WO2017016053A1 - Performance test method for optical switch chip - Google Patents

Performance test method for optical switch chip Download PDF

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WO2017016053A1
WO2017016053A1 PCT/CN2015/089212 CN2015089212W WO2017016053A1 WO 2017016053 A1 WO2017016053 A1 WO 2017016053A1 CN 2015089212 W CN2015089212 W CN 2015089212W WO 2017016053 A1 WO2017016053 A1 WO 2017016053A1
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tested
optical
optical switch
input
switch chip
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PCT/CN2015/089212
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French (fr)
Chinese (zh)
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赵元力
武保剑
廖明乐
耿勇
周星宇
文峰
邱昆
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电子科技大学
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems

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  • the invention belongs to the technical field of optical communication, and in particular relates to a performance testing method for an optical switching chip.
  • optical switching matrix unit is the core of the optical switching node technology and is usually composed of multiple 2x2 switches.
  • the silicon-based optical switching chip module is the implementation of the optical switching matrix unit at the chip level, which is in line with the integrated development trend of optical communication devices, and has received more and more attention.
  • the popular optical switching matrix chip is based on a micro-ring resonator optical switch unit or a Mach-Zehnder optical switch unit.
  • the optical switch chip can perform optical routing and switching at high speed and dynamic, and the exchange scale has reached 16 ⁇ 16. the above.
  • the design, processing, fabrication, packaging, testing and other aspects of the optical switch chip module jointly determine the performance of the optical switch chip.
  • there is no unified test method and the optical switch chip can be used like the fiber communication system performance test method.
  • the main performance parameters are all given; the test methods for most performance parameters follow the traditional method and are not targeted.
  • the measurement is performed by turning off the input signal of the optical path to be tested, and the influence of the coherent effect to be considered in the optical switch chip is not taken into account, and the performance of the optical switch chip during normal operation cannot be objectively evaluated;
  • the test method also fails to directly link the spectral characteristics of the optical switch chip with the extinction ratio, and cannot accurately give the working bandwidth of the optical switch chip.
  • the performance of the optical switch chip depends largely on the performance of the circuit. Due to the small size of the optical switch chip, the drive or control circuit is very demanding; how to realize the stability of the circuit in the optical domain is also A challenging question.
  • the object of the present invention is to provide an optical switch chip performance test method for the shortcomings of the existing optical switch chip test method, which is suitable for testing various optical switch chip modules, and is particularly suitable for testing an optical switch chip based on a micro ring resonator.
  • the test method provided by the present invention is the design development and mode of the optical switch chip. Block testing, performance testing and other links provide effective testing methods and evaluation basis, greatly improving the scientific nature of chip testing.
  • the input end and the output end have a one-to-one correspondence in the working state of the optical switch chip, and therefore the test method of the present invention is also directed to a specified set of input and output ports to be tested.
  • the specific technical solution is: an optical switch chip performance test method, including the following steps:
  • Step 1 Initialize the switch unit configuration state of the optical switch chip to be tested: specify the input and output ports to be tested for any group of optical switch chips to be tested, and the “on” state is defined as establishing between the input port to be tested and the output port to be tested.
  • the state of the connected optical path, and vice versa is the "off" state;
  • the definition of "single port input” means that only the input port of the input port is to be input, and the "multiport input” means that there is one or more input ports besides the input port to be tested.
  • Input optical signal at the same time, all input port input optical signals are optical signals of equal power;
  • Step 3 In the "multi-port input” state, configure the optical switch chip to be tested to be in the "on” state, and measure the output optical spectrum curve of the output port to be tested.
  • the optical switch chip to be tested is configured to be in an "off” state. At this time, the output port of the output to be tested and the input terminal are in an "off” state, and the output light spectrum curve of the output port to be tested is measured. And calculate the corresponding extinction ratio curve: The extinction ratio curve is in dB. with By with Unit conversion is obtained;
  • Step 4 Calculate the output optical power gain curve of the output to be tested under the “off” state of the optical switch chip to be tested:
  • the gain curve is in dB;
  • Step 5 Calculate the crosstalk performance of the optical switch chip to be tested under the "on" state of the optical switch chip to be tested: CT dB (f) ⁇ 10 lg (G 0dB + ⁇ ER dB ) - 6.378, where
  • the method for measuring the output light spectrum curve of the output port to be tested under different states in steps 2 and 3 is: using a broad spectrum light source of a specified spectral width, obtaining a spectrum curve once by the spectrum analyzer; or by setting a scan
  • the laser continuously outputs an optical signal of a specified spectral width, and each of the optical signals is received by the optical power meter
  • the optical power of the frequency component is finally superimposed to obtain a spectrum curve.
  • the corresponding operating wavelength range, ie the operating bandwidth, helps to optimize the performance of the switching chip module.
  • the power spectrum of the "on” and “off” states is compared at each wavelength or frequency point, and the wavelength (frequency) dependence curve of the extinction ratio is obtained, that is, the extinction ratio curve
  • the extinction ratio curve reflects the relationship between the extinction ratio and the wavelength (frequency) when the optical switching chip is switched from the specified "on” state to the specified "off” state; the bandwidth ratio of the switching chip can also be quantitatively measured by the extinction ratio curve. It is convenient to select a suitable modulation signal for transmission.
  • all input port input optical signals are equal-power optical signals
  • the power gain curve is obtained by comparing the "multi-port input” and “single-port input” state spectrum curves in the "off” state.
  • the crosstalk of the optical switching chip can be obtained as a function of the operating wavelength (frequency). Due to the very small size of the optical switch chip waveguide structure, the input optical signal will be multi-path switch coupled in the chip, especially in the case of multi-port input, not only the superposition of crosstalk power but also the coherent superposition of crosstalk is easily caused.
  • the micro-ring resonator and the Mach-Zehnder interference structure switch chip are particularly obvious; the crosstalk test method provided by the present invention can take into consideration the inevitable interference factors in the switch chip, and the test result is more in line with the actual situation.
  • the extinction ratio curve after multiple measurements is superimposed, and "jitter" phenomenon occurs.
  • the optical switch chip performance test method provided by the present invention can comprehensively measure the main performance parameters of the optical switch chip, such as extinction ratio, crosstalk, optical signal to noise ratio, bandwidth and jitter, like the performance test method of the optical fiber communication system.
  • the spectrum shape factor, etc. can provide a unified test method for the design, processing, fabrication, packaging, testing and other aspects of the optical switch chip module, and is highly targeted.
  • the traditional method often needs to turn on and off the signal light for the convenience of testing, such a measured crosstalk knot.
  • the interaction between the signal light and the crosstalk is not taken into consideration, and is different from the actual working state of the chip; and the crosstalk measurement method of the present invention always performs measurement under the condition that the optical signal to be measured is always present, and the optical exchange
  • the actual working conditions of the chip are consistent, which can objectively reflect the performance of the optical switch chip during normal operation, and the measured chip bandwidth is always associated with performance parameters such as extinction ratio.
  • the transmission performance of the optical switch chip is closely related to the stability of the drive or control circuit.
  • the method for testing the performance of the optical switch chip module disclosed in the present invention can also be used to test the stability of the circuit, that is, evaluate the noise characteristics of the circuit in the optical domain.
  • FIG. 1 is a schematic flow chart of a method for testing performance of an optical switch chip according to the present invention
  • Figure 3 is an extinction ratio versus frequency curve obtained from the spectrum eye diagram of Figure 2 in the embodiment
  • Figure 4 is a graph showing the measured crosstalk as a function of frequency in the embodiment
  • Figure 5 is an extinction ratio curve measured in the embodiment with a certain jitter width.
  • a 4 ⁇ 4 optical switch chip is used as the optical switch chip to be tested, and the switch unit of the optical switch chip is composed of a Mach-Zehnder interference type 2 ⁇ 2 optical switch unit, and can be driven by an external control circuit.
  • the switching state of each switching unit is controlled by applying a bias voltage to the pin and nin electrodes in the optical switching chip, thereby controlling the optical switching state of the entire optical switching chip.
  • Step 1 Initialize the switch unit configuration state of the optical switch chip.
  • the temperature control circuit controls the n-i-n electrode to stabilize the initial working state of the optical switch chip, and the p-i-n electrode is used to drive the working state of each switch unit in the optical switch chip; and the optical switch chip completes the optical switching function.
  • the "on" state indicates that an optical path is established between the input and output ports
  • the "off" state indicates that no optical path is established between the input and output ports; the corresponding switching state is configured.
  • any corresponding input/output port can be in the "on” or "off” state.
  • Step 2 In the "single port input" state, measure the output light spectrum curve P(f) of the output port in a given exchange state; by setting the scanning laser, continuously output a group of signals having the same optical power in a certain frequency range. Light, and adjust the polarization controller to input signal light to the optical switch chip; at the output port, measure the optical power corresponding to each scanning frequency point by the optical power meter; and collect the output optical power and the scanning wavelength (frequency) Correspondingly, it is the curve of the output optical power as a function of the scanning wavelength (frequency).
  • the measured spectrum curve may be represented by P 1 (f); the switching state of the optical switch chip may be changed by the switch driving circuit, that is, the test is to be performed.
  • the input/output port changes from “on” to "off”.
  • the same measurement process is used to obtain the relationship P 0 (f) of the output optical power as a function of the scanning wavelength (frequency).
  • the spectrum curves obtained in the above "on” and “light” states are displayed in the same window, and a spectrum eye diagram as shown in FIG. 2 is obtained. It is similar to the eye diagram produced by the communication signal analyzer, but with different abscissas.
  • a number of performance parameters associated with the optical switching chip can be obtained by the spectral eye diagram, and the upper and lower opening degrees of the "eye” in the spectral eye diagram correspond to the extinction ratio at the corresponding operating wavelength (frequency). Therefore, the spectrum eye diagram can intuitively observe the switching performance of the optical switching chip, and can even be used to adjust the working state of the switch driving circuit or the switching bias circuit.
  • the corresponding extinction ratio curve is shown in Figure 3, in dB.
  • the performance parameters of the optical switch chip can be quantitatively determined, thereby optimizing the exchange state of the optical switch chip, and obtaining an operating bandwidth range that satisfies the extinction ratio requirement.
  • Step 3 Perform the same test on the “multiport input” state and get the final crosstalk performance based on the test results of single port and multi port. It should be noted that when “multi-port input” is used, when the specified input/output port to be tested is tested in the “off” state, the output port cannot form an “on” state with other input ports. The specified spectral curve of the input/output port to be tested in the "on” and “off” states is recorded as with The corresponding extinction ratio curve is
  • Step 4 In the "off" state, the relationship between the output optical power at "single port input” and “multiport input” is the optical power gain. Said.
  • Step 5 According to the "single port input” and “multi-port input”, the optical power gain curve and the extinction ratio curve in the "off” state can be determined when the designated input/output port is in the "on” state.
  • Crosstalk performance :
  • the switch extinction ratio of the optical switch chip in various exchange states and the corresponding working bandwidth are directly obtained according to the extinction ratio curve; the switch measured according to the single port input and the multi port input case The extinction ratio and the optical power gain in the "off" state are calculated to measure the crosstalk performance of the optical switch chip; the measured optical signal-to-noise ratio and bandwidth jitter are calculated according to the jitter characteristics of the extinction ratio curve.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
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Abstract

The present invention belonging to the technical filed of the optical communications provides a performance test method for optical switch chip. By measuring the frequency spectrum transmission characteristics between input ports and output ports of an optical switch chip module, obtaining spectral eye patterns of the optical switch chip module in single-port input and multi-port input states respectively, and calculating the optical power gain or the extinction ratio curve, the present invention can visually observe and quantitatively determine performance parameters such as extinction ratio, crosstalk, optical signal-to-noise ratio, bandwidth, jitter, spectral shape factor of the optical switch chip in each optical switch state. The present invention is suitable for testing various optical switch chip modules, especially suitable for testing the optical switch chip based on micro-ring resonator. The test method of the present invention offers effective test means and evaluation basis for design and development, modular encapsulation, performance test and other periods of optical switch chip, and improves the scientificalness of chip test greatly.

Description

一种光交换芯片性能测试方法Optical switch chip performance test method 技术领域Technical field
本发明属于光通信技术领域，具体涉及一种光交换芯片性能测试方法。The invention belongs to the technical field of optical communication, and in particular relates to a performance testing method for an optical switching chip.
背景技术Background technique
现代通信网中，先进的光纤通信技术以其高速，带宽的明显特征而为世人所瞩目。实现灵活智能的、具有高度生存性的大容量全光交换网络是下一代光纤通信网络的发展目标，主要依赖于光交换技术的演进。光交换矩阵单元是光交换节点技术的核心，通常由多个2×2开关组成。光交换矩阵单元的构建方式有多种，其中硅基光交换芯片模块是光交换矩阵单元在芯片层面上的实现，符合光通信器件的集成化发展趋势，越来越受到人们的重视。In modern communication networks, advanced optical fiber communication technology has attracted worldwide attention for its high speed and bandwidth characteristics. Achieving flexible, intelligent, and highly survivable high-capacity all-optical switching networks is the development goal of next-generation optical fiber communication networks, and relies mainly on the evolution of optical switching technologies. The optical switching matrix unit is the core of the optical switching node technology and is usually composed of multiple 2x2 switches. There are many ways to construct the optical switching matrix unit. The silicon-based optical switching chip module is the implementation of the optical switching matrix unit at the chip level, which is in line with the integrated development trend of optical communication devices, and has received more and more attention.
目前，比较流行的光交换矩阵芯片是基于微环谐振器光开关单元或马赫-曾德尔光开关单元构建的，光交换芯片能够高速动态地进行光路由选择和切换，交换规模已经达到16×16以上。光交换芯片模块的设计、加工、制作、封装、测试等诸多环节共同决定了光交换芯片的性能优劣，目前还没有统一的测试方法，能够像光纤通信***性能测试方法那样将光交换芯片的主要性能参数全部给出；多数性能参数的测试方法沿用了传统方法，没有针对性。例如，在串扰的测量中，采用关断待测光路输入信号的方式进行测量，没有考虑到光交换芯片中需要考虑的相干效应的影响，不能客观地评价光交换芯片正常工作时的性能；传统的测试方法也没能将光交换芯片的频谱特性与消光比等性能直接联系起来，不能准确地给出光交换芯片的工作带宽。另一方面，光交换芯片的性能很大程度上依赖于电路的性能，由于光交换芯片的尺寸微小，对驱动或控制电路要求很高；如何能够在光域上体现出电路的稳定性，也是一个具有挑战性的问题。At present, the popular optical switching matrix chip is based on a micro-ring resonator optical switch unit or a Mach-Zehnder optical switch unit. The optical switch chip can perform optical routing and switching at high speed and dynamic, and the exchange scale has reached 16×16. the above. The design, processing, fabrication, packaging, testing and other aspects of the optical switch chip module jointly determine the performance of the optical switch chip. At present, there is no unified test method, and the optical switch chip can be used like the fiber communication system performance test method. The main performance parameters are all given; the test methods for most performance parameters follow the traditional method and are not targeted. For example, in the measurement of crosstalk, the measurement is performed by turning off the input signal of the optical path to be tested, and the influence of the coherent effect to be considered in the optical switch chip is not taken into account, and the performance of the optical switch chip during normal operation cannot be objectively evaluated; The test method also fails to directly link the spectral characteristics of the optical switch chip with the extinction ratio, and cannot accurately give the working bandwidth of the optical switch chip. On the other hand, the performance of the optical switch chip depends largely on the performance of the circuit. Due to the small size of the optical switch chip, the drive or control circuit is very demanding; how to realize the stability of the circuit in the optical domain is also A challenging question.
发明内容Summary of the invention
本发明的目的在于针对现有光交换芯片测试方法的缺点提供一种光交换芯片性能测试方法，适用于各种光交换芯片模块进行测试，特别适合测试基于微环谐振器的光交换芯片。本发明提供的测试方法为光交换芯片的设计开发、模 块化封装、性能测试等环节提供了有效的测试手段和评价依据，大大提高了芯片测试的科学性。The object of the present invention is to provide an optical switch chip performance test method for the shortcomings of the existing optical switch chip test method, which is suitable for testing various optical switch chip modules, and is particularly suitable for testing an optical switch chip based on a micro ring resonator. The test method provided by the present invention is the design development and mode of the optical switch chip. Block testing, performance testing and other links provide effective testing methods and evaluation basis, greatly improving the scientific nature of chip testing.
本发明的技术方案中，首先说明的是光交换芯片的工作状态中输入端与输出端为一一对应，因而本发明所述的测试方法也是针对一组指定的待测输入、输出端口进行说明的，具体技术方案为：一种光交换芯片性能测试方法，包括以下步骤：In the technical solution of the present invention, firstly, the input end and the output end have a one-to-one correspondence in the working state of the optical switch chip, and therefore the test method of the present invention is also directed to a specified set of input and output ports to be tested. The specific technical solution is: an optical switch chip performance test method, including the following steps:
步骤1.初始化待测光交换芯片的开关单元配置状态：针对待测光交换芯片任一组指定待测输入、输出端口，“开”状态定义为待测输入端口与待测输出端口之间建立连通光路的状态，反之为“关”状态；同时定义“单端口输入”表示仅有待测输入端口输入光信号，“多端口输入”表示除待测输入端口外还有一个或一个以上输入端口输入光信号；同时，所有输入端口输入光信号为等功率的光信号； Step 1. Initialize the switch unit configuration state of the optical switch chip to be tested: specify the input and output ports to be tested for any group of optical switch chips to be tested, and the “on” state is defined as establishing between the input port to be tested and the output port to be tested. The state of the connected optical path, and vice versa is the "off" state; the definition of "single port input" means that only the input port of the input port is to be input, and the "multiport input" means that there is one or more input ports besides the input port to be tested. Input optical signal; at the same time, all input port input optical signals are optical signals of equal power;
步骤2.在“单端口输入”状态下，配置待测光交换芯片为“开”状态，测量得待测输出端口的输出光频谱曲线P1(f)；再配置待测光交换芯片为“关”状态，测量得待测输出端口的输出光频谱曲线P0(f)；并计算相应消光比曲线：ERdB＝P1dB(f)-P0dB(f)，该消光比曲线以dB为单位，P1dB(f)和P0dB(f)分别由P1(f)和P0(f)单位转换得到； Step 2. In the "single port input" state, set the optical switch chip to be tested to the "on" state, measure the output optical spectrum curve P 1 (f) of the output port to be tested; and then configure the optical switch chip to be tested as " Off state, measuring the output light spectrum curve P 0 (f) of the output port to be tested; and calculating the corresponding extinction ratio curve: ER dB = P 1dB (f) - P 0dB (f), the extinction ratio curve is in dB Units, P 1dB (f) and P 0dB (f) are converted from P 1 (f) and P 0 (f) units, respectively;
步骤3.在“多端口输入”状态下，配置待测光交换芯片为“开”状态，测量得待测输出端口的输出光频谱曲线
Figure PCTCN2015089212-appb-000001
再配置待测光交换芯片为“关”状态，此时保持待测输出端口与所有输入端之间为“关”状态，测量得待测输出端口的输出光频谱曲线
Figure PCTCN2015089212-appb-000002
并计算相应消光比曲线：
Figure PCTCN2015089212-appb-000003
该消光比曲线以dB为单位，
Figure PCTCN2015089212-appb-000004
和
Figure PCTCN2015089212-appb-000005
分别由
Figure PCTCN2015089212-appb-000006
和
Figure PCTCN2015089212-appb-000007
单位转换得到；Step 3. In the "multi-port input" state, configure the optical switch chip to be tested to be in the "on" state, and measure the output optical spectrum curve of the output port to be tested.
Figure PCTCN2015089212-appb-000001
The optical switch chip to be tested is configured to be in an "off" state. At this time, the output port of the output to be tested and the input terminal are in an "off" state, and the output light spectrum curve of the output port to be tested is measured.
Figure PCTCN2015089212-appb-000002
And calculate the corresponding extinction ratio curve:
Figure PCTCN2015089212-appb-000003
The extinction ratio curve is in dB.
Figure PCTCN2015089212-appb-000004
with
Figure PCTCN2015089212-appb-000005
By
Figure PCTCN2015089212-appb-000006
with
Figure PCTCN2015089212-appb-000007
Unit conversion is obtained;
步骤4.计算待测光交换芯片为“关”状态下，待测输出端的输出光功率增益曲线：
Figure PCTCN2015089212-appb-000008
该增益曲线以dB为单位； Step 4. Calculate the output optical power gain curve of the output to be tested under the “off” state of the optical switch chip to be tested:
Figure PCTCN2015089212-appb-000008
The gain curve is in dB;
步骤5.计算待测光交换芯片为“开”状态下，待测光交换芯片的串扰性能：CTdB(f)≈10lg(G0dB+ΔERdB)-6.378，其中，
Figure PCTCN2015089212-appb-000009
 Step 5. Calculate the crosstalk performance of the optical switch chip to be tested under the "on" state of the optical switch chip to be tested: CT dB (f) ≈ 10 lg (G 0dB + ΔER dB ) - 6.378, where
Figure PCTCN2015089212-appb-000009
在本发明中，步骤2、3中测量待测输出端口在不同状态下的输出光频谱曲线的方法为：采用指定谱宽的宽谱光源，通过光谱分析仪一次获得频谱曲线；或者通过设置扫描激光器连续输出指定谱宽的光信号，利用光功率计接收每个 频率分量的光功率，最后叠加得到频谱曲线。将“开”、“关”状态下的频谱曲线叠加在同一个坐标系中即可得到类似于通信信号分析仪眼图的频谱图像，即频谱眼图；频谱眼图的上下张开度对应于相应工作波长处的消光比，据此能够直观地观察光交换芯片的驱动或控制状态；另外实现多波长信号的交换功能时，根据频谱眼图能够得到该光交换芯片处于特定交换状态下所需消光比对应的工作波长范围，即工作带宽，有助于优化交换芯片模块的性能。In the present invention, the method for measuring the output light spectrum curve of the output port to be tested under different states in steps 2 and 3 is: using a broad spectrum light source of a specified spectral width, obtaining a spectrum curve once by the spectrum analyzer; or by setting a scan The laser continuously outputs an optical signal of a specified spectral width, and each of the optical signals is received by the optical power meter The optical power of the frequency component is finally superimposed to obtain a spectrum curve. By superimposing the spectrum curves in the "on" and "off" states in the same coordinate system, a spectrum image similar to the eye diagram of the communication signal analyzer, that is, a spectrum eye diagram is obtained; the upper and lower opening degrees of the spectrum eye diagram correspond to the corresponding work. The extinction ratio at the wavelength, according to which the driving or control state of the optical switch chip can be visually observed; and when the multi-wavelength signal exchange function is realized, the extinction ratio of the optical switch chip in a specific exchange state can be obtained according to the spectrum eye diagram. The corresponding operating wavelength range, ie the operating bandwidth, helps to optimize the performance of the switching chip module.
根据所得到的频谱眼图，在每个波长或频点上对“开”、“关”状态下的频谱曲线进行功率比较，可得消光比的波长(频率)依赖曲线，即为消光比曲线；消光比曲线反映了光交换芯片由指定“开”状态转换到指定“关”状态时的消光比随波长(频率)的变换关系；通过消光比曲线还能够定量地测量交换芯片的带宽容量，便于选择合适的调制信号进行传输。According to the obtained spectrum eye diagram, the power spectrum of the "on" and "off" states is compared at each wavelength or frequency point, and the wavelength (frequency) dependence curve of the extinction ratio is obtained, that is, the extinction ratio curve The extinction ratio curve reflects the relationship between the extinction ratio and the wavelength (frequency) when the optical switching chip is switched from the specified "on" state to the specified "off" state; the bandwidth ratio of the switching chip can also be quantitatively measured by the extinction ratio curve. It is convenient to select a suitable modulation signal for transmission.
本发明中，所有输入端口输入光信号为等功率的光信号，将“关”状态下的“多端口输入”与“单端口输入”状态下的频谱曲线进行之比，就得到了功率增益曲线；通过“关”状态下的功率增益曲线和单端口/多端口输入情况下的消光比曲线，就能够得到光交换芯片的串扰随工作波长(频率)的变化关系。由于光交换芯片波导结构尺寸非常小，输入光信号在芯片中会进行多径开关耦合，特别是在多端口输入情况下，不仅会出现串扰功率的叠加，也容易导致串扰的相干叠加，在基于微环谐振器和马赫-曾德尔干涉结构的交换芯片中尤其明显；本发明提供的串扰测试方法，能够将交换芯片中不可避免的干涉因素考虑在内，测试结果更加符合实际情况。In the present invention, all input port input optical signals are equal-power optical signals, and the power gain curve is obtained by comparing the "multi-port input" and "single-port input" state spectrum curves in the "off" state. Through the power gain curve in the "off" state and the extinction ratio curve in the case of single-port/multi-port input, the crosstalk of the optical switching chip can be obtained as a function of the operating wavelength (frequency). Due to the very small size of the optical switch chip waveguide structure, the input optical signal will be multi-path switch coupled in the chip, especially in the case of multi-port input, not only the superposition of crosstalk power but also the coherent superposition of crosstalk is easily caused. The micro-ring resonator and the Mach-Zehnder interference structure switch chip are particularly obvious; the crosstalk test method provided by the present invention can take into consideration the inevitable interference factors in the switch chip, and the test result is more in line with the actual situation.
另外，由于控制电路的不稳定性和测试环境的变化等各种因素，尤其对于微环谐振器这类较敏感的器件来说，多次测量叠加之后的消光比曲线会出现“抖动”现象，能够测量得其标准差σ，从而计算其光信噪比OSNRdB＝ERdB-σdB；能够直观地观测到电路抖动等因素对光交换芯片交换性能的影响。In addition, due to various factors such as instability of the control circuit and changes in the test environment, especially for sensitive devices such as micro-ring resonators, the extinction ratio curve after multiple measurements is superimposed, and "jitter" phenomenon occurs. The standard deviation σ can be measured to calculate its optical signal-to-noise ratio OSNR dB = ER dB - σ dB . It is possible to visually observe the influence of circuit jitter and other factors on the switching performance of the optical switching chip.
综上，本发明提供的光交换芯片性能测试方法，能够像光纤通信***性能测试方法那样，综合测量出光交换芯片的主要性能参数，包括消光比、串扰、光信噪比、带宽及其抖动、频谱形状因子等，可为光交换芯片模块的设计、加工、制作、封装、测试等诸多环节提供统一的测试方法，针对性强。与传统测试方法相比，传统方法为了测试方便往往需要通断信号光，这样的所测得的串扰结 果并没有考虑到信号光与串扰之间的相互作用，也有别于芯片的实际工作状态；而本发明的串扰测量方法总是在待测光信号始终存在的条件下进行测量的，与光交换芯片的实际工作情形一致，能够客观地反映光交换芯片正常工作时的性能，测量出的芯片带宽也总是与消光比等性能参数相联系。光交换芯片的传输性能与驱动或控制电路的稳定性密切相关，本发明公开的测试光交换芯片模块性能的方法也可以用于测试电路的稳定性，即在光域上评价电路的噪声特性。In summary, the optical switch chip performance test method provided by the present invention can comprehensively measure the main performance parameters of the optical switch chip, such as extinction ratio, crosstalk, optical signal to noise ratio, bandwidth and jitter, like the performance test method of the optical fiber communication system. The spectrum shape factor, etc., can provide a unified test method for the design, processing, fabrication, packaging, testing and other aspects of the optical switch chip module, and is highly targeted. Compared with the traditional test method, the traditional method often needs to turn on and off the signal light for the convenience of testing, such a measured crosstalk knot. The interaction between the signal light and the crosstalk is not taken into consideration, and is different from the actual working state of the chip; and the crosstalk measurement method of the present invention always performs measurement under the condition that the optical signal to be measured is always present, and the optical exchange The actual working conditions of the chip are consistent, which can objectively reflect the performance of the optical switch chip during normal operation, and the measured chip bandwidth is always associated with performance parameters such as extinction ratio. The transmission performance of the optical switch chip is closely related to the stability of the drive or control circuit. The method for testing the performance of the optical switch chip module disclosed in the present invention can also be used to test the stability of the circuit, that is, evaluate the noise characteristics of the circuit in the optical domain.
附图说明DRAWINGS
图1是本发明提供光交换芯片性能测试方法的流程示意图；1 is a schematic flow chart of a method for testing performance of an optical switch chip according to the present invention;
图2是实施例中待测光交换芯片“单端口输入”状态下的频谱眼图曲线；2 is a spectrum eye curve of the "single port input" state of the optical switch chip to be tested in the embodiment;
图3是实施例中由图2所示频谱眼图得到的消光比随频率曲线；Figure 3 is an extinction ratio versus frequency curve obtained from the spectrum eye diagram of Figure 2 in the embodiment;
图4是实施例中测量得串扰随频率的变化曲线；Figure 4 is a graph showing the measured crosstalk as a function of frequency in the embodiment;
图5是实施例中测量得具有一定抖动宽度的消光比曲线。Figure 5 is an extinction ratio curve measured in the embodiment with a certain jitter width.
具体实施方式detailed description
本实施例中采用4×4光交换芯片为待测光交换芯片，该光交换芯片的开关单元由马赫-曾德尔干涉型2×2光开关单元所组成，在外置控制电路的驱动下，能够通过对该光交换芯片中的p-i-n和n-i-n电极施加偏置电压的方式来控制每个开关单元的开关状态，从而控制光交换芯片整体的光交换状态。In this embodiment, a 4×4 optical switch chip is used as the optical switch chip to be tested, and the switch unit of the optical switch chip is composed of a Mach-Zehnder interference type 2×2 optical switch unit, and can be driven by an external control circuit. The switching state of each switching unit is controlled by applying a bias voltage to the pin and nin electrodes in the optical switching chip, thereby controlling the optical switching state of the entire optical switching chip.
本实施例中光交换芯片性能测试方法，具体步骤如图1所示。In this embodiment, the optical switch chip performance test method, the specific steps are shown in FIG.
步骤1.初始化光交换芯片的开关单元配置状态。其中温控电路控制n-i-n电极以稳定光交换芯片的初始工作状态，p-i-n电极用于驱动光交换芯片中的各个开关单元的工作状态；使光交换芯片完成光交换功能。对于指定待测输入/输出端口，“开”状态表示输入与输出端口之间建立了连通的光路，而“关”状态表示输入与输出端口之间没有建立连通的光路；通过配置相应的交换状态，就能任意对应的输入/输出端口处于“开”或者“关”状态。 Step 1. Initialize the switch unit configuration state of the optical switch chip. The temperature control circuit controls the n-i-n electrode to stabilize the initial working state of the optical switch chip, and the p-i-n electrode is used to drive the working state of each switch unit in the optical switch chip; and the optical switch chip completes the optical switching function. For the specified input/output port to be tested, the "on" state indicates that an optical path is established between the input and output ports, and the "off" state indicates that no optical path is established between the input and output ports; the corresponding switching state is configured. , any corresponding input/output port can be in the "on" or "off" state.
步骤2.在“单端口输入”状态下，测量给定交换状态下输出端口的输出光频谱曲线P(f)；通过设置扫描激光器，在一定频率范围内连续输出一组具有相同光功率的信号光，并调节偏振控制器使信号光输入到光交换芯片；在输出端口，通过光功率计来测量每个扫描频率点所对应的光功率；将采集到的输出光功率 与扫描波长(频率)对应起来，即为输出光功率随扫描波长(频率)的变化曲线。当待测光交换芯片的指定待测输入/输出端口处于“开”状态时，测得的频谱曲线可用P1(f)表示；通过开关驱动电路可改变光交换芯片的交换状态，即待测输入/输出端口从“开”变到“关”状态，在“关”状态下，采用相同的测量过程，获得输出光功率随扫描波长(频率)的变化关系P0(f)。 Step 2. In the "single port input" state, measure the output light spectrum curve P(f) of the output port in a given exchange state; by setting the scanning laser, continuously output a group of signals having the same optical power in a certain frequency range. Light, and adjust the polarization controller to input signal light to the optical switch chip; at the output port, measure the optical power corresponding to each scanning frequency point by the optical power meter; and collect the output optical power and the scanning wavelength (frequency) Correspondingly, it is the curve of the output optical power as a function of the scanning wavelength (frequency). When the designated input/output port of the optical switch chip to be tested is in the "on" state, the measured spectrum curve may be represented by P 1 (f); the switching state of the optical switch chip may be changed by the switch driving circuit, that is, the test is to be performed. The input/output port changes from "on" to "off". In the "off" state, the same measurement process is used to obtain the relationship P 0 (f) of the output optical power as a function of the scanning wavelength (frequency).
将上述“开”和“光”状态下所得的频谱曲线显示于同一窗口中，得到如图2所示的频谱眼图。它类似于通信信号分析仪所产生的眼图，但横坐标不同。通过该频谱眼图能够得到许多与光交换芯片有关的性能参数，频谱眼图中“眼睛”的上下张开度对应于相应工作波长(频率)处的消光比。因此，频谱眼图可直观地观察光交换芯片的开关性能，甚至可以用于调测开关驱动电路或开关偏置电路的工作状态等。The spectrum curves obtained in the above "on" and "light" states are displayed in the same window, and a spectrum eye diagram as shown in FIG. 2 is obtained. It is similar to the eye diagram produced by the communication signal analyzer, but with different abscissas. A number of performance parameters associated with the optical switching chip can be obtained by the spectral eye diagram, and the upper and lower opening degrees of the "eye" in the spectral eye diagram correspond to the extinction ratio at the corresponding operating wavelength (frequency). Therefore, the spectrum eye diagram can intuitively observe the switching performance of the optical switching chip, and can even be used to adjust the working state of the switch driving circuit or the switching bias circuit.
根据频谱眼图，对“开”和“关”状态下的输出光谱曲线进行如下运算处理，可获取光交换芯片的消光比量化信息，即ERdB＝P1dB(f)-P0dB(f)，对应的消光比曲线如图3所示，以dB为单位。根据消光比曲线可定量地确定光交换芯片的性能参数，据此可优化光交换芯片的交换状态，得到满足消光比要求的工作带宽范围。According to the spectrum eye diagram, the output spectral curve in the "on" and "off" states is processed as follows, and the extinction ratio quantization information of the optical switch chip can be obtained, that is, ER dB = P 1dB (f) - P 0dB (f) The corresponding extinction ratio curve is shown in Figure 3, in dB. According to the extinction ratio curve, the performance parameters of the optical switch chip can be quantitatively determined, thereby optimizing the exchange state of the optical switch chip, and obtaining an operating bandwidth range that satisfies the extinction ratio requirement.
步骤3.对“多端口输入”状态进行同样的测试，根据单端口与多端口的测试结果得到最终的串扰性能。需注意的是，“多端口输入”时，对指定的待测输入/输出端口进行“关”状态测试时，该输出端口不能与其它输入端口形成“开”状态。指定的待测试输入/输出端口处于“开”和“关”状态下的频谱曲线记为
Figure PCTCN2015089212-appb-000010
和
Figure PCTCN2015089212-appb-000011
相应的消光比曲线为
Figure PCTCN2015089212-appb-000012
Step 3. Perform the same test on the “multiport input” state and get the final crosstalk performance based on the test results of single port and multi port. It should be noted that when “multi-port input” is used, when the specified input/output port to be tested is tested in the “off” state, the output port cannot form an “on” state with other input ports. The specified spectral curve of the input/output port to be tested in the "on" and "off" states is recorded as
Figure PCTCN2015089212-appb-000010
with
Figure PCTCN2015089212-appb-000011
The corresponding extinction ratio curve is
Figure PCTCN2015089212-appb-000012
步骤4.在“关”状态下，“单端口输入”和“多端口输入”时输出光功率的变化关系用光功率增益
Figure PCTCN2015089212-appb-000013
表示。 Step 4. In the "off" state, the relationship between the output optical power at "single port input" and "multiport input" is the optical power gain.
Figure PCTCN2015089212-appb-000013
Said.
步骤5.根据“单端口输入”和“多端口输入”时，“关”状态下的光功率增益曲线以及消光比曲线，可确定指定输入/输出端口处于“开”状态时该光交换芯片的串扰性能：Step 5. According to the "single port input" and "multi-port input", the optical power gain curve and the extinction ratio curve in the "off" state can be determined when the designated input/output port is in the "on" state. Crosstalk performance:
CTdB(f)≈10lg(G0dB+ΔERdB)-6.378，其中
Figure PCTCN2015089212-appb-000014
 CT dB (f) ≈ 10 lg (G 0dB + ΔER dB ) - 6.378, where
Figure PCTCN2015089212-appb-000014
得到的串扰曲线如图4所示。The resulting crosstalk curve is shown in Figure 4.
另外，在给定的两种或多种交换路由状态下，由于光交换芯片驱动或控制电路的精度原因，或者光交换芯片受到外界干扰等因素的影响，多次测量所得到 的消光比曲线会出现幅度或频谱宽度的“抖动”，如图5所示；根据消光比曲线的抖动特性可获得光交换芯片的光信噪比(OSNRdB＝ERdB-σdB)和带宽抖动信息，也可以用于测试电路抖动对光交换芯片性能的劣化程度。In addition, in the given two or more exchange routing states, due to the accuracy of the optical switch chip drive or control circuit, or the optical switch chip is affected by external interference and other factors, the extinction ratio curve obtained by multiple measurements will The “jitter” of amplitude or spectrum width appears, as shown in Figure 5; the optical signal-to-noise ratio (OSNR dB = ER dB - σ dB ) and bandwidth jitter information of the optical switch chip can be obtained according to the jitter characteristics of the extinction ratio curve. Used to test the degree of degradation of circuit jitter to the performance of the optical switch chip.
综上，本实施例测试方法中，根据消光比曲线直接得到各种交换状态下光交换芯片的开关消光比及其对应的工作带宽；根据单端口输入和多端口输入情形下所测得的开关消光比和“关”状态下的光功率增益，计算测量出光交换芯片的串扰性能；根据消光比曲线的抖动特性计算测量光信噪比和带宽抖动。In summary, in the test method of the embodiment, the switch extinction ratio of the optical switch chip in various exchange states and the corresponding working bandwidth are directly obtained according to the extinction ratio curve; the switch measured according to the single port input and the multi port input case The extinction ratio and the optical power gain in the "off" state are calculated to measure the crosstalk performance of the optical switch chip; the measured optical signal-to-noise ratio and bandwidth jitter are calculated according to the jitter characteristics of the extinction ratio curve.
以上所述，仅为本发明的具体实施方式，本说明书中所公开的任一特征，除非特别叙述，均可被其他等效或具有类似目的的替代特征加以替换；所公开的所有特征、或所有方法或过程中的步骤，除了互相排斥的特征和/或步骤以外，均可以任何方式组合。 The above description is only a specific embodiment of the present invention, and any feature disclosed in the specification may be replaced by other equivalent or similarly substituted features unless specifically stated; all the features disclosed, or All methods or steps in the process can be combined in any manner other than mutually exclusive features and/or steps.

Claims (2)

  1. 一种光交换芯片性能测试方法，其特征在于，包括以下步骤：An optical switch chip performance testing method, characterized in that the method comprises the following steps:
    步骤1.初始化待测光交换芯片的开关单元配置状态：针对待测光交换芯片任一组指定待测输入、输出端口，“开”状态定义为待测输入端口与待测输出端口之间建立连通光路的状态，反之为“关”状态；同时定义“单端口输入”表示仅有待测输入端口输入光信号，“多端口输入”表示除待测输入端口外还有一个或一个以上输入端口输入光信号；同时，所有输入端口输入光信号为等功率的光信号；Step 1. Initialize the switch unit configuration state of the optical switch chip to be tested: specify the input and output ports to be tested for any group of optical switch chips to be tested, and the “on” state is defined as establishing between the input port to be tested and the output port to be tested. The state of the connected optical path, and vice versa is the "off" state; the definition of "single port input" means that only the input port of the input port is to be input, and the "multiport input" means that there is one or more input ports besides the input port to be tested. Input optical signal; at the same time, all input port input optical signals are optical signals of equal power;
    步骤2.在“单端口输入”状态下，配置待测光交换芯片为“开”状态，测量得待测输出端口的输出光频谱曲线P1(f)；再配置待测光交换芯片为“关”状态，测量得待测输出端口的输出光频谱曲线P0(f)；并计算相应消光比曲线：ERdB＝P1dB(f)-P0dB(f)，该消光比曲线以dB为单位，P1dB(f)和P0dB(f)分别由P1(f)和P0(f)单位转换得到；Step 2. In the "single port input" state, set the optical switch chip to be tested to the "on" state, measure the output optical spectrum curve P 1 (f) of the output port to be tested; and then configure the optical switch chip to be tested as " Off state, measuring the output light spectrum curve P 0 (f) of the output port to be tested; and calculating the corresponding extinction ratio curve: ER dB = P 1dB (f) - P 0dB (f), the extinction ratio curve is in dB Units, P 1dB (f) and P 0dB (f) are converted from P 1 (f) and P 0 (f) units, respectively;
    步骤3.在“多端口输入”状态下，配置待测光交换芯片为“开”状态，测量得待测输出端口的输出光频谱曲线
    Figure PCTCN2015089212-appb-100001
    再配置待测光交换芯片为“关”状态，此时保持待测输出端口与所有输入端之间为“关”状态，测量得待测输出端口的输出光频谱曲线
    Figure PCTCN2015089212-appb-100002
    并计算相应消光比曲线：
    Figure PCTCN2015089212-appb-100003
    该消光比曲线以dB为单位，
    Figure PCTCN2015089212-appb-100004
    和
    Figure PCTCN2015089212-appb-100005
    分别由
    Figure PCTCN2015089212-appb-100006
    和
    Figure PCTCN2015089212-appb-100007
    单位转换得到；    Step 3. In the "multi-port input" state, configure the optical switch chip to be tested to be in the "on" state, and measure the output optical spectrum curve of the output port to be tested.
    Figure PCTCN2015089212-appb-100001
    The optical switch chip to be tested is configured to be in an "off" state. At this time, the output port of the output to be tested and the input terminal are in an "off" state, and the output light spectrum curve of the output port to be tested is measured.
    Figure PCTCN2015089212-appb-100002
    And calculate the corresponding extinction ratio curve:
    Figure PCTCN2015089212-appb-100003
    The extinction ratio curve is in dB.
    Figure PCTCN2015089212-appb-100004
    with
    Figure PCTCN2015089212-appb-100005
    By
    Figure PCTCN2015089212-appb-100006
    with
    Figure PCTCN2015089212-appb-100007
    Unit conversion is obtained;
    步骤4.计算待测输入、输出端口在“关”状态下，待测输出端的输出光功率增益为：
    Figure PCTCN2015089212-appb-100008
         Step 4. Calculate the output optical power gain of the input and output ports to be tested in the “off” state, and the output optical power gain of the output to be tested is:
    Figure PCTCN2015089212-appb-100008
    步骤5.计算待测输入、输出端口在“开”状态下，待测光交换芯片的串扰性能：CTdB(f)≈10lg(G0dB+ΔERdB)-6.378，其中，
    Figure PCTCN2015089212-appb-100009
    Step 5. Calculate the crosstalk performance of the optical switch chip to be tested in the "on" state of the input and output ports to be tested: CT dB (f) ≈ 10 lg (G 0dB + ΔER dB ) - 6.378, where
    Figure PCTCN2015089212-appb-100009
  2. 按权利要求1所述光交换芯片性能测试方法，其特征在于，所述步骤2、3中测量待测输出端口的输出光频谱曲线的方法为：采用指定谱宽的宽谱光源，通过光谱分析仪一次获得频谱曲线；或者通过设置扫描激光器连续输出指定谱宽的光信号，利用光功率计接收每个频率分量的光功率，最后叠加得到频谱曲线。 The optical switch chip performance test method according to claim 1, wherein the method for measuring the output light spectrum curve of the output port to be tested in the steps 2 and 3 is: using a broad spectrum light source of a specified spectral width, and performing spectral analysis The instrument obtains the spectrum curve once; or continuously sets the scanning laser to continuously output the optical signal of the specified spectral width, and uses the optical power meter to receive the optical power of each frequency component, and finally superimposes to obtain the spectrum curve.
PCT/CN2015/089212 2015-07-27 2015-09-09 Performance test method for optical switch chip WO2017016053A1 (en)

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