WO2016008301A1 - 一种工字型rfid射频芯片连接片 - Google Patents

一种工字型rfid射频芯片连接片 Download PDF

Info

Publication number
WO2016008301A1
WO2016008301A1 PCT/CN2015/072883 CN2015072883W WO2016008301A1 WO 2016008301 A1 WO2016008301 A1 WO 2016008301A1 CN 2015072883 W CN2015072883 W CN 2015072883W WO 2016008301 A1 WO2016008301 A1 WO 2016008301A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum foil
foil layer
chip
radio
frequency chip
Prior art date
Application number
PCT/CN2015/072883
Other languages
English (en)
French (fr)
Inventor
田艺儿
Original Assignee
田艺儿
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 田艺儿 filed Critical 田艺儿
Publication of WO2016008301A1 publication Critical patent/WO2016008301A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter

Definitions

  • the utility model relates to an I-shaped RFID radio frequency chip connecting piece.
  • the area of the RFID radio frequency chip is getting smaller and smaller, reaching 0.5mm*0.5mm, and the area of the electrical connection pin on the chip is smaller.
  • the process of installing the RFID radio frequency chip on the RF antenna is complicated, and the time of the anisotropic conductive adhesive is solidified. It lasts for 5-7 seconds, so the production efficiency of the RF chip mounted on the antenna is very low.
  • the RF chip is mounted on a standard-sized chip connection piece, that is, the electrical connection leg of the RF chip is mounted together with the chip connection piece to form a chip connection piece assembly (known as "strap" in the industry), and then mounted on different shapes of the RF antenna. on.
  • the size of the aluminum foil of the tie-tie RFID chip connector used in the market is 3.5*8mm, and the outer edge size is 4*9mm. Due to the limitation of the chip mounter, it is impossible to connect the chip of the 4*9mm tie knot shape. Therefore, it can only be used for the RF antenna with the longitudinal opening of the RF resonant cavity. The size of the "tie-tie" RF chip connection piece is large, which affects the aesthetic appearance of the RF product.
  • the "X"-shaped chip connecting piece used in the market has a small size of 4*4.5 mm, and the width of the chip connecting piece is about 1 mm, and the contact resistance with the RF antenna is large, and the accuracy of mounting the RF antenna is high. Thereby affecting the installation efficiency.
  • the purpose of the utility model is to overcome the above drawbacks and provide an I-shaped RFID radio frequency chip connecting piece.
  • the technical problem to be solved by the utility model is to improve the production efficiency of the electrical connection between the radio frequency chip and the radio frequency antenna, and the radio frequency chip connecting piece can be
  • the antenna used for the lateral opening of the RF resonant cavity compensates for the shortage of the "tie-tie" type RF chip connection piece which cannot be used for the laterally-opening antenna.
  • An I-shaped RFID radio frequency chip connecting piece characterized in that it comprises a PET base film, and an aluminum foil layer is composited on the PET base film, and the aluminum foil layer is provided as four components, respectively comprising an upper aluminum foil layer and a lower aluminum foil a layer and two intermediate aluminum foil layers, the upper aluminum foil layer and the lower aluminum foil layer are T-shaped structures, correspondingly disposed on the PET base film, the two intermediate aluminum foil layers are rectangular structures, correspondingly disposed in the middle of the PET base film
  • the upper aluminum foil layer, the lower aluminum foil layer and the two intermediate aluminum foil layers have an I-shaped structure and are uniform in height.
  • the upper aluminum foil layer has a lower end connected to an RF chip effective leg, and a lower aluminum foil layer has an upper end thereof. Another RF chip is connected to the active leg, and two intermediate aluminum foil layers are respectively connected to two invalid RF chip legs.
  • the column foot of the RF chip is fixed on the chip connection piece to become the RF chip connection piece assembly, and the RF chip column foot is extended by about 2 mm, which improves the production efficiency of the electrical connection with the RF antenna;
  • the I-shaped RF chip connecting piece can be used for the antenna of the horizontal opening of the RF resonant cavity, which makes up for the shortage of the "tie-tie” type RF chip connecting piece which cannot be used for the lateral opening antenna;
  • the size of the I-shaped RF chip connecting piece is small (4*4mm), suitable for small-sized antennas, and the appearance is better than the “tie-tie” chip connection piece;
  • connection area of the I-shaped RF chip connecting piece and the RF antenna reaches 1*4mm, which is 4 times higher than the connection area of the "X" type RF chip connecting piece and the antenna.
  • the contact resistance is small and the RF antenna quality is good;
  • the area connecting the I-shaped RF chip connecting piece and the antenna is 1*4mm. In the installation, the tolerance of the I-shaped RF chip connecting piece is ⁇ 1mm, which greatly improves the production efficiency;
  • Figure 1-1 shows the outline structure of the RF chip.
  • Figure 1-2 is a side elevational view of Figure 1-1.
  • Figure 2-1 shows the outline structure of the tie-tie RF chip connector used in the market.
  • Figure 2-2 is a side view of Figure 2-1.
  • Figure 3-1 shows the outline structure of the X-type RF chip connector used in the market.
  • Figure 3-2 is a side view of Figure 3-1.
  • Figure 4-1 is a structural view of the I-shaped chip connecting piece of the present invention.
  • Figure 4-2 is a side view of Figure 4-1.
  • Figure 5-1 shows the chip on the chip connection piece of the present invention. Into a structural drawing.
  • Figure 5-2 is a side elevational view of Figure 5-1.
  • Figure 6-1 is a connection diagram of the chip connector assembly and the RF antenna of the present invention.
  • Figure 6-2 is a cross-sectional view taken along line A-A of Figure 6-1.
  • Fig. 7 is a structural view showing an enlarged side section of D.
  • chip body 11, effective column foot; 12, invalid column foot; 13, effective column foot; 14, invalid column foot; 20, PET film; 21 (22, 23, 24), tie knot Aluminum foil layer of chip connecting piece; 31 (32, 33, 34), X-type chip connecting piece aluminum foil layer; 41 (42, 43, 44), I-shaped chip connecting piece aluminum foil layer; 50, RF antenna substrate PET film; 51. RF antenna aluminum foil layer; 52, RF antenna cavity opening.
  • the radio frequency chip is provided with four legs 11 , 12 , 13 , and 14 on the chip body 10 , wherein 11 and 13 are chip effective legs, and 12 and 14 are chip invalid columns. foot.
  • the size of the aluminum foil of the tie-tie RFID chip connector used in the market is 3.5*8mm, the outer edge size is 4*9mm, and 20 is a PET film as a chip connection piece.
  • Base film, thickness 0.05 mm, 21, 22, 23, 24 is the aluminum foil layer of the chip connecting piece, thickness 0.01 mm, 21, 23 and the chip effective legs 11, 13 are fixed by conductive adhesive, 22, 24 and the chip are invalid
  • the legs 12 and 14 are fixed together by a conductive adhesive. Due to the limitation of the chip mounter, the 4*9mm tie-tie chip connection piece cannot be erected, so it can only be used for the RF antenna with the longitudinal opening of the RF resonator.
  • the "tie tie" type RF chip connection piece has a large size, which affects the appearance of the RF product.
  • the size of the "X"-shaped chip connector on the market is small, 4*4.5mm, and the width of the chip connector is about 1mm, which is compared with the contact resistance of the RF antenna. Large, the accuracy of the installation of the RF antenna is high, which affects the installation efficiency.
  • 31, 32, 33, 34 are the X-shaped chip connecting piece aluminum foil layer, fixed on the PET base film 20, the aluminum foil layer 31, 33 and the chip effective column foot 11, 13 is fixed together by a conductive adhesive, and the aluminum foil layers 32, 34 and the chip invalid legs 12, 14 are fixedly connected by a conductive adhesive.
  • the composite aluminum foil on the PET base film 20 of the present invention is chemically etched to leave a shape structure as shown in FIG. 4-1, and the lower end of the upper aluminum foil layer 41 is connected to the chip leg 11
  • the contact area is large, and the contact resistance is smaller, which improves the working efficiency of the connection between the chip connector assembly and the RF antenna.
  • the aluminum foil layers 42, 44 are used to fix the invalid column legs of the radio frequency chip, and the positively small aluminum foil layer ensures that the invalid column legs and the effective column legs are simultaneously fixed on the aluminum foil and maintain the same level.
  • the chip 10 is fixed on the aluminum foil layer at the center of the chip connecting piece by a conductive adhesive, and the aluminum foil layers 41 and 43 are respectively fixed to the effective column legs 11 and 13 of the chip through the conductive adhesive.
  • the aluminum foil layers 42 and 44 are respectively fixed to the chip invalid legs 12 and 14 via the conductive adhesive, and the effective legs of the chip 10 are electrically connected to the aluminum foils 41 and 43.
  • the electrical connection size of the legs of the chip 10 is expanded from 0.5*0.5 mm. 4*4 mm range, extremely easy to install on the RF antenna, solves the problem of the RF chip size is very small, the chip is installed in the RF The end of the antenna is difficult and the production efficiency is low.
  • the aluminum foil layer of the chip connecting piece assembly is pressed together with the center of the cavity opening 52 of the antenna aluminum foil layer 51 or bonded together by a conductive adhesive.
  • the conductive aluminum foil layers 41, 43 are electrically connected to the antenna aluminum foil layer 51, and the effective legs 11 and 13 of the RF chip 10 are electrically connected to the RF antenna cavity opening 52 of the antenna aluminum foil layer 51.
  • the RF chip 10 is provided with RF reading and writing.

Landscapes

  • Details Of Aerials (AREA)

Abstract

一种工字型RFID射频芯片连接片，其特征在于，它包括PET底膜（20），在PET底膜（20）复合有铝箔层（41-44），所述的铝箔层（41-44）设置为四个组成部分，分别包括上部铝箔层（41）、下部铝箔层（43）与两个中间铝箔层（42，44），所述的上部铝箔层（41）和下部铝箔层（43）为T型结构，对应设置在PET底膜（20）上，所述的两个中间铝箔层（42，44）为矩形结构，对应设置在PET底膜（20）中部，所述的上部铝箔层（41）其下端与一个射频芯片有效柱脚（11）相连，下部铝箔层（43）其上端与另一个射频芯片有效柱脚（13）相连，两个中间铝箔层（42，44）分别与两个无效的射频芯片柱脚（12，14）相连，从而提高了射频芯片与射频天线电气连接的生产效率，而且射频芯片连接片可以用于射频谐振腔横向开口的天线，弥补领带结式射频芯片连接片不能用于横向开口天线的不足。

Description

一种工字型RFID射频芯片连接片 技术领域
本实用新型涉及一种工字型RFID射频芯片连接片。
背景技术
目前，RFID射频芯片的面积越来越小，达0.5mm*0.5mm，芯片上面的电气连接脚的面积更小，将RFID射频芯片安装在射频天线的工艺很复杂，异向导电胶固化的时间长达5-7秒钟，因而射频芯片安装在天线上的生产效率很低。
将射频芯片安装在标准尺寸的芯片连接片上，即将射频芯片的电气连接柱脚与芯片连接片安装在一起成为芯片连接片总成(业内称为“strap”)，然后安装在不同形状的射频天线上。
市场上在用的领带结型RFID射频芯片连接片的铝箔的尺寸为3.5*8mm，外沿尺寸4*9mm，由于芯片贴片机的限制，无法将4*9mm领带结形状的芯片连接片竖起来，故此只能用于射频谐振腔纵向开口的射频天线，“领带结”式射频芯片连接片尺寸大，影响射频产品美观。
另外市场上在用的“X”形状的芯片连接片的尺寸小，为4*4.5mm，芯片连接片的宽度1mm左右，与射频天线的接触电阻较大，安装在射频天线的精度要求高，从而影响安装效率。
实用新型内容
本实用新型的目的是克服上述缺陷，提供一种工字型RFID射频芯片连接片，本实用新型需要解决的技术问题是：提高射频芯片与射频天线电气连接的生产效率，而且射频芯片连接片可以用于射频谐振腔横向开口的天线，弥补“领带结”式射频芯片连接片不能用于横向开口天线的不足。
本实用新型技术方案如下所述：
一种工字型RFID射频芯片连接片，其特征在于，它包括PET底膜，在PET底膜复合有铝箔层，所述的铝箔层设置为四个组成部分，分别包括上部铝箔层、下部铝箔层与两个中间铝箔层，所述的上部铝箔层和下部铝箔层为T型结构，对应设置在PET底膜上，所述的两个中间铝箔层为矩形结构，对应设置在PET底膜中部，所述的上部铝箔层、下部铝箔层与两个中间铝箔层整体呈工字型结构并且高度一致，所述的上部铝箔层其下端与一个射频芯片有效柱脚相连，下部铝箔层其上端与另一个射频芯片有效柱脚相连，两个中间铝箔层分别与两个无效的射频芯片柱脚相连。
所述的上部铝箔层的上端、下部铝箔层的下端长度为4mm，宽度为1mm，面积为1mm*4mm＝4平方毫米。
根据上述结构及技术方案，本实用新型的有益效果在于：
1、射频芯片的柱脚固定在芯片连接片上成为射频芯片连接片总成，射频芯片柱脚外延了约2mm，提高了与射频天线电气连接的生产效率；
2、工字型射频芯片连接片可用于射频谐振腔横向开口的天线，弥补了“领带结”式射频芯片连接片不能用于横向开口天线的不足；
3、工字型射频芯片连接片的尺寸小(4*4mm)，适用于小尺寸天线，外观比“领带结”式芯片连接片好；
4、工字型射频芯片连接片与射频天线的连接面积达到1*4mm，比“X”型射频芯片连接片与天线连接的面积提高了4倍，接触电阻小，射频天线质量好；
5、工字型射频芯片连接片与天线连接的面积1*4mm，在安装中工字型射频芯片连接片允许误差达到±1mm，从而大大提高了生产效率；
6、将工字型芯片连接片旋转90度，成为“H”型芯片连接片，可适用于射频谐振腔纵向开口的射频天线。
附图说明
图1-1为射频芯片的外形结构图。
图1-2为图1-1的侧面视图。
图2-1为市场在用的领带结型射频芯片连接片外形结构图。
图2-2为图2-1的侧面视图。
图3-1为市场在用的X型射频芯片连接片外形结构图。
图3-2为图3-1的侧面视图。
图4-1为本实用新型工字型芯片连接片结构图。
图4-2为图4-1的侧面视图。
图5-1为本实用新型芯片连接片上安装芯片成为芯片连接片总 成外形结构图。
图5-2为图5-1的侧面视图。
图6-1为本实用新型芯片连接片总成与射频天线的连接外形图。
图6-2为图6-1的A-A向侧剖面视图。
图7为D处侧剖面放大后的结构视图。
在图中，10、芯片本体；11、有效柱脚；12、无效柱脚；13、有效柱脚；14、无效柱脚；20、PET膜；21(22、23、24)、领带结形芯片连接片的铝箔层；31(32、33、34)、X型芯片连接片铝箔层；41(42、43、44)、工字型芯片连接片铝箔层；50、射频天线基底PET膜；51、射频天线铝箔层；52、射频天线谐振腔开口处。
具体实施方式
如图1-1、1-2所示，射频芯片在芯片本体10上设置有四个柱脚11、12、13、14，其中11、13为芯片有效柱脚，12、14为芯片无效柱脚。
如图2-1、2-2所示，市场上在用的领带结型RFID射频芯片连接片的铝箔的尺寸为3.5*8mm，外沿尺寸4*9mm，20为PET膜，作为芯片连接片基底膜，厚度0.05毫米，21、22、23、24为芯片连接片的铝箔层，厚度0.01毫米，21、23与芯片有效柱脚11、13经导电胶固定在一起，22、24与芯片无效柱脚12、14经导电胶连接固定在一起，由于芯片贴片机的限制，无法将4*9mm领带结形状的芯片连接片竖起来，故此只能用于射频谐振腔纵向开口的射频天线，“领带结”式射频芯片连接片尺寸大，影响射频产品美观。
如图3-1、3-2所示，市场上在用的“X”形状的芯片连接片的尺寸小，为4*4.5mm，芯片连接片的宽度1mm左右，与射频天线的接触电阻较大，安装在射频天线的精度要求高，从而影响安装效率，31、32、33、34为X形芯片连接片铝箔层，固定在PET基底膜20上，铝箔层31、33与芯片有效柱脚11、13经导电胶连接固定在一起，铝箔层32、34与芯片无效柱脚12、14经导电胶连接固定在一起。
如图4-1、4-2所示，本实用新型PET底膜20上复合铝箔，经过化学蚀刻后留下如图4-1的形状结构，上部铝箔层41其下端与芯片柱脚11相连，下部铝箔层43其上端与芯片柱脚13相连，上部铝箔层41的上端、下部铝箔层43的下端的面积为1mm*4mm＝4平方毫米，远远大于X型芯片连接片上下端面积，将来与射频天线连接时的接触面积大，具有更小的接触电阻，提高芯片连接片总成与射频天线连接的工作效率。
铝箔层42、44用来固定射频芯片的无效柱脚，面积极小的铝箔层确保芯片无效柱脚与有效柱脚同时固结在铝箔上，保持一样的水平高度。
如图5-1、5-2所示，芯片10经过导电胶粘结固定在芯片连接片中心的铝箔层上，铝箔层41、43经导电胶分别与芯片有效柱脚11、13连接固定，铝箔层42、44经导电胶分别与芯片无效柱脚12、14连接固定，芯片10的有效柱脚与铝箔41、43的电气连接，芯片10的柱脚电气连接尺寸从0.5*0.5毫米扩大到了4*4毫米的范围，极其方便安装在射频天线上，解决了射频芯片尺寸极小，芯片安装在射频 天线上的结束难度高及生产效率低的缺陷。
如图6-1、6-2、图7所示，将芯片连接片总成的铝箔层面与天线铝箔层51的谐振腔开口处52中心处压合在一起或者用导电胶粘合在一起，通过导电铝箔层41、43与天线铝箔层51电气连接，射频芯片10的有效柱脚11、13与天线铝箔层51的射频天线谐振腔开口处52实现电气连接，射频芯片10具备了射频读写功能。

Claims (2)

  1. 一种工字型RFID射频芯片连接片，其特征在于，它包括PET底膜，在PET底膜复合有铝箔层，所述的铝箔层设置为四个组成部分，分别包括上部铝箔层、下部铝箔层与两个中间铝箔层，所述的上部铝箔层和下部铝箔层为T型结构，对应设置在PET底膜上，所述的两个中间铝箔层为矩形结构，对应设置在PET底膜中部，所述的上部铝箔层、下部铝箔层与两个中间铝箔层整体呈工字型结构并且高度一致，所述的上部铝箔层其下端与一个射频芯片有效柱脚相连，下部铝箔层其上端与另一个射频芯片有效柱脚相连，两个中间铝箔层分别与两个无效的射频芯片柱脚相连。
  2. 根据权利要求1所述的工字型RFID射频芯片连接片，其特征还在于，所述的上部铝箔层的上端、下部铝箔层的下端长度为4mm，宽度为1mm，面积为1mm*4mm＝4平方毫米。
PCT/CN2015/072883 2014-07-15 2015-02-12 一种工字型rfid射频芯片连接片 WO2016008301A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201420388919.8 2014-07-15
CN201420388919.8U CN203951011U (zh) 2014-07-15 2014-07-15 一种工字型rfid射频芯片连接片

Publications (1)

Publication Number Publication Date
WO2016008301A1 true WO2016008301A1 (zh) 2016-01-21

Family

ID=51893029

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/072883 WO2016008301A1 (zh) 2014-07-15 2015-02-12 一种工字型rfid射频芯片连接片

Country Status (2)

Country Link
CN (1) CN203951011U (zh)
WO (1) WO2016008301A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203951011U (zh) * 2014-07-15 2014-11-19 深圳市骄冠科技实业有限公司 一种工字型rfid射频芯片连接片
CN106288949A (zh) * 2016-08-11 2017-01-04 田艺儿 一种通过rfid进行分类识别和追踪的警棍
CN106847785A (zh) * 2017-03-15 2017-06-13 深圳市骄冠科技实业有限公司 一种射频芯片连接片总成及其制备工艺
WO2022056680A1 (zh) * 2020-09-15 2022-03-24 焦林 一种具有压力平衡柱脚短路线的射频芯片

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090278687A1 (en) * 2007-04-06 2009-11-12 Murata Manufacturing Co., Ltd. Wireless ic device
CN201838021U (zh) * 2010-09-27 2011-05-18 焦林 一种射频芯片双极连接片
WO2013064741A1 (en) * 2011-11-04 2013-05-10 Teknologian Tutkimuskeskus Vtt Antenna construction, and an rfid transponder system comprising the antenna construction
US20140103117A1 (en) * 2012-10-17 2014-04-17 Fujitsu Limited Rfid tag
CN203951011U (zh) * 2014-07-15 2014-11-19 深圳市骄冠科技实业有限公司 一种工字型rfid射频芯片连接片

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090278687A1 (en) * 2007-04-06 2009-11-12 Murata Manufacturing Co., Ltd. Wireless ic device
CN201838021U (zh) * 2010-09-27 2011-05-18 焦林 一种射频芯片双极连接片
WO2013064741A1 (en) * 2011-11-04 2013-05-10 Teknologian Tutkimuskeskus Vtt Antenna construction, and an rfid transponder system comprising the antenna construction
US20140103117A1 (en) * 2012-10-17 2014-04-17 Fujitsu Limited Rfid tag
CN203951011U (zh) * 2014-07-15 2014-11-19 深圳市骄冠科技实业有限公司 一种工字型rfid射频芯片连接片

Also Published As

Publication number Publication date
CN203951011U (zh) 2014-11-19

Similar Documents

Publication Publication Date Title
WO2016008301A1 (zh) 一种工字型rfid射频芯片连接片
JP2011512755A5 (zh)
CN203932322U (zh) 方形偶极天线
CN207441944U (zh) 聚酰亚胺基材多层天线
CN204244567U (zh) 具有良好散热结构的电路板
CN207011084U (zh) 一种带镂空金手指的厚铜箔矫形fpc
CN207426156U (zh) 一种宽带高频双极化振子
CN206421939U (zh) 一种低电感低等效串联电阻高频谐振电容器
CN105470618B (zh) 一种腔体谐振抑制结构
CN206401301U (zh) 一种基岛翻边可焊线的封装结构
CN201829489U (zh) 芯片区压边集成电路引线框架
WO2015135412A1 (zh) 一种射频芯片连接片总成
CN108633164A (zh) 气密结构
CN102904545A (zh) 微小晶体谐振器
CN206401311U (zh) 一种基岛翻边可焊线的框架结构
CN207016369U (zh) 车围吊具定位组件
CN209401837U (zh) 一种防呆天线
CN201289847Y (zh) 以塑封料部分取代引线框架材料的器件
CN207538382U (zh) 墙面装饰板安装件
CN204071644U (zh) 一种可充气浴帘
CN208352531U (zh) 具有定位结构的端脚组件
CN209119337U (zh) 一种塑胶五金天线
CN203055947U (zh) 太阳能组件连接角码
CN206272961U (zh) 一种具有凸台结构的基板
CN207705467U (zh) 一种焊板结构的微型射频连接器插座

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15821878

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15821878

Country of ref document: EP

Kind code of ref document: A1