainly the heat radiation of the backboard itself and the convection of the air vent of the whole casing. And export.
  • the application provides a heat dissipation structure and a terminal to solve the problem that the heat generated by the terminal in the prior art needs to be transmitted to the module back plate through the Heatsink, and then the heat is extracted from the module back plate through the heat dissipation hole, and the heat transfer path of the terminal is compared. Long, and the Heatsink is not tightly connected to the module backplane, reducing the heat dissipation structure. The problem of heat dissipation efficiency.
  • the present application provides a heat dissipation structure including a heat sink, a module back plate, and a screw lock; the heat sink includes a first heat sink and a second heat sink; the first heat sink is perpendicular to the second heat sink The first heat dissipation plate is further connected to the light bar, and the end of the second heat dissipation plate away from the end of the first heat dissipation plate is fixedly connected to the module back plate by the screw lock.
  • the second heat dissipation plate is opposite to the plurality of heat dissipation holes on the rear case of the terminal.
  • the first heat dissipation plate and the second heat dissipation plate are each provided with a plurality of third heat dissipation plates.
  • the plurality of the third heat dissipation plates on the first heat dissipation plate are disposed in parallel or not in parallel with each other.
  • the plurality of the third heat dissipation plates on the second heat dissipation plate are disposed in parallel or not in parallel with each other.
  • the plurality of the third heat dissipation plates disposed on the first heat dissipation plate are evenly arranged
  • the plurality of the third heat dissipation plates disposed on the second heat dissipation plate are also When uniformly arranged, a distance between any two adjacent third heat dissipation plates on the first heat dissipation plate and between any two adjacent third heat dissipation plates on the second heat dissipation plate The distance is the same or different.
  • the first heat dissipation plate, the second heat dissipation plate, and the plurality of the third heat dissipation plates are an integrated structure.
  • the heat dissipation structure and the terminal of the present application shorten the length of the module backplane and change the connection manner between the Heatsink and the module backplane, so that the part of the Heatsink is connected with the module backplane, so that the heat of the light strip transmitted to the Heatsink is not After the module backplane is exported, the heat transferred by the light bar to the Heatsink is directly derived from the Heatsink.
  • the heat transfer path of the heat dissipation structure can be shortened, and the heat dissipation efficiency of the heat dissipation structure can be improved.
  • Figure 1 is a cross-sectional view of a conventional heat dissipation structure embodiment
  • FIG. 2 is a cross-sectional view showing an embodiment of a heat dissipation structure of the present application
  • FIG 3 is a cross-sectional view of another embodiment of a heat dissipation structure of the present application.
  • the Heatsink includes a first heat dissipation plate 4 and a second heat dissipation plate 5, and the first heat dissipation plate 4 and the second heat dissipation plate 5 are vertically connected, and the light bar 1 is connected to the first heat dissipation plate 4, and specifically, the light bar 1 can be attached.
  • the heat generated by the light bar 1 can be transferred to the Heatsink for heat dissipation by the heat radiation of the Heatsink itself.
  • the module backplane 2 is connected to the entire Heatsink to provide support for the Heatsink, while the Heatsink transfers the heat absorbed from the light strip 1 to the module backplane 2.
  • Module back The board 2 is opposed to a plurality of heat dissipation holes A on the rear case 3 of the terminal.
  • the module backplane 2 absorbs the heat transferred by the Heatsink, while the module backplane 2 dissipates heat by the heat radiation, the air flows in from the plurality of heat dissipation holes A of the rear casing 3 of the terminal, and the heat on the module backplane 2 Take away to achieve the purpose of heat dissipation.
  • the heat transfer path is long, and the Heatsink is not closely connected to the module back plate 2, which reduces the heat dissipation efficiency of the heat dissipation structure.
  • the present application provides the following technical solutions for solving the problem that the heat transfer path is long and the Heatsink is not tightly connected with the module back plate 2 due to the conventional heat dissipation structure, The problem of heat dissipation efficiency of the heat dissipation structure.
  • the heat dissipation structure of the present embodiment may include a Heatsink, a module back plate 2, and a screw lock 6.
  • the Heatsink may include a first heat dissipation plate 4 and a second heat dissipation plate 5, and the first heat dissipation plate 4 and the second heat dissipation plate 5 are vertically connected.
  • the first heat dissipation plate 4 is also connected to the light bar 1, and specifically, the light bar 1 can be attached to the first heat dissipation plate 4.
  • the end of the second heat dissipation plate 5 away from the end of the first heat dissipation plate 4 is fixedly connected to the module back plate 2 by a screw lock 6 .
  • the end portion of the second heat dissipation plate 5 in the Heatsink that is away from the end of the first heat dissipation plate 4 is fixedly connected to the module back plate 2 by the screw lock 6 , and the module back plate 2 is Instead of directly supporting the Heatsink, the 6 pairs of Heatsink are supported by the screw lock, and the overall length of the module backplane 2 is shortened, that is, the entire Heatsink is no longer in contact with the module backplane 2, thus There is a problem that the Heatsink is not closely connected to the module backplane 2. When Heatsink absorbs heat from the light bar 1, it is no longer transferred to the module backplane 2. When air flows in from the plurality of heat dissipation holes A of the rear case 3, the heat on the Heatsink is taken away, thereby shortening Heat transfer path.
  • the heat dissipation structure of the embodiment by shortening the length of the module backplane 2 and changing the connection manner of the Heatsink and the module backplane 2, the part of the Heatsink is connected with the module backplane 2, so that the light bar 1 is transmitted to the Heatsink.
  • the heat is no longer exported through the module backplane 2, and the heat transferred from the light strip 1 to the Heatsink is directly derived by the Heatsink.
  • the heat transfer path of the heat dissipation structure can be shortened, and the heat dissipation efficiency of the heat dissipation structure can be improved.
  • the Heatsink itself is also radiated by heat radiation, and the heat radiation capability of the Heatsink is related to its own surface area, so the heat dissipation structure of the present application.
  • FIG. 3 is a cross-sectional view of another embodiment of the heat dissipation structure of the present application. As shown in FIG. 3, the heat dissipation structure of the present embodiment is further described in more detail on the basis of the embodiment shown in FIG.
  • a plurality of third heat dissipation plates 7 may be disposed on the first heat dissipation plate 4 and the second heat dissipation plate 5, thereby making Heatsink The overall surface area is increased.
  • the plurality of third heat dissipation plates 7 disposed on the first heat dissipation plate 4 may be uniformly or unevenly arranged.
  • the third heat dissipation plates 7 may be arbitrarily arranged according to actual needs, and the third heat dissipation plates 7 may be formed into different shapes, such as a rectangle or A triangle or the like, and may be composed of a mixture of different shapes of the third heat dissipation plates 7 in the Heatsink.
  • the plurality of third heat dissipation plates 7 disposed on the second heat dissipation plate 5 may be evenly or unevenly arranged.
  • the heat dissipation structure of the embodiment selectively forms the plurality of third heat dissipation plates 7 into a uniform shape, and is evenly arranged on the first heat dissipation plate 4 and the second heat dissipation plate 5.
  • the plurality of third heat dissipation plates 7 on the first heat dissipation plate 4 are disposed in parallel or not in parallel with each other.
  • a plurality of third heat dissipation plates 7 may be disposed in parallel on the same plane, or a plurality of third heat dissipation plates may be disposed on different planes.
  • the heat dissipation structure of the present embodiment is specifically described by taking a plurality of third heat dissipation plates 7 on the first heat dissipation plate 4 in parallel with each other as an example.
  • the plurality of third heat dissipation plates 7 are not parallel, The principle is the same, and will not be exemplified here.
  • the plurality of third heat dissipation plates 7 on the second heat dissipation plate 5 are arranged in parallel or not in parallel.
  • the plurality of third heat dissipation plates 7 disposed on the first heat dissipation plate 4 are evenly arranged, the plurality of third heat dissipation plates 7 disposed on the second heat dissipation plate 5 are evenly arranged.
  • the distance between any two adjacent third heat dissipation plates 7 on the first heat dissipation plate 4 is the same as or different from the distance between any adjacent two third heat dissipation plates 7 on the second heat dissipation plate 5.
  • the number of the third heat dissipation plates 7 provided according to the first heat dissipation plate 4 and the number of the third heat dissipation plates 7 disposed on the second heat dissipation plate 5 may be Same or different.
  • the distance between any two adjacent third heat dissipation plates 7 may be the same, or between any two adjacent third heat dissipation plates 7 on the first heat dissipation plate 4.
  • the distance between the two heat sinks 5 is another value, and the distance between any two adjacent third heat sinks 7 on the second heat sink 5 is another value.
  • the aluminum profile is only a partial implementation of the heat dissipation structure, and the technical solution of the embodiment does not limit other profiles having a good heat conduction effect.
  • the second heat dissipation plate 5 may be disposed opposite to the plurality of heat dissipation holes A on the rear case of the terminal. Due to the increased surface area of the Heatsink, the Heatsink can absorb more heat. When the air enters through the plurality of cooling holes A of the rear casing of the terminal, it can directly act on the second Heatsink, taking more heat and accelerating the heat. The heat dissipation efficiency of the structure.
  • the heat dissipation structure of the embodiment increases the surface area of the Heatsink by changing the structure of the Heatsink, enhances the heat radiation capability of the Heatsink, and allows the heat to be more concentrated on the Heatsink.
  • the length of the module back plate 2 is shortened, And changing the connection mode of the Heatsink and the module backboard 2, so that the part of the Heatsink is connected with the module backboard 2, when the air flows in from the cooling hole A of the rear casing of the terminal, the heat transferred from the light bar 1 to the Heatsink is no longer passed.
  • the module backplane 2 is exported, and the heat transferred from the light bar 1 to the Heatsink is directly derived by the Heatsink.
  • the present application further provides a terminal, which includes the heat dissipation structure shown in FIG. 2 or FIG. 3 above.
  • a terminal which includes the heat dissipation structure shown in FIG. 2 or FIG. 3 above.
  • the terminal of this embodiment realizes the use process in the terminal by adopting the above-mentioned heat dissipation structure. Effective heat dissipation through the heat dissipation structure.
  • the temperature of the terminal can be low, and some components in the terminal are prevented from being over-temperature, affecting the performance of the terminal, and improving the reliability of the terminal.
  • the device embodiments described above are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, ie may be located in one place. Or it can be distributed to at least two network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the embodiment. Those of ordinary skill in the art can understand and implement without deliberate labor.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)
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Abstract

一种散热结构及终端，其中散热结构包括散热器、模组背板（2）和螺丝锁附（6）；所述散热器包括第一散热板（4）和第二散热板（5）；所述第一散热板（4）与所述第二散热板（5）垂直连接，所述第一散热板（4）还与灯条（1）连接，所述第二散热板（5）远离所述第一散热板（4）一端的端部通过所述螺丝锁附（6）与所述模组背板（2）固定连接。该散热结构通过将模组背板（2）的长度缩短，并改变Heatsink与模组背板（2）的连接方式，使散热器的部分与模组背板（2）连接，使灯条（1）传递到散热器的热量不再经过模组背板（2）导出，实现了灯条（1）传递到散热器的热量直接由散热器导出，缩短散热结构的传热路径，提高了散热结构的散热效率。

Description

散热结构及终端
交叉引用
本申请引用于2015年11月13日提交的专利名称为“散热结构及终端”的第201520908563.0号中国专利申请，其通过引用被全部并入本申请。
技术领域
本申请涉及整机散热技术领域，尤其涉及一种散热结构及终端。
背景技术
手机、平板电脑和电视等终端，随着主频越来越高，功耗越来越大，其发热量也越来越高。终端的发热问题已经严重影响到用户感受，而且还容易导致硬件温度过高而烧毁智能终端的部件，所以终端的散热设计已成为行业重要课题。
现有的终端内部，通常采用导热率高的散热材料作为散热器(Heatsink)，将Heatsink分别与模组背板和灯条相接触，由Heatsink把灯条上的热量迅速导出，热量会有一部分储存到Heatsink上，由Heatsink热辐射导出，一部分热量会传导到与之接触的模组背板上，模组背板上的热量主要靠背板自身热辐射及整机后壳散热孔进入空气的对流而导出。
但是在实现本申请过程中，发明人发现现有技术中至少存在如下问题：现有技术中终端产生的热量需经过Heatsink传导到模组背板后，再由模组背板通过散热孔将热量导出，终端的传热路径较长，且Heatsink与模组背板连接不紧密，降低了散热结构的散热效率。
发明内容
本申请提供一种散热结构及终端，以解决现有技术中终端产生的热量需经过Heatsink传导到模组背板后，再由模组背板通过散热孔将热量导出，终端的传热路径较长，且Heatsink与模组背板连接不紧密，降低了散热结构的 散热效率的问题。
本申请提供一种散热结构，包括散热器、模组背板和螺丝锁附；所述散热器包括第一散热板和第二散热板；所述第一散热板与所述第二散热板垂直连接，所述第一散热板还与灯条连接，所述第二散热板远离所述第一散热板一端的端部通过所述螺丝锁附与所述模组背板固定连接。
进一步地，上述所述的散热结构中，所述第二散热板与终端的后壳上的多个散热孔相对。
进一步地，上述所述的散热结构中，所述第一散热板和所述第二散热板上均设置有多个第三散热板。
进一步地，上述所述的散热结构中，所述第一散热板上设置的多个所述第三散热板均匀或者不均匀排列；所述第二散热板上设置的多个所述第三散热板均匀或者不均匀排列。
进一步地，上述所述的散热结构中，所述第一散热板上的多个所述第三散热板相互平行设置或者不平行设置。
进一步地，上述所述的散热结构中，所述第二散热板上的多个所述第三散热板相互平行设置或者不平行设置。
进一步地，上述所述的散热结构中，当所述第一散热板上设置的多个所述第三散热板均匀排列，所述第二散热板上设置的多个所述第三散热板也均匀排列时，所述第一散热板上的任意相邻两个所述第三散热板之间的距离与所述第二散热板上的任意相邻两个所述第三散热板之间的距离相同或者不同。
进一步地，上述所述的散热结构中，所述第一散热板、所述第二散热板以及多个所述第三散热板均采用铝型材制成。
进一步地，上述所述的散热结构中，所述第一散热板、所述第二散热板以及多个所述第三散热板为一体化结构。
本申请实施例还提供一种终端，所述终端包括如上任一所述的散热结构。
本申请的散热结构及终端，通过将模组背板的长度缩短，并改变Heatsink与模组背板的连接方式，使Heatsink的部分与模组背板连接，使灯条传递到Heatsink的热量不再经过模组背板导出，实现了灯条传递到Heatsink的热量由Heatsink直接导出。采用本申请的技术方案，能够缩短散热结构的传热路径，提高了散热结构的散热效率。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为传统的散热结构实施例的剖视图；
图2为本申请散热结构一实施例的剖视图；
图3为本申请散热结构另一实施例的剖视图。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
实施例一
图1为传统的散热结构实施例的剖视图，如图1所示，该散热结构中，设定终端后壳的下方为终端的外部，则由内到外依次设置灯条1、Heatsink、模组背板2以及终端后壳3。其中Heatsink包括第一散热板4和第二散热板5，且第一散热板4与第二散热板5垂直连接，灯条1与第一散热板4连接，具体的可以将灯条1贴附在第一散热板4上，使灯条1产生的热量可以传递到Heatsink上，通过Heatsink自身的热辐射进行散热。模组背板2与整个Heatsink连接，从而可以对Heatsink提供支撑力，同时，Heatsink会将从灯条1吸收的热量再传递到模组背板2上。模组背 板2与终端后壳3上的多个散热孔A相对。当模组背板2吸收Heatsink传递的热量后，在模组背板2通过热辐射进行散热的同时，空气从终端后壳3的多个散热孔A流入，将模组背板2上的热量带走，从而达到散热的目的。但是，在该散热结构中，传热路径较长，且Heatsink与模组背板2连接不紧密，降低了撒热结构的散热效率。
鉴于上述问题，在传统的散热结构的基础上，本申请提供了如下技术方案，用来解决由于传统的散热结构中，传热路径较长，且Heatsink与模组背板2连接不紧密，降低了散热结构的散热效率的问题。
图2为本申请散热结构一实施例的剖视图，如图2所示，本实施例的散热结构可以包括Heatsink、模组背板2和螺丝锁附6。其中Heatsink可以包括第一散热板4和第二散热板5，且第一散热板4与第二散热板5垂直连接。第一散热板4还与灯条1连接，具体的可以将灯条1贴附在第一散热板4上。第二散热板5远离第一散热板4一端的端部通过螺丝锁附6与模组背板2固定连接。
具体地，本实施例的散热结构中，由于Heatsink中的第二散热板5的远离第一散热板4一端的端部通过螺丝锁附6与模组背板2固定连接，模组背板2不再直接对Heatsink提供支撑力，而是通过螺丝锁附6对Heatsink提供支撑力，同时缩短了模组背板2的整体长度，即Heatsink的整体不再与模组背板2接触，从而不再存在Heatsink与模组背板2连接不紧密的问题。当Heatsink从灯条1吸收的热量后，不会再传递到模组背板2上，当空气从终端后壳3的多个散热孔A流入时，将Heatsink上的热量带走，从而缩短了传热路径。
本实施例的散热结构，通过将模组背板2的长度缩短，并改变Heatsink与模组背板2的连接方式，使Heatsink的部分与模组背板2连接，使灯条1传递到Heatsink的热量不再经过模组背板2导出，实现了灯条1传递到Heatsink的热量由Heatsink直接导出。采用本实施例的技术方案，能够缩短散热结构的传热路径，提高了散热结构的散热效率。
上述实施例的散热结构中，Heatsink自身也会通过热辐射进行散热，而Heatsink的热辐射能力与自身的表面积相关，因此本申请的散热结构 还提供以下技术方案。
图3为本申请散热结构另一实施例的剖视图，如图3所示，本实施例的散热结构在图2所示实施例的基础上，进一步更加详细地对本申请的技术方案进行描述。
如图3所示，本实施例的散热结构中，为了提高Heatsink的热辐射能力，可以在第一散热板4和第二散热板5上均设置有多个第三散热板7，从而使Heatsink的整体表面积增加。具体地，可以将第一散热板4上设置的多个第三散热板7均匀或者不均匀排列。例如，在第一散热板4以上设置多个第三散热板7时，可以根据实际需要，将第三散热板7任意排列，且可以将第三散热板7做成不同的形状，如长方形或三角形等，且在该Heatsink中可以由不同形状的第三散热板7混合组成。同理，也可以将第二散热板5上设置的多个第三散热板7均匀或者不均匀排列。但为了Heatsink的美观，本实施例的散热结构可选地将多个第三散热板7制作成统一形状，且均匀排列在第一散热板4以及第二散热板5上。
进一步可选地，本实施例的散热结构中，第一散热板4上的多个第三散热板7相互平行设置或者不平行设置。例如，可以将多个第三散热板7在同一平面上平行设置，也可以将多个第三个散热板设置在不同的平面。本实施例的散热结构，具体以第一散热板4上的多个第三散热板7相互平行设置为例对本申请的技术方案进行描述，当多个第三撒热版7不平行时，其原理相同，在此不再一一举例说明。同理，本实施例的散热结构中，第二散热板5上的多个第三散热板7平行设置或者不平行设置，详细请参考上述记载，在此不再赘述。
进一步可选地，本实施例的散热结构中，当第一散热板4上设置的多个第三散热板7均匀排列，第二散热板5上设置的多个第三散热板7也均匀排列时，第一散热板4上的任意相邻两个第三散热板7之间的距离与第二散热板5上的任意相邻两个第三散热板7之间的距离相同或者不同。例如，由于第一散热板4与第二散热板5的长度不同，因此可以根据第一散热板4设置的第三散热板7的数量与第二散热板5设置的第三散热板7的数量相同或者不同。当多个第三散热板7均匀且平行地设置在第一散热板 4和第二散热板5上时，可以使任意相邻的两个第三散热板7之间的距离相同，也可以第一散热板4上的任意相邻两个第三散热板7之间的距离为一个数值，而第二散热板5上的任意相邻两个第三散热板7之间的距离为另一个数值。
进一步可选地，本实施例的散热结构中，第一散热板4、第二散热板5以及多个第三散热板7均采用铝型材制成，且可以将第一散热板4、第二散热板5以及多个第三散热板7设置为一体化结构。例如，由于铝型材的导热性比较良好，因此可以选择铝型材作为散热结构的材料，且可以通过注塑和机加工等工艺，在制作散热机构时，将第一散热板4、第二散热板5以及多个第三散热板7制作为一体化结构。
需要说明的是，上述铝型材只是散热结构的部分实现方式，本实施例的技术方案，不限制其它具有良好导热效果的型材。
进一步可选地，本实施例的散热结构中，可以将第二散热板5与终端的后壳上的多个散热孔A相对设置。由于Heatsink的表面积增大，使Heatsink能够吸收更多的热量，当空气通过终端后壳的多个散热孔A进入后，可以直接作用在第二Heatsink上，带走更多的热量，加快撒热结构的散热效率。
本实施例的散热结构，通过改变Heatsink的结构，增加了Heatsink的表面积，增强了Heatsink的热辐射能力，使热量更多的集中到Heatsink上，同时，由于将模组背板2的长度缩短，并改变Heatsink与模组背板2的连接方式，使Heatsink的部分与模组背板2连接，当空气由终端后壳的散热孔A流入时，使灯条1传递到Heatsink的热量不再经过模组背板2导出，实现了灯条1传递到Heatsink的热量由Heatsink直接导出。采用本实施例的技术方案，能够提高Heatsink的热辐射能力，缩短散热结构的传热路径，提高了散热结构的散热效率。
实施例二
本申请还提供一种终端，该终端包括上述图2或图3所示的散热结构，详细可以参考上述实施例的相关记载，在此不再赘述。
本实施例的终端，通过采用上述撒热结构，实现了在终端使用过程中 能够通过散热结构有效的散热。采用本实施例的技术方案，能够使终端的温度较低，避免了终端中部分部件因温度过高，影响终端的性能，提高了终端的可靠性。
以上所描述的装置实施例仅仅是示意性的，其中作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到至少两个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。本领域普通技术人员在不付出创造性的劳动的情况下，即可以理解并实施。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (10)

  1. 一种散热结构，其特征在于，包括散热器、模组背板和螺丝锁附；所述散热器包括第一散热板和第二散热板；所述第一散热板与所述第二散热板垂直连接，所述第一散热板还与灯条连接，所述第二散热板远离所述第一散热板一端的端部通过所述螺丝锁附与所述模组背板固定连接。
  2. 根据权利要求1所述的散热结构，其特征在于，所述第二散热板与终端的后壳上的多个散热孔相对。
  3. 根据权利要求2所述的散热结构，其特征在于，所述第一散热板和所述第二散热板上均设置有多个第三散热板。
  4. 根据权利要求3所述的散热结构，其特征在于，所述第一散热板上设置的多个所述第三散热板均匀或者不均匀排列；所述第二散热板上设置的多个所述第三散热板均匀或者不均匀排列。
  5. 根据权利要求4所述的散热结构，其特征在于，所述第一散热板上的多个所述第三散热板相互平行设置或者不平行设置。
  6. 根据权利要求5所述的散热结构，其特征在于，所述第二散热板上的多个所述第三散热板相互平行设置或者不平行设置。
  7. 根据权利要求6所述的散热结构，其特征在于，当所述第一散热板上设置的多个所述第三散热板均匀排列，所述第二散热板上设置的多个所述第三散热板也均匀排列时，所述第一散热板上的任意相邻两个所述第三散热板之间的距离与所述第二散热板上的任意相邻两个所述第三散热板之间的距离相同或者不同。
  8. 根据权利要求7所述的散热结构，其特征在于，所述第一散热板、所述第二散热板以及多个所述第三散热板均采用铝型材制成。
  9. 根据权利要求3-8任一所述的散热结构，其特征在于，所述第一散热板、所述第二散热板以及多个所述第三散热板为一体化结构。
  10. 一种终端，其特征在于，所述终端包括如上权利要求1-9任一所述的散热结构。
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