WO2017066069A8 - Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition - Google Patents

Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition Download PDF

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Publication number
WO2017066069A8
WO2017066069A8 PCT/US2016/055655 US2016055655W WO2017066069A8 WO 2017066069 A8 WO2017066069 A8 WO 2017066069A8 US 2016055655 W US2016055655 W US 2016055655W WO 2017066069 A8 WO2017066069 A8 WO 2017066069A8
Authority
WO
WIPO (PCT)
Prior art keywords
metal
electroless
phosphaadamantanes
stabilizers
water soluble
Prior art date
Application number
PCT/US2016/055655
Other languages
French (fr)
Other versions
WO2017066069A1 (en
Inventor
Stefan Schafer
Katrin SÖNTGERATH
Marlies Kleinfeld
Original Assignee
Macdermid Enthone Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Enthone Inc. filed Critical Macdermid Enthone Inc.
Priority to US15/765,637 priority Critical patent/US20190085461A1/en
Priority to CN201680059667.6A priority patent/CN108495952A/en
Priority to KR1020187013527A priority patent/KR20180089398A/en
Publication of WO2017066069A1 publication Critical patent/WO2017066069A1/en
Publication of WO2017066069A8 publication Critical patent/WO2017066069A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Abstract

The present invention relates to the use of water soluble and air stable phosphaadamantanes as stabilizers in electrolytes for electroless metal deposition. An electrolyte, as well as a method for the electroless deposition of metals is disclosed. The plated metal layers can comprise nickel, copper, cobalt, boron, silver, palladium or gold, as well as alloys comprising at least one of the aforementioned metals as an alloying metal. The present invention further relates to an organic stabilizer for electroless plating processes, and an electrolyte for the electroless deposition of a metal layer on a substrate, comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, a stabilizer and preferably an accelerator. A method for the electroless deposition of a metal layer on a surface from an electrolyte according to the invention is also disclosed.
PCT/US2016/055655 2015-10-13 2016-10-06 Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition WO2017066069A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/765,637 US20190085461A1 (en) 2015-10-13 2016-10-06 Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition
CN201680059667.6A CN108495952A (en) 2015-10-13 2016-10-06 As the water solubility of electroless metal deposition stabilizer and the phospha-adamantane of air-stable
KR1020187013527A KR20180089398A (en) 2015-10-13 2016-10-06 The water-soluble and air-stable phosphaadamantane as a stabilizer for electroless metal plating

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB15189465.6 2015-10-13
EP15189465.6 2015-10-13
EP15189465.6A EP3156517B1 (en) 2015-10-13 2015-10-13 Use of water soluble and air stable phosphaadamantanes as stabilizer in electrolytes for electroless metal deposition

Publications (2)

Publication Number Publication Date
WO2017066069A1 WO2017066069A1 (en) 2017-04-20
WO2017066069A8 true WO2017066069A8 (en) 2018-07-19

Family

ID=54324851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/055655 WO2017066069A1 (en) 2015-10-13 2016-10-06 Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition

Country Status (7)

Country Link
US (1) US20190085461A1 (en)
EP (1) EP3156517B1 (en)
KR (1) KR20180089398A (en)
CN (1) CN108495952A (en)
ES (1) ES2712858T3 (en)
TW (1) TW201718938A (en)
WO (1) WO2017066069A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646215B (en) * 2017-11-03 2019-01-01 陳始明 Electroless metal plating appratus and method thereof
CN109457238B (en) * 2018-08-30 2021-01-15 上海昕沐化学科技有限公司 High-speed stable chemical copper plating solution and preparation method thereof
JP7228411B2 (en) * 2019-03-06 2023-02-24 上村工業株式会社 Electroless gold plating bath

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2178146C (en) 1995-06-06 2002-01-15 Mark W. Zitko Electroless nickel cobalt phosphorous composition and plating process
JP3816241B2 (en) * 1998-07-14 2006-08-30 株式会社大和化成研究所 Aqueous solution for reducing and precipitating metals
DE10015214C1 (en) * 2000-03-27 2002-03-21 Infineon Technologies Ag Process for metallizing an insulator and / or a dielectric
DE10246453A1 (en) 2002-10-04 2004-04-15 Enthone Inc., West Haven Electrolyte used in process for high speed electroless plating with nickel film having residual compressive stress is based on nickel acetate and also contains reducing agent, chelant, accelerator and stabilizer
JP2005290415A (en) 2004-03-31 2005-10-20 Okuno Chem Ind Co Ltd Electroless copper-plating solution
JP5247142B2 (en) 2007-12-19 2013-07-24 株式会社大和化成研究所 Silver plating method
CN101348927B (en) 2008-09-05 2010-10-06 江南机器（集团）有限公司 Non-cyanide copper plating solution
GB2467163B (en) * 2009-01-26 2013-11-06 Rhodia Operations Ligands
PL2449148T3 (en) * 2009-07-03 2019-06-28 Macdermid Enthone Inc. Beta-amino acid comprising electrolyte and method for the deposition of a metal layer

Also Published As

Publication number Publication date
US20190085461A1 (en) 2019-03-21
KR20180089398A (en) 2018-08-08
WO2017066069A1 (en) 2017-04-20
EP3156517B1 (en) 2018-12-05
EP3156517A1 (en) 2017-04-19
TW201718938A (en) 2017-06-01
EP3156517A8 (en) 2017-06-07
ES2712858T3 (en) 2019-05-16
CN108495952A (en) 2018-09-04

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