WO2016199242A1 - Circuit pattern forming device - Google Patents

Circuit pattern forming device Download PDF

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Publication number
WO2016199242A1
WO2016199242A1 PCT/JP2015/066734 JP2015066734W WO2016199242A1 WO 2016199242 A1 WO2016199242 A1 WO 2016199242A1 JP 2015066734 W JP2015066734 W JP 2015066734W WO 2016199242 A1 WO2016199242 A1 WO 2016199242A1
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WO
WIPO (PCT)
Prior art keywords
metal
metal ink
irradiation
light
irradiation device
Prior art date
Application number
PCT/JP2015/066734
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French (fr)
Japanese (ja)
Inventor
謙磁 塚田
政利 藤田
良崇 橋本
明宏 川尻
雅登 鈴木
克明 牧原
Original Assignee
富士機械製造株式会社
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2017523023A priority Critical patent/JP6572308B2/en
Priority to PCT/JP2015/066734 priority patent/WO2016199242A1/en
Publication of WO2016199242A1 publication Critical patent/WO2016199242A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a circuit pattern forming apparatus for forming a circuit pattern by forming a wiring with a metal-containing liquid containing metal fine particles.
  • the metal-containing liquid may be discharged onto the metal-containing liquid.
  • the metal-containing liquid that has been discharged first and the metal-containing liquid are discharged onto the metal-containing liquid.
  • the resulting metal-containing liquid may be integrated and basilized.
  • the metal-containing liquid is converted into basil, a part of the metal-containing liquid discharged in a linear shape is swelled, which may cause an abnormal wiring shape, disconnection of the wiring, or the like.
  • the circuit board is heated by a heating device such as a heater, and the metal-containing liquid is discharged onto the heated circuit board.
  • a heating device such as a heater
  • the metal-containing liquid is discharged onto the heated circuit board, the solvent contained in the metal-containing liquid is dried, and basilization of the metal-containing liquid can be prevented.
  • the provision of the heater causes problems such as an increase in size and cost of the circuit pattern forming apparatus.
  • This invention is made
  • a circuit pattern forming apparatus of the present invention includes a first discharge device that discharges a curable resin that is cured by light irradiation, and light is applied to the curable resin that is discharged by the first discharge device.
  • a circuit pattern forming apparatus for forming a circuit pattern comprising: a first discharge device, a first irradiation device, a second discharge device, and a control device that controls the operation of each of the second irradiation devices.
  • a resin layer forming part that forms a resin layer by irradiating light to the curable resin discharged by the first discharge device by the first irradiation device, and a metal containing material discharged by the second discharge device Liquid
  • a wiring forming portion that forms wiring by irradiating laser light from the second irradiation device, and the wiring forming portion applies the first irradiation device to the metal-containing liquid discharged by the second discharging device. It has the 1st irradiation part which irradiates light by, It is characterized by the above-mentioned.
  • the resin layer is formed by irradiating the curable resin discharged by the first discharge device with light by the first irradiation device. Further, the metal-containing liquid discharged by the second discharge device is irradiated with laser light by the second irradiation device, thereby forming a wiring. However, at the time of wiring formation, the first irradiation device irradiates light to the metal-containing liquid discharged by the second discharge device. By irradiating the metal-containing liquid with light from the first irradiation device, the solvent contained in the metal-containing liquid is dried, and basilization of the metal-containing liquid is prevented.
  • the solvent of the metal-containing liquid is dried by the first irradiation device used at the time of forming the resin layer without newly providing a heating device such as a heater. This makes it possible to prevent the metal-containing liquid from being basilized without intentionally arranging a heater or the like.
  • FIG. 1 shows a circuit pattern forming apparatus 10.
  • the circuit pattern forming apparatus (hereinafter may be abbreviated as “forming apparatus”) 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 6) 26.
  • the conveying device 20, the first modeling unit 22, and the second modeling unit 24 are disposed on the base 28 of the forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 6) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 6) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a circuit board or the like is placed on the upper surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edge portions in the X-axis direction of the circuit board or the like placed on the base 60 are sandwiched by the holding device 62, whereby the circuit board or the like is fixedly held.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the first modeling unit 22 is, for example, a unit that models the wiring (see FIG. 3) 80 on the circuit board (see FIG. 3) 70 placed on the base 60 of the stage 52, and the first printing unit 72. And a firing part 74.
  • the first printing unit 72 includes an inkjet head 76, and discharges the metal ink 77 in a linear manner onto the circuit board 70 placed on the base 60.
  • the metal ink 77 is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 ejects the metal ink 77 from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device 78, as shown in FIG.
  • the laser irradiation device 78 is a device that irradiates the metal ink 77 discharged onto the circuit board 70 with a laser, and the metal ink 77 irradiated with the laser is baked to form the wiring 80.
  • the firing of the metal ink 77 is a phenomenon in which, by applying energy, the solvent is vaporized, the metal fine particle protective film is decomposed, and the like, and the metal fine particles are contacted or fused to increase the conductivity. It is.
  • the metal wiring 77 is formed by baking the metal ink 77.
  • the 2nd modeling unit 24 is a unit which models the resin layer (refer FIG. 5) 82 on the circuit board (refer FIG. 5) 70 mounted in the base 60 of the stage 52, for example, FIG.
  • the second printing unit 84 and the curing unit 86 are provided.
  • the second printing unit 84 has an inkjet head 88 and discharges the ultraviolet curable resin 90 onto the circuit board 70 placed on the base 60.
  • the ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
  • the curing unit 86 includes a flattening device 96 and an irradiation device 98.
  • the flattening device 96 flattens the upper surface of the ultraviolet curable resin 90 discharged onto the circuit board 70 by the ink jet head 88.
  • the flattening device 96 removes excess resin while leveling the surface of the ultraviolet curable resin 90.
  • the thickness of the ultraviolet curable resin 90 is made uniform by scraping with a roller or a blade.
  • the irradiation device 98 includes a mercury lamp as a light source, and irradiates the ultraviolet curable resin 90 discharged on the circuit board 70 with ultraviolet rays. Thereby, the ultraviolet curable resin 90 discharged on the circuit board 70 is cured, and the resin layer 82 is formed.
  • the control device 26 includes a controller 102 and a plurality of drive circuits 104 as shown in FIG.
  • the plurality of drive circuits 104 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 96, and the irradiation device 98.
  • the controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operation of the transport device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 102.
  • a circuit pattern is formed by forming wiring and a resin layer on the circuit board 70 with the above-described configuration.
  • the circuit board 70 is set on the base 60 of the stage 52.
  • the stage 52 is moved below the first modeling unit 22, and the first printing unit 72 uses the ink jet head 76 as shown in FIG.
  • Metal ink 77 is ejected onto 70.
  • the metal ink 77 is intermittently discharged.
  • the metallic ink 77 is further ejected by the inkjet head 76 onto the intermittently ejected metallic ink 77.
  • the metal ink 77 discharged on the circuit board 70 is connected linearly.
  • the laser is irradiated by the laser irradiation device 78 on the metal ink 77 discharged onto the circuit board 70.
  • the metal ink 77 is baked, and wiring 80 is formed on the circuit board 70 as shown in FIG.
  • the stage 52 is moved below the second modeling unit 24, and in the second printing unit 84, as shown in FIG.
  • An ultraviolet curable resin 90 is discharged on the circuit board 70 in a thin film shape.
  • the curing unit 86 the discharged ultraviolet curable resin 90 is flattened by the flattening device 96 so that the film thickness becomes uniform.
  • the irradiation device 98 irradiates the flattened ultraviolet curable resin 90 with ultraviolet rays.
  • a thin resin layer 82 is formed on the circuit board 70.
  • the metal ink 77 is obtained by dispersing metal fine particles in a solvent, and many of the solvents used for the metal ink 77 have high boiling points and are difficult to dry. For this reason, when the metal ink is further discharged onto the metal ink 77 at the time of wiring formation, the metal ink 77 previously discharged and the metal ink 77 discharged onto the metal ink 77 are formed. Unify and bulge.
  • the metal ink 77 When the metal ink 77 is bulged, a part of the metal ink 77 ejected in a linear shape is swelled, which may cause an abnormal wiring shape, disconnection of the wiring, or the like. Further, when the metal ink 77 is baked, the metal ink 77 is irradiated with laser light. However, if the amount of the solvent contained in the metal ink 77 is large, the amount of laser irradiation increases, resulting in a decrease in throughput, damage to the circuit board, and the like. May occur.
  • the stage 52 is provided with a heater, and the circuit board 70 is heated by the heater. Then, the metal ink 77 is ejected onto the heated circuit board 70, and the metal ink 77 is baked to form wiring. In this way, by heating the circuit board 70 and drying the solvent contained in the metal ink 77, it is possible to suppress bulging of the metal ink 77. Further, by drying the solvent, it is possible to reduce the laser irradiation amount, and it is possible to prevent a decrease in throughput, damage to the circuit board, and the like.
  • the arrangement of the heater on the stage 52 causes problems such as an increase in the size of the apparatus and an increase in cost.
  • the nozzle surface of the inkjet head 76 may be dried by the heat of the heater, and the nozzle may be clogged.
  • the circuit board 70 is damaged by heating the circuit board 70 as a whole by the heater.
  • the metal ink 77 is dried by the irradiation device 98 used at the time of forming the resin layer at the time of wiring formation.
  • the stage 52 is moved below the second modeling unit 24.
  • the circuit board 70 is irradiated with ultraviolet rays by the irradiation device 98.
  • the irradiation device 98 includes a mercury lamp as a light source, and the mercury lamp irradiates light of a relatively wide wavelength (about 200 to 2000 nm) including not only ultraviolet rays but also visible light and infrared rays. . For this reason, the upper surface of the circuit board 70 is heated by the light irradiation of the irradiation device 98.
  • the stage 52 is moved below the first modeling unit 22, and the metal ink 77 is ejected onto the circuit board 70 by the inkjet head 76 in the first printing unit 72 as shown in FIG. 7. .
  • the solvent of the metal ink 77 discharged onto the circuit board 70 is dried and vaporized.
  • the metal ink 77 ejected by the inkjet head 76 contains not only metal fine particles but also inorganic or organic fine powder.
  • titanium dioxide zinc oxide
  • black pigment carbon black, iron black (magnetite), copper / chromium black, cobalt black
  • red pigment lead red, iron oxide red (hematite) as inorganic fine powder
  • Yellow pigment yellow lead, zinc yellow (zinc yellow 1 type, zinc yellow 2 type), yellow iron oxide
  • blue pigment ultramarine blue, prussian blue (potassium ferrocyanide), cobalt blue, cerulean blue
  • Manganese blue, tungsten blue, Egypt blue green pigments (chromium oxide, viridian, cobalt green, cobalt chrome green, Victoria green, Egypt green, manganese green).
  • organic fine powders yellow pigments (isoindolinone, isoindoline, azomethine, anthraquinone, anthrone, xanthene), orange pigments (diketopyrrolopyrrole, perylene, anthraquinone (anthrone), perinone, quinacridone, indigoid), Red pigment (quinacridone, diketopyrrolopyrrole, anthraquinone, perylene, perinone, indigoid), purple pigment (dioxazine, quinacridone, perylene, indigoid, anthraquinone (anthrone), xanthene), blue pigment (phthalocyanine, anthraquinone, indigoid), green pigment (Phthalocyanine, azomethine, perylene) and the like.
  • the size of the fine powder is preferably about 100 to 300 nm in consideration of the nozzle diameter of the ink
  • the stage 52 is moved below the second modeling unit 24. Then, as shown in FIG. 12, in the curing unit 86, the irradiation device 98 irradiates the metal ink 77 discharged on the circuit board 70 with light. Thereby, the metal ink 77 discharged on the circuit board 70 is heated, and the solvent of the metal ink 77 is further dried and vaporized.
  • the metal ink 77 contains not only metal fine particles but also fine powder. Since the fine powder is an oxidized metal fine powder or a colored fine powder, it absorbs light efficiently. Therefore, the metal ink 77 is efficiently heated by light irradiation, and the solvent of the metal ink 77 is efficiently dried and vaporized.
  • the stage 52 When light is irradiated onto the metal ink 77 by the irradiation device 98, the stage 52 is moved below the first modeling unit 22, and the first printing unit 72 uses the ink jet head 76 as shown in FIG.
  • the metal ink 77 is ejected onto the metal ink 77 that is ejected at the same time.
  • the metal ink 77 since the metal ink 77 previously ejected onto the circuit board 70 is vaporized by the irradiation of light from the irradiation device 98, the metal ink 77 ejected earlier and the metal ink 77 Bulging with the metal ink 77 ejected upward is prevented.
  • the metal ink 77 is connected linearly in a state where no swelling, disconnection or the like occurs.
  • the stage 52 When the metal ink 77 is ejected linearly onto the circuit board 70, the stage 52 is moved below the second modeling unit 24, and as shown in FIG. Light is irradiated to the metal ink 77 discharged on the circuit board 70. Thereby, the solvent of the newly ejected metal ink 77 is dried and vaporized on the metal ink 77. Then, the stage 52 is moved below the first modeling unit 22, and the laser 80 is irradiated to the metal ink 77 discharged to the circuit board 70 by the laser irradiation device 78 in the baking unit 74, thereby forming the wiring 80. .
  • the metal ink 77 is baked with a small laser irradiation amount. Thereby, it is possible to prevent a decrease in throughput, damage to the circuit board, and the like.
  • the metal ink 77 that has been ejected is dried by irradiation with light from the irradiation device 98, so that the metal ink is discharged. 77 can be prevented from becoming basil, and abnormal wiring shape, disconnection of wiring, and the like can be prevented. Further, before the metal ink 77 is baked by the laser light, the metal ink 77 is dried by light irradiation of the irradiation device 98 to prevent the metal ink 77 from scattering due to bumping, and the laser irradiation amount is reduced. It is possible to prevent a decrease in throughput and damage to the circuit board.
  • the metal ink 77 is dried by the irradiation device 98 used for forming the resin layer without newly arranging a heating device such as a heater.
  • a heating device such as a heater
  • the metal ink 77 discharged onto the circuit board 70 is heated by the light irradiation of the irradiation device 98. For this reason, it is possible to reduce damage to the circuit board 70 rather than heating the entire circuit board 70 with a heater or the like. Further, it is possible to prevent the inkjet head 76 from being dried due to the heating of the circuit board 70, and it is possible to prevent nozzle clogging and the like.
  • the controller 102 of the control device 26 includes a resin layer forming part 110 and a wiring forming part 112 as shown in FIG.
  • the resin layer forming unit 110 is a functional unit for forming a resin layer in the second modeling unit 24.
  • the wiring forming unit 112 is a functional unit for forming a wiring in the first modeling unit 22.
  • the wiring forming unit 112 includes a first irradiation unit 116 and a second irradiation unit 118.
  • the first irradiation unit 116 is a functional unit for irradiating the metal ink 77 with light by the irradiation device 98.
  • the second irradiation unit 118 is a functional unit for irradiating the metal ink 77 with laser light by the laser irradiation device 78.
  • the forming apparatus 10 is an example of a circuit pattern forming apparatus.
  • the control device 26 is an example of a control device.
  • the inkjet head 76 is an example of a second ejection device.
  • the laser irradiation device 78 is an example of a second irradiation device.
  • the inkjet head 88 is an example of a first discharge device.
  • the irradiation device 98 is an example of a first irradiation device.
  • the resin layer forming unit 110 is an example of a resin layer forming unit.
  • the wiring forming unit 112 is an example of a wiring forming unit.
  • the first irradiation unit 116 is an example of a first irradiation unit.
  • the second irradiation unit 118 is an example of a second irradiation unit.
  • this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
  • a mercury lamp is used as the light source of the irradiation device 98, but various light sources such as LEDs can be used as long as they can irradiate ultraviolet rays.
  • a light source capable of emitting light including a long wavelength in consideration of drying of the metal ink 77, it is preferable to employ a light source capable of emitting light including a long wavelength.
  • forming device circuit pattern forming device
  • control device 76 inkjet head (second ejection device)
  • 88 inkjet head (first ejection device)
  • 98 irradiation device ( (First irradiation device) 110: resin layer forming unit 112: wiring forming unit 116: first irradiation unit 118: second irradiation unit

Abstract

In a circuit pattern forming device according to the present invention, an ultraviolet curable resin discharged from an inkjet head is irradiated with light using an irradiation device to form a resin layer. In addition, metal ink discharged from the inkjet head is irradiated with laser light using a laser irradiation device to form wiring. At the time of forming the wiring, the metal ink 77 discharged from the inkjet head is irradiated with light using the irradiation device 98. As the metal ink is irradiated with light using the irradiation device, solvent contained in the metal ink is dried, whereby the metal ink is prevented from bulging. In this way, in the circuit pattern forming device according to the present invention, the metal ink solvent is dried by means of the irradiation device that is used when forming a resin layer, without newly providing a warming device, such as a heater. Accordingly, the metal ink can be prevented from bulging without additionally installing a heater or the like.

Description

回路パターン形成装置Circuit pattern forming device
　本発明は、金属微粒子を含有する金属含有液により配線を形成することで、回路パターンを形成する回路パターン形成装置に関する。 The present invention relates to a circuit pattern forming apparatus for forming a circuit pattern by forming a wiring with a metal-containing liquid containing metal fine particles.
　近年、下記特許文献に記載されているように、金属微粒子を含有する金属含有液を吐出し、その吐出された金属含有液を焼成することで、回路パターンを形成するための技術が開発されている。 In recent years, as described in the following patent document, a technique for forming a circuit pattern by discharging a metal-containing liquid containing metal fine particles and firing the discharged metal-containing liquid has been developed. Yes.
特開２０１２－０６００８４号公報JP 2012-060084 A
　上記特許文献に記載の技術によれば、ある程度、配線を形成することが可能となる。ただし、金属含有液を線状に吐出するべく、金属含有液の上に金属含有液が吐出される場合があるが、先に吐出されている金属含有液と、その金属含有液の上に吐出された金属含有液とが一体化して、バジル化する虞がある。金属含有液がバジル化すると、線状に吐出された金属含有液の一部が膨らんだ状態となり、配線形状の異常化，配線の断線等が生じる虞がある。 According to the technique described in the above patent document, it is possible to form wiring to some extent. However, in order to discharge the metal-containing liquid linearly, the metal-containing liquid may be discharged onto the metal-containing liquid. However, the metal-containing liquid that has been discharged first and the metal-containing liquid are discharged onto the metal-containing liquid. The resulting metal-containing liquid may be integrated and basilized. When the metal-containing liquid is converted into basil, a part of the metal-containing liquid discharged in a linear shape is swelled, which may cause an abnormal wiring shape, disconnection of the wiring, or the like.
　このため、従来の技術では、回路基板がヒータ等の加温装置によって加温され、加温された状態の回路基板上に、金属含有液が吐出される。加温された状態の回路基板の上に、金属含有液が吐出されると、金属含有液に含まれる溶媒が乾燥し、金属含有液のバジル化を防止することが可能となる。しかしながら、ヒータの配設により、回路パターン形成装置の大型化、コストアップ等の問題が生じる。本発明は、そのような実情に鑑みてなされたものであり、ヒータ等を配設することなく、金属含有液のバジル化を防止することが可能な回路パターン形成装置の提供を課題とする。 For this reason, in the conventional technique, the circuit board is heated by a heating device such as a heater, and the metal-containing liquid is discharged onto the heated circuit board. When the metal-containing liquid is discharged onto the heated circuit board, the solvent contained in the metal-containing liquid is dried, and basilization of the metal-containing liquid can be prevented. However, the provision of the heater causes problems such as an increase in size and cost of the circuit pattern forming apparatus. This invention is made | formed in view of such a situation, and makes it a subject to provide the circuit pattern formation apparatus which can prevent basilization of a metal containing liquid, without arrange | positioning a heater etc.
　上記課題を解決するために、本発明の回路パターン形成装置は、光の照射により硬化する硬化性樹脂を吐出する第１吐出装置と、前記第１吐出装置により吐出された硬化性樹脂に光を照射する第１照射装置と、金属微粒子を含有する金属含有液を吐出する第２吐出装置と、前記第２吐出装置により吐出された金属含有液にレーザ光を照射する第２照射装置と、前記第１吐出装置と前記第１照射装置と前記第２吐出装置と前記第２照射装置との各々の作動を制御する制御装置とを備え、回路パターンを形成する回路パターン形成装置において、前記制御装置が、前記第１吐出装置により吐出された硬化性樹脂に、前記第１照射装置により光を照射することで樹脂層を形成する樹脂層形成部と、前記第２吐出装置により吐出された金属含有液に、前記第２照射装置によりレーザ光を照射することで配線を形成する配線形成部とを有し、前記配線形成部が、前記第２吐出装置により吐出された金属含有液に、前記第１照射装置により光を照射する第１照射部を有することを特徴とする。 In order to solve the above problems, a circuit pattern forming apparatus of the present invention includes a first discharge device that discharges a curable resin that is cured by light irradiation, and light is applied to the curable resin that is discharged by the first discharge device. A first irradiation device that irradiates; a second discharge device that discharges a metal-containing liquid containing metal fine particles; a second irradiation device that irradiates a metal-containing liquid discharged by the second discharge device with a laser beam; In a circuit pattern forming apparatus for forming a circuit pattern, comprising: a first discharge device, a first irradiation device, a second discharge device, and a control device that controls the operation of each of the second irradiation devices. However, a resin layer forming part that forms a resin layer by irradiating light to the curable resin discharged by the first discharge device by the first irradiation device, and a metal containing material discharged by the second discharge device Liquid A wiring forming portion that forms wiring by irradiating laser light from the second irradiation device, and the wiring forming portion applies the first irradiation device to the metal-containing liquid discharged by the second discharging device. It has the 1st irradiation part which irradiates light by, It is characterized by the above-mentioned.
　本発明の回路パターン形成装置では、第１吐出装置により吐出された硬化性樹脂に、第１照射装置により光を照射することで樹脂層が形成される。また、第２吐出装置により吐出された金属含有液に、第２照射装置によりレーザ光を照射することで配線が形成される。ただし、配線形成時には、第２吐出装置により吐出された金属含有液に、第１照射装置により光が照射される。金属含有液に第１照射装置により光が照射されることで、金属含有液に含まれる溶媒が乾燥し、金属含有液のバジル化が防止される。このように、本発明の回路パターン形成装置では、ヒータ等の加温装置を新たに設けることなく、樹脂層形成時に用いられる第１照射装置によって、金属含有液の溶媒が乾燥される。これにより、敢えてヒータ等を配設することなく、金属含有液のバジル化を防止することが可能となる。 In the circuit pattern forming apparatus of the present invention, the resin layer is formed by irradiating the curable resin discharged by the first discharge device with light by the first irradiation device. Further, the metal-containing liquid discharged by the second discharge device is irradiated with laser light by the second irradiation device, thereby forming a wiring. However, at the time of wiring formation, the first irradiation device irradiates light to the metal-containing liquid discharged by the second discharge device. By irradiating the metal-containing liquid with light from the first irradiation device, the solvent contained in the metal-containing liquid is dried, and basilization of the metal-containing liquid is prevented. Thus, in the circuit pattern forming device of the present invention, the solvent of the metal-containing liquid is dried by the first irradiation device used at the time of forming the resin layer without newly providing a heating device such as a heater. This makes it possible to prevent the metal-containing liquid from being basilized without intentionally arranging a heater or the like.
回路パターン形成装置を示す図である。It is a figure which shows a circuit pattern formation apparatus. 第１造形ユニットの第１印刷部を示す概略図である。It is the schematic which shows the 1st printing part of a 1st modeling unit. 第１造形ユニットの焼成部を示す概略図である。It is the schematic which shows the baking part of a 1st modeling unit. 第２造形ユニットの第２印刷部を示す概略図である。It is the schematic which shows the 2nd printing part of a 2nd modeling unit. 第２造形ユニットの硬化部を示す概略図である。It is the schematic which shows the hardening part of a 2nd modeling unit. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. 配線形成の工程を説明するための模式図である。It is a schematic diagram for demonstrating the process of wiring formation. 配線形成の工程を説明するための模式図である。It is a schematic diagram for demonstrating the process of wiring formation. 配線形成の工程を説明するための模式図である。It is a schematic diagram for demonstrating the process of wiring formation. 樹脂層形成の工程を説明するための模式図である。It is a schematic diagram for demonstrating the process of resin layer formation. 樹脂層形成の工程を説明するための模式図である。It is a schematic diagram for demonstrating the process of resin layer formation. 金属含有液の乾燥工程を説明するための模式図である。It is a schematic diagram for demonstrating the drying process of a metal containing liquid. 金属含有液の乾燥工程を説明するための模式図である。It is a schematic diagram for demonstrating the drying process of a metal containing liquid.
　図１に回路パターン形成装置１０を示す。回路パターン形成装置（以下、「形成装置」と略す場合がある）１０は、搬送装置２０と、第１造形ユニット２２と、第２造形ユニット２４と、制御装置（図６参照）２６を備える。それら搬送装置２０と第１造形ユニット２２と第２造形ユニット２４とは、形成装置１０のベース２８の上に配置されている。ベース２８は、概して長方形状をなしており、以下の説明では、ベース２８の長手方向をＸ軸方向、ベース２８の短手方向をＹ軸方向、Ｘ軸方向及びＹ軸方向の両方に直交する方向をＺ軸方向と称して説明する。 FIG. 1 shows a circuit pattern forming apparatus 10. The circuit pattern forming apparatus (hereinafter may be abbreviated as “forming apparatus”) 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see FIG. 6) 26. The conveying device 20, the first modeling unit 22, and the second modeling unit 24 are disposed on the base 28 of the forming device 10. The base 28 has a generally rectangular shape. In the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.
　搬送装置２０は、Ｘ軸スライド機構３０と、Ｙ軸スライド機構３２とを備えている。そのＸ軸スライド機構３０は、Ｘ軸スライドレール３４とＸ軸スライダ３６とを有している。Ｘ軸スライドレール３４は、Ｘ軸方向に延びるように、ベース２８の上に配設されている。Ｘ軸スライダ３６は、Ｘ軸スライドレール３４によって、Ｘ軸方向にスライド可能に保持されている。さらに、Ｘ軸スライド機構３０は、電磁モータ（図６参照）３８を有しており、電磁モータ３８の駆動により、Ｘ軸スライダ３６がＸ軸方向の任意の位置に移動する。また、Ｙ軸スライド機構３２は、Ｙ軸スライドレール５０とステージ５２とを有している。Ｙ軸スライドレール５０は、Ｙ軸方向に延びるように、ベース２８の上に配設されており、Ｘ軸方向に移動可能とされている。そして、Ｙ軸スライドレール５０の一端部が、Ｘ軸スライダ３６に連結されている。そのＹ軸スライドレール５０には、ステージ５２が、Ｙ軸方向にスライド可能に保持されている。さらに、Ｙ軸スライド機構３２は、電磁モータ（図６参照）５６を有しており、電磁モータ５６の駆動により、ステージ５２がＹ軸方向の任意の位置に移動する。これにより、ステージ５２は、Ｘ軸スライド機構３０及びＹ軸スライド機構３２の駆動により、ベース２８上の任意の位置に移動する。 The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 6) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. The Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 6) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
　ステージ５２は、基台６０と、保持装置６２と、昇降装置６４とを有している。基台６０は、平板状に形成され、上面に回路基板等が載置される。保持装置６２は、基台６０のＸ軸方向の両側部に設けられている。そして、基台６０に載置された回路基板等のＸ軸方向の両縁部が、保持装置６２によって挟まれることで、回路基板等が固定的に保持される。また、昇降装置６４は、基台６０の下方に配設されており、基台６０を昇降させる。 The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a circuit board or the like is placed on the upper surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edge portions in the X-axis direction of the circuit board or the like placed on the base 60 are sandwiched by the holding device 62, whereby the circuit board or the like is fixedly held. The lifting device 64 is disposed below the base 60 and lifts the base 60.
　第１造形ユニット２２は、例えば、ステージ５２の基台６０に載置された回路基板（図３参照）７０の上に配線（図３参照）８０を造形するユニットであり、第１印刷部７２と、焼成部７４とを有している。第１印刷部７２は、図２に示すように、インクジェットヘッド７６を有しており、基台６０に載置された回路基板７０の上に、金属インク７７を線状に吐出する。金属インク７７は、金属の微粒子が溶剤中に分散されたものである。なお、インクジェットヘッド７６は、例えば、圧電素子を用いたピエゾ方式によって複数のノズルから金属インク７７を吐出する。 The first modeling unit 22 is, for example, a unit that models the wiring (see FIG. 3) 80 on the circuit board (see FIG. 3) 70 placed on the base 60 of the stage 52, and the first printing unit 72. And a firing part 74. As shown in FIG. 2, the first printing unit 72 includes an inkjet head 76, and discharges the metal ink 77 in a linear manner onto the circuit board 70 placed on the base 60. The metal ink 77 is obtained by dispersing metal fine particles in a solvent. The inkjet head 76 ejects the metal ink 77 from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
　焼成部７４は、図３に示すように、レーザ照射装置７８を有している。レーザ照射装置７８は、回路基板７０の上に吐出された金属インク７７にレーザを照射する装置であり、レーザが照射された金属インク７７は、焼成し、配線８０が形成される。なお、金属インク７７の焼成とは、エネルギーを付与することによって、溶媒の気化や金属微粒子保護膜の分解等が行われ、金属微粒子が接触または融着をすることで、導電率が高くなる現象である。そして、金属インク７７が焼成することで、金属製の配線８０が形成される。 The firing unit 74 has a laser irradiation device 78, as shown in FIG. The laser irradiation device 78 is a device that irradiates the metal ink 77 discharged onto the circuit board 70 with a laser, and the metal ink 77 irradiated with the laser is baked to form the wiring 80. The firing of the metal ink 77 is a phenomenon in which, by applying energy, the solvent is vaporized, the metal fine particle protective film is decomposed, and the like, and the metal fine particles are contacted or fused to increase the conductivity. It is. And the metal wiring 77 is formed by baking the metal ink 77.
　また、第２造形ユニット２４は、例えば、ステージ５２の基台６０に載置された回路基板（図５参照）７０の上に樹脂層（図５参照）８２を造形するユニットであり、図１に示すように、第２印刷部８４と、硬化部８６とを有している。第２印刷部８４は、図４に示すように、インクジェットヘッド８８を有しており、基台６０に載置された回路基板７０の上に紫外線硬化樹脂９０を吐出する。なお、インクジェットヘッド８８は、例えば、圧電素子を用いたピエゾ方式でもよく、樹脂を加熱して気泡を発生させノズルから吐出するサーマル方式でもよい。 Moreover, the 2nd modeling unit 24 is a unit which models the resin layer (refer FIG. 5) 82 on the circuit board (refer FIG. 5) 70 mounted in the base 60 of the stage 52, for example, FIG. As shown in FIG. 2, the second printing unit 84 and the curing unit 86 are provided. As shown in FIG. 4, the second printing unit 84 has an inkjet head 88 and discharges the ultraviolet curable resin 90 onto the circuit board 70 placed on the base 60. The ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
　硬化部８６は、図５に示すように、平坦化装置９６と照射装置９８とを有している。平坦化装置９６は、インクジェットヘッド８８によって回路基板７０の上に吐出された紫外線硬化樹脂９０の上面を平坦化するものであり、例えば、紫外線硬化樹脂９０の表面を均しながら余剰分の樹脂を、ローラもしくはブレードによって掻き取ることで、紫外線硬化樹脂９０の厚みを均一させる。また、照射装置９８は、光源として水銀ランプを備えており、回路基板７０の上に吐出された紫外線硬化樹脂９０に紫外線を照射する。これにより、回路基板７０の上に吐出された紫外線硬化樹脂９０が硬化し、樹脂層８２が造形される。 As shown in FIG. 5, the curing unit 86 includes a flattening device 96 and an irradiation device 98. The flattening device 96 flattens the upper surface of the ultraviolet curable resin 90 discharged onto the circuit board 70 by the ink jet head 88. For example, the flattening device 96 removes excess resin while leveling the surface of the ultraviolet curable resin 90. The thickness of the ultraviolet curable resin 90 is made uniform by scraping with a roller or a blade. The irradiation device 98 includes a mercury lamp as a light source, and irradiates the ultraviolet curable resin 90 discharged on the circuit board 70 with ultraviolet rays. Thereby, the ultraviolet curable resin 90 discharged on the circuit board 70 is cured, and the resin layer 82 is formed.
　制御装置２６は、図６に示すように、コントローラ１０２と、複数の駆動回路１０４とを備えている。複数の駆動回路１０４は、上記電磁モータ３８，５６、保持装置６２、昇降装置６４、インクジェットヘッド７６、レーザ照射装置７８、インクジェットヘッド８８、平坦化装置９６、照射装置９８に接続されている。コントローラ１０２は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１０４に接続されている。これにより、搬送装置２０、第１造形ユニット２２、第２造形ユニット２４の作動が、コントローラ１０２によって制御される。 The control device 26 includes a controller 102 and a plurality of drive circuits 104 as shown in FIG. The plurality of drive circuits 104 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 96, and the irradiation device 98. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operation of the transport device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 102.
　＜形成装置の作動＞
　形成装置１０では、上述した構成によって、回路基板７０上に配線および、樹脂層を形成することで、回路パターンを形成する。具体的には、ステージ５２の基台６０に回路基板７０がセットされる。そして、回路基板７０に配線が形成される際には、ステージ５２が、第１造形ユニット２２の下方に移動され、第１印刷部７２において、図７に示すように、インクジェットヘッド７６によって回路基板７０の上に金属インク７７が吐出される。この際、金属インク７７は断続的に吐出されている。続いて、断続的に吐出された金属インク７７の上に、インクジェットヘッド７６によって、さらに、金属インク７７が吐出される。これにより、図８に示すように、回路基板７０の上に吐出された金属インク７７が線状に繋がる。次に、焼成部７４において、回路基板７０に吐出された金属インク７７に、レーザ照射装置７８によってレーザが照射される。これにより、金属インク７７が焼成し、図９に示すように、回路基板７０の上に配線８０が形成される。 <Operation of forming device>
In the forming apparatus 10, a circuit pattern is formed by forming wiring and a resin layer on the circuit board 70 with the above-described configuration. Specifically, the circuit board 70 is set on the base 60 of the stage 52. When the wiring is formed on the circuit board 70, the stage 52 is moved below the first modeling unit 22, and the first printing unit 72 uses the ink jet head 76 as shown in FIG. Metal ink 77 is ejected onto 70. At this time, the metal ink 77 is intermittently discharged. Subsequently, the metallic ink 77 is further ejected by the inkjet head 76 onto the intermittently ejected metallic ink 77. Thereby, as shown in FIG. 8, the metal ink 77 discharged on the circuit board 70 is connected linearly. Next, in the firing unit 74, the laser is irradiated by the laser irradiation device 78 on the metal ink 77 discharged onto the circuit board 70. As a result, the metal ink 77 is baked, and wiring 80 is formed on the circuit board 70 as shown in FIG.
　また、回路基板７０に樹脂層が形成される際には、ステージ５２が、第２造形ユニット２４の下方に移動され、第２印刷部８４において、図１０に示すように、インクジェットヘッド８８によって、回路基板７０の上に紫外線硬化樹脂９０が薄膜状に吐出される。次に、硬化部８６において、吐出された紫外線硬化樹脂９０が、膜厚が均一となるように、平坦化装置９６によって平坦化される。そして、照射装置９８が、その平坦化された紫外線硬化樹脂９０に紫外線を照射する。これにより、図１１に示すように、回路基板７０の上に薄膜状の樹脂層８２が形成される。 Further, when the resin layer is formed on the circuit board 70, the stage 52 is moved below the second modeling unit 24, and in the second printing unit 84, as shown in FIG. An ultraviolet curable resin 90 is discharged on the circuit board 70 in a thin film shape. Next, in the curing unit 86, the discharged ultraviolet curable resin 90 is flattened by the flattening device 96 so that the film thickness becomes uniform. Then, the irradiation device 98 irradiates the flattened ultraviolet curable resin 90 with ultraviolet rays. As a result, as shown in FIG. 11, a thin resin layer 82 is formed on the circuit board 70.
　このように、形成装置１０では、第１造形ユニット２２において、配線が形成され、第２造形ユニット２４において、樹脂層が形成される。そして、配線と樹脂層とが、回路基板７０の上に順次、形成されることで、回路パターンが形成される。ただし、金属インク７７は、溶剤中に金属微粒子が分散されたものであり、金属インク７７に用いられる溶媒は、高沸点のものが多く、乾燥し難い。このため、配線形成時に、金属インク７７の上に、さらに金属インクが吐出された際に、先に吐出されている金属インク７７と、その金属インク７７に上に吐出された金属インク７７とが一体化して、バルジ化する。金属インク７７がバルジ化すると、線状に吐出された金属インク７７の一部が膨らんだ状態となり、配線形状の異常化，配線の断線等が生じる虞がある。また、金属インク７７の焼成時に、金属インク７７にレーザ光が照射されるが、金属インク７７に含まれる溶媒の量が多いと、レーザ照射量が多くなり、スループットの低下、回路基板の損傷等が生じる虞がある。 Thus, in the forming apparatus 10, wiring is formed in the first modeling unit 22, and a resin layer is formed in the second modeling unit 24. Then, the wiring and the resin layer are sequentially formed on the circuit board 70, thereby forming a circuit pattern. However, the metal ink 77 is obtained by dispersing metal fine particles in a solvent, and many of the solvents used for the metal ink 77 have high boiling points and are difficult to dry. For this reason, when the metal ink is further discharged onto the metal ink 77 at the time of wiring formation, the metal ink 77 previously discharged and the metal ink 77 discharged onto the metal ink 77 are formed. Unify and bulge. When the metal ink 77 is bulged, a part of the metal ink 77 ejected in a linear shape is swelled, which may cause an abnormal wiring shape, disconnection of the wiring, or the like. Further, when the metal ink 77 is baked, the metal ink 77 is irradiated with laser light. However, if the amount of the solvent contained in the metal ink 77 is large, the amount of laser irradiation increases, resulting in a decrease in throughput, damage to the circuit board, and the like. May occur.
　このため、従来の回路パターン形成装置では、ステージ５２にヒータが配設されており、ヒータによって、回路基板７０が加温されている。そして、加温された状態の回路基板７０の上に、金属インク７７が吐出され、その金属インク７７が焼成されることで、配線が形成される。このように、回路基板７０を加温して、金属インク７７に含まれる溶媒を乾燥させることで、金属インク７７のバルジ化を抑制することが可能となる。また、溶媒の乾燥により、レーザ照射量を少なくすることが可能となり、スループットの低下、回路基板の損傷等を防止することが可能となる。 For this reason, in the conventional circuit pattern forming apparatus, the stage 52 is provided with a heater, and the circuit board 70 is heated by the heater. Then, the metal ink 77 is ejected onto the heated circuit board 70, and the metal ink 77 is baked to form wiring. In this way, by heating the circuit board 70 and drying the solvent contained in the metal ink 77, it is possible to suppress bulging of the metal ink 77. Further, by drying the solvent, it is possible to reduce the laser irradiation amount, and it is possible to prevent a decrease in throughput, damage to the circuit board, and the like.
　しかしながら、ステージ５２へのヒータの配設により、装置の大型化、コストアップ等の問題が生じる。また、ヒータの熱によって、インクジェットヘッド７６のノズル面が乾燥し、ノズルが詰まる虞がある。さらに、ヒータにより回路基板７０が全体的に加温されることで、回路基板７０が損傷する虞がある。このようなことに鑑みて、形成装置１０では、配線形成時に、樹脂層形成時に用いられる照射装置９８によって、金属インク７７を乾燥させる。 However, the arrangement of the heater on the stage 52 causes problems such as an increase in the size of the apparatus and an increase in cost. Further, the nozzle surface of the inkjet head 76 may be dried by the heat of the heater, and the nozzle may be clogged. Furthermore, there is a possibility that the circuit board 70 is damaged by heating the circuit board 70 as a whole by the heater. In view of the above, in the forming apparatus 10, the metal ink 77 is dried by the irradiation device 98 used at the time of forming the resin layer at the time of wiring formation.
　具体的には、回路基板７０に配線が形成される際に、ステージ５２が、第２造形ユニット２４の下方に移動される。そして、硬化部８６において、照射装置９８によって、回路基板７０に紫外線が照射される。照射装置９８は、上述したように、光源として水銀ランプを備えており、水銀ランプは、紫外線だけでなく、可視光、赤外線を含む比較的広域の波長（約２００～２０００ｎｍ）の光を照射する。このため、照射装置９８の光の照射により、回路基板７０の上面が加温される。 Specifically, when wiring is formed on the circuit board 70, the stage 52 is moved below the second modeling unit 24. In the curing unit 86, the circuit board 70 is irradiated with ultraviolet rays by the irradiation device 98. As described above, the irradiation device 98 includes a mercury lamp as a light source, and the mercury lamp irradiates light of a relatively wide wavelength (about 200 to 2000 nm) including not only ultraviolet rays but also visible light and infrared rays. . For this reason, the upper surface of the circuit board 70 is heated by the light irradiation of the irradiation device 98.
　次に、ステージ５２が、第１造形ユニット２２の下方に移動され、第１印刷部７２において、図７に示すように、インクジェットヘッド７６によって、回路基板７０の上に金属インク７７が吐出される。この際、回路基板７０の上面が加温されているため、回路基板７０の上に吐出された金属インク７７の溶媒は、乾燥し、気化する。なお、インクジェットヘッド７６によって吐出される金属インク７７には、金属微粒子だけでなく、無機系、若しくは、有機系の微粉末が含まれている。 Next, the stage 52 is moved below the first modeling unit 22, and the metal ink 77 is ejected onto the circuit board 70 by the inkjet head 76 in the first printing unit 72 as shown in FIG. 7. . At this time, since the upper surface of the circuit board 70 is heated, the solvent of the metal ink 77 discharged onto the circuit board 70 is dried and vaporized. The metal ink 77 ejected by the inkjet head 76 contains not only metal fine particles but also inorganic or organic fine powder.
　具体的には、無機系の微粉末として、二酸化チタン，酸化亜鉛，黒色顔料（カーボンブラック，鉄黒（マグネタイト），銅・クロムブラック，コバルトブラック），赤色顔料（鉛丹，酸化鉄赤（ヘマタイト）），黄色顔料（黄鉛，亜鉛黄（亜鉛黄1種，亜鉛黄２種），黄色酸化鉄），青色顔料（ウルトラマリン青，プロシア青（フェロシアン化鉄カリ），コバルトブルー，セルリアンブルー，マンガンブルー，タングステンブルー，エジプトブルー），緑色顔料（酸化クロム，ビリジアン，コバルトグリーン，コバルトクロムグリーン，ビクトリアグリーン，エジプトグリーン，マンガングリーン）等が挙げられる。また、有機系の微粉末として、黄色顔料（イソインドリノン，イソインドリン，アゾメチン，アントラキノン，アントロン，キサンテン），橙色顔料（ジケトピロロピロール，ペリレン，アントラキノン（アントロン），ペリノン，キナクリドン，インジゴイド），赤色顔料（キナクリドン，ジケトピロロピロール，アントラキノン，ペリレン，ペリノン，インジゴイド），紫色顔料（ジオキサジン，キナクリドン，ペリレン，インジゴイド，アントラキノン（アントロン），キサンテン），青色顔料（フタロシアニン，アントラキノン，インジゴイド），緑色顔料（フタロシアニン，アゾメチン，ペリレン）等が挙げられる。なお、微粉末の大きさは、インクジェットヘッド７６のノズル径等を考慮して、１００～３００ｎｍ程度であることが好ましい。 Specifically, titanium dioxide, zinc oxide, black pigment (carbon black, iron black (magnetite), copper / chromium black, cobalt black), red pigment (lead red, iron oxide red (hematite) as inorganic fine powder )), Yellow pigment (yellow lead, zinc yellow (zinc yellow 1 type, zinc yellow 2 type), yellow iron oxide), blue pigment (ultramarine blue, prussian blue (potassium ferrocyanide), cobalt blue, cerulean blue) , Manganese blue, tungsten blue, Egypt blue), green pigments (chromium oxide, viridian, cobalt green, cobalt chrome green, Victoria green, Egypt green, manganese green). As organic fine powders, yellow pigments (isoindolinone, isoindoline, azomethine, anthraquinone, anthrone, xanthene), orange pigments (diketopyrrolopyrrole, perylene, anthraquinone (anthrone), perinone, quinacridone, indigoid), Red pigment (quinacridone, diketopyrrolopyrrole, anthraquinone, perylene, perinone, indigoid), purple pigment (dioxazine, quinacridone, perylene, indigoid, anthraquinone (anthrone), xanthene), blue pigment (phthalocyanine, anthraquinone, indigoid), green pigment (Phthalocyanine, azomethine, perylene) and the like. The size of the fine powder is preferably about 100 to 300 nm in consideration of the nozzle diameter of the inkjet head 76 and the like.
　回路基板７０の上に金属インク７７が吐出されると、ステージ５２が、第２造形ユニット２４の下方に移動される。そして、図１２に示すように、硬化部８６において、照射装置９８によって、回路基板７０の上に吐出された金属インク７７に、光が照射される。これにより、回路基板７０の上に吐出された金属インク７７が加温され、金属インク７７の溶媒が、さらに、乾燥し、気化する。特に、金属インク７７には、上述したように、金属微粒子だけでなく、微粉末も含まれている。この微粉末は、酸化された金属の微粉末、若しくは、着色された微粉末であるため、光を効率的に吸収する。このため、金属インク７７は、光の照射によって、効率的に加温され、金属インク７７の溶媒が、効率的に乾燥し、気化する。 When the metal ink 77 is discharged onto the circuit board 70, the stage 52 is moved below the second modeling unit 24. Then, as shown in FIG. 12, in the curing unit 86, the irradiation device 98 irradiates the metal ink 77 discharged on the circuit board 70 with light. Thereby, the metal ink 77 discharged on the circuit board 70 is heated, and the solvent of the metal ink 77 is further dried and vaporized. In particular, as described above, the metal ink 77 contains not only metal fine particles but also fine powder. Since the fine powder is an oxidized metal fine powder or a colored fine powder, it absorbs light efficiently. Therefore, the metal ink 77 is efficiently heated by light irradiation, and the solvent of the metal ink 77 is efficiently dried and vaporized.
　照射装置９８によって光が金属インク７７に照射されると、ステージ５２が、第１造形ユニット２２の下方に移動され、第１印刷部７２において、図８に示すように、インクジェットヘッド７６によって、先に吐出されている金属インク７７の上に金属インク７７が吐出される。この際、回路基板７０の上に先に吐出されている金属インク７７は、照射装置９８の光の照射により気化しているため、先に吐出されている金属インク７７と、その金属インク７７の上に吐出された金属インク７７とのバルジ化が防止される。これにより、金属インク７７が、膨らみ，断線等の生じていない状態で、線状に繋がる。 When light is irradiated onto the metal ink 77 by the irradiation device 98, the stage 52 is moved below the first modeling unit 22, and the first printing unit 72 uses the ink jet head 76 as shown in FIG. The metal ink 77 is ejected onto the metal ink 77 that is ejected at the same time. At this time, since the metal ink 77 previously ejected onto the circuit board 70 is vaporized by the irradiation of light from the irradiation device 98, the metal ink 77 ejected earlier and the metal ink 77 Bulging with the metal ink 77 ejected upward is prevented. As a result, the metal ink 77 is connected linearly in a state where no swelling, disconnection or the like occurs.
　回路基板７０の上に線状に金属インク７７が吐出されると、ステージ５２が、第２造形ユニット２４の下方に移動され、図１３に示すように、硬化部８６において、照射装置９８によって、回路基板７０の上に吐出された金属インク７７に、光が照射される。これにより、金属インク７７の上に、新たに吐出された金属インク７７の溶媒が、乾燥し、気化する。そして、ステージ５２が、第１造形ユニット２２の下方に移動され、焼成部７４において、回路基板７０に吐出された金属インク７７に、レーザ照射装置７８によってレーザが照射され、配線８０が形成される。この際、金属インク７７に含まれる溶媒の量は、照射装置９８の光の照射により、少なくなっているため、少ないレーザ照射量によって、金属インク７７は焼成する。これにより、スループットの低下、回路基板の損傷等を防止することが可能となる。 When the metal ink 77 is ejected linearly onto the circuit board 70, the stage 52 is moved below the second modeling unit 24, and as shown in FIG. Light is irradiated to the metal ink 77 discharged on the circuit board 70. Thereby, the solvent of the newly ejected metal ink 77 is dried and vaporized on the metal ink 77. Then, the stage 52 is moved below the first modeling unit 22, and the laser 80 is irradiated to the metal ink 77 discharged to the circuit board 70 by the laser irradiation device 78 in the baking unit 74, thereby forming the wiring 80. . At this time, since the amount of the solvent contained in the metal ink 77 is reduced by the light irradiation of the irradiation device 98, the metal ink 77 is baked with a small laser irradiation amount. Thereby, it is possible to prevent a decrease in throughput, damage to the circuit board, and the like.
　このように、形成装置１０では、金属インク７７の上に金属インク７７が吐出される前に、先に吐出されている金属インク７７を照射装置９８の光の照射によって乾燥させることで、金属インク７７のバジル化を防止し、配線形状の異常化，配線の断線等を防止することが可能となっている。また、レーザ光によって金属インク７７が焼成される前に、金属インク７７を照射装置９８の光の照射によって乾燥させることで、金属インク７７の突沸による飛散を防止し、レーザ照射量を低減させ、スループットの低下、回路基板の損傷等を防止することが可能となっている。さらに、形成装置１０では、ヒータ等の加温装置を、新たに配設することなく、樹脂層形成に用いられる照射装置９８によって、金属インク７７を乾燥させている。これにより、ヒータ等の配設による装置の大型化、コストアップ等の問題が解消される。 As described above, in the forming apparatus 10, before the metal ink 77 is ejected onto the metal ink 77, the metal ink 77 that has been ejected is dried by irradiation with light from the irradiation device 98, so that the metal ink is discharged. 77 can be prevented from becoming basil, and abnormal wiring shape, disconnection of wiring, and the like can be prevented. Further, before the metal ink 77 is baked by the laser light, the metal ink 77 is dried by light irradiation of the irradiation device 98 to prevent the metal ink 77 from scattering due to bumping, and the laser irradiation amount is reduced. It is possible to prevent a decrease in throughput and damage to the circuit board. Further, in the forming apparatus 10, the metal ink 77 is dried by the irradiation device 98 used for forming the resin layer without newly arranging a heating device such as a heater. As a result, problems such as an increase in the size and cost of the apparatus due to the arrangement of the heater and the like are solved.
　また、形成装置１０では、照射装置９８の光の照射により回路基板７０の上に吐出された金属インク７７が加温される。このため、ヒータ等により回路基板７０全体が加温されるより、回路基板７０へのダメージを減らすことが可能となる。さらに、回路基板７０の加温によるインクジェットヘッド７６の乾燥を防止することが可能となり、ノズル詰まり等を防止することが可能となる。 Further, in the forming apparatus 10, the metal ink 77 discharged onto the circuit board 70 is heated by the light irradiation of the irradiation device 98. For this reason, it is possible to reduce damage to the circuit board 70 rather than heating the entire circuit board 70 with a heater or the like. Further, it is possible to prevent the inkjet head 76 from being dried due to the heating of the circuit board 70, and it is possible to prevent nozzle clogging and the like.
　なお、制御装置２６のコントローラ１０２は、図６に示すように、樹脂層形成部１１０と、配線形成部１１２とを有している。樹脂層形成部１１０は、第２造形ユニット２４において樹脂層を形成するための機能部である。配線形成部１１２は、第１造形ユニット２２において配線を形成するための機能部である。また、配線形成部１１２は、第１照射部１１６と、第２照射部１１８とを有している。第１照射部１１６は、照射装置９８によって金属インク７７に光を照射するための機能部である。第２照射部１１８は、レーザ照射装置７８によって金属インク７７にレーザ光を照射するための機能部である。 The controller 102 of the control device 26 includes a resin layer forming part 110 and a wiring forming part 112 as shown in FIG. The resin layer forming unit 110 is a functional unit for forming a resin layer in the second modeling unit 24. The wiring forming unit 112 is a functional unit for forming a wiring in the first modeling unit 22. Further, the wiring forming unit 112 includes a first irradiation unit 116 and a second irradiation unit 118. The first irradiation unit 116 is a functional unit for irradiating the metal ink 77 with light by the irradiation device 98. The second irradiation unit 118 is a functional unit for irradiating the metal ink 77 with laser light by the laser irradiation device 78.
　ちなみに、上記実施例において、形成装置１０は、回路パターン形成装置の一例である。制御装置２６は、制御装置の一例である。インクジェットヘッド７６は、第２吐出装置の一例である。レーザ照射装置７８は、第２照射装置の一例である。インクジェットヘッド８８は、第１吐出装置の一例である。照射装置９８は、第１照射装置の一例である。樹脂層形成部１１０は、樹脂層形成部の一例である。配線形成部１１２は、配線形成部の一例である。第１照射部１１６は、第１照射部の一例である。第２照射部１１８は、第２照射部の一例である。 Incidentally, in the above embodiment, the forming apparatus 10 is an example of a circuit pattern forming apparatus. The control device 26 is an example of a control device. The inkjet head 76 is an example of a second ejection device. The laser irradiation device 78 is an example of a second irradiation device. The inkjet head 88 is an example of a first discharge device. The irradiation device 98 is an example of a first irradiation device. The resin layer forming unit 110 is an example of a resin layer forming unit. The wiring forming unit 112 is an example of a wiring forming unit. The first irradiation unit 116 is an example of a first irradiation unit. The second irradiation unit 118 is an example of a second irradiation unit.
　なお、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。例えば、上記実施例では、照射装置９８の光源として、水銀ランプが採用されているが、紫外線を照射可能なものであれば、ＬＥＤ等の種々の光源を採用することが可能である。ただし、金属インク７７の乾燥を考慮すれば、長い波長を含む光を照射可能な光源を採用することが好ましい。 In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above embodiment, a mercury lamp is used as the light source of the irradiation device 98, but various light sources such as LEDs can be used as long as they can irradiate ultraviolet rays. However, in consideration of drying of the metal ink 77, it is preferable to employ a light source capable of emitting light including a long wavelength.
　１０：形成装置（回路パターン形成装置）　　２６：制御装置　　７６：インクジェットヘッド（第２吐出装置）　　７８：レーザ照射装置（第２照射装置）　　８８：インクジェットヘッド（第１吐出装置）　　９８：照射装置（第１照射装置）　　１１０：樹脂層形成部　　１１２：配線形成部　　１１６：第１照射部　　１１８：第２照射部 10: forming device (circuit pattern forming device) 26: control device 76: inkjet head (second ejection device) 78: laser irradiation device (second irradiation device) 88: inkjet head (first ejection device) 98: irradiation device ( (First irradiation device) 110: resin layer forming unit 112: wiring forming unit 116: first irradiation unit 118: second irradiation unit

Claims (3)

  1. 　光の照射により硬化する硬化性樹脂を吐出する第１吐出装置と、
    　前記第１吐出装置により吐出された硬化性樹脂に光を照射する第１照射装置と、
    　金属微粒子を含有する金属含有液を吐出する第２吐出装置と、
    　前記第２吐出装置により吐出された金属含有液にレーザ光を照射する第２照射装置と、
    　前記第１吐出装置と前記第１照射装置と前記第２吐出装置と前記第２照射装置との各々の作動を制御する制御装置と
    　を備え、回路パターンを形成する回路パターン形成装置において、
    　前記制御装置が、
    　前記第１吐出装置により吐出された硬化性樹脂に、前記第１照射装置により光を照射することで樹脂層を形成する樹脂層形成部と、
    　前記第２吐出装置により吐出された金属含有液に、前記第２照射装置によりレーザ光を照射することで配線を形成する配線形成部と
    　を有し、
    　前記配線形成部が、
    　前記第２吐出装置により吐出された金属含有液に、前記第１照射装置により光を照射する第１照射部を有することを特徴とする回路パターン形成装置。     A first discharge device for discharging a curable resin that is cured by light irradiation;
    A first irradiation device for irradiating light to the curable resin discharged by the first discharge device;
    A second discharge device for discharging a metal-containing liquid containing metal fine particles;
    A second irradiation device for irradiating the metal-containing liquid discharged by the second discharge device with laser light;
    In the circuit pattern forming apparatus for forming a circuit pattern, comprising: a control device that controls the operation of each of the first ejection device, the first irradiation device, the second ejection device, and the second irradiation device;
    The control device is
    A resin layer forming portion that forms a resin layer by irradiating light to the curable resin discharged by the first discharge device by the first irradiation device;
    A wiring forming unit that forms wiring by irradiating the metal-containing liquid discharged by the second discharge device with laser light from the second irradiation device;
    The wiring forming part is
    A circuit pattern forming apparatus, comprising: a first irradiation unit configured to irradiate the metal-containing liquid discharged by the second discharge device with light from the first irradiation device.
  2. 　前記第２吐出装置が、
    　金属微粒子および、光を吸収する微粉末を含有する金属含有液を吐出することを特徴とする請求項１に記載の回路パターン形成装置。     The second discharge device is
    2. The circuit pattern forming apparatus according to claim 1, wherein a metal-containing liquid containing metal fine particles and light-absorbing fine powder is discharged.
  3. 　前記配線形成部が、
    　前記第１照射装置により光が照射された金属含有液に、前記第２照射装置によりレーザ光を照射することで配線を形成する第２照射部を有することを特徴とする請求項１または請求項２に記載の回路パターン形成装置。     The wiring forming part is
    The second irradiation unit for forming a wiring by irradiating the metal-containing liquid irradiated with light from the first irradiation device with laser light from the second irradiation device. 2. The circuit pattern forming apparatus according to 2.
PCT/JP2015/066734 2015-06-10 2015-06-10 Circuit pattern forming device WO2016199242A1 (en)

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