WO2017014287A1 - 樹脂フィルム、積層体、光学部材、ガスバリア材及びタッチセンサー基材 - Google Patents
樹脂フィルム、積層体、光学部材、ガスバリア材及びタッチセンサー基材 Download PDFInfo
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- WO2017014287A1 WO2017014287A1 PCT/JP2016/071454 JP2016071454W WO2017014287A1 WO 2017014287 A1 WO2017014287 A1 WO 2017014287A1 JP 2016071454 W JP2016071454 W JP 2016071454W WO 2017014287 A1 WO2017014287 A1 WO 2017014287A1
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- resin film
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- laminate
- resin
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Images
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present invention relates to a resin film, a laminate, an optical member, a gas barrier material, and a touch sensor substrate.
- glass has been used as a base material for display members, a base material for optical members, and a material for a front plate constituting various display devices such as solar cells or displays.
- glass has the disadvantage of being easily broken and heavy.
- the glass substrate or the glass front plate has not had sufficient material properties. Therefore, an acrylic resin and a laminate obtained by imparting scratch resistance to the resin have been studied as a material or a substrate that can replace glass.
- a composite material of an organic material and an inorganic material such as a hybrid film containing polyimide and silica has also been studied (see, for example, Patent Documents 1 and 2).
- the resin film that replaces the glass substrate in the base material of the display member, the base material of the optical member, and the front plate constituting the flexible device is a laminate in which an adhesive layer, a resin film, and a hard coat layer are laminated in this order (hereinafter, adhesive layer). / May be referred to as a laminate of resin film / hard coat layer).
- adhesive layer an adhesive layer, a resin film, and a hard coat layer are laminated in this order
- adhesive layer / May be referred to as a laminate of resin film / hard coat layer.
- the hardness of the surface of the hard coat layer tends to be insufficient, and it has become clear that there is room for further improvement in this respect.
- the present invention provides a resin film that makes it possible to increase the hardness of the surface of the hard coat layer in the laminate of the adhesive layer / resin film / hard coat layer.
- One aspect of the present invention provides a resin film containing a polyimide polymer.
- the tensile elastic modulus of the resin film is 4.0 GPa or more and the resin film is repeatedly folded back into a U shape until the distance between the resin films facing each other is 3 mm, until the resin film breaks.
- the number of times the resin film is folded exceeds 100,000.
- a resin film containing a polyimide-based polymer satisfies the above requirements with respect to the tensile modulus and bending test, so that in the laminate of adhesive layer / resin film / hard coat layer, The hardness of the surface of the coat layer can be sufficiently increased.
- the yellowness of the resin film is preferably 5 or less.
- the resin film may have a thickness of 30 to 100 ⁇ m. According to the resin film having such a thickness, the more remarkable effect of the present invention can be obtained.
- the resin film can be suitably used as an optical member such as a flexible device, a gas barrier material, or a touch sensor substrate.
- the hardness of the surface of the hard coat layer in the laminate of the adhesive layer / resin film / hard coat layer can be increased with respect to the resin film containing the polyimide polymer.
- FIG. 1 is a cross-sectional view showing an embodiment of a resin film.
- a resin film 10 shown in FIG. 1 contains a polyimide-based polymer and has a pair of opposing main surfaces 10a and 10b.
- the tensile elastic modulus of the resin film 10 is 4.0 GPa or more.
- the number of times the resin film 10 is bent until the resin film 10 breaks exceeds 100,000.
- the number of times the resin film is bent in the bending test may be referred to as “the number of bending”.
- the hardness of the surface of the hard coat layer is sufficiently obtained in the adhesive layer / resin film / hard coat layer laminate. Can be increased.
- FIG. 2 is a cross-sectional view showing an embodiment of a laminate comprising an adhesive layer / resin film / hard coat layer laminate.
- a laminated body 30 shown in FIG. 2 includes a resin film 10, a functional layer 20 laminated on one main surface 10a of the resin film 10, and a functional layer 21 laminated on the other main surface 10b of the resin film 10. It is the laminated body which has.
- the resin film 10 according to the present embodiment when the functional layer 20 is a hard coat layer and the functional layer 21 is an adhesive layer, the hardness of the surface S of the functional layer (hard coat layer) 20 can be increased. Details of the hard coat layer and the adhesive layer as the functional layers 20 and 21 will be described later.
- the tensile elastic modulus of the resin film 10 is 4 GPa or more, preferably 5 GPs or more, preferably 10 GPa or less, and more preferably 8 GPa or less. When the tensile elastic modulus is within these numerical ranges, an excellent effect can be obtained in terms of bending recovery in addition to the improvement in the hardness of the surface S.
- the number of bendings until the resin film 10 is broken exceeds 100,000.
- “the resin film breaks” means that the resin film is partially or wholly broken, that is, a portion that is divided throughout the thickness direction is generated. If the resin film does not break when the number of times of bending reaches 100,000 times, the number of times of bending until the resin film breaks is considered to exceed 100,000 times. According to the knowledge of the present inventors, the contribution of the resin film to the improvement in the hardness of the surface S can be evaluated based on a bending test up to 100,000 times of bending. Details of the bending test will be described in Examples described later.
- the yellowness (YI value) of the resin film 10 is preferably 5 or less, more preferably 4 or less, and even more preferably 3 or less from the viewpoint of the visibility of the flexible device.
- the yellowness of the resin film 10 is usually 0.5 or more and may be 1 or more.
- Resin film 10 contains a polyimide polymer.
- the polyimide polymer means a polymer containing at least one repeating structural unit represented by formula (PI), formula (a), formula (a ′) and formula (b). .
- the repeating structural unit represented by a formula (PI) is a main structural unit of a polyimide-type polymer.
- the repeating structural unit represented by the formula (PI) is preferably 40 mol% or more, more preferably 50 mol% or more, further preferably 70 mol%, based on all repeating structural units of the polyimide-based polymer. More preferably, it is 90 mol% or more, and still more preferably 98 mol%.
- G in the formula (PI) represents a tetravalent organic group, and A represents a divalent organic group.
- G 2 in the formula (a) represents a trivalent organic group, and A 2 represents a divalent organic group.
- G 3 in the formula (a ′) represents a tetravalent organic group, and A 3 represents a divalent organic group.
- G 4 and A 4 in the formula (b) each represent a divalent organic group.
- the organic group of the tetravalent organic group represented by G includes an acyclic aliphatic group, a cyclic aliphatic group, and an aromatic group. And a group selected from the group consisting of:
- the organic group of G is preferably a tetravalent cyclic aliphatic group or a tetravalent aromatic group from the viewpoint of transparency and flexibility of the resin film 10.
- the aromatic group include a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group having two or more aromatic rings and connected to each other directly or by a bonding group. Etc.
- the organic group of G is a cyclic aliphatic group, a cyclic aliphatic group having a fluorine-based substituent, a monocyclic aromatic group having a fluorine-based substituent, A condensed polycyclic aromatic group having a fluorine-based substituent or a non-condensed polycyclic aromatic group having a fluorine-based substituent is preferable.
- the fluorine-based substituent means a group containing a fluorine atom.
- the fluorine-based substituent is preferably a fluoro group (fluorine atom, -F) and a perfluoroalkyl group, more preferably a fluoro group and a trifluoromethyl group.
- the organic group of G is, for example, a saturated or unsaturated cycloalkyl group, a saturated or unsaturated heterocycloalkyl group, an aryl group, a heteroaryl group, an arylalkyl group, an alkylaryl group, a heteroalkylaryl.
- Examples of the bonding group include —O—, an alkylene group having 1 to 10 carbon atoms, —SO 2 —, —CO— or —CO—NR— (where R represents a methyl group, an ethyl group, a propyl group, etc. 3 represents an alkyl group or a hydrogen atom).
- the carbon number of the tetravalent organic group represented by G is usually 2 to 32, preferably 4 to 15, more preferably 5 to 10, and further preferably 6 to 8.
- the organic group of G is a cycloaliphatic group or an aromatic group, at least one of carbon atoms constituting these groups may be replaced with a heteroatom.
- Heteroatoms include O, N, or S.
- G examples include groups represented by the following formula (20), formula (21), formula (22), formula (23), formula (24), formula (25), or formula (26). It is done. * In the formula indicates a bond.
- Z in the formula (26) represents a single bond, —O—, —CH 2 —, —C (CH 3 ) 2 —, —Ar—O—Ar—, —Ar—CH 2 —Ar—, —Ar—.
- C (CH 3 ) 2 —Ar— or —Ar—SO 2 —Ar— is represented.
- Ar represents an aryl group having 6 to 20 carbon atoms, and may be, for example, a phenylene group. At least one of the hydrogen atoms of these groups may be substituted with a fluorine-based substituent.
- the organic group of the divalent organic group represented by A includes an acyclic aliphatic group, a cyclic aliphatic group, and an aromatic group.
- the divalent organic group represented by A is preferably selected from a divalent cycloaliphatic group and a divalent aromatic group.
- the aromatic group include a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group having two or more aromatic rings and connected to each other directly or by a bonding group. Groups. From the viewpoint of transparency of the resin film and suppression of coloring, it is preferable that a fluorine-based substituent is introduced into the organic group of A.
- the organic group of A is, for example, a saturated or unsaturated cycloalkyl group, a saturated or unsaturated heterocycloalkyl group, an aryl group, a heteroaryl group, an arylalkyl group, an alkylaryl group, a heteroalkylaryl.
- the hetero atom include O, N, or S.
- Examples of the bonding group include —O—, an alkylene group having 1 to 10 carbon atoms, —SO 2 —, —CO—, or —CO—NR— (R represents methyl Group, an alkyl group having 1 to 3 carbon atoms such as an ethyl group or a propyl group, or a hydrogen atom).
- the carbon number of the divalent organic group represented by A is usually 2 to 40, preferably 5 to 32, more preferably 12 to 28, and further preferably 24 to 27.
- A include groups represented by the following formula (30), formula (31), formula (32), formula (33), or formula (34).
- * In the formula indicates a bond.
- Z 1 to Z 3 are each independently a single bond, —O—, —CH 2 —, —C (CH 3 ) 2 —, —SO 2 —, —CO— or —CO—NR— (R is Represents a C 1-3 alkyl group such as a methyl group, an ethyl group, or a propyl group, or a hydrogen atom.
- Z 1 and Z 2 , and Z 2 and Z 3 are each preferably in the meta position or the para position with respect to each ring.
- Z 1 and the single bond at the terminal, Z 2 and the single bond at the terminal, and Z 3 and the single bond at the terminal are in the meta position or the para position, respectively.
- Z 1 and Z 3 are —O— and Z 2 is —CH 2 —, —C (CH 3 ) 2 — or —SO 2 —.
- One or two or more hydrogen atoms of these groups may be substituted with a fluorine-based substituent.
- At least one hydrogen atom constituting at least one of A and G is at least one selected from the group consisting of a fluorine-based substituent, a hydroxyl group, a sulfone group, and an alkyl group having 1 to 10 carbon atoms. It may be substituted with a functional group. Further, when the organic group of A and the organic group of G are each a cyclic aliphatic group or an aromatic group, it is preferable that at least one of A and G has a fluorine-based substituent, and both A and G are More preferably, it has a fluorine-based substituent.
- G 2 in the formula (a) is a trivalent organic group.
- This organic group can be selected from the same groups as the organic group of G in formula (PI) except that it is a trivalent group.
- Examples of G 2 include groups in which any one of the four bonds of the groups represented by formulas (20) to (26) listed as specific examples of G is replaced with a hydrogen atom. Can do.
- a 2 in formula (a) can be selected from the same groups as A in formula (PI).
- G 3 in formula (a ′) can be selected from the same groups as G in formula (PI).
- a 3 in formula (a ′) can be selected from the same groups as A in formula (PI).
- G 4 in the formula (b) is a divalent organic group.
- This organic group can be selected from the same groups as the organic group of G in formula (PI) except that it is a divalent group.
- Examples of G 4 include groups in which any two of the four bonds of the groups represented by formulas (20) to (26) listed as specific examples of G are replaced with hydrogen atoms. Can do.
- a 4 in formula (b) can be selected from the same groups as A in formula (PI).
- the polyimide polymer contained in the resin film 10 is composed of a diamine and a tetracarboxylic acid compound (including tetracarboxylic acid compound analogs such as an acid chloride compound and tetracarboxylic dianhydride) or a tricarboxylic acid compound (acid chloride compound). And a condensed polymer obtained by polycondensation with at least one of tricarboxylic acid compound analogs such as tricarboxylic acid anhydride). Further, dicarboxylic acid compounds (including analogs such as acid chloride compounds) may be polycondensed.
- the repeating structural unit represented by the formula (PI) or the formula (a ′) is usually derived from a diamine and a tetracarboxylic acid compound.
- the repeating structural unit represented by the formula (a) is usually derived from diamines and tricarboxylic acid compounds.
- the repeating structural unit represented by the formula (b) is usually derived from diamines and dicarboxylic acid compounds.
- tetracarboxylic acid compounds include aromatic tetracarboxylic acid compounds, alicyclic tetracarboxylic acid compounds, and acyclic aliphatic tetracarboxylic acid compounds. Two or more of these may be used in combination.
- the tetracarboxylic acid compound is preferably tetracarboxylic dianhydride.
- tetracarboxylic dianhydrides include aromatic tetracarboxylic dianhydrides, alicyclic tetracarboxylic dianhydrides, and acyclic aliphatic tetracarboxylic dianhydrides.
- the tetracarboxylic acid compound is an alicyclic tetracarboxylic compound or an aromatic tetracarboxylic acid compound from the viewpoints of solubility of the polyimide polymer in a solvent and transparency and flexibility when the resin film 10 is formed. It is preferable. From the viewpoint of transparency of the resin film and suppression of coloring, the tetracarboxylic acid compound may be selected from an alicyclic tetracarboxylic acid compound having a fluorine-based substituent and an aromatic tetracarboxylic acid compound having a fluorine-based substituent. Preferably, it is an alicyclic tetracarboxylic acid compound having a fluorine-based substituent.
- the tricarboxylic acid compound examples include aromatic tricarboxylic acid, alicyclic tricarboxylic acid, acyclic aliphatic tricarboxylic acid and related acid chloride compounds, acid anhydrides and the like.
- the tricarboxylic acid compound is preferably selected from aromatic tricarboxylic acids, alicyclic tricarboxylic acids, acyclic aliphatic tricarboxylic acids, and related acid chloride compounds. Two or more tricarboxylic acid compounds may be used in combination.
- the tricarboxylic acid compound is preferably an alicyclic tricarboxylic acid compound or an aromatic tricarboxylic acid compound.
- the tricarboxylic acid compound is more preferably an alicyclic tricarboxylic acid compound having a fluorine-based substituent or an aromatic tricarboxylic acid compound having a fluorine-based substituent.
- dicarboxylic acid compound examples include aromatic dicarboxylic acid, alicyclic dicarboxylic acid, acyclic aliphatic dicarboxylic acid and related acid chloride compounds, acid anhydrides and the like.
- the dicarboxylic acid compound is preferably selected from aromatic dicarboxylic acids, alicyclic dicarboxylic acids, acyclic aliphatic dicarboxylic acids and related acid chloride compounds. Two or more dicarboxylic acid compounds may be used in combination.
- the dicarboxylic acid compound is preferably an alicyclic dicarboxylic acid compound or an aromatic dicarboxylic acid compound.
- the dicarboxylic acid compound is more preferably an alicyclic dicarboxylic acid compound having a fluorine-based substituent or an aromatic dicarboxylic acid compound having a fluorine-based substituent.
- diamines examples include aromatic diamines, alicyclic diamines and aliphatic diamines, and these may be used in combination of two or more. From the viewpoint of the solubility of the polyimide polymer in the solvent, and the transparency and flexibility when the resin film 10 is formed, the diamine is selected from an alicyclic diamine and an aromatic diamine having a fluorine substituent. Is preferred.
- Such a polyimide polymer has particularly excellent flexibility, high light transmittance (for example, 85% or more, preferably 88% or more with respect to light at 550 nm), low yellowness (YI A resin film having a value of 5 or less, preferably 3 or less, and a low haze (1.5% or less, preferably 1.0% or less) is easily obtained.
- the polyimide polymer may be a copolymer containing a plurality of different types of repeating structural units.
- the weight average molecular weight of the polyimide polymer is usually 10,000 to 500,000.
- the weight average molecular weight of the polyimide polymer is preferably 50,000 to 500,000, more preferably 70,000 to 400,000.
- the weight average molecular weight is a standard polystyrene equivalent molecular weight measured by gel permeation chromatography (GPC). If the weight average molecular weight of the polyimide polymer is large, high flexibility tends to be obtained, but if the weight average molecular weight of the polyimide polymer is too large, the viscosity of the varnish tends to increase and the workability tends to decrease. is there.
- the polyimide-based polymer may contain a halogen atom such as a fluorine atom that can be introduced by the above-described fluorine-based substituent.
- a halogen atom such as a fluorine atom that can be introduced by the above-described fluorine-based substituent.
- a halogen atom is preferably a fluorine atom.
- the content of halogen atoms in the polyimide polymer is preferably 1 to 40% by mass, more preferably 1 to 30% by mass based on the mass of the polyimide polymer.
- the resin film 10 may contain 1 type, or 2 or more types of ultraviolet absorbers.
- the ultraviolet absorber can be appropriately selected from those usually used as an ultraviolet absorber in the field of resin materials.
- the ultraviolet absorber may contain a compound that absorbs light having a wavelength of 400 nm or less.
- Examples of the ultraviolet absorber that can be appropriately combined with the polyimide polymer include at least one compound selected from the group consisting of benzophenone compounds, salicylate compounds, benzotriazole compounds, and triazine compounds.
- the “system compound” refers to a derivative of the compound to which the “system compound” is attached.
- a “benzophenone compound” refers to a compound having benzophenone as a host skeleton and a substituent bonded to benzophenone.
- the content of the ultraviolet absorber is usually 1% by mass or more, preferably 2% by mass or more, more preferably 3% by mass or more, and usually 10% by mass or less with respect to the total mass of the resin film. Yes, preferably 8% by mass or less, more preferably 6% by mass or less.
- the resin film 10 may further contain an inorganic material such as inorganic particles.
- the inorganic material is preferably a silicon material containing a silicon atom.
- the tensile elastic modulus of the resin film 10 can be easily set to 4.0 GPa or more.
- the method for controlling the tensile elastic modulus of the resin film 10 is not limited to the blending of inorganic materials.
- silicon materials containing silicon atoms include silica compounds, quaternary alkoxysilanes such as tetraethyl orthosilicate (TEOS), and silicon compounds such as silsesquioxane derivatives.
- TEOS tetraethyl orthosilicate
- silica particles are preferable from the viewpoint of the transparency and flexibility of the resin film 10.
- the average primary particle diameter of the silica particles is usually 100 nm or less. When the average primary particle diameter of the silica particles is 100 nm or less, the transparency tends to be improved.
- the average primary particle diameter of the silica particles in the resin film can be determined by observation with a transmission electron microscope (TEM).
- the primary particle diameter of the silica particles can be a constant direction diameter measured by a transmission electron microscope (TEM).
- the average primary particle diameter can be obtained as an average value of ten primary particle diameters measured by TEM observation.
- the particle distribution of the silica particles before forming the resin film can be determined by a commercially available laser diffraction particle size distribution meter.
- the blending ratio of the polyimide-based polymer and the inorganic material is preferably 1: 9 to 10: 0 in terms of mass ratio, with the sum of both being 10 and 3: 7 to 10: 0. More preferably, it is more preferably 3: 7 to 8: 2, and still more preferably 3: 7 to 7: 3.
- the ratio of the inorganic material to the total mass of the polyimide-based polymer and the inorganic material is usually 20% by mass or more, preferably 30% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less. .
- the compounding ratio of the polyimide polymer and the inorganic material silicon material
- the transparency and mechanical strength of the resin film tend to be improved.
- the tensile elasticity modulus of the resin film 10 can be easily made 4.0 GPa or more.
- the resin film 10 may further contain components other than the polyimide polymer and the inorganic material as long as the transparency and flexibility are not significantly impaired.
- components other than the polyimide-based polymer and the inorganic material include colorants such as antioxidants, mold release agents, stabilizers, and bluing agents, flame retardants, lubricants, thickeners, and leveling agents.
- the proportion of components other than the polyimide-based polymer and the inorganic material is preferably more than 0% and not more than 20% by mass, more preferably more than 0% and not more than 10% by mass with respect to the mass of the resin film 10. It is.
- Si / N which is the atomic ratio of silicon atoms to nitrogen atoms, is 8 or more on at least one main surface 10a.
- This atomic ratio Si / N is determined by evaluating the composition of the main surface 10a by X-ray photoelectron spectroscopy (XPS) and calculating the amount of silicon atoms and the amount of nitrogen atoms present. This is a calculated value.
- XPS X-ray photoelectron spectroscopy
- Si / N in the main surface 10a of the resin film 10 is 8 or more, sufficient adhesion with the functional layer 20 described later is obtained.
- Si / N is more preferably 9 or more, further preferably 10 or more, preferably 50 or less, and more preferably 40 or less.
- the thickness of the resin film 10 is appropriately adjusted according to the flexible device to which the laminate 30 is applied, but is usually 10 to 500 ⁇ m, preferably 15 to 200 ⁇ m, more preferably 20 to 100 ⁇ m. Preferably, the thickness is 30 to 100 ⁇ m. The thickness of the resin film 10 is more preferably 50 to 100 ⁇ m, and most preferably 70 to 90 ⁇ m.
- the resin film 10 having such a configuration has particularly excellent flexibility and practically sufficient strength.
- the polyimide polymer varnish used for the production of the resin film is prepared by dissolving a solvent-soluble polyimide polymer polymerized by a known polyimide polymer synthesis method in a solvent.
- the solvent may be any solvent that dissolves the polyimide polymer.
- DMAc N, N-dimethylacetamide
- DMF N, N-dimethylformamide
- DMSO dimethyl sulfoxide
- GBL ⁇ -butyrolactone
- an inorganic material is added to a polyimide polymer varnish, and stirred and mixed by a known stirring method to prepare a dispersion in which the silicon material is uniformly dispersed.
- a UV absorber is blended, the UV absorber can be added to this dispersion.
- the polyimide-based polymer varnish or the dispersion may contain a metal alkoxide such as alkoxysilane that contributes to the bonding between inorganic particles (silica particles and the like).
- a metal alkoxide such as alkoxysilane that contributes to the bonding between inorganic particles (silica particles and the like).
- This compound is preferably an alkoxysilane having an amino group.
- Such a combination of the compound and the inorganic particles can achieve a high elastic modulus and can contribute to increasing the number of bendings until the resin film is broken in the bending test.
- the polyimide polymer varnish or dispersion may further contain water.
- the water content is usually 0.1 to 10% by mass relative to the mass of the polyimide polymer varnish or dispersion.
- the use of water can also achieve a high elastic modulus and contribute to an increase in the number of bendings until the resin film breaks in the bending test.
- the polyimide polymer or dispersion may further contain an additive.
- additives include colorants such as antioxidants, mold release agents, stabilizers, and bluing agents, flame retardants, lubricants, thickeners, and leveling agents.
- the resin film can be produced by an appropriate known method. The following method is mentioned as an example of a manufacturing method.
- the polyimide polymer varnish or dispersion is applied to a substrate by, for example, a known roll-to-roll or batch method to form a coating film.
- the coating is dried to form a film.
- the resin film 10 is obtained by peeling a film from a base material.
- the substrate include a polyethylene terephthalate (PET) substrate, a stainless steel (SUS) belt, or a glass substrate.
- the coating film may be heated for drying and / or baking the coating film.
- the heating temperature of the coating film is usually 50 to 350 ° C.
- the coating film may be heated under an inert atmosphere or under reduced pressure.
- the solvent can be evaporated and removed by heating the coating film.
- the resin film may be formed by a method including a step of drying the coating film at 50 to 150 ° C. and a step of baking the dried coating film at 180 to 350 ° C.
- At least one main surface of the resin film may be subjected to a surface treatment.
- the surface treatment is preferably UV ozone treatment.
- Si / N can be easily increased to 8 or more.
- the method of setting Si / N to 8 or more is not limited to UV ozone treatment.
- the main surface 10a and / or 10b of the resin film 10 may be subjected to a surface treatment such as a plasma treatment or a corona discharge treatment in order to improve adhesion with a functional layer described later.
- UV ozone treatment can be performed using a known ultraviolet light source including a wavelength of 200 nm or less.
- An example of an ultraviolet light source is a low-pressure mercury lamp.
- the ultraviolet light source various commercially available devices equipped with an ultraviolet light source may be used. Examples of the commercially available apparatus include an ultraviolet (UV) ozone cleaning apparatus UV-208 manufactured by Technovision.
- the resin film 10 of the present embodiment thus obtained is excellent in flexibility. Moreover, when at least one principal surface 10a has Si / N, which is the atomic ratio of silicon atoms and nitrogen atoms, of 8 or more, excellent adhesion to the functional layer 20 described later can be obtained.
- FIG. 3 is a cross-sectional view showing an embodiment of a laminate.
- a laminate 30 shown in FIG. 3 is a laminate having a resin film 10 and a functional layer 20 laminated on one main surface 10a of the resin film 10.
- the functional layer 20 may be a layer for further imparting a function (performance) to the laminate 30 when the laminate 30 is used as an optical member of a flexible device or a base material of a display member, or a front plate.
- the optical member means a sensor unit such as a touch sensor or a signal transmission unit in the display device
- the display member means an image display unit such as an organic EL device or a liquid crystal display device in the display device.
- the functional layer 20 is preferably a layer having at least one function selected from the group consisting of ultraviolet absorption, a function of developing high hardness on the surface, adhesiveness, hue adjustment, and refractive index adjustment.
- a layer having an ultraviolet absorption function is, for example, a main material selected from an ultraviolet curable transparent resin, an electron beam curable transparent resin, and a thermosetting transparent resin; It is comprised from the ultraviolet absorber disperse
- the ultraviolet curable, electron beam curable, or thermosetting transparent resin as the main material of the ultraviolet absorbing layer is not particularly limited, and examples thereof include poly (meth) acrylate.
- the ultraviolet absorber can be selected from the same compounds as those exemplified as the ultraviolet absorber that can be contained in the resin film 10.
- the ultraviolet absorbing layer may be a layer that absorbs 95% or more of light having a wavelength of 400 nm or less (for example, light having a wavelength of 313 nm).
- the ultraviolet absorbing layer may be a layer having a transmittance of light having a wavelength of 400 nm or less (for example, light having a wavelength of 313 nm) of less than 5%.
- the ultraviolet absorbing layer can contain an ultraviolet absorber having a concentration that provides such transmittance. From the viewpoint of suppressing the increase in yellowness of the laminate due to light irradiation, the content ratio of the ultraviolet absorber in the ultraviolet absorbing layer (functional layer 20) is usually 1% by mass or more based on the mass of the ultraviolet absorbing layer. Yes, preferably 3% by mass or more, usually 10% by mass or less, and preferably 8% by mass or less.
- the functional layer (hard coat layer) that expresses high hardness on the surface as the functional layer 20 is a layer that gives the laminate a surface having a pencil hardness higher than the pencil hardness of the surface of the resin film, for example.
- the hard coat layer is not particularly limited, but includes an ultraviolet curable resin, an electron beam curable resin, or a thermosetting resin typified by poly (meth) acrylates.
- the hard coat layer may contain a photopolymerization initiator and an organic solvent.
- Poly (meth) acrylates are, for example, poly (meta) formed from one or more (meth) acrylates selected from polyurethane (meth) acrylate, epoxy (meth) acrylate and other polyfunctional poly (meth) acrylates. ) Acrylate.
- the hard coat layer may contain inorganic oxides such as silica, alumina and polyorganosiloxane in addition to the above components.
- the layer having an adhesive function (adhesive layer) as the functional layer 20 has a function of bonding the laminate 30 to another member.
- the material for forming the adhesive layer include a thermosetting resin composition and a photocurable resin composition.
- the adhesive layer may be composed of a resin composition containing a component having a polymerizable functional group. In this case, strong adhesion can be realized by further polymerizing the resin composition constituting the adhesive layer after the laminate 30 is brought into close contact with another member.
- the adhesive strength between the resin film 10 and the adhesive layer is preferably 0.1 N / cm or more, and more preferably 0.5 N / cm or more.
- the adhesive layer may contain a thermosetting resin composition or a photocurable resin composition as a material.
- the resin composition can be polymerized and cured by supplying energy afterwards.
- the pressure-sensitive adhesive layer may be a layer called a pressure-sensitive adhesive (Pressure Sensitive Adhesive, PSA) that is stuck to an object by pressing.
- PSA Pressure Sensitive Adhesive
- the pressure-sensitive adhesive may be a pressure-sensitive adhesive that is “a substance that is sticky at normal temperature and adheres to an adherend with light pressure” (JIS K6800). And an adhesive that can maintain stability until the coating is broken by appropriate means (pressure, heat, etc.) (JIS K6800).
- the layer having a function of adjusting the hue (hue adjusting layer) as the functional layer 20 is a layer capable of adjusting the laminate 30 to a target hue.
- the hue adjustment layer may be a layer containing a resin and a colorant, for example.
- the colorant include inorganic pigments such as titanium oxide, zinc oxide, dial, titanium oxide-based fired pigment, ultramarine blue, cobalt aluminate, and carbon black; azo-based compounds, quinacridone-based compounds, anthraquinone-based compounds, and perylene-based materials.
- Organic pigments such as compounds, isoindolinone compounds, phthalocyanine compounds, quinophthalone compounds, selenium compounds and diketopyrrolopyrrole compounds; body pigments such as barium sulfate and calcium carbonate; basic dyes, acid dyes and mordant dyes And the like.
- the layer having a function of adjusting the refractive index (refractive index adjusting layer) as the functional layer 20 is a layer having a refractive index different from that of the resin film 10 and can impart a predetermined refractive index to the laminate.
- the refractive index adjusting layer may be, for example, an appropriately selected resin, a resin layer further containing a pigment in some cases, or a metal thin film.
- Examples of the pigment for adjusting the refractive index include silicon oxide, aluminum oxide, antimony oxide, tin oxide, titanium oxide, zirconium oxide, and tantalum oxide.
- the average particle diameter of the pigment is preferably 0.1 ⁇ m or less.
- Examples of the metal used for the refractive index adjustment layer include metals such as titanium oxide, tantalum oxide, zirconium oxide, zinc oxide, tin oxide, silicon oxide, indium oxide, titanium oxynitride, titanium nitride, silicon oxynitride, and silicon nitride. Examples thereof include oxides and metal nitrides.
- the functional layer 20 appropriately has the above function according to the use of the laminate 30.
- the functional layer 20 may be a single layer or a plurality of layers. Each layer may have one function or two or more functions.
- the functional layer 20 preferably has a function of expressing high hardness on the surface and a function of absorbing ultraviolet rays.
- the functional layer 20 in this case is “a single layer having a function of developing high hardness on the surface and an ultraviolet absorbing function”, “a multilayer including a layer having a function of developing high hardness on the surface and an ultraviolet absorbing function” Or “a multilayer including a single layer having a function of developing high hardness on the surface and a function of absorbing ultraviolet light and a layer of developing high hardness” is preferable.
- the thickness of the functional layer 20 is appropriately adjusted according to the flexible device to which the laminate 30 is applied, but is preferably 1 ⁇ m to 100 ⁇ m, and more preferably 2 ⁇ m to 80 ⁇ m.
- the functional layer 20 is typically thinner than the resin film 10.
- the laminate 30 can be obtained by forming the functional layer 20 on the main surface 10 a of the resin film 10.
- the functional layer 20 can be formed by a known roll-to-roll or batch method.
- the ultraviolet absorbing layer as the functional layer 20 is formed by, for example, applying a dispersion liquid containing an ultraviolet absorbent and a main material such as a resin in which the ultraviolet absorbent is dispersed to the main surface 10a of the resin film 10. It can be formed by forming and drying and curing the coating.
- the hard coat layer as the functional layer 20 is formed by, for example, applying a solution containing a resin forming the hard coat layer to the main surface 10a of the resin film 10 to form a coating film, and drying and curing the coating film. Can be formed.
- the pressure-sensitive adhesive layer as the functional layer 20 is formed by, for example, applying a solution containing a pressure-sensitive adhesive that forms the pressure-sensitive adhesive layer to the main surface 10a of the resin film 10 to form a coating film, and drying and curing the coating film. Can be formed.
- the hue adjustment layer as the functional layer 20 is, for example, applied to the main surface 10a of the resin film 10 with a dispersion liquid containing a pigment or the like that forms the hue adjustment layer and a main material such as a resin in which the pigment or the like is dispersed.
- the coating film can be formed by drying and curing the coating film.
- the refractive index adjusting layer as the functional layer 20 is a dispersion containing, for example, inorganic particles that form the refractive index adjusting layer on the main surface 10a of the resin film 10 and a main material such as a resin in which the inorganic particles are dispersed. It can be formed by applying a liquid to form a coating film, and drying and curing the coating film.
- the functional layer 20 is a single layer having a function of developing a high hardness on the surface and a function of absorbing ultraviolet rays.
- the major layer 10a of the resin film 10 is mainly composed of an ultraviolet absorbent and a resin in which the ultraviolet absorbent is dispersed. It can be formed by applying a dispersion liquid containing a material and a resin for forming a hard coat layer to form a coating film, and drying and curing the coating film.
- the resin that forms the main material and the resin that forms the hard coat layer may be the same.
- a multi-layered functional layer including a function that exhibits high hardness on the surface and a layer that has a function of absorbing ultraviolet light can be formed by the following method. Applying a dispersion liquid containing a UV absorber and a main material such as a resin in which the UV absorber is dispersed to the main surface 10a of the resin film 10 to form a coating film, and drying and curing the coating film Thus, an ultraviolet absorbing layer is formed. Then, a hard coat layer may be formed by applying a solution containing a resin for forming a hard coat layer to the ultraviolet absorbing layer to form a coat, and drying and curing the coat. By this method, a multilayer functional layer including a layer having a function of developing high hardness on the surface and a layer having a function of absorbing ultraviolet rays is formed.
- a multilayer functional layer including a single layer having a function of developing high hardness and a function of absorbing ultraviolet light on the surface and a layer of developing high hardness can be formed by the following method.
- a coating film is formed on the main surface 10a of the resin film 10 by applying a dispersion containing an ultraviolet absorbent, a main material such as a resin in which the ultraviolet absorbent is dispersed, and a resin that forms a hard coat layer, The coating film is dried and cured to form a single layer having a function of expressing high hardness and an ultraviolet absorption function on the surface, and further, a solution containing a resin that forms a hard coat layer on the single layer.
- a multilayer functional layer including a layer having a function of developing high hardness on the surface and a function of absorbing ultraviolet light and a layer having a function of developing high hardness on the surface is formed.
- the laminate 30 of the present embodiment obtained in this way is excellent in flexibility.
- the laminate 30 has functionality such as transparency, UV resistance, and a function to develop high hardness on the surface, which are required when applied to a base material of an optical member or a display member of a flexible device or a front plate. be able to.
- the laminated body 30 has Si / N of 8 or more on the main surface 10a of the resin film 10, the adhesiveness between the resin film 10 and the functional layer 20 is also excellent.
- the functional layer 20 is a layer (hard coat layer) having a function of developing high hardness on the surface, the functional layer 20 can have a high surface hardness.
- FIG. 4 is also a cross-sectional view showing an embodiment of the laminate.
- the laminate 30 shown in FIG. 4 further includes a primer layer 25 provided between the resin film 10 and the functional layer 20 in addition to the resin film 10 and the functional layer 20 similar to the laminate of FIG. Yes.
- the primer layer 25 is laminated on one main surface 10 a of the resin film 10.
- the functional layer 20 is laminated on the main surface 25a opposite to the main surface that contacts the resin film 10 of the primer layer 25.
- the primer layer 25 is a layer formed from a primer agent, and preferably contains a material that can enhance adhesion between the resin film 10 and the functional layer 20.
- the compound contained in the primer layer 25 may be chemically bonded to the polyimide polymer or silicon material contained in the resin film 10 at the interface.
- primer agent examples include a UV-curable, thermosetting, or two-component curable epoxy compound primer agent.
- the primer agent may be a polyamic acid. These primer agents are suitable for enhancing the adhesion between the resin film 10 and the functional layer 20.
- the primer agent may contain a silane coupling agent.
- the silane coupling agent may be chemically bonded to the silicon material contained in the resin film 10 by a condensation reaction.
- the silane coupling agent can be suitably used particularly when the compounding ratio of the silicon material contained in the resin film 10 is high.
- Examples of the silane coupling agent include compounds having an alkoxysilyl group having a silicon atom and 1 to 3 alkoxy groups covalently bonded to the silicon atom.
- a compound having a structure in which two or more alkoxy groups are covalently bonded to a silicon atom is preferable, and a compound having a structure in which three alkoxy groups are covalently bonded to a silicon atom is more preferable.
- the alkoxy group include a methoxy group, an ethoxy group, an isopropoxy group, an n-butoxy group, and a t-butoxy group. Among these, a methoxy group and an ethoxy group are preferable because reactivity with a silicon material can be increased.
- the silane coupling agent preferably has a substituent having high affinity with the resin film 10 and the functional layer 20.
- the substituent of the silane coupling agent is preferably an epoxy group, an amino group, a ureido group or an isocyanate group.
- the functional layer 20 contains (meth) acrylates
- the affinity increases when the silane coupling agent used for the primer layer 25 has an epoxy group, a methacryl group, an acrylic group, an amino group, or a styryl group. preferable.
- a silane coupling agent having a substituent selected from a methacryl group, an acryl group, and an amino group is preferable because it tends to have excellent affinity with the resin film 10 and the functional layer 20.
- the thickness of the primer layer 25 is appropriately adjusted according to the functional layer 20, but is preferably 0.01 nm to 20 ⁇ m.
- the thickness of the primer layer 25 is preferably 0.01 ⁇ m to 20 ⁇ m, and more preferably 0.1 ⁇ m to 10 ⁇ m.
- the primer layer 25 preferably has a thickness of 0.1 nm to 1 ⁇ m, and more preferably 0.5 nm to 0.1 ⁇ m.
- the laminate 30 in FIG. 4 forms a coating film by applying a solution in which the primer agent is dissolved to the main surface 10a of the resin film 10 and then drying and curing the formed coating film to form a primer layer. It can manufacture by the method including doing.
- the method for forming other members is the same as that of the laminate 30 in FIG.
- the primer layer 25 may be cured simultaneously with the functional layer 20 or may be separately cured before the functional layer 20 is formed.
- the laminate of the present embodiment has high transparency and can maintain excellent visibility when bent. Moreover, this laminated body can also have the outstanding flexibility. Moreover, when the primer layer is provided between the resin film and the functional layer, the adhesiveness of the resin film and the functional layer becomes high.
- the laminate can have functionality such as transparency, UV resistance, and surface hardness required when applied to an optical member of a flexible device or a substrate of a display member, or a front plate.
- the structure of the resin film and the laminate can be modified as appropriate.
- functional layers can be provided on both sides of the resin film as in the laminate 30 in FIG.
- a primer layer may be provided between each functional layer and the resin film.
- FIG. 5 is a cross-sectional view showing an embodiment of a display device.
- a display device 100 illustrated in FIG. 5 includes an organic EL device 50, a touch sensor 70, and a front plate 90. These are usually housed in a housing.
- the organic EL device 50 and the touch sensor 70 and the touch sensor 70 and the front plate 90 are bonded with, for example, an optical adhesive (not shown) (Optical Clear Adhesive, OCA).
- OCA Optical Clear Adhesive
- the organic EL device 50 is a display member having an organic EL element 51, a first substrate 55, a second substrate 56, and a sealing material 59.
- the organic EL element 51 has a pair of electrodes (first electrode 52 and second electrode 53) and a light emitting layer 54.
- the light emitting layer 54 is disposed between the first electrode 52 and the second electrode 53.
- the first electrode 52 is made of a light-transmitting conductive material.
- the second electrode 53 may also have optical transparency.
- a known material can be employed as the first electrode 52 and the second electrode 53.
- the light emitting layer 54 can be formed of a known light emitting material constituting the organic EL element.
- the light emitting material may be either a low molecular compound or a high molecular compound.
- the first substrate 55 is made of a light transmissive material.
- the second substrate 56 may be light transmissive.
- substrate 56 are bonded together by the sealing material 59 arrange
- the first substrate 55, the second substrate 56, and the sealing material 59 form a sealing structure that seals the organic EL element inside.
- the first substrate 55 and / or the second substrate 56 is often a gas barrier material.
- an inorganic material such as glass or a known transparent resin such as an acrylic resin can be used.
- a transparent resin such as an acrylic resin
- the above-described resin film or laminate according to the present embodiment can also be employed.
- the first substrate 55 and the second substrate 56 that can employ the resin film or laminate according to the present embodiment correspond to the base material or gas barrier material of the display member in the present embodiment.
- the organic EL device 50 including the first substrate 55 and the second substrate 56 employs the laminate according to the present embodiment, and thus has excellent flexibility.
- the touch sensor 70 is an optical member having a touch sensor base 71 and an element layer 72 having a detection element formed on the touch sensor base 71.
- the touch sensor substrate 71 is made of a light transmissive material.
- an inorganic material such as glass or a known transparent resin such as an acrylic resin can be used.
- the touch sensor substrate 71 the resin film or laminate according to the present embodiment described above can also be employed.
- a known detection element composed of a semiconductor element, a wiring, a resistor, and the like is formed.
- a configuration of the detection element a configuration that realizes a known detection method such as a matrix switch, a resistance film method, or a capacitance method can be adopted.
- the touch sensor substrate 71 that can employ the laminate according to the present embodiment corresponds to the optical member in the present embodiment. Since the touch sensor 70 having such a touch sensor substrate 71 employs the resin film or laminate according to the present embodiment, it has excellent flexibility.
- the front plate 90 is made of a light transmissive material.
- the front plate 90 is located on the outermost layer on the display screen side of the display device and functions as a protective member that protects the display device.
- the front plate may be referred to as a window film.
- an inorganic material such as glass or a known transparent resin such as an acrylic resin can be used.
- the front plate 90 the above-described resin film or laminate according to this embodiment can also be employed.
- the laminated body is usually arranged in such a direction that the functional layer is located outside the display device.
- the front plate 90 that can employ the resin film or laminate according to the present embodiment is excellent in flexibility because it employs the resin film or laminate according to the present embodiment.
- the display device 100 can have excellent flexibility as a whole. . That is, the display device 100 can be a flexible device. In addition, the outer surface of the display device 100 can have a high surface hardness.
- the apparatus (flexible device) to which the resin film or the laminate according to the present embodiment can be applied is not limited to the display device.
- it is also applicable to a solar cell having a substrate on which a photoelectric conversion element is formed and a front plate provided on the substrate surface.
- the solar cell can have excellent flexibility as a whole.
- Example 1 A nitrogen-substituted polymerization tank was charged with a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), a catalyst and a solvent ( ⁇ -butyrolactone and dimethylacetamide). .
- the amount charged is 75.0 g of the compound represented by formula (1), 36.5 g of the compound represented by formula (2), 76.4 g of the compound represented by formula (3), 1.5 g of catalyst, and ⁇ -butyrolactone. 438.4 g and dimethylacetamide 313.1 g.
- the molar ratio of the compound represented by Formula (2) and the compound represented by Formula (3) is 3: 7, and the total of the compound represented by Formula (2) and the compound represented by Formula (3) is The molar ratio with the compound represented by Formula (1) was 1.00: 1.02.
- polyimide polyimide polymer containing a repeating structural unit of the formula (PI) was obtained by purification and drying.
- the mass ratio of silica particles to polyimide is 60:40
- the amount of alkoxysilane having an amino group is 1.67 parts by mass with respect to a total of 100 parts by mass of silica particles and polyimide
- the amount of water is silica particles and polyimide. 10 parts by mass with respect to 100 parts by mass in total.
- the mixed solution was applied to a glass substrate and dried by heating at 50 ° C. for 30 minutes and at 140 ° C. for 10 minutes. Thereafter, the film was peeled off from the glass substrate, a metal frame was attached, and the film was heated at 210 ° C. for 1 hour to obtain a resin film having a thickness of 80 ⁇ m.
- the content of silica particles in this resin film is 60% by mass.
- the yellowness (YI value) of the obtained resin film was 2.3.
- Example 2 A mixed solution for changing a polyimide to a polyimide having a glass transition temperature of 300 ° C. (“Neoprim” manufactured by Mitsubishi Gas Chemical Co., Ltd., a polyimide-based polymer containing a repeating structural unit of the formula (PI)) and forming a resin film A resin film having a thickness of 80 ⁇ m was obtained in the same manner as in Example 1 except that the mass ratio of silica particles to polyimide was changed to 30:70. The yellowness (YI value) of the obtained resin film was 1.8.
- Example 3 The polyimide is changed to “KPI-MX300F (100), a polyimide-based polymer containing a repeating structural unit of the formula (PI)” manufactured by Kawamura Sangyo Co., Ltd., and the silica particles and polyimide in the mixed solution for forming the resin film are changed.
- a resin film having a thickness of 75 ⁇ m was obtained in the same manner as in Example 1 except that the mass ratio was changed to 20:80.
- the yellowness (YI value) of the obtained resin film was 2.2.
- Example 3 A resin film having a thickness of 80 ⁇ m was obtained in the same manner as in Example 1 except that the alkoxysilane having an amino group was not added to the mixed solution for forming the resin film. The resulting resin film had a yellowness (YI value) of 2.5.
- Elastic modulus As an elastic modulus measuring device, Autograph AG-IS manufactured by Shimadzu Corporation was used. A strip-shaped resin film having a width of 10 mm and a length of 100 mm was prepared as a test piece. A tensile test was performed under the conditions of a distance between chucks of 50 mm and a speed of 20 mm / min, and the tensile elastic modulus of the resin film was measured.
- Glass transition temperature (Tg) As a measuring device, DSC Q200 manufactured by TA Instruments was used. The differential operation calorimetry (DSC) of the resin film was performed under the conditions of a sample amount: 5 mg, a temperature range: room temperature to 400 ° C., and a heating rate: 10 ° C./min. The glass transition temperature was determined from the obtained DSC curve.
- FIG. 6 is a schematic view showing a bending test method.
- a desktop durability tester “DLDMMLH-FS” manufactured by Yuasa System Equipment Co., Ltd. was used as a test apparatus.
- the bending test in FIG. 6 is also referred to as a planar body no-load U-shaped extension test.
- the two ends of a flat strip-shaped resin film 10 (width 10 mm ⁇ length 100 mm) are respectively connected to a pair of plates 1a and 1b arranged to face each other. And fixed in a state of being sandwiched between another pair of plates 2a and 2b arranged opposite to each other.
- the plate 1a and the plate 2a were arranged on the same surface side of the resin film 10.
- the plates 1a and 2a were turned inside, and the resin film was folded into a U shape so that these plates faced each other.
- the distance 2R between the resin films 10 that were bent and faced each other was set to 3 mm.
- the bent resin film 10 was returned to the state shown in FIG. With this as one cycle, the resin film 10 was repeatedly bent (bent) at a cycle of 1 cycle / 1.2 seconds. The test was continued until the number of bendings (cycle number) reached 100,000. If the laminate broke before the end of the test, the number of flexures at that time was recorded.
- Pencil hardness (resin film)
- the pencil hardness of the resin film fixed on the glass substrate was measured according to JIS K5600-5-4.
- the load for measuring the pencil hardness was 1 kg.
- Pencil hardness (adhesion layer / resin film / hard coat layer)
- a hard coating agent UVHC7800G (trade name), manufactured by Momentive
- UVHC7800G trade name
- a curing condition including heating at 80 ° C. for 3 minutes and exposure to irradiation energy of 500 mJ / cm 2
- An adhesive layer having a thickness of 25 ⁇ m and an elastic modulus of about 1 MPa was formed on a glass substrate using an acrylic adhesive.
- the laminated body was affixed to the adhesive layer in such a direction that the resin film was on the adhesive layer side.
- the pencil hardness of the hard coat layer surface was measured according to JIS K5600-5-4.
- the load for measuring the pencil hardness was 1 kgf.
- Table 1 shows the evaluation results.
- the resin films of the examples had a tensile modulus of 4 GPa or more and did not break up to 100,000 times of bending in the bending test.
- the resin film of Comparative Example 1 did not break after 100,000 times of bending, but its elastic modulus was less than 4.0 GPa.
- the resin film of Comparative Example 2 was less than 4.0 GPa and was broken with a number of flexes of less than 30000 times.
- the resin film of Comparative Example 3 had an elastic modulus of 4.0 GPa or more, it was broken with a number of flexes of less than 1000.
- the resin film of Comparative Example 4 had an elastic modulus of 4.0 GPa or more, it was ruptured with less than 20000 times of bending.
- the pencil hardness on the surface of the resin film in the glass substrate / resin film laminate no difference was observed between the Examples and Comparative Examples 1, 2, 3, and 4.
- the pencil hardness of the hard coat layer surface in the laminate of the adhesive layer / resin film / hard coat layer showed a sufficiently high value only in the case of the resin film of the example. From this result, the resin film satisfies both the tensile elastic modulus of 4 GPa or more and the number of bendings exceeding 100,000 times, so that the hardness of the hard coat layer surface in the laminate of the adhesive layer / resin film / hard coat layer is sufficient. It was confirmed that can be imparted.
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Abstract
Description
図1は、樹脂フィルムの一実施形態を示す断面図である。図1に示す樹脂フィルム10は、ポリイミド系高分子を含有し、対向する一対の主面10a及び10bを有する。
本明細書において、「系化合物」とは、当該「系化合物」が付される化合物の誘導体を指す。例えば、「ベンゾフェノン系化合物」とは、母体骨格としてのベンゾフェノンと、ベンゾフェノンに結合している置換基とを有する化合物を指す。
樹脂フィルム10の主面10a及び/又は10bには、後述する機能層との密着性を向上するために、プラズマ処理又はコロナ放電処理のような表面処理が施されていてもよい。
図3は、積層体の一実施形態を示す断面図である。図3に示す積層体30は、樹脂フィルム10と樹脂フィルム10の一方の主面10aに積層された機能層20とを有する積層体である。
樹脂フィルム10の主面10aに、紫外線吸収剤と、紫外線吸収剤が分散される樹脂などの主材とを含む分散液を塗布して塗膜を形成し、その塗膜を乾燥及び硬化させることにより紫外線吸収層を形成する。次いで、その紫外線吸収層に、ハードコート層を形成する樹脂を含む溶液を塗布して塗膜を形成し、その塗膜を乾燥及び硬化させることによりハードコート層を形成してもよい。この方法により、表面に高硬度を発現する機能を有する層と紫外線吸収の機能を有する層とを含む多層の機能層が形成される。
樹脂フィルム10の主面10aに、紫外線吸収剤と、紫外線吸収剤が分散される樹脂などの主材と、ハードコート層を形成する樹脂とを含む分散液を塗布して塗膜を形成し、その塗膜を乾燥及び硬化させて、表面に高硬度を発現する機能及び紫外線吸収の機能を有する単層を形成し、さらに、その単層上に、ハードコート層を形成する樹脂を含む溶液を塗布して塗膜を形成し、その塗膜を乾燥及び硬化させることにより、ハードコート層を形成してもよい。この方法により、表面に高硬度を発現する機能及び紫外線吸収の機能を有する層と表面に高硬度を発現する機能を有する層とを含む多層の機能層が形成される。
図5は、表示装置の一実施形態を示す断面図である。図5に示す表示装置100は、有機EL装置50と、タッチセンサー70と、前面板90とを有する。これらは通常、筐体に収容されている。有機EL装置50とタッチセンサー70との間、及びタッチセンサー70と前面板90との間は、たとえば不図示の光学接着剤(Optical Clear Adhesive、OCA)で接着されている。
窒素置換した重合槽に、式(1)で表される化合物、式(2)で表される化合物、式(3)で表される化合物、触媒及び溶媒(γブチロラクトン及びジメチルアセトアミド)を仕込んだ。仕込み量は、式(1)で表される化合物75.0g、式(2)で表される化合物36.5g、式(3)で表される化合物76.4g、触媒1.5g、γブチロラクトン438.4g、ジメチルアセトアミド313.1gとした。式(2)で表される化合物と式(3)で表される化合物とのモル比は3:7、式(2)で表される化合物及び式(3)で表される化合物の合計と式(1)で表される化合物とのモル比は、1.00:1.02であった。
ポリイミドを、300℃のガラス転移温度を有するポリイミド(三菱ガス化学社製「ネオプリム」、式(PI)の繰り返し構造単位を含むポリイミド系高分子)に変更し、樹脂フィルムを形成するための混合溶液におけるシリカ粒子とポリイミドの質量比を30:70に変更したこと以外は実施例1と同様にして、厚み80μmの樹脂フィルムを得た。得られた樹脂フィルムの黄色度(YI値)は、1.8であった。
ポリイミドを河村産業(株)製「KPI-MX300F(100)、式(PI)の繰り返し構造単位を含むポリイミド系高分子」に変更し、樹脂フィルムを形成するための混合溶液におけるシリカ粒子とポリイミドの質量比を20:80に変更したこと以外は実施例1と同様にして、厚み75μmの樹脂フィルムを得た。得られた樹脂フィルムの黄色度(YI値)は、2.2であった。
300℃のガラス転移温度を有するポリイミド(三菱ガス化学社製「ネオプリム」、式(PI)の繰り返し構造単位を含むポリイミド系高分子)を用い、このポリイミドのみを溶解したγ-ブチロラクトン溶液をガラス基板に塗布した。その他は実施例1と同様にして、80μmの樹脂フィルムを得た。得られた樹脂フィルムの黄色度(YI値)は、1.8であった。
ポリイミドを、390℃のガラス転移温度を有するポリイミド(三菱ガス化学社製「ネオプリム」、式(PI)の繰り返し構造単位を含むポリイミド系高分子)に変更したこと以外は比較例1と同様にして、厚み80μmの樹脂フィルムを得た。得られた樹脂フィルムの黄色度(YI値)は、1.4であった。
樹脂フィルムを形成するための混合溶液に、アミノ基を有するアルコキシシランを加えなかったこと以外は、実施例1と同様にして、厚み80μmの樹脂フィルムを得た。得られた樹脂フィルムの黄色度(YI値)は、2.5であった。
ポリイミドを、300℃のガラス転移温度を有するポリイミド(三菱ガス化学社製「ネオプリム」、式(PI)の繰り返し構造単位を含むポリイミド系高分子)に変更し、樹脂フィルムを形成するための混合溶液におけるシリカ粒子とポリイミドの質量比を40:60に変更し、アミノ基を有するアルコキシシランを混合溶液に加えなかったこと以外は、実施例1と同様にして、厚み80μmの樹脂フィルムを得た。得られた樹脂フィルムの黄色度(YI値)は、2.2であった。
1)弾性率
弾性率の測定装置として、島津製作所製、オートグラフAG-ISを用いた。幅10mm、長さ100mmの短冊状の樹脂フィルムを試験片として準備した。チャック間距離50mm、速度20mm/分の条件で引張試験を行い、樹脂フィルムの引張弾性率を測定した。
測定装置として、TA Instruments製、DSC Q200を用いた。試料量:5mg、温度域:室温~400℃、昇温速度:10℃/分の条件で、樹脂フィルムの示差操作熱量測定(DSC)を行った。得られたDSC曲線から、ガラス転移温度を求めた。
樹脂フィルムの黄色度(Yellow Index:YI値)を、日本分光社製の紫外可視近赤外分光光度計V-670によって測定した。サンプルがない状態でバックグランド測定を行った後、樹脂フィルムをサンプルホルダーにセットして、300nm~800nmの光に対する透過率測定を行い、3刺激値(X、Y、Z)を求めた。YI値を、下記の式に基づいて算出した。
YI=100×(1.2769X-1.0592Z)/Y
図6は、屈曲試験の方法を示す概略図である。試験装置として、ユアサシステム機器株式会社製 卓上型耐久試験機「DLDMLH-FS」を使用した。図6の屈曲試験は、面状体無負荷U字伸縮試験とも称される。図6の(a)に示すように、平面形状の1枚の短冊状の樹脂フィルム10(幅10mm×長さ100mm)の両末端を、それぞれ、対向配置された1対のプレート1a及び1bの間、及び、対向配置されたもう1対のプレート2a及び2bの間に挟んだ状態で固定した。プレート1a及びプレート2aを、樹脂フィルム10の同じ面側に配置させた。次いで、図6の(b)に示されるように、プレート1a及び2aを内側にして、これらプレートが向き合うように樹脂フィルムをU字型に折り曲げた。このとき、折り曲げられて向き合う樹脂フィルム10間の距離2Rを3mmに設定した。その後、折り曲げられた樹脂フィルム10を、再び図6の(a)の状態に戻した。これを1サイクルとして、1サイクル/1.2秒の周期で樹脂フィルム10を繰り返し折り曲げた(屈曲した)。屈曲回数(サイクル数)が100000回になるまで試験を継続した。試験終了前に積層体が破断した場合、その時点の屈曲回数を記録した。
ガラス基材上に固定された樹脂フィルムの鉛筆硬度を、JIS K5600-5-4に準拠して測定した。鉛筆硬度の測定における荷重は1kgとした。
樹脂フィルムの一方の主面上に、ハードコート剤(UVHC7800G(商品名)、Momentive社製)を用いて、80℃で3分の加熱、及び500mJ/cm2の照射エネルギーの露光を含む硬化条件で、厚さ5~6μmのハードコート層を形成させ、樹脂フィルム及びハードコート層(機能層)からなる積層体を作製した。
ガラス基材上に、アクリル系粘着剤を用いて厚さ25μmで弾性率約1MPaの粘着層を形成させた。この粘着層に、上記積層体を、樹脂フィルムが粘着層側になる向きで貼り付けた。この状態で、ハードコート層表面の鉛筆硬度を、JIS K5600-5-4に準拠して測定した。鉛筆硬度の測定における荷重は1kgfとした。
比較例2の樹脂フィルムは、4.0GPa未満であり、30000回未満の屈曲回数で破断した。比較例3の樹脂フィルムは、4.0GPa以上の弾性率を有するものの、1000回未満の屈曲回数で破断した。比較例4の樹脂フィルムは、4.0GPa以上の弾性率を有するものの、20000回未満の屈曲回数で破断した。ガラス基材/樹脂フィルムの積層体における樹脂フィルム表面の鉛筆硬度は、実施例と比較例1、2、3、4とで差異は認められなかった。しかし、粘着層/樹脂フィルム/ハードコート層の積層体におけるハードコート層表面の鉛筆硬度は、実施例の樹脂フィルムの場合のみ、十分に高い値が示された。この結果から、樹脂フィルムが、4GPa以上の引張弾性率、及び100000回を超える屈曲回数の両方を満たすことで、粘着層/樹脂フィルム/ハードコート層の積層体におけるハードコート層表面に十分な硬度を付与できることが確認された。
Claims (11)
- ポリイミド系高分子を含有する樹脂フィルムであって、
樹脂フィルムの引張弾性率が4.0GPa以上であり、
当該樹脂フィルムを向かい合う当該樹脂フィルム間の距離が3mmになるまでU字型に折り曲げて戻すことを繰り返す屈曲試験において、当該樹脂フィルムが破断するまで当該樹脂フィルムを折り曲げる回数が100000回を超え、かつ、黄色度が5以下である、樹脂フィルム。 - 樹脂フィルムの厚みが30~100μmである請求項1に記載の樹脂フィルム。
- 請求項1又は2に記載の樹脂フィルムと、該樹脂フィルムの少なくとも一方の面側に設けられた機能層と、を備える積層体。
- 樹脂フィルムと機能層との間に設けられたプライマー層を更に備える請求項3に記載の積層体。
- 機能層が、樹脂フィルムの両方の面側に設けられており、
一方の面側の機能層が表面に高硬度を発現する層で、他方の面側の機能層が粘着性の機能を有する層である請求項3又は4に記載の積層体。 - 請求項1又は2に記載の樹脂フィルムを備える光学部材。
- 請求項1又は2に記載の樹脂フィルムを備えるガスバリア材。
- 請求項1又は2に記載の樹脂フィルムを備えるタッチセンサー基材。
- 請求項3~5のいずれか一項に記載の積層体を備える光学部材。
- 請求項3~5のいずれか一項に記載の積層体を備えるガスバリア材。
- 請求項3~5のいずれか一項に記載の積層体を備えるタッチセンサー基材。
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Also Published As
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JPWO2017014287A1 (ja) | 2018-05-24 |
CN107849271B (zh) | 2021-04-23 |
CN107849271A (zh) | 2018-03-27 |
KR20170108993A (ko) | 2017-09-27 |
TWI694099B (zh) | 2020-05-21 |
US10399310B2 (en) | 2019-09-03 |
KR101874616B1 (ko) | 2018-07-05 |
JP7061641B2 (ja) | 2022-04-28 |
KR20180077331A (ko) | 2018-07-06 |
TW201718727A (zh) | 2017-06-01 |
JP6715432B2 (ja) | 2020-07-01 |
US20180370207A1 (en) | 2018-12-27 |
KR102410410B1 (ko) | 2022-06-17 |
JP2020128547A (ja) | 2020-08-27 |
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