WO2016122053A1 - Dispositif d'éclairage électrique transparent - Google Patents

Dispositif d'éclairage électrique transparent Download PDF

Info

Publication number
WO2016122053A1
WO2016122053A1 PCT/KR2015/004805 KR2015004805W WO2016122053A1 WO 2016122053 A1 WO2016122053 A1 WO 2016122053A1 KR 2015004805 W KR2015004805 W KR 2015004805W WO 2016122053 A1 WO2016122053 A1 WO 2016122053A1
Authority
WO
WIPO (PCT)
Prior art keywords
transparent
light emitting
emitting device
wiring
buffer layer
Prior art date
Application number
PCT/KR2015/004805
Other languages
English (en)
Korean (ko)
Inventor
김광복
Original Assignee
금호전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금호전기 주식회사 filed Critical 금호전기 주식회사
Publication of WO2016122053A1 publication Critical patent/WO2016122053A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to a transparent electroluminescent device using a light emitting element.
  • Such a transparent electroluminescent device forms a transparent wiring on a glass substrate, and an LED (Light Emitting Diode) is connected to the transparent wiring.
  • LED Light Emitting Diode
  • the LED using the LED is used in a variety of fields, such as a large outdoor billboard or a small indoor billboard in view of the low power and long life.
  • ITO indium tin oxide
  • ITO Indium Tin Oxide
  • One embodiment of the present invention provides a transparent light emitting device capable of lowering the thermal resistance.
  • the present invention provides a transparent electroluminescent device in which the manufacturing process is simple and the process cost can be reduced.
  • Transparent electroluminescent device the first transparent substrate; A plurality of light emitting device packages disposed on the first transparent substrate; A plurality of transparent wires electrically connected to the light emitting device package; And a buffer layer electrically connecting the light emitting device package and the transparent wiring.
  • the buffer layer may be formed in a region where the transparent wiring and the electrode of the light emitting device package are in contact with each other.
  • the buffer layer may be formed thicker than the transparent wiring.
  • the width of the buffer layer may be formed to be narrower than the width of the transparent wiring.
  • the transparent wiring and the buffer layer may include a metal.
  • the buffer layer may include a metal mesh.
  • a transparent electroluminescent device includes a first transparent substrate; A plurality of light emitting device packages disposed on the first transparent substrate; And a plurality of transparent wires electrically connected to the light emitting device package, wherein the transparent wires include a metal mesh.
  • the light emitting device package may include a buffer layer electrically connecting the transparent wiring.
  • the pitch of the metal mesh may be 400 ⁇ m or less, and the width of the metal mesh may be 7 ⁇ m or more.
  • the thermal resistance is lowered to enable uniform light output control.
  • the manufacturing cost can be reduced by using a metal mesh instead of ITO.
  • FIG. 1A and 1B are views for explaining a transparent electroluminescent device according to an embodiment of the present invention.
  • FIG. 2 is a plan view of a first transparent substrate according to an embodiment of the present invention
  • FIG. 3 is an enlarged view of a portion A of FIG. 2;
  • FIG. 4 is an enlarged view of a portion B of FIG. 3,
  • FIG. 5 is a cross-sectional view of FIG. 4 viewed in the I-I direction.
  • 6A is a view for explaining a transparent electroluminescent device according to another embodiment of the present invention.
  • FIG. 7 is a view for explaining the coupling relationship between the light emitting device package and the first transparent substrate according to another embodiment of the present invention.
  • FIG. 8 is a modification of FIG.
  • the terms "comprises” or “having” are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.
  • FIG. 1 is a view for explaining a transparent light emitting device according to an embodiment of the present invention
  • Figure 2 is a plan view of a first transparent substrate according to an embodiment of the present invention
  • Figure 3 is an enlarged portion A of FIG. 4 is an enlarged view of a portion B of FIG. 3
  • FIG. 5 is a cross-sectional view of FIG. 4 viewed from II.
  • a transparent electroluminescent device includes a first transparent substrate 30 and a plurality of light emitting device packages 40 disposed on the first transparent substrate 30. And a plurality of transparent wires 50 electrically connected to the plurality of light emitting device packages 40.
  • the first transparent substrate 30 and the second transparent substrate 10 may be applied as long as the substrate is a transparent material.
  • the first transparent substrate 30 and the second transparent substrate 10 may be glass substrates.
  • the first transparent substrate 30 and the second transparent substrate 10 may be manufactured in various ways according to the glass standard of the general building.
  • a transparent filler 20 may be interposed between the first transparent substrate 30 and the second transparent substrate 10 to fix and protect the plurality of light emitting device packages 40.
  • Various resins may be selected as the transparent filler 20.
  • a rectangular frame 22 is disposed in an edge region of the first transparent substrate 30 and the second transparent substrate 10, and a transparent filler 20 is interposed inside the frame 22.
  • the frame 22 may be a double-sided tape having a predetermined thickness.
  • the second transparent substrate 10 may be spaced apart from the first transparent substrate 30 by the thickness of the frame 22.
  • the present invention is not limited thereto, and the frame 22 may include at least one material selected from Si0 2 , Si x O y , Si 3 N 4 , SiN, SiO x N y , Al 2 O 3 , TiO 2 , and AlN. It may be formed by forming in the border region of the transparent substrate 30 or the second transparent substrate 10.
  • An injection hole is formed at one side of the frame 22 so that the transparent filler 20 may be injected. That is, after sealing the edges of the first transparent substrate 30 and the second transparent substrate 10 with the frame 20, the transparent filler 20 can be injected through the injection hole.
  • the transparent filler 20 may include a protrusion 21 filled in the injection hole. That is, the protrusion 21 may protrude outward from the filling region defined by the frame 22.
  • FIG. 1B illustrates one injection hole
  • the injection hole may be formed at each edge. Therefore, the protrusion 21 may be formed for each edge. According to this structure, the flow of the transparent filler 20 may be improved, thereby reducing the unfilled area.
  • a plurality of light emitting device packages 40 are arranged to have rows and columns in a matrix form.
  • the number of light emitting device packages 40 is not limited, and an appropriate number may be disposed to implement a text or an image.
  • the light emitting device package 40 is driven by a power source individually by the controller 1.
  • the light emitting device package 40 may be a device having three driving electrodes 41b, 41c, and 41d and one common electrode 41a.
  • the driving electrodes 41b, 41c, and 41d may be anode electrodes
  • the common electrode 41a may be a cathode electrode.
  • the light emitting device package 40 may be a package in which a blue LED chip, a green LED chip, and a red LED chip are modularized.
  • the first transparent substrate 30 has a transparent wiring 51 (hereinafter referred to as a common transparent wiring) connected to the common electrode 41a of the light emitting device package 40, and a driving electrode 41b of the light emitting device package 40. , 41c and 41d are connected to the transparent wirings 52, 53, and 54 (hereinafter referred to as driving transparent wirings) electrically. Electrode pads 55 are formed at ends of the transparent wiring, respectively. The electrode pad 55 is electrically connected to a circuit board (not shown) to apply external power to the light emitting device package 40.
  • the light emitting device package 40 may output blue light.
  • the light emitting device package 40 may output white light. Therefore, power may be selectively applied to the first to third driving transparent wirings 52, 53, and 54 to output light of various colors.
  • the color temperature may be adjusted by adjusting the current intensity.
  • the common transparent wiring 51 is commonly connected to the common electrodes 41a of the plurality of light emitting device packages 41 and 42 arranged in a row.
  • each of the driving transparent wirings 52, 53, and 54 is connected to the driving electrodes 41b, 41c, and 41d of the light emitting device package.
  • the width of the driving transparent wiring having a relatively long length may be wider.
  • the width of the first driving transparent wiring 52 connected to the second light emitting device package 42 may be wider than the width of the first driving transparent wiring 52 connected to the first light emitting device package 41. Can be.
  • a buffer layer 56 is disposed in an area where the first light emitting device package 41 and the transparent wiring 52 contact each other. That is, when the light emitting device package has one common electrode and three driving electrodes, four buffer layers are connected to one common electrode and three driving electrodes, respectively.
  • the transparent wiring 52 is indium tin oxide (ITO)
  • ITO indium tin oxide
  • soldering (S) is not possible directly with the electrodes 41b and 41d of the light emitting device package 40 and the thermal resistance is high.
  • the light emitting device package 40 and the transparent wiring 52 may be bonded by solder using the buffer layer 56, and the thermal resistance may be lowered.
  • the buffer layer 56 copper (Cu) or the like having excellent thermal conductivity may be selected.
  • the buffer layer 56 may be made of a metal mesh.
  • the line resistance of the wiring should not exceed 1 kW. Since ITO has a high resistance value, it is necessary to make the width W1 relatively wide to reduce the resistance to 1 kW.
  • the width W2 of the electrodes 41b and 41d of the light emitting device package 40 is made smaller than the width W1 of the transparent wiring 52. Therefore, the width W2 of the buffer layer 56 is preferably smaller than the width W1 of the transparent wiring 52 in terms of cost.
  • the buffer layer 56 since the buffer layer 56 is formed by a printing method using a mask pattern, the buffer layer 56 may be manufactured to have the same width as that of the transparent wiring 52, and thus, the width of the buffer layer 56 may be shorter than that of the adjacent wiring.
  • the thickness d1 of the transparent wiring 52 is manufactured to about 0.2-0.3 micrometer.
  • the buffer layer 56 is manufactured by a printing method using a mask pattern as described above, the buffer layer 56 has a thickness d2 of about 5.0 to 10.0 ⁇ m. That is, the buffer layer 56 is formed to a thickness similar to the thickness of the mask pattern.
  • FIG. 6 is a view for explaining a transparent light emitting device according to another embodiment of the present invention
  • Figure 7 is a view for explaining a coupling relationship between a light emitting device package and a first transparent substrate according to another embodiment of the present invention
  • 8 is a modification of FIG.
  • the above-described configuration may be applied as it is except for the material of the transparent wiring.
  • the common transparent wiring 51a and the driving transparent wirings 52a, 53a, and 54a may be metal meshes M.
  • the metal mesh M may be formed on the first light-transmitting substrate 30 and then patterned to form a transparent wiring.
  • the shape of the metal mesh M is not necessarily limited thereto and may be variously modified. As shown in P2 of FIG. 6B, the metal mesh M may be arranged in a regular hexagon shape, or may be arranged in a hexagonal shape as in P3 of FIG. 6B. Although not shown, predetermined polygonal shapes may be continuously arranged.
  • each metal mesh (M) is increased, the resistance can be lowered and the risk of disconnection can be reduced.
  • Table 1 below shows the resistance value of the metal mesh M, the pitch P, and the line width MW2, measured based on a metal mesh having a channel width MW1 of 790 ⁇ m and a length of 250 mm. The result is.
  • the resistance of the wiring should not exceed 1 kW. Looking at Table 1, if the pitch is 400 ⁇ m or less, and the width is 7 ⁇ m or more it can be seen that the resistance value is 1k ⁇ or less even if the thickness is different.
  • the pitch of the metal mesh M is 400 ⁇ m or less and the width is 7 ⁇ m or more, the light output of the plurality of light emitting device packages 40 may be uniformly controlled even if the thickness of the metal mesh is changed.
  • the pitch of the metal mesh M is 300 ⁇ m to 400 ⁇ m and the width is 10 ⁇ m to 30 ⁇ m, even if the length of the wiring is longer, uniform light output may be controlled to the plurality of light emitting device packages 40.
  • soldering may be directly performed with the electrodes 41b and 41d of the light emitting device package 40.
  • an additional buffer layer 56 may be further formed on the transparent wiring 50a as shown in FIG. 8.
  • the buffer layer 56 is formed relatively thicker than the transparent wiring 50a, the soldering S becomes easier. Therefore, electrical reliability of the electrodes 41b and 41d of the light emitting device package 40 and the transparent wiring 52a may be improved.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage électrique transparent comprenant : un premier substrat transparent ; une pluralité de boîtiers de diodes électroluminescentes placées sur le premier substrat transparent ; une pluralité de fils transparents connectés électriquement aux boîtiers de diodes électroluminescentes ; et une couche tampon permettant de connecter électriquement les boîtiers de diodes électroluminescentes et les fils transparents.
PCT/KR2015/004805 2015-01-30 2015-05-13 Dispositif d'éclairage électrique transparent WO2016122053A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0015411 2015-01-30
KR1020150015411A KR101747846B1 (ko) 2015-01-30 2015-01-30 투명 전광 장치

Publications (1)

Publication Number Publication Date
WO2016122053A1 true WO2016122053A1 (fr) 2016-08-04

Family

ID=56543647

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/004805 WO2016122053A1 (fr) 2015-01-30 2015-05-13 Dispositif d'éclairage électrique transparent

Country Status (2)

Country Link
KR (1) KR101747846B1 (fr)
WO (1) WO2016122053A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110875292A (zh) * 2018-09-03 2020-03-10 东芝北斗电子株式会社 发光装置
EP3660903B1 (fr) * 2017-07-28 2022-02-09 LG Chem, Ltd. Dispositif d'affichage à élément électroluminescent transparent

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102060115B1 (ko) * 2018-09-13 2019-12-27 주식회사 피아이에스 엘이디모듈의 개별제어가 가능한 엘이디기판

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050035324A (ko) * 2003-10-10 2005-04-18 삼성전기주식회사 질화갈륨계 반도체 발광 소자 및 그 제조방법
US20100065881A1 (en) * 2008-09-16 2010-03-18 Samsung Electronics Co., Ltd. Light-emitting element capable of increasing amount of light emitted, light-emitting device including the same, and method of manufacturing light-emitting element and light-emitting device
WO2013186737A1 (fr) * 2012-06-14 2013-12-19 Koninklijke Philips N.V. Dispositif d'éclairage à surface électroluminescente tactile
WO2014014170A1 (fr) * 2012-07-18 2014-01-23 지스마트주식회사 Panneau d'affichage électronique transparent et son procédé de fabrication
KR20140064252A (ko) * 2012-11-20 2014-05-28 주식회사 세미콘라이트 반도체 발광소자 및 이를 봉지하는 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050035324A (ko) * 2003-10-10 2005-04-18 삼성전기주식회사 질화갈륨계 반도체 발광 소자 및 그 제조방법
US20100065881A1 (en) * 2008-09-16 2010-03-18 Samsung Electronics Co., Ltd. Light-emitting element capable of increasing amount of light emitted, light-emitting device including the same, and method of manufacturing light-emitting element and light-emitting device
WO2013186737A1 (fr) * 2012-06-14 2013-12-19 Koninklijke Philips N.V. Dispositif d'éclairage à surface électroluminescente tactile
WO2014014170A1 (fr) * 2012-07-18 2014-01-23 지스마트주식회사 Panneau d'affichage électronique transparent et son procédé de fabrication
KR20140064252A (ko) * 2012-11-20 2014-05-28 주식회사 세미콘라이트 반도체 발광소자 및 이를 봉지하는 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3660903B1 (fr) * 2017-07-28 2022-02-09 LG Chem, Ltd. Dispositif d'affichage à élément électroluminescent transparent
CN110875292A (zh) * 2018-09-03 2020-03-10 东芝北斗电子株式会社 发光装置
CN110875292B (zh) * 2018-09-03 2023-11-28 日亚化学工业株式会社 发光装置

Also Published As

Publication number Publication date
KR20160094162A (ko) 2016-08-09
KR101747846B1 (ko) 2017-06-15

Similar Documents

Publication Publication Date Title
WO2016137056A1 (fr) Appareil d'éclairage électrique transparent
WO2020140727A1 (fr) Dispositif d'affichage à led
WO2017026820A1 (fr) Module électroluminescent et dispositif d'affichage le comportant
WO2016190644A1 (fr) Dispositif electroluminescent et lampe de véhicule comprenant celui-ci
JP6110695B2 (ja) 発光装置
WO2019093641A1 (fr) Dispositif d'affichage à del comprenant un substrat tft ayant des unités d'attaque de del formées sur celui-ci
US9951925B2 (en) Light emitting device
WO2012128458A2 (fr) Module del et ensemble d'éclairage
WO2012002629A1 (fr) Module de diode électroluminescente
CN211375271U (zh) 背光源灯板、背光源和显示装置
WO2018174434A1 (fr) Dispositif d'affichage et son procédé de fabrication
WO2010074371A1 (fr) Ensemble de del à montage direct des puces et son procédé de fabrication
WO2016122053A1 (fr) Dispositif d'éclairage électrique transparent
WO2019151616A1 (fr) Dispositif d'affichage
WO2019231191A1 (fr) Film de diode électroluminescente transparent
KR102559945B1 (ko) 발광모듈, 발광 캐비닛 및 표시장치
WO2011087319A2 (fr) Dispositif électroluminescent
WO2021015540A1 (fr) Procédé de fabrication de csp de pixel ayant un plot d'électrode extensible, et csp de pixel fabriqué par le procédé
WO2020022544A1 (fr) Lampe de véhicule utilisant un dispositif électroluminescent à semi-conducteur
WO2019231197A1 (fr) Procédé de fabrication d'une structure de conversion de couleur pour affichage à micro-del
WO2020175765A1 (fr) Dispositif d'affichage transparent et ensemble verre le comprenant
WO2023282368A1 (fr) Module de source lumineuse et film à del comprenant celui-ci
WO2022191626A1 (fr) Feuille d'isolation pour source de lumière d'affichage, et module de source de lumière d'isolation, unité de rétroéclairage d'isolation et dispositif d'affichage la comprenant
WO2023096452A1 (fr) Module de pixel et dispositif d'affichage le comprenant
CN220065081U (zh) 透明显示器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15880233

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15880233

Country of ref document: EP

Kind code of ref document: A1