WO2016041212A1 - Oled的封装方法及oled结构 - Google Patents
Oled的封装方法及oled结构 Download PDFInfo
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- WO2016041212A1 WO2016041212A1 PCT/CN2014/087078 CN2014087078W WO2016041212A1 WO 2016041212 A1 WO2016041212 A1 WO 2016041212A1 CN 2014087078 W CN2014087078 W CN 2014087078W WO 2016041212 A1 WO2016041212 A1 WO 2016041212A1
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- desiccant
- substrate
- display area
- glass
- oled
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005538 encapsulation Methods 0.000 title abstract description 5
- 239000002274 desiccant Substances 0.000 claims abstract description 79
- 239000011521 glass Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 39
- 239000000565 sealant Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 239000006059 cover glass Substances 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 31
- 238000004806 packaging method and process Methods 0.000 claims description 28
- 239000002356 single layer Substances 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 150000004756 silanes Chemical class 0.000 claims description 8
- 238000001723 curing Methods 0.000 claims description 5
- 239000005053 propyltrichlorosilane Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- PYJJCSYBSYXGQQ-UHFFFAOYSA-N trichloro(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](Cl)(Cl)Cl PYJJCSYBSYXGQQ-UHFFFAOYSA-N 0.000 claims description 4
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical group CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 238000003848 UV Light-Curing Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- -1 mercaptotris(methoxyethoxy)silane Chemical compound 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- ANBSMUXSGOZKHS-UHFFFAOYSA-N trichloro(sulfanyl)silane Chemical compound S[Si](Cl)(Cl)Cl ANBSMUXSGOZKHS-UHFFFAOYSA-N 0.000 claims description 3
- ZFNFNJYRZOQPJF-UHFFFAOYSA-N trimethoxy(sulfanyl)silane Chemical compound CO[Si](S)(OC)OC ZFNFNJYRZOQPJF-UHFFFAOYSA-N 0.000 claims description 3
- CEQGXFSRENZDFH-UHFFFAOYSA-N triethoxy(sulfanyl)silane Chemical compound CCO[Si](S)(OCC)OCC CEQGXFSRENZDFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910004205 SiNX Inorganic materials 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000001338 self-assembly Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- GKTAQHYCUOJDQO-UHFFFAOYSA-N decyl-tris(2-methoxyethoxy)silane Chemical compound C(CCCCCCCCC)[Si](OCCOC)(OCCOC)OCCOC GKTAQHYCUOJDQO-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- HLWCOIUDOLYBGD-UHFFFAOYSA-N trichloro(decyl)silane Chemical compound CCCCCCCCCC[Si](Cl)(Cl)Cl HLWCOIUDOLYBGD-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
- H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
Definitions
- the present invention relates to the field of liquid crystal display technologies, and in particular, to an OLED packaging method and an OLED structure.
- OLED is an Organic Light-Emitting Diode, which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and has received extensive attention as a new generation display mode. It has gradually replaced traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs. Unlike traditional LCD displays, OLED display technology eliminates the need for backlights and uses very thin organic coatings and glass substrates that illuminate when current is passed through. However, since organic materials are easily reacted with water and oxygen, as an organic material-based display device, an OLED display has a very high requirement for packaging. In order to realize the commercialization of OLED display panels, the related packaging technology has become a research hotspot.
- UV ultraviolet
- frame glue glass powder laser sealing
- face seal face seal
- frame glue and dam and fill film packaging.
- film packaging For the encapsulation method of sealant and desiccant filling, in the packaging process, how to let the desiccant fill the entire panel without destroying the frame glue to achieve the best packaging effect is the direction of the researchers. How to make the desiccant fill the entire panel, it is very important that the desiccant spreads well at the glass interface and the adhesion is good. The spreadability of the liquid at the interface is related to the nature of the interface.
- Polar liquids have a good spreadability at the hydrophilic interface (ie, a small contact angle), while at the hydrophobic interface, the spreadability is poor (ie, the contact angle is large); on the contrary, the non-polarity
- the liquid has poor spreadability at the hydrophilic interface and better spreadability at the hydrophobic interface.
- the interface is a hydrophilic interface, and the liquid desiccant used is mostly non-polar organic matter. Therefore, under normal circumstances, the desiccant has poor spreadability on the surface of the glass cover plate, and the distribution of the desiccant is likely to be uneven in the production, the filling of the partial area is not full, and even the liquid desiccant is unevenly spread due to the instantaneous pressing. As a result, the bubbles cannot be discharged in time, which leads to the phenomenon of squeezing.
- An object of the present invention is to provide a method for packaging an OLED, which uses a glass surface self-assembly method to modify a glass cover interface from a hydrophilic interface to a hydrophobic interface, thereby The properties of the glass cover interface are changed, so that the liquid desiccant has good spreadability at the interface of the glass cover plate, and the packaging effect of the OLED display panel is improved.
- Another object of the present invention is to provide an OLED structure by first self-assembling a hydrophobic monolayer on a glass cover and then coating a liquid desiccant, and the glass cover interface is hydrophilic from the hydrophobic monolayer
- the sexual interface modification becomes a hydrophobic interface, so that the liquid desiccant has good spreadability on the glass cover interface, and finally the packaging effect of the OLED display is improved.
- the present invention provides a method for packaging an OLED, comprising the following steps:
- Step 1 Providing a glass cover plate and a substrate to be packaged, the glass cover plate comprising a display area and an edge area surrounding the display area;
- Step 2 forming a layer of SiN x in an edge region of the cover glass
- Step 3 self-assembling a hydrophobic monomolecular layer on the surface of the display area of the glass cover plate;
- Step 4 coating a frame seal on the glass cover plate around the display area
- Step 5 coating a desiccant on the hydrophobic monolayer on the display area of the glass cover;
- Step 6 the glass cover is relatively attached to the substrate
- Step 7 The frame glue is cured by irradiation with a UV lamp to realize packaging of the glass cover plate to the substrate.
- the substrate is an OLED substrate; the method for self-assembling the hydrophobic monolayer in the step 3 is a solution immersion method or an evaporation method.
- the hydrophobic monolayer in the step 3 is a silane series molecule, and the silane series molecules are propyltrichlorosilane, octadecyltrichlorosilane, mercaptotrichlorosilane, mercaptotrimethoxysilane, anthracene. Triethoxysilane or decyltris(methoxyethoxy)silane.
- the sealant in the step 4 is applied to the edge of the cover glass and a gap is left between the display and the display area; the sealant is a UV glue.
- the desiccant is applied by the screen printing method in the step 5; the step 6 is carried out under a vacuum environment.
- the desiccant is a curable desiccant or a non-curable desiccant.
- step 5 when the desiccant is a curable desiccant, heating or UV light curing treatment is required after coating.
- the invention also provides an OLED structure, comprising a substrate, a glass cover plate sealingly connected to the substrate, and a sealant between the substrate and the glass cover plate, the glass cover plate comprising a display area and a surrounding display
- the edge region of the region further includes a SiN x layer on the edge region of the cover glass, a self-assembled hydrophobic monolayer on the surface of the display region of the cover glass, and a coating on the hydrophobic sheet A desiccant on the molecular layer.
- the substrate is an OLED substrate;
- the hydrophobic monolayer is a silane series molecule;
- the sealant is located at an edge of the cover glass, and a gap is left between the display area and the display area, and the sealant is a UV glue;
- the desiccant is a curable desiccant or a non-curing desiccant.
- the packaging method and OLED structure of the OLED of the present invention by using a glass surface self-assembly method, self-assembling a hydrophobic monolayer on the surface of the glass cover plate, so that the glass cover interface is from the hydrophilic interface
- the modification becomes a hydrophobic interface, so that the liquid desiccant has good spreadability at the interface of the glass cover plate, and the uneven diffusion of the liquid desiccant which is easy to occur in the production is avoided, so that the bubbles cannot be discharged in time, thereby causing the phenomenon of the glue, and finally improving.
- the packaging effect of the OLED display by using a glass surface self-assembly method, self-assembling a hydrophobic monolayer on the surface of the glass cover plate, so that the glass cover interface is from the hydrophilic interface
- the modification becomes a hydrophobic interface, so that the liquid desiccant has good spreadability at the interface of the glass cover plate, and the uneven diffusion of the liquid desiccant which is easy to occur in the production is avoided
- FIG. 1 is a flow chart of a method of packaging an OLED of the present invention
- FIG. 2 is a top plan view of a glass cover provided in step 1 of the packaging method of the OLED of the present invention
- step 2 of a packaging method of an OLED according to the present invention is a schematic diagram of step 2 of a packaging method of an OLED according to the present invention.
- step 3 is a schematic diagram of step 3 of a method for packaging an OLED according to the present invention.
- step 4 is a schematic diagram of step 4 of a method for packaging an OLED according to the present invention.
- step 5 is a schematic diagram of step 5 of a packaging method of an OLED according to the present invention.
- step 6 is a schematic diagram of step 6 of a method for packaging an OLED according to the present invention.
- step 7 of a method for packaging an OLED according to the present invention is a schematic diagram of step 7 of a method for packaging an OLED according to the present invention.
- FIG. 9 is a schematic cross-sectional view of an OLED structure of the present invention.
- the present invention provides a method for packaging an OLED substrate, including the following steps:
- Step 1 Providing a cover glass 1 and a substrate 5 to be packaged.
- the substrate 5 is an OLED substrate. As shown in FIG. 2, the cover glass 1 includes a display area 3 and an edge area surrounding the display area 3.
- Step 2 As shown in FIG. 3, a layer of SiN x 2 is formed on the edge region of the cover glass 1 to ensure that the self-assembled region in the subsequent step 3 is confined within the display region 3.
- Step 3 as shown in FIG. 4, a hydrophobic monolayer 6 is self-assembled on the surface of the display region 3 of the cover glass 1.
- the self-assembly method may adopt a solution immersion method or an evaporation method.
- the hydrophobic monolayer 6 is a silane series molecule, and the silane series molecules are generally propyltrichlorosilane, octadecyltrichlorosilane, decyltrichlorosilane, decyltrimethoxysilane, Mercapto triethoxysilane or mercaptotris(methoxyethoxy)silane.
- the surface of the glass cover 1 which is usually cleaned is a hydrophilic interface, and the liquid desiccant 7 used in the subsequent step 5 is a non-polar organic substance. Therefore, in general, the liquid desiccant 7 has poor spreadability on the surface of the cover glass 1.
- the liquid desiccant 7 is likely to be unevenly distributed on the surface of the cover glass 1, and some areas are not filled, and even appear in When the glass cover plate 1 and the substrate 5 are instantaneously pressed together, the liquid desiccant 7 is unevenly diffused, so that the bubbles cannot be discharged in time, thereby causing the phenomenon of squeezing.
- the hydrophobic monolayer 6 on the surface of the display region 3 of the cover glass 1, the properties of the surface of the display region 3 of the cover glass 1 are changed, from hydrophilic to hydrophobic. Thereby, the liquid desiccant 7 has good spreadability at the glass cover interface.
- Step 4 As shown in FIG. 5, a frame sealant 4 is coated on the glass cover 1 around the display area 3.
- the sealant 4 is applied to the edge of the cover glass 1 and has a certain gap with the display area 3.
- the sealant 4 is a UV glue for encapsulating the glass cover 1 to the substrate 5 .
- Step 5 As shown in FIG. 6, a desiccant 7 is applied onto the hydrophobic monolayer 6 on the display region 3 of the cover glass 1.
- the desiccant 7 is a curable desiccant or a non-curable desiccant.
- step 5 when the desiccant 7 is a curable desiccant, heating or UV light curing treatment is required after coating.
- the liquid desiccant 7 is applied by screen printing. Since the liquid desiccant 7 is a non-polar organic substance, and the surface of the display region 3 of the cover glass 1 becomes hydrophobic due to self-assembly of the hydrophobic monolayer 6, the liquid desiccant 7 is in the cover glass 1 The surface can spread evenly.
- Step 6 As shown in FIG. 7, the glass cover 1 and the substrate 5 are attached to each other in a vacuum environment.
- Step 7 as shown in FIG. 8, the frame glue 4 is cured by irradiation with a UV lamp, and the glass cover 1 is packaged on the substrate 5.
- the liquid desiccant 7 is evenly distributed on the surface of the display region 3 of the cover glass 1, and the coverage is complete, no bubbles are generated, and the encapsulation effect of the OLED display panel is improved.
- the present invention further provides an OLED structure, including a substrate 5 , a glass cover 1 sealedly connected to the substrate 5 , and the substrate 5 and a sealant 4 between the cover glass 1 , the cover glass includes a display area 3 and an edge area surrounding the display area 3 , and further includes a SiN x layer 2 located on an edge region of the cover glass 1 A self-assembled hydrophobic monolayer 6 on the surface of the display region 3 of the cover glass 1 and a desiccant 7 coated on the hydrophobic monolayer 6 are described.
- the substrate 5 is an OLED substrate.
- the hydrophobic monolayer 6 is a silane series molecule, and the silane series molecules are generally propyltrichlorosilane, octadecyltrichlorosilane, mercaptotrichlorosilane, mercaptotrimethoxysilane, mercapto III Ethoxysilane or mercaptotris(methoxyethoxy)silane, and the like.
- the sealant 4 is located at the edge of the cover glass 1 and has a gap with the display area 3, and the sealant 4 is a UV glue.
- the curable desiccant may be a thermosetting liquid desiccant or a UV curable liquid desiccant.
- the OLED packaging method and the OLED structure of the present invention self-assemble a hydrophobic monolayer on the surface of the glass cover by using a glass surface self-assembly method, so that the glass cover interface is modified from the hydrophilic interface. It becomes a hydrophobic interface, so that the liquid desiccant has good spreadability at the interface of the glass cover plate, avoids the uneven diffusion of the liquid desiccant which is easy to occur in the production, and the bubble cannot be discharged in time, thereby causing the phenomenon of the glue, and finally the OLED is improved.
- the packaging effect of the display is provided.
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Abstract
一种OLED的封装方法及OLED结构。方法包括：步骤1、提供玻璃盖板（1）与待封装的基板（5），玻璃盖板（1）包括显示区域（3）及围绕显示区域（3）的边缘区域；步骤2、在玻璃盖板（1）的边缘区域形成一层SiNx层（2）；步骤3、在玻璃盖板（1）的显示区域（3）表面自组装上疏水性单分子层（6）；步骤4、在玻璃盖板（1）上围绕显示区域（3）涂布一圈框胶（4）；步骤5、在玻璃盖板（1）的显示区域（3）上的疏水性单分子层（6）上涂布干燥剂（7）；步骤6、在真空环境下将玻璃盖板（1）与基板（5）相对贴合；步骤7、用UV灯照射使框胶（4）固化，实现玻璃盖板（1）对基板（5）的封装。
Description
本发明涉及液晶显示技术领域，尤其涉及一种OLED的封装方法及OLED结构。
OLED即有机发光二极管(Organic Light-Emitting Diode)，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的LCD显示方式不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水氧反应，作为基于有机材料的显示设备，OLED显示屏对封装的要求非常高。为了实现OLED显示面板商业化，与之相关的封装技术成为了研究热点。
常用的封装技术有紫外光(UV)固化框胶，玻璃粉末镭射封装(laser sealing)，面封装(face seal)，框胶及干燥剂填充封装(dam and fill)，薄膜封装等。对于框胶及干燥剂填充的封装方式，在封装工艺上，如何让干燥剂填充满整个面板，而不至于破坏边框胶，以达到最好的封装效果是研究人员努力的方向。如何让干燥剂充满整个面板，其中很重要的一点是，干燥剂在玻璃界面的铺展性，粘附性要好。液体在界面的铺展性与界面的性质有关。极性液体在亲水性界面，有较好的铺展性(即接触角较小)，而在疏水性界面则铺展性很差(即接触角较大)；与之相反的是，非极性液体在亲水性界面铺展性较差，而在疏水性界面上铺展性较好。常用的玻璃盖板经过清洗后，其界面都为亲水性界面，而使用的液态干燥剂大都为非极性的有机物。因此，在一般情况下，干燥剂在玻璃盖板表面的铺展性较差，在生产中容易出现干燥剂分布不均，部分区域填充不满，甚至出现由于瞬间压合时，液态干燥剂扩散不均匀导致气泡无法及时排出，从而导致冲胶的现象。
发明内容
本发明的目的在于提供一种OLED的封装方法，通过使用一种玻璃表面自组装方法，将玻璃盖板界面从亲水性界面修饰成为疏水性界面，从而
改变玻璃盖板界面的性质，从而使液态干燥剂在玻璃盖板界面具有良好的铺展性，提高OLED显示屏的封装效果。
本发明的另一目的在于提供一种OLED结构，通过在玻璃盖板上先自组装上疏水性单分子层，再涂布液态干燥剂，由于疏水性单分子层使得玻璃盖板界面从亲水性界面修饰成为疏水性界面，从而使液态干燥剂在玻璃盖板界面上具有良好的铺展性，最终提高OLED显示屏的封装效果。
为实现上述目的，本发明提供一种OLED的封装方法，包括如下步骤：
步骤1、提供玻璃盖板与待封装的基板，所述玻璃盖板包括显示区域及围绕显示区域的边缘区域；
步骤2、在所述玻璃盖板的边缘区域形成一层SiNx层；
步骤3、在所述玻璃盖板的显示区域表面自组装一疏水性单分子层；
步骤4、在所述玻璃盖板上围绕显示区域涂布一圈框胶；
步骤5、在所述玻璃盖板的显示区域上的疏水性单分子层上涂布干燥剂；
步骤6、将玻璃盖板与基板相对贴合；
步骤7、用UV灯照射使所述框胶固化，实现玻璃盖板对基板的封装。
所述基板为OLED基板；所述步骤3中自组装疏水性单分子层的方法为溶液浸泡法或蒸镀法。
所述步骤3中的疏水性单分子层为硅烷系列分子，所述硅烷系列分子为丙基三氯硅烷、十八烷基三氯硅烷、癸基三氯硅烷、癸基三甲氧基硅烷、癸基三乙氧基硅烷或癸基三(甲氧乙氧基)硅烷。
所述步骤4中的框胶涂布于玻璃盖板的边缘，并与显示区域之间留有间隙；所述框胶为UV胶。
所述步骤5中采用丝网印刷法涂布干燥剂；所述步骤6是在真空环境下进行的。
所述干燥剂为可固化型干燥剂或非固化型干燥剂。
所述非固化型干燥剂为含铝聚合物，所述含铝聚合物为[R－O－Al＝O]n(n≥1)；所述可固化型干燥剂为热固型液态干燥剂或UV固化型液态干燥剂。
所述步骤5中，当所述干燥剂为可固化型干燥剂时，涂布之后需要进行加热或UV光照固化处理。
本发明还提供一种OLED结构，包括基板、密封连接于所述基板上的玻璃盖板、及位于所述基板与玻璃盖板之间的框胶，所述玻璃盖板包括显示区域及围绕显示区域的边缘区域，还包括位于所述玻璃盖板的边缘区域
上的SiNx层，位于所述玻璃盖板的显示区域表面的自组装疏水性单分子层，及涂布于所述疏水性单分子层上的干燥剂。
所述基板为OLED基板；所述疏水性单分子层为硅烷系列分子；所述框胶位于玻璃盖板的边缘，并与显示区域之间留有间隙，所述框胶为UV胶；所述干燥剂为可固化型干燥剂或非固化型干燥剂。
本发明的有益效果：本发明OLED的封装方法及OLED结构，通过使用一种玻璃表面自组装方法，在玻璃盖板表面自组装上疏水性单分子层，使得玻璃盖板界面从亲水性界面修饰成为疏水性界面，从而使液态干燥剂在玻璃盖板界面具有良好的铺展性，避免了生产中容易出现的液态干燥剂扩散不均匀导致气泡无法及时排出，从而导致冲胶的现象，最终提高OLED显示屏的封装效果。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为本发明OLED的封装方法的流程图；
图2为本发明OLED的封装方法步骤1提供的玻璃盖板的俯视图；
图3为本发明OLED的封装方法步骤2的示意图；
图4为本发明OLED的封装方法步骤3的示意图；
图5为本发明OLED的封装方法步骤4的示意图；
图6为本发明OLED的封装方法步骤5的示意图；
图7为本发明OLED的封装方法步骤6的示意图；
图8为本发明OLED的封装方法步骤7的示意图；
图9为本发明OLED结构的剖面示意图。
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1-8，本发明提供一种OLED基板的封装方法，包括如下步骤：
步骤1、提供玻璃盖板1与待封装处理的基板5。
其中，所述基板5为OLED基板。如图2所示，所述玻璃盖板1包括显示区域3及围绕显示区域3的边缘区域。
步骤2、如图3所示，在所述玻璃盖板1的边缘区域形成一层SiNx层2，以保证将后续步骤3中的自组装区域限制在显示区域3内。
步骤3、如图4所示，在所述玻璃盖板1的显示区域3表面自组装上疏水性单分子层6。
其中，所述自组装方法可以采用溶液浸泡法或蒸镀法。优选的，所述疏水性单分子层6为硅烷系列分子，所述硅烷系列分子一般为丙基三氯硅烷、十八烷基三氯硅烷、癸基三氯硅烷、癸基三甲氧基硅烷、癸基三乙氧基硅烷或癸基三(甲氧乙氧基)硅烷等。
通常经清洗后的玻璃盖板1的表面为亲水性介面，而后续步骤5使用的液态干燥剂7为非极性的有机物。因此，在一般情况下，液态干燥剂7在玻璃盖板1表面的铺展性较差，在生产中容易出现液态干燥剂7在玻璃盖板1表面分布不均，部分区域填充不满，甚至出现在玻璃盖板1与基板5瞬间压合时，液态干燥剂7扩散不均匀导致气泡无法及时排出，从而导致冲胶的现象。而本发明中通过在所述玻璃盖板1的显示区域3表面自组装疏水性单分子层6，使玻璃盖板1的显示区域3表面的性质发生改变，由亲水性变为疏水性，从而使液态干燥剂7在玻璃盖板界面具有良好的铺展性。
步骤4、如图5所示，在所述玻璃盖板1上围绕显示区域3涂布一圈框胶4。
其中，框胶4涂布于玻璃盖板1的边缘，并与显示区域3之间留有一定间隙。所述框胶4为UV胶，用于实现玻璃盖板1对基板5的封装。
步骤5、如图6所示，在所述玻璃盖板1的显示区域3上的疏水性单分子层6上涂布干燥剂7。
所述干燥剂7为可固化型干燥剂或非固化型干燥剂。
所述非固化型干燥剂可以为含铝聚合物，所述含铝聚合物为[R－O－Al＝O]n(n≥1)；所述可固化型干燥剂为热固型液态干燥剂或UV固化型液态干燥剂。
所述步骤5中，当所述干燥剂7为可固化型干燥剂时，涂布之后需要进行加热或UV光照固化处理。
优选的，采用丝网印刷法涂布液态干燥剂7。由于该液态干燥剂7为非极性的有机物，并且玻璃盖板1的显示区域3表面由于自组装上疏水性单分子层6而变得具有疏水性，因此液态干燥剂7在玻璃盖板1表面可以铺展均匀。
步骤6、如图7所示，在真空环境下将玻璃盖板1与基板5相对贴合。
由于液态干燥剂7在玻璃盖板1表面铺展均匀，因此解决了在玻璃盖板1与基板5相对贴合时由于液态干燥剂7扩散不均匀导致气泡无法及时排出的问题，从而有效避免了冲胶的现象。
步骤7、如图8所示，用UV灯照射使所述框胶4固化，实现玻璃盖板1对基板5的封装。
该封装方法中，液态干燥剂7在玻璃盖板1的显示区域3表面均匀分布，且覆盖完全，不会产生气泡，提高了OLED显示屏的封装效果。
请参阅图9，在上述OLED基板的封装方法的基础上，本发明还提供一种OLED结构，包括基板5、密封连接于所述基板5上的玻璃盖板1、及位于所述基板5与玻璃盖板1之间的框胶4，所述玻璃盖板包括显示区域3及围绕显示区域3的边缘区域，还包括位于所述玻璃盖板1的边缘区域上的SiNx层2，位于所述玻璃盖板1的显示区域3表面的自组装疏水性单分子层6，及涂布于所述疏水性单分子层6上的干燥剂7。所述基板5为OLED基板。
所述疏水性单分子层6为硅烷系列分子，所述硅烷系列分子一般为丙基三氯硅烷、十八烷基三氯硅烷、癸基三氯硅烷、癸基三甲氧基硅烷、癸基三乙氧基硅烷或癸基三(甲氧乙氧基)硅烷等。
所述框胶4位于玻璃盖板1的边缘，并与显示区域3之间留有间隙，所述框胶4为UV胶。
所述干燥剂7为可固化型干燥剂或非固化型干燥剂；所述非固化型干燥剂可以为含铝聚合物，所述含铝聚合物为[R－O－Al＝O]n(n≥1)；所述可固化型干燥剂可以为热固型液态干燥剂或UV固化型液态干燥剂。
综上所述，本发明OLED的封装方法及OLED结构，通过使用一种玻璃表面自组装方法，在玻璃盖板表面自组装上疏水性单分子层，使得玻璃盖板界面从亲水性界面修饰成为疏水性界面，从而使液态干燥剂在玻璃盖板界面具有良好的铺展性，避免了生产中容易出现的液态干燥剂扩散不均匀导致气泡无法及时排出，从而导致冲胶的现象，最终提高OLED显示屏的封装效果。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。
Claims (11)
- 一种OLED的封装方法，包括如下步骤：步骤1、提供玻璃盖板与待封装的基板，所述玻璃盖板包括显示区域及围绕显示区域的边缘区域；步骤2、在所述玻璃盖板的边缘区域形成一层SiNx层；步骤3、在所述玻璃盖板的显示区域表面自组装一疏水性单分子层；步骤4、在所述玻璃盖板上围绕显示区域涂布一圈框胶；步骤5、在所述玻璃盖板的显示区域上的疏水性单分子层上涂布干燥剂；步骤6、将玻璃盖板与基板相对贴合；步骤7、用UV灯照射使所述框胶固化，实现玻璃盖板对基板的封装。
- 如权利要求1所述的OLED的封装方法，其中，所述基板为OLED基板；所述步骤3中自组装疏水性单分子层的方法为溶液浸泡法或蒸镀法。
- 如权利要求1所述的OLED的封装方法，其中，所述步骤3中的疏水性单分子层为硅烷系列分子，所述硅烷系列分子为丙基三氯硅烷、十八烷基三氯硅烷、癸基三氯硅烷、癸基三甲氧基硅烷、癸基三乙氧基硅烷或癸基三(甲氧乙氧基)硅烷。
- 如权利要求1所述的OLED的封装方法，其中，所述步骤4中的框胶涂布于玻璃盖板的边缘，并与显示区域之间留有间隙；所述框胶为UV胶。
- 如权利要求1所述的OLED的封装方法，其中，所述步骤5中采用丝网印刷法涂布干燥剂；所述步骤6是在真空环境下进行的。
- 如权利要求1所述的OLED的封装方法，其中，所述干燥剂为可固化型干燥剂或非固化型干燥剂。
- 如权利要求6所述的OLED的封装方法，其中，所述非固化型干燥剂为含铝聚合物，所述含铝聚合物为[R－O－Al＝O]n(n≥1)；所述可固化型干燥剂为热固型液态干燥剂或UV固化型液态干燥剂。
- 如权利要求6所述的OLED的封装方法，其中，所述步骤5中，当所述干燥剂为可固化型干燥剂时，涂布之后需要进行加热或UV光照固化处理。
- 一种OLED结构，包括基板、密封连接于所述基板上的玻璃盖板、及位于所述基板与玻璃盖板之间的框胶，所述玻璃盖板包括显示区域及围 绕显示区域的边缘区域，还包括位于所述玻璃盖板的边缘区域上的SiNx层，位于所述玻璃盖板的显示区域表面的自组装疏水性单分子层，及涂布于所述疏水性单分子层上的干燥剂。
- 如权利要求9所述的OLED结构，其中，所述基板为OLED基板；所述疏水性单分子层为硅烷系列分子；所述框胶位于玻璃盖板的边缘，并与显示区域之间留有间隙，所述框胶为UV胶；所述干燥剂为可固化型干燥剂或非固化型干燥剂。
- 一种OLED结构，包括基板、密封连接于所述基板上的玻璃盖板、及位于所述基板与玻璃盖板之间的框胶，所述玻璃盖板包括显示区域及围绕显示区域的边缘区域，还包括位于所述玻璃盖板的边缘区域上的SiNx层，位于所述玻璃盖板的显示区域表面的自组装疏水性单分子层，及涂布于所述疏水性单分子层上的干燥剂；其中，所述基板为OLED基板；所述疏水性单分子层为硅烷系列分子；所述框胶位于玻璃盖板的边缘，并与显示区域之间留有间隙，所述框胶为UV胶；所述干燥剂为可固化型干燥剂或非固化型干燥剂。
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| CN109735441A (zh) * | 2019-03-01 | 2019-05-10 | 赛纳生物科技(北京)有限公司 | 一种基因测序芯片及其制备方法 |
| CN109920933B (zh) * | 2019-03-05 | 2021-02-09 | 京东方科技集团股份有限公司 | 显示基板及其制造方法，显示面板、显示装置 |
| CN110413150B (zh) * | 2019-07-09 | 2020-12-25 | 深圳市华星光电半导体显示技术有限公司 | 一种红外触控显示装置及其制备方法 |
| CN110444568A (zh) * | 2019-07-31 | 2019-11-12 | 武汉华星光电半导体显示技术有限公司 | 有机发光二极管显示面板及其制作方法、显示装置 |
| CN111261647B (zh) * | 2020-01-20 | 2021-06-08 | 甬矽电子(宁波)股份有限公司 | 一种透光盖板、光学传感器及其制造方法 |
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| WO2013024238A1 (en) * | 2011-08-18 | 2013-02-21 | Cambridge Display Technology Limited | Electronic device |
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| CN104201295B (zh) | 2017-05-03 |
| US9614176B2 (en) | 2017-04-04 |
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