WO2017013253A1 - Dispositif pour manipuler des substrats plats - Google Patents

Dispositif pour manipuler des substrats plats Download PDF

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Publication number
WO2017013253A1
WO2017013253A1 PCT/EP2016/067556 EP2016067556W WO2017013253A1 WO 2017013253 A1 WO2017013253 A1 WO 2017013253A1 EP 2016067556 W EP2016067556 W EP 2016067556W WO 2017013253 A1 WO2017013253 A1 WO 2017013253A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
suction head
suction
contact element
sensor
Prior art date
Application number
PCT/EP2016/067556
Other languages
German (de)
English (en)
Inventor
Peter Allgaier
Harald Wanka
Matthias DREWS
Klaus Mang
Original Assignee
Asys Automatisierungssysteme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asys Automatisierungssysteme Gmbh filed Critical Asys Automatisierungssysteme Gmbh
Publication of WO2017013253A1 publication Critical patent/WO2017013253A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the invention relates to a device for handling flat substrates, in particular printed circuit boards, Wavern, solar cells, glass substrates, glassubstratbasêt components, displays, Dünnschich- tide, in particular thin-film solar cells or the like, with a suction head for holding a substrate, wherein the suction head is an annular contact element for laying on the substrate, and with a suction device operatively connected to the vacuum device for generating a negative pressure in a suction space between the suction head and the substrate.
  • planar substrates can be handled by gripping means, which only at the top of the substrate and hold by generating a negative pressure, the substrate.
  • gripping devices have a suction head with an annular contact element which is pressed onto the surface of the substrate for gripping the substrate so that the annular contact element rests fully on the substrate.
  • a vacuum device By means of a vacuum device, a negative pressure in the pressure space between the suction head and the substrate can then be generated, through which the substrate is attracted to the suction head and thus gripped.
  • the contact element often leaves marks on the surface of the substrate and can not be placed anywhere on the substrate. In this case, a plurality of suction heads distributed over the substrate must be placed on the substrate, for which purpose the substrate must have a corresponding number of points, to each of which a suction head can be placed.
  • the invention is therefore based on the object to provide a device for handling flat substrates, which allows a secure gripping of the substrate without critical mechanical stress of the substrate, and without the substrate for this must have special precautions.
  • the object underlying the invention is achieved by a device having the features of claim 1.
  • This has the advantage that the gripping device acts on the substrate overall from only one side, that the substrate does not have to be engaged behind when lifting from a plane, and that at the same time mechanical stresses due to undesired deflections of the substrate are avoided.
  • the annular course of the contact element of the Outside edge contour of the substrate corresponds.
  • the suction head is thus at least in the region of the contact element at least as large as the substrate itself, so that the contact element extends when placed on the substrate at its outer edge along. Because the outer edge of substrates is often inoperative, this can be used well for supporting the contact element.
  • the substrate is thus almost completely charged with the negative pressure by the vacuum device.
  • the substrate as a whole is drawn against the suction head, wherein regions of the substrate are also pulled in the direction of the suction head, which are spaced from the contact element.
  • the negative pressure also ensures that bending of the substrate is prevented. This results in at most on the outer edge of the substrate imprints through the contact element. Elements already provided on the substrate are not influenced by the gripping device and mechanical stresses on the substrate are avoided.
  • the contact element has an elastically deformable sealing lip.
  • the elastic deformability of the sealing lip ensures that it adapts to the substrate, so that, for example, manufacturing tolerances are compensated by elastic deformation of the sealing lip.
  • the sealing lip ensures that the substrate is not damaged during the suction in the contact region of the contact element.
  • the sealing lip surrounds the outer edge of the substrate. It is provided that the sealing lip rests at least partially on the outside of the substrate. This will become the substrate kept guided on the suction head, whereby a secure holding and transporting the substrate is ensured.
  • the sealing lip has a centering bevel so that when placing the suction head on the substrate they are automatically aligned with each other to ensure the highest possible density of the contact element on or on the substrate.
  • the vacuum device has at least one device for determining a deflection of the substrate.
  • the deflection of the substrate By determining the deflection of the substrate can be ensured that a user can be pointed out, for example, to an excessive deflection in order to interrupt the gripping process when needed. At the same time, the quality of the substrate can be checked by means of this device. For example, in case of an unexpected deflection of the substrate, it can be assumed that the material used or the production of the substrate has been faulty.
  • the device has a pressure sensor for determining the negative pressure in the suction space between the suction head and the substrate. If, for example, an unexpected pressure profile is detected, then it can be concluded that a bending of the substrate must have taken place.
  • the pressure value determined by the pressure sensor is preferably used to ensure a predeterminable minimum vacuum and thus a secure gripping of the substrate.
  • the pressure sensor is assigned according to a first embodiment of the vacuum device and detected in particular in a connecting channel between the vacuum device and the suction head there prevailing negative pressure.
  • the vacuum device is designed in particular as a vacuum pump. According to a second embodiment, it is preferably provided that the pressure sensor is associated with the suction head to detect directly there the pressure where it is crucial for the secure gripping of the substrate.
  • the device has a spacing sensor which is arranged in particular in the suction head and detects a distance of the substrate from the outer edge of the substrate to the suction head at a distance from one another. By determining the distance, in particular by detecting a change in distance can be concluded in a simple manner to a bending of the substrate.
  • the distance sensor detects a distance of a substrate centrally with respect to the contact element.
  • the distance is detected at the point which usually moves at a correspondingly high negative pressure furthest in the direction of the suction head under deflection of the substrate.
  • bending of the substrate is particularly reliably detectable.
  • the distance sensor is designed as a contact-free operating sensor, in particular as a laser or ultrasonic sensor.
  • the contactless design of the sensor ensures that additional physical contact with the substrate is avoided, thereby ensuring damage to the substrate or the elements applied to the substrate during gripping is avoided.
  • the non-contact distance measurement enables it to be carried out at any point on the substrate, regardless of whether the point is installed or not.
  • the distance sensor has at least one movable measuring sensor which, in particular in the unused state, protrudes from the suction head beyond the contact element.
  • the sensor is thus also placed on the substrate when the suction head is seated on the substrate and, in particular, cushions when placed until the suction head is completely seated. Further adjustments of the probe are then effected only by a deflection of the substrate and can be evaluated accordingly.
  • the vacuum device has a pressure control device which regulates the negative pressure in dependence on the detected deflection of the substrate or in dependence on the detected distance or the detected change in distance. It is provided that the vacuum device regulates the negative pressure such that a deflection of the substrate is avoided.
  • the pressure regulating device which regulates the negative pressure as a function of the distance, it is possible in a simple manner to counteract a bending of the substrate by increasing or decreasing the negative pressure, depending on which direction the substrate bends through.
  • the vacuum device in particular the suction head, having an actuatable valve
  • the at its operation connects the suction chamber with the environment for pressure equalization.
  • actuating the valve a rapid pressure equalization between the suction chamber and the environment is possible, whereby the pressure level in the suction chamber can be changed in a short time. This is for example advantageous if the substrate bends suddenly. Opening the valve ensures that further deflection is prevented in the shortest possible time, thus ensuring the integrity of the substrate.
  • FIG. 1 shows a device for handling a flat substrate in a simplified sectional illustration.
  • the figure shows a simplified sectional view of a device 1 for handling flat or plate-shaped substrates.
  • a substrate 2 is exemplified, which is formed for example as a solar cell, wafer or circuit board, and on a bottom 3, for example, a printing or transporting device, rests.
  • the substrate 2 may also be formed as a glass substrate, glass substrate-based component, display, thin-film element or thin-film solar cell.
  • the substrate 2 may in each case be bare or equipped with one or more components.
  • the device 1 has a suction head 4, which, viewed in longitudinal section, has the contour of a hyperbolic funnel.
  • a contact element 6 which is annular, wherein the ring shape of the contact element 6 corresponds to the contour of an outer edge 7 of the substrate 2.
  • the contact element 6 is formed as elastically deformable sealing lip 8.
  • the sealing lip 8 has a centering bevel 9 which extends over the entire circumference of the contact element 6 and is designed such that the substrate 2 can always be arranged between the outermost points of the sealing lip 8.
  • the distance from opposite extreme points of the sealing lip 8 or the opening width of the sealing lip 8 is expediently always greater than the width of the substrate 2 at the free end of the sealing lip 8.
  • the suction head 4 can be placed in a simple manner on the substrate 2, as shown in the figure.
  • the centering bevel 9 helps to securely grasp the substrate 2 in such a way that the suction head 4 rests with the contact element 6 peripherally on the outer edge 7 of the substrate 2.
  • the suction head 4 is conveniently held by a robot arm or the like, which can spend the suction head 4 in different positions. If, according to an advantageous exemplary embodiment, the suction head 4 is supported on the robot arm or on the movement device and / or the substrate is displaceable on the bottom 3, the centering bevel 9 can also be used to automatically align the suction head 4 with the substrate 2.
  • the apparatus 1 further comprises a vacuum device 11, which is designed to set a negative pressure, that is to say a lower pressure in comparison to the ambient pressure outside the suction head 4, in a suction space 12 formed between the suction head 4 and the substrate 2.
  • the vacuum device 1 1 expediently conveys the volume of air in the suction chamber 12 when placing the suction head 4 on the wheel 2 out of the suction chamber 12, as indicated by an arrow 13.
  • the substrate 2 By generating the negative pressure in the suction chamber 12 it is achieved that the substrate 2 is sucked or attracted to the suction head 4, in particular against the contact element 6. By adjusting the negative pressure, the substrate 2 is thus gripped by the device 1 and can be moved by moving the suction head 4 and, for example, transported from a first device to a second device.
  • the annular profile of the contact element 6 corresponds to the outer edge 7 or the outer edge contour of the substrate 2, ensures that a mechanical contact between the suction head 4 and substrate 2 takes place only at the outer edge, whereby the remaining surface 10 of the substrate 2 is not mechanically a force is applied, which could lead to damage or contamination of the surface 10.
  • a distance sensor 15 and a pressure regulating device 16 are provided.
  • the distance sensor 15 is held centrally in the suction head 4 in the present case.
  • the suction head 4 has a plurality of, in particular three, struts 17 which are distributed over the circumference of the suction head 4 and which lead into the center of the suction head 4, where they open into a receiving ring 18 which has a receiving opening 19 for receiving the distance sensor 15 ,
  • the struts 17 are formed integrally with the suction head 4, in particular with its jacket wall.
  • the vacuum device 1 1 does not necessarily have to be arranged in the extension of the central axis of the suction head 4. Rather, the vacuum device 1 1 can be arranged independently of the suction head 4 and connected for example by a hose connection or pipe connection with the suction head 4.
  • the arrangement shown in the figure is only to be understood as an example.
  • the distance sensor 15 is designed as a contact-free operating sensor, for example as a laser sensor or ultrasound sensor, which determines the distance or the distance to the surface 10 of the substrate 2.
  • the distance sensor 15 Due to the central arrangement of the distance sensor 15, the distance to the center of the surface 10 is detected, as shown by a dashed line.
  • the distance sensor 15 is aligned in such a way that it determines the distance in a perpendicular to the surface 10 of the substrate 2.
  • the distance sensor 15 detects a first distance A to the substrate 2. If the vacuum device 1 1 driven to generate a negative pressure in the suction chamber 12, the detected distance may change when the substrate 2 bends, as through the Line 14 indicated. In this case, a distance B is detected which is shorter than the distance A. In the present embodiment, the deflection and the associated changes in distance are exaggerated for better understanding.
  • the substrate 2 bends. It is hereby recognized that the substrate 2 bends in the direction of the suction head 4 when the distance is reduced, and that the substrate 2 deflects away in the direction away from the suction head 4 as the distance increases.
  • the reduction in distance means that the vacuum set in the suction chamber is too high.
  • the second case shows the Increasing the distance that the negative pressure is chosen too small, so that the substrate 2 by gravity from the suction head 4 downwardly deflects (not shown).
  • the device 1 further comprises a pressure control device 16, which is associated in particular with the vacuum device 11, as shown in the figure.
  • the pressure control device 16 is connected to the distance sensor 15 and regulates the negative pressure set by the vacuum device 11 in the suction chamber 12 as a function of the distance detected by the distance sensor 15 and thus in dependence on a bending of the substrate 2. Takes the currently detected distance the reference distance, the set negative pressure in the suction chamber 12 is reduced. If the currently determined distance increases compared to the reference distance, the negative pressure is increased. As a result, the respective deflection is advantageously counteracted.
  • the device 1 further comprises an actuatable valve 20, which is presently designed as a valve flap, and associated with a in the jacket wall of the suction head 4 associated opening 21 which leads into the suction chamber 12.
  • the valve flap 20 is preferably arranged on the outside of the suction head 4, so that it is pulled in the direction of the jacket wall by the negative pressure.
  • the valve 20 is actuated by an actuator 22 so that the opening 21 released and a pressure equalization between the environment and the suction chamber 12 can take place. This makes it possible to reduce the negative pressure in the suction chamber 12 in a short time.
  • a pressure sensor 23 which monitors the prevailing in the suction chamber 12 negative pressure. If a deviation from an expected pressure curve is determined on the basis of the determined pressure curve, then it is concluded that a deflection of the substrate 2 must have occurred, so that the pressure regulating device 16 regulates the negative pressure in the suction chamber 12 to avoid the deflection as a function of the pressure curve.
  • a device 1 which allows a secure gripping a substrate without special mechanical stress of the substrate, at the same time a gripping behind the substrate is not necessary and the substrate may already be equipped with electrical / electronic components, through the suction head 4th are not affected, because this rests only on the outer edge 7 of the substrate 2 by means of the contact element 6.
  • the control of the vacuum device 1 which in particular has a vacuum pump, can be done by regulating the pump power. Alternatively it can be provided that a fixed pump power is predetermined and a gas feed via a flow meter or by opening valves, such as is influenced by the valve element 20.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

La présente invention concerne un dispositif (1) pour manipuler des substrats plats (2), notamment des cartes de circuit imprimé, des tranches de semi-conducteur ou des cellules solaires, comprenant au moins une tête d'aspiration (4) pour maintenir un substrat (2), la tête d'aspiration (4) présentant un élément de contact (6) annulaire à appliquer sur le substrat (2), et un dispositif de production de dépression (11) relié à la tête d'aspiration (4) et destiné à produire une dépression dans un espace d'aspiration (12) compris entre la tête d'aspiration (4) et le substrat (2). Selon l'invention, l'allure annulaire de l'élément de contact (6) correspond à un contour extérieur du substrat (2).
PCT/EP2016/067556 2015-07-22 2016-07-22 Dispositif pour manipuler des substrats plats WO2017013253A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015213818.6A DE102015213818A1 (de) 2015-07-22 2015-07-22 Vorrichtung zur Handhabung von flachen Substraten
DE102015213818.6 2015-07-22

Publications (1)

Publication Number Publication Date
WO2017013253A1 true WO2017013253A1 (fr) 2017-01-26

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ID=56561352

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/067556 WO2017013253A1 (fr) 2015-07-22 2016-07-22 Dispositif pour manipuler des substrats plats

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DE (1) DE102015213818A1 (fr)
WO (1) WO2017013253A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112408805A (zh) * 2020-11-16 2021-02-26 中建材蚌埠玻璃工业设计研究院有限公司 极薄玻璃减薄承载装置及减薄装置

Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
CN109300831B (zh) * 2018-11-30 2021-03-23 湖南文理学院 一种磁控溅射镀膜机用基片转移保护装置
DE102019129417B4 (de) * 2019-10-31 2022-03-24 Sick Ag Verfahren zum automatischen Handhaben von Objekten
DE102020105733A1 (de) 2020-03-04 2021-09-09 Bayerische Motoren Werke Aktiengesellschaft Greifelement für eine Vakuumgreifeinrichtung sowie Vakuumgreifeinrichtung

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EP0002516A1 (fr) * 1977-12-12 1979-06-27 International Business Machines Corporation Tête à dépression pour pièces planes et minces
EP0439241A2 (fr) * 1990-01-24 1991-07-31 MANNESMANN Aktiengesellschaft Appareil de manipulation avec une ventouse
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
WO2007033830A1 (fr) * 2005-09-22 2007-03-29 J. Schmalz Gmbh Pince aspirante dotee d'un corps aspirant elastique presentant un moyen indiquant l'etat d'aspiration
WO2007058693A1 (fr) * 2005-11-18 2007-05-24 Delta Design, Inc. Procede de transport automatique de puces ci, sur un reseau planaire de buses d'aspiration, vers une cible variable dans un testeur de puces
US7396022B1 (en) * 2004-09-28 2008-07-08 Kla-Tencor Technologies Corp. System and method for optimizing wafer flatness at high rotational speeds
US20100263157A1 (en) * 2009-04-15 2010-10-21 Samsung Techwin Co., Ltd. Vacuum nozzle control apparatus and head assembly for chip mounter having the same

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US6279976B1 (en) * 1999-05-13 2001-08-28 Micron Technology, Inc. Wafer handling device having conforming perimeter seal
US7726715B2 (en) * 2003-01-29 2010-06-01 Mitsuboshi Diamond Industrial Co., Ltd. Vacuum suction head
WO2005069366A1 (fr) * 2004-01-16 2005-07-28 Sharp Kabushiki Kaisha Dispositif d'adsorption de substrat et dispositif de collage de substrat

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0002516A1 (fr) * 1977-12-12 1979-06-27 International Business Machines Corporation Tête à dépression pour pièces planes et minces
EP0439241A2 (fr) * 1990-01-24 1991-07-31 MANNESMANN Aktiengesellschaft Appareil de manipulation avec une ventouse
US7396022B1 (en) * 2004-09-28 2008-07-08 Kla-Tencor Technologies Corp. System and method for optimizing wafer flatness at high rotational speeds
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
WO2007033830A1 (fr) * 2005-09-22 2007-03-29 J. Schmalz Gmbh Pince aspirante dotee d'un corps aspirant elastique presentant un moyen indiquant l'etat d'aspiration
WO2007058693A1 (fr) * 2005-11-18 2007-05-24 Delta Design, Inc. Procede de transport automatique de puces ci, sur un reseau planaire de buses d'aspiration, vers une cible variable dans un testeur de puces
US20100263157A1 (en) * 2009-04-15 2010-10-21 Samsung Techwin Co., Ltd. Vacuum nozzle control apparatus and head assembly for chip mounter having the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112408805A (zh) * 2020-11-16 2021-02-26 中建材蚌埠玻璃工业设计研究院有限公司 极薄玻璃减薄承载装置及减薄装置
CN112408805B (zh) * 2020-11-16 2022-05-17 中建材玻璃新材料研究院集团有限公司 极薄玻璃减薄承载装置及减薄装置

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