WO2016177295A1 - 贴片封装装置及方法 - Google Patents
贴片封装装置及方法 Download PDFInfo
- Publication number
- WO2016177295A1 WO2016177295A1 PCT/CN2016/080632 CN2016080632W WO2016177295A1 WO 2016177295 A1 WO2016177295 A1 WO 2016177295A1 CN 2016080632 W CN2016080632 W CN 2016080632W WO 2016177295 A1 WO2016177295 A1 WO 2016177295A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cover plate
- substrate
- cavity
- adsorption
- air
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 130
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 239000000284 extract Substances 0.000 claims abstract description 5
- 238000001179 sorption measurement Methods 0.000 claims description 56
- 239000007789 gas Substances 0.000 claims description 34
- 230000008569 process Effects 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 9
- 238000000429 assembly Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 8
- 238000013022 venting Methods 0.000 claims description 7
- 239000001307 helium Substances 0.000 claims description 5
- 229910052734 helium Inorganic materials 0.000 claims description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 238000005273 aeration Methods 0.000 abstract 2
- 238000000605 extraction Methods 0.000 abstract 2
- 229920001621 AMOLED Polymers 0.000 description 35
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133322—Mechanical guidance or alignment of LCD panel support components
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Definitions
- the present disclosure relates to the field of display technologies, and in particular, to a chip package device and method.
- AMOLED Active Matrix Organic Light Emitting Diode
- the current three-dimensional curved surface AMOLED package patch device draws on the flexible variable idea of multi-point AMOLED package patch technology, and discretely adsorbs the rigid straight substrate of the curved glass substrate AMOLED package patch device into several short substrate adsorptions (substrate adsorption support column ( Suck Bar)), using these substrate adsorption support columns (Suck Bar) to achieve a composite shape of a three-dimensional curved glass substrate.
- the device can realize high-efficiency and continuous AMOLED package patch of three-dimensional curved glass substrate, and can save a lot of manpower and material resources without designing, manufacturing and debugging the pressure box machine plane compared with the flat AMOLED package patch of the pressure box machine. and time.
- such a device is difficult to avoid the generation of air bubbles during the patch press process, resulting in a low yield of the produced patch.
- the main object of the present disclosure is to provide a technical solution that can effectively avoid the generation of air bubbles during the patch press process, thereby improving the yield of the patch.
- the present disclosure provides a chip package device comprising: an adsorption mechanism for adsorbing a loaded cover plate; and a chip package mechanism provided with a receiving cavity for accommodating loading
- the substrate of the patch and the cover plate, the cover plate, the substrate and the side wall of the accommodating cavity after the cover plate is placed in the accommodating cavity by the absorbing mechanism Forming a closed cavity, the side wall is provided with a suction hole and an inflation hole; a suction mechanism for extracting air from the closed cavity through the air suction hole; and an inflation mechanism for passing the inflation hole
- a light gas having a density lower than that of air is flushed into the closed cavity; a pressing mechanism is used for pressing the closed cavity, so that the cover plate is completely pressed after the light gas is discharged On the substrate.
- the apparatus further includes: a first loading mechanism for loading the cover plate into a predetermined position, wherein the predetermined position is directly above the accommodating cavity; and the second loading mechanism, For loading the substrate and placing the substrate in the receiving cavity.
- the device further includes: an image collecting mechanism, configured to collect image position information of at least two first identification points preset on the cover plate after the cover plate is sucked by the adsorption mechanism, and And acquiring image position information of at least two second identification points preset on the substrate after the substrate is placed in the accommodating cavity by the second loading mechanism; and determining a module for determining Determining whether the first identification point and the second identification point correspond to each other in a manner of whether the image location information of the first identification point and the image location information of the second identification point match; the alignment mechanism is used to In a case where the positions of the first identification point and the second identification point do not correspond, adjusting a position of the adsorption structure or the accommodating cavity, so that the first identification point and the second identification point Fully corresponding.
- an image collecting mechanism configured to collect image position information of at least two first identification points preset on the cover plate after the cover plate is sucked by the adsorption mechanism, and And acquiring image position information of at least two second identification points preset on the substrate after the substrate
- the image acquisition mechanism includes one or two cameras.
- the camera is disposed above the adsorption mechanism or below the patch package mechanism, and two cameras are used.
- the two cameras are respectively disposed above the adsorption mechanism or below the patch package mechanism.
- the number of the first identification point and the second identification point is four, and the four first identification points are respectively disposed at four corners of the cover, four of the second The identification points are respectively disposed at the four corners of the substrate.
- the adsorption mechanism includes an adsorption body and a plurality of vacuum adsorption assemblies, wherein the adsorption body is provided with a plurality of suction grooves, and the plurality of suction grooves and the plurality of vacuum adsorption assemblies A through hole connection for engaging the cover plate, each of the vacuum adsorption assemblies having an elastic adsorption member for forming close contact with the cover plate.
- the pressing mechanism is integrally provided with the adsorption mechanism, and the pressing mechanism has a pressing frame, and the pressing frame is concavely formed with a sealing cavity, and the sealing cavity can be pressed during the pressing process. Sealing and abutting with the accommodating cavity.
- the inflation mechanism and the air suction mechanism are integrally disposed, and the air suction hole and the inflation hole are the same air hole.
- the light gas comprises: hydrogen, or helium.
- the present disclosure also provides a patch packaging method, including: an adsorption mechanism sucks up a loaded cover plate; the adsorption mechanism carries the cover plate to move toward a receiving cavity of the packaging mechanism, wherein the capacity A substrate for which a patch is to be placed is placed in the cavity; the adsorption mechanism places the cover plate in the accommodating cavity, and the side walls of the cover plate, the substrate and the accommodating cavity form a Closing the cavity; the air suction mechanism extracts the air in the closed cavity through the air vent provided on the side wall; the inflation mechanism rushes into the closed cavity through the air vent provided on the side wall to lighter than the air a gas; a pressing mechanism presses the closed cavity such that the cover plate is completely pressed against the substrate after the light gas is discharged.
- the patch package device and method of the present disclosure even if bubbles are generated during the package encapsulation process, since the gas in the bubble is a light gas, the AMOLED package patch is stable and light after being exposed to the atmosphere after the package is packaged. The gas will rise automatically and the bubbles will be eliminated. Therefore, this process can save energy without additional defoaming steps, and can greatly improve the yield of the package of AMOLED package.
- FIG. 1 is a block diagram showing the structure of a chip package device according to an embodiment of the present disclosure
- FIG. 2 is a flow chart of a patch packaging method in accordance with an embodiment of the present disclosure
- FIG. 3 is a schematic diagram of a specific structure of a chip package device according to an embodiment of the present disclosure
- FIG. 4 is a schematic structural view of an adsorption mechanism of a patch package device according to an embodiment of the present disclosure.
- the curved surface AMOLED package patch device with wider application range has the advantages of no need to design, manufacture and debug the pressure plate machine plane compared with the flat AMOLED package patch device of the pressure box machine, which can save a lot of manpower, material resources and time cost.
- the advantage, however, is that it is difficult to avoid the problem that bubbles are easily generated during the lamination of the patch, resulting in a lower yield of the produced patches.
- the present disclosure provides a patch package device.
- 1 is a block diagram showing the structure of a patch package device according to an embodiment of the present disclosure.
- the device mainly includes an adsorption mechanism 10, a patch package mechanism 20, a pumping mechanism 30, an inflator 40, and a press mechanism 60. (As shown in Figure 3).
- the adsorption mechanism 10 is used to adsorb the loaded cover plate.
- the chip package mechanism 20 is provided with an accommodating cavity 22 for accommodating the loaded substrate requiring the patch and the cover. After the cover plate is placed in the accommodating cavity 22 by the absorbing mechanism, the cover plate, the substrate, and the side wall of the accommodating cavity 22 form a closed cavity.
- the side wall is provided with a suction hole and an inflation hole.
- the pumping mechanism 30 is for extracting air from the enclosed chamber through the air vent (not shown).
- the inflator 40 is configured to inject a lighter gas having a density lower than that of the air into the closed cavity through the inflation hole (not shown).
- the pressing mechanism is configured to press the closed cavity such that the cover plate is completely pressed against the substrate after the light gas is discharged.
- connection structure shown in FIG. 1 is only an optional manner. In practical applications, as long as the above various functional structures are provided, A package for the cover and the substrate (patch) is realized.
- the air in the closed cavity formed by the cover plate and the substrate and the side wall of the accommodating cavity 22 can be extracted before the cover plate is attached to the substrate.
- the closed cavity must not completely remove the air, that is, air is more or less present in the closed cavity, so The air is cleaned out, and then the lighter gas with a density lower than that of air is flushed into the closed cavity.
- the density of the gas in these bubbles is gradually smaller than that of the air. Disappeared.
- the above apparatus may further include: a first loading mechanism 510 and a second loading mechanism 530.
- a first loading mechanism 510 configured to load the cover plate 520 into a predetermined position, wherein the predetermined position is directly above the accommodating cavity 22; and the second loading mechanism 530 is configured to load the The substrate 540 is described and the substrate is placed in the accommodating cavity 22.
- the above apparatus may further include an image collection mechanism 550, a determination module 560, and a registration mechanism 570.
- the image collecting mechanism 550 is configured to collect an image of at least two first identification points 522 (ie, mark points for identification and alignment) preset on the cover plate after the cover plate is sucked up by the adsorption mechanism. Position information, and collecting at least two second identification points 542 preset on the substrate after the substrate is placed in the accommodating cavity 22 by the second loading mechanism (ie, for identification and pairing) Image position information of the bit mark).
- first identification points 522 ie, mark points for identification and alignment
- the image acquisition mechanism does not need to be set to be particularly complicated, and a camera with a higher resolution can be used.
- the determining module is configured to determine whether the first identification point and the second identification point correspond to each other by determining whether the image location information of the first identification point and the image location information of the second identification point match.
- the module can be implemented by a combination of software and hardware.
- the aligning mechanism is configured to adjust a position of the adsorption structure or the accommodating cavity 22 in a case where the positions of the first identification point and the second identification point do not correspond, such that the first identification point Corresponding completely with the second identification point.
- the above image acquisition mechanism, the judgment module and the alignment mechanism can be set up. Recognizing and adjusting the relative position of the cover plate and the substrate.
- the first loading mechanism of the above-described chip packaging device loads the cover plate and the second loading mechanism, the positional accuracy of loading the substrate is sufficiently high.
- These mechanisms and modules for identifying and adjusting the position may not be set.
- the setting generally improves the positional accuracy, the accuracy of the chip package can be further improved.
- the image collection mechanism may include one or two cameras, which may be set according to the number of cameras: (1) using a camera. In the case where the camera is disposed above the suction mechanism or below the patch package mechanism; (2) in the case where two cameras are used, the two cameras are respectively disposed above the adsorption mechanism or Below the patch package mechanism.
- the number of the first identification point and the second identification point is four, and the four first identification points are respectively disposed at four corners of the cover, four The second identification points are respectively disposed at the four corners of the substrate.
- PCBs printed circuit boards
- patches if you do not consider the cost, try to set a mark point on the four corners of the printed circuit board (PCB) or patch, which will be very Helping to make overshoots in process production requires alignment and position adjustment.
- the adsorption mechanism 10 may include an adsorption body 12 and a plurality of vacuum adsorption assemblies 14, wherein the adsorption body is provided with a plurality of suction grooves 16, the plurality of And a suction groove is connected to the through holes in the plurality of vacuum adsorption assemblies for engaging the cover plate, each of the vacuum adsorption assemblies having an elastic adsorption member 18 for forming a tight contact with the cover plate contact.
- the arrangement mode and the number of the suction grooves and the number of vacuum adsorption components may be determined according to the needs of the production process of the device, as long as the pumping of the suction groove can be realized, and then multiple The vacuum suction assembly can suck the cover plate by the elastic suction member to move the cover plate in position.
- the pressing mechanism is integrally provided with the adsorption mechanism, and the pressing mechanism has a pressing frame 62, and the pressing frame is concavely formed with a sealing cavity, which is described in the pressing process.
- the sealing cavity can be sealingly abutted with the receiving cavity 22.
- the inflation mechanism and the air suction mechanism may be integrally disposed, and the air suction hole and the inflation hole may be the same air hole.
- the above-described inflation mechanism and the pumping structure may be independently provided, for example, the pumping mechanism and the pumping mechanism may be The air venting hole is disposed at one side of the accommodating cavity 22, and the inflation mechanism and the venting hole are disposed on the other side of the accommodating cavity 22, so that the air venting mechanism passes through After the air vent is used to extract the air inside the closed cavity, the air venting mechanism further injects light gas into the closed cavity through the venting hole.
- the light gas may include: hydrogen gas or helium gas.
- hydrogen gas or helium gas.
- other light gases with stable properties can also be considered.
- the present disclosure also provides a chip packaging method.
- 2 is a flow chart of a patch packaging method according to an embodiment of the present disclosure. As shown in FIG. 2, the flow includes the following steps (step S202 - step S212):
- Step S202 the adsorption mechanism sucks up the loaded cover plate
- Step S204 the absorbing mechanism carries the cover plate to move toward the accommodating cavity of the packaging mechanism, wherein the accommodating cavity is placed with a substrate on which a patch is to be placed;
- Step S206 the adsorption mechanism places the cover plate in the accommodating cavity, and the cover plate, the substrate and the sidewall of the accommodating cavity form a closed cavity;
- Step S208 the air suction mechanism extracts air in the closed cavity through an air vent provided on the side wall;
- Step S210 the inflation mechanism punches a light gas having a density smaller than air into the closed cavity through the inflation hole provided on the side wall;
- Step S212 the pressing mechanism presses the closed cavity, so that the cover plate is completely pressed on the substrate after the light gas is discharged.
- the process of the chip package includes the following steps:
- the first loading mechanism drives the AMOLED package patch A (ie, the cover plate) to be loaded.
- the second loading mechanism loads the AMOLED package patch B (ie, the substrate) to be packaged, and places it in the accommodating cavity 22 for collecting the lower position information of the four mark points of the substrate.
- the image acquisition mechanism is disposed above the accommodating cavity 22, and performs position information collection on four mark points (ie, the second identification point).
- the adjustment method includes adjusting the horizontal displacement and/or the tilting angle of the adsorption mechanism based on the mark point of the AMOLED package patch B to adjust the AMOLED package patch A. Or the purpose of adjusting the horizontal displacement and/or the tilt angle of the patch package mechanism 20 based on the AMOLED package patch A to achieve the purpose of adjusting the position of the AMOLED package patch B in such two ways.
- the adsorption mechanism drives the AMOLED package patch A to vertically descend until a preset distance of the threshold height of the platform carrying the AMOLED package patch B (the height of the position conforms to the cover plate, the substrate, and the receiving cavity 22)
- the sidewalls form a closed cavity), which is equivalent to completing a pre-patch package process, but since the AMOLED package patch A and the AMOLED package patch B are not pressed together, There is no close fit.
- the pumping structure evacuates the closed chamber through the evacuation hole, and extracts the air inside.
- the inflatable structure fills the closed cavity with a stable light gas through the inflation hole, and the stable light gas can be a gas such as hydrogen or helium, which is lighter than air, and the lighter the gas, the better the anti-bubble effect.
- the stable light gas can be a gas such as hydrogen or helium, which is lighter than air, and the lighter the gas, the better the anti-bubble effect.
- the pressing frame of the pressing mechanism integrally provided with the adsorption mechanism continues to be pressed until the surface of the AMOLED package patch A and the surface of the AMOLED package patch B are attached, and at the same time, the pressing frame and the receiving cavity 22 are The sealing state of the sealing joint is also formed. After the package is completed, the adsorption mechanism drives the pressure frame to separate and complete the chip packaging.
- the second loading mechanism leaves the packaged AMOLED package patch B away from the chip package.
- the station returns to the station before step (3) for reclaiming.
- the patch package device and method provided by the embodiments of the present disclosure have the advantages that: by filling a stable light gas before pressing, an environment of stable light gas is formed between the cover plate and the substrate, and the AMOLED package patch is in the Encapsulation in the environment, even if bubbles are generated during the package encapsulation process, since the gas in the bubble is a light gas, after the AMOLED package is exposed to the atmosphere after the package is packaged, the stable light gas will automatically rise and then the bubble It is eliminated, so this process can save energy without additional defoaming steps, and can greatly improve the patch package yield of AMOLED package.
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Vacuum Packaging (AREA)
- Packages (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (11)
- 一种贴片封装装置,包括:吸附机构,用于吸附载入后的盖板;贴片封装机构,设置有一容置腔体,用于容置载入的需要贴片的基板和所述盖板,当所述盖板被所述吸附机构放置在所述容置腔体后,所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体,所述侧壁上设置有抽气孔和充气孔;抽气机构,用于通过所述抽气孔将所述封闭腔体内的空气抽出;充气机构,用于通过所述充气孔向所述封闭腔体内冲入密度比空气小的轻质气体;压合机构,用于对所述封闭腔体进行压合,使得所述轻质气体排出后所述盖板完全压合在所述基板上。
- 根据权利要求1所述的装置,还包括:第一载入机构,用于将所述盖板载入预定位置,其中,所述预定位置位于所述容置腔体的正上方;第二载入机构,用于载入所述基板并将所述基板放置在所述容置腔体中。
- 根据权利要求1所述的装置,还包括:图像采集机构,用于在所述盖板被所述吸附机构吸起后采集所述盖板上预先设置的至少两个第一识别点的图像位置信息,并在所述基板被所述第二载入机构放置在所述容置腔体中后采集所述基板上预先设置的至少两个第二识别点的图像位置信息;判断模块,用于通过判断所述第一识别点的图像位置信息和所述第二识别点的图像位置信息是否相符的方式,确定所述第一识别点和所述第二识别点是否位置对应;对位机构,用于在所述第一识别点和所述第二识别点的位置不对应的情况下,调整所述吸附结构或所述容置腔体的位置,使得所述第一识别点和所述第二识别点完全对应。
- 根据权利要求3所述的装置,其中,所述图像采集机构包括一个或两 个摄像头,在采用一个摄像头的情况下,所述摄像头设置在所述吸附机构的上方或所述贴片封装机构的下方,在采用两个摄像头的情况下,两个摄像头分别设置在所述吸附机构的上方或所述贴片封装机构的下方。
- 根据权利要求3所述的装置,其中,所述第一识别点和所述第二识别点的个数为四个,四个所述第一识别点分别设置在所述盖板的四个角,四个所述第二识别点分别设置在所述基板的四个角。
- 根据权利要求1所述的装置,其中,所述吸附机构包括吸附本体和多个真空吸附组件,其中,所述吸附本体中设置有多个抽气槽,所述多个抽气槽与所述多个真空吸附组件中的通孔连接,用于配合吸附所述盖板,每个所述真空吸附组件具有一个弹性吸附部件,用于与所述盖板形成紧密接触。
- 根据权利要求1所述的装置,其中,所述压合机构与所述吸附机构一体设置,所述压合机构具有一压框,所述压框内凹形成有密封腔体,在压合过程中所述密封腔体能够与所述容置腔体密封吻合对接。
- 根据权利要求1所述的装置,其中,所述充气机构和所述抽气机构一体设置,所述抽气孔和所述充气孔为同一个气孔。
- 根据权利要求1至8中任一项所述的装置,其中,所述轻质气体包括:氢气、或氦气。
- 一种贴片封装方法,包括:吸附机构将载入的盖板吸起;所述吸附机构携带所述盖板向封装机构的容置腔体方向运动,其中,所述容置腔内放置有需要进行贴片的基板;所述吸附机构将所述盖板放置在所述容置腔体内,所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体;抽气机构通过侧壁上设置的抽气孔将所述封闭腔体内的空气抽出;充气机构通过侧壁上设置的充气孔向所述封闭腔体内冲入密度比空气小的轻质气体;压合机构对所述封闭腔体进行压合,使得所述轻质气体排出后所述盖板完全压合在所述基板上。
- 根据权利要求10所述的方法,其中,所述轻质气体包括氢气或氦气。
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CN107729837A (zh) * | 2017-10-12 | 2018-02-23 | 信利光电股份有限公司 | 一种指纹模组贴合设备、方法以及指纹识别传感器 |
CN109031719B (zh) * | 2018-08-16 | 2021-07-06 | 苏州精濑光电有限公司 | 一种对组压合方法 |
CN109616430B (zh) * | 2018-11-13 | 2020-10-30 | 武汉电信器件有限公司 | 一种芯片贴装识别***及方法 |
CN110515225B (zh) * | 2019-09-18 | 2024-04-12 | 深圳市深科达智能装备股份有限公司 | 全面屏无边框贴合设备 |
CN111642126B (zh) * | 2020-05-25 | 2021-04-09 | 深圳市琦轩实创科技有限公司 | 一种用于电子类产品生产的贴片设备 |
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