WO2016084126A1 - Electronic component mounting apparatus - Google Patents

Electronic component mounting apparatus Download PDF

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Publication number
WO2016084126A1
WO2016084126A1 PCT/JP2014/081045 JP2014081045W WO2016084126A1 WO 2016084126 A1 WO2016084126 A1 WO 2016084126A1 JP 2014081045 W JP2014081045 W JP 2014081045W WO 2016084126 A1 WO2016084126 A1 WO 2016084126A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
suction nozzle
inspection
inspection device
mounting machine
Prior art date
Application number
PCT/JP2014/081045
Other languages
French (fr)
Japanese (ja)
Inventor
昌弘 竹田
英矢 黒田
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2016561108A priority Critical patent/JP6522650B2/en
Priority to PCT/JP2014/081045 priority patent/WO2016084126A1/en
Publication of WO2016084126A1 publication Critical patent/WO2016084126A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Definitions

  • This specification relates to an electronic component mounting machine for mounting electronic components on a circuit board.
  • Japanese Unexamined Patent Application Publication No. 2013-143538 describes an electronic component mounting machine.
  • this electronic component mounting machine if any abnormality (error) occurs while mounting the electronic component, part of the work that would otherwise be performed in the next process is being performed while the abnormal part is being recovered. Do it in advance. As a result, the work time of the next process performed after the abnormal part is recovered is shortened.
  • examples of abnormalities include a component shortage error, a mark recognition error, a component suction error, and a component recognition error.
  • productivity can be improved compared to stopping the electronic component mounting machine immediately after an abnormality occurs by performing a part of the work of the next process while recovering the abnormal part. Can be made. However, it may take a long time to recover the abnormal part. The next process work that can be done during the recovery is limited. Therefore, it is inevitable that the electronic component mounting machine stops while the abnormal part is recovered. It is an object of the present specification to provide an electronic component mounting machine with higher productivity than before.
  • the electronic component mounting machine disclosed in this specification mounts electronic components on a circuit board.
  • This electronic component mounting machine includes a plurality of inspection devices that acquire an image of an object and inspect the object based on the acquired image.
  • the mounting of the electronic component is stopped, and a failure occurs in the second inspection device of the plurality of inspection devices. Can continue to mount electronic components.
  • the mounting of the electronic component is stopped when a failure occurs in the first inspection apparatus.
  • the mounting of the electronic component is continued.
  • the productivity of the electronic component mounting machine can be improved as compared with the conventional case by continuing the production (mounting of the electronic component).
  • the appearance of the electronic component mounting machine is shown.
  • the suction head and the camera attached to the suction head are shown.
  • the flowchart of the process which an electronic component mounting machine performs is shown (1st Example).
  • the flowchart of the process which an electronic component mounting machine performs is shown (2nd Example).
  • the electronic component mounting machine mounts (mounts) electronic components on the circuit board.
  • the electronic component mounting machine may include a plurality of inspection apparatuses that acquire an image of an object and inspect the object based on the acquired image.
  • the electronic component mounting machine stops mounting the electronic component when a failure occurs in the first inspection device of the plurality of inspection devices, and when a failure occurs in the second inspection device of the plurality of inspection devices. It may be possible to continue mounting the electronic component.
  • the first inspection apparatus may inspect the state of the electronic component after the electronic component is mounted on the circuit board.
  • the second inspection apparatus may inspect the state of the electronic component before the electronic component is mounted on the circuit board.
  • the inspection apparatus that performs the essential inspection for mounting the electronic component on the circuit board is included in the plurality of inspection apparatuses included in the electronic component mounting machine.
  • the first inspection device may be an essential inspection device
  • the second inspection device may be an additional inspection device.
  • the electronic component mounting machine at least accepts only the circuit board after mounting that has been determined to be acceptable by the first inspection device.
  • the electronic component mounting machine passes the inspection of the first inspection apparatus and the circuit board that has passed both the inspection of the first inspection apparatus and the inspection of the second inspection apparatus (circuit board after mounting), and the second inspection apparatus. It is preferable that the circuit board that does not pass the inspection of the inspection apparatus is finally passed.
  • the first inspection device is an essential inspection device and the second inspection device is an additional inspection device
  • the first inspection device is in a state of an electronic component (electronic component after mounting) after the electronic component is mounted on the circuit board.
  • the second inspection apparatus may inspect the state of the electronic component before mounting the electronic component on the circuit board (electronic component before mounting).
  • the first inspection apparatus may be provided in both the process before mounting the electronic component and the process after mounting the electronic component.
  • the first inspection device may inspect position information of the electronic component and the circuit board.
  • the first inspection device there is a camera that inspects the relative position in the horizontal direction between the suction nozzle and the electronic component sucked by the suction nozzle when the electronic component is sucked by the suction nozzle.
  • the suction nozzle is a device that picks up an electronic component before mounting and picks it up from a feeder.
  • the first inspection device may inspect the relative displacement amount between the suction nozzle and the electronic component by inspecting the suction nozzle and the relative position in the horizontal direction of the electronic component sucked by the suction nozzle.
  • the camera which determines the quality of the suction state with respect to the suction nozzle of an electronic component is also mentioned as a 1st test
  • the first inspection apparatus include a camera that inspects the position in the horizontal direction of a circuit board positioned on the substrate transfer apparatus.
  • the second inspection device may inspect the shape and position of the electronic component.
  • the second inspection apparatus include the following types of side cameras.
  • Side camera that inspects the side of the electronic component that has been picked up by the suction nozzle
  • side camera that checks from the side whether the suction nozzle is picking up the electronic component
  • the suction nozzle picks up the surface to be picked up of the electronic component
  • a side camera for inspecting whether or not an electronic component is adsorbed to the suction nozzle and a side camera for inspecting the height of the electrode of the electronic component adsorbed by the suction nozzle from the side.
  • One example is a camera that inspects the shape of a part from the side.
  • a bottom camera for inspecting the state (flatness, etc.) of the bottom surface of the electronic component that is adsorbed by the adsorption nozzle a camera for inspecting the shape of the adsorption nozzle from the lower side in the vertical direction, and a feeder (mounting)
  • a camera for inspecting the position of the electronic component in the apparatus that accommodates the previous electronic component.
  • the electronic component mounting machine may include a notification unit that notifies that a failure has occurred when a failure occurs in the first inspection device and / or when a failure occurs in the second inspection device.
  • the notification unit may be a buzzer, a warning light, character information on the screen, and a combination thereof.
  • the electronic component mounting machine may be provided with a selection mode for selecting whether or not to continue mounting of the electronic component when a failure occurs in the second inspection apparatus.
  • the selection mode may be a type operated by the user when a failure occurs in the second inspection apparatus.
  • the selection mode may be of a type operated before driving the electronic component mounting machine.
  • the electronic component mounting machine may include an input unit for a user to operate the selection mode.
  • the selection mode cannot be operated by the user, and the electronic component mounting machine manufacturer operates the selection mode. It's okay.
  • the electronic component mounting machine may not be provided with the selection mode and may be programmed in advance so as to continue mounting of the electronic component even if a failure occurs in the second inspection apparatus.
  • the electronic component mounting machine 100 will be described with reference to FIGS. 1 and 2.
  • the electronic component mounting machine 100 is a device for mounting (mounting) electronic components on a circuit board.
  • the electronic component mounting machine 100 is also referred to as a surface mounter or a chip mounter.
  • two electronic component mounting machines 10 a and 10 b are fixed to the system base 12.
  • the direction in which the electronic component mounting machines 10a and 10b are arranged is the X direction, and the horizontal Y direction perpendicular to the X direction.
  • the electronic component mounting machines 10a and 10b have substantially the same structure. Therefore, in the following description, the electronic component mounting machine 10a will be described, and the description of the electronic component mounting machine 10b will be omitted.
  • the electronic component mounting machine 10 a includes a frame 20 and a plurality of first feeders 30 fixed to the frame 20.
  • the plurality of first feeders 30 are detachably attached to the frame 20.
  • Each first feeder 30 accommodates a plurality of electronic components.
  • the first feeder 30 supplies electronic components to the mounting head 22.
  • the first feeder 30 is a tape feeder that accommodates a plurality of electronic components on a carrier tape.
  • the electronic component mounting machine 10a includes two board transfer devices 26. Each substrate transport device 26 transports a circuit board (not shown) in the X direction. Each board conveyance device 26 is connected in series with the board conveyance device 26 of the electronic component mounting machine 10b.
  • the electronic component mounting machine 10a includes a mounting head 22 and a head moving device 24 that moves the mounting head 22 in the X direction and the Y direction.
  • the suction head 22 is attached to the fixture 40, and a board imaging device (camera) 42 for inspecting the position of the circuit board in the horizontal direction is also attached to the fixture 40.
  • the head moving device 24 moves the mounting head 22 in a predetermined order with respect to the plurality of first feeders 30 and the circuit board on the substrate transfer device 26.
  • the camera 42 moves with the mounting head 22.
  • the head moving device 24 moves the camera 42 in the X direction and the Y direction.
  • the camera 42 captures a mark image provided on the circuit board, so that the circuit board is actually arranged at the predetermined position.
  • the position error can be inspected.
  • the camera 42 is an example of a first inspection device.
  • the mounting head 22 is also attached with a camera for other purposes (a camera for taking an image of an electronic component) or the like (not shown).
  • the electronic component mounting machine 10a also includes a component imaging device (camera) 28.
  • a component imaging device camera 28.
  • the camera 28 captures an image of the suction nozzle attached to the mounting head 22 and the shape of the electronic component held by the suction nozzle.
  • the suction nozzle picks up and holds the electronic component from the first feeder 30 and transports and mounts it on the circuit board on the board transport device 26.
  • the board transfer device 26 sends the circuit board on which the electronic component has been mounted to the board transfer device of the electronic component mounting machine 10b.
  • the component imaging device 28 is also provided with a camera for other purposes (a side camera for photographing the suction nozzle from the side) and the like (not shown).
  • a controller 32 is provided in the upper part of the electronic component mounting machine 10b.
  • controller 32 is provided with a notification screen and a buzzer for notifying abnormality when a failure occurs in a first inspection device and a second inspection device described later.
  • Each electronic component mounting machine 10a includes an inspection device that acquires an image of an object and inspects the object based on the acquired image.
  • the plurality of inspection apparatuses are classified into a first inspection apparatus and a second inspection apparatus as follows.
  • the first inspection apparatus is an apparatus that executes inspection items essential for mounting electronic components on a circuit board.
  • the second inspection apparatus is an apparatus that executes inspection items for mounting the electronic component on the circuit board with high accuracy.
  • the electronic component mounting machine 10a is positioned as a first inspection device on a suction nozzle and a camera that inspects the relative position of the electronic component sucked by the suction nozzle in the horizontal direction, and a substrate transport device.
  • a camera for inspecting the position of the circuit board in the horizontal direction is provided.
  • the camera 28 is an example of a camera that inspects the suction nozzle and the relative position of the electronic component sucked by the suction nozzle in the horizontal direction.
  • the camera 42 is an example of a camera that inspects the position in the horizontal direction of the circuit board positioned on the substrate transport apparatus.
  • the electronic component mounting machine 10a as the second inspection device, is a side camera that inspects from the side whether the suction nozzle is sucking the electronic component, and whether the suction nozzle is sucking the surface of the electronic component to be sucked.
  • Side camera for inspecting the shape side camera for inspecting the height of the electrode of the electronic component sucked by the suction nozzle from the side, the shape of the suction nozzle and the electronic component with the suction nozzle sucking the electronic component
  • a camera that inspects the suction nozzle from the side a bottom camera that inspects the state of the bottom surface of the electronic component sucked by the suction nozzle, a camera that inspects the shape of the suction nozzle from the lower side in the vertical direction, and the position of the electronic component in the feeder It has a camera to do.
  • the operation of the electronic component mounting machine 100a will be briefly described.
  • the circuit board is carried into the electronic component mounting machine 100a by the board conveying device 26, and the circuit board stops at a predetermined position.
  • the camera 42 first inspection apparatus
  • the image processing device provided in the control device of the electronic component mounting machine 100a performs calculation / processing based on the photographed mark image, thereby recognizing the horizontal coordinate (X, Y coordinate) of the circuit board. .
  • the electronic component mounting machine 100a detects whether or not the circuit board is stopped at a predetermined position, and if the circuit board is shifted from the predetermined position and stopped.
  • the image processing apparatus may be provided in the camera 42 instead of the control device of the electronic component mounting machine 100a.
  • the suction head 22 sucks the electronic components provided in the first feeder 30.
  • a camera second inspection device: not shown
  • the image processing apparatus provided in the control device of the electronic component mounting machine 100a performs calculation / processing based on the captured image of the electronic component, whereby the horizontal coordinate (X, Y) of the electronic component in the cavity is calculated. Recognize coordinates. By recognizing the position of the electronic component in the cavity in the horizontal direction, the suction nozzle can pick up the optimum position (typically, the center of the electronic component) of the electronic component.
  • the electronic component is arrange
  • the suction nozzle is photographed using a side camera (second inspection device: not shown) attached to the component imaging device 28. Thereby, it is possible to detect whether or not the suction nozzle is sucking the electronic component, and whether or not the suction nozzle is sucking the surface to be sucked of the electronic component (whether or not a suction abnormality has occurred). Note that the height of the electrode of the electronic component sucked by the suction nozzle can also be inspected by the side camera.
  • the head moving device 24 moves the mounting head 22 to above the circuit board.
  • the mounting head 22 moves above the component imaging device (camera: first inspection device) 28 while moving to the circuit board from the position where the electronic component is sucked.
  • the camera 28 images the electronic component sucked by the suction nozzle from below the electronic component.
  • the image processing device provided in the control device of the electronic component mounting machine 100a performs calculation / processing based on the photographed suction nozzle and the image of the electronic component, so that the suction nozzle and the electron sucked by the suction nozzle are processed.
  • the relative position of the parts in the horizontal direction can be inspected.
  • the image processing apparatus may be provided in the component imaging device (camera) 28 instead of the control device of the electronic component mounting machine 100a.
  • the component imaging device 28 can also serve as a camera for inspecting the shape of the suction nozzle from the lower side in the vertical direction, a bottom surface state of the electronic component attracted by the suction nozzle, and a bottom camera for inspecting the shape of the electronic component.
  • a camera for inspecting the shape of the electronic component
  • the camera that inspects the shape of the suction nozzle from the lower side in the vertical direction, the state of the bottom surface of the electronic component, and the bottom camera that inspects the shape of the electronic component correspond to the second inspection device. That is, the component imaging device 28 can serve as both the first inspection device and the second inspection device.
  • the suction head 22 After taking an image of the electronic component with the component imaging device 28, the suction head 22 moves onto the circuit board, and the electronic component sucked by the suction nozzle is mounted on the circuit board. Thereafter, the suction nozzle is photographed using a side camera (second inspection device) attached to the component imaging device 28 described above. As a result, it is possible to detect a problem that the electronic component is not attached to the circuit board and is attracted to the suction nozzle.
  • the inspection apparatus in which the defect has occurred is the first inspection apparatus (S4).
  • the notification unit notifies that the defect has occurred in the first inspection device (S6), and stops mounting the electronic component on the circuit board. (S8). In this case, after the first inspection apparatus is restored, the driving of the electronic component mounting machine 100 is resumed.
  • the inspection apparatus in which the defect has occurred is not the first inspection apparatus (S4: NO)
  • it is determined whether or not the inspection apparatus in which the defect has occurred is the second inspection apparatus (S10). If the second inspection apparatus has not failed (S10: NO), the process returns to step S2 to determine again whether or not the inspection apparatus has a defect. If a failure has occurred in the second inspection device (S10: YES), it is determined whether or not a mode for continuing production (continuation mode) has been selected even if the second inspection device has failed (S12). .
  • the continuation mode is not selected (S10: NO)
  • the notification unit notifies that a failure has occurred in the second inspection apparatus (S14), and stops mounting the electronic component on the circuit board (S16).
  • the continuation mode is selected (S12: YES)
  • the notification unit notifies that a failure has occurred in the second inspection device (S18), and production continues.
  • the continuous mode when priority is given to improving the yield in the process, the continuous mode may be turned off.
  • the driving of the electronic component mounting machine 100 is stopped, and the production can be resumed after the second inspection apparatus is restored.
  • the electronic component can be mounted on the circuit board while always passing the inspection by the second inspection apparatus.
  • the continuation mode may be turned on. Even when the second inspection apparatus is stopped, the electronic component is continuously mounted on the substrate, so that production can be prevented from being interrupted. Even if the continuation mode is ON, if the first inspection apparatus malfunctions, production is interrupted and the first inspection apparatus is returned.
  • the circuit board on which the electronic component is mounted always passes the inspection by the first inspection device. Therefore, even if the continuation mode is ON, it is possible to suppress the yield in the process from greatly decreasing.
  • the user may select whether to continue production even if the second inspection apparatus fails, or the user may select before the electronic component mounting machine 100 is driven.
  • One hundred manufacturers may pre-program.
  • the notification unit When a failure occurs in the second inspection device (S10: YES), the notification unit notifies that a failure has occurred in the second inspection device (S30), and stops mounting electronic components on the circuit board ( S32). Thereafter, the user operates the controller 32 to determine whether or not to turn on the continuation mode (S34). The user selects the continuation mode ON if he wants to continue production without solving the problem of the second inspection apparatus, and selects the continuation mode OFF if he wants to eliminate the problem of the second inspection apparatus (or the continuation mode ON) Leave it unselected). When the continuous mode ON is selected (S34: YES), the electronic component mounting machine 100 resumes the operation of mounting the electronic component on the circuit board (S38). When the continuation mode OFF is selected (S34: NO), the electronic component mounting machine 100 remains stopped.
  • the electronic component mounting machine 100 that executes the above-described procedure, it is possible to select ON / OFF of the continuous mode when a failure occurs in the second inspection apparatus.
  • the electronic component mounting machine 100 stops when a failure occurs in the second inspection apparatus (S32)
  • the production can be continued by selecting the continuous mode ON.
  • Priority is given to improving the yield in the process (that is, the second inspection device is restored) or the production speed is given priority (ie, the second inspection device is restored) according to the production plan and production results. Not) can be selected.
  • 10a Electronic component mounting machine 10b: Electronic component mounting machine 22: Mounting head 24: Head moving device 26: Substrate transport device 32: Controller 100: Electronic component mounting device

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

This electronic component mounting apparatus mounts an electronic component on a circuit board. The electronic component mounting apparatus is provided with a plurality of inspection devices. Each of the inspection devices acquires an image of a subject, and inspects the subject on the basis of the acquired image. The electronic component mounting apparatus is capable of stopping the mounting of the electronic component when a failure occurred in a first inspection device among the inspection devices, and is capable of continuing the mounting of the electronic component when a failure occurred in a second inspection device among the inspection devices.

Description

電子部品装着機Electronic component mounting machine
　本明細書は、回路基板に電子部品を装着する電子部品装着機に関する。 This specification relates to an electronic component mounting machine for mounting electronic components on a circuit board.
　特開２０１３－１４３５３８号公報に、電子部品装着機が記載されている。この電子部品装着機では、電子部品を装着しているときに何らかの異常（エラー）が生じた場合、異常個所の復旧を行っている間に、本来であれば次工程で行う作業の一部を先行して行う。その結果、異常個所が復旧した後に行う次工程の作業時間が短くしている。特開２０１３－１４３５３８号公報では、異常の例として、部品切れエラー、マーク認識エラー、部品吸着エラー、部品認識エラー等が挙げられている。 Japanese Unexamined Patent Application Publication No. 2013-143538 describes an electronic component mounting machine. In this electronic component mounting machine, if any abnormality (error) occurs while mounting the electronic component, part of the work that would otherwise be performed in the next process is being performed while the abnormal part is being recovered. Do it in advance. As a result, the work time of the next process performed after the abnormal part is recovered is shortened. In Japanese Patent Laid-Open No. 2013-143538, examples of abnormalities include a component shortage error, a mark recognition error, a component suction error, and a component recognition error.
　上記した電子部品装着機では、異常個所の復旧を行っている間に次工程の作業の一部を行うことにより、異常が発生した後に即座に電子部品装着機を停止するよりは生産性を向上させることができる。しかしながら、異常個所の復旧には長時間を要することがある。その復旧の間に行うことができる次工程の作業は限定的である。そのため、異常個所を復旧している間、電子部品装着機が停止することは避けられない。本明細書は、従来よりも生産性の高い電子部品装着機を提供することを目的とする。 In the electronic component mounting machine described above, productivity can be improved compared to stopping the electronic component mounting machine immediately after an abnormality occurs by performing a part of the work of the next process while recovering the abnormal part. Can be made. However, it may take a long time to recover the abnormal part. The next process work that can be done during the recovery is limited. Therefore, it is inevitable that the electronic component mounting machine stops while the abnormal part is recovered. It is an object of the present specification to provide an electronic component mounting machine with higher productivity than before.
　本明細書で開示する電子部品装着機は、回路基板に電子部品を装着する。この電子部品装着機は、対象物の画像を取得し、取得した画像に基づいて対象物の検査を行う複数の検査装置を備えている。この電子部品装着機では、複数の検査装置のうちの第１検査装置に不具合が生じたときは電子部品の装着を停止し、複数の検査装置のうちの第２検査装置に不具合が生じたときは電子部品の装着を継続することが可能である。 The electronic component mounting machine disclosed in this specification mounts electronic components on a circuit board. This electronic component mounting machine includes a plurality of inspection devices that acquire an image of an object and inspect the object based on the acquired image. In this electronic component mounting machine, when a failure occurs in the first inspection device of the plurality of inspection devices, the mounting of the electronic component is stopped, and a failure occurs in the second inspection device of the plurality of inspection devices. Can continue to mount electronic components.
　上記した電子部品装着機では、第１検査装置に不具合が生じたときは電子部品の装着を停止する。しかしながら、第２検査装置に不具合が生じたときは電子部品の装着を継続する。すなわち、第１検査装置に不具合が生じたときは第１検査装置の復旧を行うものの、第２検査装置に不具合が生じたときは第２検査装置の復旧を行わずに電子部品の装着を継続することができる。特定の検査装置（第２検査装置）に不具合が生じても生産（電子部品の装着）を継続することにより、電子部品装着機の生産性を従来よりも向上させることができる。 In the electronic component mounting machine described above, the mounting of the electronic component is stopped when a failure occurs in the first inspection apparatus. However, when a failure occurs in the second inspection apparatus, the mounting of the electronic component is continued. In other words, when the first inspection device fails, the first inspection device is restored, but when the second inspection device fails, the mounting of the electronic component is continued without restoring the second inspection device. can do. Even if a problem occurs in a specific inspection device (second inspection device), the productivity of the electronic component mounting machine can be improved as compared with the conventional case by continuing the production (mounting of the electronic component).
電子部品装着機の外観を示す。The appearance of the electronic component mounting machine is shown. 吸着ヘッドと、吸着ヘッドに取り付けられているカメラを示す。The suction head and the camera attached to the suction head are shown. 電子部品装着機が実行する処理のフローチャートを示す（第１実施例）。The flowchart of the process which an electronic component mounting machine performs is shown (1st Example). 電子部品装着機が実行する処理のフローチャートを示す（第２実施例）。The flowchart of the process which an electronic component mounting machine performs is shown (2nd Example).
　以下、本明細書で開示する電子部品装着機の技術的特徴の幾つかを記す。なお、以下に記す事項は、各々単独で技術的な有用性を有している。 Hereinafter, some technical features of the electronic component mounting machine disclosed in this specification will be described. The items described below have technical usefulness independently.
　電子部品装着機は、回路基板に電子部品を装着（実装）する。電子部品装着機は、対象物の画像を取得し、取得した画像に基づいて対象物の検査を行う複数の検査装置を備えていてよい。電子部品装着機は、複数の検査装置のうちの第１検査装置に不具合が生じたときは電子部品の装着を停止し、複数の検査装置のうちの第２検査装置に不具合が生じたときは電子部品の装着を継続することが可能であってよい。 The electronic component mounting machine mounts (mounts) electronic components on the circuit board. The electronic component mounting machine may include a plurality of inspection apparatuses that acquire an image of an object and inspect the object based on the acquired image. The electronic component mounting machine stops mounting the electronic component when a failure occurs in the first inspection device of the plurality of inspection devices, and when a failure occurs in the second inspection device of the plurality of inspection devices. It may be possible to continue mounting the electronic component.
　第１検査装置は、電子部品を回路基板に装着した後の電子部品の状態を検査してよい。この場合、第２検査装置は、電子部品を回路基板に装着する前の電子部品の状態を検査してよい。回路基板に装着する前の電子部品の状態を検査することができなくても、電子部品を回路基板に装着した後の電子部品（以下、実装後の電子部品という）の状態を検査することにより、実装後の回路基板が良品であるか否かを判断することができる。第１検査装置に不具合が生じたときは電子部品の装着が停止するので、第１検査装置の検査を受けていない製品が次工程あるいは最終製品として流通することを防止することができる。 The first inspection apparatus may inspect the state of the electronic component after the electronic component is mounted on the circuit board. In this case, the second inspection apparatus may inspect the state of the electronic component before the electronic component is mounted on the circuit board. By inspecting the state of an electronic component after mounting the electronic component on the circuit board (hereinafter referred to as an electronic component after mounting) even if the state of the electronic component before mounting on the circuit board cannot be inspected Whether the circuit board after mounting is a non-defective product can be determined. When a failure occurs in the first inspection device, the mounting of the electronic components is stopped, so that it is possible to prevent a product that has not been inspected by the first inspection device from being distributed as the next process or the final product.
　電子部品装着機が備える複数の検査装置には、電子部品を回路基板に装着するための必須の検査を実行する検査装置（必須検査装置）と、電子部品をより精度よく回路基板に装着するための検査であって、電子部品を回路基板に装着するために必須ではない検査を実行する検査装置（付加的検査装置）が存在する。第１検査装置が必須検査装置であり、第２検査装置が付加的検査装置であってよい。この場合、電子部品装着機は、少なくとも第１検査装置で合格と判定された実装後の回路基板のみを最終合格とすることが好ましい。換言すると、電子部品装着機は、第１検査装置の検査及び第２検査装置の検査の双方に合格した回路基板（実装後の回路基板）と、第１検査装置の検査に合格し、第２検査装置の検査に不合格である回路基板とを最終合格とすることが好ましい。 In order to mount the electronic component on the circuit board more accurately, the inspection apparatus (essential inspection apparatus) that performs the essential inspection for mounting the electronic component on the circuit board is included in the plurality of inspection apparatuses included in the electronic component mounting machine. There is an inspection apparatus (additional inspection apparatus) that performs an inspection that is not essential for mounting an electronic component on a circuit board. The first inspection device may be an essential inspection device, and the second inspection device may be an additional inspection device. In this case, it is preferable that the electronic component mounting machine at least accepts only the circuit board after mounting that has been determined to be acceptable by the first inspection device. In other words, the electronic component mounting machine passes the inspection of the first inspection apparatus and the circuit board that has passed both the inspection of the first inspection apparatus and the inspection of the second inspection apparatus (circuit board after mounting), and the second inspection apparatus. It is preferable that the circuit board that does not pass the inspection of the inspection apparatus is finally passed.
　第１検査装置が必須検査装置であり、第２検査装置が付加的検査装置である場合、第１検査装置は電子部品を回路基板に装着した後の電子部品（実装後の電子部品）の状態を検査し、第２検査装置は電子部品を回路基板に装着する前の電子部品（実装前の電子部品）の状態を検査してよい。なお、第１検査装置は、電子部品を実装する前の工程と、電子部品を実装した後の工程の双方に設けられていてもよい。 When the first inspection device is an essential inspection device and the second inspection device is an additional inspection device, the first inspection device is in a state of an electronic component (electronic component after mounting) after the electronic component is mounted on the circuit board. The second inspection apparatus may inspect the state of the electronic component before mounting the electronic component on the circuit board (electronic component before mounting). The first inspection apparatus may be provided in both the process before mounting the electronic component and the process after mounting the electronic component.
　第１検査装置は、電子部品及び回路基板の位置情報を検査するものであってよい。以下に、第１検査装置の具体例を幾つか記す。第１検査装置として、電子部品が吸着ノズルに吸着されているときに、吸着ノズルと吸着ノズルに吸着された電子部品の水平方向における相対的な位置を検査するカメラが挙げられる。なお、吸着ノズルとは、実装前の電子部品を吸着し、フィーダから取り上げる装置のことをいう。第１検査装置は、吸着ノズルと吸着ノズルに吸着された電子部品の水平方向における相対的な位置を検査することにより、吸着ノズルと電子部品の相対的なずれ量を検査してもよい。また、第１検査装置として、電子部品の吸着ノズルに対する吸着状態の良否を判定するカメラも挙げられる。第１検査装置として、基板搬送装置上に位置決めされた回路基板の、水平方向における位置を検査するカメラも挙げられる。 The first inspection device may inspect position information of the electronic component and the circuit board. Several specific examples of the first inspection apparatus will be described below. As the first inspection device, there is a camera that inspects the relative position in the horizontal direction between the suction nozzle and the electronic component sucked by the suction nozzle when the electronic component is sucked by the suction nozzle. The suction nozzle is a device that picks up an electronic component before mounting and picks it up from a feeder. The first inspection device may inspect the relative displacement amount between the suction nozzle and the electronic component by inspecting the suction nozzle and the relative position in the horizontal direction of the electronic component sucked by the suction nozzle. Moreover, the camera which determines the quality of the suction state with respect to the suction nozzle of an electronic component is also mentioned as a 1st test | inspection apparatus. Examples of the first inspection apparatus include a camera that inspects the position in the horizontal direction of a circuit board positioned on the substrate transfer apparatus.
　第２検査装置は、電子部品の形状・位置等を検査するものであってよい。以下に、第２検査装置の具体例を幾つか記す。第２検査装置として、次のタイプの側面カメラが挙げられる。吸着ノズルに吸着された状態の電子部品の側面を検査する側面カメラ、吸着ノズルが電子部品を吸着しているか否かを側面から検査する側面カメラ、吸着ノズルが電子部品の吸着すべき面を吸着しているか否かを検査する側面カメラ、吸着ノズルに吸着された電子部品の電極の高さを側面から検査するための側面カメラ、吸着ノズルが電子部品を吸着している状態の吸着ノズルと電子部品の形状を側面から検査するカメラが挙げられる。また、第２検査装置として、吸着ノズルに吸着された状態の電子部品の底面の状態（平坦度等）を検査する底面カメラ、鉛直方向下側から吸着ノズルの形状を検査するカメラ、フィーダ（実装前の電子部品を収容する装置）内の電子部品の位置を検査するためのカメラが挙げられる。 The second inspection device may inspect the shape and position of the electronic component. Several specific examples of the second inspection apparatus will be described below. Examples of the second inspection apparatus include the following types of side cameras. Side camera that inspects the side of the electronic component that has been picked up by the suction nozzle, side camera that checks from the side whether the suction nozzle is picking up the electronic component, and the suction nozzle picks up the surface to be picked up of the electronic component A side camera for inspecting whether or not an electronic component is adsorbed to the suction nozzle, and a side camera for inspecting the height of the electrode of the electronic component adsorbed by the suction nozzle from the side. One example is a camera that inspects the shape of a part from the side. Also, as a second inspection device, a bottom camera for inspecting the state (flatness, etc.) of the bottom surface of the electronic component that is adsorbed by the adsorption nozzle, a camera for inspecting the shape of the adsorption nozzle from the lower side in the vertical direction, and a feeder (mounting) There is a camera for inspecting the position of the electronic component in the apparatus that accommodates the previous electronic component.
　電子部品装着機は、第１検査装置に不具合が生じたとき、及び／又は、第２検査装置に不具合が生じたときに、不具合が生じていることを報知する報知部を備えていてよい。報知部は、ブザー、警告灯、画面への文字情報、及びこれらの複合であってよい。 The electronic component mounting machine may include a notification unit that notifies that a failure has occurred when a failure occurs in the first inspection device and / or when a failure occurs in the second inspection device. The notification unit may be a buzzer, a warning light, character information on the screen, and a combination thereof.
　電子部品装着機は、第２検査装置に不具合が生じたときに、電子部品の装着を継続するか否かを選択する選択モードを備えていてよい。選択モードは、第２検査装置に不具合が生じたときに、ユーザーが操作するタイプであってよい。あるいは、選択モードは、電子部品装着機を駆動する前に操作するタイプであってもよい。電子部品装着機を駆動する前に選択モードを操作するタイプの場合、電子部品装着機は、ユーザーが選択モードの操作を行うための入力部を備えていてよい。また、電子部品装着機を駆動する前に選択モードを操作するタイプの場合、ユーザーによる選択モードの操作は行うことができず、電子部品装着機の製造者が選択モードの操作を行うタイプであってよい。なお、電子部品装着機は、選択モードを備えておらず、第２検査装置に不具合が生じても電子部品の装着を継続するように予めプログラムされたものであってもよい。 The electronic component mounting machine may be provided with a selection mode for selecting whether or not to continue mounting of the electronic component when a failure occurs in the second inspection apparatus. The selection mode may be a type operated by the user when a failure occurs in the second inspection apparatus. Alternatively, the selection mode may be of a type operated before driving the electronic component mounting machine. In the case of a type in which the selection mode is operated before driving the electronic component mounting machine, the electronic component mounting machine may include an input unit for a user to operate the selection mode. In the case of a type in which the selection mode is operated before driving the electronic component mounting machine, the selection mode cannot be operated by the user, and the electronic component mounting machine manufacturer operates the selection mode. It's okay. The electronic component mounting machine may not be provided with the selection mode and may be programmed in advance so as to continue mounting of the electronic component even if a failure occurs in the second inspection apparatus.
　図１及び図２を参照し、電子部品装着機１００について説明する。電子部品装着機１００は、回路基板に電子部品を実装（装着）する装置である。電子部品装着機１００は、表面実装機又はチップマウンタとも称される。電子部品装着機１００では、２個の電子部品装着機１０ａ、１０ｂが、システムベース１２に固定されている。以下、電子部品装着機１０ａ、１０ｂが並ぶ方向をＸ方向とし、それに垂直な水平方向なＹ方向とする。 The electronic component mounting machine 100 will be described with reference to FIGS. 1 and 2. The electronic component mounting machine 100 is a device for mounting (mounting) electronic components on a circuit board. The electronic component mounting machine 100 is also referred to as a surface mounter or a chip mounter. In the electronic component mounting machine 100, two electronic component mounting machines 10 a and 10 b are fixed to the system base 12. Hereinafter, the direction in which the electronic component mounting machines 10a and 10b are arranged is the X direction, and the horizontal Y direction perpendicular to the X direction.
　電子部品装着機１０ａ及び１０ｂは、実質的に同じ構造を有している。そのため、以下の説明では電子部品装着機１０ａを説明し、電子部品装着機１０ｂの説明を省略する。電子部品装着機１０ａは、フレーム２０と、フレーム２０に固定された複数の第１フィーダ３０を備えている。複数の第１フィーダ３０は、フレーム２０に着脱可能に取り付けられている。各々の第１フィーダ３０は、複数の電子部品を収容している。第１フィーダ３０は、装着ヘッド２２へ電子部品を供給する。第１フィーダ３０は、複数の電子部品をキャリアテープに収容するテープ式フィーダである。 The electronic component mounting machines 10a and 10b have substantially the same structure. Therefore, in the following description, the electronic component mounting machine 10a will be described, and the description of the electronic component mounting machine 10b will be omitted. The electronic component mounting machine 10 a includes a frame 20 and a plurality of first feeders 30 fixed to the frame 20. The plurality of first feeders 30 are detachably attached to the frame 20. Each first feeder 30 accommodates a plurality of electronic components. The first feeder 30 supplies electronic components to the mounting head 22. The first feeder 30 is a tape feeder that accommodates a plurality of electronic components on a carrier tape.
　電子部品装着機１０ａは、２個の基板搬送装置２６を備えている。各々の基板搬送装置２６は、回路基板（図示省略）をＸ方向へ搬送する。各々の基板搬送装置２６は、電子部品装着機１０ｂの基板搬送装置２６と一連に接続される。電子部品装着機１０ａは、装着ヘッド２２と、装着ヘッド２２をＸ方向及びＹ方向に移動させるヘッド移動装置２４を備えている。吸着ヘッド２２は、固定具４０に取り付けられており、回路基板の水平方向における位置を検査する基板撮像装置（カメラ）４２も固定具４０に取り付けられている。ヘッド移動装置２４は、複数の第１フィーダ３０及び基板搬送装置２６上の回路基板に対して、装着ヘッド２２を所定の順序で移動させる。カメラ４２は、装着ヘッド２２とともに移動する。すなわち、ヘッド移動装置２４が、カメラ４２をＸ方向及びＹ方向に移動させる。基板搬送装置２６が回路基板を所定の位置に配置した後、カメラ４２が回路基板に設けられているマーク画像を撮影することにより、上記所定の位置に対して実際に回路基板が配置されている位置の誤差を検査することができる。カメラ４２は、第１検査装置の一例である。なお、装着ヘッド２２には、他の目的のカメラ（電子部品の画像を撮影するカメラ）等も取り付けられている（図示省略）。 The electronic component mounting machine 10a includes two board transfer devices 26. Each substrate transport device 26 transports a circuit board (not shown) in the X direction. Each board conveyance device 26 is connected in series with the board conveyance device 26 of the electronic component mounting machine 10b. The electronic component mounting machine 10a includes a mounting head 22 and a head moving device 24 that moves the mounting head 22 in the X direction and the Y direction. The suction head 22 is attached to the fixture 40, and a board imaging device (camera) 42 for inspecting the position of the circuit board in the horizontal direction is also attached to the fixture 40. The head moving device 24 moves the mounting head 22 in a predetermined order with respect to the plurality of first feeders 30 and the circuit board on the substrate transfer device 26. The camera 42 moves with the mounting head 22. That is, the head moving device 24 moves the camera 42 in the X direction and the Y direction. After the substrate transfer device 26 arranges the circuit board at a predetermined position, the camera 42 captures a mark image provided on the circuit board, so that the circuit board is actually arranged at the predetermined position. The position error can be inspected. The camera 42 is an example of a first inspection device. The mounting head 22 is also attached with a camera for other purposes (a camera for taking an image of an electronic component) or the like (not shown).
　電子部品装着機１０ａは、部品撮像装置（カメラ）２８も備えている。カメラ２８は、装着ヘッド２２がカメラ２８の上方を通過するときに、装着ヘッド２２に取り付けられている吸着ノズルの画像、及び、吸着ノズルに保持されている電子部品の形状を撮像する。吸着ノズルは、第１フィーダ３０から電子部品を取り上げて保持し、基板搬送装置２６上の回路基板へ搬送して装着する。基板搬送装置２６は、電子部品の装着が完了した回路基板を、電子部品装着機１０ｂの基板搬送装置に送り出す。なお、部品撮像装置２８には、他の目的のカメラ（吸着ノズルを側方から撮影する側面カメラ）等も取り付けられている（図示省略）。電子部品装着機１０ｂの上部にコントローラ３２が設けられている。電子部品装着機１０ａ，１０ｂに対する各種設定は、コントローラ３２に入力することができる。また、コントローラ３２には、後述する第１検査装置，第２検査装置に不具合が生じたときに、異常を報知する報知画面、ブザーが設けられている。 The electronic component mounting machine 10a also includes a component imaging device (camera) 28. When the mounting head 22 passes over the camera 28, the camera 28 captures an image of the suction nozzle attached to the mounting head 22 and the shape of the electronic component held by the suction nozzle. The suction nozzle picks up and holds the electronic component from the first feeder 30 and transports and mounts it on the circuit board on the board transport device 26. The board transfer device 26 sends the circuit board on which the electronic component has been mounted to the board transfer device of the electronic component mounting machine 10b. The component imaging device 28 is also provided with a camera for other purposes (a side camera for photographing the suction nozzle from the side) and the like (not shown). A controller 32 is provided in the upper part of the electronic component mounting machine 10b. Various settings for the electronic component mounting machines 10 a and 10 b can be input to the controller 32. In addition, the controller 32 is provided with a notification screen and a buzzer for notifying abnormality when a failure occurs in a first inspection device and a second inspection device described later.
　各々の電子部品装着機１０ａは、対象物の画像を取得し、取得した画像に基づいて対象物の検査を行う検査装置を備えている。複数の検査装置は、次のように、第１検査装置と第２検査装置に分類される。第１検査装置は、電子部品を回路基板に装着する上で必須の検査項目を実行する装置である。また、第２検査装置は、電子部品を回路基板に高精度に装着するための検査項目を実行する装置である。具体的には、電子部品装着機１０ａは、第１検査装置として、吸着ノズルと吸着ノズルに吸着された電子部品の水平方向における相対的な位置を検査するカメラ、基板搬送装置上に位置決めされた回路基板の水平方向における位置を検査するカメラを備えている。カメラ２８は、吸着ノズルと吸着ノズルに吸着された電子部品の水平方向における相対的な位置を検査するカメラの一例である。カメラ４２は、基板搬送装置上に位置決めされた回路基板の水平方向における位置を検査するカメラの一例である。また、電子部品装着機１０ａは、第２検査装置として、吸着ノズルが電子部品を吸着しているか否かを側面から検査する側面カメラ、吸着ノズルが電子部品の吸着すべき面を吸着しているか否かを検査する側面カメラ、吸着ノズルに吸着された電子部品の電極の高さを側面から検査するための側面カメラ、吸着ノズルが電子部品を吸着している状態の吸着ノズルと電子部品の形状を側面から検査するカメラ、吸着ノズルに吸着された状態の電子部品の底面の状態を検査する底面カメラ、鉛直方向下側から吸着ノズルの形状を検査するカメラ、フィーダ内の電子部品の位置を検査するためのカメラを備えている。 Each electronic component mounting machine 10a includes an inspection device that acquires an image of an object and inspects the object based on the acquired image. The plurality of inspection apparatuses are classified into a first inspection apparatus and a second inspection apparatus as follows. The first inspection apparatus is an apparatus that executes inspection items essential for mounting electronic components on a circuit board. The second inspection apparatus is an apparatus that executes inspection items for mounting the electronic component on the circuit board with high accuracy. Specifically, the electronic component mounting machine 10a is positioned as a first inspection device on a suction nozzle and a camera that inspects the relative position of the electronic component sucked by the suction nozzle in the horizontal direction, and a substrate transport device. A camera for inspecting the position of the circuit board in the horizontal direction is provided. The camera 28 is an example of a camera that inspects the suction nozzle and the relative position of the electronic component sucked by the suction nozzle in the horizontal direction. The camera 42 is an example of a camera that inspects the position in the horizontal direction of the circuit board positioned on the substrate transport apparatus. In addition, the electronic component mounting machine 10a, as the second inspection device, is a side camera that inspects from the side whether the suction nozzle is sucking the electronic component, and whether the suction nozzle is sucking the surface of the electronic component to be sucked. Side camera for inspecting the shape, side camera for inspecting the height of the electrode of the electronic component sucked by the suction nozzle from the side, the shape of the suction nozzle and the electronic component with the suction nozzle sucking the electronic component A camera that inspects the suction nozzle from the side, a bottom camera that inspects the state of the bottom surface of the electronic component sucked by the suction nozzle, a camera that inspects the shape of the suction nozzle from the lower side in the vertical direction, and the position of the electronic component in the feeder It has a camera to do.
　電子部品装着機１００ａの動作について簡単に説明する。基板搬送装置２６により回路基板が電子部品装着機１００ａに搬入され、所定の位置で回路基板が停止する。回路基板が停止すると、吸着ヘッド２２に取り付けられたカメラ４２（第１検査装置）が、回路基板に設けられているマーク画像を撮影する。電子部品装着機１００ａの制御装置に設けられている画像処理装置が、撮影されたマーク画像に基づいて演算・処理を行うことにより、回路基板の水平方向の座標（Ｘ，Ｙ座標）を認識する。すなわち、電子部品装着機１００ａは、回路基板が所定の位置に停止しているか否か、回路基板が所定の位置からずれて停止している場合はそのずれ量を検出する。なお、画像処理装置は、電子部品装着機１００ａの制御装置ではなく、カメラ４２内に設けてもよい。 The operation of the electronic component mounting machine 100a will be briefly described. The circuit board is carried into the electronic component mounting machine 100a by the board conveying device 26, and the circuit board stops at a predetermined position. When the circuit board stops, the camera 42 (first inspection apparatus) attached to the suction head 22 captures a mark image provided on the circuit board. The image processing device provided in the control device of the electronic component mounting machine 100a performs calculation / processing based on the photographed mark image, thereby recognizing the horizontal coordinate (X, Y coordinate) of the circuit board. . In other words, the electronic component mounting machine 100a detects whether or not the circuit board is stopped at a predetermined position, and if the circuit board is shifted from the predetermined position and stopped. The image processing apparatus may be provided in the camera 42 instead of the control device of the electronic component mounting machine 100a.
　次に、吸着ヘッド２２が第１フィーダ３０に設けられている電子部品を吸着する。このときに、吸着ヘッド２２に取り付けられているカメラ（第２検査装置：図示省略）が、第１フィーダ３０のテープのキャビティ内における電子部品を撮影する。電子部品装着機１００ａの制御装置に設けられている画像処理装置が、撮影された電子部品の画像に基づいて演算・処理を行うことにより、キャビティ内における電子部品の水平方向の座標（Ｘ，Ｙ座標）を認識する。キャビティ内における電子部品の水平方向の位置を認識することにより、吸着ノズルは、電子部品の吸着すべき最適の位置（典型的に、電子部品の中央）を吸着することができる。 Next, the suction head 22 sucks the electronic components provided in the first feeder 30. At this time, a camera (second inspection device: not shown) attached to the suction head 22 images the electronic component in the tape cavity of the first feeder 30. The image processing apparatus provided in the control device of the electronic component mounting machine 100a performs calculation / processing based on the captured image of the electronic component, whereby the horizontal coordinate (X, Y) of the electronic component in the cavity is calculated. Recognize coordinates. By recognizing the position of the electronic component in the cavity in the horizontal direction, the suction nozzle can pick up the optimum position (typically, the center of the electronic component) of the electronic component.
　なお、電子部品は、キャビティ内の所定の位置に配置されており、電子部品装着機１００ａの制御装置は、電子部品が配置される位置を記憶している。そのため、理論的には、キャビティ内における電子部品の水平方向の位置（Ｘ，Ｙ座標）を認識する必要はない。しかしながら、実際には、キャビティ内における電子部品の位置の誤差，テープの引き出し長さの誤差により、電子部品が配置される位置にずれが生じる。キャビティ内における電子部品を撮影することにより、電子部品が配置されている位置のずれを補償し、吸着ノズルが電子部品の吸着すべき最適の位置を吸着することができる（少なくとも、吸着位置のずれを低減することができる）。 In addition, the electronic component is arrange | positioned in the predetermined position in a cavity, and the control apparatus of the electronic component mounting machine 100a has memorize | stored the position where an electronic component is arrange | positioned. Therefore, theoretically, it is not necessary to recognize the horizontal position (X, Y coordinate) of the electronic component in the cavity. However, in reality, the position where the electronic component is arranged is shifted due to an error in the position of the electronic component in the cavity and an error in the length of the tape drawn out. By photographing the electronic component in the cavity, the displacement of the position where the electronic component is arranged can be compensated, and the suction nozzle can pick up the optimum position to be sucked by the electronic component (at least the displacement of the suction position) Can be reduced).
　次に、部品撮像装置２８に取り付けられている側面カメラ（第２検査装置：図示省略）を用いて、吸着ノズルを撮影する。これにより、吸着ノズルが電子部品を吸着しているか否か、吸着ノズルが電子部品の吸着すべき面を吸着しているか否か（吸着異常が生じているか否か）を検出することができる。なお、側面カメラにより、吸着ノズルに吸着されている電子部品の電極の高さを検査することもできる。 Next, the suction nozzle is photographed using a side camera (second inspection device: not shown) attached to the component imaging device 28. Thereby, it is possible to detect whether or not the suction nozzle is sucking the electronic component, and whether or not the suction nozzle is sucking the surface to be sucked of the electronic component (whether or not a suction abnormality has occurred). Note that the height of the electrode of the electronic component sucked by the suction nozzle can also be inspected by the side camera.
　吸着ノズルが電子部品を吸着した後、ヘッド移動装置２４は、装着ヘッド２２を回路基板の上方まで移動させる。装着ヘッド２２は、電子部品を吸着した位置から回路基板に移動する途中で部品撮像装置（カメラ：第１検査装置）２８の上方に移動する。カメラ２８は、電子部品の下方から、吸着ノズルに吸着された電子部品を撮影する。電子部品装着機１００ａの制御装置に設けられている画像処理装置が、撮影された吸着ノズルと、電子部品の画像に基づいて演算・処理を行うことにより、吸着ノズルと吸着ノズルに吸着された電子部品の水平方向における相対的な位置を検査することができる。吸着ノズルと電子部品の水平方向における相対的な位置を検査することにより、吸着ノズルと電子部品の相対的なずれ量を検査することができ、電子部品を回路基板の適切な位置に装着することができる。なお、画像処理装置は、電子部品装着機１００ａの制御装置ではなく、部品撮像装置（カメラ）２８内に設けてもよい。 After the suction nozzle picks up the electronic component, the head moving device 24 moves the mounting head 22 to above the circuit board. The mounting head 22 moves above the component imaging device (camera: first inspection device) 28 while moving to the circuit board from the position where the electronic component is sucked. The camera 28 images the electronic component sucked by the suction nozzle from below the electronic component. The image processing device provided in the control device of the electronic component mounting machine 100a performs calculation / processing based on the photographed suction nozzle and the image of the electronic component, so that the suction nozzle and the electron sucked by the suction nozzle are processed. The relative position of the parts in the horizontal direction can be inspected. By inspecting the relative position of the suction nozzle and the electronic component in the horizontal direction, the relative displacement between the suction nozzle and the electronic component can be inspected, and the electronic component is mounted at an appropriate position on the circuit board. Can do. The image processing apparatus may be provided in the component imaging device (camera) 28 instead of the control device of the electronic component mounting machine 100a.
　部品撮像装置２８は、鉛直方向下側から吸着ノズルの形状を検査するカメラ、吸着ノズルに吸着された状態の電子部品の底面の状態，電子部品の形状を検査する底面カメラを兼ねることもできる。電子部品の形状を検査することにより、電子部品の吸着の有無、適切な電子部品を吸着しているか否か、電子部品の適切な面を吸着しているか否か、を検査することができる。なお、上記したように、鉛直方向下側から吸着ノズルの形状を検査するカメラ、電子部品の底面の状態，電子部品の形状を検査する底面カメラは、第２検査装置に該当する。すなわち、部品撮像装置２８は、第１検査装置と第２検査装置を兼ねることができる。 The component imaging device 28 can also serve as a camera for inspecting the shape of the suction nozzle from the lower side in the vertical direction, a bottom surface state of the electronic component attracted by the suction nozzle, and a bottom camera for inspecting the shape of the electronic component. By inspecting the shape of the electronic component, it is possible to inspect whether or not the electronic component is adsorbed, whether or not an appropriate electronic component is adsorbed, and whether or not an appropriate surface of the electronic component is adsorbed. As described above, the camera that inspects the shape of the suction nozzle from the lower side in the vertical direction, the state of the bottom surface of the electronic component, and the bottom camera that inspects the shape of the electronic component correspond to the second inspection device. That is, the component imaging device 28 can serve as both the first inspection device and the second inspection device.
　部品撮像装置２８で電子部品の画像を撮影した後、吸着ヘッド２２が回路基板上に移動し、吸着ノズルで吸着している電子部品を回路基板に装着する。その後、上記した部品撮像装置２８に取り付けられている側面カメラ（第２検査装置）を用いて、吸着ノズルを撮影する。これにより、電子部品が回路基板に装着されずに、吸着ノズルに吸着されているという不具合を検出することができる。 After taking an image of the electronic component with the component imaging device 28, the suction head 22 moves onto the circuit board, and the electronic component sucked by the suction nozzle is mounted on the circuit board. Thereafter, the suction nozzle is photographed using a side camera (second inspection device) attached to the component imaging device 28 described above. As a result, it is possible to detect a problem that the electronic component is not attached to the circuit board and is attracted to the suction nozzle.
（第１実施例）
　図３を参照し、電子部品装着機１００が実行する処理について説明する。本実施例では、電子部品装着機１００が動作を開始する前に、第２検査装置が不具合を起こしても生産を継続するか否かが予め選択されている場合の処理について説明する。 (First embodiment)
Processing executed by the electronic component mounting machine 100 will be described with reference to FIG. In the present embodiment, a description will be given of processing in a case where whether or not to continue production is selected in advance even if the second inspection apparatus malfunctions before the electronic component mounting machine 100 starts operation.
　検査装置に不具合が発生したことを検知すると（Ｓ２：ＹＥＳ）、不具合が発生した検査装置が第１検査装置であるか否かを判定する（Ｓ４）。不具合が発生した検査装置が第１検査装置の場合（Ｓ４：ＹＥＳ）、第１検査装置に不具合が発生したことを報知部で報知し（Ｓ６）、電子部品を回路基板に装着することを停止する（Ｓ８）。この場合、第１検査装置の復旧を行った後に、電子部品装着機１００の駆動を再開する。 When it is detected that a defect has occurred in the inspection apparatus (S2: YES), it is determined whether or not the inspection apparatus in which the defect has occurred is the first inspection apparatus (S4). When the inspection device in which the defect has occurred is the first inspection device (S4: YES), the notification unit notifies that the defect has occurred in the first inspection device (S6), and stops mounting the electronic component on the circuit board. (S8). In this case, after the first inspection apparatus is restored, the driving of the electronic component mounting machine 100 is resumed.
　不具合が発生した検査装置が第１検査装置ではない場合（Ｓ４：ＮＯ）、不具合が発生した検査装置が第２検査装置であるか否かを判定する（Ｓ１０）。第２検査装置が不具合を起こしていない場合（Ｓ１０：ＮＯ）、ステップＳ２に戻り、検査装置に不具合が生じているか否かをあらためて判定する。第２検査装置に不具合が発生している場合（Ｓ１０：ＹＥＳ）、第２検査装置が不具合を起こしても生産を継続するモード（継続モード）が選択されているか否かを判定する（Ｓ１２）。継続モードが選択されていない場合（Ｓ１０：ＮＯ）、第２検査装置に不具合が発生したことを報知部で報知し（Ｓ１４）、電子部品を回路基板に装着することを停止する（Ｓ１６）。継続モードが選択されている場合（Ｓ１２：ＹＥＳ）、第２検査装置に不具合が発生したことを報知部で報知し（Ｓ１８）、生産は継続する。 When the inspection apparatus in which the defect has occurred is not the first inspection apparatus (S4: NO), it is determined whether or not the inspection apparatus in which the defect has occurred is the second inspection apparatus (S10). If the second inspection apparatus has not failed (S10: NO), the process returns to step S2 to determine again whether or not the inspection apparatus has a defect. If a failure has occurred in the second inspection device (S10: YES), it is determined whether or not a mode for continuing production (continuation mode) has been selected even if the second inspection device has failed (S12). . When the continuation mode is not selected (S10: NO), the notification unit notifies that a failure has occurred in the second inspection apparatus (S14), and stops mounting the electronic component on the circuit board (S16). When the continuation mode is selected (S12: YES), the notification unit notifies that a failure has occurred in the second inspection device (S18), and production continues.
　上記の処置を実行する電子部品装着機１００によると、工程内の歩留まりを向上させることを優先する場合は、継続モードをＯＦＦにすればよい。第２検査装置に不具合が発生したときに電子部品装着機１００の駆動が停止し、第２検査装置を復旧した後に生産を再開することができる。常に第２検査装置による検査に合格した状態で、電子部品を回路基板に装着することができる。また、生産スピードを優先する場合は、継続モードをＯＮにすればよい。第２検査装置が停止しても、電子部品を基板に装着し続けるので、生産が中断されることを防止することができる。なお、継続モードがＯＮであっても、第１検査装置が不具合を起こした場合は生産を中断し、第１検査装置を復帰させる。電子部品を実装した回路基板は、常に第１検査装置による検査を合格している。そのため、継続モードがＯＮであっても、工程内の歩留まりが大幅に低下することは抑制することができる。 According to the electronic component mounting machine 100 that executes the above-described treatment, when priority is given to improving the yield in the process, the continuous mode may be turned off. When a failure occurs in the second inspection apparatus, the driving of the electronic component mounting machine 100 is stopped, and the production can be resumed after the second inspection apparatus is restored. The electronic component can be mounted on the circuit board while always passing the inspection by the second inspection apparatus. If priority is given to production speed, the continuation mode may be turned on. Even when the second inspection apparatus is stopped, the electronic component is continuously mounted on the substrate, so that production can be prevented from being interrupted. Even if the continuation mode is ON, if the first inspection apparatus malfunctions, production is interrupted and the first inspection apparatus is returned. The circuit board on which the electronic component is mounted always passes the inspection by the first inspection device. Therefore, even if the continuation mode is ON, it is possible to suppress the yield in the process from greatly decreasing.
　なお、上記実施例において、第２検査装置が不具合を起こしても生産を継続するか否かの選択は、電子部品装着機１００の駆動前にユーザーが選択してもよいし、電子部品装着機１００の製造者が予めプログラムしていてもよい。 In the above-described embodiment, the user may select whether to continue production even if the second inspection apparatus fails, or the user may select before the electronic component mounting machine 100 is driven. One hundred manufacturers may pre-program.
（第２実施例）
　図４を参照し、電子部品装着機１００が実行する処理の他の形態について説明する。本実施例では、第２検査装置が不具合を起こしたときに、ユーザーが生産を継続するか否かの選択を行う場合の処理について説明する。なお、本実施例において、ステップＳ２からＳ１０までは第１実施例と同一のため説明を省略する。 (Second embodiment)
With reference to FIG. 4, another form of processing executed by the electronic component mounting machine 100 will be described. In the present embodiment, a description will be given of processing in a case where the user selects whether to continue production when the second inspection apparatus malfunctions. In this embodiment, steps S2 to S10 are the same as those in the first embodiment, and the description thereof is omitted.
　第２検査装置に不具合が発生している場合（Ｓ１０：ＹＥＳ）第２検査装置に不具合が発生したことを報知部で報知し（Ｓ３０）、電子部品を回路基板に装着することを停止する（Ｓ３２）。その後、ユーザーがコントローラ３２を操作し、継続モードをＯＮするか否かを決定する（Ｓ３４）。ユーザーは、第２検査装置の不具合を解消することなく生産を継続したい場合は継続モードＯＮを選択し、第２検査装置の不具合を解消したい場合は継続モードＯＦＦを選択する（あるいは、継続モードＯＮを選択しないでそのままにしておく）。継続モードＯＮを選択した場合（Ｓ３４：ＹＥＳ）、電子部品装着機１００は電子部品を回路基板に装着する動作を再開する（Ｓ３８）。継続モードＯＦＦを選択した場合（Ｓ３４：ＮＯ）、電子部品装着機１００は停止したままである。 When a failure occurs in the second inspection device (S10: YES), the notification unit notifies that a failure has occurred in the second inspection device (S30), and stops mounting electronic components on the circuit board ( S32). Thereafter, the user operates the controller 32 to determine whether or not to turn on the continuation mode (S34). The user selects the continuation mode ON if he wants to continue production without solving the problem of the second inspection apparatus, and selects the continuation mode OFF if he wants to eliminate the problem of the second inspection apparatus (or the continuation mode ON) Leave it unselected). When the continuous mode ON is selected (S34: YES), the electronic component mounting machine 100 resumes the operation of mounting the electronic component on the circuit board (S38). When the continuation mode OFF is selected (S34: NO), the electronic component mounting machine 100 remains stopped.
　上記の処置を実行する電子部品装着機１００によると、第２検査装置に不具合が生じた時点で、継続モードのＯＮ・ＯＦＦを選択することができる。第２検査装置に不具合が生じたときに電子部品装着機１００が停止する（Ｓ３２）ものの、継続モードＯＮを選択することにより生産を継続することができる。生産計画と生産実績に応じて、工程内の歩留まりを向上させることを優先する（すなわち、第２検査装置の復旧を行う）か、生産スピードを優先する（すなわち、第２検査装置の復旧を行わない）か、を選択することができる。 According to the electronic component mounting machine 100 that executes the above-described procedure, it is possible to select ON / OFF of the continuous mode when a failure occurs in the second inspection apparatus. Although the electronic component mounting machine 100 stops when a failure occurs in the second inspection apparatus (S32), the production can be continued by selecting the continuous mode ON. Priority is given to improving the yield in the process (that is, the second inspection device is restored) or the production speed is given priority (ie, the second inspection device is restored) according to the production plan and production results. Not) can be selected.
　以上、本発明の具体例を詳細に説明したが、これらは例示にすぎず、特許請求の範囲を限定するものではない。特許請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。本明細書または図面に説明した技術要素は、単独であるいは各種の組み合わせによって技術的有用性を発揮するものであり、出願時の請求項に記載の組み合わせに限定されるものではない。また、本明細書または図面に例示した技術は複数の目的を同時に達成するものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。 Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.
１０ａ：電子部品装着機
１０ｂ：電子部品装着機
２２：装着ヘッド
２４：ヘッド移動装置
２６：基板搬送装置
３２：コントローラ
１００：電子部品装着機
  10a: Electronic component mounting machine 10b: Electronic component mounting machine 22: Mounting head 24: Head moving device 26: Substrate transport device 32: Controller 100: Electronic component mounting device

Claims (7)

  1. 　回路基板に電子部品を装着する電子部品装着機であって、
    　対象物の画像を取得し、取得した画像に基づいて対象物の検査を行う複数の検査装置を備えており、
    　前記複数の検査装置のうちの第１検査装置に不具合が生じたときは電子部品の装着を停止し、
    　前記複数の検査装置のうちの第２検査装置に不具合が生じたときは電子部品の装着を継続することが可能である、電子部品装着機。     An electronic component mounting machine for mounting electronic components on a circuit board,
    It has a plurality of inspection devices that acquire an image of the object and inspect the object based on the acquired image,
    When a failure occurs in the first inspection device among the plurality of inspection devices, the mounting of the electronic component is stopped,
    An electronic component mounting machine capable of continuing mounting of an electronic component when a failure occurs in a second inspection device of the plurality of inspection devices.
  2. 　第１検査装置は、電子部品を回路基板に装着した後の電子部品の状態を検査し、
    　第２検査装置は、電子部品を回路基板に装着する前の電子部品の状態を検査する請求項１に記載の電子部品装着機。     The first inspection device inspects the state of the electronic component after the electronic component is mounted on the circuit board,
    The electronic component mounting machine according to claim 1, wherein the second inspection device inspects the state of the electronic component before the electronic component is mounted on the circuit board.
  3. 　第１検査装置の検査及び第２検査装置の検査の双方に合格した回路基板と、
    　第１検査装置の検査に合格し、第２検査装置の検査に不合格である回路基板と、を最終合格とする請求項２に記載の電子部品装着機。     A circuit board that has passed both the inspection of the first inspection device and the inspection of the second inspection device;
    The electronic component mounting machine according to claim 2, wherein the circuit board that passes the inspection of the first inspection device and fails the inspection of the second inspection device is finally passed.
  4. 　第１検査装置は、電子部品の位置情報を検査し、
    　第２検査装置は、電子部品の形状を検査する、請求項１から３のいずれか一項に記載の電子部品装着機。     The first inspection device inspects position information of the electronic component,
    The electronic component mounting machine according to any one of claims 1 to 3, wherein the second inspection device inspects the shape of the electronic component.
  5. 　第１検査装置は、電子部品が吸着ノズルに吸着されているときに、吸着ノズルと吸着ノズルに吸着された電子部品の水平方向における相対的な位置を検査し、
    　第２検査装置は、電子部品が吸着ノズルに吸着されているときに、吸着ノズルと吸着ノズルに吸着された電子部品の少なくとも一方の鉛直方向における画像の形状を検査する、請求項１に記載の電子部品装着機。     The first inspection device inspects the relative position in the horizontal direction between the suction nozzle and the electronic component sucked by the suction nozzle when the electronic component is sucked by the suction nozzle,
    The second inspection device inspects the shape of an image in the vertical direction of at least one of the suction nozzle and the electronic component sucked by the suction nozzle when the electronic component is sucked by the suction nozzle. Electronic component mounting machine.
  6. 　第１検査装置は、電子部品が吸着ノズルに吸着されているときに、吸着ノズルと吸着ノズルに吸着された電子部品の相対的なずれ量を検査するとともに、電子部品の吸着ノズルに対する吸着状態の良否を判定し、
    　第２検査装置は、電子部品が吸着ノズルに吸着されているときに、電子部品の吸着ノズルに対する吸着状態の良否を判定する、請求項１に記載の電子部品装着機。     The first inspection device inspects the relative displacement amount between the suction nozzle and the electronic component sucked by the suction nozzle when the electronic component is sucked by the suction nozzle, and the suction state of the electronic component with respect to the suction nozzle. Judge good or bad,
    The electronic component mounting machine according to claim 1, wherein the second inspection device determines whether the suction state of the electronic component with respect to the suction nozzle is good or not when the electronic component is sucked by the suction nozzle.
  7. 　第１検査装置は、電子部品が吸着ノズルに吸着されているときに、吸着ノズルと吸着ノズルに吸着された電子部品の相対的なずれ量を検査し、
    　第２検査装置は、電子部品が吸着ノズルに吸着されるより前に、前記ずれ量を低減するための検査をする、請求項１に記載の電子部品装着機。
          The first inspection device inspects a relative shift amount between the suction nozzle and the electronic component sucked by the suction nozzle when the electronic component is sucked by the suction nozzle,
    The electronic component mounting machine according to claim 1, wherein the second inspection device performs an inspection for reducing the shift amount before the electronic component is adsorbed by the adsorption nozzle.
PCT/JP2014/081045 2014-11-25 2014-11-25 Electronic component mounting apparatus WO2016084126A1 (en)

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WO2022123773A1 (en) * 2020-12-11 2022-06-16 株式会社Fuji Suction nozzle and component mounter
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