WO2016143586A1 - Joined structure production method, joined structure, and laser device - Google Patents

Joined structure production method, joined structure, and laser device Download PDF

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Publication number
WO2016143586A1
WO2016143586A1 PCT/JP2016/056090 JP2016056090W WO2016143586A1 WO 2016143586 A1 WO2016143586 A1 WO 2016143586A1 JP 2016056090 W JP2016056090 W JP 2016056090W WO 2016143586 A1 WO2016143586 A1 WO 2016143586A1
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WO
WIPO (PCT)
Prior art keywords
laser
concave portion
manufacturing
joining
metal member
Prior art date
Application number
PCT/JP2016/056090
Other languages
French (fr)
Japanese (ja)
Inventor
和義 西川
Original Assignee
オムロン株式会社
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Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2016143586A1 publication Critical patent/WO2016143586A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B29C65/1661—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning repeatedly, e.g. quasi-simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/118—Single monotone curved joints
    • B29C66/1182—Single monotone curved joints the joint being C-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1244—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue
    • B29C66/12443—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue having the tongue substantially in the middle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12463—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being tapered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/126—Tenon and mortise joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/301—Three-dimensional joints, i.e. the joined area being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/939—Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079—Liquid crystals

Definitions

  • the present invention relates to a method for manufacturing a bonded structure, a bonded structure, and a laser device.
  • Patent Document 1 is known as a document describing a three-dimensional laser processing machine.
  • Patent Document 1 discloses a three-dimensional laser processing machine that performs high-precision laser processing on a workpiece by setting the focal position of laser light applied to the workpiece to a predetermined position.
  • 3D shape measuring device that measures the 3D shape of the 3D laser processing that sets the focal position of the laser beam based on the 3D shape data of the workpiece measured by the 3D shape measuring device A machine is disclosed.
  • laser processing is performed by setting the distance between the laser beam and the workpiece based on the three-dimensional shape data of the workpiece measured by the three-dimensional shape measuring instrument. Can do.
  • FIG. 15A is a schematic diagram illustrating a conventional laser processing method
  • FIG. 15B is an explanatory diagram illustrating a workpiece processed by the conventional laser processing method.
  • the present invention has been made in view of the above points, and its object is to provide a laser device capable of suppressing energy loss in laser processing, and a bonded structure manufactured using the laser device, Another object of the present invention is to provide a method for manufacturing the joined structure.
  • the present invention is configured as follows.
  • the method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure including a bonding process in which a second member is opposed to a first member and bonded to the first member.
  • a concave portion forming step of forming a concave portion filled with the second member on a joint surface of one member is provided, and the concave portion forming step is a processing laser for forming a concave portion on the first member.
  • the first member is rotated so that the bonding surface of the first member is perpendicular to the irradiation direction.
  • the laser irradiation may be performed while adjusting a focal position with respect to a bonded surface of the first member.
  • the bonding step is such that the bonding surface is perpendicular to the irradiation direction of a bonding laser for bonding the first member and the second member.
  • the first member and the second member may be rotated.
  • a surface of the first member facing the second member may be a convex shape.
  • the concave portion in the method for manufacturing the bonded structure, in the concave portion forming step, may be formed by irradiating a laser beam in which one pulse includes a plurality of subpulses.
  • a metal, a thermoplastic resin, or a thermosetting resin may be used for the first member.
  • a resin that transmits laser light may be used for the second member.
  • the bonded structure according to the present invention is manufactured by the above-described method for manufacturing a bonded structure.
  • the laser apparatus includes a laser that irradiates a laser beam toward the irradiated member, and a rotating unit that rotates the irradiated member so that the irradiated member is perpendicular to the irradiation direction of the laser.
  • the laser irradiates a laser beam in which one pulse is composed of a plurality of sub-pulses.
  • the present invention it is possible to provide a laser device capable of suppressing energy loss in laser processing, a bonded structure manufactured using the laser device, and a method for manufacturing the bonded structure.
  • FIG. 1 is an explanatory diagram for explaining the configuration of a laser device
  • FIGS. 2 and 3 are explanatory diagrams for explaining a concave portion forming process
  • FIGS. 4 to 7 are explanatory diagrams for explaining a joining process
  • FIG. It is a perspective view of a junction structure.
  • the laser apparatus 10 includes a laser that irradiates a target member with laser, a scanning unit 12, a position adjusting unit 13, and a rotating unit 14 (see FIG. 1).
  • the irradiated member is, for example, a first member (metal member 2) or a second member (resin member 3) in the case of a bonded structure according to the present invention described later.
  • a processing laser 11a for processing the metal member 2 can be given.
  • a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, or an excimer laser can be selected.
  • a fiber laser, a YAG laser, a second harmonic of a YAG laser, a YVO 4 laser, and a semiconductor laser are preferable.
  • a laser capable of pulse oscillation may be used according to the processing shape of the metal member 2, and one pulse may be composed of a plurality of subpulses.
  • the scanning unit 12 scans the laser beam irradiated from the processing laser 11a in the horizontal direction (X direction and Y direction in FIG. 1) with respect to the irradiation surface of the irradiated member (metal member 2 or resin member 3). It is. As an example, there is a means for scanning the irradiated member in the horizontal direction using a galvano mirror and a telecentric f ⁇ lens.
  • the scanning means 12 can scan the laser beam incident from the processing laser 11a within the scanning range A (see FIG. 1), and emits it in a parallel state.
  • the laser beam scanning may be performed by the position adjusting unit 13 as described later.
  • the position adjusting means 13 adjusts the focal position of the laser beam from the processing laser 11a.
  • the focal position of the laser beam is adjusted by operating a stage 14a described later in the vertical direction.
  • the position adjusting means 13 is not limited to the vertical operation, and the stage 14a may be operated in the horizontal direction. Thereby, even if it is the range exceeding the scanning range A of a galvanometer mirror, a laser beam can be irradiated perpendicularly
  • the position adjusting means 13 is not limited to the above-described form, and the processing laser 11a itself may be operated in the vertical or horizontal direction.
  • the rotating means 14 rotates the irradiated member so that the irradiated member (metal member 2 or resin member 3) is perpendicular to the irradiation direction of the laser beam emitted from the processing laser 11a.
  • a stage 14a on which the irradiated member is placed and a rotating shaft 14b for rotating the stage 14a are provided (see FIG. 1).
  • the rotation shaft 14b can be rotated around the X axis and can also be rotated around the Y axis.
  • the rotating unit 14 and the position adjusting unit 13 may be controlled so as to perform laser processing by irradiating a desired position with laser light in synchronization with the scanning speed of the scanning unit 12 described above.
  • the laser device 10 has been described with respect to the embodiment in which the laser is the processing laser 11a (FIG. 1).
  • the laser 11 for bonding is used instead of the processing laser 11a.
  • the bonding laser 11b is, for example, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide laser, or an excimer laser.
  • the manufacturing method of the bonded structure according to the present embodiment is a method of manufacturing a bonded structure in which the second member is opposed to the first member and bonded, and includes a concave portion forming step and a bonding step. .
  • the first member is the metal member 2, and examples of the metal include iron-based metal, stainless-based metal, copper-based metal, aluminum-based metal, magnesium-based metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
  • the surface of the first member (metal member 2) that faces a second member (resin member 3) to be described later has a convex shape.
  • the convex shape of this embodiment is a curved surface.
  • the second member is the resin member 3, which is a thermoplastic resin or a thermosetting resin.
  • thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid
  • TPE thermoplastic elastomer
  • examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
  • thermosetting resins examples include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
  • a filler may be added to the thermoplastic resin and the thermosetting resin.
  • the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
  • the second member is preferably made of a material that transmits laser light when the laser beam is irradiated from above the resin member 3 in the joining step described later.
  • the transmittance is 3 mm. Sometimes it is preferably 15% or more.
  • the resin member 3 may not have laser transmittance. .
  • the surface (bonding surface BP) facing the metal member 2 in the resin member 3 has a concave shape corresponding to the curved surface of the metal member 2 described above.
  • a concave part formation process is a process of forming the concave part o by which the resin member 3 is filled in the joint surface BP in the metal member 2, and uses the laser apparatus 10 provided with the processing laser 11a. Done.
  • the processing laser 11a a fiber laser marker MXZ2000 or MX-Z2050 manufactured by OMRON can be cited.
  • the metal member 2 is placed on the stage 14a (see FIG. 1). And in this embodiment, in order to form the recessed part o in the joint surface BP of the metal member 2 in the position exceeding the scanning range A of the scanning means 12, the position where the recessed part o is formed by the position adjusting means 13 is the scanning range. The stage 14a is moved so as to enter A.
  • the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the processing laser 11a is irradiated perpendicularly to the joint surface BP of the metal member 2 (see FIG. 2). Specifically, by rotating the stage 14a so that the tangent of the formation part of the concave part o on the joint surface BP of the metal member 2 faces the horizontal direction, the laser beam is perpendicular to the formation part of the concave part o. Can be irradiated.
  • the position adjusting means 13 adjusts the focal position of the laser light emitted from the processing laser 11 a to the bonding surface BP of the metal member 2. That is, by moving the stage 14a up and down, the location where the concave portion o is formed on the joint surface BP of the metal member 2 is moved to the focal position of the laser beam.
  • pulse light (preferably sub-pulse light) is irradiated as laser light from the processing laser 11a to a position where the concave portion o in the metal member 2 is formed.
  • the fiber laser marker made by OMRON it is possible to irradiate a laser beam in which one pulse is composed of a plurality of sub-pulses. For this reason, the energy of the laser beam is easily concentrated in the depth direction, which is suitable for forming the concave portion o.
  • the metal member 2 when the metal member 2 is irradiated with a laser beam, the metal member 2 is locally melted to advance the formation of the concave portion o. At this time, since the laser beam is composed of a plurality of sub-pulses, the molten metal member 2 is not easily scattered and easily deposited in the vicinity of the concave portion o. Then, as the formation of the concave portion o proceeds, the molten metal member 2 is deposited inside the concave portion o, so that a protruding portion t protruding inward is formed on the inner peripheral surface of the concave portion o. .
  • the projecting portion t is formed at a position near the opening of the concave portion o, but may be formed at the opening end depending on the processing conditions by the fiber laser marker, or may be near the bottom of the concave portion o. It may be formed.
  • one period of the subpulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the concave portion o having the protruding portion t.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the concave portion o having the protruding portion t.
  • the opening diameter of the concave portion o is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because if the opening diameter is less than 30 ⁇ m, the laser beam from the irradiated bonding laser 11b (see FIG. 4) is not sufficiently confined in the concave portion o in the bonding step described later, and the energy of the laser beam is reduced. This is because the conversion efficiency for conversion into heat may be reduced. On the other hand, if the opening diameter exceeds 100 ⁇ m, the number of concave portions o per unit area decreases, and conversion efficiency for converting the energy of the laser light into heat may decrease.
  • the depth of the concave portion o is preferably 10 ⁇ m or more. This is because if the depth is less than 10 ⁇ m, the conversion efficiency for converting the energy of laser light from the bonding laser 11b described later into heat may be reduced. In the present embodiment, for example, the processing depth of the concave portion o is 43 ⁇ m to 45 ⁇ m.
  • the second concave portion o is formed in the metal member 2.
  • the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13, The concave portion o is formed.
  • the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above.
  • the concave portion o is formed by raising and lowering.
  • the metal member 2 is moved so that the tangent of the formation portion of the concave portion o on the joint surface BP of the metal member 2 faces the horizontal direction, and the formation portion of the concave portion o is moved to the focal position of the laser beam. Then, the laser beam is irradiated. That is, it is possible to make the incident angle of the laser beam constant with respect to the bonding surface BP that is a curved surface.
  • FIG. 3 schematically illustrates a state in which the third concave portion o is formed.
  • the interval between the concave portions o (the distance between the center of the predetermined concave portion o and the center of the concave portion o adjacent to the predetermined concave portion o) is preferably 200 ⁇ m or less. This is because when the interval between the concave portions o exceeds 200 ⁇ m, the number of the concave portions o per unit area decreases, and the conversion efficiency for converting the energy of laser light from the bonding laser 11b described later into heat decreases. This is because there are cases.
  • An example of the lower limit of the interval between the concave portions o is a distance at which the concave portions o are not overlapped and crushed.
  • the interval of the recessed part o is an equal interval. This is because when the concave portions o are equally spaced, the heat distribution when the bonding laser light is irradiated is isotropic.
  • the laser beam can be irradiated in a direction perpendicular to the laser beam irradiation surface (bonding surface BP) in the metal member 2, unlike the conventional technique shown in FIG. 15B,
  • the metal member 2 can be processed while suppressing energy loss corresponding to the reflected light.
  • the term “perpendicular to the bonding surface BP of the metal member 2” does not require the angle between the bonding surface BP and the laser light to be strictly 90 °, and is in the range of 80 ° to 100 °. I just need it. If it is the said range, the energy loss equivalent to reflected light can be reduced.
  • Laser Fiber laser (wavelength 1062nm) Frequency: 10kHz Output: 3.8W Scanning speed: 650mm / sec Number of scans: 40 times Irradiation interval: 65 ⁇ m Number of subpulses: 20
  • the bonding process is a process of bonding the metal member 2 and the resin member 3 to each other, and is performed using the laser device 10 including the bonding laser 11b described above.
  • the present invention is not limited to this mode, and the resin member 3 is heated and melted with a heater or the like, or the metal member 2 is bonded.
  • a method of insert molding using a mold that accommodates the material may be used.
  • the laser beam from the bonding laser 11b is irradiated to the bonding surface BP between the translucent resin member 3 and the metal member 2, and the metal member 2 is heated to come into contact with the metal member 2.
  • a method of transferring heat to the existing resin member 3 and melting and bonding the resin member 3 will be described.
  • the melted resin member 3 is filled in the concave portion o of the metal member 2 and solidified, whereby the metal member 2 and the resin member 3 are mechanically joined.
  • the resin member 3 is placed on the joint surface BP of the metal member 2 placed on the stage 14a (see FIG. 4). Then, the resin member 3 is brought into pressure contact with the joint surface BP of the metal member 2. Further, since the resin member 3 is filled in the concave portion o of the metal member 2 at a position exceeding the scanning range A (see FIG. 5) of the scanning means 12, the position adjusting means 13 scans the position where the concave portion o is formed. The stage 14a is moved so as to fall within the range A.
  • the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the bonding laser 11b is irradiated perpendicularly to the bonding surface BP of the metal member 2 (see FIG. 6). Specifically, the stage 14a is rotated so that the tangent of the laser irradiation spot on the joint surface BP of the metal member 2 faces the horizontal direction.
  • the position adjusting means 13 adjusts the focal position of the laser light emitted from the bonding laser 11b on the bonding surface BP of the metal member 2. That is, by moving the stage 14a up and down, the bonding surface BP of the metal member 2 is moved to the focal position of the laser beam for bonding.
  • the laser beam from the bonding laser 11b is irradiated to the bonding surface BP of the metal member 2 by continuous oscillation.
  • the energy of the laser light is converted into heat inside the metal member 2 and the surface temperature of the metal member 2 is increased.
  • the resin member 3 in the vicinity of the surface of the metal member 2 is melted, and the resin member 3 is filled in the concave portion o.
  • the laser beam from the bonding laser 11b is scanned by the scanning unit 12 and the laser beam is continuously oscillated, the heat in the metal member 2 is prevented from diffusing and the temperature is lowered, and the efficiency is improved.
  • the temperature of the metal member 2 can be increased by storing heat.
  • the second concave portion o is filled with the resin member 3.
  • the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13 to form a concave shape.
  • the portion o is filled with the resin member 3.
  • the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above.
  • the concave member o is filled with the resin member 3 by moving up and down. For this reason, the laser beam for bonding is scanned along the bonding surface BP from a direction perpendicular to the bonding surface BP of the metal member 2.
  • FIG. 7 schematically illustrates a state where the third concave portion o is filled with the resin member 3).
  • the metal member 2 and the resin member 3 are reflected by filling the resin member 3 into the concave portion o formed in the direction perpendicular to the joining surface BP in the concave portion forming step.
  • a bonded structure 1 (see FIG. 8) bonded with suppressing energy loss due to light can be manufactured.
  • the focal position of the laser beam is adjusted by the position adjusting means 13 while the concave portion o is filled with the resin member 3, the bonded structure 1 in which the bonding variation due to the shift of the focal length is reduced is manufactured. be able to.
  • the direction in which the concave portion o as in the prior art of FIG. 15B is formed is one direction.
  • An anchor effect can be heightened compared with what is prepared. Therefore, it is possible to manufacture the bonded structure 1 in which the bonding strength between the metal member 2 and the resin member 3 is improved. This will be described in detail in the experimental example of the first embodiment.
  • Laser Semiconductor laser (wavelength 808 nm)
  • Oscillation mode Continuous oscillation output: 30W
  • Focal diameter 4mm Scanning speed: 1mm / sec
  • Contact pressure 0.6 MPa
  • the evaluation of the bonding strength performed for confirming the effect of the first embodiment described above will be described while comparing an example corresponding to the first embodiment and a comparative example.
  • the material of the resin member was PMMA
  • the material of the metal member was SUS304.
  • the above-described concave portion forming step and the bonding step were performed to manufacture a bonded structure (see, for example, FIG. 6).
  • the processing laser is not irradiated perpendicularly to the joint surface of the metal member in the above-described concave portion forming step (see, for example, FIGS. 15A and 15B). That is, as described in FIGS. 15A and 15B, the bonded structure of the comparative example generates reflected light R when the metal member is irradiated with laser light. The energy of the laser light corresponding to the reflected light R is generated. Therefore, the concave portion of the metal member is processed shallower than the setting.
  • the direction in which each concave portion is formed is aligned in one direction. That is, the formation angle of the concave portion with respect to the joint surface in the metal member is not constant.
  • the evaluation of the bonding strength of the bonding structures according to the above-described examples and the bonding structures according to the comparative examples was performed by a thermal shock test using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, a thermal shock of one cycle of 1 hour of 30 minutes in an environment of ⁇ 40 ° C. and 30 minutes in an environment of 85 ° C. was continued to be applied to the examples and comparative examples until the bonding interface reached peeling.
  • the confirmation as to whether or not the bonding interface had peeled was performed after applying thermal shocks of 100, 250, 500, 750, 1000, 1500 cycles (times). And when the joining interface reached peeling in a certain cycle, the cycle in which peeling of the previous joining interface was not confirmed was adopted as the thermal shock test resistance. For example, when peeling of the bonding interface was confirmed after 1000 thermal shocks were applied, the previous 750 times were regarded as thermal shock test resistance. Table 1 shows the thermal shock test resistance obtained for the examples and comparative examples.
  • the bonded structures of the examples according to the present invention were confirmed to be peeled after 1500 cycles of the thermal shock test, and thus the thermal shock test resistance was 1000 cycles.
  • the thermal shock test resistance was 250 cycles.
  • the bonded structure according to the example had improved thermal shock test resistance as compared with the comparative example.
  • FIGS. 9 and 10 are explanatory diagrams for explaining the concave portion forming step in the manufacturing method of the bonded structure
  • FIGS. 11 to 13 are explanatory diagrams for explaining the bonding step in the manufacturing method of the bonded structure
  • FIG. It is a perspective view of a junction structure.
  • the manufacturing method of the bonded structure according to the present embodiment is a method of manufacturing a bonded structure in which the second member is opposed to the first member and bonded, and includes a concave portion forming step and a bonding step. .
  • a surface (bonding surface BP ′) that faces a second member (resin member 3 ′), which will be described later, in the first member (metal member 2 ′) has a convex shape.
  • a bulged rectangular bulging portion B ′ is provided. Further, the side peripheral surface of the bulging portion B ′ is an inclined surface TP ′.
  • the surface of the resin member 3 ′ facing the metal member 2 ′ has a concave shape corresponding to the bulging portion B ′ of the metal member 2 ′ described above.
  • metal member 2 ' is mounted in the stage 14a of the rotation means 14. As shown in FIG. In this embodiment, since the concave portion o is formed on the joint surface BP ′ of the metal member 2 ′ at a position exceeding the scanning range A of the scanning means 12, the position where the concave portion o is formed by the position adjusting means 13. The stage 14a is moved so as to fall within the scanning range A.
  • the stage 14a is rotated by the rotating shaft 14b so that the rotating shaft 14b irradiates the laser beam from the processing laser 11a perpendicularly to the joint surface BP ′ of the metal member 2 ′ (see FIG. 9). ).
  • the stage 14a is finely adjusted by the rotating shaft 14b.
  • the position adjusting means 13 adjusts the position of the focal position of the laser light emitted from the processing laser 11a on the joining surface BP ′ of the metal member 2 ′. That is, by moving the stage 14a up and down, the location where the concave portion o is formed on the joint surface BP ′ of the metal member 2 ′ is moved to the focal position of the laser beam.
  • pulse light (preferably sub-pulse light) is irradiated as a laser beam from the processing laser 11a to a position where the concave portion o in the metal member 2 ′ is formed.
  • the second concave portion o is formed on the metal member 2 ′.
  • the stage 14a is rotated by the rotating shaft 14b and the position adjusting unit 13 as described above.
  • the concave portion o is formed by moving up and down.
  • the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above.
  • the concave portion o is formed by raising and lowering.
  • FIG. 10 schematically illustrates a state in which the second concave portion o is formed.
  • a joining process is a process of joining metal member 2 'and resin member 3' mutually, and is performed using laser device 10 provided with laser 11b for joining mentioned above.
  • the laser beam from the bonding laser 11b is applied to the bonding surface BP ′ between the translucent resin member 3 ′ and the metal member 2 ′, and the metal member 2 ′ is heated to thereby heat the metal member 2 ′.
  • a method for transferring heat to the resin member 3 ′ in contact with ′ and melting and bonding the resin member 3 ′ will be described.
  • the resin member 3 ′ is placed on the joint surface BP ′ of the metal member 2 ′ placed on the stage 14a (see FIG. 11). Then, the resin member 3 is brought into pressure contact with the joint surface BP of the metal member 2. Further, since the resin member 3 ′ is filled in the concave portion o of the metal member 2 ′ at a position exceeding the scanning range A of the scanning means 12, the position where the concave portion o is formed by the position adjusting means 13 is within the scanning range. The stage 14a is moved to enter.
  • the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the bonding laser 11b is irradiated perpendicularly to the bonding surface BP ′ of the metal member 2 ′.
  • the resin member 3 ′ is filled in the concave portion o of the substantially horizontal plane (outer edge portion of the bulging portion B ′) of the metal member 2 ′, so that the laser is perpendicular to the metal member 2 ′.
  • the stage 14a is finely adjusted by the rotating shaft 14b so that light is irradiated (see FIG. 12).
  • the position adjusting means 13 adjusts the focal position of the laser light emitted from the bonding laser 11b on the bonding surface BP ′ of the metal member 2 ′. That is, by moving the stage 14a up and down, the joining surface BP 'of the metal member 2' is moved to the focal position of the joining laser beam.
  • the laser beam from the bonding laser 11b is irradiated to the bonding surface BP ′ of the metal member 2 ′ by continuous oscillation.
  • the energy of the laser beam is converted into heat inside the metal member 2 ′.
  • the surface temperature of ′ becomes high. Thereby, the resin member 3 ′ in the vicinity of the surface of the metal member 2 ′ is melted, and the resin member 3 ′ is filled in the concave portion o.
  • the second concave portion o is filled with the resin member 3 ′.
  • the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 is moved up and down. Then, the concave portion o is filled with the resin member 3 ′.
  • the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above.
  • the concave portion o is filled with the resin member 3 ′ by moving up and down. For this reason, the laser beam for bonding is scanned along the bonding surface BP ′ from a direction perpendicular to the bonding surface BP ′ of the metal member 2 ′.
  • FIG. 13 schematically illustrates a state in which the second concave portion o is filled with the resin member 3 ′).
  • the metal member 2 ′ and the resin member 3 ′ are filled by filling the resin member 3 ′ in the concave portion o formed in the direction perpendicular to the bonding surface BP ′ in the concave portion formation step.
  • Can be manufactured see FIG. 14).
  • the first member may be a thermoplastic resin or a thermosetting resin
  • the second member may be a metal

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Abstract

A joined structure production method that is provided with: a joining step wherein a first member (2) and a second member are brought into opposition and joined; and a recessed part forming step wherein, before the joining step, a recessed part (o) that is to be filled with the second member is formed in a joining surface of the first member (2). In the recessed part forming step, the first member (2) is rotated such that the joining surface of the first member (2) is perpendicular to the irradiation direction of a machining laser (11a) that forms the recessed part (o) in the first member (2).

Description

接合構造体の製造方法、接合構造体、及びレーザ装置Bonding structure manufacturing method, bonding structure, and laser apparatus
　本発明は、接合構造体の製造方法、接合構造体、及びレーザ装置に関する。 The present invention relates to a method for manufacturing a bonded structure, a bonded structure, and a laser device.
　従来から、三次元レーザ加工機が記載された文献として、特許文献１が知られている。 Conventionally, Patent Document 1 is known as a document describing a three-dimensional laser processing machine.
　特許文献１には、被加工物に照射されるレーザ光の焦点位置を所定位置に設定することにより、被加工物に高精度なレーザ加工を施す三次元レーザ加工機であって、被加工物の三次元形状を測定する三次元形状測定器が備えられており、三次元形状測定器によって測定した被加工物の三次元形状データに基づいて、レーザ光の焦点位置を設定する三次元レーザ加工機が開示されている。 Patent Document 1 discloses a three-dimensional laser processing machine that performs high-precision laser processing on a workpiece by setting the focal position of laser light applied to the workpiece to a predetermined position. 3D shape measuring device that measures the 3D shape of the 3D laser processing that sets the focal position of the laser beam based on the 3D shape data of the workpiece measured by the 3D shape measuring device A machine is disclosed.
　この三次元レーザ加工機によれば、三次元形状測定器によって測定した被加工物の三次元形状データに基づいて、レーザ光と被加工物との間の距離を設定してレーザ加工を施すことができる。 According to this three-dimensional laser processing machine, laser processing is performed by setting the distance between the laser beam and the workpiece based on the three-dimensional shape data of the workpiece measured by the three-dimensional shape measuring instrument. Can do.
特開２０１４－１３３２４８号公報JP 2014-133248 A
　しかしながら、特許文献１の三次元レーザ加工機で被加工物をレーザ加工すると、次のような不都合があった。以下、この点について図１５Ａ及び図１５Ｂを参照しながら説明する。図１５Ａは、従来のレーザ加工方法を示す模式図、図１５Ｂは、従来のレーザ加工方法で加工された被加工物を説明する説明図である。 However, when the workpiece is laser processed with the three-dimensional laser processing machine of Patent Document 1, there are the following disadvantages. This point will be described below with reference to FIGS. 15A and 15B. FIG. 15A is a schematic diagram illustrating a conventional laser processing method, and FIG. 15B is an explanatory diagram illustrating a workpiece processed by the conventional laser processing method.
　特許文献１のレーザ加工方法では、被加工物２００におけるレーザ照射面が例えば凸面２１０である場合、加工用レーザＬからのレーザ光を被加工物２００に向けて照射すると、凸面２１０によって反射光Ｒが生じる。このように反射光Ｒが発生すると、反射光Ｒに相当するエネルギー損失が生じるため、被加工物２００の凹状部２２０の加工深さが設定よりも浅く加工される問題があった。 In the laser processing method of Patent Document 1, when the laser irradiation surface of the workpiece 200 is, for example, the convex surface 210, when the laser light from the processing laser L is irradiated toward the workpiece 200, the reflected light R is reflected by the convex surface 210. Occurs. When the reflected light R is generated in this way, an energy loss corresponding to the reflected light R occurs, so that there is a problem that the processing depth of the concave portion 220 of the workpiece 200 is processed to be shallower than the setting.
　本発明は、かかる点に鑑みてなされたものであり、その目的とするところは、レーザ加工においてエネルギー損失を抑制することができるレーザ装置及び、このレーザ装置を用いて製造された接合構造体、並びにこの接合構造体の製造方法を提供することにある。 The present invention has been made in view of the above points, and its object is to provide a laser device capable of suppressing energy loss in laser processing, and a bonded structure manufactured using the laser device, Another object of the present invention is to provide a method for manufacturing the joined structure.
　上記目的を達するために、本発明は次のとおりの構成としている。 In order to achieve the above object, the present invention is configured as follows.
　本発明に係る接合構造体の製造方法は、第１部材に第２部材を対峙させて接合する接合工程を備えた接合構造体の製造方法であって、前記接合工程を行う前に、前記第１部材における接合面に前記第２部材が充填される凹状部を形成する凹状部形成工程が備えられており、前記凹状部形成工程は、前記第１部材に凹状部を形成する加工用レーザの照射方向に対して、前記第１部材の接合面が垂直となるように、前記第１部材を回転させて行われることを特徴とする。 The method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure including a bonding process in which a second member is opposed to a first member and bonded to the first member. A concave portion forming step of forming a concave portion filled with the second member on a joint surface of one member is provided, and the concave portion forming step is a processing laser for forming a concave portion on the first member. The first member is rotated so that the bonding surface of the first member is perpendicular to the irradiation direction.
　また、上記接合構造体の製造方法であって、前記レーザ照射は、前記第１部材の接合面に対して焦点位置を調整しながら行われてもよい。 Further, in the manufacturing method of the bonded structure, the laser irradiation may be performed while adjusting a focal position with respect to a bonded surface of the first member.
　また、上記接合構造体の製造方法であって、前記接合工程は、前記第１部材と前記第２部材とを接合させる接合用レーザの照射方向に対して、前記接合面が垂直となるように、前記第１部材及び前記第２部材を回転させて行われてもよい。 Further, in the manufacturing method of the bonded structure, the bonding step is such that the bonding surface is perpendicular to the irradiation direction of a bonding laser for bonding the first member and the second member. The first member and the second member may be rotated.
　また、上記接合構造体の製造方法であって、前記第１部材における前記第２部材と対峙される面は、凸形状であってもよい。 Further, in the method for manufacturing the joint structure, a surface of the first member facing the second member may be a convex shape.
　また、上記接合構造体の製造方法であって、前記凹状部形成工程では、１パルスが複数のサブパルスで構成されるレーザ光を照射することによって前記凹状部を形成してもよい。 Further, in the method for manufacturing the bonded structure, in the concave portion forming step, the concave portion may be formed by irradiating a laser beam in which one pulse includes a plurality of subpulses.
　また、上記接合構造体の製造方法であって、前記第１部材には、金属、熱可塑性樹脂、又は、熱硬化性樹脂が用いられていてもよい。 Further, in the method for manufacturing the bonded structure, a metal, a thermoplastic resin, or a thermosetting resin may be used for the first member.
　また、上記接合構造体の製造方法であって、前記第２部材には、レーザ光を透過する樹脂が用いられていてもよい。 Further, in the method for manufacturing the bonded structure, a resin that transmits laser light may be used for the second member.
　本発明に係る接合構造体は、上記接合構造体の製造方法によって製造されたことを特徴とする。 The bonded structure according to the present invention is manufactured by the above-described method for manufacturing a bonded structure.
　本発明に係るレーザ装置は、被照射部材に向けてレーザ光を照射するレーザと、前記レーザの照射方向に対して前記被照射部材が垂直となるように、前記被照射部材を回転させる回転手段と、が備えられており、前記レーザは、１パルスが複数のサブパルスで構成されるレーザ光を照射することを特徴とする。 The laser apparatus according to the present invention includes a laser that irradiates a laser beam toward the irradiated member, and a rotating unit that rotates the irradiated member so that the irradiated member is perpendicular to the irradiation direction of the laser. The laser irradiates a laser beam in which one pulse is composed of a plurality of sub-pulses.
　本発明によれば、レーザ加工においてエネルギー損失を抑制することができるレーザ装置及び、このレーザ装置を用いて製造された接合構造体、並びにこの接合構造体の製造方法を提供することができる。 According to the present invention, it is possible to provide a laser device capable of suppressing energy loss in laser processing, a bonded structure manufactured using the laser device, and a method for manufacturing the bonded structure.
本発明に係るレーザ装置の構成を説明する説明図である。It is explanatory drawing explaining the structure of the laser apparatus based on this invention. 本発明に係る接合構造体の製造方法における凹状部形成工程を説明する説明図である。It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the joining structure which concerns on this invention. 本発明に係る接合構造体の製造方法における凹状部形成工程を説明する説明図である。It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the joining structure which concerns on this invention. 本発明に係る接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. 本発明に係る接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. 本発明に係る接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. 本発明に係る接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the joining structure which concerns on this invention. 本発明に係る接合構造体の斜視図である。It is a perspective view of the junction structure concerning the present invention. 本発明に係る他の接合構造体の製造方法における凹状部形成工程を説明する説明図である。It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the other joining structure which concerns on this invention. 本発明に係る他の接合構造体の製造方法における凹状部形成工程を説明する説明図である。It is explanatory drawing explaining the recessed part formation process in the manufacturing method of the other joining structure which concerns on this invention. 本発明に係る他の接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the other joined structure which concerns on this invention. 本発明に係る他の接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the other joined structure which concerns on this invention. 本発明に係る他の接合構造体の製造方法における接合工程を説明する説明図である。It is explanatory drawing explaining the joining process in the manufacturing method of the other joined structure which concerns on this invention. 本発明に係る他の接合構造体の斜視図である。It is a perspective view of the other junction structure concerning the present invention. 従来のレーザ加工方法を示す模式図である。It is a schematic diagram which shows the conventional laser processing method. 従来のレーザ加工方法で加工された被加工物を説明する説明図である。It is explanatory drawing explaining the to-be-processed object processed with the conventional laser processing method.
　以下、本発明に係るレーザ装置の実施形態を説明した後に、当該レーザ装置を用いた接合構造体の製造方法の実施形態について説明する。なお、本発明に係る接合構造体の説明は、接合構造体の製造方法の説明を以ってこれに代える。 Hereinafter, after describing an embodiment of a laser apparatus according to the present invention, an embodiment of a method for manufacturing a bonded structure using the laser apparatus will be described. In addition, description of the joining structure which concerns on this invention replaces with this by description of the manufacturing method of a joining structure.
　図１は、レーザ装置の構成を説明する説明図、図２及び図３は、凹状部形成工程を説明する説明図、図４～図７は、接合工程を説明する説明図、図８は、接合構造体の斜視図である。 FIG. 1 is an explanatory diagram for explaining the configuration of a laser device, FIGS. 2 and 3 are explanatory diagrams for explaining a concave portion forming process, FIGS. 4 to 7 are explanatory diagrams for explaining a joining process, and FIG. It is a perspective view of a junction structure.
　［レーザ装置］
　本発明に係るレーザ装置１０は、被照射部材に向けてレーザ照射するレーザと、走査手段１２と、位置調整手段１３と、回転手段１４と、が備えられている（図１参照）。 [Laser device]
The laser apparatus 10 according to the present invention includes a laser that irradiates a target member with laser, a scanning unit 12, a position adjusting unit 13, and a rotating unit 14 (see FIG. 1).
　被照射部材は、例えば、後述する本発明に係る接合構造体の場合では、第１部材（金属部材２）又は第２部材（樹脂部材３）である。 The irradiated member is, for example, a first member (metal member 2) or a second member (resin member 3) in the case of a bonded structure according to the present invention described later.
　レーザは、一例として、金属部材２を加工する加工用レーザ１１ａが挙げられる。加工用レーザ１１ａの種類としては、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択できる。レーザの波長を考慮すると、ファイバレーザ、ＹＡＧレーザ、ＹＡＧレーザの第２高調波、ＹＶＯ４レーザ、半導体レーザが好ましい。さらに、金属部材２の加工形状に応じて、パルス発振可能なレーザであってもよく、さらには、１パルスが複数のサブパルスで構成されていてもよい。 As an example of the laser, a processing laser 11a for processing the metal member 2 can be given. As the type of the processing laser 11a, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, or an excimer laser can be selected. Considering the wavelength of the laser, a fiber laser, a YAG laser, a second harmonic of a YAG laser, a YVO 4 laser, and a semiconductor laser are preferable. Further, a laser capable of pulse oscillation may be used according to the processing shape of the metal member 2, and one pulse may be composed of a plurality of subpulses.
　走査手段１２は、加工用レーザ１１ａから照射されたレーザ光を被照射部材（金属部材２又は樹脂部材３）の照射面に対して水平方向（図１のＸ方向及びＹ方向）に走査させるものである。一例として、ガルバノミラーとテレセントリックｆθレンズを用いて被照射部材の水平方向に走査させる手段が挙げられる。この走査手段１２は、加工用レーザ１１ａから入射されるレーザ光を走査範囲Ａ（図１参照）内で走査可能であり、平行な状態で出射するようになっている。なお、レーザ光の走査は、後述するとおり位置調整手段１３によって行われてもよい。 The scanning unit 12 scans the laser beam irradiated from the processing laser 11a in the horizontal direction (X direction and Y direction in FIG. 1) with respect to the irradiation surface of the irradiated member (metal member 2 or resin member 3). It is. As an example, there is a means for scanning the irradiated member in the horizontal direction using a galvano mirror and a telecentric fθ lens. The scanning means 12 can scan the laser beam incident from the processing laser 11a within the scanning range A (see FIG. 1), and emits it in a parallel state. The laser beam scanning may be performed by the position adjusting unit 13 as described later.
　位置調整手段１３は、加工用レーザ１１ａからのレーザ光の焦点位置を調整するものである。本実施形態では、後述するステージ１４ａを鉛直方向に動作させることによってレーザ光の焦点位置を調整させている。また、位置調整手段１３は、鉛直動作に限定されず、ステージ１４ａを水平方向に動作させてもよい。これにより、ガルバノミラーの走査範囲Ａを超える範囲であっても、被照射部材における照射面に対して垂直にレーザ光を照射させることができる。なお、位置調整手段１３の前述の形態に限られず、加工用レーザ１１ａ自体を鉛直又は水平方向に動作させてもよい。 The position adjusting means 13 adjusts the focal position of the laser beam from the processing laser 11a. In the present embodiment, the focal position of the laser beam is adjusted by operating a stage 14a described later in the vertical direction. Further, the position adjusting means 13 is not limited to the vertical operation, and the stage 14a may be operated in the horizontal direction. Thereby, even if it is the range exceeding the scanning range A of a galvanometer mirror, a laser beam can be irradiated perpendicularly | vertically with respect to the irradiation surface in a to-be-irradiated member. The position adjusting means 13 is not limited to the above-described form, and the processing laser 11a itself may be operated in the vertical or horizontal direction.
　回転手段１４は、加工用レーザ１１ａから照射されたレーザ光の照射方向に対して被照射部材（金属部材２又は樹脂部材３）が垂直となるように、被照射部材を回転させるものであり、被照射部材を載置するステージ１４ａと、ステージ１４ａを回転させる回転軸１４ｂと、が備えられている（図１参照）。回転軸１４ｂは、図示例において、Ｘ軸周りに回転させることができるとともに、Ｙ軸周りに回転させることも可能である。なお、回転手段１４及び位置調整手段１３は、上述した走査手段１２の走査速度と同期させて所望の位置にレーザ光を照射してレーザ加工するように制御されていてもよい。 The rotating means 14 rotates the irradiated member so that the irradiated member (metal member 2 or resin member 3) is perpendicular to the irradiation direction of the laser beam emitted from the processing laser 11a. A stage 14a on which the irradiated member is placed and a rotating shaft 14b for rotating the stage 14a are provided (see FIG. 1). In the illustrated example, the rotation shaft 14b can be rotated around the X axis and can also be rotated around the Y axis. The rotating unit 14 and the position adjusting unit 13 may be controlled so as to perform laser processing by irradiating a desired position with laser light in synchronization with the scanning speed of the scanning unit 12 described above.
　以上、本発明に係るレーザ装置１０として、レーザが加工用レーザ１１ａとする実施形態（図１）について説明したが、レーザの変形例として加工用レーザ１１ａに代えて、接合用レーザ１１ｂであってもよい（図５参照）。この場合、接合用レーザ１１ｂは、例えば、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ4レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザとする。 As described above, the laser device 10 according to the present invention has been described with respect to the embodiment in which the laser is the processing laser 11a (FIG. 1). However, as a modified example of the laser, the laser 11 for bonding is used instead of the processing laser 11a. (See FIG. 5). In this case, the bonding laser 11b is, for example, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide laser, or an excimer laser.
　［接合構造体の製造方法］
　本発明に係る接合構造体の製造方法について２つの実施形態を説明する。 [Method of manufacturing joined structure]
Two embodiments of the method for manufacturing a bonded structure according to the present invention will be described.
　－第１実施形態－
　本実施形態に係る接合構造体の製造方法は、第１部材に第２部材を対峙させて接合する接合構造体の製造方法であって、凹状部形成工程と、接合工程と、を備えている。 -First embodiment-
The manufacturing method of the bonded structure according to the present embodiment is a method of manufacturing a bonded structure in which the second member is opposed to the first member and bonded, and includes a concave portion forming step and a bonding step. .
　第１部材は、金属部材２であり、金属の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。 The first member is the metal member 2, and examples of the metal include iron-based metal, stainless-based metal, copper-based metal, aluminum-based metal, magnesium-based metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
　第１部材（金属部材２）における後述する第２部材（樹脂部材３）と対峙される面は、凸形状である。本実施形態の凸形状は、湾曲面とされている。 The surface of the first member (metal member 2) that faces a second member (resin member 3) to be described later has a convex shape. The convex shape of this embodiment is a curved surface.
　第２部材は、樹脂部材３であり、熱可塑性樹脂、又は、熱硬化性樹脂である。熱可塑性樹脂の一例としては、ＰＶＣ（ポリ塩化ビニル）、ＰＳ（ポリスチレン）、ＡＳ（アクリロニトリル・スチレン）、ＡＢＳ（アクリロニトリル・ブタジエン・スチレン）、ＰＭＭＡ（ポリメチルメタクリレート）、ＰＥ（ポリエチレン）、ＰＰ（ポリプロピレン）、ＰＣ（ポリカーボネート）、ｍ－ＰＰＥ（変性ポリフェニレンエーテル）、ＰＡ６（ポリアミド６）、ＰＡ６６（ポリアミド６６）、ＰＯＭ（ポリアセタール）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＳＦ（ポリサルホン）、ＰＡＲ（ポリアリレート）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＥＳ（ポリエーテルサルホン）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＡＩ（ポリアミドイミド）、ＬＣＰ（液晶ポリマー）、ＰＶＤＣ（ポリ塩化ビニリデン）、ＰＴＦＥ（ポリテトラフルオロエチレン）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、および、ＰＶＤＦ（ポリフッ化ビニリデン）が挙げられる。また、ＴＰＥ（熱可塑性エラストマ）であってもよく、ＴＰＥの一例としては、ＴＰＯ（オレフィン系）、ＴＰＳ（スチレン系）、ＴＰＥＥ（エステル系）、ＴＰＵ（ウレタン系）、ＴＰＡ（ナイロン系）、および、ＴＰＶＣ（塩化ビニル系）が挙げられる。 The second member is the resin member 3, which is a thermoplastic resin or a thermosetting resin. Examples of thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), and include PVDF (poly (vinylidene fluoride)) it is. TPE (thermoplastic elastomer) may also be used, and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
　熱硬化性樹脂の一例としては、ＥＰ（エポキシ）、ＰＵＲ（ポリウレタン）、ＵＦ（ユリアホルムアルデヒド）、ＭＦ（メラミンホルムアルデヒド）、ＰＦ（フェノールホルムアルデヒド）、ＵＰ（不飽和ポリエステル）、および、ＳＩ（シリコーン）が挙げられる。また、ＦＲＰ（繊維強化プラスチック）であってもよい。 Examples of thermosetting resins include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
　なお、熱可塑性樹脂および熱硬化性樹脂には、充填剤が添加されていてもよい。充填剤の一例としては、無機系充填剤（ガラス繊維、無機塩類など）、金属系充填剤、有機系充填剤、および、炭素繊維などが挙げられる。 Note that a filler may be added to the thermoplastic resin and the thermosetting resin. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
　また、第２部材（樹脂部材３）は、後述する接合工程において、樹脂部材３の上方からレーザ光を照射する場合は、レーザ光を透過する材料が好ましく、その透過率は、厚みが３ｍｍのときに１５％以上であることが好ましい。一方、後述する接合工程において、樹脂部材３の下方からレーザ光を照射する場合（レーザ光を金属部材２に直接照射する場合）は、樹脂部材３はレーザ透過性を有していなくてもよい。 The second member (resin member 3) is preferably made of a material that transmits laser light when the laser beam is irradiated from above the resin member 3 in the joining step described later. The transmittance is 3 mm. Sometimes it is preferably 15% or more. On the other hand, in the bonding step described later, when the laser beam is irradiated from below the resin member 3 (when the laser beam is directly irradiated to the metal member 2), the resin member 3 may not have laser transmittance. .
　樹脂部材３における金属部材２と対峙される面（接合面ＢＰ）は、前述した金属部材２の湾曲面に対応した凹面形状である。 The surface (bonding surface BP) facing the metal member 2 in the resin member 3 has a concave shape corresponding to the curved surface of the metal member 2 described above.
　以下、本実施形態に係る接合構造体の製造方法の各工程について説明する。 Hereinafter, each process of the manufacturing method of the joined structure according to the present embodiment will be described.
　・凹状部形成工程
　凹状部形成工程は、金属部材２における接合面ＢＰに、樹脂部材３が充填される凹状部ｏを形成する工程であり、加工用レーザ１１ａを備えたレーザ装置１０を用いて行われる。加工用レーザ１１ａの一例としては、オムロン製のファイバレーザマーカＭＸＺ２０００又はＭＸ－Ｚ２０５０を挙げることができる。 -Concave part formation process A concave part formation process is a process of forming the concave part o by which the resin member 3 is filled in the joint surface BP in the metal member 2, and uses the laser apparatus 10 provided with the processing laser 11a. Done. As an example of the processing laser 11a, a fiber laser marker MXZ2000 or MX-Z2050 manufactured by OMRON can be cited.
　まず、金属部材２をステージ１４ａに載置する（図１参照）。そして、本実施形態では、走査手段１２の走査範囲Ａを超える位置における金属部材２の接合面ＢＰに凹状部ｏを形成するため、位置調整手段１３によって、凹状部ｏを形成する位置が走査範囲Ａ内に入るように、ステージ１４ａを移動させる。 First, the metal member 2 is placed on the stage 14a (see FIG. 1). And in this embodiment, in order to form the recessed part o in the joint surface BP of the metal member 2 in the position exceeding the scanning range A of the scanning means 12, the position where the recessed part o is formed by the position adjusting means 13 is the scanning range. The stage 14a is moved so as to enter A.
　次に、回転軸１４ｂによって、金属部材２の接合面ＢＰに対して垂直に加工用レーザ１１ａからのレーザ光が照射されるように、ステージ１４ａを回転させる（図２参照）。具体的には、金属部材２の接合面ＢＰにおける凹状部ｏの形成箇所の接線が水平方向を向くようにステージ１４ａを回転させることにより、その凹状部ｏの形成箇所に対してレーザ光を垂直に照射可能にする。 Next, the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the processing laser 11a is irradiated perpendicularly to the joint surface BP of the metal member 2 (see FIG. 2). Specifically, by rotating the stage 14a so that the tangent of the formation part of the concave part o on the joint surface BP of the metal member 2 faces the horizontal direction, the laser beam is perpendicular to the formation part of the concave part o. Can be irradiated.
　次に、位置調整手段１３によって、加工用レーザ１１ａから照射されるレーザ光の焦点位置を、金属部材２の接合面ＢＰに位置調節する。すなわち、ステージ１４ａを上下動させることにより、レーザ光の焦点位置に、金属部材２の接合面ＢＰにおける凹状部ｏの形成箇所を移動させる。 Next, the position adjusting means 13 adjusts the focal position of the laser light emitted from the processing laser 11 a to the bonding surface BP of the metal member 2. That is, by moving the stage 14a up and down, the location where the concave portion o is formed on the joint surface BP of the metal member 2 is moved to the focal position of the laser beam.
　そして、金属部材２における凹状部ｏを形成する位置に加工用レーザ１１ａからのレーザ光としてパルス光（好ましくはサブパルス光）を照射する。 Then, pulse light (preferably sub-pulse light) is irradiated as laser light from the processing laser 11a to a position where the concave portion o in the metal member 2 is formed.
　ここで、オムロン製のファイバレーザマーカでは、１パルスが複数のサブパルスで構成されるレーザ光を照射することが可能である。このため、レーザ光のエネルギーを深さ方向に集中させやすいので、凹状部ｏを形成するのに好適である。 Here, with the fiber laser marker made by OMRON, it is possible to irradiate a laser beam in which one pulse is composed of a plurality of sub-pulses. For this reason, the energy of the laser beam is easily concentrated in the depth direction, which is suitable for forming the concave portion o.
　具体的には、金属部材２にレーザ光が照射されると、金属部材２が局部的に溶融されることにより凹状部ｏの形成が進行する。このとき、レーザ光が複数のサブパルスで構成されているため、溶融された金属部材２が飛散されにくく、凹状部ｏの近傍に堆積されやすい。そして、凹状部ｏの形成が進行すると、溶融された金属部材２が凹状部ｏの内部に堆積されることにより、凹状部ｏの内周面に、内側に突出する突出部ｔが形成される。 Specifically, when the metal member 2 is irradiated with a laser beam, the metal member 2 is locally melted to advance the formation of the concave portion o. At this time, since the laser beam is composed of a plurality of sub-pulses, the molten metal member 2 is not easily scattered and easily deposited in the vicinity of the concave portion o. Then, as the formation of the concave portion o proceeds, the molten metal member 2 is deposited inside the concave portion o, so that a protruding portion t protruding inward is formed on the inner peripheral surface of the concave portion o. .
　本実施形態では、突出部ｔの形成位置は、凹状部ｏの開口近傍位置であるが、上記ファイバレーザマーカによる加工条件により、開口端に形成されていてもよいし、凹状部ｏの底部近傍位置に形成されていてもよい。 In the present embodiment, the projecting portion t is formed at a position near the opening of the concave portion o, but may be formed at the opening end depending on the processing conditions by the fiber laser marker, or may be near the bottom of the concave portion o. It may be formed.
　なお、上記ファイバレーザマーカによる加工条件としては、サブパルスの１周期が１５ｎｓ以下であることが好ましい。これは、サブパルスの１周期が１５ｎｓを超えると、熱伝導によりエネルギーが拡散しやすくなり、突出部ｔを有する凹状部ｏを形成しにくくなるためである。なお、サブパルスの１周期は、サブパルスの１回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。 In addition, as a processing condition by the fiber laser marker, it is preferable that one period of the subpulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the concave portion o having the protruding portion t. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
　また、上記ファイバレーザマーカによる加工条件としては、１パルスのサブパルス数は、２以上５０以下であることが好ましい。これは、サブパルス数が５０を超えると、サブパルスの単位あたりの出力が小さくなり、突出部ｔを有する凹状部ｏを形成しにくくなるためである。 Further, as a processing condition by the fiber laser marker, the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the concave portion o having the protruding portion t.
　凹状部ｏの開口径は、３０μｍ以上、１００μｍ以下が好ましい。これは、開口径が３０μｍを下回ると、後述する接合工程において、照射された接合用レーザ１１ｂ（図４参照）からのレーザ光が凹状部ｏ内に十分に閉じ込められず、レーザ光のエネルギーを熱に変換する変換効率が低下する場合があるためである。一方、開口径が１００μｍを上回ると、単位面積あたりの凹状部ｏの数が減少して、レーザ光のエネルギーを熱に変換する変換効率が低下する場合があるためである。 The opening diameter of the concave portion o is preferably 30 μm or more and 100 μm or less. This is because if the opening diameter is less than 30 μm, the laser beam from the irradiated bonding laser 11b (see FIG. 4) is not sufficiently confined in the concave portion o in the bonding step described later, and the energy of the laser beam is reduced. This is because the conversion efficiency for conversion into heat may be reduced. On the other hand, if the opening diameter exceeds 100 μm, the number of concave portions o per unit area decreases, and conversion efficiency for converting the energy of the laser light into heat may decrease.
　また、凹状部ｏの深さは、１０μｍ以上であることが好ましい。これは、深さが１０μｍを下回ると、後述する接合用レーザ１１ｂからのレーザ光のエネルギーを熱に変換する変換効率が低下する場合があるためである。本実施形態では、たとえば、凹状部ｏの加工深さは４３μｍ～４５μｍとする。 Further, the depth of the concave portion o is preferably 10 μm or more. This is because if the depth is less than 10 μm, the conversion efficiency for converting the energy of laser light from the bonding laser 11b described later into heat may be reduced. In the present embodiment, for example, the processing depth of the concave portion o is 43 μm to 45 μm.
　１つ目の凹状部ｏを形成後、金属部材２に２つ目の凹状部ｏを形成する。ここで、２つ目の凹状部ｏの形成する位置が、走査範囲Ａ内に入っている場合は、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させるとともに位置調整手段１３によって昇降させて、凹状部ｏの形成を行う。一方、走査範囲Ａ内に入っていない場合は、位置調整手段１３によって、ステージ１４ａを走査範囲Ａ内に移動させた後に、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させるとともに位置調整手段１３によって昇降させて、凹状部ｏの形成を行う。すなわち、金属部材２の接合面ＢＰにおける凹状部ｏの形成箇所の接線が水平方向を向くように金属部材２を移動させるとともに、レーザ光の焦点位置に凹状部ｏの形成箇所を移動させた状態で、レーザ光が照射される。つまり、湾曲面である接合面ＢＰに対するレーザ光の入射角度を一定にすることが可能である。 After forming the first concave portion o, the second concave portion o is formed in the metal member 2. Here, when the position formed by the second concave portion o is within the scanning range A, as described above, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13, The concave portion o is formed. On the other hand, if not within the scanning range A, after the stage 14a is moved into the scanning range A by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above. The concave portion o is formed by raising and lowering. That is, the metal member 2 is moved so that the tangent of the formation portion of the concave portion o on the joint surface BP of the metal member 2 faces the horizontal direction, and the formation portion of the concave portion o is moved to the focal position of the laser beam. Then, the laser beam is irradiated. That is, it is possible to make the incident angle of the laser beam constant with respect to the bonding surface BP that is a curved surface.
　上述した工程を、凹状部ｏを形成する個数分、繰り返し行う（図３は、３つ目の凹状部ｏを形成している状態を模式的に説明している。）。なお、同じ箇所に複数回レーザ光を照射することにより、１つの凹状部ｏを形成するようにしてもよい。 The above-described steps are repeated for the number of the concave portions o to be formed (FIG. 3 schematically illustrates a state in which the third concave portion o is formed). In addition, you may make it form one concave part o by irradiating a laser beam to the same location in multiple times.
　ここで、凹状部ｏの間隔（所定の凹状部ｏの中心と、所定の凹状部ｏと隣接する凹状部ｏの中心との距離）は、２００μｍ以下であることが好ましい。これは、凹状部ｏの間隔が２００μｍを上回ると、単位面積あたりの凹状部ｏの数が減少して、後述する接合用レーザ１１ｂからのレーザ光のエネルギーを熱に変換する変換効率が低下する場合があるためである。なお、凹状部ｏの間隔の下限の一例としては、凹状部ｏが重畳して潰れない距離である。また、凹状部ｏの間隔は等間隔であることが好ましい。これは、凹状部ｏが等間隔であると、接合用のレーザ光が照射される際の熱の分布が等方的になるためである。 Here, the interval between the concave portions o (the distance between the center of the predetermined concave portion o and the center of the concave portion o adjacent to the predetermined concave portion o) is preferably 200 μm or less. This is because when the interval between the concave portions o exceeds 200 μm, the number of the concave portions o per unit area decreases, and the conversion efficiency for converting the energy of laser light from the bonding laser 11b described later into heat decreases. This is because there are cases. An example of the lower limit of the interval between the concave portions o is a distance at which the concave portions o are not overlapped and crushed. Moreover, it is preferable that the interval of the recessed part o is an equal interval. This is because when the concave portions o are equally spaced, the heat distribution when the bonding laser light is irradiated is isotropic.
　以上説明したとおり、凹状部形成工程では、金属部材２におけるレーザ光の照射面（接合面ＢＰ）に対して垂直方向にレーザを照射することができるので、図１５Ｂに示した従来技術と異なり、反射光に相当するエネルギー損失を抑制して金属部材２を加工することができる。 As described above, in the concave portion forming step, since the laser beam can be irradiated in a direction perpendicular to the laser beam irradiation surface (bonding surface BP) in the metal member 2, unlike the conventional technique shown in FIG. 15B, The metal member 2 can be processed while suppressing energy loss corresponding to the reflected light.
　なお、本実施形態において、金属部材２の接合面ＢＰに対して垂直とは、接合面ＢＰとレーザ光とのなす角度が厳密に９０°である必要はなく、８０°から１００°の範囲にあればよい。上記範囲であれば、反射光に相当するエネルギー損失を低減することができる。 In the present embodiment, the term “perpendicular to the bonding surface BP of the metal member 2” does not require the angle between the bonding surface BP and the laser light to be strictly 90 °, and is in the range of 80 ° to 100 °. I just need it. If it is the said range, the energy loss equivalent to reflected light can be reduced.
　また、本実施形態の凹状部形成工程によれば、位置調整手段１３によって焦点位置が調節されるため、焦点距離のずれによる加工ばらつきを低減することができる。 Further, according to the concave portion forming step of the present embodiment, since the focal position is adjusted by the position adjusting means 13, processing variations due to a shift in focal length can be reduced.
　なお、凹状部形成工程における加工用レーザの加工条件の一例を以下に記載する。 An example of the processing conditions of the processing laser in the concave portion forming step will be described below.
　＜加工用レーザにおける加工条件＞
レーザ：ファイバレーザ（波長１０６２ｎｍ）
周波数：１０ｋＨｚ
出力：３．８Ｗ
走査速度：６５０ｍｍ／ｓｅｃ
走査回数：４０回
照射間隔：６５μｍ
サブパルス数：２０ <Processing conditions for processing laser>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 3.8W
Scanning speed: 650mm / sec
Number of scans: 40 times Irradiation interval: 65 μm
Number of subpulses: 20
　・接合工程
　接合工程は、金属部材２と樹脂部材３とを互いに接合する工程であり、上述した接合用レーザ１１ｂを備えたレーザ装置１０を用いて行われる。 Bonding process The bonding process is a process of bonding the metal member 2 and the resin member 3 to each other, and is performed using the laser device 10 including the bonding laser 11b described above.
　なお、本実施形態では、金属部材２と樹脂部材３とをレーザ接合させる形態を説明するが、この形態に限られず、樹脂部材３をヒータ等で加熱溶融させて接合させる方法や、金属部材２を収容する金型を用いてインサート成形させる方法等を用いてもよい。 In the present embodiment, a mode in which the metal member 2 and the resin member 3 are laser bonded will be described. However, the present invention is not limited to this mode, and the resin member 3 is heated and melted with a heater or the like, or the metal member 2 is bonded. For example, a method of insert molding using a mold that accommodates the material may be used.
　また、金属部材２と樹脂部材３とのレーザ接合の方法としては、金属部材２を接合用レーザ１１ｂにより加熱させることによって、金属部材２と接触している樹脂部材３に熱が伝わり、樹脂部材３を溶融させて接合させる方法と、樹脂部材３自体を接合用レーザ１１ｂにより加熱溶融させて金属部材２と接合させる方法が挙げられる。 Further, as a method of laser joining of the metal member 2 and the resin member 3, heat is transmitted to the resin member 3 in contact with the metal member 2 by heating the metal member 2 with the joining laser 11b, and the resin member. And a method in which the resin member 3 itself is heated and melted by the bonding laser 11b and bonded to the metal member 2.
　本実施形態では、接合用レーザ１１ｂからのレーザ光を、透光性の樹脂部材３と金属部材２との接合面ＢＰに照射させ、金属部材２を加熱させることにより金属部材２と接触している樹脂部材３に熱を伝え、樹脂部材３を溶融させて接合させる方法について説明する。なお、溶融された樹脂部材３が金属部材２の凹状部ｏに充填されて固化されることにより金属部材２および樹脂部材３が機械的に接合される。 In the present embodiment, the laser beam from the bonding laser 11b is irradiated to the bonding surface BP between the translucent resin member 3 and the metal member 2, and the metal member 2 is heated to come into contact with the metal member 2. A method of transferring heat to the existing resin member 3 and melting and bonding the resin member 3 will be described. The melted resin member 3 is filled in the concave portion o of the metal member 2 and solidified, whereby the metal member 2 and the resin member 3 are mechanically joined.
　まず、ステージ１４ａに載置された金属部材２の接合面ＢＰに、樹脂部材３を載置する（図４参照）。そして、樹脂部材３を金属部材２の接合面ＢＰに加圧接触させる。また、走査手段１２の走査範囲Ａ（図５参照）を超える位置における金属部材２の凹状部ｏに樹脂部材３を充填するため、位置調整手段１３によって、凹状部ｏが形成された位置が走査範囲Ａ内に入るように、ステージ１４ａを移動させる。 First, the resin member 3 is placed on the joint surface BP of the metal member 2 placed on the stage 14a (see FIG. 4). Then, the resin member 3 is brought into pressure contact with the joint surface BP of the metal member 2. Further, since the resin member 3 is filled in the concave portion o of the metal member 2 at a position exceeding the scanning range A (see FIG. 5) of the scanning means 12, the position adjusting means 13 scans the position where the concave portion o is formed. The stage 14a is moved so as to fall within the range A.
　次に、回転軸１４ｂによって、金属部材２の接合面ＢＰに対して垂直に接合用レーザ１１ｂからのレーザ光が照射されるように、ステージ１４ａを回転させる（図６参照）。具体的には、金属部材２の接合面ＢＰにおけるレーザ照射箇所の接線が水平方向を向くようにステージ１４ａを回転させる。 Next, the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the bonding laser 11b is irradiated perpendicularly to the bonding surface BP of the metal member 2 (see FIG. 6). Specifically, the stage 14a is rotated so that the tangent of the laser irradiation spot on the joint surface BP of the metal member 2 faces the horizontal direction.
　次に、位置調整手段１３によって、接合用レーザ１１ｂから照射されるレーザ光の焦点位置を、金属部材２の接合面ＢＰに位置調節する。すなわち、ステージ１４ａを上下動させることにより、接合用のレーザ光の焦点位置に、金属部材２の接合面ＢＰが移動される。 Next, the position adjusting means 13 adjusts the focal position of the laser light emitted from the bonding laser 11b on the bonding surface BP of the metal member 2. That is, by moving the stage 14a up and down, the bonding surface BP of the metal member 2 is moved to the focal position of the laser beam for bonding.
　そして、金属部材２の接合面ＢＰに対して接合用レーザ１１ｂからのレーザ光を連続発振によって照射する。 Then, the laser beam from the bonding laser 11b is irradiated to the bonding surface BP of the metal member 2 by continuous oscillation.
　樹脂部材３と金属部材２との接合面ＢＰにレーザ光を照射することにより、レーザ光のエネルギーが金属部材２の内部で熱に変換され、金属部材２の表面の温度が高くなる。これにより、金属部材２の表面近傍の樹脂部材３が溶融され、その樹脂部材３が凹状部ｏに充填される。本実施形態では、接合用レーザ１１ｂからのレーザ光を走査手段１２によって走査させるとともにレーザ光を連続発振させているので、金属部材２内の熱が拡散されて温度低下することを防ぎ、効率よく金属部材２を蓄熱させて温度を高めることができる。 By irradiating the joint surface BP between the resin member 3 and the metal member 2 with laser light, the energy of the laser light is converted into heat inside the metal member 2 and the surface temperature of the metal member 2 is increased. Thereby, the resin member 3 in the vicinity of the surface of the metal member 2 is melted, and the resin member 3 is filled in the concave portion o. In the present embodiment, since the laser beam from the bonding laser 11b is scanned by the scanning unit 12 and the laser beam is continuously oscillated, the heat in the metal member 2 is prevented from diffusing and the temperature is lowered, and the efficiency is improved. The temperature of the metal member 2 can be increased by storing heat.
　１つ目の凹状部ｏに樹脂部材３を充填した後、２つ目の凹状部ｏに樹脂部材３を充填する。ここで、２つ目の凹状部ｏの位置が、走査範囲Ａ内に入っている場合は、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させさせるとともに位置調整手段１３によって昇降させて、凹状部ｏに樹脂部材３を充填する。一方、走査範囲Ａ内に入っていない場合は、位置調整手段１３によってステージ１４ａを走査範囲Ａ内に移動させた後に、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させるとともに位置調整手段１３によって昇降させて、凹状部ｏに樹脂部材３を充填する。このため、接合用のレーザ光が金属部材２の接合面ＢＰに対して垂直な方向からその接合面ＢＰに沿って走査される。 After filling the first concave portion o with the resin member 3, the second concave portion o is filled with the resin member 3. Here, when the position of the second concave portion o is within the scanning range A, as described above, the stage 14a is rotated by the rotating shaft 14b and moved up and down by the position adjusting means 13 to form a concave shape. The portion o is filled with the resin member 3. On the other hand, if not within the scanning range A, after the stage 14a is moved into the scanning range A by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above. The concave member o is filled with the resin member 3 by moving up and down. For this reason, the laser beam for bonding is scanned along the bonding surface BP from a direction perpendicular to the bonding surface BP of the metal member 2.
　上述した工程を、凹状部ｏの個数分、繰り返し行う（図７は、３つ目の凹状部ｏに樹脂部材３を充填している状態を模式的に説明している。）。 The above-described steps are repeated for the number of the concave portions o (FIG. 7 schematically illustrates a state where the third concave portion o is filled with the resin member 3).
　このようにして、接合工程では、凹状部形成工程において接合面ＢＰに対して垂直方向に形成された凹状部ｏ内に、樹脂部材３を充填することによって金属部材２と樹脂部材３とを反射光によるエネルギー損失を抑制して接合させた接合構造体１（図８参照）を製造することができる。 In this way, in the joining step, the metal member 2 and the resin member 3 are reflected by filling the resin member 3 into the concave portion o formed in the direction perpendicular to the joining surface BP in the concave portion forming step. A bonded structure 1 (see FIG. 8) bonded with suppressing energy loss due to light can be manufactured.
　また、凹状部ｏに樹脂部材３を充填している間も位置調整手段１３によってレーザ光の焦点位置が調節されるため、焦点距離のずれによる接合ばらつきが低減された接合構造体１を製造することができる。 In addition, since the focal position of the laser beam is adjusted by the position adjusting means 13 while the concave portion o is filled with the resin member 3, the bonded structure 1 in which the bonding variation due to the shift of the focal length is reduced is manufactured. be able to.
　また、接合面ＢＰに対して垂直方向に形成された凹状部ｏ内に、樹脂部材３が充填されるので、図１５Ｂの従来技術のような凹状部ｏが形成されている方向が一方向に揃っているものと比較してアンカー効果を高めることできる。従って、金属部材２と樹脂部材３との接合強度を向上させた接合構造体１を製造することができる。これについては、第１実施形態の実験例にて詳述する。 Further, since the resin member 3 is filled in the concave portion o formed in the direction perpendicular to the bonding surface BP, the direction in which the concave portion o as in the prior art of FIG. 15B is formed is one direction. An anchor effect can be heightened compared with what is prepared. Therefore, it is possible to manufacture the bonded structure 1 in which the bonding strength between the metal member 2 and the resin member 3 is improved. This will be described in detail in the experimental example of the first embodiment.
　なお、接合工程における接合用レーザの照射条件の一例を以下に記載する。 In addition, an example of the irradiation conditions of the laser for joining in a joining process is described below.
　＜接合用レーザ照射条件＞
レーザ：半導体レーザ（波長８０８ｎｍ）
発振モード：連続発振
出力：３０Ｗ
焦点径：４ｍｍ
走査速度：１ｍｍ／ｓｅｃ
密着圧力：０．６ＭＰａ <Laser irradiation conditions for bonding>
Laser: Semiconductor laser (wavelength 808 nm)
Oscillation mode: Continuous oscillation output: 30W
Focal diameter: 4mm
Scanning speed: 1mm / sec
Contact pressure: 0.6 MPa
　－第１実施形態の実験例－
　次に、上記した第１実施形態の効果を確認するために行った接合強度の評価について、第１実施形態に対応する実施例と、比較例とを比較しながら説明する。なお、実施例の接合構造体及び比較例の接合構造体ともに、樹脂部材の材料はＰＭＭＡとし、金属部材の材料はＳＵＳ３０４とした。 -Experimental example of the first embodiment-
Next, the evaluation of the bonding strength performed for confirming the effect of the first embodiment described above will be described while comparing an example corresponding to the first embodiment and a comparative example. In addition, as for the joining structure of an Example and the joining structure of a comparative example, the material of the resin member was PMMA, and the material of the metal member was SUS304.
　実施例では、上述した凹状部形成工程及び接合工程を行って接合構造体を製造した（例えば図６参照）。 In the example, the above-described concave portion forming step and the bonding step were performed to manufacture a bonded structure (see, for example, FIG. 6).
　また、比較例では、上述した凹状部形成工程において、金属部材における接合面に対して垂直に加工用レーザを照射していない（例えば、図１５Ａ及び図１５Ｂ参照）。すなわち、比較例の接合構造体は、図１５Ａ及び図１５Ｂで説明したとおり、金属部材に対してレーザ光を照射すると反射光Ｒが発生しており、この反射光Ｒに相当するレーザ光のエネルギー分の損失が生じるため、金属部材の凹状部が設定よりも浅く加工されている。 In the comparative example, the processing laser is not irradiated perpendicularly to the joint surface of the metal member in the above-described concave portion forming step (see, for example, FIGS. 15A and 15B). That is, as described in FIGS. 15A and 15B, the bonded structure of the comparative example generates reflected light R when the metal member is irradiated with laser light. The energy of the laser light corresponding to the reflected light R is generated. Therefore, the concave portion of the metal member is processed shallower than the setting.
　また、比較例の接合構造体では、各凹状部が形成される方向が一方向に揃っている。すなわち、金属部材において接合面に対して凹状部の形成角度が一定となっていない。 Moreover, in the joint structure of the comparative example, the direction in which each concave portion is formed is aligned in one direction. That is, the formation angle of the concave portion with respect to the joint surface in the metal member is not constant.
　上述した実施例に係る接合構造体及び比較例に係る接合構造体の接合強度の評価は、エスペック製の冷熱衝撃装置ＴＳＤ－１００による熱衝撃試験によって評価した。具体的には、－４０℃の環境下で３０分、８５℃の環境下で３０分という１サイクル１時間の熱衝撃を、接合界面が剥離に至るまで実施例および比較例に加え続けた。 The evaluation of the bonding strength of the bonding structures according to the above-described examples and the bonding structures according to the comparative examples was performed by a thermal shock test using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, a thermal shock of one cycle of 1 hour of 30 minutes in an environment of −40 ° C. and 30 minutes in an environment of 85 ° C. was continued to be applied to the examples and comparative examples until the bonding interface reached peeling.
　接合界面が剥離に至った否かの確認は、１００、２５０、５００、７５０、１０００、１５００サイクル（回）の熱衝撃を加えた後にそれぞれ行った。そして、或るサイクルで接合界面が剥離に至った場合には、その前の接合界面の剥離が確認されなかったサイクルを熱衝撃試験耐性として採用した。例えば、接合界面の剥離が１０００回の熱衝撃を加えた後に確認された場合には、その前の７５０回を熱衝撃試験耐性とした。実施例および比較例について得られた熱衝撃試験耐性を表１に示す。 The confirmation as to whether or not the bonding interface had peeled was performed after applying thermal shocks of 100, 250, 500, 750, 1000, 1500 cycles (times). And when the joining interface reached peeling in a certain cycle, the cycle in which peeling of the previous joining interface was not confirmed was adopted as the thermal shock test resistance. For example, when peeling of the bonding interface was confirmed after 1000 thermal shocks were applied, the previous 750 times were regarded as thermal shock test resistance. Table 1 shows the thermal shock test resistance obtained for the examples and comparative examples.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　上記評価結果より、本発明に係る実施例の接合構造体は、冷熱衝撃試験を１５００サイクル行った後に剥離が確認されたので、冷熱衝撃試験耐性は１０００サイクルであった。 From the above evaluation results, the bonded structures of the examples according to the present invention were confirmed to be peeled after 1500 cycles of the thermal shock test, and thus the thermal shock test resistance was 1000 cycles.
　一方で、比較例の接合構造体は、冷熱衝撃試験を５００サイクル行った後に剥離が確認されたので、冷熱衝撃試験耐性は２５０サイクルであった。 On the other hand, since the bonded structure of the comparative example was confirmed to be peeled after 500 cycles of the thermal shock test, the thermal shock test resistance was 250 cycles.
　以上により、実施例による接合構造体は、比較例と比較して、冷熱衝撃試験耐性が向上していることを確認することができた。 From the above, it was confirmed that the bonded structure according to the example had improved thermal shock test resistance as compared with the comparative example.
　－第２実施形態－
　接合構造体の製造方法の第２実施形態を図９～図１４を参照しながら説明する。図９及び図１０は、接合構造体の製造方法における凹状部形成工程を説明する説明図、図１１～図１３は、接合構造体の製造方法における接合工程を説明する説明図、図１４は、接合構造体の斜視図である。 -Second Embodiment-
A second embodiment of the method for manufacturing a joined structure will be described with reference to FIGS. 9 and 10 are explanatory diagrams for explaining the concave portion forming step in the manufacturing method of the bonded structure, FIGS. 11 to 13 are explanatory diagrams for explaining the bonding step in the manufacturing method of the bonded structure, and FIG. It is a perspective view of a junction structure.
　本実施形態は、前述した第１実施形態と、金属部材及び樹脂部材の形状が異なるだけであるので、以下、その相違点に関連する事項について説明し、同一の構成要素については、同一符号を付してその説明を省略する。 Since the present embodiment is different from the first embodiment described above only in the shapes of the metal member and the resin member, the following describes matters related to the differences, and the same components are denoted by the same reference numerals. A description thereof will be omitted.
　本実施形態に係る接合構造体の製造方法は、第１部材に第２部材を対峙させて接合する接合構造体の製造方法であって、凹状部形成工程と、接合工程と、を備えている。 The manufacturing method of the bonded structure according to the present embodiment is a method of manufacturing a bonded structure in which the second member is opposed to the first member and bonded, and includes a concave portion forming step and a bonding step. .
　第１部材（金属部材２´）における後述する第２部材（樹脂部材３´）と対峙される面（接合面ＢＰ´）は、凸形状であり、本実施形態の凸形状は、中央部が膨出された方形状の膨出部Ｂ´を備えている。また、膨出部Ｂ´の側周面は、傾斜面ＴＰ´とされている。 A surface (bonding surface BP ′) that faces a second member (resin member 3 ′), which will be described later, in the first member (metal member 2 ′) has a convex shape. A bulged rectangular bulging portion B ′ is provided. Further, the side peripheral surface of the bulging portion B ′ is an inclined surface TP ′.
　樹脂部材３´における金属部材２´と対峙される面は、前述した金属部材２´の膨出部Ｂ´に対応した凹形状である。 The surface of the resin member 3 ′ facing the metal member 2 ′ has a concave shape corresponding to the bulging portion B ′ of the metal member 2 ′ described above.
　以下、本実施形態に係る接合構造体の製造方法の各工程について説明する。 Hereinafter, each process of the manufacturing method of the joined structure according to the present embodiment will be described.
　・凹状部形成工程
　まず、金属部材２´を回転手段１４のステージ１４ａに載置する。そして、本実施形態では、走査手段１２の走査範囲Ａを超える位置における金属部材２´の接合面ＢＰ´に凹状部ｏを形成するため、位置調整手段１３によって、凹状部ｏを形成する位置が走査範囲Ａ内に入るように、ステージ１４ａを移動させる。 -Concave part formation process First, metal member 2 'is mounted in the stage 14a of the rotation means 14. As shown in FIG. In this embodiment, since the concave portion o is formed on the joint surface BP ′ of the metal member 2 ′ at a position exceeding the scanning range A of the scanning means 12, the position where the concave portion o is formed by the position adjusting means 13. The stage 14a is moved so as to fall within the scanning range A.
　次に、回転軸１４ｂによって、金属部材２´の接合面ＢＰ´に対して垂直に加工用レーザ１１ａからのレーザ光が照射されるように、回転軸１４ｂによってステージ１４ａを回転させる（図９参照）。本実施形態では、まず最初に、金属部材２´の略水平面（膨出部Ｂ´の外縁部）に凹状部ｏを形成するため、金属部材２´に対して垂直にレーザ光が照射されるように、ステージ１４ａを回転軸１４ｂによって微調整する。 Next, the stage 14a is rotated by the rotating shaft 14b so that the rotating shaft 14b irradiates the laser beam from the processing laser 11a perpendicularly to the joint surface BP ′ of the metal member 2 ′ (see FIG. 9). ). In the present embodiment, first, in order to form the concave portion o on the substantially horizontal plane (outer edge portion of the bulging portion B ′) of the metal member 2 ′, laser light is irradiated perpendicularly to the metal member 2 ′. Thus, the stage 14a is finely adjusted by the rotating shaft 14b.
　次に、位置調整手段１３によって、加工用レーザ１１ａから照射されるレーザ光の焦点位置を、金属部材２´の接合面ＢＰ´に位置調節する。すなわち、ステージ１４ａを上下動させることにより、レーザ光の焦点位置に、金属部材２´の接合面ＢＰ´における凹状部ｏの形成箇所を移動させる。 Next, the position adjusting means 13 adjusts the position of the focal position of the laser light emitted from the processing laser 11a on the joining surface BP ′ of the metal member 2 ′. That is, by moving the stage 14a up and down, the location where the concave portion o is formed on the joint surface BP ′ of the metal member 2 ′ is moved to the focal position of the laser beam.
　そして、金属部材２´における凹状部ｏを形成する位置に加工用レーザ１１ａからのレーザ光としてパルス光（好ましくはサブパルス光）を照射する。 Then, pulse light (preferably sub-pulse light) is irradiated as a laser beam from the processing laser 11a to a position where the concave portion o in the metal member 2 ′ is formed.
　１つ目の凹状部ｏを形成後、金属部材２´に２つ目の凹状部ｏを形成する。ここで、２つ目の凹状部ｏの形成する位置が、走査手段１２の走査範囲Ａ内に入っている場合は、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させるとともに位置調整手段１３によって昇降させて、凹状部ｏの形成を行う。一方、走査範囲Ａ内に入っていない場合は、位置調整手段１３によって、ステージ１４ａを走査範囲Ａ内に移動させた後に、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させるとともに位置調整手段１３によって昇降させて、凹状部ｏの形成を行う。すなわち、金属部材２´の接合面ＢＰ´における傾斜面ＴＰ´に対して加工用のレーザ光を垂直に照射することが可能である。つまり、傾斜面ＴＰ´を有する接合面ＢＰ´に対するレーザ光の入射角度を一定にすることが可能である。 After forming the first concave portion o, the second concave portion o is formed on the metal member 2 ′. Here, when the position formed by the second concave portion o is within the scanning range A of the scanning unit 12, the stage 14a is rotated by the rotating shaft 14b and the position adjusting unit 13 as described above. The concave portion o is formed by moving up and down. On the other hand, if not within the scanning range A, after the stage 14a is moved into the scanning range A by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above. The concave portion o is formed by raising and lowering. That is, it is possible to irradiate the processing laser beam perpendicularly to the inclined surface TP ′ on the joint surface BP ′ of the metal member 2 ′. That is, it is possible to make the incident angle of the laser beam constant with respect to the bonding surface BP ′ having the inclined surface TP ′.
　上述した工程を、凹状部ｏを形成する個数分、繰り返し行う（図１０は、２つ目の凹状部ｏを形成している状態を模式的に説明している。）。なお、同じ箇所に複数回レーザ光を照射することにより、１つの凹状部ｏを形成するようにしてもよい。 The above-described process is repeated for the number of the concave portions o to be formed (FIG. 10 schematically illustrates a state in which the second concave portion o is formed). In addition, you may make it form one concave part o by irradiating a laser beam to the same location in multiple times.
　・接合工程
　接合工程は、金属部材２´と樹脂部材３´とを互いに接合する工程であり、上述した接合用レーザ１１ｂを備えたレーザ装置１０を用いて行われる。 -Joining process A joining process is a process of joining metal member 2 'and resin member 3' mutually, and is performed using laser device 10 provided with laser 11b for joining mentioned above.
　本実施形態では、接合用レーザ１１ｂからのレーザ光を、透光性の樹脂部材３´と金属部材２´との接合面ＢＰ´に照射させ、金属部材２´を加熱させることにより金属部材２´と接触している樹脂部材３´に熱を伝え、樹脂部材３´を溶融させて接合させる方法について説明する。 In the present embodiment, the laser beam from the bonding laser 11b is applied to the bonding surface BP ′ between the translucent resin member 3 ′ and the metal member 2 ′, and the metal member 2 ′ is heated to thereby heat the metal member 2 ′. A method for transferring heat to the resin member 3 ′ in contact with ′ and melting and bonding the resin member 3 ′ will be described.
　まず、ステージ１４ａに載置された金属部材２´の接合面ＢＰ´に、樹脂部材３´を載置する（図１１参照）。そして、樹脂部材３を金属部材２の接合面ＢＰに加圧接触させる。また、走査手段１２の走査範囲Ａを超える位置における金属部材２´の凹状部ｏに樹脂部材３´を充填するため、位置調整手段１３によって、凹状部ｏが形成された位置が走査範囲内に入るように、ステージ１４ａを移動させる。 First, the resin member 3 ′ is placed on the joint surface BP ′ of the metal member 2 ′ placed on the stage 14a (see FIG. 11). Then, the resin member 3 is brought into pressure contact with the joint surface BP of the metal member 2. Further, since the resin member 3 ′ is filled in the concave portion o of the metal member 2 ′ at a position exceeding the scanning range A of the scanning means 12, the position where the concave portion o is formed by the position adjusting means 13 is within the scanning range. The stage 14a is moved to enter.
　次に、回転軸１４ｂによって、金属部材２´の接合面ＢＰ´に対して垂直に接合用レーザ１１ｂからのレーザ光が照射されるように、ステージ１４ａを回転させる。本実施形態では、まず最初に、金属部材２´の略水平面（膨出部Ｂ´の外縁部）の凹状部ｏに樹脂部材３´を充填するため、金属部材２´に対して垂直にレーザ光が照射されるように、ステージ１４ａを回転軸１４ｂによって微調整する（図１２参照）。 Next, the stage 14a is rotated by the rotating shaft 14b so that the laser beam from the bonding laser 11b is irradiated perpendicularly to the bonding surface BP ′ of the metal member 2 ′. In the present embodiment, first, the resin member 3 ′ is filled in the concave portion o of the substantially horizontal plane (outer edge portion of the bulging portion B ′) of the metal member 2 ′, so that the laser is perpendicular to the metal member 2 ′. The stage 14a is finely adjusted by the rotating shaft 14b so that light is irradiated (see FIG. 12).
　次に、位置調整手段１３によって、接合用レーザ１１ｂから照射されるレーザ光の焦点位置を、金属部材２´の接合面ＢＰ´に位置調節する。すなわち、ステージ１４ａを上下動させることにより、接合用のレーザ光の焦点位置に、金属部材２´の接合面ＢＰ´が移動される。 Next, the position adjusting means 13 adjusts the focal position of the laser light emitted from the bonding laser 11b on the bonding surface BP ′ of the metal member 2 ′. That is, by moving the stage 14a up and down, the joining surface BP 'of the metal member 2' is moved to the focal position of the joining laser beam.
　そして、金属部材２´の接合面ＢＰ´に対して接合用レーザ１１ｂからのレーザ光を連続発振によって照射する。 Then, the laser beam from the bonding laser 11b is irradiated to the bonding surface BP ′ of the metal member 2 ′ by continuous oscillation.
　樹脂部材３´と金属部材２´との接合面ＢＰ´に接合用レーザ１１ｂからのレーザ光を照射することにより、レーザ光のエネルギーが金属部材２´の内部で熱に変換され、金属部材２´の表面の温度が高くなる。これにより、金属部材２´の表面近傍の樹脂部材３´が溶融され、その樹脂部材３´が凹状部ｏに充填される。 By irradiating the bonding surface BP ′ between the resin member 3 ′ and the metal member 2 ′ with the laser beam from the bonding laser 11 b, the energy of the laser beam is converted into heat inside the metal member 2 ′. The surface temperature of ′ becomes high. Thereby, the resin member 3 ′ in the vicinity of the surface of the metal member 2 ′ is melted, and the resin member 3 ′ is filled in the concave portion o.
　１つ目の凹状部ｏに樹脂部材３´を充填した後、２つ目の凹状部ｏに樹脂部材３´を充填する。ここで、２つ目の凹状部ｏの位置が、走査手段１２の走査範囲Ａ内に入っている場合は、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させさせるとともに位置調整手段１３によって昇降させて、凹状部ｏに樹脂部材３´を充填する。一方、走査範囲Ａ内に入っていない場合は、位置調整手段１３によってステージ１４ａを走査範囲Ａ内に移動させた後に、上述したとおり、回転軸１４ｂによってステージ１４ａを回転させるとともに位置調整手段１３によって昇降させて、凹状部ｏに樹脂部材３´を充填する。このため、接合用のレーザ光が金属部材２´の接合面ＢＰ´に対して垂直な方向からその接合面ＢＰ´に沿って走査される。 After filling the first concave portion o with the resin member 3 ′, the second concave portion o is filled with the resin member 3 ′. Here, when the position of the second concave portion o is within the scanning range A of the scanning means 12, as described above, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 is moved up and down. Then, the concave portion o is filled with the resin member 3 ′. On the other hand, if not within the scanning range A, after the stage 14a is moved into the scanning range A by the position adjusting means 13, the stage 14a is rotated by the rotating shaft 14b and the position adjusting means 13 as described above. The concave portion o is filled with the resin member 3 ′ by moving up and down. For this reason, the laser beam for bonding is scanned along the bonding surface BP ′ from a direction perpendicular to the bonding surface BP ′ of the metal member 2 ′.
　上述した工程を、凹状部ｏの個数分、繰り返し行う（図１３は、２つ目の凹状部ｏに樹脂部材３´を充填している状態を模式的に説明している。） The above-described steps are repeated for the number of the concave portions o (FIG. 13 schematically illustrates a state in which the second concave portion o is filled with the resin member 3 ′).
　以上により、接合工程では、凹状部形成工程において接合面ＢＰ´に対して垂直方向に形成された凹状部ｏ内に、樹脂部材３´を充填することによって金属部材２´と樹脂部材３´とを接合した接合構造体１´を製造することができる（図１４参照）。 As described above, in the bonding step, the metal member 2 ′ and the resin member 3 ′ are filled by filling the resin member 3 ′ in the concave portion o formed in the direction perpendicular to the bonding surface BP ′ in the concave portion formation step. Can be manufactured (see FIG. 14).
　なお、上記に示した本発明の実施形態及び実施例はいずれも本発明を具体化した例であって、本発明の技術的範囲を限定する性格のものではない。例えば、第１部材を熱可塑性樹脂、又は、熱硬化性樹脂とし、第２部材を金属としてもよい。 The above-described embodiments and examples of the present invention are all examples of the present invention, and are not of a character that limits the technical scope of the present invention. For example, the first member may be a thermoplastic resin or a thermosetting resin, and the second member may be a metal.
１０    　　　レーザ装置
１１ａ  　　　加工用レーザ
１１ｂ  　　　接合用レーザ
１２    　　　走査手段
１３    　　　位置調整手段
１４    　　　回転手段
１４ａ  　　　ステージ
１４ｂ  　　　回転軸
１、１´　　　接合構造体
２、２´　　　金属部材
３、３´　　　樹脂部材
ｏ　　　　　　凹状部
ｔ　　　　　　突出部
ＢＰ、ＢＰ´　接合面
Ｂ´　　　　　膨出部
ＴＰ´　　　　傾斜面 DESCRIPTION OF SYMBOLS 10 Laser apparatus 11a Processing laser 11b Joining laser 12 Scanning means 13 Position adjusting means 14 Rotating means 14a Stage 14b Rotating shaft 1, 1 'Joining structure 2, 2' Metal member 3, 3 'Resin member o Concave part t Projection Part BP, BP ′ Joint surface B ′ Swelling part TP ′ Inclined surface

Claims (9)

  1. 　第１部材に第２部材を対峙させて接合する接合工程を備えた接合構造体の製造方法であって、
    　前記接合工程を行う前に、前記第１部材における接合面に前記第２部材が充填される凹状部を形成する凹状部形成工程が備えられており、
    　前記凹状部形成工程は、前記第１部材に凹状部を形成する加工用レーザの照射方向に対して、前記第１部材の接合面が垂直となるように、前記第１部材を回転させて行われることを特徴とする接合構造体の製造方法。     A method for manufacturing a joined structure including a joining step of joining a first member with a second member facing each other,
    Before performing the joining step, a concave portion forming step of forming a concave portion filled with the second member on the joining surface of the first member is provided,
    The concave portion forming step is performed by rotating the first member so that the joining surface of the first member is perpendicular to the irradiation direction of the processing laser for forming the concave portion on the first member. The manufacturing method of the joining structure characterized by the above-mentioned.
  2. 　請求項１に記載された接合構造体の製造方法であって、
    　前記レーザ照射は、前記第１部材の接合面に対して焦点位置を調整しながら行われることを特徴とする接合構造体の製造方法。     A method for manufacturing a joined structure according to claim 1,
    The method of manufacturing a joined structure, wherein the laser irradiation is performed while adjusting a focal position with respect to a joining surface of the first member.
  3. 　請求項１又は２に記載された接合構造体の製造方法であって、
    　前記接合工程は、前記第１部材と前記第２部材とを接合させる接合用レーザの照射方向に対して、前記接合面が垂直となるように、前記第１部材及び前記第２部材を回転させて行われることを特徴とする接合構造体の製造方法。     It is a manufacturing method of the joined structure according to claim 1 or 2,
    In the joining step, the first member and the second member are rotated so that the joining surface becomes perpendicular to the irradiation direction of the joining laser for joining the first member and the second member. The manufacturing method of the junction structure characterized by the above-mentioned.
  4. 　請求項１～３のいずれか１項に記載された接合構造体の製造方法であって、
    　前記第１部材における前記第２部材と対峙される面は、凸形状であることを特徴とする接合構造体の製造方法。     A method for manufacturing a joined structure according to any one of claims 1 to 3,
    The method of manufacturing a joined structure, wherein a surface of the first member facing the second member is a convex shape.
  5. 　請求項１～４のいずれか１項に記載された接合構造体の製造方法であって、
    　前記凹状部形成工程では、１パルスが複数のサブパルスで構成されるレーザ光を照射することによって前記凹状部を形成することを特徴とする接合構造体の製造方法。     A method for manufacturing a joined structure according to any one of claims 1 to 4,
    In the concave portion forming step, the concave portion is formed by irradiating a laser beam in which one pulse includes a plurality of subpulses.
  6. 　請求項１～５のいずれか１項に記載された接合構造体の製造方法であって、
    　前記第１部材には、金属、熱可塑性樹脂、又は、熱硬化性樹脂が用いられていることを特徴とする接合構造体の製造方法。     A method for producing a joined structure according to any one of claims 1 to 5,
    A metal, a thermoplastic resin, or a thermosetting resin is used for the first member.
  7. 　請求項１～６のいずれか１項に記載された接合構造体の製造方法であって、
    　前記第２部材には、レーザ光を透過する樹脂が用いられていることを特徴とする接合構造体の製造方法。     A method for producing a joined structure according to any one of claims 1 to 6,
    A method for manufacturing a joint structure, wherein the second member is made of a resin that transmits laser light.
  8. 　請求項１～７のいずれか１項に記載された接合構造体の製造方法によって製造された接合構造体。 A joint structure manufactured by the method for manufacturing a joint structure according to any one of claims 1 to 7.
  9. 　被照射部材に向けてレーザ光を照射するレーザと、
    　前記レーザの照射方向に対して前記被照射部材が垂直となるように、前記被照射部材を回転させる回転手段と、
    　が備えられており、
    　前記レーザは、１パルスが複数のサブパルスで構成されるレーザ光を照射することを特徴とするレーザ装置。     A laser that emits laser light toward the irradiated member;
    Rotating means for rotating the irradiated member so that the irradiated member is perpendicular to the laser irradiation direction;
    Is provided,
    The laser device irradiates a laser beam in which one pulse is composed of a plurality of sub-pulses.
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