JP2004356604A - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component Download PDF

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JP2004356604A
JP2004356604A JP2003188669A JP2003188669A JP2004356604A JP 2004356604 A JP2004356604 A JP 2004356604A JP 2003188669 A JP2003188669 A JP 2003188669A JP 2003188669 A JP2003188669 A JP 2003188669A JP 2004356604 A JP2004356604 A JP 2004356604A
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electronic component
component
mounting
polarity
tape
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JP2003188669A
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JP4403449B2 (en
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Tomohiko Hattori
友彦 服部
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a failure in mounting a component supplied from a tape by detecting the direction of polarity before suction. <P>SOLUTION: An apparatus for mounting electronic components comprises a component feeder which sends out a component feeding tape supported by a reel and puts the electronic components held in the tape to be located in a pickup position one by one, a mounting device which picks up and carries the components located in the pickup position and mounts it on a substrate, and a polarity detector which includes a camera for detecting the direction of polarity of the electronic components located in the pickup position. Pictures of the components held in the tape are took before suction to detect the directions of polarity. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板等の基板に電子部品を装着する電子部品装着装置及び電子部品装着方法に関するものであり、特に、部品を供給する手段として、リールに巻回された部品供給テープを用いる電子部品装着装置及び電子部品装着方法に関する。
【０００２】
【従来の技術】
回路基板等に電子部品を装着する電子部品装着装置において、テープ媒体に保持された部品を供給して装着する装置が広く知られている。この種の電子部品装着装置は、大略、装置本体を構成する筐体内に、基板の搬入と搬出を行なう基板搬送コンベアと、同一種類の電子部品を多数供給する部品供給テープが巻回されたリールがセットされたテープ部品供給フィーダを含んでなる部品供給装置と、部品供給装置から供給された部品を基板に装着する部品装着装置と、が設けられて構成される。
【０００３】
図５に示されるように、部品供給テープ１００は、キャリアテープ１１０とトップテープ１２０とから構成される。キャリアテープ１１０には、各々１個の部品を収容する部品収容凹部１１１がテープの延在方向に配列して複数形成されている。トップテープ１２０は、部品収容凹部１１１の開口を塞ぐべくキャリアテープ１１０の上面に貼付されており、これにより、部品収容凹部１１１に収容された電子部品は凹部から脱落することなく保持される。また、１３０は部品供給テープ１００が巻回されるリールである。なお、部品供給テープ１００は、先ず、部品充填装置によってキャリアテープ１１０の部品収容凹部１０１に電子部品を充填し、次に、トップテープ１２０をキャリアテープ１１０の上面にテーピングすることで製造されている。
【０００４】
テープ部品供給フィーダは、リール１３０を保持するリール保持機構と、テープに保持された電子部品を順次部品供給位置に位置付けるべく、テープをピックアップ位置である部品供給位置に向けて間欠送りするテープ送り機構と、キャリアテープ１１０からトップテープ１２０を剥離する剥離機構と、を含んで構成される。テープ送り機構は部品供給テープ１００を部品供給位置に向けて間欠送りすることで部品収容凹部１１１に収容された電子部品を順次部品供給位置に位置付け、剥離機構は、部品供給位置に到達する直前に部品収容凹部１１１の開口を塞いでいるトップテープ１２０を剥離し、部品収容凹部１１１に収容された電子部品がピックアップ可能な状態となるようにしている。
【０００５】
【特許文献１】
特開平９−１８１４８７号公報
【０００６】
【発明が解決しようとする課題】
上述した電子部品供給テープ１００は、様々な種類の電子部品に対応したものが利用されており、例えば、図５に示すダイオードやコンデンサ等の極性を有する電子部品Ｐｅを供給する部品供給テープ１００も存在する。この電子部品Ｐｅは、極性の方向を示す目印として部品の上面（電極が形成される面の対面）に極性マークＭｅを有しており、シルク印刷又はレーザマーキングによる刻印により形成されている。
【０００７】
電子部品Ｐｅを供給する部品供給テープ１００は、自動部品充填装置により、部品収容凹部１１１に収容される全ての部品が所定の同一の極性方向を向いてパッケージされるように製造されるが、この部品充填装置の不具合等が原因で、収容される電子部品の一部もしくは全部が所定の極性方向とは異なる姿勢で部品収容凹部１１１に収容された部品供給テープ１００も少なからず存在する。このような部品供給テープ１００から供給された電子部品は、極性方向が誤った状態で基板に実装されるおそれがあり、不良基板を生産してしまうことがあった。
【０００８】
【課題を解決するための手段】
請求項１に記載の発明は、部品供給テープに収容された電子部品をピックアップして搬送し基板に装着する電子部品装着装置であって、前記部品供給テープに収容されたピックアップされる前の電子部品の極性方向を検出する極性検出装置を備えたことを特徴とする。
【０００９】
請求項２に記載の発明は、部品供給テープに収容された電子部品をピックアップして搬送し基板上に装着する電子部品装着装置であって、リールに保持された部品供給テープを送り出し該テープに収容された電子部品を順次ピックアップ位置に位置付ける部品供給装置と、前記ピックアップ位置に位置付けられた電子部品をピックアップして搬送し基板に装着する装着装置と、前記ピックアップ位置に位置付けられた電子部品の極性方向を検出する極性検出装置と、少なくとも前記部品供給装置、前記装着装置及び前記極性検出装置を制御する制御装置と、を有することを特徴とする。
【００１０】
これらの発明によれば、部品供給テープに収容された電子部品を、ピックアップする前に、その極性方向を検出するようにしたので、部品供給装置に、電子部品が部品収容凹部内に誤った極性方向で収容された部品供給テープがセットされたとしても、実装不良などの不具合を防ぐことができる。
【００１１】
請求項３に記載の発明は、請求項２に記載の電子部品装着装置であって、前記極性検出装置は、前記ピックアップ位置に位置付けられた電子部品を撮像するカメラを含んで構成されることを特徴とする。
【００１２】
この発明によれば、極性検出装置としてカメラを利用するようにしたので、例えば、部品装着ヘッドに基板マーク認識用カメラを設けた電子部品装着装置であれば、基板マーク認識用のカメラを極性検出装置としても利用することが可能となり、装置構成を簡素化が可能となる。
【００１３】
請求項４に記載の発明は、請求項２又は３に記載の電子部品装着装置において、前記極性検出装置は、前記部品供給テープに収容された電子部品の上面に形成された極性マークを検出するものであることを特徴とする。
【００１４】
請求項５に記載の発明は、請求項２乃至４の何れか一に記載の電子部品装着装置において、前記極性検出装置で検出された電子部品の極性方向が予定された方向と異なる場合に、装着装置による装着を中止するよう制御することを特徴とする。
【００１５】
この発明によれば、電子部品供給テープに収容された電子部品の極性方向が誤っている場合には、その電子部品が実装される前に直ちに生産を中止することができるので、実装不良による不良基板の発生を未然に防止することができる。
【００１６】
請求項６に記載の発明は、請求項２乃至４の何れか一に記載の電子部品装着装置において、前記装着装置は、ピックアップした部品の角度姿勢を調整する角度姿勢調整装置を含み、前記制御装置は、前記極性検出装置で検出された電子部品の極性方向が予定された方向と異なる場合に、予定された極性方向と検出された極性方向の角度差を打ち消すように前記角度姿勢調整装置を制御することを特徴とする。
【００１７】
この発明によれば、電子部品供給テープに収容された電子部品の極性方向が誤っている場合であっても、その極性方向の誤差を修正した上で基板に実装するようにしたので、不良基板を発生させることなく基板の生産を継続することができる。
【００１８】
請求項７に記載の発明は、部品供給テープに収容された電子部品をピックアップして搬送し基板に装着する電子部品の装着方法であって、前記部品供給テープに収容された電子部品の極性方向をその部品がピックアップされる前に検出する極性検出工程を含むことを特徴とする。
【００１９】
この発明によれば、部品供給テープに収容された電子部品をピックアップする前に、その極性方向を検出するようにしたので、部品供給装置に、電子部品が部品収容凹部内に誤った極性方向で収容された部品供給テープがセットされたとしても、実装不良などの不具合を防ぐことができる。
【００２０】
【発明の実施の形態】
以下、本発明の電子部品実装装置の実施形態について図面に基づいて説明する。なお、従来技術と同一の構成については同一の符号を付与するものとする。図１は、本実施形態の電子部品実装装置の全体を示す斜視図である。同図において、１４０は部品供給テープ１００が巻回されたリールから電子部品Ｐｅを一つづつピックアップ位置に供給するフィーダであり、生産に必要な電子部品Ｐｅの種類に応じた台数がセットされて部品供給装置を構成するものである。その構成は上述した従来技術と同様である。
【００２１】
１５０は回路基板Ｂの搬出入と位置決めを行なう基板搬送装置である。１６０はフィーダ１４０から供給された電子部品Ｐｅを吸着することでピックアップするとともに、回路基板Ｂに部品を装着する部品吸着ヘッドであり、１７０は部品装着ヘッドをＸＹ方向に移動するＸＹロボットである。これら部品吸着ヘッド１６０及びＸＹロボット１７０により電子部品Ｐｅを基板に装着する装着装置が構成されている。１８０は部品吸着ヘッド１６０により吸着された電子部品Ｐｅの画像を撮像し、電子部品Ｐｅの吸着位置及び吸着姿勢を認識するＣＣＤカメラである。
【００２２】
図２は、部品吸着ヘッド１６０を示す図である。同図に示すように、部品吸着ヘッド１６０は、電子部品Ｐｅを吸着するノズル１６１とカメラ１６２とを備えて構成されている。カメラ１６２は、基板搬送装置１５０によって搬入された回路基板Ｂに形成されたの基準マークを読み取り、回路基板Ｂが位置決めされている位置を認識する基板位置認識用に用いられるとともに、フィーダ１４０のピックアップ位置ＰＰに位置付けられた電子部品Ｐｅを認識し、部品収容凹部１１１内における電子部品Ｐｅの位置及び姿勢、並びにその極性方向を認識する電子部品認識用としても用いられる。すなわち、カメラ１６２は、基板位置認識装置、又は電子電子部品認識装置もしくは極性方向認識装置を構成するものである。
【００２３】
また、部品吸着ヘッド１６０には、ノズル１６１の昇降と自転を行なわせる機構１６３が組み込まれており、予定された装着角度で電子部品Ｐｅを回路基板Ｂに装着するために、ノズル１６１に吸着された部品の吸着角度姿勢を調整する角度姿勢調整手段が構成されている。
【００２４】
次に、本実施形態の電子部品実装装置において実行される電子部品の実装方法について説明する。最初に、回路基板Ｂが基板搬送装置１５０によって搬入されて所定の位置に停止すると、ＸＹロボット１７０が部品装着ヘッド１６０を駆動して回路基板Ｂに形成された基準マークを探索し、部品装着ヘッド１６０に設けられたカメラ１６２によって基準マークを認識する。これにより、回路基板Ｂの停止した位置が確認される。
【００２５】
次に、生産プログラムに応じて生産プログラムで指定された電子部品Ｐｅを吸着して指定された位置に装着する部品装着動作が行なわれる。なお、生産プログラムは、回路基板Ｂに装着すべき電子部品Ｐｅの種類を特定するＩＤの各々に対応させて、その電子部品Ｐｅが装着される回路基板Ｂ上の位置及び装着角度を示す装着情報と、その電子部品Ｐｅを供給するフィーダ１４０を特定するフィーダ特定情報と、その電子部品Ｐｅが供給される際の正規の極性方向を示す供給姿勢情報と、が指定されてなるものであり、図示しない電子部品実装装置の制御部によって実行されるものである。
【００２６】
まず、ＸＹロボット１７０が駆動され、部品装着ヘッド１６０がフィーダ特定情報によって指定されたフィーダ１４０の近傍に位置付けられる。次いで、図３に示されるように、カメラ１６２によってピックアップ位置ＰＰに位置付けられている部品収容凹部１１１内の電子部品Ｐｅを撮像して、電子部品Ｐｅの上面に形成された極性マークＭｅの位置を認識し、部品収容凹部１１１内に収容された電子部品Ｐｅの極性方向を確認する極性方向認識工程が行なわれる。次いで、認識された極性方向と供給姿勢情報とを比較する極性方向比較工程が行なわれる。
【００２７】
比較の結果、極性方向が一致しているのであれば、電子部品Ｐｅは所定の極性方向に向いた正しい姿勢で部品収容凹部１１１に収容されていることとなるので、そのまま電子部品Ｐｅの回路基板Ｂへの装着が続行される。すなわち、カメラ１６２で撮像されたばかりの電子部品Ｐｅをノズル１６１で吸着してピックアップし、ＸＹロボット１７０を駆動して部品装着ヘッドを回路基板Ｂまで搬送し、電子部品Ｐｅを所定の装着位置に装着するまでの作業が行なわれる。
【００２８】
しかし、極性方向が一致しない場合は、電子部品Ｐｅは所定の極性方向とは異なる誤った姿勢で部品収容凹部１１１に収容されていることとなるので、そのまま生産を続行すると不良基板が生産されるおそれがあることから、カメラ１６２で認識した電子部品Ｐｅの回路基板Ｂへの装着を行なう前に生産を停止し、作業者に向けて図示しない警告手段等により極性方向が不適切である旨の警告を行ない、作業者に部品供給テープ１００が巻回されたリール１３０の交換などの保守作業を促す。
【００２９】
このように本発明の実施形態によれば、部品供給テープ１００に収容された電子部品Ｐｅをピックアップする前にその極性方向を検出するようにしたので、部品収容凹部１１１内に電子部品Ｐｅが誤った極性方向で収容された部品供給テープ１００がセットされたとしても、実装不良などの不具合を未然に防ぐことが可能となる。また、極性方向の検出は、部品装着ヘッド１６０に装備されたカメラ１６２によって行なうこととしたので、カメラ１６２による撮像完了後直ちにノズル１６１での吸着を行なうことができ、多大な時間を要することなく極性検出を実行することができる。また、カメラ１６２は、回路基板Ｂに形成された基準マークの認識用カメラを兼務することができるので、装置コストを増大させることなく極性検出を行なうことができる。
【００３０】
以上、本発明の主たる実施形態について説明したが、本発明の主旨を逸脱しない範囲であれば様々な応用が可能である。上述した実施形態においては、極性方向比較工程において極性方向が一致しない場合に、直ちに生産を停止し警告を発していたが、この態様に限られることはなく、確認された極性方向と生産プログラムの供給姿勢情報で予定された極性方向との角度差を打ち消すように、角度姿勢調整装置を駆動させてから、回路基板Ｂに装着するようにしても良い。この態様によれば、供給される電子部品Ｐｅの極性方向が誤っていたとしても、装置を停止することなく、生産を続行することが可能となる。
【００３１】
また、カメラ１６２によって電子部品Ｐｅの極性方向を認識する極性方向認識工程及び極性方向比較工程は、ピックアップ位置ＰＰに位置付けられた全ての電子部品Ｐｅに対して実行しても良いが、その場合に限られることはなく、新たなリール１３０を備えたフィーダ１４０がセットされた場合にそのリール１３０から供給される最初の部品についてだけ実行するようにしても良い。電子部品Ｐｅが誤った極性方向でパッケージされた部品供給テープ１００が製造される原因は、部品供給テープ１００の製造に携わる作業者が上述した自動部品充填装置の充填方向を誤設定したためであることが多いが、このようにして製造された部品供給テープ１００の不良品は、全ての電子部品Ｐｅが同一の誤った極性方向を向いて収容されるため、その部品供給テープ１００に収容された電子部品Ｐｅの最初の一つの極性方向を認識するだけで、不良か否かを判断できるからである。
【００３２】
この実施形態によれば、極性方向認識工程及び極性方向比較工程は一の部品供給テープ１００に対して一回行なうだけで良く、例えば、あらたにセットされたフィーダ１４０に対してのみ極性方向認識工程及び極性方向比較工程を行なうようにすれば良いから、先の実施形態に比べて、動作が簡略化し生産時間の短縮を成し遂げることができる。
【００３３】
また、極性方向認識工程において、電子部品Ｐｅの極性方向を認識することのほかに、ピックアップ位置に位置付けられた部品収容凹部１１１内における電子部品Ｐｅの位置、姿勢についても認識するようにしても良い。
【００３４】
【発明の効果】
以上のとおり、本発明の電子部品装着装置及び電子部品装着方法によれば、部品供給テープに収容された電子部品を、ピックアップする前に、その極性方向を検出するようにしたので、部品供給装置に、電子部品が部品収容凹部内に誤った極性方向で収容された部品供給テープがセットされたとしても、実装不良などの不具合を防ぐことができる。
【図面の簡単な説明】
【図１】本発明の実施形態の電子部品実装装置を示す概略図。
【図２】部品吸着ヘッドを示す図。
【図３】本発明の実施形態の極性認識工程を示す図。
【図４】部品供給テープのリールを示す図。
【図５】極性部品を示す図。
【符号の説明】
１００ 部品供給テープ
１３０ リール
１４０ フィーダ
１６０ 部品吸着ヘッド
１６１ ノズル
１６２ カメラ
１７０ ＸＹロボット
Ｐｅ 電子部品
Ｍｅ 極性マーク[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and electronic component mounting method for mounting an electronic component on a substrate such as a circuit board, and in particular, an electronic device using a component supply tape wound around a reel as a means for supplying the component. The present invention relates to a component mounting apparatus and an electronic component mounting method.
[0002]
[Prior art]
2. Description of the Related Art In an electronic component mounting apparatus that mounts electronic components on a circuit board or the like, devices that supply and mount components held on a tape medium are widely known. This type of electronic component mounting apparatus is generally a reel in which a substrate carrying conveyor for carrying in and out substrates and a component supply tape for supplying a large number of electronic components of the same type are wound in a housing constituting the apparatus main body. A component supply device including a tape component supply feeder on which is set, and a component mounting device for mounting a component supplied from the component supply device on a substrate are provided.
[0003]
As shown in FIG. 5, the component supply tape 100 includes a carrier tape 110 and a top tape 120. The carrier tape 110 is formed with a plurality of component receiving recesses 111 each storing one component arranged in the extending direction of the tape. The top tape 120 is affixed to the upper surface of the carrier tape 110 so as to close the opening of the component housing recess 111, whereby the electronic component housed in the component housing recess 111 is held without dropping from the recess. Reference numeral 130 denotes a reel on which the component supply tape 100 is wound. The component supply tape 100 is manufactured by first filling electronic components into the component receiving recess 101 of the carrier tape 110 by a component filling device, and then taping the top tape 120 on the upper surface of the carrier tape 110. .
[0004]
The tape component supply feeder includes a reel holding mechanism that holds the reel 130 and a tape feeding mechanism that intermittently feeds the tape toward a component supply position that is a pickup position in order to sequentially position electronic components held on the tape at the component supply position. And a peeling mechanism for peeling the top tape 120 from the carrier tape 110. The tape feeding mechanism intermittently feeds the component supply tape 100 toward the component supply position to sequentially position the electronic components accommodated in the component accommodation recess 111 at the component supply position, and the peeling mechanism immediately before reaching the component supply position. The top tape 120 that closes the opening of the component housing recess 111 is peeled off so that the electronic component housed in the component housing recess 111 can be picked up.
[0005]
[Patent Document 1]
JP-A-9-181487 [0006]
[Problems to be solved by the invention]
The electronic component supply tape 100 described above is used for various types of electronic components. For example, the component supply tape 100 for supplying an electronic component Pe having a polarity such as a diode or a capacitor shown in FIG. Exists. This electronic component Pe has a polarity mark Me on the upper surface of the component (facing the surface on which the electrode is formed) as a mark indicating the direction of polarity, and is formed by marking by silk printing or laser marking.
[0007]
The component supply tape 100 for supplying the electronic component Pe is manufactured by an automatic component filling device so that all components accommodated in the component accommodating recess 111 are packaged in a predetermined same polarity direction. Due to the malfunction of the component filling device and the like, there are not a few component supply tapes 100 in which some or all of the electronic components to be accommodated are accommodated in the component accommodating recess 111 in a posture different from the predetermined polarity direction. The electronic component supplied from such a component supply tape 100 may be mounted on the substrate in a state where the polarity direction is wrong, which may produce a defective substrate.
[0008]
[Means for Solving the Problems]
The invention according to claim 1 is an electronic component mounting apparatus that picks up an electronic component accommodated in a component supply tape, conveys the electronic component, and mounts the electronic component on a substrate. The electronic component is accommodated in the component supply tape before being picked up. A polarity detection device for detecting the polarity direction of the component is provided.
[0009]
According to a second aspect of the present invention, there is provided an electronic component mounting apparatus for picking up and transporting an electronic component accommodated in a component supply tape and mounting the electronic component on a substrate. A component supply device that sequentially positions the received electronic components at the pickup position, a mounting device that picks up and conveys the electronic components positioned at the pickup position, and mounts them on the substrate, and the polarity of the electronic components positioned at the pickup position A polarity detection device that detects a direction, and a control device that controls at least the component supply device, the mounting device, and the polarity detection device.
[0010]
According to these inventions, since the polarity direction of the electronic component accommodated in the component supply tape is detected before the electronic component is picked up, the electronic component is misplaced in the component accommodation recess in the component supply device. Even if the component supply tape accommodated in the direction is set, problems such as mounting defects can be prevented.
[0011]
A third aspect of the present invention is the electronic component mounting apparatus according to the second aspect, wherein the polarity detection device includes a camera that images the electronic component positioned at the pickup position. Features.
[0012]
According to the present invention, since the camera is used as the polarity detection device, for example, in the case of an electronic component mounting device in which a substrate mark recognition camera is provided on the component mounting head, the polarity detection is performed on the substrate mark recognition camera. It can also be used as an apparatus, and the apparatus configuration can be simplified.
[0013]
According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to the second or third aspect, the polarity detection device detects a polarity mark formed on an upper surface of the electronic component accommodated in the component supply tape. It is characterized by being.
[0014]
The invention according to claim 5 is the electronic component mounting device according to any one of claims 2 to 4, wherein the polarity direction of the electronic component detected by the polarity detection device is different from the planned direction. It is characterized by controlling to stop the mounting by the mounting device.
[0015]
According to this invention, when the polarity direction of the electronic component accommodated in the electronic component supply tape is wrong, the production can be stopped immediately before the electronic component is mounted. Generation | occurrence | production of a board | substrate can be prevented beforehand.
[0016]
According to a sixth aspect of the present invention, in the electronic component mounting device according to any one of the second to fourth aspects, the mounting device includes an angular posture adjusting device that adjusts an angular posture of a picked-up component, and the control is performed. When the polarity direction of the electronic component detected by the polarity detection device is different from the planned direction, the device adjusts the angular attitude adjustment device so as to cancel the angular difference between the planned polarity direction and the detected polarity direction. It is characterized by controlling.
[0017]
According to the present invention, even if the polarity direction of the electronic component housed in the electronic component supply tape is wrong, the error in the polarity direction is corrected and mounted on the substrate. The production of the substrate can be continued without generating.
[0018]
The invention according to claim 7 is a mounting method of an electronic component that picks up and conveys an electronic component accommodated in the component supply tape, and mounts the electronic component on a substrate, wherein the polarity direction of the electronic component accommodated in the component supply tape is And a polarity detection step of detecting the component before the component is picked up.
[0019]
According to the present invention, since the polarity direction is detected before the electronic component accommodated in the component supply tape is picked up, the electronic component is in the wrong polarity direction in the component accommodating recess. Even if the housed component supply tape is set, problems such as mounting defects can be prevented.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component mounting apparatus of the present invention will be described based on the drawings. In addition, the same code | symbol shall be provided about the same structure as a prior art. FIG. 1 is a perspective view showing the entire electronic component mounting apparatus according to the present embodiment. In the figure, reference numeral 140 denotes a feeder that supplies electronic components Pe one by one from a reel on which the component supply tape 100 is wound to a pickup position, and the number corresponding to the type of electronic components Pe required for production is set. This constitutes a component supply device. The configuration is the same as that of the above-described prior art.
[0021]
Reference numeral 150 denotes a board transfer device for carrying in / out and positioning of the circuit board B. Reference numeral 160 denotes a component suction head for picking up the electronic component Pe supplied from the feeder 140 and picking it up and mounting the component on the circuit board B. Reference numeral 170 denotes an XY robot that moves the component mounting head in the XY directions. The component suction head 160 and the XY robot 170 constitute a mounting device for mounting the electronic component Pe on the substrate. A CCD camera 180 captures an image of the electronic component Pe sucked by the component suction head 160 and recognizes the suction position and suction posture of the electronic component Pe.
[0022]
FIG. 2 is a diagram showing the component suction head 160. As shown in the figure, the component suction head 160 includes a nozzle 161 and a camera 162 for sucking the electronic component Pe. The camera 162 reads a reference mark formed on the circuit board B carried in by the board transfer device 150 and is used for recognizing the position where the circuit board B is positioned, and also picks up the feeder 140. The electronic component Pe positioned at the position PP is recognized, and the electronic component Pe is also used for recognizing the position and posture of the electronic component Pe in the component receiving recess 111 and the polarity direction thereof. That is, the camera 162 constitutes a substrate position recognition device, an electronic / electronic component recognition device, or a polarity direction recognition device.
[0023]
In addition, the component suction head 160 incorporates a mechanism 163 that moves the nozzle 161 up and down and rotates, so that the electronic component Pe is mounted on the circuit board B at a predetermined mounting angle. An angle posture adjusting means for adjusting the suction angle posture of the component is configured.
[0024]
Next, an electronic component mounting method executed in the electronic component mounting apparatus of the present embodiment will be described. First, when the circuit board B is carried in by the board conveying device 150 and stopped at a predetermined position, the XY robot 170 drives the component mounting head 160 to search for a reference mark formed on the circuit board B, and the component mounting head. The reference mark is recognized by the camera 162 provided at 160. Thereby, the stopped position of the circuit board B is confirmed.
[0025]
Next, a component mounting operation is performed in which the electronic component Pe specified by the production program is sucked and mounted at the specified position according to the production program. The production program corresponds to each ID for specifying the type of electronic component Pe to be mounted on the circuit board B, and mounting information indicating the position and mounting angle on the circuit board B on which the electronic component Pe is mounted. And feeder specifying information for specifying the feeder 140 that supplies the electronic component Pe, and supply attitude information indicating a normal polarity direction when the electronic component Pe is supplied are designated, It is executed by the control unit of the electronic component mounting apparatus that does not.
[0026]
First, the XY robot 170 is driven, and the component mounting head 160 is positioned in the vicinity of the feeder 140 specified by the feeder specifying information. Next, as shown in FIG. 3, the electronic component Pe in the component housing recess 111 positioned at the pickup position PP is imaged by the camera 162, and the position of the polarity mark Me formed on the upper surface of the electronic component Pe is determined. A polarity direction recognition step of recognizing and confirming the polarity direction of the electronic component Pe housed in the component housing recess 111 is performed. Next, a polarity direction comparison step for comparing the recognized polarity direction with the supply posture information is performed.
[0027]
As a result of the comparison, if the polar directions are the same, the electronic component Pe is housed in the component housing recess 111 in a correct posture facing the predetermined polarity direction, and thus the circuit board of the electronic component Pe as it is. Installation on B continues. That is, the electronic component Pe just picked up by the camera 162 is picked up and picked up by the nozzle 161, the XY robot 170 is driven to transport the component mounting head to the circuit board B, and the electronic component Pe is mounted at a predetermined mounting position. The work up to is done.
[0028]
However, if the polar directions do not match, the electronic component Pe is housed in the component housing recess 111 in a wrong posture different from the predetermined polarity direction, and thus a defective board is produced if production is continued as it is. Since there is a risk, the production is stopped before mounting the electronic component Pe recognized by the camera 162 to the circuit board B, and the polarity direction is inappropriate for the worker by a warning means (not shown). A warning is issued to prompt the operator to perform maintenance work such as replacement of the reel 130 around which the component supply tape 100 is wound.
[0029]
As described above, according to the embodiment of the present invention, since the polarity direction is detected before the electronic component Pe accommodated in the component supply tape 100 is picked up, the electronic component Pe is incorrectly in the component accommodating recess 111. Even if the component supply tape 100 accommodated in the polarity direction is set, it is possible to prevent problems such as mounting defects. In addition, since the detection of the polarity direction is performed by the camera 162 mounted on the component mounting head 160, the suction by the nozzle 161 can be performed immediately after completion of imaging by the camera 162, without requiring much time. Polarity detection can be performed. Further, since the camera 162 can also serve as a reference mark recognition camera formed on the circuit board B, polarity detection can be performed without increasing the cost of the apparatus.
[0030]
As mentioned above, although main embodiment of this invention was described, various applications are possible if it is the range which does not deviate from the main point of this invention. In the embodiment described above, when the polarity direction does not match in the polarity direction comparison step, the production is immediately stopped and a warning is issued. However, the embodiment is not limited to this, and the confirmed polarity direction and the production program The angle / orientation adjusting device may be driven and then mounted on the circuit board B so as to cancel out the angle difference with the polarity direction planned in the supply / orientation information. According to this aspect, even if the polarity direction of the supplied electronic component Pe is incorrect, production can be continued without stopping the apparatus.
[0031]
Further, the polarity direction recognition step and the polarity direction comparison step for recognizing the polarity direction of the electronic component Pe by the camera 162 may be executed for all the electronic components Pe positioned at the pickup position PP. The present invention is not limited, and when the feeder 140 having the new reel 130 is set, only the first part supplied from the reel 130 may be executed. The reason why the component supply tape 100 in which the electronic component Pe is packaged in the wrong polarity direction is manufactured is that an operator who is engaged in the manufacture of the component supply tape 100 has erroneously set the filling direction of the automatic component filling apparatus described above. However, the defective part supply tape 100 manufactured in this way is stored in the same component supply tape 100 because all the electronic parts Pe are stored in the same wrong polarity direction. This is because it is possible to determine whether or not it is defective only by recognizing the first one polarity direction of the component Pe.
[0032]
According to this embodiment, the polarity direction recognition step and the polarity direction comparison step need only be performed once for one component supply tape 100, for example, the polarity direction recognition step only for a newly set feeder 140. In addition, since it is sufficient to perform the polarity direction comparison step, the operation can be simplified and the production time can be shortened as compared with the previous embodiment.
[0033]
Further, in the polarity direction recognition step, in addition to recognizing the polarity direction of the electronic component Pe, the position and orientation of the electronic component Pe in the component receiving recess 111 positioned at the pickup position may be recognized. .
[0034]
【The invention's effect】
As described above, according to the electronic component mounting apparatus and the electronic component mounting method of the present invention, since the electronic component accommodated in the component supply tape is detected before the pickup, the component supply device In addition, even if the component supply tape in which the electronic component is accommodated in the component accommodation recess in the wrong polarity direction is set, it is possible to prevent problems such as mounting defects.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram showing a component suction head.
FIG. 3 is a diagram showing a polarity recognition step according to the embodiment of the present invention.
FIG. 4 is a diagram showing a reel of a component supply tape.
FIG. 5 is a diagram showing polar parts.
[Explanation of symbols]
100 Component supply tape 130 Reel 140 Feeder 160 Component suction head 161 Nozzle 162 Camera 170 XY robot Pe Electronic component Me Polarity mark

Claims (7)

部品供給テープに収容された電子部品をピックアップして搬送し基板に装着する電子部品装着装置であって、
前記部品供給テープに収容されたピックアップされる前の電子部品の極性方向を検出する極性検出装置を備えたことを特徴とする電子部品装着装置。An electronic component mounting apparatus for picking up and transporting an electronic component housed in a component supply tape and mounting it on a substrate,
An electronic component mounting apparatus comprising a polarity detection device for detecting a polarity direction of an electronic component accommodated in the component supply tape before being picked up. 部品供給テープに収容された電子部品をピックアップして搬送し基板上に装着する電子部品装着装置であって、
リールに保持された部品供給テープを送り出し該テープに収容された電子部品を順次ピックアップ位置に位置付ける部品供給装置と、前記ピックアップ位置に位置付けられた電子部品をピックアップして搬送し基板に装着する装着装置と、前記ピックアップ位置に位置付けられた電子部品の極性方向を検出する極性検出装置と、少なくとも前記部品供給装置、前記装着装置及び前記極性検出装置を制御する制御装置と、を有することを特徴とする電子部品装着装置。An electronic component mounting apparatus for picking up and transporting an electronic component housed in a component supply tape and mounting it on a substrate,
A component supply device for feeding a component supply tape held on a reel and sequentially positioning electronic components accommodated in the tape at a pickup position, and a mounting device for picking up and conveying the electronic components positioned at the pickup position and mounting them on a substrate And a polarity detection device that detects a polarity direction of the electronic component positioned at the pickup position, and a control device that controls at least the component supply device, the mounting device, and the polarity detection device. Electronic component mounting device. 前記極性検出装置は、前記ピックアップ位置に位置付けられた電子部品を撮像するカメラを含んで構成されることを特徴とする請求項２に記載の電子部品装着装置。The electronic component mounting apparatus according to claim 2, wherein the polarity detection device includes a camera that captures an image of the electronic component positioned at the pickup position. 前記極性検出装置は、前記部品供給テープに収容された電子部品の上面に形成された極性マークを検出するものであることを特徴とする請求項２又は３に記載の電子部品装着装置。4. The electronic component mounting apparatus according to claim 2, wherein the polarity detection device detects a polarity mark formed on an upper surface of the electronic component accommodated in the component supply tape. 前記制御装置は、前記極性検出装置で検出された電子部品の極性方向が予定された方向と異なる場合に、装着装置による装着を中止するよう制御することを特徴とする請求項２乃至４の何れか一に記載の電子部品装着装置。5. The control device according to claim 2, wherein when the polarity direction of the electronic component detected by the polarity detection device is different from a predetermined direction, the control device controls to stop the mounting by the mounting device. The electronic component mounting apparatus according to claim 1. 前記装着装置は、ピックアップした部品の角度姿勢を調整する角度姿勢調整装置を含み、前記制御装置は、前記極性検出装置で検出された電子部品の極性方向が予定された方向と異なる場合に、予定された極性方向と検出された極性方向の角度差を打ち消すように前記角度姿勢調整装置を制御することを特徴とする請求項２乃至４の何れか一に記載の電子部品装着装置。The mounting device includes an angle posture adjustment device that adjusts an angle posture of a picked-up component, and the control device is scheduled when the polarity direction of the electronic component detected by the polarity detection device is different from the planned direction. 5. The electronic component mounting apparatus according to claim 2, wherein the angle posture adjustment device is controlled so as to cancel an angle difference between the detected polarity direction and the detected polarity direction. 6. 部品供給テープに収容された電子部品をピックアップして搬送し基板に装着する電子部品の装着方法であって、
前記部品供給テープに収容された電子部品の極性方向をその部品がピックアップされる前に検出する極性検出工程を含むことを特徴とする電子部品の装着方法。An electronic component mounting method for picking up and transporting an electronic component housed in a component supply tape and mounting it on a substrate,
An electronic component mounting method comprising: a polarity detection step of detecting a polarity direction of an electronic component accommodated in the component supply tape before the component is picked up.
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