WO2015186960A1 - Dispositif connecteur d'alimentation - Google Patents

Dispositif connecteur d'alimentation Download PDF

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Publication number
WO2015186960A1
WO2015186960A1 PCT/KR2015/005554 KR2015005554W WO2015186960A1 WO 2015186960 A1 WO2015186960 A1 WO 2015186960A1 KR 2015005554 W KR2015005554 W KR 2015005554W WO 2015186960 A1 WO2015186960 A1 WO 2015186960A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection part
power
accelerator
connector device
power connector
Prior art date
Application number
PCT/KR2015/005554
Other languages
English (en)
Inventor
Jungho Park
Original Assignee
Manycoresoft Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR2020140004206U external-priority patent/KR20140004273U/ko
Application filed by Manycoresoft Co., Ltd. filed Critical Manycoresoft Co., Ltd.
Publication of WO2015186960A1 publication Critical patent/WO2015186960A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Definitions

  • the present invention relates to a power connector device and, more particularly, to a power connector device that is applicable to a high-density server.
  • high-density server refers to a server in which the principal components of a server, such as one or more central processing units (CPUs), accelerators, main memory modules, motherboards, hard disk drives (HDDs), etc., can be mounted at a high density, and thus a large number of CPUs and accelerators can be inserted and installed into the same space.
  • CPUs central processing units
  • accelerators accelerators
  • main memory modules main memory modules
  • motherboards hard disk drives
  • HDDs hard disk drives
  • Examples of a high-density server include the HP ProLiant SL270s server, the Supermicro 1027GR-TQF server, etc.
  • HP ProLiant SL270s server an HP ProLiant s6500 chassis is installed in a 19-inch server rack at a 4U height, two SL270s servers are mounted on left and right sides, and a maximum of 16 accelerators can be mounted at the 4U height.
  • Such a high-density server enables accelerators to be mounted at a density 2 to 4 times that of a typical server, and thus has the advantage of reducing energy expenses and an installation space.
  • an accelerator is a device that can perform a massive amount of computation more rapidly than a Central Processing Unit (CPU) because the accelerator has tens, hundreds or more of cores.
  • An example of an accelerator is a Graphics Processing Unit (GPU).
  • a GPU is a device that processes graphics, and has been developed to reduce the burden of a CPU that results from the processing of graphics.
  • GPGPU General-Purpose computing on Graphics Processing Units
  • An accelerator is a printed circuit board (PCB) on which electronic parts have been mounted.
  • PCB printed circuit board
  • principal components such as a processor 120, etc., are mounted on the front 110 of an accelerator 10, and the lower end 130 of the accelerator 10 is fitted into a slot of a motherboard. Accordingly, the accelerator 10 is mounted and operated in a server.
  • a power input part 150 can be disposed on the front 110 of the accelerator 10 so that the terminal of the power input part 150 is directed toward the upper end 140 of the accelerator 10, and power to be used to drive the accelerator 10 can be supplied via the power input part 150.
  • the terminal of the power input of a component that is supplied with power should be directed toward a side of the component (for example, a side 160 of the accelerator 10) so that power can be supplied to the component inside the high-density server.
  • the terminal of the power input part 150 of the accelerator 10 is disposed to be directed toward the upper end 140 of the accelerator, and thus a problem arises in that it is impossible to connect a power cable to the power input part 150 of the accelerator 10.
  • Korean Patent Application Publication No. 10-2013-0093585 discloses systems and methods for providing a general-purpose computing system.
  • This publication discloses that a first electronic circuit board for performing a first function and a second electronic circuit board for performing a second function are included, a module-type motherboard in which the first and second boards are connected such that they can operate to provide an integrated logic board for a computer system is provided, and the motherboard includes a power connector.
  • At least one embodiment of the present invention is directed to the proposal of a power connector device that is optimized for a high-density server.
  • a power connector device mountable in a high-density server including at least one accelerator, the power connector device including a first connection part configured to be connectable to the power input part of the accelerator; a second connection part configured to be connectable to a power supply unit; and a bridge part configured to provide power from the second connection part to the first connection part.
  • a power connector device optimized for a high-density server can be proposed.
  • an accelerator in the limited internal space of a high-density server already commercialized in the market while maintaining the original shape of the high-density server and to smoothly supply power to the accelerator. Accordingly, the expenses required for the additional design of a high-density server can be minimized, and thus the expenses required for the construction of a server can be also reduced.
  • an accelerator in the limited internal space of an accelerator already commercialized in the market and to smoothly supply power to the accelerator while maintaining the original shape of the high-density server. Accordingly, inexpensive and high-performance gaming GPUs can be disposed at a high density and can be used as accelerators, and thus the expenses required for the construction of a server can be reduced.
  • Fig. 1 illustrates an accelerator on which a power connector device according to an embodiment of the present invention is mounted
  • Fig. 2 illustrates a power connector device according to an embodiment of the present invention
  • Figs. 3 and 4 illustrate a bridge part that constitutes part of the power connector device according to the embodiment of the present invention
  • Fig. 5 illustrates a state in which the power connector device according to the embodiment of the present invention is mounted on the accelerator
  • Fig. 6 illustrates a high-density server in which the power connector device according to the embodiment of the present invention has been installed.
  • a portion or component when a portion or component is described as being connected to another portion or component, this includes not only a case where they are directly connected to each other but also a case where they are electrically connected to each other with a third portion or component interposed there between. Furthermore, when a portion or component is described as including another portion or component, this means that a third portion or component is not be excluded from the first portion or component but may be included in the first portion or component, unless particularly described to the contrary.
  • Fig. 1 illustrates an accelerator 10 on which a power connector device 20 according to the embodiment of the present invention is mounted.
  • Fig. 2 illustrates the power connector device 20 according to the embodiment of the present invention.
  • Fig. 2 will be described later in conjunction with Figs. 3 to 5.
  • Figs. 3 and 4 illustrate a bridge part 230 that constitutes part of the power connector device 20 according to the embodiment of the present invention.
  • Fig. 5 illustrates a state in which the power connector device 20 according to the embodiment of the present invention is mounted on the accelerator 10.
  • the power connector device 20 includes a first connection part 210, a second connection part 220, and a bridge part 230.
  • the first connection part 210 is configured to be connectable to the power input part 150 of the accelerator 10.
  • the first connection part 210 may transfer power, supplied to the first connection part 210, to the power input part 150 of the accelerator 10.
  • the first connection part 210 may be configured in conformity with the PCI-E power connector specifications.
  • the first connection part 210 may be implemented, for example, in a form that interlocks with the power input part 150 of the accelerator 10.
  • the power input part 150 of the accelerator 10 is often implemented as a female connector that is connectable to “6 pins + 6 pins,” “8 pins + 8 pins” or “6 pins + 8 pins.”
  • the female connector may include a female housing and a male climps.
  • the first connection part 210 may be configured as a male climp, and may be implemented in a “6 pins + 6 pins,” “8 pins + 8 pins” or “6 pins + 8 pins” form. In Fig. 2, the first connection part 210 implemented in the “6 pins + 8 pins” form is illustrated.
  • the second connection part 220 is configured to a power supply unit (not illustrated) and is supplied with power from the power supply unit.
  • the power supply unit (not illustrated) may be located outside or inside the high-density server.
  • the second connection part 220 is connected to the power supply unit. That is, the second connection part 220 may be connected directly to the power supply unit, or may be electrically connected to the power supply unit via a Peripheral Component Interconnect Express (PCI-E) power cable.
  • PCI-E Peripheral Component Interconnect Express
  • the second connection part 220 may be configured in conformity with the PCI-E power connector specifications.
  • the second connection part 220 may be implemented to have, for example, a shape that can interlock with the power supply unit or the cable connected to the power supply unit.
  • the PCI-E power cable i.e., the cable connected to the power supply unit
  • the second connection part 220 may be implemented as a female connector so that it can connect with the PCI-E power cable.
  • the second connection part 220 may be implemented as an 8- or 6-pin female connector in accordance with the PCI-E standard.
  • the second connection part 220 may be implemented as, for example, two female connectors.
  • the two female connectors may be vertically disposed along the direction A of Fig. 2. That is, since the second connection part 220 is implemented by vertically disposing the two female connectors along the direction A of Fig. 2, not the direction B of Fig. 2, the power connector device can be easily mounted in a high-density server.
  • the bridge part 230 is configured to connect the first connection part 210 and the second connection part 220.
  • the bridge part 230 may transfer power from the second connection part 220 to the first connection part 210.
  • the bridge part 230 may be implemented as a printed circuit board (PCB) in order to connect the first connection part 210 and the second connection part 220.
  • the first connection part 210 and the second connection part 220 may be disposed and fastened onto the bridge part 230.
  • Fig. 3 illustrates the bridge part 230 according to the embodiment of the present invention.
  • the left side of Fig. 3 illustrates the front of the bridge part 230 directed to the direction A of Fig. 2, and the right side of Fig. 3 illustrates the back of the bridge part 230 directed to the direction opposite the direction A of Fig. 2.
  • the bridge part 230 may include one or more holes 231 into which an output socket for the supply of power and an input socket for the input of power are mounted. Furthermore, the bridge part 230 may further include a conductor 233 that connects sockets. In this case, the number and arrangement of the holes 231 or the shape of the conductor 233 on the bridge part 230 may be determined depending on the shapes of the first and second connection parts 210 and 220.
  • Fig. 4 is a design drawing illustrating an implementation of the bridge part 230 according to an embodiment of the present invention. Both upper and lower sides of Fig. 4 illustrate the back surface of the bridge part 230. As conductors are disposed on the back surface of the bridge part 230 in two layers, a conductor 402 on the upper side of Fig. 4 may be disposed on a conductor 401 on the lower side of Fig. 4.
  • the bridge part 230 may be configured, as follows:
  • the pin sense0 of the first connection part is connected to the pin sense0 of the second connection part or the GND pin of the second connection part by the conductor
  • the pin sense1 of the first connection part is connected to the pin sense1 of the second connection part or the GND pin of the second connection part by the conductor
  • the first connection part 210 can be connected to two or more power input parts, thus the pin sense0 and the pin sense1 of the first connection part 210 can be plural, respectively.
  • the sense pins sense0 and sense1 are pins used to check whether power is being supplied to the accelerator, and the power input part 150 of the accelerator may also include sense pins. Accordingly, via the sense pins conforming to the PCI-E standard, the power input part 150 of the accelerator may be connected to the ground (GND) of a power supply unit (not illustrated) through the first connection part 210, the bridge part 230 and the second connection part 220. If it is determined that the sense pin of the power input part 150 has been connected to the ground, it can be seen that power is being supplied to the accelerator.
  • GND ground
  • holes 231 may be disposed on the bridge part 230 so that the individual pins can be connected.
  • the first connection part 210 and the second connection part 220 may be disposed on the bridge part 230.
  • the first connection part 210 and the second connection part 220 may be located adjacent to each other, and the terminal of the first connection part 210 and the terminal of the second connection part 220 may be directed in different directions.
  • first connection part 210 and the second connection part 220 may be disposed such that a first direction A in which the first connection part 210 is directed toward the power input part 150 is not parallel with a second direction B in which the second connection part 220 is directed toward the power supply unit (not illustrated).
  • first connection part 210 and the second connection part 220 may be disposed such that the first direction A is skew to the second direction B, as illustrated in Fig. 2.
  • the first connection part 210 and the second connection part 220 may be disposed such that the second direction B is perpendicular to the line A”.
  • the power connector device 20 may further include an insulation part (not illustrated) configured to prevent a short circuit.
  • the insulation part may be made of an insulating material.
  • the insulation part may be disposed on the back of the bridge part 230 and functions to prevent a short circuit in the power connector device or a short circuit between the power connector device and another component.
  • a space in which the power connector device 20 is disposed i.e., the gap between the upper end 140 of the accelerator and a server chassis or the gap between the upper end 140 of the accelerator and an inner partition, is usually narrow.
  • the server chassis and the inner partition are commonly made of a conductor, such as aluminum.
  • the bridge part 230 may include an insulating part on the back thereof.
  • the power connector device 20 including the above components may be connected to the power input part 150 of the accelerator 10 or the power supply unit (not illustrated) of a high-density server.
  • the first connection part 210 of the power connector device 20 may be connected to the power input part 150 of the accelerator 10. Accordingly, power provided to the second connection part 220 of the power connector device 20 can be transferred to the first connection part 210 through the bridge part 230, and the power input part 150 can be supplied with the power from the first connection part 210.
  • Fig. 6 illustrates a high-density server 50 in which the power connector device 20 according to the embodiment of the present invention and the accelerator 10 have been installed.
  • the high-density server 50 may be the HP ProLiant SL270s server in which a maximum of eight accelerators can be mounted in a single node.
  • the high-density server 50 may include a plurality of slots 510, and the accelerator 10 may be mounted in each of the slots 510.
  • the power connector device 20 connected to the power input part of the accelerator 10 may be disposed in each slot 510.
  • the power connector device 20 may be connected to the accelerator 10 ass illustrated in the enlarged view 500 of Fig. 6.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Sources (AREA)

Abstract

La présente invention concerne un dispositif connecteur d'alimentation. Le dispositif connecteur d'alimentation peut être monté dans un serveur haute densité comprenant au moins un accélérateur. Le dispositif connecteur d'alimentation comprend une première partie connexion, une seconde partie connexion et une partie pont. La première partie connexion peut être connectée à la partie entrée d'alimentation de l'accélérateur. La seconde partie connexion peut être connectée à une unité d'alimentation électrique. La partie pont alimente la première partie connexion à partir de la seconde partie connexion.
PCT/KR2015/005554 2014-06-03 2015-06-03 Dispositif connecteur d'alimentation WO2015186960A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR2020140004206U KR20140004273U (ko) 2014-06-03 2014-06-03 전원연결장치
KR20-2014-0004206 2014-06-03
KR2020150003543U KR20150004464U (ko) 2014-06-03 2015-06-02 전원연결장치
KR20-2015-0003543 2015-06-02

Publications (1)

Publication Number Publication Date
WO2015186960A1 true WO2015186960A1 (fr) 2015-12-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/005554 WO2015186960A1 (fr) 2014-06-03 2015-06-03 Dispositif connecteur d'alimentation

Country Status (1)

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WO (1) WO2015186960A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381758B1 (en) * 2018-03-22 2019-08-13 Deep In The Mines LLC Breakout board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210920A (ja) * 1999-12-21 2001-08-03 Sagem Sa 電力モジュールおよびその製造方法
JP2002291135A (ja) * 2001-03-28 2002-10-04 Yazaki Corp 端子とフレキシブルプリント回路体の接続構造および補機モジュール
KR20030018308A (ko) * 2001-08-28 2003-03-06 엘지전자 주식회사 보드의 컨넥터 구조
US6811440B1 (en) * 2003-08-29 2004-11-02 Tyco Electronics Corporation Power connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210920A (ja) * 1999-12-21 2001-08-03 Sagem Sa 電力モジュールおよびその製造方法
JP2002291135A (ja) * 2001-03-28 2002-10-04 Yazaki Corp 端子とフレキシブルプリント回路体の接続構造および補機モジュール
KR20030018308A (ko) * 2001-08-28 2003-03-06 엘지전자 주식회사 보드의 컨넥터 구조
US6811440B1 (en) * 2003-08-29 2004-11-02 Tyco Electronics Corporation Power connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381758B1 (en) * 2018-03-22 2019-08-13 Deep In The Mines LLC Breakout board

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