CN216624252U

CN216624252U - Heat radiator for sealing device

Info

Publication number: CN216624252U
Application number: CN202122950908.7U
Authority: CN
Inventors: 雷述宇
Original assignee: Ningbo Abax Sensing Electronic Technology Co Ltd
Current assignee: Ningbo Abax Sensing Electronic Technology Co Ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-05-27
Anticipated expiration: 2031-11-29

Abstract

The application discloses sealing device's heat abstractor, its characterized in that includes: the heat dissipation module comprises a shell, a heat dissipation block, a semiconductor device and a PCB; the heat dissipation block is fixed on the outer shell; the conductor device and the PCB are fixed on the outer shell; by the scheme of the invention, the heat dissipation problem of the high-power sealing device can be effectively solved.

Description

Heat radiator for sealing device

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat dissipation device for a sealing device.

Background

With the continuous development of semiconductor technology, semiconductor devices with high power-to-volume ratio are more and more widely applied in the fields of industry, consumer electronics, vehicle-mounted devices and the like. Therefore, the heat dissipation problem of the device caused by the high power-to-volume ratio is more and more emphasized, and the heat dissipation becomes an important restriction factor for restricting the miniaturization and the high power of the semiconductor device.

At present, when the semiconductor device is applied, heat is conducted out from a heating point of the device mainly by optimally designing the appearance, the size and the material of a structural component, and measures for accelerating heat dissipation, such as a fan, a water cooling device and the like, are supplemented. However, in a scene with a sealing requirement, the structural member of the device cannot be perforated, and only heat is conducted out first and then dissipated outwards in a heat conduction manner, which is far from sufficient heat dissipation efficiency for a high-power device, so that a new heat dissipation structure or a heat dissipation method is urgently needed to solve the heat dissipation problem of the high-power device.

Disclosure of Invention

An object of the present application is to provide a heat dissipation structure of a sealing device to solve the heat dissipation problem of the high power sealing device, aiming at the above disadvantages in the prior art.

In order to achieve the above purpose, the technical solutions adopted in the embodiments of the present application are as follows:

the embodiment of the application provides a heat abstractor of sealing device, its characterized in that includes: the heat dissipation device comprises an outer shell, a heat dissipation block, a semiconductor device, a PCB, a sealing ring, an upper sealing plate and a lower sealing plate;

the heat dissipation block is fixed on the outer shell;

the semiconductor device and the PCB are fixed on the outer shell;

locking the upper sealing plate in a sealing groove at the upper part of the outer shell by using a screw;

locking the lower sealing plate in a sealing groove at the lower part of the outer shell by using a screw;

the heat dissipation block is provided with a cold flow inlet pipe and a cold flow outlet pipe, and the cold flow inlet pipe and the cold flow outlet pipe penetrate through the through hole of the lower sealing plate.

Optionally, the sealing ring is embedded in the outer housing.

Optionally, the sealing device further comprises an upper sealing plate, and the sealing ring is locked in the sealing groove at the upper part of the outer shell through the upper sealing plate by using a screw.

Optionally, the sealing device further comprises a lower sealing plate, and the sealing ring is locked in the sealing groove at the lower part of the outer shell through the lower sealing plate by using a screw.

Optionally, the cold source is provided with an outlet and an inlet, and the inlet and the outlet of the cold source are respectively in butt joint with the cold flow outlet pipe and the cold flow inlet pipe.

Optionally, the heat dissipation block further comprises a cold source, wherein the cold source is provided with an outlet and an inlet, and the heat dissipation block is internally provided with capillary pipelines connected with each other.

Optionally, the outer housing surface has a heat dissipating fin structure.

Optionally, the outer housing is made of a highly thermally conductive material.

Optionally, the heat slug is made of a highly thermally conductive material.

The beneficial effect of this application is:

1. the embodiment of the application provides a heat abstractor of sealing device, its characterized in that includes: the heat dissipation device comprises an outer shell, a heat dissipation block, a semiconductor device, a PCB, a sealing ring, an upper sealing plate and a lower sealing plate;

the heat dissipation block is fixed on the outer shell;

the semiconductor device and the PCB are fixed on the outer shell;

the heat dissipation block is provided with a cold flow inlet pipe and a cold flow outlet pipe, and the cold flow inlet pipe and the cold flow outlet pipe penetrate through the through hole of the lower sealing plate; by the scheme of the invention, the heat dissipation problem of the high-power sealing device can be effectively solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic view of a heat dissipation structure of a sealed high-power semiconductor device according to an embodiment of the present disclosure;

fig. 2 is a cross-sectional view of a secondary heat dissipation structure of a high power semiconductor device according to an embodiment of the present disclosure;

fig. 3 is a schematic view of a heat dissipation block structure according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a capillary channel in a heat slug according to an embodiment of the present disclosure;

fig. 5 is a schematic view of a structure of a cooling source according to an embodiment of the present disclosure.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The fan is additionally arranged, so that the air flow speed on the surface of the radiator can be increased, the heat on the radiator can be effectively and quickly taken away, the radiating efficiency is improved, and the junction temperature of the chip is reduced. However, the common fan has high power consumption, high noise and low safety performance, and the fan drives the surrounding rotating magnetic field to interfere with the normal operation of surrounding electronic components due to magnetic leakage or electric sparks. Therefore, the prior art further provides a scheme for performing forced convection heat transfer by using a small piezoelectric fan, and researches the influence of parameters such as the distance between the fan and a heat source, the amplitude, the resonant frequency shift and the like on the heat transfer rate, and indicates that the resonant frequency shift of the fan and the amplitude of the fan are the most important influence factors on the heat transfer rate. A vibrating rib made of piezoelectric material is covered with a thin copper layer by utilizing the piezoelectric principle. When voltage acts on the piezoelectric fins, the fins vibrate along with the change of the voltage and the frequency, so that a thermal boundary layer is damaged to achieve the purpose of improving the heat exchange coefficient. However, the air cooling technology is mainly applied to devices with lower power, and other auxiliary heat dissipation methods are required to be found in the aspect of heat dissipation of high-power devices.

Liquid cooling is to take heat away by driving liquid to flow by a pump, so that the purpose of heat dissipation is achieved. The liquid cooling heat radiation system has simple structure, large power, low noise and good cooling effect, and the heat radiation efficiency is more than 20 times of that of the traditional air cooling system. The liquid cooling heat dissipation mainly comprises water cooling, cooling of the porous micro heat dissipation block and cooling of the micro channel

But, microjet technology, etc. A micro-pumping system is arranged on the radiator to solve the problem of heat dissipation. In a closed system, water enters a small groove on the bottom plate of the device under the action of a micro pump to absorb heat, and then returns to a small water container to dissipate heat through a fan. The micro-pump structure can reduce the external thermal resistance. The structure is relatively complex in addition to having good cooling properties but a large loss in heat transfer performance if the internal interface has a high thermal resistance.

The heat pipe is a heat exchange element with extremely high heat efficiency, realizes heat transfer by means of phase change of working liquid in the heat pipe, and can obtain larger heat conductivity through smaller temperature difference. The heat pipe has the advantages of extremely high equivalent heat conductivity coefficient, simple structure, unidirectional heat conduction, low noise and long service life, so that the heat pipe technology is more applied to the heat dissipation of high-power devices. The heat radiation of the thermosyphon heat absorption pipe greatly reduces the junction temperature and the thermal resistance. However, the conventional thermosiphon heat pipe has a vapor-liquid path, so if the heat pipe is bent, the performance of the heat pipe is reduced sharply. However, when applied to high power devices, the heat pipe must be bent, and thus the conventional heat pipe cannot effectively solve the heat dissipation problem of the high power devices.

Fig. 1 is a schematic view of a heat dissipation structure of a sealed high-power semiconductor device according to an embodiment of the present disclosure; the heat dissipation structure shown in fig. 1 includes: an outer shell 1; a heat dissipation block 2; a semiconductor device and a PCB 3; a seal ring 4; an upper closing plate 5; a lower seal plate 6; a cold source 7; screw A8; a screw B9; screw C10. Wherein the heat dissipation block 2 is fixed on the outer shell 1 through a screw B9, and heat-conducting silicone grease is coated at the bottom; the semiconductor device and the PCB 3 are fixed on the outer shell 1 through a screw C10, and heat-conducting silicone grease is smeared at the bottom; the sealing ring 4 is embedded into a sealing groove at the upper part of the outer shell 1, is compressed by an upper sealing plate 5 and is locked by a screw A8; cold flow inlet pipes and cold flow outlet pipes on the radiating block 2 penetrate through holes in the lower sealing plate 6, and the sealing ring 4 is embedded into a sealing groove in the lower part of the outer shell 1, is tightly pressed through the lower sealing plate 6 and is locked by a screw A8; the cold flow outlet and the cold flow inlet on the cold source 7 are respectively in butt-joint sleeve fit with the cold flow inlet pipe and the cold flow outlet pipe on the radiating block 2.

The heat generated by the semiconductor device and the PCB 3 is partially conducted to the outer shell 1 and dissipated through the outer surface of the outer shell 1; the heat generated by the semiconductor device and the PCB 3 is partially conducted to the heat dissipation block 2, and is taken out of the shell by cold flow in the heat dissipation block and is cooled by the cold source 7 for heat dissipation. And after the cold flow inlet pipe and the cold flow outlet pipe on the radiating block 2 penetrate through the through holes on the lower sealing plate 6, the through holes are blocked by sealant, so that the internal sealing of the outer shell 1 is ensured. The surface of the outer shell 1 is provided with a heat dissipation fin structure; the outer housing 1 is made of a highly heat conductive material. The heat dissipation block 2 is internally provided with mutually connected capillary pipelines, and heat is taken away when cold flow passes through the capillary pipelines; the illustrated heat slug 2 is made of a highly thermally conductive material. The cold source 7 is an automatic power source and can continuously input cold flow to the radiating block 2.

Fig. 2 is a cross-sectional view of a secondary heat dissipation structure of a high power semiconductor device according to an embodiment of the present disclosure; the sectional view of the heat dissipation structure shown in fig. 2 includes: an outer housing 201; a heat dissipation block 202; a semiconductor device and PCB 203; a seal ring 204; an upper closure plate 205; a lower closure plate 206; a cold source 207. Wherein the heat dissipation block 202 is fixed on the outer shell 201 through screws, and heat-conducting silicone grease is coated at the bottom; the semiconductor device and the PCB 203 are fixed on the outer shell 1 through screws, and heat-conducting silicone grease is coated at the bottom; the sealing ring 204 is embedded into a sealing groove at the upper part of the outer shell 201, is compressed by an upper sealing plate 205 and is locked by a screw; cold flow inlet pipes and cold flow outlet pipes on the heat dissipation block 202 penetrate through holes in the lower seal plate 206, and the seal ring 204 is embedded into a seal groove in the lower portion of the outer shell 201, is tightly pressed through the lower seal plate 206 and is locked by screws; the cold flow outlet and inlet on the cold source 207 are respectively in butt joint with the cold flow inlet pipe and the cold flow outlet pipe on the radiating block 202.

The heat generated by the semiconductor device and the PCB 203 is partially conducted to the outer shell 201 and dissipated through the outer surface of the outer shell 201; the heat generated by the semiconductor device and the PCB 203 is partially conducted to the heat sink 202, and is carried out of the housing by the cold flow in the heat sink and is cooled by the cold source 207 for heat dissipation. After a cold flow inlet pipe and a cold flow outlet pipe on the heat dissipation block 202 penetrate through the through holes on the lower sealing plate 206, the through holes are blocked by sealing, and the internal sealing of the outer shell 201 is guaranteed. The surface of the outer shell 201 is designed with a heat dissipation fin structure; the outer housing 201 is made of a highly thermally conductive material. The heat dissipation block 202 is designed with interconnected capillary tubes inside, and the cold flow takes away heat when passing through the capillary tubes; the illustrated heatslug 202 is made of a highly thermally conductive material. The cold source 207 is an automatic power source and can continuously input cold fluid to the heat dissipation block 202.

Fig. 3 is a schematic view of a heat dissipation block structure according to an embodiment of the present application. The heat dissipation block structure shown in fig. 3 includes: capillary 21, cold flow inlet 22 and outlet 23. And after the cold flow inlet pipe 22 and the cold flow outlet pipe 23 on the radiating block (radiating block) penetrate through the via hole on the lower sealing plate, the via hole is blocked by sealant, so that the internal sealing of the outer shell is ensured. The surface of the outer shell is provided with a heat dissipation fin structure; the outer housing is made of a highly thermally conductive material. The heat dissipation block is internally provided with mutually connected capillary pipelines 21, and heat is taken away when cold flow passes through the capillary pipelines; the heat sink block is made of a highly thermally conductive material.

Fig. 4 is a schematic diagram of a capillary channel in a heat dissipation block according to an embodiment of the present disclosure. As shown in the figure, micro pipelines are vertically and horizontally arranged in the structure, so that the flow contact area of cold flow and the radiating block is increased, the heat exchange efficiency is increased, and much heat is taken away.

Fig. 5 is a schematic diagram of a structure of a cooling source according to an embodiment of the present application. The cold source structure shown in fig. 5 includes a pressurizing micro-pump 71 with the cold source, a cold fluid inlet 72, a cold fluid outlet 73, and heat dissipation fins 74. The cold source is provided with a pressurizing micro pump 71, and fluid which is discharged from the cold flow outlet pipe and cooled can be continuously pressurized and then sent to the heat dissipation block through the cold flow inlet pipe, so that wireless circulating work can be realized. The heat sink is externally designed with heat dissipation fins 74, which can accelerate cold flow cooling.

It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat sink for a sealed device, comprising:

the heat dissipation device comprises an outer shell, a heat dissipation block, a semiconductor device, a PCB, a sealing ring, an upper sealing plate and a lower sealing plate;

the heat dissipation block is fixed on the outer shell;

the conductor device and the PCB are fixed on the outer shell;

2. A heat sink for a sealing device as recited in claim 1, wherein said sealing ring is embedded in said outer housing.

3. The heat dissipating device for a sealing device of claim 2, wherein said sealing ring is fastened in said sealing groove of said upper portion of said outer housing by means of screws through said upper sealing plate.

4. The heat dissipating device for a sealing device of claim 2, wherein said sealing ring is fastened in the sealing groove of the lower portion of said outer housing by means of screws through said lower sealing plate.

5. The heat sink for sealing device of claim 1, further comprising a cold source having an outlet and an inlet, wherein the inlet and the outlet of the cold source are respectively fitted to the cold flow outlet pipe and the cold flow inlet pipe.

6. The heat dissipating device of a sealed device of claim 1, wherein the heat dissipating block has capillary channels therein that are interconnected.

7. The heat dissipating device of a sealed device of claim 1, wherein the outer housing surface has a heat dissipating fin structure.

8. The heat dissipating device of a sealed device of claim 1, wherein said outer housing is made of a highly thermally conductive material.

9. The heat dissipating device of a sealed device of claim 1, wherein said heat slug is made of a highly thermally conductive material.