WO2016157594A1 - Sheet-like joining material, electronic component equipped with same, joining method, and joined body - Google Patents

Sheet-like joining material, electronic component equipped with same, joining method, and joined body Download PDF

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Publication number
WO2016157594A1
WO2016157594A1 PCT/JP2015/081364 JP2015081364W WO2016157594A1 WO 2016157594 A1 WO2016157594 A1 WO 2016157594A1 JP 2015081364 W JP2015081364 W JP 2015081364W WO 2016157594 A1 WO2016157594 A1 WO 2016157594A1
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Prior art keywords
resin
bonding material
joining
bonding
electronic component
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PCT/JP2015/081364
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French (fr)
Japanese (ja)
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野村昭博
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株式会社村田製作所
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Publication of WO2016157594A1 publication Critical patent/WO2016157594A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to a sheet-like bonding material used when, for example, an electronic component including an electrode is mounted on a circuit board, and further, an electronic component including the same, a bonding method using the bonding material, and bonding About the body.
  • An anisotropic conductive bonding material is known as a bonding material used when an electronic component including an electrode is bonded to a conductor (for example, a land electrode) on a circuit board.
  • the anisotropically conductive bonding material has two members as described above (for example, a circuit board including an electronic component including an electrode and a conductor (electrode) to which the electrode included in the electronic component is to be electrically connected). It is a joining material used when joining.
  • anisotropic conductivity means that when two members as described above are bonded, the two electrodes to be connected to each other are bonded in such a manner that they are electrically connected.
  • the electrodes adjacent to each other in the direction parallel to the main surface of the circuit board hereinafter also referred to as “plane direction”) can be kept electrically insulated without being electrically connected. Refers to the nature.
  • the bonding material has a conductivity in the thickness direction, that is, between two electrodes facing each other.
  • anisotropic conductive bonding materials are roughly classified into paste-like and sheet-like materials, and sheet-like materials have advantages in terms of usability compared to paste-like materials.
  • a paste-like bonding material it is necessary to use a method such as printing or dispensing, and in any case, a jig such as a mask, squeegee, syringe, needle, or consumable material is required. It is necessary to accurately manage a small amount of coating, and there are problems that it is expensive and the manufacturing process is complicated.
  • Patent Documents 1 and 2 Such sheet-like bonding materials (anisotropic conductive bonding materials) are disclosed in Patent Documents 1 and 2 below.
  • Patent Document 1 in an anisotropic conductive adhesive or film containing an adhesive component and conductive particles, at least two or more types of particles having different hardness and substantially the same particle size are used as the conductive particles.
  • An anisotropic conductive bonding material (an anisotropic conductive adhesive) is disclosed.
  • Patent Document 2 resin particles made of an acrylic resin having a maximum compressive deformation rate of 60% or more and a load required for compressive deformation of 60% are 60 mN or less are used as a core material.
  • An anisotropic conductive bonding material anisotropic conductive adhesive
  • anisotropic conductive adhesive which contains conductive particles having a conductive material attached to the surface thereof, and the conductive particles are dispersed in the adhesive material.
  • the anisotropic conductive bonding materials of Patent Documents 1 and 2 are both related to an anisotropic conductive bonding material using a resin material and conductive particles, and are related to conductive particles to be blended in the bonding material. By appropriately adjusting the characteristics such as the sheath size, the ease of compressive deformation, and the like, a stable crimp-fixed state is obtained and high conduction reliability is obtained.
  • the conduction between the conductive particles and the object to be bonded is either the electrode and a part of the conductive particles are in contact, Alternatively, it is obtained by being close to the extent that current flows by the tunnel effect or the Schottky effect, and is not obtained by physical and strong bonding like metal bonding.
  • conductive particles may be caused by the expansion and contraction of the bonding target (for example, electronic components and circuit boards) and the bonding material itself due to repeated temperature changes, moisture absorption and condensation in a high humidity environment, etc.
  • the bonding target for example, electronic components and circuit boards
  • the bonding material itself due to repeated temperature changes, moisture absorption and condensation in a high humidity environment, etc.
  • the stable joint state of the contact between the electrode and the electrode is impaired, and good electrical conduction cannot be maintained.
  • Patent Document 3 proposes an anisotropic conductive bonding material using conductive particles whose surfaces are covered with solder so that the conductive particles and the electrode can be firmly bonded by metal bonding. ing.
  • solder layer exists outside the conductive layer in the conductive particles, the solder layer and the electrode can be metal-bonded by melting the solder layer by heating. It is said that high bonding reliability can be obtained.
  • the conductive particles used in Patent Document 3 have a configuration in which the core is formed of a resin material and a solder layer is formed as a surface layer, the core and the surface layer (solder layer) Since the thermal expansion coefficients differ greatly, there is a risk of destruction at the interface between the core and the surface layer (solder layer) due to temperature cycling.
  • the conductive particles in which the core is formed of a resin material and the solder layer is formed as a surface layer are melted only on the surface when heated, and only the conductive particles that have been in contact with the electrode have the surface layer (solder Layer) will be metal bonded to the electrode. Therefore, only the conductive particles that exist on the electrode (between two electrodes facing each other) contribute effectively to the electrical connection, and the conductive particles that do not exist on the electrode contribute to the electrical connection. In addition to this, there is a problem that, depending on the case, it may cause a short circuit between electrodes adjacent to each other in a direction (plane direction) parallel to the main surface of the circuit board.
  • the present invention solves the above-described problems, and is used when, for example, an electronic component including an electrode is mounted on a circuit board.
  • the present invention has excellent handleability and reliable mechanical joining and good electrical continuity. It is possible to reliably join electronic parts and joining objects that have excellent connection workability and high connection reliability after mounting, using this bonding material.
  • An object of the present invention is to provide a simple bonding method and a bonded body with high bonding reliability.
  • the bonding material of the present invention is: A sheet-like bonding material used for bonding between members having electrodes, A liquid cross-linkable resin at 15 ° C. or higher and 25 ° C. or lower; A cross-linked resin solid at 15 ° C. or higher and 25 ° C. or lower; It is characterized by containing solder.
  • the crosslinkable resin is preferably a thermosetting resin.
  • a thermosetting resin as the cross-linking resin, it is possible to realize highly reliable bonding only by heating, and the present invention can be more effectively realized.
  • thermosetting resin is an epoxy resin.
  • an epoxy resin By using an epoxy resin as the thermosetting resin, stable bonding reliability can be realized.
  • the content ratio of the liquid crosslinkable resin and the solid crosslinkable resin is preferably in the range of 5:95 to 95: 5 by weight. Stable handling, sufficient storage stability, and high bonding reliability are realized by setting the content ratio of liquid crosslinkable resin and solid crosslinkable resin in the range of 5:95 to 95: 5 by weight. It is possible to provide a bonding material that can be used.
  • solder is contained in a proportion of 2.5% by volume to 50% by volume.
  • a bonding material capable of realizing stable handling, sufficient storage stability, and high bonding reliability by containing solder in a proportion of 2.5% by volume or more and 50% by volume or less. it can.
  • solder is Sn-based solder having Sn as one of main components.
  • Sn-based solder with Sn as one of the main components, a bonding material capable of realizing high bonding reliability can be provided.
  • the Sn-based solder is SnAgCu-based solder or SnBi-based solder.
  • SnAgCu-based solder or SnBi-based solder As the Sn-based solder, a bonding material capable of realizing high bonding reliability can be provided.
  • the bonding material of the present invention preferably contains an activator. Since the activator functions to remove the solder and the oxide film on the electrode surface, the activator is included to improve the joint state between the electrode and the solder and realize a highly reliable joint. Can do.
  • the activator is adipic acid or sebacic acid.
  • the activator is adipic acid or sebacic acid, it is possible to provide a bonding material that can more reliably achieve a good bonding state.
  • the electronic component of the present invention is characterized by including the bonding material of the present invention.
  • the bonding method of the present invention is a bonding method for bonding members having electrodes, and the liquid material and the solid material in a state where the bonding material of the present invention is positioned between the members having the electrode. It is characterized by cross-linking the cross-linked resin.
  • the joined body of the present invention is characterized in that one joining object and the other joining object are joined by the joining method of the present invention.
  • the joining material of the present invention is a sheet-like joining material used for joining members having electrodes, and is a liquid crosslinkable resin (hereinafter simply referred to as “liquid resin”) at 15 ° C. or more and 25 ° C. or less. And a solid cross-linkable resin (hereinafter also simply referred to as “solid resin”) at 15 ° C. or higher and 25 ° C. or lower, and solder, and is in the form of a sheet. Compared to, it is easy to handle. That is, as in the case of supplying a paste-like bonding material, it is not necessary to use a method such as printing or dispensing, and an appropriate amount of bonding material can be easily supplied.
  • liquid resin liquid crosslinkable resin
  • solid resin solid cross-linkable resin
  • the ratio of the liquid resin and the solid resin is controlled, or the type of the liquid resin and the solid resin is appropriately selected. By doing so, it is possible to impart moderate flexibility, adhesiveness, and the like, and further improve the handleability.
  • the electronic component of the present invention includes the bonding material of the present invention, for example, when mounting on a circuit board, the electronic component and the circuit are not required to separately prepare the bonding material. Mounting electronic components on a circuit board in such a posture that the bonding material is positioned between the boards, heating them in a reflow furnace, and crosslinking the liquid resin and solid resin easily and with high reliability ( Joining) can be performed.
  • the bonding method of the present invention is a bonding method for bonding members having electrodes, wherein the bonding material of the present invention is placed between the members having the electrodes in a liquid and solid state. Since the cross-linking resin is cross-linked, it is possible to easily bond the two by simply performing a cross-linking process such as heating while the bonding material is positioned between the members (between the objects to be bonded). It becomes possible. Further, since the bonding material of the present invention is used, highly reliable bonding can be performed.
  • the joined body of the present invention is obtained by joining one member having an electrode and the other member having an electrode by the joining method of the present invention, and the joining material of the present invention is used as a joining material. Therefore, it is possible to easily obtain a bonded body with high bonding reliability.
  • the bonding material of the present invention is a sheet-shaped bonding material used for bonding members having electrodes, and is a liquid cross-linkable resin (liquid resin) at 15 ° C. or higher and 25 ° C. or lower, and 15 ° C. or higher, It contains a solid cross-linkable resin (solid resin) and solder at 25 ° C. or lower.
  • liquid resin liquid resin
  • solid resin solid cross-linkable resin
  • the bonding material of the present invention two types of resins, that is, a liquid crosslinkable resin and a solid crosslinkable resin at 15 ° C. or higher and 25 ° C. or lower are blended as the crosslinkable resin.
  • the determination of whether or not the cross-linked resin is “liquid at 15 ° C. or higher and 25 ° C. or lower” is performed by the following liquid confirmation test used for the dangerous goods determination of the Fire Service Act.
  • Constant temperature water tank A stirrer, a heater, a thermometer, and an automatic temperature controller (which can be controlled at ⁇ 0.1 ° C) are prepared with a depth of 150 mm or more.
  • Test tubes A flat bottom cylindrical transparent glass having an inner diameter of 30 mm and a height of 120 mm is prepared. Mark lines (hereinafter referred to as “A line” and “B line”) are attached to the test tubes at a height of 55 mm and 85 mm from the bottom of the tube.
  • Thermometer (1) Prepare a freezing point (SOP-58) (scale range 20 ° C.
  • test article (crosslinkable resin)
  • the test article (crosslinkable resin) used for the test shall be stored at a temperature of 20 ⁇ 5 ° C. for 24 hours or more.
  • thermometer is inserted so that the tip of the thermometer is 30 mm deep from the surface of the test article (crosslinked resin), and is upright with respect to the test tube.
  • the two test tubes are placed in a thermostat so as to stand upright so that the line B is immersed under the water surface.
  • the temperature of the test article (crosslinked resin) in the temperature measurement test tube reaches the liquid confirmation temperature ⁇ 0.1 ° C., the state is maintained for 10 minutes.
  • liquid crosslinkable resin liquid resin
  • solid crosslinkable resin solid that is solid at 15 ° C. or more and 25 ° C. or less, determined by the above-described method Resin
  • liquid crosslinkable resin liquid resin
  • an epoxy resin a phenol resin, a melamine resin, a urea resin, an unsaturated polyester resin, a urea resin, a urethane resin having an appropriate molecular weight
  • a polyimide resin, a silicone resin, an acrylic resin, or the like can be used as a liquid crosslinkable resin (liquid resin) at 15 ° C. or more and 25 ° C. or less.
  • a cross-linked resin (solid resin) solid at 15 ° C. or more and 25 ° C. or less a phenoxy resin, an epoxy resin, a phenol resin, a melamine resin, a urea resin, an unsaturated polyester resin, a urea resin having an appropriate molecular weight, Urethane resin, polyimide resin, silicone resin, acrylic resin, or the like can be used.
  • thermosetting resin it is usually desirable to use a thermosetting resin, but it is also possible to use a photocuring resin or a resin that crosslinks with a catalyst or the like.
  • solder constituting the bonding material of the present invention it is preferable to use Sn-based solder having a relatively low melting point and capable of heat treatment at a low temperature, and among them, SnAgCu-based solder and SnBi-based solder are used. Is preferred. However, solder materials having other compositions can be sufficiently used by applying processing conditions in accordance with their melting points.
  • the blending amount of the solder is preferably in the range of 2.5% by volume to 50% by volume.
  • a substantially spherical shape is preferable from the viewpoint of material acquisition and processing ease when processing into a sheet shape, but it is also possible to use a different shape such as a flake shape or a linear shape. is there.
  • a substantially spherical thing it is preferable to use a thing with an average particle diameter (D50) of 3 micrometers or more and 100 micrometers or less.
  • the optimum size and blending amount can be selected according to the form of the joining object, the area and arrangement of the electrodes, and the like. However, from the viewpoint of not causing poor bonding such as open or short, it is preferable to blend a powder having an average particle diameter (D50) of 3 ⁇ m or more and 100 ⁇ m or less in a range of 2.5 volume% or more and 50 volume% or less. .
  • D50 average particle diameter
  • the distribution (arrangement) of the solder in the sheet-like bonding material may be uniformly distributed, and the electrodes facing each other to be bonded in consideration of the relationship with the position of the electrode in the bonding object, for example. You may make it distribute unevenly so that many may exist in between.
  • an activator serves to remove solder (powder) and an oxide film on the electrode surface.
  • an organic acid or amine having a function of efficiently removing solder (powder) or an oxide film on the electrode surface is used.
  • organic acids are suitable from the viewpoint of activity and reliability, and adipic acid or sebacic acid is particularly preferred.
  • the sheet-like bonding material of the present invention uses a liquid cross-linked resin and a solid cross-linked resin in the vicinity of room temperature (15 to 25 ° C.).
  • a bonding material can be provided.
  • the joining material of the present invention when joining one member having an electrode (joining object) and the other member having the electrode (joining object) to each other, the joining material between one member and the other member The two can be easily joined simply by cross-linking (for example, heating) the cross-linkable resin in a state where is positioned.
  • the bonding material of the present invention configured as described above is used, highly reliable mounting (bonding) can be performed. That is, it is possible to firmly bond the electrode included in one object to be bonded and the electrode included in the other object to be bonded by solder, and the one object to be bonded and the other object to be bonded can be cross-linked. Since it can adhere
  • thermoplastic resin In order to keep the sheet material in a solid state around room temperature, it is possible to use a thermoplastic resin. However, when the thermoplastic resin is exposed to a temperature higher than the melting point, it melts again and exhibits fluidity. There is a problem that the joint cannot maintain a stable state.
  • thermosetting resin having fluidity at room temperature and stopping the curing reaction in the middle may be considered, but it is difficult to obtain a stable shelf life, which is not preferable.
  • thermosetting resin Bisphenol A liquid epoxy resin (weight average molecular weight mw380)
  • the solid phenoxy resin used what was melt
  • liquid and solid thermosetting resins were blended so as to have the ratios shown in Sample Nos. 1 to 30 in Table 1A and Table 1B.
  • the mixing ratio of the liquid thermosetting resin (liquid resin) and the solid thermosetting resin (solid resin) in the samples Nos. 1 to 30 in Table 1A and Table 1B is based on the solid resin excluding the solvent.
  • the ratio of liquid resin (liquid resin / solid resin (excluding solvent)) is shown.
  • solder As the solder, the following solders (c1) and (c2) were prepared. In addition, as a solder, the thing of an average particle diameter as shown to Table 1A and Table 1B is used, and the ratio as shown in Table 1A and Table 1B, ie, the ratio in a sheet-like joining material, is 2.5 volume. % To 50% by volume or less.
  • C1 Sn3Ag0.5Cu solder powder (average particle size 20 ⁇ m)
  • C2) Sn58Bi Average particle size 20 ⁇ m
  • Sn3Ag0.5Cu indicates that Ag is 3% by weight, Cu is 0.5% by weight, and the rest is Sn.
  • Sn58Bi indicates that Bi is 58% by weight and the rest is Sn. Show.
  • the following curing agents (d1) and (d2) were used.
  • Phenol resin (weight average molecular weight mw190)
  • the phenol resin was used by dissolving in propylene glycol monomethyl ether acetate so that the proportion of the phenol resin was 65% by weight.
  • the 2-phenyl-4,5-dihydroxymethylimidazole of (d1) is a constant ratio with respect to the total amount of the liquid resin and solid resin (not including the solvent component) constituting the sheet-like bonding material. (To 6 wt% with respect to the total amount of liquid resin and solid resin).
  • the phenol resin (d2) is used as a curing agent only for the sample of sample number 31 in Table 1B.
  • the blending ratio of the phenol resin as the curing agent in consideration of the molecular weight (weight average molecular weight) of the liquid resin and the solid resin and the number of reactive groups they have. Determined.
  • the phenol resin acts as a solid cross-linked resin (thermosetting resin) in the sheet before heating, in the sample of sample number 31 using a phenol resin as a curing agent, the solid resin (phenoxy of (b) above)
  • the ratio of the liquid resin (bisphenol A type liquid epoxy resin of (a) above) to the resin and the total of phenol resin as the curing agent of (d2) above, that is, the value of liquid resin: solid resin (total) is 55 : 45. This ratio is a ratio within the scope of the present invention.
  • the following curing agents (e1) and (e2) were used.
  • the adipic acid of (e1) and the sebacic acid of (e2) are both at a certain ratio to the amount of solder contained in the sheet-like bonding material ( 2% by weight).
  • the above raw materials were mixed with a mixer. It is also possible to use a crusher instead of a mixer.
  • a solvent propylene glycol monomethyl ether acetate was further added to the paste obtained by mixing the raw materials to adjust the viscosity so as not to hinder the formation of the coating film.
  • the paste whose viscosity was adjusted was thinly stretched using a doctor blade on the surface of the release film on the PET film which had been release-treated on one side. This was heat-treated in an oven at 90 ° C. for 30 minutes to volatilize the solvent, thereby obtaining a sheet-like bonding material.
  • the squeegee thickness was adjusted so that the thickness of the sheet-like bonding material was about 40 ⁇ m.
  • the sheet-like bonding material (sample) is cut into a dimension having a length of 0.6 mm and a width of 0.3 mm (a dimension corresponding to the dimension of the electronic component (chip resistor) 10) to obtain a chip resistor.
  • the cut sheet-like bonding material 3 was placed on the circuit board 1 (land electrodes 2a and 2b) on which the circuit board 10 is mounted (see FIG. 2).
  • a chip resistor 10 having a pair of electrodes 11a and 11b on both ends in the length direction and having a length of 0.6 mm and a width of 0.3 mm is mounted on the bonding material 3 and applied with a pressure of about 1 MPa. While applying pressure, it was heated to 250 ° C. and held for 1 minute.
  • the resistance between the land electrodes 2a and 2b of the chip resistor 10 was measured using a micro ohm meter, and the one having a resistance value in the range of 10 ⁇ 0.5 ⁇ was determined as a good product.
  • the test was performed on 10 test samples prepared for each sample in Table 1A and Table 1B, and the number of samples determined to be non-defective was counted.
  • the cut sheet-shaped bonding material 3 is placed on the circuit board 1 and the chip resistor 10 is mounted thereon.
  • a chip resistor may be mounted on the circuit board.
  • Bonding reliability Chip resistance determined to be good in the bonding property test of (2) above is put in a temperature cycle test bath of -40 ° C to 125 ° C for 30 minutes, and the resistance value after 1000 cycles is obtained. It was measured. Then, a non-defective product / defective product was determined by the same method as in the case of the bondability test (2), and the number of samples determined to be non-defective was counted. The results are also shown in Table 1A and Table 1B.
  • sample of sample number 31 is a sample using a phenol resin (weight average molecular weight 190) as the curing agent, this sample number 31 also has good characteristics in each test described above. It was confirmed.
  • the samples (sheet-like bonding material) of sample numbers 1 to 31 having the requirements of the present invention are excellent in handleability and reliable when used for mounting chip resistors. It was confirmed that it was possible to achieve a good joint and good electrical continuity.
  • each electronic component 10 can be easily and reliably mounted on each stage 20a, 20b.
  • the bonding material 3 for bonding a plurality of electronic components 10 may include the bonding material 3 as shown in FIG. 3. It is also possible to configure (two electronic components) 10 to be joined to each land electrode 2.
  • the sheet-shaped bonding material 3 of the present invention is used.
  • the electrode 11 of the electronic component 10 can be bonded to the land electrode 2 disposed on the bottom surface 31 of the recess 30 of the circuit board 1 so that highly reliable mounting can be performed.
  • the land electrode 2 on the bottom surface 31 of the recess 30 is formed.
  • it is necessary to supply a paste-like bonding material on the upper surface it is difficult to supply the paste-like bonding material to the bottom surface 31 of the recess 30, which may cause a decrease in productivity and poor mounting. is there.
  • the sheet-like bonding material 3 of the present invention the difficult operation of supplying the paste-like bonding material is unnecessary, and the electrode 11 of the electronic component 10 can be easily and reliably connected to the circuit board. It is possible to perform mounting with high reliability by bonding to the land electrode 2 disposed on the bottom surface of the one recess 30.
  • the single bonding material 3 is used to bond each electronic component (two electronic components) 10 to each land electrode 2.
  • each electronic component 10 so as to include the bonding material 3 as a separate body.
  • both the main surfaces 40 a and 40 b of the vertical wall 40 and the vertical wall 40 are provided. Even when the electronic component 10 is mounted on the land electrode 2 on the bottom surface 42 of the enclosed region 41, the electrode 11 of the electronic component 10 is attached to the vertical wall 40 by using the sheet-like bonding material 3 of the present invention. Highly reliable mounting can be achieved by efficiently and reliably joining the land electrode 2 disposed on both the main surfaces 40a and 40b and the land electrode 2 disposed on the bottom surface 42.
  • a temporary fixing adhesive or adhesive tape is used.
  • an adhesive member as a bonding material of the present invention, by using a sheet-like bonding material having tackiness, there is no need for a temporary fixing adhesive or an adhesive tape. It is possible to perform mounting and joining, which is particularly meaningful.
  • a plurality of electronic components (two of the inner surface 40 a of the vertical wall 40 and one of the bottom surface 42, a total of three electronic components) 10 are bonded to each land electrode 2 with one bonding material 3.
  • the electrode of the electronic component 10 is obtained by using the sheet-like bonding material 3 of the present invention. 11 can be efficiently and reliably bonded to the land electrodes 2 on both the main surfaces 1a and 1b of the circuit board 1 to achieve highly reliable mounting.
  • the bonding material 3 may be used by being attached to the mounting surface of the surface-mounted electronic component 10, or the circuit board 1 on which the surface-mounted electronic component 10 is mounted. You may make it stick and use.
  • the joining material of the present invention has a feature of excellent anisotropic connectivity, the number of terminals of electronic components to be joined and a circuit board that is an electronic component connection target (mounting target)
  • mounting target There are no restrictions on the number of electrodes provided, not only 2-terminal passive components, but also electronic components with more terminals are mounted on connection targets (mounting targets) such as circuit boards equipped with the corresponding electrodes. It can also be used for bonding. It can also be used for mounting and joining various electronic module components.
  • FIG. 3 shows a configuration for mounting a three-terminal electronic component 10a
  • FIG. 4 shows a configuration for mounting an electronic component 10b having a large number of terminals such as an IC chip. It is shown.
  • this invention is not limited to the said embodiment, It is possible to add various application and deformation

Abstract

Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving reliable mechanical joining and excellent electrical conduction; an electronic component which uses the joining material, and exhibits excellent workability during mounting, and high conduction reliability after mounting; a joining method capable of reliably joining together objects to be joined; and a joined body exhibiting high joining reliability. The sheet-like joining material used to join members provided with electrodes includes: a crosslinked resin which is liquid between 15˚C and 25˚C inclusive; a crosslinked resin which is solid between 15˚C and 25˚C inclusive; and solder. Thermosetting resins are employed as the crosslinked resins. The content ratio of the liquid crosslinked resin to the solid crosslinked resin, expressed as a weight ratio, is in the range of 5:95 to 95:5. The solder content is in the range of 2.5 vol% to 50 vol% inclusive.

Description

シート状の接合材料、それを備えた電子部品、接合方法、接合体Sheet-like bonding material, electronic component including the same, bonding method, and bonded body
　本発明は、例えば電極を備える電子部品を回路基板上に実装する場合などに用いられるシート状の接合材料に関し、さらに、それを備えた電子部品、前記接合材料を用いた接合方法、および、接合体に関する。 The present invention relates to a sheet-like bonding material used when, for example, an electronic component including an electrode is mounted on a circuit board, and further, an electronic component including the same, a bonding method using the bonding material, and bonding About the body.
　電極を備える電子部品を回路基板上の導体（例えばランド電極）に接合する場合などに用いられる接合材料として、異方導電性接合材料が知られている。 An anisotropic conductive bonding material is known as a bonding material used when an electronic component including an electrode is bonded to a conductor (for example, a land electrode) on a circuit board.
　異方導電性接合材料は、上述のような、２つの部材（例えば、電極を備える電子部品と、上記電子部品が備える電極が電気的に接続されるべき導体（電極）を備えた回路基板）を接合する際に用いられる接合材料である。このような接合材料における、異方導電性とは、上述のような２つの部材を接合するにあたって、互いに接続されるべき２つの電極については、電気的に導通するような態様で接合することが可能である一方、例えば、回路基板の主面に平行な方向（以下「面方向」ともいう）に隣接する電極間については、電気的に導通させずに、絶縁状態を保持することができるような性質をいう。 The anisotropically conductive bonding material has two members as described above (for example, a circuit board including an electronic component including an electrode and a conductor (electrode) to which the electrode included in the electronic component is to be electrically connected). It is a joining material used when joining. In such a bonding material, anisotropic conductivity means that when two members as described above are bonded, the two electrodes to be connected to each other are bonded in such a manner that they are electrically connected. On the other hand, for example, the electrodes adjacent to each other in the direction parallel to the main surface of the circuit board (hereinafter also referred to as “plane direction”) can be kept electrically insulated without being electrically connected. Refers to the nature.
　したがって、異方導電性を有する接合材料を接合すべき２つの部材間に配置し、圧力を加えながら加熱することで、接合材料の厚み方向、すなわち２つの互いに対向する電極間には導電性を付与する一方で、面方向に隣接する電極間については電気的に導通させることなく絶縁性を保った状態で、２つの部材を接合することが可能になる。 Therefore, by arranging a bonding material having anisotropic conductivity between two members to be bonded and heating while applying pressure, the bonding material has a conductivity in the thickness direction, that is, between two electrodes facing each other. On the other hand, it is possible to join the two members while maintaining insulation without causing electrical conduction between the electrodes adjacent in the plane direction.
　ところで、異方導電性接合材料には、大きく分けて、ペースト状のものとシート状のものがあり、シート状のものは、ペースト状のものと比較して、使い勝手の面で有利な点が多い。例えば、ペースト状の接合材料を塗布する場合、印刷やディスペンスなどの工法を用いることが必要で、いずれの場合もマスクやスキージ、シリンジやニードルなどの治具や消耗材料などを必要とし、また、わずかな塗布量を精度よく管理することが必要で、コストがかかったり、製造工程が複雑化したりするという問題点がある。 By the way, anisotropic conductive bonding materials are roughly classified into paste-like and sheet-like materials, and sheet-like materials have advantages in terms of usability compared to paste-like materials. Many. For example, when applying a paste-like bonding material, it is necessary to use a method such as printing or dispensing, and in any case, a jig such as a mask, squeegee, syringe, needle, or consumable material is required. It is necessary to accurately manage a small amount of coating, and there are problems that it is expensive and the manufacturing process is complicated.
　一方、シート材料の場合は、塗布に必要な治具や消耗材料が不要であるばかりでなく、周囲を汚染しない、接合材料のにじみやたれが起こらない、均一な接合材料の供給が可能で、塗布量の管理が容易であるなどの利点がある。さらに、段差が多い部分や、側面や下側など、ペースト状の接合材料の場合には供給が困難な箇所にも供給することができるという利点がある。 On the other hand, in the case of sheet material, not only jigs and consumable materials necessary for application are unnecessary, but also it is possible to supply a uniform bonding material that does not contaminate the surroundings and does not cause bleeding or blurring of the bonding material. There are advantages such as easy management of the coating amount. Furthermore, there is an advantage that it can be supplied to places where supply is difficult in the case of a paste-like bonding material, such as a portion with many steps, a side surface or a lower side.
　このようなシート状の接合材料（異方導電性接合材料）が、以下の特許文献１および２に開示されている。
　特許文献１には、接着剤成分と導電性粒子を含む異方導電性接着剤もしくはフィルムにおいて、導電性粒子として、硬度が異なり、かつ粒径がほぼ同一である、少なくとも２種類以上の粒子を用いるようにした異方導電性接合材料（異方導電性接着剤）が開示されている。 Such sheet-like bonding materials (anisotropic conductive bonding materials) are disclosed in Patent Documents 1 and 2 below.
In Patent Document 1, in an anisotropic conductive adhesive or film containing an adhesive component and conductive particles, at least two or more types of particles having different hardness and substantially the same particle size are used as the conductive particles. An anisotropic conductive bonding material (an anisotropic conductive adhesive) is disclosed.
　特許文献２には、アクリル樹脂からなる樹脂粒子であって、最大圧縮変形率が６０％以上であり、かつ、６０％圧縮変形するのに必要な荷重が６０ｍＮ以下である樹脂粒子を芯材とし、その表面に導電材料が付着されてなる導電性粒子を含有し、その導電性粒子が接着材料中に分散されている異方導電性接合材料（異方導電性接着剤）が開示されている。 In Patent Document 2, resin particles made of an acrylic resin having a maximum compressive deformation rate of 60% or more and a load required for compressive deformation of 60% are 60 mN or less are used as a core material. An anisotropic conductive bonding material (anisotropic conductive adhesive) is disclosed which contains conductive particles having a conductive material attached to the surface thereof, and the conductive particles are dispersed in the adhesive material. .
　特許文献１および２の異方導電性接合材料は、いずれも、樹脂材料と導電性粒子を用いた異方導電性の接合材に関するもので、接合材料に配合する導電性粒子に関し、それぞれ、硬さや大きさ、圧縮変形のしやすさなどの特性を適切に調整することにより、安定な圧着固定状態を得て、高い導通信頼性を得るようにしている。 The anisotropic conductive bonding materials of Patent Documents 1 and 2 are both related to an anisotropic conductive bonding material using a resin material and conductive particles, and are related to conductive particles to be blended in the bonding material. By appropriately adjusting the characteristics such as the sheath size, the ease of compressive deformation, and the like, a stable crimp-fixed state is obtained and high conduction reliability is obtained.
　しかしながら、特許文献１および２の異方導電性接合材料の場合、導電性粒子と接合対象間（例えば電極間）の導通は、いずれも、電極と導電性粒子の一部が接触しているか、もしくはトンネル効果やショットキー効果によって電流が流れる程度に近接することによって得られものであり、金属結合のように物理的な、強固な結合によって得られているものではない。 However, in the case of the anisotropic conductive bonding materials of Patent Documents 1 and 2, the conduction between the conductive particles and the object to be bonded (for example, between the electrodes) is either the electrode and a part of the conductive particles are in contact, Alternatively, it is obtained by being close to the extent that current flows by the tunnel effect or the Schottky effect, and is not obtained by physical and strong bonding like metal bonding.
　このため、厳しい環境条件下にさらされた際、繰り返し温度変化による接合対象（例えば電子部品や回路基板）や接合材自身の膨張収縮や、高湿度環境下における吸湿、結露などによって、導電性粒子と電極間の接点の安定な接合状態が損なわれ、良好な電気的導通を維持することができなくなるという問題点がある。 For this reason, when exposed to harsh environmental conditions, conductive particles may be caused by the expansion and contraction of the bonding target (for example, electronic components and circuit boards) and the bonding material itself due to repeated temperature changes, moisture absorption and condensation in a high humidity environment, etc. There is a problem that the stable joint state of the contact between the electrode and the electrode is impaired, and good electrical conduction cannot be maintained.
　特許文献３には、導電性粒子と電極との間を、金属結合により強固に接合することができるように、表面をはんだで被覆した導電性粒子を用いた異方導電性接合材料が提案されている。 Patent Document 3 proposes an anisotropic conductive bonding material using conductive particles whose surfaces are covered with solder so that the conductive particles and the electrode can be firmly bonded by metal bonding. ing.
　特許文献３によれば、導電性粒子における導電層の外側にはんだ層が存在していることから、加熱によりはんだ層を溶融させることで、はんだ層と電極とを金属結合させることができるため、高い接合信頼性が得られるとされている。 According to Patent Document 3, since the solder layer exists outside the conductive layer in the conductive particles, the solder layer and the electrode can be metal-bonded by melting the solder layer by heating. It is said that high bonding reliability can be obtained.
　しかしながら、特許文献３で用いられている導電性粒子は、コアが樹脂材料から形成され、表面層としてはんだ層が形成された構成を有していることから、コアと表面層（はんだ層）とで熱膨張係数が大きく異なるため、温度サイクルにより、コアと表面層（はんだ層）との界面で破壊するおそれがある。 However, since the conductive particles used in Patent Document 3 have a configuration in which the core is formed of a resin material and a solder layer is formed as a surface layer, the core and the surface layer (solder layer) Since the thermal expansion coefficients differ greatly, there is a risk of destruction at the interface between the core and the surface layer (solder layer) due to temperature cycling.
　また、コアが樹脂材料から形成され、表面層としてはんだ層が形成された導電性粒子は、加熱時にその表面だけが溶融し、電極に接触していた導電性粒子のみにおいて、その表面層（はんだ層）が電極と金属結合することになる。それゆえ、電極上（互いに対向する２つの電極間）に存在している導電性粒子だけが電気的接合に有効に寄与し、電極上に存在していない導電性粒子は、電気的接合に寄与しないばかりでなく、場合によっては、回路基板の主面に平行な方向（面方向）に隣接する電極間をショートさせる要因になるという問題点がある。 In addition, the conductive particles in which the core is formed of a resin material and the solder layer is formed as a surface layer are melted only on the surface when heated, and only the conductive particles that have been in contact with the electrode have the surface layer (solder Layer) will be metal bonded to the electrode. Therefore, only the conductive particles that exist on the electrode (between two electrodes facing each other) contribute effectively to the electrical connection, and the conductive particles that do not exist on the electrode contribute to the electrical connection. In addition to this, there is a problem that, depending on the case, it may cause a short circuit between electrodes adjacent to each other in a direction (plane direction) parallel to the main surface of the circuit board.
　したがって、このような異方導電性接合材料を用いる場合、互いに対向する２つの電極間の導通と、面方向の絶縁を両立するためには、接合すべき電極の面積や位置関係と、面方向に隣接する電極間距離、導電性粒子の大きさや存在確率などを考慮して設計することが必要で、電極間の導通と面方向の絶縁の２つの点で十分な信頼性を確保することは必ずしも容易ではないのが実情である。 Therefore, when using such an anisotropic conductive bonding material, in order to achieve both conduction between two electrodes facing each other and insulation in the plane direction, the area and positional relationship of the electrodes to be bonded, and the plane direction It is necessary to design in consideration of the distance between electrodes adjacent to each other, the size and existence probability of conductive particles, and ensuring sufficient reliability in two points: conduction between electrodes and insulation in the plane direction. The situation is not always easy.
特開２００４－１５５９５７号公報JP 2004-155957 A 特開２００８－２３１４３８号公報JP 2008-231438 A 特開２０１２－１９０８０４号公報JP 2012-190804 A
　本発明は、上記課題を解決するものであり、例えば電極を備える電子部品を回路基板上に実装する場合などに用いられる、取り扱い性に優れ、かつ、確実な機械的接合と良好な電気的導通を得ることが可能なシート状の接合材料、該接合材料を用いた、実装時の作業性に優れ、実装後の接続信頼性の高い電子部品、接合対象物どうしを確実に接合することが可能な接合方法、および、接合信頼性の高い接合体を提供することを目的とする。 The present invention solves the above-described problems, and is used when, for example, an electronic component including an electrode is mounted on a circuit board. The present invention has excellent handleability and reliable mechanical joining and good electrical continuity. It is possible to reliably join electronic parts and joining objects that have excellent connection workability and high connection reliability after mounting, using this bonding material. An object of the present invention is to provide a simple bonding method and a bonded body with high bonding reliability.
　上記課題を解決するために、本発明の接合材料は、
　電極を有する部材間を接合するのに用いられるシート状の接合材料であって、
　１５℃以上、２５℃以下において液状の架橋型樹脂と、
　１５℃以上、２５℃以下において固形の架橋型樹脂と、
　はんだと
　を含むことを特徴としている。 In order to solve the above problems, the bonding material of the present invention is:
A sheet-like bonding material used for bonding between members having electrodes,
A liquid cross-linkable resin at 15 ° C. or higher and 25 ° C. or lower;
A cross-linked resin solid at 15 ° C. or higher and 25 ° C. or lower;
It is characterized by containing solder.
　本発明においては、前記架橋型樹脂が熱硬化型樹脂であることが好ましい。
　架橋型樹脂として、熱硬化型樹脂を用いることにより、加熱を行うだけで、信頼性の高い接合を実現することが可能になり、本発明をより実効あらしめることができる。 In the present invention, the crosslinkable resin is preferably a thermosetting resin.
By using a thermosetting resin as the cross-linking resin, it is possible to realize highly reliable bonding only by heating, and the present invention can be more effectively realized.
　前記熱硬化型樹脂がエポキシ樹脂であることが好ましい。
　熱硬化型樹脂としてエポキシ樹脂を用いることにより、安定した接合信頼性を実現することができる。 It is preferable that the thermosetting resin is an epoxy resin.
By using an epoxy resin as the thermosetting resin, stable bonding reliability can be realized.
　前記液状の架橋型樹脂と前記固形の架橋型樹脂の含有割合が重量比で５：９５～９５：５の範囲にあることが好ましい。
　液状の架橋型樹脂と固形の架橋型樹脂の含有割合を、重量比で５：９５～９５：５の範囲とすることにより、安定した取り扱い性、十分な保存安定性、高い接合信頼性を実現することが可能な接合材料を提供することができる。 The content ratio of the liquid crosslinkable resin and the solid crosslinkable resin is preferably in the range of 5:95 to 95: 5 by weight.
Stable handling, sufficient storage stability, and high bonding reliability are realized by setting the content ratio of liquid crosslinkable resin and solid crosslinkable resin in the range of 5:95 to 95: 5 by weight. It is possible to provide a bonding material that can be used.
　前記はんだを２．５体積％以上、５０体積％以下の割合で含むことが好ましい。
　はんだを２．５体積％以上、５０体積％以下の割合で含有させることにより、安定した取り扱い性、十分な保存安定性、高い接合信頼性を実現することが可能な接合材料を提供することができる。 It is preferable that the solder is contained in a proportion of 2.5% by volume to 50% by volume.
To provide a bonding material capable of realizing stable handling, sufficient storage stability, and high bonding reliability by containing solder in a proportion of 2.5% by volume or more and 50% by volume or less. it can.
　前記はんだがＳｎを主たる成分の１つとするＳｎ系はんだであることが好ましい。
　はんだを、Ｓｎを主たる成分の１つとするＳｎ系はんだとすることにより、高い接合信頼性を実現することが可能な接合材料を提供することができる。 It is preferable that the solder is Sn-based solder having Sn as one of main components.
By using Sn-based solder with Sn as one of the main components, a bonding material capable of realizing high bonding reliability can be provided.
　前記Ｓｎ系はんだがＳｎＡｇＣｕ系はんだ、またはＳｎＢｉ系はんだであることが好ましい。
　Ｓｎ系はんだとしてＳｎＡｇＣｕ系はんだ、またはＳｎＢｉ系はんだを用いることにより、高い接合信頼性を実現することが可能な接合材料を提供することができる。 It is preferable that the Sn-based solder is SnAgCu-based solder or SnBi-based solder.
By using SnAgCu-based solder or SnBi-based solder as the Sn-based solder, a bonding material capable of realizing high bonding reliability can be provided.
　本発明の接合材料は、活性剤を含んでいることが好ましい。
　活性剤は、はんだや電極表面の酸化膜を除去する機能を果たすため、この活性剤を含ませることにより、電極とはんだの間の接合状態を改善して、信頼性の高い接合を実現することができる。 The bonding material of the present invention preferably contains an activator.
Since the activator functions to remove the solder and the oxide film on the electrode surface, the activator is included to improve the joint state between the electrode and the solder and realize a highly reliable joint. Can do.
　前記活性剤がアジピン酸またはセバシン酸であることが好ましい。
　活性剤がアジピン酸またはセバシン酸である場合、より確実に、良好な接合状態を実現することが可能な接合材料を提供することができる。 It is preferred that the activator is adipic acid or sebacic acid.
When the activator is adipic acid or sebacic acid, it is possible to provide a bonding material that can more reliably achieve a good bonding state.
　本発明の電子部品は、上記本発明の接合材料を備えていることを特徴としている。 The electronic component of the present invention is characterized by including the bonding material of the present invention.
　また、本発明の接合方法は、電極を有する部材間を接合するための接合方法であって、上記本発明の接合材料を、前記電極を有する部材間に位置させた状態で、前記液状および固形の架橋型樹脂を架橋させることを特徴としている。 Further, the bonding method of the present invention is a bonding method for bonding members having electrodes, and the liquid material and the solid material in a state where the bonding material of the present invention is positioned between the members having the electrode. It is characterized by cross-linking the cross-linked resin.
　また、本発明の接合体は、上記本発明の接合方法により、一方の接合対象物と他方の接合対象物とが接合されたものであることを特徴としている。 Further, the joined body of the present invention is characterized in that one joining object and the other joining object are joined by the joining method of the present invention.
　本発明の接合材料は、電極を有する部材間を接合するのに用いられるシート状の接合材料であって、１５℃以上、２５℃以下において液状の架橋型樹脂（以下、単に「液状樹脂」ともいう）と、１５℃以上、２５℃以下において固形の架橋型樹脂（以下、単に「固形樹脂」ともいう）と、はんだとを含むものであり、シート状であることから、ペースト状の接合材料に比べて、取り扱い性に優れている。すなわち、ペースト状の接合材を供給する場合のように、印刷やディスペンスなどの方法を用いることが不要で、適量の接合材料を容易に供給することが可能になる。 The joining material of the present invention is a sheet-like joining material used for joining members having electrodes, and is a liquid crosslinkable resin (hereinafter simply referred to as “liquid resin”) at 15 ° C. or more and 25 ° C. or less. And a solid cross-linkable resin (hereinafter also simply referred to as “solid resin”) at 15 ° C. or higher and 25 ° C. or lower, and solder, and is in the form of a sheet. Compared to, it is easy to handle. That is, as in the case of supplying a paste-like bonding material, it is not necessary to use a method such as printing or dispensing, and an appropriate amount of bonding material can be easily supplied.
　また、本発明の接合材料においては、液状樹脂と、固形樹脂とを組み合わせて用いるようにしているので、液状樹脂と固形樹脂の割合を制御したり、液状樹脂および固形樹脂の種類を適切に選択したりすることにより、適度な柔軟性や、粘着性などを付与することが可能で、さらに取り扱い性を向上させることができる。 In the bonding material of the present invention, since the liquid resin and the solid resin are used in combination, the ratio of the liquid resin and the solid resin is controlled, or the type of the liquid resin and the solid resin is appropriately selected. By doing so, it is possible to impart moderate flexibility, adhesiveness, and the like, and further improve the handleability.
　本発明の電子部品は、本発明の接合材料を備えているので、例えば、回路基板上に実装するような場合に、別途、接合材料を用意することを必要とせずに、電子部品と、回路基板の間に接合材料が位置するような姿勢で電子部品を回路基板上に載置してリフロー炉により加熱し、液状樹脂および固形樹脂を架橋させるだけで、容易に、信頼性の高い実装（接合）を行うことが可能になる。 Since the electronic component of the present invention includes the bonding material of the present invention, for example, when mounting on a circuit board, the electronic component and the circuit are not required to separately prepare the bonding material. Mounting electronic components on a circuit board in such a posture that the bonding material is positioned between the boards, heating them in a reflow furnace, and crosslinking the liquid resin and solid resin easily and with high reliability ( Joining) can be performed.
　また、本発明の接合方法は、電極を有する部材間を接合するための接合方法であって、上記本発明の接合材料を、前記電極を有する部材間に位置させた状態で、液状および固形の架橋型樹脂を架橋させるようにしているので、部材間（接合対象物間）に接合材料を位置させた状態で加熱などの架橋を行わせる処理を行うだけで、両者を容易に接合することが可能になる。また、本発明の接合材料を用いているので、信頼性の高い接合を行うことが可能になる。 Further, the bonding method of the present invention is a bonding method for bonding members having electrodes, wherein the bonding material of the present invention is placed between the members having the electrodes in a liquid and solid state. Since the cross-linking resin is cross-linked, it is possible to easily bond the two by simply performing a cross-linking process such as heating while the bonding material is positioned between the members (between the objects to be bonded). It becomes possible. Further, since the bonding material of the present invention is used, highly reliable bonding can be performed.
　また、本発明の接合体は、本発明の接合方法により、電極を有する一方の部材と、電極を有する他方の部材とを接合したものであり、接合材料として、本発明の接合材料が用いられることから、容易に、接合信頼性の高い接合体を得ることが可能になる。 The joined body of the present invention is obtained by joining one member having an electrode and the other member having an electrode by the joining method of the present invention, and the joining material of the present invention is used as a joining material. Therefore, it is possible to easily obtain a bonded body with high bonding reliability.
本発明において用いる架橋型樹脂について行った液状確認試験の方法を説明する図である。It is a figure explaining the method of the liquid confirmation test done about the crosslinkable resin used in this invention. 本発明の接合材料を用いて、電子部品（チップ抵抗）を、ランド電極を備えた回路基板に搭載する方法を説明する図である。It is a figure explaining the method to mount an electronic component (chip resistance) on the circuit board provided with the land electrode using the joining material of this invention. 本発明の接合材料を用いて、電子部品を回路基板に搭載する場合の第１の変形例を示す図である。It is a figure which shows the 1st modification in the case of mounting an electronic component on a circuit board using the joining material of this invention. 本発明の接合材料を用いて、電子部品を回路基板に搭載する場合の第２の変形例を示す図である。It is a figure which shows the 2nd modification in the case of mounting an electronic component on a circuit board using the joining material of this invention. 本発明の接合材料を用いて、電子部品を回路基板に搭載する場合の第３の変形例を示す図である。It is a figure which shows the 3rd modification in the case of mounting an electronic component on a circuit board using the joining material of this invention. 本発明の接合材料を用いて、電子部品を回路基板に搭載する場合の第４の変形例を示す図である。It is a figure which shows the 4th modification in the case of mounting an electronic component on a circuit board using the joining material of this invention.
　以下に本発明を実施するための形態を示して、本発明の特徴とするところをさらに詳しく説明する。 Hereinafter, the features of the present invention will be described in more detail with reference to embodiments for carrying out the present invention.
　［実施形態］
　本発明の接合材料は、電極を有する部材間を接合するのに用いられるシート状の接合材料であり、１５℃以上、２５℃以下において液状の架橋型樹脂（液状樹脂）と、１５℃以上、２５℃以下において固形の架橋型樹脂（固形樹脂）と、はんだとを含有している。 [Embodiment]
The bonding material of the present invention is a sheet-shaped bonding material used for bonding members having electrodes, and is a liquid cross-linkable resin (liquid resin) at 15 ° C. or higher and 25 ° C. or lower, and 15 ° C. or higher, It contains a solid cross-linkable resin (solid resin) and solder at 25 ° C. or lower.
　上述のように、本発明の接合材料においては、架橋型樹脂として、１５℃以上、２５℃以下において液状である架橋型樹脂と固形である架橋型樹脂の２種類の樹脂が配合されているが、架橋型樹脂についての、「１５℃以上、２５℃以下において液状」のものであるか否かの判定は、消防法の危険物判定に用いる以下の液状確認試験により行う。 As described above, in the bonding material of the present invention, two types of resins, that is, a liquid crosslinkable resin and a solid crosslinkable resin at 15 ° C. or higher and 25 ° C. or lower are blended as the crosslinkable resin. The determination of whether or not the cross-linked resin is “liquid at 15 ° C. or higher and 25 ° C. or lower” is performed by the following liquid confirmation test used for the dangerous goods determination of the Fire Service Act.
　（架橋型樹脂についての液状確認試験）
　［１］装置および器具
　（１）恒温水槽
　かくはん器、ヒーター、温度計、自動温度調節器（±０．１℃で温度制御が可能なもの）を備え、深さ１５０ｍｍ以上のものを用意する。
　（２）試験管（２本）
　内径３０ｍｍ、高さ１２０ｍｍの平底円筒型透明ガラス製のものを用意する。
　試験管には管底から５５ｍｍおよび８５ｍｍの高さのところに標線（以下「Ａ線」および「Ｂ線」という）を付す。
　（３）温度計（１本）
　「石油類試験用ガラス製温度計」（ＪＩＳ　Ｂ７４１０－１９８２）に規定する凝固点用（ＳＯＰ－５８）のもの（目盛範囲２０℃～５０℃）を用意する。
　（４）ゴム栓（２個）
　　上記の（２）の試験管の口に合うものを用意する。そのうち１個には栓の中央に温度計を支える孔を設ける。
　（５）ストップウォッチ (Liquid confirmation test for cross-linked resin)
[1] Apparatus and instrument (1) Constant temperature water tank A stirrer, a heater, a thermometer, and an automatic temperature controller (which can be controlled at ± 0.1 ° C) are prepared with a depth of 150 mm or more.
(2) Test tubes (2)
A flat bottom cylindrical transparent glass having an inner diameter of 30 mm and a height of 120 mm is prepared.
Mark lines (hereinafter referred to as “A line” and “B line”) are attached to the test tubes at a height of 55 mm and 85 mm from the bottom of the tube.
(3) Thermometer (1)
Prepare a freezing point (SOP-58) (scale range 20 ° C. to 50 ° C.) as defined in “Glass Thermometer for Petroleum Testing” (JIS B7410-1982).
(4) Rubber plugs (2 pieces)
Prepare one that fits the mouth of the test tube in (2) above. One of them has a hole to support the thermometer in the center of the stopper.
(5) Stopwatch
　［２］実施場所
　（１）温度の調整
　試験場所の温度は２０±５℃に調整する。
　（２）記録
　温度は試験開始前および試験終了後に測定し、記録する。 [2] Implementation location (1) Temperature adjustment Adjust the temperature at the test location to 20 ± 5 ° C.
(2) Recording Temperature is measured and recorded before the start of the test and after the end of the test.
　［３］試験物品（架橋型樹脂）の調整
　試験に供する試験物品（架橋型樹脂）は２０±５℃の温度で２４時間以上保存しているものとする。 [3] Preparation of test article (crosslinkable resin) The test article (crosslinkable resin) used for the test shall be stored at a temperature of 20 ± 5 ° C. for 24 hours or more.
　［４］確認方法
　（１）恒温水槽中の水の温度を液状確認温度（液状であるか否かを確認する温度（２０±５℃の範囲内の所定の温度））±０．１℃に設定する。
　（２）試験物品（架橋型樹脂）を２本の試験管のＡ線まで注入する（図１参照）。
　（３）一方の試験管を孔穴のないゴム栓で密栓する。（以下この試験管を「液状判断用試験管」という。）
　（４）もう一方の試験管（以下この試験管を「温度測定用試験管」という。）は温度計をつけたゴム栓で密栓する。　ただし、温度計はその先端が試験物品（架橋型樹脂）表面より３０ｍｍの深さとなるよう挿入し、試験管に対し直立させる。
　（５）２本の試験管を恒温槽中に、Ｂ線が水面下に没するよう直立させて静置させる。
　（６）温度測定用試験管中の試験物品（架橋型樹脂）の温度が液状確認温度±０．１℃となってから、１０分間そのままの状態を保持する。
　（７）液状判断用試験管を恒温水槽から水平な台上に直立した状態のまま取り出し、直ちに台の上に水平に倒し、試験物品（架橋型樹脂）の先端がＢ線に到達するまでの時間を、ストップウォッチを用いて測定し、記録する。 [4] Confirmation method (1) The temperature of the water in the thermostatic bath is set to a liquid confirmation temperature (a temperature for confirming whether or not it is liquid (a predetermined temperature within a range of 20 ± 5 ° C.)) ± 0.1 ° C. Set.
(2) A test article (crosslinked resin) is injected up to line A of two test tubes (see FIG. 1).
(3) Seal one of the test tubes with a rubber plug without a hole. (Hereinafter, this test tube is referred to as “liquid determination test tube”.)
(4) The other test tube (hereinafter, this test tube is referred to as “temperature measurement test tube”) is sealed with a rubber stopper equipped with a thermometer. However, the thermometer is inserted so that the tip of the thermometer is 30 mm deep from the surface of the test article (crosslinked resin), and is upright with respect to the test tube.
(5) The two test tubes are placed in a thermostat so as to stand upright so that the line B is immersed under the water surface.
(6) After the temperature of the test article (crosslinked resin) in the temperature measurement test tube reaches the liquid confirmation temperature ± 0.1 ° C., the state is maintained for 10 minutes.
(7) Remove the test tube for liquid judgment from the thermostatic water tank while standing upright on a horizontal base, immediately lay down horizontally on the base, and until the tip of the test article (cross-linked resin) reaches line B Time is measured and recorded using a stopwatch.
　［５］結果の評価
　上述の［４］の測定結果が９０秒以内であるものを「液状」と判断する。 [5] Evaluation of the result When the measurement result of [4] is within 90 seconds, it is determined as “liquid”.
　本発明の接合材料においては、上述の方法で判定される、１５℃以上、２５℃以下において液状の架橋型樹脂（液状樹脂）と、１５℃以上、２５℃以下において固形の架橋型樹脂（固形樹脂）が、重量比で５：９５～９５：５の割合となるように配合される。 In the bonding material of the present invention, a liquid crosslinkable resin (liquid resin) that is determined at 15 ° C. or more and 25 ° C. or less, and a solid crosslinkable resin (solid that is solid at 15 ° C. or more and 25 ° C. or less, determined by the above-described method Resin) is blended in a weight ratio of 5:95 to 95: 5.
　なお、１５℃以上、２５℃以下において液状の架橋型樹脂（液状樹脂）としては、適切な分子量を有するエポキシ樹脂、フェノール樹脂、メラミン樹脂、ユリア樹脂、不飽和ポリエステル樹脂、尿素樹脂、ウレタン樹脂、ポリイミド樹脂、シリコーン樹脂、アクリル樹脂などを用いることができる。 In addition, as a liquid crosslinkable resin (liquid resin) at 15 ° C. or more and 25 ° C. or less, an epoxy resin, a phenol resin, a melamine resin, a urea resin, an unsaturated polyester resin, a urea resin, a urethane resin having an appropriate molecular weight, A polyimide resin, a silicone resin, an acrylic resin, or the like can be used.
　また、１５℃以上、２５℃以下において固形の架橋型樹脂（固形樹脂）としては、適切な分子量を有するフェノキシ樹脂、エポキシ樹脂、フェノール樹脂、メラミン樹脂、ユリア樹脂、不飽和ポリエステル樹脂、尿素樹脂、ウレタン樹脂、ポリイミド樹脂、シリコーン樹脂、アクリル樹脂などを用いることができる。 In addition, as a cross-linked resin (solid resin) solid at 15 ° C. or more and 25 ° C. or less, a phenoxy resin, an epoxy resin, a phenol resin, a melamine resin, a urea resin, an unsaturated polyester resin, a urea resin having an appropriate molecular weight, Urethane resin, polyimide resin, silicone resin, acrylic resin, or the like can be used.
　なお、液状樹脂および固形樹脂としては、通常、熱硬化型樹脂を用いることが望ましいが、光硬化樹脂や、触媒などにより架橋する樹脂を用いることも可能である。 In addition, as the liquid resin and the solid resin, it is usually desirable to use a thermosetting resin, but it is also possible to use a photocuring resin or a resin that crosslinks with a catalyst or the like.
　また、液状樹脂と固形樹脂の配合割合は、使用する樹脂により最適な配合比を選択することが望ましいが、シート状の接合材料としての取り扱い性の見地からは、液状樹脂と固形樹脂との配合割合は、液状樹脂：固形樹脂（重量比）＝５：９５～９５：５の範囲とすることが望ましい。 In addition, the mixing ratio of the liquid resin and the solid resin is preferably an optimum mixing ratio depending on the resin to be used. However, from the viewpoint of handleability as a sheet-like bonding material, the mixing ratio of the liquid resin and the solid resin is preferred. The ratio is preferably in the range of liquid resin: solid resin (weight ratio) = 5: 95 to 95: 5.
　液状樹脂と固形樹脂の配合割合の特に好ましい範囲は、液状樹脂：固形樹脂（重量比）＝５０：５０～９０：１０の範囲である。
　これは、液状樹脂の割合が５０重量％未満になると、シート状の接合材料の柔軟性が低下する傾向があり、また、液状樹脂の割合が９０重量％を超えると、粘性やタック性が増すため、より慎重な取り扱いが必要になることによる。
　したがって、液状樹脂：固形樹脂（重量比）＝５０：５０～９０：１０の範囲とすることにより、さらに確実、かつ容易にシート状の接合材料を取り扱うことができる。 A particularly preferable range of the blending ratio of the liquid resin and the solid resin is a range of liquid resin: solid resin (weight ratio) = 50: 50 to 90:10.
This is because when the proportion of the liquid resin is less than 50% by weight, the flexibility of the sheet-like bonding material tends to decrease, and when the proportion of the liquid resin exceeds 90% by weight, the viscosity and tackiness increase. Therefore, more careful handling is required.
Therefore, by setting the ratio of liquid resin: solid resin (weight ratio) = 50: 50 to 90:10, the sheet-like bonding material can be handled more reliably and easily.
　また、本発明の接合材料を構成するはんだとしては、比較的低い融点を有し、低温での熱処理が可能なＳｎ系はんだを用いることが好ましく、その中でもＳｎＡｇＣｕ系はんだやＳｎＢｉ系はんだを用いることが好ましい。ただし、他の組成のはんだ材料でも、その融点に合わせた加工条件を適用することで十分に使用することができる。
　本発明の接合材料において、はんだの配合量は２．５体積％以上、５０体積％以下の範囲とすることが望ましい。 Further, as the solder constituting the bonding material of the present invention, it is preferable to use Sn-based solder having a relatively low melting point and capable of heat treatment at a low temperature, and among them, SnAgCu-based solder and SnBi-based solder are used. Is preferred. However, solder materials having other compositions can be sufficiently used by applying processing conditions in accordance with their melting points.
In the bonding material of the present invention, the blending amount of the solder is preferably in the range of 2.5% by volume to 50% by volume.
　はんだの形態としては、材料入手およびシート状に加工する際の加工の容易性の観点から略球状のものが好ましいが、リン片状、線状など別の形態のものを使用することも可能である。なお、はんだとして略球状のものを用いる場合には、平均粒径（Ｄ５０）が３μｍ以上、１００μｍ以下のものを用いることが好ましい。 As the form of the solder, a substantially spherical shape is preferable from the viewpoint of material acquisition and processing ease when processing into a sheet shape, but it is also possible to use a different shape such as a flake shape or a linear shape. is there. In addition, when using a substantially spherical thing as a solder, it is preferable to use a thing with an average particle diameter (D50) of 3 micrometers or more and 100 micrometers or less.
　はんだの粒径と配合量は、接合対象物の形態、電極の面積や配置などによって、最適な大きさおよび配合量を選択することができる。ただし、オープンやショートといった接合不良を起こさないという見地からは、平均粒径（Ｄ５０）が３μｍ以上、１００μｍ以下の粉末を２．５体積％以上、５０体積％以下の範囲で配合することが好ましい。 As for the solder particle size and blending amount, the optimum size and blending amount can be selected according to the form of the joining object, the area and arrangement of the electrodes, and the like. However, from the viewpoint of not causing poor bonding such as open or short, it is preferable to blend a powder having an average particle diameter (D50) of 3 μm or more and 100 μm or less in a range of 2.5 volume% or more and 50 volume% or less. .
　シート状の接合材料中におけるはんだの分布（配置）については、均一に分布した状態としてもよく、また、例えば接合対象物における電極の位置との関係を考慮し、接合しようとする互いに対向する電極間に多く存在するように、不均一に分布させるようにしてもよい。 The distribution (arrangement) of the solder in the sheet-like bonding material may be uniformly distributed, and the electrodes facing each other to be bonded in consideration of the relationship with the position of the electrode in the bonding object, for example. You may make it distribute unevenly so that many may exist in between.
　また、接合材料には、活性剤を配合することが好ましい。活性剤は、はんだ（粉末）や電極表面の酸化膜を除去する機能を果たすものである。活性剤としては、はんだ（粉末）や電極表面の酸化膜を効率よく除去する機能を有する有機酸やアミンなどが用いられる。それらのなかでも、活性度と信頼性の観点から、有機酸が適切であり、特にアジピン酸あるいはセバシン酸を用いることが好ましい。 In addition, it is preferable to add an activator to the bonding material. The activator serves to remove solder (powder) and an oxide film on the electrode surface. As the activator, an organic acid or amine having a function of efficiently removing solder (powder) or an oxide film on the electrode surface is used. Of these, organic acids are suitable from the viewpoint of activity and reliability, and adipic acid or sebacic acid is particularly preferred.
　本発明のシート状の接合材料は、上述のように、常温付近（１５～２５℃）において液状の架橋型樹脂と固形の架橋型樹脂を併用しているので、シート状で、取り扱い性に優れた接合材料を提供することができる。 As described above, the sheet-like bonding material of the present invention uses a liquid cross-linked resin and a solid cross-linked resin in the vicinity of room temperature (15 to 25 ° C.). A bonding material can be provided.
　本発明の接合材料を用いることにより、電極を有する一方の部材（接合対象物）と、電極を有する他方の部材（接合対象物）を互いに接合する場合に、一方と他方の部材間に接合材料を位置させた状態で、架橋型樹脂を架橋させる（例えば加熱する）だけで、両者を容易に接合することができる。 By using the joining material of the present invention, when joining one member having an electrode (joining object) and the other member having the electrode (joining object) to each other, the joining material between one member and the other member The two can be easily joined simply by cross-linking (for example, heating) the cross-linkable resin in a state where is positioned.
　上述のように構成された本発明の接合材料を用いた場合、信頼性の高い実装（接合）を行うことができる。
　すなわち、一方の接合対象物が備える電極と、他方の接合対象物が備える電極とをはんだによって強固に接合することが可能になるとともに、一方の接合対象物と他方の接合対象物を、架橋型樹脂で確実に接着することができるため、高い信頼性を有する接合構造を実現することができる。 When the bonding material of the present invention configured as described above is used, highly reliable mounting (bonding) can be performed.
That is, it is possible to firmly bond the electrode included in one object to be bonded and the electrode included in the other object to be bonded by solder, and the one object to be bonded and the other object to be bonded can be cross-linked. Since it can adhere | attach reliably with resin, the joining structure which has high reliability is realizable.
　なお、シート材料を、常温付近で固形状に保つためには、熱可塑性樹脂を使うことも考えられるが、熱可塑性樹脂は融点より高い温度にさらされると、再び溶融して流動性を示すため、接合部が安定な状態を保つことができないという問題がある。 In order to keep the sheet material in a solid state around room temperature, it is possible to use a thermoplastic resin. However, when the thermoplastic resin is exposed to a temperature higher than the melting point, it melts again and exhibits fluidity. There is a problem that the joint cannot maintain a stable state.
　また、例えば、常温で流動性を有する熱硬化型樹脂を用い、硬化反応を途中で停止させるようにする方法も考えられるが、安定した貯蔵寿命（シェルフライフ）を得ることが困難で、好ましくない。 In addition, for example, a method of using a thermosetting resin having fluidity at room temperature and stopping the curing reaction in the middle may be considered, but it is difficult to obtain a stable shelf life, which is not preferable. .
　これらの点を考慮すると、本発明のように、室温付近で、液状の架橋型樹脂と固形の架橋型樹脂とを組み合わせて用いることが望ましく、固形樹脂による形態保持性と、液状樹脂による取り扱い性および加熱時の流動性を確保するとともに、最終的には、架橋反応（例えば熱硬化反応）によって、接合後も高い信頼性を備えた接合を行うことができる。 In consideration of these points, it is desirable to use a combination of a liquid crosslinkable resin and a solid crosslinkable resin near room temperature as in the present invention. The form retainability by the solid resin and the handleability by the liquid resin are desirable. In addition, the fluidity at the time of heating can be ensured, and finally, bonding with high reliability can be performed even after bonding by a crosslinking reaction (for example, thermosetting reaction).
　また、はんだが溶融して、導通させるべき電極どうしがはんだを介して確実に接続されるとともに、溶融したはんだの液滴が合一して電極間に集まろうとするため、電極の面方向に隣り合う電極どうしの短絡も防止される。 In addition, since the solder is melted and the electrodes to be conducted are securely connected to each other through the solder, and the molten solder droplets coalesce and gather between the electrodes, Short-circuiting between adjacent electrodes is also prevented.
　［実施例］
　以下、本発明の実施例について説明する。
　＜１＞シート状の接合材料の作製
　１５℃以上、２５℃以下において液状の架橋型樹脂（熱硬化型樹脂）および、１５℃以上、２５℃以下において固形の架橋型樹脂（熱硬化型樹脂）として、下記の（ａ）および（ｂ）の樹脂を用意した。 [Example]
Examples of the present invention will be described below.
<1> Production of sheet-like bonding material Liquid cross-linkable resin (thermosetting resin) at 15 to 25 ° C. and solid cross-linking resin (thermosetting resin) at 15 to 25 ° C. The following resins (a) and (b) were prepared.
　（ａ）液状の架橋型樹脂（熱硬化型樹脂）：
　ビスフェノールＡ型液状エポキシ樹脂（重量平均分子量ｍｗ３８０）
　（ｂ）固形の架橋型樹脂（熱硬化型樹脂）：
　フェノキシ樹脂（重量平均分子量ｍｗ５００００）
　なお、固形のフェノキシ樹脂は、他の材料と混合することができるように、溶剤に溶かしたものを用いた。この実施例では、プロピレングリコールモノメチルエーテルアセテートに、フェノキシ樹脂が４０重量％となるように溶かした樹脂溶液として用いた。 (A) Liquid cross-linked resin (thermosetting resin):
Bisphenol A liquid epoxy resin (weight average molecular weight mw380)
(B) Solid cross-linked resin (thermosetting resin):
Phenoxy resin (weight average molecular weight mw 50000)
In addition, the solid phenoxy resin used what was melt | dissolved in the solvent so that it could mix with another material. In this example, it was used as a resin solution in which phenoxy resin was dissolved in propylene glycol monomethyl ether acetate so as to be 40% by weight.
　そして、この液状および固形の熱硬化型樹脂を、表１Ａ、表１Ｂの試料番号１～３０に示すような割合となるように配合した。なお、表１Ａ、表１Ｂの試料番号１～３０の試料における液状の熱硬化型樹脂（液状樹脂）と、固形の熱硬化型樹脂（固形樹脂）の配合割合は、溶剤を除いた固形樹脂に対する液状樹脂の割合（液状樹脂／固形樹脂（溶剤を除いたもの））を示している。 Then, the liquid and solid thermosetting resins were blended so as to have the ratios shown in Sample Nos. 1 to 30 in Table 1A and Table 1B. The mixing ratio of the liquid thermosetting resin (liquid resin) and the solid thermosetting resin (solid resin) in the samples Nos. 1 to 30 in Table 1A and Table 1B is based on the solid resin excluding the solvent. The ratio of liquid resin (liquid resin / solid resin (excluding solvent)) is shown.
　はんだとしては、下記の（ｃ１）および（ｃ２）のはんだを用意した。なお、はんだとしては、表１Ａ、表１Ｂに示すような平均粒径のものを用いるとともに、表１Ａ、表１Ｂに示すような割合、すなわち、シート状の接合材料における割合が、２．５体積％以上、５０体積％以下となるような割合で配合した。
　（ｃ１）Ｓｎ３Ａｇ０．５Ｃｕはんだ粉末（平均粒径２０μｍ）
　（ｃ２）Ｓｎ５８Ｂｉ（平均粒径２０μｍ）
　なお、「Ｓｎ３Ａｇ０．５Ｃｕ」は、Ａｇが３重量％、Ｃｕが０．５重量％、残りがＳｎであることを示し、「Ｓｎ５８Ｂｉ」は、Ｂｉが５８重量％、残りがＳｎであることを示している。 As the solder, the following solders (c1) and (c2) were prepared. In addition, as a solder, the thing of an average particle diameter as shown to Table 1A and Table 1B is used, and the ratio as shown in Table 1A and Table 1B, ie, the ratio in a sheet-like joining material, is 2.5 volume. % To 50% by volume or less.
(C1) Sn3Ag0.5Cu solder powder (average particle size 20 μm)
(C2) Sn58Bi (average particle size 20 μm)
“Sn3Ag0.5Cu” indicates that Ag is 3% by weight, Cu is 0.5% by weight, and the rest is Sn. “Sn58Bi” indicates that Bi is 58% by weight and the rest is Sn. Show.
　硬化剤として、下記の（ｄ１）および（ｄ２）の硬化剤を用いた。
　（ｄ１）２－フェニル－４、５－ジヒドロキシメチルイミダゾール
　（ｄ２）フェノール樹脂（重量平均分子量ｍｗ１９０）
　なお、フェノール樹脂は、プロピレングリコールモノメチルエーテルアセテートに、フェノール樹脂の割合が６５重量％となるように溶かして用いた。 As the curing agent, the following curing agents (d1) and (d2) were used.
(D1) 2-Phenyl-4,5-dihydroxymethylimidazole (d2) Phenol resin (weight average molecular weight mw190)
The phenol resin was used by dissolving in propylene glycol monomethyl ether acetate so that the proportion of the phenol resin was 65% by weight.
　上記（ｄ１）の２－フェニル－４、５－ジヒドロキシメチルイミダゾールは、シート状の接合材料を構成する液状樹脂および固形樹脂（溶剤成分を含まない）の合計量に対して一定の割合となるように（液状樹脂および固形樹脂の合計量に対して６重量％になるように）配合した。 The 2-phenyl-4,5-dihydroxymethylimidazole of (d1) is a constant ratio with respect to the total amount of the liquid resin and solid resin (not including the solvent component) constituting the sheet-like bonding material. (To 6 wt% with respect to the total amount of liquid resin and solid resin).
　上記（ｄ２）のフェノール樹脂は、表１Ｂの試料番号３１の試料についてのみ硬化剤として用いている。（ｄ２）のフェノール樹脂を硬化剤として用いるにあたっては、上記液状樹脂および固形樹脂の分子量（重量平均分子量）、およびそれらが有する反応基の数を考慮して、硬化剤としてのフェノール樹脂の配合割合を定めた。 The phenol resin (d2) is used as a curing agent only for the sample of sample number 31 in Table 1B. In using the phenol resin of (d2) as the curing agent, the blending ratio of the phenol resin as the curing agent in consideration of the molecular weight (weight average molecular weight) of the liquid resin and the solid resin and the number of reactive groups they have. Determined.
　なお、表１Ｂの試料番号３１の試料では、上記（ａ）の液状樹脂と、上記（ｂ）の固形樹脂の合計量の６３重量％に相当する量のフェノール樹脂（上記（ｄ２）のフェノール樹脂）を配合するようにした。 In the sample of sample number 31 in Table 1B, an amount of phenol resin corresponding to 63% by weight of the total amount of the liquid resin (a) and the solid resin (b) (the phenol resin (d2) above). ).
　フェノール樹脂は、加熱前のシート中で固形の架橋型樹脂（熱硬化型樹脂）として作用するため、硬化剤としてフェノール樹脂を用いた試料番号３１の試料では、固形樹脂（前記（ｂ）のフェノキシ樹脂と、前記（ｄ２）の硬化剤としてのフェノール樹脂の合計）に対する液状樹脂（前記（ａ）のビスフェノールＡ型液状エポキシ樹脂）の割合、すなわち、液状樹脂：固形樹脂（合計）の値は５５：４５となる。なお、この割合は本発明の範囲内の割合である。 Since the phenol resin acts as a solid cross-linked resin (thermosetting resin) in the sheet before heating, in the sample of sample number 31 using a phenol resin as a curing agent, the solid resin (phenoxy of (b) above) The ratio of the liquid resin (bisphenol A type liquid epoxy resin of (a) above) to the resin and the total of phenol resin as the curing agent of (d2) above, that is, the value of liquid resin: solid resin (total) is 55 : 45. This ratio is a ratio within the scope of the present invention.
　活性剤としては、下記の（ｅ１），（ｅ２）の硬化剤を用いた。
　（ｅ１）アジピン酸
　（ｅ２）セバシン酸
　なお、（ｅ１）のアジピン酸、および、（ｅ２）のセバシン酸は、いずれも、シート状の接合材料に含まれるはんだの量に対して一定の割合（２重量％）となるように配合した。 As the activator, the following curing agents (e1) and (e2) were used.
(E1) Adipic acid (e2) Sebacic acid The adipic acid of (e1) and the sebacic acid of (e2) are both at a certain ratio to the amount of solder contained in the sheet-like bonding material ( 2% by weight).
　上述の各素原料を、ミキサーで混合した。ミキサーの代わりに擂潰機を用いることも可能である。 The above raw materials were mixed with a mixer. It is also possible to use a crusher instead of a mixer.
　各素原料を混合して得たペーストにさらに溶剤（プロピレングリコールモノメチルエーテルアセテート）を加えて、塗膜形成するのに支障のない粘度に調整した。 Further, a solvent (propylene glycol monomethyl ether acetate) was further added to the paste obtained by mixing the raw materials to adjust the viscosity so as not to hinder the formation of the coating film.
　粘度を調整したペーストを、片面に離形処理を施したＰＥＴフィルム上の、離形処理した面に、ドクターブレードを用いて薄く引き延ばした。これを、オーブンで９０℃、３０分間の条件で加熱処理して、溶剤を揮発させることにより、シート状の接合材料を得た。
　この実施例では、シート状の接合材料の厚みが約４０μｍになるようにスキージ厚みを調整した。 The paste whose viscosity was adjusted was thinly stretched using a doctor blade on the surface of the release film on the PET film which had been release-treated on one side. This was heat-treated in an oven at 90 ° C. for 30 minutes to volatilize the solvent, thereby obtaining a sheet-like bonding material.
In this example, the squeegee thickness was adjusted so that the thickness of the sheet-like bonding material was about 40 μm.
　＜２＞シート状の接合材料の評価
　（１）ＰＥＴフィルムからの剥離性
　ＰＥＴフィルム上に形成されたシート状の接合材料（試料）を５ｍｍ幅にカットし、ＰＥＴフィルムを折り曲げて、ＰＥＴフィルムからシート状の接合材料を剥離させた。
　このとき、ＰＥＴから剥離することができない試料、もしくは割れや欠けが発生した試料を剥離性（取り扱い性）が不良、これらの不具合が認められなかった試料を剥離性が良好と判定した。
　試験は各試料について５回行い、良品と判定された試料の数を計数した。
　その結果を表１Ａ、表１Ｂに示す。 <2> Evaluation of sheet-shaped bonding material (1) Peelability from PET film Sheet-shaped bonding material (sample) formed on a PET film is cut into a width of 5 mm, the PET film is bent, The sheet-like bonding material was peeled off.
At this time, a sample that could not be peeled from PET, or a sample that had cracks or chipped portions was judged to have poor peelability (handleability), and a sample that did not have these defects was judged to have good peelability.
The test was performed five times for each sample, and the number of samples determined to be non-defective was counted.
The results are shown in Table 1A and Table 1B.
　（２）接合性
　シート状の接合材料（試料）を、長さが０．６ｍｍ、幅が０．３ｍｍの寸法（電子部品（チップ抵抗）１０の寸法に対応する寸法）にカットし、チップ抵抗１０が実装される回路基板１（のランド電極２ａ，２ｂ）上に、カットされたシート状の接合材料３を載置した（図２参照）。それから、接合材料３上に、長さが０．６ｍｍ、幅が０．３ｍｍの寸法の、長さ方向両端側に一対の電極１１ａ，１１ｂを備えたチップ抵抗１０を搭載し、１ＭＰａ程度の加圧を加えながら、２５０℃に加熱し、１分間保持した。 (2) Bondability The sheet-like bonding material (sample) is cut into a dimension having a length of 0.6 mm and a width of 0.3 mm (a dimension corresponding to the dimension of the electronic component (chip resistor) 10) to obtain a chip resistor. The cut sheet-like bonding material 3 was placed on the circuit board 1 ( land electrodes 2a and 2b) on which the circuit board 10 is mounted (see FIG. 2). Then, a chip resistor 10 having a pair of electrodes 11a and 11b on both ends in the length direction and having a length of 0.6 mm and a width of 0.3 mm is mounted on the bonding material 3 and applied with a pressure of about 1 MPa. While applying pressure, it was heated to 250 ° C. and held for 1 minute.
　チップ抵抗１０のランド電極２ａ，２ｂ間の抵抗をマイクロオームメーターを用いて測定し、抵抗値が１０±０．５Ωの範囲にあるものを良品と判定した。
　試験は表１Ａ、表１Ｂの各試料のそれぞれについて用意した、１０個の被検試料について行い、良品と判定された試料の数を計数した。 The resistance between the land electrodes 2a and 2b of the chip resistor 10 was measured using a micro ohm meter, and the one having a resistance value in the range of 10 ± 0.5Ω was determined as a good product.
The test was performed on 10 test samples prepared for each sample in Table 1A and Table 1B, and the number of samples determined to be non-defective was counted.
　なお、この実施例では、上述のように、回路基板１上に、カットされたシート状の接合材料３を載置し、その上にチップ抵抗１０を搭載するようにしたが、チップ抵抗にシート状の接合材料を貼り付け、その状態で、回路基板上にチップ抵抗を搭載するようにしてもよい。 In this embodiment, as described above, the cut sheet-shaped bonding material 3 is placed on the circuit board 1 and the chip resistor 10 is mounted thereon. In this state, a chip resistor may be mounted on the circuit board.
　（３）接合信頼性
　上記（２）の接合性の試験において良好と判定されたチップ抵抗を、－４０℃⇔１２５℃各３０分の温度サイクル試験槽に投入し、１０００サイクル後の抵抗値を測定した。そして、上記（２）の接合性の試験の場合と同様の方法で良品／不良品の判定を行い、良品と判定された試料の数を計数した。
　その結果を表１Ａ、表１Ｂに併せて示す。 (3) Bonding reliability Chip resistance determined to be good in the bonding property test of (2) above is put in a temperature cycle test bath of -40 ° C to 125 ° C for 30 minutes, and the resistance value after 1000 cycles is obtained. It was measured. Then, a non-defective product / defective product was determined by the same method as in the case of the bondability test (2), and the number of samples determined to be non-defective was counted.
The results are also shown in Table 1A and Table 1B.
　また、比較のため、架橋型樹脂として、１５℃以上、２５℃以下において液状の液状樹脂（上記（ａ）のビスフェノールＡ型液状エポキシ樹脂）のみを用いた試料（表１Ｂの試料番号３２の試料）と、１５℃以上、２５℃以下において固形の固形樹脂（上記（ｂ）のフェノキシ樹脂のみを用いた試料（表１Ｂの試料番号３３の試料）を作製し、上述の試料番号１～３１の試料と同様の方法で試験を行った。その結果を表１Ａ、表１Ｂに併せて示す。 For comparison, a sample using only a liquid resin (bisphenol A type liquid epoxy resin of (a) above) at 15 ° C. or more and 25 ° C. or less as a crosslinkable resin (sample No. 32 in Table 1B). ), And a solid resin (sample (33) in Table 1B) using only a solid resin (sample (33) in (b) above) at 15 ° C. or higher and 25 ° C. or lower. The test was conducted in the same manner as the sample, and the results are shown in Table 1A and Table 1B.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　（４）評価
　表１Ａ、表１Ｂの試料番号１～３１の試料（本発明の要件を満たす実施例の試料）は、剥離性を調べる試験（取り扱い性試験）、接合性を調べる試験、および接合信頼性を調べる試験のいずれにおいても不良が認められず、いずれの特性も良好であることが確認された。 (4) Evaluation Samples 1 to 31 in Tables 1A and 1B (examples satisfying the requirements of the present invention) were tested for peelability (handability test), test for bondability, and bonding No defect was observed in any of the tests for examining reliability, and it was confirmed that all the characteristics were good.
　なお、試料番号３１の試料は、硬化剤として、フェノール樹脂（重量平均分子量１９０）を用いた試料であるが、この試料番号３１の試料も、上述の各試験において、いずれの特性も良好であることが確認された。 In addition, although the sample of sample number 31 is a sample using a phenol resin (weight average molecular weight 190) as the curing agent, this sample number 31 also has good characteristics in each test described above. It was confirmed.
　これに対し、架橋型樹脂として液状樹脂のみを用いた試料番号３２の試料の場合、剥離性試験の結果が不良で、接合性試験および接合信頼性試験を行うことができなかった。 On the other hand, in the case of the sample No. 32 using only the liquid resin as the crosslinkable resin, the peelability test result was poor and the bondability test and the bond reliability test could not be performed.
　また、架橋型樹脂として、固形樹脂のみを用いた試料番号３３の試料の場合、剥離性試験の結果が好ましくなく、接合性試験の結果も芳しくなく、接合信頼性試験を行うことができなかった。 Further, in the case of the sample No. 33 using only a solid resin as the crosslinkable resin, the result of the peelability test was not preferable, the result of the bondability test was not good, and the bonding reliability test could not be performed. .
　上記結果から、本発明の要件を備えた試料番号１～３１の試料（シート状の接合材料）は、取り扱い性に優れているとともに、かつ、チップ抵抗の実装に用いた場合に、確実な機械的接合と良好な電気的導通を実現できることが確認された。 From the above results, the samples (sheet-like bonding material) of sample numbers 1 to 31 having the requirements of the present invention are excellent in handleability and reliable when used for mounting chip resistors. It was confirmed that it was possible to achieve a good joint and good electrical continuity.
　なお、接合の対象である、基板の種類や電子部品の種類に特に制約はなく、種々の基板や電子部品を、本発明の接合材料を用いた接合の対象とすることができる。 In addition, there is no restriction | limiting in particular in the kind of board | substrate and electronic component which are the object of joining, A various board | substrate and electronic component can be made into the object of joining using the joining material of this invention.
　また、基板や基板に設けられた電極の形状、電子部品や電子部品が備える電極の形状などにも特に制約はなく、それらが各種形状のものである場合にも本発明の接合材料を適用することが可能である。 Moreover, there is no restriction | limiting in particular in the shape of the electrode provided in the board | substrate and the board | substrate, the electronic component and the electrode with which an electronic component is provided, The joining material of this invention is applied also when those are various shapes. It is possible.
　具体的には、例えば、図３に示すように、段差２０を有する回路基板１の各ステージ２０ａ，２０ｂのそれぞれ電子部品（表面実装型の電子部品）１０を実装するような場合に、シート状の接合材料３を用いることにより、各電子部品１０の各電極１１を回路基板１上の各ランド電極２に効率よくしかも確実に接合することが可能になり、信頼性の高い実装を行うことができる。 Specifically, for example, as shown in FIG. 3, when mounting each electronic component (surface-mounted electronic component) 10 of each stage 20 a, 20 b of the circuit board 1 having the step 20, a sheet shape By using this bonding material 3, it becomes possible to bond each electrode 11 of each electronic component 10 to each land electrode 2 on the circuit board 1 efficiently and surely, and to perform highly reliable mounting. it can.
　段差２０を有する回路基板１の各ステージ２０ａ，２０ｂに配設された各ランド電極２に、従来のようなペースト状の接合材料を供給することは困難であり、生産性の低下や、実装不良などを招くおそれがあるが、本発明にかかるシート状の接合材料３を用いることにより、各ステージ２０ａ，２０ｂに容易かつ確実に各電子部品１０を実装することが可能になる。
　なお、複数個の電子部品１０を接合するための接合材料３として、図３のように電子部品１０がそれぞれ接合材料３を備えるようにしてもよいが、一つの接合材料３で、各電子部品（２つの電子部品）１０をそれぞれのランド電極２に接合するように構成することも可能である。 It is difficult to supply a pasty bonding material as in the past to each land electrode 2 disposed on each stage 20a, 20b of the circuit board 1 having the step 20, which causes a decrease in productivity and poor mounting. However, by using the sheet-like bonding material 3 according to the present invention, each electronic component 10 can be easily and reliably mounted on each stage 20a, 20b.
As the bonding material 3 for bonding a plurality of electronic components 10, each of the electronic components 10 may include the bonding material 3 as shown in FIG. 3. It is also possible to configure (two electronic components) 10 to be joined to each land electrode 2.
　また、図４に示すように、回路基板１の凹部３０の底面３１のランド電極２に、電子部品１０の電極１１を接合する場合にも、本発明のシート状の接合材料３を用いることにより、電子部品１０の電極１１を、回路基板１の凹部３０の底面３１に配設されたランド電極２に接合して、信頼性の高い実装を行うことができる。 Further, as shown in FIG. 4, when the electrode 11 of the electronic component 10 is bonded to the land electrode 2 on the bottom surface 31 of the recess 30 of the circuit board 1, the sheet-shaped bonding material 3 of the present invention is used. The electrode 11 of the electronic component 10 can be bonded to the land electrode 2 disposed on the bottom surface 31 of the recess 30 of the circuit board 1 so that highly reliable mounting can be performed.
　回路基板１が備える凹部３０の底面３１に配設されたランド電極２に、従来のペースト状の接合材料を用いて電子部品１０の電極を接合しようとすると、凹部３０の底面３１のランド電極２上にペースト状の接合材料を供給することが必要になるが、凹部３０の底面３１にペースト状の接合材料を供給することは困難であり、生産性の低下や、実装不良などを招くおそれがある。これに対し、本発明のシート状の接合材料３を用いることにより、ペースト状の接合材料を供給するという困難な作業を不要にして、電子部品１０の電極１１を、容易かつ確実に、回路基板１の凹部３０の底面に配設されたランド電極２に接合して、信頼性の高い実装を行うことができる。 When the electrode of the electronic component 10 is to be bonded to the land electrode 2 disposed on the bottom surface 31 of the recess 30 included in the circuit board 1 using a conventional paste-like bonding material, the land electrode 2 on the bottom surface 31 of the recess 30 is formed. Although it is necessary to supply a paste-like bonding material on the upper surface, it is difficult to supply the paste-like bonding material to the bottom surface 31 of the recess 30, which may cause a decrease in productivity and poor mounting. is there. On the other hand, by using the sheet-like bonding material 3 of the present invention, the difficult operation of supplying the paste-like bonding material is unnecessary, and the electrode 11 of the electronic component 10 can be easily and reliably connected to the circuit board. It is possible to perform mounting with high reliability by bonding to the land electrode 2 disposed on the bottom surface of the one recess 30.
　なお、電子部品１０を接合するための接合材料３として、図４に示すように、一つの接合材料３で、各電子部品（２つの電子部品）１０をそれぞれのランド電極２に接合するように構成することも可能であるが、各電子部品１０のそれぞれが別体としての接合材料３を備えるように構成することも可能である。 As the bonding material 3 for bonding the electronic component 10, as shown in FIG. 4, the single bonding material 3 is used to bond each electronic component (two electronic components) 10 to each land electrode 2. Although it is possible to configure, it is also possible to configure each electronic component 10 so as to include the bonding material 3 as a separate body.
　また、図５に示すように、例えば、回路基板１が、垂直壁４０に囲まれた領域４１を備えているような場合において、垂直壁４０の両主面４０ａ，４０ｂと、垂直壁４０に囲まれた領域４１の底面４２のランド電極２上に電子部品１０を実装する場合にも、本発明のシート状の接合材料３を用いることにより、電子部品１０の電極１１を、垂直壁４０の両主面４０ａ，４０ｂに配設されたランド電極２、および、底面４２に配設されたランド電極２に効率よくしかも確実に接合して、信頼性の高い実装を行うことができる。 Further, as shown in FIG. 5, for example, in the case where the circuit board 1 includes a region 41 surrounded by the vertical wall 40, both the main surfaces 40 a and 40 b of the vertical wall 40 and the vertical wall 40 are provided. Even when the electronic component 10 is mounted on the land electrode 2 on the bottom surface 42 of the enclosed region 41, the electrode 11 of the electronic component 10 is attached to the vertical wall 40 by using the sheet-like bonding material 3 of the present invention. Highly reliable mounting can be achieved by efficiently and reliably joining the land electrode 2 disposed on both the main surfaces 40a and 40b and the land electrode 2 disposed on the bottom surface 42.
　なお、垂直壁４０の両主面４０ａ，４０ｂ、および、底面４２に電子部品１０を実装するような場合も、従来のはんだペーストなどのペースト状の接合材料を供給することは困難であり、生産性の低下や、実装不良などを招くおそれがあるが、本発明のシート状の接合材料を用いることにより、信頼性の高い実装を、容易かつ確実に行うことが可能になる。 Even when the electronic component 10 is mounted on both the main surfaces 40a and 40b and the bottom surface 42 of the vertical wall 40, it is difficult to supply a pasty bonding material such as a conventional solder paste. However, by using the sheet-like bonding material of the present invention, highly reliable mounting can be easily and reliably performed.
　また、図５に示すように、垂直壁４０の両主面に電子部品１０を実装しようとすると、従来のペースト状の接合材料を用いる場合には、仮止め用の接着剤や粘着テープなどの接着部材を用いることが必要になるが、本発明の接合材料として、粘着性を備えたシート状の接合材料を用いることにより、特に仮止め用の接着剤や粘着テープなどを必要とすることなく、実装および接合を行うことが可能になり、特に有意義である。 Further, as shown in FIG. 5, when the electronic component 10 is to be mounted on both main surfaces of the vertical wall 40, when a conventional paste-like bonding material is used, a temporary fixing adhesive or adhesive tape is used. Although it is necessary to use an adhesive member, as a bonding material of the present invention, by using a sheet-like bonding material having tackiness, there is no need for a temporary fixing adhesive or an adhesive tape. It is possible to perform mounting and joining, which is particularly meaningful.
　図５の構成では、一つの接合材料３で、複数の電子部品（垂直壁４０の内側面４０ａの２つと、底面４２の一つの合計３つの電子部品）１０をそれぞれのランド電極２に接合するようにしているが、各電子部品１０用に複数の接合材料３を用意して、各電子部品１０のそれぞれを、各接合材料３で、それぞれのランド電極２に接合するように構成することも可能である。 In the configuration of FIG. 5, a plurality of electronic components (two of the inner surface 40 a of the vertical wall 40 and one of the bottom surface 42, a total of three electronic components) 10 are bonded to each land electrode 2 with one bonding material 3. However, it is also possible to prepare a plurality of bonding materials 3 for each electronic component 10 and to connect each electronic component 10 to each land electrode 2 with each bonding material 3. Is possible.
　また、図６に示すように、回路基板１の両主面１ａ，１ｂに、電子部品１０を実装する場合にも、本発明のシート状の接合材料３を用いることにより、電子部品１０の電極１１を、回路基板１の両主面１ａ，１ｂのランド電極２に効率よくしかも確実に接合して、信頼性の高い実装を行うことができる。 Further, as shown in FIG. 6, even when the electronic component 10 is mounted on both the main surfaces 1 a and 1 b of the circuit board 1, the electrode of the electronic component 10 is obtained by using the sheet-like bonding material 3 of the present invention. 11 can be efficiently and reliably bonded to the land electrodes 2 on both the main surfaces 1a and 1b of the circuit board 1 to achieve highly reliable mounting.
　図６に示す実装態様の場合も、本発明の接合材料３として、粘着性を備えたシート状の接合材料を用いることにより、仮止め用の接着剤や粘着テープなどを必要とすることなく、実装および接合を行うことが可能になるため特に有意義である。 Also in the case of the mounting mode shown in FIG. 6, by using a sheet-like bonding material having adhesiveness as the bonding material 3 of the present invention, without needing an adhesive or a pressure-sensitive adhesive tape for temporary fixing, This is particularly significant because it enables mounting and joining.
　本発明の接合材料３を用いるにあたっては、接合材料３を表面実装型の電子部品１０の実装面に貼り付けて用いてもよく、また、表面実装型の電子部品１０が搭載される回路基板１に貼り付けて用いるようにしてもよい。 In using the bonding material 3 of the present invention, the bonding material 3 may be used by being attached to the mounting surface of the surface-mounted electronic component 10, or the circuit board 1 on which the surface-mounted electronic component 10 is mounted. You may make it stick and use.
　なお、本発明の接合材料は、異方接続性に優れるという特徴を有していることから、接合される電子部品の端子の数や、電子部品の接続対象（実装対象）である回路基板に設けられている電極の数に制約がなく、２端子の受動部品はもちろん、さらに多くの端子を有する電子部品を、それに対応する電極を備えた回路基板などの接続対象（実装対象）に実装、接合する場合にも用いることができる。また、各種電子モジュール部品の実装や接合にも使用することが可能である。 In addition, since the joining material of the present invention has a feature of excellent anisotropic connectivity, the number of terminals of electronic components to be joined and a circuit board that is an electronic component connection target (mounting target) There are no restrictions on the number of electrodes provided, not only 2-terminal passive components, but also electronic components with more terminals are mounted on connection targets (mounting targets) such as circuit boards equipped with the corresponding electrodes. It can also be used for bonding. It can also be used for mounting and joining various electronic module components.
　図３には、３端子型の電子部品１０ａを実装する場合の構成が示されており、図４には、例えば、ＩＣチップなどの多数の端子を備えた電子部品１０ｂを実装する場合の構成が示されている。 FIG. 3 shows a configuration for mounting a three-terminal electronic component 10a, and FIG. 4 shows a configuration for mounting an electronic component 10b having a large number of terminals such as an IC chip. It is shown.
　なお、本発明は上記実施形態に限定されるものではなく、接合すべき対象物の種類や、接合工程における条件などに関し、発明の範囲内において、種々の応用、変形を加えることが可能である。 In addition, this invention is not limited to the said embodiment, It is possible to add various application and deformation | transformation within the range of invention regarding the kind of the target object which should be joined, the conditions in a joining process, etc. .
　１　　　　　　　回路基板
　１ａ，１ｂ　　　回路基板の両主面
　２ａ，２ｂ　　　ランド電極
　３　　　　　　　接合材料
　１０　　　　　　電子部品（チップ抵抗）
　１０ａ　３端子型の電子部品
　１０ｂ　多数の端子を備えた電子部品
　１１，１１ａ，１１ｂ　電極
　２０　　　　　　段差
　２０ａ，２０ｂ　回路基板の各ステージ
　３０　　　　　　回路基板の凹部
　３１　　　　　　凹部の底面
　４０　　　　　　回路基板の垂直壁
　４０ａ，４０ｂ　垂直壁の両主面
　４１　　　　　　垂直壁に囲まれた領域
　４２　　　　　　垂直壁に囲まれた領域の底面 DESCRIPTION OF SYMBOLS 1 Circuit board 1a, 1b Both main surfaces of a circuit board 2a, 2b Land electrode 3 Joining material 10 Electronic component (chip resistance)
DESCRIPTION OF SYMBOLS 10a 3 terminal type electronic component 10b Electronic component with many terminals 11, 11a, 11b Electrode 20 Step 20a, 20b Each stage of a circuit board 30 Recessed part of a circuit board 31 Bottom face of a recessed part 40 Vertical wall of a circuit board 40a, 40b Both main surfaces of the vertical wall 41 Area surrounded by the vertical wall 42 Bottom face of the area surrounded by the vertical wall

Claims (12)

  1. 　電極を有する部材間を接合するのに用いられるシート状の接合材料であって、
    　１５℃以上、２５℃以下において液状の架橋型樹脂と、
    　１５℃以上、２５℃以下において固形の架橋型樹脂と、
    　はんだと
    　を含むことを特徴とする接合材料。     A sheet-like bonding material used for bonding between members having electrodes,
    A liquid cross-linkable resin at 15 ° C. or higher and 25 ° C. or lower;
    A cross-linked resin solid at 15 ° C. or higher and 25 ° C. or lower;
    A bonding material characterized by including solder.
  2. 　前記架橋型樹脂が熱硬化型樹脂であることを特徴とする請求項１記載の接合材料。 The bonding material according to claim 1, wherein the cross-linking resin is a thermosetting resin.
  3. 　前記熱硬化型樹脂がエポキシ樹脂であることを特徴とする請求項２記載の接合材料。 The bonding material according to claim 2, wherein the thermosetting resin is an epoxy resin.
  4. 　前記液状の架橋型樹脂と前記固形の架橋型樹脂の含有割合が重量比で５：９５～９５：５の範囲にあることを特徴とする請求項１～３のいずれかに記載の接合材料。 The bonding material according to any one of claims 1 to 3, wherein a content ratio of the liquid crosslinkable resin and the solid crosslinkable resin is in a range of 5:95 to 95: 5 by weight.
  5. 　前記はんだを２．５体積％以上、５０体積％以下の割合で含むことを特徴とする請求項１～４のいずれかに記載の接合材料。 The bonding material according to any one of claims 1 to 4, wherein the solder is contained in a proportion of 2.5% by volume or more and 50% by volume or less.
  6. 前記はんだがＳｎを主たる成分の１つとするＳｎ系はんだであることを特徴とする請求項１～５のいずれかに記載の接合材料。 The bonding material according to any one of claims 1 to 5, wherein the solder is Sn-based solder containing Sn as one of main components.
  7. 　前記Ｓｎ系はんだがＳｎＡｇＣｕ系はんだ、またはＳｎＢｉ系はんだであることを特徴とする請求項１～６のいずれかに記載の接合材料。 7. The bonding material according to claim 1, wherein the Sn-based solder is SnAgCu-based solder or SnBi-based solder.
  8. 　活性剤を含むことを特徴とする請求項１～７のいずれかに記載の接合材料。 8. The bonding material according to claim 1, further comprising an activator.
  9. 　前記活性剤がアジピン酸またはセバシン酸であることを特徴とする請求項１～８のいずれかに記載の接合材料。 The bonding material according to any one of claims 1 to 8, wherein the activator is adipic acid or sebacic acid.
  10. 　請求項１～９のいずれかに記載の接合材料を備えていることを特徴とする電子部品。 An electronic component comprising the bonding material according to any one of claims 1 to 9.
  11. 　電極を有する部材間を接合するための接合方法であって、
    　請求項１～９のいずれかに記載の接合材料を、前記電極を有する部材間に位置させた状態で、前記液状および固形の架橋型樹脂を架橋させること
    　を特徴とする接合方法。     A joining method for joining members having electrodes,
    10. A bonding method comprising cross-linking the liquid and solid cross-linked resin in a state where the bonding material according to claim 1 is positioned between members having the electrodes.
  12. 　請求項１１に記載の接合方法により、一方の接合対象物と他方の接合対象物とが接合されたものであることを特徴とする接合体。 12. A joined body in which one joining object and the other joining object are joined by the joining method according to claim 11.
PCT/JP2015/081364 2015-03-27 2015-11-06 Sheet-like joining material, electronic component equipped with same, joining method, and joined body WO2016157594A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047590A (en) * 2018-09-18 2020-03-26 積水化学工業株式会社 Conductive film and connection structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235060A (en) * 2001-11-05 2002-08-23 Sony Chem Corp Anisotropic electroconductive film
JP2006096896A (en) * 2004-09-30 2006-04-13 Sumitomo Electric Ind Ltd Method for producing anisotropic electroconductive adhesive, anisotropic electroconductive adhesive and anisotropic electroconductive film
WO2007125650A1 (en) * 2006-04-27 2007-11-08 Sumitomo Bakelite Co., Ltd. Adhesive tape, semiconductor package, and electronic device
WO2008023452A1 (en) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Adhesive tape, joint structure, and semiconductor package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002235060A (en) * 2001-11-05 2002-08-23 Sony Chem Corp Anisotropic electroconductive film
JP2006096896A (en) * 2004-09-30 2006-04-13 Sumitomo Electric Ind Ltd Method for producing anisotropic electroconductive adhesive, anisotropic electroconductive adhesive and anisotropic electroconductive film
WO2007125650A1 (en) * 2006-04-27 2007-11-08 Sumitomo Bakelite Co., Ltd. Adhesive tape, semiconductor package, and electronic device
WO2008023452A1 (en) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Adhesive tape, joint structure, and semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020047590A (en) * 2018-09-18 2020-03-26 積水化学工業株式会社 Conductive film and connection structure

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