WO2016114174A1 - Method for producing bonded structure, and bonded structure - Google Patents

Method for producing bonded structure, and bonded structure Download PDF

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Publication number
WO2016114174A1
WO2016114174A1 PCT/JP2016/050132 JP2016050132W WO2016114174A1 WO 2016114174 A1 WO2016114174 A1 WO 2016114174A1 JP 2016050132 W JP2016050132 W JP 2016050132W WO 2016114174 A1 WO2016114174 A1 WO 2016114174A1
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WO
WIPO (PCT)
Prior art keywords
metal member
laser
bonding
bonded structure
resin member
Prior art date
Application number
PCT/JP2016/050132
Other languages
French (fr)
Japanese (ja)
Inventor
和義 西川
Original Assignee
オムロン株式会社
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Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2016114174A1 publication Critical patent/WO2016114174A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/15—Magnesium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

Definitions

  • the present invention relates to a method for manufacturing a bonded structure and a bonded structure.
  • Patent Document 1 a method for manufacturing a bonded structure in which a metal member and a resin member are bonded and a bonded structure are known (see, for example, Patent Document 1).
  • Patent Document 1 discloses a technique in which an oxide layer is formed by performing a surface modification treatment on the bonding interface side (metal member side) of a resin member, and then the resin member and the metal member are bonded by laser irradiation. ing.
  • a perforated portion is provided on the surface of the metal member, particularly on the bonding interface side (resin member side), and the resin member is buried and bonded to the perforated portion.
  • the surface of the resin member is melted to a depth of about several tens of ⁇ m from the surface layer due to heat transfer from the metal member side heated by laser irradiation, and the surface modification effect provided on the resin member side is sufficient.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a bonded structure and a bonded structure capable of improving the bondability between a metal member and a resin member. Is to provide a body.
  • a method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a step of forming a perforated portion having an opening on a surface of the metal member; After forming the portion, the method includes a step of modifying the surface of the metal member, and a step of bonding the surface-modified metal member and the resin member.
  • the step of modifying the surface of the metal member may be performed by any of plasma treatment, corona treatment, UV ozone treatment, or laser treatment on the surface of the metal member. It may be a step of forming.
  • the step of bonding the surface-modified metal member and the resin member may be any of laser irradiation, injection molding, and hot pressing. .
  • the step of forming the perforated part may be a step of forming the perforated part by irradiating a laser in which one pulse is composed of a plurality of subpulses.
  • the bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
  • the method for manufacturing a bonded structure and the bonded structure of the present invention it is possible to improve the bondability (bonding strength) due to the strong anchor bonding effect between the metal member and the resin member.
  • FIG. 1 It is a schematic diagram of the cross section of the joining structure body by one Embodiment of this invention. It is the schematic diagram which showed the state by which the perforated part was formed in the metal member of a joining structure. It is the schematic diagram which showed the state by which surface modification was performed to the metal member of the joining structure. It is the perspective view which showed the metal member of the joining structure body of an Example. It is the perspective view which showed the joining structure of the Example.
  • the bonded structure 100 according to the present embodiment is obtained by bonding a metal member 10 and a resin member 20 made of different materials.
  • a modified layer (oxide film) 10a subjected to a surface modification process is formed on the surface 13 of the metal member 10. This surface modification is performed in order to improve the affinity between the metal member 10 and the molten resin member 20 when the metal member 10 and the resin member 20 are joined.
  • a perforated portion 11 having an opening is formed on the surface 13 of the metal member 10.
  • FIG. 1 is a diagram schematically showing an enlarged joining interface between the metal member 10 and the resin member 20, and actually a plurality of perforated portions 11 are provided, but only one is shown in FIG. It was.
  • Examples of the metal member 10 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molded body may be sufficient and zinc die casting, aluminum die casting, powder metallurgy, etc. may be sufficient.
  • Resin member 20 is a thermoplastic resin or a thermosetting resin.
  • thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid crystal polymer), PV
  • TPE thermoplastic elastomer
  • examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
  • thermosetting resins examples include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
  • a filler may be added to the above-described thermoplastic resin and thermosetting resin.
  • the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
  • the perforated portion 11 formed on the surface 13 of the metal member 10 is previously formed by laser processing, blast processing, sandpaper processing, anodizing processing, electric discharge processing, etching processing, press processing, or the like.
  • the perforated part 11 is a substantially circular non-through hole when viewed in plan, and a plurality of perforated parts 11 are formed on the surface 13 of the metal member 10.
  • the opening diameter R1 of the surface 13 of the perforated part 11 is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because when the opening diameter R1 is less than 30 ⁇ m, the filling property of the resin member 20 is deteriorated and the anchor effect may be lowered. On the other hand, when the opening diameter R1 exceeds 100 ⁇ m, the number of the perforated portions 11 per unit area is reduced, and the anchor effect may be lowered.
  • the interval between the perforated parts 11 is preferably 200 ⁇ m or less. This is because when the interval between the perforated portions 11 exceeds 200 ⁇ m, the number of the perforated portions 11 per unit area decreases, and the anchor effect may be reduced.
  • the perforated part 11 has an enlarged diameter part 111 whose opening diameter increases from the surface 13 side toward the bottom part 113 in the depth direction (Z direction), and an opening diameter from the surface 13 side toward the bottom part 113 in the depth direction. It is formed so as to be connected to the reduced diameter portion 112 where the diameter becomes smaller.
  • the enlarged diameter portion 111 is formed so as to increase in diameter in a curved shape, and the reduced diameter portion 112 is formed so as to reduce in diameter in a curved shape.
  • the enlarged diameter portion 111 is disposed on the surface 13 side, and the reduced diameter portion 112 is disposed on the bottom 113 side.
  • the opening diameter (inner diameter) R2 of the boundary part between the enlarged diameter part 111 and the reduced diameter part 112 is the largest, and the opening diameter R1 is smaller than the opening diameter R2.
  • the protrusion part 12 is arrange
  • This protrusion 12 is formed over the entire length in the circumferential direction, for example, and is formed in an annular shape.
  • the protruding portion 12 protruding inwardly on the inner peripheral surface of the perforated portion 11, the protruding portion 12 and the resin member 20 filled in the perforated portion 11 are engaged in the peeling direction (Z direction). By doing so, it is possible to improve the bonding strength in the peeling direction. Thereby, it is possible to improve the bonding strength in the peeling direction in addition to the shearing direction. Furthermore, even in a heat cycle environment, even if a peeling stress due to a difference in linear expansion coefficient between the metal member 10 and the resin member 20 occurs, the bonding strength can be maintained. That is, it is possible to improve durability under a heat cycle environment.
  • This perforated part 11 is formed by, for example, laser irradiation.
  • a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected from the viewpoint of enabling pulse oscillation, and considering the laser wavelength, a fiber laser, a YAG laser, a YAG
  • the second harmonic of the laser, YVO 4 laser, and semiconductor laser are preferred.
  • the laser output is set in consideration of the laser irradiation diameter, the type of material of the metal member 10, the shape (for example, thickness) of the metal member 10, and the like.
  • the output upper limit of the laser is preferably 40W. This is because when the laser output exceeds 40 W, the energy is large and it is difficult to form the perforated part 11 having the protruding part 12.
  • fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON As an example of an apparatus for forming the perforated part 11, there can be mentioned fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON. With this fiber laser marker, it is possible to irradiate a laser where one pulse is composed of a plurality of subpulses. For this reason, since the energy of a laser is easy to concentrate on the depth direction, it is suitable for forming the perforated part 11. Specifically, when the metal member 10 is irradiated with a laser, the metal member 10 is locally melted, so that the formation of the perforated portion 11 proceeds. At this time, since the laser is composed of a plurality of sub-pulses, the molten metal member 10 is not easily scattered and easily deposited in the vicinity of the perforated portion 11.
  • the molten metal member 10 is deposited inside the perforated part 11, thereby forming the protruding part 12.
  • the laser irradiation direction is, for example, a direction perpendicular to the surface 13, and the axis of the perforated part 11 is perpendicular to the surface 13.
  • one period of the subpulse is 15 ns or less. This is because if one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 11 having the protruding part 12.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the perforated part 11 having the protruding parts 12.
  • the surface 13 of the metal member 10 exhibits a state in which a modified layer is formed in no small amount.
  • the purpose of laser irradiation is to form the perforated portion 11, and it has not yet been possible to form a uniform and uniform modified layer on the surface 13 of the metal member 10.
  • the formation of the modified layer by laser irradiation in the gap between the perforated part 11 and the perforated part 11 is more uneven, or the modified layer Is not formed.
  • any one of plasma treatment, corona treatment, UV ozone treatment, or laser treatment is performed.
  • the perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 is processed using an atmospheric pressure plasma processing apparatus.
  • the other portions than the perforated portion 11 are masked with a resin so that the perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 is exposed.
  • the entire surface including the perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 is processed using a table-top conveyor type UV reformer.
  • Laser treatment is performed using a semiconductor laser 808 nm on a perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 at a focal diameter of 1 mm and a scanning speed of 1 mm / sec.
  • the resin member 20 is bonded to the surface 13 of the metal member 10 in which the perforated portion 11 is formed.
  • the resin member 20 is bonded to the metal member 10 by, for example, laser bonding, injection molding bonding, hot press bonding, cast hardening, ultrasonic welding, or vibration welding. Thereby, the resin member 20 is solidified in the state where the perforated part 11 is filled.
  • Such a bonded structure 100 is applicable, for example, when a resin cover (not shown) is bonded to a metal case (not shown) of a photoelectric sensor.
  • the metal case corresponds to the metal member 10
  • the resin cover corresponds to the resin member 20.
  • laser bonding In laser bonding, the metal member 10 and the resin member 20 are pressed with a jig or the like and brought into surface contact, and then laser irradiation is performed. Laser irradiation is performed from the resin member 20 side (only when having laser transparency) and / or the metal member 10 side.
  • laser irradiation is performed from the resin member 20 side (only when having laser transparency) and / or the metal member 10 side.
  • fiber laser, YAG laser, YVO 4 laser, a semiconductor laser, a carbon dioxide laser, or excimer laser can be selected.
  • the metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the material of the resin member 20 is PMMA resin (Acrylite (registered trademark) manufactured by Mitsubishi Rayon.
  • the resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness. Is 3 mm.
  • Example conditions for laser irradiation are as follows.
  • Laser Semiconductor laser (wavelength 808 nm) Oscillation mode: Continuous oscillation Output: 30W Focal diameter: 4mm Scanning speed: 1mm / sec Contact pressure: 0.6 MPa
  • Injection molding joining In the injection molding joining, the metal member 10 was inserted into an injection mold and joined to the resin member 20 by injection molding. As a material of the metal member 10, SUS304 is used. The metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the molding machine uses J35EL3 manufactured by Nippon Steel Works.
  • the resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • Molding conditions are as follows.
  • Hot press bonding In the hot press bonding, the metal member 10 is installed in the lower mold of a press machine that has been heated and adjusted in advance, and the bonding surface of the resin member 20 is installed facing the bonding surface of the metal member 10. Press to join.
  • a material of the metal member 10 SUS304 is used.
  • the metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • Example conditions for hot press bonding are as follows.
  • the perforated part 11 is formed on the surface 13 of the metal member 10, and the protruding part 12 is formed on the inner peripheral surface of the perforated part 11.
  • the perforated part 11 and the protruding part 12 are formed, for example, by irradiating a laser in which one pulse is composed of a plurality of sub-pulses. As a specific example, it is formed using the fiber laser marker MX-Z2000 or MX-Z2050 described above.
  • the metal member 10 is subjected to any one of plasma treatment, corona treatment, UV ozone treatment, or laser treatment on the surface 13 of the metal member 10 on which the perforated portion 11 is formed.
  • a modified layer (oxide film) 10a is formed on the surface 13 of the substrate.
  • the resin member 20 is filled into the perforated portion 11 of the surface-modified metal member 10, and the resin member 20 is solidified. Thereby, the metal member 10 and the resin member 20 are joined, and the joining structure 100 (refer FIG. 1) is formed.
  • the resin member 20 is bonded by, for example, the above-described laser bonding, injection molding bonding, hot press bonding, cast hardening, ultrasonic welding, or vibration welding.
  • Example 1 In Experimental Example 1, a bonded structure 500 (see FIG. 5) according to Examples A1, A2, A3, and A4 corresponding to the present embodiment and a bonded structure according to Comparative Example A were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 1.
  • the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • a perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example A1 was performed by plasma treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example A2 was performed by corona treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example A3 was performed by UV ozone treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example A4 was performed by laser processing.
  • a predetermined region R on the surface of the metal member 501 is irradiated with a joining laser.
  • the laser irradiation conditions are as described above.
  • the thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
  • the bonding level that can be realized by forming the perforated portion in the metal member of this experimental example is a breakage of the resin member in the bonding strength evaluation when the thermal cycle test is not performed. That is, the bonding strength becomes the breaking strength of the resin, and it cannot be determined whether or not there is a surface modification effect. Therefore, it is effective to observe thermal cycle fatigue resistance as a method for evaluating the surface modification effect of this experimental example.
  • the pass / fail judgment was made according to the following criteria.
  • the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage)
  • ⁇ a product exceeding the standard was regarded as acceptable ( ⁇ ).
  • the number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
  • Example A1 As shown in Table 1 above, in Comparative Example A (standard), when the number of thermal cycles was 250, partial peeling was observed at the bonding interface. On the other hand, in Example A1, when the number of thermal cycles was 750, partial peeling was observed at the bonding interface. In Examples A2 and A3, partial peeling was observed at the bonding interface when the number of thermal cycles was 500. In Example A4, when the number of thermal cycles was 750, partial peeling was observed at the bonding interface.
  • thermal cycle fatigue is achieved by performing surface modification on the metal member 501 as compared with the joining structure of Comparative Example A (when surface modification is not performed). Resistance was high. As a result, it was found that the surface modification of the metal member 501 as in the bonded structures 500 of Examples A1 to A4 can suppress the peeling due to thermal stress and improve the bondability. did.
  • Example 2 In Experimental Example 2, a bonded structure 500 (see FIG. 5) according to Examples B1, B2, B3, and B4 corresponding to the present embodiment and a bonded structure according to Comparative Example B were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 2.
  • the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example B1 was performed by plasma treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example B2 was performed by corona treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example B3 was performed by UV ozone treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example B4 was performed by laser processing.
  • the metal member 501 was inserted into an injection mold and joined to the resin member 502 by injection molding.
  • the molding conditions are as described above.
  • the thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
  • the pass / fail judgment was made according to the following criteria.
  • the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage)
  • ⁇ a product exceeding the standard was regarded as acceptable ( ⁇ ).
  • the number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
  • thermal cycle fatigue is achieved by performing surface modification on the metal member 501 compared to the joining structure of Comparative Example B (when surface modification is not performed). Resistance was high. As a result, it was found that, as in the bonding structures 500 of Examples B1 to B4, the surface modification of the metal member 501 can suppress the peeling due to thermal stress and improve the bondability. did.
  • the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example C1 was performed by plasma treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example C2 was performed by corona treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example C3 was performed by UV ozone treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example C4 was performed by laser processing. These surface modification conditions are as described above.
  • the metal member 501 was placed in a lower mold of a press machine that had been heated and adjusted in advance, and pressed and joined in a state where the joint surface of the resin member 502 was placed facing the joint surface of the metal member 501.
  • the conditions for hot press bonding are as described above.
  • the thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
  • the pass / fail judgment was made according to the following criteria.
  • the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage)
  • ⁇ a product exceeding the standard was regarded as acceptable ( ⁇ ).
  • the number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
  • Example C As shown in Table 3 above, in Comparative Example C (standard), when the thermal cycle number was 250, partial peeling was observed at the bonding interface. On the other hand, in Example C1, when the number of thermal cycles was 1000, partial peeling was observed at the bonding interface. In Examples C2 and C3, partial peeling was observed at the bonding interface when the number of thermal cycles was 750. In Example C4, when the number of thermal cycles was 1000, partial peeling was observed at the bonding interface.
  • thermal cycle fatigue is achieved by performing surface modification on the metal member 501 as compared with the joining structure of Comparative Example C (when surface modification is not performed). Resistance was high. As a result, it was found that, by performing the surface modification of the metal member 501 as in the bonding structures 500 of Examples C1 to C4, it is possible to suppress peeling due to thermal stress and to improve bondability. did.
  • the effects listed below can be obtained. That is, in this embodiment, as described above, the metal member 10 and the resin member are formed by forming the modified layer (oxide film) 10a by modifying the surface of the metal member 10 in which the perforated portion 11 is formed. Since the embedding property (fillability) of the resin member 20 into the perforated part 11 provided on the surface 13 of the metal member 10 is improved in the joining process with the metal member 10, the strong anchor joining effect between the metal member 10 and the resin member 20 is improved. Bondability can be improved.
  • the present invention is not limited to this.
  • the surface modification in the step of performing the surface modification, the surface modification may be performed by a step other than the above steps.
  • the modified layer oxide film
  • the present invention is not limited to this.
  • the surface of the metal member other than the oxide film can be improved.
  • a modified layer may be formed.
  • the step of bonding the surface-modified metal member and the resin member may be a step other than the above.
  • the projecting part may not be formed in the perforated part. That is, the cross-sectional shape of the perforated part may be a concave shape such as a rectangular shape or a triangular shape. Further, the perforated part may be formed in a groove shape so as to be continuous.
  • the present invention is applicable to a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a bonded structure.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
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Abstract

This method for producing a bonded structure, in which a metal member and a resin member are bonded with each other, comprises: a step for forming a perforated part that has an opening in the surface of the metal member; a step for performing surface modification of the metal member after the formation of the perforated part; and a step for bonding the surface-modified metal member and the resin member with each other.

Description

接合構造体の製造方法および接合構造体Manufacturing method of bonded structure and bonded structure
　本発明は、接合構造体の製造方法および接合構造体に関する。 The present invention relates to a method for manufacturing a bonded structure and a bonded structure.
　従来、金属部材と樹脂部材とが接合された接合構造体の製造方法および接合構造体が知られている（たとえば、特許文献１参照）。 Conventionally, a method for manufacturing a bonded structure in which a metal member and a resin member are bonded and a bonded structure are known (see, for example, Patent Document 1).
　特許文献１には、樹脂部材の接合界面側（金属部材側）に表面改質処理を施すことにより酸化層を形成し、その後、樹脂部材と金属部材とをレーザ照射により接合する技術が開示されている。 Patent Document 1 discloses a technique in which an oxide layer is formed by performing a surface modification treatment on the bonding interface side (metal member side) of a resin member, and then the resin member and the metal member are bonded by laser irradiation. ing.
特開２０１２－５６３０８号公報JP 2012-56308 A
　しかしながら、金属部材と樹脂部材とを物理的に接合させる場合、特に金属部材の接合界面側（樹脂部材側）の表面に穿孔部を設け、この穿孔部に対して樹脂部材を埋没させて接合する場合、レーザ照射により加熱された金属部材側からの伝熱により、樹脂部材の表面は表層から数十μｍ程度の深さまで溶融された状態になり、樹脂部材側に設けた表面改質効果を十分に機能させることができず、金属部材と樹脂部材との接合性（接合強度）の向上を図ることが困難になるという問題点がある。 However, when the metal member and the resin member are physically bonded, a perforated portion is provided on the surface of the metal member, particularly on the bonding interface side (resin member side), and the resin member is buried and bonded to the perforated portion. In this case, the surface of the resin member is melted to a depth of about several tens of μm from the surface layer due to heat transfer from the metal member side heated by laser irradiation, and the surface modification effect provided on the resin member side is sufficient. However, it is difficult to improve the bondability (bonding strength) between the metal member and the resin member.
　本発明は、上記の課題を解決するためになされたものであり、本発明の目的は、金属部材と樹脂部材との接合性の向上を図ることが可能な接合構造体の製造方法および接合構造体を提供することである。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a bonded structure and a bonded structure capable of improving the bondability between a metal member and a resin member. Is to provide a body.
　本発明による接合構造体の製造方法は、金属部材と樹脂部材とが接合された接合構造体の製造方法であって、前記金属部材の表面に開口を有する穿孔部を形成する工程と、前記穿孔部を形成した後に、前記金属部材に表面改質を行う工程と、前記表面改質された金属部材と前記樹脂部材とを接合する工程とを備えることを特徴とする。 A method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a step of forming a perforated portion having an opening on a surface of the metal member; After forming the portion, the method includes a step of modifying the surface of the metal member, and a step of bonding the surface-modified metal member and the resin member.
　また、上記接合構造体の製造方法において、前記金属部材に表面改質を行う工程は、プラズマ処理、コロナ処理、ＵＶオゾン処理、または、レーザ処理のいずれかにより、前記金属部材の表面に酸化膜を形成する工程であってもよい。 In the method for manufacturing a bonded structure, the step of modifying the surface of the metal member may be performed by any of plasma treatment, corona treatment, UV ozone treatment, or laser treatment on the surface of the metal member. It may be a step of forming.
　また、上記接合構造体の製造方法において、前記表面改質された金属部材と前記樹脂部材とを接合する工程は、レーザ照射、射出成形、または、熱プレスのいずれかの工程であってもよい。 In the method for manufacturing a bonded structure, the step of bonding the surface-modified metal member and the resin member may be any of laser irradiation, injection molding, and hot pressing. .
　また、上記接合構造体の製造方法において、前記穿孔部を形成する工程は、１パルスが複数のサブパルスで構成されるレーザを照射することにより前記穿孔部を形成する工程であってもよい。 In the method for manufacturing a bonded structure, the step of forming the perforated part may be a step of forming the perforated part by irradiating a laser in which one pulse is composed of a plurality of subpulses.
　本発明による接合構造体は、上記したいずれか１つの接合構造体の製造方法によって製造されている。 The bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
　本発明の接合構造体の製造方法および接合構造体によれば、金属部材と樹脂部材との強力なアンカー接合効果による接合性（接合強度）の向上を図ることができる。 According to the method for manufacturing a bonded structure and the bonded structure of the present invention, it is possible to improve the bondability (bonding strength) due to the strong anchor bonding effect between the metal member and the resin member.
本発明の一実施形態による接合構造体の断面の模式図である。It is a schematic diagram of the cross section of the joining structure body by one Embodiment of this invention. 接合構造体の金属部材に穿孔部が形成された状態を示した模式図である。It is the schematic diagram which showed the state by which the perforated part was formed in the metal member of a joining structure. 接合構造体の金属部材に表面改質が行われた状態を示した模式図である。It is the schematic diagram which showed the state by which surface modification was performed to the metal member of the joining structure. 実施例の接合構造体の金属部材を示した斜視図である。It is the perspective view which showed the metal member of the joining structure body of an Example. 実施例の接合構造体を示した斜視図である。It is the perspective view which showed the joining structure of the Example.
　以下、本発明の一実施形態について図面を参照して説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
　－全体構成－
　まず、図１～図３を参照して、本実施形態による接合構造体１００の全体構成について説明する。 -overall structure-
First, the overall configuration of the joint structure 100 according to the present embodiment will be described with reference to FIGS.
　本実施形態による接合構造体１００は、図１に示すように、異なる材料からなる金属部材１０および樹脂部材２０が接合されたものである。金属部材１０の表面１３には、表面改質処理が施された改質層（酸化膜）１０ａが形成されている。この表面改質は、金属部材１０と樹脂部材２０との接合時に、金属部材１０と溶融した樹脂部材２０との親和性を向上させるために実施されるものである。また、金属部材１０の表面１３には、開口を有する穿孔部１１が形成されている。 As shown in FIG. 1, the bonded structure 100 according to the present embodiment is obtained by bonding a metal member 10 and a resin member 20 made of different materials. On the surface 13 of the metal member 10, a modified layer (oxide film) 10a subjected to a surface modification process is formed. This surface modification is performed in order to improve the affinity between the metal member 10 and the molten resin member 20 when the metal member 10 and the resin member 20 are joined. A perforated portion 11 having an opening is formed on the surface 13 of the metal member 10.
　穿孔部１１の内周面には、内側に突出する突出部１２が形成されている。そして、金属部材１０の穿孔部１１には、樹脂部材２０が充填されて固化されている。なお、図１は、金属部材１０および樹脂部材２０の接合界面を拡大して模式的に示した図であり、実際には穿孔部１１が複数設けられているが、図１では１つだけ示した。 A protruding portion 12 that protrudes inward is formed on the inner peripheral surface of the perforated portion 11. The perforated portion 11 of the metal member 10 is filled with a resin member 20 and solidified. FIG. 1 is a diagram schematically showing an enlarged joining interface between the metal member 10 and the resin member 20, and actually a plurality of perforated portions 11 are provided, but only one is shown in FIG. It was.
　金属部材１０の一例としては、鉄系金属、ステンレス系金属、銅系金属、アルミ系金属、マグネシウム系金属、および、それらの合金が挙げられる。また、金属成形体であってもよく、亜鉛ダイカスト、アルミダイカスト、粉末冶金などであってもよい。 Examples of the metal member 10 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molded body may be sufficient and zinc die casting, aluminum die casting, powder metallurgy, etc. may be sufficient.
　樹脂部材２０は、熱可塑性樹脂、または、熱硬化性樹脂である。熱可塑性樹脂の一例としては、ＰＶＣ（ポリ塩化ビニル）、ＰＳ（ポリスチレン）、ＡＳ（アクリロニトリル・スチレン）、ＡＢＳ（アクリロニトリル・ブタジエン・スチレン）、ＰＭＭＡ（ポリメチルメタクリレート）、ＰＥ（ポリエチレン）、ＰＰ（ポリプロピレン）、ＰＣ（ポリカーボネート）、ｍ－ＰＰＥ（変性ポリフェニレンエーテル）、ＰＡ６（ポリアミド６）、ＰＡ６６（ポリアミド６６）、ＰＯＭ（ポリアセタール）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＳＦ（ポリサルホン）、ＰＡＲ（ポリアリレート）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポリフェニレンサルファイド）、ＰＥＳ（ポリエーテルサルホン）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＡＩ（ポリアミドイミド）、ＬＣＰ（液晶ポリマー）、ＰＶＤＣ（ポリ塩化ビニリデン）、ＰＴＦＥ（ポリテトラフルオロエチレン）、ＰＣＴＦＥ（ポリクロロトリフルオロエチレン）、および、ＰＶＤＦ（ポリフッ化ビニリデン）が挙げられる。また、ＴＰＥ（熱可塑性エラストマ）であってもよく、ＴＰＥの一例としては、ＴＰＯ（オレフィン系）、ＴＰＳ（スチレン系）、ＴＰＥＥ（エステル系）、ＴＰＵ（ウレタン系）、ＴＰＡ（ナイロン系）、および、ＴＰＶＣ（塩化ビニル系）が挙げられる。 Resin member 20 is a thermoplastic resin or a thermosetting resin. Examples of thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid crystal polymer), PVDC (polyvinylidene chloride), PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), and include PVDF (poly (vinylidene fluoride)) it is. TPE (thermoplastic elastomer) may also be used, and examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
　熱硬化性樹脂の一例としては、ＥＰ（エポキシ）、ＰＵＲ（ポリウレタン）、ＵＦ（ユリアホルムアルデヒド）、ＭＦ（メラミンホルムアルデヒド）、ＰＦ（フェノールホルムアルデヒド）、ＵＰ（不飽和ポリエステル）、および、ＳＩ（シリコーン）が挙げられる。また、ＦＲＰ（繊維強化プラスチック）であってもよい。 Examples of thermosetting resins include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
　なお、上記した熱可塑性樹脂および熱硬化性樹脂には、充填剤が添加されていてもよい。充填剤の一例としては、無機系充填剤（ガラス繊維、無機塩類など）、金属系充填剤、有機系充填剤、および、炭素繊維などが挙げられる。 In addition, a filler may be added to the above-described thermoplastic resin and thermosetting resin. Examples of the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
　－穿孔部－
　金属部材１０の表面１３に形成された穿孔部１１は、予めレーザ加工処理、ブラスト処理、サンドペーパ処理、陽極酸化処理、放電加工処理、エッチング処理、または、プレス加工処理などにより形成されている。 -Perforated part-
The perforated portion 11 formed on the surface 13 of the metal member 10 is previously formed by laser processing, blast processing, sandpaper processing, anodizing processing, electric discharge processing, etching processing, press processing, or the like.
　穿孔部１１は、平面的に見てほぼ円形の非貫通孔であり、金属部材１０の表面１３に複数形成されている。穿孔部１１の表面１３の開口径Ｒ１は、３０μｍ以上、１００μｍ以下が好ましい。これは、開口径Ｒ１が３０μｍを下回ると、樹脂部材２０の充填性が悪化してアンカー効果が低下する場合があるためである。一方、開口径Ｒ１が１００μｍを上回ると、単位面積あたりの穿孔部１１の数が減少してアンカー効果が低下する場合があるためである。 The perforated part 11 is a substantially circular non-through hole when viewed in plan, and a plurality of perforated parts 11 are formed on the surface 13 of the metal member 10. The opening diameter R1 of the surface 13 of the perforated part 11 is preferably 30 μm or more and 100 μm or less. This is because when the opening diameter R1 is less than 30 μm, the filling property of the resin member 20 is deteriorated and the anchor effect may be lowered. On the other hand, when the opening diameter R1 exceeds 100 μm, the number of the perforated portions 11 per unit area is reduced, and the anchor effect may be lowered.
　また、穿孔部１１の間隔（所定の穿孔部１１の中心と、所定の穿孔部１１と隣接する穿孔部１１の中心との距離）は、２００μｍ以下であることが好ましい。これは、穿孔部１１の間隔が２００μｍを上回ると、単位面積あたりの穿孔部１１の数が減少してアンカー効果が低下する場合があるためである。 Further, the interval between the perforated parts 11 (the distance between the center of the predetermined perforated part 11 and the center of the perforated part 11 adjacent to the predetermined perforated part 11) is preferably 200 μm or less. This is because when the interval between the perforated portions 11 exceeds 200 μm, the number of the perforated portions 11 per unit area decreases, and the anchor effect may be reduced.
　また、穿孔部１１は、深さ方向（Ｚ方向）において表面１３側から底部１１３に向けて開口径が大きくなる拡径部１１１と、深さ方向において表面１３側から底部１１３に向けて開口径が小さくなる縮径部１１２とが連なるように形成されている。拡径部１１１は、曲線状に拡径するように形成され、縮径部１１２は、曲線状に縮径するように形成されている。 The perforated part 11 has an enlarged diameter part 111 whose opening diameter increases from the surface 13 side toward the bottom part 113 in the depth direction (Z direction), and an opening diameter from the surface 13 side toward the bottom part 113 in the depth direction. It is formed so as to be connected to the reduced diameter portion 112 where the diameter becomes smaller. The enlarged diameter portion 111 is formed so as to increase in diameter in a curved shape, and the reduced diameter portion 112 is formed so as to reduce in diameter in a curved shape.
　そして、拡径部１１１が表面１３側に配置されるとともに、縮径部１１２が底部１１３側に配置されている。このため、穿孔部１１において、拡径部１１１と縮径部１１２との境界部分の開口径（内径）Ｒ２が最も大きくなっており、開口径Ｒ１が開口径Ｒ２よりも小さくなっている。これにより、突出部１２が金属部材１０の表面１３側に配置されている。この突出部１２は、たとえば、周方向における全長にわたって形成されており、環状に形成されている。 Further, the enlarged diameter portion 111 is disposed on the surface 13 side, and the reduced diameter portion 112 is disposed on the bottom 113 side. For this reason, in the perforated part 11, the opening diameter (inner diameter) R2 of the boundary part between the enlarged diameter part 111 and the reduced diameter part 112 is the largest, and the opening diameter R1 is smaller than the opening diameter R2. Thereby, the protrusion part 12 is arrange | positioned at the surface 13 side of the metal member 10. FIG. This protrusion 12 is formed over the entire length in the circumferential direction, for example, and is formed in an annular shape.
　このように、穿孔部１１の内周面に内側に突出する突出部１２を形成することによって、突出部１２と穿孔部１１に充填された樹脂部材２０とが剥離方向（Ｚ方向）において係合されることにより、剥離方向の接合強度の向上を図ることができる。これにより、せん断方向に加えて剥離方向についても接合強度の向上を図ることができる。さらに、熱サイクル環境下において、金属部材１０および樹脂部材２０の線膨張係数差に起因する剥離応力が発生しても、接合強度を維持することができる。すなわち、熱サイクル環境下における耐久性の向上を図ることができる。 Thus, by forming the protruding portion 12 protruding inwardly on the inner peripheral surface of the perforated portion 11, the protruding portion 12 and the resin member 20 filled in the perforated portion 11 are engaged in the peeling direction (Z direction). By doing so, it is possible to improve the bonding strength in the peeling direction. Thereby, it is possible to improve the bonding strength in the peeling direction in addition to the shearing direction. Furthermore, even in a heat cycle environment, even if a peeling stress due to a difference in linear expansion coefficient between the metal member 10 and the resin member 20 occurs, the bonding strength can be maintained. That is, it is possible to improve durability under a heat cycle environment.
　この穿孔部１１は、たとえば、レーザが照射されることによって形成される。レーザの種類としては、パルス発振が可能な観点から、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ、炭酸ガスレーザ、エキシマレーザが選択でき、レーザの波長を考慮すると、ファイバレーザ、ＹＡＧレーザ、ＹＡＧレーザの第２高調波、ＹＶＯ４レーザ、半導体レーザが好ましい。なお、レーザの出力は、レーザの照射径、金属部材１０の材料の種類、金属部材１０の形状（たとえば厚み）などを考慮して設定される。たとえば、レーザの出力上限は４０Ｗが好ましい。これは、レーザの出力が４０Ｗを超えると、エネルギが大きく、突出部１２を有する穿孔部１１を形成することが困難であるためである。 This perforated part 11 is formed by, for example, laser irradiation. As the type of laser, a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected from the viewpoint of enabling pulse oscillation, and considering the laser wavelength, a fiber laser, a YAG laser, a YAG The second harmonic of the laser, YVO 4 laser, and semiconductor laser are preferred. The laser output is set in consideration of the laser irradiation diameter, the type of material of the metal member 10, the shape (for example, thickness) of the metal member 10, and the like. For example, the output upper limit of the laser is preferably 40W. This is because when the laser output exceeds 40 W, the energy is large and it is difficult to form the perforated part 11 having the protruding part 12.
　穿孔部１１を形成する装置の一例としては、オムロン製のファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を挙げることができる。このファイバレーザマーカでは、１パルスが複数のサブパルスで構成されるレーザを照射することが可能である。このため、レーザのエネルギを深さ方向に集中させやすいので、穿孔部１１を形成するのに好適である。具体的には、金属部材１０にレーザが照射されると、金属部材１０が局部的に溶融されることにより穿孔部１１の形成が進行する。このとき、レーザが複数のサブパルスで構成されているため、溶融された金属部材１０が飛散されにくく、穿孔部１１の近傍に堆積されやすい。そして、穿孔部１１の形成が進行すると、溶融された金属部材１０が穿孔部１１の内部に堆積されることにより、突出部１２が形成される。なお、レーザの照射方向は、たとえば、表面１３に対して垂直方向であり、穿孔部１１の軸心が表面１３に対して垂直になる。 As an example of an apparatus for forming the perforated part 11, there can be mentioned fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON. With this fiber laser marker, it is possible to irradiate a laser where one pulse is composed of a plurality of subpulses. For this reason, since the energy of a laser is easy to concentrate on the depth direction, it is suitable for forming the perforated part 11. Specifically, when the metal member 10 is irradiated with a laser, the metal member 10 is locally melted, so that the formation of the perforated portion 11 proceeds. At this time, since the laser is composed of a plurality of sub-pulses, the molten metal member 10 is not easily scattered and easily deposited in the vicinity of the perforated portion 11. When the formation of the perforated part 11 proceeds, the molten metal member 10 is deposited inside the perforated part 11, thereby forming the protruding part 12. The laser irradiation direction is, for example, a direction perpendicular to the surface 13, and the axis of the perforated part 11 is perpendicular to the surface 13.
　なお、上記ファイバレーザマーカによる加工条件としては、サブパルスの１周期が１５ｎｓ以下であることが好ましい。これは、サブパルスの１周期が１５ｎｓを超えると、熱伝導によりエネルギが拡散しやすくなり、突出部１２を有する穿孔部１１を形成しにくくなるためである。なお、サブパルスの１周期は、サブパルスの１回分の照射時間と、そのサブパルスの照射が終了されてから次回のサブパルスの照射が開始されるまでの間隔との合計時間である。 In addition, as a processing condition by the fiber laser marker, it is preferable that one period of the subpulse is 15 ns or less. This is because if one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 11 having the protruding part 12. Note that one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
　また、上記ファイバレーザマーカによる加工条件としては、１パルスのサブパルス数は、２以上５０以下であることが好ましい。これは、サブパルス数が５０を超えると、サブパルスの単位あたりの出力が小さくなり、突出部１２を有する穿孔部１１を形成しにくくなるためである。 Further, as a processing condition by the fiber laser marker, the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the perforated part 11 having the protruding parts 12.
　－表面改質－
　レーザ照射にて穿孔部１１が形成される過程においては、金属部材１０の表面１３は少なからず改質層が形成された状態を呈している。ただし、レーザ照射は穿孔部１１を形成するのが目的であり、金属部材１０の表面１３に一様に均一な改質層を形成するには至っていない。さらには、特に穿孔部１１と穿孔部１１との間隔が広い場合などでは、穿孔部１１と穿孔部１１との間隙部でレーザ照射による改質層の形成が一層不均一、もしくは、改質層が形成されていない状態となる。 -Surface modification-
In the process in which the perforated part 11 is formed by laser irradiation, the surface 13 of the metal member 10 exhibits a state in which a modified layer is formed in no small amount. However, the purpose of laser irradiation is to form the perforated portion 11, and it has not yet been possible to form a uniform and uniform modified layer on the surface 13 of the metal member 10. Further, particularly when the distance between the perforated part 11 and the perforated part 11 is wide, the formation of the modified layer by laser irradiation in the gap between the perforated part 11 and the perforated part 11 is more uneven, or the modified layer Is not formed.
　そのため、穿孔部１１の形成後の金属部材１０の表面改質を一様に実施するために、プラズマ処理、コロナ処理、ＵＶオゾン処理、または、レーザ処理のいずれかを行う。なお、表面改質を実施する部位に、異物などが付着している場合は、アルコール、または、アセトンなどを用いて超音波洗浄を行うことが好ましい。 Therefore, in order to uniformly perform the surface modification of the metal member 10 after the formation of the perforated portion 11, any one of plasma treatment, corona treatment, UV ozone treatment, or laser treatment is performed. In addition, when the foreign material etc. have adhered to the site | part which implements surface modification, it is preferable to perform ultrasonic cleaning using alcohol or acetone.
　プラズマ処理では、大気圧プラズマ処理装置を用いて、金属部材１０の表面１３に形成された穿孔部１１（２０×２０ｍｍ）に処理を行う。 In the plasma processing, the perforated portion 11 (20 × 20 mm) formed on the surface 13 of the metal member 10 is processed using an atmospheric pressure plasma processing apparatus.
　コロナ処理では、金属部材１０の表面１３に形成された穿孔部１１（２０×２０ｍｍ）が露出するように、穿孔部１１以外を樹脂でマスキングして処理を行う。 In the corona treatment, the other portions than the perforated portion 11 are masked with a resin so that the perforated portion 11 (20 × 20 mm) formed on the surface 13 of the metal member 10 is exposed.
　ＵＶオゾン処理では、卓上コンベア型ＵＶ改質装置を用いて、金属部材１０の表面１３に形成された穿孔部１１（２０×２０ｍｍ）を含む表面全体に処理を行う。 In the UV ozone treatment, the entire surface including the perforated portion 11 (20 × 20 mm) formed on the surface 13 of the metal member 10 is processed using a table-top conveyor type UV reformer.
　レーザ処理は、半導体レーザ８０８ｎｍを用いて、金属部材１０の表面１３に形成された穿孔部１１（２０×２０ｍｍ）に焦点径１ｍｍで走査速度１ｍｍ／ｓｅｃで処理を行う。 Laser treatment is performed using a semiconductor laser 808 nm on a perforated portion 11 (20 × 20 mm) formed on the surface 13 of the metal member 10 at a focal diameter of 1 mm and a scanning speed of 1 mm / sec.
　－接合－
　上記のように、樹脂部材２０は、穿孔部１１が形成された金属部材１０の表面１３に接合されている。この樹脂部材２０は、たとえば、レーザ接合、射出成形接合、熱プレス接合、注型硬化、超音波溶着、または、振動溶着によって金属部材１０に接合されている。これにより、樹脂部材２０が穿孔部１１に充填された状態で固化されている。 -Joining-
As described above, the resin member 20 is bonded to the surface 13 of the metal member 10 in which the perforated portion 11 is formed. The resin member 20 is bonded to the metal member 10 by, for example, laser bonding, injection molding bonding, hot press bonding, cast hardening, ultrasonic welding, or vibration welding. Thereby, the resin member 20 is solidified in the state where the perforated part 11 is filled.
　このような接合構造体１００は、たとえば、光電センサの金属ケース（図示省略）に樹脂カバー（図示省略）を接合させる場合に適用可能である。この場合には、金属ケースが金属部材１０に相当し、樹脂カバーが樹脂部材２０に相当する。 Such a bonded structure 100 is applicable, for example, when a resin cover (not shown) is bonded to a metal case (not shown) of a photoelectric sensor. In this case, the metal case corresponds to the metal member 10, and the resin cover corresponds to the resin member 20.
　以下に、接合工程の一例として、レーザ接合、射出成形接合および熱プレス接合について説明する。 Hereinafter, laser bonding, injection molding bonding, and hot press bonding will be described as an example of the bonding process.
　（１）レーザ接合
　レーザ接合では、金属部材１０と樹脂部材２０とを治具などで加圧して面接触させた後に、レーザ照射を行う。レーザ照射は、樹脂部材２０側（レーザ透過性を有する場合のみ）、および／または、金属部材１０側から照射する。なお、接合用のレーザの種類としては、ファイバレーザ、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ、炭酸ガスレーザ、または、エキシマレーザが選択できる。 (1) Laser bonding In laser bonding, the metal member 10 and the resin member 20 are pressed with a jig or the like and brought into surface contact, and then laser irradiation is performed. Laser irradiation is performed from the resin member 20 side (only when having laser transparency) and / or the metal member 10 side. As the type of laser for bonding, fiber laser, YAG laser, YVO 4 laser, a semiconductor laser, a carbon dioxide laser, or excimer laser can be selected.
　金属部材１０の材料として、ＳＵＳ３０４を用いる。金属部材１０は、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。 SUS304 is used as the material of the metal member 10. The metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
　樹脂部材２０の材料として、ＰＭＭＡ樹脂（三菱レイヨン製のアクリライト（登録商標）を用いる。樹脂部材２０は、板状に形成されており、長さが１００ｍｍであり、幅が２５ｍｍであり、厚みが３ｍｍである。 The material of the resin member 20 is PMMA resin (Acrylite (registered trademark) manufactured by Mitsubishi Rayon. The resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness. Is 3 mm.
　レーザ照射の実施例条件は、以下の通りである。 Example conditions for laser irradiation are as follows.
　＜レーザ照射条件＞
　レーザ：半導体レーザ（波長８０８ｎｍ）
　発振モード：連続発振
　出力：３０Ｗ
　焦点径：４ｍｍ
　走査速度：１ｍｍ／ｓｅｃ
　密着圧力：０．６ＭＰａ
　（２）射出成形接合
　射出成形接合では、金属部材１０を射出成型金型にインサートして、樹脂部材２０と射出成型にて接合した。金属部材１０の材料として、ＳＵＳ３０４を用いる。金属部材１０は、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。 <Laser irradiation conditions>
Laser: Semiconductor laser (wavelength 808 nm)
Oscillation mode: Continuous oscillation Output: 30W
Focal diameter: 4mm
Scanning speed: 1mm / sec
Contact pressure: 0.6 MPa
(2) Injection molding joining In the injection molding joining, the metal member 10 was inserted into an injection mold and joined to the resin member 20 by injection molding. As a material of the metal member 10, SUS304 is used. The metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
　樹脂部材２０の材料として、ＰＢＴ（ウィンテックポリマー製のジュラネックス（登録商標）３３１６）を用いる。また、成形機は、日本製鋼所製のＪ３５ＥＬ３を用いる。樹脂部材２０は、板状に形成されており、長さが１００ｍｍであり、幅が２５ｍｍであり、厚みが３ｍｍである。 PBT (Juranex (registered trademark) 3316 made by Wintech Polymer) is used as the material of the resin member 20. The molding machine uses J35EL3 manufactured by Nippon Steel Works. The resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
　成形条件は以下のとおりである。 Molding conditions are as follows.
　＜成形条件＞
　予備乾燥：１２０℃×５時間
　金型温度：１２０℃
　シリンダ温度：２７０℃
　保圧：１００ＭＰａ
　（３）熱プレス接合
　熱プレス接合では、予め加熱調整されたプレス機の下型に金属部材１０を設置し、金属部材１０の接合面に樹脂部材２０の接合面を対面して設置した状態でプレスして接合する。金属部材１０の材料として、ＳＵＳ３０４を用いる。金属部材１０は、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。 <Molding conditions>
Pre-drying: 120 ° C x 5 hours Mold temperature: 120 ° C
Cylinder temperature: 270 ° C
Holding pressure: 100 MPa
(3) Hot press bonding In the hot press bonding, the metal member 10 is installed in the lower mold of a press machine that has been heated and adjusted in advance, and the bonding surface of the resin member 20 is installed facing the bonding surface of the metal member 10. Press to join. As a material of the metal member 10, SUS304 is used. The metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
　樹脂部材２０の材料として、ＰＢＴ（ウィンテックポリマー製のジュラネックス（登録商標）３３１６）を用いる。樹脂部材２０は、板状に形成されており、長さが１００ｍｍであり、幅が２５ｍｍであり、厚みが３ｍｍである。 PBT (Juranex (registered trademark) 3316 made by Wintech Polymer) is used as the material of the resin member 20. The resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
　熱プレス接合の実施例条件は以下の通りである。 Example conditions for hot press bonding are as follows.
　＜熱プレス条件＞
　下型温度：３３０℃（金属部材を設置する側）
　上型温度：１００℃（樹脂部材を設置する側）
　プレス圧力：２．０ＭＰａ
　プレス時間：６０秒
　－接合構造体の製造方法－
　次に、図１～図３を参照して、本実施形態による接合構造体１００の製造方法について説明する。 <Hot press conditions>
Lower mold temperature: 330 ° C (side on which metal members are installed)
Upper mold temperature: 100 ° C (side on which resin member is installed)
Press pressure: 2.0 MPa
Press time: 60 seconds-Manufacturing method of bonded structure-
Next, with reference to FIGS. 1 to 3, the method for manufacturing the joint structure 100 according to the present embodiment will be described.
　まず、図２に示すように、金属部材１０の表面１３に穿孔部１１を形成するとともに、その穿孔部１１の内周面に突出部１２を形成する。この穿孔部１１および突出部１２は、たとえば、１パルスが複数のサブパルスで構成されたレーザを照射することによって形成される。具体例としては、上記したファイバレーザマーカＭＸ－Ｚ２０００またはＭＸ－Ｚ２０５０を用いて形成する。 First, as shown in FIG. 2, the perforated part 11 is formed on the surface 13 of the metal member 10, and the protruding part 12 is formed on the inner peripheral surface of the perforated part 11. The perforated part 11 and the protruding part 12 are formed, for example, by irradiating a laser in which one pulse is composed of a plurality of sub-pulses. As a specific example, it is formed using the fiber laser marker MX-Z2000 or MX-Z2050 described above.
　次に、図３に示すように、穿孔部１１が形成された金属部材１０の表面１３に、プラズマ処理、コロナ処理、ＵＶオゾン処理、または、レーザ処理のいずれかを行うことにより、金属部材１０の表面１３に改質層（酸化膜）１０ａを形成する。 Next, as shown in FIG. 3, the metal member 10 is subjected to any one of plasma treatment, corona treatment, UV ozone treatment, or laser treatment on the surface 13 of the metal member 10 on which the perforated portion 11 is formed. A modified layer (oxide film) 10a is formed on the surface 13 of the substrate.
　その後、表面改質された金属部材１０の穿孔部１１に樹脂部材２０を充填し、その樹脂部材２０を固化させる。これにより、金属部材１０および樹脂部材２０が接合され、接合構造体１００（図１参照）が形成される。なお、樹脂部材２０は、たとえば、上記したレーザ接合、射出成形接合、熱プレス接合、注型硬化、超音波溶着、または、振動溶着によって接合される。 Thereafter, the resin member 20 is filled into the perforated portion 11 of the surface-modified metal member 10, and the resin member 20 is solidified. Thereby, the metal member 10 and the resin member 20 are joined, and the joining structure 100 (refer FIG. 1) is formed. The resin member 20 is bonded by, for example, the above-described laser bonding, injection molding bonding, hot press bonding, cast hardening, ultrasonic welding, or vibration welding.
　－実験例－
　次に、図４および図５を参照して、上記した本実施形態の効果を確認するために行った実験例１～３について説明する。 -Experimental example-
Next, with reference to FIGS. 4 and 5, Experimental Examples 1 to 3 performed for confirming the effects of the above-described embodiment will be described.
　［実験例１］
　この実験例１では、本実施形態に対応する実施例Ａ１、Ａ２、Ａ３およびＡ４による接合構造体５００（図５参照）と、比較例Ａによる接合構造体とを作製し、それぞれについての接合評価を行った。その結果を表１に示す。 [Experimental Example 1]
In Experimental Example 1, a bonded structure 500 (see FIG. 5) according to Examples A1, A2, A3, and A4 corresponding to the present embodiment and a bonded structure according to Comparative Example A were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　まず、表１に示す実施例Ａ１～Ａ４による接合構造体５００の作製方法について説明する。 First, a method for producing a bonded structure 500 according to Examples A1 to A4 shown in Table 1 will be described.
　実施例Ａ１～Ａ４の接合構造体５００では、金属部材５０１の材料としてＳＵＳ３０４を用いた。この金属部材５０１は、図４および図５に示すように、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。金属部材５０１の所定領域Ｒにレーザを照射して穿孔部を形成した。 In the joined structures 500 of Examples A1 to A4, SUS304 was used as the material of the metal member 501. As shown in FIGS. 4 and 5, the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
　実施例Ａ１による接合構造体５００の金属部材５０１の表面改質は、プラズマ処理により行った。実施例Ａ２による接合構造体５００の金属部材５０１の表面改質は、コロナ処理により行った。実施例Ａ３による接合構造体５００の金属部材５０１の表面改質は、ＵＶオゾン処理により行った。実施例Ａ４による接合構造体５００の金属部材５０１の表面改質は、レーザ処理により行った。これらの表面改質の条件は、上述の通りである。 The surface modification of the metal member 501 of the bonded structure 500 according to Example A1 was performed by plasma treatment. The surface modification of the metal member 501 of the joint structure 500 according to Example A2 was performed by corona treatment. The surface modification of the metal member 501 of the joint structure 500 according to Example A3 was performed by UV ozone treatment. The surface modification of the metal member 501 of the joint structure 500 according to Example A4 was performed by laser processing. These surface modification conditions are as described above.
　そして、図４および図５に示すように、金属部材５０１の表面の所定領域Ｒに接合用のレーザを照射する。レーザの照射条件は、上述の通りである。 Then, as shown in FIGS. 4 and 5, a predetermined region R on the surface of the metal member 501 is irradiated with a joining laser. The laser irradiation conditions are as described above.
　次に、比較例Ａによる接合構造体の作製方法について説明する。 Next, a method for producing a bonded structure according to Comparative Example A will be described.
　比較例Ａの接合構造体では、金属部材および樹脂部材の材料として実施例Ａ１～Ａ４と同じものを用いた。ここで、比較例Ａの接合構造体では、金属部材の表面改質を実施していない。また、比較例Ａの接合構造体の接合方法は、実施例Ａ１～Ａ４と同じ設定にした。 In the joined structure of Comparative Example A, the same materials as in Examples A1 to A4 were used as the metal member and the resin member. Here, in the joint structure of Comparative Example A, the surface modification of the metal member is not performed. Further, the bonding method of the bonded structure of Comparative Example A was set to the same setting as in Examples A1 to A4.
　そして、実施例Ａ１～Ａ４の接合構造体５００および比較例Ａの接合構造体についての接合評価を行った。 Then, the joining evaluation was performed on the joining structure 500 of Examples A1 to A4 and the joining structure of Comparative Example A.
　熱衝撃試験は、エスペック製の冷熱衝撃装置ＴＳＤ－１００を用いて行った。具体的には、－４０℃で３０分間の低温さらしと、８５℃で３０分間の高温さらしとを接合界面が剥離に至るまで繰り返し行った。 The thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at −40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
　本実験例の金属部材に穿孔部を形成することにより実現できる接合レベルは、熱サイクル試験をかけない場合、接合強度評価では樹脂部材の破断となる。つまり、接合強度は樹脂の破壊強度となり、表面改質効果の有無が判断できない。よって、本実験例の表面改質効果の評価方法としては、熱サイクル疲労耐性を観測することが有効となる。 The bonding level that can be realized by forming the perforated portion in the metal member of this experimental example is a breakage of the resin member in the bonding strength evaluation when the thermal cycle test is not performed. That is, the bonding strength becomes the breaking strength of the resin, and it cannot be determined whether or not there is a surface modification effect. Therefore, it is effective to observe thermal cycle fatigue resistance as a method for evaluating the surface modification effect of this experimental example.
　そして、熱サイクル環境下での信頼性を判断するために、以下の基準で合否判断を行った。すなわち、本実験例の効果を判断するため、金属部材の表面改質を実施していない検体の熱サイクル環境下での耐性（樹脂部材の破断を初期として、接合界面に部分剥離が観測され始める熱サイクル数）を基準として、基準を超えるものを合格（○）とした。熱サイクル数の確認は、０、１００、２５０、５００、７５０、１０００、１５００、および、２０００サイクルまでとした。 And in order to judge the reliability under the heat cycle environment, the pass / fail judgment was made according to the following criteria. In other words, in order to determine the effect of this experimental example, the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage) Based on the number of thermal cycles), a product exceeding the standard was regarded as acceptable (◯). The number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
　上記した表１に示すように、比較例Ａ（基準）では、熱サイクル数が２５０の場合に、接合界面に部分剥離が観測された。これに対して、実施例Ａ１では、熱サイクル数が７５０の場合に、接合界面に部分剥離が観測された。また、実施例Ａ２およびＡ３は、熱サイクル数が５００の場合に、接合界面に部分剥離が観測された。また、実施例Ａ４では、熱サイクル数が７５０の場合に、接合界面に部分剥離が観測された。 As shown in Table 1 above, in Comparative Example A (standard), when the number of thermal cycles was 250, partial peeling was observed at the bonding interface. On the other hand, in Example A1, when the number of thermal cycles was 750, partial peeling was observed at the bonding interface. In Examples A2 and A3, partial peeling was observed at the bonding interface when the number of thermal cycles was 500. In Example A4, when the number of thermal cycles was 750, partial peeling was observed at the bonding interface.
　これにより、実施例Ａ１～Ａ４の接合構造体５００では、金属部材５０１に表面改質を行うことにより、比較例Ａの接合構造体（表面改質を行わない場合）に比べて、熱サイクル疲労耐性が高くなっていた。これにより、実施例Ａ１～Ａ４の接合構造体５００のように、金属部材５０１の表面改質を行うことにより、熱応力による剥離を抑制可能であるとともに、接合性の向上が図られることが判明した。 Thereby, in the joining structures 500 of Examples A1 to A4, thermal cycle fatigue is achieved by performing surface modification on the metal member 501 as compared with the joining structure of Comparative Example A (when surface modification is not performed). Resistance was high. As a result, it was found that the surface modification of the metal member 501 as in the bonded structures 500 of Examples A1 to A4 can suppress the peeling due to thermal stress and improve the bondability. did.
　［実験例２］
　この実験例２では、本実施形態に対応する実施例Ｂ１、Ｂ２、Ｂ３およびＢ４による接合構造体５００（図５参照）と、比較例Ｂによる接合構造体とを作製し、それぞれについての接合評価を行った。その結果を表２に示す。 [Experiment 2]
In Experimental Example 2, a bonded structure 500 (see FIG. 5) according to Examples B1, B2, B3, and B4 corresponding to the present embodiment and a bonded structure according to Comparative Example B were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 2.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　次に、表２に示す実施例Ｂ１～Ｂ４による接合構造体５００の作製方法について説明する。 Next, a manufacturing method of the bonded structure 500 according to Examples B1 to B4 shown in Table 2 will be described.
　実施例Ｂ１～Ｂ４の接合構造体５００では、金属部材５０１の材料としてＳＵＳ３０４を用いた。この金属部材５０１は、図４および図５に示すように、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。金属部材５０１の所定領域Ｒにレーザを照射して穿孔部を形成した。 In the bonded structures 500 of Examples B1 to B4, SUS304 was used as the material of the metal member 501. As shown in FIGS. 4 and 5, the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
　実施例Ｂ１による接合構造体５００の金属部材５０１の表面改質は、プラズマ処理により行った。実施例Ｂ２による接合構造体５００の金属部材５０１の表面改質は、コロナ処理により行った。実施例Ｂ３による接合構造体５００の金属部材５０１の表面改質は、ＵＶオゾン処理により行った。実施例Ｂ４による接合構造体５００の金属部材５０１の表面改質は、レーザ処理により行った。これらの表面改質の条件は、上述の通りである。 The surface modification of the metal member 501 of the bonded structure 500 according to Example B1 was performed by plasma treatment. The surface modification of the metal member 501 of the bonded structure 500 according to Example B2 was performed by corona treatment. The surface modification of the metal member 501 of the bonded structure 500 according to Example B3 was performed by UV ozone treatment. The surface modification of the metal member 501 of the joint structure 500 according to Example B4 was performed by laser processing. These surface modification conditions are as described above.
　そして、金属部材５０１を射出成形金型にインサートして、樹脂部材５０２と射出成形にて接合した。成形条件は、上述の通りである。 Then, the metal member 501 was inserted into an injection mold and joined to the resin member 502 by injection molding. The molding conditions are as described above.
　次に、比較例Ｂによる接合構造体の作製方法について説明する。 Next, a method for manufacturing a bonded structure according to Comparative Example B will be described.
　比較例Ｂの接合構造体では、金属部材および樹脂部材の材料として実施例Ｂ１～Ｂ４と同じものを用いた。ここで、比較例Ｂの接合構造体では、金属部材の表面改質を実施していない。また、比較例Ｂの接合構造体の接合方法は、実施例Ｂ１～Ｂ４と同じ設定にした。 In the joint structure of Comparative Example B, the same materials as in Examples B1 to B4 were used as materials for the metal member and the resin member. Here, in the joint structure of Comparative Example B, the surface modification of the metal member is not performed. Further, the bonding method of the bonded structure of Comparative Example B was set to the same setting as in Examples B1 to B4.
　そして、実施例Ｂ１～Ｂ４の接合構造体５００および比較例Ｂの接合構造体についての接合評価を行った。 Then, the bonding evaluation was performed on the bonding structures 500 of Examples B1 to B4 and the bonding structure of Comparative Example B.
　熱衝撃試験は、エスペック製の冷熱衝撃装置ＴＳＤ－１００を用いて行った。具体的には、－４０℃で３０分間の低温さらしと、８５℃で３０分間の高温さらしとを接合界面が剥離に至るまで繰り返し行った。 The thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at −40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
　そして、熱サイクル環境下での信頼性を判断するために、以下の基準で合否判断を行った。すなわち、本実験例の効果を判断するため、金属部材の表面改質を実施していない検体の熱サイクル環境下での耐性（樹脂部材の破断を初期として、接合界面に部分剥離が観測され始める熱サイクル数）を基準として、基準を超えるものを合格（○）とした。熱サイクル数の確認は、０、１００、２５０、５００、７５０、１０００、１５００、および、２０００サイクルまでとした。 And in order to judge the reliability under the heat cycle environment, the pass / fail judgment was made according to the following criteria. In other words, in order to determine the effect of this experimental example, the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage) Based on the number of thermal cycles), a product exceeding the standard was regarded as acceptable (◯). The number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
　上記した表２に示すように、比較例Ｂ（基準）では、熱サイクル数が５００の場合に、接合界面に部分剥離が観測された。これに対して、実施例Ｂ１～Ｂ４では、熱サイクル数が１５００の場合に、接合界面に部分剥離が観測された。 As shown in Table 2 above, in Comparative Example B (standard), when the number of thermal cycles was 500, partial peeling was observed at the bonding interface. In contrast, in Examples B1 to B4, when the number of thermal cycles was 1500, partial peeling was observed at the bonding interface.
　これにより、実施例Ｂ１～Ｂ４の接合構造体５００では、金属部材５０１に表面改質を行うことにより、比較例Ｂの接合構造体（表面改質を行わない場合）に比べて、熱サイクル疲労耐性が高くなっていた。これにより、実施例Ｂ１～Ｂ４の接合構造体５００のように、金属部材５０１の表面改質を行うことにより、熱応力による剥離を抑制可能であるとともに、接合性の向上が図られることが判明した。 Thus, in the joining structures 500 of Examples B1 to B4, thermal cycle fatigue is achieved by performing surface modification on the metal member 501 compared to the joining structure of Comparative Example B (when surface modification is not performed). Resistance was high. As a result, it was found that, as in the bonding structures 500 of Examples B1 to B4, the surface modification of the metal member 501 can suppress the peeling due to thermal stress and improve the bondability. did.
　［実験例３］
　この実験例３では、本実施形態に対応する実施例Ｃ１、Ｃ２、Ｃ３およびＣ４による接合構造体５００（図５参照）と、比較例Ｃによる接合構造体とを作製し、それぞれについての接合評価を行った。その結果を表３に示す。 [Experiment 3]
In Experimental Example 3, a bonded structure 500 (see FIG. 5) according to Examples C1, C2, C3, and C4 corresponding to the present embodiment and a bonded structure according to Comparative Example C were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 3.
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
　次に、表３に示す実施例Ｃ１～Ｃ４による接合構造体５００の作製方法について説明する。 Next, a manufacturing method of the bonded structure 500 according to Examples C1 to C4 shown in Table 3 will be described.
　実施例Ｃ１～Ｃ４の接合構造体５００では、金属部材５０１の材料としてＳＵＳ３０４を用いた。この金属部材５０１は、図４および図５に示すように、板状に形成されており、長さが１００ｍｍであり、幅が２９ｍｍであり、厚みが３ｍｍである。金属部材５０１の所定領域Ｒにレーザを照射して穿孔部を形成した。 In the bonded structures 500 of Examples C1 to C4, SUS304 was used as the material of the metal member 501. As shown in FIGS. 4 and 5, the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
　実施例Ｃ１による接合構造体５００の金属部材５０１の表面改質は、プラズマ処理により行った。実施例Ｃ２による接合構造体５００の金属部材５０１の表面改質は、コロナ処理により行った。実施例Ｃ３による接合構造体５００の金属部材５０１の表面改質は、ＵＶオゾン処理により行った。実施例Ｃ４による接合構造体５００の金属部材５０１の表面改質は、レーザ処理により行った。これらの表面改質の条件は、上述の通りである。 The surface modification of the metal member 501 of the bonded structure 500 according to Example C1 was performed by plasma treatment. The surface modification of the metal member 501 of the joint structure 500 according to Example C2 was performed by corona treatment. The surface modification of the metal member 501 of the bonded structure 500 according to Example C3 was performed by UV ozone treatment. The surface modification of the metal member 501 of the bonded structure 500 according to Example C4 was performed by laser processing. These surface modification conditions are as described above.
　そして、金属部材５０１を予め加熱調整されたプレス機の下型に設置し、金属部材５０１の接合面に樹脂部材５０２の接合面を対面して設置した状態でプレスして接合した。熱プレス接合の条件は、上述の通りである。 Then, the metal member 501 was placed in a lower mold of a press machine that had been heated and adjusted in advance, and pressed and joined in a state where the joint surface of the resin member 502 was placed facing the joint surface of the metal member 501. The conditions for hot press bonding are as described above.
　次に、比較例Ｃによる接合構造体の作製方法について説明する。 Next, a method for producing a bonded structure according to Comparative Example C will be described.
　比較例Ｃの接合構造体では、金属部材および樹脂部材の材料として実施例Ｃ１～Ｃ４と同じものを用いた。ここで、比較例Ｃの接合構造体では、金属部材の表面改質を実施していない。また、比較例Ｃの接合構造体の接合方法は、実施例Ｃ１～Ｃ４と同じ設定にした。 In the joint structure of Comparative Example C, the same materials as in Examples C1 to C4 were used as materials for the metal member and the resin member. Here, in the joint structure of Comparative Example C, the surface modification of the metal member is not performed. Further, the bonding method of the bonded structure of Comparative Example C was set to the same setting as in Examples C1 to C4.
　そして、実施例Ｃ１～Ｃ４の接合構造体５００および比較例Ｃの接合構造体についての接合評価を行った。 Then, the bonding evaluation was performed on the bonding structure 500 of Examples C1 to C4 and the bonding structure of Comparative Example C.
　熱衝撃試験は、エスペック製の冷熱衝撃装置ＴＳＤ－１００を用いて行った。具体的には、－４０℃で３０分間の低温さらしと、８５℃で３０分間の高温さらしとを接合界面が剥離に至るまで繰り返し行った。 The thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at −40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
　そして、熱サイクル環境下での信頼性を判断するために、以下の基準で合否判断を行った。すなわち、本実験例の効果を判断するため、金属部材の表面改質を実施していない検体の熱サイクル環境下での耐性（樹脂部材の破断を初期として、接合界面に部分剥離が観測され始める熱サイクル数）を基準として、基準を超えるものを合格（○）とした。熱サイクル数の確認は、０、１００、２５０、５００、７５０、１０００、１５００、および、２０００サイクルまでとした。 And in order to judge the reliability under the heat cycle environment, the pass / fail judgment was made according to the following criteria. In other words, in order to determine the effect of this experimental example, the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage) Based on the number of thermal cycles), a product exceeding the standard was regarded as acceptable (◯). The number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
　上記した表３に示すように、比較例Ｃ（基準）では、熱サイクル数が２５０の場合に、接合界面に部分剥離が観測された。これに対して、実施例Ｃ１では、熱サイクル数が１０００の場合に、接合界面に部分剥離が観測された。また、実施例Ｃ２およびＣ３は、熱サイクル数が７５０の場合に、接合界面に部分剥離が観測された。また、実施例Ｃ４では、熱サイクル数が１０００の場合に、接合界面に部分剥離が観測された。 As shown in Table 3 above, in Comparative Example C (standard), when the thermal cycle number was 250, partial peeling was observed at the bonding interface. On the other hand, in Example C1, when the number of thermal cycles was 1000, partial peeling was observed at the bonding interface. In Examples C2 and C3, partial peeling was observed at the bonding interface when the number of thermal cycles was 750. In Example C4, when the number of thermal cycles was 1000, partial peeling was observed at the bonding interface.
　これにより、実施例Ｃ１～Ｃ４の接合構造体５００では、金属部材５０１に表面改質を行うことにより、比較例Ｃの接合構造体（表面改質を行わない場合）に比べて、熱サイクル疲労耐性が高くなっていた。これにより、実施例Ｃ１～Ｃ４の接合構造体５００のように、金属部材５０１の表面改質を行うことにより、熱応力による剥離を抑制可能であるとともに、接合性の向上が図られることが判明した。 As a result, in the joining structures 500 of Examples C1 to C4, thermal cycle fatigue is achieved by performing surface modification on the metal member 501 as compared with the joining structure of Comparative Example C (when surface modification is not performed). Resistance was high. As a result, it was found that, by performing the surface modification of the metal member 501 as in the bonding structures 500 of Examples C1 to C4, it is possible to suppress peeling due to thermal stress and to improve bondability. did.
　以上説明したように、本実施形態による接合構造体５００および接合構造体５００の製造方法によれば、以下に列記するような効果が得られる。すなわち、本実施形態では、上記のように、穿孔部１１が形成された金属部材１０の表面改質を行うことにより改質層（酸化膜）１０ａを形成することによって、金属部材１０と樹脂部材２０との接合工程において金属部材１０の表面１３に設けた穿孔部１１への樹脂部材２０の埋没性（充填性）が向上するので、金属部材１０と樹脂部材２０との強力なアンカー接合効果による接合性の向上を図ることができる。 As described above, according to the bonding structure 500 and the manufacturing method of the bonding structure 500 according to the present embodiment, the effects listed below can be obtained. That is, in this embodiment, as described above, the metal member 10 and the resin member are formed by forming the modified layer (oxide film) 10a by modifying the surface of the metal member 10 in which the perforated portion 11 is formed. Since the embedding property (fillability) of the resin member 20 into the perforated part 11 provided on the surface 13 of the metal member 10 is improved in the joining process with the metal member 10, the strong anchor joining effect between the metal member 10 and the resin member 20 is improved. Bondability can be improved.
　（他の実施形態）
　なお、今回開示した実施形態は、すべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、特許請求の範囲の記載に基づいて画定される。また、本発明の技術的範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 (Other embodiments)
In addition, embodiment disclosed this time is an illustration in all the points, Comprising: It does not become a basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. Further, the technical scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the claims.
　たとえば、上記実施形態では、表面改質を行う工程の一例として、プラズマ処理、コロナ処理、ＵＶオゾン処理、または、レーザ処理のいずれかを行う例を示したが、本発明はこれに限られない。本発明では、表面改質を行う工程において、上記の工程以外の工程により表面改質を行ってもよい。 For example, in the above-described embodiment, an example in which any one of the plasma treatment, the corona treatment, the UV ozone treatment, or the laser treatment is performed as an example of the surface modification process, but the present invention is not limited to this. . In the present invention, in the step of performing the surface modification, the surface modification may be performed by a step other than the above steps.
　また、上記実施形態では、表面改質を行う工程により金属部材の表面に改質層（酸化膜）を形成する例を示したが、本発明はこれに限られない。たとえば、金属部材と樹脂部材との接合において金属部材の表面に設けた穿孔部への樹脂部材の馴染み性（濡れ性）を向上させることが可能であれば、金属部材の表面に酸化膜以外の改質層を形成してもよい。 In the above embodiment, the example in which the modified layer (oxide film) is formed on the surface of the metal member by the surface modifying step is shown, but the present invention is not limited to this. For example, if it is possible to improve the familiarity (wetting property) of the resin member to the perforated portion provided on the surface of the metal member in the joining of the metal member and the resin member, the surface of the metal member other than the oxide film can be improved. A modified layer may be formed.
　また、上記実施形態では、表面改質された金属部材と樹脂部材とを接合する工程の一例として、レーザ照射、射出成形、または、熱プレスのいずれかを行う例を示したが、本発明はこれに限られない。たとえば、表面改質された金属部材と樹脂部材とを接合する工程は、上記以外の工程であってもよい。 Moreover, in the said embodiment, although the example which performs any of laser irradiation, injection molding, or hot press was shown as an example of the process of joining the surface-modified metal member and the resin member, the present invention It is not limited to this. For example, the step of bonding the surface-modified metal member and the resin member may be a step other than the above.
　また、上記実施形態では、穿孔部に突出部が形成されている例を示したが、穿孔部に突出部が形成されていなくてもよい。すなわち、穿孔部の断面形状が矩形状や三角形状などの凹形状であってもよい。また、穿孔部は、連続するように溝状に形成されていてもよい。 In the above embodiment, the example in which the projecting part is formed in the perforated part is shown, but the projecting part may not be formed in the perforated part. That is, the cross-sectional shape of the perforated part may be a concave shape such as a rectangular shape or a triangular shape. Further, the perforated part may be formed in a groove shape so as to be continuous.
　本発明は、金属部材と樹脂部材とが接合された接合構造体の製造方法および接合構造体に利用可能である。 The present invention is applicable to a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a bonded structure.
　１０　　金属部材
　１０ａ　改質層
　１１　　穿孔部
　１２　　突出部
　１３　　表面
　２０　　樹脂部材
　１００　接合構造体
　５００　接合構造体
　５０１　金属部材
　５０２　樹脂部材 DESCRIPTION OF SYMBOLS 10 Metal member 10a Modified layer 11 Perforated part 12 Projection part 13 Surface 20 Resin member 100 Joining structure 500 Joining structure 501 Metal member 502 Resin member

Claims (5)

  1. 　金属部材と樹脂部材とが接合された接合構造体の製造方法であって、
    　前記金属部材の表面に開口を有する穿孔部を形成する工程と、
    　前記穿孔部を形成した後に、前記金属部材に表面改質を行う工程と、
    　前記表面改質された金属部材と前記樹脂部材とを接合する工程とを備えることを特徴とする接合構造体の製造方法。     A method for manufacturing a joined structure in which a metal member and a resin member are joined,
    Forming a perforated portion having an opening on the surface of the metal member;
    After forming the perforated part, performing a surface modification on the metal member;
    A method for manufacturing a bonded structure comprising the step of bonding the surface-modified metal member and the resin member.
  2. 　請求項１に記載の接合構造体の製造方法において、
    　前記金属部材に表面改質を行う工程は、プラズマ処理、コロナ処理、ＵＶオゾン処理、または、レーザ処理のいずれかにより、前記金属部材の表面に酸化膜を形成する工程であることを特徴とする接合構造体の製造方法。     In the manufacturing method of the joined structure according to claim 1,
    The step of modifying the surface of the metal member is a step of forming an oxide film on the surface of the metal member by any of plasma treatment, corona treatment, UV ozone treatment, or laser treatment. A method for manufacturing a bonded structure.
  3. 　請求項１または２に記載の接合構造体の製造方法において、
    　前記表面改質された金属部材と前記樹脂部材とを接合する工程は、レーザ照射、射出成形、または、熱プレスのいずれかの工程であることを特徴とする接合構造体の製造方法。     In the manufacturing method of the junction structure according to claim 1 or 2,
    The method for manufacturing a bonded structure, wherein the step of bonding the surface-modified metal member and the resin member is any one of laser irradiation, injection molding, and hot pressing.
  4. 　請求項１～３のいずれか１つに記載の接合構造体の製造方法において、
    　前記穿孔部を形成する工程は、１パルスが複数のサブパルスで構成されるレーザを照射することにより前記穿孔部を形成する工程であることを特徴とする接合構造体の製造方法。     In the method for manufacturing a bonded structure according to any one of claims 1 to 3,
    The step of forming the perforated portion is a step of forming the perforated portion by irradiating a laser in which one pulse is composed of a plurality of subpulses.
  5. 　請求項１～４のいずれか１つに記載の接合構造体の製造方法によって製造されたことを特徴とする接合構造体。
          A bonded structure manufactured by the method for manufacturing a bonded structure according to any one of claims 1 to 4.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019058949A (en) * 2018-06-05 2019-04-18 住友理工株式会社 Manufacturing method of composite member
US11178781B2 (en) * 2017-09-08 2021-11-16 Apple Inc. Etching for bonding polymer material to a metal surface

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6441295B2 (en) * 2016-12-26 2018-12-19 本田技研工業株式会社 Junction structure and manufacturing method thereof
JP6961159B2 (en) * 2017-02-09 2021-11-05 睦月電機株式会社 Joining method of metal member and synthetic resin molded member and its joining body
FR3063965B1 (en) * 2017-03-14 2023-07-14 Dorel France Sa FOLDING CAR WITH SLIDING TROLLEYS
CN109890589A (en) * 2017-09-26 2019-06-14 住友理工株式会社 The manufacturing method of composite component
KR102090531B1 (en) * 2017-12-22 2020-03-19 주식회사 포스코 Method for producing plastic-metal composite material using vacuum plasma
JP2019117061A (en) * 2017-12-26 2019-07-18 ファナック株式会社 Rotary encoder and manufacturing method of rotary encoder
DE102019103130A1 (en) * 2019-02-08 2020-08-13 Bayerische Motoren Werke Aktiengesellschaft Method for creating a functional structure and component

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274279A (en) * 2009-05-27 2010-12-09 Nagoya Industrial Science Research Inst Method for joining member using laser
JP2012056308A (en) * 2010-08-11 2012-03-22 Hitachi Ltd Laser bonding method
JP2012223889A (en) * 2011-04-15 2012-11-15 Hitachi Ltd Method for laser bonding
JP2013107325A (en) * 2011-11-22 2013-06-06 Fujimori Kogyo Co Ltd Method of joining metal and polyolefin resin and laminate
JP2013216028A (en) * 2012-04-11 2013-10-24 Hitachi Ltd Laser bonding method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009226643A (en) * 2008-03-19 2009-10-08 Aisin Seiki Co Ltd Bonding method and bonded body
JP2009302209A (en) * 2008-06-11 2009-12-24 Nec Electronics Corp Lead frame, semiconductor device, manufacturing method of lead frame, and manufacturing method of semiconductor device
JP4626687B2 (en) * 2008-08-19 2011-02-09 トヨタ自動車株式会社 Bonding method between resin and metal
JP4527196B2 (en) * 2009-12-24 2010-08-18 東ソー株式会社 Composite and production method thereof
JP5108904B2 (en) * 2010-02-01 2012-12-26 大成プラス株式会社 Composite of metal and polyamide resin composition and method for producing the same
JP2013058739A (en) * 2011-08-17 2013-03-28 Dainippon Printing Co Ltd Optical semiconductor device lead frame, optical semiconductor device lead frame with resin, optical semiconductor device, and optical semiconductor device lead frame manufacturing method
JP2013111881A (en) * 2011-11-29 2013-06-10 Polyplastics Co Method of manufacturing metal component, and composite molding

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274279A (en) * 2009-05-27 2010-12-09 Nagoya Industrial Science Research Inst Method for joining member using laser
JP2012056308A (en) * 2010-08-11 2012-03-22 Hitachi Ltd Laser bonding method
JP2012223889A (en) * 2011-04-15 2012-11-15 Hitachi Ltd Method for laser bonding
JP2013107325A (en) * 2011-11-22 2013-06-06 Fujimori Kogyo Co Ltd Method of joining metal and polyolefin resin and laminate
JP2013216028A (en) * 2012-04-11 2013-10-24 Hitachi Ltd Laser bonding method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11178781B2 (en) * 2017-09-08 2021-11-16 Apple Inc. Etching for bonding polymer material to a metal surface
US11547005B2 (en) * 2017-09-08 2023-01-03 Apple Inc. Etching for bonding polymer material to anodized metal
JP2019058949A (en) * 2018-06-05 2019-04-18 住友理工株式会社 Manufacturing method of composite member

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