WO2016140097A1 - Joining method, joined-structure production method, and joined structure - Google Patents

Joining method, joined-structure production method, and joined structure Download PDF

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Publication number
WO2016140097A1
WO2016140097A1 PCT/JP2016/055101 JP2016055101W WO2016140097A1 WO 2016140097 A1 WO2016140097 A1 WO 2016140097A1 JP 2016055101 W JP2016055101 W JP 2016055101W WO 2016140097 A1 WO2016140097 A1 WO 2016140097A1
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WIPO (PCT)
Prior art keywords
metal member
laser
heating device
joining
resin
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Application number
PCT/JP2016/055101
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French (fr)
Japanese (ja)
Inventor
和義 西川
Original Assignee
オムロン株式会社
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Publication date
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Publication of WO2016140097A1 publication Critical patent/WO2016140097A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44—Joining a heated non plastics element to a plastics element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
    • B29C66/939—Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges

Definitions

  • the first heating device may preheat the metal member by resistance heating, induction heating, or infrared heating.
  • a method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a step of forming a concave portion on the surface of the metal member, and a resin member on the surface of the metal member A resin member by irradiating the metal member with a laser by the second heating device in a state in which the metal member is preheated by the first heating device and the metal member is preheated by the first heating device. And a step of melting the slag into a concave portion.
  • the opening diameter of the open end of the perforated part 12 is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because if the opening diameter is less than 30 ⁇ m, the filling property of the resin member 2 is deteriorated and the anchor effect may be lowered. On the other hand, if the opening diameter exceeds 100 ⁇ m, the number of perforated portions 12 per unit area is reduced, and the anchor effect may be lowered.
  • Such a perforated part 12 is formed by a laser L1 in which one pulse is composed of a plurality of sub-pulses.
  • This laser L1 is suitable for forming the perforated portion 12 because energy can be easily concentrated in the depth direction.
  • the laser processing apparatus capable of irradiating such a laser L1 there can be mentioned fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON.
  • the method for manufacturing the joint structure 100 includes a method for bonding the metal member 1 and the resin member 2.
  • the coil 52 is disposed above the resin member 2, that is, on the surface 11 side with respect to the metal member 1. Further, as shown in FIG. 4, the bonding region R is disposed inside the coil 52.
  • the high-frequency induction heating device is an example of the “first heating device” in the present invention.
  • the metal member 1 is irradiated with the laser L2 on the surface 11 of the metal member 1 while the surface 11 of the metal member 1 is preheated by the high frequency induction heating device. 1 and the resin member 2 are joined.
  • laser bonding can be performed in a properly preheated state, so that occurrence of unmelted portions in the bonding region R can be suppressed. Thereby, improvement of joining quality can be aimed at.
  • preheating the metal member 1 laser bonding can be performed using a low-power laser heating device.
  • laser bonding it is possible to form the bonding region R with high accuracy and to suppress overheating of the region other than the bonding region R.
  • the joining method of this embodiment is particularly effective when the material of the metal member 1 is a material having a high thermal conductivity such as copper or aluminum.
  • the anchor effect can be improved by forming the protruding portion 13 in the perforated portion 12.
  • FIG. 6 is a diagram for explaining a preheating method according to a second modification of the present embodiment.
  • the metal member 1 may be held by a jig 55 incorporating a heater rod 55a, and the metal member 1 may be preheated by the jig 55 (heater rod 55a). That is, the metal member 1 may be preheated by resistance heating.
  • the jig 55 is an example of the “first heating device” in the present invention.
  • Example 1 First, a method for manufacturing a bonded structure according to Example 1 will be described.
  • a drilling part was formed by irradiating a processing laser to the joining region on the surface of the metal member.
  • the joining region is a linear region having a length of 12 mm and a width of 2 mm, and is provided so as to extend in the width direction of the metal member.
  • This laser irradiation was performed using an Omron fiber laser marker MX-Z2000.
  • the laser irradiation conditions are as follows.
  • the metal member and the resin member were joined by irradiating a joining laser from the resin member side toward the joining region of the metal member while the metal member was preheated by the high frequency induction heating device. Specifically, the metal member is further heated by laser irradiation, and the surface of the metal member becomes higher than the melting temperature of the resin member. The heat of the metal member is transmitted to the resin member, and the resin member is melted by the heat. For this reason, the molten resin member is filled in the perforated portion, and then the resin member is solidified. Moreover, the irradiation conditions of the laser for joining are as follows.
  • Example 2 the metal member was preheated using a plate heater as in the first modification described above.
  • the metal member was preheated using a jig with a built-in heater rod as in the second modification described above.
  • the metal member was preheated using an infrared heater as in the third modification described above.
  • the remaining points of the second to fourth embodiments are the same as those of the first embodiment.
  • the protruding portion 13 is formed in the perforated portion 12 is shown, but the present invention is not limited to this, and the protruding portion may not be formed in the perforated portion.
  • the perforated part may be formed in a cylindrical shape or a mortar shape.
  • the surface opposite to the surface on which the resin member of the metal member is disposed (joining region) It is also possible to irradiate a laser for bonding on the surface opposite to the surface on which the film is provided.
  • the resin member may not be transparent to the bonding laser.
  • the example in which the coil 52 of the high-frequency induction heating device is disposed on the front surface 11 side of the metal member 1 is shown.
  • the metal member may be disposed on the opposite side of the resin member.
  • the metal member 1 is preheated by the plate heater 54 in the first modification of the present embodiment.
  • the present invention is not limited to this, and the metal member may be preheated by a band heater or a ribbon heater.
  • the bonding laser L2 may be scanned a plurality of times.
  • a temperature sensor (not shown) for detecting the temperature of the metal member 1 may be provided, and the number of scans may be controlled according to the detection result of the temperature sensor. For example, the scanning of the joining laser L2 may be repeated until the metal member 1 reaches a preset temperature or higher.
  • the present invention is applicable to a joining method for joining a metal member and a resin member, a method for manufacturing a joined structure, and a joined structure.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)

Abstract

This joining method for joining a resin member to a metal member having recesses formed in the surface is provided with: a step in which the resin member is arranged on the surface of the metal member; a step in which the metal member is preheated by a first heating device; and a step in which a second heating device is used to irradiate the metal member with a laser, while the metal member is in a state of having been preheated by the first heating device, to melt the resin member and cause the resin member to fill the recesses.

Description

接合方法、接合構造体の製造方法および接合構造体Bonding method, manufacturing method of bonded structure, and bonded structure
　本発明は、接合方法、接合構造体の製造方法および接合構造体に関する。 The present invention relates to a bonding method, a method for manufacturing a bonded structure, and a bonded structure.
　従来、レーザ光に対する透過率が大きい第１樹脂材と、レーザ光に対する透過率が小さい第２樹脂材とを接合する接合方法が知られている（たとえば、特許文献１参照）。 Conventionally, there has been known a joining method in which a first resin material having a high transmittance with respect to laser light and a second resin material having a low transmittance with respect to laser light are joined (for example, see Patent Document 1).
　特許文献１の接合方法では、第１樹脂材と第２樹脂材とが当接界面で接触するように配置される。そして、予備加熱用レーザ光が第１樹脂材側から当接界面に照射されることにより、当接界面が予備加熱される。その後、溶着用レーザ光が第１樹脂材側から当接界面に照射されることにより、当接界面で第１樹脂材と第２樹脂材とが溶着される。このように、当接界面を予備加熱する工程を設けることによって、第１樹脂材と第２樹脂材との溶着強度を向上させることが可能である。なお、予備加熱用レーザ光のスポット径は、溶着用レーザ光のスポット径に比べて大きくされている。 In the joining method of Patent Document 1, the first resin material and the second resin material are arranged so as to contact each other at the contact interface. The contact interface is preheated by irradiating the contact interface with the preheating laser beam from the first resin material side. Thereafter, the welding laser beam is irradiated from the first resin material side to the contact interface, whereby the first resin material and the second resin material are welded at the contact interface. Thus, by providing the step of preheating the contact interface, it is possible to improve the welding strength between the first resin material and the second resin material. The spot diameter of the preheating laser beam is set larger than the spot diameter of the welding laser beam.
特開２００７－１８２００３号公報JP 2007-182003 A
　ここで、金属部材と樹脂部材とを接合する際におけるその接合品質を向上させるために、特許文献１に記載の技術を適用することが考えられる。すなわち、凹状部が形成された金属部材と樹脂部材とを隣接配置した状態で、予熱用のレーザを照射した後に、接合用のレーザを照射することにより、樹脂部材を溶融させて凹状部に充填することによって、金属部材と樹脂部材とを接合することが考えられる。 Here, in order to improve the joining quality when joining the metal member and the resin member, it is conceivable to apply the technique described in Patent Document 1. In other words, with the metal member and the resin member with the concave part formed adjacent to each other, the preheating laser is irradiated and then the bonding laser is irradiated to melt the resin member and fill the concave part. By doing so, it is conceivable to join the metal member and the resin member.
　しかしながら、金属部材は熱伝導率が高いことから、予熱用のレーザを照射した後に接合用のレーザが照射されるまでの間に熱が拡散されやすいので、適切に予熱された状態を維持しにくいという問題点がある。そして、適切に予熱されていない場合には、金属部材と樹脂部材との接合領域において、樹脂部材に未溶融箇所が発生し、接合品質が低下するおそれがある。 However, since the metal member has high thermal conductivity, heat is likely to be diffused between the time when the laser for preheating is irradiated and the time when the laser for bonding is irradiated, so that it is difficult to maintain a properly preheated state. There is a problem. And when it is not preheated appropriately, in the joining area | region of a metal member and a resin member, an unmelted location may generate | occur | produce in a resin member and there exists a possibility that joining quality may fall.
　本発明は、上記の課題を解決するためになされたものであり、本発明の目的は、接合品質の向上を図ることが可能な接合方法、接合構造体の製造方法および接合構造体を提供することである。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a bonding method, a method for manufacturing a bonded structure, and a bonded structure capable of improving the bonding quality. That is.
　本発明による接合方法は、表面に凹状部が形成された金属部材に樹脂部材を接合する接合方法であり、金属部材の表面に樹脂部材を配置する工程と、第１加熱装置により金属部材を予熱する工程と、第１加熱装置により金属部材が予熱されている状態で、第２加熱装置により金属部材にレーザを照射することによって、樹脂部材を溶融させて凹状部に充填する工程とを備える。 A joining method according to the present invention is a joining method in which a resin member is joined to a metal member having a concave portion formed on the surface, and the step of placing the resin member on the surface of the metal member and preheating the metal member by the first heating device. And a step of irradiating the metal member with a laser with the second heating device while the metal member is preheated by the first heating device to melt the resin member and filling the concave portion.
　上記接合方法において、第１加熱装置は、抵抗加熱、誘導加熱または赤外線加熱により金属部材を予熱するようにしてもよい。 In the above bonding method, the first heating device may preheat the metal member by resistance heating, induction heating, or infrared heating.
　上記接合方法において、金属部材の凹状部は、平面的に見て円形に形成され、その内周面に内側に突出する突出部を有していてもよい。 In the above joining method, the concave portion of the metal member may be formed in a circular shape when seen in a plan view, and may have a protruding portion protruding inward on the inner peripheral surface thereof.
　本発明による接合構造体の製造方法は、金属部材および樹脂部材が接合された接合構造体の製造方法であり、金属部材の表面に凹状部を形成する工程と、金属部材の表面に樹脂部材を配置する工程と、第１加熱装置により金属部材を予熱する工程と、第１加熱装置により金属部材が予熱されている状態で、第２加熱装置により金属部材にレーザを照射することによって、樹脂部材を溶融させて凹状部に充填する工程とを備える。 A method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a step of forming a concave portion on the surface of the metal member, and a resin member on the surface of the metal member A resin member by irradiating the metal member with a laser by the second heating device in a state in which the metal member is preheated by the first heating device and the metal member is preheated by the first heating device. And a step of melting the slag into a concave portion.
　本発明による接合構造体は、上記した接合構造体の製造方法によって製造されている。 The bonded structure according to the present invention is manufactured by the above-described manufacturing method of the bonded structure.
　本発明の接合方法、接合構造体の製造方法および接合構造体によれば、接合品質の向上を図ることができる。 According to the bonding method, the manufacturing method of the bonded structure, and the bonded structure of the present invention, the bonding quality can be improved.
本発明の一実施形態による接合構造体の断面を示した模式図である。It is the schematic diagram which showed the cross section of the joining structure body by one Embodiment of this invention. 接合構造体の製造方法を説明するための図であって、金属部材に穿孔部を形成する工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process of forming a perforated part in a metal member. 接合構造体の製造方法を説明するための図であって、金属部材に樹脂部材を接合する工程を示した図である。It is a figure for demonstrating the manufacturing method of a joining structure, Comprising: It is the figure which showed the process of joining the resin member to a metal member. 接合領域とコイルとの位置関係を説明するための図である。It is a figure for demonstrating the positional relationship of a joining area | region and a coil. 本実施形態の第１変形例による予熱方法を説明するための図である。It is a figure for demonstrating the preheating method by the 1st modification of this embodiment. 本実施形態の第２変形例による予熱方法を説明するための図である。It is a figure for demonstrating the preheating method by the 2nd modification of this embodiment. 本実施形態の第３変形例による予熱方法を説明するための図である。It is a figure for demonstrating the preheating method by the 3rd modification of this embodiment.
　以下、本発明の一実施形態について図面を参照して説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
　まず、図１を参照して、本発明の一実施形態による接合構造体１００について説明する。 First, a bonded structure 100 according to an embodiment of the present invention will be described with reference to FIG.
　接合構造体１００は、図１に示すように、金属部材１および樹脂部材２を備え、金属部材１および樹脂部材２が接合されている。なお、図１では、見やすさを考慮してハッチングを省略した。 1, the bonded structure 100 includes a metal member 1 and a resin member 2, and the metal member 1 and the resin member 2 are bonded to each other. In FIG. 1, hatching is omitted for ease of viewing.
　金属部材１の材料の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成型体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。 Examples of the material of the metal member 1 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molding may be sufficient and zinc die-casting, aluminum die-casting, powder metallurgy, etc. may be sufficient.
　金属部材１の表面１１には、接合領域Ｒに穿孔部１２が形成され、その穿孔部１２には、樹脂部材２が充填されて固化されている。これにより、金属部材１と樹脂部材２とがアンカー効果によって機械的に接合されている。なお、穿孔部１２は、本発明の「凹状部」の一例である。 A perforated portion 12 is formed in the bonding region R on the surface 11 of the metal member 1, and the perforated portion 12 is filled with the resin member 2 and solidified. Thereby, the metal member 1 and the resin member 2 are mechanically joined by the anchor effect. The perforated part 12 is an example of the “concave part” in the present invention.
　穿孔部１２は、平面的に見てほぼ円形の非貫通孔であり、金属部材１の接合領域Ｒに複数形成されている。穿孔部１２の内周面には、内側に突出する突出部１３が形成されている。突出部１３は、周方向における全長にわたって形成されており、環状に形成されている。なお、接合領域Ｒ（図４参照）は、たとえば平面的に見て矩形状に形成されている。 The perforated part 12 is a substantially circular non-through hole when seen in a plan view, and a plurality of perforated parts 12 are formed in the joining region R of the metal member 1. A projecting portion 13 projecting inward is formed on the inner peripheral surface of the perforated portion 12. The protrusion 13 is formed over the entire length in the circumferential direction, and is formed in an annular shape. The junction region R (see FIG. 4) is formed in a rectangular shape when viewed in plan, for example.
　具体的には、穿孔部１２は、深さ方向において表面１１側から底部に向けて開口径が大きくなる拡径部と、深さ方向において表面１１側から底部に向けて開口径が小さくなる縮径部とが連なるように形成されている。拡径部は、表面１１側に配置され、曲線状に拡径するように形成されている。縮径部は、底部側に配置され、曲線状に縮径するように形成されている。すなわち、拡径部により突出部１３が構成されている。 Specifically, the perforated part 12 has a diameter-enlarged part in which the opening diameter increases from the surface 11 side to the bottom part in the depth direction and a contraction in which the opening diameter decreases from the surface 11 side to the bottom part in the depth direction. It is formed so as to be continuous with the diameter portion. The enlarged diameter portion is disposed on the surface 11 side and is formed so as to expand in a curved shape. The reduced diameter portion is disposed on the bottom side and is formed to reduce the diameter in a curved shape. That is, the protruding portion 13 is configured by the enlarged diameter portion.
　穿孔部１２の開放端の開口径は、３０μｍ以上、１００μｍ以下が好ましい。これは、開口径が３０μｍを下回ると、樹脂部材２の充填性が悪化してアンカー効果が低下する場合があるためである。一方、開口径が１００μｍを上回ると、単位面積あたりの穿孔部１２の数が減少してアンカー効果が低下する場合があるためである。 The opening diameter of the open end of the perforated part 12 is preferably 30 μm or more and 100 μm or less. This is because if the opening diameter is less than 30 μm, the filling property of the resin member 2 is deteriorated and the anchor effect may be lowered. On the other hand, if the opening diameter exceeds 100 μm, the number of perforated portions 12 per unit area is reduced, and the anchor effect may be lowered.
　また、穿孔部１２の間隔（所定の穿孔部１２の中心と、所定の穿孔部１２と隣接する穿孔部１２の中心との距離）は、２００μｍ以下であることが好ましい。これは、穿孔部１２の間隔が２００μｍを上回ると、単位面積あたりの穿孔部１２の数が減少してアンカー効果が低下する場合があるためである。 Further, the interval between the perforated portions 12 (the distance between the center of the predetermined perforated portion 12 and the center of the perforated portion 12 adjacent to the predetermined perforated portion 12) is preferably 200 μm or less. This is because if the interval between the perforated portions 12 exceeds 200 μm, the number of perforated portions 12 per unit area may decrease and the anchor effect may be reduced.
　この穿孔部１２は、たとえば加工用のレーザＬ１（図２参照）によって形成されている。なお、レーザＬ１の種類としては、パルス発振が可能なものが好ましく、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ4レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択でき、波長を考慮すると、ファイバレーザ、ＹＡＧレーザ、ＹＡＧレーザの第２高調波、ＹＶＯ4レーザ、半導体レーザが好ましい。 The perforated portion 12 is formed by, for example, a processing laser L1 (see FIG. 2). The type of laser L1 is preferably a laser capable of pulse oscillation, and can be selected from a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser. The second harmonic of YAG laser, YVO 4 laser, and semiconductor laser are preferable.
　このような穿孔部１２は、１パルスが複数のサブパルスで構成されるレーザＬ１によって形成される。このレーザＬ１では、エネルギを深さ方向に集中させやすいので、穿孔部１２を形成するのに好適である。このようなレーザＬ１を照射可能なレーザ加工装置の一例としては、オムロン製のファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を挙げることができる。 Such a perforated part 12 is formed by a laser L1 in which one pulse is composed of a plurality of sub-pulses. This laser L1 is suitable for forming the perforated portion 12 because energy can be easily concentrated in the depth direction. As an example of the laser processing apparatus capable of irradiating such a laser L1, there can be mentioned fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON.
　上記ファイバレーザマーカによる加工条件としては、サブパルスの１周期が１５ｎｓ以下であることが好ましい。これは、サブパルスの１周期が１５ｎｓを超えると、熱伝導によりエネルギが拡散しやすくなり、穿孔部１２を形成しにくくなるためである。なお、サブパルスの１周期は、サブパルスの１回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。 As processing conditions by the fiber laser marker, it is preferable that one period of the sub-pulse is 15 ns or less. This is because when one period of the sub-pulse exceeds 15 ns, energy is easily diffused due to heat conduction and it is difficult to form the perforated portion 12. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
　また、１パルスのサブパルス数は、２以上５０以下であることが好ましい。これは、サブパルス数が５０を超えると、サブパルスの単位あたりの出力が小さくなり、穿孔部１２を形成しにくくなるためである。 Also, the number of subpulses in one pulse is preferably 2 or more and 50 or less. This is because when the number of subpulses exceeds 50, the output per unit of subpulses becomes small and it becomes difficult to form the perforated portion 12.
　樹脂部材２は、たとえば、接合用のレーザＬ２（図３参照）に対して透過性を有する熱可塑性樹脂または熱硬化性樹脂である。 The resin member 2 is, for example, a thermoplastic resin or a thermosetting resin that is transmissive to the bonding laser L2 (see FIG. 3).
　熱可塑性樹脂の一例としては、ＰＶＣ（ポリ塩化ビニル）、ＰＳ（ポリスチレン）、ＡＳ（アクリロニトリル・スチレン）、ＡＢＳ（アクリロニトリル・ブタジエン・スチレン）、ＰＭＭＡ（ポリメチルメタクリレート）、ＰＥ（ポリエチレン）、ＰＰ（ポリプロピレン）、ＰＣ（ポリカーボネート）、ｍ－ＰＰＥ（変性ポリフェニレンエーテル）、ＰＡ６（ポリアミド６）、ＰＡ６６（ポリアミド６６）、ＰＯＭ（ポリアセタール）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＳＦ（ポリサルホン）、ＰＡＲ（ポリアリレート）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＥＳ（ポリエーテルサルホン）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＡＩ（ポリアミドイミド）、ＬＣＰ（液晶ポリマー）、ＰＶＤＣ（ポリ塩化ビニリデン）、ＰＴＦＥ（ポリテトラフルオロエチレン）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、および、ＰＶＤＦ（ポリフッ化ビニリデン）が挙げられる。また、ＴＰＥ（熱可塑性エラストマ）であってもよく、ＴＰＥの一例としては、ＴＰＯ（オレフィン系）、ＴＰＳ（スチレン系）、ＴＰＥＥ（エステル系）、ＴＰＵ（ウレタン系）、ＴＰＡ（ナイロン系）、および、ＴＰＶＣ（塩化ビニル系）が挙げられる。 Examples of thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI Polyamideimide), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), and include PVDF (poly (vinylidene fluoride)) it is. TPE (thermoplastic elastomer) may also be used, and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
　熱硬化性樹脂の一例としては、ＥＰ（エポキシ）、ＰＵＲ（ポリウレタン）、ＵＦ（ユリアホルムアルデヒド）、ＭＦ（メラミンホルムアルデヒド）、ＰＦ（フェノールホルムアルデヒド）、ＵＰ（不飽和ポリエステル）、および、ＳＩ（シリコーン）が挙げられる。また、ＦＲＰ（繊維強化プラスチック）であってもよい。 Examples of thermosetting resins include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
　なお、樹脂部材２には、充填剤が添加されていてもよい。充填剤の一例としては、無機系充填剤（ガラス繊維、無機塩類など）、金属系充填剤、有機系充填剤、および、炭素繊維などが挙げられる。 Note that a filler may be added to the resin member 2. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
　－接合構造体の製造方法－
　次に、図１～図４を参照して、本実施形態による接合構造体１００の製造方法について説明する。なお、接合構造体１００の製造方法には、金属部材１と樹脂部材２との接合方法が含まれている。 -Manufacturing method of bonded structure-
Next, with reference to FIGS. 1 to 4, the method for manufacturing the joint structure 100 according to the present embodiment will be described. Note that the method for manufacturing the bonded structure 100 includes a method for bonding the metal member 1 and the resin member 2.
　まず、図２に示すように、レーザ加工装置のヘッド５１から金属部材１の表面１１の接合領域Ｒ（図１参照）にレーザＬ１を照射する。これにより、金属部材１の接合領域Ｒに穿孔部１２を形成するとともに、その内周面に突出部１３を形成する。このレーザＬ１は、たとえばファイバレーザであり、１パルスが複数のサブパルスで構成されている。 First, as shown in FIG. 2, the laser beam L1 is irradiated from the head 51 of the laser processing apparatus to the bonding region R (see FIG. 1) of the surface 11 of the metal member 1. Thereby, while forming the perforated part 12 in the joining area | region R of the metal member 1, the protrusion part 13 is formed in the internal peripheral surface. The laser L1 is, for example, a fiber laser, and one pulse is composed of a plurality of subpulses.
　次に、図３に示すように、金属部材１の表面１１に樹脂部材２が積層され、その樹脂部材２が金属部材１側に押し付けられる。そして、本実施形態では、高周波誘導加熱装置により金属部材１を予熱する。具体的には、高周波誘導加熱装置のコイル５２に高周波の交流電流を流すことにより、金属部材１で渦電流が発生し、その渦電流によるジュール熱で金属部材１が加熱される。すなわち、誘導加熱により金属部材１が予熱される。この高周波誘導加熱装置による加熱条件は、金属部材１の表面１１が樹脂部材２の溶融温度よりも低い所定温度になるように設定されている。つまり、後述する接合用のレーザＬ２の照射前に、金属部材１が予めほぼ所定温度で維持されるようになっている。 Next, as shown in FIG. 3, the resin member 2 is laminated on the surface 11 of the metal member 1, and the resin member 2 is pressed against the metal member 1 side. In this embodiment, the metal member 1 is preheated by the high frequency induction heating device. Specifically, an eddy current is generated in the metal member 1 by flowing a high-frequency alternating current through the coil 52 of the high-frequency induction heating device, and the metal member 1 is heated by Joule heat due to the eddy current. That is, the metal member 1 is preheated by induction heating. The heating conditions by this high frequency induction heating device are set so that the surface 11 of the metal member 1 has a predetermined temperature lower than the melting temperature of the resin member 2. That is, the metal member 1 is maintained in advance at a substantially predetermined temperature before irradiation with a joining laser L2 described later.
　なお、コイル５２は、樹脂部材２の上方、すなわち金属部材１に対して表面１１側に配置される。また、図４に示すように、コイル５２の内側に接合領域Ｒが配置される。また、高周波誘導加熱装置は、本発明の「第１加熱装置」の一例である。 The coil 52 is disposed above the resin member 2, that is, on the surface 11 side with respect to the metal member 1. Further, as shown in FIG. 4, the bonding region R is disposed inside the coil 52. The high-frequency induction heating device is an example of the “first heating device” in the present invention.
　そして、高周波誘導加熱装置により金属部材１の表面１１が予熱されている状態で、レーザ加熱装置のヘッド５３から金属部材１の表面１１の接合領域ＲにレーザＬ２を照射する。これにより、予熱されている金属部材１がさらに加熱され、金属部材１の表面１１が樹脂部材２の溶融温度よりも高くなる。そして、金属部材１の熱が樹脂部材２に伝達され、その熱により樹脂部材２が溶融される。このため、その溶融された樹脂部材２が穿孔部１２に充填され、その後樹脂部材２が固化される。これにより、金属部材１と樹脂部材２とがアンカー効果によって機械的に接合される。このレーザＬ２は、たとえば半導体レーザであり、樹脂部材２側から金属部材１の接合領域Ｒに向けて照射される。なお、レーザ加熱装置は、本発明の「第２加熱装置」の一例である。 Then, in a state where the surface 11 of the metal member 1 is preheated by the high frequency induction heating device, the laser beam L2 is irradiated from the head 53 of the laser heating device to the bonding region R of the surface 11 of the metal member 1. Thereby, the preheated metal member 1 is further heated, and the surface 11 of the metal member 1 becomes higher than the melting temperature of the resin member 2. And the heat of the metal member 1 is transmitted to the resin member 2, and the resin member 2 is melted by the heat. For this reason, the melted resin member 2 is filled in the perforated portion 12, and then the resin member 2 is solidified. Thereby, the metal member 1 and the resin member 2 are mechanically joined by the anchor effect. The laser L2 is, for example, a semiconductor laser, and is irradiated from the resin member 2 side toward the bonding region R of the metal member 1. The laser heating device is an example of the “second heating device” in the present invention.
　このようにして、図１に示す接合構造体１００が製造される。 In this way, the joined structure 100 shown in FIG. 1 is manufactured.
　－効果－
　本実施形態では、上記のように、高周波誘導加熱装置により金属部材１の表面１１を予熱している状態で、レーザ加熱装置により金属部材１の表面１１にレーザＬ２を照射することにより、金属部材１および樹脂部材２を接合する。このように構成することによって、適切に予熱した状態でレーザ接合することができるので、接合領域Ｒにおいて未溶融箇所の発生を抑制することができる。これにより、接合品質の向上を図ることができる。また、金属部材１を予熱することにより、低出力のレーザ加熱装置を用いてレーザ接合することができる。また、レーザ接合することにより、接合領域Ｒを高い精度で形成するとともに、接合領域Ｒ以外の領域が過熱されるのを抑制することができる。なお、本実施形態の接合方法は、金属部材１の材料が銅やアルミニウムなどの熱伝導率が高いものである場合に、特に有効である。 -effect-
In the present embodiment, as described above, the metal member 1 is irradiated with the laser L2 on the surface 11 of the metal member 1 while the surface 11 of the metal member 1 is preheated by the high frequency induction heating device. 1 and the resin member 2 are joined. By configuring in this way, laser bonding can be performed in a properly preheated state, so that occurrence of unmelted portions in the bonding region R can be suppressed. Thereby, improvement of joining quality can be aimed at. Further, by preheating the metal member 1, laser bonding can be performed using a low-power laser heating device. Further, by performing laser bonding, it is possible to form the bonding region R with high accuracy and to suppress overheating of the region other than the bonding region R. In addition, the joining method of this embodiment is particularly effective when the material of the metal member 1 is a material having a high thermal conductivity such as copper or aluminum.
　また、本実施形態では、高周波誘導加熱装置により金属部材１を加熱することによって、金属部材１の表面１１を直接加熱するとともに、その加熱される領域を容易に設定することができる。 Further, in the present embodiment, by heating the metal member 1 with the high frequency induction heating device, the surface 11 of the metal member 1 can be directly heated and the heated region can be easily set.
　また、本実施形態では、穿孔部１２に突出部１３を形成することによって、アンカー効果の向上を図ることができる。 In this embodiment, the anchor effect can be improved by forming the protruding portion 13 in the perforated portion 12.
　－予熱方法の変形例－
　次に、図５～図７を参照して、金属部材１を予熱する予熱方法の変形例について説明する。 -Modification of preheating method-
Next, a modification of the preheating method for preheating the metal member 1 will be described with reference to FIGS.
　図５は、本実施形態の第１変形例による予熱方法を説明するための図である。図５に示すように、金属部材１の表面１１とは反対側の面に接触するようにプレートヒータ５４を配置し、そのプレートヒータ５４により金属部材１を予熱するようにしてもよい。すなわち、抵抗加熱（間接抵抗加熱）により金属部材１を予熱してもよい。なお、プレートヒータ５４は、本発明の「第１加熱装置」の一例である。 FIG. 5 is a diagram for explaining a preheating method according to a first modification of the present embodiment. As shown in FIG. 5, a plate heater 54 may be disposed so as to contact a surface opposite to the surface 11 of the metal member 1, and the metal member 1 may be preheated by the plate heater 54. That is, the metal member 1 may be preheated by resistance heating (indirect resistance heating). The plate heater 54 is an example of the “first heating device” in the present invention.
　図６は、本実施形態の第２変形例による予熱方法を説明するための図である。図６に示すように、ヒータロッド５５ａを内蔵する治具５５により金属部材１を保持し、その治具５５（ヒータロッド５５ａ）により金属部材１を予熱するようにしてもよい。すなわち、抵抗加熱により金属部材１を予熱してもよい。なお、治具５５は、本発明の「第１加熱装置」の一例である。 FIG. 6 is a diagram for explaining a preheating method according to a second modification of the present embodiment. As shown in FIG. 6, the metal member 1 may be held by a jig 55 incorporating a heater rod 55a, and the metal member 1 may be preheated by the jig 55 (heater rod 55a). That is, the metal member 1 may be preheated by resistance heating. The jig 55 is an example of the “first heating device” in the present invention.
　図７は、本実施形態の第３変形例による予熱方法を説明するための図である。図７に示すように、金属部材１の表面１１とは反対側の面に離間するように赤外線ヒータ５６を配置し、その赤外線ヒータ５６により金属部材１を予熱するようにしてもよい。すなわち、赤外線加熱により金属部材１を予熱してもよい。なお、赤外線ヒータ５６は、本発明の「第１加熱装置」の一例である。 FIG. 7 is a diagram for explaining a preheating method according to a third modification of the present embodiment. As shown in FIG. 7, an infrared heater 56 may be disposed so as to be separated from the surface opposite to the surface 11 of the metal member 1, and the metal member 1 may be preheated by the infrared heater 56. That is, the metal member 1 may be preheated by infrared heating. The infrared heater 56 is an example of the “first heating device” in the present invention.
　－実験例－
　次に、上記した本実施形態の効果を確認するために行った実験例について説明する。 -Experimental example-
Next, an experimental example performed to confirm the effect of the above-described embodiment will be described.
　この実験例では、本実施形態に対応する実施例１～４による接合構造体を作製し、それらについての接合評価を行った。 In this experimental example, bonded structures according to Examples 1 to 4 corresponding to this embodiment were produced, and bonding evaluation was performed on them.
　まず、実施例１による接合構造体の作製方法について説明する。 First, a method for manufacturing a bonded structure according to Example 1 will be described.
　実施例１の接合構造体では、金属部材の材料としてアルミニウム（Ａ５０５２）を用いた。この金属部材は、板状に形成されており、長さが４５ｍｍであり、幅が１５ｍｍであり、厚みが３ｍｍである。 In the joined structure of Example 1, aluminum (A5052) was used as the material of the metal member. This metal member is formed in a plate shape, has a length of 45 mm, a width of 15 mm, and a thickness of 3 mm.
　そして、金属部材の表面の接合領域に加工用のレーザを照射して穿孔部を形成した。なお、接合領域は、長さが１２ｍｍで幅が２ｍｍの線状領域であり、金属部材の幅方向に延びるように設けられている。このレーザの照射は、オムロン製のファイバレーザマーカＭＸ－Ｚ２０００を用いて行った。レーザの照射条件は、以下のとおりである。 Then, a drilling part was formed by irradiating a processing laser to the joining region on the surface of the metal member. The joining region is a linear region having a length of 12 mm and a width of 2 mm, and is provided so as to extend in the width direction of the metal member. This laser irradiation was performed using an Omron fiber laser marker MX-Z2000. The laser irradiation conditions are as follows.
　＜加工用のレーザ照射条件＞
　レーザ：ファイバレーザ（波長１０６２ｎｍ）
　周波数：１０ｋＨｚ
　出力：２．５Ｗ
　走査速度：６５０ｍｍ／ｓｅｃ
　走査回数：１０～５０回
　照射間隔：６５μｍ
　サブパルス数：２０
　なお、周波数は、複数（この例では２０）のサブパルスによって構成されるパルスの周波数である。つまり、この照射条件では、１秒間に６５０ｍｍ移動しながら６５μｍの間隔で１万回レーザ（パルス）を照射し、そのパルスが２０のサブパルスによって構成されている。なお、走査回数は、レーザが同じ箇所に繰り返し照射される回数である。 <Laser irradiation conditions for processing>
Laser: Fiber laser (wavelength 1062nm)
Frequency: 10kHz
Output: 2.5W
Scanning speed: 650mm / sec
Number of scans: 10-50 times Irradiation interval: 65 μm
Number of subpulses: 20
The frequency is a frequency of a pulse constituted by a plurality (20 in this example) of sub-pulses. That is, under this irradiation condition, laser (pulse) is irradiated 10,000 times at intervals of 65 μm while moving 650 mm per second, and the pulse is composed of 20 sub-pulses. Note that the number of scans is the number of times the laser is repeatedly irradiated to the same location.
　このように、１パルスが複数のサブパルスで構成されるレーザを照射することにより、金属部材の接合領域には穿孔部が形成されるとともに、その穿孔部の内周面に突出部が形成される。 In this way, by irradiating a laser in which one pulse is composed of a plurality of subpulses, a perforated part is formed in the joining region of the metal member, and a protruding part is formed on the inner peripheral surface of the perforated part. .
　その後、金属部材の接合領域に板状の樹脂部材が積層される。この樹脂部材としてはＰＭＭＡ（ポリメチルメタクリレート）を用いた。そして、高周波誘導加熱装置を用いて金属部材を加熱した。なお、この加熱は、金属部材の接合領域を含む領域に対して行った。また、加熱条件は、周波数を４００ｋＨｚとし、金属部材の表面が樹脂部材の溶融温度（１６０℃）よりも低い所定温度になるように設定されている。すなわち、接合用のレーザを照射する前に、金属部材が所定温度で維持されるように予熱される。 Thereafter, a plate-like resin member is laminated on the joining region of the metal member. PMMA (polymethyl methacrylate) was used as this resin member. And the metal member was heated using the high frequency induction heating apparatus. In addition, this heating was performed with respect to the area | region containing the joining area | region of a metal member. The heating conditions are set so that the frequency is 400 kHz and the surface of the metal member is at a predetermined temperature lower than the melting temperature (160 ° C.) of the resin member. That is, before irradiating the bonding laser, the metal member is preheated so as to be maintained at a predetermined temperature.
　そして、高周波誘導加熱装置により金属部材が予熱されている状態で、樹脂部材側から金属部材の接合領域に向けて接合用のレーザを照射することにより、金属部材と樹脂部材とを接合した。具体的には、レーザの照射により金属部材がさらに加熱され、金属部材の表面が樹脂部材の溶融温度よりも高くなる。そして、金属部材の熱が樹脂部材に伝達され、その熱により樹脂部材が溶融される。このため、その溶融された樹脂部材が穿孔部に充填され、その後樹脂部材が固化される。また、接合用のレーザの照射条件は、以下のとおりである。 Then, the metal member and the resin member were joined by irradiating a joining laser from the resin member side toward the joining region of the metal member while the metal member was preheated by the high frequency induction heating device. Specifically, the metal member is further heated by laser irradiation, and the surface of the metal member becomes higher than the melting temperature of the resin member. The heat of the metal member is transmitted to the resin member, and the resin member is melted by the heat. For this reason, the molten resin member is filled in the perforated portion, and then the resin member is solidified. Moreover, the irradiation conditions of the laser for joining are as follows.
　＜接合用のレーザ照射条件＞
　レーザ：半導体レーザ（波長８０８ｎｍ）
　発振モード：連続発振
　出力：３０Ｗ
　焦点径：４ｍｍ
　走査速度：１ｍｍ／ｓｅｃ
　密着圧力：０．６ＭＰａ
　このようにして、実施例１の接合構造体を作製した。 <Laser irradiation conditions for bonding>
Laser: Semiconductor laser (wavelength 808 nm)
Oscillation mode: Continuous oscillation Output: 30W
Focal diameter: 4mm
Scanning speed: 1mm / sec
Contact pressure: 0.6 MPa
In this way, the bonded structure of Example 1 was produced.
　次に、実施例２～４の接合構造体の作製方法について説明する。実施例２の接合構造体では、上記した第１変形例のようにプレートヒータを用いて金属部材の予熱を行った。実施例３の接合構造体では、上記した第２変形例のようにヒータロッドが内蔵された治具を用いて金属部材の予熱を行った。実施例４の接合構造体では、上記した第３変形例のように赤外線ヒータを用いて金属部材の予熱を行った。なお、実施例２～４のその他の点については実施例１と同様である。 Next, a method for producing the joined structure of Examples 2 to 4 will be described. In the joint structure of Example 2, the metal member was preheated using a plate heater as in the first modification described above. In the joint structure of Example 3, the metal member was preheated using a jig with a built-in heater rod as in the second modification described above. In the joined structure of Example 4, the metal member was preheated using an infrared heater as in the third modification described above. The remaining points of the second to fourth embodiments are the same as those of the first embodiment.
　実施例１～４の接合構造体では、接合領域において樹脂部材の未溶融箇所の発生を抑制することができた。すなわち、接合品質の向上を図ることができた。これは、安定した状態で予熱されている金属部材に対して、接合用のレーザを照射することができたためであると考えられる。 In the bonded structures of Examples 1 to 4, it was possible to suppress the occurrence of unmelted portions of the resin member in the bonded region. That is, it was possible to improve the bonding quality. This is considered to be because the metal member preheated in a stable state could be irradiated with a laser for bonding.
　－他の実施形態－
　なお、今回開示した実施形態は、すべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、特許請求の範囲の記載に基づいて画定される。また、本発明の技術的範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 -Other embodiments-
In addition, embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, the technical scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the claims.
　たとえば、本実施形態では、穿孔部１２内の突出部１３が表面１１側に設けられる例を示したが、これに限らず、突出部が穿孔部の深さ方向において入り込んだ位置に設けられていてもよい。 For example, in the present embodiment, an example in which the protruding portion 13 in the perforated portion 12 is provided on the surface 11 side is shown, but the present invention is not limited thereto, and the protruding portion is provided at a position where it enters in the depth direction of the perforated portion. May be.
　また、本実施形態では、穿孔部１２に突出部１３が形成される例を示したが、これに限らず、穿孔部に突出部が形成されていなくてもよい。たとえば、穿孔部が円筒状またはすり鉢状に形成されていてもよい。 Further, in the present embodiment, an example in which the protruding portion 13 is formed in the perforated portion 12 is shown, but the present invention is not limited to this, and the protruding portion may not be formed in the perforated portion. For example, the perforated part may be formed in a cylindrical shape or a mortar shape.
　また、本実施形態では、凹状部の一例として平面的に見て円形の穿孔部１２を示したが、これに限らず、凹状部として溝部が形成されていてもよい。 Further, in the present embodiment, the circular perforated portion 12 is shown as a plan view as an example of the concave portion, but the present invention is not limited thereto, and a groove portion may be formed as the concave portion.
　また、本実施形態では、樹脂部材２側から接合用のレーザＬ２が照射される例を示したが、これに限らず、金属部材の樹脂部材が配置される面とは反対の面（接合領域が設けられる面とは反対の面）に接合用のレーザを照射するようにしてもよい。この場合には、樹脂部材が接合用のレーザに対して透過性を有していなくてもよい。 Moreover, in this embodiment, although the example in which the laser L2 for joining is irradiated from the resin member 2 side was shown, the surface opposite to the surface on which the resin member of the metal member is disposed (joining region) It is also possible to irradiate a laser for bonding on the surface opposite to the surface on which the film is provided. In this case, the resin member may not be transparent to the bonding laser.
　また、本実施形態では、高周波誘導加熱装置のコイル５２が金属部材１の表面１１側に配置される例を示したが、これに限らず、高周波誘導加熱装置のコイルが金属部材の裏面側（金属部材に対して樹脂部材とは反対側）に配置されていてもよい。 In the present embodiment, the example in which the coil 52 of the high-frequency induction heating device is disposed on the front surface 11 side of the metal member 1 is shown. The metal member may be disposed on the opposite side of the resin member.
　また、本実施形態の第１変形例では、プレートヒータ５４により金属部材１を予熱する例を示したが、これに限らず、バンドヒータまたはリボンヒータにより金属部材を予熱するようにしてもよい。 In the first modification of the present embodiment, the example in which the metal member 1 is preheated by the plate heater 54 has been described. However, the present invention is not limited to this, and the metal member may be preheated by a band heater or a ribbon heater.
　また、本実施形態において、接合用のレーザＬ２を複数回走査するようにしてもよい。この場合に、金属部材１の温度を検出する温度センサ（図示省略）を設け、その温度センサの検出結果に応じて走査回数を制御するようにしてもよい。たとえば、金属部材１が予め設定された温度以上になるまで、接合用のレーザＬ２の走査を繰り返すようにしてもよい。 In this embodiment, the bonding laser L2 may be scanned a plurality of times. In this case, a temperature sensor (not shown) for detecting the temperature of the metal member 1 may be provided, and the number of scans may be controlled according to the detection result of the temperature sensor. For example, the scanning of the joining laser L2 may be repeated until the metal member 1 reaches a preset temperature or higher.
　また、本実施形態では、接合領域Ｒが平面的に見て矩形状である例を示したが、これに限らず、接合領域が矩形以外のその他の形状であってもよい。 Further, in the present embodiment, an example in which the bonding region R is rectangular when viewed in plan is shown, but the present invention is not limited thereto, and the bonding region may have other shapes other than the rectangle.
　本発明は、金属部材と樹脂部材とを接合する接合方法、接合構造体の製造方法および接合構造体に利用可能である。 The present invention is applicable to a joining method for joining a metal member and a resin member, a method for manufacturing a joined structure, and a joined structure.
　１　　　金属部材
　２　　　樹脂部材
　１１　　表面
　１２　　穿孔部（凹状部）
　１３　　突出部
　５２　　コイル（第１加熱装置）
　５３　　ヘッド（第２加熱装置）
　５４　　プレートヒータ（第１加熱装置）
　５５　　治具（第１加熱装置）
　５６　　赤外線ヒータ（第１加熱装置）
　１００　接合構造体 DESCRIPTION OF SYMBOLS 1 Metal member 2 Resin member 11 Surface 12 Perforated part (concave part)
13 Protrusion 52 Coil (first heating device)
53 head (second heating device)
54 Plate heater (first heating device)
55 Jig (first heating device)
56 Infrared heater (first heating device)
100 joint structure

Claims (5)

  1. 　表面に凹状部が形成された金属部材に樹脂部材を接合する接合方法であって、
    　前記金属部材の表面に前記樹脂部材を配置する工程と、
    　第１加熱装置により前記金属部材を予熱する工程と、
    　前記第１加熱装置により前記金属部材が予熱されている状態で、第２加熱装置により前記金属部材にレーザを照射することによって、前記樹脂部材を溶融させて前記凹状部に充填する工程とを備えることを特徴とする接合方法。     A joining method for joining a resin member to a metal member having a concave portion formed on the surface,
    Placing the resin member on the surface of the metal member;
    Preheating the metal member with a first heating device;
    A step of irradiating the metal member with a laser by the second heating device while the metal member is preheated by the first heating device, thereby melting the resin member and filling the concave portion. The joining method characterized by the above-mentioned.
  2. 　請求項１に記載の接合方法において、
    　前記第１加熱装置は、抵抗加熱、誘導加熱または赤外線加熱により前記金属部材を予熱することを特徴とする接合方法。     The bonding method according to claim 1,
    The first heating device preheats the metal member by resistance heating, induction heating or infrared heating.
  3. 　請求項１または２に記載の接合方法において、
    　前記金属部材の凹状部は、平面的に見て円形に形成され、その内周面に内側に突出する突出部を有することを特徴とする接合方法。     In the joining method according to claim 1 or 2,
    The concave portion of the metal member is formed in a circular shape when seen in a plan view, and has a protruding portion that protrudes inward on an inner peripheral surface thereof.
  4. 　金属部材および樹脂部材が接合された接合構造体の製造方法であって、
    　前記金属部材の表面に凹状部を形成する工程と、
    　前記金属部材の表面に前記樹脂部材を配置する工程と、
    　第１加熱装置により前記金属部材を予熱する工程と、
    　前記第１加熱装置により前記金属部材が予熱されている状態で、第２加熱装置により前記金属部材にレーザを照射することによって、前記樹脂部材を溶融させて前記凹状部に充填する工程とを備えることを特徴とする接合構造体の製造方法。     A method for manufacturing a joined structure in which a metal member and a resin member are joined,
    Forming a concave portion on the surface of the metal member;
    Placing the resin member on the surface of the metal member;
    Preheating the metal member with a first heating device;
    A step of irradiating the metal member with a laser by the second heating device while the metal member is preheated by the first heating device, thereby melting the resin member and filling the concave portion. The manufacturing method of the joining structure characterized by the above-mentioned.
  5. 　請求項４に記載の接合構造体の製造方法によって製造されたことを特徴とする接合構造体。 A joint structure manufactured by the method for manufacturing a joint structure according to claim 4.
PCT/JP2016/055101 2015-03-04 2016-02-22 Joining method, joined-structure production method, and joined structure WO2016140097A1 (en)

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KR102631904B1 (en) 2018-09-28 2024-01-31 주식회사 엘지화학 Method for manufacturing different material joint body and different material joint body

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