JP2013153089A - 電子装置及びその製造方法 - Google Patents
電子装置及びその製造方法 Download PDFInfo
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2924/153—Connection portion
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Abstract
【解決手段】電子装置は、半導体装置3と、前記半導体装置の上方に設けられ、熱伝導体10と樹脂11とを含む熱伝導性樹脂4と、前記熱伝導性樹脂の上方に設けられ、前記熱伝導体と熱的に接触する線状炭素5と、前記線状炭素の上方に設けられ、前記熱伝導性樹脂が埋め込まれた凹部7を備えるヒートスプレッダ8と、を備える。
【選択図】図1
Description
凹部7の形成方法としては、ヒートスプレッダの材質や形成しようとする凹部7の形状および寸法に応じて、ウェットエッチング、ドライエッチング、成形加工、切削加工またはプレス加工などの方法を適宜選択することができる。
スピンコーティングを行うと、図3(a)および図3(b)に示すように、ヒートスプレッダ8の内壁の表面に線状炭素5が物理吸着し、開口6の一部を線状炭素5により被覆することができる。このように、スピンコーティング法を用いると、分散溶液の濃度とスピンコート回転数とを調整することにより線状炭素の供給量をコントロールできるため、所望の被覆率を得ることができる。また、線状炭素の長さを凹部の開口の径よりも大きくすると、線状炭素が凹部に入り込みにくくなるため、凹部の開口上に線状炭素を配置することができる。
(変形例)
次に、本発明の実施形態におけるヒートスプレッダの変形例について、図6乃至図9を参照して説明する。
2:はんだバンプ
3:半導体装置
4:熱伝導性樹脂
5:線状炭素
6:開口
7:凹部
8:ヒートスプレッダ
9:接着剤
10:CNT
11:樹脂
12:分散液
17:凹部
18:ヒートスプレッダ
26:開口
27:線状溝
28:ヒートスプレッダ
36:開口
37:貫通孔
38:ヒートスプレッダ
Claims (10)
- 半導体装置と、
前記半導体装置の上方に設けられ、熱伝導体と樹脂とを含む熱伝導性樹脂と、
前記熱伝導性樹脂の上方に設けられ、前記熱伝導体と熱的に接触する線状炭素と、
前記線状炭素の上方に設けられ、前記熱伝導性樹脂が埋め込まれた凹部を備えるヒートスプレッダと、
を有することを特徴とする電子装置。 - 前記線状炭素は、前記凹部の開口の一部を覆っていることを特徴とする請求項1記載の電子装置。
- 前記線状炭素は、前記熱伝導性樹脂と前記ヒートスプレッダとの間に分散して設けられており、
前記樹脂は、前記線状炭素が分散されている領域よりも広い領域で前記ヒートスプレッダの前記半導体装置に対向する面を覆っていることを特徴とする請求項1又は2に記載の電子装置。 - 前記開口の幅が、前記線状炭素の長さよりも小さいことを特徴とする請求項1〜3のいずれか1項に記載の電子装置。
- 前記凹部が、深くなるほど開口が小さくなる形状を有する孔であることを特徴とする請求項1〜4のいずれか1項に記載の電子装置。
- 前記凹部が、線状の溝であることを特徴とする請求項1〜4のいずれか1項に記載の電子装置。
- 前記凹部が貫通孔であることを特徴とする請求項1〜4のいずれか1項に記載の電子装置。
- 前記開口の面積に対する前記線状炭素の被覆率は、10%〜50%であることを特徴とする請求項1〜7のいずれか1項に記載の電子装置。
- 半導体装置の上方に熱伝導体と樹脂とを含む導電性樹脂を配置する工程と、
ヒートスプレッダに設けられた凹部の開口の一部を線状炭素で覆う工程と、
前記線状炭素が備えられた前記ヒートスプレッダで前記熱伝導性樹脂を押圧することにより、前記熱伝導体と前記線状炭素とを接触させるとともに、前記導電性樹脂を前記凹部に埋め込む工程と、
を有することを特徴とする電子装置の製造方法。 - 前記凹部の少なくとも一部は貫通孔であり、
前記熱伝導性樹脂を前記凹部に埋め込む工程は、
前記樹脂を前記貫通孔に埋め込むとともに、前記貫通孔の前記樹脂が埋め込まれる側の開口と異なる開口から、前記貫通孔の内部の空気を排出させることを特徴とする請求項9記載の電子装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012013583A JP6015009B2 (ja) | 2012-01-25 | 2012-01-25 | 電子装置及びその製造方法 |
US13/675,335 US9137926B2 (en) | 2012-01-25 | 2012-11-13 | Electronic device and method of manufacturing the same |
TW101142383A TWI493665B (zh) | 2012-01-25 | 2012-11-14 | 電子裝置及其之製造方法 |
CN201210477612.0A CN103227157B (zh) | 2012-01-25 | 2012-11-21 | 电子器件及其制造方法 |
KR20120132903A KR101442349B1 (ko) | 2012-01-25 | 2012-11-22 | 전자 장치 및 그 제조 방법 |
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CN103227157A (zh) | 2013-07-31 |
CN103227157B (zh) | 2015-12-23 |
TWI493665B (zh) | 2015-07-21 |
TW201332067A (zh) | 2013-08-01 |
JP6015009B2 (ja) | 2016-10-26 |
US9137926B2 (en) | 2015-09-15 |
US20130188319A1 (en) | 2013-07-25 |
KR101442349B1 (ko) | 2014-09-17 |
KR20130086515A (ko) | 2013-08-02 |
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