WO2016064101A1 - 유리 면취 방법 - Google Patents

유리 면취 방법 Download PDF

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Publication number
WO2016064101A1
WO2016064101A1 PCT/KR2015/010220 KR2015010220W WO2016064101A1 WO 2016064101 A1 WO2016064101 A1 WO 2016064101A1 KR 2015010220 W KR2015010220 W KR 2015010220W WO 2016064101 A1 WO2016064101 A1 WO 2016064101A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
glass substrate
chamfering
heating member
substrate
Prior art date
Application number
PCT/KR2015/010220
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
손동진
김동환
김종민
탁광용
Original Assignee
동우화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 동우화인켐 주식회사 filed Critical 동우화인켐 주식회사
Publication of WO2016064101A1 publication Critical patent/WO2016064101A1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/002—Thermal treatment

Definitions

  • the present invention relates to a glass substrate chamfering processing method for chamfering a glass substrate by applying a specific range of heat and pressure.
  • Glass products are treated as essential components in a wide range of technologies and industries, such as monitors, cameras, VTRs, mobile phones, video and optical equipment, automobiles, transportation equipment, various tableware, and construction facilities. According to the present invention, glass having various physical properties is manufactured and used.
  • Such a glass substrate for display can be largely produced by a floating method and an overflow method.
  • Floating method is a method of making glass substrates by dropping glass flowing down from the furnace to cool down.
  • Overflow method is a method of making glass substrates by flowing glass boiled in the furnace horizontally. Floating method is compared with overflow method. While an additional polishing process is required, it is widely used in manufacturing glass substrates because of its wide production capability.
  • particles generated during the process can be a major source of contamination on the surface of the glass plate, requiring large-scale cleaning and drying at the end of the glass substrate manufacturing process, and increasing the manufacturing cost by the additional steps. Problem occurs.
  • the particles and chips caught between the belt and the glass sheet can seriously damage the surface of the glass sheet, interrupt the series of processing steps, and reduce the processing rate due to the reduced number of selected products. have.
  • Korean Laid-Open Patent Publication No. 2013-0081541 discloses a processing method for cutting glass edges into strips using MoSi2 as a heating element in order to minimize dust generated during edge processing of glass substrates. have.
  • the glass surface condition is important because it is processed by heat.Chippings that existed on the glass substrate before processing cause uneven heat distribution, and after processing, the glass surface does not have a straightness, so stress concentration occurs. There is a problem of lowering the strength.
  • An object of this invention is to provide the chamfering method of the glass substrate which can lower the surface roughness of a glass substrate.
  • an object of this invention is to provide the chamfering method of the glass substrate which can improve the elongation of a glass substrate.
  • a method of chamfering a corner by contacting a heating member with an edge of a glass substrate wherein the amount of heat supplied from the heating member to the glass substrate is 10 to 200 Kcal, and the pressure applied to the glass substrate is 300 to 700 kgf.
  • Glass chamfering method which is / cm2.
  • the edge of the glass substrate is cut by the thermal stress, glass chamfering method.
  • the thermal conductivity of the glass substrate is 0.5 to 1 Kcal / mh °C, glass chamfering method.
  • the temperature of the heating member is 1200 to 1700 °C, glass chamfering method.
  • the moving speed of the heating member is 0.5 to 5 m / min, glass chamfering method.
  • the surface roughness (Ra) of the chamfered surface of the glass substrate is 20 ⁇ m or less, glass chamfering method.
  • the glass substrate is a tempered glass substrate
  • glass chamfering method In the above 1, wherein the glass substrate is a tempered glass substrate, glass chamfering method.
  • the tempered glass substrate has a Vickers hardness of 600 to 700 kgf / mm2, glass chamfering method.
  • the tempered glass substrate is a reinforced layer depth of 10 to 200 ⁇ m, glass chamfering method.
  • the present invention can smoothly process the edges of the glass substrate by chamfering by applying a specific range of heat and pressure to the glass substrate, thereby lowering the surface roughness.
  • the stress is evenly distributed, and the elongation of the glass substrate can be improved.
  • the quality of the glass substrate which carried out the chamfering process can be improved by the method of this invention.
  • Example 1 is a view schematically showing the cut surface of the glass substrate when chamfered by the method of Example 1.
  • FIG. 2 is a view schematically showing the cut surface of the glass substrate when chamfered by the method of Comparative Example 1.
  • FIG 3 is a schematic cross-sectional view (a) and a front view (b) of a cut surface chamfered according to the present invention.
  • FIG. 4 is a view schematically showing an embodiment of a chamfering method according to the present invention.
  • FIG. 5 is a view schematically showing another embodiment of the chamfering method according to the present invention.
  • the present invention is a method of chamfering the corner by contacting the heating member to the edge of the glass substrate, the amount of heat supplied from the heating member to the glass substrate is 10 to 200 Kcal, the pressure applied to the glass substrate is 300 to It is related with the glass chamfering method which is 700 kgf / cm ⁇ 2>.
  • the heating member is brought into contact with the edge of the glass substrate to chamfer the edge, and the amount of heat Q supplied from the heating member to the glass substrate is determined by the thermal conductivity of the glass, the temperature of the heating element, the temperature of the glass, and the moving speed of the heating element. And after the heating element is in contact with the glass can be adjusted through the distance the heating element moved in the glass direction, it is 10 to 200Kcal.
  • the thermal stress is insufficient to chamfer the glass substrate with the heating member, and if it exceeds 200Kcal, the thermal stress is deformed and the glass is broken.
  • the heating member chamfers the glass substrate by applying a specific range of pressure to the glass substrate.
  • the present invention provides a method of chamfering a glass substrate by contacting a heating member while applying a certain range of pressure to the glass substrate, thereby partially melting the glass substrate by high temperature and high pressure, and thus chipping at the corners.
  • a certain range of pressure to the glass substrate, thereby partially melting the glass substrate by high temperature and high pressure, and thus chipping at the corners.
  • the processed surface becomes smooth and the surface roughness Ra is lowered.
  • the surface roughness value is not particularly problematic as long as it meets the object of the present invention, and may be, for example, 20 ⁇ m or less, and there is no particular limitation on the lower limit. .
  • the stress is evenly distributed on the glass substrate, so that the elongation (strength) of the glass substrate can be improved, and the elongation value is not particularly problematic as long as it satisfies the purpose of the present invention, for example, 0.15% or more.
  • the upper limit There is no special limit to the upper limit.
  • the range of pressure applied to the glass substrate is 300 to 700 kgf / cm 2, preferably 450 to 650 kgf / cm 2. If the pressure is less than 300kgf / cm2, the degree of elongation improvement is low, the effect of improving the strength of the glass substrate is lowered, and if the pressure exceeds 700kgf / cm2, there is a problem that a crack occurs in the glass substrate.
  • the glass chamfering method of this invention can chamfer a glass substrate by making a heating member contact the edge of a glass substrate, and cutting off the edge part of a glass substrate by thermal stress.
  • the heating member of the present invention is in contact with the edge of the glass substrate, due to the characteristics of the glass having a low heat transfer rate, thermal stress is generated at the edge portion where the heat generating device is in contact, so that the portion from the heat source contact portion to a predetermined depth is separated. Therefore, when the heating device moves while being in contact with the edge of the glass substrate, the edge of the glass substrate may be chamfered.
  • the thermal conductivity of the glass substrate chamfered according to the glass chamfering method of the present invention may be 0.5 to 1 Kcal / mh °C, preferably 0.7 to 0.9 Kcal / mh °C.
  • the chamfering process according to the present invention can be made while showing the desired effect of the present invention better.
  • the temperature of the heating member may be 1200 to 1700 °C, the temperature of the above range is preferable for the chamfering process, the higher the temperature within the range the effect that the processing speed is faster have.
  • the moving speed of the heating member may be 0.5 to 5 m / min, it is possible to prevent the occurrence of cracks due to thermal shock within the above range.
  • the kind of glass substrate to be chamfered by this invention is not restrict
  • the heat generating device for chamfering processing of this invention is applicable also to tempered glass.
  • the hardness of the tempered glass substrate is not particularly limited, specifically, Vickers hardness may be 600 to 700 kgf / mm2.
  • the depth of the reinforcing layer of the tempered glass substrate is not particularly limited, but may be specifically 10 to 200 ⁇ m.
  • Figure 3 is a schematic cross-sectional view (a) and the side of the chamfered glass Front view (b) is shown.
  • the method of processing the inclined upper and lower corners of the side surface of the glass to be inclined in a detailed order, the number of times, and the inclination angle of contacting the heating elements if the upper and lower corners are inclined in the final form There is no special limitation.
  • the heating element may be carried out by contacting the heating element to the upper and lower corners of the glass.
  • the inclined surface may be formed by contacting the heating element with the upper edge portion 1 and the lower edge portion 2 of the side surface of the glass.
  • the heating element may be contacted with the upper edge portion and the lower edge portion of the side of the glass and then contacted with the heating element in a parallel direction of the side of the glass.
  • Figure 5 schematically shows the chamfering method of this embodiment. Referring to Figure 5, first to form a slope to a predetermined portion (1) by contacting the heating element in the upper corner portion of the side of the glass. Next, the heating element is brought into contact with the upper edge portion of the side surface of the glass to form an inclined surface up to a predetermined portion (2). Subsequently, the final cross-sectional shape can be obtained by contacting the heating element in the parallel direction of the side surfaces of the glass to remove the glass to the required portion 3.
  • the order of the chamfering process can be changed, and thus, the chamfering process may be performed in a different order from that shown in FIG. 5.
  • the chamfering process may be performed in the order of 2, 1 and 3, or may be performed in the order of 3, 2, and 1, but is not limited thereto.
  • the reinforcement process of the surface of the side surface of glass can be further performed as needed. This reinforcement process allows for a more uniform surface and excellent strength.
  • the reinforcing process according to the present invention includes a method of polishing the side of the glass with a polishing wheel, or etching the side of the glass with an etchant containing hydrofluoric acid.
  • a method of polishing with a polishing wheel is a method of polishing the side of the glass more evenly by contacting the side of the glass with the rotating polishing wheel after the inclined surface processing by the heating element is completed. As a result, fine cracks or the like present on the surface are polished to reinforce the side surface of the glass.
  • the polishing wheel may use a wheel made of abrasive particles such as cerium oxide. It is preferable that the size of abrasive grain is 5 micrometers or less from the viewpoint which fully demonstrates the side reinforcement effect of glass. The smaller the size of the abrasive particles, the higher the polishing accuracy is. Therefore, the lower limit is not particularly limited, but considering the process time or the like, about 0.01 ⁇ m can be used.
  • the rotation speed of the polishing wheel is not particularly limited and may be appropriately selected so that the side of the glass is sufficiently polished to obtain a desired level of strength, for example, it may be 1,000 to 10,000 rpm.
  • the method of etching using hydrofluoric acid is a method of applying an etching solution containing hydrofluoric acid to the side of the glass to etch the surface portion of the side of the glass.
  • an etchant containing hydrofluoric acid the side of the glass exhibits an embossed pattern and is etched to reinforce the surface.
  • the etchant including hydrofluoric acid is an aqueous hydrofluoric acid solution, and may further include components known in the art as free etching components such as hydrochloric acid, nitric acid, and sulfuric acid, in addition to hydrofluoric acid.
  • the time for etching the side of the glass with the etchant including hydrofluoric acid is not particularly limited, but for example, etching between 30 seconds and 10 minutes may increase the strength without excessively etching the side of the glass.
  • the temperature of the etching liquid containing hydrofluoric acid is not specifically limited, For example, it is preferable that it is 20-50 degreeC. If the temperature is lower than 20 °C process time is long and the etching may proceed inadequately, if the temperature is higher than 50 °C process time is short but the etching may proceed unevenly.
  • An etchant including hydrofluoric acid may be applied to the side of the glass in a manner known in the art, such as sprayed on the side of the glass or immersing the side of the glass in the etchant.
  • the chamfering process was performed by making a glass substrate contact the heating member on process conditions like Table 1 below.
  • the ambient temperature during the process was 23.5 ° C. and the humidity (RH) was 17%.
  • the glass substrate used Corning's gorilla glass and the physical properties thereof are shown in Table 2 below.
  • T is the thickness of the window substrate (mm)
  • ⁇ is the crosshead displacement (mm)
  • s is the distance between the support spans (mm)
  • the chamfering according to the embodiments has a higher elongation than the glass substrates chamfering according to the comparative examples.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
PCT/KR2015/010220 2014-10-20 2015-09-25 유리 면취 방법 WO2016064101A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140141614A KR102223005B1 (ko) 2014-10-20 2014-10-20 유리 면취 방법
KR10-2014-0141614 2014-10-20

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WO2016064101A1 true WO2016064101A1 (ko) 2016-04-28

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KR (1) KR102223005B1 (zh)
TW (1) TW201619081A (zh)
WO (1) WO2016064101A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI726118B (zh) * 2016-08-12 2021-05-01 日商Ａｇｃ股份有限公司 玻璃基板及玻璃基板的製造方法
ES2957433A1 (es) * 2022-06-03 2024-01-18 Docampo Samuel Dieguez Procedimiento para transformar tejido de fibra de vidrio en un tejido con apariencia de fibra de carbono

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703591A (en) * 1985-04-15 1987-11-03 Libbey-Owens-Ford Co. Ultra-high pressure abrasive jet cutting of glass
JP2001294437A (ja) * 2000-04-13 2001-10-23 Sharp Corp 液晶表示装置のガラス基板の面取り方法およびその方法に用いる加熱器
KR20110017980A (ko) * 2009-08-17 2011-02-23 한양대학교 산학협력단 열응력을 이용한 유리판 절단장치 및 유리판 절단방법
KR20110131563A (ko) * 2010-05-31 2011-12-07 주)제원 Csc 유리박판의 모서리 연삭 방법 및 장치
KR20130081541A (ko) * 2012-01-09 2013-07-17 주식회사 라미넥스 유리 모서리 가공 방법 및 장치
KR20140018227A (ko) * 2011-02-28 2014-02-12 아사히 가라스 가부시키가이샤 강화용 유리판
KR20140062428A (ko) * 2011-09-15 2014-05-23 니폰 덴키 가라스 가부시키가이샤 유리판 절단방법 및 유리판 절단장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101405442B1 (ko) * 2012-08-01 2014-06-13 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703591A (en) * 1985-04-15 1987-11-03 Libbey-Owens-Ford Co. Ultra-high pressure abrasive jet cutting of glass
JP2001294437A (ja) * 2000-04-13 2001-10-23 Sharp Corp 液晶表示装置のガラス基板の面取り方法およびその方法に用いる加熱器
KR20110017980A (ko) * 2009-08-17 2011-02-23 한양대학교 산학협력단 열응력을 이용한 유리판 절단장치 및 유리판 절단방법
KR20110131563A (ko) * 2010-05-31 2011-12-07 주)제원 Csc 유리박판의 모서리 연삭 방법 및 장치
KR20140018227A (ko) * 2011-02-28 2014-02-12 아사히 가라스 가부시키가이샤 강화용 유리판
KR20140062428A (ko) * 2011-09-15 2014-05-23 니폰 덴키 가라스 가부시키가이샤 유리판 절단방법 및 유리판 절단장치
KR20130081541A (ko) * 2012-01-09 2013-07-17 주식회사 라미넥스 유리 모서리 가공 방법 및 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI726118B (zh) * 2016-08-12 2021-05-01 日商Ａｇｃ股份有限公司 玻璃基板及玻璃基板的製造方法
ES2957433A1 (es) * 2022-06-03 2024-01-18 Docampo Samuel Dieguez Procedimiento para transformar tejido de fibra de vidrio en un tejido con apariencia de fibra de carbono

Also Published As

Publication number Publication date
TW201619081A (zh) 2016-06-01
KR102223005B1 (ko) 2021-03-03
KR20160046357A (ko) 2016-04-29

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