WO2016150067A1 - 背光源、显示装置 - Google Patents

背光源、显示装置 Download PDF

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Publication number
WO2016150067A1
WO2016150067A1 PCT/CN2015/086254 CN2015086254W WO2016150067A1 WO 2016150067 A1 WO2016150067 A1 WO 2016150067A1 CN 2015086254 W CN2015086254 W CN 2015086254W WO 2016150067 A1 WO2016150067 A1 WO 2016150067A1
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Prior art keywords
solder resist
resist layer
guide plate
light guide
circuit board
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PCT/CN2015/086254
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English (en)
French (fr)
Inventor
徐善飞
郑伯然
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京东方科技集团股份有限公司
京东方光科技有限公司
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Application filed by 京东方科技集团股份有限公司, 京东方光科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/908,498 priority Critical patent/US10338293B2/en
Publication of WO2016150067A1 publication Critical patent/WO2016150067A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

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  • the present disclosure relates to the field of liquid crystal display technologies, and in particular, to a backlight and a display device.
  • the diffusion sheet has a first region covering the FPC (flexible circuit board), and the region and the light guide plate often have a gap, which affects the display effect when pressed.
  • the present disclosure provides a backlight and a display device that reduce a gap between a diffusion sheet and a light guide plate to prevent light leakage.
  • a backlight including:
  • the light bar includes an LED lamp and a flexible circuit board connected to the LED lamp
  • the flexible circuit board includes: a flexible circuit board substrate, respectively disposed on the flexible circuit board substrate a first solder resist layer and a second solder resist layer on both sides, the first solder resist layer is disposed on a side of the flexible circuit board substrate adjacent to the light guide plate, and the second solder resist layer is disposed on the flexible circuit a side of the board substrate away from the light guide plate, the first solder resist layer is connected with an LED lamp;
  • Providing one side of the second solder resist layer on the flexible circuit board substrate includes a first region in which the second solder resist layer is disposed and a second region in which the second solder resist layer is not disposed, and the second portion The area is located on a side close to the light guide plate;
  • the diffusion sheet has a connecting portion that partially covers or completely covers the second region near an end of the light bar.
  • the second solder resist layer is provided with a copper wire layer for electrical connection of the LED lamp, and the area of the wiring region of the copper wire layer is not larger than the area of the second solder resist layer.
  • the light guide plate has a bell mouth structure near one end of the light bar, the first One end of the solder resist layer adjacent to the light guide plate is located above the bell mouth structure of the light guide plate.
  • the bell mouth structure has a slope on the light exiting side of the light guide plate, and the first solder resist layer is close to the sloped surface.
  • the bell mouth structure is a plane on a side opposite to the light exiting side of the light guide plate.
  • the thickness of the second solder resist layer is the same as the thickness of the diffusion sheet.
  • the diffusion sheet has a thickness of 0.04 to 0.055 mm.
  • a white oil character is disposed on the first solder resist layer.
  • the present disclosure also discloses a display device including the backlight described above.
  • the second solder resist layer does not completely cover the flexible circuit board substrate, and the diffusion sheet directly overlaps the flexible circuit board substrate, thereby reducing the thickness between the diffusion sheet and the light guide plate to avoid light leakage.
  • FIG. 1 is a schematic structural view of a backlight in the related art
  • FIG. 2 is a schematic view showing the structure of a backlight in an embodiment of the present disclosure.
  • the diffusion sheet has a first region covering the FPC (flexible circuit board), and the flexible circuit board includes: a flexible circuit board substrate 1.
  • the first solder resist layer 2 and the second solder resist layer 3 on opposite sides of the flexible wiring board substrate 1.
  • the first solder resist layer 2 is connected to the LED lamp 6, and the diffusion sheet 4 is overlapped on the second solder resist layer 3.
  • the first region of the diffusion sheet 4 and the light guide plate 5 have a gap, and when the FPC is pressed, the backlight effect of the backlight It will change as the gap decreases.
  • a backlight including:
  • the light bar comprises an LED lamp 6 and a flexible circuit board connected to the LED lamp 6.
  • the flexible circuit board comprises: a flexible circuit board substrate 1, and a first solder resist layer 2 respectively disposed on opposite sides of the flexible circuit board substrate 1 And the second solder resist layer 3, the first solder resist layer 2 is disposed on one side of the flexible circuit board substrate 1 adjacent to the light guide plate 5, and the second solder resist layer 3 is disposed on the flexible circuit board substrate 1 away from the light guide plate 5.
  • One side, the first solder resist layer 2 is connected with an LED lamp 6;
  • the flexible circuit board substrate 1 is provided with one side of the second solder resist layer 3 including a first region in which the second solder resist layer 3 is disposed and a second region in which the second solder resist layer 3 is not disposed, and the second region is located near the lead One side of the light panel 5;
  • the end of the diffusion sheet 4 adjacent to the light bar has a connection portion that partially covers or completely covers the second region.
  • the flexible wiring board substrate 1 includes a first region in which the second solder resist layer 3 is disposed and a second region in which the second solder resist layer 3 is not disposed, that is, the second solder resist layer 3 does not completely cover the flexible wiring board substrate 1.
  • the second area is located on one side of the first area.
  • the diffusion sheet 4 is directly overlapped on the flexible circuit board substrate 1, thereby reducing the thickness between the connection portion of the diffusion sheet 4 and the light guide plate 5, so that pressing the flexible circuit board does not change the effect before the lamp, thereby avoiding diffusion. Light leakage caused by the thickness between the connecting portion of the sheet 4 and the light guide plate 5.
  • the second solder resist layer 3 is provided with a copper wire layer (not shown) for electrically connecting the LED lamp 6, and the area of the wiring region of the copper wire layer is not larger than the area of the second solder resist layer 3.
  • the reduction in the area of the second solder resist layer 3 does not affect the routing of the copper wires for the electrical connection of the LED lamps 6.
  • one end of the light guide plate 5 adjacent to the light bar has a bell mouth structure 51
  • one end of the first solder resist layer 2 adjacent to the light guide plate 5 is located above the bell mouth structure 51 of the light guide plate 5 .
  • the bell mouth structure 51 is a portion of the light guide plate 5 located below the connecting portion of the diffusion sheet 4.
  • the thickness of the bell mouth structure 51 near the end of the LED lamp 6 is greater than the thickness of the end away from the LED lamp 6, and is open. Shaped like a horn.
  • the bell mouth structure includes at least one inclined surface, and the inclined surface is located on the light exiting side of the light guide plate 5.
  • the bell mouth structure 51 may be a plane or a slope on a side opposite to the light exiting side of the light guide plate 5.
  • the bell mouth structure 51 has a slope on the light exiting side of the light guide plate 5, and as shown in FIG. 2, the first solder resist layer 2 is adjacent to the slope. This design is beneficial to the light emitted by the LED lamp 6 completely entering the inside of the light guide plate, thereby improving the utilization of light.
  • the bell mouth structure 51 is flat on the side opposite to the light exiting side of the light guide plate 5, so that the thickness of the backlight can be reduced, and the processing difficulty can be reduced.
  • the reduction in the overall thickness of the portion of the flexible circuit board located above the light guide plate 5 makes the flexible circuit board more flexible and can be attached more closely to the bell mouth of the light guide plate.
  • the thickness of the second solder resist layer 3 is the same as the thickness of the diffusion sheet 4.
  • the diffusion sheet 4 has a thickness of 0.04 to 0.055 mm.
  • a white oil character (not shown) is disposed on the first solder resist layer 2 as an identifier of the device.
  • the present disclosure also discloses a display device including the backlight described above.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种背光源，包括：导光板（5）；设置于导光板（5）出光侧的扩散片（4）；位于导光板（5）入光侧的灯条，灯条包括LED灯（6）和位于连接LED灯（6）的柔性线路板。柔性线路板包括：柔性线路板基材（1）、分别设置于柔性线路板基材（1）相对的两面的第一阻焊层（2）和第二阻焊层（3），第一阻焊层（2）设置于柔性线路板基材（1）上靠近导光板（5）的一面，第二阻焊层（3）设置于柔性线路板基材（1）上远离导光板（5）的一面，第一阻焊层（2）连接有LED灯（6）。柔性线路板基材（1）设置第二阻焊层（3）的一面包括设置第二阻焊层（3）的第一区域和未设置第二阻焊层（3）的第二区域且第二区域位于靠近导光板（5）的一侧。扩散片（4）靠近灯条的一端具有部分覆盖或完全覆盖第二区域的连接部。

Description

背光源、显示装置
相关申请的交叉引用
本申请主张在2015年3月26日在中国提交的中国专利申请号No.201520175601.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及液晶显示技术领域，尤其涉及一种背光源、显示装置。
背景技术
目前的背光源结构中，扩散片上具有覆盖于FPC(柔性电路板)上的第一区域，该区域与导光板之间往往具有缝隙，当被按压时会影响显示效果。
发明内容
为了解决上述技术问题，本公开提供一种背光源、显示装置，减小扩散片与导光板之间的缝隙，防止漏光。
为了达到上述目的，本公开采用的技术方案是：一种背光源，包括：
导光板；
设置于导光板出光侧的扩散片；
位于导光板入光侧的灯条，所述灯条包括LED灯和连接于LED灯的柔性线路板，所述柔性线路板包括：柔性线路板基材、分别设置于柔性线路板基材相对的两面的第一阻焊层和第二阻焊层，所述第一阻焊层设置于所述柔性线路板基材上靠近导光板的一面，所述第二阻焊层设置于所述柔性线路板基材上远离所述导光板的一面，所述第一阻焊层连接有LED灯；
所述柔性线路板基材设置所述第二阻焊层的一面包括设置所述第二阻焊层的第一区域和未设置所述第二阻焊层的第二区域，且所述第二区域位于靠近所述导光板的一侧；
所述扩散片靠近所述灯条的一端具有部分覆盖或完全覆盖所述第二区域的连接部。
进一步的，所述第二阻焊层上设有用于LED灯电连接的铜线层，所述铜线层的布线区的面积不大于所述第二阻焊层的面积。
进一步的，所述导光板靠近所述灯条的一端具有喇叭口结构，所述第一 阻焊层靠近导光板的一端位于导光板的喇叭口结构上方。
进一步的，所述喇叭口结构在导光板出光侧具有一斜面，所述第一阻焊层贴近所述斜面。
进一步的，所述喇叭口结构在与导光板出光侧相对的一侧为平面。
进一步的，所述第二阻焊层的厚度与所述扩散片的厚度相同。
进一步的，所述扩散片的厚度为0.04～0.055mm。
进一步的，所述第一阻焊层上设置有白油字符。
本公开还公开一种显示装置，包括上述的背光源。
本公开的有益效果是：第二阻焊层未完全覆盖柔性线路板基材，扩散片直接搭接于柔性线路板基材上，从而减小扩散片与导光板之间的厚度，以避免漏光。
附图说明
图1表示相关技术中背光源的结构示意图；
图2表示本公开实施例中背光源的结构示意图。
具体实施方式
以下结合附图对本公开的特征和原理进行详细说明，所举实施例仅用于解释本公开，并非以此限定本公开的保护范围。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
如图1所示，在相关技术的背光源结构中，扩散片上具有覆盖于FPC(柔性电路板)上的第一区域，所述柔性线路板包括：柔性线路板基材1、设置 于柔性线路板基材1相对的两面的第一阻焊层2和第二阻焊层3。所述第一阻焊层2连接有LED灯6，扩散片4搭接于第二阻焊层3上。但由于导光板5上对应于扩散片4的第一区域的位置呈喇叭口状设置，扩散片4的第一区域与导光板5之间具有缝隙，当按压FPC时，背光灯的灯前效果会随缝隙的减小而发生改变。
如图2所示，在一个实施例中，提供了一种背光源，包括：
导光板5；
设置于导光板5出光侧的扩散片4；
位于导光板5入光侧的灯条，
其中，灯条包括LED灯6和连接于LED灯6的柔性线路板，柔性线路板包括：柔性线路板基材1、分别设置于柔性线路板基材1相对的两面的第一阻焊层2和第二阻焊层3，第一阻焊层2设置于柔性线路板基材1上靠近导光板5的一面，第二阻焊层3设置于柔性线路板基材1上远离导光板5的一面，第一阻焊层2连接有LED灯6；
柔性线路板基材1设置所述第二阻焊层3的一面包括设置第二阻焊层3的第一区域和未设置第二阻焊层3的第二区域，且第二区域位于靠近导光板5的一侧；
扩散片4靠近灯条的一端具有部分覆盖或完全覆盖第二区域的连接部。
柔性线路板基材1包括设置第二阻焊层3的第一区域和未设置第二阻焊层3的第二区域，即第二阻焊层3未完全覆盖柔性线路板基材1。如图2所示，第二区域位于第一区域的一侧。相对于现有技术，本实施例中减小了第二阻焊层3从左至右方向上的长度(图2中所示方向)，扩散片4的连接部部分覆盖或完全覆盖第二区域，即扩散片4直接搭接于柔性线路板基材1上，从而减小扩散片4连接部与导光板5之间的厚度，实现按压柔性线路板不会改变灯前效果，从而避免由于扩散片4的连接部与导光板5之间的厚度造成的漏光。
可选的，第二阻焊层3上设有用于LED灯6电连接的铜线层(图中未示出)，铜线层的布线区的面积不大于第二阻焊层3的面积，使得第二阻焊层3面积的减小并不影响用于LED灯6电连接的铜线的走线。
可选的，导光板5靠近所述灯条的一端具有喇叭口结构51，第一阻焊层2靠近导光板5的一端位于导光板5的喇叭口结构51上方。
如图2所示，喇叭口结构51为导光板5位于扩散片4连接部下方的部分，喇叭口结构51靠近LED灯6的一端的厚度大于远离LED灯6的一端的厚度，呈敞口状，形状似喇叭。
上述喇叭口结构包括至少一个斜面，且该斜面位于导光板5的出光侧，喇叭口结构51在与导光板5出光侧相对的一侧可以为平面或斜面。
具体地，在一种实施例中，喇叭口结构51在导光板5出光侧具有一斜面，如图2所示，第一阻焊层2贴近该斜面。这样设计有利于LED灯6发出的光完全进入导光板内部，提高光的利用率。
而在另一种实施例中，喇叭口结构51在与导光板5出光侧相对的一侧为平面，这样不仅可以减薄背光源的厚度，还可以降低加工难度。
柔性线路板位于导光板5上方的部分的整体厚度的降低，使得柔性线路板更加柔软，可以更加紧密的贴附在导光板的喇叭口上。
可选的，第二阻焊层3的厚度与所述扩散片4的厚度相同。
可选的，扩散片4的厚度为0.04～0.055mm。
可选的，第一阻焊层2上设置有白油字符(图中未示出)，作为器件的标识。
本公开还公开一种显示装置，包括上述的背光源。
以上为本公开较佳实施例，需要说明的是，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开保护范围。

Claims (9)

  1. 一种背光源，包括：
    导光板；
    设置于导光板出光侧的扩散片；
    位于导光板入光侧的灯条，
    其中，所述灯条包括LED灯和连接于LED灯的柔性线路板，所述柔性线路板包括：柔性线路板基材、分别设置于柔性线路板基材相对的两面的第一阻焊层和第二阻焊层，所述第一阻焊层设置于所述柔性线路板基材上靠近导光板的一面，所述第二阻焊层设置于所述柔性线路板基材上远离导光板的一面，所述第一阻焊层连接有LED灯；
    其中，所述柔性线路板基材设置所述第二阻焊层的一面包括设置所述第二阻焊层的第一区域和未设置所述第二阻焊层的第二区域，且所述第二区域位于靠近所述导光板的一侧；
    所述扩散片靠近所述灯条的一端具有部分覆盖或完全覆盖所述第二区域的连接部。
  2. 根据权利要求1所述的背光源，其中，所述第二阻焊层上设有用于LED灯电连接的铜线层，所述铜线层的布线区的面积不大于所述第二阻焊层的面积。
  3. 根据权利要求1所述的背光源，其中，所述导光板靠近所述灯条的一端具有喇叭口结构，所述第一阻焊层靠近导光板的一端位于导光板的喇叭口结构上方。
  4. 根据权利要求3所述的背光源，其中，所述喇叭口结构在导光板出光侧具有一斜面，所述第一阻焊层贴近所述斜面。
  5. 根据权利要求3或4所述的背光源，其中，所述喇叭口结构在与导光板出光侧相对的一侧为平面。
  6. 根据权利要求1所述的背光源，其中，所述第二阻焊层的厚度与所述扩散片的厚度相同。
  7. 根据权利要求1或6所述的背光源，其中，所述扩散片的厚度为 0.04～0.055mm。
  8. 根据权利要求1所述的背光源，其中，所述第一阻焊层上设置有白油字符。
  9. 一种显示装置，包括权利要求1-8任一项所述的背光源。
PCT/CN2015/086254 2015-03-26 2015-08-06 背光源、显示装置 WO2016150067A1 (zh)

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US14/908,498 US10338293B2 (en) 2015-03-26 2015-08-06 Backlight source and display device

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CN201520175601.6 2015-03-26
CN201520175601.6U CN204466035U (zh) 2015-03-26 2015-03-26 一种背光源、显示装置

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