WO2016000415A1 - 服务器 - Google Patents

服务器 Download PDF

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Publication number
WO2016000415A1
WO2016000415A1 PCT/CN2014/093520 CN2014093520W WO2016000415A1 WO 2016000415 A1 WO2016000415 A1 WO 2016000415A1 CN 2014093520 W CN2014093520 W CN 2014093520W WO 2016000415 A1 WO2016000415 A1 WO 2016000415A1
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WO
WIPO (PCT)
Prior art keywords
hard disk
server
node
tray
power
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PCT/CN2014/093520
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English (en)
French (fr)
Inventor
康盛
陈国峰
魏伟
朱永忠
王洁
Original Assignee
北京百度网讯科技有限公司
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Application filed by 北京百度网讯科技有限公司 filed Critical 北京百度网讯科技有限公司
Priority to US14/900,011 priority Critical patent/US20170112015A1/en
Publication of WO2016000415A1 publication Critical patent/WO2016000415A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/188—Mounting of power supply units
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/266—Arrangements to supply power to external peripherals either directly from the computer or under computer control, e.g. supply of power through the communication port, computer controlled power-strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1492—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1498—Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location

Definitions

  • the present invention relates to the field of server technologies, and in particular, to a server.
  • the current server is designed according to the height of 1U, 2U, etc.
  • the width is designed according to the width of the 19" cabinet (448mm).
  • the hard disk is connected to the hard disk backplane and placed in a single layer.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent.
  • a server includes: a shell and a single server node of at least one server, wherein the single server node is placed in the housing; and the single server node includes a first size hard disk.
  • the hot plug of the first size hard disk is connected to the hard disk backboard by using a retractable cable, or each hard disk tray is connected to the main board and the node power distribution board by a retractable cable, and the pullable hard disk tray can be realized.
  • the server of the embodiment of the present invention is placed on the pull-type hard disk tray through the hard disk, and the pull-type hard disk tray is at least two layers, which can fully utilize the space in the server and improve space utilization; in addition, the embodiment passes each layer.
  • the hard disk tray is connected to the hard disk backplane through a retractable cable, or connected to the motherboard and the node power distribution board, so that each hard disk can be hot swapped.
  • FIG. 1 is a schematic structural diagram of a server according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a position of a power supply group and a centralized power management board in an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a single server node in an embodiment of the present invention.
  • FIG. 4 is another schematic structural diagram of a single server node in an embodiment of the present invention.
  • FIG. 5 is another schematic structural diagram of a single server node in an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a total tray of a single server node in an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a power supply group and a centralized power management board according to an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a server according to an embodiment of the present invention. As shown in FIG. 1, the server includes a housing 11 and a single server node 12 of at least one server, and a single server node 12 is placed within the housing 11.
  • the single server nodes 12 are respectively placed in different areas of the server.
  • a single server node of two servers can be placed, wherein the single server nodes 12 are respectively placed on the left and right sides of the server.
  • the single server node 12 includes a first size hard disk, a pull hard disk tray, a hard disk backplane, a motherboard, and a node power distribution board;
  • the first size hard disk is placed on the pull-type hard disk tray, and the pull-type hard disk tray is at least two layers;
  • Each of the hard disk trays is connected to the hard disk backplane by a retractable cable, or each hard disk tray is connected to the main board and the node power distribution board by a retractable cable, the pullable hard disk tray
  • the hot plugging of the first size hard disk can be implemented.
  • the hard disk is placed on the pull-type hard disk tray, and the pull-type hard disk tray is at least two layers, which can fully utilize the space in the server to improve space utilization.
  • the present embodiment is scalable through each layer of the hard disk tray.
  • the cable is connected to the hard disk backplane, or connected to the motherboard and the node power distribution board to enable hot swapping of each layer of the hard disk.
  • the server of this embodiment further includes a power group 13 and a centralized power management board 14, and the power supply.
  • the group 13 and the centralized power management board 14 are placed inside the server to centrally supply power to the two server nodes.
  • this embodiment can solve the problem of interference with the power distribution unit (PDU) and the node cable at the rear of the cabinet.
  • PDU power distribution unit
  • a single server node may include a fan module 31 and a first size hard disk, and the first size hard disk may include a first group of hard disks 32, and the first group of hard disks 32 are placed. At the front of the fan module 31.
  • the first size hard disk refers to a 3.5 inch (3.5") hard disk.
  • the fan module 31 includes at least one fan, and two fans are illustrated in the figure, and each fan may be 80 mm ⁇ 38 mm in size. Redundancy can be achieved by setting at least two fans. Specifically, the settings of the two fans can achieve 1+1 redundancy and improve heat dissipation reliability.
  • the single server node may further include: a power adapter board, a CPU, a memory, and the like.
  • the first group of hard disks 32 are placed on the first group of pull-type hard disk trays.
  • the first group of pull-type hard disk trays is three layers, and each layer includes at most four.
  • a first size hard drive so 12 hard drives can be placed in a single server node.
  • Each hard disk tray can be connected to the hard disk backplane or the main board and the node power distribution board through a retractable cable, so that each layer of the hard disk can be dialed out with continuous operation and continuous power, thereby achieving hot plugging.
  • a flexible cable is connected to the hard disk backplane 34 as an example.
  • the rear of the fan module 31 is the main board space, and the single server node height is 2 U, which can realize a 2 U height CPU heat sink design to achieve high performance heat dissipation.
  • the embodiment by placing the 3.5" disk in three layers, and each layer can be placed up to four, the space utilization of the server can be improved, and the single server density and the storage density are greatly increased.
  • the embodiment can be in the rear space of the fan. Cooling for high-performance heat dissipation optimizes heat dissipation and reduces fan power consumption.
  • the first size hard disk may further include a second group of hard disks 33, and the second group of hard disks 33 are placed at the rear of the fan module 31.
  • the second set of hard disks 33 are placed on the second set of pull hard disk trays, and the second set of pull hard disk trays are at least two layers, and each layer includes at most four first size hard disks.
  • the second group of hard disks are respectively placed on two hard disk trays, and two hard disks are placed on each layer as an example. It can be understood that the second group of hard disks can also be placed horizontally like the first group of hard disks to achieve 4 layers per layer. .
  • Each hard disk tray in the second group of hard disks can be connected to the hard disk backplane through a retractable cable, or to the motherboard and the node power distribution board, so that each layer of the hard disk can be dialed out and continuously operated and continuously powered. Hot plug.
  • the lower space of the second set of hard drives or the front space of the second set of hard drives can be placed on low-power motherboards, such as low-power CPU boards or Jbod boards.
  • At least two layers can be placed on the rear of the fan by placing the 3.5" disk, and each layer can be placed at most four.
  • One step is to increase the space utilization of the server, and further increase the single server density and storage density.
  • each server node may include a second size hard disk 51, and the second size hard disk 51 is placed in an upright manner.
  • the second size hard disk 51 is a 2.5" hard disk.
  • the server node of the embodiment further includes a fan module 31.
  • the fan module 31 includes at least one fan.
  • each fan may be 80 mm ⁇ 38 mm in size.
  • the two fans can be set to achieve 1+1 redundancy, which improves heat dissipation reliability.
  • the second size hard disk 51 is located at the front of the fan module 31 and is placed vertically, and supports up to 12 hot disks.
  • the rear of the fan module 31 is the main board space, and the single server node height is 2 U, which can realize a 2 U height CPU heat sink design to achieve high performance heat dissipation.
  • the 2.5" disk by placing the 2.5" disk vertically, it can support hot plugging of up to 12 2.5" disks, which can improve the space utilization of the server and greatly increase the density and storage density of the single server.
  • heat can be dissipated in the rear space of the fan to achieve high-performance heat dissipation, which can optimize heat dissipation and reduce fan power consumption.
  • a single server node is placed in the corresponding total tray 61, and by placing different sub-pallets in the total tray 61, changes to different configurations can be achieved.
  • the first size hard disk is placed in the first sub tray
  • the second size hard disk is placed in the second sub tray.
  • the first sub tray can be placed.
  • the second sub-tray can be placed at the front space 611 of the main tray 61.
  • the single-server node is carried in the total tray, and the nodes of different configurations are carried in different sub-trays. Different configurations can be implemented by replacing the sub-tray, and the server configuration can be flexibly replaced.
  • the server may further include a power group 71 and a centralized power management board 72.
  • the power pack 71 is used to provide power
  • the power group 71 can include at least one power source.
  • a redundant design can be implemented.
  • two power sources can be configured to implement a 1+1 redundant power supply design, and the power supply is placed in the middle.
  • the centralized power management board 72 is connected to the power group 71 and the node power distribution board 73 of the single server node, and is configured to perform centralized power distribution and management on the single server node according to the power provided by the power group;
  • the centralized power management board can centrally supply power to server nodes placed on the left and right.
  • the node power distribution board 73 is connected to the centralized power management board 72 corresponding to the single server node, and is configured to perform power distribution and management on a single server node corresponding to the node power distribution board.
  • the node power distribution board on the left side supplies power to the single server node on the left side
  • the node power distribution board on the right side supplies power to the single server node on the right side
  • the power supply is centrally located, and the centralized power supply can be realized.
  • this embodiment can solve the problem of interference with the PDU and the node cable at the rear of the cabinet during the extraction.
  • the power supply redundancy design of the embodiment can improve the reliability of the power supply.

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Abstract

本发明提出一种服务器，该服务器包括：壳体和至少一台服务器的单服务器节点，所述单服务器节点放置在所述壳体内；所述单服务器节点包括第一尺寸的硬盘、抽拉式硬盘托盘、硬盘背板、主板和节点电源分配板；所述第一尺寸的硬盘放置在所述抽拉式硬盘托盘上，所述抽拉式硬盘托盘为至少两层；每层硬盘托盘采用可伸缩线缆连接到所述硬盘背板上，或者，每层硬盘托盘采用可伸缩线缆连接到所述主板和所述节点电源分配板上，所述抽拉式硬盘托盘可实现所述第一尺寸的硬盘的热插拔。该服务器能够提高服务器的空间利用率，实现每层硬盘的热插拔。

Description

服务器
相关申请的交叉引用
本申请要求百度在线网络技术(北京)有限公司于2014年07月04日提交的、发明名称为“服务器”的、中国专利申请号“201410318162.X”的优先权。
技术领域
本发明涉及服务器技术领域，尤其涉及一种服务器。
背景技术
随着计算世界的发展和数据量的增大，各类企业对服务器的需求也在日益增长。目前的服务器多按照1U、2U等高度进行设计，宽度按照19”机柜宽度尺寸(448mm)设计，为了实现热插拔硬盘，硬盘与硬盘背板相连，且单层放置。
但是，现有的服务器空间利用率低。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。
为此，本发明的一个目的在于提出一种服务器，该方法可以提高服务器的空间利用率。
为达到上述目的，本发明实施例提出的服务器，包括：壳体和至少一台服务器的单服务器节点，所述单服务器节点放置在所述壳体内；所述单服务器节点包括第一尺寸的硬盘、抽拉式硬盘托盘、硬盘背板、主板和节点电源分配板；所述第一尺寸的硬盘放置在所述抽拉式硬盘托盘上，所述抽拉式硬盘托盘为至少两层；每层硬盘托盘采用可伸缩线缆连接到所述硬盘背板上，或者，每层硬盘托盘采用可伸缩线缆连接到所述主板和所述节点电源分配板上，所述抽拉式硬盘托盘可实现所述第一尺寸的硬盘的热插拔。
本发明实施例提出的服务器，通过硬盘放置在抽拉式硬盘托盘上，抽拉式硬盘托盘为至少两层，可以充分利用服务器中的空间，提高空间利用率；另外，本实施例通过每层硬盘托盘通过可伸缩线缆与硬盘背板连接，或者与主板和节点电源分配板连接，可以实现每层硬盘的热插拔。
本发明附加的方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：
图1是本发明一实施例提出的服务器的结构示意图；
图2是本发明实施例中电源组和集中电源管理板位置的一种结构示意图；
图3是本发明实施例中单服务器节点的一种结构示意图；
图4是本发明实施例中单服务器节点的另一种结构示意图；
图5是本发明实施例中单服务器节点的另一种结构示意图；
图6是本发明实施例中单服务器节点的总托盘的结构示意图；
图7是本发明实施例中电源组和集中电源管理板的结构示意图。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。相反，本发明的实施例包括落入所附加权利要求书的精神和内涵范围内的所有变化、修改和等同物。
下面参考附图描述根据本发明实施例的服务器。
图1是本发明一实施例的服务器的结构示意图。如图1所示，该服务器包括：壳体11和至少一台服务器的单服务器节点12，单服务器节点12放置在壳体11内。
其中，单服务器节点12分别放置在所述服务器的不同区域。
具体的，参见图1，以服务器高度是2U为例，则可以放置两台服务器的单服务器节点，其中，单服务器节点12分别放置在服务器的左侧和右侧。
具体的，单服务器节点12包括第一尺寸的硬盘、抽拉式硬盘托盘、硬盘背板、主板和节点电源分配板；
所述第一尺寸的硬盘放置在所述抽拉式硬盘托盘上，所述抽拉式硬盘托盘为至少两层；
每层硬盘托盘采用可伸缩线缆连接到所述硬盘背板上，或者，每层硬盘托盘采用可伸缩线缆连接到所述主板和所述节点电源分配板上，所述抽拉式硬盘托盘可实现所述第一尺寸的硬盘的热插拔。
本实施例通过硬盘放置在抽拉式硬盘托盘上，抽拉式硬盘托盘为至少两层，可以充分利用服务器中的空间，提高空间利用率；另外，本实施例通过每层硬盘托盘通过可伸缩线缆与硬盘背板连接，或者，与主板和节点电源分配板连接，可以实现每层硬盘的热插拔。
进一步的，参见图2，本实施例的服务器还包括电源组13和集中电源管理板14，电源 组13和集中电源管理板14中置在服务器的内部，为两台服务器节点进行集中供电。相对于现有技术中电源侧边放置的方案，本实施例可以解决抽出时与机柜后部电源分配单元(Power Distribution Unit，PDU)及节点线缆干涉问题。
以单服务器节点为例，一个实施例中，参见图3，单服务器节点可以包括风扇模块31和第一尺寸的硬盘，第一尺寸的硬盘可以包括第一组硬盘32，第一组硬盘32放置在风扇模块31的前部。
具体的，第一尺寸的硬盘是指3.5英寸(3.5”)的硬盘。
可选的，参见图3，风扇模块31包括至少一个风扇，图中示意为2个风扇，每个风扇的尺寸可以是80mm×38mm。通过设置至少两个风扇可以实现冗余，具体的，两个风扇的设置可以实现1+1冗余，提高散热可靠性。
当然，可以理解的是，单服务器节点还可以包括：电源转接板、CPU、内存等。
可选的，参见图3，所述第一组硬盘32放置在第一组抽拉式硬盘托盘上，本实施例以第一组抽拉式硬盘托盘是三层为例，每层最多包括四个第一尺寸的硬盘，因此，一台服务器节点中可以放置12个硬盘。每层硬盘托盘可以通过可伸缩线缆与硬盘背板，或者主板和节点电源分配板连接，可以实现每层硬盘带线缆拨出，而持续工作，不断电，从而实现热插拨。参见图3，以可伸缩线缆与硬盘背板34连接为例。
参见图3，风扇模块31的后部是主板空间，单服务器节点高度是2U，可实现2U高度CPU散热片设计，实现高性能散热。
本实施例通过将3.5”盘放置三层，每层最多能够放置4个，可以提高服务器的空间利用率，且大大增加了单服务器密度和存储密度。另外，本实施例可以在风扇后部空间进行散热，实现高性能散热，可以优化散热，降低风扇功耗。
一个实施例中，参见图4，第一尺寸的硬盘还可以包括第二组硬盘33，第二组硬盘33放置在风扇模块31的后部。
所述第二组硬盘33放置在第二组抽拉式硬盘托盘上，第二组抽拉式硬盘托盘是至少两层，每层最多包括四个第一尺寸的硬盘。
参见图4，以第二组硬盘分别放置在两层硬盘托盘上，每层放置两个硬盘为例，可以理解的，第二组硬盘也可以类似第一组硬盘横向放置实现每层放置4个。
第二组硬盘中的每层硬盘托盘可以通过可伸缩线缆与硬盘背板，或者主板和节点电源分配板连接，可以实现每层硬盘带线缆拨出，而持续工作，不断电，从而实现热插拨。
第二组硬盘的下部空间或第二组硬盘的前部空间可以放置低功耗主板，例如，低功耗CPU板卡或Jbod板卡。
本实施例通过将3.5”盘在风扇后部再放置至少两层，每层最多能够放置4个，可以进 一步提高服务器的空间利用率，且进一步增加了单服务器密度和存储密度。
一个实施例中，参见图5，每台服务器节点可以包括第二尺寸的硬盘51，所述第二尺寸的硬盘51采用竖插方式放置。
具体的，第二尺寸的硬盘51是2.5”的硬盘。
可选的，参见图5，本实施例的服务器节点还包括风扇模块31，风扇模块31包括至少一个风扇，图5中以设置两个风扇为例，每个风扇的尺寸可以是80mm×38mm。而两个风扇通过设置可以实现1+1冗余，提高散热可靠性。
第二尺寸的硬盘51位于风扇模块31的前部，竖插放置，最多支持12个硬盘的热插播。
参见图5，风扇模块31的后部是主板空间，单服务器节点高度是2U，可实现2U高度CPU散热片设计，实现高性能散热。
本实施例通过将2.5”盘竖插放置，最多能够支持12个2.5”盘的热插拔，可以提高服务器的空间利用率，且大大增加了单服务器密度和存储密度。另外，本实施例可以在风扇后部空间进行散热，实现高性能散热，可以优化散热，降低风扇功耗。
一个实施例中，参见图6，单服务器节点放置在对应的总托盘61中，通过在总托盘61中放置不同的子托盘，可以实现不同配置的变更。例如，第一尺寸的硬盘放置在第一子托盘中，第二尺寸的硬盘放置在第二子托盘中，当需要在风扇模块31前端配置第一尺寸的硬盘时，可以将第一子托盘放置在总托盘61的前部空间611处，当需要配置第二尺寸的硬盘时，可以将第二子托盘放置在总托盘61的前部空间611处。
本实施例通过单服务器节点承载在总托盘中，不同配置的节点承载在不同的子托盘中，可以通过更换子托盘实现不同配置，实现服务器配置灵活更换。
一个实施例中，参见图7，该服务器还可以包括电源组71、集中电源管理板72。
电源组71用于提供电源；
具体的，参见图7，电源组71可以包括至少一个电源，当设置多个电源时可以实现冗余设计，例如设置两个电源可实现1+1冗余电源设计，且电源中置。
集中电源管理板72，与所述电源组71以及单服务器节点中的节点电源分配板73连接，用于根据所述电源组提供的电源对所述单服务器节点进行集中电源分配和管理；
具体的，在单服务器节点左右放置时，集中电源管理板可以为左右放置的服务器节点集中供电。
节点电源分配板73，与所述单服务器节点对应，与集中电源管理板72连接，用于对与所述节点电源分配板对应的单服务器节点进行电源分配和管理。
例如，左侧的节点电源分配板为左侧的单服务器节点供电，右侧的节点电源分配板为右侧的单服务器节点供电。
本实施例电源中置，可以实现集中供电，相对于现有技术中电源侧边放置的方案，本实施例可以解决抽出时与机柜后部PDU及节点线缆干涉问题。另外，本实施例通过电源冗余设计，可以提高电源的可靠性。
需要说明的是，在本发明的描述中，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性。此外，在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (16)

  1. 一种服务器，其特征在于，包括：
    壳体和至少一台服务器的单服务器节点，所述单服务器节点放置在所述壳体内；
    所述单服务器节点包括第一尺寸的硬盘、抽拉式硬盘托盘、硬盘背板、主板和节点电源分配板；
    所述第一尺寸的硬盘放置在所述抽拉式硬盘托盘上，所述抽拉式硬盘托盘为至少两层；
    每层硬盘托盘采用可伸缩线缆连接到所述硬盘背板上，或者，每层硬盘托盘采用可伸缩线缆连接到所述主板和所述节点电源分配板上，所述抽拉式硬盘托盘可实现所述第一尺寸的硬盘的热插拔。
  2. 根据权利要求1所述的服务器，其特征在于，
    所述单服务器节点还包括：风扇模块；
    所述单服务器节点中的所述第一尺寸的硬盘包括：第一组硬盘，所述第一组硬盘放置在所述风扇模块的前部。
  3. 根据权利要求2所述的服务器，其特征在于，所述第一组硬盘分别放置在三层硬盘托盘上，每层最多包括四个第一尺寸的硬盘。
  4. 根据权利要求2或3所述的服务器，其特征在于，
    所述单服务器节点中的所述第一尺寸的硬盘还包括：第二组硬盘，所述第二组硬盘放置在所述风扇模块的后部。
  5. 根据权利要求4所述的服务器，其特征在于，所述第二组硬盘分别放置在至少两层硬盘托盘上，每层最多包括四个第一尺寸的硬盘。
  6. 根据权利要求4或5所述的服务器，其特征在于，
    所述单服务器节点还包括：低功耗CPU板卡或Jbod板卡，所述第二组硬盘放置在所述低功耗CPU板卡或Jbod板卡的上部或者后部。
  7. 根据权利要求2至6任一项所述的服务器，其特征在于，所述风扇模块包括至少一个风扇。
  8. 根据权利要求1至7任一项所述的服务器，其特征在于，所述第一尺寸的硬盘是3.5英寸的硬盘。
  9. 根据权利要求1至8任一项所述的服务器，其特征在于，
    所述单服务器节点包括：第二尺寸的硬盘，所述第二尺寸的硬盘采用竖插方式放置。
  10. 根据权利要求9所述的服务器，其特征在于，所述第二尺寸的硬盘是2.5英寸的硬盘。
  11. 根据权利要求9或10任一项所述的服务器，其特征在于，所述单服务器节点放置在对应的总托盘中，所述第一尺寸的硬盘放置在第一子托盘中，所述第二尺寸的硬盘放置在第二子托盘中，且所述第一子托盘或所述第二子托盘放置在所述总托盘中。
  12. 根据权利要求1-11任一项所述的服务器，其特征在于，所述单服务器节点分别放置在所述服务器的不同区域。
  13. 根据权利要求12所述的服务器，其特征在于，当包括两台服务器的单服务器节点时，不同服务器的单服务器节点分别放置在所述服务器的左右两侧。
  14. 根据权利要求1至13任一项所述的服务器，其特征在于，所述服务器还包括：电源组和集中电源管理板；
    所述电源组用于提供电源；
    所述集中电源管理板与所述电源组以及所述单服务器节点中的所述节点电源分配板连接，用于根据所述电源组提供的电源对所有所述单服务器节点进行集中电源分配和管理；
    所述节点电源分配板用于对与所述节点电源分配板对应的单服务器节点进行电源分配和管理。
  15. 根据权利要求14所述的服务器，其特征在于，所述电源组包括至少一个电源。
  16. 根据权利要求14或15所述的服务器，其特征在于，所述电源组和所述集中电源管理板中置在所述服务器中，以集中供电。
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