WO2016105071A1 - Laminate for bonding sheet and multilayer flexible printed circuit board including same - Google Patents

Laminate for bonding sheet and multilayer flexible printed circuit board including same Download PDF

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Publication number
WO2016105071A1
WO2016105071A1 PCT/KR2015/014075 KR2015014075W WO2016105071A1 WO 2016105071 A1 WO2016105071 A1 WO 2016105071A1 KR 2015014075 W KR2015014075 W KR 2015014075W WO 2016105071 A1 WO2016105071 A1 WO 2016105071A1
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WIPO (PCT)
Prior art keywords
layer
printed circuit
circuit board
epoxy resin
resin composition
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PCT/KR2015/014075
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French (fr)
Korean (ko)
Inventor
김형완
박광석
정인기
정대현
김승윤
Original Assignee
주식회사 두산
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Priority to CN201580066414.7A priority Critical patent/CN107000418B/en
Publication of WO2016105071A1 publication Critical patent/WO2016105071A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the present invention relates to a laminate for a bonding sheet that performs a coverlay function as well as a bonding sheet function, and a multilayer flexible printed circuit board including the same.
  • Printed circuit boards may be divided into rigid printed circuit boards, flexible printed circuit boards, and rigid-flex printed circuit boards having a combination of the two according to their physical characteristics.
  • the flexible printed circuit board has a multi-layered structure in which a double-sided printed circuit board and a double-sided printed circuit board are coupled to each other or a double-sided printed circuit board and a single-sided printed circuit board are coupled to each other as the integration of a circuit is required. That is, the multilayer flexible printed circuit board has a cross section formed of a circuit layer 14 and an insulating layer 15 above and below a double-sided printed circuit board including the circuit layer 11 and the insulating layer 12 as shown in FIG. 1. Each of the printed circuit boards has a structure in which a bonding sheet 16 is coupled, and in this case, the double-sided printed circuit board includes a coverlay 13 that protects the circuit layer 11.
  • the circuit is integrated by the multi-layer flexible printed circuit board, the thinning of the multi-layer flexible printed circuit board due to the use of the bonding sheet 16 and the presence of the plurality of coverlays 13 for bonding the printed circuit boards together. There was a limit to satisfying.
  • prepreg is mainly used as the bonding sheet 16. Since the prepreg includes a fiber substrate, there is also a problem of lowering the hole workability of the printed circuit board.
  • An object of the present invention is to provide a laminate for bonding sheets having a bonding sheet function and also having a coverlay function in order to solve the above problems.
  • Another object of the present invention is to provide a multilayer flexible printed circuit board comprising the laminate for bonding sheets.
  • the present invention is a substrate layer; A first resin layer laminated on one surface of the substrate layer and formed of a first resin composition; It is laminated
  • the present invention also provides a printed circuit board including an insulating layer, a first circuit layer coupled to an upper surface of the insulating layer, and a second circuit layer coupled to a lower surface of the insulating layer; A second printed circuit board disposed on the first circuit layer; And a third printed circuit board disposed on the second circuit layer, wherein the laminate for the bonding sheet is provided between the first circuit layer and the second printed circuit board, wherein the second circuit layer and the second circuit board are provided.
  • the present invention also provides a multilayer flexible printed circuit board having a laminate for bonding sheets between the printed circuit boards.
  • the laminate for bonding sheets of the present invention includes the adhesive first and second resin layers, a plurality of printed circuit boards may be bonded in place of conventional prepregs.
  • the first and second resin layers may also perform a coverlay function, a coverlay for protecting a circuit layer of a printed circuit board is not separately required. Accordingly, the present invention can provide a multi-layer flexible printed circuit board with a minimized thickness.
  • FIG. 1 is a cross-sectional view illustrating a conventional multilayer flexible printed circuit board.
  • FIG. 2 is a cross-sectional view showing a laminate for bonding sheets according to an example of the present invention.
  • the present invention relates to a laminate for bonding sheets (hereinafter, referred to as a "laminated body") that combines a plurality of printed circuit boards and has a coverlay function.
  • laminated body a laminate for bonding sheets
  • coverlay function a coverlay function
  • the laminate of the present invention includes a first resin layer 21 and a second resin layer 23 on both sides of the base layer 21.
  • the base material layer 21 contained in the laminated body of this invention serves to support a laminated body.
  • the material constituting the base layer 21 is not particularly limited, but non-limiting examples include polyimide (PI), polyethylene terephthalate (PET), polyethylene (PE), and the like, and polyimide (PI). It is preferable that it is made.
  • the thickness of the base layer 21 is not particularly limited, but considering the slimming of the multilayer flexible printed circuit board, the thickness is preferably 5 to 25 ⁇ m, more preferably 5 to 12 ⁇ m.
  • the 1st resin layer 22 contained in the laminated body of this invention is a layer laminated
  • the second resin layer 23 included in the laminate of the present invention is a layer laminated on the other surface of the base layer 21, and the second resin layer 23 also has adhesiveness as it is formed of the second resin composition. .
  • the 1st resin composition and 2nd resin composition for forming the 1st resin layer 22 and the 2nd resin layer 23 are not specifically limited here, It is preferable that it is an epoxy resin composition.
  • the first resin layer 22 and the second resin layer 23 include a first epoxy resin, a second epoxy resin, a rubber modified epoxy resin and a curing agent, and the first epoxy resin and the second epoxy resin One or more of them may be each formed of an epoxy resin composition having a polydispersity index (PDI) of 2 or less.
  • PDI polydispersity index
  • the first epoxy resin contained in the epoxy resin composition is an epoxy resin containing two or more epoxy groups in a molecule, and an epoxy equivalent (EEW) is a high equivalent epoxy resin in the range of 400 to 1,000 g / eq.
  • EW epoxy equivalent
  • Mw weight average molecular weight
  • the second epoxy resin contained in the epoxy resin composition is an epoxy resin containing two or more epoxy groups in the molecule, and the epoxy equivalent (EEW) is a low equivalent epoxy resin having a range of 100 to 300 g / eq.
  • the weight average molecular weight (Mw) of this 2nd epoxy resin is not specifically limited, It is preferable that it is the range of 500-2,000.
  • Epoxy equivalent weight (EEW) epoxy resins have a low melt viscosity and good wettability for adhesion, and high equivalent epoxy resins (EEW) have plasticity in themselves, so that the laminate can bend (bending) and punchability. Molding properties such as the like can be improved. Therefore, the laminate of the present invention has a high degree according to the first resin layer 22 and the second resin layer 23 formed of an epoxy resin composition containing two kinds of epoxy resins having a polymerization degree (n) or an equivalent difference. Adhesiveness, excellent moisture resistance reliability, excellent moldability and the like.
  • the first epoxy resin and the second epoxy resin has a polydispersity index (PDI) of 2.0 or less (preferably between 1 and 1.7, more preferably between 1.1 and 1.5).
  • narrow dispersity) epoxy resin the narrow molecular weight ND epoxy resin contains relatively high molecular weight polymers (eg, High Mw species) and low molecular weight polymers (eg, Oligomers), and has a uniform molecular weight distribution. Since the ND epoxy resin having a uniform molecular weight distribution has less side reaction and has a higher degree of curing than a general epoxy resin, when the resin layer is formed of an epoxy resin composition containing such ND epoxy resin, the free volume is minimized.
  • PDI polydispersity index
  • the polydispersity index (PDI) is a criterion (scale) indicating the width (width) of the molecular weight distribution of the polymer, it is defined as the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn). Specifically, the larger the polydispersity index (PDI), the wider the molecular weight distribution. The closer to 1, the closer the polymer is to a single molecular weight polymer having good physical properties.
  • the present invention lowers the viscosity of the epoxy resin composition by using a narrow dispersity (ND) epoxy resin, either one of the first epoxy resin or the second epoxy resin, or both have a polydispersity index of 2.0 or less, which eventually leads to epoxy
  • ND narrow dispersity
  • the mixing ratio thereof is not particularly limited, but considering the curability, processability, and adhesiveness, the first epoxy resin and the second epoxy resin are 10 It is preferable to mix in the weight ratio of 50-50: 50, and it is more preferable to mix in the weight ratio of 30-50: 50-70.
  • the first epoxy resin and the second epoxy resin is not particularly limited as long as it is an epoxy resin having the equivalent range, bisphenol A epoxy resin, bisphenol F-type epoxy resin, cresol novolac-type epoxy resin, And dicyclopentadiene type epoxy resins, trisphenylmethane type epoxy resins, naphthalene type epoxy resins, biphenyl type epoxy resins and hydrogenated epoxy resins.
  • the rubber-modified epoxy resin included in the epoxy resin composition serves to increase the adhesion, heat resistance and insulation of the epoxy resin composition.
  • Such rubber modified epoxy resins are not particularly limited, but non-limiting examples include acrylonitrile-butadiene rubber (NBR), carboxy-terminated butadiene-acrylonitrile (CTBN) rubber, epoxy-terminated butadiene-acrylonitrile (ETBN) rubber and amines Terminal butadiene-acrylonitrile (ATBN) rubber and the like.
  • the content of the rubber-modified epoxy resin included in the epoxy resin composition is not particularly limited, but considering the curability, processability and adhesiveness, rubber modification based on a total of 100 parts by weight of the first epoxy resin, the second epoxy resin and the curing agent
  • the epoxy resin is preferably included in 5 to 50 parts by weight, more preferably 10 to 40 parts by weight.
  • the curing agent included in the epoxy resin composition serves to cause a curing reaction of the epoxy resin composition.
  • a curing agent is not particularly limited as long as it is a material known in the art, but two or more curing agents are used, at least one of which has a polydispersity index (PDI) of 2.0 or less (preferably 1 to 1.7, and more).
  • PDI polydispersity index
  • ND narrow dispersity hardener which is 1.1-1.5).
  • non-limiting examples of the first curing agent when used by mixing the first curing agent and the second curing agent as a curing agent phenol novolak-based curing agent, imidazole-based curing agent, amine-based curing agent and the like
  • the second curing agent Non-limiting examples of the cresol novolak-based curing agent, bisphenol A novolak-based curing agent, naphthalene-based curing agent, amine-based curing agent, aminotriazine novolak-based curing agent, and the like, any one of the first and second curing agents
  • the polydispersity index (PDI) of 2 is preferably 2 or less, or the polydispersity index (PDI) of both the first curing agent and the second curing agent is preferably 2 or less.
  • the content of the curing agent included in the epoxy resin composition is not particularly limited, but in order to prevent the deterioration of molding characteristics such as bending property and punch workability due to the hardening of the insulating layer in consideration of curing properties, heat resistance and adhesiveness, etc.
  • an epoxy resin (first epoxy resin + second epoxy resin) are preferably mixed in a weight ratio of 20 to 50:50 to 80.
  • the epoxy resin composition of the present invention may further include an inorganic filler in order to increase the viscosity and the thermal conductivity.
  • the inorganic filler is not particularly limited as long as it is a material known in the art, but non-limiting examples include silicon oxide, aluminum oxide, zinc oxide, aluminum nitride, silicon nitride, boron nitride, silica, talc, calcium carbonate and magnesium carbonate. have.
  • the content of the inorganic filler included in the epoxy resin composition is not particularly limited, but considering the viscosity, thermal conductivity and processability, the inorganic filler is 5 to 5 based on 100 parts by weight of the total of the first epoxy resin, the second epoxy resin and the curing agent. It is preferably included in 90 parts by weight, more preferably included in 10 to 40 parts by weight.
  • the epoxy resin composition of the present invention may further include a curing accelerator to increase the curing reaction rate.
  • the curing accelerator is not particularly limited as long as it is a material known in the art, but non-limiting examples include tertiary amines such as benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri (dimethylaminomethyl) phenol, and the like; Imidazole series such as 2-methylimidazole and 2-phenylimidazole; Organic phosphine series such as triphenylphosphine, diphenylphosphine and phenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate.
  • the content of the curing accelerator included in the epoxy resin composition is not particularly limited, but considering the curing property, the curing accelerator is included in an amount of 0.001 to 0.5 parts by weight based on a total of 100 parts by weight of the first epoxy resin, the second epoxy resin and the curing agent. It is desirable to be.
  • the epoxy resin composition of the present invention is a flame retardant within a range that does not impair the inherent physical properties of the epoxy resin composition; Thermosetting resins or thermoplastic resins and oligomers thereof not mentioned above; An epoxy resin different from the first epoxy resin and the second epoxy resin; Additives such as ultraviolet absorbers, antioxidants, polymerization initiators, dyes, pigments, dispersants, thickeners and leveling agents may be further included.
  • the epoxy resin composition includes a first epoxy resin, which is an ND epoxy resin, and / or a second epoxy resin, so that the ionic content such as K + , NH 4+ Na + , Cl ⁇ is low, and thus high purity is shown.
  • the resin layer 22 and the second resin layer 23 each exhibit very low water absorption.
  • the first resin layer 22 and the second resin layer 23 of the present invention each have an ion content of 10 to 500 ppm and a water absorption of 0.01 to 0.4%.
  • the conductivity is achieved through the first resin layer 22 and / or the second resin layer 23.
  • ions e.g., Cu 2 +
  • migration this is minimized, which results when performing a laminate coverlay feature of the present invention, the first resin layer 22 and / or the second resin layer 23 of the It is possible to provide a multilayer flexible printed circuit board having high reliability by minimizing the movement of conductive ions to the circuit layer of the printed circuit board which is combined with.
  • a multilayer flexible printed circuit board is manufactured by coupling a plurality of printed circuit boards to each other.
  • a bonding sheet or a coverlay that protects the circuit layer may be bonded between the first printed circuit board and the second printed circuit board.
  • migration resistance is also required to prevent the migration of conductive ions present in the circuit layer. This is because when the conductive ions in the circuit layer move freely, short circuits occur and reliability of the first printed circuit board, the second printed circuit board, or the multilayer flexible printed circuit board including the same decreases.
  • the laminate of the present invention can obtain high adhesiveness by applying the first resin layer 22 and the second resin layer 23 having a low water absorption of 0.01 to 0.4% as the adhesive layer.
  • the ionic content of the first resin layer 22 and the second resin layer 23 is 10 to 500 ppm, the mobility of the conductive ions is also minimized, thereby obtaining excellent migration resistance.
  • the present invention has a low dielectric constant as other resin compositions other than the epoxy resin composition are applied to the first resin composition and the second resin composition for forming the first resin layer 22 and the second resin layer 23. It is also possible to provide a laminate having excellent heat dissipation.
  • each of the first resin layer 22 and the second resin layer 23 is not particularly limited, but in consideration of slimming of the adhesive and multilayer flexible printed circuit board, the thickness of each of the first resin layer 22 and the second resin layer 23 is preferably 10 to 25 ⁇ m.
  • the laminate of the present invention may further include a release layer for protecting the first resin layer 22 and the second resin layer 23, respectively.
  • the material constituting the release layer is not particularly limited, and may include polyester, polyethylene terephthalate, polyethylene, polypropylene, polyester, or silicone.
  • the overall thickness of the laminate of the present invention is not particularly limited, but considering the slimming of the multilayer flexible printed circuit board, the thickness is preferably 25 to 62 ⁇ m.
  • the present invention provides a multilayer flexible printed circuit board that does not include a coverlay by including the laminate.
  • the multilayer flexible printed circuit board of the present invention includes a first printed circuit board, a second printed circuit board, and a third printed circuit board, and the laminate is disposed between the first printed circuit board and the second printed circuit board.
  • the laminate is provided between the first printed circuit board and the third printed circuit board.
  • the first printed circuit board included in the multilayer flexible printed circuit board of the present invention includes an insulating layer, a first circuit layer coupled to an upper surface of the insulating layer, and a second circuit layer coupled to a lower surface of the insulating layer.
  • the material constituting the insulating layer and the first and second circuit layers included in the first printed circuit board is not particularly limited as long as it is a material known in the art.
  • the second printed circuit board included in the multilayer flexible printed circuit board of the present invention is disposed on the first circuit layer of the first printed circuit board.
  • the second printed circuit board may be a single-sided printed circuit board having a circuit layer provided on one surface of the insulating layer, or may be a double-sided printed circuit board having circuit layers provided on both sides of the insulating layer like the first printed circuit board.
  • the third printed circuit board included in the multilayer flexible printed circuit board of the present invention is disposed on the second circuit layer of the first printed circuit board.
  • the third printed circuit board may also be a single-sided printed circuit board provided with a circuit layer on one surface of the insulating layer, or may be a double-sided printed circuit board provided with circuit layers on both sides of the insulating layer like the first printed circuit board.
  • the laminate is provided between the first circuit layer and the second printed circuit board of the first printed circuit board so that the first printed circuit board and the second printed circuit board are coupled to each other.
  • the laminate is provided between the second circuit layer and the third printed circuit board of the printed circuit board to couple the first printed circuit board and the third printed circuit board, wherein the first resin layer included in the laminate, or
  • the second resin layer performs a bonding sheet (adhesive layer) function and also a coverlay function. Therefore, the multilayer flexible printed circuit board of the present invention does not require a coverlay for protecting the first circuit layer and the second circuit layer of the first printed circuit board separately, so the present invention provides a slim multilayer flexible printed circuit board. Can provide.
  • each component was mixed according to the composition of Table 1 below to prepare an epoxy resin composition.
  • the content unit in Table 1 is parts by weight
  • the standard is a content of the remaining components relative to the total amount of the first epoxy resin, the second epoxy resin and the curing agent to 100 parts by weight.
  • the epoxy resin composition was prepared in the same manner as in Preparation Example 1, except that the epoxy resin composition was prepared by mixing the components according to the composition of Table 2 below.
  • Comparative Preparation Example 1 Comparative Preparation Example 2 1) Epoxy Resin 1 35 35 2) First side epoxy resin (ND epoxy) - - 3) epoxy resin 2 35 35 4) Second side epoxy resin (ND epoxy) - - 5) Hardener 1 side 30 30 6) First side hardener (ND hardener) - - 7) Rubber modified epoxy resin 1 30 - 8) Rubber modified epoxy resin 2 - 30 9) weapon filler 10 10 10) Curing accelerator 0.006 0.006 1) Kukdo Chemical, YD-1282) PDI: 1.57 / EEW: 600g / eq epoxy resin 3) Kukdo Chemical, YDCN-6004) PDI: 1.26 / EEW: 6190g / eq epoxy resin 5) Kukdo Chemical, KPN-21106) PDI : 1.40 / EEW 106.8g / eq Hardener 7) NBR Rubber (XER-32) 8) NBR Rubber (1072J) 9) Aluminum (ATH
  • the epoxy resin composition prepared in Preparation Examples 1 to 6 was applied to one surface and the other surface of the substrate layer made of 12 ⁇ m-thick polyimide (PI), and dried at 160 ° C. for 3 minutes to form a first water having a thickness of 20 ⁇ m.
  • the laminated body (former thickness 52 micrometers) in which a base layer and the 2nd resin layer were formed respectively was produced.
  • the epoxy resin composition prepared in Preparation Example 1 was applied to one surface and the other surface of the substrate layer made of polyimide (PI) having a thickness of 5 ⁇ m, respectively, and dried at 160 ° C. for 3 minutes to form a first resin layer having a thickness of 10 ⁇ m.
  • the laminated body (preferred thickness 25micrometer) in which the 2nd resin layer was formed respectively was produced.
  • Coating property The degree to which the 1st resin layer and the 2nd resin layer were coated on the base material layer was visually evaluated (( ⁇ : very good / (circle): good / (triangle
  • Ion-migration Test The degree of Ion transition of the first resin layer and the second resin layer was evaluated under the conditions of Pattern (Line / Space) 75/75 ⁇ m, temperature 85 ° C., humidity 85% RH, DC 100V.
  • Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 Coating ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Adhesiveness (@ 1 / 2Oz-kgf / cm) 1.4 1.3 1.2 1.2 1.27 1.35 1.1 0.9 0.8 Heat resistance (S / D @ 288) > 10min > 10min > 10min > 10min > 10min 8min > 10min > 10min 5min Absorption rate (D-2 / 100) 0.2 0.15 0.2 0.25 0.25 0.18 0.2 0.41 0.5 Ion Content (ppm) 250 200 300 320 300 410 250 980 1200 Ion-migration Test (85 °C 85% RH DC100V, L / S 75/75) > 1000h > 1000h > 1000h 800h 800h 800h > 1000h 300h 200h
  • the laminate according to the present invention has excellent physical properties.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a laminate for a bonding sheet and a multilayer flexible printed circuit board including the laminate for the bonding sheet.

Description

본딩 시트용 적층체 및 이를 포함하는 다층 연성 인쇄회로기판Bonding sheet laminate and multilayer flexible printed circuit board comprising the same
본 발명은 본딩 시트 기능과 함께 커버레이 기능도 수행하는 본딩 시트용 적층체 및 이를 포함하는 다층 연성 인쇄회로기판에 관한 것이다.The present invention relates to a laminate for a bonding sheet that performs a coverlay function as well as a bonding sheet function, and a multilayer flexible printed circuit board including the same.
최근 노트북, 휴대폰과 같은 전자기기의 소형화 및 슬림화가 강조되면서 전자기기에 포함되는 인쇄회로기판의 집적화 및 경박화가 요구되고 있다. 인쇄회로기판은 그 물리적 특성에 따라 리지드(rigid) 인쇄회로기판, 연성(flexible) 인쇄회로기판, 이 두 가지가 결합된 리지드-연성 인쇄회로기판 등으로 나눌 수 있다.Recently, as miniaturization and slimming of electronic devices such as notebooks and mobile phones are emphasized, integration and lightening of printed circuit boards included in electronic devices are required. Printed circuit boards may be divided into rigid printed circuit boards, flexible printed circuit boards, and rigid-flex printed circuit boards having a combination of the two according to their physical characteristics.
상기 연성 인쇄회로기판은 회로의 집적화가 요구됨에 따라 양면 인쇄회로기판과 양면 인쇄회로기판이 서로 결합되거나, 양면 인쇄회로기판과 단면 인쇄회로기판이 서로 결합된 다층 구조로 이루어진다. 즉, 다층 연성 인쇄회로기판은 도 1에 도시된 바와 같이 회로층(11)과 절연층(12)을 포함하는 양면 인쇄회로기판의 상하에 회로층(14) 및 절연층(15)으로 이루어진 단면 인쇄회로기판 각각이 본딩 시트(16)로 결합된 구조를 가지며, 이때, 양면 인쇄회로기판에는 회로층(11)을 보호하는 커버레이(13)가 포함되어 있다.The flexible printed circuit board has a multi-layered structure in which a double-sided printed circuit board and a double-sided printed circuit board are coupled to each other or a double-sided printed circuit board and a single-sided printed circuit board are coupled to each other as the integration of a circuit is required. That is, the multilayer flexible printed circuit board has a cross section formed of a circuit layer 14 and an insulating layer 15 above and below a double-sided printed circuit board including the circuit layer 11 and the insulating layer 12 as shown in FIG. 1. Each of the printed circuit boards has a structure in which a bonding sheet 16 is coupled, and in this case, the double-sided printed circuit board includes a coverlay 13 that protects the circuit layer 11.
이와 같은 다층 연성 인쇄회로기판에 의해 회로의 집적화가 이루어졌지만 인쇄회로기판을 서로 결합시키기 위한 본딩 시트(16)의 사용 및 복수의 커버레이(13)의 존재로 인해 다층 연성 인쇄회로기판의 경박화를 만족시키는 데는 한계가 있었다.Although the circuit is integrated by the multi-layer flexible printed circuit board, the thinning of the multi-layer flexible printed circuit board due to the use of the bonding sheet 16 and the presence of the plurality of coverlays 13 for bonding the printed circuit boards together. There was a limit to satisfying.
또한, 본딩 시트(16)로는 프리프레그가 주로 사용되는데, 이러한 프리프레그는 섬유 기재를 포함하기 때문에 인쇄회로기판의 홀 가공성을 저하시키는 문제점도 있었다.In addition, prepreg is mainly used as the bonding sheet 16. Since the prepreg includes a fiber substrate, there is also a problem of lowering the hole workability of the printed circuit board.
본 발명은 상기한 문제점을 해결하기 위해 본딩 시트 기능을 가짐과 동시에 커버레이 기능도 가지고 있는 본딩 시트용 적층체를 제공하는 것을 목적으로 한다.An object of the present invention is to provide a laminate for bonding sheets having a bonding sheet function and also having a coverlay function in order to solve the above problems.
또한, 본 발명은 상기 본딩 시트용 적층체를 포함하는 다층 연성 인쇄회로기판을 제공하는 것도 목적으로 한다.In addition, another object of the present invention is to provide a multilayer flexible printed circuit board comprising the laminate for bonding sheets.
상기한 목적을 달성하기 위해, 본 발명은 기재층; 상기 기재층의 일면에 적층되며, 제1 수지 조성물로 형성된 제1 수지층; 상기 기재층의 타면에 적층되며, 제2 수지 조성물로 형성된 제2 수지층을 포함하고, 상기 제1 수지층과 상기 제2 수지층은 접착성을 가지는 본딩 시트용 적층체를 제공한다.In order to achieve the above object, the present invention is a substrate layer; A first resin layer laminated on one surface of the substrate layer and formed of a first resin composition; It is laminated | stacked on the other surface of the said base material layer, and includes the 2nd resin layer formed from the 2nd resin composition, The said 1st resin layer and the said 2nd resin layer provide the bonding sheet laminated body which has adhesiveness.
또한 본 발명은 절연층, 상기 절연층의 상면에 결합된 제1 회로층 및 상기 절연층의 하면에 결합된 제2 회로층을 포함하는 제1 인쇄회로기판; 상기 제1 회로층 상에 배치되는 제2 인쇄회로기판; 및 상기 제2 회로층 상에 배치되는 제3 인쇄회로기판을 포함하고, 상기 제1 회로층과 상기 제2 인쇄회로기판 사이에 상기 본딩 시트용 적층체가 구비되며, 상기 제2 회로층과 상기 제3 인쇄회로기판 사이에도 상기 본딩 시트용 적층체가 구비된 다층 연성 인쇄회로기판을 제공한다.The present invention also provides a printed circuit board including an insulating layer, a first circuit layer coupled to an upper surface of the insulating layer, and a second circuit layer coupled to a lower surface of the insulating layer; A second printed circuit board disposed on the first circuit layer; And a third printed circuit board disposed on the second circuit layer, wherein the laminate for the bonding sheet is provided between the first circuit layer and the second printed circuit board, wherein the second circuit layer and the second circuit board are provided. The present invention also provides a multilayer flexible printed circuit board having a laminate for bonding sheets between the printed circuit boards.
본 발명의 본딩 시트용 적층체는 접착성을 가지는 제1 및 제2 수지층을 포함하기 때문에 종래의 프리프레그(prepreg)를 대체하여 복수의 인쇄회로기판을 결합시킬 수 있다. 또한 상기 제1 및 제2 수지층이 커버레이 기능도 수행할 수 있기 때문에 인쇄회로기판의 회로층을 보호하기 위한 커버레이가 별도로 요구되지 않는다. 따라서 본 발명은 두께가 최소화된 다층 연성 인쇄회로기판을 제공할 수 있다.Since the laminate for bonding sheets of the present invention includes the adhesive first and second resin layers, a plurality of printed circuit boards may be bonded in place of conventional prepregs. In addition, since the first and second resin layers may also perform a coverlay function, a coverlay for protecting a circuit layer of a printed circuit board is not separately required. Accordingly, the present invention can provide a multi-layer flexible printed circuit board with a minimized thickness.
도 1은 종래의 다층 연성 인쇄회로기판을 도시한 단면도이다.1 is a cross-sectional view illustrating a conventional multilayer flexible printed circuit board.
도 2는 본 발명의 일례에 따른 본딩 시트용 적층체를 도시한 단면도이다.2 is a cross-sectional view showing a laminate for bonding sheets according to an example of the present invention.
이하, 본 발명을 설명한다.Hereinafter, the present invention will be described.
1. One. 본딩Bonding 시트용  For sheet 적층체Laminate
본 발명은 복수의 인쇄회로기판을 서로 결합시킴과 동시에 커버레이 기능도 가지고 있는 본딩 시트용 적층체(이하, '적층체'라 함)에 관한 것으로, 도 2를 참조하여 구체적으로 설명하면 다음과 같다.The present invention relates to a laminate for bonding sheets (hereinafter, referred to as a "laminated body") that combines a plurality of printed circuit boards and has a coverlay function. Hereinafter, the present invention will be described in detail with reference to FIG. same.
본 발명의 적층체는 기재층(21)을 중심으로, 그 양 측에 제1 수지층(21) 및 제2 수지층(23)을 포함한다.The laminate of the present invention includes a first resin layer 21 and a second resin layer 23 on both sides of the base layer 21.
본 발명의 적층체에 포함되는 기재층(21)은 적층체를 지지하는 역할을 한다. 이러한 기재층(21)을 이루는 물질은 특별히 한정되지 않으나, 비제한적인 예로 폴리이미드(PI), 폴리에틸렌테레프탈레이트(PET), 폴리에틸렌(PE) 등을 들 수 있으며, 그 중에서도 폴리이미드(PI)로 이루어진 것이 바람직하다. 또한 기재층(21)의 두께도 특별히 한정되지 않으나, 다층 연성 인쇄회로기판의 슬림화를 고려할 때, 5 내지 25㎛인 것이 바람직하고, 5 내지 12㎛인 것이 더욱 바람직하다.The base material layer 21 contained in the laminated body of this invention serves to support a laminated body. The material constituting the base layer 21 is not particularly limited, but non-limiting examples include polyimide (PI), polyethylene terephthalate (PET), polyethylene (PE), and the like, and polyimide (PI). It is preferable that it is made. In addition, the thickness of the base layer 21 is not particularly limited, but considering the slimming of the multilayer flexible printed circuit board, the thickness is preferably 5 to 25 µm, more preferably 5 to 12 µm.
본 발명의 적층체에 포함되는 제1 수지층(22)은 기재층(21)의 일면에 적층되는 층으로, 제1 수지 조성물로 형성됨에 따라 접착성을 가진다. 또한 본 발명의 적층체에 포함되는 제2 수지층(23)은 기재층(21)의 타면에 적층되는 층으로, 제2 수지 조성물로 형성됨에 따라 제2 수지층(23)도 접착성을 가진다. The 1st resin layer 22 contained in the laminated body of this invention is a layer laminated | stacked on one surface of the base material layer 21, and has adhesiveness as it is formed from a 1st resin composition. In addition, the second resin layer 23 included in the laminate of the present invention is a layer laminated on the other surface of the base layer 21, and the second resin layer 23 also has adhesiveness as it is formed of the second resin composition. .
여기서 제1 수지층(22)과 제2 수지층(23)을 형성하기 위한 제1 수지 조성물 및 제2 수지 조성물은 특별히 한정되지 않으나, 에폭시 수지 조성물인 것이 바람직하다. 구체적으로, 제1 수지층(22)과 제2 수지층(23)은 제1 에폭시 수지, 제2 에폭시 수지, 고무 변성 에폭시 수지 및 경화제를 포함하며, 상기 제1 에폭시 수지와 상기 제2 에폭시 수지 중 1종 이상은 다분산지수(PDI)가 2 이하인 에폭시 수지 조성물로 각각 형성될 수 있다.Although the 1st resin composition and 2nd resin composition for forming the 1st resin layer 22 and the 2nd resin layer 23 are not specifically limited here, It is preferable that it is an epoxy resin composition. Specifically, the first resin layer 22 and the second resin layer 23 include a first epoxy resin, a second epoxy resin, a rubber modified epoxy resin and a curing agent, and the first epoxy resin and the second epoxy resin One or more of them may be each formed of an epoxy resin composition having a polydispersity index (PDI) of 2 or less.
상기 에폭시 수지 조성물에 포함되는 제1 에폭시 수지는 분자 중에 2개 이상의 에폭시기를 포함하는 에폭시 수지로, 에폭시 당량(EEW)이 400~1,000 g/eq 범위인 고당량 에폭시 수지이다. 이러한 제1 에폭시 수지의 중량 평균 분자량(Mw)은 특별히 한정되지 않으나, 1,000 내지 3,000 범위인 것이 바람직하다.The first epoxy resin contained in the epoxy resin composition is an epoxy resin containing two or more epoxy groups in a molecule, and an epoxy equivalent (EEW) is a high equivalent epoxy resin in the range of 400 to 1,000 g / eq. Although the weight average molecular weight (Mw) of such a 1st epoxy resin is not specifically limited, It is preferable that it is the range of 1,000-3,000.
상기 에폭시 수지 조성물에 포함되는 제2 에폭시 수지도 분자 중에 2개 이상의 에폭시기를 포함하는 에폭시 수지로, 에폭시 당량(EEW)이 100~300 g/eq 범위인 저당량 에폭시 수지이다. 이러한 제2 에폭시 수지의 중량 평균 분자량(Mw)은 특별히 한정되지 않으나, 500 내지 2,000 범위인 것이 바람직하다.The second epoxy resin contained in the epoxy resin composition is an epoxy resin containing two or more epoxy groups in the molecule, and the epoxy equivalent (EEW) is a low equivalent epoxy resin having a range of 100 to 300 g / eq. Although the weight average molecular weight (Mw) of this 2nd epoxy resin is not specifically limited, It is preferable that it is the range of 500-2,000.
저당량(epoxy equivalent weight, EEW) 에폭시 수지는 낮은 용융점도 및 접착에 있어서 양호한 습윤성을 가지며, 고당량 에폭시 수지(EEW)는 그 자체로 가소성을 가져 적층체의 벤딩성(굽힘 가공성) 및 펀칭성 등과 같은 성형 특성을 향상시킬 수 있다. 따라서 본 발명의 적층체는 이와 같이 중합도(n) 또는 당량차가 있는 2종의 에폭시 수지를 포함하는 에폭시 수지 조성물로 형성된 제1 수지층(22)과 제2 수지층(23)을 포함함에 따라 높은 접착성, 탁월한 내습 신뢰도, 우수한 성형성 등을 나타낼 수 있다.Epoxy equivalent weight (EEW) epoxy resins have a low melt viscosity and good wettability for adhesion, and high equivalent epoxy resins (EEW) have plasticity in themselves, so that the laminate can bend (bending) and punchability. Molding properties such as the like can be improved. Therefore, the laminate of the present invention has a high degree according to the first resin layer 22 and the second resin layer 23 formed of an epoxy resin composition containing two kinds of epoxy resins having a polymerization degree (n) or an equivalent difference. Adhesiveness, excellent moisture resistance reliability, excellent moldability and the like.
여기서 상기 제1 에폭시 수지와 상기 제2 에폭시 수지 중 1종 이상은 다분산지수(PDI)가 2.0 이하(바람직하게는 1 내지 1.7이며, 보다 바람직하게는 1.1 내지 1.5)인 좁은 분자량 분포의 ND(narrow dispersity) 에폭시 수지이다. 즉, 좁은 분자량 분포의 ND 에폭시 수지는 상대적으로 높은 분자량을 가지는 고분자(예를 들어, High Mw species)와 낮은 분자량을 가지는 고분자(예를 들어, Oligomer)를 적게 함유하며, 분자량 분포가 균일하다. 이와 같이 분자량 분포가 균일한 ND 에폭시 수지는 side reaction이 적어 일반적인 에폭시 수지에 비해 높은 경화도를 가지기 때문에 이러한 ND 에폭시 수지를 포함하는 에폭시 수지 조성물로 수지층을 형성할 경우, free volume이 최소화된 수지층을 얻게 되며, 이는 결과적으로 접착성이 높고 흡수율이 낮은 수지층을 얻게 된다. 또한 ND 에폭시 수지는 에폭시 수지의 합성과정에서 생성되는 이온 및 부반응 생성물과 같은 불순물의 함량이 낮아 고순도를 나타내게 때문에 이러한 ND 에폭시 수지를 포함하는 에폭시 수지 조성물로 수지층을 형성할 경우, 마이그레이션이 최소화된 수지층을 얻게 되는데, 이에 대한 구체적인 설명은 후술하기로 한다.Wherein at least one of the first epoxy resin and the second epoxy resin has a polydispersity index (PDI) of 2.0 or less (preferably between 1 and 1.7, more preferably between 1.1 and 1.5). narrow dispersity) epoxy resin. That is, the narrow molecular weight ND epoxy resin contains relatively high molecular weight polymers (eg, High Mw species) and low molecular weight polymers (eg, Oligomers), and has a uniform molecular weight distribution. Since the ND epoxy resin having a uniform molecular weight distribution has less side reaction and has a higher degree of curing than a general epoxy resin, when the resin layer is formed of an epoxy resin composition containing such ND epoxy resin, the free volume is minimized. This results in a resin layer having high adhesion and low water absorption. In addition, since the ND epoxy resin exhibits high purity due to the low content of impurities such as ions and side reaction products generated during the synthesis of the epoxy resin, migration of the resin layer formed of an epoxy resin composition containing such ND epoxy resin is minimized. A resin layer is obtained, which will be described later.
한편, 상기 다분산지수(Polydispersity Index, PDI)는 고분자의 분자량 분포의 넓이(폭)를 나타내는 기준(척도)이 되며, 수평균 분자량(Mn)에 대한 무게평균 분자량(Mw)의 비로 정의된다. 구체적으로, 다분산지수(Polydispersity Index, PDI)가 클수록 분자량 분포가 넓으며, 1에 가까우면 가까울수록 좋은 물성을 가진 단일 분자량의 고분자로 해석된다.On the other hand, the polydispersity index (PDI) is a criterion (scale) indicating the width (width) of the molecular weight distribution of the polymer, it is defined as the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn). Specifically, the larger the polydispersity index (PDI), the wider the molecular weight distribution. The closer to 1, the closer the polymer is to a single molecular weight polymer having good physical properties.
본 발명은 제1 에폭시 수지 또는 제2 에폭시 수지 중 어느 하나, 또는 이들 모두가 2.0 이하의 다분산지수를 가지는 ND(narrow dispersity) 에폭시 수지를 사용함에 따라 에폭시 수지 조성물의 점도가 낮아지며, 이는 결국 에폭시 수지 조성물로 형성된 제1 수지층(22) 및 제2 수지층(23)의 Wetting성 및 접착성을 향상시키는 효과를 얻을 수 있다.The present invention lowers the viscosity of the epoxy resin composition by using a narrow dispersity (ND) epoxy resin, either one of the first epoxy resin or the second epoxy resin, or both have a polydispersity index of 2.0 or less, which eventually leads to epoxy The effect of improving the wetting property and adhesiveness of the 1st resin layer 22 and the 2nd resin layer 23 formed from the resin composition can be acquired.
상기 에폭시 수지 조성물에 제1 에폭시 수지와 제2 에폭시 수지가 모두 포함될 경우 이들의 혼합비율은 특별히 한정되지 않으나, 경화성, 가공성 및 접착성 등을 고려할 때, 제1 에폭시 수지와 제2 에폭시 수지는 10 내지 50 : 50 내지 90의 중량 비율로 혼합되는 것이 바람직하며, 30 내지 50 : 50 내지 70의 중량 비율로 혼합되는 것이 더욱 바람직하다. When both of the first epoxy resin and the second epoxy resin are included in the epoxy resin composition, the mixing ratio thereof is not particularly limited, but considering the curability, processability, and adhesiveness, the first epoxy resin and the second epoxy resin are 10 It is preferable to mix in the weight ratio of 50-50: 50, and it is more preferable to mix in the weight ratio of 30-50: 50-70.
한편 상기 제1 에폭시 수지와, 상기 제2 에폭시 수지는 상기 당량 범위를 가지는 에폭시 수지라면 특별히 한정되지 않으나, 비제한적인 예로 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 크레졸노볼락형 에폭시 수지, 디시클로펜타젠형 에폭시 수지, 트리스페닐메탄형 에폭시 수지, 나프탈렌형 에폭시 수지, 바이페닐형 에폭시 수지 및 수소 첨가 에폭시 수지 등을 들 수 있다.On the other hand, the first epoxy resin and the second epoxy resin is not particularly limited as long as it is an epoxy resin having the equivalent range, bisphenol A epoxy resin, bisphenol F-type epoxy resin, cresol novolac-type epoxy resin, And dicyclopentadiene type epoxy resins, trisphenylmethane type epoxy resins, naphthalene type epoxy resins, biphenyl type epoxy resins and hydrogenated epoxy resins.
상기 에폭시 수지 조성물에 포함되는 고무 변성 에폭시 수지는 에폭시 수지 조성물의 접착성, 내열성 및 절연성을 높이는 역할을 한다. 이러한 고무 변성 에폭시 수지는 특별히 한정되지 않으나, 비제한적인 예로 아크릴로니트릴-부타디엔 고무(NBR), 카복시 말단 부타디엔-아크릴로니트릴(CTBN) 고무, 에폭시 말단 부타디엔-아크릴로니트릴(ETBN) 고무 및 아민 말단 부타디엔-아크릴로니트릴(ATBN) 고무 등을 들 수 있다.The rubber-modified epoxy resin included in the epoxy resin composition serves to increase the adhesion, heat resistance and insulation of the epoxy resin composition. Such rubber modified epoxy resins are not particularly limited, but non-limiting examples include acrylonitrile-butadiene rubber (NBR), carboxy-terminated butadiene-acrylonitrile (CTBN) rubber, epoxy-terminated butadiene-acrylonitrile (ETBN) rubber and amines Terminal butadiene-acrylonitrile (ATBN) rubber and the like.
상기 에폭시 수지 조성물에 포함되는 고무 변성 에폭시 수지의 함량은 특별히 한정되지 않으나, 경화성, 가공성 및 접착성 등을 고려할 때, 제1 에폭시 수지, 제2 에폭시 수지 및 경화제의 총합 100중량부를 기준으로 고무 변성 에폭시 수지는 5 내지 50중량부로 포함되는 것이 바람직하며, 10 내지 40중량부로 포함되는 것이 더욱 바람직하다.The content of the rubber-modified epoxy resin included in the epoxy resin composition is not particularly limited, but considering the curability, processability and adhesiveness, rubber modification based on a total of 100 parts by weight of the first epoxy resin, the second epoxy resin and the curing agent The epoxy resin is preferably included in 5 to 50 parts by weight, more preferably 10 to 40 parts by weight.
상기 에폭시 수지 조성물에 포함되는 경화제는 에폭시 수지 조성물의 경화반응을 일으키는 역할을 한다. 이러한 경화제는 당업계에 공지된 물질이라면 특별히 한정되지 않으나, 2종 이상의 경화제를 사용하되, 그 중 적어도 하나는 다분산지수(Polydispersity Index, PDI)가 2.0 이하(바람직하게는 1 내지 1.7이며, 보다 바람직하게는 1.1 내지 1.5)인 ND(narrow dispersity) 경화제인 것이 바람직하다.The curing agent included in the epoxy resin composition serves to cause a curing reaction of the epoxy resin composition. Such a curing agent is not particularly limited as long as it is a material known in the art, but two or more curing agents are used, at least one of which has a polydispersity index (PDI) of 2.0 or less (preferably 1 to 1.7, and more). Preferably it is a narrow dispersity (ND) hardener which is 1.1-1.5).
구체적으로, 경화제로 제1 경화제와 제2 경화제를 혼합하여 사용할 경우 제1 경화제의 비제한적인 예로는, 페놀노볼락계 경화제, 이미다졸계 경화제, 아민계 경화제 등을 들 수 있으며, 제2 경화제의 비제한적인 예로는 크레졸노볼락계 경화제, 비스페놀 A 노볼락계 경화제, 나프탈렌계 경화제, 아민계 경화제, 아미노트리아진 노볼락계 경화제 등을 들 수 있으며, 제1 경화제와 제2 경화제 중 어느 하나의 다분산지수(PDI)가 2 이하이거나, 제1 경화제와 제2 경화제 모두 다분산지수(PDI)가 2 이하인 것이 바람직하다.Specifically, non-limiting examples of the first curing agent when used by mixing the first curing agent and the second curing agent as a curing agent, phenol novolak-based curing agent, imidazole-based curing agent, amine-based curing agent and the like, the second curing agent Non-limiting examples of the cresol novolak-based curing agent, bisphenol A novolak-based curing agent, naphthalene-based curing agent, amine-based curing agent, aminotriazine novolak-based curing agent, and the like, any one of the first and second curing agents The polydispersity index (PDI) of 2 is preferably 2 or less, or the polydispersity index (PDI) of both the first curing agent and the second curing agent is preferably 2 or less.
상기 에폭시 수지 조성물에 포함되는 경화제의 함량은 특별히 한정되지 않으나, 경화성, 내열성 및 접착성 등을 고려하고, 절연층의 경질화로 인해 벤딩성 및 펀치 가공성 등과 같은 성형 특성이 저하되는 것을 방지하기 위해 경화제와 에폭시 수지(제1 에폭시 수지+제2 에폭시 수지)를 20 내지 50 : 50 내지 80의 중량 비율로 혼합하는 것이 바람직하다.The content of the curing agent included in the epoxy resin composition is not particularly limited, but in order to prevent the deterioration of molding characteristics such as bending property and punch workability due to the hardening of the insulating layer in consideration of curing properties, heat resistance and adhesiveness, etc. And an epoxy resin (first epoxy resin + second epoxy resin) are preferably mixed in a weight ratio of 20 to 50:50 to 80.
한편 본 발명의 에폭시 수지 조성물은 점도 및 열전도율을 높이기 위해 무기 필러를 더 포함할 수 있다. 이러한 무기 필러는 당업계에 공지된 물질이라면 특별히 한정되지 않으나, 비제한적인 예로 산화규소, 산화알루미늄, 산화아연, 질화알루미늄, 질화규소, 질화붕소, 실리카, 탈크, 탄산칼슘 및 탄산마그네슘 등을 들 수 있다.Meanwhile, the epoxy resin composition of the present invention may further include an inorganic filler in order to increase the viscosity and the thermal conductivity. The inorganic filler is not particularly limited as long as it is a material known in the art, but non-limiting examples include silicon oxide, aluminum oxide, zinc oxide, aluminum nitride, silicon nitride, boron nitride, silica, talc, calcium carbonate and magnesium carbonate. have.
상기 에폭시 수지 조성물에 포함되는 무기 필러의 함량은 특별히 한정되지 않으나, 점도, 열전도율 및 가공성 등을 고려할 때, 제1 에폭시 수지, 제2 에폭시 수지 및 경화제의 총합 100중량부를 기준으로 무기필러는 5 내지 90중량부로 포함되는 것이 바람직하며, 10 내지 40중량부로 포함되는 것이 더욱 바람직하다.The content of the inorganic filler included in the epoxy resin composition is not particularly limited, but considering the viscosity, thermal conductivity and processability, the inorganic filler is 5 to 5 based on 100 parts by weight of the total of the first epoxy resin, the second epoxy resin and the curing agent. It is preferably included in 90 parts by weight, more preferably included in 10 to 40 parts by weight.
또한 본 발명의 에폭시 수지 조성물은 경화반응 속도를 높이기 위해 경화촉진제를 더 포함할 수 있다. 이러한 경화촉진제는 당업계에 공지된 물질이라면 특별히 한정되지 않으나, 비제한적인 예로 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀 등의 3급 아민계열; 2-메틸이미다졸, 2-페닐이미다졸 등의 이미다졸계열; 트리페닐포스핀, 디페닐포스핀, 페닐포스핀 등의 유기 포스핀계열; 테트라페닐포스포니움 테트라페닐보레이트, 트리페닐포스핀 테트라페닐보레이트 등의 테트라페닐보론염 등을 들 수 있다.In addition, the epoxy resin composition of the present invention may further include a curing accelerator to increase the curing reaction rate. The curing accelerator is not particularly limited as long as it is a material known in the art, but non-limiting examples include tertiary amines such as benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri (dimethylaminomethyl) phenol, and the like; Imidazole series such as 2-methylimidazole and 2-phenylimidazole; Organic phosphine series such as triphenylphosphine, diphenylphosphine and phenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate.
상기 에폭시 수지 조성물에 포함되는 경화촉진제의 함량은 특별히 한정되지 않으나, 경화성 등을 고려할 때, 제1 에폭시 수지, 제2 에폭시 수지 및 경화제의 총합 100중량부를 기준으로 경화촉진제는 0.001 내지 0.5중량부로 포함되는 것이 바람직하다.The content of the curing accelerator included in the epoxy resin composition is not particularly limited, but considering the curing property, the curing accelerator is included in an amount of 0.001 to 0.5 parts by weight based on a total of 100 parts by weight of the first epoxy resin, the second epoxy resin and the curing agent. It is desirable to be.
이외에도, 본 발명의 에폭시 수지 조성물은 에폭시 수지 조성물의 고유 물성을 해하지 않는 범위 내에서 난연제; 상기에 기재되지 않은 열경화성 수지나 열가소성 수지 및 이들의 올리고머; 상기 제1 에폭시 수지와 제2 에폭시 수지와는 다른 에폭시 수지; 자외선 흡수제, 항산화제, 중합개시제, 염료, 안료, 분산제, 증점제 및 레벨링제 등의 첨가제 더 포함할 수 있다.In addition, the epoxy resin composition of the present invention is a flame retardant within a range that does not impair the inherent physical properties of the epoxy resin composition; Thermosetting resins or thermoplastic resins and oligomers thereof not mentioned above; An epoxy resin different from the first epoxy resin and the second epoxy resin; Additives such as ultraviolet absorbers, antioxidants, polymerization initiators, dyes, pigments, dispersants, thickeners and leveling agents may be further included.
이러한 에폭시 수지 조성물은 ND 에폭시 수지인 제1 에폭시 수지, 및/또는 제2 에폭시 수지를 포함함으로써 K+, NH4+ Na+, Cl-와 같은 이온 함량이 적어 고순도를 나타내기 때문에 이로 이루어진 제1 수지층(22) 및 제2 수지층(23)은 각각 매우 낮은 흡수율을 나타낸다. The epoxy resin composition includes a first epoxy resin, which is an ND epoxy resin, and / or a second epoxy resin, so that the ionic content such as K + , NH 4+ Na + , Cl − is low, and thus high purity is shown. The resin layer 22 and the second resin layer 23 each exhibit very low water absorption.
구체적으로, 본 발명의 제1 수지층(22) 및 제2 수지층(23)은 각각 이온 함량이 10 내지 500ppm이고, 수분 흡수율이 0.01 내지 0.4%이다.Specifically, the first resin layer 22 and the second resin layer 23 of the present invention each have an ion content of 10 to 500 ppm and a water absorption of 0.01 to 0.4%.
이와 같이 이온 함량이 낮은 제1 수지층(22) 및 제2 수지층(23)을 적층체의 접착층으로 구비할 경우 제1 수지층(22) 및/또는 제2 수지층(23)을 통한 전도성 이온(예를 들어, Cu2 +)의 이동(migration)이 최소화되며, 이로 인해 본 발명의 적층체가 커버레이 기능을 수행할 경우 제1 수지층(22) 및/또는 제2 수지층(23)과 결합되는 인쇄회로기판의 회로층으로 전도성 이온의 이동이 최소화되어 신뢰도가 높은 다층 연성 인쇄회로기판을 제공할 수 있다.As such, when the first resin layer 22 and the second resin layer 23 having a low ion content are provided as the adhesive layer of the laminate, the conductivity is achieved through the first resin layer 22 and / or the second resin layer 23. ions (e.g., Cu 2 +) movement (migration), this is minimized, which results when performing a laminate coverlay feature of the present invention, the first resin layer 22 and / or the second resin layer 23 of the It is possible to provide a multilayer flexible printed circuit board having high reliability by minimizing the movement of conductive ions to the circuit layer of the printed circuit board which is combined with.
즉, 일반적으로 다층 연성회로기판은 복수의 인쇄회로기판이 서로 결합되어 제조되는데, 이때, 제1 인쇄회로기판과 제2 인쇄회로기판 사이를 결합시키는 본딩 시트, 또는 회로층을 보호하는 커버레이는 높은 접착성뿐만 아니라 회로층에 존재하는 전도성 이온의 이동을 방지하는 내마이그레이션성도 요구된다. 회로층에 존재하는 전도성 이온이 자유롭게 이동하면 회로의 단락(short circuit)이 유발되어 제1 인쇄회로기판, 제2 인쇄회로기판, 또는 이들을 포함하는 다층 연성 인쇄회로기판의 신뢰도가 떨어지기 때문이다.That is, in general, a multilayer flexible printed circuit board is manufactured by coupling a plurality of printed circuit boards to each other. In this case, a bonding sheet or a coverlay that protects the circuit layer may be bonded between the first printed circuit board and the second printed circuit board. In addition to high adhesion, migration resistance is also required to prevent the migration of conductive ions present in the circuit layer. This is because when the conductive ions in the circuit layer move freely, short circuits occur and reliability of the first printed circuit board, the second printed circuit board, or the multilayer flexible printed circuit board including the same decreases.
그러나 본 발명의 적층체는 수분 흡수율이 0.01 내지 0.4%로 낮은 제1 수지층(22) 및 제2 수지층(23)을 접착층으로 적용함에 따라 높은 접착성을 얻을 수 있다. 또한, 제1 수지층(22) 및 제2 수지층(23)의 이온 함량이 10 내지 500ppm로 낮음에 따라 전도성 이온의 이동도 최소화되기 때문에 우수한 내마이그레이션성도 얻을 수 있다.However, the laminate of the present invention can obtain high adhesiveness by applying the first resin layer 22 and the second resin layer 23 having a low water absorption of 0.01 to 0.4% as the adhesive layer. In addition, since the ionic content of the first resin layer 22 and the second resin layer 23 is 10 to 500 ppm, the mobility of the conductive ions is also minimized, thereby obtaining excellent migration resistance.
한편 제1 수지층(22) 및 제2 수지층(23)을 형성하기 위한 제1 수지 조성물 및 제2 수지 조성물로 상기 에폭시 수지 조성물 이외에 다른 수지 조성물을 적용함에 따라 본 발명은 저유전율을 가지거나, 방열성이 우수한 적층체를 제공할 수도 있다.Meanwhile, the present invention has a low dielectric constant as other resin compositions other than the epoxy resin composition are applied to the first resin composition and the second resin composition for forming the first resin layer 22 and the second resin layer 23. It is also possible to provide a laminate having excellent heat dissipation.
이러한 제1 수지층(22) 및 제2 수지층(23) 각각의 두께는 특별히 한정되지 않으나, 접착성 및 다층 연성 인쇄회로기판의 슬림화를 고려할 때, 각각 10 내지 25㎛인 것이 바람직하다.The thickness of each of the first resin layer 22 and the second resin layer 23 is not particularly limited, but in consideration of slimming of the adhesive and multilayer flexible printed circuit board, the thickness of each of the first resin layer 22 and the second resin layer 23 is preferably 10 to 25 μm.
본 발명의 적층체는 제1 수지층(22) 및 제2 수지층(23)을 각각 보호하는 이형층을 더 포함할 수 있다. 상기 이형층을 이루는 물질은 특별히 한정되지 않으나, 폴리에스터, 폴리에틸렌테레프탈레이트, 폴리에틸렌, 폴리프로필렌, 폴리에스테르, 또는 실리콘 등을 들 수 있다.The laminate of the present invention may further include a release layer for protecting the first resin layer 22 and the second resin layer 23, respectively. The material constituting the release layer is not particularly limited, and may include polyester, polyethylene terephthalate, polyethylene, polypropylene, polyester, or silicone.
이와 같은 본 발명의 적층체의 전체 두께는 특별히 한정되지 않으나, 다층 연성 인쇄회로기판의 슬림화를 고려할 때, 25 내지 62㎛인 것이 바람직하다.The overall thickness of the laminate of the present invention is not particularly limited, but considering the slimming of the multilayer flexible printed circuit board, the thickness is preferably 25 to 62 μm.
2. 다층 연성 인쇄회로기판2. Multi-layer flexible printed circuit board
본 발명은 상기 적층체를 포함함으로써 커버레이가 포함되지 않은 다층 연성 인쇄회로기판을 제공한다. 구체적으로 본 발명의 다층 연성 인쇄회로기판은 제1 인쇄회로기판, 제2 인쇄회로기판 및 제3 인쇄회로기판을 포함하고, 상기 제1 인쇄회로기판과 상기 제2 인쇄회로기판 사이에는 상기 적층체가 구비되며, 상기 제1 인쇄회로기판과 상기 제3 인쇄회로기판 사이에도 상기 적층체가 구비된다.The present invention provides a multilayer flexible printed circuit board that does not include a coverlay by including the laminate. Specifically, the multilayer flexible printed circuit board of the present invention includes a first printed circuit board, a second printed circuit board, and a third printed circuit board, and the laminate is disposed between the first printed circuit board and the second printed circuit board. The laminate is provided between the first printed circuit board and the third printed circuit board.
본 발명의 다층 연성 인쇄회로기판에 포함되는 제1 인쇄회로기판은 절연층, 상기 절연층의 상면에 결합된 제1 회로층 및 상기 절연층의 하면에 결합된 제2 회로층을 포함한다. 이러한 제1 인쇄회로기판에 포함된 절연층, 제1 및 제2 회로층을 이루는 물질은 당업계에 공지된 물질이라면 특별히 한정되지 않는다.The first printed circuit board included in the multilayer flexible printed circuit board of the present invention includes an insulating layer, a first circuit layer coupled to an upper surface of the insulating layer, and a second circuit layer coupled to a lower surface of the insulating layer. The material constituting the insulating layer and the first and second circuit layers included in the first printed circuit board is not particularly limited as long as it is a material known in the art.
본 발명의 다층 연성 인쇄회로기판에 포함되는 제2 인쇄회로기판은 제1 인쇄회로기판의 제1 회로층 상에 배치된다. 이러한 제2 인쇄회로기판은 절연층의 일면에 회로층이 구비된 단면 인쇄회로기판이거나, 제1 인쇄회로기판과 같이 절연층의 양면에 회로층이 각각 구비된 양면 인쇄회로기판일 수 있다.The second printed circuit board included in the multilayer flexible printed circuit board of the present invention is disposed on the first circuit layer of the first printed circuit board. The second printed circuit board may be a single-sided printed circuit board having a circuit layer provided on one surface of the insulating layer, or may be a double-sided printed circuit board having circuit layers provided on both sides of the insulating layer like the first printed circuit board.
본 발명의 다층 연성 인쇄회로기판에 포함되는 제3 인쇄회로기판은 제1 인쇄회로기판의 제2 회로층 상에 배치된다. 이러한 제3 인쇄회로기판도 절연층의 일면에 회로층이 구비된 단면 인쇄회로기판이거나, 제1 인쇄회로기판과 같이 절연층의 양면에 회로층이 각각 구비된 양면 인쇄회로기판일 수 있다.The third printed circuit board included in the multilayer flexible printed circuit board of the present invention is disposed on the second circuit layer of the first printed circuit board. The third printed circuit board may also be a single-sided printed circuit board provided with a circuit layer on one surface of the insulating layer, or may be a double-sided printed circuit board provided with circuit layers on both sides of the insulating layer like the first printed circuit board.
이러한 본 발명의 다층 연성 인쇄회로기판은 제1 인쇄회로기판의 제1 회로층과 제2 인쇄회로기판 사이에 상기 적층체가 구비되어 제1 인쇄회로기판과 제2 인쇄회로기판이 결합되고, 제1 인쇄회로기판의 제2 회로층과 제3 인쇄회로기판 사이에 상기 적층체가 구비되어 제1 인쇄회로기판과 제3 인쇄회로기판이 결합되는데, 이때, 상기 적층제에 포함된 제1 수지층, 또는 제2 수지층은 본딩 시트(접착층) 기능을 수행함과 동시에 커버레이 기능도 수행한다. 따라서 본 발명의 다층 연성 인쇄회로기판은 상기 제1 인쇄회로기판의 제1 회로층 및 제2 회로층을 각각 보호하기 위한 커버레이가 별도로 요구되지 않기 때문에 본 발명은 슬림화된 다층 연성 인쇄회로기판을 제공할 수 있다.In the multilayer flexible printed circuit board of the present invention, the laminate is provided between the first circuit layer and the second printed circuit board of the first printed circuit board so that the first printed circuit board and the second printed circuit board are coupled to each other. The laminate is provided between the second circuit layer and the third printed circuit board of the printed circuit board to couple the first printed circuit board and the third printed circuit board, wherein the first resin layer included in the laminate, or The second resin layer performs a bonding sheet (adhesive layer) function and also a coverlay function. Therefore, the multilayer flexible printed circuit board of the present invention does not require a coverlay for protecting the first circuit layer and the second circuit layer of the first printed circuit board separately, so the present invention provides a slim multilayer flexible printed circuit board. Can provide.
이하 본 발명을 실시예를 통하여 상세히 설명하면 다음과 같다. 단, 하기 실시예는 본 발명을 예시하는 것일 뿐, 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to Examples. However, the following examples are merely to illustrate the invention, the present invention is not limited by the following examples.
[[ 준비예Preparation 1 내지 6] 에폭시 수지 조성물의 제조 1 to 6] Preparation of Epoxy Resin Composition
하기 표 1의 조성에 따라 각 성분들을 혼합하여 에폭시 수지 조성물을 제조하였다. 이때, 하기 표 1의 함량 단위는 중량부이고, 그 기준은 제1 에폭시 수지, 제2 에폭시 수지 및 경화제의 총합을 100중량부로 하여 나머지 성분의 함량을 상대적으로 결정하였다.Each component was mixed according to the composition of Table 1 below to prepare an epoxy resin composition. At this time, the content unit in Table 1 is parts by weight, and the standard is a content of the remaining components relative to the total amount of the first epoxy resin, the second epoxy resin and the curing agent to 100 parts by weight.
준비예 1Preparation Example 1 준비예 2Preparation Example 2 준비예 3Preparation Example 3 준비예 4Preparation Example 4 준비예 5Preparation Example 5 준비예 6Preparation Example 6
1)에폭시 수지1 1) Epoxy Resin 1 -- -- -- 3535 -- --
2)제1면 에폭시 수지(ND 에폭시) 2) First side epoxy resin (ND epoxy) 3535 3535 3535 -- 3535 3535
3)에폭시 수지 2 3) epoxy resin 2 -- -- -- -- 3535 --
4)제2면 에폭시 수지(ND 에폭시) 4) Second side epoxy resin (ND epoxy) 3535 3535 3535 3535 -- 3535
5)경화제1면 5) Hardener 1 side -- -- 3030 -- -- --
6)제1면 경화제(ND 경화제) 6) First side hardener (ND hardener) 3030 3030 -- 3030 3030 3030
7) 고무 변성 에폭시 수지 1 7) Rubber modified epoxy resin 1 3030 2020 3030 3030 3030 --
8) 고무 변성 에폭시 수지 2 8) Rubber modified epoxy resin 2 -- -- -- -- -- 3030
9)무기 필러 9) weapon filler 1010 1010 1010 1010 1010 1010
10)경화촉진제 10) Curing accelerator 0.0060.006 0.0060.006 0.0060.006 0.0060.006 0.0060.006 0.0060.006
1) 국도화학, YD-1282) PDI: 1.57 / EEW: 600g/eq 에폭시 수지3) 국도화학, YDCN-6004) PDI: 1.26 / EEW: 6190g/eq 에폭시 수지5) 국도화학, KPN-21106) PDI: 1.40 / EEW 106.8g/eq 경화제7) NBR Rubber (XER-32)8) NBR Rubber (1072J)9) 알루미늄계(ATH)10) 이미다졸계 (2E4Mz)1) Kukdo Chemical, YD-1282) PDI: 1.57 / EEW: 600g / eq epoxy resin 3) Kukdo Chemical, YDCN-6004) PDI: 1.26 / EEW: 6190g / eq epoxy resin 5) Kukdo Chemical, KPN-21106) PDI : 1.40 / EEW 106.8g / eq Hardener 7) NBR Rubber (XER-32) 8) NBR Rubber (1072J) 9) Aluminum (ATH) 10) Imidazole (2E4Mz)
[비교 [compare 준비예Preparation 1 및 2] 1 and 2]
하기 표 2의 조성에 따라 각 성분들을 혼합하여 에폭시 수지 조성물을 제조한 것을 제외하고는, 상기 준비예 1과 동일한 방법으로 에폭시 수지 조성물을 제조하였다.The epoxy resin composition was prepared in the same manner as in Preparation Example 1, except that the epoxy resin composition was prepared by mixing the components according to the composition of Table 2 below.
비교 준비예 1Comparative Preparation Example 1 비교 준비예 2Comparative Preparation Example 2
1)에폭시 수지1 1) Epoxy Resin 1 3535 3535
2)제1면 에폭시 수지(ND 에폭시) 2) First side epoxy resin (ND epoxy) -- --
3)에폭시 수지 2 3) epoxy resin 2 3535 3535
4)제2면 에폭시 수지(ND 에폭시) 4) Second side epoxy resin (ND epoxy) -- --
5)경화제1면 5) Hardener 1 side 3030 3030
6)제1면 경화제(ND 경화제) 6) First side hardener (ND hardener) -- --
7) 고무 변성 에폭시 수지 1 7) Rubber modified epoxy resin 1 3030 --
8) 고무 변성 에폭시 수지 2 8) Rubber modified epoxy resin 2 -- 3030
9)무기 필러 9) weapon filler 1010 1010
10)경화촉진제 10) Curing accelerator 0.0060.006 0.0060.006
1) 국도화학, YD-1282) PDI: 1.57 / EEW: 600g/eq 에폭시 수지3) 국도화학, YDCN-6004) PDI: 1.26 / EEW: 6190g/eq 에폭시 수지5) 국도화학, KPN-21106) PDI: 1.40 / EEW 106.8g/eq 경화제7) NBR Rubber (XER-32)8) NBR Rubber (1072J)9) 알루미늄계(ATH)10) 이미다졸계 (2E4Mz)1) Kukdo Chemical, YD-1282) PDI: 1.57 / EEW: 600g / eq epoxy resin 3) Kukdo Chemical, YDCN-6004) PDI: 1.26 / EEW: 6190g / eq epoxy resin 5) Kukdo Chemical, KPN-21106) PDI : 1.40 / EEW 106.8g / eq Hardener 7) NBR Rubber (XER-32) 8) NBR Rubber (1072J) 9) Aluminum (ATH) 10) Imidazole (2E4Mz)
[[ 실시예Example 1 내지 6]  1 to 6] 적층체Laminate 제조 Produce
12㎛ 두께의 폴리이미드(PI)로 이루어진 기재층의 일면 및 타면에 상기 준비예 1 내지 6에서 제조된 에폭시 수지 조성물을 각각 도포하고, 160℃에서 3분 동안 건조하여 20㎛ 두께의 제1 수지층과 제2 수지층이 각각 형성된 적층체(전제 두께 52㎛)를 제조하였다.The epoxy resin composition prepared in Preparation Examples 1 to 6 was applied to one surface and the other surface of the substrate layer made of 12 μm-thick polyimide (PI), and dried at 160 ° C. for 3 minutes to form a first water having a thickness of 20 μm. The laminated body (former thickness 52 micrometers) in which a base layer and the 2nd resin layer were formed respectively was produced.
[[ 실시예Example 7]  7] 적층체Laminate 제조 Produce
5㎛ 두께의 폴리이미드(PI)로 이루어진 기재층의 일면 및 타면에 상기 준비예 1에서 제조된 에폭시 수지 조성물을 각각 도포하고, 160℃에서 3분 동안 건조하여 10㎛ 두께의 제1 수지층과 제2 수지층이 각각 형성된 적층체(전제 두께 25㎛)를 제조하였다.The epoxy resin composition prepared in Preparation Example 1 was applied to one surface and the other surface of the substrate layer made of polyimide (PI) having a thickness of 5 μm, respectively, and dried at 160 ° C. for 3 minutes to form a first resin layer having a thickness of 10 μm. The laminated body (preferred thickness 25micrometer) in which the 2nd resin layer was formed respectively was produced.
[[ 비교예Comparative example 1 및 2]  1 and 2] 적층체Laminate 제조 Produce
상기 비교 준비예 1 및 2에서 제조된 에폭시 수지 조성물로 제1 수지층과 제2 수지층을 각각 형성한 것을 제외하고는, 상기 실시예 1과 동일한 방법으로 적층체(전제 두께 52㎛)를 제조하였다.Except that the first resin layer and the second resin layer were formed with the epoxy resin compositions prepared in Comparative Preparation Examples 1 and 2, respectively, a laminate (preceding thickness: 52 μm) was prepared in the same manner as in Example 1. It was.
[[ 실험예Experimental Example 1]  One] 적층체의Laminate 물성 평가 Property evaluation
상기 실시예 1 내지 7 및 비교예 1, 2에서 각각 제조된 적층체의 물성을 하기와 같은 방법으로 평가하였으며, 그 결과를 하기 표 3에 나타내었다.The physical properties of the laminates prepared in Examples 1 to 7 and Comparative Examples 1 and 2, respectively, were evaluated in the following manner, and the results are shown in Table 3 below.
1) 코팅성: 기재층에 제1 수지층과 제2 수지층이 코팅된 정도를 육안으로 평가하였다(◎: 매우 양호 / ○: 양호 / △: 보통 / X: 불량).1) Coating property: The degree to which the 1st resin layer and the 2nd resin layer were coated on the base material layer was visually evaluated ((◎: very good / (circle): good / (triangle | delta): normal / X: bad).
2) 접착성(Peel Strength, P/S); IPC-TM-650 2.4.8의 평가 규격에 따라 제1 수지층과, 제2 수지층의 접착성을 평가하였다.2) Peel Strength (P / S); The adhesiveness of the 1st resin layer and the 2nd resin layer was evaluated in accordance with the evaluation specification of IPC-TM-650 2.4.8.
3) 내열성: IPC TM-650 2. 4. 13 평가 규격에 따라 제1 수지층과, 제2 수지층의 내열성을 평가하였다.3) Heat resistance: The heat resistance of the 1st resin layer and the 2nd resin layer was evaluated in accordance with IPC TM-650 2.4.4 13 evaluation standard.
4) 흡수율(%): IPC-TM-650 2.6.2.1의 평가 규격에 따라 제1 수지층과, 제2 수지층의 흡수율을 평가하였다.4) Water absorption rate (%): The water absorption rate of the 1st resin layer and the 2nd resin layer was evaluated according to the evaluation standard of IPC-TM-650 2.6.2.1.
5) 이온 함량(ppm): 이온크로마토그래피로 제1 수지층과, 제2 수지층의 이온 함량을 평가하였다.5) Ion Content (ppm): The ion content of the first resin layer and the second resin layer was evaluated by ion chromatography.
6) Ion-migration Test: 제1 수지층과, 제2 수지층의 Ion 전이 정도를 Pattern(Line/Space) 75/75㎛, 온도 85℃, 습도 85% RH, DC 100V조건 하에 평가하였다.6) Ion-migration Test: The degree of Ion transition of the first resin layer and the second resin layer was evaluated under the conditions of Pattern (Line / Space) 75/75 μm, temperature 85 ° C., humidity 85% RH, DC 100V.
실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 실시예 5Example 5 실시예 6Example 6 실시예 7Example 7 비교예 1Comparative Example 1 비교예 2Comparative Example 2
코팅성Coating ◎◎ ◎◎ ◎◎ ◎◎ ◎◎ ◎◎ ◎◎ ○○ ○○
접착성(@1/2Oz-kgf/㎝)Adhesiveness (@ 1 / 2Oz-kgf / cm) 1.41.4 1.31.3 1.21.2 1.21.2 1.271.27 1.351.35 1.11.1 0.90.9 0.80.8
내열성(S/D @288)Heat resistance (S / D @ 288) > 10min> 10min > 10min> 10min > 10min> 10min > 10min> 10min > 10min> 10min 8min8min > 10min> 10min > 10min> 10min 5min5min
흡수율(D-2/100)Absorption rate (D-2 / 100) 0.20.2 0.150.15 0.20.2 0.250.25 0.250.25 0.180.18 0.20.2 0.410.41 0.50.5
이온 함량(ppm)Ion Content (ppm) 250250 200200 300300 320320 300300 410410 250250 980980 12001200
Ion-migration Test(85℃ 85%RH DC100V, L/S 75/75)Ion-migration Test (85 ℃ 85% RH DC100V, L / S 75/75) > 1000h> 1000h > 1000h> 1000h > 1000h> 1000h 800h800h 800h800h 800h800h > 1000h> 1000h 300h300h 200h200h
상기 표 3을 참조하면, 본 발명에 따른 적층체는 물성이 우수한 것을 확인할 수 있다.Referring to Table 3, it can be confirmed that the laminate according to the present invention has excellent physical properties.

Claims (5)

  1. 기재층;Base layer;
    상기 기재층의 일면에 적층되며, 제1 수지 조성물로 형성된 제1 수지층;A first resin layer laminated on one surface of the substrate layer and formed of a first resin composition;
    상기 기재층의 타면에 적층되며, 제2 수지 조성물로 형성된 제2 수지층을 포함하고,It is laminated | stacked on the other surface of the said base material layer, Comprising a 2nd resin layer formed from the 2nd resin composition,
    상기 제1 수지층과 상기 제2 수지층은 접착성을 가지는 본딩 시트용 적층체.The said 1st resin layer and said 2nd resin layer are laminated bodies for bonding sheets which have adhesiveness.
  2. 제1항에 있어서,The method of claim 1,
    상기 제1 수지 조성물과 상기 제2 수지 조성물은 각각 에폭시 수지 조성물이며,The first resin composition and the second resin composition are each an epoxy resin composition,
    상기 에폭시 수지 조성물로 형성된 제1 수지층과 제2 수지층의 흡수율이 각각 0.01 내지 0.4%인 본딩 시트용 적층체.The laminated body for bonding sheets whose water absorptions of a 1st resin layer and a 2nd resin layer formed from the said epoxy resin composition are 0.01 to 0.4%, respectively.
  3. 제1항에 있어서,The method of claim 1,
    상기 제1 수지 조성물과 상기 제2 수지 조성물은 각각 에폭시 수지 조성물이며,The first resin composition and the second resin composition are each an epoxy resin composition,
    상기 에폭시 수지 조성물로 형성된 제1 수지층과 제2 수지층의 이온 함량이 10 내지 500ppm인 본딩 시트용 적층체.The laminated sheet for bonding sheets whose ion content of the 1st resin layer and the 2nd resin layer formed from the said epoxy resin composition is 10-500 ppm.
  4. 제1항에 있어서,The method of claim 1,
    두께가 25 내지 62㎛인 본딩 시트용 적층체.The laminated body for bonding sheets whose thickness is 25-62 micrometers.
  5. 절연층, 상기 절연층의 상면에 결합된 제1 회로층 및 상기 절연층의 하면에 결합된 제2 회로층을 포함하는 제1 인쇄회로기판;A first printed circuit board including an insulating layer, a first circuit layer coupled to an upper surface of the insulating layer, and a second circuit layer coupled to a lower surface of the insulating layer;
    상기 제1 회로층 상에 배치되는 제2 인쇄회로기판; 및A second printed circuit board disposed on the first circuit layer; And
    상기 제2 회로층 상에 배치되는 제3 인쇄회로기판을 포함하고,A third printed circuit board disposed on the second circuit layer,
    상기 제1 회로층과 상기 제2 인쇄회로기판 사이에 제1항 내지 제4항 중 어느 한 항의 본딩 시트용 적층체가 구비되며,A laminate for bonding sheets according to any one of claims 1 to 4 is provided between the first circuit layer and the second printed circuit board.
    상기 제2 회로층과 상기 제3 인쇄회로기판 사이에 상기 본딩 시트용 적층체가 구비된 다층 연성 인쇄회로기판.And a laminate for the bonding sheet provided between the second circuit layer and the third printed circuit board.
PCT/KR2015/014075 2014-12-24 2015-12-22 Laminate for bonding sheet and multilayer flexible printed circuit board including same WO2016105071A1 (en)

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KR102465243B1 (en) * 2017-12-14 2022-11-09 주식회사 아모센스 Method for manufacturing circuit board and circuit board manufactured by the method

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