WO2016052783A1 - 형광층 배치 방법 - Google Patents
형광층 배치 방법 Download PDFInfo
- Publication number
- WO2016052783A1 WO2016052783A1 PCT/KR2014/009310 KR2014009310W WO2016052783A1 WO 2016052783 A1 WO2016052783 A1 WO 2016052783A1 KR 2014009310 W KR2014009310 W KR 2014009310W WO 2016052783 A1 WO2016052783 A1 WO 2016052783A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluorescent layer
- phosphor
- layer pattern
- fluorescent
- manufacturing equipment
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 claims abstract description 32
- 239000000945 filler Substances 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 51
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000000126 substance Substances 0.000 abstract 5
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to a method of arranging a fluorescent layer, and more particularly, a fluorescent layer capable of effectively disposing a fluorescent layer at a desired position while preventing the fluorescent material from being damaged when the fluorescent layer is separated and disposed on an upper surface of the light emitting diode. It is about a placement method.
- Such light emitting diodes are used for automobile lighting, traffic lights, BLUs (back light units) of liquid crystal displays due to the above-mentioned advantages.
- the MacAdam Rule has been proposed as an index for evaluating whether the color coordinates measured by an artificial light source are the same as the color coordinates seen by the human eye.
- This MacAdam Rule provides four levels of criteria. In the Americas, artificial light sources that do not meet the MacAdam Rule's three-stage criteria are not allowed to be sold. It is very important to reduce the color deviation of the white light to satisfy the three levels of the MacAdam Rule.
- Korean Patent Laid-Open Publication No. 10-2008-0070193 discloses a fluorescent film in which a fluorescent material is formed on a film surface of a resin material.
- the fluorescent film is separated or cut off. The process is necessary.
- the color variation of the white light is not caused due to the electrostatic force or the adhesive force between the fluorescent material and the film of the resin material, or the fluorescent material is not effectively disposed on the upper surface of the light emitting diode. It was very difficult to reduce.
- the present invention has been made to solve the problems of the prior art, and the technical problem to be achieved by the present invention is to effectively prevent a fluorescent material from being broken when the fluorescent layer is disposed on the upper surface of the light emitting diode, while effectively desired position. It is to provide a fluorescent layer arrangement method capable of arranging a fluorescent layer in a.
- a fluorescent layer arrangement method includes a vertical frame and a shape of a fluorescent layer pattern penetrated in a vertical direction of the vertical frame in a predetermined region of the vertical frame.
- a fluorescent layer manufacturing apparatus including a plurality of fluorescent layer pattern holes, and filling the fluorescent layer material solution including phosphor, silicon, and filler in each of the fluorescent layer pattern holes of the fluorescent layer manufacturing equipment Drying the layer material solution to manufacture a fluorescent layer, placing a light emitting diode spaced apart from a lower portion of a phosphor present in any one of a plurality of fluorescent layer pattern holes of the fluorescent layer manufacturing equipment;
- the phosphor is applied by a force applied in the vertical direction downward from the top of the phosphor existing in the phosphor layer pattern hole. Come off the fluorescent layer pattern holes in the vertical direction on the lower side and a step is disposed on the upper surface of the LED.
- a force applied in a vertical direction downward from an upper portion of the phosphor existing in the phosphor layer pattern hole is lowered.
- the plane may be transmitted by a flat object.
- a fluorescent layer arrangement method includes a vertical frame and a shape of the fluorescent layer pattern penetrated in a vertical direction of the vertical frame in a predetermined region of the vertical frame.
- a fluorescent layer manufacturing apparatus including a plurality of fluorescent layer pattern holes, and filling the fluorescent layer material solution including phosphor, silicon, and filler in each of the fluorescent layer pattern holes of the fluorescent layer manufacturing equipment
- the phosphor is separated from the fluorescent layer pattern hole in the vertical direction upward and placed on the lower surface of the vacuum chuck, the lower surface of the vacuum chuck
- the upper surface of the upper guider may be flat.
- the fluorescent layer is not formed on the film surface of the resin material, and only the fluorescent layer prepared by filling the fluorescent material solution in the fluorescent layer pattern hole formed in the vertical frame region is just below.
- the fluorescent layer arrangement method is a fluorescent layer formed by filling a fluorescent material solution in the fluorescent layer pattern hole formed in the vertical frame region, the fluorescent material is not formed on the film surface of the resin material
- the fluorescent material is not formed on the film surface of the resin material
- FIG. 1 is a plan view of a fluorescent layer manufacturing equipment used in the fluorescent layer arrangement method according to embodiments of the present invention.
- Figure 2 is a perspective view of the fluorescent layer manufacturing equipment used in the fluorescent layer arrangement method according to embodiments of the present invention.
- FIG. 3 is a perspective view showing that the fluorescent layer is manufactured in the fluorescent layer manufacturing equipment of FIG.
- FIG 4 and 5 are cross-sectional views for explaining the detailed steps of the fluorescent layer arrangement method according to an embodiment of the present invention.
- 6 to 9 are cross-sectional views for explaining the detailed steps of the fluorescent layer arrangement method according to another embodiment of the present invention.
- the vertical frame 1100 and the vertical frame in a predetermined region of the vertical frame 1100 may be configured to include a plurality of fluorescent layer pattern holes (1111 to 1114, 1121 to 1124, 1131 to 1134, 1141 to 1144 through which the shape of the fluorescent layer pattern penetrates in the vertical direction of 1100).
- the plurality of fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 may include shapes of pad electrodes, respectively. Specifically, as shown in FIG. 1 or 2, the rectangular shape is included in the upper left and the upper right of the plurality of fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144, respectively.
- a pad electrode is formed on the upper left side and the upper right side of the fluorescent layer. Can be deployed.
- the shape of the pad electrode must be included in the upper left and upper right. It is not necessary, and the shape of the pad electrode may be included in various positions such as upper center, lower left, lower center, and lower right as necessary.
- the plurality of mold layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 do not need to include only rectangular pad electrodes as shown in FIG. 1 or 2. Therefore, the shape of various electrode pads such as a circle, a triangle, a pentagon, and a hexagon may be included.
- the vertical frame 1100 may be formed of a non-transmissive material that does not transmit light. Specifically, it may be formed of a non-permeable metal material such as aluminum or stainless steel (SUS), or a non-permeable insulating material such as silicon or silicon oxide. As described above, when the vertical frame 1100 is formed of an impermeable material through which light is not transmitted, the fluorescent layer dried in the fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 is formed.
- a non-permeable metal material such as aluminum or stainless steel (SUS)
- SUS stainless steel
- the light emitted from the light emitting diode is transmitted through the fluorescent layer after the light emitting diode is positioned on the light emitting diode as it is, the light emitted from the light emitting diode is transmitted to the vertical frame 1100.
- the test described below can be effectively performed.
- the fluorescent layer may be manufactured by filling a plurality of fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 with a fluorescent material solution having a viscosity of about 1,000 cP to 300,000 cP. .
- a fluorescent material solution having a viscosity of about 1,000 cP to 300,000 cP.
- the fluorescent material solution having the above-described viscosity since the fluorescent material solution can be effectively maintained in the plurality of fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144, respectively, The yield of the layer can be kept stable.
- the vertical frame 1100 filled with the solution of the fluorescent material is 50 ??
- the fluorescent layer (1111 to 1114, 1121 to 1124, 1131 to 1134, 1141 to 1144) in the fluorescent layer 11-14, 21-24, 31-34, 41-44).
- the fluorescent layers 11 to 14, 21 to 24, 31 to 34, and 41 to 44 dried in the fluorescent layer pattern holes 1111 to 1114, 1121 to 1124, 1131 to 1134, and 1141 to 1144 are emitted as they are.
- the light emitted from the light emitting diode after being positioned above the diode is transmitted through the fluorescent layers 11 to 14, 21 to 24, 31 to 34, and 41 to 44 to test the characteristics of the light passing through the fluorescent layer.
- a fluorescent layer comprising a plurality of fluorescent layer pattern holes through which the shape of the fluorescent layer pattern penetrates in a vertical direction of the vertical frame in a vertical frame 1100 and a predetermined region of the vertical frame.
- the filled fluorescent layer material solution is dried to form a fluorescent layer.
- the light emitting diode is spaced apart from the lower part of the phosphor 11 present in one of the plurality of fluorescent layer pattern holes of the fluorescent layer manufacturing apparatus 1000. 1300).
- a force is applied in the vertical direction downward from the upper portion of the phosphor 11 present in the phosphor layer pattern hole 1111 to cause the phosphor 11 to form the phosphor layer hole 1111.
- Is disposed on the upper surface of the light emitting diode 1300 is separated from the vertical direction.
- the force applied in the vertical direction downward from the upper portion of the phosphor 11 present in the fluorescent layer pattern hole 1111 may be transmitted by the lower guider 1200 having a flat bottom surface.
- a fluorescent layer comprising a plurality of fluorescent layer pattern holes through which the shape of the fluorescent layer pattern penetrates in a vertical direction of the vertical frame in a vertical frame 1100 and a predetermined region of the vertical frame.
- the filled fluorescent layer material solution is dried to form a fluorescent layer.
- the upper guider is spaced apart from the lower part of the phosphor 11 present in one of the plurality of fluorescent layer pattern holes of the fluorescent layer manufacturing apparatus 1000.
- 2200 is positioned, and the vacuum chuck 2400 is positioned above the phosphor 11 existing in the phosphor layer pattern hole 1111.
- a force is applied in the vertical direction upward from the lower portion of the phosphor 11 present in the phosphor layer pattern hole 1111 by the upper guider 2200. Is separated from the fluorescent layer pattern hole 1111 in an upward vertical direction and placed on a lower surface of the vacuum chuck 2400.
- the upper guider 2200 may be used that the upper surface is flat.
- the phosphor placed on the lower surface of the vacuum chuck 2400 is kept below a predetermined pressure so that the phosphor 11 is adsorbed on the lower surface of the vacuum chuck 2400. do.
- the phosphor 11 adsorbed on the lower surface of the vacuum chuck 2400 is moved and disposed on the upper surface of the light emitting diode 2300.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Optical Filters (AREA)
Abstract
Description
Claims (4)
- 수직 프레임과, 상기 수직 프레임의 소정의 영역 내에 상기 수직 프레임의 수직 방향으로 형광층 패턴의 형상이 관통되어 뚫려 있는 형광층 패턴 홀을 다수로 포함하는 형광층 제조 장비를 준비하는 단계;상기 형광층 제조 장비의 다수의 형광층 패턴 홀 각각에 형광체, 실리콘 및 필러를 포함하는 형광층 물질 용액을 채운 후에 상기 채워진 형광층 물질 용액을 건조시켜 형광층을 제조하는 단계;상기 형광층 제조 장비의 다수의 형광층 패턴 홀 중 어느 하나의 형광층 패턴 홀에 존재하는 형광체의 하부에 이격하여 발광 다이오드를 위치시키는 단계; 및상기 형광층 패턴 홀에 존재하는 형광체의 상부에서 하방의 수직방향으로 힘이 가해짐으로써 상기 형광체가 상기 형광층 패턴 홀에서 하방의 수직방향으로 이탈하여 상기 발광 다이오드의 상면에 배치되는 단계를 포함하는 형광층 배치 방법.
- 제1항에 있어서,상기 형광체가 상기 발광 다이오드의 상면에 배치되는 단계에서,상기 형광층 패턴 홀에 존재하는 형광체의 상부에서 하방의 수직방향으로 가해지는 힘은 하부면이 평평한 물체에 의해서 전달되는 것을 특징으로 하는 형광층 배치 방법.
- 수직 프레임과, 상기 수직 프레임의 소정의 영역 내에 상기 수직 프레임의 수직 방향으로 형광층 패턴의 형상이 관통되어 뚫려 있는 형광층 패턴 홀을 다수로 포함하는 형광층 제조 장비를 준비하는 단계;상기 형광층 제조 장비의 다수의 형광층 패턴 홀 각각에 형광체, 실리콘 및 필러를 포함하는 형광층 물질 용액을 채운 후에 상기 채워진 형광층 물질 용액을 건조시켜 형광층을 제조하는 단계;상기 형광층 제조 장비의 다수의 형광층 패턴 홀 중 어느 하나의 형광층 패턴 홀에 존재하는 형광체의 하부에 이격하여 상방 가이더를 위치시키며, 상기 형광층 패턴 홀에 존재하는 형광체의 상부에 이격하여 진공 척을 위치시키는 단계;상기 상방 가이더에 의해서 상기 형광층 패턴 홀에 존재하는 형광체의 하부에서 상방의 수직방향으로 힘이 가해짐으로써 상기 형광체가 상기 형광층 패턴 홀에서 상방의 수직방향으로 이탈하여 상기 진공 척의 하면에 놓이는 단계;상기 진공 척의 하면에 놓여 있는 형광체를 상기 진공 척이 소정의 압력 이하로 유지되어 상기 형광체가 상기 진공 척의 하면에 흡착되는 단계; 및상기 진공 척의 하면에 흡착되어 있는 형광체를 이동시켜 발광 다이오드의 상면에 배치시키는 단계를 포함하는 형광층 배치 방법.
- 제3항에 있어서,상기 상방 가이더의 상부면이 평평한 것을 특징으로 하는 형광층 배치 방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480082446.1A CN106796971A (zh) | 2014-10-02 | 2014-10-02 | 荧光层配置方法 |
JP2017538150A JP2017533476A (ja) | 2014-10-02 | 2014-10-02 | 蛍光層の配置方法 |
DE112014007023.8T DE112014007023T5 (de) | 2014-10-02 | 2014-10-02 | Verfahren zum anordnen fluoreszierender schichten |
PCT/KR2014/009310 WO2016052783A1 (ko) | 2014-10-02 | 2014-10-02 | 형광층 배치 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2014/009310 WO2016052783A1 (ko) | 2014-10-02 | 2014-10-02 | 형광층 배치 방법 |
Publications (1)
Publication Number | Publication Date |
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WO2016052783A1 true WO2016052783A1 (ko) | 2016-04-07 |
Family
ID=55630801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/KR2014/009310 WO2016052783A1 (ko) | 2014-10-02 | 2014-10-02 | 형광층 배치 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2017533476A (ko) |
CN (1) | CN106796971A (ko) |
DE (1) | DE112014007023T5 (ko) |
WO (1) | WO2016052783A1 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110051769A (ko) * | 2009-11-11 | 2011-05-18 | 삼성엘이디 주식회사 | 발광 소자 패키지 제조 방법 |
KR20120019385A (ko) * | 2010-08-25 | 2012-03-06 | 삼성엘이디 주식회사 | 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 |
WO2014002784A1 (ja) * | 2012-06-28 | 2014-01-03 | 東レ株式会社 | 樹脂シート積層体およびそれを用いた半導体発光素子の製造方法 |
JP2014130928A (ja) * | 2012-12-28 | 2014-07-10 | Micro-Tec Co Ltd | 樹脂充填装置及び樹脂充填方法 |
KR20150034954A (ko) * | 2013-09-27 | 2015-04-06 | (주)라이타이저코리아 | 형광층 배치 방법 |
-
2014
- 2014-10-02 CN CN201480082446.1A patent/CN106796971A/zh active Pending
- 2014-10-02 WO PCT/KR2014/009310 patent/WO2016052783A1/ko active Application Filing
- 2014-10-02 DE DE112014007023.8T patent/DE112014007023T5/de not_active Withdrawn
- 2014-10-02 JP JP2017538150A patent/JP2017533476A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110051769A (ko) * | 2009-11-11 | 2011-05-18 | 삼성엘이디 주식회사 | 발광 소자 패키지 제조 방법 |
KR20120019385A (ko) * | 2010-08-25 | 2012-03-06 | 삼성엘이디 주식회사 | 형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 |
WO2014002784A1 (ja) * | 2012-06-28 | 2014-01-03 | 東レ株式会社 | 樹脂シート積層体およびそれを用いた半導体発光素子の製造方法 |
JP2014130928A (ja) * | 2012-12-28 | 2014-07-10 | Micro-Tec Co Ltd | 樹脂充填装置及び樹脂充填方法 |
KR20150034954A (ko) * | 2013-09-27 | 2015-04-06 | (주)라이타이저코리아 | 형광층 배치 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN106796971A (zh) | 2017-05-31 |
DE112014007023T5 (de) | 2017-07-13 |
JP2017533476A (ja) | 2017-11-09 |
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