WO2016101876A1 - 通讯设备金属外壳以及其制备方法 - Google Patents

通讯设备金属外壳以及其制备方法 Download PDF

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Publication number
WO2016101876A1
WO2016101876A1 PCT/CN2015/098299 CN2015098299W WO2016101876A1 WO 2016101876 A1 WO2016101876 A1 WO 2016101876A1 CN 2015098299 W CN2015098299 W CN 2015098299W WO 2016101876 A1 WO2016101876 A1 WO 2016101876A1
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WO
WIPO (PCT)
Prior art keywords
slit
metal substrate
metal
width
metal casing
Prior art date
Application number
PCT/CN2015/098299
Other languages
English (en)
French (fr)
Inventor
赵桂网
李孔林
刘晨岑
吴涛
Original Assignee
比亚迪股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN201410836203.4A external-priority patent/CN105530790A/zh
Priority claimed from CN201410829098.1A external-priority patent/CN105530784B/zh
Application filed by 比亚迪股份有限公司 filed Critical 比亚迪股份有限公司
Publication of WO2016101876A1 publication Critical patent/WO2016101876A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02—Waveguide horns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer

Definitions

  • the present invention relates to the field of materials, and in particular, to a method of preparing a metal casing for a communication device and a metal casing.
  • metal casing Due to the more beautiful and more textured metal casing and the superior performance of wear resistance and scratch resistance, with the development of metal processing technology, mobile communication devices such as mobile phones and tablet computers are increasingly inclined to use metal casings.
  • the metal casing especially the large-area metal casing, cannot penetrate electromagnetic waves.
  • it is necessary to process a single or a plurality of slits on the casing and design the antenna at the slit.
  • the first one is the traditional method of machining slits, such as grinding wheel cutting, CNC machine tools (CNC), etc., which has low precision and can not reach the metal casing.
  • the size of the slit is required, and in this cutting mode, the blade/bit is contacted with the workpiece in a high-speed operation, which causes mechanical stress on the workpiece, which easily causes deformation of the product and lowers the overall mechanical strength.
  • the second method uses a short wavelength of light such as ultraviolet light and green light to peel off the metal substrate (or metal substrate) layer by layer by laser etching.
  • the method has low processing efficiency and cannot process a thick metal substrate due to the problem of depth of focus (the thickest layer can be 0.4 mm), and the processed product has low strength.
  • the method needs to be repeatedly processed to cut through the substrate, and the high-speed scanning of the galvanometer for controlling the laser path has a certain precision, and repeated processing repeatedly causes the processing precision to be reduced and the processing time to be prolonged.
  • the slit processed in this way has a large taper, the outer surface (ie, the upper surface) is large, and the inner surface (ie, the lower surface) is small.
  • the inner surface may affect the passage of electromagnetic signals while ensuring the width of the outer surface.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. Accordingly, it is an object of the present invention to provide a metal housing for a communication device.
  • the metal casing provided by the invention has a thick thickness, and the inner and outer surfaces of the slit have a very small taper and a uniform appearance in appearance.
  • the invention provides a method of preparing a metal casing for a communication device, wherein the method comprises the steps of: 1) forming a narrowness on the metal substrate through the inner and outer surfaces of the metal substrate Seam; 2) Forming a plastic support layer on an inner surface of the metal substrate having the slit; and 3) providing a decorative layer on an outer surface of the metal substrate having the plastic support layer; wherein the metal substrate has a thickness of 0.2 to 2 mm .
  • a method of preparing a metal casing for a communication device which method can process a single or a plurality of slits on a metal substrate of 0.2 mm (for example, 0.2-2) or more, and because coaxial blowing is used in the cutting process,
  • the residue is discharged from the inner surface of the metal substrate (also referred to as the lower surface), so the outer surface of the slit (also referred to as the upper surface, that is, the primary surface of the product, that is, the outer surface of the metal substrate) is smooth and burr-free.
  • the metal substrate is thick enough to ensure sufficient strength of the substrate for subsequent injection molding, mechanical processing (such as polishing, sanding, sand blasting, CNC, etc.) and surface decoration.
  • the slits obtained by the processing have substantially no taper on the inner and outer surfaces (upper and lower surfaces), which ensures that the outer surface (upper surface) slit finally achieves invisible effect to the naked eye, and at the same time ensures that the slit width of the upper inner surface does not affect the passage of electromagnetic waves.
  • Subsequent coverage of the surface decorative layer enables the naked eye of the outer casing to be invisible, thereby ensuring an integrated appearance of the metal outer casing and enabling the outer casing to assume an all-metal texture.
  • the antenna of the electronic communication device is designed at the slit to allow electromagnetic waves to pass through without shielding the antenna radiation.
  • the invention proposes a metal casing for a communication device.
  • the metal casing is prepared by the method previously described herein.
  • the metal casing has all the features and advantages of the metal casing prepared by the above method, and will not be described herein.
  • FIG. 1 is a schematic structural view of a metal casing of a communication device according to an embodiment of the present invention
  • FIG. 2 is a block diagram showing the structure of a metal casing of a communication device according to another embodiment of the present invention.
  • FIG. 3 is a block diagram showing the structure of a metal casing of a communication device in accordance with still another embodiment of the present invention.
  • the communication device can be: a mobile phone, a tablet computer, a notebook computer or a Bluetooth headset.
  • the inner surface of the metal casing is defined as the surface of the metal casing facing the interior of the communication device when it is used in a communication device. It will be understood that the outer surface of the metal casing is defined as the surface of the metal casing facing the outside when it is used in a communication device. Further, the inner and outer surfaces of the metal substrate for preparing the metal outer casing and the inner and outer surfaces of the slit are also applicable to the above definition.
  • laser cutting refers to illuminating a workpiece with a focused high power density laser beam, causing the irradiated material to rapidly melt, vaporize, ablate or reach a flash point while being blown off by a high velocity air stream coaxial with the beam. The substance is melted to cut the workpiece.
  • the material of the metal substrate may be various metals commonly used in communication equipment in the art, and may be, for example, aluminum alloy, stainless steel, magnesium alloy or titanium alloy.
  • the invention provides a method of making a metal casing for a communication device.
  • the method ensures that the metal substrate is deformed during laser cutting to form a slit, and that the metal substrate has sufficient strength for subsequent injection molding and mechanical processing (such as polishing and polishing). , sand blasting, CNC, etc.) and surface decoration.
  • the method comprises:
  • a slit penetrating the inner surface and the outer surface of the metal substrate is formed on the metal substrate by cutting.
  • the above slit can effectively ensure the signal transmission between the antenna and the outside world, and realize communication.
  • the metal substrate may have a thickness of 0.2 to 2 mm, and according to some embodiments of the present invention, the metal substrate may have a thickness of 0.6 to 1.2 mm.
  • the specific number of the slits, the setting manner, the length of the slit, the width and the like are not particularly limited, and those skilled in the art can according to the specific type of the communication device and the antenna in the communication device.
  • the above parameters of the slit are designed for specific positions and parameters such as the frequency of the communication signal through the slit.
  • a plurality of slits can be formed on the metal casing metal casing metal substrate as needed. That is, in order to improve the practical use effect of the metal casing (or metal casing), it is necessary to form one or more slits on the metal substrate of the metal casing.
  • the laser can be cut on the metal substrate to form a slit penetrating the inner and outer surfaces of the metal substrate.
  • the width of the slit may be as long as communication can be realized, but from the viewpoint of further improving the communication effect, according to some embodiments of the present invention, the slit has a width of 15 to 500 ⁇ m on the outer surface of the metal substrate, and the slit is in the metal.
  • the width on the inner surface of the substrate is 20-600 ⁇ m, and the ratio of the width of the slit on the inner surface of the metal substrate to the width of the slit on the outer surface of the metal substrate is (1.05-1.5):
  • the slit has a width of 15 to 200 ⁇ m on the outer surface of the metal substrate, the slit has a width of 20 to 250 ⁇ m on the inner surface of the metal substrate, and the slit is on the inner surface of the metal substrate.
  • the ratio of the width to the width of the slit on the outer surface of the metal substrate is 1.05-1.4:1; according to some embodiments of the invention, the slit has a width of 15 to 200 ⁇ m on the outer surface of the metal substrate, the slit The width on the inner surface of the metal substrate is 20-220 ⁇ m, and the slit is on the inner surface of the metal substrate The ratio of the width to the width of the slit on the outer surface of the metal substrate is from 1.1-1.35:1.
  • the inner and outer surfaces of the slit are substantially free of taper, which is more advantageous for signal passage. For easy communication.
  • the slit length may be from 0.1 to 500 mm, according to some embodiments of the invention, the slit length is from 10 to 150 mm; the spacing between adjacent two slits may be from 0.1 to 10 mm, according to some embodiments of the invention The spacing between two adjacent slits is 0.3-1.6 mm.
  • the number and shape of the slits are not particularly limited as long as communication can be realized.
  • the number of slits may be 1-200.
  • the number of slits is 5-50;
  • the shape of the slit may be linear, curved, square wave or zigzag.
  • the shape of the slit is linear.
  • the laser may have a wavelength of 1060-1080 nm; according to some embodiments of the invention, the laser has a wavelength of 1064 nm or 1080 nm.
  • the laser cutting conditions are: processing power of 20-500 W, processing speed of 2-50 mm/s, frequency of 0.5- 5 kHz; according to some embodiments of the present invention, the laser cutting conditions are: processing power is 40-250 W, processing speed is 5-30 mm/s, frequency is 1.2-3 kHz; further laser cutting conditions are: processing power is 40- 200W, processing speed is 10-30mm/s, frequency is 1.2-3kHz.
  • the residue can be discharged from the inner surface (also referred to as the lower surface) of the metal substrate to prevent the slit region from being re-conducted.
  • the cut residue can be discharged from the inner surface (also referred to as the lower surface) of the metal substrate to prevent the slit region from being re-conducted.
  • the inner and outer surfaces also referred to as upper and lower surfaces
  • the slit width does not affect the passage of electromagnetic waves.
  • a plastic support layer is provided on the inner surface of the metal substrate.
  • a strong support can be provided for the metal casing.
  • the specific position and thickness of the plastic support layer are not particularly limited, and those skilled in the art can design according to actual conditions.
  • a plastic support layer may be disposed at a corresponding position where the inner surface of the metal substrate is formed with a slit such that the plastic support layer covers the inner surface of the slit to place the slit and the metal substrate at the slit is deformed.
  • a plastic support layer may be provided on the inner surface of the entire metal substrate such that the plastic support layer covers the entire inner surface of the metal substrate to provide maximum support for the metal outer casing.
  • the above plastic support layer can be formed by molding the inner surface of the metal substrate.
  • the method of molding the resin can be carried out by a conventional injection molding method.
  • the injection molding method is an injection pressure of 1600-2400 bar, and the pressure is 800-1400 bar.
  • the upper and lower mold temperatures are 80-150 degrees Celsius, and the injection time is 0.5-2 s.
  • the material used in the above injection molding may be a resin conventionally used in the art, and may be, for example, selected from the group consisting of polyethylene, polypropylene, polyacetal, polystyrene, modified polyphenylene ether, polyethylene terephthalate, and poly Butylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamideimide, polyetherimide, polysulfone, polyethersulfone, polyetherketone One or more of polyetherether magnesium, polycarbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer.
  • the material used in the injection molding is a mixture of the above resin and glass fiber.
  • the resin is selected from one or more of polyphenylene sulfide, polycarbonate, and polyamide; based on the weight of the mixture,
  • the glass fibers are present in an amount of from 1 to 50% by weight, and according to some embodiments of the invention, the glass fibers are present in an amount of from 20 to 40% by weight.
  • a decorative layer is formed on the outer surface of the metal substrate.
  • the decorative layer may be disposed on the outer surface of the metal substrate and cover the slit on the metal substrate, thereby preventing the top of the slit from being directly exposed to the air, and also making the slit invisible, thereby improving the metal casing. The degree of beauty.
  • the decorative layer can be carried out by conventional methods and conditions in the art, for example, the decorative layer can be formed by one or more of electrophoresis, micro-arc oxidation, anodization, hard anode, and spray coating.
  • the thickness of the above decorative layer may vary over a wide range, and according to some embodiments of the present invention, the decorative layer has a thickness of 5 to 60 ⁇ m.
  • the decorative layer may be an existing decorative layer of various electronic product casings, for example, one of an aluminum oxide layer, an epoxy resin coating, and an acrylic resin coating.
  • the decorative layer may be formed by an anodizing method
  • the anodizing condition may be a condition known in the art, for example, sulfuric acid having a concentration of 150-210 g/L may be used as a bath, and the voltage is 10-15 V.
  • the current density is 1-2A/dm 2
  • the temperature is 10-22 degrees Celsius
  • the anodizing time is 20-60min
  • the sealing liquid component such as NiSO 4 aqueous solution
  • the sealing temperature is 50. -95 degrees Celsius
  • the sealing time is 10-50 minutes.
  • the thickness of the decorative layer formed by the above anodizing method is usually 10 to 30 ⁇ m.
  • the decorative layer may be formed by a micro-arc oxidation method, and the micro-arc oxidation conditions may be conditions well known in the art, for example, pH 6-12, voltage 0-800 V, current density 1-10 A/ Dm 2 , the temperature is 15-60 degrees Celsius, the time is 10-60min, the sealing liquid is water, the sealing temperature is 70-90 degrees Celsius, and the sealing time is 1-10min.
  • the thickness of the decorative layer formed by the above micro-arc oxidation method is usually from 10 to 50 ⁇ m.
  • the decorative layer may be formed by electrophoresis, and the electrophoresis conditions may be conditions well known in the art, for example, cathodic electrophoresis: voltage of 20-60 V, pH of 4-6, temperature of 15-30 degrees Celsius, time of 20- 60s; anodic electrophoresis: voltage is 40-100V, pH is 6-8, temperature is 15-30 degrees Celsius, time is 40-90s; baking temperature is 120-200 degrees Celsius, baking time is 30-60min.
  • the thickness of the decorative layer formed by the above electrophoresis method is usually 5 to 35 ⁇ m.
  • the decorative layer may be formed by spraying, and the spraying conditions may be conditions well known in the art, for example, electrostatic high pressure: 60-90 kV; electrostatic current: 10-20 ⁇ A; flow rate pressure: 0.3-0.55 Mpa; atomization pressure: 0.33- 0.45Mpa; conveying speed: 4.5-5.5m/min; curing temperature: 150-220 degrees Celsius; curing time: 20-120min.
  • electrostatic high pressure 60-90 kV
  • electrostatic current 10-20 ⁇ A
  • flow rate pressure 0.3-0.55 Mpa
  • atomization pressure 0.33- 0.45Mpa
  • conveying speed 4.5-5.5m/min
  • curing temperature 150-220 degrees Celsius
  • curing time 20-120min.
  • the metal casing prepared by the above method may have the following structure: a metal substrate 100, a slit 200 penetrating the outer surface of the metal substrate and the inner surface, and being disposed on the inner surface of the metal substrate.
  • the number of the slits 200 may be more than one.
  • the object of the present invention is to overcome the problems of low efficiency of laser etching such as ultraviolet and green light, and low thickness of processed metal substrate, and to provide high precision on a thick metal substrate.
  • a method of preparing a metal casing of a communication device for processing slits with high efficiency may include the following steps:
  • the metal substrate has a thickness of 0.2-2 mm.
  • the invention proposes a metal casing for a communication device.
  • the metal casing is prepared by the method described above.
  • the metal casing has all the features and advantages of the metal casing prepared by the above method, and will not be described herein.
  • a portion of the outer surface of the plastic support layer may be introduced into the slit without filling the slit; or a portion of the decorative layer may be embedded in the slit without filling the slit.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.8mm
  • a laser cutting machine (the model produced by Huagong Laser is LSF20)
  • the laser, wavelength 1064 nm) was processed on a metal substrate, wherein the power of the laser processing was 60 W, the speed was 20 mm/s, the frequency was 1.5 kHz, and the processing time was 6 s, and the metal substrate A11 having the slit was obtained.
  • the slit has a width of 50 ⁇ m on the outer surface of the metal substrate, and the slit has a width of 60 ⁇ m on the inner surface of the metal substrate, and the slit processing strip
  • the number is six, the length of the slit is 10 mm, and the slit pitch is 0.6 mm. In addition, there is no clogging during the slit processing.
  • the above metal substrate is degreased and washed to remove surface stains and oil stains, and then dried at 80 degrees Celsius for 20 minutes to obtain a metal substrate A12 after washing and drying.
  • the above metal substrate A12 was placed in a mold, and injection molding was performed using a polyphenylene sulfide resin.
  • the injection molding conditions are: injection pressure of 1800 bar, pressure of 1000 bar, upper and lower mold temperature of 100 ° C when using oil temperature machine, injection time of 1.5 s, forming a plastic support layer (thickness of 1 mm), thereby obtaining a metal bottom with a plastic support layer Material A13.
  • the metal substrate A13 was subjected to alkali etching, water washing, pickling, and water washing, and then immersed in an electrolytic cell containing a H 2 SO 4 aqueous solution having a concentration of 180 g/L, using a metal substrate A13 as an anode and a stainless steel plate as a cathode. It is anodized for 40 minutes under the condition of voltage of 15V, current density of 1A/dm 2 and temperature of 19 degrees Celsius. After anodizing, it is taken out and ultrasonically cleaned to avoid the influence of acid in the slit on subsequent coloration. At this point, the slit is completely covered by the decorative layer and is invisible to the naked eye.
  • the anodized metal substrate A13 was immersed in an acid dye solution (purchased from Okuno Industry Co., Ltd., dye type TAC BLACK-SLH) for 10 min, and the acid dye solution concentration was 5 g/L, and the pH was 5.5.
  • the dyeing solution has a temperature of 50 degrees Celsius and is taken out and cleaned after completion.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.8mm was cut into a metal substrate of 15mm x 80mm.
  • the laser cutting machine (model LSF20 laser produced by Huagong Laser, wavelength 1064nm) is used to process the slit on the metal substrate.
  • the laser processing power is 40W
  • the speed is 30mm/s
  • the frequency is 3kHz
  • the processing time is 4s.
  • a metal substrate A21 having a slit is obtained.
  • the slit has a width of 15 ⁇ m on the outer surface of the metal substrate, and the slit has a width of 20 ⁇ m on the inner surface of the metal substrate, and the slit processing strip
  • the number is 6, the length of the slit is 10mm, narrow
  • the seam spacing is 0.6 mm. In addition, there is no clogging during the slit processing.
  • a metal substrate A23 with a plastic support layer was obtained in the same manner as in the step 2) of Example 1.
  • the metal substrate A23 is degreased, and then immersed in a micro-arc oxidation electrolyte (component and composition: sodium hexametaphosphate 40 g / L, sodium silicate 8 g / L, ammonium metavanadate 12 g / L), the metal
  • the substrate A23 is used as an anode, and the stainless steel plate is used as a cathode.
  • the micro-arc is oxidized for 40 minutes under the conditions of a voltage of 0-600 V, a current density of 5 A/dm 2 and a temperature of 25 ° C. After completion, it is taken out and cleaned with pure water.
  • the metal substrate A23 after micro-arc oxidation was obtained. At this time, the slit is completely covered by the micro-arc oxide film, and the surface slit has no hand feeling.
  • microarc oxidized metal substrate A23 was immersed in hot pure water at a temperature of 85 ° C for 5 min, and then taken out and blown dry.
  • a communication device metal casing A24 having a surface flat decorative layer having a thickness of 35 ⁇ m was obtained.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.8mm was cut into a metal substrate of 15mm x 80mm.
  • the laser cutting machine (model LSF20 laser produced by Huagong Laser, wavelength 1064nm) is used to process slits on the metal substrate.
  • the laser processing power is 200W
  • the speed is 10mm/s
  • the frequency is 1.2kHz
  • the processing time is 12s.
  • a metal substrate A31 having a slit is obtained.
  • the slit has a width of 200 ⁇ m on the outer surface of the metal substrate, and the slit has a width of 220 ⁇ m on the inner surface of the metal substrate, and the slit processing strip
  • the number is six, the length of the slit is 10 mm, and the slit pitch is 0.6 mm. In addition, there is no clogging during the slit processing.
  • a metal substrate A33 with a plastic support layer was obtained in the same manner as in the step 2) of Example 1.
  • the metal substrate A33 was subjected to alkali etching, water washing, pickling, and water washing treatment, and then an electrophoretic paint (available as an acrylic resin (purchased from Shimizu Corporation) was dissolved in water as a cathode, and the acrylic acid content was 10 parts by weight.
  • an electrophoretic paint available as an acrylic resin (purchased from Shimizu Corporation) was dissolved in water as a cathode, and the acrylic acid content was 10 parts by weight.
  • the pH was 4.5
  • the temperature was 23 ° C
  • the voltage was 35 V
  • the electrophoresis coating was formed on the surface after 120 s of electrophoresis.
  • the substrate was immersed in clean water for 120 s to remove the residual liquid on the surface of the coating. A metal casing after electrophoretic coating is obtained.
  • the above substrate was placed in an oven at a temperature of 175 ° C, baked for 50 min, and baked and cured to obtain a metal shell A34 of a communication device having a surface smoothing electrophoretic coating having a thickness of 30 ⁇ m.
  • the method of the first embodiment is carried out, except that the step 1) is: cutting aluminum alloy (purchased from Dongguan Gangxiang Metal Material Co., Ltd., grade 6063, thickness 2mm) into a size of 15mm x 80mm as a metal bottom. material.
  • the laser cutting machine (the laser cutting machine of the model LCF200CI produced by Huagong Laser, the wavelength of 1080nm) processes the slit on the metal substrate, wherein the laser processing power is 250W, the speed is 5mm/s, and the frequency is 1.2kHz.
  • the processing time was 24 s, and a metal substrate A41 having a slit was obtained.
  • the slit has a width of 50 ⁇ m on the outer surface of the metal substrate, and the slit has a width of 70 ⁇ m on the inner surface of the metal substrate, and the slit processing strip
  • the number is six, the length of the slit is 10 mm, and the slit pitch is 0.6 mm.
  • the finally obtained communication device metal casing A44 has a surface flat decorative layer. In addition, there is no clogging during the slit processing.
  • the method of the first embodiment is carried out, except that the step 1) is: cutting aluminum alloy (purchased from Dongguan Gangxiang Metal Material Co., Ltd., grade 6063, thickness 0.4mm) into a size of 15 mm x 80 mm as a metal. Substrate.
  • the UV laser drilling machine JG12 ultraviolet laser machine manufactured by Zhengye Technology, wavelength 355nm
  • the laser drilling power is 1.5W
  • the speed is 300mm/s
  • the frequency is At 15 kHz
  • the processing time was 10 min
  • the slit has a width of 15 ⁇ m on the outer surface of the metal substrate, and the slit has a width of 5 ⁇ m on the inner surface of the metal substrate, and the slit processing strip
  • the number is six
  • the length of the slit is 10 mm
  • the slit pitch is 0.6 mm.
  • the resulting communication device metal casing D14 in addition, in the slit processing, the clogging phenomenon is still remarkable after 10 minutes of processing, and the metal substrate as a whole is severely deformed due to repeated processing for a long time, and the obtained decorative layer of the metal casing has irregularities. .
  • the method of the first embodiment is carried out, except that the step 1) is: cutting aluminum alloy (purchased from Dongguan Gangxiang Metal Material Co., Ltd., grade 6063, thickness 0.4mm) into a size of 15 mm x 80 mm as a metal. Substrate. Using CNC equipment (CNC equipment of TC-510 of Lijin Machinery), the slit is machined in metal substrate, the processing speed is 2000r/min, the processing speed is 500mm/min, the processing frequency is 40 times, and the processing time is 2mim. A metal substrate D21 having a slit.
  • CNC equipment CNC equipment of TC-510 of Lijin Machinery
  • the slit has a width of 0.4 mm on the outer surface of the metal substrate, and the slit has a width of 0.4 mm on the inner surface of the metal substrate, and the slit
  • the number of processed strips is six, the length of the slit is 10 mm, and the slit pitch is 0.6 mm.
  • the finally obtained communication device metal casing D24 is still visible after the surface decoration.
  • the slit processed by the method of the present invention is transparent, has no clogging phenomenon, can be successfully processed only once, and the inner and outer surfaces (upper and lower surfaces) of the slit have no taper, and the obtained metal casing is obtained.
  • the decorative layer is flat and there is no unevenness.
  • the clogging phenomenon was still obvious after the processing of Comparative Example 1 for 10 minutes, and the metal substrate was severely deformed as a whole due to repeated processing for a long time, and the decorative layer of the obtained metal casing was uneven; Comparative Example 2 was processed. It can be successful many times, and because the cutter head is too thin, the tool life is very short, the processing size is 0.4mm, the precision is very low, and the obtained metal casing is obviously visible after being decorated by the surface.

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Abstract

提出了用于通讯设备的金属外壳制备方法以及利用该方法制备的金属外壳，其中，该方法包括以下步骤：1)通过切割，在金属底材上形成贯穿所述金属底材内表面和外表面的狭缝；2)在具有所述狭缝的金属底材内表面形成塑料支撑层；以及3)在具有所述塑料支撑层的金属底材外表面设置装饰层；其中，所述金属底材的厚度为0.2-2mm。

Description

通讯设备金属外壳以及其制备方法
优先权信息
本申请请求2014年12月26日向中国国家知识产权局提交的、专利申请号为201410829098.1/201410836203.4的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及材料领域，具体地，本发明涉及通讯设备金属外壳的制备方法以及金属外壳。
背景技术
金属外壳由于具有更加美观，更具质感，同时耐磨耐划伤等性能更加优越的特点，随着金属加工技术的发展，手机、平板电脑等移动通信设备，越来越倾向选用金属外壳。然而金属外壳，尤其是大面积的金属外壳，电磁波不能穿透，为了达到良好的电信号效果，采用金属外壳时需要在外壳上加工单条或多条狭缝，并将天线设计在狭缝处。
现有的加工狭缝的方法主要有两种，第一种是传统的机械加工狭缝的方式，如砂轮切割、数控机床(CNC)等，这种加工方式精度低，达不到金属外壳对于狭缝尺寸的要求，且在这种切割方式下，刀片/钻头等以高速运转的方式接触加工工件，会对工件产生机械应力，容易造成产品变形，降低整体的机械强度。第二种是采用紫外线及绿光等波长较短的光，通过激光刻蚀的方法将金属底材底材(或称为金属底材)一层一层地剥离。该方法加工效率低，且由于焦深的问题无法加工厚的金属底材(最厚能够做到0.4mm)，加工所得的产品强度低。另外该方法需重复加工多次才能将基材切穿，控制激光路径的振镜高速扫描有一定的精度，反复加工多次会造成加工精度的降低和加工时间的延长。且这种方式加工的狭缝有较大的锥度，外表面(即上表面)较大，内表面(即下表面)较小。在保证外表面缝宽的情况下，内表面可能会影响电磁信号的通过。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明的一个目的在于提出一种用于通讯设备的金属外壳。本发明提供的金属外壳具有较厚的厚度，狭缝内外表面锥度极小，在外观上具有平整一致性。
在本发明的一个方面，本发明提出了用于通讯设备的金属外壳制备方法，其中，该方法包括以下步骤：1)在金属底材上形成贯穿所述金属底材内表面和外表面的狭缝；2) 在具有所述狭缝的金属底材内表面形成塑料支撑层；以及3)在具有所述塑料支撑层的金属底材外表面设置装饰层；其中，所述金属底材的厚度为0.2-2mm。
根据本发明的通讯设备金属外壳的制备方法，该方法可在0.2mm(例如为0.2-2)以上的金属底材上加工单条或者多条狭缝，且由于切割过程中采用同轴吹气，将残渣由金属底材内表面(又称下表面)排出，所以狭缝外表面(又称上表面，即产品的一级面，也即金属底材的外表面)光滑无毛刺。通过金属底材足够厚可以保证基体有足够的强度可以进行后续的注塑、机械处理(如抛光、打磨、喷砂、CNC等)和表面装饰。且加工所得的狭缝，内外表面(上下表面)基本没有锥度，可确保外表面(上表面)狭缝最终达到肉眼不可见的效果，同时保证上内表面的缝宽不会影响电磁波的通过。后续通过表面装饰层的覆盖，实现外壳狭缝处肉眼不可见，从而能够保证金属外壳在外观上具有一体化效果，并且能够使该外壳外观呈现为全金属质感。同时又因为狭缝处为非金属材质，将电子通讯设备天线设计在狭缝处，可使电磁波通过，不会屏蔽天线辐射。
在本发明的另一方面，本发明提出了一种用于通讯设备的金属外壳。根据本发明的实施例，该金属外壳是利用本发明前面描述的方法制备的。由此，该金属外壳具有利用上述方法制备的金属外壳的全部特征以及优点，在此不再赘述。
本发明的其它特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
图1显示了根据本发明一个实施例的通讯设备金属外壳的结构示意图；
图2显示了根据本发明另一个实施例的通讯设备金属外壳的结构示意图；以及
图3显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图。
附图标记说明：
100：金属底材
200：狭缝
300：塑料支撑层
400：装饰层
具体实施方式
以下对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
在本发明中，通讯设备可以为：手机、平板电脑、笔记本电脑或蓝牙耳机等。
在本发明中，金属外壳的内表面定义为将其用于通讯设备中时，金属外壳朝向通讯设备内部的表面。可以理解的是，金属外壳的外表面定义为将其用于通讯设备中时，金属外壳朝向外界的表面。另外，用于制备金属外壳的金属底材的内外表面和狭缝的内外表面也适用于上述定义。
在本发明中，“激光切割”是指利用经聚焦的高功率密度激光束照射工件，使被照射的材料迅速熔化、汽化、烧蚀或达到燃点，同时借助与光束同轴的高速气流吹除熔融物质，从而实现将工件割开。
在本发明中，金属底材的材质可以为本领域通常用于通讯设备的各种金属，例如可以为铝合金、不锈钢、镁合金或钛合金等。
在本发明的一个方面，本发明提出了一种用于通讯设备的金属外壳制备方法。该方法通过使用足够厚的金属底材，可确保在激光切割形成狭缝过程中金属底材发生变形，并且可以保证金属底材有足够的强度可以进行后续的注塑、机械处理(如抛光、打磨、喷砂、CNC等)和表面装饰。根据本发明的实施例，该方法包括：
1)设置狭缝根据本发明的实施例，在该步骤中，通过切割，在金属底材上形成贯穿该金属底材内表面和外表面的狭缝。上述狭缝可有效的保证天线与外界的信号传输，实现通讯。
具体地，在该步骤中，金属底材的厚度可以为0.2-2mm，根据本发明的一些实施例，该金属底材的厚度可以为0.6-1.2mm。需要说明的是，在该步骤中，狭缝的具体数量、设置方式、狭缝的长度、宽度等参数不受特别限制，本领域技术人员可以根据通讯设备的具体类型以及在该通讯设备中天线的具***置、需要通过狭缝的通讯信号的频率等参数，对狭缝的上述参数进行设计。例如，根据本发明，可以根据需要，在金属外壳金属外壳金属底材上形成多条狭缝。即，为了提高该金属外壳(或称为金属壳体)的实际使用效果，需要在金属外壳的金属底材上形成一条以上的狭缝。
在本发明中，可以通过激光在金属底材上进行切割，从而形成贯穿金属底材内外表面的狭缝。狭缝的宽度只要能够实现通讯即可，但从进一步能够提高通讯效果方面来考虑，根据本发明的一些实施例，狭缝在金属底材外表面上的宽度为15-500μm，狭缝在金属底材内表面上的宽度为20-600μm，且狭缝在所述金属底材内表面上的宽度与狭缝在所述金属底材外表面上的宽度的比值为(1.05-1.5)：1；根据本发明的一些实施例，狭缝在金属底材外表面上的宽度为15-200μm，狭缝在金属底材内表面上的宽度为20-250μm，且狭缝在金属底材内表面上的宽度与狭缝在金属底材外表面上的宽度的比值为1.05-1.4：1；根据本发明的一些实施例，狭缝在金属底材外表面上的宽度为15-200μm，狭缝在金属底材内表面上的宽度为20-220μm，且狭缝在金属底材内表面上 的宽度与狭缝在金属底材外表面上的宽度的比值为1.1-1.35：1。
根据本发明，通过使狭缝在内外表面的宽度(或称为狭缝在上下表面的宽度)以及宽度比在上述范围内，从而实现狭缝内外表面基本没有锥度，能够更加有利于信号的通过，便于通讯。
此外，狭缝长度可以为0.1-500mm，根据本发明的一些实施例，狭缝长度为10-150mm；相邻两条狭缝之间的间距可以为0.1-10mm，根据本发明的一些实施例，相邻两条狭缝之间的间距为0.3-1.6mm。另外，狭缝的条数和形状没有特别的限定，只要能够实现通讯即可。例如狭缝的条数可以为1-200条，根据本发明的一些实施例，狭缝的条数为5-50条；狭缝的形状可以为直线形、曲线形、方波线形或锯齿线形，根据本发明的一些实施例，狭缝的形状为直线形。
在本发明中，所述激光的波长可以为1060-1080nm；根据本发明的一些实施例，所述激光的波长为1064nm或1080nm。
根据本发明，为了得到上述狭缝宽度范围内的狭缝，根据本发明的一些实施例，激光切割的条件为：加工功率为20-500W，加工速度为2-50mm/s，频率为0.5-5kHz；根据本发明的一些实施例，激光切割的条件为：加工功率为40-250W，加工速度为5-30mm/s，频率为1.2-3kHz；进一步激光切割的条件为：加工功率为40-200W，加工速度为10-30mm/s，频率为1.2-3kHz。
根据本发明，由于激光切割过程中采用同轴吹气，能够将残渣由金属底材内表面(又称为下表面)排出，防止狭缝区域重新导通。
根据本发明，由于通过激光切割直接在金属底材上形成狭缝，可使切割的残渣由金属底材内表面(又称为下表面)排出，防止狭缝区域重新导通。且通过上述条件加工所得的狭缝，内外表面(又称为上下表面)基本没有锥度，可确保外表面狭缝最终达到肉眼不可见的效果，同时能够保证内外表面(又称为上下表面)的缝宽不会影响电磁波的通过。
2)设置塑料支撑层
根据本发明的实施例，在该步骤中，在金属底材的内表面设置塑料支撑层。由此，可以为该金属外壳提供有力的支撑。需要说明的是，该塑料支撑层的具***置以及厚度不受特别限制，本领域技术人员，可以根据实际情况进行设计。例如，可以在金属底材内表面形成有狭缝的对应位置设置塑料支撑层，使该塑料支撑层覆盖狭缝的内表面，以便放置狭缝以及狭缝处金属底材发生变形。此外，还可以在整个金属底材的内表面设置塑料支撑层，使该塑料支撑层覆盖金属底材的整个内表面，以便为该金属外壳提供最大程度的支撑。
根据本发明，在该步骤中，可以通过对金属底材内表面进行注塑树脂，形成上述塑料支撑层。注塑树脂的方法可采用常规的注塑成型方法，例如，注塑方法为射压1600-2400bar，保压800-1400bar，使用油温机时上下模温为80-150摄氏度，射出时间为0.5-2s。
上述注塑时采用的材料可以为本领域常规使用的树脂，例如可选自聚乙烯、聚丙烯、聚缩醛、聚苯乙烯、改性聚苯醚、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚萘二甲酸乙二醇之、聚苯硫醚、聚酰亚胺、聚酰胺酰亚胺、聚醚酰亚胺、聚砜、聚醚砜、聚醚酮、聚醚醚镁、聚碳酸酯、聚酰胺和丙烯腈-丁二烯-苯乙烯共聚物中的一种或多种。
为了进一步提高得到的金属底材的力学强度，根据本发明的一些实施例，注塑时采用的材料为上述树脂与玻璃纤维的混合物。根据本发明的一些实施例，上述混合物中，根据本发明的一些实施例，树脂选自聚苯硫醚、聚碳酸酯和聚酰胺中的一种或多种；以该混合物的重量为基准，玻璃纤维的含量为1-50重量％，根据本发明的一些实施例，玻璃纤维的含量为20-40重量％。
3)设置装饰层
在该步骤中，在金属底材外表面形成装饰层。需要说明的是，该步骤形成的装饰层的具***置以及厚度不受特别限制，本领域技术人员可以根据实际情况进行选择。该装饰层可以设置在金属底材的外表面上，并覆盖金属底材上的狭缝，进而可以避免狭缝的顶部直接暴露在空气中，也可以使狭缝不可见，进而提高该金属外壳的美观程度。
装饰层可以采用本领域的常规方法和条件进行，例如可以通过电泳、微弧氧化、阳极氧化、硬质阳极和喷涂中的一种或多种形成装饰层。
对于上述装饰层的厚度可在较大范围内变动，根据本发明的一些实施例，所述装饰层的厚度为5-60μm。装饰层可以为现有的各种电子产品外壳装饰层，例如可以为氧化铝层、环氧树脂涂层、丙烯酸树脂涂层中的一种。
本发明中，可采用阳极氧化方法形成所述装饰层，阳极氧化条件可以本领域所公知的条件，例如可以为：以浓度为150-210g/L的硫酸作为槽液，电压为10-15V，电流密度为1-2A/dm2，温度为10-22摄氏度，阳极氧化时间为20-60min，封孔槽液(成分例如为NiSO4水溶液)浓度为1-10g/L，封孔温度为50-95摄氏度，封孔时间为10-50min。通过上述阳极氧化方法形成的装饰层厚度通常为10-30μm。
或者，也可通过微弧氧化方法形成所述装饰层，微弧氧化条件可以本领域所公知的条件，例如可以为：pH为6-12，电压为0-800V，电流密度为1-10A/dm2，温度为15-60摄氏度，时间为10-60min，封孔槽液为水，封孔温度为70-90摄氏度，封孔时间为1-10min。通过上述微弧氧化方法形成的装饰层厚度通常为10-50μm。
或者，通过电泳形成所述装饰层，电泳条件可以本领域所公知的条件，例如可以为：阴极电泳：电压为20-60V，pH为4-6，温度为15-30摄氏度，时间为20-60s；阳极电泳：电压为40-100V，pH为6-8，温度为15-30摄氏度，时间为40-90s；烘烤温度为120-200摄氏度，烘烤时间为30-60min。通过上述电泳方法形成的装饰层厚度通常为5-35μm。
或者，通过喷涂形成装饰层，喷涂条件可以本领域所公知的条件，例如可以为：静电高压：60-90kV；静电电流：10-20μA；流速压力：0.3-0.55Mpa；雾化压力：0.33-0.45Mpa；输送速度：4.5-5.5m/min；固化温度：150-220摄氏度；固化时间：20-120min。
根据本发明的实施例，参考图1，利用上述方法制备的金属外壳可以具有以下结构：金属底材100，贯穿金属底材外表面以及内表面的狭缝200，设置在金属底材内表面的塑料支撑层300，以及设置在金属底材100外表面的装饰层400。其中，参考图2，狭缝200的数量可以不止一个。
综上所述，本发明的目的在于克服紫外及绿光等波长较短的激光刻蚀加工效率低、加工金属底材厚度薄的问题，提供一种能够在较厚的金属底材上高精度且高效率地加工狭缝的通讯设备金属外壳的制备方法。为了实现上述目的，该方法可以包括以下步骤：
1)通过激光在金属底材上进行切割，形成贯穿所述金属底材内外表面的狭缝；
2)对金属底材的内表面注塑树脂；
3)在金属底材外表面形成装饰层；
其中，所述金属底材的厚度为0.2-2mm。
在本发明的另一方面，本发明提出了一种该用于通讯设备的金属外壳。根据本发明的实施例，该金属外壳是利用前面描述的方法制备的。由此，该金属外壳具有利用上述方法制备的金属外壳的全部特征以及优点，在此不再赘述。
需要说明的是，在不付出创造性劳动的前提下，对基于本发明的金属外壳制备方法以及金属外壳所作出的改进也属于本发明保护的范围。例如，参考图3，可以使塑料支撑层外表面的一部分进入狭缝中，但不填满狭缝；或者，可以使装饰层的一部分嵌入到狭缝中，但不将狭缝填满。
以下将通过实施例对本发明进行详细描述。需要说明的是，下面的具体实施例仅仅是用于说明的目的，而不以任何方式限制本发明的范围，另外，如无特殊说明，未具体记载条件或者步骤的方法均为常规方法，所采用的试剂和材料均可从商业途径获得。
实施例1
1)通过激光切割形成狭缝
将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为0.8mm)切割为15mm x 80mm的尺寸作为金属底材。采用激光切割机(华工激光生产的型号为LSF20 激光器，波长1064nm)在金属底材上加工狭缝，其中，激光加工的功率为60W，速度为20mm/s，频率为1.5kHz，加工时间为6s，得到开设有狭缝的金属底材A11。在所得到的金属底材A11中，所述狭缝在所述金属底材外表面上的宽度为50μm，所述狭缝在所述金属底材内表面上的宽度为60μm，狭缝加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。另外，狭缝加工过程中没有堵塞现象。
2)注塑
对上述金属底材进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属底材A12。将上述金属底材A12放入模具中，采用聚苯硫醚树脂进行注塑。注塑条件为：射压1800bar，保压1000bar，使用油温机时上下模温为100摄氏度，射出时间为1.5s，形成塑料支撑层(厚度为1mm)，从而得到带有塑料支撑层的金属底材A13。
3)采用阳极氧化方法形成表面装饰层
将上述金属底材A13进行碱蚀、水洗、酸洗、水洗处理，之后浸入盛有浓度为180g/L的H2SO4水溶液的电解槽中，以金属底材A13作为阳极，不锈钢板作为阴极，在电压为15V，电流密度为1A/dm2、温度为19摄氏度的条件下阳极氧化40min，完成阳极氧化后取出并超声波清洗干净，避免狭缝内藏酸影响后续着色。此时，狭缝完全被装饰层填充覆盖，肉眼不可见。
将上述经过阳极氧化的金属底材A13浸入酸性染液(购自奥野制业工业株式会社，染料型号为TAC BLACK-SLH)中染色10min，该酸性染液浓度为5g/L，PH值为5.5，所述染液的温度为50摄氏度，完成后取出并清洗干净。
然后在封孔剂(NiSO4水溶液，浓度为10g/L)中浸渍20min，温度为95摄氏度，完成封孔后用90摄氏度的纯水清洗干净，并在60摄氏度条件下烘烤15min。得到厚度为20μm的装饰层。最终得到具有表面平整装饰层的通讯设备金属外壳A14。
实施例2
1)通过激光切割形成狭缝
将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为0.8mm)切割为15mm x 80mm的尺寸作为金属底材。采用激光切割机(华工激光生产的型号为LSF20激光器，波长1064nm)在金属底材上加工狭缝，其中，激光加工的功率为40W，速度为30mm/s，频率为3kHz，加工时间为4s，得到开设有狭缝的金属底材A21。在所得到的金属底材A21中，所述狭缝在所述金属底材外表面上的宽度为15μm，所述狭缝在所述金属底材内表面上的宽度为20μm，狭缝加工条数为6条，狭缝的长度为10mm，狭 缝间距为0.6mm。另外，狭缝加工过程中没有堵塞现象。
2)注塑
按照实施例1步骤2)的方法得到带有塑料支撑层的金属底材A23。
3)采用微弧氧化方法形成表面装饰涂层。
将金属底材A23进行脱脂处理，之后浸入微弧氧化电解液(成分与组成为：六偏磷酸钠40g/L，硅酸钠8g/L，偏钒酸铵12g/L)中，以该金属底材A23作为阳极，不锈钢板作为阴极，在电压为0-600V，电流密度为5A/dm2，温度为25摄氏度的条件下微弧氧化40min，完成后取出用纯水清洗干净。得到微弧氧化后的金属底材A23。此时，狭缝完全被微弧氧化膜填充覆盖，表面狭缝无手感。
将上述微弧氧化后的金属底材A23浸入温度为85摄氏度的热纯水中封闭5min，然后取出吹干。得到具有35μm厚度的表面平整装饰层的通讯设备金属外壳A24。
实施例3
1)通过激光切割形成狭缝
将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为0.8mm)切割为15mm x 80mm的尺寸作为金属底材。采用激光切割机(华工激光生产的型号为LSF20激光器，波长1064nm)在金属底材上加工狭缝，其中，激光加工的功率为200W，速度为10mm/s，频率为1.2kHz，加工时间为12s，得到开设有狭缝的金属底材A31。在所得到的金属底材A31中，所述狭缝在所述金属底材外表面上的宽度为200μm，所述狭缝在所述金属底材内表面上的宽度为220μm，狭缝加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。另外，狭缝加工过程中没有堵塞现象。
2)注塑
按照实施例1步骤2)的方法得到带有塑料支撑层的金属底材A33。
3)采用电泳方法形成表面装饰层
将金属底材A33进行碱蚀、水洗、酸洗和水洗处理，之后作为阴极放入电泳漆(将丙烯酸树脂(购于清水株式会社)以胶体形式溶解在水中而得到，丙烯酸的含量为10重量％)中，在阴极电泳漆pH为4.5，温度为23摄氏度，电压为35V的条件下，电泳120s，表面形成电泳涂层。之后，将上述基材放入清水中浸洗120s，去除涂层表面残液。得到电泳涂装后的金属外壳。此时，狭缝完全被电泳涂层覆盖，表面狭缝肉眼不可见。最后，将上述基材放入温度为175摄氏度的烘箱中，烘烤50min，经过烘烤固化后，得到具有30μm厚度的表面平整的电泳涂层的通讯设备金属外壳A34。
实施例4
按照实施例1的方法进行，不同的是，步骤1)为：将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为2mm)切割为15mm x 80mm的尺寸作为金属底材。采用激光切割机(华工激光生产的型号为LCF200CI的激光切割机，波长为1080nm)在金属底材上加工狭缝，其中，激光加工的功率为250W，速度为5mm/s，频率为1.2kHz，加工时间为24s，得到开设有狭缝的金属底材A41。在所得到的金属底材A41中，所述狭缝在所述金属底材外表面上的宽度为50μm，所述狭缝在所述金属底材内表面上的宽度为70μm，狭缝加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。由此，最终得到的通讯设备金属外壳A44具有表面平整装饰层。另外，狭缝加工过程中没有堵塞现象。
对比例1
按照实施例1的方法进行，不同的是，步骤1)为：将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为0.4mm)切割为15mm x 80mm的尺寸作为金属底材。采用紫外激光打孔机(正业科技生产的型号为JG12的紫外激光机，波长355nm)在金属底材上进行狭缝加工，其中，激光打孔的功率为1.5W，速度为300mm/s，频率为15kHz，加工时间为10min，得到开设有狭缝的金属底材D11。在所得到的金属底材D11中，所述狭缝在所述金属底材外表面上的宽度为15μm，所述狭缝在所述金属底材内表面上的宽度为5μm，狭缝加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。此外，最终得到的通讯设备金属外壳D14。另外，狭缝加工中，在加工了10min后，堵塞现象还是很明显，而且由于长时间反复加工，金属底材整体有严重变形，得到的金属外壳的装饰层具有凹凸不平。。
对比例2
按照实施例1的方法进行，不同的是，步骤1)为：将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为0.4mm)切割为15mm x 80mm的尺寸作为金属底材。采用CNC设备(力劲机械的型号为TC-510的CNC设备)在金属底材加工狭缝，加工转速2000r/min，加工走速500mm/min，加工次数40次，加工时间为2mim，得到开设有狭缝的金属底材D21。在所得到的金属底材D21中，所述狭缝在所述金属底材外表面上的宽度为0.4mm，所述狭缝在所述金属底材内表面上的宽度为0.4mm，狭缝加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。此外，最终得到的通讯设备金属外壳D24在经过表面装饰后，狭缝还是很明显可见。
通过上述实施例和对比例可知，通过本发明的方法加工出的狭缝通透，无堵塞现象，仅加工一次即可成功，并且狭缝内外表面(上下表面)不具有锥度，得到的金属外壳的装饰层平整，没有凹凸不平。与此相对，对比例1在加工了10min后，堵塞现象还是很明显，而且由于长时间反复加工，金属底材整体有严重变形，得到的金属外壳的装饰层具有凹凸不平；对比例2需加工多次方可成功，而且由于刀头太细造成刀具使用寿命很短，加工尺寸达到0.4mm，精度很低，得到的金属外壳在经过表面装饰后，狭缝还是很明显可见。
以上详细描述了本发明的一些实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合。
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。
本发明的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。

Claims (16)

  1. 一种用于通讯设备的金属外壳的制备方法，其特征在于，包括：
    1)在金属底材上形成贯穿所述金属底材内表面和外表面的狭缝；
    2)在具有所述狭缝的金属底材内表面形成塑料支撑层；以及
    3)在具有所述塑料支撑层的金属底材外表面设置装饰层；
    其中，所述金属底材的厚度为0.2-2mm。
  2. 根据权利要求1所述的金属外壳的制备方法，其特征在于，所述金属底材的厚度为0.6-1.2mm。
  3. 根据权利要求1所述的金属外壳的制备方法，其特征在于，通过切割在所述金属底材上形成所述狭缝，所述切割为激光切割。
  4. 根据权利要求3所述的金属外壳的制备方法，其特征在于，所述激光的波长为1060-1080nm。
  5. 根据权利要求4所述的金属外壳的制备方法，其特征在于，所述激光的波长为1064nm。
  6. 根据权利要求3所述的金属外壳的制备方法，其特征在于，所述激光切割的条件为：加工功率为20-500W，加工速度为2-50mm/s，频率为0.5-5kHz。
  7. 根据权利要求6所述的金属外壳的制备方法，其特征在于，所述激光切割的条件为：加工功率为40-200W，加工速度为10-30mm/s，频率为1.2-3kHz。
  8. 根据权利要求1所述的金属外壳的制备方法，其特征在于，在步骤1)中，在所述金属底材上形成多条所述狭缝。
  9. 根据权利要求8所述的金属外壳的制备方法，其特征在于，相邻两条狭缝之间的间距为0.1-10mm。
  10. 根据权利要求1-9任一项所述的金属外壳制备方法，其特征在于，所述狭缝长度为0.1-500mm。
  11. 根据权利要求1所述的金属外壳的制备方法，其特征在于，所述狭缝在所述金属底材外表面上的宽度为15-500μm，所述狭缝在所述金属底材内表面上的宽度为20-600μm，且所述狭缝在所述金属底材内表面上的宽度与所述狭缝在所述金属底材外表面上的宽度的比值为(1.05-1.5)：1。
  12. 根据权利要求11所述的金属外壳的制备方法，其特征在于，所述狭缝在所述金属底材外表面上的宽度为15-200μm，所述狭缝在所述金属底材内表面上的宽度为20-250μm， 且所述狭缝在所述金属底材内表面上的宽度与所述狭缝在所述金属底材外表面上的宽度的比值为(1.05-1.4)：1。
  13. 根据权利要求11所述的金属外壳的制备方法，其特征在于，所述狭缝在所述金属底材外表面上的宽度为15-200μm，所述狭缝在所述金属底材内表面上的宽度为20-220μm，且所述狭缝在所述金属底材内表面上的宽度与所述狭缝在所述金属底材外表面上的宽度的比值为(1.1-1.35)：1。
  14. 根据权利要求1所述的金属外壳的制备方法，其特征在于，在步骤2)中，所述塑料支撑层是通过对所述金属底材内表面进行注塑树脂形成的。
  15. 根据权利要求1-14任一所述的金属外壳的制备方法，其特征在于，在步骤3)中，所述装饰层通过电泳、微弧氧化、阳极氧化、硬质阳极和喷涂中的一种或多种形成。
  16. 一种用于通讯设备的金属外壳，其特征在于，所述金属外壳是通过权利要求1-15任一项所述的方法制备的。
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