WO2016045250A1 - Oled显示面板及其封装方法和oled显示装置 - Google Patents
Oled显示面板及其封装方法和oled显示装置 Download PDFInfo
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- WO2016045250A1 WO2016045250A1 PCT/CN2015/070281 CN2015070281W WO2016045250A1 WO 2016045250 A1 WO2016045250 A1 WO 2016045250A1 CN 2015070281 W CN2015070281 W CN 2015070281W WO 2016045250 A1 WO2016045250 A1 WO 2016045250A1
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- film layer
- oled display
- display panel
- substrate
- oled
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- 238000000034 method Methods 0.000 title claims abstract description 17
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the present invention relates to the field of display technologies, and in particular, to an OLED display panel, a packaging method thereof, and an OLED display device.
- OLED Organic Light-Emitting Diode
- OLED displays are characterized by high brightness, high contrast, ultra-thin and ultra-light, low power consumption, no viewing angle limitation, and wide operating temperature range. They are considered as emerging applications for next-generation flat panel displays.
- the packaging technology of OLED devices is a key technology that distinguishes OLED displays from other displays.
- OLED devices use organic materials, and organic materials undergo irreversible photooxidation reactions in the presence of moisture and oxygen. In addition, water and oxygen also have a strong erosive effect on electrode materials such as aluminum, magnesium or silver. Therefore, the packaging of OLED devices has very high requirements for water and oxygen permeability.
- An existing OLED device packaging technology is a "UV+ package back cover" method. As shown in FIG. 1, in this technique, first, a desiccant 7 for absorbing moisture is attached to the package back cover 6, and then a UV adhesive 9 is applied around the OLED glass substrate 8, and finally the package back cover 6 is attached.
- the OLED glass substrate 8 is aligned with a UV-curable adhesive 9 (i.e., UV glue).
- a UV-curable adhesive 9 i.e., UV glue
- the technology has the advantages of mature technology and low equipment cost, it also has the following disadvantages: poor sealing performance; water and oxygen permeability; unsuitable for top emission type OLED display, flexible OLED display and large size OLED display; and desiccant 7 adhered to The thickness and volume of the OLED display are increased to some extent on the package back cover 6.
- a laser sintered glass powder packaging technology (Frit).
- the method has better sealing performance and is far better than the traditional UV resin sealing performance.
- a low-softening point glass powder having a width of about 1-2 mm and a thickness of about 6-100 ⁇ m is deposited on the edge of the package back cover 6 by screen printing.
- the organic matter in the glass frit is removed to solidify the glass frit.
- the glass frit is then heated by laser irradiation to melt the glass frit to bond the OLED glass substrate 8 and the package back cover 6 to form the glass wall 10.
- the packaging technology still exists In certain problems.
- the thickness of the glass wall 10 formed by the melting of the glass powder is gradually increased, so that the energy of the laser light gradually decreases as the depth of incidence into the glass wall 10 increases, so that the laser cannot be melted and disposed on the glass wall. All the glass powder within 10. This will result in the presence of a large number of holes and cracks in the glass wall 10 which provide a passage for moisture and oxygen to penetrate into the interior of the OLED device 11, greatly reducing the lifetime of the OLED device 11.
- the present invention is directed to the above technical problems existing in the prior art, and provides an OLED display panel, a packaging method thereof, and an OLED display device.
- the package structure of the OLED device disposed between the substrate and the cover plate in the OLED display panel not only can absorb water vapor and oxygen well, but also can more closely seal and package the OLED device, thereby making the OLED display
- the panel is not only protected from moisture and oxygen, but also ensures a better seal.
- the present invention provides an OLED display panel including a substrate and a cover plate disposed opposite to the substrate, the substrate being provided with an OLED device attached to the substrate such that the OLED device is located Between the substrate and the cover plate, a package structure is further disposed between the substrate and the cover plate, and the package structure is disposed around a periphery of the OLED device for drying the OLED device. And anti-oxidation sealed package.
- the package structure comprises an inner film layer and an outer film layer surrounding the periphery of the OLED device, the outer film layer is a closed ring shape, and the inner rubber film layer is an unclosed ring shape. And the outer film layer surrounds the periphery of the inner film layer.
- the inner film layer is formed by a plurality of fold-shaped sub-film layers, and any two adjacent sub-film layers have opposite portions to form between the opposite portions.
- the number of the grooves formed by the plurality of the sub-film layers is from 10 to 100.
- the trench is filled with a desiccant and an antioxidant.
- the mixing ratio of the desiccant and the antioxidant is 2:1-3:1.
- the desiccant comprises a silica gel desiccant
- the antioxidant comprises Fe particles
- the desiccant and the antioxidant are spherical and/or cylindrical particles.
- the size of the slit is larger than the size of the desiccant and the particles of the antioxidant.
- the inner film layer and the outer film layer are both disposed on the substrate or the cover plate; or one of the inner film layer and the outer film layer is disposed at On the substrate, the other of the inner film layer and the outer film layer is disposed on the cover.
- the inner film layer and the outer film layer have the same thickness, and the inner film layer and the outer film layer have a thickness equal to the thickness of the OLED device.
- the inner film layer and the outer film layer are formed by using a heat curing glue or a UV curing glue.
- the package structure further includes a plurality of pressure pads disposed on a side of the cover plate facing the OLED device, the plurality of pressure pads are evenly distributed, and the number of the pressure pads is The size of the OLED display panel is proportional.
- the pressure pad is in the shape of a truncated cone or a column, and a larger bottom surface of the truncated cone is attached to the cover plate, and a smaller top surface of the truncated cone is opposite to the OLED device. .
- the thickness of the pressure resistant pad is less than or equal to a difference between a distance between the substrate and the cover plate and a thickness of the OLED device.
- the pressure resistant pad is formed using a polyurethane or polyethylene terephthalate material.
- the present invention also provides an OLED display device including the above OLED display panel.
- the present invention also provides a packaging method for the above OLED display panel, the packaging method comprising: forming the package structure on a substrate or a cover plate, and then aligning the substrate and the cover plate by the package structure Paste and seal the package.
- the step of forming the package structure on the substrate or the cover plate comprises:
- Step S1 coating an outer film layer and an inner film layer on the substrate or the cover plate by using a frame sealant coating device, wherein the inner film layer comprises a plurality of fold lines formed by coating a sub-film layer, any two adjacent sub-film layers having opposite portions to form an elongated groove between the opposite portions; wherein the opposite portions are not connected and are in the Forming a gap at both ends of the groove;
- Step S2 filling the trench with a desiccant and an antioxidant.
- the OLED display panel provided by the present invention has a package structure disposed on the periphery of the OLED device between the substrate and the cover plate, the package structure not only can absorb water vapor and oxygen well, but also can be used for OLED.
- the device is tightly sealed, so that the OLED display panel is not only protected from moisture and oxygen, but also ensures a better sealing and packaging effect, thereby extending the service life of the OLED display panel.
- the OLED display device provided by the present invention improves the package quality of the OLED display device by using the OLED display panel described above, and also prolongs the service life of the OLED display device.
- FIG. 1 is a cross-sectional view showing a package structure of a prior art OLED device.
- FIG. 2 is a cross-sectional view showing another package structure of an OLED device in the prior art.
- FIG 3 is a cross-sectional view of an OLED display panel in a first embodiment of the present invention.
- FIG. 4 is a top plan view of the OLED display panel of FIG. 3 with the cover removed.
- Figure 5 is a plan view of the inner film layer of Figure 3.
- FIG. 6 is a cross-sectional view showing the OLED display panel of FIG. 3 deformed by an external pressing force.
- This embodiment provides an OLED display panel, as shown in FIGS. 3 and 4, including a substrate 1 and a cover 2 opposite to the substrate 1.
- An OLED device 11 is disposed on the substrate 1.
- the cover 2 is attached to the substrate 1 such that the OLED device 11 is located between the substrate 1 and the cover 2.
- a package structure is further disposed between the substrate 1 and the cover 2, and the package structure is disposed around the periphery of the OLED device 11 for drying and anti-oxidation sealing of the OLED device 11.
- the package structure enables a sealed package for drying and oxidation of the OLED device to prevent moisture and oxygen from intruding into the interior of the OLED device 11, thereby preventing moisture and oxygen from damaging the OLED device 11.
- the OLED device 11 refers to an organic electroluminescence unit in an OLED display panel.
- the organic electroluminescent unit generally includes an anode, a hole transporting layer, a light emitting layer, an electron transporting layer, and a cathode, and the layers are sequentially laminated to form a structure such as a sandwich.
- the package structure includes an inner film layer 3 and an outer film layer 4 surrounding the periphery of the OLED device 11, the outer film layer 4 is a closed ring shape, and the inner film layer 3 is an unclosed ring shape. And the outer film layer 4 surrounds the outer periphery of the inner film layer 3.
- the inner film layer 3 is formed by arranging a plurality of zigzag-shaped sub-film layers 31.
- One of the two adjacent sub-film layers 31 is partially opposed to the other (ie, any adjacent two sub-film layers 31 have portions opposite to each other) such that a long length is formed between the opposite two portions.
- the opposite portions of the adjacent two sub-film layers 31 forming the grooves 32 are not connected and a slit 33 is formed at both ends of the groove 32. That is, the groove 32 is not completely closed.
- the arrangement is such that the desiccant and the anti-oxidation 12 are subsequently filled into the trench 32 through the slit 33 to prevent moisture and oxygen from intruding into the OLED device 11, thereby preventing moisture and oxygen from damaging the OLED device 11.
- each sub-film layer 31 may be a substantially z-shaped or z-shaped inverted line shape as shown in FIG. 5, or may be a substantially "s" shape with rounded corners or
- the generalized polygonal line shape of the "s" shape which is reversed left and right may be other suitable polygonal line shapes.
- the number of the grooves 32 formed by the plurality of sub-film layers 31 may be 10 to 100. This number of grooves 32 ensures sufficient amount of desiccant and antioxidant 12 Filling to further ensure adequate absorption of moisture and oxygen.
- the number of the grooves 32 is determined by the coating process of the inner film layer 3.
- the trench 32 is filled with a desiccant and an antioxidant 12.
- the desiccant is capable of absorbing water vapor, which prevents oxygen from intruding into the OLED device 11 and causing oxidation thereof.
- the desiccant is disposed on the top of the OLED device 11, and the desiccant and the anti-oxidation 12 are filled into the trench 32 formed by the inner film layer 3, which can save space, thereby avoiding an increase in the entire OLED. Displays the thickness and volume of the panel.
- the desiccant and the antioxidant 12 filled in the groove 32 can sufficiently exert its drying and anti-oxidation effect by the flow of air through the slit 33.
- the outer film layer 4 is a closed annular structure, the airtightness of the package of the OLED device 11 can be ensured, and at the same time, the inner film layer 3 is an unclosed ring structure (ie, an open structure) in which the slits 33 are formed.
- the desiccant and the anti-oxidation 12 filled in the groove 32 surrounded by the inner film layer 3 can well absorb moisture and resist oxidation, and thus, the external anti-adhesion (ie, the outer film layer 4)
- the external moisture and oxygen are prevented from entering the OLED device 11, and the inner film layer 3 absorbs water vapor and oxygen inside the OLED device 11, and the two tubes are effectively prevented from corrosion and oxidation of the OLED device 11 by water vapor and oxygen.
- the mixing ratio of the desiccant and the antioxidant 12 may be from 2:1 to 3:1. Since the OLED device 11 is more susceptible to damage by moisture, experiments have confirmed that the mixing ratio of the desiccant and the antioxidant 12 is an optimum mixing ratio.
- the desiccant comprises a silica gel desiccant
- the antioxidant includes Fe particles.
- the desiccant and the antioxidant 12 are spherical and/or cylindrical particles.
- the desiccant is solid and may be a chemical adsorption desiccant or a physical adsorption desiccant, such as a solid desiccant, a transparent desiccant, an opaque desiccant, a black desiccant, and the like.
- the fine pore silica gel desiccant is the best because it does not cause secondary pollution after the silica gel desiccant absorbs moisture.
- the appearance of the silica gel desiccant is white, which is a translucent vitreous, and its chemical formula is mSiO 2 ⁇ nH 2 O. It is mainly used for drying and moisture proof. It has the characteristics of high bulk density and obvious moisture absorption under low humidity.
- the silica gel desiccant may be of any shape, including a regular shape or an irregular shape, such as one or more of a spherical shape and a cylindrical shape, and the size thereof may be determined according to requirements.
- the antioxidant may be a chemical reducing agent or a physical reducing agent such as a solid reducing agent. Among them, a particulate reducing agent such as Fe fine particles is preferred.
- the antioxidant can reduce oxygen and prevent oxygen in the air from negatively affecting the organic luminescent material in the OLED device 11.
- the shape and size of the antioxidant are the same as those of the desiccant, and will not be described again.
- the size of the slit 33 is larger than the size of the desiccant and the anti-oxidation 12 particles. This ensures that the desiccant and the antioxidant 12 can be smoothly filled into the grooves 32 through the slits 33.
- the slit 33 may be formed using a mesh having small pores having a pore size smaller than the size of the particles of the desiccant and the antioxidant 12. Sealed to achieve the following two functions: first, to prevent the desiccant and the anti-oxidation 12 from coming off the groove 32 through the slit 33, so that the inner film layer 3 loses the function of drying and anti-oxidation sealing package; secondly, keeping the air Flow to exert the drying and antioxidant effects of the desiccant and antioxidant 12.
- the inner film layer 3 and the outer film layer 4 are both disposed on the substrate 1.
- the inner rubber film layer 3 and the outer rubber film layer 4 may also be disposed on the cover plate 2; or, the inner rubber film layer 3 is disposed on the substrate 1, and the outer rubber film layer 4 is disposed on the cover plate 2. Or, the inner film layer 3 is disposed on the cover 2, and the outer film layer 4 is disposed on the substrate 1. It suffices to ensure that the inner film layer 3 and the outer film layer 4 are double-layered to the OLED device 11.
- the thickness of the inner film layer 3 and the outer film layer 4 are equal, and the thicknesses of the inner film layer 3 and the outer film layer 4 are equal to the thickness of the OLED device 11.
- the thickness of the inner rubber film layer 3 and the outer rubber film layer 4 refers to the vertical distance from the inner rubber film layer 3 and the outer rubber film layer 4 from the substrate 1 to the cover plate 2. This arrangement minimizes the thickness and volume of the OLED display panel.
- the inner film layer 3 and the outer film layer 4 are formed by using a heat curing glue or a UV curing glue.
- the thermosetting adhesive is a mixture of epoxy resin, catalyst and catalyst solvent, which is liquid at normal temperature, and becomes solid after heat curing (about 5 minutes at 120 ° C);
- UV curable adhesive is caused by acrylic resin and UV. It is a mixture of agents and the like, and is liquid at normal temperature. It is solidified by UV curing (curing at 120 ° C for about 3-5 minutes).
- the heat curing adhesive or the UV curing adhesive enables the substrate 1 and the cover 2 to be firmly bonded together, thereby forming the OLED device 11 Very good package.
- the package structure further includes a plurality of pressure pads 5 disposed on the side of the cover 2 facing the OLED device 11.
- the plurality of pressure pads 5 are evenly distributed.
- the number of pressure pads 5 is proportional to the size of the OLED display panel.
- the pressure pad 5 is formed of a polyurethane or polyethylene terephthalate material.
- the pressure pad 5 of the above material has a low hardness and a high elasticity. As shown in FIG. 6 , when the OLED display panel is deformed by an external pressing force, the pressure pad 5 is elastically deformed by contact with the OLED device 11 , thereby preventing the cover plate 2 from being deformed to contact the OLED device 11 due to the force. It causes damage.
- the shape of the pressure-resistant pad 5 is a truncated cone shape, and the bottom surface of the truncated cone having a large area is attached to the cover plate 2, and the top surface of the truncated cone having a smaller area is opposed to the OLED device 11.
- the pressure-resistant pad 5 can be easily damaged during the process of exerting a compressive action, and deformation deformation is not easily caused, and the OLED device 11 is not damaged at the same time, thereby ensuring good formation of the OLED device 11. Compressive protection.
- the shape of the pressure pad 5 may be a columnar shape such as a columnar shape or a prismatic shape.
- the thickness of the pressure resistant pad 5 is less than or equal to the difference between the distance between the substrate and the cover plate and the thickness of the OLED device 11. In this way, it is ensured that the pressure-resistant pad 5 forms a good pressure protection for the OLED device 11 without causing damage to the OLED display panel during the compression process, such as stretching the substrate 1 and the cover plate 2 under pressure. At the same time, the thickness of the pressure pad 5 does not increase the thickness of the OLED display panel.
- the embodiment further provides a packaging method for the above OLED display panel, comprising forming a package structure in the OLED display panel according to the first embodiment of the present invention on the substrate 1 or the cover 2, and then the substrate 1 and the package structure are The cover 2 is aligned and sealed to form a sealed package.
- the package structure is formed on the substrate 1.
- the step of forming a package structure on the substrate 1 specifically includes:
- Step S1 coating the substrate 1 with an outer film layer 4 and an inner film layer 3 by using a frame sealant coating device, and the inner film layer 3 includes a plurality of line-shaped sub-film layers 31 formed by coating. Any two adjacent sub-film layers 31 have opposite portions to form elongated grooves 32 between the opposite portions; two phases of adjacent two sub-film layers 31 forming the grooves 32 The portions are not connected and a slit 33 is formed at both ends of the groove 32.
- the outer film layer 4 and the inner film layer 3 are formed by a conventional frame sealant coating process.
- the pattern of the inner rubber film layer 3 formed by coating the sealant coating device may be a plurality of line-shaped lines which are arranged in a ring shape and which are not in contact with each other in a plan view. Since the width of the line-shaped line is usually 0.5-0.6 mm, the application of the line-shaped sub-film layer 31 can be completely realized by the frame seal coating apparatus.
- Step S2 The trench 32 is filled with a desiccant and an antioxidant 12.
- the desiccant and the anti-oxidation 12 can be filled into the trench 32 from the top opening of the trench 32 by a mechanical filling device such as a mechanical fill hand.
- a mechanical filling device such as a mechanical fill hand.
- the desiccant and the anti-oxidation 12 can also be filled from the slit 33. Into the groove 32.
- the slit 33 may be sealed with a mesh having small pores having a pore size smaller than the size of the particles of the desiccant and the antioxidant 12.
- the encapsulation process of the OLED device 11 in this embodiment is as follows: first, a plurality of sub-adhesive film layers 31 formed in a fold line shape are coated on the substrate 1 to form an inner adhesive film layer 3; and then, the outer adhesive film layer 3 is coated.
- a package structure is disposed on the periphery of the OLED device between the substrate and the cover plate, and the package structure not only performs good for water vapor and oxygen Absorbing, and more rigorous sealing and packaging of OLED devices, so that OLED display panels can not only be protected from moisture and oxygen damage, but also ensure better sealing and packaging effects, thereby extending the use of OLED display panels. life.
- This embodiment provides an OLED display device including the OLED in the first embodiment. Display panel.
- the package quality of the OLED display device is improved, and the service life of the OLED display device is also prolonged.
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Abstract
Description
Claims (18)
- 一种OLED显示面板,包括基板和与所述基板相对设置的盖板,所述基板上设置有OLED器件,所述盖板附接到所述基板上以使得所述OLED器件位于所述基板与所述盖板之间,其特征在于,所述基板与所述盖板之间还设置有封装结构,所述封装结构围设在所述OLED器件的***,以用于对所述OLED器件进行干燥和抗氧化密封封装。
- 根据权利要求1所述的OLED显示面板,其特征在于,所述封装结构包括包围在所述OLED器件***的内胶膜层和外胶膜层,所述外胶膜层为封闭的环状,所述内胶膜层为不封闭的环状,且所述外胶膜层包围在所述内胶膜层的***。
- 根据权利要求2所述的OLED显示面板,其特征在于,所述内胶膜层由多个折线形的子胶膜层拼设而成,任意相邻的两个所述子胶膜层具有相对的部分以在所述相对的部分之间形成长条形的沟槽,其中所述相对的部分不相连接且在所述沟槽的两端形成有缝隙。
- 根据权利要求3所述的OLED显示面板,其特征在于,由多个所述子胶膜层形成的所述沟槽的数量为10-100个。
- 根据权利要求3所述的OLED显示面板,其特征在于,所述沟槽中填充有干燥剂和抗氧化物。
- 根据权利要求5所述的OLED显示面板,其特征在于,所述干燥剂和所述抗氧化物的混合比例为2:1-3:1。
- 根据权利要求5所述的OLED显示面板,其特征在于,所述干燥剂包括硅胶干燥剂,所述抗氧化物包括Fe微粒,并且所述干燥 剂和所述抗氧化物为球状和/或圆柱状的颗粒。
- 根据权利要求7所述的OLED显示面板,其特征在于,所述缝隙的尺寸大于所述干燥剂和所述抗氧化物的颗粒的尺寸。
- 根据权利要求2-8中任意一项所述的OLED显示面板,其特征在于,所述内胶膜层和所述外胶膜层均设置在所述基板或所述盖板上;或者,所述内胶膜层和所述外胶膜层中的一个设置在所述基板上,而所述内胶膜层和所述外胶膜层中的另一个设置在所述盖板上。
- 根据权利要求9所述的OLED显示面板,其特征在于,所述内胶膜层和所述外胶膜层的厚度相等,且所述内胶膜层和所述外胶膜层的厚度均等于所述OLED器件的厚度。
- 根据权利要求2所述的OLED显示面板,其特征在于,所述内胶膜层和所述外胶膜层采用热固化胶或UV固化胶形成。
- 根据权利要求2所述的OLED显示面板,其特征在于,所述封装结构还包括设置在所述盖板的面向所述OLED器件的一侧上的多个抗压垫,所述多个抗压垫均匀分布,所述抗压垫的数量与所述OLED显示面板的大小成正比。
- 根据权利要求12所述的OLED显示面板,其特征在于,所述抗压垫的形状为圆台状或柱状,所述圆台的面积较大的底面与所述盖板相贴合,所述圆台的面积较小的顶面与所述OLED器件相对。
- 根据权利要求12或13所述的OLED显示面板,其特征在于,所述抗压垫的厚度小于或等于所述基板和所述盖板之间的距离与所述OLED器件的厚度之差。
- 根据权利要求12所述的OLED显示面板,其特征在于,所述抗压垫采用聚氨酯或聚对苯二甲酸乙二酯材料形成。
- 一种OLED显示装置,其特征在于,包括权利要求1-15中任意一项所述的OLED显示面板。
- 一种如权利要求1-15中任意一项所述的OLED显示面板的封装方法,其特征在于,所述封装方法包括:在基板或盖板上形成所述封装结构,然后通过所述封装结构将所述基板和所述盖板进行对准贴合并密封封装。
- 根据权利要求17所述的OLED显示面板的封装方法,其特征在于,所述在基板或盖板上形成所述封装结构的步骤包括:步骤S1:采用封框胶涂布设备在所述基板或所述盖板上涂覆形成外胶膜层和内胶膜层,所述内胶膜层包括涂覆形成的多个折线形的子胶膜层,任意相邻的两个所述子胶膜层具有相对的部分以在所述相对的部分之间形成长条形的沟槽;其中所述相对的部分不相连接且在所述沟槽的两端形成缝隙;以及步骤S2:在所述沟槽中填充干燥剂和抗氧化物。
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