WO2015102046A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- WO2015102046A1 WO2015102046A1 PCT/JP2014/050012 JP2014050012W WO2015102046A1 WO 2015102046 A1 WO2015102046 A1 WO 2015102046A1 JP 2014050012 W JP2014050012 W JP 2014050012W WO 2015102046 A1 WO2015102046 A1 WO 2015102046A1
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- Prior art keywords
- semiconductor device
- grease
- cooler
- region
- semiconductor module
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a semiconductor device having a structure in which a grease member is interposed between a cooler and a semiconductor module.
- An object of the present invention is to solve the above-described problems and to provide a semiconductor device having a structure for preventing and suppressing pumping out of a grease member provided in a filling region between a semiconductor module and a cooler. .
- a semiconductor device includes a semiconductor module having a heat dissipation surface at the bottom, a cooler provided with a surface facing the heat dissipation surface, the heat dissipation surface of the semiconductor module, and the cooler.
- a grease member provided in a filling region between the surface and the surface, and a peripheral contact member formed on the surface of the cooler so as to cover a side region of the grease member without a gap.
- a semiconductor device includes a semiconductor module having a heat dissipation surface at the bottom, a cooler provided with a surface facing the heat dissipation surface, the heat dissipation surface of the semiconductor module, and the cooler.
- a first grease member and a second grease member provided in a filling region between the first grease member and the surface, the first grease member corresponding to a central region of the heat radiating surface, and the second grease member.
- the first grease member is a semi-solid first type grease provided corresponding to a peripheral region other than the central region of the heat radiating surface
- the second grease member is the first type grease.
- the solidified type 2 grease having higher hardness is used as a constituent material.
- the semiconductor device according to the first aspect of the present invention is characterized by having a peripheral contact member formed on the surface of the cooler by covering the side surface region of the grease member without any gap.
- the semiconductor device has the above-described characteristics, so that the grease constituting the grease member is a phenomenon in which the grease is pushed out from the filling region between the heat radiation surface of the semiconductor module and the surface of the cooler. Can be reliably suppressed, the thermal resistance of the entire apparatus can be kept low, the quality of the apparatus can be maintained, and the life can be extended.
- the first grease member (the constituent material is a semi-solid first type grease) provided corresponding to the central region of the heat radiating surface is used to improve the heat radiation performance.
- the movement of the first type grease in the first grease member can be suppressed by the second grease member provided corresponding to the region (the constituent material is a solidified second type grease).
- the semiconductor device reliably suppresses pump-out, which is a phenomenon in which the first type grease is pushed out from the filling region between the heat radiation surface of the semiconductor module and the surface of the cooler.
- the thermal resistance of the entire apparatus can be kept low, and the quality improvement can be maintained.
- FIG. 9 is a plan view illustrating a planar structure of the semiconductor device illustrated in FIG. 8. It is sectional drawing which shows the structure of the semiconductor device which is Embodiment 7 of this invention. It is sectional drawing which shows the structure of the semiconductor device which is Embodiment 8 of this invention. It is sectional drawing which shows the structure of the semiconductor device which is Embodiment 9 of this invention. It is sectional drawing which shows the structure of the semiconductor device which is Embodiment 10 of this invention. It is sectional drawing which shows the structure of the semiconductor device which is Embodiment 11 of this invention. It is sectional drawing which shows the structure of the semiconductor device which is Embodiment 12 of this invention.
- FIG. 22 is an explanatory diagram schematically showing pump-out of the semiconductor device shown in FIG. 21.
- FIG. 21 is a cross-sectional view showing the structure of a semiconductor device, which is a prerequisite technology of the present invention, having a structure in which a grease member is interposed between a cooler and a semiconductor module.
- the semiconductor device 91 as a prerequisite technology has a structure in which a grease layer 69 (grease member) made of grease is provided in a filling region between the semiconductor module 30 and the cooler 40.
- a grease layer 69 grey member
- the cooler 40 is made of a metal such as aluminum (AL) or stainless steel (SUS: Steel Special Use Stainless).
- the semiconductor module 30 has a resin sealing portion 31 in which at least one semiconductor chip (not shown) is sealed with a resin, and a heat dissipation material 32 is formed on a large area of the bottom surface of the resin sealing portion 31.
- the heat dissipating material 32 is made of a metal such as aluminum, copper (Cu), copper / molybdenum alloy (Cu / Mo), ALSiC, molybdenum, etc., and 10 to 10 by processing such as etching, shot blasting, pressing, and laser processing. It is formed with a film thickness of about 50 ⁇ m.
- the resin sealing part 31 is formed over the upper surface and side surface of the heat dissipation material 32.
- a plurality of terminal portions 33 that are electrically connected to the semiconductor chip from the side surface of the resin sealing portion 31 and protrude outside in an L shape are formed.
- the semiconductor device 91 is configured by providing the grease layer 69 in the filling region between the heat radiation surface which is the bottom surface of the heat radiation material 32 of the semiconductor module 30 having such a structure and the surface of the cooler 40.
- greye described in the present specification means “a lubricant obtained by dispersing a thickener in a raw material base oil to make it semi-solid”.
- FIG. 22 is an explanatory view schematically showing pump-out of the semiconductor device 91 shown in FIG.
- the semiconductor module 30 and the grease module 69e shown in FIG. There has been a problem in that a grease pump-out occurs in which a part is pushed out from the filling region with the cooler 40.
- a semiconductor device having a structure in which a grease layer (grease member) is provided in a filling region between a cooler and a semiconductor module is described in the following first to seventeenth embodiments. It is a semiconductor device.
- FIG. 1 is a cross-sectional view showing a structure of a semiconductor device according to Embodiment 1 of the present invention, which has a structure in which a grease layer is provided in a filling region between a cooler and a semiconductor module.
- the semiconductor device 1 has a structure in which a grease layer 61 (grease member) is provided in a filling region between the semiconductor module 30 and the cooler 40.
- the semiconductor module 30 includes a resin sealing portion 31 in which at least one semiconductor chip (not shown) is resin-sealed, and a heat dissipation material 32 formed on a large area of the bottom surface of the resin sealing portion 31. ing.
- the resin sealing part 31 is formed over the upper surface and side surface of the heat dissipation material 32.
- the semiconductor module 30 includes a plurality of terminals that are electrically connected to the semiconductor chip from the side surface of the resin sealing portion 31 and project outward in an L shape, each of which is made of metal or the like and has conductivity.
- a portion 33 is provided.
- a grease layer 61 made of grease is provided in a filling region between the heat radiation surface, which is the bottom surface of the heat radiation material 32 of the semiconductor module 30 having such a structure, and the surface of the cooler 40.
- the semiconductor module 30, the grease layer 61, and the cooler 40 are fixed with high stability by applying a vertical force that sandwiches the grease layer 61 by fastening bolts (not shown).
- the semiconductor device 1 covers the heat radiation surface of the heat radiation material 32 and the periphery of the grease layer 61 without gaps in a plan view, that is, covers all the side regions of the grease layer 61 without gaps.
- a sealing material 51 which is a peripheral contact member formed on the surface of the vessel 40 is provided.
- the sealing material 51 uses a liquid curable sealing agent as a constituent material.
- liquid curable sealing agent described in the present specification means a sealing agent that satisfies the following conditions (1) and (2).
- the initial state is liquid, and it hardens by heat, moisture or chemical reaction. (2) After curing, it has adhesion and higher hardness than “grease”.
- the semiconductor device 1 is provided with the grease layer 61 composed of the heat-dissipating grease in the filling region between the heat-dissipating surface of the semiconductor module 30 and the surface of the cooler 40.
- the structure is characterized in that the outer periphery of the region is sealed with a sealing material 51 composed of a liquid curable sealing agent.
- the semiconductor module 30 and the cooler 40 are cooled by the thermal deformation of the semiconductor module 30 and the cooler 40. Even if thermal deformation occurs in the filling region, which is a joint portion with the container 40, and in the vicinity thereof, a structure in which the grease layer 61 does not pump out to the outside can be realized.
- the liquid curable sealing agent used as the sealing material 51 has adhesiveness, and is cured in a state where it is adhered to the semiconductor module 30 and the cooler 40, whereby the grease layer 61 between the semiconductor module 30 and the cooler 40 is contained in the grease layer 61. Since the pump-out can be suppressed without entering a part of the sealing agent constituting the sealing material 51, the heat dissipation of the semiconductor device 1 can be maintained high.
- the sealing material 51 is made of a liquid curable sealant
- the side surface region of the grease layer 61 is not restricted by the shape and size of the heat radiation surface of the semiconductor module 30 and the film thickness of the grease layer 61. All can be covered with no gap and sealed with high accuracy.
- a vertical force to be sandwiched between the semiconductor module 30 and the cooler 40 by fastening bolts or the like is applied to the grease layer 61 so that the grease layer 61 has a diameter approximately equal to the filler diameter of the grease that is a constituent material of the grease layer 61.
- the sealing material 51 having a thickness that matches the film thickness of the grease layer 61 can be formed with high accuracy.
- the semiconductor device 1 covers the entire side surface region, which is the outer peripheral portion of the grease layer 61, without any gap, and the sealing material 51 (peripheral adhesion member) formed on the surface of the cooler 40. It is characterized by having.
- the semiconductor device 1 according to the first embodiment has the above-described characteristics, so that the grease that is the constituent material of the grease layer 61 is pushed out from the filling region between the heat radiation surface of the semiconductor module 30 and the surface of the cooler 40.
- the pump-out which is a phenomenon that occurs, can be reliably suppressed, the thermal resistance of the entire semiconductor device 1 can be kept low, the quality of the semiconductor device 1 can be maintained, and the life can be extended.
- FIG. 2 is a sectional view showing a structure of a semiconductor device 2 according to the second embodiment of the present invention.
- the semiconductor device 2 of the second embodiment is characterized in that a gel portion 52 is provided instead of the sealing material 51 of the first embodiment used as a peripheral contact member. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the gel part 52 is made of a hard gel having a penetration of 55 or less (based on the JIS K2220 test method) as a constituent material.
- the gel portion 52 that is a peripheral contact member in the semiconductor device 2 of the second embodiment uses a gel-like substance having a penetration of 55 or less as a constituent material, thereby pumping out grease in the grease layer 61.
- FIG. 3 is a sectional view showing the structure of a semiconductor device 3A according to the first mode of the third embodiment of the present invention.
- the semiconductor device 3A of the third embodiment is characterized in that a cooler 40B is provided in place of the cooler 40 of the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the cooler 40B according to the first aspect of the third embodiment is characterized by having an uneven area 81 (an uneven area for the cooler) on the surface. That is, the uneven region 81 is formed by providing a plurality of fine band-like grooves on the surface of the cooler 40B. Each recess of the uneven region 81 formed in the cooler 40B is formed with a unit recess width W3A.
- the semiconductor device 3A according to the first aspect of the third embodiment has the movement of the grease in the grease layer 61 by the rough surface of the uneven region 81 having the unit recess width W3A formed on the surface of the cooler 40B.
- FIG. 4 is a cross sectional view showing the structure of a semiconductor device 3B according to the second mode of the third embodiment of the present invention.
- the semiconductor device 3B according to the third embodiment is provided with a cooler 40C in place of the cooler 40 according to the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the cooler 40C has an uneven area 83 (an uneven area for the cooler) on its surface. That is, the uneven region 83 is formed by providing a plurality of slit-shaped (strip-shaped) grooves on the surface of the cooler 40C. Each recess of the uneven area 83 formed in the cooler 40C is formed with a unit recess width W3B.
- the concave / convex region 83 formed in the cooler 40C of the second mode has a wider unit concave portion width W3B (> W3A) than the unit concave portion width W3A of the concave / convex region 81 formed in the cooler 40B of the third embodiment. ).
- the reason why the unit recess width W3B of the uneven region 83 is formed wider than the unit recess width W3A of the uneven region 81 is that the second mode is mainly intended to suppress the warpage of the cooler 40C. is there.
- the unit recess width W3A is set to a relatively narrow width suitable for suppressing the movement of grease in the grease layer 61, and in the second mode, the unit recess width W3B is suppressed from warping of the cooler 40C. It is set to a relatively wide width suitable for.
- the semiconductor device 3B according to the second aspect of the third embodiment is cooled by heat by the slit-like groove processed surface of the uneven region 83 having the unit recess width W3B formed on the surface of the cooler 40C. Since the deformation of the surface of the container 40C can be suppressed, the grease in the grease layer 61 is not pushed out to the outside. Furthermore, by combining with the sealing effect by the sealing material 51 composed of a liquid curable sealing agent, it is possible to realize a structure in which no pump-out occurs.
- FIG. 5 is a sectional view showing a structure of a semiconductor device 4A according to the first mode of the fourth embodiment of the present invention.
- the semiconductor device 4A of the fourth embodiment is provided with a semiconductor module 30B in place of the semiconductor module 30 of the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the semiconductor module 30 ⁇ / b> B is provided with a heat dissipation material 34 instead of the heat dissipation material 32 on the bottom surface of the resin sealing portion 31. It is characterized by having. That is, the uneven region 82 is formed by providing a plurality of fine band-like grooves on the heat dissipation surface of the heat dissipation material 34. Each recess of the uneven area 82 formed on the heat dissipation surface of the heat dissipation material 34 is formed with a unit recess width W4A.
- the semiconductor device 4A according to the first aspect of the fourth embodiment is filled with the grease layer 61 by the rough surface of the concavo-convex region 82 having the unit recess width W4A formed on the heat radiating surface of the heat radiating material 34.
- the sealing material 51 composed of the liquid curable sealing agent, and a structure in which pump-out does not occur can be realized.
- FIG. 6 is a sectional view showing a structure of a semiconductor device 4B according to the second mode of the fourth embodiment of the present invention.
- the semiconductor device 4B according to the fourth embodiment is provided with a semiconductor module 30C in place of the semiconductor module 30 according to the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the semiconductor module 30 ⁇ / b> C is provided with a heat radiating material 38 on the bottom surface of the resin sealing portion 31 instead of the heat radiating material 32. It is characterized by having. That is, the uneven region 84 is formed by providing a plurality of slit-shaped (strip-shaped) grooves on the heat radiation surface of the heat radiation material 38. Each recess of the uneven area 84 formed on the heat dissipation surface of the heat dissipation material 38 is formed with a unit recess width W4B.
- region 84 formed in the thermal radiation surface of the heat radiating material 38 of a 2nd aspect is a unit wider than the unit recessed part width W4A of the uneven
- the unit recess width W4B of the uneven region 84 is formed wider than the unit recess width W4A of the uneven region 82 is that the second mode is mainly intended to suppress the warp of the heat radiation material 38. is there.
- the unit recess width W4A is set to a relatively narrow width suitable for suppressing the movement of grease in the grease layer 61, and in the second mode, the unit recess width W4B is suppressed from warping of the heat radiating material 38. It is set to a relatively wide width suitable for.
- the semiconductor device 4B according to the second mode of the fourth embodiment has the heat generated by the slit-like groove processed surface of the concavo-convex region 84 having the unit recess width W4B formed on the heat dissipation surface of the heat dissipation material 38.
- the deformation of the heat radiating surface of the semiconductor module 30C due to can be suppressed, so that the grease in the grease layer 61 is not pushed out.
- the sealing material 51 composed of a liquid curable sealing agent, it is possible to realize a structure in which no pump-out occurs.
- FIG. 7 is a sectional view showing the structure of a semiconductor device 5 according to the fifth embodiment of the present invention.
- a semiconductor module 30D is provided instead of the semiconductor module 30 of the first embodiment, and a cooler 40D is provided instead of the cooler 40.
- 61 filling region 61 is formed along the outer periphery, and has a protruding portion 35a protruding downward.
- the cooler 40D is characterized in that a fixing groove 42 is provided in a region corresponding to the protrusion 35a on the surface.
- the semiconductor module 30D and the cooler 40D are formed by inserting a part of the protrusion 35a into the fixing groove 42 when the semiconductor module 30D and the cooler 40D are assembled. It has a positional correspondence that allows temporary fixing between the coolers 40D. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the semiconductor module 30D, the tip portion which is a part of the protruding portion 35a of the semiconductor module 30D is inserted into the fixing groove 42 provided on the surface of the cooler 40D.
- the resin sealing portion with protrusions 35 is formed along the outer periphery of the heat radiating surface of the heat radiating material 32 so as to surround the grease layer 61 in plan view, and the protrusion 35a of the resin sealing portion with protrusions 35 is provided.
- the grease layer 61 can be sealed together with the sealing material 51, a structure with a more enhanced pump-out suppressing function can be realized.
- FIG. 8 is a sectional view showing the structure of a semiconductor device 6 according to the sixth embodiment of the present invention.
- FIG. 9 is a plan view showing a planar structure of the semiconductor device 6 shown in FIG. As shown in these drawings, the semiconductor device 6 of the sixth embodiment is provided with a cooler 40E instead of the cooler 40 of the first embodiment.
- the cooler 40 ⁇ / b> E has a belt-like shape extending on its surface from the semiconductor module 30, i.e., from the central region below the grease layer 61 to the outside of the semiconductor module 30 and the sealing material 51.
- a grease groove 43 is formed.
- the sealing material 51 covers the resin sealing portion 31 of the semiconductor module 30, that is, the grease layer 61 under the semiconductor module 30 without a gap in plan view.
- This feature is not unique to the sixth embodiment, but is common to the first to fifth embodiments described above and the seventh to fifteenth embodiments described later (however, the implementation In the second embodiment and the eighth embodiment, the sealing material 51 is replaced with the gel portion 52). Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the cooler 40E in the semiconductor device 6 has the grease groove 43 formed on the surface extending from the central region below the grease layer 61 to the outside of the semiconductor module 30 and the sealing material 51. Have. For this reason, when the grease layer 61 is formed at the time of manufacture, excess grease can be discharged out of the filling region through the grease groove 43 serving as an escape path, so that the thickness of the grease layer 61 is set to a desired thickness. It has the effect of reducing the thermal resistance by making it thinner.
- the pump-out suppression effect of the grease in the grease layer 61 can be exhibited as in the other embodiments.
- FIG. 10 is a sectional view showing the structure of a semiconductor device 7 according to the seventh embodiment of the present invention. As shown in the figure, the semiconductor device 7 of the seventh embodiment is provided with a cooler 40F in place of the cooler 40 of the first embodiment.
- the cooler 40F is characterized in that a bump 48 protruding upward is provided on the surface of the cooler 40F corresponding to the central portion of the semiconductor module 30, that is, the heat radiating member 32 in a plan view.
- the bump 48 is bonded to the surface of the cooler 40F during or after the formation of the cooler 40F, and is provided integrally with the cooler 40F.
- the thickness of the bump 48 provided on the surface of the cooler 40F regulates the interval between the heat radiation surface of the heat radiation material 32 and the surface of the cooler 40F, that is, the lower limit of the thickness of the grease layer 61.
- the planar shape of the bump 48 may be rectangular, circular, or the like. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the gap (gap) between the heat radiation surface of the semiconductor module 30 and the surface of the cooler 40F is set according to the thickness of the bumps 48 provided on the surface of the cooler 40F. More than a certain length can be secured.
- the semiconductor device 7 according to the seventh embodiment suppresses a part of the grease in the grease layer 61 from being pushed out from the filling region due to deformation of the cooler 40F or the semiconductor module 30 and the like, and is a liquid curable sealing agent. By combining with the sealing effect by the configured sealing material 51, it is possible to realize a structure that does not cause pump-out.
- the semiconductor device 7 according to the seventh embodiment can improve heat dissipation by using a material having high thermal conductivity as the bump 48.
- FIG. 11 is a sectional view showing a structure of a semiconductor device 8 according to the eighth embodiment of the present invention.
- the semiconductor device 8 of the eighth embodiment is provided with a gel part 52 in the same manner as in the second embodiment in place of the sealing material 51 of the first embodiment used as a peripheral contact member.
- a cooler 40G is provided instead of the first cooler 40.
- the cooler 40G has four bumps 49 (only two are shown in FIG. 11) projecting upward corresponding to the four corners of the semiconductor module 30, that is, the heat radiating material 32, in plan view. ).
- the four bumps 49 are joined to the surface of the cooler 40G during or after the formation of the cooler 40G, and are provided integrally with the cooler 40G.
- the thickness of the four bumps 49 regulates the interval between the heat radiation surface of the heat radiation material 32 and the surface of the cooler 40G, that is, the lower limit of the thickness of the grease layer 61.
- rectangular shape, circular shape, etc. can be considered as a planar shape of each of the four bumps 49. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the gap (gap) between the heat radiation surface of the semiconductor module 30 and the surface of the cooler 40G is ensured to be a certain length or more depending on the thickness of the four bumps 49. it can.
- the semiconductor device 8 of the eighth embodiment suppresses a part of the grease in the grease layer 61 from being pushed out from the filling region due to deformation of the semiconductor module 30 or the cooler 40G, and the sealing effect by the gel portion 52 is achieved. By combining with, it is possible to realize a structure that does not cause pump-out.
- the semiconductor device 8 of the eighth embodiment can further improve the heat dissipation by using a material with high thermal conductivity as the four bumps 49.
- the grease layer 61 and the semiconductor module 30 can be covered in a relatively wide area by providing the gel part 52 that is cheaper and easier to manufacture than the sealing material 51 as the peripheral contact member.
- the gel portion 52 is used as the peripheral contact member.
- the sealing material 51 may be used.
- FIG. 12 is a sectional view showing the structure of a semiconductor device 9 according to the ninth embodiment of the present invention.
- the semiconductor device 9 of the ninth embodiment instead of the grease layer 61, grease layers 62 and 63 (first and second grease members) made of two different types of grease are used. It is characterized by providing. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the grease layer 62 is composed of a first filler grease having a filler size FS1 (first filler size), and the grease layer 63 has a filler size FS2 (second filler size; FS2> FS1).
- the second grease is used as a constituent material.
- the filler sizes FS1 and FS2 include a filler size FS1 having a filler diameter smaller than 70 ⁇ m and a filler size FS2 having a filler diameter larger than 70 ⁇ m.
- the grease layer 62 is provided corresponding to the central region of the heat dissipation surface of the heat dissipation material 32, and the grease layer 63 is provided corresponding to the peripheral region other than the central region of the heat dissipation surface.
- the semiconductor device 9 according to the ninth embodiment has a small filler as a constituent material of the grease layer 62 provided corresponding to the central region of the heat radiation surface, which is relatively easy to cope with external movement (deformation, etc.).
- a gap due to deformation of the semiconductor module 30 or the cooler 40 due to its own heat generation can be reduced.
- the second grease having a large filler that is relatively difficult to cope with external movement is used. Used. For this reason, not only the second grease in the grease layer 63 but also the first grease in the grease layer 62 due to deformation of the semiconductor module 30 and the cooler 40 can be suppressed, and the liquid hardening sealant is used. By combining with the sealing effect by the sealing material 51, a structure in which pump-out is less likely to occur can be realized.
- FIG. 13 is a sectional view showing the structure of a semiconductor device 10 according to the tenth embodiment of the present invention.
- the semiconductor device 10 of the tenth embodiment is provided with a cooler 40H in place of the cooler 40 of the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the cooler 40 ⁇ / b> H has a seal material groove 45 formed in a region along the outer periphery of the grease layer 61, that is, a region corresponding to the formation region of the seal material 51. It is characterized in that a part of the sealing material 51 is embedded in the groove 45 for use. That is, in the semiconductor device 10 of the tenth embodiment, the sealing material groove 45 is formed along the outer periphery of the heat dissipation surface of the semiconductor module 30 in plan view on the surface of the cooler 40H.
- a part of the sealing material 51 that is the peripheral contact member is embedded and formed in the seal material groove 45 that is the peripheral contact member groove portion.
- the adhesion area between the material 51 and the cooler 40H increases, and the sealing effect by the sealing material 51 can be further enhanced.
- FIG. 14 is a sectional view showing the structure of a semiconductor device 11 according to the eleventh embodiment of the present invention.
- a resist 25 made of resin or the like is further formed on the surface of the cooler 40.
- the resist 25 is formed on the surface of the cooler 40 while providing a gap d25 for the sealing material 51 between the end of the grease layer 61 along the outer periphery of the grease layer 61 in plan view.
- the resist 25 is selectively provided on the surface of the cooler 40, and the seal material 51 is formed in the groove formed in the gap d25 between the grease layer 61 and the resist 25. Part is embedded and formed.
- the sealing material 51 and the cooler 40 are provided with the resist 25 and the resist 25 provided on the cooler 40 with a strong adhesion force. Therefore, when the semiconductor device 11 according to the eleventh embodiment is provided with the resist 25 and the resist 25 provided on the cooler 40 with a strong adhesion force is considered as a part of the cooler 40, the sealing material 51 and the cooler 40.
- the adhesion area with (+ resist 25) increases, and the sealing effect by the sealing material 51 can be enhanced.
- FIG. 15 is a sectional view showing the structure of a semiconductor device 12 according to the twelfth embodiment of the present invention.
- the semiconductor device 12 of the twelfth embodiment is provided with a cooler 40I in place of the cooler 40 of the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the cooler 40I further has a protrusion 46 on the surface thereof.
- the protruding portion 46 is formed to protrude upward on the surface of the cooler 40 while providing a gap d46 for the sealant 51 between the end of the grease layer 61 along the outer periphery of the grease layer 61. .
- the protrusion 46 is provided on the surface of the cooler 40I, and a part of the sealing material 51 is formed in the groove formed in the gap d46 between the grease layer 61 and the protrusion 46. Is embedded and formed.
- the bonding area between the seal material 51 and the cooler 40I increases, and the sealing effect by the seal material 51 is enhanced. be able to.
- FIG. 16 is a sectional view showing the structure of a semiconductor device 13 according to the thirteenth embodiment of the present invention.
- the semiconductor device 13 of the thirteenth embodiment is provided with a cooler 40J in place of the cooler 40 of the first embodiment. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the cooler 40J further has a recess 47 on the surface thereof.
- the filling region of the grease layer 61 is a region between the bottom surface of the recess 47 and the heat dissipation surface of the semiconductor module 30.
- the recess 47 is further formed while providing a gap d47 for the sealing material 51 between the side surface end of the grease layer 61.
- the cooler 40J in the semiconductor device 13 according to the thirteenth embodiment has the recessed portion 47 that is recessed from the surface in a region including the entire semiconductor module 30 and a part of the sealing material 51 in plan view. Yes. A part of the sealing material 51 is embedded in a gap region formed by a gap d47 between the side surface end of the grease layer 61 and the side surface of the recess 47. Therefore, in the semiconductor device 13 of the thirteenth embodiment, by providing the recess 47 in the cooler 40J, the bonding area between the seal material 51 and the cooler 40J increases, and the sealing effect by the seal material 51 can be enhanced.
- ⁇ Embodiment 14> 17 is a sectional view showing a part of the structure of a semiconductor device 14 according to the fourteenth embodiment of the present invention. As shown in the figure, the semiconductor device 14 according to the fourteenth embodiment is provided with a semiconductor module 30E in place of the semiconductor module 30 according to the first embodiment.
- the semiconductor module 30 ⁇ / b> E includes a chamfered resin sealing portion 39 instead of the resin sealing portion 31, and each of the four sides constituting the peripheral portion of the bottom surface of the chamfered resin sealing portion 39.
- the chamfered portion 71 is chamfered.
- the chamfered portion 71 is chamfered upward according to the direction toward the side surface end of the resin sealing portion 31, that is, the distance from the surface of the cooler 40 is increased according to the side surface end portion direction (right direction in FIG. 17). It is formed by chamfering.
- the heat radiating material 32 is provided on the bottom surface of the chamfered resin sealing portion 39 excluding the chamfered portion 71, and the grease layer 61 is provided in the filling region between the heat radiating surface of the heat radiating material 32 and the surface of the cooler 40. . Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof will be omitted as appropriate.
- the semiconductor module 30E in the semiconductor device 14 of the fourteenth embodiment has a chamfered portion 71, and a space that widens in the end direction is formed below the chamfered portion 71 of the chamfered resin sealing portion 39. Yes.
- the liquid curable sealing agent which is a constituent material of the sealing material 51 and has an initial liquid state, easily flows to the outside at the time of manufacture (based on the semiconductor module 30). The possibility of entering into 61 can be suppressed, and the heat dissipation of the grease layer 61 can be maintained.
- the chamfered portion 71 is provided in the semiconductor module 30E, the bonding area between the sealing material 51 and the semiconductor module 30E increases, and the sealing effect by the sealing material 51 can be enhanced.
- ⁇ Embodiment 15> 18 is a sectional view showing a part of the structure of a semiconductor device 15 according to the fifteenth embodiment of the present invention. As shown in the figure, a semiconductor module 30F is provided in place of the semiconductor module 30E of the fourteenth embodiment.
- the semiconductor module 30F has a chamfered resin sealing portion 39t instead of the chamfered resin sealing portion 39.
- the chamfered resin sealing portion 39t has a chamfered portion 71 similar to that of the chamfered resin sealed portion 39, and protrudes downward along the end portions of the four sides of the bottom surface where the chamfered portion 71 is formed. It further has a projecting portion 72 having a tapered shape. Since the other configuration is the same as that of the fourteenth embodiment shown in FIG. 17, the same reference numerals are given and the description thereof is omitted as appropriate.
- the chamfered resin sealing portion 39t of the semiconductor device 15 of the fifteenth embodiment has a protruding portion 72.
- the sealing material 51 having a liquid curable sealant as a constituent material is characterized by being cured from the surface in contact with air and forming a film on the surface.
- the film on the surface is appropriately broken by the sharp tip portion of the protruding portion 72 formed on the chamfered resin sealing portion 39t, so that the internal uncured sealing agent flows to the outside.
- the sealing agent can be prevented from entering the grease layer 61, and the heat radiation property of the grease layer 61 can be maintained.
- FIG. 19 is a cross sectional view showing a structure of a semiconductor device 16 according to the sixteenth embodiment of the present invention.
- the semiconductor device 16 according to the sixteenth embodiment includes grease layers 64 and 65 (first and second greases) composed of two different types of grease between the semiconductor module 30 and the cooler 40.
- the grease member is provided with a structure. That is, the grease layers 64 and 65 are provided in the filling region between the heat dissipation surface, which is the bottom surface of the heat dissipation material 32 of the semiconductor module 30, and the surface of the cooler 40. Since other configurations are the same as those of the first embodiment shown in FIG. 1, the same reference numerals are given and description thereof is omitted as appropriate.
- the grease layer 64 is provided corresponding to the central region of the radiation surface, and the grease layer 65 is provided only corresponding to the peripheral region other than the central region of the heat dissipation surface.
- the constituent material of the grease layer 64 is a semi-solid grease (first type grease) even after the apparatus is completed, like the grease layer 61.
- the grease layer 65 uses a two-component curable grease (second-type grease) as a constituent material. Since the two-component curing type grease has the property of solidifying effectively by the two-component chemical reaction, it is solidified after completion of the apparatus. “Semi-solid” means one having a viscosity of 600 [Pa ⁇ s] or less.
- the semiconductor device 16 according to the sixteenth embodiment is provided with the grease layers 64 and 65 made of two different types of grease (first type and second type grease) between the semiconductor module 30 and the cooler 40. It is characterized by that.
- the heat dissipation is improved by the first type grease of the grease layer 64 (first grease member) provided corresponding to the central region of the heat dissipation surface of the semiconductor module 30, and the peripheral region.
- the movement of the grease in the grease layer 64 can be suppressed by the second type grease of the grease layer 65 (second grease member) provided corresponding to the above. That is, the grease layer 64 plays the role of the grease layer 61 (62, 63) used in the first to fifteenth embodiments, and the grease layer 65 is a peripheral contact member used in the first to fifteenth embodiments. It plays the role of (sealant 51, gel part 52).
- a two-component curable grease has properties such that the adhesiveness and hardness after curing are low compared to a liquid curable sealant that is a constituent material of the sealing material 51. As shown in FIG. 19, the grease layer 65 made of grease is narrowed by the cooler 40 and the semiconductor module 30 to enhance the sealing function.
- the pump is a phenomenon in which the first type grease in the grease layer 64 is pushed out from the filling region between the heat radiation surface of the semiconductor module 30 and the surface of the cooler. Out can be reliably suppressed, the thermal resistance of the entire apparatus can be kept low, quality improvement can be maintained, and the life of the apparatus can be extended.
- the second type grease which is a constituent material of the grease layer 65, is a two-component curable grease, it can be cured to the inside not in contact with air to obtain a stable sealing effect. Pumping out of the grease layer 64 can be suppressed without the need for a sealing member.
- the two-component curable grease has a higher thermal conductivity than a sealant such as a liquid curable sealant, it is possible to suppress a decrease in heat dissipation.
- the grease layer 65 is formed only in the peripheral region of the heat radiating surface, the semiconductor device 16 having the above-described effects can be realized with the minimum necessary amount of the second type grease.
- ⁇ Embodiment 17> 20 is a cross sectional view showing a structure of a semiconductor device 17 according to the seventeenth embodiment of the present invention.
- the semiconductor device 17 according to the seventeenth embodiment has two different grease layers 64 and 65 (first and second) between the semiconductor module 30 and the cooler 40 as in the sixteenth embodiment.
- the grease member) is provided.
- Other configurations are the same as those in Embodiments 1 and 16 shown in FIG. 1 and FIG.
- the grease layer 64 is provided corresponding to the central region of the radiation surface, and the grease layer 65 is formed over a peripheral region other than the central region of the heat dissipation surface and a part of the surface of the cooler 40 outside the peripheral region.
- first type and second type grease are used as constituent materials between the semiconductor module 30 and the cooler 40.
- the grease layers 64 and 65 are provided.
- the heat dissipation is improved by the grease layer 64 provided corresponding to the central region of the heat dissipation surface of the semiconductor module 30 as in the sixteenth embodiment, and the peripheral region and the outside of the peripheral region are The movement of the grease layer 64 can be suppressed by the grease layer 65 provided corresponding to a part of the surface of the cooler 40.
- the second type grease which is a constituent material of the grease layer 65, is a two-component curable grease, it is possible to suppress the pump-out and the decrease in heat dissipation as in the case of the sixteenth embodiment.
- the grease layer 65 is formed from the peripheral region of the heat dissipation surface to a part of the surface of the cooler 40 outside the peripheral region, the adhesion area between the grease layer 65 and the cooler 40 increases, and the grease layer 65 The sealing effect by can be enhanced.
- the semiconductor device manufacturing method is basically realized by executing the following steps (a) to (d).
- step (a) IV the semiconductor modules 30B to 30F and the coolers 40B to 40J described in the third to eighth embodiments, the tenth embodiment, and the twelfth to fifteenth embodiments are obtained. Processing is also performed.
- step (b) grease layers 62 and 63 are formed instead of the grease layer 61 in the ninth embodiment, and grease layers 64 and 65 are formed instead of the grease layer 61 in the sixteenth and seventeenth embodiments.
- step (c) the execution of step (c) is omitted.
- step (b) when the grease layers 62 and 63 are applied, the grease layer 62 is applied to the central area of the heat dissipation surface of the heat dissipation material 32 and the grease layer 63 is applied to the peripheral area by printing.
- step (b) IV when the grease layers 64 and 65 are applied, the grease layer 64 is applied to the central area of the heat dissipation surface of the heat dissipation material 32 and the grease layer 65 is applied to the peripheral area by printing.
- the grease layer 65 may be applied to the surface of the cooler 40 (including a region corresponding to the peripheral region).
- step (c) the gel part 52 is formed in place of the sealing material 51 in the second and eighth embodiments.
- step (c) IV in the eleventh embodiment, a process for forming the resist 25 is additionally executed.
- heat dissipating materials 34 and 38 shown in the present embodiment have different shapes
- the constituent materials are the same as those of the heat dissipating material 32, and each shape can be realized by an existing method.
- the constituent materials are the same as those of the cooler 40, and each shape can be realized by an existing method.
- the shapes of the resin sealing portions 35, 39, 39t and the like can be realized by an existing method by changing the mold.
- the configuration using the sealing material 51 or the gel portion 52 as the peripheral contact member is shown, but these can be used as appropriate.
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Abstract
Description
図21は、冷却器と半導体モジュールとの間にグリース部材を介した構造を有する、本願発明の前提技術となる半導体装置の構造を示す断面図である。
図1は、冷却器と半導体モジュールとの間の充填領域にグリース層を設けた構造を有する、この発明の実施の形態1である半導体装置の構造を示す断面図である。
(2) 硬化後においては、接着性を有し、「グリース」よりも硬度が高い。
図2はこの発明の実施の形態2である半導体装置2の構造を示す断面図である。同図に示すように、実施の形態2の半導体装置2は、周辺密着部材として用いた実施の形態1のシール材51に代えて、ゲル部52を設けたことを特徴としている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
(第1の態様)
図3はこの発明の実施の形態3の第1の態様である半導体装置3Aの構造を示す断面図である。同図に示すように、実施の形態3の半導体装置3Aは、実施の形態1の冷却器40に代えて冷却器40Bを設けたことを特徴としている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図4はこの発明の実施の形態3の第2の態様である半導体装置3Bの構造を示す断面図である。同図に示すように、実施の形態3の半導体装置3Bは、実施の形態1の冷却器40に置き換えて冷却器40Cを設けている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
(第1の態様)
図5はこの発明の実施の形態4の第1の態様である半導体装置4Aの構造を示す断面図である。同図に示すように、実施の形態4の半導体装置4Aは、実施の形態1の半導体モジュール30に置き換えて半導体モジュール30Bを設けている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図6はこの発明の実施の形態4の第2の態様である半導体装置4Bの構造を示す断面図である。同図に示すように、実施の形態4の半導体装置4Bは、実施の形態1の半導体モジュール30に置き換えて半導体モジュール30Cを設けている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図7はこの発明の実施の形態5である半導体装置5の構造を示す断面図である。同図に示すように、実施の形態5の半導体装置5は、実施の形態1の半導体モジュール30に代えて半導体モジュール30Dを設け、冷却器40に代えて冷却器40Dを設けている。
図8はこの発明の実施の形態6である半導体装置6の構造を示す断面図である。図9は図8で示した半導体装置6の平面構造を示す平面図である。これらの図に示すように、実施の形態6の半導体装置6は、実施の形態1の冷却器40に代えて冷却器40Eを設けている。
図10はこの発明の実施の形態7である半導体装置7の構造を示す断面図である。同図に示すように、実施の形態7の半導体装置7は、実施の形態1の冷却器40に代えて冷却器40Fを設けている。
図11はこの発明の実施の形態8である半導体装置8の構造を示す断面図である。同図に示すように、実施の形態8の半導体装置8は、周辺密着部材として用いた実施の形態1のシール材51に代えて実施の形態2と同様にゲル部52を設け、実施の形態1の冷却器40に代えて冷却器40Gを設けている。
図12はこの発明の実施の形態9である半導体装置9の構造を示す断面図である。同図に示すように、実施の形態9の半導体装置9は、グリース層61に代えて、異なる二種類のグリースを構成材料としたグリース層62及び63(第1及び第2のグリース部材)を設けたことを特徴としている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図13はこの発明の実施の形態10である半導体装置10の構造を示す断面図である。同図に示すように、実施の形態10の半導体装置10は、実施の形態1の冷却器40に置き換えて冷却器40Hを設けている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図14はこの発明の実施の形態11である半導体装置11の構造を示す断面図である。同図に示すように、冷却器40の表面上にさらに樹脂等によるレジスト25を形成している。レジスト25は、平面視してグリース層61の外周に沿って、グリース層61の端部との間にシール材51用の間隔d25を設けつつ、冷却器40の表面上に形成されている。
図15はこの発明の実施の形態12である半導体装置12の構造を示す断面図である。同図に示すように、実施の形態12の半導体装置12は、実施の形態1の冷却器40に置き換えて冷却器40Iを設けている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図16はこの発明の実施の形態13である半導体装置13の構造を示す断面図である。同図に示すように、実施の形態13の半導体装置13は、実施の形態1の冷却器40に置き換えて冷却器40Jを設けている。他の構成は図1で示した実施の形態1と同様であるため、同一符号を付して適宜、説明を省略する。
図17はこの発明の実施の形態14である半導体装置14の構造の一部を示す断面図である。同図に示すように、実施の形態14の半導体装置14は、実施の形態1の半導体モジュール30に置き換えて半導体モジュール30Eを設けている。
図18はこの発明の実施の形態15である半導体装置15の構造の一部を示す断面図である。同図に示すように、実施の形態14の半導体モジュール30Eに置き換えて半導体モジュール30Fを設けている。
図19は、この発明の実施の形態16である半導体装置16の構造を示す断面図である。同図に示すように、実施の形態16の半導体装置16は、半導体モジュール30と冷却器40との間に異なる2種類のグリースを構成材料とするグリース層64及び65(第1及び第2のグリース部材)が設けられた構造を呈している。すなわち、半導体モジュール30の放熱材32の底面である放熱面と、冷却器40の表面との間の充填領域にグリース層64及び65が設けられる。なお、他の構成は図1で示した実施の形態1と同様であるため、同一符号を付し説明を適宜省略する。
図20は、この発明の実施の形態17である半導体装置17の構造を示す断面図である。同図に示すように、実施の形態17の半導体装置17は、実施の形態16と同様、半導体モジュール30と冷却器40との間に異なる2種類のグリース層64及び65(第1及び第2のグリース部材)が設けられた構造を呈している。他の構成は図1及び図19で示した実施の形態1及び実施の形態16と同様であるため、同一符号を付し説明を適宜省略する。
以下、図1で示した実施の形態1の半導体装置1を例に挙げて、本願発明における半導体装置の製造方法について説明する。
(b) 放熱材32の放熱面にグリース層61を印刷により塗布するステップ、
(c) 液状硬化型のシール剤をグリース層61の側面領域全てを覆うように形成してシール材51を得るステップ、及び、
(d) ボルト等の締結により、半導体モジュール30,冷却器40間を固定するステップを実行して半導体装置1を完成する。
なお、本実施の形態で示した放熱材34,38は形状が異なるが構成材料は放熱材32と同様であり、それぞれの形状は既存の方法で実現可能である。
Claims (20)
- 底部に放熱面(32,34,38)を有する半導体モジュール(30,30B~30F)と、
表面が前記放熱面に対向するように設けられる冷却器(40,40B~40J)と、
前記半導体モジュールの前記放熱面と前記冷却器の表面との間の充填領域に設けられるグリース部材(61~63)と、
前記グリース部材の側面領域を隙間無く覆って、前記冷却器の表面上に形成される周辺密着部材(51,52)とを備える、
半導体装置。 - 請求項1記載の半導体装置であって、
前記周辺密着部材(51)は、
液状熱硬化型シール剤を構成材料とする、
半導体装置。 - 請求項1記載の半導体装置であって、
前記周辺密着部材(52)は、
針入度が55以下のゲル状物質を構成材料とする、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40B,40C)は表面に冷却器用凹凸領域(81,83)を有することを特徴とする、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記半導体モジュール(30B,30C)は前記放熱面(34,38)にモジュール用凹凸領域(82,84)を有することを特徴とする、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記半導体モジュール(30D)は前記放熱面の一部から突出した突出部(35a)を有し、
前記冷却器(40D)は表面に固定用溝部(42)を有し、
前記半導体モジュールの前記突出部と前記冷却器の前記固定用溝部とは、前記固定用溝部に前記突出部の一部が挿入される対応関係で形成されることを特徴とする、
半導体装置。 - 請求項6記載の半導体装置であって、
前記突出部は平面視して前記グリース部材を囲むように前記放熱面の外周に沿って形成される、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40E)は表面にグリース用溝(43)を有し、前記グリース用溝は平面視して前記グリース部材の形成領域と一部が重複し、他の一部が前記グリース部材の形成領域外に延びて形成される、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40F)は、平面視して前記放熱面の中心部に対応した領域に、表面から上方に突出したバンプ(48)を有する、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40G)は、平面視して前記放熱面の4つの角部に対応した領域に、それぞれが表面から上方に突出した複数のバンプ(49)を有する、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記グリース部材(62,63)は、
第1のフィラーサイズを有する第1のグリースを構成材料とする第1のグリース部材(62)と、
前記第1のフィラーサイズより大きい第2のフィラーサイズを有する第2のグリースを構成材料とする第2のグリース部材(63)とを含み、
前記第1のグリースは前記放熱面の中央領域に対応して設けられ、前記第2のグリースは前記放熱面の前記中央領域以外の周辺領域に対応して設けられる、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40H)は、平面視して前記半導体モジュールの前記放熱面の外周に沿って形成される周辺密着部材用溝部(45)を表面に有し、
前記周辺密着部材の一部は前記周辺密着部材用溝部内に埋め込まれて形成される、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
平面視して前記周辺密着部材の外周に沿って前記冷却器の表面上に形成されるレジスト(25)をさらに備える、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40I)は、平面視して前記半導体モジュールの外周に沿って、表面から突出して形成される突出部(46)を有し、
前記周辺密着部材は前記グリース部材の周辺から前記突出部にかけて形成される、
半導体装置。 - 請求項1から請求項3のうち、いずれか1項に記載の半導体装置であって、
前記冷却器(40J)は表面に、平面視して前記半導体モジュールの全て及び前記周辺密着部材の少なくとも一部を含む領域に、表面から凹んだ凹み部(47)を有し、
前記グリース部材は前記放熱面と前記冷却器の前記凹み部の底面との間を前記充填領域として設けられ
前記周辺密着部材は少なくとも一部が前記充填領域を除く前記凹み部内に埋め込まれて形成される、
半導体装置。 - 請求項2記載の半導体装置であって、
前記半導体モジュール(30E,30F)の周辺部は端部方向に従い前記冷却器の表面との距離が広がるように面取り加工された面取り部(71)を有し、前記放熱面は前記面取り部を除く前記半導体モジュールの底部に設けられ、
前記周辺密着部材の少なくとも一部は前記面取り部の下方に形成される、
半導体装置。 - 請求項16記載の半導体装置であって、
前記半導体モジュール(30F)の端部は下方に突出した突出部(72)をさらに有する、
半導体装置。 - 底部に放熱面(32)を有する半導体モジュール(30)と、
表面が前記放熱面に対向するように設けられる冷却器(40)と、
前記半導体モジュールの前記放熱面と前記冷却器の表面との間に充填領域に設けられる第1及び第2のグリース部材(64,65)とを備え、
前記第1のグリース部材は前記放熱面の中央領域に対応して設けられ、前記第2のグリース部材は前記放熱面の前記中央領域以外の周辺領域に対応して設けられ、
前記第1のグリース部材は半固体化された第1種グリースを構成材料とし、
前記第2のグリース部材は前記第1種グリースより硬度が高い固体化された第2種グリースを構成材料としている、
半導体装置。 - 請求項18記載の半導体装置であって、
前記第2種グリースは二液硬化型グリースであり、
前記第2のグリース部材は前記放熱面の前記周辺領域のみに形成される、
半導体装置。 - 請求項18記載の半導体装置であって、
前記第2種グリースは二液硬化型グリースであり、
前記第2のグリース部材は前記放熱面の前記周辺領域から前記周辺領域の外部の前記冷却器の表面の一部にかけてさらに形成される、
半導体装置。
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US10049960B2 (en) | 2018-08-14 |
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