WO2016074404A1 - Remote fluorescent powder lens and manufacturing method and application thereof - Google Patents

Remote fluorescent powder lens and manufacturing method and application thereof Download PDF

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Publication number
WO2016074404A1
WO2016074404A1 PCT/CN2015/074686 CN2015074686W WO2016074404A1 WO 2016074404 A1 WO2016074404 A1 WO 2016074404A1 CN 2015074686 W CN2015074686 W CN 2015074686W WO 2016074404 A1 WO2016074404 A1 WO 2016074404A1
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WO
WIPO (PCT)
Prior art keywords
phosphor
resin
remote phosphor
remote
solid curved
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PCT/CN2015/074686
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French (fr)
Chinese (zh)
Inventor
殷江
陆建新
卢伟
殷俊
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江苏脉锐光电科技有限公司
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Publication of WO2016074404A1 publication Critical patent/WO2016074404A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Definitions

  • the present invention relates to the field of illumination technologies, and in particular, to a remote phosphor lens, a manufacturing method thereof and an application thereof
  • COB integrated Chip On Board is to bond a plurality of blue LED light-emitting chips on a metal-based or ceramic substrate, and then electrically connect the blue LED chip to the circuit of the substrate by using a gold wire.
  • the mixture of LED yellow phosphor and silica gel is coated on the blue LED chip and cured.
  • the appropriate voltage or current is applied to the electrical connection line of the COB integrated light source, part of the blue light emitted by the blue LED chip excites the phosphor to emit yellow light, and after mixing with the blue light emitted by the blue LED chip, white light can be obtained.
  • the COB integrated light source also called COB surface light source, is a planar package structure.
  • the COB integrated white light source itself has the characteristics of high power density.
  • the blue chip works, a large amount of heat is generated.
  • the large amount of heat generated by the phosphor being excited by the blue light emitted by the LED chip is also transmitted to the chip, and the heat cannot be in a small space.
  • Distributing in time, the LED blue chip and the phosphor are always at a high working temperature, resulting in a decrease in the luminous efficiency of the chip, and at the same time, the luminous intensity of the phosphor is gradually attenuated, thereby causing a decrease in the luminous efficiency of the light source.
  • the refractive index of silica gel is generally between 1.4 and 1.7, and the refractive index of air is about 1, so part of the yellow light emitted by the phosphor in the silica gel layer and part of the blue light emitted by the LED blue chip are as long as the incident angle is greater than a certain critical angle. , total reflection occurs at the silica gel/air interface, re-entering the silica gel layer, reducing the light extraction efficiency of the light source. These partially reflected light rays are absorbed by the chip or phosphor and released as heat.
  • the illumination angle of the light source is also limited due to its inherent package structure.
  • the present invention provides a remote phosphor lens and a manufacturing method thereof and applications thereof.
  • a remote phosphor lens according to the present invention comprises a hemispherical composite curved surface structure, as shown in FIG.
  • the compound-like hemispherical composite curved surface structure is a composite of a shell 3 having a large radius of curvature and a solid curved surface body 4 having a small radius of curvature; the cross-section of the composite curved surface structure may be a circular shape with a large radius of curvature
  • the circular cross section of the casing 3 and the solid curved body 4 having a small radius of curvature shares a center O.
  • the housing 3 has an outer surface 1 and an inner surface 2; the outer surface 1 of the housing 3 may be a spherical surface, or a paraboloid or any smooth convex surface; the thickness of the housing 3 may be uniform or may be based on the final The application environment is adjusted; the thickness of the casing 3 ranges from 50 micrometers to 3 millimeters; the inner surface 2 of the casing 3 is completely identical to the surface physical shape of the solid curved surface body 4, and may be a spherical surface, or a paraboloid or any smooth surface; The surface of the curved body 4 completely conforms to the inner surface 2 of the casing 3 having a large radius of curvature.
  • the housing 3 having a larger radius of curvature is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles;
  • the transparent organic substrate A is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC.
  • Enhanced PMMA or MS resin, or silica gel specifically, depending on the ambient temperature environment used.
  • the phosphor B is an LED yellow phosphor, or a mixture of an LED green phosphor and an LED red phosphor, or a mixture of an LED yellow phosphor and a small amount of LED red phosphor;
  • the solid curved surface body 4 with a small radius of curvature is a transparent organic material C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin, or silica gel; can be selected according to the ambient temperature environment.
  • the material base A of the casing 3 and the material C of the solid curved body 4 may be the same or different.
  • the organic matrix A of the casing 3 and the material C of the solid curved body 4 have the same or similar refractive index to avoid light. Transmission loss
  • the remote phosphor housing 3 having the larger radius of curvature may further comprise a double layer structure, as shown in FIG. 2, the double layer structure comprises a composite structure of the remote phosphor housing 5 and the remote phosphor housing 6;
  • the outer surface 7 of the body 6 is exactly the same as the physical surface of the inner surface of the casing 5, and the materials used are also the same; the thickness of the casing 6 and the casing 5 may be the same or different; the casing 5 contains the organic substrate A. a mixture with the phosphor D, the housing 6 comprising a mixture of the organic substrate A and the phosphor E;
  • the placement order or the respective thicknesses of the above two-layer and two-layer remote phosphor housings have a certain influence on the light-emitting quality of the LED light-emitting device, so it is necessary to thickness of each of the above-mentioned remote phosphor housings.
  • the arrangement between each other is optimized for design. Taking the remote phosphor lens of FIG. 2 as an example, the phosphor E in the remote phosphor housing 6 is a green phosphor, and the phosphor D in the remote phosphor housing 5 is a red phosphor.
  • the blue light emitted by the blue chip first enters the solid curved body 4 and then passes out from the surface 9 of the solid curved body 4 to enter the remote phosphor housings 5 and 6, respectively.
  • the green phosphor E in the remote phosphor housing 6 is excited by the blue light emitted by the LED blue chip to emit green light.
  • the wavelength of green light is greater than the wavelength of blue light, but less than the wavelength of red light.
  • part of the green light emitted by the green phosphor E in the remote phosphor housing 6 can excite the red phosphor D in the remote phosphor housing 5 to emit red light.
  • a portion of the blue light emitted by the LED blue chip also excites the red phosphor D in the remote phosphor housing 5 after it has penetrated the remote phosphor housing 6, causing it to be excited to emit red light.
  • the blue light emitted by the blue chip except for the remaining light for exciting the phosphor light in the remote phosphor housings 6 and 5, and the green light emitted by the phosphor E in the remote phosphor housing 6,
  • the remaining light for exciting the red phosphor D in the remote phosphor housing 5 will be mixed with the red light emitted by the blue phosphor and the green light in the remote phosphor housing 5, thereby enabling remote fluorescence
  • the outer surface 8 of the powder casing 5 emits white light. In the white light thus synthesized, the content (relative intensity) of green light is smaller than expected, and the content (relative intensity) of red light is larger than expected.
  • the green phosphor content in the remote phosphor housing 6 may be appropriately increased, and the red phosphor content in the remote phosphor housing 5 may be appropriately reduced; or may be appropriately increased.
  • the same purpose can be achieved by the thickness of the remote phosphor housing 6, and appropriately reducing the thickness of the remote phosphor housing 5.
  • the quality of the white light emitted can be finely adjusted by adjusting the thickness of each remote phosphor housing and the amount of phosphor contained therein.
  • the phosphor E in the remote phosphor housing 6 may also be an LED yellow phosphor, or an LED red phosphor, or a mixture of any two of the above phosphors; the phosphor D in the remote phosphor housing 5 may also be LED yellow fluorescent Light powder, or LED green phosphor, or a mixture of any two of the above phosphors; however, the phosphor composition of the remote phosphor housing 6 and the remote phosphor housing 5 is different.
  • the remote phosphor lens according to the present invention may further have a square umbrella-shaped convex shape structure, and the schematic view is shown in FIG.
  • the square umbrella type convex shape structure is a composite of a large remote phosphor shell 10 having a square umbrella type convex shape structure and a small square umbrella type convex shape structure solid curved body 11; a square umbrella type convex shape structure solid
  • the bottom surface of the curved body 11 is a square, and the intersections of the four sides are H, I, J, and K, respectively;
  • the square umbrella-shaped convex-shaped structure solid curved surface body 11 is a semi-cylindrical body having a line connecting the midpoints of two opposite sides JK and HI of a square, and two opposite sides IJ and KH of a square.
  • the point line is the area formed by the overlapping portion of the semi-circular cylinder of the axis; the intersection lines JL, IL, HL and KL between the two semi-cylinders are compared with the point L.
  • the intersections JL, IL, HL, and KL between the two semi-cylinders are smoothed, and the L-point becomes the center point of the four smooth-surface convergence regions.
  • the surface of the solid umbrella body 11 of the square umbrella type convex shape structure is completely identical with the inner surface of the large remote phosphor housing 10 of the square umbrella type convex shape structure, and the large remote phosphor housing 10 of the square umbrella type convex shape structure It has a uniform thickness and a thickness ranging from 50 microns to 3 mm.
  • the remote phosphor lens according to the present invention may further have a deformed semi-cylindrical shape structure, and the schematic view is shown in FIG.
  • the deformed semi-cylindrical shape structure is a composite of a large remote phosphor housing 13 having a deformed semi-cylindrical shape structure and a smaller deformed semi-cylindrical shape structure solid curved body 14; a rectangle, the intersection of the four sides is M, N, P and Q;
  • the deformed semi-cylindrical shape structure solid curved body 14 is a semi-cylindrical body with a line connecting the midpoints of two opposite sides MN and PQ of a rectangle and two opposite sides of the rectangle MQ and PN
  • the midpoint line is the area formed by the overlapping portion of the semi-circular cylinder of the axis; the intersection between the two semi-cylinders is QR, MR, PS, and NS.
  • QR, MR, PS the intersection between the two semi-cylinders.
  • the surface of the deformed semi-cylindrical solid curved body 14 is completely coincident with the inner surface of the deformed semi-cylindrical shape of the large remote phosphor housing 13, and the deformed semi-cylindrical shape of the large remote phosphor
  • the housing 13 has a uniform thickness ranging from 50 micrometers to 3 millimeters.
  • blue light refers to light having a center wavelength between 400 nm and 490 nm; the term “green light” particularly relates to light having a center wavelength between 500 nm and 560 nm; the term “yellow light” particularly relates to the center wavelength.
  • the term “red light” specifically refers to light with a center wavelength between approximately 590 nm and 650 nm;
  • the term “yellow phosphor” means light at a wavelength less than its own wavelength Excited to emit a laser-emitting material with a center wavelength between approximately 560 nm and 590 nm;
  • the term “green phosphor” is It is a luminescent material that emits laser light having a center wavelength between about 500 nm and 560 nm when excited by light having a wavelength smaller than its own wavelength;
  • the term “red luminescent phosphor” means that the wavelength is less than itself.
  • a laser-emitting luminescent material having a center wavelength between about 590 nm and 650 nm can be emitted.
  • the present invention further provides a method of manufacturing a remote phosphor lens.
  • the method for manufacturing a remote phosphor lens having a hemispherical compound curved surface structure includes the following steps:
  • Step 1 the particles of the resin C are added to the barrel of the injection molding machine to melt, and the solid curved body 4 is obtained by the injection molding process by means of the mold;
  • Step 2 the powder of the resin A and the powder of the phosphor B are thoroughly mixed, and then added to the barrel of the injection molding machine to melt, and the remote phosphor housing 3 is obtained by the injection molding process by means of the mold;
  • Step 3 The solid curved body 4 is placed in the remote phosphor housing 3, and baked in a vacuum so that the outer surface of the solid curved body 4 is sufficiently adhered to the inner surface of the remote phosphor housing 3; It is characterized in that the organic substance C and the organic substance A are softened and adhered, but the molten state is not formed.
  • Steps 2 and 3 can also be replaced by the following steps, as shown in Figure 5, as follows:
  • S301 mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture
  • the volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
  • S303 uniformly coating the slurry on the surface of the solid curved body 4, and drying the solid curved body 4 coated with the slurry at a temperature of 40 ° C to 130 ° C and a drying time of 5 minutes to 10 hours;
  • the coating process of the material includes screen printing and electrostatic spraying.
  • the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, and the baking time is 5 minutes - 20 hours.
  • the cooling time is from 20 minutes to 10 hours, and a mixed coating containing the phosphor B and the resin C is obtained on the surface of the solid curved body 4;
  • the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting of the resin A
  • the temperature is above 10 ° C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous In the vitreous body, a resin A coating containing the phosphor B can be obtained on the surface of the solid curved body 4.
  • Resin A should have better fluidity than resin C, and the glass transition temperature and melting temperature of resin A are lower than the glass transition temperature and melting temperature of resin A by 10 ° C or higher, and resin A at baking temperature T 1 .
  • the powder is softened, even close to melting, and adheres to each other on the surface of the resin C to form a uniform distribution of the continuous glass body; at this time, the phosphor B particles are separated and wrapped by the continuous glass body (resin A) to form on the surface of the solid curved body 4 A uniform Resin B coating containing Phosphor B.
  • Resin A should have a thermal expansion coefficient similar to or the same as that of resin C, so as not to be deformed from the baking temperature T 1 to room temperature, the solid curved body 4 is deformed due to the difference in thermal expansion coefficients of the two resins; there is little difference in thermal expansion coefficient
  • the two resins can fix the shape of the solid curved body 4 by means of a mold; preferably, the resin A and the resin C are different derivatives of the same resin, and the resin C coating and the solid curved body 4 are completely integrated. structure.
  • the drying process in the above step S303 can be carried out in the air or in a vacuum.
  • the baking process can be carried out in the air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire;
  • Steps S301 to S305 are repeated a plurality of times until the remote phosphor case 3 satisfies the thickness requirement.
  • the preparation process is similar.
  • a method of manufacturing a remote phosphor lens having a square umbrella-shaped convex shape structure and a deformed semi-cylindrical shape structure is similar to the above method, and only the mold used is different.
  • the method for manufacturing a remote phosphor lens having a hemispherical composite curved surface structure includes the following steps:
  • Step 1 Mix the thermosetting resin or silica gel, remove the bubbles, inject into the mold, and cure at 50 ° C ⁇ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature, to obtain a solid curved body 4;
  • Step 2 thoroughly mix the thermosetting resin or silica gel with the powder of the phosphor B, remove the bubbles, inject into the mold, cure at 50 ° C ⁇ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature to obtain the remote phosphor shell. 3;
  • Step 3 coating the inner surface of the remote phosphor housing 3 with a transparent organic glue, then placing the solid curved body 4 into the remote phosphor housing 3, and baking in a vacuum to make the outer surface of the solid curved body 4
  • the inner surface of the remote phosphor housing 3 is sufficiently fitted; the organic glue has the same or similar refractive index as the solid curved body 4 and the remote phosphor housing 3, so as to avoid loss of light transmission.
  • the preparation process is similar.
  • a method of manufacturing a remote phosphor lens having a square umbrella-shaped convex shape structure and a deformed semi-cylindrical shape structure is similar to the above method, and only the mold used is different.
  • silicon dioxide SiO 2
  • zirconium dioxide ZrO 2
  • aluminum oxide Al 2 O 3
  • SiO 2 silicon dioxide
  • the volume ratio of the phosphor to the oxide particles is from 100:1 to 100:150.
  • the inorganic oxide particles may be composed of two or more types as needed.
  • the invention also provides a white light emitting device using a remote phosphor lens, comprising a remote phosphor lens with a circular COB integrated blue light source and a hemispherical composite curved surface structure.
  • the structure of the COB integrated blue light source is as shown in FIG. 6 , and includes a substrate 16 .
  • the LED chip area (circular) on the substrate 16 is pasted with a plurality of (group) blue LED chips 20 , and the plurality of blue LED chips pass through the gold wire 21 .
  • Circuit connections on substrate 16 and 17 and 22 are electrical connection terminals for the COB integrated blue light source.
  • the LED chip area is covered with a transparent silica gel layer 19, and the thickness of the transparent silica gel layer is just enough to cover the chip and the gold wire, and the remote phosphor lens is placed on the transparent silica gel layer, and the outer side of the lens is just close to the dam 18, The silica gel is applied to the joint between the lens and the dam.
  • the COB blue light source + remote phosphor lens combination is placed in a constant temperature oven for baking and curing, the baking temperature is 50 ° C to 200 ° C, and the baking time is 10 minutes to 2.5 hours. After the oven is cooled to room temperature, the cured COB blue light source + remote phosphor lens combination is taken out to obtain the white light emitting device of the present invention, as shown in FIG.
  • the phosphor and the blue chip are a "remote phosphor" arrangement, which is different from the conventional direct coating of a mixture of phosphor and silica gel or epoxy on the surface of the blue chip, the blue chip and the phosphor There is no direct contact and there is a certain physical space.
  • the blue chip 20 emits blue light and first enters the solid curved body 4, and part of the blue light is irradiated to the remote Phosphor particles B in the phosphor shell excite the yellow light that emits a longer wavelength. In this way, part of the blue light emitted by the LED chip is mixed with the yellow light excited by the phosphor to obtain white light.
  • FIG. 8 A cross-sectional view of a COB integrated white light source with a silicone lens packaged using conventional technology is shown in Fig. 8.
  • the cross section of the silicone lens is half circular, 23 is a substrate, 24 is a blue chip, and 25 is a coated silica gel. Regions, 26 and 27 are dams, and 28 are phosphor particles coated by silica gel regions;
  • the phosphor particles 28 are excited by the blue light emitted by the blue chip to emit yellow light 32, and are incident on the lens and air interface at an incident angle ⁇ 1 .
  • the yellow light ray 33 will exit from the T point with a slightly larger refraction angle ⁇ 2 ; the phosphor particles 29 are excited by the blue light emitted by the blue chip to emit yellow light 30 At the incident angle ⁇ 3 , it is incident on the U point at the interface between the lens and the air, and the yellow ray 31 will exit from the U point with a slightly larger refraction angle ⁇ 4 .
  • FIG. 9 shows a cross-sectional view of a COB integrated white light source of a planar structure packaged by a conventional technique, wherein 23 is a substrate and 24 is a blue chip. 25 is the coated silica gel region, 26 and 27 are the dams, 28 is the phosphor particles coated by the silica gel region, and the broken line 34 is the interface between the silica gel and the air; the phosphor particles 29 corresponding to FIG. 8 are subjected to The yellow light 30 emitted by the blue light emitted by the blue chip, the yellow light 35 in FIG.
  • FIG. 10 A cross-sectional view of a white light source of a COB blue light integrated light source plus a remote phosphor lens in the present invention is shown in FIG. 10, wherein the lens has a hemispherical composite curved surface structure, and the interface between the shell and the solid curved surface body is semicircular.
  • the center of the circle is O
  • 23 is the substrate
  • 24 is the blue chip
  • 25 is the coated silica gel region
  • 26 and 27 are the dam
  • 37 is the scattering agent particles
  • the organic material of the shell and the solid curved body is silica gel, and coated with The silica gel in the chip-covered region has the same refractive index.
  • the white light source adopting the COB blue light integrated light source and the remote phosphor lens combination has completely different illumination characteristics from the COB integrated white light source with the lens packaged by the conventional technology.
  • Phosphor particles are partially blue by the blue chip
  • the yellow light (such as 39, 41, and 45) emitted by the light and the remaining blue light (such as 42) emitted by the blue chip will be diffusely scattered on the lens surface after being refracted by the scattering agent (such as 43).
  • the white light obtained after mixing will produce various emission directions, and the illumination angle is greatly increased, so that the emitted light is more evenly distributed in space, and glare is avoided.
  • the blue chip and the phosphor are not in direct contact, there is a certain spatial distance, and the phosphor is excited by the blue light emitted by the LED blue chip to emit a longer wavelength light (such as yellow light, red light, etc.).
  • a longer wavelength light such as yellow light, red light, etc.
  • the COB blue integrated light source and the remote phosphor lens are combined to form a convex curved surface at the interface between the white light source and the air, so that the LED is compared with the COB integrated white light source of the planar structure packaged by the conventional technology.
  • the blue light emitted by the blue chip and the longer wavelength light emitted by the phosphor are greatly reflected at the interface with the air and are reabsorbed into the light-emitting device, thereby greatly reducing the luminous efficiency of the light source. At the same time reduce the heat generated by the light source.
  • the white light-emitting device can greatly improve the light-emitting efficiency of the light source, the heat generation of the light source can be greatly reduced, and the operating temperature of the chip can be greatly reduced, and the luminous efficiency of the LED blue light chip can be greatly improved.
  • the phosphor is far away from the chip, and the heat generation amount of the light source is greatly reduced, so that the operating temperature of the phosphor is greatly reduced, so that the light decay is greatly reduced, and the life of the light emitting device can be greatly extended.
  • the remote phosphor is a prefabricated component, which does not generate additional stress, and the process is relatively simple, which helps to improve the yield of the product.
  • a white light emitting device using a remote phosphor lens according to the present invention is not limited to a remote phosphor lens including a circular COB integrated blue light source and a hemispherical composite curved surface structure, and may also include a The light-emitting area is a square COB integrated blue light source and a square umbrella-shaped convex-shaped remote phosphor lens, or a remote phosphor lens having a rectangular COB integrated blue light source and a deformed semi-cylindrical shape structure.
  • a white light emitting device using a COB integrated blue light source and a remote phosphor lens combination has the advantage that a phosphor is placed between the blue chip and a "remote phosphor" setting, in combination with a conventional phosphor and silica gel or epoxy.
  • the blue chip does not directly contact the phosphor, and has a certain physical space; in the white light emitting device in which the remote phosphor lens and the COB blue integrated light source are combined, the phosphor and the blue chip are One kind
  • the "remote phosphor" setting the phosphor is excited by the blue light emitted by the LED blue chip, and the longer wavelength light (such as yellow light, red light, etc.) re-enters the chip and the chance of absorption is greatly reduced, which can effectively improve the light source illumination.
  • the phosphor particles in the remote phosphor shell are randomly distributed in space, and the light is diffusely reflected between the particles, and finally the light on the surface of the remote phosphor shell can be emitted in any direction, the angle of illumination
  • the increase is large, so that the outgoing light is more evenly distributed in space, avoiding the glare phenomenon
  • the interface between the light-emitting device and the air is a convex curved surface, so compared with the conventional technology packaged planar structure COB integrated white light source, the LED blue light chip
  • the emitted light emitted by the blue light and the phosphor is stimulated by the total wavelength of the light at the interface with the air to be re-entered into the light-emitting device, the light extraction efficiency is greatly increased, the light-emitting angle is greatly increased, and the phosphor works.
  • the temperature is greatly reduced, the phosphor light decay is greatly reduced, and the luminous efficiency of the light source is greatly improved.
  • the service life of the illuminating device is greatly extended.
  • Figure 1 Schematic diagram of a hemispherical remote phosphor lens.
  • Figure 2 Schematic diagram of a remote phosphor lens constructed with a hemispherical double shell.
  • Figure 3 Schematic diagram of a remote fluorescent lens of a square umbrella-shaped convex shape structure.
  • Figure 4 Schematic diagram of a deformed semi-cylindrical shape structure remote phosphor lens.
  • Figure 5 Process flow diagram for preparing a resin-based remote phosphor housing on a solid curved surface.
  • FIG. 1 Schematic diagram of the COB blue integrated light source.
  • FIG. 7 Schematic diagram of a white light emitting device combined with a COB blue integrated light source and a remote phosphor lens.
  • Figure 8 Cross-sectional view of a COB integrated white light source with a silicone lens packaged using conventional techniques.
  • Figure 9 Cross-sectional view of a COB integrated white light source with a planar structure packaged using conventional techniques.
  • Figure 10 Cross-sectional view of a white light source with a COB blue integrated light source plus a remote phosphor lens.
  • Embodiment 1 will be specifically described with reference to FIG. 1.
  • Figure 1 is a schematic view showing the structure of a hemispherical remote phosphor lens, wherein 3 is a remote having a large radius of curvature
  • the phosphor hemispherical shell 4 is a solid hemisphere having a small radius of curvature
  • O is a spherical core common to the remote phosphor hemispherical shell 3 and the solid hemisphere 4.
  • the housing 3 has an outer surface 1 and an inner surface 2; the outer surface 1 of the housing 3 may also be a spherical surface, or a paraboloid or any smooth convex surface; the thickness of the housing 3 may be uniform or may be The final application environment is adjusted; the thickness of the casing 3 ranges from 50 micrometers to 3 millimeters; the inner surface 2 of the casing 3 is completely identical to the physical shape of the surface of the solid curved surface body 4, and may be a spherical surface, or a paraboloid or any smooth surface; The surface of the solid curved body 4 completely conforms to the inner surface 2 of the casing 3 having a large radius of curvature.
  • the housing 3 having a larger radius of curvature is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles;
  • the transparent organic substrate A is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC.
  • the phosphor B is an LED yellow phosphor, or a mixture of an LED green phosphor and an LED red phosphor, or a mixture of an LED yellow phosphor and a small amount of LED red phosphor;
  • the solid curved surface body 4 with a small radius of curvature is a transparent organic material C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin.
  • a transparent organic material C which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin.
  • the material base A of the casing 3 and the material C of the solid curved body 4 may be the same or different.
  • the organic matrix A of the casing 3 and the material C of the solid curved body 4 have the same or similar refractive index to avoid light. Transmission loss
  • Step 1 the particles of the resin C are added to the barrel of the injection molding machine to melt, and the solid curved body 4 is obtained by the injection molding process by means of the mold;
  • Step 2 the powder of the resin A and the powder of the phosphor B are thoroughly mixed, and then added to the barrel of the injection molding machine to melt, and the remote phosphor housing 3 is obtained by the injection molding process by means of the mold;
  • Step 3 The solid curved body 4 is placed in the remote phosphor housing 3, and baked in a vacuum so that the outer surface of the solid curved body 4 is sufficiently adhered to the inner surface of the remote phosphor housing 3; It is characterized in that the organic substance C and the organic substance A are softened and adhered, but the molten state is not formed.
  • Steps 2 and 3 can also be replaced by the following steps, as shown in Figure 5:
  • S301 mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture
  • the volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
  • S303 uniformly coating the slurry on the surface of the solid curved body 4, and drying the solid curved body 4 coated with the slurry at a temperature of 40 ° C to 130 ° C and a drying time of 5 minutes to 10 hours;
  • the coating process of the material includes screen printing and electrostatic spraying.
  • the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, and the baking time is 5 minutes - 20 hours.
  • the cooling time is from 20 minutes to 10 hours, and a mixed coating containing the phosphor B and the resin C is obtained on the surface of the solid curved body 4;
  • the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting of the resin A
  • the temperature is above 10 ° C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous
  • the vitreous body can obtain a resin A coating containing phosphor B on the surface of the solid curved body 4.
  • Resin A should have better fluidity than resin C, and the glass transition temperature and melting temperature of resin A are lower than the glass transition temperature and melting temperature of resin A by 10 ° C or higher, and resin A at baking temperature T 1 .
  • the powder is softened, even close to melting, and adheres to each other on the surface of the resin C to form a uniform distribution of the continuous glass body; at this time, the phosphor B particles are separated and wrapped by the continuous glass body (resin A) to form on the surface of the solid curved body 4 A uniform Resin B coating containing Phosphor B.
  • Resin A should have a thermal expansion coefficient similar to or the same as that of resin C, so as not to be deformed from the baking temperature T 1 to room temperature, the solid curved body 4 is deformed due to the difference in thermal expansion coefficients of the two resins; there is little difference in thermal expansion coefficient
  • the two resins can fix the shape of the solid curved body 4 by means of a mold; preferably, the resin A and the resin C are different derivatives of the same resin, and the resin C coating and the solid curved body 4 are completely integrated. structure.
  • the drying process in the above step S303 can be carried out in the air or in a vacuum.
  • the baking process can be carried out in the air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire;
  • Steps S301 to S305 are repeated a plurality of times until the remote phosphor case 3 satisfies the thickness requirement.
  • an appropriate amount of silica may be added to the mixed powder of the phosphor B powder and the resin A powder ( Inorganic oxide particles such as SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) act as a light-mixing effect.
  • the volume ratio of the phosphor B powder to the oxide particles is from 100:1 to 100:150.
  • the particle size of the added oxide particles can be selected according to specific practical requirements.
  • the inorganic oxide particles may be composed of two or more types as needed.
  • the blue chip 20 emits blue light and first enters the solid curved body 4, and some of the blue light is irradiated to the remote phosphor. On the phosphor particles B in the casing, it emits yellow light having a longer wavelength. In this way, part of the blue light emitted by the LED chip is mixed with the yellow light excited by the phosphor to obtain white light.
  • Inorganic oxide particles such as (SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) added to the blue light emitted from the LED blue chip 20
  • the portion of the blue light and the phosphor B particles absorbed by the phosphor B particles in the body 3 are more complexly reflected and refracted by the longer wavelength light emitted by the excitation, so that the two portions of the light are more thoroughly mixed. Therefore, a better quality white light is obtained.
  • Embodiment 3 will be specifically described with reference to FIG. 3.
  • FIG. 3 is a schematic structural view of a remote phosphor lens having a square umbrella-shaped convex shape structure, wherein the bottom surface of the solid curved surface body 11 of the square umbrella-shaped convex shape structure is a square, and the intersections of the four sides are H, I, J, and K, respectively.
  • Umbrella-shaped convex shape structure The solid curved surface body 11 is composed of a semi-cylindrical body with a line connecting the midpoint of the line segment JK and the line segment HI, and an overlapping portion of the semi-circular cylinder with the line connecting line IJ and the midpoint of the line segment HK as the axis.
  • the surface of the solid curved surface body 11 is completely identical with the inner surface of the large remote phosphor housing 10 of the square umbrella-shaped convex shape structure, and the large remote phosphor of the square umbrella-shaped convex shape structure
  • the housing 10 has a uniform thickness and a thickness in the range of 1 mm. ;
  • Step 1 Inject the silica gel into the mold and cure it at 60-150 ° C for 30 minutes to 2 hours. After cooling, the solid curved body 11 can be obtained;
  • Step 2 thoroughly mix the silica gel and the powder of the phosphor B, and then inject it into the mold after vacuuming, and then solidify at 60 to 150 ° C for 30 minutes to 2 hours, and then obtain a large remote fluorescence of the convex shape of the square umbrella shape after cooling.
  • Step 3 Applying a transparent glue to the inner surface of the large remote phosphor housing 10 of the square umbrella-shaped convex shape structure, and placing the solid curved surface body 11 into the remote phosphor housing 10, and curing at 60 to 150 ° C for 30 minutes. ⁇ 2 hours, after cooling A remote phosphor lens having a square umbrella-shaped convex shape structure can be obtained.
  • the organic glue has the same or similar refractive index as the solid curved body and the remote phosphor housing to avoid loss of light transmission.
  • Embodiment 4 will be specifically described with reference to FIGS. 6 and 7.
  • FIG. 7 is a schematic structural view of a white light emitting device combined with a COB blue light source and a remote phosphor lens
  • FIG. 6 is a schematic structural view of the COB blue integrated light source (22W) of FIG. 7, including a substrate 16, and an LED chip region on the substrate 16 is pasted.
  • a plurality of (group) blue LED chips 20, a plurality of blue LED chips being connected to circuits on the substrate 16 via gold wires 21, and 17 and 22 being electrical connection terminals of the light source.
  • the LED chip area is covered with a transparent silica gel 19, and the thickness of the transparent silica gel layer is just enough to cover the chip and the gold wire, and the remote phosphor lens is placed on the transparent silica gel layer, and the outer side of the lens is just close to the dam 18, The connection between the lens and the dam is coated with silica gel.
  • the organic matter of the solid curved body 4 and the remote phosphor case 3 in the remote phosphor lens is silica gel, and the phosphor B contains an LED green phosphor (luminescence center wavelength 554 nm) and a red phosphor (wavelength 643 nm).
  • the COB blue light source and the remote phosphor lens combination were placed in a constant temperature oven for baking and curing, the baking temperature was 100 ° C, and the baking time was 2 hours. After the oven is cooled to room temperature, the solidified COB blue light source and the remote phosphor lens are combined and taken out to obtain the white light emitting device of the present invention.

Abstract

Disclosed is a remote fluorescent powder lens, comprising a composite curved structure, wherein the composite curved structure is a composite body which has an approximately hemispherical housing (3) with a larger radius of curvature and an approximately hemispherical solid curved body (4) with a smaller radius of curvature, the cross section of the composite body being an approximate semicircle, and the approximately semicircular cross section of the housing (3) having the larger radius of curvature and that of the solid curved-surface body (4) having the smaller radius of curvature having a common circular centre, or is a composite body of a big remote fluorescent powder housing (3) having a square bottom surface and having a square umbrella type convex surface-shaped structure and a small solid curved body (4) having a square umbrella type convex surface-shaped structure, or is a composite body of a big remote fluorescent powder housing (3) having a rectangular bottom surface and having a deformed semi-cylinder-shaped structure and a small solid curved-surface body (4) having a deformed semi-cylinder-shaped structure.

Description

一种远程荧光粉透镜和制造方法及其应用Remote phosphor lens and manufacturing method and application thereof 技术领域Technical field
本发明涉及照明技术领域，尤其涉及一种远程荧光粉透镜和制造方法及其应用The present invention relates to the field of illumination technologies, and in particular, to a remote phosphor lens, a manufacturing method thereof and an application thereof
背景技术Background technique
COB集成白光光源(Chip On Board)就是将多颗蓝光LED发光芯片粘结在金属基或陶瓷基板上，然后利用金线将蓝光LED芯片与基板的线路实现电气连接。将LED黄色荧光粉与硅胶的混合物涂覆在蓝光LED芯片上并进行固化，这就是所说的COB集成光源封装，其中的硅胶层还可以对COB光源的芯片及金线起到保护作用。当给COB集成光源的电气连接线路加载适当的电压或电流后，蓝光LED芯片发出的部分蓝光激发荧光粉发出黄光，与蓝光LED芯片发出的部分蓝光混合后就可以得到白光。此外，还可以在黄色荧光粉中加入适当的LED红色荧光粉或绿色荧光粉，来调节光源的色温及显示指数。由于上述特征，COB集成光源又叫做COB面光源，是一种平面封装结构。COB integrated Chip On Board is to bond a plurality of blue LED light-emitting chips on a metal-based or ceramic substrate, and then electrically connect the blue LED chip to the circuit of the substrate by using a gold wire. The mixture of LED yellow phosphor and silica gel is coated on the blue LED chip and cured. This is the COB integrated light source package, in which the silica gel layer can also protect the chip and gold wire of the COB light source. When the appropriate voltage or current is applied to the electrical connection line of the COB integrated light source, part of the blue light emitted by the blue LED chip excites the phosphor to emit yellow light, and after mixing with the blue light emitted by the blue LED chip, white light can be obtained. In addition, an appropriate LED red phosphor or green phosphor can be added to the yellow phosphor to adjust the color temperature and display index of the light source. Due to the above characteristics, the COB integrated light source, also called COB surface light source, is a planar package structure.
COB集成白光光源本身具有高功率密度的特点，蓝光芯片工作时会产生大量的热量，荧光粉被LED芯片发出的蓝光激发所产生的大量热量也会传递给芯片，这些热量在狭小的空间内无法及时散发，使得LED蓝光芯片及荧光粉始终处于高的工作温度下，导致芯片发光效率下降，同时使得荧光粉的发光强度逐渐衰减，从而引发光源的发光效率下降。对于暖白光的COB集成光源，由于黄色荧光粉和红色荧光粉等其他荧光粉的衰减规律不一样，高的工作温度还会导致COB集成光源的色偏差。此外，在现有的COB集成光源封装技术中，荧光粉紧贴LED蓝光芯片，因此LED蓝光芯片发出的部分蓝光会重新进入芯片，在芯片中产生热效应，加剧COB集成光源的散热问题，而且降低了光源的光线提取效率。The COB integrated white light source itself has the characteristics of high power density. When the blue chip works, a large amount of heat is generated. The large amount of heat generated by the phosphor being excited by the blue light emitted by the LED chip is also transmitted to the chip, and the heat cannot be in a small space. Distributing in time, the LED blue chip and the phosphor are always at a high working temperature, resulting in a decrease in the luminous efficiency of the chip, and at the same time, the luminous intensity of the phosphor is gradually attenuated, thereby causing a decrease in the luminous efficiency of the light source. For warm white COB integrated light sources, because other phosphors such as yellow phosphors and red phosphors have different attenuation laws, high operating temperatures can also cause color deviation of COB integrated light sources. In addition, in the existing COB integrated light source packaging technology, the phosphor closely adheres to the LED blue chip, so part of the blue light emitted by the LED blue chip re-enters the chip, generating a thermal effect in the chip, aggravating the heat dissipation problem of the COB integrated light source, and reducing The light extraction efficiency of the light source.
另外，在上述传统的COB集成光源的平面封装技术中，硅胶与荧光粉混合层与空气间存在一个水平的界面。硅胶的折射率一般在1.4～1.7之间，而空气的折射率约为1，因此硅胶层中荧光粉发出的部分黄光及LED蓝光芯片发出的部分蓝光只要其入射角大于某一临界角度时，就会在硅胶/空气界面处发生全反射，重新进入硅胶层，降低了光源的光线提取效率。这些被全反射的光线部分会被芯片或荧光粉吸收以热量的形式被释放出来。In addition, in the planar packaging technology of the above-mentioned conventional COB integrated light source, there is a horizontal interface between the silica gel and the phosphor mixed layer and the air. The refractive index of silica gel is generally between 1.4 and 1.7, and the refractive index of air is about 1, so part of the yellow light emitted by the phosphor in the silica gel layer and part of the blue light emitted by the LED blue chip are as long as the incident angle is greater than a certain critical angle. , total reflection occurs at the silica gel/air interface, re-entering the silica gel layer, reducing the light extraction efficiency of the light source. These partially reflected light rays are absorbed by the chip or phosphor and released as heat.
在上述传统的COB集成光源的平面封装技术中，由于其固有的封装结构，光源的发光角度也受到一定限制。In the planar packaging technology of the above-mentioned conventional COB integrated light source, the illumination angle of the light source is also limited due to its inherent package structure.
为了提高COB集成白光光源的光线提取效率，在封装行业中出现了在COB集成白光光 源表面直接成型硅胶透镜的技术，但是这种技术目前还只用在小功率COB光源的封装中。在直接成型硅胶透镜技术的热固化工艺中，硅胶自身的应力及热收缩还会导致互联芯片间金线断裂的风险。如中国发明专利申请103681991A“用于LED封装的硅胶透镜及其制造方法”的技术中公布了一种具有不同折射率的硅胶多层结构透镜，来提高光线提取效率，并提高光线提取效率。上述改进措施尽管一定程度上提高了光线提取效率及出光角度，但是光线提取效率及出光角度提高有限，并且仍然无法解决荧光粉的衰减问题。In order to improve the light extraction efficiency of COB integrated white light source, white light is integrated in COB in the packaging industry. The source surface directly forms a silicone lens technology, but this technology is currently only used in low power COB light source packages. In the thermal curing process of direct-formed silicone lens technology, the stress and thermal shrinkage of the silicone itself can also cause the risk of gold wire breakage between the interconnected chips. A technique of a silicone multilayer film having different refractive indices is disclosed in the technique of Chinese Patent Application No. 103681991A "Silicone Lens for LED Packaging and Method of Manufacturing the Same" to improve light extraction efficiency and improve light extraction efficiency. Although the above improvement measures have improved the light extraction efficiency and the light extraction angle to some extent, the light extraction efficiency and the light extraction angle are limited, and the problem of the attenuation of the phosphor cannot be solved.
发明内容Summary of the invention
针对上述传统COB集成光源封装技术及改进型封装技术中存在的缺点，本发明提供一种远程荧光粉透镜和制造方法及其应用。In view of the above disadvantages of the conventional COB integrated light source packaging technology and the improved packaging technology, the present invention provides a remote phosphor lens and a manufacturing method thereof and applications thereof.
本发明所涉及的一种远程荧光粉透镜，包括一种类半球体的复合曲面结构，如图1所示。类半球体的复合曲面结构是一个具有较大曲率半径的壳体3和一个具有较小曲率半径的实心曲面体4的复合体；复合曲面结构的横截面可以为圆形，较大曲率半径的壳体3和具有较小曲率半径的实心曲面体4的圆形截面共有一个圆心O。A remote phosphor lens according to the present invention comprises a hemispherical composite curved surface structure, as shown in FIG. The compound-like hemispherical composite curved surface structure is a composite of a shell 3 having a large radius of curvature and a solid curved surface body 4 having a small radius of curvature; the cross-section of the composite curved surface structure may be a circular shape with a large radius of curvature The circular cross section of the casing 3 and the solid curved body 4 having a small radius of curvature shares a center O.
其中，壳体3具有一个外表面1和一个内表面2；壳体3的外表面1可以为球面、或抛物面或任意光滑的凸面；壳体3的厚度可以是均匀的，也可以根据其最终的应用环境来调节；壳体3的厚度范围为50微米～3毫米；壳体3的内表面2与实心曲面体4的表面物理形状完全一致，可以为球面、或抛物面或任意光滑表面；实心曲面体4的表面与较大曲率半径的壳体3的内表面2完全贴合。Wherein, the housing 3 has an outer surface 1 and an inner surface 2; the outer surface 1 of the housing 3 may be a spherical surface, or a paraboloid or any smooth convex surface; the thickness of the housing 3 may be uniform or may be based on the final The application environment is adjusted; the thickness of the casing 3 ranges from 50 micrometers to 3 millimeters; the inner surface 2 of the casing 3 is completely identical to the surface physical shape of the solid curved surface body 4, and may be a spherical surface, or a paraboloid or any smooth surface; The surface of the curved body 4 completely conforms to the inner surface 2 of the casing 3 having a large radius of curvature.
其中，较大曲率半径的壳体3是一种远程荧光粉结构，包含一种透明有机物基体A与荧光粉B颗粒的混合物；Wherein, the housing 3 having a larger radius of curvature is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles;
其中，透明有机物基体A的材质为PMMA、PMMA合金树脂、聚碳酸酯、PC合金树脂、环氧、丁苯、苯砜树脂、CR-39、MS、NAS、聚氨脂光学树脂、尼龙或PC增强的PMMA或MS树脂、或硅胶；具体可以根据使用环境温度环境来选择。Among them, the transparent organic substrate A is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC. Enhanced PMMA or MS resin, or silica gel; specifically, depending on the ambient temperature environment used.
其中，荧光粉B为LED黄色荧光粉、或LED绿色荧光粉与LED红色荧光粉的混合物，或者是LED黄色荧光粉与少量LED红色荧光粉的混合物；Wherein, the phosphor B is an LED yellow phosphor, or a mixture of an LED green phosphor and an LED red phosphor, or a mixture of an LED yellow phosphor and a small amount of LED red phosphor;
其中，较小曲率半径的实心曲面体4为一种透明的有机物C，其材质为PMMA、PMMA合金树脂、聚碳酸酯、PC合金树脂、环氧、丁苯、苯砜树脂、CR-39、MS、NAS、聚氨脂光学树脂、尼龙或PC增强的PMMA或MS树脂、或硅胶；具体可以根据使用环境温度环境来选择。 The solid curved surface body 4 with a small radius of curvature is a transparent organic material C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin, or silica gel; can be selected according to the ambient temperature environment.
其中，壳体3的有机物基体A与实心曲面体4的材质C可以相同，也可以不同；壳体3的有机物基体A与实心曲面体4的材质C具有相同或相近的折射率，以避免光线的传播损失；The material base A of the casing 3 and the material C of the solid curved body 4 may be the same or different. The organic matrix A of the casing 3 and the material C of the solid curved body 4 have the same or similar refractive index to avoid light. Transmission loss
其中，上述较大曲率半径的远程荧光粉壳体3还可以包含双层结构，如图2所示，该双层结构包含远程荧光粉壳体5和远程荧光粉壳体6的复合结构；壳体6的外表面7与壳体5的内表面的物理形貌完全一样，所用材质也相同；壳体6与壳体5的厚度可以相同，也可以不同；壳体5中包含机物基体A和荧光粉D的混合物，壳体6中包含机物基体A和荧光粉E的混合物；Wherein, the remote phosphor housing 3 having the larger radius of curvature may further comprise a double layer structure, as shown in FIG. 2, the double layer structure comprises a composite structure of the remote phosphor housing 5 and the remote phosphor housing 6; The outer surface 7 of the body 6 is exactly the same as the physical surface of the inner surface of the casing 5, and the materials used are also the same; the thickness of the casing 6 and the casing 5 may be the same or different; the casing 5 contains the organic substrate A. a mixture with the phosphor D, the housing 6 comprising a mixture of the organic substrate A and the phosphor E;
一般而言，上述2层及2层以上的远程荧光粉壳体的安置顺序或各自的厚度，都会对LED发光器件的出光质量有一定影响，因此有必要对上述各个远程荧光粉壳体的厚度、彼此之间的排列循序作最佳化设计。以图2所述远程荧光粉透镜为例，远程荧光粉壳体6中的荧光粉E为绿色荧光粉，远程荧光粉壳体5中的荧光粉D为红色荧光粉。蓝光芯片发出的蓝光首先进入实心曲面体4，然后从实心曲面体4的表面9穿出，分别进入远程荧光粉壳体5和6。远程荧光粉壳体6中的绿色荧光粉E受LED蓝光芯片发出的蓝色光激发后发出绿色光。绿色光的波长大于蓝色光的波长，但小于红色光的波长。根据物理学原理，远程荧光粉壳体6中绿色荧光粉E受激发后发出的绿色光中的部分光线可以激发远程荧光粉壳体5中的红色荧光体D，使其发出红色光。而LED蓝光芯片发出的蓝色光的一部分也会在穿透远程荧光粉壳体6之后激发远程荧光粉壳体5中的红色荧光粉D，使其受激发出红色光。蓝光芯片发出的蓝色光中，除用于激发远程荧光粉壳体6和5中的荧光粉发光外的剩余光线、远程荧光粉壳体6中荧光粉E受激发后发出的绿色光中，除了用于激发远程荧光粉壳体5中的红色荧光粉D发光外的剩余光线，都将和远程荧光粉壳体5中受蓝色光和绿色光激发发出的红色光相混合，从而可以在远程荧光粉壳体5的外表面8出射白光。在如此合成的白光中，绿色光的含量(相对强度)比预期的要小一些，而红色光的含量(相对强度)则会比预期的要大一些。为了不使白光的质量(例如显色指数)劣化，可以适当增加远程荧光粉壳体6中的绿色荧光粉含量，并适当减少远程荧光粉壳体5中的红色荧光粉含量；或者适当地增加远程荧光粉壳体6的厚度，并适当地减少远程荧光粉壳体5的厚度也可以达到同样目的。总之，所发白光的品质可以通过调节各个远程荧光粉壳体的厚度及其所含荧光粉的量来进行精细的调整。In general, the placement order or the respective thicknesses of the above two-layer and two-layer remote phosphor housings have a certain influence on the light-emitting quality of the LED light-emitting device, so it is necessary to thickness of each of the above-mentioned remote phosphor housings. The arrangement between each other is optimized for design. Taking the remote phosphor lens of FIG. 2 as an example, the phosphor E in the remote phosphor housing 6 is a green phosphor, and the phosphor D in the remote phosphor housing 5 is a red phosphor. The blue light emitted by the blue chip first enters the solid curved body 4 and then passes out from the surface 9 of the solid curved body 4 to enter the remote phosphor housings 5 and 6, respectively. The green phosphor E in the remote phosphor housing 6 is excited by the blue light emitted by the LED blue chip to emit green light. The wavelength of green light is greater than the wavelength of blue light, but less than the wavelength of red light. According to the physics principle, part of the green light emitted by the green phosphor E in the remote phosphor housing 6 can excite the red phosphor D in the remote phosphor housing 5 to emit red light. A portion of the blue light emitted by the LED blue chip also excites the red phosphor D in the remote phosphor housing 5 after it has penetrated the remote phosphor housing 6, causing it to be excited to emit red light. Among the blue light emitted by the blue chip, except for the remaining light for exciting the phosphor light in the remote phosphor housings 6 and 5, and the green light emitted by the phosphor E in the remote phosphor housing 6, The remaining light for exciting the red phosphor D in the remote phosphor housing 5 will be mixed with the red light emitted by the blue phosphor and the green light in the remote phosphor housing 5, thereby enabling remote fluorescence The outer surface 8 of the powder casing 5 emits white light. In the white light thus synthesized, the content (relative intensity) of green light is smaller than expected, and the content (relative intensity) of red light is larger than expected. In order not to deteriorate the quality of white light (for example, color rendering index), the green phosphor content in the remote phosphor housing 6 may be appropriately increased, and the red phosphor content in the remote phosphor housing 5 may be appropriately reduced; or may be appropriately increased. The same purpose can be achieved by the thickness of the remote phosphor housing 6, and appropriately reducing the thickness of the remote phosphor housing 5. In summary, the quality of the white light emitted can be finely adjusted by adjusting the thickness of each remote phosphor housing and the amount of phosphor contained therein.
上述远程荧光粉壳体6中的荧光粉E还可以是LED黄色荧光粉、或LED红色荧光粉，或上述任意二种荧光粉的混合物；上述远程荧光粉壳体5中的荧光粉D还可以是LED黄色荧 光粉、或LED绿色荧光粉，或上述任意二种荧光粉的混合物；但远程荧光粉壳体6和远程荧光粉壳体5所用荧光粉成分不同。The phosphor E in the remote phosphor housing 6 may also be an LED yellow phosphor, or an LED red phosphor, or a mixture of any two of the above phosphors; the phosphor D in the remote phosphor housing 5 may also be LED yellow fluorescent Light powder, or LED green phosphor, or a mixture of any two of the above phosphors; however, the phosphor composition of the remote phosphor housing 6 and the remote phosphor housing 5 is different.
本发明所涉及远程荧光粉透镜，还可以具有方伞型凸面形状结构，示意图如图3。方伞型凸面形状结构是一个具有方伞型凸面形状结构的较大远程荧光粉壳体10和一个较小的方伞型凸面形状结构实心曲面体11的复合体；方伞型凸面形状结构实心曲面体11的底面为一正方形，四条边的交点分别为H、I、J和K；The remote phosphor lens according to the present invention may further have a square umbrella-shaped convex shape structure, and the schematic view is shown in FIG. The square umbrella type convex shape structure is a composite of a large remote phosphor shell 10 having a square umbrella type convex shape structure and a small square umbrella type convex shape structure solid curved body 11; a square umbrella type convex shape structure solid The bottom surface of the curved body 11 is a square, and the intersections of the four sides are H, I, J, and K, respectively;
其中，方伞型凸面形状结构实心曲面体11是由以正方形的两条相对的边JK和HI的中点连线为轴线的半圆柱体及以正方形的两条相对的边IJ和KH的中点连线为轴线的半园柱体的重叠部分构成的区域；两个半圆柱体之间的交线JL、IL、HL和KL相较于L点。为了获得均匀的出射光线，两个半圆柱体之间的交线JL、IL、HL和KL区域做平滑处理，L点成为四个平滑曲面汇聚区域的中心点。方伞型凸面形状结构实心曲面体11的表面与方伞型凸面形状结构的较大远程荧光粉壳体10的内表面完全一致，且方伞型凸面形状结构的较大远程荧光粉壳体10具有均匀的厚度，厚度范围为50微米～3毫米。Wherein, the square umbrella-shaped convex-shaped structure solid curved surface body 11 is a semi-cylindrical body having a line connecting the midpoints of two opposite sides JK and HI of a square, and two opposite sides IJ and KH of a square. The point line is the area formed by the overlapping portion of the semi-circular cylinder of the axis; the intersection lines JL, IL, HL and KL between the two semi-cylinders are compared with the point L. In order to obtain a uniform outgoing ray, the intersections JL, IL, HL, and KL between the two semi-cylinders are smoothed, and the L-point becomes the center point of the four smooth-surface convergence regions. The surface of the solid umbrella body 11 of the square umbrella type convex shape structure is completely identical with the inner surface of the large remote phosphor housing 10 of the square umbrella type convex shape structure, and the large remote phosphor housing 10 of the square umbrella type convex shape structure It has a uniform thickness and a thickness ranging from 50 microns to 3 mm.
本发明所涉及远程荧光粉透镜，还可以具有变形的半园柱体形状结构，示意图如图4。变形的半园柱体形状结构是一个具有变形的半园柱体形状结构的较大远程荧光粉壳体13和一个较小的变形的半园柱体形状结构实心曲面体14的复合体；底面为一长方形，四条边的交点分别为M、N、P和Q；The remote phosphor lens according to the present invention may further have a deformed semi-cylindrical shape structure, and the schematic view is shown in FIG. The deformed semi-cylindrical shape structure is a composite of a large remote phosphor housing 13 having a deformed semi-cylindrical shape structure and a smaller deformed semi-cylindrical shape structure solid curved body 14; a rectangle, the intersection of the four sides is M, N, P and Q;
其中，变形的半园柱体形状结构实心曲面体14是由以长方形的两条相对的边MN和PQ的中点连线为轴线的半圆柱体及以长方形的两条相对的边MQ和PN的中点连线为轴线的半园柱体的重叠部分构成的区域；两个半圆柱体之间的交线为QR、MR、PS和NS。为了获得均匀的出射光线，需要对两个半圆柱体之间的交线QR、MR、PS和NS区域做平滑处理。变形的半园柱体形状实心曲面体14的表面与变形的半园柱体形状的较大远程荧光粉壳体13的内表面完全一致，且变形的半园柱体形状的较大远程荧光粉壳体13具有均匀的厚度，厚度范围为50微米～3毫米。Wherein, the deformed semi-cylindrical shape structure solid curved body 14 is a semi-cylindrical body with a line connecting the midpoints of two opposite sides MN and PQ of a rectangle and two opposite sides of the rectangle MQ and PN The midpoint line is the area formed by the overlapping portion of the semi-circular cylinder of the axis; the intersection between the two semi-cylinders is QR, MR, PS, and NS. In order to obtain uniform outgoing light, it is necessary to smooth the intersections QR, MR, PS and NS between the two semi-cylinders. The surface of the deformed semi-cylindrical solid curved body 14 is completely coincident with the inner surface of the deformed semi-cylindrical shape of the large remote phosphor housing 13, and the deformed semi-cylindrical shape of the large remote phosphor The housing 13 has a uniform thickness ranging from 50 micrometers to 3 millimeters.
术语“蓝色光”是指中心波长位于400纳米与490纳米之间的光；术语“绿色光”特别涉及中心波长位于500纳米到560纳米之间的光；术语“黄色光”特别涉及中心波长约位于560纳米到590纳米之间的光；术语“红色光”特别涉及中心波长约位于590纳米到650纳米之间的光；术语“黄色荧光粉”是指，在被波长小于自身发光波长的光线所激发下，能发出中心波长约位于560纳米到590纳米之间的受激光的发光材料；术语“绿色荧光粉”是 指，在被波长小于自身发光波长的光线所激发下，能发出中心波长约位于500纳米到560纳米之间的受激光的发光材料；术语“红色发光荧光粉”是指，在被波长小于自身发光波长的光线激发下，能发出中心波长约位于590纳米到650纳米之间的受激光的发光材料。The term "blue light" refers to light having a center wavelength between 400 nm and 490 nm; the term "green light" particularly relates to light having a center wavelength between 500 nm and 560 nm; the term "yellow light" particularly relates to the center wavelength. Light between 560 nm and 590 nm; the term "red light" specifically refers to light with a center wavelength between approximately 590 nm and 650 nm; the term "yellow phosphor" means light at a wavelength less than its own wavelength Excited to emit a laser-emitting material with a center wavelength between approximately 560 nm and 590 nm; the term "green phosphor" is It is a luminescent material that emits laser light having a center wavelength between about 500 nm and 560 nm when excited by light having a wavelength smaller than its own wavelength; the term "red luminescent phosphor" means that the wavelength is less than itself. Upon excitation by light of the illuminating wavelength, a laser-emitting luminescent material having a center wavelength between about 590 nm and 650 nm can be emitted.
上述黄色荧光粉包括含三价铈的石榴石((Gd,Y)3(Al,Ga)5O12:Ce3+(YAG),或者Tb3-xRExO12:Ce3+(TAG),RE＝Y,Gd,La,Lu)、含三价铈的硅氮化物(La3Si6N11:Ce3+；CaAlSiN3:Ce3+)、含二价铕的氮氧化物(Eu2+:MSi2O2-δN2+2/3δ,M＝Ca,Sr,Ba；α-SIALON:Eu2+)、含二价铕的硅酸盐(M2SiO4:Eu2+,M＝Ca,Sr,Ba)、含二价铕的硫代镓酸盐(thiogallate,Sr1-xCaxGa2S4:Eu2++zGa2S3)，优选含三价铈的石榴石，但不仅限于上述几种化合物。The above yellow phosphor includes garnet containing trivalent europium ((Gd, Y) 3 (Al, Ga) 5 O 12 : Ce 3+ (YAG), or Tb 3-x RE x O 12 : Ce 3+ (TAG ), RE=Y, Gd, La, Lu), silicon nitride containing trivalent europium (La 3 Si 6 N 11 :Ce 3+ ; CaAlSiN 3 :Ce 3+ ), nitrogen oxide containing divalent europium ( Eu 2+ : MSi 2 O 2-δ N 2+2/3δ , M=Ca, Sr, Ba; α-SIALON: Eu 2+ ), divalent europium-containing silicate (M 2 SiO 4 :Eu 2 + , M = Ca, Sr, Ba), thiogallate (Sr 1-x Ca x Ga 2 S 4 :Eu 2+ +zGa 2 S 3 ) containing divalent europium, preferably containing trivalent europium Garnet, but not limited to the above several compounds.
上述绿色荧光粉包括含二价铕的硅酸盐(M2SiO4:Eu2+,M＝Ca,Sr,Ba)、含二价铕的硫化物(M4Ga2S7:Eu2+,M＝Ca,Sr,Ba)、含二价铕的氮氧化物(Si6-zAlzOzN8-z:Eu2+,M＝Ca,Sr,Ba；MSi2O2N2:Eu2+,M＝Ca,Sr,Ba；α-SIALON:Yb3+)等，但不仅限于上述几种化合物。The above green phosphor includes a divalent europium-containing silicate (M 2 SiO 4 :Eu 2+ , M=Ca, Sr, Ba), a divalent europium-containing sulfide (M 4 Ga 2 S 7 :Eu 2+ ) , M=Ca, Sr, Ba), oxynitride containing divalent cerium (Si 6-z Al z O z N 8-z :Eu 2+ , M=Ca, Sr,Ba; MSi 2 O 2 N 2 :Eu 2+ , M=Ca, Sr, Ba; α-SIALON: Yb 3+ ), etc., but are not limited to the above several compounds.
上述红色荧光粉包括含二价铕的硅氮化合物(M2Si5N8:Eu2+,M＝Ca,Sr,Ba；CaAlSiN3:Eu2+)、二价铕的硫化物(CaS:Eu2+)、二价铕的硅酸盐(Ca3Si2O7:Eu2+)、含二价铕的氮氧化物(Ca-α-SIALON:Eu2+)等，但不仅限于上述几种化合物。The above red phosphor includes a silicon nitride compound containing divalent europium (M 2 Si 5 N 8 :Eu 2+ , M=Ca, Sr,Ba; CaAlSiN 3 :Eu 2+ ), and a sulfide of divalent europium (CaS: Eu 2+ ), a divalent europium silicate (Ca 3 Si 2 O 7 :Eu 2+ ), a divalent europium-containing nitrogen oxide (Ca-α-SIALON:Eu 2+ ), etc., but not limited to the above Several compounds.
为达上述目的，本发明另提出一种远程荧光粉透镜的制造方法。To achieve the above object, the present invention further provides a method of manufacturing a remote phosphor lens.
对于有机物基体A和有机物C的材质均为热塑性树脂时，具有类半球体复合曲面结构的远程荧光粉透镜的制造方法包括下列步骤：When the materials of the organic substrate A and the organic material C are all thermoplastic resins, the method for manufacturing a remote phosphor lens having a hemispherical compound curved surface structure includes the following steps:
步骤一：将树脂C的颗粒加入注塑机的料筒熔化，借助于模具通过注塑工艺获得实心曲面体4；Step 1: the particles of the resin C are added to the barrel of the injection molding machine to melt, and the solid curved body 4 is obtained by the injection molding process by means of the mold;
步骤二：将树脂A的粉末与荧光粉B的粉末充分混合后加入注塑机料筒熔化，借助于模具通过注塑工艺获得远程荧光粉壳体3；Step 2: the powder of the resin A and the powder of the phosphor B are thoroughly mixed, and then added to the barrel of the injection molding machine to melt, and the remote phosphor housing 3 is obtained by the injection molding process by means of the mold;
步骤三：将实心曲面体4放入远程荧光粉壳体3中，在真空中烘烤使得实心曲面体4的外表面与远程荧光粉壳体3的内表面充分贴合；其中烘烤温度的特征在于使得有机物C和有机物A发生软化粘连，但未形成熔化状态。Step 3: The solid curved body 4 is placed in the remote phosphor housing 3, and baked in a vacuum so that the outer surface of the solid curved body 4 is sufficiently adhered to the inner surface of the remote phosphor housing 3; It is characterized in that the organic substance C and the organic substance A are softened and adhered, but the molten state is not formed.
其中步骤二和三还可以采用下列步骤来取代完成，如图5所示，具体如下： Steps 2 and 3 can also be replaced by the following steps, as shown in Figure 5, as follows:
S301：将树脂A粉末、荧光粉B粉末和溶剂混和成均匀的浆料，其中树脂A粉末与荧光粉B粉末的质量比为100:10－20:150，荧光粉B粉末加树脂A粉末混合物的总体积与溶剂的体积比为10：100－300：100,且树脂A粉末和荧光粉B粉末的粒径在1微米到60微米之间；其中溶剂是液体的醇、醚、酮、酯、烃类。 S301: mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture The volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
S303:将上述浆料均匀涂覆在实心曲面体4的表面上，将涂覆浆料的实心曲面体4恒温干燥，干燥温度为40℃-130℃，干燥时间为5分钟-10小时；浆料的涂覆工艺包括丝网印刷及静电喷涂等。S303: uniformly coating the slurry on the surface of the solid curved body 4, and drying the solid curved body 4 coated with the slurry at a temperature of 40 ° C to 130 ° C and a drying time of 5 minutes to 10 hours; The coating process of the material includes screen printing and electrostatic spraying.
S305:将干燥后的涂有浆料的实心曲面体4烘烤,烘烤温度T1为100℃-260℃，升温速率为1-10℃/分钟，烘烤时间为5分钟-20小时，降温时间为20分钟-10小时，在实心曲面体4表面得到含有荧光粉B与树脂C的混合涂层；烘烤温度T1高于树脂C的玻璃化转变温度，但低于树脂A的融化温度10℃以上，且T1接近但低于树脂A的融化温度；在烘烤温度T1下，有机溶剂完全挥发或分解；在烘烤温度T1下，树脂A粉末软化并结合成连续的玻璃体，即可在实心曲面体4表面得到含荧光体B的树脂A涂层。S305: baking the dried solid curved body 4 coated with the slurry, the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, and the baking time is 5 minutes - 20 hours. The cooling time is from 20 minutes to 10 hours, and a mixed coating containing the phosphor B and the resin C is obtained on the surface of the solid curved body 4; the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting of the resin A The temperature is above 10 ° C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous In the vitreous body, a resin A coating containing the phosphor B can be obtained on the surface of the solid curved body 4.
树脂A应该比树脂C有更好的流动性，而且树脂A的玻璃化转变温度及融化温度均低于树脂A的玻璃化转变温度及融化温度10℃以上，在烘烤温度T1下树脂A的粉末软化、甚至接近融化，在树脂C表面上相互粘连，形成均匀分布的连续玻璃体；此时，荧光粉B颗粒被连续的玻璃体(树脂A)分隔并包裹，在实心曲面体4表面上形成均匀的含荧光粉B的树脂A涂层。Resin A should have better fluidity than resin C, and the glass transition temperature and melting temperature of resin A are lower than the glass transition temperature and melting temperature of resin A by 10 ° C or higher, and resin A at baking temperature T 1 . The powder is softened, even close to melting, and adheres to each other on the surface of the resin C to form a uniform distribution of the continuous glass body; at this time, the phosphor B particles are separated and wrapped by the continuous glass body (resin A) to form on the surface of the solid curved body 4 A uniform Resin B coating containing Phosphor B.
树脂A应该有与树脂C相近或相同的热膨胀系数，以免从烘烤温度T1冷却至室温的过程中，由于两种树脂的热膨胀系数的差异导致实心曲面体4变形；对于热膨胀系数差异不大的两种树脂，可以借助于模具来固定实心曲面体4的形状；优选树脂A和树脂C为同一种树脂的不同衍生品种，则树脂C涂层与实心曲面体4会完全融为一体化的结构。Resin A should have a thermal expansion coefficient similar to or the same as that of resin C, so as not to be deformed from the baking temperature T 1 to room temperature, the solid curved body 4 is deformed due to the difference in thermal expansion coefficients of the two resins; there is little difference in thermal expansion coefficient The two resins can fix the shape of the solid curved body 4 by means of a mold; preferably, the resin A and the resin C are different derivatives of the same resin, and the resin C coating and the solid curved body 4 are completely integrated. structure.
上述步骤S303中干燥过程能在空气中进行，也能在真空中进行。The drying process in the above step S303 can be carried out in the air or in a vacuum.
上述步骤S305中烘烤过程能在空气中进行，也能在真空中进行，烘烤方式是利用红外线直接烘烤或利用电热丝加热烘烤；In the above step S305, the baking process can be carried out in the air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire;
上述步骤S303和S305可以合并为一个分步加热步骤进行。The above steps S303 and S305 can be combined into one step heating step.
多次重复步骤S301～S305,直至远程荧光粉壳体3满足厚度要求为止。Steps S301 to S305 are repeated a plurality of times until the remote phosphor case 3 satisfies the thickness requirement.
对于两层或多层远程荧光粉壳体结构，其制备方法类似。For two or more layers of remote phosphor housing structures, the preparation process is similar.
具有方伞型凸面形状结构及变形的半园柱体形状结构的远程荧光粉透镜的制造方法与上述方法类似，仅使用的模具有所不同。A method of manufacturing a remote phosphor lens having a square umbrella-shaped convex shape structure and a deformed semi-cylindrical shape structure is similar to the above method, and only the mold used is different.
对于有机物基体A和有机物C的材质均为热固性树脂或硅胶时，具有类半球体复合曲面结构的远程荧光粉透镜的制造方法包括下列步骤： When the materials of the organic substrate A and the organic material C are both thermosetting resin or silica gel, the method for manufacturing a remote phosphor lens having a hemispherical composite curved surface structure includes the following steps:
步骤一：将热固性树脂或硅胶调匀，去气泡后注入模具，在50℃～200℃下固化20分钟～2小时，然后冷却至室温，即可获得实心曲面体4；Step 1: Mix the thermosetting resin or silica gel, remove the bubbles, inject into the mold, and cure at 50 ° C ~ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature, to obtain a solid curved body 4;
步骤二：将热固性树脂或硅胶与荧光粉B的粉末充分混合，去气泡后注入模具，在50℃～200℃下固化20分钟～2小时，然后冷却至室温，即可获得远程荧光粉壳体3；Step 2: thoroughly mix the thermosetting resin or silica gel with the powder of the phosphor B, remove the bubbles, inject into the mold, cure at 50 ° C ~ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature to obtain the remote phosphor shell. 3;
步骤三：在远程荧光粉壳体3的内表面涂覆透明的有机胶水，然后将实心曲面体4放入远程荧光粉壳体3中，在真空中烘烤使得实心曲面体4的外表面与远程荧光粉壳体3的内表面充分贴合；有机胶水与实心曲面体4和远程荧光粉壳体3有相同或相近的折射率，以免造成光线传输损失。Step 3: coating the inner surface of the remote phosphor housing 3 with a transparent organic glue, then placing the solid curved body 4 into the remote phosphor housing 3, and baking in a vacuum to make the outer surface of the solid curved body 4 The inner surface of the remote phosphor housing 3 is sufficiently fitted; the organic glue has the same or similar refractive index as the solid curved body 4 and the remote phosphor housing 3, so as to avoid loss of light transmission.
对于两层或多层远程荧光粉壳体结构，其制备方法类似。For two or more layers of remote phosphor housing structures, the preparation process is similar.
具有方伞型凸面形状结构及变形的半园柱体形状结构的远程荧光粉透镜的制造方法与上述方法类似，仅使用的模具有所不同。A method of manufacturing a remote phosphor lens having a square umbrella-shaped convex shape structure and a deformed semi-cylindrical shape structure is similar to the above method, and only the mold used is different.
为了增强光线的混合效果，在制备远程荧光粉壳体时，还可以在荧光粉中加入适量的二氧化硅(SiO2)、二氧化锆(ZrO2)、三氧化二铝(Al2O3)等无机氧化物颗粒，以起到混光作用。其中荧光粉与氧化物颗粒的体积比为100：1～100：150。上述无机氧化物颗粒也可以根据需要由两种或两种以上的种类搭配构成。In order to enhance the mixing effect of light, in the preparation of the remote phosphor shell, an appropriate amount of silicon dioxide (SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) may be added to the phosphor. Inorganic oxide particles, etc., to function as a light mixing. The volume ratio of the phosphor to the oxide particles is from 100:1 to 100:150. The inorganic oxide particles may be composed of two or more types as needed.
本发明还提供一种运用远程荧光粉透镜的白光发光装置，包含一个发光区域为圆形COB集成蓝光光源和一个类半球体复合曲面结构的远程荧光粉透镜。The invention also provides a white light emitting device using a remote phosphor lens, comprising a remote phosphor lens with a circular COB integrated blue light source and a hemispherical composite curved surface structure.
其中，COB集成蓝光光源结构示意图如图6所示，包含基板16，基板16上的LED芯片区域(圆形)粘贴多个(组)蓝光LED芯片20，多个蓝光LED芯片通过金线21与基板16上的电路连接，17和22为COB集成蓝光光源的电气连接端子。The structure of the COB integrated blue light source is as shown in FIG. 6 , and includes a substrate 16 . The LED chip area (circular) on the substrate 16 is pasted with a plurality of (group) blue LED chips 20 , and the plurality of blue LED chips pass through the gold wire 21 . Circuit connections on substrate 16 and 17 and 22 are electrical connection terminals for the COB integrated blue light source.
其中，LED芯片区域上覆盖一层透明硅胶层19，透明硅胶层的厚度以刚好覆盖芯片及金线为好，将远程荧光粉透镜安置在透明硅胶层上，透镜外侧刚好紧贴围坝18，在透镜与围坝的连接处涂有硅胶。Wherein, the LED chip area is covered with a transparent silica gel layer 19, and the thickness of the transparent silica gel layer is just enough to cover the chip and the gold wire, and the remote phosphor lens is placed on the transparent silica gel layer, and the outer side of the lens is just close to the dam 18, The silica gel is applied to the joint between the lens and the dam.
将上述COB蓝光光源+远程荧光粉透镜组合放置在恒温烘箱中烘烤固化，烘烤温度为50℃～200℃，烘烤时间为10分钟～2.5小时。待烘箱冷却至室温后，将固化后的COB蓝光光源+远程荧光粉透镜组合取出就得到了本发明的白光发光装置，如图7所示。The COB blue light source + remote phosphor lens combination is placed in a constant temperature oven for baking and curing, the baking temperature is 50 ° C to 200 ° C, and the baking time is 10 minutes to 2.5 hours. After the oven is cooled to room temperature, the cured COB blue light source + remote phosphor lens combination is taken out to obtain the white light emitting device of the present invention, as shown in FIG.
在上述白光发光装置中，荧光粉与蓝光芯片间是一种“远程荧光粉”设置，与传统的将荧光粉与硅胶或环氧的混合物直接涂覆在蓝光芯片表面不同，蓝光芯片与荧光粉间不直接接触，有一定的物理空间。 In the above white light emitting device, the phosphor and the blue chip are a "remote phosphor" arrangement, which is different from the conventional direct coating of a mixture of phosphor and silica gel or epoxy on the surface of the blue chip, the blue chip and the phosphor There is no direct contact and there is a certain physical space.
在上述白光发光装置中，通过电气连接端子17和22给发光装置提供一定工作电压或工作电流后，蓝光芯片20发出蓝色光线，并首先进入实心曲面体4，其中部分蓝色光线照射到远程荧光粉壳体中的荧光粉颗粒B上，激发其发出波长较长的黄色光线。这样LED芯片发出的部分蓝色光线与荧光粉受激发出的黄色光线混合就得到了白色光线。In the above white light emitting device, after a certain operating voltage or operating current is supplied to the light emitting device through the electrical connection terminals 17 and 22, the blue chip 20 emits blue light and first enters the solid curved body 4, and part of the blue light is irradiated to the remote Phosphor particles B in the phosphor shell excite the yellow light that emits a longer wavelength. In this way, part of the blue light emitted by the LED chip is mixed with the yellow light excited by the phosphor to obtain white light.
为了说明本发明的有益效果，下面对使用传统技术封装的加硅胶透镜的COB集成白光光源及本发明中的COB蓝光集成光源加远程荧光粉透镜的白光光源的光线传输特征加以说明。使用传统技术封装的加硅胶透镜的COB集成白光光源的横截面图如图8所示，其中硅胶透镜的横截面为一半圆形，23为基板，24为蓝光芯片，25为所涂覆的硅胶区域，26和27为围坝，28为被硅胶区域所包覆的荧光粉颗粒；In order to illustrate the beneficial effects of the present invention, the light transmission characteristics of a COB integrated white light source with a silicone lens and a COB blue integrated light source of the present invention plus a remote fluorescent lens white light source are described below. A cross-sectional view of a COB integrated white light source with a silicone lens packaged using conventional technology is shown in Fig. 8. The cross section of the silicone lens is half circular, 23 is a substrate, 24 is a blue chip, and 25 is a coated silica gel. Regions, 26 and 27 are dams, and 28 are phosphor particles coated by silica gel regions;
如图8所示，运用传统技术封装的加硅胶透镜的COB集成白光光源中，荧光粉颗粒28受到蓝光芯片所发出的蓝光激发后发出黄光32，以入射角θ1入射到透镜与空气界面处的T点，由于硅胶的折射率大于空气的折射率，该黄色光线33将以稍大折射角θ2从T点出射；荧光粉颗粒29受到蓝光芯片所发出的蓝光激发后发出黄光30，以入射角θ3入射到透镜与空气界面处的U点，该黄色光线31将以稍大折射角θ4从U点出射。As shown in FIG. 8 , in the COB integrated white light source with a silicone lens packaged by a conventional technology, the phosphor particles 28 are excited by the blue light emitted by the blue chip to emit yellow light 32, and are incident on the lens and air interface at an incident angle θ 1 . At the point T, since the refractive index of the silica gel is greater than the refractive index of the air, the yellow light ray 33 will exit from the T point with a slightly larger refraction angle θ 2 ; the phosphor particles 29 are excited by the blue light emitted by the blue chip to emit yellow light 30 At the incident angle θ 3 , it is incident on the U point at the interface between the lens and the air, and the yellow ray 31 will exit from the U point with a slightly larger refraction angle θ 4 .
为了与运用传统技术封装的平面结构的COB集成白光光源的出光效果做对比，图9显示了运用传统技术封装的平面结构的COB集成白光光源的横截面图，其中23为基板，24为蓝光芯片，25为所涂覆的硅胶区域，26和27为围坝，28为被硅胶区域所包覆的荧光粉颗粒，虚线34为硅胶与空气的界面；对应于图8中的荧光粉颗粒29受到蓝光芯片发出的蓝光激发后所发出的黄光30，图9中的黄色光线35以入射角θ5入射到硅胶与空气界面处的V点后，该光线36以稍大的折射角θ6出射。与图8所示的运用传统技术封装的加硅胶透镜的COB集成白光光源的光线出射效果相比，两者的出光效果并无太大不同。In order to compare with the light-emitting effect of a COB integrated white light source using a planar structure of a conventional technology package, FIG. 9 shows a cross-sectional view of a COB integrated white light source of a planar structure packaged by a conventional technique, wherein 23 is a substrate and 24 is a blue chip. 25 is the coated silica gel region, 26 and 27 are the dams, 28 is the phosphor particles coated by the silica gel region, and the broken line 34 is the interface between the silica gel and the air; the phosphor particles 29 corresponding to FIG. 8 are subjected to The yellow light 30 emitted by the blue light emitted by the blue chip, the yellow light 35 in FIG. 9 is incident on the V point at the interface between the silicon dioxide and the air at the incident angle θ 5 , and the light 36 is emitted at a slightly larger refraction angle θ 6 . . Compared with the light-emitting effect of the COB integrated white light source with the silicone lens shown in FIG. 8 , the light-emitting effect of the two is not much different.
本发明中的COB蓝光集成光源加远程荧光粉透镜的白光光源的横截面图如图10所示，其中透镜具有半球体型的复合曲面结构，壳体和实心曲面体的界面均为半圆形，圆心为O，23为基板，24为蓝光芯片，25为所涂覆的硅胶区域，26和27为围坝，37为散射剂颗粒，壳体和实心曲面体的有机材质为硅胶，且与涂覆芯片区域的硅胶有相同的折射率。如图10所示，采用COB蓝光集成光源加远程荧光粉透镜组合的白光光源，其发光特征与运用传统技术封装的加透镜的COB集成白光光源完全不同。荧光粉颗粒在受到蓝光芯片发出的部分蓝色 光线激发后所发出的黄色光线(如39、41和45等)及蓝光芯片发出的剩余蓝色光线(如42等)经散射剂的折射作用后在透镜表面会发生漫散射(如43等)，混合后得到的白光会产生各种出射方向，发光角度大幅增加，使得出射光线在空间上分布更均匀，避免了眩光现象。A cross-sectional view of a white light source of a COB blue light integrated light source plus a remote phosphor lens in the present invention is shown in FIG. 10, wherein the lens has a hemispherical composite curved surface structure, and the interface between the shell and the solid curved surface body is semicircular. The center of the circle is O, 23 is the substrate, 24 is the blue chip, 25 is the coated silica gel region, 26 and 27 are the dam, 37 is the scattering agent particles, and the organic material of the shell and the solid curved body is silica gel, and coated with The silica gel in the chip-covered region has the same refractive index. As shown in FIG. 10, the white light source adopting the COB blue light integrated light source and the remote phosphor lens combination has completely different illumination characteristics from the COB integrated white light source with the lens packaged by the conventional technology. Phosphor particles are partially blue by the blue chip The yellow light (such as 39, 41, and 45) emitted by the light and the remaining blue light (such as 42) emitted by the blue chip will be diffusely scattered on the lens surface after being refracted by the scattering agent (such as 43). The white light obtained after mixing will produce various emission directions, and the illumination angle is greatly increased, so that the emitted light is more evenly distributed in space, and glare is avoided.
在上述白光发光装置中，由于蓝光芯片与荧光粉间不直接接触，有一定的空间距离，荧光粉受LED蓝光芯片发出的蓝光激发所发出的波长较长的光线(如黄光、红光等)重新进入芯片被吸收的机会大幅减少，可以有效提高光源的光线提取效率，提高发光效率，同时减少光源的发热量。In the above white light emitting device, since the blue chip and the phosphor are not in direct contact, there is a certain spatial distance, and the phosphor is excited by the blue light emitted by the LED blue chip to emit a longer wavelength light (such as yellow light, red light, etc.). The opportunity to re-enter the chip is greatly reduced, which can effectively improve the light extraction efficiency of the light source, improve the luminous efficiency, and reduce the heat generation of the light source.
在上述白光发光装置中，COB蓝光集成光源加远程荧光粉透镜组合成的白光光源与空气的交界面为凸型的曲面，因此与运用传统技术封装的平面结构的COB集成白光光源相比，LED蓝光芯片所发出的蓝光及荧光粉受激所发出的波长较长的光线中在与空气交界面处被全反射进入发光装置而重新被吸收的数量大幅减少，可以有效提高光源的发光效率，并同时减少光源的发热量。In the above white light emitting device, the COB blue integrated light source and the remote phosphor lens are combined to form a convex curved surface at the interface between the white light source and the air, so that the LED is compared with the COB integrated white light source of the planar structure packaged by the conventional technology. The blue light emitted by the blue chip and the longer wavelength light emitted by the phosphor are greatly reflected at the interface with the air and are reabsorbed into the light-emitting device, thereby greatly reducing the luminous efficiency of the light source. At the same time reduce the heat generated by the light source.
上述白光发光装置由于可以大幅提高光源的发光效率，因此可以大幅减少光源的发热，使得芯片的工作温度大幅降低，可以大幅提高LED蓝光芯片的发光效率。Since the white light-emitting device can greatly improve the light-emitting efficiency of the light source, the heat generation of the light source can be greatly reduced, and the operating temperature of the chip can be greatly reduced, and the luminous efficiency of the LED blue light chip can be greatly improved.
在上述白光发光装置中，荧光粉远离芯片，并且光源的发热量大幅减少，使得荧光粉的工作温度大幅降低，因此光衰大幅降低，发光装置的使用寿命可以大幅延长。In the above white light emitting device, the phosphor is far away from the chip, and the heat generation amount of the light source is greatly reduced, so that the operating temperature of the phosphor is greatly reduced, so that the light decay is greatly reduced, and the life of the light emitting device can be greatly extended.
在上述白光发光装置中，远程荧光粉为预制元件，不会产生额外的应力，工艺相对简单，有助于提高产品的良率。In the above white light emitting device, the remote phosphor is a prefabricated component, which does not generate additional stress, and the process is relatively simple, which helps to improve the yield of the product.
本发明所涉及的一种运用远程荧光粉透镜的白光发光装置，并不仅限于包含一个发光区域为圆形COB集成蓝光光源和一个类半球体复合曲面结构的远程荧光粉透镜，还可以是包含一个发光区域为正方形COB集成蓝光光源和一个方伞型凸面形状结构的远程荧光粉透镜，或是包含一个发光区域为长方形COB集成蓝光光源和一个变形的半园柱体形状结构的远程荧光粉透镜。A white light emitting device using a remote phosphor lens according to the present invention is not limited to a remote phosphor lens including a circular COB integrated blue light source and a hemispherical composite curved surface structure, and may also include a The light-emitting area is a square COB integrated blue light source and a square umbrella-shaped convex-shaped remote phosphor lens, or a remote phosphor lens having a rectangular COB integrated blue light source and a deformed semi-cylindrical shape structure.
综上所述本发明的有益效果在于，In summary, the beneficial effects of the present invention are:
使用COB集成蓝光光源和一个远程荧光粉透镜组合的白光发光装置，具有如下优点：荧光粉与蓝光芯片间是一种“远程荧光粉”设置，与传统的将荧光粉与硅胶或环氧的混合物直接涂覆在蓝光芯片表面不同，蓝光芯片与荧光粉间不直接接触，有一定的物理空间；在远程荧光粉透镜加COB蓝光集成光源组合成的白光发光装置中，荧光粉与蓝光芯片间是一种 “远程荧光粉”设置，荧光粉受LED蓝光芯片所发蓝光激发而发出的波长较长的光线(如黄光、红光等)重新进入芯片被吸收的机会大幅减少，可以有效提高光源的发光效率，同时减少光源的散热；远程荧光体壳体中的荧光粉颗粒在空间无序分布，光线在这些颗粒间发生漫反射，最终在远程荧光粉壳体表面光线可以沿任意方向出射，发光角度大幅增加，使得出射光线在空间上分布更均匀，避免了眩光现象；发光装置与空气的交界面为凸型的曲面，因此与传统技术封装的平面结构COB集成白光光源相比，LED蓝光芯片所发出的蓝光及荧光粉受激所发出的波长较长的光线中在与空气交界面处被全反射重新进入发光装置的数量大幅减少，光线提取效率大幅提高，发光角度大幅增加，且荧光粉工作温度大幅降低，荧光粉光衰大幅降低，光源的发光效率大幅提高，同时减少光源的发热；荧光粉远离芯片，工作温度大幅降低，可以大幅降低荧光粉的光衰，减少色偏，并大幅延长发光装置的使用寿命；工艺简单，有助于提高产品良率。发光装置的使用寿命大幅延长。A white light emitting device using a COB integrated blue light source and a remote phosphor lens combination has the advantage that a phosphor is placed between the blue chip and a "remote phosphor" setting, in combination with a conventional phosphor and silica gel or epoxy. Directly coated on the surface of the blue chip, the blue chip does not directly contact the phosphor, and has a certain physical space; in the white light emitting device in which the remote phosphor lens and the COB blue integrated light source are combined, the phosphor and the blue chip are One kind The "remote phosphor" setting, the phosphor is excited by the blue light emitted by the LED blue chip, and the longer wavelength light (such as yellow light, red light, etc.) re-enters the chip and the chance of absorption is greatly reduced, which can effectively improve the light source illumination. Efficiency, while reducing the heat dissipation of the light source; the phosphor particles in the remote phosphor shell are randomly distributed in space, and the light is diffusely reflected between the particles, and finally the light on the surface of the remote phosphor shell can be emitted in any direction, the angle of illumination The increase is large, so that the outgoing light is more evenly distributed in space, avoiding the glare phenomenon; the interface between the light-emitting device and the air is a convex curved surface, so compared with the conventional technology packaged planar structure COB integrated white light source, the LED blue light chip The emitted light emitted by the blue light and the phosphor is stimulated by the total wavelength of the light at the interface with the air to be re-entered into the light-emitting device, the light extraction efficiency is greatly increased, the light-emitting angle is greatly increased, and the phosphor works. The temperature is greatly reduced, the phosphor light decay is greatly reduced, and the luminous efficiency of the light source is greatly improved. Reduce the heat source; phosphor away from the chip, significantly reducing the working temperature, the phosphor light decay can be significantly reduced, reducing color shift, and to significantly extend the life of the light emitting device; simple process, a better product yield. The service life of the illuminating device is greatly extended.
附图说明：BRIEF DESCRIPTION OF THE DRAWINGS:
图1.半球形远程荧光粉透镜的结构示意图。Figure 1. Schematic diagram of a hemispherical remote phosphor lens.
图2.半球形双层壳体构造的远程荧光粉透镜的结构示意图。Figure 2. Schematic diagram of a remote phosphor lens constructed with a hemispherical double shell.
图3.方伞型凸面形状结构远程荧光粉透镜的结构示意图。Figure 3. Schematic diagram of a remote fluorescent lens of a square umbrella-shaped convex shape structure.
图4.变形的半园柱体形状结构远程荧光粉透镜的结构示意图。Figure 4. Schematic diagram of a deformed semi-cylindrical shape structure remote phosphor lens.
图5.实心曲面体表面制备树脂基远程荧光粉壳体的工艺流程图。Figure 5. Process flow diagram for preparing a resin-based remote phosphor housing on a solid curved surface.
图6.COB蓝光集成光源的结构示意图。Figure 6. Schematic diagram of the COB blue integrated light source.
图7.COB蓝光集成光源加远程荧光粉透镜组合成的白光发光装置结构示意图。Figure 7. Schematic diagram of a white light emitting device combined with a COB blue integrated light source and a remote phosphor lens.
图8.使用传统技术封装的加硅胶透镜的COB集成白光光源的横截面图。Figure 8. Cross-sectional view of a COB integrated white light source with a silicone lens packaged using conventional techniques.
图9.运用传统技术封装的平面结构的COB集成白光光源的横截面图。Figure 9. Cross-sectional view of a COB integrated white light source with a planar structure packaged using conventional techniques.
图10.COB蓝光集成光源加远程荧光粉透镜的白光光源的横截面图。Figure 10. Cross-sectional view of a white light source with a COB blue integrated light source plus a remote phosphor lens.
具体实施例：Specific embodiment:
为了更清晰地表述本发明，下面结合附图对本发明做进一步地描述。In order to more clearly illustrate the invention, the invention will be further described below in conjunction with the drawings.
实施例1：Example 1:
以图1对实施例1做具体说明。 Embodiment 1 will be specifically described with reference to FIG. 1.
图1为半球形远程荧光粉透镜的结构示意图，其中3是一个具有较大曲率半径的远程 荧光粉半球型壳体，4是一个具有较小曲率半径的实心半球体，O是远程荧光粉半球型壳体3和实心半球体4共同的球心。Figure 1 is a schematic view showing the structure of a hemispherical remote phosphor lens, wherein 3 is a remote having a large radius of curvature The phosphor hemispherical shell 4 is a solid hemisphere having a small radius of curvature, and O is a spherical core common to the remote phosphor hemispherical shell 3 and the solid hemisphere 4.
其中，壳体3具有一个外表面1和一个内表面2；壳体3的外表面1也可以为球面、或抛物面或任意光滑的凸面；壳体3的厚度可以是均匀的，也可以根据其最终的应用环境来调节；壳体3的厚度范围为50微米～3毫米；壳体3的内表面2与实心曲面体4的表面物理形状完全一致，可以为球面、或抛物面或任意光滑表面；实心曲面体4的表面与较大曲率半径的壳体3的内表面2完全贴合。Wherein, the housing 3 has an outer surface 1 and an inner surface 2; the outer surface 1 of the housing 3 may also be a spherical surface, or a paraboloid or any smooth convex surface; the thickness of the housing 3 may be uniform or may be The final application environment is adjusted; the thickness of the casing 3 ranges from 50 micrometers to 3 millimeters; the inner surface 2 of the casing 3 is completely identical to the physical shape of the surface of the solid curved surface body 4, and may be a spherical surface, or a paraboloid or any smooth surface; The surface of the solid curved body 4 completely conforms to the inner surface 2 of the casing 3 having a large radius of curvature.
其中，较大曲率半径的壳体3是一种远程荧光粉结构，包含一种透明有机物基体A与荧光粉B颗粒的混合物；Wherein, the housing 3 having a larger radius of curvature is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles;
其中，透明有机物基体A的材质为PMMA、PMMA合金树脂、聚碳酸酯、PC合金树脂、环氧、丁苯、苯砜树脂、CR-39、MS、NAS、聚氨脂光学树脂、尼龙或PC增强的PMMA或MS树脂；Among them, the transparent organic substrate A is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC. Enhanced PMMA or MS resin;
其中，荧光粉B为LED黄色荧光粉、或LED绿色荧光粉与LED红色荧光粉的混合物，或者是LED黄色荧光粉与少量LED红色荧光粉的混合物；Wherein, the phosphor B is an LED yellow phosphor, or a mixture of an LED green phosphor and an LED red phosphor, or a mixture of an LED yellow phosphor and a small amount of LED red phosphor;
其中，较小曲率半径的实心曲面体4为一种透明的有机物C，其材质为PMMA、PMMA合金树脂、聚碳酸酯、PC合金树脂、环氧、丁苯、苯砜树脂、CR-39、MS、NAS、聚氨脂光学树脂、尼龙或PC增强的PMMA或MS树脂。The solid curved surface body 4 with a small radius of curvature is a transparent organic material C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin.
其中，壳体3的有机物基体A与实心曲面体4的材质C可以相同，也可以不同；壳体3的有机物基体A与实心曲面体4的材质C具有相同或相近的折射率，以避免光线的传播损失；The material base A of the casing 3 and the material C of the solid curved body 4 may be the same or different. The organic matrix A of the casing 3 and the material C of the solid curved body 4 have the same or similar refractive index to avoid light. Transmission loss
图1所示的半球形远程荧光粉透镜的制备步骤如下：The preparation steps of the hemispherical remote phosphor lens shown in Figure 1 are as follows:
步骤一：将树脂C的颗粒加入注塑机的料筒熔化，借助于模具通过注塑工艺获得实心曲面体4；Step 1: the particles of the resin C are added to the barrel of the injection molding machine to melt, and the solid curved body 4 is obtained by the injection molding process by means of the mold;
步骤二：将树脂A的粉末与荧光粉B的粉末充分混合后加入注塑机料筒熔化，借助于模具通过注塑工艺获得远程荧光粉壳体3；Step 2: the powder of the resin A and the powder of the phosphor B are thoroughly mixed, and then added to the barrel of the injection molding machine to melt, and the remote phosphor housing 3 is obtained by the injection molding process by means of the mold;
步骤三：将实心曲面体4放入远程荧光粉壳体3中，在真空中烘烤使得实心曲面体4的外表面与远程荧光粉壳体3的内表面充分贴合；其中烘烤温度的特征在于使得有机物C和有机物A发生软化粘连，但未形成熔化状态。Step 3: The solid curved body 4 is placed in the remote phosphor housing 3, and baked in a vacuum so that the outer surface of the solid curved body 4 is sufficiently adhered to the inner surface of the remote phosphor housing 3; It is characterized in that the organic substance C and the organic substance A are softened and adhered, but the molten state is not formed.
其中步骤二和三还可以采用下列步骤来取代完成，如图5所示： Steps 2 and 3 can also be replaced by the following steps, as shown in Figure 5:
S301：将树脂A粉末、荧光粉B粉末和溶剂混和成均匀的浆料，其中树脂A粉末与荧光粉B粉末的质量比为100:10－20:150，荧光粉B粉末加树脂A粉末混合物的总体积与溶剂的体积比为10：100－300：100,且树脂A粉末和荧光粉B粉末的粒径在1微米到60微米之间；其中溶剂是液体的醇、醚、酮、酯、烃类。S301: mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture The volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
S303:将上述浆料均匀涂覆在实心曲面体4的表面上，将涂覆浆料的实心曲面体4恒温干燥，干燥温度为40℃-130℃，干燥时间为5分钟-10小时；浆料的涂覆工艺包括丝网印刷及静电喷涂等。S303: uniformly coating the slurry on the surface of the solid curved body 4, and drying the solid curved body 4 coated with the slurry at a temperature of 40 ° C to 130 ° C and a drying time of 5 minutes to 10 hours; The coating process of the material includes screen printing and electrostatic spraying.
S305:将干燥后的涂有浆料的实心曲面体4烘烤,烘烤温度T1为100℃-260℃，升温速率为1-10℃/分钟，烘烤时间为5分钟-20小时，降温时间为20分钟-10小时，在实心曲面体4表面得到含有荧光粉B与树脂C的混合涂层；烘烤温度T1高于树脂C的玻璃化转变温度，但低于树脂A的融化温度10℃以上，且T1接近但低于树脂A的融化温度；在烘烤温度T1下，有机溶剂完全挥发或分解；在烘烤温度T1下，树脂A粉末软化并结合成连续的玻璃体，即可在实心曲面体4表面得到含荧光粉B的树脂A涂层。S305: baking the dried solid curved body 4 coated with the slurry, the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, and the baking time is 5 minutes - 20 hours. The cooling time is from 20 minutes to 10 hours, and a mixed coating containing the phosphor B and the resin C is obtained on the surface of the solid curved body 4; the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting of the resin A The temperature is above 10 ° C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous The vitreous body can obtain a resin A coating containing phosphor B on the surface of the solid curved body 4.
树脂A应该比树脂C有更好的流动性，而且树脂A的玻璃化转变温度及融化温度均低于树脂A的玻璃化转变温度及融化温度10℃以上，在烘烤温度T1下树脂A的粉末软化、甚至接近融化，在树脂C表面上相互粘连，形成均匀分布的连续玻璃体；此时，荧光粉B颗粒被连续的玻璃体(树脂A)分隔并包裹，在实心曲面体4表面上形成均匀的含荧光粉B的树脂A涂层。Resin A should have better fluidity than resin C, and the glass transition temperature and melting temperature of resin A are lower than the glass transition temperature and melting temperature of resin A by 10 ° C or higher, and resin A at baking temperature T 1 . The powder is softened, even close to melting, and adheres to each other on the surface of the resin C to form a uniform distribution of the continuous glass body; at this time, the phosphor B particles are separated and wrapped by the continuous glass body (resin A) to form on the surface of the solid curved body 4 A uniform Resin B coating containing Phosphor B.
树脂A应该有与树脂C相近或相同的热膨胀系数，以免从烘烤温度T1冷却至室温的过程中，由于两种树脂的热膨胀系数的差异导致实心曲面体4变形；对于热膨胀系数差异不大的两种树脂，可以借助于模具来固定实心曲面体4的形状；优选树脂A和树脂C为同一种树脂的不同衍生品种，则树脂C涂层与实心曲面体4会完全融为一体化的结构。Resin A should have a thermal expansion coefficient similar to or the same as that of resin C, so as not to be deformed from the baking temperature T 1 to room temperature, the solid curved body 4 is deformed due to the difference in thermal expansion coefficients of the two resins; there is little difference in thermal expansion coefficient The two resins can fix the shape of the solid curved body 4 by means of a mold; preferably, the resin A and the resin C are different derivatives of the same resin, and the resin C coating and the solid curved body 4 are completely integrated. structure.
上述步骤S303中干燥过程能在空气中进行，也能在真空中进行。The drying process in the above step S303 can be carried out in the air or in a vacuum.
上述步骤S305中烘烤过程能在空气中进行，也能在真空中进行，烘烤方式是利用红外线直接烘烤或利用电热丝加热烘烤；In the above step S305, the baking process can be carried out in the air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire;
上述步骤S303和S305可以合并为一个分步加热步骤进行。The above steps S303 and S305 can be combined into one step heating step.
多次重复步骤S301～S305,直至远程荧光粉壳体3满足厚度要求为止。Steps S301 to S305 are repeated a plurality of times until the remote phosphor case 3 satisfies the thickness requirement.
实施例2：Example 2:
实施例2与实施例1的区别在于,为了增强光线的混合效果，在制备远程荧光粉壳体 3时，还可以在荧光粉B粉末与树脂A粉末的混合粉末中加入适量的二氧化硅(SiO2)、二氧化锆(ZrO2)、三氧化二铝(Al2O3)等无机氧化物颗粒，以起到混光作用。其中荧光粉B粉末与这些氧化物颗粒的体积比为100：1～100：150。所加氧化物颗粒的粒径可根据具体的实际要求选择。上述无机氧化物颗粒也可以根据需要由两种或两种以上的种类搭配构成。The difference between the embodiment 2 and the embodiment 1 is that, in order to enhance the mixing effect of the light, in the preparation of the remote phosphor housing 3, an appropriate amount of silica may be added to the mixed powder of the phosphor B powder and the resin A powder ( Inorganic oxide particles such as SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) act as a light-mixing effect. The volume ratio of the phosphor B powder to the oxide particles is from 100:1 to 100:150. The particle size of the added oxide particles can be selected according to specific practical requirements. The inorganic oxide particles may be composed of two or more types as needed.
在图7中，通过电气连接端子17和22给发光装置提供一定工作电压或工作电流后，蓝光芯片20发出蓝色光线，并首先进入实心曲面体4，其中部分蓝色光线照射到远程荧光粉壳体中的荧光粉颗粒B上，激发其发出波长较长的黄色光线。这样LED芯片发出的部分蓝色光线与荧光粉受激发出的黄色光线混合就得到了白色光线。In FIG. 7, after a certain operating voltage or operating current is supplied to the light-emitting device through the electrical connection terminals 17 and 22, the blue chip 20 emits blue light and first enters the solid curved body 4, and some of the blue light is irradiated to the remote phosphor. On the phosphor particles B in the casing, it emits yellow light having a longer wavelength. In this way, part of the blue light emitted by the LED chip is mixed with the yellow light excited by the phosphor to obtain white light.
额外加进的(SiO2)、二氧化锆(ZrO2)、三氧化二铝(Al2O3)等无机氧化物颗粒会对LED蓝光芯片20发出的蓝色光中，未被程荧光粉壳体3中的荧光粉B颗粒所吸收的那部分蓝光和荧光粉B颗粒受激发所发出的波长较长的光进行更复杂的反射及折射，使得所述的两部分光线进行更充分的混合，因此获得更好质量的白光。Inorganic oxide particles such as (SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) added to the blue light emitted from the LED blue chip 20 The portion of the blue light and the phosphor B particles absorbed by the phosphor B particles in the body 3 are more complexly reflected and refracted by the longer wavelength light emitted by the excitation, so that the two portions of the light are more thoroughly mixed. Therefore, a better quality white light is obtained.
实施例3：Example 3:
以图3对实施例3做具体说明。 Embodiment 3 will be specifically described with reference to FIG. 3.
图3是方伞型凸面形状结构的远程荧光粉透镜结构示意图，其中，方伞型凸面形状结构实心曲面体11的底面为一正方形，四条边的交点分别为H、I、J和K,方伞型凸面形状结构实心曲面体11是由以线段JK和线段HI的中点连线为轴线的半圆柱体及以线段IJ和线段HK中点连线为轴线的半园柱体的重叠部分构成的区域；方伞型凸面形状结构实心曲面体11的表面与方伞型凸面形状结构的较大远程荧光粉壳体10的内表面完全一致，且方伞型凸面形状结构的较大远程荧光粉壳体10具有均匀的厚度，厚度范围为1毫米。；3 is a schematic structural view of a remote phosphor lens having a square umbrella-shaped convex shape structure, wherein the bottom surface of the solid curved surface body 11 of the square umbrella-shaped convex shape structure is a square, and the intersections of the four sides are H, I, J, and K, respectively. Umbrella-shaped convex shape structure The solid curved surface body 11 is composed of a semi-cylindrical body with a line connecting the midpoint of the line segment JK and the line segment HI, and an overlapping portion of the semi-circular cylinder with the line connecting line IJ and the midpoint of the line segment HK as the axis. Area; square umbrella-shaped convex shape structure The surface of the solid curved surface body 11 is completely identical with the inner surface of the large remote phosphor housing 10 of the square umbrella-shaped convex shape structure, and the large remote phosphor of the square umbrella-shaped convex shape structure The housing 10 has a uniform thickness and a thickness in the range of 1 mm. ;
方伞型凸面形状结构的远程荧光粉透镜的制备步骤如下：The preparation steps of the remote phosphor lens of the square umbrella type convex shape structure are as follows:
步骤一：将硅胶注入模具，经60～150℃固化30分钟～2小时，冷却后即可获得实心曲面体11；Step 1: Inject the silica gel into the mold and cure it at 60-150 ° C for 30 minutes to 2 hours. After cooling, the solid curved body 11 can be obtained;
步骤二：将硅胶与荧光粉B的粉末充分混合，经真空去气泡后注入模具，经60～150℃固化30分钟～2小时，冷却后即可获得方伞型凸面形状结构的较大远程荧光粉壳体10。Step 2: thoroughly mix the silica gel and the powder of the phosphor B, and then inject it into the mold after vacuuming, and then solidify at 60 to 150 ° C for 30 minutes to 2 hours, and then obtain a large remote fluorescence of the convex shape of the square umbrella shape after cooling. Powder housing 10.
步骤三：在方伞型凸面形状结构的较大远程荧光粉壳体10的内表面涂覆透明胶水，将实心曲面体11安置进远程荧光粉壳体10内，经60～150℃固化30分钟～2小时，冷却后即 可获得方伞型凸面形状结构的远程荧光粉透镜。Step 3: Applying a transparent glue to the inner surface of the large remote phosphor housing 10 of the square umbrella-shaped convex shape structure, and placing the solid curved surface body 11 into the remote phosphor housing 10, and curing at 60 to 150 ° C for 30 minutes. ~2 hours, after cooling A remote phosphor lens having a square umbrella-shaped convex shape structure can be obtained.
有机胶水与实心曲面体和远程荧光粉壳体有相同或相近的折射率，以免造成光线传输损失。The organic glue has the same or similar refractive index as the solid curved body and the remote phosphor housing to avoid loss of light transmission.
实施例4：Example 4:
以图6和图7对实施例4做具体说明。 Embodiment 4 will be specifically described with reference to FIGS. 6 and 7.
图7表示由COB蓝光光源加远程荧光粉透镜组合成的白光发光装置结构示意图，图6表示图7中COB蓝光集成光源(22W)的结构示意图，包含基板16，基板16上的LED芯片区域粘贴多个(组)蓝光LED芯片20，多个蓝光LED芯片通过金线21与基板16上的电路连接，17和22为光源的电气连接端子。7 is a schematic structural view of a white light emitting device combined with a COB blue light source and a remote phosphor lens, and FIG. 6 is a schematic structural view of the COB blue integrated light source (22W) of FIG. 7, including a substrate 16, and an LED chip region on the substrate 16 is pasted. A plurality of (group) blue LED chips 20, a plurality of blue LED chips being connected to circuits on the substrate 16 via gold wires 21, and 17 and 22 being electrical connection terminals of the light source.
其中，LED芯片区域上覆盖一层透明硅胶19，透明硅胶层的厚度以刚好覆盖芯片及金线为好，将远程荧光粉透镜安置在透明硅胶层上，透镜外侧刚好紧贴围坝18，在透镜与围坝的连接处涂有硅胶。远程荧光粉透镜中实心曲面体4及远程荧光粉壳体3的有机物均为硅胶，荧光粉B包含LED绿色荧光粉(发光中心波长554nm)与红色荧光粉(波长643nm)。Wherein, the LED chip area is covered with a transparent silica gel 19, and the thickness of the transparent silica gel layer is just enough to cover the chip and the gold wire, and the remote phosphor lens is placed on the transparent silica gel layer, and the outer side of the lens is just close to the dam 18, The connection between the lens and the dam is coated with silica gel. The organic matter of the solid curved body 4 and the remote phosphor case 3 in the remote phosphor lens is silica gel, and the phosphor B contains an LED green phosphor (luminescence center wavelength 554 nm) and a red phosphor (wavelength 643 nm).
将上述COB蓝光光源加远程荧光粉透镜组合放置在恒温烘箱中烘烤固化，烘烤温度为100℃，烘烤时间为2小时。待烘箱冷却至室温后，将固化后的COB蓝光光源加远程荧光粉透镜组合取出就得到了本发明的白光发光装置。The COB blue light source and the remote phosphor lens combination were placed in a constant temperature oven for baking and curing, the baking temperature was 100 ° C, and the baking time was 2 hours. After the oven is cooled to room temperature, the solidified COB blue light source and the remote phosphor lens are combined and taken out to obtain the white light emitting device of the present invention.
经测试表明，采用传统平面封装工艺的22W COB集成白光光源的亮度为2444流明，显指为90，而本发明中的白光发光装置的亮度为3080流明，显指为90。 Tests have shown that the brightness of the 22W COB integrated white light source using the conventional planar packaging process is 2444 lumens, which is indicated by 90, while the brightness of the white light emitting device of the present invention is 3080 lumens, which is indicated as 90.

Claims (11)

  1. 一种远程荧光粉透镜，其特征是包括一种复合曲面结构,其中复合曲面结构是一个具有较大曲率半径的类半球壳体和一个具有较小曲率半径的类半球实心曲面体的复合体，复合体的横截面为类半圆形；较大曲率半径的壳体和具有较小曲率半径的实心曲面体的类半圆形截面共有一个圆心；或是一个底面为正方形的具有方伞型凸面形状结构的大远程荧光粉壳体和一个小的方伞型凸面形状结构实心曲面体的复合体；或是一个底面为长方形的具有变形的半园柱体形状结构的大远程荧光粉壳体和一个小的变形的半园柱体形状结构实心曲面体的复合体。A remote phosphor lens characterized by comprising a composite curved structure, wherein the composite curved structure is a composite of a hemispherical shell having a large radius of curvature and a hemispherical solid curved body having a small radius of curvature. The cross section of the composite is semi-circular; the semi-circular cross-section of the shell with a large radius of curvature and the solid curved body with a small radius of curvature has a center; or a square-shaped convex surface with a square bottom. a large remote phosphor housing of a shape structure and a composite of a small square umbrella-shaped convex shape solid curved body; or a large remote phosphor housing having a rectangular bottom surface having a deformed semi-cylindrical shape structure and A small deformed semi-cylindrical shape structure of a solid curved body complex.
  2. 根据权利要求1所述的远程荧光粉透镜，其特征在于壳体具有一个外表面和一个内表面；壳体的外表面为球面、抛物面或任意光滑的凸面；壳体的厚度是均匀的，或根据其最终的应用环境来调节；壳体的厚度范围为50微米～3毫米；壳体的内表面与实心曲面体表面的物理形状完全一致，为球面、或抛物面或任意光滑表面；较小的实心曲面体表面与较大的壳体内表面完全贴合。The remote phosphor lens of claim 1 wherein the housing has an outer surface and an inner surface; the outer surface of the housing is a spherical surface, a paraboloid or any smooth convex surface; the thickness of the housing is uniform, or Adjusted according to its final application environment; the thickness of the shell ranges from 50 microns to 3 mm; the inner surface of the shell is exactly the same as the physical shape of the surface of the solid curved surface, which is spherical, or parabolic or any smooth surface; The solid curved body surface fits snugly against the larger inner surface of the housing.
  3. 根据权利要求1所述的远程荧光粉透镜，其特征在于，较大的壳体是一种远程荧光粉结构，包含一种透明有机物基体A与荧光粉B颗粒的混合物；其中，透明有机物基体A的材质为PMMA、PMMA合金树脂、聚碳酸酯、PC合金树脂、环氧、丁苯、苯砜树脂、CR-39、MS、NAS、聚氨脂光学树脂、尼龙或PC增强的PMMA或MS树脂、或硅橡胶；其中，荧光粉B为LED黄色荧光粉、或LED绿色荧光粉与LED红色荧光粉的混合物，或者是LED黄色荧光粉与少量LED红色荧光粉的混合物；较小的实心曲面体为一种透明的有机物C，其材质为PMMA、PMMA合金树脂、聚碳酸酯、PC合金树脂、环氧、丁苯、苯砜树脂、CR-39、MS、NAS、聚氨脂光学树脂、尼龙或PC增强的PMMA或MS树脂、或硅橡胶；具体可以根据使用温度环境来选择。The remote phosphor lens according to claim 1, wherein the larger casing is a remote phosphor structure comprising a mixture of a transparent organic substrate A and phosphor B particles; wherein the transparent organic substrate A Materials are PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butyl benzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin Or silicone rubber; wherein, phosphor B is an LED yellow phosphor, or a mixture of LED green phosphor and LED red phosphor, or a mixture of LED yellow phosphor and a small amount of LED red phosphor; smaller solid curved body It is a transparent organic substance C, which is made of PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, phenyl sulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon. Or PC-reinforced PMMA or MS resin, or silicone rubber; specifically, it can be selected according to the temperature environment.
  4. 根据权利要求1、2和3所述的远程荧光粉透镜，其特征在于，壳体的有机物基体A与实心曲面体的材质C相同或不同；壳体的有机物基体A与实心曲面体的材质C具有相同或相近的折射率，以避免光线的传播损失。The remote phosphor lens according to any one of claims 1, 2 and 3, wherein the organic substance matrix A of the casing is the same as or different from the material C of the solid curved body; the material C of the organic body of the casing and the material C of the solid curved body Have the same or similar refractive index to avoid loss of light propagation.
  5. 根据权利要求1所述的远程荧光粉透镜，其特征在于，较大的远程荧光粉壳体还包含双层结构，该双层结构包含远程荧光粉外层壳体和远程荧光粉内层壳体的复合结构；内层壳体的外表面与外层壳体的内表面的物理形貌完全一样，所用材质也相同；内层壳体与外层壳体的厚度相同或不同；外层壳体中包含机物基体A和荧光粉D的混合物，内层壳体中包含有机物基体A和荧光粉E的混合物；远程荧光粉内层壳体中的荧光粉是LED黄色荧光粉、或LED红色荧光 粉，或上述任意二种荧光粉的混合物；上述远程荧光粉外层壳体中的荧光粉D是LED黄色荧光粉、或LED绿色荧光粉，或上述任意二种荧光粉的混合物；但远程荧光粉内层壳体和远程荧光粉外层壳体所用荧光粉成分不同。The remote phosphor lens of claim 1 wherein the larger remote phosphor housing further comprises a two-layer structure comprising a remote phosphor outer shell and a remote phosphor inner shell Composite structure; the outer surface of the inner casing is exactly the same as the inner surface of the outer casing, and the materials used are the same; the thickness of the inner casing and the outer casing are the same or different; the outer casing The mixture comprising the matrix of the organic substance A and the phosphor D, the inner shell comprises a mixture of the organic matrix A and the phosphor E; the phosphor in the inner shell of the remote phosphor is an LED yellow phosphor or an LED red fluorescent Powder, or a mixture of any two of the above phosphors; the phosphor D in the outer layer of the remote phosphor is an LED yellow phosphor, or an LED green phosphor, or a mixture of any two of the above; but remotely fluorescent The powder inner shell and the remote phosphor outer shell have different phosphor compositions.
  6. 一种远程荧光粉透镜的制备方法，其特征在于，对于有机物基体A和有机物C的材质均为热塑性树脂时，包括下列步骤：A method for preparing a remote phosphor lens, characterized in that, when the materials of the organic substrate A and the organic material C are all thermoplastic resins, the following steps are included:
    步骤一：将树脂C的颗粒加入注塑机的料筒熔化，借助于模具通过注塑工艺获得实心曲面体；Step 1: the particles of the resin C are melted into the barrel of the injection molding machine, and the solid curved body is obtained by the injection molding process by means of the mold;
    步骤二：将树脂A的粉末与荧光粉B的粉末充分混合后加入注塑机料筒熔化，借助于模具通过注塑工艺获得远程荧光粉壳体；Step 2: thoroughly mixing the powder of the resin A with the powder of the phosphor B, and then adding it to the barrel of the injection molding machine to melt, and obtaining the remote phosphor housing by the injection molding process by means of the mold;
    步骤三：将实心曲面体放入远程荧光粉壳体中，在真空中烘烤使得实心曲面体的外表面与远程荧光粉壳体的内表面充分贴合；其中烘烤温度的特征在于使得有机物C和有机物A发生软化粘连，但未形成熔化状态。Step 3: placing the solid curved body into the remote phosphor housing, and baking in a vacuum so that the outer surface of the solid curved body is fully adhered to the inner surface of the remote phosphor housing; wherein the baking temperature is characterized by the organic matter C and organic substance A softened and adhered, but did not form a molten state.
  7. 根据权利要求6所述的一种远程荧光粉透镜的制备方法，其特征在于，步骤二和三还可以采用下列步骤来取代完成，具体如下：The method for preparing a remote phosphor lens according to claim 6, wherein the steps 2 and 3 can also be replaced by the following steps, as follows:
    S301：将树脂A粉末、荧光粉B粉末和溶剂混和成均匀的浆料，其中树脂A粉末与荧光粉B粉末的质量比为100:10－20:150，荧光粉B粉末加树脂A粉末混合物的总体积与溶剂的体积比为10：100－300：100,且树脂A粉末和荧光粉B粉末的粒径在1微米到60微米之间；其中溶剂是液体的醇、醚、酮、酯、烃类。S301: mixing resin A powder, phosphor B powder and solvent into a uniform slurry, wherein the mass ratio of the resin A powder to the phosphor B powder is 100:10-20:150, and the phosphor B powder plus the resin A powder mixture The volume ratio of the total volume to the solvent is 10:100-300:100, and the particle size of the resin A powder and the phosphor B powder is between 1 micrometer and 60 micrometer; wherein the solvent is a liquid alcohol, ether, ketone, ester , hydrocarbons.
    S303:将上述浆料均匀涂覆在实心曲面体的表面上，将涂覆浆料的实心曲面体恒温干燥，干燥温度为40℃-130℃，干燥时间为5分钟-10小时；浆料的涂覆工艺包括丝网印刷及静电喷涂。S303: uniformly coating the slurry on the surface of the solid curved body, and drying the solid curved body of the coating slurry at a temperature of 40 ° C to 130 ° C, and drying time of 5 minutes to 10 hours; The coating process includes screen printing and electrostatic spraying.
    S305:将干燥后的涂有浆料的实心曲面体烘烤,烘烤温度T1为100℃-260℃，升温速率为1-10℃/分钟，烘烤时间为5分钟-20小时，降温时间为20分钟-10小时，在实心曲面体表面得到含有荧光粉B与树脂C的混合涂层；烘烤温度T1高于树脂C的玻璃化转变温度，但低于树脂A的融化温度10℃以上，且T1接近但低于树脂A的融化温度；在烘烤温度T1下，有机溶剂完全挥发或分解；在烘烤温度T1下，树脂A粉末软化并结合成连续的玻璃体，即可在实心曲面体表面得到含荧光体B的树脂A涂层。S305: baking the dried solid curved surface body after baking, the baking temperature T 1 is 100 ° C - 260 ° C, the heating rate is 1-10 ° C / min, the baking time is 5 minutes - 20 hours, cooling The time is from 20 minutes to 10 hours, and a mixed coating containing phosphor B and resin C is obtained on the surface of the solid curved surface; the baking temperature T 1 is higher than the glass transition temperature of the resin C, but lower than the melting temperature of the resin A 10 Above °C, and T 1 is close to but lower than the melting temperature of the resin A; at the baking temperature T 1 , the organic solvent is completely volatilized or decomposed; at the baking temperature T 1 , the resin A powder is softened and combined into a continuous glass body, A resin A coating containing phosphor B can be obtained on the surface of the solid curved surface.
    上述步骤S303中干燥过程能在空气或在真空中进行。The drying process in the above step S303 can be carried out in air or in a vacuum.
    上述步骤S305中烘烤过程能在空气或在真空中进行，烘烤方式是利用红外线直接烘烤或利用电热丝加热烘烤。 In the above step S305, the baking process can be carried out in air or in a vacuum, and the baking method is direct baking by infrared rays or heating and baking by electric heating wire.
    上述步骤S303和S305能合并为一个分步加热步骤进行。The above steps S303 and S305 can be combined into one step heating step.
  8. 根据权利要求6和7所述的一种远程荧光粉透镜的制备方法，其特征在于，树脂A应该比树脂C有更好的流动性，而且树脂A的玻璃化转变温度及融化温度均低于树脂A的玻璃化转变温度及融化温度10℃以上，在烘烤温度T1下树脂A的粉末软化、甚至接近融化，在树脂C表面上相互粘连，形成均匀分布的连续玻璃体；此时，荧光粉B颗粒被连续的玻璃体即树脂A分隔并包裹，在实心曲面体4表面上形成均匀的含荧光粉B的树脂A涂层；树脂A应该有与树脂C相近或相同的热膨胀系数，以免从烘烤温度T1冷却至室温的过程中，由于两种树脂的热膨胀系数的差异导致实心曲面体变形；优选树脂A和树脂C为同一种树脂的不同衍生品种。A method for preparing a remote phosphor lens according to claims 6 and 7, wherein the resin A should have better fluidity than the resin C, and the glass transition temperature and melting temperature of the resin A are lower than The glass transition temperature and the melting temperature of the resin A are 10 ° C or higher, and the powder of the resin A softens or even approaches melting at the baking temperature T 1 , and adheres to each other on the surface of the resin C to form a uniformly distributed continuous glass body; The powder B particles are separated and wrapped by a continuous glass body, that is, the resin A, and a uniform phosphor A-containing resin A coating layer is formed on the surface of the solid curved body 4; the resin A should have a thermal expansion coefficient close to or the same as that of the resin C, so as not to During the cooling of the baking temperature T 1 to room temperature, the solid curved body is deformed due to the difference in thermal expansion coefficients of the two resins; preferably, the resin A and the resin C are different derivatives of the same resin.
  9. 一种远程荧光粉透镜的制备方法，其特征在于，对于有机物基体A和有机物C的材质均为热固性树脂或硅胶时，远程荧光粉透镜的制造方法包括下列步骤：A method for preparing a remote phosphor lens, wherein when the materials of the organic substrate A and the organic material C are thermosetting resins or silica gel, the method for manufacturing the remote phosphor lens comprises the following steps:
    步骤一：将热固性树脂或硅橡胶调匀，去气泡后注入模具，在50℃～200℃下固化20分钟～2小时，然后冷却至室温，即可获得实心曲面体；Step 1: Mix the thermosetting resin or silicone rubber, remove the bubbles, inject into the mold, cure at 50 ° C ~ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature to obtain a solid curved body;
    步骤二：将热固性树脂或硅橡胶与荧光粉B的粉末充分混合，去气泡后注入模具，在50℃～200℃下固化20分钟～2小时，然后冷却至室温，即可获得远程荧光粉壳体3；Step 2: thoroughly mix the thermosetting resin or silicone rubber with the powder of the phosphor B, remove the bubbles, inject into the mold, cure at 50 ° C ~ 200 ° C for 20 minutes to 2 hours, and then cool to room temperature to obtain the remote phosphor powder shell. Body 3;
    步骤三：在远程荧光粉壳体的内表面涂覆透明的有机胶水，然后将实心曲面体放入远程荧光粉壳体中，在真空中烘烤使得实心曲面体的外表面与远程荧光粉壳体的内表面充分贴合；有机胶水与实心曲面体和远程荧光粉壳体有相同或相近的折射率，以免造成光线传输损失。Step 3: Apply transparent organic glue to the inner surface of the remote phosphor housing, then place the solid curved body into the remote phosphor housing and bake in vacuum to make the outer surface of the solid curved body and the remote phosphor shell The inner surface of the body is fully conformed; the organic glue has the same or similar refractive index as the solid curved body and the remote phosphor housing to avoid loss of light transmission.
  10. 根据权利要求1、6和9所述的一种远程荧光粉透镜的制备方法，其特征在于，为了增强光线的混合效果，在制备远程荧光粉壳体时，还可以在荧光粉中加入适量的二氧化硅(SiO2)、二氧化锆(ZrO2)、三氧化二铝(Al2O3)等无机氧化物颗粒，以起到混光的作用。其中荧光粉与氧化物颗粒的体积比为100：1～100：150；上述无机氧化物颗粒也可以根据需要由两种或两种以上的种类搭配构成。The method for preparing a remote phosphor lens according to claims 1, 6 and 9, characterized in that, in order to enhance the mixing effect of the light, an appropriate amount of the phosphor may be added to the phosphor during the preparation of the remote phosphor shell. Inorganic oxide particles such as silica (SiO 2 ), zirconium dioxide (ZrO 2 ), and aluminum oxide (Al 2 O 3 ) act to mix light. The volume ratio of the phosphor to the oxide particles is from 100:1 to 100:150; and the inorganic oxide particles may be composed of two or more types as needed.
  11. 一种运用远程荧光粉透镜的白光发光装置，其特征在于，包含一个发光区域为圆形COB集成蓝光光源和一个类半球体复合曲面结构的远程荧光粉透镜，或包含一个发光区域为正方形COB集成蓝光光源和一个方伞型凸面形状结构的远程荧光粉透镜，或包含一个发光区域为长方形COB集成蓝光光源和一个变形的半园柱体形状结构的远程荧光粉透镜；荧光粉与蓝光芯片间是一种“远程荧光粉”设置，与传统的将荧光粉与硅胶或环氧的混合物直接涂覆在蓝光芯片表面不同，蓝光芯片与荧光粉间不直接接触，有一定的物理空间。 A white light emitting device using a remote phosphor lens, characterized in that it comprises a remote phosphor lens with a circular COB integrated blue light source and a hemispherical composite curved surface structure, or a light emitting area for square COB integration A blue phosphor light source and a remote phosphor lens having a square umbrella-shaped convex shape structure, or a remote phosphor lens having a light-emitting area of a rectangular COB integrated blue light source and a deformed semi-cylindrical shape structure; between the phosphor and the blue chip A "remote phosphor" setting is different from the traditional application of a mixture of phosphor and silica gel or epoxy directly on the surface of the blue chip. The blue chip does not directly contact the phosphor and has a certain physical space.
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