WO2016161945A1 - 一种抛光方法 - Google Patents

一种抛光方法 Download PDF

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Publication number
WO2016161945A1
WO2016161945A1 PCT/CN2016/078680 CN2016078680W WO2016161945A1 WO 2016161945 A1 WO2016161945 A1 WO 2016161945A1 CN 2016078680 W CN2016078680 W CN 2016078680W WO 2016161945 A1 WO2016161945 A1 WO 2016161945A1
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WIPO (PCT)
Prior art keywords
polishing
water
ceramic
workpiece
belt
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PCT/CN2016/078680
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English (en)
French (fr)
Inventor
冯竞浩
宋宪君
Original Assignee
广东一鼎科技有限公司
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Application filed by 广东一鼎科技有限公司 filed Critical 广东一鼎科技有限公司
Priority to BR112017012252-9A priority Critical patent/BR112017012252B1/pt
Priority to ES16776120T priority patent/ES2877434T3/es
Priority to EP16776120.4A priority patent/EP3281742B1/en
Publication of WO2016161945A1 publication Critical patent/WO2016161945A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain

Definitions

  • the present invention relates to a polishing method.
  • the surface to be processed of the workpiece is usually oriented directly upward, and polished and polished on the surface to be processed by a polishing and polishing device; for example, ceramic polished tiles, including a rough back surface and a smooth surface (rough back surface is a veneer surface)
  • the smooth surface is the decorative surface
  • the ceramic polishing brick 40 is first placed on the horizontally disposed conveyor belt 1 such that the decorative surface 41 of the ceramic polishing brick 40 faces upward, that is, the tile of the ceramic polishing tile 40.
  • the veneer is facing the ground, and a plurality of polishing heads 2 arranged along the conveying direction of the conveyor belt are disposed above the conveyor belt 1.
  • the ceramic polishing bricks 40 are continuously moved along with the conveyor belt 1, and each of the polishing mills 2 is ceramic from top to bottom.
  • the polished tile 40 is polished. (Ceramic polished tiles are generally bricks before polishing, therefore, in the art, ceramic polished tiles are also referred to as ceramic polished tiles before polishing)
  • the polishing head 2 polishes the decorative surface 41 of the ceramic polishing tile 40, a large amount of minute-grained abrasive chips 42 are generated, which remain on the decorative surface 41 and follow the polishing head 2 at a high speed. Rotation will scratch the decorative surface 41, seriously affecting the polishing effect, and at the same time, since there is a layer of wear debris 42 between the polishing head 2 and the decorative surface 41, the contact ratio between the polishing head 2 and the decorative surface 41 is lowered. , thus seriously affecting the efficiency of polishing; in order to solve the above problems, the traditional approach is to treat while polishing A large amount of water is sprayed on the surface to wash away the wear debris.
  • the object of the present invention is to provide a polishing method which can effectively prevent the grinding debris from remaining on the surface to be processed of the workpiece, and simplifies the polishing process of the workpiece.
  • the present invention adopts the following technical solutions:
  • the water is applied from the bottom to the top by the water application device.
  • the water application device is a water spray mechanism for spraying water from the bottom to the top during the polishing process, and the water is subjected to pressure atomization treatment during water spray, and the atomized water is sprayed onto the surface to be processed.
  • the polishing apparatus includes at least one polishing head driven by a first drive mechanism.
  • the number of polishing heads is plural, and the plurality of polishing heads are disposed below the surface to be processed of the workpiece and are arranged at intervals along the conveying direction of the conveying mechanism.
  • the transport mechanism includes a belt driven by the second drive mechanism and a backup roller positioned below the belt, and the workpiece is clamped between the belt and the backup roller during polishing.
  • a support beam is arranged in the annular region of the belt, the support beam extending in the same direction as the belt.
  • the polishing method of the present invention when polishing and polishing the workpiece, causes the surface to be processed of the workpiece to face the ground, and the polishing surface is used to polish the surface to be processed under the workpiece, and the grinding debris generated during the polishing process will be
  • the polishing method of the present invention can effectively prevent the grinding debris from remaining on the surface to be processed of the workpiece, thereby improving the polishing efficiency and improving the polishing effect.
  • 1 is a schematic view showing a polishing method of a conventional ceramic polished tile
  • Figure 2 is an enlarged view of a portion A in Figure 1;
  • Figure 3 is a schematic view of a polishing method of the present invention.
  • Figure 4 is an enlarged view of B in Figure 3;
  • 3 and 4 illustrate a polishing method of the present invention applied to polishing of a ceramic polished tile, the method specifically conveying a ceramic polished tile along a predetermined track by a transport mechanism, and when transporting, the ceramic polished tile
  • the decorative surface 41 of the 40 faces the ground 50, and moves along the conveying path of the ceramic polishing tile 40 along the transport mechanism.
  • the decorative surface 41 of the ceramic polished tile is polished under the ceramic polishing tile by a polishing device.
  • the above method puts the decorative surface 41 of the ceramic polishing tile 40 downward, that is, the decorative surface 41 faces the ground 50, and the grinding generated during the polishing process falls according to its own gravity, thereby effectively avoiding grinding on the ceramic polishing brick 40. Remaining on the decorative surface 41, avoiding the grinding effect on the polishing effect, and improving the polishing efficiency.
  • the above polishing apparatus of the present invention may be a polishing head 30 for polishing a ceramic polishing brick in the prior art, which will not be described herein.
  • the water spray mechanism is used to spray the decorative surface 41 of the ceramic polished tile from bottom to top.
  • a high-pressure pump can be arranged inside the water spray mechanism, and at the same time, an atomizing nozzle can be arranged at the water spray port of the water spray mechanism, and the high-pressure pump and the atomizing nozzle are used.
  • the water is atomized by high pressure and sprayed onto the decorative surface 41 of the ceramic polished tile.
  • the above method can polish the ceramic polishing tile 40 with at least one polishing head 30, which is driven by the first drive mechanism.
  • the first drive mechanism can be driven by a motor or other similar drive mechanism other than the motor.
  • a plurality of polishing heads 30 are disposed under the transport mechanism, and the plurality of polishing heads 30 are arranged along the transport direction of the transport mechanism, such that during polishing A plurality of ceramic polishing bricks can be continuously conveyed by a conveying mechanism, and each of the ceramic polishing bricks is sequentially polished by a plurality of polishing grinding heads 30 to achieve a polishing grade of the surface of the ceramic polishing brick.
  • the plurality of polishing heads 30 may be arranged at equal intervals or may be arranged at unequal intervals. Moreover, each of the polishing heads 30 can be separately driven by a first drive mechanism, or the plurality of polishing heads 30 can be collectively driven by a first drive mechanism.
  • each of the above-mentioned polishing heads 30 can be regarded as a polishing station, and the polishing surface 41 of the ceramic polishing bricks located at the polishing station can be sprayed at each polishing station, specifically
  • the water spray mechanism may be provided with a plurality of water spray ports, which may share a single water supply channel, or may have an independent water supply channel, the plurality of water spray ports corresponding to each other.
  • the water is disposed in the middle of the plurality of polishing heads 30.
  • the high-pressure pump and the atomizing nozzle can uniformly distribute the sprayed water on the ceramic polishing bricks.
  • the face 41 is decorated and the sprayed water is allowed to cover as much as possible the decorative face 41 of the ceramic buff.
  • the decorative surface 41 of the ceramic polishing brick 40 is oriented toward the ground 50, that is, the surface of the ceramic polishing brick 40 having a high water absorption is located at the polishing head 30.
  • the above polishing method of the present invention greatly reduces the ceramic The amount of water absorption of the polished tile during the polishing process, therefore, for the ceramic polished tile having high water absorption, after the polishing by the above-described polishing method of the present invention, the subsequent drying step can be eliminated.
  • the method of the present invention is not limited to the above-mentioned method of supplying water to the surface of the ceramic polishing brick by means of spraying, and other water application equipment can be utilized during the polishing process.
  • the decorative surface 41 of the ceramic polished tile is supplied with water.
  • a roller made of absorbent cotton may be disposed under the ceramic polished tile.
  • the squeeze roller passes the water inside the roller.
  • the water supply mechanism can be used to continuously supply water inside the roller to supplement the amount of water inside the roller.
  • the transport mechanism in the above method of the present invention includes a belt 10 driven by a second drive mechanism and a backup roller located below the belt 10, and the belt 10 is used to drive the movement of the ceramic polishing tile 40.
  • the ceramic polishing tile 40 is transported. Clamped between the lower surface of the belt 10 and the top end surface of the polishing head 30, while the ceramic polishing brick 40 is also clamped between the lower surface of the belt 10 and the backup roller, after the ceramic polishing brick 40 is clamped, the ceramic polishing The upper surface of the brick 40 having a certain roughness has a large frictional force with the lower surface of the belt 10, which is the driving force for driving the horizontal movement of the ceramic polishing brick 40, and the ceramic polishing brick 40 is topped up by the polishing grinding head 30.
  • the belt 10 defines the degree of freedom of the ceramic polishing tile 40 to move upward, so that a certain pressure is generated between the decorative surface 41 of the ceramic polishing tile 40 and the polishing head 30, thus ensuring that the polishing can be performed normally, of course, considering
  • the belt 10 may be deformed when pressed by the ceramic polishing tile 40, so that the mutual pressure between the polishing head 30 and the ceramic polishing tile 40 is too small, which affects the polishing effect.
  • a supporting beam 20 is disposed in the annular region of the belt 10, and the supporting beam 20 extends in the same direction as the conveying direction of the belt 10. When the belt 10 is deformed upwardly, the supporting beam 20 can be used to support the belt 10. Thereby, it is ensured that there is a sufficiently large pressure between the ceramic polishing tile 40 and the polishing head 30.
  • the second drive mechanism can be a motor or a similar drive mechanism belt other than the motor move.
  • the present invention can also adopt the transmission mechanism other than the above-mentioned belt conveying device to realize the transportation of the ceramic polishing brick.
  • the decorative surface 41 of the ceramic polishing brick is facing downward and the polishing head can be polished. There is a mutual pressure between the ceramic polished tiles and the ceramic polishing tiles.
  • polishing method for ceramic polishing tiles is merely an application example of the present invention, and the polishing method of the present invention can also be applied to polishing processing of other types of workpieces, for example, other ceramics other than ceramic polished tiles.
  • Pieces, sheet metal parts of course, the shape of these workpieces is not limited to the plate-like structure, in short, as long as the decorative surface 41 of the workpiece faces the ground 50 during the polishing process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

一种抛光方法，利用一传输机构输送工件，并且使工件的待加工面朝向地面，利用抛光装置在待加工面的下方对待加工面进行抛光。该抛光方法在针对工件进行抛光打磨时，使工件的待加工面朝向地面，利用抛光装置在工件的待加工面下方对待加工面进行抛光，抛光过程中产生的磨屑会依据自重向下掉落，因此，该抛光方法能够有效的避免磨屑残留在工件的待加工面，提高了抛光的效率，改善了抛光的效果。

Description

一种抛光方法 技术领域
本发明涉及一种抛光方法。
背景技术
工件在抛光时，通常将工件的待加工面朝向正上方，利用抛光打磨装置在待加工面上进行抛光打磨；例如陶瓷抛光砖，包括粗糙的背面和光滑的表面(粗糙的背面为铺贴面，光滑的表面为装饰面)，装饰面需要进行抛光工艺。参见图1、2所示，陶瓷抛光砖40在抛光时，先将陶瓷抛光砖40放置于水平设置的传送带1上，使陶瓷抛光砖40的装饰面41朝上，即陶瓷抛光砖40的铺贴面朝向地面，传送带1上方设置有多个沿着传送带的输送方向排列的抛光磨头2，陶瓷抛光砖40随着传送带1连续地移动，每个抛光磨2头均从上往下地对陶瓷抛光砖40进行抛光。(陶瓷抛光砖在抛光之前一般为砖坯，因此，在本领域中，陶瓷抛光砖在抛光之前又称为陶瓷抛光砖坯)
在抛光过程中，由于抛光磨头2打磨陶瓷抛光砖40的装饰面41，会产生大量的微小颗粒状的磨屑42，这些磨屑42残留在装饰面41上并随着抛光磨头2高速转动，会将装饰面41刮花，严重影响抛光的效果，同时，由于在抛光磨头2与装饰面41之间存在一层磨屑42，抛光磨头2与装饰面41之间接触率降低，从而严重的影响了抛光的效率；为了解决上述的问题，传统的做法是在抛光的同时，对待加工 面喷大量的水，以冲洗掉磨屑，同时，对于一些吸水率较高的陶瓷抛光砖，由于在水冲洗过程中吸收大量的水分，后续还必须利用烘干炉进行烘干，增加了陶瓷抛光砖加工的复杂程度；当然，上述的抛光方法在应用于其他工件的加工时，同样会存在上述的问题。
发明内容
针对现有技术的不足，本发明的目的旨在于提供一种抛光方法，其能够有效的避免磨屑残留在工件的待加工面上，简化了工件的抛光工艺。
为实现上述目的，本发明采用如下技术方案：
一种抛光方法，利用一传输机构输送工件，并且使工件的待加工面朝向地面，利用抛光装置在待加工面的下方对待加工面进行抛光。
在抛光过程中，利用施水装置由下至上对待加工面施水。
施水装置为一在抛光过程中由下至上对待加工面喷水的喷水机构，在喷水时对水进行加压雾化处理，将雾化后的水喷至待加工面。
抛光装置包括至少一个由第一驱动机构带动的抛光磨头。
优选地，抛光磨头的数量有多个，该多个抛光磨头设置于工件的待加工面下方并沿着传输机构的输送方向间隔排列。
传输机构包括由第二驱动机构带动的皮带和位于皮带下方的支承辊，抛光时，工件被夹持在皮带和支承辊之间。
在皮带的环形区域内设置有一支撑横梁，该支撑横梁的延伸方向与皮带的输送方向一致。
本发明的有益效果在于：
相比于现有技术，本发明的抛光方法在针对工件进行抛光打磨时，使工件的待加工面朝向地面，利用抛光装置在工件的下方对待加工面进行抛光，抛光过程中产生的磨屑会依据自重向下掉落，因此，本发明的抛光方法能够有效的避免磨屑残留在工件的待加工面，提高了抛光的效率，改善了抛光的效果。
附图说明
图1为现有陶瓷抛光砖抛光方法的示意图；
图2为图1中A处的放大视图；
图3为本发明的一种抛光方法的示意图；
图4为图3中B处的放大视图；
其中：10、皮带；20、支撑横梁；30、抛光磨头；40、陶瓷抛光砖；41、装饰面；50、地面。
具体实施方式
下面，结合附图以及具体实施方式，对本发明做进一步描述：
图3和图4示意了本发明的一种抛光方法，其应用于陶瓷抛光砖的抛光，该方法具体的是利用一传输机构沿预定的轨迹输送陶瓷抛光砖，并且在输送时，陶瓷抛光砖40的装饰面41(装饰面41即陶瓷抛光砖40较为光滑的表面，装饰面41为陶瓷抛光砖40的待加工表面)朝向地面50，在陶瓷抛光砖40沿着传输机构的输送轨迹运动的过程 中，利用抛光装置在陶瓷抛光砖的下方对陶瓷抛光砖的装饰面41进行抛光。上述方法将陶瓷抛光砖40的装饰面41朝下，即装饰面41朝向地面50，在抛光过程中产生的磨削会依据自身的重力下落，从而有效的避免了磨削在陶瓷抛光砖40的装饰面41上残留，避免磨削影响抛光效果，同时提高了抛光的效率。本发明的上述抛光装置可以是现有技术中对陶瓷抛光砖进行抛光用的抛光磨头30,在这里不做赘述。
此外，为了进一步提升抛光的效果以及抛光效率，在抛光的过程中，利用喷水机构由下至上对陶瓷抛光砖的装饰面41喷水。在喷水机构对陶瓷抛光砖的抛光面喷水时，可以在喷水机构内部设置高压泵，同时，还可以在喷水机构的喷水口设置雾化喷头，利用高压泵和雾化喷头，将水高压雾化后喷至陶瓷抛光砖的装饰面41。实现上述高压雾化水的具体结构或技术手段较多，但这些技术手段均属于本领域技术人员惯常使用的方法。
上述方法可以利用至少一个的抛光磨头30对陶瓷抛光砖40进行抛光，抛光磨头30由第一驱动机构带动。
第一驱动机构可以是电机或除电机以外的其他类似驱动机构带动。
优选地，抛光磨头30的数量有多个，多个抛光磨头30均设置于传输机构的下方，并且该多个抛光磨头30沿着传输机构的输送方向间隔排列，如此，在抛光时，可以通过传输机构连续的输送多个陶瓷抛光砖，每一个陶瓷抛光砖均依次被多个抛光磨头30打磨，从而达到陶瓷抛光砖表面的抛光等级。
多个抛光磨头30既可以等间距排列，也可以不等间距排列。而且，每个抛光磨头30可以由一个第一驱动机构分别带动，或者多个抛光磨头30共同由一个第一驱动机构带动。
当然，可以将上述的每一个抛光磨头30的位置均视为一个抛光工位，在每一个抛光工位处均可以对位于该抛光工位的陶瓷抛光砖的装饰面41喷水，具体的是，上述的喷水机构可以是设置有多个喷水口，该多个喷水口可以是共用一个供水通道，也可以是分别具有一个独立的供水通道，该多个喷水口一一对应的设置在多个抛光磨头30的中部，如此，在抛光磨头30中部为陶瓷抛光砖的抛光供水，上述的高压泵和雾化喷头，可以使得喷出的水均匀分布于陶瓷抛光砖的装饰面41，并且使喷出的水能够尽可能的覆盖陶瓷抛光砖的装饰面41。
本发明的上述方法在针对陶瓷抛光砖40进行抛光打磨时，使陶瓷抛光砖40的装饰面41朝向地面50，也就是说，陶瓷抛光砖40吸水性较强的铺贴面位于抛光磨头30和喷水机构喷水口的上方，并且，陶瓷抛光砖40的铺贴面与喷水机构的喷水口之间被陶瓷抛光砖40的装饰面41隔离开，由于装饰面41的吸水性极低，因此，大量的水被装饰面41阻挡后从陶瓷抛光砖的四周滴落，不会进入到陶瓷抛光砖40的铺贴面，也就是说，本发明的上述抛光方法大大的降低了陶瓷抛光砖在抛光过程中的吸水量，因此，对于吸水性较强的陶瓷抛光砖来说，在利用本发明的上述抛光方法完成抛光后，可以无需再进行后续的烘干步骤。需要指出的是，本发明的方法不仅限于上述采用喷射的方式为陶瓷抛光砖的表面供水，在抛光过程中，还可以利用其它的施水装 置代替上述的喷水机构为陶瓷抛光砖的装饰面41供水，例如，可以在陶瓷抛光砖的下方设置利用吸水棉制成的辊子，在抛光过程中，挤压辊子将辊子内部的水由下至上施于陶瓷抛光砖的装饰面41，当然，为了保证供水的持续性，可以利用供水机构为辊子内部持续的供水，用以补充辊子内部的水量。
本发明的上述方法中的传输机构包括由第二驱动机构带动的皮带10和位于皮带10下方的支承辊，利用皮带10带动陶瓷抛光砖40运动，具体的是，陶瓷抛光砖40在输送时被夹持于皮带10下表面与抛光磨头30的顶端面之间，同时陶瓷抛光砖40也是被夹持于皮带10下表面与支承辊之间，在陶瓷抛光砖40被夹紧后，陶瓷抛光砖40具有一定粗糙度的上表面与皮带10下表面之间具有较大的摩擦力，该摩擦力即为驱动陶瓷抛光砖40水平移动的动力，由于抛光磨头30将陶瓷抛光砖40向上顶压，并且皮带10限定了陶瓷抛光砖40向上移动的自由度，使得陶瓷抛光砖40的装饰面41与抛光磨头30之间产生一定的压力，如此，确保抛光能够正常进行，当然，考虑到皮带10可能会在受到陶瓷抛光砖40向上顶压时发生形变，致使抛光磨头30与陶瓷抛光砖40之间的相互压力过小，影响抛光效果，还可以在上述皮带10的环形区域内设置一支撑横梁20，该支撑横梁20的延伸方向与皮带10的输送方向一致，在皮带10被向上顶压发生形变时，可以利用支撑横梁20来支撑皮带10，从而确保陶瓷抛光砖40与抛光磨头30之间具有足够大的压力。
第二驱动机构可以是电机或除电机以外的其他类似驱动机构带 动。
需要说明的是，本发明还可以采用除上述皮带传送装置以外的传输机构来实现陶瓷抛光砖的输送，总之只要能够在输送陶瓷抛光砖时确保陶瓷抛光砖的装饰面41朝下以及抛光磨头与陶瓷抛光砖之间具有满足抛光要求的相互压力即可。
值得一提的是，上述针对陶瓷抛光砖的抛光方法仅仅是本发明的一种应用实例，本发明的抛光方法还可应用于其他类型工件的抛光加工，例如，除陶瓷抛光砖外的其他陶瓷件、钣金件，当然，这些工件的形状并不局限于板状结构，总之，只要是在抛光过程中，使工件的装饰面41朝向地面50即可。
对本领域的技术人员来说，可根据以上描述的技术方案以及构思，做出其它各种相应的改变以及形变，而所有的这些改变以及形变都应该属于本发明权利要求的保护范围之内。

Claims (7)

  1. 一种抛光方法，其特征在于，利用一传输机构输送工件，并且使工件的待加工面朝向地面，利用抛光装置在待加工面的下方对待加工面进行抛光。
  2. 如权利要求1所述的抛光方法，其特征在于，在抛光过程中，利用施水装置由下至上对待加工面施水。
  3. 如权利要求2所述的抛光方法，其特征在于，施水装置为一在抛光过程中由下至上对待加工面喷水的喷水机构，在喷水时对水进行加压雾化处理，将雾化后的水喷至待加工面。
  4. 如权利要求1所述的抛光方法，其特征在于，抛光装置包括至少一个由第一驱动机构带动的抛光磨头。
  5. 如权利要求4所述的抛光方法，其特征在于，抛光磨头的数量有多个，该多个抛光磨头设置于工件的待加工面下方并沿着传输机构的输送方向间隔排列。
  6. 如权利要求1所述的抛光方法，其特征在于，传输机构包括由第二驱动机构带动的皮带和位于皮带下方的支承辊，抛光时，工件被夹持在皮带和支承辊之间。
  7. 如权利要求6所述的抛光方法，其特征在于，在皮带的环形区域内设置有一支撑横梁，该支撑横梁的延伸方向与皮带的输送方向一致。
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