WO2016124387A1 - Isolierband für eine spule und wickelband-isoliersystem für elektrische maschinen - Google Patents
Isolierband für eine spule und wickelband-isoliersystem für elektrische maschinen Download PDFInfo
- Publication number
- WO2016124387A1 WO2016124387A1 PCT/EP2016/050958 EP2016050958W WO2016124387A1 WO 2016124387 A1 WO2016124387 A1 WO 2016124387A1 EP 2016050958 W EP2016050958 W EP 2016050958W WO 2016124387 A1 WO2016124387 A1 WO 2016124387A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cas
- tape
- imidazole
- derivative
- pyrazole
- Prior art date
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- 238000009413 insulation Methods 0.000 title claims abstract description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 69
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000003217 pyrazoles Chemical class 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims abstract description 7
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 16
- 150000002460 imidazoles Chemical class 0.000 claims description 14
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 claims description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 12
- 238000004804 winding Methods 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 238000005470 impregnation Methods 0.000 claims description 7
- -1 pentasubstituted phenyl Chemical group 0.000 claims description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 5
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical compound [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 150000001299 aldehydes Chemical class 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 5
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 5
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 5
- 125000001424 substituent group Chemical group 0.000 claims description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 5
- NCNNNERURUGJAB-UHFFFAOYSA-N 3-[2,2-bis(3-prop-2-enoyloxypropoxymethyl)butoxy]propyl prop-2-enoate Chemical compound C=CC(=O)OCCCOCC(CC)(COCCCOC(=O)C=C)COCCCOC(=O)C=C NCNNNERURUGJAB-UHFFFAOYSA-N 0.000 claims description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 4
- 150000003007 phosphonic acid derivatives Chemical class 0.000 claims description 4
- 239000003349 gelling agent Substances 0.000 claims description 3
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 claims description 3
- 150000003458 sulfonic acid derivatives Chemical class 0.000 claims description 3
- RFXJLECGYGFJCI-UHFFFAOYSA-N 2-(2-methylpropyl)-1h-imidazole Chemical compound CC(C)CC1=NC=CN1 RFXJLECGYGFJCI-UHFFFAOYSA-N 0.000 claims description 2
- SLLDUURXGMDOCY-UHFFFAOYSA-N 2-butyl-1h-imidazole Chemical compound CCCCC1=NC=CN1 SLLDUURXGMDOCY-UHFFFAOYSA-N 0.000 claims description 2
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- MKBBSFGKFMQPPC-UHFFFAOYSA-N 2-propyl-1h-imidazole Chemical compound CCCC1=NC=CN1 MKBBSFGKFMQPPC-UHFFFAOYSA-N 0.000 claims description 2
- CTUNHIMNHSKDBN-UHFFFAOYSA-N 2-tert-butyl-1h-imidazole Chemical compound CC(C)(C)C1=NC=CN1 CTUNHIMNHSKDBN-UHFFFAOYSA-N 0.000 claims description 2
- VQTVFIMEENGCJA-UHFFFAOYSA-N 3,4-dimethyl-1H-pyrazole Chemical compound CC=1C=NNC=1C VQTVFIMEENGCJA-UHFFFAOYSA-N 0.000 claims description 2
- SDXAWLJRERMRKF-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazole Chemical compound CC=1C=C(C)NN=1 SDXAWLJRERMRKF-UHFFFAOYSA-N 0.000 claims description 2
- IHNXHUNMFYXQCG-UHFFFAOYSA-N 4-ethyl-1h-pyrazole Chemical compound CCC=1C=NNC=1 IHNXHUNMFYXQCG-UHFFFAOYSA-N 0.000 claims description 2
- WAVKYNIKJIPTGF-UHFFFAOYSA-N 5-cyclohexa-2,4-dien-1-yl-1H-pyrazole Chemical compound C1(CC=CC=C1)C1=NNC=C1 WAVKYNIKJIPTGF-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- XHLKOHSAWQPOFO-UHFFFAOYSA-N 5-phenyl-1h-imidazole Chemical compound N1C=NC=C1C1=CC=CC=C1 XHLKOHSAWQPOFO-UHFFFAOYSA-N 0.000 claims description 2
- ULKZTFQDSPKNMV-UHFFFAOYSA-N 5-tert-butyl-1h-imidazole Chemical compound CC(C)(C)C1=CN=CN1 ULKZTFQDSPKNMV-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 125000002883 imidazolyl group Chemical group 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 1
- 239000011265 semifinished product Substances 0.000 claims 1
- WGCYRFWNGRMRJA-UHFFFAOYSA-N 1-ethylpiperazine Chemical compound CCN1CCNCC1 WGCYRFWNGRMRJA-UHFFFAOYSA-N 0.000 abstract description 8
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract description 7
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 description 7
- 239000010445 mica Substances 0.000 description 6
- 229910052618 mica group Inorganic materials 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000001879 gelation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000000466 oxiranyl group Chemical group 0.000 description 3
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 238000005966 aza-Michael addition reaction Methods 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 2
- 238000001212 derivatisation Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- PVOAHINGSUIXLS-UHFFFAOYSA-N 1-Methylpiperazine Chemical compound CN1CCNCC1 PVOAHINGSUIXLS-UHFFFAOYSA-N 0.000 description 1
- UTAKUDHMJGKXGJ-UHFFFAOYSA-N 2-cyclohexa-2,4-dien-1-yl-1h-imidazole Chemical compound C1C=CC=CC1C1=NC=CN1 UTAKUDHMJGKXGJ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- YIDCITOHTLPMMZ-UHFFFAOYSA-N 5-tert-butyl-1h-pyrazole Chemical compound CC(C)(C)C1=CC=NN1 YIDCITOHTLPMMZ-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- QQCGKIZHTJLRNN-NBRVCOCJSA-N Pipericine Chemical compound CCCCCCCCCCCCC\C=C\C=C\C(=O)NCC(C)C QQCGKIZHTJLRNN-NBRVCOCJSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- HHRFWSALGNYPHA-UHFFFAOYSA-N [N].C1CNCCN1 Chemical group [N].C1CNCCN1 HHRFWSALGNYPHA-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000013074 reference sample Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 229940066771 systemic antihistamines piperazine derivative Drugs 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/32—Windings characterised by the shape, form or construction of the insulation
- H02K3/40—Windings characterised by the shape, form or construction of the insulation for high voltage, e.g. affording protection against corona discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/03—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in aqueous media
- C08J3/075—Macromolecular gels
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/203—Solid polymers with solid and/or liquid additives
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/30—Windings characterised by the insulating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the invention relates to an insulating tape for insulating stator coils in electrical machines, in particular the tape accelerator in the tape adhesive of the insulating tape, which is used for a winding tape insulation system.
- stator and in some cases also the rotor have insulating systems with windings.
- an insulating tape is wound around a conductor or a conductor bundle.
- the insulating tape comprises an applied on a flexible support such as film or glass cloth, surface breakdown ⁇ solid inorganic material such as mica platelets and / or fine mica layers, which connected to the carrier and each other and optionally with a final cover layer and or ei ⁇ ner further layer by means of a tape adhesive is.
- a flexible support such as film or glass cloth
- surface breakdown ⁇ solid inorganic material such as mica platelets and / or fine mica layers
- This tape adhesive comprises a dissolved and / or finely divided tape accelerator.
- the belt accelerator serves to gel a low-viscosity impregnating resin, which is applied to the stator windings, for example in a vacuum pressure impregnation (VPI). After gelling at elevated temperature, the impregnated stator windings are thermally cured in the laminated stator core.
- VPI vacuum pressure impregnation
- Such an insulating tape is known from DE 38 24 254 AI be ⁇ known. From EP 0424376B1 corresponding tape adhesive and tape accelerator are known which have sufficient Lagerstabi ⁇ quality.
- the disclosed therein tape adhesive are the 1: 4 molar Additi ⁇ modulation products from bisphenols, especially bisphenol-A, and cycloaliphatic epoxy resins, especially 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.
- EP 0424376B1 discloses that the associated band accelerator is preferably a 1: 3 molar adduct of trimethylolpropane triacrylate and N-ethylpiperazine.
- the band accelerator and / or the adhesive tape in the mica tape composite are preferably chemically equipped such that when stored at room temperature and no premature curing unge ⁇ wanted occurs. This ensures the workability of the mica tape.
- the gelation of the glycidyl ether-based epoxy resin takes place very rapidly, since terminal oxirane functionalities in combination with acid anhydrides undergo very rapid polymerization.
- the desired storage stability of the non-impregnated mica tape and the rapid gelation of the impregnated stator can finally so ⁇ probably realize.
- phthalic anhydride-free or even anhydride-free epoxy-based VPI resins find use.
- the object of the present invention is therefore to provide an insulating tape and in particular a tape accelerator for an insulating tape, which can be used in anhydride-free VPI resins.
- the object and object of the present invention is therefore an insulating tape with a tape adhesive in which at least one tape accelerator is dissolved and / or finely divided, wherein the at least one tape accelerator is an imidazole and / or a pyrazole and / or a derivative of an imidazole and / or a derivative of a pyrazole.
- a derivative is a chemical derivative herein designated net, that is a derived substance or a derivative Ver ⁇ bond, of one or more hydrogen atoms can be prepared from the parent compound, that is, for example, imidazole and / or pyrazole, by substitution. Substitution can take place in many different chemical ways.
- the present invention is an insulating tape with a tape adhesive in which a Bandbeschleuni- ger contained and / or finely divided, which contains an adduct of at least one imidazole and / or at least one pyrazole with at least one acrylate and / or an adduct ei ⁇ nes or more imidazole derivative (s) and / or one or more pyrazole derivative (s) with one or more
- Acrylate derivative (s) is. Any combinations of derivatives and parent compounds can form the adduct.
- the adduct itself is also formed by derivatization, so is itself again a derivative.
- the heterocycle is a preferably at relatively low temperatures melting and / or liquid at room temperature ⁇ -nitrogen heterocycle having 1 to 4 nitrogen atoms in the ring.
- imidazoles such as the ⁇ -2-methylimidazole (CAS No. 693-98-1) or the 1H-imidazole (CAS No. 288-32-4), the ⁇ -2-ethylimidazole (CAS No. 1072-62-4), ⁇ -2-propylimidazole (CAS No. 50995-95-4), 1H-2-isopropyl-azazole (CAS No. 36947-68-9), ⁇ -2-butylimidazole (CAS No. 50790-93-7), ⁇ -2-iso-butylimidazole (CAS No. 61491-92-7), ⁇ -2-tert-butylimidazole (CAS No.
- phthalic anhydride-containing impregnating resins as are known from EP 0424376 Bl, as strip adhesive, the 1: 4 molar addition products of bisphenols, especially of bisphenol-A, and cycloaliphatic epoxy resins, in particular of 3,4-epoxycyclohexylmethyl-3, 4-
- Epoxycyclohexanecarboxylate disclosed.
- the tape adhesive described therein contains in its theoretical molecular structure after quantitative conversion only cycloaliphatic
- Trimethylolpropane triacrylate and N-ethylpiperazine contains by the underlying aza - Michael reaction theoretically three terminal, tertiary substituted piperazine nitrogen atoms.
- Triacrylates but especially of the tetra- and penta / hexaacrylates, with ⁇ -2-methylimidazole, 1H-2-ethylimidazole, ⁇ -2-propylimidazole, ⁇ -2-iso-propylimidazole, ⁇ -2-butylimidazole, ⁇ - 2-iso-butylimidazole, 1H-2-phenylimidazole and lH-2-ethyl-4-methylimidazole particularly ⁇ terestante compounds as a tape accelerator, because a) the achievable by anionic polymerization glass transition temperatures
- Diglycidyletherbasis are very much higher than Ver ⁇ application of N-methylpiperazine and N- Ethylpiperazinaddukte of TMPTAs b) not acide alkyl / gel and cure acylimidazoles
- L-methyl-2-alkylimidazoles are not vacuum-stable per se and even at room temperature very thin liquid; They can therefore very easily migrate in vacuo at elevated temperature during the evacuation and pre-drying of the stators to imoniagnie ⁇ leaders from the Isolierbandkleber. Therefore, the acrylates derivatized imidazoles are a preferred embodiment of the invention.
- the covalent attachment of the ⁇ -2-alkylimidazoles at the ⁇ -position in particular of the ⁇ -2-methylimidazole, 1H-2-ethylimidazole, ⁇ -2-propylimidazole, 1H-iso-propylimidazole, 1H-2-ethyl-4- Methylimidazoles, ⁇ -2-butylimidazoles, ⁇ -2-isobutyl-imidazoles and ⁇ -2-tert-butylimidazoles, to the previously used TMPTA, for example via an aza-Michael coupling, it is possible to use the N- unsuitable for phthalic anhydride epoxy resins.
- phthalic anhydride-free glycidyl ether epoxy resins Due to the high vapor pressure of the 2-alkylimidazoles and the high fluidity, however, a dispersion of small imidazole molecules and / or imidazole derivatives in the tape adhesive with the associated with later danger that the evacuation (70 ° C, 0.1 mbar for up to 72 hours) leads to evaporation or migration of the volatile alkylimidazole and this accumulates at cold ⁇ ren bodies.
- adducts of ⁇ -2-methylimidazole, 1H-2-ethylimidazole, ⁇ -2-propylimidazole, ⁇ -2-iso-propylimidazole and ⁇ -2-butylimidazole or branched ⁇ -2-isobutylimidazole and ⁇ -2 tert-Butyl imidazole with acrylates leads to a cost saving in the final structure as well as an increase in the network density by the structural number of polymerization initiators using higher acrylates such as PETA and DPHA.
- the vapor pressures of the alkyl imidazoles at elevated temperatures et ⁇ are adversely, in particular the vapor pressure of advanta- adhere l-alkyl-2-Methylimidazole is relatively high, so that during prolonged Evakuierphasen at elevated temperatures, such as They are now used in the manufacture of electrical machinery before the VPI impregnation of the stators about for predrying partially used today, a partial expulsion of any used imidazoles from the tape adhesive is to be feared.
- alkyl imidazoles ie generally the smaller imidazole derivatives, which are generally volatile at elevated temperatures, have proven to be very efficient band accelerators.
- a Bandbe ⁇ accelerator which is an adduct of a lH-imidazole derivative
- such a tape adhesive shows a vapor pressure less than 10 ⁇ 4 mbar at 70 ° C, and a high dynamic viscosity.
- the 1H-alkyl-imidazoles and / or the 1H-alkyl-pyrazoles are derivatized, for example, with acrylates.
- the acrylate is a liquid at room temperature acrylate such as
- TMPTA Trimethylolpropane triacrylate
- CAS No. 15625-89-5 Trimethylolpropane triacrylate
- no synonym CAS No. 53879-54-2
- Pentaerythritol tetraacrylate PETA, CAS No. 4986-89-4
- DPHA Technical Mix CAS No. 60506-81-2
- the structural formula I shown here represents an embodiment of a belt accelerator according to the invention and is a possible adduct of TMPTA and one or more 1H-imidazole derivative (s); for example, R is the same or different and
- R H, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, tert-butyl, phenyl and / or mono-, di-, tri-, tetra-, pentasubstituted phenyl, where the substituents on the phenyl radical may be the same or different and selected from the following group:
- R p h enyi alkyl (linear and branched), alkoxy, -F, -Cl, -Br, -J, aldehyde, ketone, acid ester, acid amide, phosphonic acid derivative and / or
- Trimethylolpropane propoxylate triacrylate and 1H-imidazole derivatives for example, with R equal or unequal and
- R H, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-
- the structural formula III presented here provides a back walls ⁇ res embodiment of a band accelerator according to the invention, and is a potential adduct of
- Pentaerythritol tetraacrylate PETA
- 1H-imidazole derivatives for example with
- R H, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, tert-butyl, phenyl and / or mono-, di-, tri-, tetra-, pentasubstituted phenyl, where the substituents on the phenyl radical may be the same or different and are selected from the following group again:
- R phenyl i alkyl (linear and branched), alkoxy, -F, -Cl, -Br, -I, aldehyde, ketone, acid ⁇ ester, Acid amide, phosphonic acid derivative and / or
- the structural formula IV shown here illustrates yet another embodiment of a band according to the accelerator OF INVENTION ⁇ formation and is a potential adduct of
- DPHA Dipentaerythritol penta- / hexacrylate
- 1H-imidazole derivatives for example, with R equal or unequal and
- imidazoles and / or pyrazoles are very effective gelling and hardening substances for
- Suitable tape adhesives are commercially available and in ⁇ example on a silicone elastomer base.
- the invention relates to an insulating tape for insulating stator coils in electrical machines, in particular the tape accelerator in the tape adhesive of the insulating tape.
- the previously known N-ethylpiperazine-based belt accelerators are replaced here by new and better compounds.
- the invention further relates to the use of an imidazole and / or a pyrazole and / or an imidazole and / or pyrazole derivative as a gelling and / or hardener substance for phthalic acid-free epoxy resins on bisphenol A and / or
- the invention relates to an insulating tape for insulating stator coils in electrical machines, in particular the tape accelerator in the tape adhesive of the insulating tape, which is used for a winding tape insulation system.
- the previously known N-ethyl-piperazine-based belt accelerators are here replaced by imidazole and / or pyrazole compounds.
- imidazole and / or pyrazole compounds are here replaced by imidazole and / or pyrazole compounds.
- imidazole and / or pyrazole compounds as gelling and / or curing generally in epoxy resins
- Bisphenol A and / or bisphenol F diglycidyl ether base instead, in particular the phthalic acid-free species thereof.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Insulating Bodies (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR112017016680-1A BR112017016680A2 (pt) | 2015-02-05 | 2016-01-19 | fita isolante, sistema de isolamento, bobina de um motor elétrico/gerador, máquina elétrica, e uso |
RU2017130758A RU2724601C2 (ru) | 2015-02-05 | 2016-01-19 | Изоляционная лента для катушки и система изоляции с обмоточной лентой для электрических машин |
EP16702490.0A EP3227893A1 (de) | 2015-02-05 | 2016-01-19 | Isolierband für eine spule und wickelband-isoliersystem für elektrische maschinen |
US15/548,319 US20180022897A1 (en) | 2015-02-05 | 2016-01-19 | Insulating Tapes For A Coil And Wrapping Tape Insulation Systems For Electric Machines |
CN201680008618.XA CN107207922A (zh) | 2015-02-05 | 2016-01-19 | 用于电机用的线圈和缠绕胶带绝缘体系的绝缘胶带 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015202053.3 | 2015-02-05 | ||
DE102015202053 | 2015-02-05 | ||
DE102015208527 | 2015-05-07 | ||
DE102015208527.9 | 2015-05-07 | ||
DE102015214872.6A DE102015214872A1 (de) | 2015-02-05 | 2015-08-04 | Isolierband für eine Spule und Wickelband-Isoliersystem für elektrische Maschinen |
DE102015214872.6 | 2015-08-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016124387A1 true WO2016124387A1 (de) | 2016-08-11 |
Family
ID=56498609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2016/050958 WO2016124387A1 (de) | 2015-02-05 | 2016-01-19 | Isolierband für eine spule und wickelband-isoliersystem für elektrische maschinen |
Country Status (7)
Country | Link |
---|---|
US (1) | US20180022897A1 (de) |
EP (1) | EP3227893A1 (de) |
CN (1) | CN107207922A (de) |
BR (1) | BR112017016680A2 (de) |
DE (1) | DE102015214872A1 (de) |
RU (1) | RU2724601C2 (de) |
WO (1) | WO2016124387A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016223656A1 (de) | 2016-11-29 | 2018-05-30 | Siemens Aktiengesellschaft | Füllstoffhaltige Vergussmasse, Isolationswerkstoff, sowie Verwendung dazu |
WO2018141619A1 (de) * | 2017-01-31 | 2018-08-09 | Siemens Aktiengesellschaft | Wickelbandisoliersystem für elektrische maschinen, verwendung dazu sowie elektrische maschine |
EP3389058A1 (de) | 2017-04-10 | 2018-10-17 | Siemens Aktiengesellschaft | Glimmschutzband für elektrische hochspannungsmaschine |
EP3996113A1 (de) | 2020-11-05 | 2022-05-11 | Siemens Aktiengesellschaft | Glimmschutzband für rotierende elektrische hochspannungsmaschine, verwendung dazu und elektrische maschine |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015213537A1 (de) | 2015-07-17 | 2017-01-19 | Siemens Aktiengesellschaft | Fester, insbesondere bandförmiger, Isolationswerkstoff, Formulierung für ein Imprägniermittel zur Herstellung eines Isolationssystems in einem Vakuumimprägnierverfahren damit und Maschinen mit derartigem Isolationssystem |
DE102016203867A1 (de) | 2016-03-09 | 2017-09-14 | Siemens Aktiengesellschaft | Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem |
CN108047655A (zh) * | 2017-12-28 | 2018-05-18 | 西安合容电力设备有限公司 | 一种干式电抗器包封绝缘体系的配方及制备方法 |
DE102019207771A1 (de) | 2019-05-28 | 2020-12-03 | Siemens Aktiengesellschaft | Additiv, Verwendung dazu, Isolationssystem und elektrische Maschine |
EP4003954A1 (de) | 2019-09-04 | 2022-06-01 | Siemens Aktiengesellschaft | Bandbeschleuniger und verwendung davon, fester isolationswerkstoff und anhydrid-freies isolationssystem |
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EP0355558A1 (de) * | 1988-08-18 | 1990-02-28 | Siemens Aktiengesellschaft | Isolierband zur Herstellung einer imprägnierten Isolier-hülse für elektrische Leiter |
EP0424376A1 (de) * | 1988-07-14 | 1991-05-02 | Siemens Ag | Isolierband zur herstellung einer mit einer heisshärtenden epoxidharz-säureanhydrid-mischung imprägnierten isolierhülse für elektrische leiter. |
EP0586753A1 (de) * | 1992-08-25 | 1994-03-16 | Siemens Aktiengesellschaft | Isolierband für einer Wicklung eine elektrischen Maschine |
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DE2142571B1 (de) * | 1971-08-20 | 1972-06-08 | Siemens Ag | Isolierband zur herstellung einer mit einer heisshaertenden epoxidharz-saeureanhydridhaertermischung impraegnierten isolierhuelse fuer elektrische leiter |
DE19839285C1 (de) * | 1998-08-28 | 2000-04-27 | Siemens Ag | Glimmschutzband |
DE102009007392A1 (de) * | 2009-01-29 | 2010-08-05 | Siemens Aktiengesellschaft | Tränkharzsystem für Isolierstoffe in Schaltanlagen |
RU2009121714A (ru) * | 2009-06-09 | 2010-12-20 | Закрытое акционерное общество "Электроизолит" (RU) | Электроизоляционный стеклослюдинитовый материал |
-
2015
- 2015-08-04 DE DE102015214872.6A patent/DE102015214872A1/de not_active Withdrawn
-
2016
- 2016-01-19 EP EP16702490.0A patent/EP3227893A1/de not_active Withdrawn
- 2016-01-19 US US15/548,319 patent/US20180022897A1/en not_active Abandoned
- 2016-01-19 CN CN201680008618.XA patent/CN107207922A/zh active Pending
- 2016-01-19 RU RU2017130758A patent/RU2724601C2/ru not_active IP Right Cessation
- 2016-01-19 WO PCT/EP2016/050958 patent/WO2016124387A1/de active Application Filing
- 2016-01-19 BR BR112017016680-1A patent/BR112017016680A2/pt not_active IP Right Cessation
Patent Citations (3)
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EP0424376A1 (de) * | 1988-07-14 | 1991-05-02 | Siemens Ag | Isolierband zur herstellung einer mit einer heisshärtenden epoxidharz-säureanhydrid-mischung imprägnierten isolierhülse für elektrische leiter. |
EP0355558A1 (de) * | 1988-08-18 | 1990-02-28 | Siemens Aktiengesellschaft | Isolierband zur Herstellung einer imprägnierten Isolier-hülse für elektrische Leiter |
EP0586753A1 (de) * | 1992-08-25 | 1994-03-16 | Siemens Aktiengesellschaft | Isolierband für einer Wicklung eine elektrischen Maschine |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016223656A1 (de) | 2016-11-29 | 2018-05-30 | Siemens Aktiengesellschaft | Füllstoffhaltige Vergussmasse, Isolationswerkstoff, sowie Verwendung dazu |
WO2018141619A1 (de) * | 2017-01-31 | 2018-08-09 | Siemens Aktiengesellschaft | Wickelbandisoliersystem für elektrische maschinen, verwendung dazu sowie elektrische maschine |
CN110431640A (zh) * | 2017-01-31 | 2019-11-08 | 西门子股份公司 | 用于电机的缠绕带绝缘体系、其用途和电机 |
CN110431640B (zh) * | 2017-01-31 | 2021-01-29 | 弗兰德有限公司 | 用于电机的缠绕带绝缘体系、其用途和电机 |
EP3389058A1 (de) | 2017-04-10 | 2018-10-17 | Siemens Aktiengesellschaft | Glimmschutzband für elektrische hochspannungsmaschine |
WO2018188843A1 (de) | 2017-04-10 | 2018-10-18 | Siemens Aktiengesellschaft | Glimmschutzband für elektrische hochspannungsmaschine |
EP3996113A1 (de) | 2020-11-05 | 2022-05-11 | Siemens Aktiengesellschaft | Glimmschutzband für rotierende elektrische hochspannungsmaschine, verwendung dazu und elektrische maschine |
WO2022096429A1 (de) | 2020-11-05 | 2022-05-12 | Siemens Aktiengesellschaft | Glimmschutzband für rotierende elektrische hochspannungsmaschine, verwendung dazu und elektrische maschine |
Also Published As
Publication number | Publication date |
---|---|
BR112017016680A2 (pt) | 2018-04-10 |
DE102015214872A1 (de) | 2016-08-11 |
EP3227893A1 (de) | 2017-10-11 |
RU2017130758A3 (de) | 2019-03-06 |
CN107207922A (zh) | 2017-09-26 |
RU2724601C2 (ru) | 2020-06-25 |
RU2017130758A (ru) | 2019-03-06 |
US20180022897A1 (en) | 2018-01-25 |
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