WO2015096453A1 - 导热复合材料片及其制作方法 - Google Patents

导热复合材料片及其制作方法 Download PDF

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Publication number
WO2015096453A1
WO2015096453A1 PCT/CN2014/081785 CN2014081785W WO2015096453A1 WO 2015096453 A1 WO2015096453 A1 WO 2015096453A1 CN 2014081785 W CN2014081785 W CN 2014081785W WO 2015096453 A1 WO2015096453 A1 WO 2015096453A1
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Prior art keywords
aluminum alloy
sheet
layer
graphite
conductive composite
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PCT/CN2014/081785
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English (en)
French (fr)
Inventor
胡锐
翟立谦
王东
池善久
李金山
孙智刚
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP14874601.9A priority Critical patent/EP3007531B1/en
Publication of WO2015096453A1 publication Critical patent/WO2015096453A1/zh
Priority to US15/084,098 priority patent/US20160209133A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/084Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to the technical field of thermal control, in particular to a thermal conductive composite material sheet with high thermal conductivity and a manufacturing method thereof. Background technique
  • forged aluminum alloy materials with high strength and high thermal conductivity such as American grade 6XXX series (6061, 6063), domestic grade LD series aluminum alloy, are often used for heat dissipation fins, heat. Shen frame and other structures.
  • 6XXX series aluminum alloy is a kind of medium-high strength aluminum alloy which can be heat-treated and strengthened. It has a series of excellent comprehensive properties: good processability and corrosion resistance, sufficient toughness, anodizing coloring, stress-free corrosion cracking tendency, and its With high specific strength and good thermal conductivity, it can produce a variety of structural or functional aluminum alloy components with special applications. It has a wide range of applications in aerospace, transportation, electronics, building decoration and sports equipment.
  • High thermal conductivity graphite sheet is a new high thermal conductivity heat sink material.
  • the United States and Japan developed high thermal conductivity asphalt-based graphite materials, and developed cold pressed high thermal conductivity graphite sheets, high thermal conductivity asphalt-based graphite fibers, high thermal conductivity mesophase asphalt graphite foam, etc., thermal conductivity from 1000W. /mK has grown to 1500W/mK.
  • cold pressed high thermal conductivity graphite sheets have been applied to electronic component package covers.
  • the high-conductivity graphite sheet has improved thermal conductivity while improving the performance of electronic components (components) because of its uniform thermal conductivity in a direction perpendicular to the normal plane of the graphite sheet.
  • the high thermal conductivity graphite sheet is not aging, is not embrittled, and is suitable for most chemical media. It has been widely used in large-scale integrated circuits, high-power density electronic devices, computers, 3G smart phones, cutting-edge electronic devices, etc. There are also good market prospects in the aerospace, aviation, computer, medical, communications and electronics industries.
  • the compatibility of aluminum and graphite is very poor. This involves two problems. First, the wettability of liquid aluminum and graphite is poor, and the metal aluminum liquid cannot be spread on the graphite substrate. Secondly, when the synthesis temperature exceeds 500 °C, A chemical reaction occurs between aluminum and carbon to form a brittle carbide reaction layer. As the synthesis temperature is further increased, the chemical reaction is aggravated, which seriously impairs the thermal conductivity of the graphite itself and also causes degradation of the composite properties.
  • the technical problem to be solved by the embodiments of the present invention is to provide a thermally conductive composite material sheet and a method for fabricating the same, which can connect a high thermal conductivity aluminum alloy with graphite and have a low production cost.
  • a thermally conductive composite sheet is provided.
  • a thermally conductive composite sheet comprising a first aluminum alloy layer, at least one graphite sheet, an aluminum alloy frame, and a second aluminum alloy layer, the aluminum alloy frame having at least one opening, the graphite sheet being positioned at an opening of the aluminum alloy frame
  • the aluminum alloy frame and the graphite sheet are interposed between the first aluminum alloy layer and the second aluminum alloy layer, and the first aluminum alloy layer is diffusion-bonded to the graphite sheet and the aluminum alloy frame.
  • the second aluminum alloy layer is diffusion-bonded to the graphite sheet and the aluminum alloy frame, and the graphite sheet is covered by the first aluminum alloy layer, the second aluminum alloy layer and the aluminum alloy frame to form a whole.
  • the materials of the first aluminum alloy layer, the second aluminum alloy layer, and the aluminum alloy frame are the same.
  • the first aluminum alloy layer has a thickness of 0.26 mm to 1.0 mm.
  • the second aluminum alloy layer has a thickness of 0.26 mm to 1.0 mm.
  • the aluminum alloy frame has one of the openings, and the number of the graphite sheets is also one, and the graphite sheet is received in the opening.
  • the aluminum alloy frame has a plurality of the openings mouth.
  • the number of the graphite sheets is also plural, and each of the graphite sheets is correspondingly housed in one opening.
  • a thermally conductive composite sheet is provided.
  • a thermally conductive composite sheet comprising a first aluminum alloy layer, at least one graphite sheet, a first transition layer, a second transition layer, an aluminum alloy frame, and a second aluminum alloy layer, the aluminum alloy frame having at least one opening, the graphite
  • the sheet is positioned in the opening of the aluminum alloy frame, the aluminum alloy frame and the graphite sheet are interposed between the first aluminum alloy layer and the second aluminum alloy layer, and the first transition layer is disposed on the graphite
  • the second transition layer is disposed between the second aluminum alloy layer and the graphite sheet, and the first aluminum alloy layer is diffusion-bonded with the first transition layer, a diffusion connection between the first transition layer and the graphite sheet, a diffusion connection between the graphite sheet and the second transition layer, and a diffusion connection between the second transition layer and the second aluminum alloy layer, the relative orientation of the aluminum alloy frame
  • the two sides are respectively diffusion-bonded to the first aluminum alloy layer and the second aluminum alloy layer, so that the first transition layer, the second transition layer and the graph
  • the materials of the first aluminum alloy layer, the second aluminum alloy layer, and the aluminum alloy frame are the same.
  • the first aluminum alloy layer has a thickness of 0.26 mm to 1.0 mm.
  • the second aluminum alloy layer has a thickness of from 0.26 mm to 1.0 mm.
  • the aluminum alloy frame has one of the openings, and the number of the graphite sheets is also one, and the graphite sheet is received in the opening.
  • the aluminum alloy frame has a plurality of the openings therein.
  • the number of the graphite sheets is also plural, and each of the graphite sheets is correspondingly housed in one opening.
  • the first transition layer is made of titanium or a titanium-containing alloy.
  • the second transition layer is made of titanium or a titanium-containing alloy.
  • the first transition layer has a thickness of from 20 micrometers to 40 micrometers.
  • the second transition layer has a thickness of 20 micrometers. Up to 40 microns.
  • a method of making a thermally conductive composite sheet is provided.
  • the method for manufacturing a thermally conductive composite material sheet comprises the steps of: providing two aluminum alloy sheets and an aluminum alloy frame, the aluminum alloy frame having at least one opening, and mechanically treating and chemically treating the aluminum alloy sheet and the aluminum alloy frame to Reducing the roughness of the surface of the aluminum alloy sheet and the surface of the aluminum alloy frame and obtaining an active aluminum alloy surface; providing at least one graphite sheet; placing the graphite sheet in the opening of the aluminum alloy frame, and in the aluminum alloy frame and An aluminum alloy sheet is respectively placed on opposite sides of the graphite sheet to form a laminated structure, and the laminated structure is placed in the furnace cavity, and the furnace cavity is evacuated; and the laminated structure is heated and pressurized, The aluminum alloy frame on which the graphite sheet is placed and the two aluminum alloy sheets are diffusion-bonded to obtain a thermally conductive composite material sheet.
  • the mechanical treatment comprises sanding and polishing to reduce the roughness of the surface of the aluminum alloy sheet and the surface of the aluminum alloy.
  • the chemical treatment comprises pickling and caustic washing to obtain an active aluminum alloy surface.
  • the furnace chamber is evacuated to a pressure of
  • the temperature in the furnace chamber is raised to 530 degrees Celsius to 590 degrees Celsius. And applying a pressure of 10 MPa to 15 MPa to the laminated structure to make a diffusion connection between the surface of the graphite sheet in contact with the aluminum alloy.
  • the number of the openings in the aluminum alloy frame is plural, and the number of the graphite sheets is also multiple, and each graphite piece is correspondingly received in one Within the opening.
  • a method of making a thermally conductive composite sheet is provided.
  • the manufacturing method of the thermal conductive composite material sheet comprises the steps of: providing two aluminum alloy sheets and an aluminum alloy frame, and mechanically treating and chemically treating the aluminum alloy sheet and the aluminum alloy frame to reduce the surface of the aluminum alloy sheet and the surface of the aluminum alloy Roughness and obtaining an active aluminum alloy surface; providing a graphite sheet and two transition sheets; respectively placing two transition sheets on opposite sides of the graphite sheet, so that the graphite sheet and the transition sheet are diffusion-bonded to obtain
  • the composite layer is placed in the opening of the aluminum alloy frame, and the aluminum alloy sheets are respectively placed on opposite sides of the aluminum alloy frame and the graphite sheet to form a laminated structure, which is placed in the furnace cavity and The vacuum processing is performed; and the aluminum alloy frame on which the composite layer is placed and the two aluminum alloy sheets are diffusion-bonded to obtain a thermally conductive composite material sheet.
  • the mechanical treatment comprises sanding and polishing to reduce the roughness of the surface of the aluminum alloy sheet and the surface of the aluminum alloy.
  • the chemical treatment comprises pickling and caustic washing to obtain an active aluminum alloy surface.
  • the furnace chamber is evacuated to a pressure of 5 x 10 -3 Pa to 7 x 10 -3 Pa.
  • the temperature in the furnace chamber is raised to 530 degrees Celsius to 590 degrees Celsius. And applying a pressure of 10 MPa to 15 MPa to the laminated structure to make a diffusion connection between the surface of the graphite sheet in contact with the aluminum alloy.
  • the two transition sheets are respectively placed on opposite sides of the graphite sheet and stacked neatly, and the stacked two transition sheets and the graphite sheet are placed in the furnace cavity, and vacuum is drawn to The pressure is 5x lO-3Pa to 7x lO-3Pa, and then the furnace temperature is raised to 850 degrees Celsius to 830 degrees Celsius, and a pressure of ll MPa to 12 MPa is applied between the two transition sheets for a duration of 100 minutes to 170 minutes.
  • the heat conductive composite material sheet provided by the invention and the manufacturing method thereof have the advantages of high thermal conductivity of the graphite sheet and the aluminum alloy, so that the heat conductive composite material sheet has good thermal conductivity and light weight, and can be widely used in the field of thermal control technology and electronics. Component packaging technology field. After the surface of the aluminum alloy sheet in contact with the graphite sheet is mechanically treated and chemically treated, the aluminum oxide layer on the surface of the aluminum alloy can be effectively removed to form an activated surface of the aluminum alloy.
  • the bonding between the aluminum alloy and the graphite sheet is achieved by means of diffusion bonding under vacuum conditions, seamless welding can be achieved, and the quality of the bonding is high.
  • the method for manufacturing the thermally conductive composite material sheet provided by the invention is simple in implementation, suitable for mass production, short in production cycle, low in production cost and high in production efficiency.
  • FIG. 1 is a schematic cross-sectional view of a thermally conductive composite material sheet according to a first preferred embodiment of the present invention
  • FIG. 2 is an exploded perspective view of the thermally conductive composite material sheet of FIG.
  • FIG. 3 is a schematic cross-sectional view of a thermally conductive composite material according to a second preferred embodiment of the present invention
  • FIG. 4 is an exploded perspective view of the thermally conductive composite material sheet of FIG.
  • FIG. 5 is a schematic cross-sectional view of a thermally conductive composite material sheet according to a third preferred embodiment of the present invention.
  • FIG. 6 is an exploded perspective view of the thermally conductive composite material sheet of FIG.
  • Figure 7 is an electron micrograph of the joint of the aluminum alloy in the technical solution
  • Figure 8 is an electron micrograph of the joint of graphite and aluminum alloy in the technical solution
  • FIG. 9 is a flow chart showing a method of fabricating a thermally conductive composite material sheet according to a first preferred embodiment of the present invention.
  • FIG. 10 is a flow chart showing a method of fabricating a thermally conductive composite material sheet according to a second preferred embodiment of the present invention.
  • Figure 11 is a flow chart showing a method of fabricating a thermally conductive composite sheet according to a third preferred embodiment of the present invention. detailed description
  • a first technical solution of the present invention provides a thermally conductive composite sheet.
  • a thermally conductive composite material sheet 100 according to a first embodiment of the present technical solution is provided.
  • the thermally conductive composite sheet 100 includes a first aluminum alloy layer 110, a graphite sheet 120, an aluminum alloy frame 130, and a second aluminum alloy layer 140.
  • the aluminum alloy frame 130 has an opening 131
  • the graphite sheet 120 is positioned in the opening 131 of the aluminum alloy frame 130 .
  • the aluminum alloy frame 130 and the graphite sheet 120 are interposed on the first aluminum alloy layer 110 and Between the second aluminum alloy layers 140, the first aluminum alloy layer 110 is diffusion-bonded between the graphite sheet 120 and the aluminum alloy frame 130, and between the second aluminum alloy layer 140 and the graphite sheet 120 and the aluminum alloy frame 130. Diffusion bonding, the graphite sheet 120 is covered by the first aluminum alloy layer 110, the second aluminum alloy layer 140, and the aluminum alloy frame 130 as a whole.
  • the thermally conductive composite sheet 100 may have a thickness of less than 1 mm.
  • the thickness of the 110 and second aluminum alloy layers 140 is 0.26 mm to 1.0 mm.
  • the first aluminum alloy layer 110, the aluminum alloy frame 130 and the second aluminum alloy layer 140 may be made of the same material, and may be made of a 6 X X X series aluminum alloy (LD series) or a 1 X X X series aluminum alloy.
  • the aluminum alloy mainly includes aluminum, magnesium, silicon, and the like.
  • the graphite sheet 120 is made of a high thermal conductivity graphite sheet, and the thermal conductivity of the graphite sheet 120 should be greater than 600 W/m.K.
  • the shape of the opening 131 formed by the aluminum alloy frame 130 corresponds to the shape of the graphite sheet 120 such that the graphite sheet 120 can be fitted in the aluminum alloy frame 130.
  • the thickness of the aluminum alloy frame 130 is equal to the thickness of the graphite sheet 120.
  • the first aluminum alloy layer 110 and the second aluminum alloy layer 140 are both rectangular, the aluminum alloy frame 130 is a rectangular frame, and the opening is also rectangular, and the area of the graphite sheet 120 is smaller than The areas of the first aluminum alloy layer 110 and the second aluminum alloy layer 140 are described.
  • the area of the graphite sheet 120 is equal to the area of the opening 131.
  • the thermally conductive composite material sheet 100 is in the form of a flat sheet, and the thermally conductive composite material web 100 is substantially rectangular. It can be understood that, according to actual needs, the thermally conductive composite material sheet 100 can be made into other shapes, such as a circle, a polygon, or the like. Further, the thermally conductive composite material 100 may be formed into a curved sheet-like structure.
  • the first aluminum alloy layer 110 and the second aluminum alloy layer 140 are combined with the contact faces of the graphite sheet 120 and the aluminum alloy frame 130 by diffusion bonding, thereby, aluminum
  • the bonding strength between the alloy and the graphite sheet is good.
  • the aluminum alloy and the graphite have a small density and good thermal conductivity, so that the heat conductive composite material sheet 100 has a light weight and good thermal conductivity, and can be used as a material for designing a thermal control structure, and can improve the electrons connected thereto.
  • the heat dissipation efficiency of components are provided by the technical solution.
  • a second preferred embodiment of the first technical solution of the present invention provides a thermally conductive composite material sheet 200.
  • the heat conductive composite material sheet 200 has a structure similar to that of the heat conductive composite material sheet 100 provided by the first preferred embodiment, and the functions achieved are also substantially the same.
  • the thermally conductive composite sheet 200 includes a first aluminum alloy layer 210, a graphite sheet 220, an aluminum alloy frame 230, and a second aluminum alloy layer 240.
  • the aluminum alloy frame 230 has an opening 231
  • the graphite sheet 220 is positioned in the opening 231 of the aluminum alloy frame 230 .
  • the thermally conductive composite sheet 200 further includes a first transition layer 250 and a second transition layer 260.
  • the first transition layer 250 is disposed between the graphite sheet 220 and the first aluminum alloy layer 210
  • the second transition layer 260 is disposed between the graphite sheet 220 and the second aluminum alloy layer 240 .
  • the first aluminum alloy layer 210 is diffusion-connected with the first transition layer 250
  • the first transition layer 250 is diffusion-connected with the graphite sheet 220
  • the graphite sheet 120 and the second transition layer 260 are diffusion-bonded.
  • the second transition layer 260 is diffusion-bonded to the second aluminum alloy layer 240.
  • the areas of the first transition layer 250 and the second transition layer 260 are the same as the area of the graphite layer 220, and opposite sides of the aluminum alloy frame 230 are respectively associated with the first aluminum alloy layer 210 and the second aluminum alloy layer 240.
  • the diffusion connection is such that the first transition layer 250, the second transition layer 260, and the graphite sheet 220 are covered by the first aluminum alloy layer 210, the second aluminum alloy layer 240, and the aluminum alloy frame 230 as a whole.
  • the thermally conductive composite material sheet 200 is a flat sheet shape, and the thermally conductive composite material web 200 is substantially rectangular. It can be understood that the thermally conductive composite sheet 200 can be made into other shapes such as a circle, a polygon or the like according to actual needs. Further, the thermally conductive composite material 200 may be formed into a curved sheet-like structure.
  • thermally conductive composite material sheet 300 is similar in structure to the thermally conductive composite sheet 100 provided in the first preferred embodiment, and the functions achieved are substantially the same.
  • the thermally conductive composite sheet 300 includes a first aluminum alloy layer 310, a graphite sheet 320, an aluminum alloy frame 330, and a second aluminum alloy layer 340. The difference is that the thermally conductive composite sheet 300 includes a plurality of graphite sheets 320 having a plurality of openings 331. Each of the graphite sheets 320 is correspondingly embedded in an opening 331.
  • the aluminum alloy frame 330 and the graphite sheet 320 are interposed between the first aluminum alloy layer 310 and the second aluminum alloy layer 340, and between the first aluminum alloy layer 310 and the graphite sheet 320 and the aluminum alloy frame 330. Diffusion bonding, the second aluminum alloy layer 340 is diffusion-bonded between the graphite sheet 320 and the aluminum alloy frame 330, and the plurality of graphite sheets 320 are covered by the first aluminum alloy layer 310, the second aluminum alloy layer 340, and the aluminum alloy frame.
  • the 330 is covered as a whole.
  • the thermally conductive composite sheet 300 of the present embodiment may also include a transition layer, which is disposed on opposite sides of each of the graphite sheets 320.
  • a second technical solution of the present invention provides a method of fabricating a thermally conductive composite sheet.
  • a method for fabricating a thermally conductive composite material sheet according to a first preferred embodiment of the second technical solution of the present invention, and a thermally conductive composite material sheet 100 provided by the first preferred embodiment of the first technical solution is as follows.
  • the method for manufacturing the thermally conductive composite material sheet 100 includes the steps of:
  • Step S101 providing two aluminum alloy sheets and one aluminum alloy frame, and mechanically treating and chemically treating the aluminum alloy sheet and the aluminum alloy frame.
  • the aluminum alloy sheet and the aluminum alloy frame have a thickness of 0.26 mm to 1.0 mm.
  • the aluminum alloy sheet and the aluminum alloy frame may be made of the same material, and may be made of a 6 ⁇ ⁇ lanthanum aluminum alloy (LD series) or a 1 X X X series aluminum alloy.
  • the purpose of mechanical treatment and chemical treatment of the aluminum alloy sheet and the aluminum alloy frame is to remove the aluminum oxide layer formed on the surface of the aluminum alloy sheet and the aluminum alloy frame by oxidation to obtain an active aluminum alloy surface.
  • the aluminum alloy sheet and the aluminum alloy frame are mechanically treated.
  • the mechanical treatment includes sanding and polishing to reduce the surface roughness of the aluminum alloy sheet and the aluminum alloy frame.
  • the surface of the aluminum alloy sheet and the aluminum alloy frame may be polished by using 400#, 600#, 1000#, 2000# paper. Then, the surface of the polished aluminum alloy sheet and the aluminum alloy frame is polished with a flannel.
  • the aluminum alloy sheet and the aluminum alloy frame may be placed in acetone to be immersed to remove oil stains on the surface of the aluminum alloy sheet and the aluminum alloy frame.
  • the aluminum alloy sheet and the aluminum alloy frame should be immersed in acetone for more than 10 hours.
  • the aluminum alloy sheet and the aluminum alloy frame are chemically treated.
  • the chemical treatment includes subtractive washing and pickling to remove the aluminum oxide layer on the surface of the aluminum alloy sheet and the aluminum alloy frame to obtain an active alumina surface.
  • the aluminum alloy sheet and the aluminum alloy frame are immersed in an alkali solution having a mass percentage of 10%, such as a sodium hydroxide solution, and the temperature of the alkali solution is kept at about 60 degrees Celsius, and the soaking time is about 5 to 10 minutes, after which Wash with running water.
  • the aluminum alloy sheet and the aluminum alloy frame are immersed in an acid solution having a mass percentage of 25%, such as a nitric acid solution, and the temperature of the acid solution is maintained at 18 degrees Celsius to 24 degrees Celsius for a duration of about 1 minute.
  • an acid solution having a mass percentage of 25% such as a nitric acid solution
  • the aluminum alloy sheet and the aluminum alloy frame were immersed in acetone, and air was isolated to prevent oxidation of the surface of the aluminum alloy sheet and the aluminum alloy frame.
  • Step S102 providing a graphite sheet and performing surface treatment on the graphite sheet.
  • Step S103 placing a graphite sheet in the opening of the aluminum alloy frame, and placing aluminum alloy sheets on opposite sides of the aluminum alloy frame and the graphite sheet to form a laminated structure, and placing the aluminum alloy with the graphite sheet
  • the frame and the two aluminum alloy sheets are placed in the furnace chamber, and the furnace chamber is evacuated.
  • the vacuum is evacuated to a pressure in the furnace chamber to 5 x l 0-3 Pa to 7 x l O-3 Pa.
  • Step S104 the aluminum alloy frame on which the graphite sheet is placed and the two aluminum alloy sheets are diffusion-bonded to obtain a thermally conductive composite material sheet 100.
  • the temperature in the furnace chamber was raised to 530 ° C to 590 ° C, and a pressure of 10 MPa to 15 MPa was applied to the laminated structure to effect diffusion bonding between the graphite sheets and the surfaces in contact with the aluminum alloy. Since the surfaces of the aluminum alloy sheet and the aluminum alloy frame are mechanically treated and chemically treated, they become active aluminum alloy surfaces. In the heated and pressurized state, carbon atoms and aluminum atoms between the active surfaces of the aluminum alloy and between the active surface of the aluminum alloy and the surface of the graphite sheet are mutually dispersed, thereby forming a stable and reliable interconnection.
  • the thermally conductive composite material sheet 200 includes the following steps:
  • step S201 two aluminum alloy sheets and an aluminum alloy frame are provided, and the aluminum alloy sheet and the aluminum alloy frame are mechanically treated and chemically treated.
  • the aluminum alloy tablet aluminum alloy frame is the same as the aluminum alloy sheet and the aluminum alloy frame provided in the previous embodiment. Further, the mechanical treatment and chemical treatment of the aluminum alloy sheet and the aluminum alloy frame are also the same as in the previous embodiment.
  • Step S202 providing a graphite sheet and two transition sheets, and performing surface treatment on the graphite sheet.
  • the transition piece may be made of titanium or a titanium-containing alloy, and the transition piece may have the same shape as the graphite piece, and the transition piece has the same size as the graphite piece.
  • the transition piece can also be made of other transition metals.
  • the transition sheet has a thickness of from 20 micrometers to 40 micrometers.
  • Step S203 placing two transition sheets on opposite sides of the graphite sheet, so that the graphite sheet and the transition sheet are diffusion-bonded to obtain a composite layer.
  • the two transition sheets are placed on opposite sides of the graphite sheet and stacked neatly so that the transition sheet completely overlaps the graphite sheet.
  • the two transition sheets and the graphite sheets after stacking were placed in a furnace chamber, and evacuated to a pressure of 5 x lO-3Pa to 7 x lO-3Pa. Then increasing the furnace temperature to 850 degrees Celsius to 930 degrees Celsius, and applying a pressure of ll MPa to 12 MPa between the two transition sheets for a duration of 100 minutes to 170 minutes, such that the transition sheet is in contact with the graphite sheet. Fully spread.
  • Step S204 placing the composite layer in the opening of the aluminum alloy frame, and placing aluminum alloy sheets on opposite sides of the aluminum alloy frame and the graphite sheet to form a laminated structure, and vacuuming.
  • the aluminum alloy frame and the two aluminum alloy sheets on which the graphite sheets are placed are placed in a furnace chamber, and the furnace chamber is evacuated to a pressure of 5xlO-3Pa to 7xlO-3Pa.
  • Step S205 the aluminum alloy frame on which the composite layer is placed and the two aluminum alloy sheets are diffusion-bonded to obtain a thermally conductive composite material sheet 100.
  • the temperature in the furnace chamber was raised to 530 ° C to 590 ° C, and a pressure of 10 MPa to 15 MPa was applied to the laminate structure to cause diffusion bonding between the surfaces of the transition sheet in contact with the aluminum alloy. Since the surfaces of the aluminum alloy sheet and the aluminum alloy frame are mechanically treated and chemically treated, they become active aluminum alloy surfaces. In the heated and pressurized state, carbon atoms and aluminum atoms between the active surfaces of the aluminum alloy and between the active surface of the aluminum alloy and the surface of the graphite sheet are mutually dispersed, thereby forming a stable and reliable interconnection.
  • a method for fabricating a thermally conductive composite material sheet according to a third preferred embodiment of the second technical solution of the present invention the thermal conductive composite material provided by the third preferred embodiment of the first technical solution is as follows.
  • the sheet 300 is taken as an example for description.
  • the manufacturing method of the heat conductive composite material sheet 300 includes the steps of:
  • Step S301 providing two aluminum alloy sheets and an aluminum alloy frame, the aluminum alloy frame having a plurality of openings, and mechanically treating and chemically treating the aluminum alloy sheets and the aluminum alloy frames.
  • the aluminum alloy sheet and the aluminum alloy frame have a thickness of 0.26 mm to 1.0 mm.
  • the aluminum alloy sheet and The aluminum alloy frame can be made of the same material, and can be made of 6xx x series aluminum alloy (LD series) or 1 series aluminum alloy.
  • the purpose of mechanical treatment and chemical treatment of the aluminum alloy sheet and the aluminum alloy frame is to remove the aluminum oxide layer formed on the surface of the aluminum alloy sheet and the aluminum alloy frame by oxidation to obtain an active aluminum alloy surface.
  • a plurality of openings are formed in the aluminum alloy frame. In the present embodiment, the plurality of openings are arranged in a row, and the shapes and sizes of the plurality of openings are the same.
  • the mechanical treatment and chemical treatment of the aluminum alloy sheet and the aluminum alloy frame are also the same as the step S101 in the first embodiment, and will not be described herein.
  • step S302 a plurality of graphite sheets are provided, and each of the graphite sheets is subjected to surface treatment.
  • each of the graphite sheets correspond to the shape and size of the openings formed in the aluminum alloy frame.
  • the processing method of the graphite sheet is the same as the step S102 in the first embodiment, and details are not described herein again.
  • Step S303 placing each graphite sheet in a corresponding opening of the aluminum alloy frame, and respectively placing aluminum alloy sheets on opposite sides of the aluminum alloy frame and the graphite sheet to form a laminated structure, and laminating the laminated structure Placed in the furnace cavity and vacuumed the furnace cavity.
  • the vacuum is applied to the pressure in the furnace chamber to 5x lO-3Pa to 7xl0-3Pa o
  • Step S304 the aluminum alloy frame on which the graphite sheet is placed and the two aluminum alloy sheets are diffusion-bonded to obtain a thermally conductive composite material sheet 300.
  • the temperature in the furnace chamber was raised to 530 ° C to 590 ° C, and a pressure of 10 MPa to 15 MPa was applied to the laminated structure to effect diffusion bonding between the graphite sheets and the surfaces in contact with the aluminum alloy. Since the surfaces of the aluminum alloy sheet and the aluminum alloy frame are mechanically treated and chemically treated, they become active aluminum alloy surfaces. In the heated and pressurized state, carbon atoms and aluminum atoms between the active surfaces of the aluminum alloy and between the active surface of the aluminum alloy and the surface of the graphite sheet are mutually dispersed, thereby forming a stable and reliable interconnection.
  • the heat conductive composite material sheet provided by the invention and the manufacturing method thereof have the advantages of high thermal conductivity of the graphite sheet and the aluminum alloy, so that the heat conductive composite material sheet has good thermal conductivity and light weight, and can be widely used in the field of thermal control technology and electronics. Component packaging technology field. After the surface of the aluminum alloy sheet in contact with the graphite sheet is mechanically treated and chemically treated, the aluminum oxide layer on the surface of the aluminum alloy can be effectively removed to form an activated surface of the aluminum alloy.
  • the aluminum alloy is realized by means of diffusion bonding under vacuum conditions The combination with the graphite sheet enables seamless welding and high quality bonding.
  • the method for manufacturing the thermally conductive composite material sheet provided by the invention is simple in implementation, suitable for mass production, short in production cycle, low in production cost and high in production efficiency.

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Abstract

本发明公开了一种导热复合材料片(100),包括第一铝合金层(110)、至少一个石墨片(120)、铝合金框(130)及第二铝合金层(140),所述铝合金框(130)具有至少一个开口(131),所述石墨片(120)定位于所述铝合金框(130)的开口(131)内,所述铝合金框(130)及石墨片(120)夹设于所述第一铝合金层(110)和第二铝合金层(140)之间,所述第一铝合金层(110)与石墨片(120)及铝合金框(130)之间扩散连接,所述第二铝合金层(140)与石墨片(120)及铝合金框(130)之间扩散连接,所述石墨片(120)被所述第一铝合层(110)、第二铝合金层(140)及铝合金框(130)包覆,成为一个整体。本发明还提供所述导热复合材料片的制作方法。本发明提供的导热复合材料片及其制作方法,能够将高导热性铝合金与石墨进行连接,并具有较低的生产成本。

Description

导热复合材料片及其制作方法 本发明要求 2013 年 12月 27 日递交的发明名称为 "导热复合材料片及 其制作方法" 的申请号 201310738145.7的在先申请优先权, 上述在先申请的 内容以引入的方式并入本文本中。 技术领域
本发明涉及热控制技术领域,特别涉及一种高导热特性的导热复合材料片 及其制作方法。 背景技术
在电子元器件散热结构中, 强度较高、 热导率较高的锻造铝合金材料, 如 美国牌号 6XXX系列 ( 6061、 6063 ), 国内牌号 LD系列铝合金, 常被用于散 热翅片、 热沉框架等结构。 6XXX系列铝合金是一类可热处理强化的中高强度 铝合金, 具有一系列优良的综合性能: 良好的工艺性和耐蝕性、 足够的韧性, 可进行阳极氧化着色、 无应力腐蚀破裂倾向, 加之其比强度高、 导热性好等特 点, 能够制备出多种具有特殊用途的结构或功能铝合金构件, 在航空航天、 交 通运输、 电子行业、 建筑装饰和体育器材等领域有着广泛的应用。
高导热石墨片是一种全新的高导热散热材料。 上世纪末本世纪初, 美国、 日本发展了高导热沥青基石墨材料, 并开发了冷压高导热石墨片、 高导热沥青 基石墨纤维、 高导热中间相沥青石墨泡沫等产品, 热导率从 1000W/m.K发展 到 1500W/m.K。 特别是冷压高导热石墨片已应用于电子元件封装盖板。 高导 热石墨片由于具有沿垂直于石墨片平面法线方向上的均匀导热性能,可在提高 散热效率的同时改进电子元件(组件)的性能。 且高导热石墨片不老化, 不脆 化, 适用于大多数化学品介质, 现已大量应用于大规模集成电路、 高功率密度 电子器件、 电脑、 3G智能手机、 尖端电子仪器等导热、 散热元件; 在航太、 航空、 电脑、 医疗、 通讯行业和电子工业领域也有良好的市场前景。
铝和石墨的相容性很差, 这包含两个方面的问题, 首先是液体铝与石墨的 润湿性差,金属铝液不能在石墨基板上铺展。其次, 当合成温度超过 500 °C时, 铝和碳之间会发生化学反应, 生成脆性的碳化物反应层, 随合成温度的进一步 提高, 化学反应加重, 严重削弱石墨自身的导热性能, 同时也引起复合材料性 能的退化。
传统热压可以制造高性能材料, 但对如纯氮化物、 碳化物、 氧化物或接近 100 %的理论密度硼化物等材料, 特别是当需用高体积分数的高导热陶瓷或金 刚石、石墨等与金属基体混合复合时,很难通过粉末烧结致密或液相处理技术 进行制备。并且,用这项技术的生产力相当有限的,热处理温度高达至 2200 °C, 周期时间通常为 6小时或 12小时, 生产的工艺复杂, 生产周期长。 发明内容
本发明实施例所要解决的技术问题在于提供一种导热复合材料片及其制 作方法, 能够将高导热性铝合金与石墨进行连接, 并具有较低的生产成本。
为了实现上述目的, 本发明实施方式提供如下技术方案:
第一方面, 提供了一种导热复合材料片。
导热复合材料片, 包括第一铝合金层、 至少一个石墨片、 铝合金框及第二 铝合金层, 所述铝合金框具有至少一个开口, 所述石墨片定位于所述铝合金框 的开口内,所述铝合金框及石墨片夹设于所述第一铝合金层和第二铝合金层之 间, 所述第一铝合金层与石墨片及铝合金框之间扩散连接, 所述第二铝合金层 与石墨片及铝合金框之间扩散连接, 所述石墨片被所述第一铝合层、 第二铝合 金层及铝合金框包覆, 成为一个整体。
在第一方面的第一种可能的实现方式中, 所述第一铝合金层、 第二铝合金 层及铝合金框的材料相同,
在第一方面的第二种可能的实现方式中,所述第一铝合金层的厚度为 0.26 毫米至 1.0毫米。
在第一方面的第三种可能的实现方式中,所述第二铝合金层的厚度为 0.26 毫米至 1.0毫米。
在第一方面的第四种可能的实现方式中,所述铝合金框内具有一个所述开 口, 所述石墨片的数量也为一个, 所述石墨片收容于所述开口内。
在第一方面的第五种可能的实现方式中,所述铝合金框内具有多个所述开 口。 所述石墨片的数量也为多个, 每个所述石墨片对应收容于一个开口内。 第二方面, 提供一种导热复合材料片。
导热复合材料片, 包括第一铝合金层、 至少一个石墨片、 第一过渡层、 第 二过渡层、 铝合金框及第二铝合金层, 所述铝合金框具有至少一个开口, 所述 石墨片定位于所述铝合金框的开口内,所述铝合金框及石墨片夹设于所述第一 铝合金层和第二铝合金层之间,所述第一过渡层设置于所述石墨片与第一铝合 金层之间, 所述第二过渡层设置于所述第二铝合金层与石墨片之间, 所述第一 铝合金层与第一过渡层之间扩散连接, 所述第一过渡层与石墨片之间扩散连 接, 所述石墨片与第二过渡层之间扩散连接, 所述第二过渡层与第二铝合金层 之间扩散连接,所述铝合金框的相对两侧分别与所述第一铝合金层和第二铝合 金层扩散连接,从而使得第一过渡层、第二过渡层及石墨片被所述第一铝合层、 第二铝合金层及铝合金框包覆, 成为一个整体。
在第二方面的第一种可能实现方式中, 所述所述第一铝合金层、 第二铝合 金层及铝合金框的材料相同,
在第二方面的第二种可能实现方式中, 所述第一铝合金层的厚度为 0.26 毫米至 1.0毫米。
在第二方面的第三种可能实现方式中, 第二铝合金层的厚度为 0.26 亳米 至 1.0毫米。
在第二方面的第四种可能实现方式中, 所述铝合金框内具有一个所述开 口, 所述石墨片的数量也为一个, 所述石墨片收容于所述开口内。
在第二方面的第五种可能实现方式中, 所述铝合金框内具有多个所述开 口。 所述石墨片的数量也为多个, 每个所述石墨片对应收容于一个开口内。
在第二方面的第六种可能实现方式中,所述第一过渡层釆用钛或含钛的合 金制成。
在第二方面的第七种可能实现方式中,所述第二过渡层釆用钛或含钛的合 金制成。
在第二方面的第八种可能实现方式中, 所述第一过渡层的厚度为 20微米 至 40微米。
在第二方面的第九种可能实现方式中, 所述第二过渡层的厚度为 20微米 至 40微米。
第三方面, 提供一种导热复合材料片的制作方法。
导热复合材料片的制作方法, 包括步骤:提供两个铝合金片及一个铝合金 框, 所述铝合金框具有至少一个开口, 并对铝合金片及铝合金框进行机械处理 及化学处理,以降低所述铝合金片表面及铝合金框表面的粗糙度并得到活性的 铝合金表面; 提供至少一个石墨片; 将石墨片放置于所述 4吕合金框的开口内, 并在铝合金框及石墨片的相对两侧分别放置铝合金片形成叠层结构,并将所述 叠层结构放置于炉腔内, 并将炉腔内抽真空; 以及对所述叠层结构进行加热加 压, 将所述放置有石墨片的铝合金框及两个铝合金片之间进行扩散连接,从而 得到导热复合材料片。
在第三方面的第一种可能实现方式中, 所述机械处理包括打磨及抛光, 以 降低所述铝合金片表面及铝合金表面的粗糙度。
在第三方面的第二种可能实现方式中, 所述化学处理包括酸洗及碱洗, 以 得到活性的铝合金表面。
在第三方面的第三种可能实现方式中, 将所述炉腔内抽真空至压强为
5xlO-3Pa至 7xlO-3Pa。
在第三方面的第四种可能实现方式中,将所述放置有石墨片的铝合金框及 两个铝合金片之间进行扩散连接时, 将炉腔内的温度升至 530 摄氏度至 590 摄氏度, 并对所述叠层结构施加 lOMPa至 15MPa的压力, 使得所述石墨片与 铝合金接触的表面之间进行扩散连接。
在第三方面的第五种可能实现方式中,所述铝合金框内的所述开口的个数 为多个,所述石墨片的个数也为多个,每个石墨片对应收容于一个所述开口内。
第四方面, 提供一种导热复合材料片的制作方法。
导热复合材料片的制作方法, 包括步骤:提供两个铝合金片及铝合金框, 并对铝合金片及铝合金框进行机械处理及化学处理,以降低所述铝合金片表面 及铝合金表面的粗糙度,并得到活性的铝合金表面;提供石墨片及两个过渡片; 将两个过渡片分别放置于石墨片相对两侧,使得所述石墨片与所述过渡片进行 扩散连接, 得到复合层; 将所述复合层放置于所述铝合金框的开口中, 并在铝 合金框及石墨片的相对两侧分别放置铝合金片形成叠层结构,放置于炉腔内并 抽真空处理;以及将所述放置有复合层的铝合金框及两个铝合金片之间进行扩 散连接, 从而得到导热复合材料片。
在第四方面的第一种可能实现方式中, 所述机械处理包括打磨及抛光, 以 降低所述铝合金片表面及铝合金表面的粗糙度。
在第四方面的第二种可能实现方式中, 所述化学处理包括酸洗及碱洗, 以 得到活性的铝合金表面。
在第四方面的第三种可能实现方式中, 将所述炉腔内抽真空至压强为 5xlO-3Pa至 7xlO-3Pa。
在第四方面的第四种可能实现方式中,将所述放置有复合层的铝合金框及 两个铝合金片之间进行扩散连接时, 将炉腔内的温度升至 530 摄氏度至 590 摄氏度, 并对所述叠层结构施加 lOMPa至 15MPa的压力, 使得所述石墨片与 铝合金接触的表面之间进行扩散连接。
在第四方面的第五种可能实现方式中,将两个过渡片分别放置于石墨片相 对两侧并堆叠整齐, 将堆叠后的两个过渡片及石墨片放置于炉腔内,抽真空至 压强为 5x lO-3Pa至 7x lO-3Pa, 然后升高炉温至 850摄氏度至 830摄氏度, 并 在所述两过渡片之间施加 llMPa至 12MPa的压力,持续时间为 100分钟至 170 分钟。
本发明提供的导热复合材料片及其制作方法,由于石墨片及铝合金均具有 高的导热系数, 从而所述导热复合材料片导热性能好, 质量轻, 能够广泛应用 于热控制技术领域及电子元器件封装技术领域。所述铝合金片与石墨片接触的 表面经过机械处理及化学处理后, 能够有效地去除铝合金表面的氧化铝层, 形 成铝合金的活化表面。通过釆用在真空条件下扩散连接的方式实现所述铝合金 与石墨片之间的结合, 可以实现无缝焊接, 并且结合的质量高。 从而使得得到 的导热复合材料片即使在复杂且恶劣的环境下使用, 也不会出现鼓胀、 变形及 传热失效等问题。 进一步的, 本发明提供的导热复合材料片制作方法实现方式 简单, 适用于量产, 生产的周期短, 具有较低的生产成本并具有较高的生产效 率。 附图说明 为了更清楚地说明本发明实施例的技术方案,下面将对实施例描述中所需 要使用的附图作简单地介绍, 显而易见地, 下面描述中的附图仅仅是本发明的 一些实施例, 对于本领域普通技术人员来讲, 在不付出创造性劳动的前提下, 还可以根据这些附图获得其他的附图。
图 1是本发明第一较佳实施方式提供的导热复合材料片的剖面示意图; 图 2是图 1的导热复合材料片的分解示意图。
图 3是本发明第二较佳实施方式提供的导热复合材料的剖面示意图; 图 4是图 3的导热复合材料片的分解示意图;
图 5是本发明第三较佳实施方式提供的导热复合材料片的剖面示意图; 图 6是图 5的导热复合材料片的分解示意图;
图 7是本技术方案中铝合金连接处的电子显微镜照片;
图 8是本技术方案中石墨与铝合金连接处的电子显微镜照片;
图 9 是本发明第一较佳实施方式提供的导热复合材料片的制作方法的流 程图;
图 10是本发明第二较佳实施方式提供的导热复合材料片的制作方法的流 程图;
图 11是本发明第三较佳实施方式提供的导热复合材料片的制作方法的流 程图。 具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清 楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而不是 全部的实施例。基于本发明中的实施例, 本领域普通技术人员在没有做出创造 性劳动前提下所获得的所有其他实施例, 都属于本发明保护的范围。
本发明的第一技术方案提供一种导热复合材料片。 请参阅图 1至图 2, 本 技术方案的第一实施方式提供的导热复合材料片 100。 所述导热复合材料片 100包括第一铝合金层 110、 石墨片 120、 铝合金框 130及第二铝合金层 140。 所述铝合金框 130具有开口 131, 所述石墨片 120定位于所述铝合金框 130的 开口 131内。所述铝合金框 130及石墨片 120夹设于所述第一铝合金层 110和 第二铝合金层 140之间, 所述第一铝合金层 110与石墨片 120及铝合金框 130 之间扩散连接,所述第二铝合金层 140与石墨片 120及铝合金框 130之间扩散 连接, 石墨片 120被所述第一铝合层 110、 第二铝合金层 140及铝合金框 130 包覆成为一个整体。
所述导热复合材料片 100的厚度可以达到小于 1毫米。所述第一铝合金层
110和第二铝合金层 140的厚度为 0.26毫米至 1.0毫米。所述第一铝合金层 110、 铝合金框 130及第二铝合金层 140可以采用相同材料制成,具体可以采用 6 X X X 系铝合金(LD系列)或者 1 X X X系铝合金制成。 所述铝合金主要包括铝、 镁及 硅等。 所述石墨片 120采用高导热石墨片制成, 所述石墨片 120的导热系数应 大于 600W/m.K。 所述铝合金框 130形成的开口 131的形状与所述石墨片 120 的形状相对应, 以使得所述石墨片 120可以配合镶嵌于所述铝合金框 130内。 优选地, 所述铝合金框 130的厚度与所述石墨片 120的厚度相等。 本实施方式 中, 所述第一铝合金层 110和第二铝合金层 140 均为长方形, 所述铝合金框 130为长方形框, 所述开口也为长方形, 所述石墨片 120的面积小于所述第一 铝合金层 110和第二铝合金层 140的面积。所述石墨片 120的面积与所述开口 131的面积相等。
本实施方式中, 所述导热复合材料片 100为平面的片状, 所述导热复合材 料片 100大致为长方形。 可以理解的是, 根据实际的需要, 所述导热复合材料 片 100可以一制作为其他形状, 如圓形、 多边形等。 并且, 所述导热复合材料 100也可以制作成曲面的片状结构。
本技术方案提供的导热复合材料片, 所述第一铝合金层 110、 第二铝合金 层 140与石墨片 120及铝合金框 130的接触面之间通过扩散连接的方式相互结 合, 从而, 铝合金与石墨片之间的结合强度好。 并且, 铝合金及石墨的密度均 较小, 且导热性能好, 从而所述的导热复合材料片 100的重量较轻, 导热性能 好, 可以作为热控结构设计的材料, 能够提高与其连接的电子元器件的散热效 率。
请参阅图 3及图 4, 本发明第一技术方案的第二较佳实施方式提供一种导 热复合材料片 200。 所述导热复合材料片 200与第一较佳实施方式提供的导热 复和材料片 100 的结构相近, 实现的功能也大致相同。 所述导热复合材料片 200包括第一铝合金层 210、 石墨片 220、 铝合金框 230及第二铝合金层 240。 所述铝合金框 230具有开口 231 , 所述石墨片 220定位于所述铝合金框 230的 开口 231内。 不同之处在于, 所述导热复合材料片 200还包括第一过渡层 250 和第二过渡层 260。所述第一过渡层 250设置于石墨片 220与第一铝合金层 210 之间, 所述第二过渡层 260设置于石墨片 220与第二铝合金层 240之间。 所述 第一铝合金层 210与第一过渡层 250之间扩散连接,所述第一过渡层 250与石 墨片 220之间扩散连接, 所述石墨片 120与第二过渡层 260之间扩散连接, 所 述第二过渡层 260与第二铝合金层 240之间扩散连接。 所述第一过渡层 250 和第二过渡层 260的面积与石墨层 220的面积相同 ,所述铝合金框 230的相对 两侧分别与所述第一铝合金层 210和第二铝合金层 240扩散连接,从而使得第 一过渡层 250、 第二过渡层 260及石墨片 220被所述第一铝合金层 210、 第二 铝合金层 240及铝合金框 230包覆成为一个整体。
本实施方式中, 所述导热复合材料片 200为平面的片状, 所述导热复合材 料片 200大致为长方形。 可以理解的是, 根据实际的需要, 所述导热复合材料 片 200 可以制作为其他形状, 如圓形、 多边形等。 并且, 所述导热复合材料 200也可以制作成曲面的片状结构。
请参阅图 5及图 6, 本发明第一技术方案第三实施方式提供的导热复合材 料片 300。 所述导热复合材料片 300与第一较佳实施方式提供的导热复和材料 片 100的结构相近, 实现的功能也大致相同。 所述导热复合材料片 300包括第 一铝合金层 310、 石墨片 320、 铝合金框 330及第二铝合金层 340。 不同之处 在于, 所述导热复合材料片 300包括多个石墨片 320 , 所述铝合金框 330具有 多个开口 331。每个石墨片 320对应嵌设于一个开口 331内。所述铝合金框 330 及石墨片 320夹设于所述第一铝合金层 310和第二铝合金层 340之间,所述第 一铝合金层 310与石墨片 320及铝合金框 330之间扩散连接,所述第二铝合金 层 340与石墨片 320及铝合金框 330之间扩散连接,多个石墨片 320被所述第 一铝合层 310、 第二铝合金层 340及铝合金框 330包覆成为一个整体。 可以理 解的是, 本实施方式的导热复合材料片 300也可以包括过渡层, 所述过渡层对 应设置于每个石墨片 320的相对两侧。
本实施方式可以用于制作面积较大的导热复合材料片。 本发明第二技术方案提供导热复合材料片的制作方法。请参阅图 7及图 2, 本发明第二技术方案的第一较佳实施方式提供的导热复合材料片制作方法,下 面以制作第一技术方案第一较佳实施方式提供的导热复合材料片 100 为例来 进行说明, 所述导热复合材料片 100的制作方法包括步骤:
步骤 S101, 提供两个铝合金片及一个铝合金框, 并对铝合金片及铝合金 框进行机械处理及化学处理。
所述铝合金片及铝合金框的厚度为 0.26毫米至 1.0毫米。所述铝合金片及 铝合金框可以采用相同材料制成, 具体可以釆用 6χ χ χ系铝合金(LD系列)或 者 1 X X X系铝合金制成。 对所述铝合金片及铝合金框进行机械处理及化学处理 的目的是去除铝合金片及铝合金框表面的由于氧化而形成的氧化铝层,得到活 性的铝合金表面。
首先, 对所述铝合金片及铝合金框进行机械处理。 所述机械处理包括打磨 及抛光,降低所述铝合金片及铝合金框的表面粗糙度。具体的,在进行打磨时, 可以先后采用 400#、 600#、 1000#、 2000#的 、纸对铝合金片及铝合金框表面 进行打磨。 然后, 采用绒布对打磨后的铝合金片及铝合金框表面进行抛光。
在抛光处理之后, 还可以包括将铝合金片及铝合金框放置于丙酮中浸泡, 以去除铝合金片及铝合金框表面的油污等。所述铝合金片及铝合金框浸泡于丙 酮的时间应大于 10小时。
然后, 对所述铝合金片及铝合金框进行化学处理。 所述化学处理包括减洗 及酸洗, 以去除所述铝合金片及铝合金框表面的氧化铝层, 得到活性的氧化铝 表面。先将铝合金片及铝合金框浸泡于质量百分含量为 10%的碱溶液中,如氢 氧化钠溶液,并保持碱溶液的温度约为 60摄氏度,浸泡时间约为 5至 10分钟, 之后用流动水清洗。 然后,将铝合金片及铝合金框浸泡于质量百分含量为 25% 的酸溶液中, 如硝酸溶液, 并保持酸溶液的温度为 18摄氏度至 24摄氏度, 持 续时间约为 1分钟。
处理之后, 将所述铝合金片及铝合金框浸泡于丙酮中, 并隔离空气, 以防 止所述铝合金片及铝合金框表面被氧化。
步骤 S102 , 提供石墨片, 并对石墨片进行表面处理。
对石墨片进行表面处理包括对石墨片表面进行打磨及擦拭。 具体的, 釆用 2000#砂纸等石墨片表面进行打磨, 然后, 采用丙酮对石墨片的表面进行擦拭。 步骤 S103 , 将石墨片放置于所述铝合金框的开口内, 并在铝合金框及石 墨片的相对两侧分别放置铝合金片形成叠层结构,并将所述放置有石墨片的铝 合金框及两个铝合金片放置于炉腔内,并将炉腔内抽真空处理。本实施方式中, 抽真空至炉腔内压强至 5 x l 0-3Pa至 7 x l O-3Pa。
步骤 S104, 将所述放置有石墨片的铝合金框及两个铝合金片之间进行扩 散连接, 从而得到导热复合材料片 100。
在抽真空之后, 将炉腔内的温度升至 530摄氏度至 590摄氏度, 并对所述 叠层结构施加 lOMPa至 15MPa的压力, 使得所述石墨片与铝合金接触的表面 之间进行扩散连接。由于铝合金片及铝合金框的表面均经过机械处理及化学处 理, 成为活性的铝合金表面。 在加温及加压的状态下, 所述铝合金的活性表面 之间以及铝合金的活性表面与石墨片表面之间的碳原子与铝原子之间相互扩 散, 从而形成稳定可靠的相互连接。
请一并参阅图 7及图 8, 经过扩散连接之后, 铝合金片与石墨片的连接面 之间紧密结合。所述铝合金片与铝合金框的连接面经过扩散连接之后成为一个 整体,通过电子显微镜的照片中也不能看观察到铝合金片与铝合金框的相互结 合的连接面。
请参阅图 10及图 4, 本发明第二技术方案的第二较佳实施方式提供的导 热复合材料片制作方法,下面以制作第一技术方案第二较佳实施方式提供的导 热复合材料片 200为例来进行说明,所述导热复合材料片 200的制作方法包括 步骤:
步骤 S201, 提供两个铝合金片及铝合金框, 并对铝合金片及铝合金框进 行机械处理及化学处理。
所述铝合金片剂铝合金框与前一实施方式提供的铝合金片及铝合金框均 相同。 并且, 对铝合金片及铝合金框的机械处理和化学处理也与前一实施方式 相同。
步骤 S202, 提供石墨片及两个过渡片, 并对石墨片进行表面处理。
本步骤中, 对石墨片的处理方式与第一实施方式中的步骤 S102的处理方 式相同, 此处不再赘述。 所述过渡片可以采用钛或含钛的合金制成,所述过渡片的形状可以与石墨 片的形状相同, 所述过渡片的尺寸也与所述石墨片的尺寸相同。 所述过渡片也 可以采用其他过渡金属制成。 所述过渡片的厚度为 20微米至 40微米。
步骤 S203, 将两个过渡片分别放置于石墨片相对两侧, 使得所述石墨片 与所述过渡片进行扩散连接, 得到复合层。
将两个过渡片分别放置于石墨片相对两侧并堆叠整齐,使得所述过渡片与 石墨片完全重叠。 将堆叠后的两个过渡片及石墨片放置于炉腔内,抽真空至压 强为 5x lO-3Pa至 7x lO-3Pa。 然后升高炉温至 850摄氏度至 930摄氏度, 并在 所述两过渡片之间施加 llMPa至 12MPa的压力, 持续时间为 100分钟至 170 分钟, 使得所述过渡片与石墨片相接触的表面的原子充分进行扩散。
步骤 S204, 将所述复合层放置于所述铝合金框的开口中, 并在铝合金框 及石墨片的相对两侧分别放置铝合金片形成叠层结构, 并抽真空处理。
将所述放置有石墨片的铝合金框及两个铝合金片放置于炉腔内,并将炉腔 内抽真空至压强至 5xlO-3Pa至 7xlO-3Pa。
步骤 S205, 将所述放置有复合层的铝合金框及两个铝合金片之间进行扩 散连接, 从而得到导热复合材料片 100。
在抽真空之后, 将炉腔内的温度升至 530摄氏度至 590摄氏度, 并对所述 叠层结构施加 lOMPa至 15MPa的压力, 使得所述过渡片与铝合金接触的表面 之间进行扩散连接。由于铝合金片及铝合金框的表面均经过机械处理及化学处 理, 成为活性的铝合金表面。 在加温及加压的状态下, 所述铝合金的活性表面 之间以及铝合金的活性表面与石墨片表面之间的碳原子与铝原子之间相互扩 散, 从而形成稳定可靠的相互连接。
请一并参阅图 11及图 6, 本发明第二技术方案的第三较佳实施方式提供 的导热复合材料片制作方法,下面以制作第一技术方案第三较佳实施方式提供 的导热复合材料片 300为例来进行说明,所述导热复合材料片 300的制作方法 包括步骤:
步骤 S301, 提供两个铝合金片及一个铝合金框, 所述铝合金框具有多个 开口, 并对铝合金片及铝合金框进行机械处理及化学处理。
所述铝合金片及铝合金框的厚度为 0.26毫米至 1.0毫米。所述铝合金片及 铝合金框可以采用相同材料制成, 具体可以采用 6xx x系铝合金(LD系列)或 者 1 系铝合金制成。 对所述铝合金片及铝合金框进行机械处理及化学处理 的目的是去除铝合金片及铝合金框表面的由于氧化而形成的氧化铝层,得到活 性的铝合金表面。 所述铝合金框内形成有多个开口。 在本实施方式中, 所述多 个开口阵列排布, 多个开口的形状及大小均相同。
本步骤中,对铝合金片及铝合金框的机械处理和化学处理也与第一实施方 式中步骤 S101相同, 此处不再赘述。
步骤 S302, 提供多个石墨片, 并对每个石墨片进行表面处理。
每个石墨片的形状与大小与所述铝合金框内形成的开口的形状及大小相 对应。
本步骤中, 对石墨片的处理方法与第一实施方式中步骤 S102相同, 此处 不再赘述。
步骤 S303, 将每个石墨片放置于所述铝合金框的对应一个开口内, 并在 铝合金框及石墨片的相对两侧分别放置铝合金片形成叠层结构,并将所述叠层 结构放置于炉腔内, 并将炉腔内抽真空处理。 本实施方式中, 抽真空至炉腔内 压强至 5x lO-3Pa至 7xl0-3Pao
步骤 S304, 将所述放置有石墨片的铝合金框及两个铝合金片之间进行扩 散连接, 从而得到导热复合材料片 300。
在抽真空之后, 将炉腔内的温度升至 530摄氏度至 590摄氏度, 并对所述 叠层结构施加 lOMPa至 15MPa的压力, 使得所述石墨片与铝合金接触的表面 之间进行扩散连接。由于铝合金片及铝合金框的表面均经过机械处理及化学处 理, 成为活性的铝合金表面。 在加温及加压的状态下, 所述铝合金的活性表面 之间以及铝合金的活性表面与石墨片表面之间的碳原子与铝原子之间相互扩 散, 从而形成稳定可靠的相互连接。
本发明提供的导热复合材料片及其制作方法,由于石墨片及铝合金均具有 高的导热系数, 从而所述导热复合材料片导热性能好, 质量轻, 能够广泛应用 于热控制技术领域及电子元器件封装技术领域。所述铝合金片与石墨片接触的 表面经过机械处理及化学处理后, 能够有效地去除铝合金表面的氧化铝层, 形 成铝合金的活化表面。通过釆用在真空条件下扩散连接的方式实现所述铝合金 与石墨片之间的结合, 可以实现无缝焊接, 并且结合的质量高。 从而使得得到 的导热复合材料片即使在复杂且恶劣的环境下使用, 也不会出现鼓胀、 变形及 传热失效等问题。 进一步的, 本发明提供的导热复合材料片制作方法实现方式 简单, 适用于量产, 生产的周期短, 具有较低的生产成本并具有较高的生产效 率。
以上所述的实施方式, 并不构成对该技术方案保护范围的限定。任何在上 述实施方式的精神和原则之内所作的修改、等同替换和改进等, 均应包含在该 技术方案的保护范围之内。

Claims

权 利 要 求
1. 一种导热复合材料片, 包括第一铝合金层、 至少一个石墨片、 铝合金 框及第二铝合金层, 所述铝合金框具有至少一个开口, 所述石墨片定位于所述 铝合金框的开口内,所述铝合金框及石墨片夹设于所述第一铝合金层和第二铝 合金层之间, 所述第一铝合金层与石墨片及铝合金框之间扩散连接, 所述第二 铝合金层与石墨片及铝合金框之间扩散连接, 所述石墨片被所述第一铝合层、 第二铝合金层及铝合金框包覆, 成为一个整体。
2. 如权利要求 1所述的导热复合材料片, 其特征在于, 所述第一铝合金 层、 第二铝合金层及铝合金框的材料相同。
3. 如权利要求 1所述的导热复合材料片, 其特征在于, 所述第一铝合金 层的厚度为 0.26毫米至 1.0毫米。
4. 如权利要求 1所述的导热复合材料片, 其特征在于, 所述第二铝合金 层的厚度为 0.26毫米至 1.0毫米。
5. 如权利要求 1所述的导热复合材料片, 其特征在于, 所述铝合金框内 具有一个所述开口, 所述石墨片的数量也为一个, 所述石墨片收容于所述开口 内。
6. 如权利要求 1所述的导热复合材料片, 其特征在于, 所述铝合金框内 具有多个所述开口, 所述石墨片的数量也为多个, 每个所述石墨片对应收容于 一个开口内。
7. 一种导热复合材料片, 包括第一铝合金层、 至少一个石墨片、 第一过 渡层、 第二过渡层、 铝合金框及第二铝合金层, 所述铝合金框具有至少一个开 口, 所述石墨片定位于所述铝合金框的开口内, 所述铝合金框及石墨片夹设于 所述第一铝合金层和第二铝合金层之间,所述第一过渡层设置于所述石墨片与 第一铝合金层之间, 所述第二过渡层设置于所述第二铝合金层与石墨片之间, 所述第一铝合金层与第一过渡层之间扩散连接,所述第一过渡层与石墨片之间 扩散连接, 所述石墨片与第二过渡层之间扩散连接, 所述第二过渡层与第二铝 合金层之间扩散连接,所述铝合金框的相对两侧分别与所述第一铝合金层和第 二铝合金层扩散连接, 从而使得第一过渡层、 第二过渡层及石墨片被所述第一 铝合层、 第二铝合金层及铝合金框包覆, 成为一个整体。
8. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述所述第一铝 合金层、 第二铝合金层及铝合金框的材料相同。
9. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述第一铝合金 层的厚度为 0.26毫米至 1.0毫米。
10. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述第二铝合金 层的厚度为 0.26毫米至 1.0毫米。
11. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述铝合金框内 具有一个所述开口, 所述石墨片的数量也为一个, 所述石墨片收容于所述开口 内。
12. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述铝合金框内 具有多个所述开口, 所述石墨片的数量也为多个, 每个所述石墨片对应收容于 一个所述开口内。
13. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述第一过渡层 釆用钛或含钛的合金制成。
14. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述第二过渡层 釆用钛或含钛的合金制成。
15. 如权利要求 7所述的导热复合材料片, 其特征在于, 所述第一过渡层 的厚度为 20微米至 40微米。
16. 如权利要求 7所述的导热复合材料片, 其特征在于, 第二过渡层的厚 度为 20微米至 40微米。
17. 一种导热复合材料片的制作方法, 包括步骤:
提供两个铝合金片及一个铝合金框, 所述铝合金框具有至少一个开口, 并 对铝合金片及铝合金框进行机械处理及化学处理,以降低所述铝合金片表面及 铝合金框表面的粗糙度, 并得到活性的铝合金表面;
提供至少一个石墨片;
将石墨片放置于所述铝合金框的开口内,并在铝合金框及石墨片的相对两 侧分别放置铝合金片形成叠层结构, 并将所述叠层结构放置于炉腔内, 并将炉 腔内抽真空; 以及 对所述叠层结构进行加热加压,将所述放置有石墨片的铝合金框及两个铝 合金片之间进行扩散连接, 从而得到导热复合材料片。
18. 如权利要求 17所述的导热复合材料片的制作方法, 其特征在于, 所 述机械处理包括打磨及抛光, 以降低所述铝合金片表面及铝合金表面的粗糙 度。
19. 如权利要求 17所述的导热复合材料片的制作方法, 其特征在于, 所 述化学处理包括酸洗及碱洗, 以得到活性的铝合金表面。
20. 如权利要求 17所述的导热复合材料片的制作方法, 其特征在于, 将 所述炉腔内抽真空至压强为 5xlO-3Pa至 7x lO-3Pa。
21. 如权利要求 17所述的导热复合材料片的制作方法, 其特征在于, 将 所述放置有石墨片的铝合金框及两个铝合金片之间进行扩散连接时,将炉腔内 的温度升至 530摄氏度至 590摄氏度,并对所述叠层结构施加 lOMPa至 15MPa 的压力, 使得所述石墨片与铝合金接触的表面之间进行扩散连接。
22. 如权利要求 17所述的导热复合材料片的制作方法, 其特征在于, 所 述铝合金框内的所述开口的个数为多个, 所述石墨片的个数也为多个,每个石 墨片对应收容于一个所述开口内。
23. 一种导热复合材料片的制作方法, 包括步骤:
提供两个铝合金片及铝合金框,并对铝合金片及铝合金框进行机械处理及 化学处理, 以降低所述铝合金片表面及铝合金框表面的粗糙度, 并得到活性的 铝合金表面;
提供石墨片及两个过渡片;
将两个过渡片分别放置于石墨片相对两侧,使得所述石墨片与所述过渡片 进行扩散连接, 得到复合层;
将所述复合层放置于所述铝合金框的开口中,并在铝合金框及石墨片的相 对两侧分别放置铝合金片形成叠层结构, 放置于炉腔内并抽真空处理; 以及 将所述放置有复合层的铝合金框及两个铝合金片之间进行扩散连接,从而 得到导热复合材料片。
24. 如权利要求 23所述的导热复合材料片的制作方法, 其特征在于, 所 述机械处理包括打磨及抛光, 以降低所述铝合金片表面及铝合金表面的粗糙 度。
25. 如权利要求 23所述的导热复合材料片的制作方法, 其特征在于, 所 述化学处理包括酸洗及碱洗, 以得到活性的铝合金表面。
26. 如权利要求 23所述的导热复合材料片的制作方法, 其特征在于, 将 所述炉腔内抽真空至压强为 5xlO-3Pa至 7x lO-3Pa。
27. 如权利要求 23所述的导热复合材料片的制作方法, 其特征在于, 将 所述放置有复合层的铝合金框及两个铝合金片之间进行扩散连接时,将炉腔内 的温度升至 530摄氏度至 590摄氏度,并对所述叠层结构施加 lOMPa至 15MPa 的压力, 使得所述石墨片与铝合金接触的表面之间进行扩散连接。
28. 如权利要求 23所述的导热复合材料片的制作方法, 其特征在于, 将 两个过渡片分别放置于石墨片相对两侧并堆叠整齐,将堆叠后的两个过渡片及 石墨片放置于炉腔内, 抽真空至压强为 5x lO-3Pa至 7x lO-3Pa, 然后升高炉温 至 850摄氏度至 930摄氏度, 并在所述两过渡片之间施加 llMPa至 12MPa的 压力, 持续时间为 100分钟至 170分钟。
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Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10576514B2 (en) 2013-11-04 2020-03-03 Loci Controls, Inc. Devices and techniques relating to landfill gas extraction
US10029290B2 (en) 2013-11-04 2018-07-24 Loci Controls, Inc. Devices and techniques relating to landfill gas extraction
CN107027264B (zh) * 2015-06-24 2019-04-16 碁鼎科技秦皇岛有限公司 散热片及其制作方法及电子设备
US10705063B2 (en) 2016-03-01 2020-07-07 Loci Controls, Inc. Designs for enhanced reliability and calibration of landfill gas measurement and control devices
CA3016023A1 (en) 2016-03-01 2017-09-08 Loci Controls, Inc. Designs for enhanced reliability and calibration of landfill gas measurement and control devices
US11114365B2 (en) * 2016-12-22 2021-09-07 Kyocera Corporation Electronic element mounting substrate, electronic device, and electronic module
CN110301043B (zh) * 2017-01-30 2024-03-01 积水保力马科技株式会社 散热片
CN107953616A (zh) * 2017-09-23 2018-04-24 世星科技股份有限公司 一种导热石墨膜的复合结构及其制备工艺
WO2019098377A1 (ja) * 2017-11-20 2019-05-23 富士通化成株式会社 複合伝熱部材、及び複合伝熱部材の製造方法
US10946420B2 (en) 2018-03-06 2021-03-16 Loci Controls, Inc. Landfill gas extraction control system
US20210324255A1 (en) * 2018-09-07 2021-10-21 Sekisui Polymatech Co., Ltd. Heat conductive sheet
WO2020072457A1 (en) 2018-10-01 2020-04-09 Loci Controls, Inc. Landfill gas extraction systems and methods
CN109462965A (zh) * 2018-12-14 2019-03-12 中国航空工业集团公司西安航空计算技术研究所 一种流动性材料填充的石墨导热板
JP2020188235A (ja) * 2019-05-17 2020-11-19 三菱マテリアル株式会社 複合伝熱部材、及び、複合伝熱部材の製造方法
US11980081B2 (en) 2019-08-27 2024-05-07 Boe Technology Group Co., Ltd. Display device, method for manufacturing display device, heat dissipation layer, and electronic device
CA3168631A1 (en) 2020-01-29 2021-08-05 Loci Controls, Inc. Automated compliance measurement and control for landfill gas extraction systems
US11623256B2 (en) 2020-07-13 2023-04-11 Loci Controls, Inc. Devices and techniques relating to landfill gas extraction
CN112492849A (zh) * 2020-11-27 2021-03-12 北京无线电测量研究所 轻质高导热板
WO2022120046A1 (en) 2020-12-03 2022-06-09 Loci Controls, Inc. Greenhouse gas emissions control
CN112662333A (zh) * 2020-12-28 2021-04-16 新昌县辰逸服饰有限公司 一种石墨烯导热散热膜
CN112918039A (zh) * 2021-01-21 2021-06-08 西安工业大学 一种金属复合材料的复合结构及其成型方法
CN113977199A (zh) * 2021-11-01 2022-01-28 上海兆为金属有限公司 一种双曲面铝单板生产加工工艺
CN114083841A (zh) * 2021-12-16 2022-02-25 成都四威高科技产业园有限公司 一种高导热石墨膜均温板及其制备方法
CN115384129A (zh) * 2022-04-19 2022-11-25 中国科学院山西煤炭化学研究所 一种铝合金-石墨扩热板及制作方法
CN114921682B (zh) * 2022-06-28 2023-03-28 北京科技大学广州新材料研究院 一种高导热各向同性的石墨球-铜基的复合材料及其制备方法
CN115507694B (zh) * 2022-09-19 2023-11-17 中国核动力研究设计院 导热肋片及其制造设备、制造方法和包含其的换热设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101160033A (zh) * 2006-10-08 2008-04-09 通用电气公司 传热复合材料、相关装置和方法
CN101994071A (zh) * 2010-09-28 2011-03-30 蔡乐勤 一种铝基碳纤维石墨复合材料及制备方法
CN102586703A (zh) * 2012-03-23 2012-07-18 北京科技大学 一种石墨晶须增强铝基复合材料的制备方法
CN103343265A (zh) * 2013-07-24 2013-10-09 上海交通大学 石墨/硅混杂增强高导热低膨胀铝基复合材料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3770488A (en) * 1971-04-06 1973-11-06 Us Air Force Metal impregnated graphite fibers and method of making same
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
JP4440838B2 (ja) * 2005-06-30 2010-03-24 ポリマテック株式会社 熱伝導性部材および該熱伝導性部材を用いた冷却構造
TW200829102A (en) * 2006-12-21 2008-07-01 New Era Electronics Co Ltd Manufacturing method of aluminum alloy circuit plate
JP5025328B2 (ja) * 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
JP4558012B2 (ja) * 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
JP5316602B2 (ja) * 2010-12-16 2013-10-16 株式会社日本自動車部品総合研究所 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
JP5548722B2 (ja) * 2012-03-30 2014-07-16 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、及び、ヒートシンク付パワーモジュール用基板の製造方法
US11105567B2 (en) * 2012-09-25 2021-08-31 Momentive Performance Materials Quartz, Inc. Thermal management assembly comprising bulk graphene material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101160033A (zh) * 2006-10-08 2008-04-09 通用电气公司 传热复合材料、相关装置和方法
CN101994071A (zh) * 2010-09-28 2011-03-30 蔡乐勤 一种铝基碳纤维石墨复合材料及制备方法
CN102586703A (zh) * 2012-03-23 2012-07-18 北京科技大学 一种石墨晶须增强铝基复合材料的制备方法
CN103343265A (zh) * 2013-07-24 2013-10-09 上海交通大学 石墨/硅混杂增强高导热低膨胀铝基复合材料

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3007531A4 *

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