WO2022056680A1 - 一种具有压力平衡柱脚短路线的射频芯片 - Google Patents

一种具有压力平衡柱脚短路线的射频芯片 Download PDF

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Publication number
WO2022056680A1
WO2022056680A1 PCT/CN2020/115362 CN2020115362W WO2022056680A1 WO 2022056680 A1 WO2022056680 A1 WO 2022056680A1 CN 2020115362 W CN2020115362 W CN 2020115362W WO 2022056680 A1 WO2022056680 A1 WO 2022056680A1
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pressure balance
radio frequency
frequency chip
short
lead
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PCT/CN2020/115362
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English (en)
French (fr)
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焦林
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焦林
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Priority to PCT/CN2020/115362 priority Critical patent/WO2022056680A1/zh
Publication of WO2022056680A1 publication Critical patent/WO2022056680A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the utility model relates to the technical field of radio frequency, and more particularly, to a radio frequency chip with a pressure-balanced column foot short-circuit line.
  • a radio frequency chip refers to an electronic component that converts radio signal communication into a certain radio signal waveform and sends it out through antenna resonance. It is regarded as one of the core components of radio frequency technology and is widely used in various industries.
  • the bottom of the traditional radio frequency chip is provided with a pressure balance pin, which has nothing to do with the chip circuit.
  • the pressure balance pin supports the chip and maintains the balance of the chip together with the lead pin.
  • the traditional RF chip pin layout has the following defects:
  • the contact resistance on-line measurement cannot be performed on the bottom pin layout. Since the RF chip is fixed on the RF antenna by flip-packaging with thermally cured anisotropic conductive resin, the coating amount of the anisotropic conductive resin, packaging pressure, The packaging temperature and the cleanliness of the surface of the aluminum foil antenna will affect the contact resistance between the lead pins and the aluminum foil antenna. Failure to measure the contact resistance will make it difficult to monitor the packaging quality and affect production efficiency.
  • the present invention provides a radio frequency chip with a pressure-balanced pin short circuit.
  • a radio frequency chip with a pressure balance column foot short circuit the bottom of the radio frequency chip is provided with a lead column foot and a pressure balance column foot, a short circuit line is arranged between the pressure balance column foot, and the thickness of the short circuit line is smaller than the lead column foot the height of.
  • the short-circuit lines are conductive lines made of silver or gold.
  • the thickness of the short-circuit lines is less than 2 microns.
  • the lead pins and the pressure balance pins are symmetrically distributed in the center.
  • the pressure balance column foot includes a first pressure balance column foot and a second pressure balance column foot, the first pressure balance column foot and the second pressure balance column foot
  • the balance pins are connected through the short-circuit line.
  • the number of the lead pins and the pressure balance pins are both two, and the lead pins are respectively arranged at the opposite corners of the bottom of the radio frequency chip.
  • the pressure balance pillars are respectively arranged at the other two diagonal corners of the bottom of the radio frequency chip.
  • the beneficial effect is that the utility model adds a short-circuit line between the pressure balancing legs, and when making a radio frequency antenna with inner and outer loop antennas connected in series, the lead legs pass through the pressure balancing legs and the short circuit.
  • Route connection instead of connecting through slender inner and outer coil connecting lines, simplifies the production process, greatly reduces the production scrap rate, and is conducive to the promotion of miniature RF sensors with two-circle RF antennas, and at the same time, it can measure the RF chip and the aluminum foil antenna package online. Contact resistance when fixed, monitor the chip packaging process, and improve the quality of chip packaging.
  • FIG. 1 is a schematic structural diagram 1 of the present utility model.
  • FIG. 2 is a second structural schematic diagram of the utility model.
  • FIG. 3 is a schematic diagram of the connection structure between the utility model and the aluminum foil antenna.
  • FIG. 4 is a schematic diagram of the structure of adding a contact resistance aluminum foil measuring disc when the RF chip is packaged.
  • a radio frequency chip with a pressure balance column foot short circuit as shown in FIG. 1 , the bottom of the radio frequency chip 1 is provided with a lead column foot 11 and a pressure balance column foot 12, and a short circuit 13 is arranged between the pressure balance column foot 12, and the short circuit 13
  • the thickness is smaller than the height of the lead pins 11 .
  • the pressure balance column foot 12 includes a first pressure balance column foot 121 and a second pressure balance column foot 122 .
  • the first pressure balance column foot 121 and the second pressure balance column foot 122 are connected by a short-circuit line 13 . or short-circuit connection.
  • the lead pin 11 includes a first lead pin 111 and a second lead pin 112 .
  • the first pressure balance pins 121 and the second pressure balance pins 122 are arranged diagonally, and the first lead pins 111 and the second lead pins 112 are arranged diagonally.
  • the four pillars are symmetrically arranged at the four corners of the bottom of the chip to obtain a more stable equilibrium state.
  • the lead pins 11 are hemispherical, and the lead pins 11 are connected to the aluminum foil antenna.
  • the pressure balance column foot 12 is conical or hemispherical, and is in contact with the short-circuit line 13, and forms a balanced state at the bottom of the radio frequency chip 1, and plays the role of supporting and balancing the radio frequency chip 1.
  • the short-circuit line 13 is a conductive line made of silver or gold.
  • the lead pins on the radio frequency chip 1 are connected to the aluminum foil antenna.
  • the first lead pin 111 is connected with the first pressure balance pin 121 through the aluminum foil antenna to form a passage of the inner loop antenna 2
  • the first lead pin 111 is the starting end of the inner loop antenna 2
  • the first pressure balance pin 121 is The terminal of the inner loop antenna 2.
  • the first pressure balance column 121 is connected to the second pressure balance column 122 through the short circuit 13 .
  • the second pressure balance column 122 is connected with the second lead column 112 through the aluminum foil antenna to form a passage of the outer loop antenna 3 , the second lead column 112 is the starting end of the outer loop antenna 3 , and the second pressure balance column 122 is the outer loop antenna 3 . Terminal of loop antenna 3.
  • the inner loop antenna 2 and the outer loop antenna 3 are connected in series through the short-circuit line 13, and the path is the first lead pin 111—the inner loop antenna 2—the first pressure balance pin 121—the short-circuit line 13— — the second pressure balance pin 122 — the outer loop antenna 3 — the second lead pin 112 .
  • the utility model connects the inner loop antenna 2 and the outer loop antenna 3 through the short-circuit line 13 to form a series radio frequency antenna. Due to the setting of the short-circuit line 13, the inner loop antenna 2 can be connected to the outer loop antenna 3 through the pressure balance column 12. There is no need to use a laser to engrave a 0.1 mm wide aluminum foil line segment to connect the inner loop antenna 2 and the outer loop antenna.
  • the antenna 3 is independent and produced separately, which simplifies the production process of the aluminum foil antenna, thereby improving the product qualification rate and production efficiency, and making it possible to popularize the miniature radio frequency sensor with two aluminum foil antennas.
  • the thickness of the shorting line 13 is much smaller than the height of the pins of the RF chip 1 . In one embodiment, the thickness of the shorting line 13 is less than 2 micrometers, and the heights of the lead pins 11 and the pressure balance pins 12 are 15-18 micrometers. Therefore, the short-circuit line 13 does not affect the packaging and fixation of the radio frequency chip 1 .
  • the contact resistance aluminum foil test pad is added to test the packaging.
  • the two contacts on the resistance measuring instrument are respectively contacted and connected with the contact resistance aluminum foil measuring disc 4 to obtain the resistance value between the first pressure balance pin 121 and the second pressure balance pin 122 to determine the first pressure balance pin 121.
  • the packaging of the lead pins 111, the second lead pins 112 and the aluminum foil antenna adjust the coating amount of the guiding conductive resin in time, change the packaging temperature and packaging pressure, and keep the measured resistance value as low as possible. Encapsulation quality, improve the stability of RFID tags.
  • a short circuit 13 is added between the pressure balance legs 12, and the lead legs 11 are connected by the pressure balance legs 12 and the short circuit 13, instead of being connected by a slender inner and outer coil connecting wire, which separates the inner and outer coils into two parts.
  • An independent aluminum foil antenna simplifies the production process, greatly reduces the production scrap rate, and is conducive to the promotion of miniature radio frequency sensors with two inner and outer circles of radio frequency antennas in series.
  • the packaging process improves the quality of chip packaging.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

一种具有压力平衡柱脚短路线（13）的射频芯片（1），射频芯片（1）底部设置引线柱脚（11）与压力平衡柱脚（12），压力平衡柱脚（12）之间设置短路线（13），短路线（13）小于引线柱脚（11）的高度。在制作内环天线（2）和外环天线（3）串联在一起的射频天线时，内环天线（2）和外环天线（3）通过引线柱脚（11）、压力平衡柱脚（12）及短路线（13）连接，而非通过细长的连接线连接，从而将内环天线（2）和外环天线（3）分开为两条独立的铝箔天线，该射频芯片（1）的设计简化了制作工艺，降低了生产废品率，同时能够在线测量射频芯片（1）与铝箔天线封装固定时的接触电阻，监控封装过程，提高封装质量。

Description

一种具有压力平衡柱脚短路线的射频芯片 技术领域
本实用新型涉及射频技术领域，更具体地说，是涉及一种具有压力平衡柱脚短路线的射频芯片。
背景技术
射频芯片指的就是将无线电信号通信转换成一定的无线电信号波形，并通过天线谐振发送出去的一个电子元器件，被视作射频技术的核心部件之一，广泛用于各行业中。
传统的射频芯片底部设置有压力平衡柱脚，该压力平衡柱脚与芯片电路无关联，用于芯片封装时与引线柱脚一同起到支撑芯片、保持芯片平衡的作用。传统的射频芯片柱脚布局具有如下缺陷：
1.在制作具有内外双环的两圈铝箔射频天线时，为了令内环天线与外环天线连接的同时还连接射频芯片的引线柱脚，需要在芯片柱脚之间制作一条极细的铝箔线条作为内环天线与外环天线的连接线，通常为内环天线与外环天线一体化制作，因该铝箔线条工艺复杂，在生产过程中易造成铝箔天线废品率提高，影响生产效率与生产数量。
2.在封装时，该底部柱脚布局无法实施接触电阻在线测量，由于射频芯片是通过热固化异向导电树脂倒封装固定在射频天线上，故而异向导电树脂的涂布量、封装压力、封装温度及铝箔天线表面的洁净度都会影响引线柱脚与铝箔天线的接 触电阻，无法测量接触接触电阻会导致难以监控封装质量，影响生产效率。
以上不足，有待改进。
发明内容
为了克服现有的技术的不足，本实用新型提供一种具有压力平衡柱脚短路线的射频芯片。
本实用新型技术方案如下所述：
一种具有压力平衡柱脚短路线的射频芯片，射频芯片底部设置引线柱脚与压力平衡柱脚，所述压力平衡柱脚之间设置短路线，所述短路线的厚度小于所述引线柱脚的高度。
上述的一种具有压力平衡柱脚短路线的射频芯片，所述短路线为银或金制成的导电线条。
上述的一种具有压力平衡柱脚短路线的射频芯片，所述短路线的厚度小于2微米。
上述的一种具有压力平衡柱脚短路线的射频芯片，所述引线柱脚与所述压力平衡柱脚呈中心对称分布。
上述的一种具有压力平衡柱脚短路线的射频芯片，所述压力平衡柱脚包括第一压力平衡柱脚与第二压力平衡柱脚，所述第一压力平衡柱脚与所述第二压力平衡柱脚通过所述短路线连接。
上述的一种具有压力平衡柱脚短路线的射频芯片，所述引线柱脚与所述压力平衡柱脚的数量均为二，所述引线柱脚分别设置在所述射频芯片底部的对角处，所述压力平衡柱脚分别设置在所述射频芯片底部的另外两个对角处。
根据上述方案的本实用新型，其有益效果在于，本实用新型在压力平衡柱脚之间增加短路线，制作具有内外环天线串联在一起的射频天线时，引线柱脚通过压力平衡柱脚及短路线连接，而非通过细长的内外线圈连接线连接，简化制作工艺，极大地降低生产废品率，有利于推广含两圈式射频天线的微型射频传感器，同时能够在线测量射频芯片与铝箔天线封装固定时的接触电阻，监控芯片封装过程，提高芯片封装质量。
附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本实用新型的结构示意图一。
图2为本实用新型的结构示意图二。
图3为本实用新型与铝箔天线的连接结构示意图。
图4为射频芯片封装时添加接触电阻铝箔测量盘的结构示意图。
其中，图中各附图标记：
1.射频芯片；11.引线柱脚；111.第一引线柱脚；112.第二引线柱脚；12.压力平衡柱脚；121.第一压力平衡柱脚；122.第二压力平衡柱脚；13.短路线；
2.内环天线；
3.外环天线；
4.接触电阻铝箔测量盘。
具体实施方式
为了使本实用新型所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本实用新型，并不用于限定本实用新型。
需要说明的是，当部件被称为“固定”或“设置”或“连接”另一个部件，它可以直接或者间接位于该另一个部件上。术语“内”、“外”等指示的方位或位置为基于附图所示的方位或位置，仅是为了便于描述，不能理解为对本技术方案的限制。术语“第一”、“第二”等仅用于便于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明技术特征的数量。
一种具有压力平衡柱脚短路线的射频芯片，如图1所示，射频芯片1底部设置引线柱脚11与压力平衡柱脚12，压力平衡柱脚12之间设置短路线13，短路线13的厚度小于引线柱脚11的高度。
如图1所示，压力平衡柱脚12包括第一压力平衡柱脚121与第二压力平衡柱脚122，第一压力平衡柱脚121与第二压力平衡柱脚122通过短路线13连接，二者短路连接。引线柱脚11包括第一引线柱脚111与第二引线柱脚112。第一压力平衡柱脚121与第二压力平衡柱脚122呈对角线设置，第一引线柱脚111与第二引线柱脚112呈对角线设置。
在一种实施例中，四个柱脚呈中心对称状设置在芯片底部四角，以获得更稳定的平衡状态。
如图2所示，引线柱脚11呈半球形，引线柱脚11与铝箔天线连接。压力平衡柱脚12呈圆锥形或半球形，均与短路线13接触连接，并在射频芯片1底部形 成平衡状态，起到支撑与平衡射频芯片1的作用。
优选的，短路线13为银或金制成的导电线条。
如图3所示，制作内外环天线串联在一起的射频天线时，射频芯片1与铝箔天线封装完毕后，射频芯片1上的引线柱脚连接铝箔天线。第一引线柱脚111通过铝箔天线与第一压力平衡柱脚121连接，形成内环天线2的通路，第一引线柱脚111为内环天线2的起始端，第一压力平衡柱脚121为内环天线2的终端。第一压力平衡柱脚121通过短路线13与第二压力平衡柱脚122连接。第二压力平衡柱122脚通过铝箔天线与第二引线柱脚112连接形成外环天线3的通路，第二引线柱脚112为外环天线3的起始端，第二压力平衡柱脚122为外环天线3的终端。
如此，通过短路线13将内环天线2与外环天线3串联在一起，其通路为第一引线柱脚111——内环天线2——第一压力平衡柱脚121——短路线13——第二压力平衡柱脚122——外环天线3——第二引线柱脚112。
本实用新型通过短路线13连接内环天线2与外环天线3，形成串联式的射频天线。由于短路线13的设置，内环天线2可以通过压力平衡柱脚12连接外环天线3，无需用激光刻制一段0.1毫米宽的铝箔线段连接内外环天线，可将内环天线2与外环天线3独立，分开制作，简化铝箔天线的制作工艺，从而提高产品合格率，提高生产效率，为含两圈铝箔天线的微型射频传感器的推广提供可能。
短路线13的厚度远小于射频芯片1柱脚的高度，在一种实施例中，短路线13的厚度小于2微米，引线柱脚11与压力平衡柱脚12的高度为15-18微米。因此，短路线13并不会影响射频芯片1的封装固定。
如图4所示，在进行射频芯片1与铝箔天线封装时，增加接触电阻铝箔测试 盘测试封装情况。封装过程中，电阻测量仪上的两个触点分别与接触电阻铝箔测量盘4接触连接，获得第一压力平衡柱脚121与第二压力平衡柱脚122之间的电阻值，以判断第一引线柱脚111、第二引线柱脚112及铝箔天线的封装情况，及时调节导向导电树脂的涂布量，改变封装温度、封装压力，尽可能令测量电阻值保持低阻值的范围，从而提高封装质量，提高射频标签的稳定性。
本实用新型在压力平衡柱脚12之间增加短路线13，引线柱脚11通过压力平衡柱脚12及短路线13连接，而非通过细长的内外线圈连接线连接，将内外线圈分开为两条独立的铝箔天线，简化制作工艺，极大地降低生产废品率，有利于推广内外两圈串联射频天线的微型射频传感器，同时能够在线测量射频芯片1与铝箔天线封装固定时的接触电阻，监控芯片封装过程，提高芯片封装质量。
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。

Claims (7)

  1. 一种具有压力平衡柱脚短路线的射频芯片，其特征在于，射频芯片底部设置引线柱脚与压力平衡柱脚，所述压力平衡柱脚之间设置短路线，所述短路线小于所述引线柱脚的高度。
  2. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片，其特征在于，所述短路线为银或金制成的导电线条。
  3. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片，其特征在于，所述引线柱脚与所述压力平衡柱脚呈中心对称分布。
  4. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片，其特征在于，所述引线柱脚包括第一引线柱脚与第二引线柱脚，所述第一引线柱脚经内环天线连接所述压力平衡柱脚，所述压力平衡柱脚经外环天线连接所述第二引线柱脚。
  5. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片，其特征在于，所述压力平衡柱脚包括第一压力平衡柱脚与第二压力平衡柱脚，所述第一压力平衡柱脚与所述第二压力平衡柱脚通过所述短路线连接。
  6. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片，其特征在于，所述引线柱脚与所述压力平衡柱脚的数量均为二，所述引线柱脚分别设置在所述射频芯片底部的两角处，所述压力平衡柱脚分别设置在所述射频芯片底部的另外两角处。
  7. 根据权利要求1中所述的一种具有压力平衡柱脚短路线的射频芯片，其特征在于，所述短路线的厚度小于2微米。
PCT/CN2020/115362 2020-09-15 2020-09-15 一种具有压力平衡柱脚短路线的射频芯片 WO2022056680A1 (zh)

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