WO2012095047A2 - Plaque d'interconnexion et système serveur - Google Patents

Plaque d'interconnexion et système serveur Download PDF

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Publication number
WO2012095047A2
WO2012095047A2 PCT/CN2012/071510 CN2012071510W WO2012095047A2 WO 2012095047 A2 WO2012095047 A2 WO 2012095047A2 CN 2012071510 W CN2012071510 W CN 2012071510W WO 2012095047 A2 WO2012095047 A2 WO 2012095047A2
Authority
WO
WIPO (PCT)
Prior art keywords
connector
node
server system
electrically connected
substrate
Prior art date
Application number
PCT/CN2012/071510
Other languages
English (en)
Chinese (zh)
Other versions
WO2012095047A3 (fr
Inventor
敖峰
罗飞
李爽
雕峻峰
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN2012800003812A priority Critical patent/CN102725924A/zh
Priority to PCT/CN2012/071510 priority patent/WO2012095047A2/fr
Publication of WO2012095047A2 publication Critical patent/WO2012095047A2/fr
Publication of WO2012095047A3 publication Critical patent/WO2012095047A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1492—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications

Definitions

  • the present invention relates to interconnection technologies, and more particularly to an interconnection board and a server system. Background technique
  • a server system such as a rack server
  • some nodes on the system such as various cards
  • these nodes need to be interconnected by some cables.
  • a connector is separately provided on each node, and then cables are interposed on these connectors to realize interconnection between nodes.
  • the present invention provides an interconnection board and a server system for solving the problem that the connection cable existing in the prior art is complicated and time consuming when interconnecting a large number of nodes.
  • an embodiment of the present invention provides an interconnection board, which is applied to a server system, and includes: a substrate;
  • the first connector is electrically connected to a first node of the server system
  • the second connector is electrically connected to the second node of the server system
  • the first connector and the second connector are connected by a cable to implement interconnection of the first node and the second node.
  • An embodiment of the present invention further provides a server system, including: a first node, a second node, where the first node and the second node are used to process a service; An interconnection of the first node and the second node.
  • the first node and the second node are implemented by using the first connector and the second connector disposed on the substrate of the interconnecting board by providing an interconnecting board.
  • Point interconnection since the connectors on the substrate have been connected by cables, as long as the interconnection board is directly electrically connected to the first node and the second node, it is no longer necessary to connect the cables one by one. , simplifies the operation, even if there are a large number of cables, the operation during use only needs to be connected with the first node and the second node, which shortens the connection time.
  • FIG. 1 is a schematic structural diagram of an interconnection board according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of an interconnection board according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of an interconnection board according to another embodiment of the present invention.
  • Figure 4 is a cross-sectional view of the first connector 20 or the second connector 30 of the present invention.
  • FIG. 5 is a schematic structural diagram of an interconnection board according to another embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a server system according to an embodiment of the present invention.
  • the technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention.
  • the embodiments are a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
  • the interconnection board of this embodiment may be applied to a server system, and may specifically include a substrate 10; a connector 20 and a second connector 30; the first connector 20 is electrically connected to a first node of the server system; the second connector 30 is electrically connected to a second node of the server system; The first connector 20 and the second connector 30 are connected by a cable 40 to implement interconnection of the first node and the second node.
  • the cable 40 connecting the first connector 20 and the second connector 30 may be a cable that supports high-speed signal transmission, for example, can support 14.5 Gigabits per second (Gbps) or 25 Gbps, etc. High-speed signal cable or fiber optic cable.
  • the cables 40 are respectively connected to the rear ends of the first connector 20 and the second connector 30, and are connected to the pin pins of the connectors according to the logical relationship of interconnection.
  • the first connector 20 may be electrically connected to a connector in the first node
  • the second connector 30 may be connected to a connector in the second node. Electrical connections.
  • the server system may further include a backplane.
  • a third connector is disposed in the backboard.
  • the first connector 20 may further be electrically connected to the first node through the third connector, and the second connector 30 may further pass through the third connector and the second node.
  • the connector is electrically connected.
  • a fourth connector and a fifth connector are disposed in the backboard.
  • the first connector 20 may further be electrically connected to the first node through the fourth connector, and the second connector 30 may further pass through the fifth connector and the second node.
  • the connector is electrically connected, and the fourth connector and the fifth connector are connected by a PCB trace on the backplane.
  • the first connector 20 is electrically connected to the first node of the server system through the first connector 20 and the second connector 30 disposed on the substrate 10, and the second connector 30 is The second node of the server system is electrically connected, and the first connector 20 and the second connector 30 are connected by a cable 40, so that the first node and the second node are interconnected.
  • the ability to address the size of the backplane and PCB in the prior art limits the number and form of interconnections of nodes in the server system, thereby increasing the transmission rate and flexibility of the nodes.
  • the interconnecting board provided in this embodiment may further include a cable management frame 50 fixedly disposed on the substrate 10 to accommodate the cable 40, so that the plurality of cables 40 may be
  • the multi-layer arrangement and fixing by the cable management frame 50 makes the internal cables clean and clear, and is easy to maintain.
  • the interconnecting board provided in this embodiment may further include the guiding device 60 of the first connector 20 and the second connector 30 fixedly disposed on the substrate 10.
  • the guiding device 70 is configured to increase the connection between the first node and the first connector 20 Alignment accuracy, and alignment accuracy of the connection of the second node to the second connector 30.
  • the first connector 20 and the second connector 30 are fixedly disposed on the substrate 10.
  • the first connector 20 and the second connector 30 are slidably disposed on the substrate 10, and the first node and the first connection can be reduced.
  • the alignment difficulty of the connection of the device 20, and the alignment difficulty of the connection of the second node with the second connector 30, and further compensate for the deviation (for example: ⁇ 0.5 mm) caused by the manufacturing process The alignment accuracy of multiple connectors at the same time is ensured.
  • the cross-sectional view of the first connector 20 or the second connector 30 may be as shown in FIG. 4, and D is a slidable distance.
  • the interconnecting board provided in this embodiment may further include a housing 80 disposed outside the base plate 10; and a wrench 90 fixedly disposed on the housing.
  • the housing 80 may employ a housing (e.g., a metal housing) having an electromagnetic shielding function, and the cable 40 may have no shielding sheath, which enables the wiring to be more flexible.
  • the interconnecting board provided by this embodiment may be in the form of a plug-in board, and a plurality of cables are integrated into one plug-in board to realize external connection of the above several cables (the first node and the second node in the server system)
  • the interconnect function of the node may be in the form of a plug-in board, and a plurality of cables are integrated into one plug-in board to realize external connection of the above several cables (the first node and the second node in the server system)
  • the interconnect function of the node may be in the form of a plug-in board, and a plurality of cables are integrated into one plug-in board to realize external connection of the above several cables (the first node and the second node in the server system)
  • the interconnect function of the node may be in the form of a plug-in board, and a plurality of cables are integrated into one plug-in board to realize external connection of the above several cables (the first node and the second node in the server system)
  • the server system further includes a backplane, and the interconnecting board can be connected to the server system through the backplane.
  • the server system may further include more nodes, and the interconnecting board may also include more connectors, and the interconnected connectors are connected by cables, thereby implementing connection between more nodes. .
  • the interconnection boards of this embodiment can interconnect these nodes more quickly, thereby simplifying operations, improving operational efficiency, and saving a large amount of connection time.
  • the foregoing embodiment implements the first node by using a first connector and a second connector disposed on a substrate of the interconnect board by providing an interconnecting board and a server system including the interconnecting board.
  • the interconnection of the second node because the connector on the substrate has been passed through the cable Connection, therefore, as long as the interconnection board is directly connected to the first node and the second node, it is no longer necessary to connect the cables one by one, which simplifies the operation even if there are a large number of cables in use.
  • the operation only needs to be connected to the first node and the second node (for example, through the connector on the first and second nodes, or the connector on the backboard, etc.), which shortens the connection time.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

La présente invention concerne une plaque d'interconnexion et un système serveur. Selon l'invention, un premier connecteur et un deuxième connecteur sont disposés sur un substrat, le premier connecteur est relié électriquement à un premier noeud du système serveur, le deuxième connecteur est relié électriquement à un deuxième noeud du système serveur, et le premier et le deuxième connecteur sont reliés par un câble, de sorte que le premier noeud et le deuxième noeud sont interconnectés, ce qui simplifie les opérations d'interconnexion entre les noeuds et permet d'économiser le temps d'interconnexion des noeuds.
PCT/CN2012/071510 2012-02-23 2012-02-23 Plaque d'interconnexion et système serveur WO2012095047A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2012800003812A CN102725924A (zh) 2012-02-23 2012-02-23 互连板及服务器***
PCT/CN2012/071510 WO2012095047A2 (fr) 2012-02-23 2012-02-23 Plaque d'interconnexion et système serveur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/071510 WO2012095047A2 (fr) 2012-02-23 2012-02-23 Plaque d'interconnexion et système serveur

Publications (2)

Publication Number Publication Date
WO2012095047A2 true WO2012095047A2 (fr) 2012-07-19
WO2012095047A3 WO2012095047A3 (fr) 2013-01-24

Family

ID=46507494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/071510 WO2012095047A2 (fr) 2012-02-23 2012-02-23 Plaque d'interconnexion et système serveur

Country Status (2)

Country Link
CN (1) CN102725924A (fr)
WO (1) WO2012095047A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103718658A (zh) * 2013-03-18 2014-04-09 华为技术有限公司 背板、插框和网络设备
US9406462B2 (en) * 2013-06-28 2016-08-02 The Boeing Company Truss interconnect
CN103744479B (zh) * 2013-12-30 2017-10-24 杭州华为数字技术有限公司 一种八处理器***以及服务器
CN104064893B (zh) 2014-06-06 2016-06-29 华为技术有限公司 一种背板及通讯设备
CN109757052B (zh) * 2017-11-06 2021-11-02 中兴通讯股份有限公司 一种通信设备数据信号传输装置及通信设备
CN113067219B (zh) * 2021-03-26 2023-03-24 山东英信计算机技术有限公司 一种多路服务器节点跨板信号互联装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
CN2616939Y (zh) * 2003-04-29 2004-05-19 华硕电脑股份有限公司 桥接电路板
CN101031896A (zh) * 2004-06-28 2007-09-05 伊姆西公司 低成本灵活网络访问存储体系结构
CN101490991A (zh) * 2006-08-29 2009-07-22 思科技术公司 用于网状网络节点互连的无源光纤配线盒

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592401B1 (en) * 2002-02-22 2003-07-15 Molex Incorporated Combination connector
CN2582278Y (zh) * 2002-10-22 2003-10-22 南京普天楼宇智能有限公司 系列家庭多媒体配线箱
CN102365907B (zh) * 2009-01-30 2015-12-02 莫列斯公司 高速互连电缆组件
JP5574867B2 (ja) * 2010-07-28 2014-08-20 キヤノン株式会社 電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2616939Y (zh) * 2003-04-29 2004-05-19 华硕电脑股份有限公司 桥接电路板
CN101031896A (zh) * 2004-06-28 2007-09-05 伊姆西公司 低成本灵活网络访问存储体系结构
CN101490991A (zh) * 2006-08-29 2009-07-22 思科技术公司 用于网状网络节点互连的无源光纤配线盒

Also Published As

Publication number Publication date
CN102725924A (zh) 2012-10-10
WO2012095047A3 (fr) 2013-01-24

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